Condensing panel assembly and heat dissipation device including same

Abstract

The present invention relates to a condensing panel assembly and a heat dissipation device including same, and, particularly, comprises: an evaporation panel assembly which has a storage unit for storing a refrigerant capable of phase-changing according to temperature, and of which at least a part of the lower surface is in surface thermal contact with heating surfaces of heating elements; and a plurality of condensing panel assemblies which are coupled to the evaporation panel assembly so as to allow communication with the storage unit, and which emit heat transferred from the heating elements through heat exchange with the outside air (outdoor air), wherein each of the plurality of condensing panel assemblies include: a one-side heat conduction panel sheet-metal processed through press-molding as a metal panel member having at least a predetermined thermal conductivity; and an other-side heat conduction panel sheet-metal processed through press-molding as the same metal panel member as the one-side heat conduction panel, and thus the heat dissipation performance of the heat dissipation device is maximized.

Description

Condenser plate assembly and heat dissipation device including the same

[0001] The present invention relates to a condensing panel assembly and a heat dissipation apparatus including the same, and more particularly, to a condensing panel assembly and a heat dissipation apparatus including the same, which can prevent physical shaking due to an increase in internal pressure occurring during the gas-liquid circulation of a refrigerant and achieve a shorter gas-liquid circulation cycle.

[0002] In diverse industries such as communications, electronics, and electricity, related technologies are continuously being developed at an advanced level for application in more advanced industries. This advanced technological development requires high-power energy, and devices utilizing this energy inevitably face the problem of high heat generation. Consequently, the development of appropriate heat dissipation systems must accompany this development.

[0003] Heat dissipation systems are used in a variety of industries, including air conditioners, mobile communications, data centers, aerospace mobility, electric vehicles, energy storage devices, and displays. These systems are a major source of power consumption, and power consumption is steadily increasing as industries develop.

[0004] In general, heat dissipation devices are largely divided into active cooling devices and passive cooling devices. Active cooling devices mainly utilize forced convection by fans, and passive cooling devices can be classified as a technology that utilizes natural convection without fans.

[0005] However, conventional heat dissipation systems have limitations in dissipating the high heat generated by continuously evolving, advanced technologies. Therefore, related industries urgently need innovative technologies to address these issues, and heat dissipation devices are being developed to address this issue.

[0006] Phase change refers to the change in the inherent state of a liquid / gas / solid when it accumulates a large amount of energy or releases stored heat energy.

[0007] A phase change refers to a change in the physical arrangement of molecules rather than a chemical reaction such as chemical bonding or formation. When energy is applied to a substance, the heat that does not undergo a phase change is called sensible heat, and the heat used when the phase changes is called latent heat.

[0008] However, radiators have a problem: since temperature and pressure are proportional, pressure increases as temperature increases. This can lead to the rupture of the radiator itself if the high temperature transmitted from the heating element within the sealed radiator increases pressure. To address this, pressure must be prevented from increasing, and the radiator must have sufficient internal volume to ensure pressure equilibrium during the phase change cycle of the material.

[0009] In addition, the heat transferred to the radiator should be used for the phase change of the refrigerant as much as possible, but if the energy is used for the shaking (flow) of the radiator itself due to the increase in internal pressure, the gas-liquid circulation cycle becomes long, which may have the problem of lowering the heat dissipation performance.

[0010]

[0011] The present invention has been devised to solve the above-mentioned technical problem, and its purpose is to provide a condenser assembly capable of maximizing heat dissipation performance and a heat dissipation device including the same.

[0012] In addition, another object of the present invention is to provide a condensing plate assembly and a heat dissipation device including the same, which can minimize the conversion of heat energy into physical force required for the phase change of liquid refrigerant into gaseous refrigerant, thereby shortening the gas-liquid circulation cycle and inducing more active gas-liquid circulation.

[0013] In addition, another object of the present invention is to provide a condensing plate assembly and a heat dissipation device including the same, which can improve heat dissipation performance by quickly inducing the rapid capture and movement of liquid refrigerant in which gaseous refrigerant is condensed to a portion close to a heating element.

[0014] The tasks of the present invention are not limited to the tasks mentioned above, and other technical tasks not mentioned will be clearly understood by those skilled in the art from the description below.

[0015] A condensation plate assembly according to one embodiment of the present invention comprises a one-side heat-conducting panel formed of a metal panel member having a thermal conductivity of a predetermined level or higher and formed of sheet metal by a press molding process, and an other-side heat-conducting panel formed of the same metal panel member as the one-side heat-conducting panel and formed of sheet metal by a press molding process, wherein the one-side heat-conducting panel and the other-side heat-conducting panel are joined to each other at edge ends excluding the lower end with respect to the direction of gravity to form a refrigerant flow space in which refrigerant flows, and the lower ends of the one-side heat-conducting panel and the other-side heat-conducting panel are connected to an evaporation plate assembly in which a storage unit is formed in which liquid refrigerant condensed from the refrigerant flow space drops and is stored.

[0016] Here, a plurality of strength reinforcing parts may be formed in the one-side heat-conducting panel and the other-side heat-conducting panel by being grooved and formed inwardly so as to be in contact with each other in the refrigerant flow space.

[0017] In addition, the plurality of strength reinforcing members can be joined by welding at the portions that come into contact with each other in the refrigerant flow space.

[0018] In addition, the refrigerant flow space may include a first refrigerant flow path formed to surround each of the plurality of strength reinforcement parts and a second refrigerant flow path formed to be recessed toward the refrigerant flow space in the one-side heat-conducting panel and the other-side heat-conducting panel in the thickness direction of the refrigerant flow space, as the maximum separation distance between the one-side heat-conducting panel and the other-side heat-conducting panel, and formed between each of the plurality of strength reinforcement parts and the first refrigerant flow path.

[0019] Additionally, the depth of the second refrigerant passage toward the refrigerant flow space may be formed to be spaced apart from each other in the thickness direction within the refrigerant flow space.

[0020] Additionally, the sinking depth of the second refrigerant passage may be at least greater than the sinking depth of the first refrigerant passage and less than the plurality of strength reinforcing members.

[0021] Additionally, the second refrigerant flow path can be defined to be distinct from the second refrigerant flow path adjacent to the first refrigerant flow path.

[0022] Additionally, the lower ends of the one-side heat-conducting panel and the other-side heat-conducting panel can be overlapped and combined with the storage portion of the evaporation plate assembly.

[0023] In addition, the one-side heat-conducting panel and the other-side heat-conducting panel can be coupled so that the lower end penetrates an installation slit formed in a mounting panel coupled to the upper surface of the evaporation plate assembly to mediate coupling with the evaporation plate assembly and is seated in the storage unit.

[0024] Additionally, the one-side heat-conducting panel and the other-side heat-conducting panel can be welded together along the periphery of the installation slit after being joined to the installation slit of the mounting panel.

[0025] In addition, in the storage section of the evaporation plate assembly, a plurality of rigid reinforcing members are arranged in a plurality of rows spaced apart from each other to support the lower surface of the mounting panel and the bottom surface of the storage section, and the one-side heat-conducting panel and the other-side heat-conducting panel can have their upper surfaces, which are separated by a dividing groove formed in a groove shape on the upper portion of the plurality of rigid reinforcing members, supported on the lower surface of the mounting panel.

[0026] In addition, the one-side heat-conducting panel and the other-side heat-conducting panel can be mutually joined at the edge ends except for the lower end that is joined to the evaporator assembly to form the refrigerant flow space.

[0027] In addition, it may further include a plurality of condensed refrigerant collecting absorbers arranged in a refrigerant flow space formed between the one-side heat-conducting panel and the other-side heat-conducting panel to guide the condensed refrigerant.

[0028] A condensation plate assembly according to another embodiment of the present invention may include a one-side heat-conducting panel formed of a metal panel member having a thermal conductivity of a predetermined level or higher and processed into sheet metal by a press molding process, an other-side heat-conducting panel formed of the same metal panel member as the one-side heat-conducting panel and processed into sheet metal by a press molding process, and a plurality of condensation refrigerant capture absorbers (hereinafter, abbreviated as “absorbers”) arranged in a refrigerant flow space formed between the one-side heat-conducting panel and the other-side heat-conducting panel, and supported by contacting an inner surface of the one-side heat-conducting panel forming one heat-radiating surface of the refrigerant flow space and an inner surface of the other-side heat-conducting panel forming the other heat-radiating surface of the refrigerant flow space, which are arranged long in the direction of gravity.

[0029] In addition, the absorber may be provided with either a metal foam in which metal wires are braided or a metal sintered body in which metal powder is sintered.

[0030] In addition, the absorbent body may be formed with a plurality of pores having a size such that the condensed liquid refrigerant in the refrigerant flow space is absorbed by capillary force or surface tension.

[0031] In addition, a plurality of absorber installation grooves that support the absorption body to prevent the flow of the absorption body within the refrigerant flow space may be formed in the one-side heat-conducting panel and the other-side heat-conducting panel in correspondence to the number of the absorption bodies.

[0032] Additionally, the plurality of absorbers and the plurality of absorber installation grooves may be arranged to be spaced apart from each other in the horizontal direction.

[0033] In addition, when the lower ends of the one-side heat-conducting panel and the other-side heat-conducting panel are joined to an evaporation plate assembly in which a storage portion is formed in which condensed liquid refrigerant from the refrigerant flow space falls and is stored, the absorber may have a length that protrudes further downward than the lower ends of the one-side heat-conducting panel and the other-side heat-conducting panel so that the lower ends are positioned in the storage portion of the evaporation plate assembly.

[0034] In addition, the one-side heat-conducting panel and the other-side heat-conducting panel can be mutually joined at the edge ends except for the lower end that is joined to the evaporator assembly to form the refrigerant flow space.

[0035] In addition, a plurality of strength reinforcing parts may be formed in the one-side heat-conducting panel and the other-side heat-conducting panel by being grooved and formed inwardly so as to be in contact with each other in the refrigerant flow space.

[0036] In addition, the plurality of strength reinforcing members can be joined by welding at the portions that come into contact with each other in the refrigerant flow space.

[0037] In addition, a plurality of absorber installation grooves are formed corresponding to the number of absorbers in the one-side heat-conducting panel and the other-side heat-conducting panel to support and prevent the flow of the absorber within the refrigerant flow space, and the plurality of strength reinforcing parts can be formed in the one-side heat-conducting panel and the other-side heat-conducting panel that are not occupied by the plurality of absorber installation grooves.

[0038] In addition, the one-side heat-conducting panel and the other-side heat-conducting panel can be coupled so that the lower end penetrates an installation slit formed in a mounting panel coupled to the upper surface of the evaporation plate assembly to mediate coupling with the evaporation plate assembly and is seated in the storage unit.

[0039] Additionally, the one-side heat-conducting panel and the other-side heat-conducting panel can be welded together along the periphery of the installation slit after being joined to the installation slit of the mounting panel.

[0040] In addition, in the storage section of the evaporation plate assembly, a plurality of rigid reinforcing members are arranged in a plurality of rows to support the lower surface of the mounting panel and the bottom surface of the storage section, and the one-side heat-conducting panel and the other-side heat-conducting panel can have one lower side and the other lower side supported between the plurality of rigid reinforcing members.

[0041] A heat dissipation device according to one embodiment of the present invention includes an evaporator assembly having a storage unit formed to be in surface thermal contact with a heating surface of a heating element and storing a liquid refrigerant among refrigerants, a plurality of condenser plate assemblies coupled to the evaporator plate assembly and through which a phase-changed gaseous refrigerant in the storage unit diffuses and condenses, and a mounting panel mediating a slit connection between the evaporator plate assembly and the condenser plate assembly, wherein the evaporator plate assembly is made of a copper material, and the condenser plate assembly is made of a SUS material.

[0042] Here, the plurality of condensing plate assembly can form a refrigerant flow space in which the liquid refrigerant and the gaseous refrigerant flow by joining the edge ends of two parent panels made of SUS material and the strength reinforcing parts formed at multiple locations inside the panels.

[0043] In addition, in the plurality of condensing plate assemblies, a plurality of refrigerant passages through which the liquid refrigerant flows in the direction of gravity are formed, and an absorber made of a braided wire mesh may be provided in each of the plurality of refrigerant passages.

[0044] In addition, a plurality of strength reinforcing members that reinforce strength between the evaporation plate assembly and the mounting panel can be joined using a brazing method.

[0045] According to another embodiment of the present invention, a heat dissipation device includes an evaporation plate assembly having a storage portion in which a refrigerant capable of phase change depending on temperature is stored, and at least a portion of a lower surface thereof is in surface thermal contact with a heating surface of heating elements, and a plurality of condensation plate assemblies that are connected to the evaporation plate assembly in communication with the storage portion and release heat transferred from the heating elements through heat exchange with external air (outside air), and each of the plurality of condensation plate assemblies includes a first heat-conducting panel formed of a metal panel member having a thermal conductivity equal to or higher than a predetermined level and formed by a press molding process, and an second heat-conducting panel formed of the same metal panel member as the first heat-conducting panel and formed by a press molding process, and the first heat-conducting panel and the second heat-conducting panel are joined to each other at edge ends excluding a lower end based on a direction of gravity to form a refrigerant flow space in which the refrigerant flows, and the lower ends of the first heat-conducting panel and the second heat-conducting panel are connected to the storage portion of the evaporation plate assembly in communication with each other.

[0046] Here, the one-side heat-conducting panel and the other-side heat-conducting panel can be mutually joined at the remaining edge ends, except for the lower end that is joined to the evaporator assembly, to form the refrigerant flow space.

[0047] In addition, a plurality of strength reinforcing parts may be formed in the one-side heat-conducting panel and the other-side heat-conducting panel by being grooved and formed inwardly so as to be in contact with each other in the refrigerant flow space.

[0048] In addition, the plurality of strength reinforcing members can be joined by welding at the portions that come into contact with each other in the refrigerant flow space.

[0049] In addition, the refrigerant flow space may include a first refrigerant flow path formed to surround each of the plurality of strength reinforcement parts and a second refrigerant flow path formed to be recessed toward the refrigerant flow space in the one-side heat-conducting panel and the other-side heat-conducting panel in the thickness direction of the refrigerant flow space, as the maximum separation distance between the one-side heat-conducting panel and the other-side heat-conducting panel, and formed between each of the plurality of strength reinforcement parts and the first refrigerant flow path.

[0050] Additionally, the depth of the second refrigerant passage toward the refrigerant flow space may be formed to be spaced apart from each other in the thickness direction within the refrigerant flow space.

[0051] Additionally, the sinking depth of the second refrigerant passage may be at least greater than the sinking depth of the first refrigerant passage and less than the plurality of strength reinforcing members.

[0052] Additionally, the second refrigerant flow path can be defined to be distinct from the second refrigerant flow path adjacent to the first refrigerant flow path.

[0053] Additionally, the lower ends of the one-side heat-conducting panel and the other-side heat-conducting panel can be overlapped and combined with the storage portion of the evaporation plate assembly.

[0054] In addition, the present invention further includes a mounting panel coupled to an upper surface of the evaporator assembly to mediate coupling of the evaporator assembly and the plurality of condenser plate assemblies, and the one-side heat-conducting panel and the other-side heat-conducting panel can be coupled so that their lower ends penetrate an installation slit formed in the mounting panel and are seated in the storage unit.

[0055] Additionally, the one-side heat-conducting panel and the other-side heat-conducting panel can be welded together along the periphery of the installation slit after being joined to the installation slit of the mounting panel.

[0056] In addition, in the storage section of the evaporation plate assembly, a plurality of rigid reinforcing members are arranged in a plurality of rows spaced apart from each other to support the lower surface of the mounting panel and the bottom surface of the storage section, and the one-side heat-conducting panel and the other-side heat-conducting panel can have their upper surfaces, which are separated by a dividing groove formed in a groove shape on the upper portion of the plurality of rigid reinforcing members, supported on the lower surface of the mounting panel.

[0057] In addition, the condensing plate assembly may further include a plurality of condensing refrigerant collecting absorbers (hereinafter, abbreviated as “absorbers”) arranged long in the direction of gravity so as to be disposed in a refrigerant flow space formed between the one-side heat-conducting panel and the other-side heat-conducting panel, and at the same time, be supported by contacting an inner surface of the one-side heat-conducting panel forming one-side heat-radiating surface in the refrigerant flow space and an inner surface of the other-side heat-conducting panel forming the other-side heat-radiating surface in the refrigerant flow space.

[0058] In addition, the absorber may be provided with either a metal foam in which metal wires are braided or a metal sintered body in which metal powder is sintered.

[0059] In addition, the absorbent body may be formed with a plurality of pores having a size such that the condensed liquid refrigerant in the refrigerant flow space is absorbed by capillary force or surface tension.

[0060] In addition, a plurality of absorber installation grooves that support the absorption body to prevent the flow of the absorption body within the refrigerant flow space may be formed in the one-side heat-conducting panel and the other-side heat-conducting panel in correspondence to the number of the absorption bodies.

[0061] Additionally, the plurality of absorbers and the plurality of absorber installation grooves may be arranged to be spaced apart from each other in the horizontal direction.

[0062] In addition, when the lower ends of the one-side heat-conducting panel and the other-side heat-conducting panel are joined to the evaporation plate assembly in which the storage portion is formed, in which the condensed liquid refrigerant from the refrigerant flow space falls and is stored, the absorber may have a length that protrudes further downward than the lower ends of the one-side heat-conducting panel and the other-side heat-conducting panel so that the lower ends are positioned in the storage portion of the evaporation plate assembly.

[0063] In addition, a heat transfer plate assembly may be further included that receives heat generated from the above heating elements and then mediates the transfer to the lower surface of the evaporator plate assembly.

[0064] In addition, the heat transfer plate assembly may include a joining frame having a rectangular frame shape with a hollow center, and a heat transfer panel joined to a center portion of the joining frame, the lower surface of which is in surface thermal contact with the heating surfaces of the heating elements, and the upper surface of which is in surface thermal contact with the lower surface of the evaporation plate assembly.

[0065] Additionally, at least one pair of panel fixing hooks for fixing the heat transfer panel may be integrally formed on the inner end of the above-mentioned joining frame.

[0066] In addition, the present invention further includes a mounting panel coupled to the upper surface of the evaporation plate assembly to mediate the coupling of the evaporation plate assembly and the plurality of condensation plate assemblies, and the coupling frame may be formed with a support hook portion that is inserted through an extension hole formed in the evaporation plate assembly and the mounting panel and then hooked to the upper surface of the mounting panel.

[0067]

[0068] The condensing plate assembly according to the present invention and the heat dissipation device including the same have the effect of preventing physical shaking due to an increase in internal pressure occurring during the gas-liquid circulation of the refrigerant and achieving a shorter gas-liquid circulation cycle.

[0069] In addition, there is an effect that allows the thickness of the condensing plate assembly to be manufactured slim so that almost all of the heat generated from the heating elements is actually invested only in the gas-liquid phase change (phase change) of the refrigerant, which performs the role of heat dissipation.

[0070] In addition, the condensing plate assembly according to the present invention and the heat dissipation device including the same have the effect of maximizing heat dissipation performance by quickly inducing the rapid capture and movement of the liquid refrigerant in which the gaseous refrigerant is condensed to a portion close to the heating element.

[0071] The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

[0072]

[0073] Figure 1 is a downward perspective view and an upward perspective view showing a heat dissipation device according to one embodiment of the present invention.

[0074] Figure 2 is a downward perspective view and an upward perspective view showing a heat dissipation device according to another embodiment of the present invention.

[0075] Figure 3 is a perspective view showing a condenser assembly according to one embodiment of the present invention.

[0076] Figure 4 is an exploded perspective view of Figure 3,

[0077] Figure 5a is a front view (a) of Figure 3, a cross-sectional view (b) taken along line BB, and an enlarged view (c) of the portion thereof.

[0078] Figure 5b is a front view (a) of Figure 3, a cutaway perspective view (b) taken along the line BB, and a partial enlarged view (c) thereof.

[0079] Figure 6 is a perspective view showing a condenser assembly according to another embodiment of the present invention.

[0080] Figure 7 is an exploded perspective view of Figure 6.

[0081] Figure 8 is a front view (a) of Figure 6, a cross-sectional view (b) taken along line AA, and a cutaway perspective view (c) thereof.

[0082] Figures 9a and 9b are exploded perspective views of Figure 1,

[0083] Fig. 10 is an exploded perspective view of the condensation plate assembly according to the first embodiment of the configuration of Fig. 1, separated from the evaporation plate assembly.

[0084] Figure 11 is a perspective view showing the combined appearance of a single condensation plate assembly according to the first embodiment of the evaporation plate assembly.

[0085] Figure 12 is an exploded perspective view of Figure 11,

[0086] Fig. 13 is an exploded perspective view of the other side heat conduction panel of the condenser assembly according to the first embodiment of Fig. 1.

[0087] Fig. 14 is a perspective view of a single condensation plate assembly according to the first embodiment of the configuration of the heat dissipation device of Fig. 1, with the other side heat conduction panel removed, in a state where the condensation plate assembly is coupled to the evaporation plate assembly.

[0088] Fig. 15 is a perspective view showing the evaporation plate assembly of the configuration of Fig. 1.

[0089] Figure 16 is an exploded perspective view of the mounting panel of Figure 15.

[0090] Figure 17 is an exploded perspective view of the mounting panel and heat transfer plate assembly of Figure 15.

[0091] Fig. 18 is a perspective view of the configuration of Fig. 15 with the mounting panel removed.

[0092] Figure 19 is an exploded perspective view of one row of the multiple stiffening members of Figure 16.

[0093] Fig. 20 is an exploded perspective view of the condensation plate assembly according to the second embodiment of the configuration of Fig. 2, separated from the evaporation plate assembly.

[0094] Figure 21 is an exploded perspective view of Figure 20.

[0095] Fig. 22 is an exploded perspective view of the other side heat conduction panel of the condenser assembly according to the second embodiment of Fig. 20.

[0096] Fig. 23 is a perspective view of a single condensation plate assembly according to the second embodiment of the configuration of the heat dissipation device of Fig. 20, with the mounting panel removed, in a state where the condensation plate assembly is coupled to the evaporation plate assembly.

[0097] Figure 24 is an exploded perspective view of the mounting panel separated from the evaporator assembly.

[0098] Figure 25 is an exploded perspective view showing the mounting panel and multiple rigid reinforcing members separated during construction.

[0099] Fig. 26 is a perspective view of the configuration of Fig. 24 with the mounting panel removed.

[0100] Figure 27 is an exploded perspective view of one of the multiple stiffening members of Figure 24.

[0101] Fig. 28 is a cross-sectional view taken along line A'-A' of Fig. 1,

[0102] Fig. 29a is a front view (a) and a cross-sectional view (b) taken along line B'-B' of Fig. 2,

[0103] Figure 29b is a front view (a) and a cross-sectional view (b) taken along line C'-C' of Figure 2.

[0104]

[0105] <Explanation of symbols>

[0106] 1,2: Heat sink 50: Air vent tube

[0107] 60: Screw boss 70: Hook boss

[0108] 75; Fastening boss 80: Mounting screw

[0109] 100: Evaporation plate assembly 110: Storage unit

[0110] 120A, 120B: Screw assembly worker 120A: 1st assembly worker

[0111] 120B: 2nd assembly worker 125: Extension worker

[0112] 130: Vacuum groove 150,150': Rigid reinforcement member

[0113] 170: Heat transfer plate assembly 171: Frame for joining

[0114] 174: Panel fixing hook 175: Guide pin

[0115] 177: Support hook part 200,202: Condensing plate part assembly

[0116] 200A, 202A: One-sided heat-conducting panel 200B, 202B: Other-sided heat-conducting panel

[0117] 205: Refrigerant flow space 210; edge end

[0118] 205a: First refrigerant passage 205b: Second refrigerant passage

[0119] 230; Strength reinforcement part 240: Lower part

[0120] 250: Absorber 300: Mounting panel

[0121] 310: Installation slit 320A, 320B: Screw fastening hole

[0122] 320A: 1st fastener 320B: 2nd fastener

[0123] 325: Extension worker

[0124]

[0125] Hereinafter, a heat dissipation device according to one embodiment of the present invention will be described in detail with reference to the attached drawings.

[0126] When assigning reference numerals to components in each drawing, it should be noted that identical components are assigned the same numerals whenever possible, even if they appear on different drawings. Furthermore, when describing embodiments of the present invention, if a detailed description of a related known configuration or function is deemed to hinder understanding of the embodiments of the present invention, the detailed description will be omitted.

[0127] When describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only intended to distinguish the components from other components, and the nature, order, or sequence of the components are not limited by these terms. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant technology, and shall not be interpreted in an idealized or overly formal sense unless explicitly defined in this application.

[0128]

[0129] FIG. 1 is a downward perspective view and an upward perspective view showing a heat dissipation device according to one embodiment of the present invention, FIG. 2 is a downward perspective view and an upward perspective view showing a heat dissipation device according to another embodiment of the present invention, FIG. 3 is a perspective view showing a condensation plate assembly according to one embodiment of the present invention, FIG. 4 is an exploded perspective view of FIG. 3, FIG. 5a is a front view (a), a cross-sectional view (b) taken along the line BB of FIG. 3, and a partially enlarged view (c) thereof, FIG. 5b is a front view (a) of FIG. 3, a cut-away perspective view (b) taken along the line BB, and a partially enlarged view (c) thereof, FIG. 6 is a perspective view showing a condensation plate assembly according to another embodiment of the present invention, FIG. 7 is an exploded perspective view of FIG. 6, and FIG. 8 is a front view (a) of FIG. 6, a cross-sectional view (b) taken along the line AA, and a cut-away perspective view (c) thereof.

[0130] A heat dissipation device (1) according to one embodiment of the present invention includes, as referenced in FIGS. 1 to 8, an evaporation plate assembly (100) formed with a storage section (110) in which a liquid refrigerant among refrigerants is stored and is in surface thermal contact with a heating surface of a heating element (not shown), a plurality of condensation plate assemblies (200, 202) coupled to the evaporation plate assembly (100) and in which a phase-changed gaseous refrigerant in the storage section is diffused and condensed, and a mounting panel (300) that mediates a slit connection between the evaporation plate assembly (100) and the condensation plate assemblies (200, 202).

[0131] Here, the evaporation plate assembly (100) may be made of copper (Cu), and the condensation plate assembly (200, 202) may be made of SUS.

[0132] In addition, a plurality of condenser plate assemblies (200, 202) can form a refrigerant flow space (205) in which liquid refrigerant and gaseous refrigerant flow by joining the edge end (210) of one side heat-conducting panel (200A, 202A) and the other side heat-conducting panel (200B, 202B), which are two base panels made of SUS material, and the strength reinforcing parts (230) formed at a plurality of locations on the surface thereof.

[0133] In addition, a plurality of condenser plate assemblies (200, 202) may be provided with a plurality of refrigerant passages (205a, 205b) through which liquid refrigerant flows in the direction of gravity, and an absorber (250) made of a braided wire mesh may be provided in each of the plurality of refrigerant passages (205a, 205b).

[0134] Here, in the evaporation plate assembly (100), a plurality of strength reinforcing members (refer to the drawing reference numeral '150' of FIG. 16 and the drawing reference numeral '150'' of FIG. 20 described below) that reinforce strength between the evaporation plate assembly (100) and the mounting panel (300) described above can be joined using a brazing method.

[0135] Meanwhile, a plurality of installation slits (310) may be formed in the mounting panel (300) into which the lower portions of a plurality of condenser plate assemblies (200, 202) are fitted.

[0136] In addition, an air vent tube (50) may be further installed in the evaporator assembly (100) to be used for filling refrigerant or to evacuate the refrigerant flow space (205) before or after injecting the refrigerant.

[0137] The heat dissipation device (1) according to one embodiment of the present invention described above can be implemented as a specific embodiment, such as the heat dissipation devices (1, 2) according to another embodiment of the present invention and another embodiment described below.

[0138] First, a heat dissipation device (1, 2) according to other embodiments of the present invention may include, as shown in FIGS. 1 and 2, a storage unit (see reference numeral '110' in FIG. 3 and below) in which a refrigerant capable of phase change depending on temperature is stored, an evaporation plate assembly (100) in which at least a portion of the lower surface is in surface thermal contact with a heating surface of heating elements (not shown), and a plurality of condensation plate assemblies (200, 202) that are connected to the evaporation plate assembly (100) so as to be in communication with the storage unit (110) and release heat transferred from the heating elements through heat exchange with external air (outside air).

[0139] Here, the heat dissipation device (1, 2) of the present invention can be divided into one embodiment (1) as referenced in FIG. 1 and another embodiment (2) as referenced in FIG. 2, and the standard for this division is the presence or absence of an absorber (250) in a refrigerant flow space (205) formed by a heat-conducting panel (200A, 202A) on one side and a heat-conducting panel (200B, 202B) on the other side, which will be described later.

[0140] That is, as shown in FIGS. 3 to 5b below, an embodiment including a condensing plate assembly (200) according to the first embodiment, which is provided so that condensation of the refrigerant occurs without an absorber (250) in the refrigerant flow space (205), may be defined as a heat dissipation device (1) according to another embodiment, and conversely, as shown in FIGS. 6 to 8 below, an embodiment including a condensing plate assembly (202) according to the second embodiment, which is provided so that condensation of the refrigerant occurs by an absorber (250) in the refrigerant flow space (205), may be defined as a heat dissipation device (2) according to another embodiment.

[0141] According to embodiments of the present invention, a plurality of condensation plate assemblies (200, 202) are combined with an evaporation plate assembly (100) to form a heat dissipation device (1, 2), as shown in FIGS. 1 and 2.

[0142] FIG. 10 is an exploded perspective view of a condensation plate assembly according to the first embodiment of the configuration of FIG. 1, separated from an evaporation plate assembly, FIG. 11 is a perspective view showing a state in which a single condensation plate assembly according to the first embodiment is coupled to an evaporation plate assembly, FIG. 12 is an exploded perspective view of FIG. 11, FIG. 13 is an exploded perspective view of a condensation plate assembly according to the first embodiment of FIG. 1, separated from a heat-conducting panel on the other side, and FIG. 14 is a perspective view of a single condensation plate assembly according to the first embodiment of the configuration of a heat dissipation device of FIG. 1, coupled to an evaporation plate assembly, with the heat-conducting panel on the other side removed.

[0143] Hereinafter, a heat dissipation device (1) according to one embodiment of the present invention will be described in detail.

[0144] A heat dissipation device (1) according to one embodiment of the present invention includes, as referenced in FIGS. 10 to 14, an evaporation plate assembly (100) formed with a storage section (110) in which liquid refrigerant is stored and is in surface thermal contact with a heating surface of a heating element (not shown) and a plurality of condensation plate assemblies (200) coupled to the evaporation plate assembly (100) and in which gaseous refrigerant that has undergone a phase change in the storage section (110) is diffused and condensed.

[0145] Hereinafter, the condensation plate assembly (200) included in the heat dissipation device (1) according to another embodiment of the present invention is defined as the condensation plate assembly (200) according to the first embodiment and described.

[0146] Conversely, the condensation plate assembly (202) included in the heat dissipation device (2) according to another embodiment of the present invention is defined and described as a condensation plate assembly (202) according to the second embodiment.

[0147] Here, the evaporator assembly (100) can receive heat from the heating surfaces of heating elements (not shown) that are electrically driven, such as electronic devices, and inevitably generate heat, and perform the function of evaporating the liquid refrigerant stored in the storage unit (110) into a gaseous refrigerant.

[0148] In addition, the condensation plate assembly (200) according to the first embodiment is provided to communicate with the storage unit (110) of the evaporation plate assembly (100) via the mounting panel (300), as described later, and can discharge heat supplied from the heating elements to the outside through heat exchange with the outside air (outside air) during the process in which the phase-changed gaseous refrigerant in the evaporation plate assembly (100) diffuses and flows and condenses back into a liquid refrigerant.

[0149] More specifically, the evaporation plate assembly (200) may have a storage section (110) formed in the shape of a groove of a predetermined depth so as to have a horizontal cross-section of approximately a rectangle in the center of the upper surface, as shown in FIGS. 10 to 14.

[0150] Here, in the storage unit (110), liquid refrigerant is stored, and the upper open portion can be shielded by a mounting panel (300) described later that mediates the connection of the condensation plate assembly (200) according to the first embodiment to the evaporation plate assembly (200).

[0151] That is, the condensation plate assembly (200) according to the first embodiment can be coupled to the evaporation plate assembly (100) via the mounting panel (300). Here, when the evaporation plate assembly (100) is provided in a rectangular panel shape with roughly rounded corners, the mounting panel (300) can also be provided in a panel shape that can cover the entire upper surface of the evaporation plate assembly (100).

[0152] The mounting panel (300) is provided to cover the storage section (110) of the evaporation plate assembly (100), and may serve to support portions of a plurality of condensation plate assemblies (200) by inserting them therein.

[0153] To this end, a plurality of installation slits (310) into which a plurality of condensation plate assemblies (200) are individually inserted are formed longitudinally in the mounting panel (300), and can be cut to communicate with the storage unit (110) and the refrigerant flow space (205) of the plurality of condensation plate assemblies (200) according to the first embodiment.

[0154] A plurality of screw assembly holes (120A, 120B) and a plurality of screw fastening holes (320A, 320B) may be formed at the edge end of the evaporation plate assembly (100) and the edge end of the mounting panel (300) to be mutually assembled through the mounting screws (80) described later.

[0155] More specifically, the plurality of screw assembly holes (120A, 120B) may include a first assembly hole (120A) formed to penetrate vertically through one longitudinal end and the other longitudinal end of the edge end of the evaporation plate assembly (100), and a second assembly hole (120B) formed to penetrate vertically through the middle portion of the widthwise end of the edge end of the evaporation plate assembly (100).

[0156] In addition, a plurality of screw fastening holes (320A, 320B) may be formed in the mounting panel (300), and may include a first fastening hole (320A) formed to penetrate vertically at a position corresponding to the first assembly hole (120A) of the evaporation plate assembly (100) described above, and a second fastening hole (320B) formed to penetrate vertically at a position corresponding to the second assembly hole (120B) of the evaporation plate assembly (100).

[0157] Here, the mounting screw (80) can be fastened via a screw boss (60) that is coupled to a plurality of screw assembly holes (120A, 120B) and a plurality of screw fastening holes (320A, 320B).

[0158] The screw boss (60) may include a hook boss (70) that is hooked to the edge ends of a plurality of screw fastening holes (320A, 320B) on the upper side of the mounting panel (300) and that is hooked to at least the head of the mounting screw (80) when the mounting screw (80) is passed through, and a fastening boss (75) that is inserted to be penetrated into a plurality of screw assembly holes (120A, 120B) on the lower side of the evaporator assembly (100), and has a female thread formed on the inside to engage with a male thread formed on the outer periphery of the body of the mounting screw (80).

[0159] The process of attaching the mounting panel (300) to the evaporator assembly (100) using the mounting screw (80) is briefly described as follows.

[0160] First, a fastening boss (75) is inserted and positioned inside a plurality of screw assembly holes (120A, 120B) formed in the evaporation plate assembly (100), and then a hook boss (70) is placed in a position where a plurality of screw fastening holes (320A, 320B) formed in the mounting panel (300) are formed, and then a mounting screw (80) is rotated and fastened from the upper side of the hook boss (70).

[0161] At this time, the male thread of the mounting screw (80) engages with the female thread formed inside the fastening boss (75) and is fastened, and the head of the mounting screw (80) is caught inside the hooking boss (70), thereby increasing the adhesion or bonding force of the mounting panel (300) to the upper surface of the evaporation plate assembly (100).

[0162] Meanwhile, among the plurality of screw fastening holes (320A, 320B), the first fastening hole (320A) and among the plurality of screw assembly holes (120A, 120B), the first assembly hole (120A) are formed to have a diameter in which at least the fastening boss (75) is inserted, but a diameter in which the catch boss (70) is not inserted, and an extension hole (325, 125) can be formed to be in communication with one side of the first fastening hole (320A) and the first assembly hole (120A) so as to be able to move in one direction while at least the fastening boss (75) is inserted.

[0163] For reference, the extension holes (325, 125) formed in the evaporation plate assembly (100) and the mounting panel (300) can serve to allow the support hook portion (177) of the heat transfer plate assembly (170) described later to be inserted and caught. This will be described in more detail later.

[0164] The evaporator assembly (100) and the mounting panel (300) joined by the mounting screw (80) can be sealed to prevent the liquid refrigerant (or gaseous refrigerant) stored in the internal storage (110) from leaking.

[0165] In addition, a vacuum groove (130) for the installation of an air vent tube (50) described later may be further processed and formed in a groove shape at least at one of the edge ends of the evaporation plate assembly (100). The vacuum groove (130) may be formed to be in communication with the storage unit (110).

[0166] Meanwhile, at least one of the edge ends of the mounting panel (300) may be formed so as to be in communication with the vacuum groove (130) at a position corresponding to the vacuum groove (130) of the evaporation plate assembly (100), and a tube installation hole (330) for fixed installation of the air vent tube (50) described later may be formed through the vacuum groove (130).

[0167] In the heat dissipation device (1) according to embodiments of the present invention, when a refrigerant that undergoes a phase change is filled inside, such as the condensation plate assembly (201) according to the first embodiment, a vacuuming process is essential to evacuate the refrigerant flow space (205) so as to correspond to the change in internal pressure that occurs during the phase change. The vacuuming process described above can be performed through an air vent tube (50) coupled through a vacuum groove (130) of the evaporation plate assembly (100) and a tube installation hole (330) of the mounting panel (300).

[0168] After the vacuum process is completed, an air tube caulking process may be performed to block ventilation from the outside after cutting off the air vent tube (50). However, it is not necessary to cut off the air vent tube (50), and it is sufficient to perform the caulking process to block the air flow path of the air vent tube (50).

[0169] Meanwhile, as referenced in FIGS. 10 to 19, a heat dissipation device (1) according to another embodiment of the present invention may further include a heat transfer plate assembly (170) coupled to receive heat from heating elements (not shown) and transfer it to the lower surface of the evaporation plate assembly (100). The specific configuration and structure of the heat transfer plate assembly (170) will be described in more detail below.

[0170] It is desirable that the lower surface of the heat transfer plate assembly (170) be arranged so that it makes complete contact with the heating surfaces of the heating elements without any gaps, and for this purpose, it will be natural that a heat transfer material (not shown) can be applied between them.

[0171] Meanwhile, in a heat dissipation device (1) according to another embodiment of the present invention, a condensation plate assembly (200) according to the first embodiment, which is coupled to the upper surface of an evaporation plate assembly (100) via a mounting panel (300), may include a heat-conducting panel (200A) on one side and a heat-conducting panel (200B) on the other side, as referenced in FIGS. 3 to 5B.

[0172] Here, the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) are metal panel members each having a predetermined or higher thermal conductivity, and can be processed into sheet metal using a press mold process.

[0173] More specifically, the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) can be formed by sheet metal processing a metal panel member as a base material into a trapezoidal shape in which the upper and lower sides are parallel to each other, but the length of the lower side that is joined to the evaporation plate assembly (100) is shorter than the length of the upper side, through the press mold process described above.

[0174] That is, the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) are connected so as to protrude upwards perpendicular to the upper surface of the evaporator assembly (100), and the internal refrigerant flow space (205) gradually becomes wider as it goes upwards, so that the heat dissipation area with respect to the external air (outside air) can gradually increase.

[0175] In addition, in the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B), a border end (210) for mutual bonding, a plurality of strength reinforcing parts (230) described later, and a first refrigerant flow path (205a) and a second refrigerant flow path (205b), which are detailed configurations of the refrigerant flow space (205), can be simultaneously formed during sheet metal processing according to the press mold process.

[0176] More specifically, the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) are processed into a shape symmetrical to each other through the press mold process described above, and then each edge end (210) except for the lower portion that is joined to the evaporator assembly (100) is joined through a joining process, thereby forming a refrigerant flow space (205) inside.

[0177] Meanwhile, the refrigerant flow space (205) may include a first refrigerant flow path (205a) formed to be spaced apart as much as possible in the thickness direction of the refrigerant flow space (205) as the maximum separation distance between one side heat-conducting panel (200A) and the other side heat-conducting panel (200B), but formed to surround each of the plurality of strength reinforcement parts (230) described later, and a second refrigerant flow path (205b) formed to be recessed toward the refrigerant flow space (205) in the one side heat-conducting panel (200A) and the other side heat-conducting panel (200B), but formed between each of the plurality of strength reinforcement parts (230) described later and the first refrigerant flow path (205a).

[0178] More specifically, the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) can be mutually bonded through a bonding process, with the edge end (210) and the plurality of strength reinforcing parts (230) simultaneously formed during sheet metal processing through a press mold process, so that the refrigerant flow space (205) excluding the lower part, which is the bonding portion for the evaporator assembly (100), can be shielded. At this time, the bonding process may include a welding method, and the welding method may include laser welding.

[0179] Meanwhile, a plurality of strength reinforcing members (230) may be formed in a dot shape or an oval shape by recessing the refrigerant flow space (205) into the inside of the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B) when processing sheet metal through a press mold process. In the condensation plate assembly (200) according to the first embodiment, the plurality of strength reinforcing members (230) may be formed to be evenly spaced apart over the entire area of ​​the one-sided heat-conducting panel (200A) and the other-sided heat-conducting panel (200B).

[0180] Here, a plurality of strength reinforcing members (230) are formed at mutually symmetrical positions on one side heat-conducting panel (200A) and the other side heat-conducting panel (200B), and are provided so that the sunken areas in the refrigerant flow space (205) are mutually contacted, and the contacted areas can be joined by a welding method including a laser welding method.

[0181] The multiple strength reinforcing members (230) formed in this manner can also play a role in reinforcing the rigidity of one side heat-conducting panel (200A) and the other side heat-conducting panel (200B) during sheet metal processing by a press mold process.

[0182] Here, the depth of the second refrigerant passage (205b) formed on each of the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) toward the refrigerant flow space (205) can be formed to be spaced apart from each other in the thickness direction within the refrigerant flow space (205).

[0183] Preferably, the sunken depth of the second refrigerant passage (205b) can be formed to be at least greater than the sunken depth of the first refrigerant passage (205a) and smaller than the plurality of strength reinforcing members (230).

[0184] In particular, it is sufficient to understand that the first refrigerant passage (205a) corresponds to the basic base surface as a portion that is not pressed when the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B) are processed with a press mold process.

[0185] The first refrigerant flow path (205a) serves to guide the flow of liquid refrigerant toward the storage section (110) of the evaporator assembly (100) located lower in the direction of gravity when the liquid refrigerant evaporates within the storage section (110) of the evaporator assembly (100) and changes into a gaseous refrigerant, then diffuses and flows into the refrigerant flow space (205) and then condenses again through heat exchange with the outside air (outside air) and changes into a liquid refrigerant.

[0186] Therefore, it is preferable that the first refrigerant passage (205a) be formed in a pattern that is inclined or vertical so that no flow resistance occurs when the refrigerant flows downward based on the direction of gravity.

[0187] Meanwhile, the second refrigerant passage (205b) can play a role in facilitating the diffusion and dispersion of the vaporized refrigerant within the storage portion (110) of the evaporator plate assembly (100). That is, since the liquid refrigerant is usually guided to flow through the first refrigerant passage (205a), the vapor refrigerant flows more actively and is diffused and dispersed through the second refrigerant passage (205b) which is smaller in the thickness direction than the first refrigerant passage (205a), thereby shortening the overall vapor-liquid circulation cycle.

[0188] Here, the second refrigerant passage (205b) can be formed to be distinguished by the first refrigerant passage (205a) for each of the plurality of strength reinforcing members (230).

[0189] More specifically, when defining that the plurality of strength reinforcement parts (230) are arranged to have a uniform spacing across the entire area of ​​each of the one-side heat-conducting panel (200A) and the other-side heat-conducting panel (200B), and are formed to be sunken toward the refrigerant flow space (205) in a dot shape, the second refrigerant flow path (205b) can be sunken in a predetermined pattern shape to surround the periphery of each strength reinforcement part (230).

[0190] Here, the pattern shape of the second refrigerant passage (205b) includes all of a hexagonal shape, a pentagonal shape, and a square shape, and it is preferable to adopt a shape that does not affect the inclined shape of the first refrigerant passage (205a) described above.

[0191] Meanwhile, the first refrigerant passage (205a) can be formed in a pattern shape in which each pattern shape of the second refrigerant passage (205b) described above is mutually distinguishable.

[0192] Referring to FIGS. 10 to 14, a method for manufacturing a condenser plate assembly (202) according to one embodiment of the present invention is briefly described as follows.

[0193] First, a metal panel member, preferably made of SUS material as a base metal panel member, can be manufactured by forming a heat-conducting panel (200A) on one side and a heat-conducting panel (200B) on the other side through sheet metal processing using a press mold process so that the left and right sides are symmetrical with respect to the middle part in the longitudinal direction.

[0194] In particular, during the press mold process, a refrigerant flow space (205) is formed with a predetermined thickness inside one side heat-conducting panel (200A) and the other side heat-conducting panel (200B), and the edge ends (210) can be simultaneously processed and formed to be mutually joined so that the refrigerant flow space (205) is closed except for the lower part (240) that is coupled to the evaporator assembly (100).

[0195] In addition, during the press mold process, a plurality of strength reinforcement parts (230) for welding-joining each other within the refrigerant flow space (205) between one side heat-conducting panel (200A) and the other side heat-conducting panel (200B) can be simultaneously processed and formed, and the respective pattern shapes of the first refrigerant flow path (205a) and the second refrigerant flow path (205b) formed around each of the plurality of strength reinforcement parts (230) can also be simultaneously processed and formed.

[0196] After the edge end (210), the strength reinforcement part (230), and the first refrigerant flow path (205a) and the second refrigerant flow path (205b) described above are formed through the press mold process, the edge end (210) and the strength reinforcement part (230) of one side heat-conducting panel (200A) and the other side heat-conducting panel (200B) are welded through a bonding process, thereby forming a refrigerant flow space (205) inside.

[0197] Meanwhile, the condensation plate assembly (200) according to the first embodiment manufactured through the process described above can be installed so that its lower part (240) is immersed in the storage part (110) of the evaporation plate assembly (100), as shown in FIGS. 13 and 14.

[0198] Fig. 15 is a perspective view showing the evaporation plate assembly of the configuration of Fig. 1, Fig. 16 is an exploded perspective view of the configuration of Fig. 15 with the mounting panel separated, Fig. 17 is an exploded perspective view of the configuration of Fig. 15 with the mounting panel and heat transfer plate assembly separated, Fig. 18 is a perspective view of the configuration of Fig. 15 with the mounting panel removed, and Fig. 19 is an exploded perspective view of one row of the plurality of rigid reinforcing members of Fig. 16 with one row separated.

[0199] The evaporation plate assembly (100) in which the condensation plate assembly (200) according to the first embodiment is installed is described in more detail as follows.

[0200] The evaporator assembly (100) is provided so as to be in surface thermal contact with the heating surfaces of the heating elements, as shown in FIGS. 15 to 19, and can serve as a heat sink that changes the liquid refrigerant stored in the internal storage unit (110) into a gaseous refrigerant by the heat supplied from the heating elements.

[0201] To this end, the evaporation plate assembly (100) may be formed of a metal material with excellent thermal conductivity. Preferably, the evaporation plate assembly (100) may be formed of a copper (Cu) material, and, except for the edge end for joining the mounting panel (300), the portion where the storage unit (110) is formed, which directly receives heat from the heating elements, may be formed to have as thin a thickness as possible.

[0202] Meanwhile, a plurality of installation slits (310) for installing a plurality of condensation plate assemblies (200) at a distance from each other can be formed to penetrate in the vertical direction in the mounting panel (300) that shields the upper surface of the storage section (110) of the evaporation plate assembly (100).

[0203] More specifically, when the mounting panel (300) is provided with a rectangular metal panel member that is formed long in the left-right direction, and when the lower part (240) of the condensation plate assembly (200) is installed long in the left-right direction, a plurality of installation slits (310) can be formed to be spaced apart in the width direction defined in the front-back direction.

[0204] In one embodiment of the present invention, a description will be made of a heat dissipation device (1) in which eight condensation plate assemblies (200) are each connected longitudinally in the left and right directions on the upper surface of a single evaporation plate assembly (100), but are arranged at a predetermined distance apart in the width direction.

[0205] Here, the portion forming the storage portion (110) of the evaporation plate assembly (100) is a metal panel member made of copper (Cu) and has very weak strength (hardness), so a plurality of rigid reinforcing members (150) can be installed in the storage portion (110) to reinforce it.

[0206] A plurality of rigid reinforcing members (150) can be arranged to have a plurality of rows extending approximately in the left and right directions of the storage unit (110), as shown in FIGS. 15 to 19.

[0207] More specifically, in the condensation plate assembly (200) according to the first embodiment, a plurality of rigid reinforcing members (150) are arranged so that their lower surfaces are secured to the storage section (110) of the evaporation plate assembly (100) by a fixing method including a welding method, and can be arranged to have four rows in the width direction defined in the front-back direction.

[0208] Here, the adjacent plurality of rigid reinforcing members (150) are provided so that their upper surfaces are divided into two by a dividing groove (155), and each divided upper surface can be in contact with the lower surface corresponding to the space between the installation slits (310) of the mounting panel (300).

[0209] Here, in the case where the condenser plate assembly (200) according to the first embodiment installed through the mounting panel (300) is a total of eight, eight installation slits (310) are also formed on the mounting panel (300). However, since the mounting panel (300) is provided in the form of a very thin SUS material panel, there is a concern that sagging in the vertical direction may occur due to the formation of eight installation slits (310), and therefore, a plurality of rigid reinforcing members (150) are provided to support this.

[0210] More specifically, a plurality of rigid reinforcing members (150) are arranged four apart in the width direction, and a total of eight upper surfaces divided by the dividing grooves (155) of the rigid reinforcing members (150) are fixed and supported by a fixing method including a welding method to the lower surface of the mounting panel (300) corresponding to each of the eight installation slits (310), thereby enabling the mounting panel (300) to be supported upward.

[0211] In each side portion of the plurality of rigid reinforcing members (150) described above, the lower portion (240) of the plurality of condensation plate assemblies (200) is inserted, so that the outer surface of the lower portion of one side heat-conducting panel (200A) and the other side heat-conducting panel (200B) constituting each condensation plate assembly (202) can be supported.

[0212] More specifically, a plurality of rigid reinforcing members (150) can be arranged in a plurality of rows to support the lower surface of the mounting panel (300) and the bottom surface of the storage section (110) of the evaporation plate assembly (100), and one side of the heat-conducting panel (200A) and the other side of the heat-conducting panel (200B) can be supported on one side of the lower portion and the other side of the lower portion between the plurality of rigid reinforcing members (150).

[0213] In this way, after a plurality of condensing plate assembly (200) according to the first embodiment are joined through each installation slit (310) of the mounting panel (300), the liquid refrigerant stored in the storage unit (110) of the evaporating plate assembly (100) or the gaseous refrigerant that has undergone a phase change therefrom and diffuses and flows through the refrigerant flow space (205) of the condensing plate assembly (200) can be welded together along the periphery of the installation slit (310) to prevent external leakage.

[0214] In this way, the plurality of rigid reinforcing members (150) can serve to reinforce the rigidity of each portion of the evaporation plate assembly (100) and the mounting panel (300) which are provided with a relatively thin thickness by being joined at the contact end portions of the lower and upper sides to the evaporation plate assembly (100) and the mounting panel (300).

[0215] In addition, a plurality of such rigid reinforcing members (150) are positioned in the storage section (110) of the evaporator assembly (100), and are immersed in the stored liquid refrigerant, thereby indirectly transferring heat supplied from the heating elements to the liquid refrigerant. In addition, by increasing the heat transfer area, they can assist in enabling more active gas-liquid conversion (phase change).

[0216] To this end, a plurality of rigid reinforcing members (150) may be provided with a metal material having excellent thermal conductivity, and preferably may be made of the same SUS material as the condensation plate assembly (200) or the same Cu material as the evaporation plate assembly (100).

[0217] Meanwhile, a heat dissipation device (2) according to one embodiment of the present invention may further include a heat transfer plate assembly (170) that directly receives heat generated from heating elements and then mediates the transfer to the lower surface of the evaporation plate assembly (100), as shown in FIGS. 15 to 19.

[0218] In general, the most desirable design in terms of heat transfer efficiency would be one in which the lower surface of the evaporator assembly (100) is in direct surface thermal contact with the heating surfaces of the heating elements. However, it can be assumed that there are cases in which the heating surfaces of the heating elements and the lower surface of the evaporator assembly (100) are separated from each other to the extent that surface thermal contact is impossible due to various reasons.

[0219] Here, the heat transfer plate assembly (170) is placed in a space separated from the heating surfaces of the above-described heating elements, and serves to transfer heat supplied from the heating surfaces of the heating elements to the evaporation plate assembly (100) by utilizing high thermal conductivity.

[0220] A heat transfer plate assembly (170) such as this may include a non-conductive material bonding frame (171) provided in a roughly rectangular frame shape, as shown in FIG. 17, and a heat transfer panel (180) bonded to the center portion of the bonding frame (171), the lower surface of which is in surface thermal contact with the heating surfaces of the heating elements, and the upper surface of which is in surface thermal contact with the lower surface of the evaporation plate assembly (100).

[0221] Here, a predetermined space (173) can be formed between the joining frame (171) and the heat transfer panel (180).

[0222] The heat transfer panel (180) may be made of gold depending on the heat dissipation requirements for the heating elements, as high thermal conductivity is required. However, the entire panel need not be made of gold, and it may be plated with gold to facilitate heat transfer.

[0223] Meanwhile, among the components of the heat transfer plate assembly (170), the joining frame (171) is a structure for heat transfer of the heat transfer panel (180) described above, and is formed so that the center is penetrated in the vertical direction, and at least one pair of panel fixing hooks (174) for fixing the heat transfer panel (180) can be integrally formed on the penetrated inner end of the joining frame (171).

[0224] In addition, a support hook portion (177) may be further formed in the joining frame (171) to be inserted through an extension hole (125, 325) formed in the evaporation plate assembly (100) and the mounting panel (300), and then ultimately hooked onto and fastened to the upper surface of the mounting panel (300).

[0225] In addition, the heat transfer plate assembly (170) may further include at least one guide pin (175) for guiding the hook connection of the evaporation plate assembly (100) and the mounting panel (300) of the coupling frame (171).

[0226] Meanwhile, in the heat dissipation device (1) according to one embodiment of the present invention, the condensing plate assembly (200) according to the first embodiment may further include a plurality of condensing refrigerant capture absorbers (hereinafter, abbreviated as “absorbers”) provided in the condensing plate assembly (202) according to the second embodiment described later, although not shown in the drawing.

[0227] It is sufficient to understand that the absorber here is formed in the same manner as the condensation plate assembly (202) according to the second embodiment described below, so the specific description thereof will be replaced with the description of the condensation plate assembly (202) according to the second embodiment.

[0228] Above, the condenser plate assembly (200) according to the first embodiment included in the heat dissipation device (1) according to another embodiment of the present invention has been described in detail.

[0229] Below, a heat dissipation device (2) according to another embodiment of the present invention and a condenser plate assembly (202) according to a second embodiment included therein are described.

[0230] The condensing plate assembly (202) according to the second embodiment may further include a plurality of condensing refrigerant collecting absorbers (250, hereinafter abbreviated as “absorbers”) arranged in a refrigerant flow space (205) formed between one side heat-conducting panel (202A) and the other side heat-conducting panel (202B), as shown in FIGS. 6 to 8, and supported by contacting the inner surface of the one side heat-conducting panel (202A) forming one side heat-radiating surface of the refrigerant flow space (205) and the inner surface of the other side heat-conducting panel (202B) forming the other side heat-radiating surface of the refrigerant flow space (205).

[0231] Here, the absorber (250) performs the role of capturing the liquid refrigerant that has been phase-changed from a liquid refrigerant state in the storage section (110) of the evaporator assembly (100) and then condensed again from the gaseous refrigerant through heat exchange with the outside air (outside air) after the gaseous refrigerant has been diffused and flowed into the refrigerant flow space (205) between the one-side heat-conducting panel (202A) and the other-side heat-conducting panel (202B) and smoothly flowing into the storage section (110) of the lower evaporator assembly (100).

[0232] In particular, the absorbers (250) are arranged in a plurality of pieces in the refrigerant flow space (205) between the one-side heat-conducting panel (202A) and the other-side heat-conducting panel (202B) which are arranged in a long left-right direction on the upper part of the evaporator assembly (100), and are evenly arranged with a predetermined distance between them in the left-right direction, so that the liquid refrigerant that is uniformly condensed throughout the refrigerant flow space (205) is not concentrated to one side, but is captured and evenly distributed in the adjacent absorbers (250).

[0233] The absorbent (250), although not shown in the drawing, may include a number of pores having a size that allows gaseous refrigerant (gaseous refrigerant) to pass through without interference and allows liquid refrigerant (liquid refrigerant) to be absorbed by capillary force or surface tension.

[0234] In addition, the absorbent (250) may be provided in the form of either a metal foam in which metal wires are braided to form the above-described plurality of pores, or a metal sintered body in which metal powder is sintered.

[0235] In particular, the absorber (250) is preferably made of a metal material so that it can efficiently evaporate the absorbed liquid refrigerant by receiving heat transferred from the heating elements via the evaporation plate assembly (100), and more preferably, it can be made of SUS material.

[0236] As described above, a plurality of absorbers (250) can be installed to be supported in a plurality of absorber installation grooves (220) provided on the refrigerant flow space (205) of one side heat-conducting panel (202A) and the other side heat-conducting panel (202B).

[0237] Meanwhile, a plurality of absorbers (250) and a plurality of absorber installation grooves (220) can be arranged to be spaced apart from each other in the horizontal direction (more specifically, in the longitudinal direction, that is, the left-right direction of the evaporation plate assembly (100).

[0238] Here, when the absorber (250) is provided with a metal foam and a metal sintered body of a metal material as described above, it has its own rigidity and hardness, and can play a role in supplementing the strength of the one-sided heat-conducting panel (202A) and the other-sided heat-conducting panel (202B) manufactured with a relatively thin thickness as described below.

[0239] For example, the rigidity of the one-side heat-conducting panel (202A) and the other-side heat-conducting panel (202B) itself is increased through the multiple absorber installation grooves (220) formed by the press mold process on the side of the refrigerant flow space (205) so that multiple absorbers (250) are installed, and the multiple absorbers (250) themselves installed in the refrigerant flow space (205) are supported outwardly against an external force acting from the outside toward the refrigerant flow space (205), so that the outer shapes of the one-side heat-conducting panel (202A) and the other-side heat-conducting panel (202B) can be maintained.

[0240] On the other hand, while the plurality of absorbers (250) provide shape retention force against an external force acting from the outside toward the refrigerant flow space (205), the plurality of strength reinforcing members (230) are mutually bonded within the refrigerant flow space (205), as described below, thereby preventing one side heat-conducting panel (202A) and the other side heat-conducting panel (202B) from being separated from each other or shaking in response to a change in internal pressure that occurs when the refrigerant phases change, thereby providing shape retention force against the internal pressure.

[0241] Here, in one side heat-conducting panel (202A) and the other side heat-conducting panel (202B), as referenced in FIGS. 6 to 8, a plurality of absorber installation grooves (220) for supporting the absorption body (250) to prevent the flow of the absorption body (250) within the refrigerant flow space (205) are evenly spaced apart from each other at the middle portions of the left and right ends, and a plurality of strength reinforcing parts (230) can be formed on one side heat-conducting panel (202A) and the other side heat-conducting panel (202B) that are not occupied by the plurality of absorber installation grooves (220).

[0242] Meanwhile, the plurality of absorbers (250) may be formed to protrude further downward than the lower ends of one side heat-conducting panel (202A) and the other side heat-conducting panel (202B) so that the lower ends are immersed in the storage portion (110) of the evaporation plate assembly (100), as shown in FIGS. 6 and 7.

[0243] That is, when the lower portions of the one-side heat-conducting panel (202A) and the other-side heat-conducting panel (202B) are joined to the evaporation plate assembly (100) by dropping the condensed liquid refrigerant from the refrigerant flow space (205), the plurality of absorbers (250) may have a length that protrudes further downward than the lower portions of the one-side heat-conducting panel (202A) and the other-side heat-conducting panel (202B) so that the lower portions are positioned in the storage portion (110) of the evaporation plate assembly (100).

[0244] FIG. 20 is an exploded perspective view of a condensation plate assembly according to the second embodiment of the configuration of FIG. 2, separated from an evaporation plate assembly; FIG. 21 is an exploded perspective view of FIG. 20; FIG. 22 is an exploded perspective view of a condensation plate assembly according to the second embodiment of FIG. 20, separated from a heat-conducting panel on the other side; FIG. 23 is a perspective view of a single condensation plate assembly according to the second embodiment of the configuration of the heat dissipation device of FIG. 20, coupled to an evaporation plate assembly, with the mounting panel removed; FIG. 24 is an exploded perspective view of a mounting panel separated from an evaporation plate assembly; FIG. 25 is an exploded perspective view of a mounting panel and a plurality of rigid reinforcing members separated from the configuration; FIG. 26 is a perspective view of a configuration of FIG. 24, with the mounting panel removed; and FIG. 27 is an exploded perspective view of one of a plurality of rigid reinforcing members of FIG. 24, separated. It's a perspective view.

[0245] In a heat dissipation device (2) according to another embodiment of the present invention, each configuration of the evaporation plate assembly (100) and the mounting panel (200) is described as being the same as that of the heat dissipation device (1) according to an embodiment of the present invention already described.

[0246] However, in the heat dissipation device (2) according to another embodiment of the present invention, the plurality of rigid reinforcing members (150') may be configured differently as follows compared to the heat dissipation device (1) according to another embodiment of the present invention already described.

[0247] That is, a plurality of rigid reinforcing members (150') may be arranged to be installed in the storage section (110) of the evaporation plate assembly (100), and may be arranged to have eight rows in the width direction defined in the front-back direction.

[0248] Here, a plurality of adjacent rigid reinforcing members (see drawing symbols '150-1' and '150-2' of FIG. 25) are arranged so as to have a predetermined distance in the front-rear width direction, and each distance can be arranged so as to be located directly below the installation slit (310) of the mounting panel (300) arranged thereon.

[0249] In a space corresponding to the spacing between the plurality of rigid reinforcing members (150-1, 150-2) described above, the lower portion (240) of the plurality of condensation plate assemblies (202) according to the second embodiment is inserted, so that the plurality of rigid reinforcing members (150') can play a role of supporting the outer surface of the lower portion of one side heat-conducting panel (202A) and the other side heat-conducting panel (202B) that constitute the condensation plate assembly (202) according to the second embodiment, respectively.

[0250] More specifically, a plurality of rigid reinforcing members (150') can be arranged in a plurality of rows to support the lower surface of the mounting panel (300) and the bottom surface of the storage section (110) of the evaporation plate assembly (100), and one side of the heat-conducting panel (202A) and the other side of the heat-conducting panel (202B) can be supported on one side of the lower portion and the other side of the lower portion between the plurality of rigid reinforcing members (150').

[0251] In this way, after a plurality of condensing plate assembly (202) according to the second embodiment are joined through each installation slit (310) of the mounting panel (300), the liquid refrigerant stored in the storage unit (110) of the evaporating plate assembly (100) or the gaseous refrigerant that has undergone a phase change therefrom and diffuses and flows through the refrigerant flow space (205) of the condensing plate assembly (202) can be welded together along the periphery of the installation slit (310) to prevent external leakage.

[0252] Meanwhile, a plurality of rigid reinforcing members (150') are formed to have a wave-shaped vertical cross-section, and the lower surface (150B) is in contact with the bottom surface (115) of the storage section (110) of the evaporation plate assembly (100), and the upper surface (150A) is in contact with the lower surface (355) corresponding to the space between the installation slits (310) of the mounting panel (300), and each contacted portion can be joined by a welding method.

[0253] In this way, the plurality of rigid reinforcing members (150') can serve to reinforce the rigidity of each portion of the evaporation plate assembly (100) and the mounting panel (300) which are provided with a relatively thin thickness by having the respective contact end portions (150A, 150B) on the lower and upper sides joined to the evaporation plate assembly (100) and the mounting panel (300).

[0254] In addition, a plurality of such rigid reinforcing members (150') are positioned in the storage section (110) of the evaporator assembly (100), and are immersed in the stored liquid refrigerant, thereby indirectly transferring heat supplied from the heating elements to the liquid refrigerant. In addition, by increasing the heat transfer area, they can assist in enabling more active gas-liquid conversion (phase change).

[0255] To this end, a plurality of rigid reinforcing members (150') may be provided with a metal material having excellent thermal conductivity, and preferably, may be selected from the same SUS material as the condensation plate assembly (202) according to the second embodiment or the same Cu material as the evaporation plate assembly (100).

[0256] Fig. 28 is a cross-sectional view taken along line A'-A' of Fig. 1, Fig. 29a is a front view (a) and a cross-sectional view (b) taken along line B'-B' of Fig. 2, and Fig. 29b is a front view (a) and a cross-sectional view (b) taken along line C'-C' of Fig. 2.

[0257] Briefly describing the heat dissipation process by the heat dissipation device (1) according to another embodiment of the present invention, as shown in FIG. 28, when the liquid refrigerant (liquid refrigerant) stored in the storage unit (110) of the evaporator assembly (100) receives heat from the heating elements through the lower surface of the evaporator assembly (100) or the heat transfer panel (180) of the heat transfer plate assembly (170) as a medium and then changes into a gaseous refrigerant (gaseous refrigerant), the liquid refrigerant diffuses and flows toward the refrigerant flow space (205) of the plurality of condenser plate assemblies (200) implemented as the first embodiment, and the liquid refrigerant condensed through heat exchange with the outside air (outside air) easily falls in the direction of gravity through the first refrigerant flow path (205a) of the refrigerant flow space (205), thereby repeatedly capturing the liquid refrigerant again in the storage unit (110) of the evaporator assembly (100). It is a circulation of gas and liquid.

[0258] At this time, the evaporation plate assembly (100) not only has the mounting panel (300) firmly supported by a plurality of rigid reinforcing members (150), but also the condensation plate assembly (200) can have its own rigidity that can easily respond to changes in internal pressure during gas-liquid circulation by a plurality of strength reinforcing members (230).

[0259] Meanwhile, a heat dissipation device (2) according to another embodiment of the present invention, as also shown in FIGS. 29a and 29b, can form a gas-liquid circulation cycle in which the phase change from liquid refrigerant to gaseous refrigerant occurs in the storage unit (110) of the evaporator plate assembly (100), like the heat dissipation device (1) according to the above-described embodiment of the present invention, and the phase change from gaseous refrigerant to liquid refrigerant is repeated through the refrigerant flow space (205) of a plurality of condenser plate assemblies (200) according to the second embodiment.

[0260] At this time, the liquid refrigerant condensed inside the plurality of condensing plate assemblies (200) is uniformly collected into the storage unit (110) of the evaporating plate assembly (100) located at the lower side based on the direction of gravity through the absorber (250), thereby enabling faster gas-liquid circulation.

[0261] According to the embodiments of the present invention, each condensing plate assembly (200, 202) of the heat dissipation device (1, 2) having the above-described configuration provides the advantage of maximizing heat dissipation performance by adopting a SUS material having a thermal conductivity of 1 / 10 or less, rather than the most commonly used aluminum (Al) material, as the metal material of the metal panel member forming the one-sided heat-conducting panel (200A, 202A) and the other-sided heat-conducting panel (200B, 202B), and by manufacturing it with a slim thickness so that almost all of the heat generated from the heating elements is actually invested only in the gas-liquid change (phase change) of the refrigerant that performs the heat dissipation role, and by having a technical feature designed to minimize the conversion of heat energy into physical force through the change in internal pressure within the refrigerant flow space (205) due to the manufacturing with a slim thickness.

[0262]

[0263] Hereinafter, the condenser plate assembly and the heat dissipation device including the same according to embodiments of the present invention have been described in detail with reference to the attached drawings. However, the embodiments of the present invention are not necessarily limited to the above-described single embodiment, and it will be understood that various modifications and equivalent implementations are possible by those skilled in the art to which the present invention pertains. Therefore, the true scope of the present invention is defined by the claims set forth below.

[0264]

[0265] The present invention provides a condensing plate assembly and a heat dissipation device including the same, which can prevent physical shaking due to an increase in internal pressure occurring during the gas-liquid circulation of a refrigerant and achieve a shorter gas-liquid circulation cycle.

Claims

1. A one-sided thermal conductive panel which is a metal panel member having a thermal conductivity higher than a predetermined level; and A second side heat-conducting panel which is the same metal panel member as the first side heat-conducting panel; The above one-sided heat-conducting panel and the other-sided heat-conducting panel are joined together at the edges except for the lower part based on the direction of gravity to form a refrigerant flow space in which the refrigerant flows. A condensation plate assembly in which the lower portions of the one-side heat-conducting panel and the other-side heat-conducting panel are connected to an evaporation plate assembly in which a storage portion is formed in which condensed liquid refrigerant from the refrigerant flow space falls and is stored.

2. In claim 1, A condensation plate assembly, wherein a plurality of strength reinforcing parts are formed inwardly and grooved so as to be in contact with each other in the refrigerant flow space, on the one side heat-conducting panel and the other side heat-conducting panel.

3. In claim 2, A condenser plate assembly in which the plurality of strength reinforcing members are joined by welding at the points where they come into contact with each other in the refrigerant flow space.

4. In claim 2, The above refrigerant flow space is, A first refrigerant flow path formed to be spaced apart as much as possible in the thickness direction of the refrigerant flow space as the maximum separation distance between the one side heat-conducting panel and the other side heat-conducting panel, and formed to surround the periphery of each of the plurality of strength reinforcing parts; and A condensation plate assembly comprising a second refrigerant passage formed between each of the plurality of strength reinforcing parts and the first refrigerant passage, wherein the second refrigerant passage is formed to be sunken into the refrigerant flow space side in the one-side heat-conducting panel and the other-side heat-conducting panel; 5. In claim 4, A condensing plate assembly in which the depth of the second refrigerant passage toward the refrigerant flow space is formed to be spaced apart from each other in the thickness direction within the refrigerant flow space.

6. In claim 4, A condenser plate assembly, wherein the sunken depth of the second refrigerant passage is at least greater than the sunken depth of the first refrigerant passage and smaller than the plurality of strength reinforcing members.

7. In claim 4, A condensing plate assembly, wherein the second refrigerant passage is defined to be distinct from the adjacent second refrigerant passage by the first refrigerant passage.

8. In claim 1, A condensation plate assembly in which the lower ends of the one-side heat-conducting panel and the other-side heat-conducting panel are overlapped and connected to the storage portion of the evaporation plate assembly.

9. In claim 8, A condensation plate assembly in which the one-side heat-conducting panel and the other-side heat-conducting panel are connected so that their lower ends penetrate an installation slit formed in a mounting panel connected to the upper surface of the evaporation plate assembly to mediate connection with the evaporation plate assembly and are secured to the storage unit.

10. In claim 9, The above one-side heat-conducting panel and the other-side heat-conducting panel are joined to the installation slit of the above-mentioned mounting panel and then welded along the periphery of the installation slit, thereby forming a condensation plate assembly.

11. In claim 9, In the storage section of the above evaporation plate assembly, a plurality of rigid reinforcing members are arranged in a plurality of rows spaced apart from each other to support the lower surface of the mounting panel and the bottom surface of the storage section. The above-mentioned one-side heat-conducting panel and the other-side heat-conducting panel are a condensation plate assembly in which the upper surface, which is distinguished by a dividing groove formed in a groove shape on the upper portion of the plurality of rigid reinforcing members, is supported on the lower surface of the mounting panel.

12. In claim 1, A condensation plate assembly in which the one-side heat-conducting panel and the other-side heat-conducting panel are mutually joined at the edge ends except for the lower end that is joined to the evaporation plate assembly to form the refrigerant flow space.

13. In claim 1, A condensing plate assembly further comprising a plurality of condensing refrigerant collecting absorbers arranged in a refrigerant flow space formed between the one-side heat-conducting panel and the other-side heat-conducting panel to guide condensing refrigerant.

14. A one-sided thermally conductive panel which is a metal panel member having a thermal conductivity higher than a predetermined level; A second side heat-conducting panel which is the same metal panel member as the first side heat-conducting panel; and A condensing plate assembly comprising a plurality of condensing refrigerant collecting absorbers (hereinafter, abbreviated as “absorbers”) arranged long in the direction of gravity so as to be supported by contacting the inner surface of the one-side heat-conducting panel forming one heat dissipation surface of the refrigerant flow space and the inner surface of the other-side heat-conducting panel forming the other heat dissipation surface of the refrigerant flow space, while being arranged in a refrigerant flow space formed between the one-side heat-conducting panel and the other-side heat-conducting panel; 15. In claim 14, The above absorber is a condenser plate assembly comprising either a metal foam in which metal wires are braided or a metal sintered body in which metal powder is sintered.

16. In claim 14, The above absorber is a condensing plate assembly having a plurality of pores formed therein, each pore having a size sufficient to allow the condensed liquid refrigerant in the refrigerant flow space to be absorbed by capillary force or surface tension.

17. In claim 14, A condensing plate assembly, wherein a plurality of absorber installation grooves are formed corresponding to the number of absorbers in the one-side heat conduction panel and the other-side heat conduction panel to support and prevent the flow of the absorber within the refrigerant flow space.

18. In claim 17, A condenser plate assembly in which the plurality of absorbers and the plurality of absorber installation grooves are arranged to be spaced apart from each other in the horizontal direction.

19. In claim 14, When the lower portions of the one-side heat-conducting panel and the other-side heat-conducting panel are joined to an evaporation plate assembly in which a storage portion is formed in which the condensed liquid refrigerant from the refrigerant flow space falls and is stored, The above absorber has a length that protrudes downwards more than the lower ends of the one side heat-conducting panel and the other side heat-conducting panel so that the lower end is positioned in the storage portion of the above evaporation plate assembly.

20. In claim 19, A condensation plate assembly in which the one-side heat-conducting panel and the other-side heat-conducting panel are mutually joined at the edge ends except for the lower end that is joined to the evaporation plate assembly to form the refrigerant flow space.

21. In claim 20, A condensation plate assembly, wherein a plurality of strength reinforcing parts are formed inwardly and grooved so as to be in contact with each other in the refrigerant flow space, on the one side heat-conducting panel and the other side heat-conducting panel.

22. In claim 21, A condenser plate assembly in which the plurality of strength reinforcing members are joined by welding at the points where they come into contact with each other in the refrigerant flow space.

23. In claim 21, In the one-side heat-conducting panel and the other-side heat-conducting panel, a plurality of absorber installation grooves are formed corresponding to the number of absorbers to support the absorption body so as to prevent the absorption body from flowing within the refrigerant flow space. A condensation plate assembly in which the above plurality of strength reinforcing parts are formed on the one-side heat-conducting panel and the other-side heat-conducting panel that are not occupied by the above plurality of absorber installation grooves.

24. In claim 19, A condensation plate assembly in which the one-side heat-conducting panel and the other-side heat-conducting panel are connected so that their lower ends penetrate an installation slit formed in a mounting panel connected to the upper surface of the evaporation plate assembly to mediate connection with the evaporation plate assembly and are secured to the storage unit.

25. In claim 24, The above one-side heat-conducting panel and the other-side heat-conducting panel are joined to the installation slit of the above-mentioned mounting panel and then welded along the periphery of the installation slit, thereby forming a condensation plate assembly.

26. In claim 24, In the storage section of the above evaporation plate assembly, a plurality of rigid reinforcing members are arranged in multiple rows to support the lower surface of the mounting panel and the bottom surface of the storage section. The above one-side heat-conducting panel and the other-side heat-conducting panel are condensation plate assembly in which one side of the lower portion and the other side of the lower portion are supported between the plurality of rigid reinforcing members.

27. An evaporator having a storage section formed in which liquid refrigerant is stored and is in surface thermal contact with the heating surface of the heating element; A plurality of condensing units coupled to the above evaporation unit and in which the phase-changed gaseous refrigerant in the storage unit diffuses and condenses; and A slit housing that mediates a slit connection between the evaporator and the condenser; A heat dissipation device in which the above evaporation part is made of copper material and the above condensation part is made of SUS material.

28. In claim 27, A heat dissipation device in which the above plurality of condensing sections are formed by joining the edge ends of two parent panels made of SUS material and the strength reinforcing sections formed at multiple locations inside the panels to form a refrigerant flow space in which the liquid refrigerant and the gaseous refrigerant flow.

29. In claim 27, In the above plurality of condensing units, a plurality of refrigerant passages are formed through which the liquid refrigerant flows in the direction of gravity, A heat dissipation device, wherein each of the above plurality of refrigerant passages is provided with an absorber made of a braided wire mesh.

30. In claim 27, A heat dissipation device in which a plurality of strength reinforcing members for reinforcing strength between the above evaporation plate assembly and the mounting panel are joined by a brazing method.

31. An evaporator assembly in which a storage section is formed to store a refrigerant capable of phase change depending on temperature, and at least a portion of the lower surface is in surface thermal contact with the heating surfaces of the heating elements; and A plurality of condensing plate assemblies are connected to the storage unit in communication with the evaporation plate assembly and emit heat transferred from the heating elements through heat exchange with external air (outside air); Each of the above multiple condenser plate assemblies is A one-sided thermally conductive panel which is a metal panel member having a thermal conductivity higher than a predetermined level; and A second side heat-conducting panel, which is a metal panel member identical to the first side heat-conducting panel; The above one-sided heat-conducting panel and the other-sided heat-conducting panel are joined together at the edges except for the lower part based on the direction of gravity to form a refrigerant flow space in which the refrigerant flows. A heat dissipation device in which the lower portions of the one-side heat-conducting panel and the other-side heat-conducting panel are connected to the storage portion of the evaporation plate assembly.

32. In claim 31, A heat dissipation device in which the one-side heat-conducting panel and the other-side heat-conducting panel are mutually joined at the edge ends, except for the lower end that is joined to the evaporator assembly, to form the refrigerant flow space.

33. In claim 31, A heat dissipation device in which a plurality of strength reinforcing parts are formed inwardly with grooves so as to be in contact with each other in the refrigerant flow space, on the one side heat-conducting panel and the other side heat-conducting panel.

34. In claim 33, A heat dissipation device in which the plurality of strength reinforcing members are joined by welding at a location where they come into contact with each other in the refrigerant flow space.

35. In claim 33, The above refrigerant flow space is, A first refrigerant flow path formed to be spaced apart as much as possible in the thickness direction of the refrigerant flow space as the maximum separation distance between the one side heat-conducting panel and the other side heat-conducting panel, and formed to surround the periphery of each of the plurality of strength reinforcing parts; and A heat dissipation device comprising a second refrigerant passage formed between each of the plurality of strength reinforcing parts and the first refrigerant passage, wherein the second refrigerant passage is formed to be sunken into the refrigerant flow space side in the one-side heat-conducting panel and the other-side heat-conducting panel; 36. In claim 35, A heat dissipation device in which the depth of the second refrigerant passage toward the refrigerant flow space is formed to be spaced apart from each other in the thickness direction within the refrigerant flow space.

37. In claim 35, A heat dissipation device in which the sunken depth of the second refrigerant passage is at least greater than the sunken depth of the first refrigerant passage and smaller than the plurality of strength reinforcing members.

38. In claim 35, A heat dissipation device, wherein the second refrigerant passage is defined to be distinct from the adjacent second refrigerant passage by the first refrigerant passage.

39. In claim 1, A heat dissipation device in which the lower ends of the one-side heat-conducting panel and the other-side heat-conducting panel are overlapped and connected to the storage portion of the evaporation plate assembly.

40. In claim 39, Further comprising a mounting panel coupled to the upper surface of the evaporator assembly to mediate coupling of the evaporator assembly and the plurality of condenser plate assemblies; A heat dissipation device in which the one-side heat-conducting panel and the other-side heat-conducting panel are joined so that the lower part penetrates the installation slit formed in the mounting panel and is seated in the storage unit.

41. In claim 40, A heat dissipation device in which the above one-side heat-conducting panel and the other-side heat-conducting panel are joined to the installation slit of the above mounting panel and then welded along the periphery of the installation slit.

42. In claim 40, In the storage section of the above evaporation plate assembly, a plurality of rigid reinforcing members are arranged in a plurality of rows spaced apart from each other to support the lower surface of the mounting panel and the bottom surface of the storage section. A heat dissipation device in which the upper surface of the one-side heat-conducting panel and the other-side heat-conducting panel is supported on the lower surface of the mounting panel by a dividing groove formed in a groove shape on the upper portion of the plurality of rigid reinforcing members.

43. In claim 31, The above condenser assembly is, A heat dissipation device further comprising a plurality of condensed refrigerant collecting absorbers (hereinafter, abbreviated as “absorbers”) arranged in a refrigerant flow space formed between the one-side heat-conducting panel and the other-side heat-conducting panel, and at the same time, being supported by contacting the inner surface of the one-side heat-conducting panel forming one heat dissipation surface in the refrigerant flow space and the inner surface of the other-side heat-conducting panel forming the other heat dissipation surface in the refrigerant flow space; 44. In claim 43, The above absorber is a heat dissipation device provided with either a metal foam in which metal wires are braided or a metal sintered body in which metal powder is sintered.

45. In claim 43, The above absorber is a heat dissipation device in which a plurality of pores are formed, each sized to allow condensed liquid refrigerant in the refrigerant flow space to be absorbed by capillary force or surface tension.

46. ​​In claim 44, A heat dissipation device, wherein a plurality of absorber installation grooves are formed corresponding to the number of absorbers in the one-side heat conduction panel and the other-side heat conduction panel to support and prevent the flow of the absorber within the refrigerant flow space.

47. In claim 46, A heat dissipation device in which the plurality of absorbers and the plurality of absorber installation grooves are arranged to be spaced apart from each other in the horizontal direction.

48. In claim 44, When the lower portions of the one-side heat-conducting panel and the other-side heat-conducting panel are joined to the evaporation plate assembly in which the storage portion is formed, in which the condensed liquid refrigerant from the refrigerant flow space falls and is stored, A heat dissipation device in which the absorber has a length that protrudes lower than the lower ends of the one-side heat-conducting panel and the other-side heat-conducting panel so that the lower end is positioned in the storage portion of the evaporation plate assembly.

49. In claim 31, A heat dissipation device further comprising a heat transfer plate assembly that receives heat generated from the above heating elements and then mediates the transfer to the lower surface of the evaporation plate assembly.

50. In claim 49, The above heat transfer plate assembly, A joining frame having a rectangular frame shape with a hollow center; and A heat dissipation device comprising a heat transfer panel which is coupled to the center portion of the above-mentioned joining frame, the lower surface of which is in surface thermal contact with the heating surfaces of the above-mentioned heating elements, and the upper surface of which is in surface thermal contact with the lower surface of the above-mentioned evaporation plate assembly.

51. In claim 49, A heat dissipation device, wherein at least one pair of panel fixing hooks for fixing the heat transfer panel is integrally formed on the inner end of the above-mentioned joining frame.

52. In claim 49, Further comprising a mounting panel coupled to the upper surface of the evaporator assembly to mediate coupling of the evaporator assembly and the plurality of condenser plate assemblies; A heat dissipation device in which a support hook portion is formed in the above-mentioned joining frame, which is inserted through an extension hole formed in the above-mentioned evaporation plate assembly and the above-mentioned mounting panel, and then hooked onto and fastened to the upper surface of the above-mentioned mounting panel.

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