Antenna structure

Abstract

The antenna structure includes: an antenna element including an antenna conductive layer and an antenna ground layer; a first circuit board electrically connected to the antenna conductive layer; a second circuit board electrically connected to the antenna ground layer; and a connector coupled to both the end of the first circuit board and the end of the second circuit board. The second circuit board may be used to improve radiation directivity, and may be connected to the first circuit board via the connector.

Description

antenna structure

[0001] The present invention relates to an antenna structure. More particularly, it relates to an antenna structure including an antenna element and a circuit board.

[0002] With the recent development of the information society, wireless communication technologies such as Wi-Fi and Bluetooth are being applied or built into display devices, electronic devices, and buildings.

[0003] In addition, as mobile communication technology has evolved recently, antennas for performing high-frequency or ultra-high-frequency communication are being applied to public transportation such as buses and subways, building structures, and various mobile devices.

[0004] For example, repeater antennas can be applied to public transportation such as buses and subways, building structures, windows, etc. to facilitate signal transmission and reception in image display devices, electronic devices, etc. having high frequency or ultra-high frequency communication bands such as 3G, 4G, 5G, or higher.

[0005] For example, a film-shaped antenna can be attached to a target object and connected to an external power source via a circuit board and connector. However, signal and power loss may occur on the circuit board, as well as at the connection points between the circuit board and the connector. Furthermore, the antenna's directivity may be disrupted depending on the material, structure, etc. of the target object.

[0006] Therefore, it is necessary to design an antenna structure that can avoid / reduce signal loss and radiation characteristic disturbance caused by the target and connecting structures.

[0007] For example, Korean Patent Publication No. 2019-0009232 discloses an antenna module integrated into a display panel.

[0008] An object of the present invention is to provide an antenna structure having improved operational reliability and signal efficiency.

[0009] 1. An antenna structure comprising an antenna element including an antenna conductive layer and an antenna ground layer; a first circuit board electrically connected to the antenna conductive layer; a second circuit board electrically connected to the antenna ground layer; and a connector coupled together to ends of the first circuit board and the second circuit board.

[0010] 2. In the above 1, the first circuit board comprises: a first core layer; a first inner conductive layer formed on one surface of the first core layer adjacent to the antenna conductive layer and including a signal wiring electrically connected to the antenna conductive layer; and a first outer conductive layer formed on the other surface of the first core layer opposite to the one surface and facing the first inner conductive layer, an antenna structure.

[0011] 3. An antenna structure according to the above 2, wherein the first inner conductive layer further includes a co-planar ground disposed around the signal wiring on the one surface of the first core layer.

[0012] 4. An antenna structure according to the above 3, wherein the first circuit board further includes a via structure penetrating the first core layer to electrically connect the first outer conductive layer and the co-planar ground.

[0013] 5. An antenna structure in the above 2, wherein the second circuit board includes a second core layer; and a second inner conductive layer formed on one surface of the second core layer adjacent to the antenna ground layer.

[0014] 6. An antenna structure according to 5 above, wherein the second circuit board further includes a second outer conductive layer formed on the other side opposite to the first side of the second core layer and facing the second inner conductive layer.

[0015] 7. An antenna structure according to 6 above, wherein the connector includes a ground pin connected to the second inner conductive layer or the second outer conductive layer of the second circuit board; and a signal / power supply pin connected to the signal wiring of the first circuit board.

[0016] 8. An antenna structure according to 7 above, further comprising a penetration fixing mechanism that penetrates the first circuit board and the second circuit board and is fastened to the ground pin of the connector.

[0017] 9. An antenna structure in the above 8, wherein a pair of penetration fixing mechanisms are fastened to the connector with the signal / feed pins of the connector interposed therebetween.

[0018] 10. An antenna structure according to the above 1, further comprising an insulating blocking structure disposed between the connectors and the adjacent ends of the first circuit board and the second circuit board.

[0019] 11. An antenna structure according to the above 1, wherein the antenna element further includes an antenna dielectric layer disposed between the antenna conductive layer and the antenna ground layer.

[0020] 12. An antenna structure according to the above 11, wherein the antenna dielectric layer comprises at least two dielectric layers and at least two point-adhesive layers.

[0021] 13. In the above 1, the antenna conductive layer includes an antenna unit including a radiator, a transmission line connected to one end of the radiator, and a signal pad connected to a terminal end of the transmission line, and the first circuit board includes a signal wiring bonded to the signal pad of the antenna unit.

[0022] 14. An antenna structure according to 13 above, wherein the radiator has a mesh structure and the signal pad is a solid metal or alloy pattern.

[0023] 15. An antenna structure according to 13 above, wherein the antenna unit further includes a ground pad disposed around the signal pad and electrically and physically separated from the signal pad, and the first circuit board further includes a co-planar ground extending along the signal wire around the signal wire and bonded to the ground pad of the antenna unit.

[0024] An antenna structure according to embodiments of the present invention may include a first circuit board connected to an antenna unit and a second circuit board connected to an antenna ground layer. The first circuit board and the second circuit board may be connected together to a connector.

[0025] As the second circuit board is connected to the connector, the ground efficiency through the antenna ground layer is increased, and the directivity of the antenna unit can be enhanced. According to exemplary embodiments, by utilizing a plurality of separate circuit boards, a stable connection between the antenna element and the connector can be implemented without folding of the circuit board even if the thickness of the antenna element increases.

[0026] The connector can be connected to the first circuit board and the second circuit board through a fixing mechanism (connection pin) that penetrates the first circuit board and the second circuit board. Therefore, soldering or welding can be omitted, and physical and thermal damage to the connection area of ​​the circuit board can be prevented.

[0027] In some embodiments, a blocking structure may be inserted between the first circuit board and the second circuit board in the connection area. The blocking structure prevents short-circuiting between the first circuit board and the second circuit board, and enables stable connector connection.

[0028] FIG. 1 is a schematic cross-sectional view showing an antenna structure according to exemplary embodiments.

[0029] FIG. 2 is a partially enlarged cross-sectional view showing an antenna structure in a connection area according to exemplary embodiments.

[0030] FIG. 3 is a plan view of a first surface direction of a first circuit board of an antenna structure according to exemplary embodiments.

[0031] FIG. 4 is a plan view of a second surface direction of a first circuit board of an antenna structure according to exemplary embodiments.

[0032] FIG. 5 is a plan view of a second circuit board of an antenna structure according to exemplary embodiments in the first surface direction.

[0033] FIG. 6 is a plan view of a second surface direction of a second circuit board of an antenna structure according to exemplary embodiments.

[0034] FIG. 7 is a schematic plan view showing an antenna unit included in an antenna structure according to exemplary embodiments.

[0035] FIG. 8 is a schematic cross-sectional view showing an antenna element of an antenna structure according to some exemplary embodiments.

[0036] Embodiments of the present invention provide an antenna structure including an antenna element and a plurality of circuit boards.

[0037] Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings. However, the following drawings attached to this specification illustrate preferred embodiments of the present invention and, together with the contents of the invention described above, serve to further understand the technical concept of the present invention. Therefore, the present invention should not be interpreted as being limited to the matters described in such drawings.

[0038] The terms “first,” “second,” “upper,” “lower,” “top,” “bottom,” etc. used in this application are not used to designate absolute positions, but rather to distinguish different configurations or to distinguish relative positions between configurations.

[0039] The sizes of the components / structures illustrated in the attached drawings may be exaggerated for convenience of explanation and are not limited to the sizes illustrated in the drawings.

[0040] FIG. 1 is a schematic cross-sectional view showing an antenna structure according to exemplary embodiments.

[0041] Referring to FIG. 1, the antenna structure may include an antenna element (100), a first circuit board (210), a second circuit board (250), and a connector (300).

[0042] The antenna element (100) may include an antenna conductive layer (120), a dielectric layer (antenna dielectric layer) (110), and an antenna ground layer (130). The antenna conductive layer (120) and the antenna ground layer (130) may be formed on the upper and lower surfaces of the dielectric layer (110), respectively.

[0043] The antenna conductive layer (120) and the antenna ground layer (130) may include a metal or an alloy. For example, the antenna conductive layer (120) and the antenna ground layer (130) may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these. These may be used alone or in combination of two or more thereof.

[0044] In one embodiment, the antenna conductive layer (120) and the antenna ground layer (130) may include silver (Ag) or a silver alloy (e.g., a silver-palladium-copper (APC) alloy), or copper (Cu) or a copper alloy (e.g., a copper-calcium (CuCa) alloy) for low resistance implementation and fine linewidth patterning.

[0045] In some embodiments, the antenna conductive layer (120) may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (ITZO), or zinc oxide (ZnOx).

[0046] In some embodiments, the antenna conductive layer (120) may include a laminated structure of a transparent conductive oxide layer and a metal layer, for example, a two-layer structure of a transparent conductive oxide layer-metal layer, or a three-layer structure of a transparent conductive oxide layer-metal layer-transparent conductive oxide layer. In this case, the flexible characteristics may be improved by the metal layer, while the resistance may be lowered, thereby improving the signal transmission speed, and the corrosion resistance and transparency may be improved by the transparent conductive oxide layer.

[0047] The antenna conductive layer (120) may include a blackening treatment portion. Accordingly, the reflectivity on the surface of the antenna unit may be reduced, thereby reducing pattern visibility due to light reflection.

[0048] In one embodiment, the surface of the metal layer included in the antenna unit may be converted into a metal oxide or metal sulfide to form a blackening layer. In one embodiment, a blackening layer such as a black material coating layer or a plating layer may be formed on the antenna unit or the metal layer. The black material or plating layer may include an oxide, sulfide, alloy, or the like containing silicon, carbon, copper, molybdenum, tin, chromium, molybdenum, nickel, cobalt, or at least one of these.

[0049] The composition and thickness of the blackening layer can be adjusted taking into account the reflectivity reduction effect and antenna radiation characteristics.

[0050] The dielectric layer (110) may include, for example, a transparent resin material. For example, the dielectric layer (110) may include a polyester resin such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, or polybutylene terephthalate; a cellulose resin such as diacetyl cellulose or triacetyl cellulose; a polycarbonate resin; an acrylic resin such as polymethyl (meth)acrylate or polyethyl (meth)acrylate; a styrene resin such as polystyrene or an acrylonitrile-styrene copolymer; a polyolefin resin such as polyethylene, polypropylene, a polyolefin having a cyclo- or norbornene structure, or an ethylene-propylene copolymer; a vinyl chloride resin; an amide resin such as nylon or an aromatic polyamide; an imide resin; a polyethersulfone resin; a sulfone resin; a polyetheretherketone resin; a sulfated polyphenylene resin; a vinyl alcohol resin; It may include vinylidene chloride resin; vinyl butyral resin; allylate resin; polyoxymethylene resin; epoxy resin; urethane or acrylic urethane resin; silicone resin, etc. These may be used alone or in combination of two or more.

[0051] In some embodiments, an adhesive film such as an optically clear adhesive (OCA), an optically clear resin (OCR), or the like may also be included in the dielectric layer (110).

[0052] In some embodiments, the dielectric layer (110) may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, glass, or the like.

[0053] The dielectric layer (110) forms an impedance or inductance for the antenna unit, so that the frequency band that the antenna element (100) can drive or sense can be adjusted. In some embodiments, the dielectric constant of the dielectric layer (110) can be adjusted to a range of about 1.5 to 12. If the dielectric constant exceeds about 12, the driving frequency may be excessively reduced, so that driving in a high-frequency band may not be realized.

[0054] The first circuit board (210) may be electrically connected to the antenna conductive layer (120) or the antenna unit. The second circuit board (250) may be electrically connected to the antenna ground layer (130).

[0055] One end of the first circuit board (210) and the second circuit board (250) can be electrically connected to the antenna element (100) in the bonding area (BR).

[0056] In some embodiments, the antenna unit and the first circuit board (210) may be electrically connected to each other using a first conductive bonding film (160) in the bonding area (BR). The antenna ground layer (130) and the second circuit board (250) may be electrically connected to each other using a second conductive bonding film (170) in the bonding area (BR).

[0057] The first conductive bonding film (160) and the second conductive bonding film (170) can each be formed from an anisotropic conductive film (ACF).

[0058] The other ends of the first circuit board (210) and the second circuit board (250) can be electrically connected to a connector (300) at a connection area (CR). The connection area (CR) can be an area where an external power source and an antenna structure are connected via the connector (300).

[0059] According to the exemplary embodiments described above, the antenna ground layer (130) may be connected to the second circuit board (250), so that the grounding efficiency through the antenna ground layer (130) may be improved. In addition, the radiation directivity of the antenna conductive layer (120) may be enhanced in the direction opposite to the antenna ground layer (130). According to the exemplary embodiments, the antenna element (100) may be provided as a vertical radiation antenna having radiation directivity above the upper surface of the antenna conductive layer (120).

[0060] According to exemplary embodiments, the first circuit board (210) connected to the antenna unit and the second circuit board (250) connected to the antenna ground layer (130) can be used as independent circuit boards that are physically separated from each other. Accordingly, directivity enhancement through the antenna ground layer (130) and power / signal transmission efficiency to the antenna conductive layer (120) can be independently implemented without mutual interference.

[0061] Even if the thickness of the antenna element (100) increases, the first circuit board (210) and the second circuit board (250) can be connected to the connector (300) while being separated from each other. Therefore, damage to the circuit board due to bending stress caused when using a single circuit board can be prevented. Therefore, power supply / signal loss through the circuit boards (210, 250) can be prevented, and radiation efficiency through the antenna conductive layer (120) can be improved.

[0062] In some embodiments, a blocking structure (290) may be disposed between the other ends of the first circuit board (210) and the second circuit board (250) in the connection area (CR). The blocking structure (290) includes an insulating material such as a resin material and may prevent the first circuit board (210) and the second circuit board (250) from contacting or short-circuiting each other in the connection area (CR).

[0063] For example, the blocking structure (290) may be formed in the form of an insulating printed pattern, an adhesive film, or a tape.

[0064] FIG. 2 is a partially enlarged cross-sectional view showing an antenna structure in a connection area according to exemplary embodiments.

[0065] Referring to FIG. 2, the first circuit board (210) may include a first core layer (215), a first inner conductive layer (220), and a first outer conductive layer (230). The first inner conductive layer (220) and the first outer conductive layer (230) may be disposed on the lower surface and the upper surface of the first core layer (215), respectively.

[0066] The lower surface of the first core layer (215) may be a surface adjacent to the antenna conductive layer (120), and the upper surface of the first core layer (215) may be an opposite surface of the lower surface and the antenna conductive layer (120).

[0067] The first inner conductive layer (220) of the first circuit board (210) can be bonded and electrically connected to the antenna conductive layer (120).

[0068] The second circuit board (250) may include a second core layer (255), a second inner conductive layer (260), and a second outer conductive layer (270). The second inner conductive layer (260) and the second outer conductive layer (270) may be disposed on the upper and lower surfaces of the second core layer (255), respectively.

[0069] The upper surface of the second core layer (255) may be a surface adjacent to the antenna ground layer (130), and the lower surface of the second core layer (255) may be an opposite surface of the upper surface and the antenna ground layer (130).

[0070] The second inner conductive layer (260) of the second circuit board (250) can be electrically connected by bonding to the antenna ground layer (130).

[0071] The first and second core layers (215, 255) may include a flexible resin such as a polyimide resin, a modified polyimide (MPI), an epoxy resin, a polyester, a cycloolefin polymer (COP), a liquid crystal polymer (LCP), etc. In a preferred embodiment, the first and second core layers (215, 255) may include a polyimide resin or an MPI.

[0072] The conductive layers (220, 230, 260, 270) of the circuit board may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), tin (Sn), zinc (Zn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these metals. In some embodiments, the conductive layers (220, 230, 260, 270) may include copper or a copper alloy in consideration of signal efficiency and ground efficiency.

[0073] In one embodiment, the first and second circuit boards (210, 250) may be manufactured from a copper clad laminate (CCL). The first and second circuit boards (210, 250) may be provided as a flexible printed circuit board (FPCB).

[0074] As described above, the other ends of the circuit boards (210, 250) can be connected to the connector (300).

[0075] The connector (300) may include a signal / power supply pin (310) and ground pins (320a, 320b). The signal / power supply pin (310) may be in contact with or connected to a first inner conductive layer (220) of a first circuit board (210). The connector (300) includes an external connection terminal (330), and a power cable may be connected through the external connection terminal (330). Accordingly, power supply and signal transmission may be performed to the antenna conductive layer (120) through the power cable, the external connection terminal (330), the signal / power supply pin (310), and the first inner conductive layer (220).

[0076] The above ground pin may include a first ground pin (320a) that contacts or is connected to the first outer conductive layer (230) of the first circuit board (210) and a second ground pin (320b) that contacts or is connected to the conductive layer of the second circuit board (250). For example, the second ground pin (320b) may contact or be connected to the second inner conductive layer (260) and / or the second outer conductive layer (270) of the second circuit board (250).

[0077] According to exemplary embodiments, the penetration fixing mechanism (340) can penetrate the connector (300) and the circuit boards (210, 250) to fix / connect the connector (300) to the circuit boards (210, 250). Accordingly, the connector (300) can be fixed without a thermal process such as soldering or welding. Accordingly, damage to the circuit board (210, 250) due to the thermal process can be prevented, and the signal transmission efficiency and grounding efficiency of the circuit board (210, 250) can be improved.

[0078] In addition, since heat processes such as soldering and welding are omitted, the connector (300) can be separated and recycled in case of a defective product.

[0079] In one embodiment, the penetrating fixing mechanism (340) may have the form of a screw, nail, pin, or the like.

[0080] FIG. 3 is a plan view of a first surface direction of a first circuit board of an antenna structure according to exemplary embodiments.

[0081] As illustrated in FIG. 1, the first surface (210a) of the first circuit board (210) may correspond to the inner surface facing the antenna element (100). As described with reference to FIG. 2, the first inner conductive layer (220) may be arranged on the lower surface of the first core layer (215) toward the inner surface.

[0082] The first inner conductive layer (220) may include a signal wire (222). One end of the signal wire (222) may be bonded or electrically connected to the antenna conductive layer (120) or the antenna unit in a bonding area (BR).

[0083] In some embodiments, the first inner conductive layer (220) may further include a co-planar ground (224) extending together with the signal wire (222) at the same level as the signal wire (222). The co-planar ground (224) may be physically spaced from the signal wire (222) by a predetermined distance.

[0084] For example, a pair of co-planar grounds (224) can be arranged facing each other with a signal wire (222) between them. The co-planar grounds (224) can block noise around the signal wire (222) and improve the power supply concentration through the signal wire (222).

[0085] FIG. 4 is a plan view of a second surface direction of a first circuit board of an antenna structure according to exemplary embodiments.

[0086] As illustrated in FIG. 1, the second surface (210b) of the first circuit board (210) may correspond to an outer surface facing the antenna element (100). As described with reference to FIG. 2, a first outer conductive layer (230) may be disposed on the upper surface of the first core layer (215) toward the outer surface.

[0087] The first outer conductive layer (230) faces the signal wire (222) with the first core layer (215) interposed therebetween and can serve as a vertical ground for the signal wire (222). An electric field is formed in the first core layer (215) between the first outer conductive layer (230) and the signal wire (222), and power supply efficiency through the signal wire (222) can be increased.

[0088] In some embodiments, the co-planar ground (224) and the first outer conductive layer (230) may be connected to each other through a via structure (240). The via structure (240) may penetrate the first core layer (215) and connect the co-planar ground (224) and the first outer conductive layer (230) to each other. Accordingly, absorption and emission of noise around the signal wire (222) may be promoted.

[0089] For example, a plurality of via structures (240) may be arranged along a signal wiring (222) to form a via row. For example, the via structure (240) may be formed by forming a via hole penetrating the first core layer (215) and then filling the via hole through a copper plating process.

[0090] Fig. 5 is a plan view of a second circuit board of an antenna structure in a first surface direction according to exemplary embodiments. Fig. 6 is a plan view of a second circuit board of an antenna structure in a second surface direction according to exemplary embodiments.

[0091] As illustrated in Fig. 1, the first surface (250a) of the second circuit board (250) may correspond to an inner surface facing the antenna element (100). The second surface (250b) of the second circuit board (250) may correspond to an outer surface facing the antenna element (100).

[0092] As described with reference to FIG. 2, a second inner conductive layer (260) may be disposed on the upper surface of the second core layer (255) toward the inner surface. A second outer conductive layer (270) may be disposed on the lower surface of the second core layer (255) toward the outer surface.

[0093] Referring to FIGS. 5 and 6, the second inner conductive layer (260) and the second outer conductive layer (270) can face each other with the second core layer (255) interposed therebetween.

[0094] One end of the second inner conductive layer (260) may be bonded or electrically connected to the antenna ground layer (130) in a bonding region (BR). Accordingly, noise absorption / emission through the antenna ground layer (130) is promoted, and vertical radiation above the upper surface of the antenna element (100) may be promoted by the antenna ground layer (130).

[0095] The above-described function of the second inner conductive layer (260) may be additionally enhanced by the second outer conductive layer (270). In one embodiment, the second outer conductive layer (270) may be omitted.

[0096] Referring again to FIGS. 3 to 6, through ports (TP1, TP2) may be formed at the other end of the connection area (CR) of the circuit boards (210, 250) or at the other end of the conductive layers (220, 230, 260, 270). The through ports (TP1, TP2) have a through hole shape, and a through fixing mechanism (340) may be inserted to fix the connector (300).

[0097] In some embodiments, the through port includes a first through port (TP1) and a second through port (TP2), and a pair of through ports (TP1, TP2) may be formed on a pair of co-planar grounds (224) with a signal wire (222) therebetween.

[0098] A penetration fixing mechanism (340) is inserted into each of the first penetration port (TP1) and the second penetration port (TP2) to fasten the connector (300) to the circuit boards (210, 250).

[0099] In one embodiment, a pair of penetration fasteners (340) can be inserted into the connector (300) by penetrating the circuit boards (210, 250) with the signal / power supply pins (310) of the connector (300) interposed therebetween. Accordingly, the connector (300) can be more stably fastened to the circuit boards (210, 250).

[0100] FIG. 7 is a schematic plan view showing an antenna unit included in an antenna structure according to exemplary embodiments.

[0101] Referring to FIG. 7, the antenna unit may include a radiator (122), a transmission line (124), and a signal pad (126).

[0102] For example, the radiator (122) has a polygonal plate shape, and the transmission line (124) has a width smaller than the radiator (122) and can be connected to one end or one side of the radiator (122). The radiator (122) and the transmission line (124) can be formed as a single member integrally connected to each other.

[0103] The target resonant frequency of the antenna element (100) can be adjusted depending on the shape / size of the radiator (122). In a non-limiting embodiment, the radiator (122) can be designed to be capable of radiating in a high frequency / ultra-high frequency band of 3G, 4G, 5G or higher. For example, a radiation band of a frequency band of 0.5 GHz or higher, 1 GHz or higher, 10 GHz or higher, 20 GHz or higher, 30 GHz or higher, or 40 GHz or higher can be implemented through the radiator (122).

[0104] The signal pad (126) may be positioned in the bonding region (BR) and connected to the end of the transmission line (124). In one embodiment, the signal pad (126) may be a single member substantially integral with the transmission line (124). In this case, the end of the transmission line (124) may also be provided as the signal pad (126).

[0105] The radiator (122) may be positioned within the visible area of ​​the target object. The radiator (122) may be formed in a mesh structure to prevent the radiator (122) from being visually recognized. The transmission line (124) may also be formed at least partially in the mesh structure.

[0106] In one embodiment, a dummy mesh layer (125) may be formed around the radiator (122) and the transmission line (124). The dummy mesh layer (125) may include a mesh structure substantially identical to the mesh structure included in the radiator (122) and the transmission line (124). Accordingly, the spatial distribution of the conductive pattern around the radiator (122) and the transmission line (124) may be uniform, thereby preventing the radiator (122) and the transmission line (124) from being visually recognized.

[0107] The dummy mesh layer (125) can be formed together with the radiator (122) and the transmission line (124) by etching the same mesh layer. The dummy mesh layer (125) can be physically separated / separated from the radiator (122) and the transmission line (124) through a separation region (SR).

[0108] The signal pad (126) positioned in the bonding area (BR) may be a solid metal or alloy pattern. Accordingly, an increase in resistance due to bonding with the first circuit board (210) can be suppressed, thereby improving power supply efficiency.

[0109] In some embodiments, a ground pad (128) may be disposed around a signal pad (126) in a bonding region (BR). For example, a pair of ground pads (128) may be disposed facing each other with the signal pad (126) interposed therebetween. The ground pad (128) may be formed of a solid metal or alloy pattern. The ground pad (128) may be physically and electrically separated / separated from the signal pad (126).

[0110] For example, an anisotropic conductive film (ACF) can be attached to the signal pad (126) and the ground pad (128) together in the bonding region (BR). Thereafter, one end of the signal wire (222) and the co-planar ground (224) can be bonded onto the signal pad (126) and the ground pad (128), respectively, through a heating / pressure process.

[0111] Accordingly, the signal pad (126) is electrically connected to the signal wiring (222), and the ground pad (128) can be electrically connected to the co-planar ground (224). The ground pad (128) is provided as a bonding pad to enhance bonding stability, and can absorb noise around the signal pad (126) and discharge it through the co-planar ground (224).

[0112] FIG. 8 is a schematic cross-sectional view showing an antenna element of an antenna structure according to some exemplary embodiments.

[0113] Referring to Fig. 8, the dielectric layer included in the antenna element may have a multi-layer structure. For example, a first dielectric layer (115) may be laminated on the upper surface of a substrate layer (111), and the first dielectric layer (115) may be laminated on the substrate layer (111) via a first adhesive layer (117).

[0114] A second dielectric layer (113) is laminated below the bottom surface of the substrate layer (111), and the second dielectric layer (113) can be combined with the antenna ground layer (130) through the second point-adhesive layer (119).

[0115] The substrate layer (111), the first dielectric layer (115), and the second dielectric layer (113) may include the transparent resin material described above. By utilizing the multi-layer dielectric structure, the dielectric constant and impedance suitable for the desired target frequency can be finely adjusted.

[0116] As described above, when a multi-layer dielectric structure is used, the thickness of the antenna element may increase (e.g., 1 mm or more, 1.5 mm or more, or 2 mm or more). According to embodiments of the present invention, by independently using the first circuit board (210) and the second circuit board (250), which are respectively connected to the antenna conductive layer (120) and the antenna ground layer (130), a stable connection to the connector (300) can be provided even when the thickness of the antenna element increases.

[0117] The antenna structure according to the embodiments described above can be attached or fixed to, for example, a building structure such as a window, wall or ceiling of a public transportation, a window, a vehicle, a sign, etc.

[0118] The antenna cable can be buried in objects such as public transportation such as buses and subways, building interior walls, windows, and signs, and connected or inserted into the external connection terminal (330) of the connector (300). Accordingly, power can be supplied to the antenna unit, and antenna radiation can be performed.

[0119] For example, the antenna element (100) can be electrically connected to a public Wi-Fi repeater in a public transportation or building via the antenna cable and used as a repeater antenna.

[0120] However, the application of the above-described antenna structure is not limited to a repeater antenna, and can also be applied to an antenna of an image display device combined with a communication function, such as a smartphone.

Claims

1. An antenna element including an antenna conductive layer and an antenna ground layer; A first circuit board electrically connected to the above antenna conductive layer; a second circuit board electrically connected to the antenna ground layer; and An antenna structure comprising a connector coupled together to ends of the first circuit board and the second circuit board.

2. In claim 1, the first circuit board 1st core layer; A first inner conductive layer formed on one side of the first core layer adjacent to the antenna conductive layer and including a signal wiring electrically connected to the antenna conductive layer; and An antenna structure comprising a first outer conductive layer formed on the other side opposite to the first side of the first core layer and facing the first inner conductive layer.

3. An antenna structure according to claim 2, wherein the first inner conductive layer further includes a co-planar ground disposed around the signal wiring on the one surface of the first core layer.

4. An antenna structure according to claim 3, wherein the first circuit board further includes a via structure penetrating the first core layer to electrically connect the first outer conductive layer and the co-planar ground.

5. In claim 2, the second circuit board second core layer; and An antenna structure comprising a second inner conductive layer formed on one surface adjacent to the antenna ground layer of the second core layer.

6. An antenna structure according to claim 5, wherein the second circuit board further includes a second outer conductive layer formed on the other side opposite to the one side of the second core layer and facing the second inner conductive layer.

7. In claim 6, the connector a ground pin connected to the second inner conductive layer or the second outer conductive layer of the second circuit board; and An antenna structure comprising a signal / power supply pin connected to the signal wiring of the first circuit board.

8. An antenna structure according to claim 7, further comprising a through-hole fixing mechanism that penetrates the first circuit board and the second circuit board and is fastened to the ground pin of the connector.

9. An antenna structure according to claim 8, wherein a pair of penetration fixing mechanisms are fastened to the connector with the signal / feed pins of the connector interposed therebetween.

10. An antenna structure according to claim 1, further comprising an insulating blocking structure disposed between the connectors and the adjacent ends of the first circuit board and the second circuit board.

11. An antenna structure according to claim 1, wherein the antenna element further includes an antenna dielectric layer disposed between the antenna conductive layer and the antenna ground layer.

12. An antenna structure according to claim 11, wherein the antenna dielectric layer comprises at least two dielectric layers and at least two point-bonded adhesive layers.

13. In claim 1, the antenna conductive layer includes an antenna unit including a radiator, a transmission line connected to one end of the radiator, and a signal pad connected to a terminal end of the transmission line. An antenna structure, wherein the first circuit board includes signal wiring bonded to the signal pad of the antenna unit.

14. An antenna structure according to claim 13, wherein the radiator has a mesh structure and the signal pad is a solid metal or alloy pattern.

15. In claim 13, the antenna unit further includes a ground pad disposed around the signal pad and electrically and physically separated from the signal pad, An antenna structure, wherein the first circuit board further includes a co-planar ground extending along the signal wiring around the signal wiring and bonded to the ground pad of the antenna unit.

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