Induction heating device comprising laminated boards on which heating coils and container detection coils are printed

Abstract

According to one embodiment of the present disclosure, the disclosed induction heating device comprises a container detection coil layer patterned by printing a plurality of container detection coils in order to detect a cooking container. The induction heating device according to one embodiment of the present invention may comprise: a plurality of heating coil pattern layers patterned by printing heating coils; and an insulating layer positioned between the plurality of heating coil pattern layers and a container detection coil layer so as to insulate the plurality of heating coil pattern layers and the container detection coil layer, wherein the container detection coil layer, the plurality of heating coil pattern layers, and the insulating layer can be laminated and pressed so as to form a heating coil board.

Description

Induction heating device comprising laminated substrates having printed heating coils and vessel sensing coils

[0001] The present disclosure relates to an induction heating device having a plurality of laminated boards having a heating coil and a container sensing coil printed thereon.

[0002] A variety of cooking appliances are used to heat food in homes and restaurants. While gas-fueled stoves have traditionally been widely used, recent developments have seen the proliferation of cooking appliances that use electricity to heat objects, such as cooking pots, without relying on gas.

[0003] Methods for heating a subject using electricity are broadly divided into resistance heating and induction heating. Resistance heating is a method of heating a subject by transferring the heat generated when current is passed through a metallic resistance wire or a non-metallic heating element such as silicon carbide to the subject (e.g., a cooking vessel) through radiation or conduction. Induction heating is a method of generating eddy currents in a subject made of metallic components by utilizing the magnetic field generated around the coil when a certain amount of high-frequency power is applied to the coil, thereby heating the subject itself. Among these, induction ranges that apply the induction heating method typically have working coils (heating coils) in corresponding areas to heat each of a plurality of subjects (cooking vessels).

[0004] An induction range is a cooking appliance that utilizes the principle of induction heating. Commonly called induction, induction heating device, or induction cooking device, induction ranges do not consume oxygen and do not emit waste gases compared to gas ranges, which can reduce indoor air pollution and temperature increases. Furthermore, induction ranges utilize an indirect method of inducing heat to the heated object itself, resulting in high energy efficiency and stability. Furthermore, since heat is generated only within the heated object itself and not the contact surface, there is a low risk of burns, which has led to a continued increase in demand for induction ranges.

[0005] Recently, induction ranges have been developed that allow the heated object to be freely placed anywhere on the top plate (hereinafter referred to as "Any Place"). With these induction ranges, an object can be inductively heated regardless of its size or location within an area containing multiple heating coils.

[0006] Induction ranges typically include a heating coil wound around a copper wire and a container detection sensor capable of detecting a cooking vessel. However, a structure in which the heating coil is printed on a substrate is required to improve productivity. Since the heating coil in an induction range must be able to conduct a large current, in the manufacture of the heating coil printed on the substrate, the thickness and width of the pattern when the heating coil is printed, as well as the laminate thickness, need to be precisely designed. In addition, in a structure in which the heating coil is printed on the substrate, the container detection sensor can be replaced with a container detection coil, so that the container detection coil can also be provided on the printed substrate.

[0007] According to one embodiment of the present disclosure, an induction heating device is disclosed, which includes a patterned container detection coil layer having a plurality of container detection coils printed thereon for detecting a cooking vessel. In one embodiment, the induction heating device may include a plurality of heating coil pattern layers having a plurality of heating coils printed thereon and a patterned heating coil layer, and an insulating layer positioned between the plurality of heating coil pattern layers and the container detection coil layer to insulate the plurality of heating coil pattern layers and the container detection coil layer. In one embodiment, the container detection coil layer, the plurality of heating coil pattern layers, and the insulating layer may be laminated and pressed to form a heating coil substrate. In one embodiment, the insulating layer may have a thickness of 140 μm or less after pressing.

[0008] According to one embodiment of the present disclosure, a method for producing a heating coil substrate including a patterned vessel sensing coil layer in an induction heating device is disclosed. According to one embodiment, the laminated substrate may include a step of producing a plurality of heating coil pattern layers in which heating coils are printed and patterned, and an insulating layer positioned between the plurality of heating coil pattern layers and the vessel sensing coil layer to insulate and bond the plurality of heating coil pattern layers and the vessel sensing coil layer. According to one embodiment of the present disclosure, a method for producing a heating coil substrate including a patterned vessel sensing coil layer in an induction heating device may include a step of pressing the laminated substrate to produce the heating coil substrate. According to one embodiment, the insulating layer may have a thickness of 140 um or less after pressing.

[0009] The aspects, features and advantages of the present disclosure will become more apparent with reference to the drawings and detailed description below.

[0010] FIG. 1a is a drawing for explaining an induction heating device according to one embodiment of the present disclosure.

[0011] FIG. 1b is a drawing for explaining an induction heating device according to one embodiment of the present disclosure.

[0012] FIG. 2 is a cross-sectional view of a cooking vessel placed on an induction heating device according to one embodiment of the present disclosure.

[0013] FIG. 3 is an inverter circuit diagram of an induction heating device for operating a plurality of heating coils according to one embodiment of the present disclosure.

[0014] FIG. 4a illustrates an induction heating device using a square heating coil according to one embodiment of the present disclosure.

[0015] FIG. 4b illustrates an induction heating device using a square heating coil according to one embodiment of the present disclosure.

[0016] FIG. 5 is a drawing showing an induction heating device according to one embodiment of the present disclosure together with a heating coil.

[0017] Figure 6 is a drawing showing the heating coil being wound in an Anyplace induction heating device.

[0018] Fig. 7a is a drawing showing the external appearance of a coiled heating coil.

[0019] Figure 7b is an example diagram of an induction heating device equipped with a container detection sensor.

[0020] FIG. 8 illustrates a heating coil substrate of an induction heating device according to one embodiment of the present disclosure.

[0021] FIG. 9a is a plan view of a heating coil substrate according to one embodiment of the present disclosure.

[0022] FIG. 9b is a cross-sectional view showing interlayer connections of a heating coil substrate according to one embodiment of the present disclosure.

[0023] FIG. 9c is a cross-sectional view of a series-parallel connection between a 16-layer heating coil substrate and a heating coil substrate according to one embodiment of the present disclosure.

[0024] FIG. 9d is a cross-sectional view showing the interlayer connection of a heating coil substrate including a container sensing coil layer according to one embodiment of the present disclosure.

[0025] FIG. 10A is a patterned layer including a container sensing coil according to one embodiment of the present disclosure.

[0026] FIG. 10b is a diagram showing a container sensing coil layer according to one embodiment of the present disclosure.

[0027] FIG. 10c is a drawing showing a heating coil pattern layer according to one embodiment of the present disclosure.

[0028] FIG. 11 illustrates a process of manufacturing a heating coil substrate of an induction heating device according to one embodiment of the present disclosure.

[0029] FIG. 12 is a drawing showing a heating coil substrate layer by layer according to one embodiment of the present disclosure.

[0030] FIG. 13 is a drawing showing a heating coil pattern width specification according to one embodiment of the present disclosure.

[0031] FIG. 14 is a drawing showing a cross-section of a laminated substrate according to one embodiment of the present disclosure.

[0032] Figure 15 is a characteristic curve of a temperature sensor according to one embodiment of the present disclosure.

[0033] Figure 16 is a characteristic curve of a temperature sensor according to one embodiment of the present disclosure.

[0034] Fig. 17 is a temperature sensing circuit according to one embodiment of the present disclosure.

[0035] Fig. 18 is a temperature sensing circuit according to one embodiment of the present disclosure.

[0036] FIG. 19 illustrates a structure in which each substrate of an induction heating device is connected according to one embodiment of the present disclosure.

[0037] FIG. 20 is a drawing showing a structure in which a connector is connected to a heating coil substrate in an induction heating device according to one embodiment of the present disclosure.

[0038] FIG. 21 is a drawing showing a structure in which a connector is mounted on the back of a heating coil substrate in an induction heating device according to one embodiment of the present disclosure.

[0039] Fig. 22 is a block diagram of an induction heating device according to one embodiment of the present disclosure.

[0040] FIG. 23 is a flowchart of creating a heating coil substrate according to one embodiment of the present disclosure.

[0041] FIG. 24 illustrates detection of the material of a cooking vessel by a vessel detection coil according to one embodiment of the present disclosure.

[0042] The terms used in this disclosure will be briefly explained, and one embodiment of the present disclosure will be specifically described.

[0043] The terms used in this disclosure are selected from widely used, current terms, taking into account the functions of one embodiment of the disclosure. However, these terms may vary depending on the intentions of those skilled in the art, precedents, the emergence of new technologies, etc. Furthermore, in certain cases, terms may be arbitrarily selected by the applicant, and in such cases, their meanings will be described in detail in the description of the relevant embodiments of the disclosure. Therefore, the terms used in this disclosure should not be defined simply as names of terms, but rather based on the meanings of the terms and the overall content of the disclosure.

[0044] In this disclosure, the expression “at least one of a, b or c” may refer to “a”, “b”, “c”, “a and b”, “a and c”, “b and c”, “all of a, b and c”, or variations thereof.

[0045] Throughout this disclosure, when a part is said to "include" a certain component, this does not mean that other components are excluded, but rather that other components may be included, unless otherwise specifically stated. Furthermore, terms such as "part," "module," etc., used in this disclosure refer to a unit that processes at least one function or operation, and "part" and "module" may be implemented as hardware or software, or as a combination of hardware and software.

[0046] Below, with reference to the attached drawings, embodiments of the present disclosure are described in detail so that those skilled in the art can easily implement the present disclosure. However, one embodiment of the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In addition, in the drawings, parts irrelevant to the description are omitted to clearly describe one embodiment of the present disclosure, and similar parts are designated with similar drawing reference numerals throughout the present disclosure.

[0047] Induction heating devices heat cooking utensils by inducing a magnetic field in the heating coil, which causes eddy currents to flow in the cooking utensil. When the heating coil and the container detection coil, which detects the cooking utensil, are printed on a PCB (printed circuit board), assembly becomes simpler and the durability of the induction heating device increases. However, when the heating coil and the container detection coil are printed on a circuit board, a large alternating current flows through the heating coil, which can interfere with the low-power container detection coil. Therefore, the container detection coil must be designed to minimize interference from the heating coil. Furthermore, when the heating coil is patterned to form multiple pattern layers, the insulation must also be designed appropriately.

[0048] Accordingly, according to one embodiment of the present disclosure, an induction heating device is disclosed, which includes a pattern layer including a container detection coil and a plurality of heating coil pattern layers. In the present disclosure, the board may be a printed circuit board (PCB) on which a patterned circuit is printed. When a plurality of heating coil pattern layers are laminated, an insulating layer may be included therebetween.

[0049] FIG. 1a is a drawing for explaining an induction heating device according to one embodiment of the present disclosure.

[0050] Referring to FIG. 1A, an induction heating device (2000) according to one embodiment of the present disclosure may include a plurality of burners (201, 202, 203). Hereinafter, the induction heating device (2000) may be expressed as an induction heating device, an induction heating device, an induction cooking device, or simply a heating device. Not all of the components illustrated in FIG. 1A are essential components. The induction heating device (2000) may be implemented with more components than the illustrated components, or may be implemented with fewer components.

[0051] The cooking vessel (101) may be a device for heating the contents inside the cooking vessel (101). The contents inside the cooking vessel (101) may be liquids such as water, tea, coffee, soup, juice, wine, oil, etc., or solids such as butter, meat, vegetables, bread, rice, etc., but are not limited thereto.

[0052] According to one embodiment of the present disclosure, the cooking vessel (101) can wirelessly receive power from an induction heating device (2000) using electromagnetic induction. Therefore, the cooking vessel (101) according to one embodiment of the present disclosure may not include a power cord connected to a power outlet.

[0053] According to one embodiment of the present disclosure, the type of cooking vessel (101) that wirelessly receives power from the induction heating device (2000) may vary. The cooking vessel (101) may be a general induction heating (IH) vessel (hereinafter, IH vessel) containing a magnetic material. The cooking vessel (101) may have a magnetic field induced in the vessel (IH metal) itself.

[0054] The cooking vessel (101) may be a general IH vessel, such as a pot, a frying pan, or a steamer. The cooking vessel (101) may include a cooker device. The cooker device may be a device into which a general IH vessel may be inserted or removed. In one embodiment, the cooker device may be a device capable of automatically cooking contents according to a recipe. The cooker device may be referred to as a pot, a rice cooker, or a steamer depending on its use. For example, if an inner pot for cooking rice is inserted into the cooker device, the cooker device may be referred to as a rice cooker. Hereinafter, the cooker device may be defined as a smart pot (or smart pot).

[0055] According to one embodiment of the present disclosure, when the cooking vessel (101) includes a communication interface, the cooking vessel (101) can communicate with the induction heating device (2000). The communication interface may include a short-range communication unit, a long-range communication unit, etc. The short-range wireless communication interface may include, but is not limited to, a Bluetooth communication unit, a BLE (Bluetooth Low Energy) communication unit, an NFC (Near Field Communication interface), a WLAN (Wi-Fi) communication unit, a Zigbee communication unit, an IrDA (Infrared Data Association) communication unit, a WFD (Wi-Fi Direct) communication unit, an UWB (ultra wideband) communication unit, an ANT+ communication unit, etc. When the cooking vessel (101) is remotely controlled by a server in an IoT (Internet of Things) environment, the long-range communication unit may be used to communicate with a server (not shown). The telecommunications unit may include the Internet, a computer network (e.g., a LAN or WAN), and a mobile communication unit. The mobile communication unit may include, but is not limited to, a 3G module, a 4G module, a 5G module, an LTE module, an NB-IoT module, an LTE-M module, and the like.

[0056] According to one embodiment of the present disclosure, the cooking vessel (101) can transmit information to a server (not shown) via the induction heating device (2000). For example, the cooking vessel (101) can transmit information obtained from the cooking vessel (101) (e.g., temperature information of the contents, etc.) to the induction heating device (2000) via short-range wireless communication (e.g., Bluetooth, BLE, etc.). At this time, the induction heating device (2000) can transmit the information obtained from the cooking vessel (101) to the server by connecting to the server using a WLAN (Wi-Fi) communication unit or a long-distance communication unit (e.g., the Internet). Meanwhile, the server can provide the information obtained from the cooking vessel (101) received from the induction heating device (2000) to the user via a mobile terminal (not shown) connected to the server. According to another embodiment of the present disclosure, the induction heating device (2000) may directly transmit information obtained from the cooking vessel (101) to the user's mobile terminal through D2D (device to device) communication (e.g., WFD (Wi-Fi Direct) communication or BLE communication).

[0057] Meanwhile, according to one embodiment of the present disclosure, the cooking vessel (101) may directly transmit information (e.g., temperature information of the contents, etc.) of the cooking vessel (101) to a server via a communication interface (e.g., a WLAN (Wi-Fi) communication unit). In addition, the cooking vessel (101) may directly transmit information (e.g., temperature information of the contents, etc.) obtained from the cooking vessel (101) to a user's mobile terminal via short-range wireless communication (e.g., Bluetooth, BLE, etc.) or D2D (device to device) communication.

[0058] An induction heating device (2000) according to one embodiment of the present disclosure may be a device that wirelessly transmits power to a cooking vessel (101) positioned on a top plate of the induction heating device (2000) using electromagnetic induction. The induction heating device (2000) may include a working coil that generates a magnetic field for inductively heating the cooking vessel (101). The working coil is a coil that forms a magnetic field through an electric current, and may be referred to as a heating coil throughout the present disclosure.

[0059] Generating a magnetic field by a heating coil may include transmitting power by utilizing a magnetic field induced in an IH metal (e.g., iron component) through magnetic induction. For example, an induction heating device (2000) may generate eddy currents in a cooking vessel (101) by flowing a current through a heating coil to form a magnetic field.

[0060] According to one embodiment of the present disclosure, the induction heating device (2000) may include a plurality of heating coils. For example, if the top plate of the induction heating device (2000) includes a plurality of cooking zones, the induction heating device (2000) may include a plurality of heating coils corresponding to each of the plurality of cooking zones. In addition, the induction heating device (2000) may include a high-power cooking zone in which a first heating coil is provided on the inside and a second heating coil is provided on the outside. The high-power cooking zone may include two or more heating coils.

[0061] The top plate of the induction heating device (2000) according to one embodiment of the present disclosure may be made of reinforced glass, such as ceramic glass, to prevent it from being easily damaged. In addition, the top plate of the induction heating device (2000) may include a guide mark to guide the cooking zone where the cooking vessel (101) should be positioned.

[0062] An induction heating device (2000) according to one embodiment of the present disclosure can detect that a cooking vessel (101) including a magnetic material is placed on a top plate. For example, the induction heating device (2000) can detect that the cooking vessel (101) is positioned on the top plate of the induction heating device (2000) based on a change in the current value (inductance) of a heating coil due to the approach of the cooking vessel (101). In addition, the vessel detection coil of the induction heating device (2000) can detect when the cooking vessel (101) is placed on the top plate.

[0063] According to one embodiment of the present disclosure, the induction heating device (2000) may include a communication interface for communicating with an external device. For example, the induction heating device (2000) may communicate with a cooking vessel (101) or a server through the communication interface. The communication interface may include a short-range communication unit (e.g., an NFC communication unit, a Bluetooth communication unit, a BLE communication unit, etc.), a mobile communication unit, etc.

[0064] According to one embodiment of the present disclosure, the induction heating device (2000) can detect a cooking vessel (101) positioned on the top plate through a communication interface. For example, the induction heating device (2000) can detect the cooking vessel (101) by receiving a packet transmitted from the cooking vessel (101) positioned on the top plate using short-range wireless communication (e.g., BLE mesh network, Bluetooth).

[0065] According to one embodiment of the present disclosure, the induction heating device (2000) can detect whether the cooking vessel (101) is placed on the top plate of the induction heating device (2000) through the vessel detection coil even if the cooking vessel (101) does not have a communication interface.

[0066] According to one embodiment of the present disclosure, the induction heating device (2000) can display information related to the cooking vessel (101) through a user interface. For example, when the cooking vessel (101) is detected, the induction heating device (2000) can display information such as identification information of the cooking vessel (101), location information of the cooking vessel (101), presence or absence of the cooking vessel (101), material of the cooking vessel (101), etc., on a display included in the user interface.

[0067] Referring to FIG. 1A, when a user places a cooking vessel (101) (e.g., a pot) on the top plate of an induction heating device (2000), the induction heating device (2000) can provide the user with identification information of the cooking vessel (101) (e.g., a pot), location information of the cooking vessel (101) (e.g., located on the right burner), and material information of the cooking vessel (101) on a display (2411) as an output interface. The material information of the cooking vessel (101) can be detected by a change in inductance when the cooking vessel (101) is placed on the top plate and heated, and the material information of the cooking vessel (101) can be information related to the degree to which the cooking vessel (101) is heated when the same heating power is applied. For example, if the cooking vessel (101) is made of material A, it may be a material that can boil 1 liter of water to 100 degrees Celsius in 1 minute when the heating power is 1.5 kW, whereas if the cooking vessel (101) is made of material B, it may be a material that can boil 1 liter of water to 100 degrees Celsius in 2 minutes when the heating power is 1.5 kW. The induction heating device (2000) divides these materials into grades - for example, grades 1 to 7 - and displays them on the display so that the consumer can easily determine whether the cooking vessel (101) he or she currently owns is a cooking vessel (101) made of a material with good heating efficiency.

[0068] FIG. 1b is a drawing for explaining an induction heating device according to one embodiment of the present disclosure.

[0069] Fig. 1b is a bird's-eye view of the induction heating device (2000) according to Fig. 1a, when no cooking vessel is present. The induction heating device (2000) according to Fig. 1b may include multiple burners (201, 202, 203), and thus may heat multiple cooking vessels simultaneously. When the induction heating device (2000) heats multiple cooking vessels simultaneously, a heating coil corresponding to each burner may operate. The induction heating device (2000) according to Figs. 1a and 1b is an induction heating device in which burners corresponding to cooking vessels are set.

[0070] FIG. 2 is a cross-sectional view of a cooking vessel placed on an induction heating device according to one embodiment of the present disclosure.

[0071] Referring to FIG. 2, the cooking vessel (101) may include a magnetic material (e.g., IH metal) in which a magnetic field can be induced.

[0072] The cooking vessel (101) can be inductively heated by an induction heating device (2000) and can be a variety of containers including a magnetic material. Induction heating (IH) is a method of heating an IH metal using an electromagnetic induction phenomenon. For example, when an alternating current is supplied to a heating coil (2120) of an induction heating device (2000), a magnetic field that varies over time is induced inside the heating coil (2120). The magnetic field generated by the heating coil (2120) passes through the bottom of the cooking vessel (101). When the magnetic field that varies over time passes through the IH metal (e.g., iron, steel, nickel, or various types of alloys) included in the bottom of the cooking vessel (101), a current that rotates around the magnetic field is generated in the IH metal. This rotating current is called an eddy current, and the phenomenon in which a current is induced by a magnetic field that varies over time is called an electromagnetic induction phenomenon. Heat is generated at the bottom of the cooking vessel (101) by the eddy current and the resistance of the IH metal (e.g., iron). The contents of the cooking vessel (101) can be heated by the heat generated at this time.

[0073] FIG. 3 is an inverter circuit diagram of an induction heating device for operating a plurality of heating coils according to one embodiment of the present disclosure.

[0074] Referring to Fig. 3, the input power source (2211) is an AC power source. The AC voltage of the input power source (2211) passes through an EMI filter (2111) and is rectified by a rectifier circuit (2112). The rectifier circuit (2112) may use a diode as a component for converting the AC voltage into a DC voltage. The component of the rectifier circuit (2112) may be a diode, but a thyristor or another type of switching component may also be used. When the AC voltage is converted into a DC voltage through the rectifier circuit (2112), the DC voltage may be smoothed by a DC link capacitor (2117_1, 2117_2).

[0075] In Fig. 3, two resonance circuits are illustrated assuming that there are two heating coils (2120_1, 2120_2), but if there are three craters and three heating coils are required, a resonance circuit can be added.

[0076] The DC voltage smoothed by the DC link capacitor (2117_1) generates a magnetic field in the first heating coil (2120_1) by resonance between the first heating coil (2120_1) and the resonant capacitor 1 (2114_1) and the resonant capacitor 2 (2114_2) through the switching operation of the two switching elements SW1 (2113_1) and SW2 (2113_2). The magnetic field generated in the first heating coil (2120_1) generates an eddy current in the cooking container placed on the top of the first heating coil (2120_1) to heat the contents of the cooking container. CT1 (2115_1) is a current sensor for detecting the current flowing in the first heating coil (2120_1).

[0077] Likewise, the DC voltage smoothed by the DC link capacitor (2117_2) at the bottom generates a magnetic field in the second heating coil (2120_2) by resonance between the second heating coil (2120_2) and the resonance capacitor 3 (2114_3) and the resonance capacitor 4 (2114_4) through the switching operation of the two switch elements SW3 (2113_3) and SW4 (2113_4). The magnetic field generated in the second heating coil (2120_2) generates an eddy current in the cooking container placed on the top of the second heating coil (2120_2), thereby heating the contents of the cooking container. CT2 (2115_2) is a current sensor for detecting the current flowing in the second heating coil (2120_2).

[0078] FIGS. 4A and 4B illustrate an induction heating device using a square heating coil according to one embodiment of the present disclosure.

[0079] Referring to FIGS. 4A and 4B, an induction heating device (2000) according to one embodiment of the present disclosure may include a circular first crater (201) operated by a circular heating coil and a square crater (204) formed by a square heating coil. The square may be rectangular, and the heating coil on the bottom of the square crater (204) may be a plurality of rectangular heating coils. Alternatively, the heating coil on the bottom of the square crater (204) may use a plurality of circular heating coils.

[0080] Using a square heating coil in an induction heating device (2000) has the advantage of eliminating a non-cooking zone, for example, when a square pot is placed on it. In addition, no matter where the user of the induction heating device (2000) places the cooking vessel on the square burner (204), the induction heating device (2000) recognizes the cooking vessel and operates the square heating coil necessary for heating the cooking vessel to heat the contents of the cooking vessel. Although FIGS. 4A and 4B illustrate a case where the first burner (201), which is a circular burner, and the square burner (204) are present together, the induction heating device (2000) according to an embodiment of the present disclosure may include only a square burner. In this case, the induction heating device (2000) is called an any-place induction heating device because the induction heating device (2000) detects the cooking vessel wherever it is placed and operates the heating coil.

[0081] FIG. 5 is a drawing showing an induction heating device according to one embodiment of the present disclosure together with a heating coil.

[0082] FIG. 5 illustrates the appearance of the heating coils in the induction heating device (2000) wound together with the exterior of the induction heating device (2000). The appearance of the heating coils wound is not actually visible from the outside. As shown in FIG. 5, according to one embodiment, four square heating coils (2120_3, 2120_4, 2120_5, 2120_6) corresponding to the square craters (204) in the induction heating device (2000) are wound sequentially from the top of the induction heating device (2000). Of course, this is only one embodiment, and the number of square heating coils (2120_3, 2120_4, 2120_5, 2120_6) corresponding to the square craters (204) may be four or more or less than four. Additionally, if the induction heating device (2000) is an any place induction heating device as described above, the first heating coil (2120_1) may also be replaced by one or more rectangular heating coils.

[0083] On the right side of the top plate of the induction heating device (2000) according to FIG. 5, a circular first heating coil (2120_1) corresponding to the circular first crater (201) is wound, as seen in FIG. 1.

[0084] Figure 6 is a drawing showing the heating coil being wound in an Anyplace induction heating device.

[0085] According to Fig. 6, the heating coil (2120) of the induction heating device (2000) is made of a Litz wire wound in a circular shape and densely arranged under the top plate of the induction heating device (2000) so that there is no heating gap no matter where the cooking container (101) is placed. The induction heating device (2000) as shown in Fig. 6 may be referred to as an any-place induction heating device. In the any-place induction heating device as shown in Fig. 6, the heating coils are densely arranged so that there is no blind spot between the plurality of heating coils. In addition, at least one container detection coil may also be arranged where the heating coil is arranged.

[0086] In one embodiment, a temperature sensor (2600) for sensing the temperature of the cooking vessel (101) may be placed in the center of each heating coil (2120).

[0087] As shown in FIG. 6, when heating coils are densely arranged on the induction heating device (2000), container detection coils can also be densely arranged, and the plurality of container detection coils can detect whether a cooking container (101) is present and, if so, where the cooking container (101) is located on the top plate of the induction heating device (2000) based on changes in the current on the container detection coils. For example, in FIG. 6, the current value flowing in the container detection coil below the location where the cooking container (101) is located will be different from the current value flowing in the container detection coils in other locations where the cooking container (101) is not placed. By this difference in current value, the induction heating device (2000) can preferentially detect that there is a cooking container (101) and also know the location of the cooking container (101). Once the position of the cooking vessel (101) is determined, the induction heating device (2000) can use only the heating coil under the cooking vessel (101) for heating.

[0088] Fig. 7a is a drawing showing the external appearance of a coiled heating coil.

[0089] Referring to Fig. 7a, the heating coil (2120) is shown to be connected to the inverter substrate (30) via a wire (660). The inverter substrate (30) may be provided with an inverter connector to which the wire (660) can be connected. The heating coil (2120) may be manufactured by winding a litz wire into a round shape, or in the case of a square heating coil (2120_3, 2120_4, 2120_5, 2120_6), into a square shape. A conductor wire may be used as the litz wire. Copper wire is often used as the litz wire. The end of each heating coil (2120) may be connected to the inverter substrate (30) via a wire (660). In the case where the heating coil (2120) is manufactured entirely using Litz wire, there may be blind spots between the multiple heating coils in the Anyplace induction heating device, which allows the cooking vessel (101) to be freely placed anywhere on the top plate. Therefore, it is necessary to manufacture each heating coil small and place them closely together. In addition, when the heating coil (2120) is manufactured using Litz wire, the Litz wire must be wound manually or semi-automatically, which is time-consuming and may result in inconsistent heating coil quality. If the heating coil quality is inconsistent, the inductance determined by the heating coil will result in inconsistent results. In addition, when a heating coil manufactured using Litz wire is used, as shown in FIG. 7A, numerous wires (660) must be used to connect the heating coil (2120) and the inverter board (30), which not only complicates the work process but also inefficiently assembles the coils and increases manufacturing costs. In addition, long wires may become entangled, which may cause wire damage. This phenomenon may cause poor wire quality and poor quality of the induction heating device (2000).

[0090] Recently, induction heating devices (2000) and the components included in the induction heating devices (2000) have been trending towards miniaturization, slimming, and thinning, and in line with this trend, issues have also arisen regarding reducing heat generated from circuit components. Various cooling structures are being developed to address the heat generated from circuit components, but as the number of heating coils increases, the connections between circuit components become more complex, and the space for placing heating coils, wires connected to heating coils, and inverter boards becomes narrower, making the design of circuit components and cooling circuits difficult.

[0091] Therefore, in order to solve this problem, the plurality of heating coils of the induction heating device (2000) according to one embodiment of the present disclosure may be manufactured by printing the coils on a heating coil substrate rather than by winding them with Litz wire. In addition, a laminated substrate in which a plurality of heating coil pattern layers on which heating coils are printed are laminated may be compressed to produce a heating coil substrate. In addition, the laminated substrate may include an insulating material for insulation together with each heating coil pattern layer formed of printed heating coils.

[0092] Additionally, the heating coil substrate generated in this manner may be connected to the inverter substrate (30) via a wire (660), but a board-to-board connection may be used using a fixed vertical connector mounted on each substrate. According to one embodiment of the present disclosure, the heating coil substrate may be connected to the inverter substrate or an intermediate substrate via a connector.

[0093] The heating coil (2120) printed within the heating coil substrate resonates with a resonant capacitor (not shown) on the inverter substrate (30) by the operation of the inverter, thereby heating the cooking vessel (101). The inverter substrate (30) may also be referred to as an inverter PBA (printed board assembly).

[0094] Figure 7b is an example diagram of an induction heating device equipped with a container detection sensor.

[0095] The heating coil (2120) may include a first heating coil (2120_1) wound on the inside and a second heating coil (2120_2) wound on the outside. A container detection sensor (2710) is positioned in the center of the first heating coil (2120_1) to detect when a cooking vessel is placed on the top plate of the induction heating device (2000). FIG. 7b illustrates an example in which a container detection sensor (2710) is mounted when a heating coil wound with a Litz wire is used instead of a heating coil substrate (10) in the induction heating device (2000). When using a container detection sensor (2710) such as that of FIG. 7b, not only is manual work required to wind the first heating coil (2120_1) and the second heating coil (2120_2), but an assembly work to integrate the heating coil (2120) and the container detection sensor (2710) must also be performed in parallel. Unlike FIG. 7b, when a heating coil substrate in which the heating coil is printed and patterned on a substrate is used, the container detection coil capable of detecting the container is also printed and patterned on the substrate, thereby reducing the assembly process, reducing the number of parts, and ultimately reducing the manufacturing cost. In addition, when a heating coil substrate is used, the number of parts is reduced and the work of winding the coil is eliminated, so that quality problems that may occur due to winding the wire can be prevented in advance.

[0096] FIG. 8 illustrates a heating coil substrate of an induction heating device according to one embodiment of the present disclosure.

[0097] Referring to FIG. 8, a heating coil substrate (10) in which a heating coil (2120) is patterned on a substrate is illustrated.

[0098] The heating coil may be provided in the form of a conductor printed on a heating coil substrate (10). In one embodiment, a heating coil substrate (10) in which two or more heating coil pattern layers are laminated may be employed as the heating coil substrate (10). In order to implement a high-power (maximum exceeding 3 kW) induction heating device using a heating coil substrate (10) in which two or more heating coil pattern layers are laminated, the copper thickness of the first layer (the thickness of the coil pattern) needs to be approximately 500 μm. Doing so may increase the influence of the skin effect, which may increase coil loss. In order to implement high power while reducing the skin effect, a method may be considered in which the thickness and width of the heating coil pattern are reduced and a plurality of heating coil patterns are connected in parallel to secure current capacity. In this case, the number of interlayer connections for connecting a plurality of heating coils in parallel increases, and heating coil loss depending on the wiring length may also increase. Accordingly, according to one embodiment of the present disclosure, a laminated substrate having multilayer heating coil pattern layers that can reduce the number of interlayer connections while reducing heating coil loss and a heating coil substrate (10) that presses the same may be employed. Here, the multilayer may include four or more layers. In one embodiment, the heating coil (2120) pattern layer may be provided on the heating coil substrate (10) in a sheet shape. For example, the heating coil (2120) may be in the form of a printed circuit board formed on the heating coil substrate (10) by a patterning process using photoresist or the like. In one embodiment, each of the plurality of heating coils may have the same shape and size. The shapes and sizes of the plurality of heating coils do not have to be all the same. For example, at least one of the shape and size of at least one of the plurality of heating coils may be different from other heating coils.

[0099] The heating coil substrate (10) can replace multiple heating coil positions provided in an induction heating device (2000) such as that shown in Fig. 6. In this manner, an any-place induction heating device (2000) formed by the heating coil substrate (10) can be manufactured.

[0100] FIG. 9a is a plan view of a heating coil substrate according to one embodiment of the present disclosure.

[0101] Referring to FIG. 9a, the heating coil substrate (10) may be a printed circuit board formed by laminating four or more heating coil pattern layers (PL) on which coil patterns (CP; coil patterns) are formed. An insulating layer may be inserted between the heating coil pattern layers. According to the induction heating device (2000) having such a heating coil substrate (10), since the heating coil substrate (10) has a laminated structure of four or more layers, the thickness of one layer of the heating coil, for example, the thickness of the copper, can be made thin and the pattern width can be made small, thereby reducing the influence of the skin effect and reducing coil loss. Of course, this is only one example, and the heating coil substrate (10) may have a laminated structure of five or more layers, which is more than four layers.

[0102] In the heating coil substrate (10), one or more coil patterns are formed on each pattern layer of a plurality of heating coil pattern layers. For example, the coil pattern (CP) may be spiral-shaped. In one embodiment, the coil pattern (CP) may be formed by a plurality of coil elements that are approximately rectangular in a plan view, as illustrated in FIG. 8. In one embodiment, the coil pattern (CP) may be formed by a plurality of coil elements that are circular in a plan view. The shape of the coil elements forming the coil pattern (CP) is not limited to the above-described shape. The heating coil substrate (10) may include a plurality of serial pattern groups. The plurality of serial pattern groups may be connected in parallel with each other. Each of the plurality of serial pattern groups may include a plurality of serially connected coil patterns (CP). The plurality of serial pattern groups may be formed such that coil patterns formed on adjacent pattern layers among the plurality of pattern layers are mutually connected in parallel. Thereby, the coils formed on the plurality of pattern layers may form a parallel connection relationship, and a large current capacity may be secured while reducing heating coil loss. A plurality of coil patterns (CPs) forming each of a plurality of serial pattern groups may be formed in four or more pattern layers. At least one of the plurality of serial pattern groups may have a different combination of the plurality of pattern layers from the remaining serial pattern groups. Accordingly, the wiring structure may be simplified, the number of interlayer connections may be reduced, and thus power loss may be reduced. In other words, since the impedance gap between the parallel-connected serial pattern groups due to the mutual impedance in each pattern layer is reduced, efficiency characteristics equivalent to those of a full-layer serial connection structure can be theoretically maintained. In addition, since the number of interlayer connections is reduced compared to a full-layer serial connection structure, the interlayer wiring resistance is lowered, enabling a lower-loss design than a full-layer serial connection structure. The plurality of serial pattern groups may include at least two serial pattern groups having the same combination of the plurality of pattern layers. Accordingly, the number of interlayer connections may be reduced.

[0103] In one embodiment, a plurality of terminals (input terminal (2a), output terminal (2b)) for parallel connection of a plurality of serial pattern groups included in each laminated layer of the heating coil substrate (10) may be formed on the outer periphery of the coil pattern (CP). In addition, electrical connection between the pattern layers may be achieved by a conductor (through hole (TH) or via hole) formed by penetrating the heating coil substrate (10). The through hole (TH) penetrates all of the pattern layers (PL) and enables electrical connection between the layers.

[0104] In addition, in the heating coil substrate (10) according to one embodiment of the present disclosure, the coil patterns (CP) can be connected so that the input terminal (2a) side is the uppermost layer among the plurality of pattern layers, and the output terminal (2b) side is the lowermost layer among the plurality of pattern layers (PL). According to this configuration, when forming multilayer coil patterns (CP), a weak electric sensor can be mounted on the upper layer, and the weak electric sensor can be easily formed in a thin film structure.

[0105] FIG. 9b is a cross-sectional view showing interlayer connections of a heating coil substrate according to one embodiment of the present disclosure.

[0106] FIG. 9b is a cross-sectional view illustrating interlayer connections in an eight-layer heating coil substrate (10) according to one embodiment of the present disclosure. Referring to FIG. 9b, the heating coil substrate (10) may be a PCB substrate formed by stacking four or more pattern layers (PL) on which coil patterns (CP) are formed. An insulating layer formed by stacking two or more prepreg insulating layers may be included between the pattern layers.

[0107] According to one embodiment of the present disclosure, FIG. 9B illustrates a heating coil substrate (10) formed by stacking eight heating coil pattern layers (first to eighth layers). According to one embodiment, the heating coil substrate (10) includes four heating coil pattern layers (11, 12, 13, 14) and another four heating coil pattern layers (15, 16, 17, 18). In one embodiment, each of the four heating coil pattern layers (11, 12, 13, 14) may have four coil patterns (CP) connected in series. The four heating coil pattern layers (11, 12, 13, 14) are connected in parallel to each other through 2c through holes (TH).

[0108] In Fig. 9b, let us call each pattern layer of the plurality of heating coil pattern layers (11, 12, ..., 18) from the top a first heating coil pattern layer (11), a second heating coil pattern layer (12), a third heating coil pattern layer (13), a fourth heating coil pattern layer (14), a fifth heating coil pattern layer (15), a sixth heating coil pattern layer (16), a seventh heating coil pattern layer (17), and an eighth heating coil pattern layer (18).

[0109] Referring to FIG. 9b, the first heating coil pattern layer (11) can be connected in series with the eighth heating coil pattern layer (18) formed in the eighth layer through a 2d through hole. The second heating coil pattern layer (12) can be connected in series with the seventh heating coil pattern layer (17) formed in the seventh layer through a 2d through hole. The third heating coil pattern layer (13) of the third layer can be connected in series with the sixth heating coil pattern layer (16) formed in the sixth layer through a 2d through hole. The fourth heating coil pattern layer (14) of the fourth layer can be connected in series with the fifth heating coil pattern layer (15) formed in the fifth layer through a 2d through hole.

[0110] In this way, the heating coil pattern layers (11, 12, 13, 14) illustrated in FIGS. 9a and 9b have different combinations of pattern layers that are connected in series. When four heating coil pattern layers (11, 12, 13, 14) are connected in parallel, the coil patterns (CP) formed on different pattern layers can be connected in parallel.

[0111] In addition, in the heating coil substrate (10) according to one embodiment of the present disclosure, the coil patterns (CP) can be connected so that the input terminal (2a) side is on the uppermost layer among the plurality of heating coil pattern layers, and the output terminal (2b) side is on the lowermost layer among the plurality of heating coil pattern layers. According to this configuration, when forming a plurality of heating coil pattern layers and mounting a weak electric sensor on the upper layer, it is easy to form the weak electric sensor in a thin film structure. The weak electric sensor can include a container detection coil.

[0112] The multi-layer structure of the heating coil substrate (10) is not limited to the eight-layer structure described above.

[0113] FIG. 9c is a cross-sectional view of a series-parallel connection between a 16-layer heating coil substrate and a heating coil substrate according to one embodiment of the present disclosure.

[0114] According to the connection cross-section according to Fig. 9c, it is the same as Fig. 9b in that the method of laminating and a plurality of coil patterns connected in series can be provided in one heating coil pattern layer.

[0115] A single heating coil substrate (10) may have a plurality of series pattern groups. The plurality of series pattern groups may be connected in parallel with each other. Each of the plurality of series pattern groups may have a plurality of series-connected coil patterns (CP). The plurality of series pattern groups may be formed such that adjacent pattern layers among the plurality of heating coil pattern layers are mutually connected in parallel. Accordingly, coils formed in the plurality of heating coil pattern layers may form a parallel connection relationship, and a large current capacity can be secured. The plurality of coil patterns (CP) forming each of the plurality of series pattern groups may be formed in four or more pattern layers. At least one of the plurality of series pattern groups may have a different combination of the plurality of heating coil pattern layers from the remaining series pattern groups. Accordingly, the wiring structure can be simplified, thereby reducing the number of interlayer connections, and consequently reducing power loss. That is, the impedance gap between the parallel-connected series pattern groups is lowered by the mutual impedance in each heating coil pattern layer, thereby theoretically maintaining efficiency characteristics equivalent to an entire layer series connection structure. Furthermore, by reducing the number of interlayer connections compared to full-layer serial connection casting, the interlayer wiring resistance is lowered, enabling a lower-loss design than the full-layer serial connection structure. Multiple serial pattern groups may include at least two serial pattern groups with the same combination of multiple heating coil pattern layers. This allows for a reduced number of interlayer connections.

[0116] According to one embodiment of the present disclosure, a heating coil substrate (10) formed by stacking 16 pattern layers (first to sixteenth layers) is disclosed in FIG. 9c. As one embodiment, the heating coil substrate (10) includes four heating coil pattern layers (11, 12, 13, 14). According to one embodiment, each of the four heating coil pattern layers (11, 12, 13, 14) may include four coil patterns (CP) connected in series. The four heating coil pattern layers (11, 12, 13, 14) are connected in parallel to each other through 2c through holes.

[0117] For example, referring to FIG. 9c, the first heating coil pattern layer (11) of the first layer can be connected in series with the heating coil pattern layer (CP) formed in the 8th layer. The second heating coil pattern layer (12) of the second layer can be connected in series with the heating coil pattern layers (CP) formed in the 7th layer, the 10th layer, and the 15th layer. The third heating coil pattern layer (13) of the third layer can be connected in series with the heating coil pattern layers (CP) formed in the 6th layer, the 11th layer, and the 14th layer. The fourth heating coil pattern layer (24) of the 4th layer can be connected in series with the heating coil pattern layers (CP) formed in the 5th layer, the 12th layer, and the 13th layer.

[0118] In this way, each of the heating coil pattern layers (11, 12, 13, 14) illustrated in Fig. 9c has a different combination of series-connected heating coil pattern layers. When four heating coil pattern layers (11, 12, 13, 14) are connected in parallel, the coil patterns (CP) formed on different heating coil pattern layers are connected in parallel.

[0119] According to one embodiment of the present disclosure, electrical connections between heating coil pattern layers are formed by conductors (through holes (TH)) formed by penetrating the heating coil substrate (10). The through holes (TH) are formed by penetrating all heating coil pattern layers. Four coil patterns (CP) forming each heating coil pattern layer (11, 12, 13, 14) can be connected in series by one middle terminal (2c) formed by a conductor installed on the outer periphery of the coil pattern (CP) and a plurality of connection terminals (2d) formed by conductors installed on the inner periphery of the coil pattern (CP).

[0120] In addition, in the heating coil substrate (10) of the present embodiment, the coil patterns (CP) can be connected so that the input terminal (2a) side is the uppermost layer among the plurality of heating coil pattern layers, and the output terminal (2b) side is the lowermost layer among the plurality of heating coil pattern layers. According to this configuration, when a weak electric sensor is mounted on the upper layer when a plurality of heating coil pattern layers are formed, it is easy to form the weak electric sensor in a thin film structure. According to one embodiment of the present disclosure, the weak electric sensor may include a container detection coil as a container detection sensor.

[0121] FIG. 9d is a cross-sectional view showing the interlayer connection of a heating coil substrate including a container sensing coil layer according to one embodiment of the present disclosure.

[0122] The heating coil substrate (10) according to Fig. 9d includes a container detection coil layer (33) including a container detection coil on the top layer.

[0123] A container detection coil layer (33) according to one embodiment of the present disclosure is a pattern layer having a plurality of container detection coils printed thereon for detecting a cooking vessel (101) placed on a top plate of an induction heating device (2000).

[0124] According to one embodiment of the present disclosure, at least two prepreg insulating layers may be included between the container sensing coil layer (33) and the first heating coil pattern layer (11) to simultaneously insulate and bond the two layers. According to one embodiment, each of the two prepreg insulating layers may be an insulating layer comprising 60% to 80% of a resin content.

[0125] According to one embodiment of the present disclosure, a heating coil substrate (10) according to FIG. 9d is produced by pressing a laminated substrate including a container sensing coil layer (33), first to sixteenth heating coil pattern layers, and a signal layer (35) for connector connection as the lowermost layer. According to one embodiment of the present disclosure, when pressing, a conductor of the container sensing coil layer (33) of the uppermost layer of the laminated substrate or a conductor included in any one of the first to sixteenth heating coil pattern layers does not come into contact with the reinforcing fiber of the prepreg insulating layer, so that insulation can be maintained.

[0126] In one embodiment, a first end of each of the plurality of container detection coils included in the container detection coil layer (33) may be connected to a signal layer (35) for connector connection, which is the lowest layer, through the through-hole 2e through the heating coil substrate (10). The first end of the container detection coil connected to the signal layer (35) for connector connection through the through-hole 2e may be connected to a connector mounted on the signal layer (35) for connector connection. In addition, a second end of each of the container detection coils may be connected to a terminal of a connector provided on the heating coil substrate (10) on the container detection coil layer (33). The first and second ends of each of the plurality of container detection coils may be connected to a processor included in the inverter substrate (30) or the intermediate substrate (20) through the connector.

[0127] In one embodiment, the through hole 2e connected to each of the first ends of the container detection coils of the container detection coil layer (33) may be provided with a minimum space in the coil pattern of the heating coil so that it does not come into contact with the conductor of the first to sixteenth heating coil pattern layers when passing through the first to sixteenth heating coil pattern layers, through which the through hole 2e can pass vertically.

[0128] FIG. 10A is a patterned layer including a container sensing coil according to one embodiment of the present disclosure.

[0129] Referring to FIG. 10a, a container detection coil layer (33) including a container detection coil (2700) among the heating coil substrates (10) is illustrated.

[0130] The container detection coil layer (33) according to FIG. 10a includes eight container detection coils (2700) in a pattern. In addition, according to one embodiment, the container detection coil layer (33) includes a hole (25) through which a temperature sensor capable of detecting the temperature of the cooking vessel can pass. In some cases, the hole (25) through which the temperature sensor can pass in the container detection coil layer (33) may not be included. The pattern of the container detection coil (2700) in the container detection coil layer (33) according to FIG. 10 has a circular shape and may be provided in a plane space that does not vertically overlap with the heating coil patterned in another layer as much as possible. The reason why the container detection coil (2700) and the heating coil should not vertically overlap with each other as much as possible is because the power level of the heating coil is high. A heating coil with a high power level may affect the detection operation of the container detection coil (2700) with a relatively low power level. Thus, in one embodiment, the container sensing coil may be printed as close to an edge as possible on a diagonal line of the substrate on which the container sensing coil is printed, and the heating coil may be printed in the center of the substrate on which the heating coil is printed.

[0131] The container detection coil (2700) may include a first stage (2701) that goes down to the signal layer (35) for connector connection, which is the lowest layer of the heating coil substrate (10), through a through hole or via hole in the center of the patterned circle, and a second stage (2703) for connection to a connector or wire provided on the container detection coil layer (33). The induction heating device (2000) can detect whether a container is present on the top plate (5) of the induction heating device (2000) through a change in inductance measured by the container detection coil (2700) through the first stage (2701) and the second stage (2703). Of course, this is only one example, and the first stage that goes down to the lowest layer of the heating coil substrate (10) through the through hole can be connected to a connector or wire at the lower part of the heating coil pattern layer of the lowest layer if the heating coil substrate (10) is not provided with a separate signal layer (35) for connection and the lower part of the heating coil pattern layer of the lowest layer can be used as a printed pattern.

[0132] FIG. 10b is a diagram showing a container sensing coil layer according to one embodiment of the present disclosure.

[0133] Figure 10b shows that a container detection coil (2700) is printed on the container detection coil layer (33).

[0134] FIG. 10c is a drawing showing a heating coil pattern layer according to one embodiment of the present disclosure.

[0135] Let the heating coil pattern layer of Fig. 10c be referred to as the first heating coil pattern layer (11), which is one of a plurality of heating coil pattern layers. The container detection coil layer (33) and the first heating coil pattern layer (11) of Fig. 10b may be laminated to form a part of a laminated substrate. When the laminated substrate is compressed, a heating coil substrate (10) may be created.

[0136] The container detection coil (2700) on the container detection coil layer (33) of FIG. 10b can be printed in an area (2707) that vertically minimizes overlap with the heating coil of the first heating coil pattern layer (11) of FIG. 10c. Since the container detection coil (2700) is printed in an area (2707) that vertically minimizes overlap with the heating coil, the container detection coil (2700), which is at a low power level, can minimize electrical interference from the heating coil, which is at a high power level.

[0137] FIG. 11 illustrates a process of manufacturing a heating coil substrate of an induction heating device according to one embodiment of the present disclosure.

[0138] Figure 11 illustrates the final production process of a CCL (copper clad laminate, 1110). A CCL is a PCB substrate formed by laminating multiple heating coil pattern layers. A CCL can be produced by bonding copper foil to one or both sides of a PCB core. A CCL is produced by laminating copper foil to prepreg (preimpregnated materials) (1120).

[0139] Prepreg (1120) is a sheet-shaped resin product in which a matrix is ​​pre-impregnated into reinforced fiber (1130), and is made into a semi-cured state by impregnating the reinforced fiber (1130) with a thermosetting resin (1140). Prepreg is an insulating material, but is also used as an adhesive for bonding each heating coil pattern layer.

[0140] FIG. 12 is a drawing showing a heating coil substrate layer by layer according to one embodiment of the present disclosure.

[0141] According to FIG. 12, a laminated substrate (300) according to one embodiment of the present disclosure may include eight plurality of heating coil pattern layers (11, 12, ..., 18) and nine plurality of insulating layers (311, 312, ..., 319). One insulating layer (312) is composed of, for example, two prepreg insulating layers (312a, 312b). The heating coil substrate (10) is produced by hot pressing the laminated substrate (300) above.

[0142] In Fig. 12, the PCB original used to make a substrate forming one heating coil pattern layer (11) has a size of 1020 (mm) x 1200 (mm) or 1020 (mm) x 1020 (mm). When manufacturing a substrate by printing a heating coil pattern on a PCB original, in order to supply high power while reducing the skin effect, the thickness of the copper patterned as a conductor and the width of the heating coil pattern must be narrow. At the same time, the current capacity can be secured by connecting a plurality of heating coil pattern layers (11, 12, ... , 18) in parallel. However, in order to connect a plurality of heating coil pattern layers (11, 12, ... , 18) in parallel, the number of connections between layers increases and the coil loss due to the wiring length also increases. In order to reduce the number of interlayer connections while reducing coil loss, a plurality of heating coil pattern layers (11, 12, ..., 18) may be provided with a plurality of serially connected serial patterns. In addition, these plurality of serial patterns may be connected in parallel to each other. In one embodiment, it is preferable that at least one serial pattern is laminated in four or more layers.

[0143] According to one embodiment of the present disclosure, the upper four layers (11, 12, 13, 14) among the plurality of heating coil pattern layers (11, 12, ..., 18) may be electrically connected in parallel. In addition, the lower four layers (15, 16, 17, 18) among the plurality of heating coil pattern layers (11, 12, ..., 18) may be electrically connected in parallel. Here, although 'upper' and 'lower' are relative terms, the one among the plurality of heating coil pattern layers (11, 12, ..., 18) that is closer to the top plate of the induction heating device (2000) may be referred to as the 'upper'.

[0144] Four heating coil pattern layers electrically connected in parallel to each other can be connected in series with each other. The series connection between the heating coil pattern layers can be made between the first heating coil pattern layer (11) - the eighth heating coil pattern layer (18), the second heating coil pattern layer (12) - the seventh heating coil pattern layer (17), the third heating coil pattern layer (13) - the sixth heating coil pattern layer (16), and the fourth heating coil pattern layer (14) - the fifth heating coil pattern layer (15). A detailed description has already been described with reference to FIG. 10b.

[0145] However, this is only one example, and if the heating coil pattern layer is composed of only the first heating coil pattern layer (11) to the fourth heating coil pattern layer (14), the first heating coil pattern layer (11) and the second heating coil pattern layer (12) may be electrically connected in parallel with each other, and the third heating coil pattern layer (13) and the fourth heating coil pattern layer (14) may be electrically connected in parallel. In addition, the first heating coil pattern layer (11) and the fourth heating coil pattern layer (14) may be electrically connected in series, and the second heating coil pattern layer (12) and the third heating coil pattern layer (13) may be electrically connected in series.

[0146] In one embodiment, the thickness of each heating coil pattern layer in the plurality of heating coil pattern layers (11, 12, …, 18) may be 60 um to 82 um.

[0147] In one embodiment, the thickness of the heating coil substrate (10) formed by pressing a laminated substrate (300) including a container detection coil layer (33), a signal layer (35) for connector connection, and a plurality of heating coil pattern layers of 18 layers may be 3.3 mm or less. However, this is only one embodiment, and the thickness of the heating coil substrate (10) formed by pressing the laminated substrate (300) may be between 2.5 mm and 4.0 mm.

[0148] When a manufacturer of an induction heating device (2000) orders a CCL, the CCL may be manufactured in a form that includes two heating coil pattern layers and an insulating layer between them. In this case, an insulating layer may be inserted between multiple CCLs to create a laminated substrate (300). In this case, the insulating layer may be created by laminating two prepreg insulating layers.

[0149] Referring to FIG. 12, the first CCL (3001) may be composed of a first heating coil pattern layer (11), an insulating layer (312), and a second heating coil pattern layer (12). The second CCL (3002) may be composed of a third heating coil pattern layer (13), an insulating layer (314), and a fourth heating coil pattern layer (14). When the manufacturer of the induction heating device (2000) obtains the CCL ordered, insulating layers may be laminated between the CCLs to produce a laminated substrate (300). For example, an insulating layer (313) may be inserted between the first CCL (3001) and the second CCL (3002). The insulating layer (313) may be produced by laminating two prepreg insulating layers.

[0150] Finally, when the laminated substrate (300) is compressed, the CCLs are hardly compressed because they have already been compressed, and instead, the compression ratio of the insulating layer between the CCLs - for example, the insulating layer (313) - is high. In one embodiment, the insulating layer within the CCLs - for example, the insulating layer (312) - may have a thickness of 140 μm or less after compression. On the other hand, the insulating layer between the CCLs - for example, the insulating layer (313) - may have a thickness of 120 μm or less after compression.

[0151] In Fig. 12, the number of the plurality of heating coil pattern layers is illustrated as eight, but this is only one example, and according to one embodiment of the present disclosure, the number of the plurality of heating coil pattern layers can be adjusted according to the design. For example, the number of the plurality of heating coil pattern layers can be four. Alternatively, in one embodiment, a heating coil substrate having a total of sixteen heating coil pattern layers can be used, in which eight CCLs including two heating coil pattern layers and an insulating layer therebetween are laminated.

[0152] As shown in Fig. 12, patterning a heating coil onto a PCB simplifies the manufacturing process and reduces manufacturing costs compared to manufacturing a heating coil by winding it with Litz wire. Furthermore, patterning a heating coil onto a PCB increases the inductance accuracy of the heating coil compared to manufacturing a heating coil by winding it with Litz wire, thereby ensuring a consistent heating level.

[0153] Additionally, patterning the heating coil on a PCB reduces copper usage as only 1 / 3 of the copper is used for the same heating output compared to manufacturing the heating coil by winding it with Litz wire.

[0154] When 1 ounce of copper is used on the PCB original plate (1020(mm)x1200(mm) or 1020(mm)x1020(mm)) used to manufacture the heating coil pattern layer, insulation can be secured between the multiple insulating layers (311, 312, ..., 319) and the multiple heating coil pattern layers (11, 12, ..., 18) when the laminated substrate on which the PCB original plates are laminated is hot pressed, but the amount of copper may be insufficient as a heating coil required for high power. If the amount of copper is insufficient, overheating may occur in the heating coil pattern, and heat loss may increase. In order to lower the heat generated in the heating coil pattern, there is a method of widening the width of the heating coil pattern, but if the pattern width is widened, it is difficult to secure a large number of turns, and therefore it is difficult to secure an appropriate inductance, so widening the pattern width is difficult in terms of design. Therefore, there is a way to increase the thickness of the heating coil pattern.

[0155] FIG. 13 is a drawing showing a heating coil pattern width specification according to one embodiment of the present disclosure.

[0156] Unlike the copper patterns on typical PCBs, heating coil patterns need to handle a significant amount of power. Therefore, a large amount of current must flow through the patterned heating coil, requiring the pattern width to be wider than a typical copper pattern, or the pattern thickness (height) to be thicker (higher).

[0157] To increase the thickness of the heating coil pattern, 2 ounces (Oz) of copper can be used on the PCB substrate instead of the conventional 1 ounce (Oz) of copper.

[0158] Referring to Fig. 13, a cross-sectional view of a copper pattern using 2 ounces of copper on a PCB original is illustrated. As seen in Fig. 13, the copper pattern has a height of 35 μm when 1 ounce of copper is used, whereas the height is 60 μm or more when 2 ounces of copper are used. The width (gap width) is the width requested by the customer who manufactures the induction heating device (2000), and the upper part of the pattern can be between 95% and 125% of the ordered width (A), and the lower part of the pattern can be between 100% and 130% of the ordered width (A). Usually, when liquid copper is melted, it becomes a trapezoidal shape with slightly different widths at the upper and lower parts, as shown in Fig. 13.

[0159] However, if more than 2 ounces (Oz) of copper is used on the PCB substrate - 2 ounces to 3 ounces - the copper becomes too thick, and when hot pressing the laminated substrate (300) according to FIG. 12, a problem may occur where one prepreg insulating layer (312a) is pressed in a liquefied state and comes into contact with the copper coil.

[0160] However, if more than 2 ounces (Oz) of copper is used on the PCB substrate - 2 ounces to 3 ounces - the copper becomes too thick, and when hot pressing the laminated substrate (300) according to FIG. 12, a problem may occur where one prepreg insulating layer (312a) is pressed in a liquefied state and comes into contact with the copper coil.

[0161] Figure 14 shows a cross-section (37) of a portion of the heating coil in Figure 12.

[0162] FIG. 14 is a drawing showing a cross-section of a laminated substrate according to one embodiment of the present disclosure.

[0163] When looking at a cross-section (37) of a portion of the heating coil, a phenomenon occurs in which copper comes into contact with reinforcing fibers included in the intermediate insulating material due to compression. Therefore, in order to prevent the phenomenon in which copper comes into contact with reinforcing fibers as shown in FIG. 14, an insulating layer in which at least two prepreg layers are laminated is used according to one embodiment of the present disclosure. In one embodiment, the at least two prepreg layers may have a thickness of about 140 μm or less before compression. In one embodiment, the at least two prepreg layers must have a thickness of 130-140 μm or less before compression so that the thickness of the heating coil substrate after compression can be 3.3 mm or less.

[0164] One prepreg insulating layer (312a) contains resin contents, and when making a PCB into multiple layers and pressing the multi-layer PCB, the resin contents may flow out. The resin contents that flow out in this way may come into contact with the reinforcing fibers included in the prepreg insulating layer (312a), resulting in a part having poor adhesion. If the inter-pattern layer adhesion by the prepreg insulating layer (312a) is not properly formed, the heating coil pattern may be lifted internally when current flows through the heating coil, and when the heating coil pattern is lifted, moisture or air may enter the lifted interior, causing the PCB to swell. To prevent this phenomenon, a method of laminating two prepreg insulating layers (312a, 312b) between the heating coil pattern layers as an insulating layer, as shown in FIG. 12, may be used.

[0165] The insulation layer uses a prepreg insulation layer having a resin content of 60% (RC60) or more and 80% (RC80) or less, and laminates two or more layers of such prepreg insulation layers (312a, 312b). The thickness of one layer of the prepreg insulation layer (312a, 312b) may be 70 μm or less before pressing. Therefore, the prepreg insulation layer (312a, 312b) may have a thickness of 130 to 140 μm or less before pressing. The resin content of 60% (RC60) or more and 80% or less (RC80) or less means that the resin is included in 60 to 80% of the total components of the compound included in the prepreg insulation layer.

[0166] Let's go back to Figure 12 and continue the explanation.

[0167] Each layer constituting the laminated substrate (300) according to one embodiment of the present disclosure may include a hole (25) through which a temperature sensor can pass. The temperature sensor may sense the temperature of a cooking vessel (101) placed on the top plate of an induction heating device (2000).

[0168] According to one embodiment of the present disclosure, the uppermost layer of the laminated substrate (300) may include a container detection coil layer (33) that includes only a container detection coil for detecting whether a cooking vessel is placed on the top plate (5) of the induction heating device (2000). Of course, this is only one embodiment, and the container detection coil may be patterned and included together with the heating coil in the first heating coil pattern layer (11), which is the uppermost heating coil pattern layer among the plurality of heating coil pattern layers (11, 12, ..., 18). When the container detection coil is patterned together with the heating coil pattern layer, induced power may be introduced into the container detection coil by the heating coil. Therefore, according to one embodiment, the laminated substrate (300) may be designed such that the container detection coil is included in a container detection coil layer (33) separate from the heating coil pattern layer. According to one embodiment, the container detection coil layer (33) may have a thickness of 110 μm or less after compression.

[0169] An insulating layer (311) including two prepreg insulating layers may be placed between the container sensing coil layer (33) and the first heating coil pattern layer (11) for insulation and adhesion. The insulating layer (311) placed between the container sensing coil layer (33) and the first heating coil pattern layer (11) may be thinner than the insulating layer (312) including two prepreg insulating layers placed between the first heating coil pattern layer (11) and the second heating coil pattern layer (12). In one embodiment, the thickness of the insulating layer (311) placed between the container sensing coil layer (33) and the first heating coil pattern layer (11) may be 130 um or less. In addition, the amount of copper (0.5 to 1 Oz) used in the PCB original plate to manufacture the container sensing coil layer (33) may be less than the amount of copper (2 to 3 oz) used in the heating coil pattern layer. The reason is that the container detection coil of the container detection coil layer (33) is used for cooking container sensing, so the amount of copper used is less than that of the heating coil for conversation power.

[0170] The container detection coil included in the container detection coil layer (33) can detect when a cooking vessel (101) is placed on the top plate of the induction heating device (2000). When the container detection coil of the induction heating device (2000) detects the cooking vessel (101), the processor of the induction heating device (2000) can display information such as identification information of the cooking vessel (101) detected through the container detection coil, location information of the cooking vessel (101), presence or absence of the cooking vessel (101), and material of the cooking vessel (101) on a display included in the user interface.

[0171] In order to explain a method for detecting the material of a cooking vessel (101), a description will be given with reference to Fig. 24.

[0172] FIG. 24 illustrates detection of the material of a cooking vessel by a vessel detection coil according to one embodiment of the present disclosure.

[0173] When a cooking vessel (101) is placed on the vessel detection coil (2700), a change occurs in the magnetic field formed by the vessel detection coil (2700). At this time, when a cooking vessel (101) having a high permeability (μ1) approaches the vessel detection coil (2700), the total inductance generated by the vessel detection coil (2700) increases, and accordingly, the current (i1) flowing in the vessel detection coil (2700) decreases. If the permeability (μ2 < μ1) of the cooking vessel (101) is relatively low, the total inductance generated by the vessel detection coil (2700) relatively decreases, and accordingly, the current (i2) flowing in the vessel detection coil (2700) increases compared to the current (i1) in the previous case. According to this change in current, the induction heating device (2000) can determine the material of the cooking vessel (101) by the vessel detection coil (2700).

[0174] According to one embodiment of the present disclosure, the container sensing coil layer (33) may include a temperature sensor for sensing the temperature of the heating coil substrate (10) when the induction heating device (2000) heats the cooking vessel (101).

[0175] One or more processors included in the induction heating device (2000) can individually or collectively execute commands stored in memory to cause the induction heating device (2000) to determine the material of the cooking vessel (101). By having one or more processors execute the commands, the induction heating device (2000) can also determine the location of the cooking vessel (101) and the presence or absence of the cooking vessel (101).

[0176] Figures 15 and 16 are characteristic curves of a temperature sensor according to one embodiment of the present disclosure.

[0177] The temperature sensor may include a PTC (positive temperature coefficient) thermistor or an NTC (negative temperature coefficient) thermistor. FIG. 15 is a characteristic curve of a PTC thermistor according to one embodiment of the present disclosure.

[0178] According to Fig. 15, the PTC thermistor has a characteristic in which the resistance increases as the temperature of the location where the PTC thermistor is attached increases. For example, the resistance of the PTC thermistor becomes 1 kΩ when the detection temperature is around 130 degrees. And the resistance of the PTC thermistor becomes 100 Ω or less when the detection temperature is around 100 degrees. Of course, the PTC thermistor according to Fig. 15 is only an example, and the temperature-resistance characteristic curve of the PTC thermistor may also vary depending on the type.

[0179] Fig. 16 is a characteristic curve of an NTC thermistor according to one embodiment of the present disclosure.

[0180] According to Fig. 16, the NTC thermistor has a characteristic that the resistance decreases as the temperature of the location where the NTC thermistor is attached increases. For example, the resistance of the NTC thermistor becomes 973Ω when the detection temperature is around 100 degrees. And the resistance of the NTC thermistor becomes 10kΩ when the detection temperature is around 25 degrees. Of course, the NTC thermistor according to Fig. 16 is only an example, and the temperature-resistance characteristic curve of the NTC thermistor may also vary depending on the type.

[0181] Fig. 17 is a temperature sensing circuit according to one embodiment of the present disclosure.

[0182] Fig. 17 is a temperature detection circuit using a thermistor as a temperature sensor according to one embodiment of the present disclosure.

[0183] The temperature detection circuit according to Fig. 17 may include a distribution resistor (1710) and a PTC thermistor (1720) as a temperature sensor, and the output point A of the temperature detection circuit may be input to an analog-to-digital conversion input port. Of course, this is only one embodiment, and the output point A of the temperature detection circuit may be directly input to a processor (not shown) having an analog-to-digital conversion input port, for example, or may be input to a comparator and compared with a predetermined value. The PTC thermistor (1720) detects the temperature of the heating coil substrate (10).

[0184] According to Fig. 17, the input voltage of +5 V is distributed by the distribution resistor (1710) 1 kΩ and the PTC thermistor (1720). The distribution resistor (1710) is a resistor that distributes the input voltage of +5 V to the PTC thermistor (1720). In addition, it can be seen from Fig. 17 that the distribution resistor (1710) is a pull-up resistor. The point (A) between the distribution resistor (1710) and the PTC thermistor (1720) is connected to an analog-to-digital conversion input port or a comparator input. Although the distribution resistor (1710) is shown as one in Fig. 17, multiple distribution resistors may be used. In Fig. 17, the PTC thermistor (1720) is shown as having a resistance of 1 kΩ at 130 degrees Celsius, but the resistance depending on the temperature may vary depending on the type of PTC thermistor (1720). According to Fig. 17, the voltage applied to point A at 130 degrees Celsius is 2.5 V. Let's say that the temperature at which the heating coil substrate (10) is determined to be overheated is 130 degrees Celsius. If the resistance of the PTC thermistor (1720) becomes 1 kΩ at 130 degrees Celsius, the voltage applied to point A becomes 2.5 V. Therefore, a processor (not shown) that detects a digital value corresponding to 2.5 V can determine that the heating coil substrate (10) is overheated. The processor that determines that the heating coil substrate (10) is overheated can subsequently perform an overheat prevention operation. The temperature at which the heating coil substrate (10) is determined to be overheated can be arbitrarily selected by the designer according to the specifications of the material forming the heating coil substrate (10). In this way, point A, which reads the voltage value that changes due to the change in resistance of the PTC thermistor (1720) according to the change in temperature, can be said to be the output of the temperature detection circuit.

[0185] According to one embodiment, the induction heating device (2000) can lower the output of the induction heating device (2000) if the temperature detected by the temperature sensor included in the heating coil substrate (10) is higher than a predetermined temperature - for example, the temperature detected in the heating coil pattern layer is 130 degrees. Let us assume that the output of the induction heating device (2000) is divided into levels 1 to 10 and that the induction heating device (2000) is currently performing a heating operation in levels 10. For example, if the temperature of the heating coil pattern layer detected by the temperature sensor is 130 degrees, the induction heating device (2000) can automatically lower the output to level 9. If the temperature of the heating coil pattern layer does not fall below 130 degrees within a predetermined time - for example, 30 seconds - even after the induction heating device (2000) lowers the output to level 9, the induction heating device (2000) can further automatically lower the output to level 8.

[0186] Conversely, when the temperature of the heating coil pattern layer drops below a predetermined second temperature - for example, 90 degrees - while the output is at level 8, the induction heating device (2000) can increase the output to level 9 again. In this way, the output of the induction heating device (2000) can be adjusted according to the temperature of the heating coil pattern layer through the temperature sensor. In one embodiment, the output adjustment of the induction heating device (2000) can be performed by a processor (not shown) of the induction heating device (2000).

[0187] Fig. 18 is a temperature sensing circuit according to one embodiment of the present disclosure.

[0188] The temperature detection circuit according to Fig. 18 may include a distribution resistor (1710) and an NTC thermistor (1730) as a temperature sensor, and the output B point of the temperature detection circuit may be input to an analog-to-digital conversion input port or a comparator.

[0189] An NTC thermistor (1730) can be used to detect the temperature of the heating coil substrate (10). The distribution resistor (1710) is a resistor that distributes the input voltage of +5 V to the NTC thermistor (1730).

[0190] According to Fig. 18, the input voltage of +5 V is distributed by the distribution resistor (1710) 973Ω and the NTC thermistor (1730). In Fig. 18, the distribution resistor (1710) is a pull-up resistor. Point (B) between the distribution resistor (1710) and the NTC thermistor (1730) is connected to the analog-to-digital conversion input port or the analog-to-digital conversion input port of the processor (not shown) if the processor has an analog-to-digital conversion input port or a comparator input. Although the distribution resistor (1710) is shown as one in Fig. 18, multiple ones may be used. In Fig. 18, the NTC thermistor (1730) is shown as having a resistance of 973kΩ at 100 degrees Celsius, but the resistance depending on the temperature may vary depending on the type of NTC thermistor (1730). Let's say that the temperature at which the heating coil substrate (10) is determined to be overheated is 100 degrees Celsius. According to Fig. 18, when the resistance of the NTC thermistor (1730) becomes 973Ω at 100 degrees Celsius, the voltage applied to point B becomes 2.5 V. Therefore, a processor that detects a digital value corresponding to 2.5 V can determine that the heating coil substrate (10) is overheated. When the processor determines that the heating coil substrate (10) is overheated, the processor can selectively perform an overheat prevention operation. The temperature at which the heating coil substrate (10) is determined to be overheated can be arbitrarily selected by the designer according to the specifications of the heating coil substrate (10). In this way, point B, which reads the voltage value that changes according to the NTC thermistor (1730), can be referred to as the output of the temperature detection circuit.

[0191] According to one embodiment, the induction heating device (2000) can lower the output of the induction heating device (2000) if the temperature detected by the temperature sensor included in the container detection coil layer (33) is higher than a predetermined temperature - for example, the temperature detected in the heating coil pattern layer is 100 degrees. Let us assume that the output of the induction heating device (2000) is divided into steps 1 to 10 and the induction heating device (2000) is currently performing a heating operation in step 8. For example, if the temperature of the heating coil pattern layer is detected as 100 degrees by the temperature sensor, the induction heating device (2000) can automatically lower the output to step 7. If the temperature of the heating coil pattern layer does not drop below 100 degrees within a predetermined time even though the induction heating device (2000) has lowered the output to step 7, the induction heating device (2000) can further automatically lower the output to step 6.

[0192] Conversely, when the temperature of the heating coil pattern layer drops below a predetermined second temperature - for example, 80 degrees - while the output is at level 7, the induction heating device (2000) can increase the output to level 8 again. In this way, the output of the induction heating device (2000) can be adjusted according to the temperature of the heating coil pattern layer through the temperature sensor. In one embodiment, the output adjustment of the induction heating device (2000) can be performed by a processor (not shown) of the induction heating device (2000).

[0193] Returning to FIG. 12, according to one embodiment of the present disclosure, the lowermost layer of the laminated substrate (300) may include a connector connection signal layer (35) on which a connector is mounted to connect the heating coil substrate (10) and the inverter substrate of the induction heating device (2000) with a connector. According to one embodiment, the connector connection signal layer (35) may have a thickness of 110 μm or less after compression. An insulation layer (319) in which two prepreg insulation layers are laminated may be placed between the connector connection signal layer (35) and the eighth heating coil pattern layer (18) for insulation and adhesion. The insulating layer (319) formed by laminating two prepreg insulating layers between the signal layer (35) for connector connection and the eighth heating coil pattern layer (18) may be thinner than the insulating layer (318) formed by laminating two prepreg insulating layers between the seventh heating coil pattern layer (17) and the eighth heating coil pattern layer (18). In one embodiment, if the thickness of the insulating layer (319) formed between the signal layer (35) for connector connection and the eighth heating coil pattern layer (18) is 120 um or less, the thickness of the insulating layer (318) formed between the seventh heating coil pattern layer (17) and the eighth heating coil pattern layer (18) may be slightly thicker, 130 um or less. In addition, the amount of copper (0.5 to 1 Oz) used in the PCB substrate to manufacture the signal layer (35) for connector connection may be less than the amount of copper (2 to 3 Oz) used in the heating coil pattern layer. The reason is that the signal coil of the signal layer (35) for connector connection is used for signal transmission, so the amount of copper used is less than that of the heating coil for conversation power.

[0194] In order to explain how a connector for connection between boards such as a heating coil board (10) and an inverter board is mounted, a description will be given with reference to FIGS. 19 to 21.

[0195] FIG. 19 illustrates a structure in which each substrate of an induction heating device is connected according to one embodiment of the present disclosure.

[0196] Referring to FIG. 19, an induction heating device (2000) according to one embodiment of the present disclosure may include a top plate (5) on which a cooking vessel (101) is placed, and a heating coil substrate (10) on which a plurality of heating coils are patterned and laminated under the top plate (5). An induction heating device (2000) according to one embodiment of the present disclosure may include an intermediate substrate (20) including a relay, a resonant capacitor, etc. under the heating coil substrate (10). In one embodiment, the intermediate substrate (20) may include a memory for storing a program for controlling the operation of the induction heating device (2000) and a processor for executing the program stored in the memory to control the induction heating device (2000).

[0197] An induction heating device (2000) according to one embodiment of the present disclosure may include an inverter substrate (30) including an inverter and a power converter under an intermediate substrate (20). A resonant capacitor may be included in the inverter substrate (30) according to one embodiment. In one embodiment, the intermediate substrate (20) and the inverter substrate (30) may be combined into a single inverter substrate depending on design specifications. The inverter substrate (30) may include a plurality of electronic switches constituting the inverter. The plurality of electronic switches perform PWM switching. The PWM switching may induce resonance between a heating coil (2120) included in the heating coil substrate (10) and the resonant capacitor, thereby inducing an eddy current in the cooking vessel (101). The inverter substrate (30) may include a power converter for generating a low-voltage DC voltage used for a processor, memory, etc. included in the intermediate substrate (20). The power converter may also generate a voltage of +15 V or +12 V for switching the plurality of electronic switches of the inverter. In the present disclosure, the power conversion device may be referred to as a switched mode power supply (SMPS).

[0198] In one embodiment, the intermediate substrate (20) may be electrically connected to a second connector (120) vertically mounted on an upper surface of an inverter substrate (30) by receiving a first connector (110) vertically mounted on a lower surface of the intermediate substrate (20). In this embodiment, the electrical connection between the intermediate substrate (20) and the inverter substrate (30) may be made only by a connection between the first connector (110) and the second connector (120).

[0199] In one embodiment, the first connector (110) mounted vertically on the lower surface of the intermediate substrate (20) may be a male connector, and the second connector (120) mounted vertically on the upper surface of the inverter substrate (30) may be a female connector. In one embodiment, conversely, the first connector (110) mounted vertically on the lower surface of the intermediate substrate (20) may be a female connector, and the second connector (120) mounted vertically on the upper surface of the inverter substrate (30) may be a male connector.

[0200] When the heating coil substrate (10), the intermediate substrate (20), and the inverter substrate (30) are connected as shown in Fig. 19, wires for connecting the substrates are no longer necessary, so that product defects caused by the wires do not occur. In addition, the inconvenience of assembly or increased manufacturing costs caused by the wires do not occur. Therefore, the structure in which the substrates are connected with connectors as shown in Fig. 19 simplifies product assembly and minimizes product defects. The reason why this structure is possible is that the heating coil is patterned so that the heating coil substrate (10) can be connected to the inverter substrate (30) only with the connector as shown in Fig. 19.

[0201] FIG. 20 is a drawing showing a structure in which a connector is connected to a heating coil substrate in an induction heating device according to one embodiment of the present disclosure.

[0202] Fig. 20 shows the lower surface of the heating coil substrate (10) on which the heating coil substrate connector (130) is mounted, rather than the upper surface on which the top plate (5) is placed. The heating coil substrate connector (130) is vertically mounted on the lower surface of the heating coil substrate (10) so that each heating coil (2120) is electrically connected to the inverter (2113). The heating coil substrate connector (130) may be a male connector or a female connector. In the present disclosure, the heating coil substrate connector (130) may be referred to as a third connector to distinguish it from the first connector (110) and the second connector (120) illustrated in Fig. 19. In one embodiment, the heating coil substrate connector (130) may have a structure in which it is directly connected to a connector vertically mounted on the inverter substrate (30) by penetrating a hole of the intermediate substrate (20) of Fig. 19. Alternatively, in one embodiment, the heating coil substrate connector (130) may be connected to a fourth connector mounted on the intermediate substrate (20). In one embodiment, the heating coil substrate connector (130) is connected to the fourth connector of the intermediate substrate (20) when a resonant capacitor (2114) is mounted on the intermediate substrate (20).

[0203] FIG. 21 is a drawing showing a structure in which a connector is mounted on the back of a heating coil substrate in an induction heating device according to one embodiment of the present disclosure.

[0204] Fig. 21, similar to Fig. 20, shows the lower surface of the heating coil substrate (10). The heating coil substrate (10) of Fig. 21 has a hole penetrating the entire heating coil substrate (10) at the center where the heating coil (2120) is printed and patterned, and a temperature sensor (2600) is installed in this hole. The temperature sensor (2600) can be used to measure the temperature of a cooking vessel (101) placed on the top plate (5) of the induction heating device (2000).

[0205] A heating coil substrate (10) is vertically mounted with a heating coil substrate connector (130) to be electrically connected to an intermediate substrate (20) and / or an inverter substrate (30) placed below the heating coil substrate (10).

[0206] This method of connecting boards with connectors eliminates complex wire connections, which not only increases assembly convenience and reduces the possibility of product defects, but also reduces manufacturing costs.

[0207] Fig. 22 is a block diagram of an induction heating device according to one embodiment of the present disclosure.

[0208] As illustrated in FIG. 22, an induction heating device (2000) according to one embodiment of the present disclosure may include a top plate (5), a heating coil substrate (10), an intermediate substrate (20), and an inverter substrate (30).

[0209] In an induction heating device (2000) according to one embodiment of the present disclosure, the top plate (5) is a plate on which a cooking vessel (100) is placed and is usually made of heat-resistant tempered glass. The top plate (5) may include an output interface (2410) such as a display and an input interface (2420) such as a touch button. In one embodiment, the actual operation of the output interface (2410) such as a display and the input interface (2420) such as a touch button may be performed by the control of a processor (2200) included in an intermediate substrate (20) to be described below. In one embodiment, the display panel or the actual touch button itself may be mounted on the intermediate substrate (20), and only the interface may be mounted on the top plate (5).

[0210] The user interface (2400) that the top plate (5) may include may include an output interface (2410) and an input interface (2420). The output interface (2410) is for outputting an audio signal or a video signal and may include a display and an audio output section, etc.

[0211] When the display and the touchpad are configured as a touch screen in a layered structure, the display can be used as an input interface (2420) in addition to an output interface (2410). The display can include at least one of a liquid crystal display, a thin film transistor-liquid crystal display, a light-emitting diode (LED), an organic light-emitting diode, a flexible display, a 3D display, and an electrophoretic display. In addition, depending on the design, the induction heating device (2000) can include two or more displays.

[0212] The audio output unit can output audio data received from the communication interface (2300) or stored in the memory (2500). In addition, the audio output unit can output audio signals related to functions performed in the induction heating device (2000). The audio output unit can include a speaker, a buzzer, etc.

[0213] According to one embodiment of the present disclosure, the output interface (2410) can display information regarding the cooking vessel (101). For example, the output interface (2410) can output a GUI (Graphical User Interface) corresponding to identification information or product type information of the cooking vessel (101). In addition, the output interface (2410) can output information regarding the current location of the cooking vessel (101) or the material of the cooking vessel (101).

[0214] The input interface (2420) is for receiving input from a user. The input interface (2420) may be at least one of a key pad, a dome switch, a touch pad (contact electrostatic capacitance type, pressure resistive film type, infrared detection type, surface ultrasonic conduction type, integral tension measurement type, piezo effect type, etc.), a jog wheel, and a jog switch, but is not limited thereto.

[0215] The input interface (2420) may include a voice recognition module. For example, the induction heating device (2000) may receive a voice signal, which is an analog signal, through a microphone, and convert the voice portion into computer-readable text using an Automatic Speech Recognition (ASR) model. The induction heating device (2000) may interpret the converted text using a Natural Language Understanding (NLU) model to obtain the user's speech intent. Here, the ASR model or the NLU model may be an artificial intelligence model. The artificial intelligence model may be processed by an artificial intelligence-dedicated processor designed with a hardware structure specialized for processing artificial intelligence models. The artificial intelligence model may be created through learning. Here, being created through learning means that a basic artificial intelligence model is learned using a plurality of learning data by a learning algorithm, thereby creating a predefined operation rule or artificial intelligence model set to perform a desired characteristic (or purpose). The artificial intelligence model may be composed of multiple neural network layers. Each of the multiple neural network layers has multiple weight values, and performs neural network operations through operations between the operation results of the previous layer and the multiple weight values.

[0216] Linguistic understanding is the technology of recognizing, applying, and processing human language / characters, including natural language processing, machine translation, dialog systems, question answering, and speech recognition / synthesis.

[0217] In an induction heating device (2000) according to one embodiment of the present disclosure, a heating coil substrate (10) may include a heating coil (2120) that is patterned by being printed on a first heating coil pattern layer (11). The heating coil substrate (10) may have a structure in which a plurality of heating coil pattern layers are laminated. The heating coil (2120) may be a plurality of heating coils, and the plurality of heating coil pattern layers may include a first heating coil pattern layer (11), a second heating coil pattern layer (12), ..., an n-th heating coil pattern layer (19) (n is a natural number greater than or equal to 2, and n = 4, 8, 12, 16). The heating coil substrate (10) may include a signal layer (35) for connector connection, on which a connector may be vertically mounted so as to be connected to an intermediate substrate (20) and / or an inverter substrate (30) without a wire.

[0218] A heating coil (2120) patterned on a heating coil substrate (10) can generate a magnetic field for heating a cooking vessel (101). For example, when current is supplied to the heating coil (2120), a magnetic field can be induced around the heating coil (2120). When a current whose size and direction change over time, i.e., an alternating current, is supplied to the heating coil (2120), a magnetic field whose size and direction change over time can be induced around the heating coil (2120). The magnetic field around the heating coil (2120) can pass through a top plate (5) made of tempered glass and can reach a cooking vessel (101) placed on the top plate (5). Due to the magnetic field whose size and direction change over time, an eddy current that rotates around the magnetic field can be generated in the cooking vessel (101), and due to the eddy current, resistive heat can be generated in the cooking vessel (101). Resistance heat is heat generated in a resistor when current flows through the resistor, and is also called Joule heat. The cooking vessel (101) is heated by the electric resistance heat, and the contents inside the cooking vessel (101) can be heated.

[0219] In an induction heating device (2000) according to one embodiment of the present disclosure, the heating coil substrate (10) may further include a temperature sensor (2600). The temperature sensor (2600) may sense the temperature of the top plate (5) or the cooking vessel (101) placed on the top plate (5). Based on the temperature of the cooking vessel (101) sensed by the temperature sensor (2600), the processor (2200) may determine whether the cooking vessel (101) is being co-heated or overheated. In one embodiment, the temperature sensor (2600) may be installed in a hole penetrating the heating coil substrate (10).

[0220] The heating coil substrate (10) of the induction heating device (2000) according to one embodiment of the present disclosure may further include a container detection coil layer (33). In one embodiment, the container detection coil layer (33) may include a container detection coil. In one embodiment, the container detection coil may be printed in a pattern form on the first heating coil pattern layer (11). The processor (2200) of the induction heating device (2000) may detect whether the cooking vessel (101) is placed on the top plate (5) of the induction heating device (2000) through the container detection coil included in the container detection coil layer (33) or the first heating coil pattern layer (11).

[0221] The inverter substrate (30) may include a driving unit (2110). The driving unit (2110) may receive power from an input power source and supply current to a heating coil (2120) according to a driving control signal of a processor (2200). The driving unit (2110) may include, but is not limited to, an EMI (Electro Magnetic Interference) filter (2111), a rectifier circuit (2112), an inverter (2113), and a resonant capacitor (2114). In one embodiment, the resonant capacitor (2114) may be located on the intermediate substrate (20) rather than the inverter substrate (30) depending on design specifications.

[0222] The EMI filter (2111) blocks high-frequency noise included in the AC voltage supplied from the input power source and can pass AC voltage and AC current of a predetermined frequency (e.g., 50 Hz or 60 Hz). A fuse and a relay for blocking overcurrent may be provided between the EMI filter (2111) and the input power source. The AC voltage from which high-frequency noise has been blocked by the EMI filter (2111) is supplied to the rectifier circuit (2112).

[0223] The rectifier circuit (2112) can convert an AC voltage into a DC voltage. For example, the rectifier circuit (2112) can convert an AC voltage whose magnitude and polarity (positive voltage or negative voltage) change over time into a DC voltage whose magnitude and polarity are constant, and can convert an AC current whose magnitude and direction (positive current or negative current) change over time into a DC current whose polarity does not change over time. The rectifier circuit (2112) can include a diode as a rectification element. For example, the rectifier circuit (2112) can include four diodes. The diodes can convert an AC voltage whose polarity changes over time into a positive voltage whose polarity is constant, and can convert an AC current whose direction changes over time into a positive current whose direction is constant. The rectifier circuit (2112) can be connected to a DC link capacitor that smoothes the rectified DC voltage.

[0224] The inverter (2113) may include a switching circuit that supplies or cuts off a driving current to the heating coil (2120). The inverter (2113) may generate resonance between the heating coil (2120) and the resonance capacitor (2114) through a switching operation of the switching circuit. In one embodiment, the resonance capacitor (2114) may be included in the inverter substrate (30) or the intermediate substrate (20). The switching circuit may include two switches for each burner as illustrated in FIG. 3. The first switch (2113_1) and the second switch (2113_2) illustrated in FIG. 3 may be turned on or off according to a driving control signal of the processor (2200). In one embodiment, the induction heating device (2000) may include a separate driving processor in addition to the processor (2200) to generate a driving control signal.

[0225] The inverter (2113) can control the current supplied to the heating coil (2120). For example, the magnitude and direction of the current flowing in the first heating coil (2120_1) can change depending on the turning on / off of the first switch (2113_1) and the second switch (2113_2) included in the inverter (2113). In addition, the magnitude and direction of the current flowing in the second heating coil (2120_2) can change depending on the turning on / off of another switch pair included in the inverter (2113). In this case, an alternating current can be supplied to the first heating coil (2120_1) and the second heating coil (2120_2).

[0226] The inverter substrate (30) may include a connector (not shown) that can be connected between the intermediate substrate (20) and the board.

[0227] In an induction heating device (2000) according to one embodiment of the present disclosure, an intermediate substrate (20) may be positioned between a heating coil substrate (10) and an inverter substrate (30). The intermediate substrate (20) may be a first substrate when the inverter substrate (30) is a second substrate. According to one embodiment, the intermediate substrate (20) may include, but is not limited to, a processor (2200), a communication interface (2300), and a memory (2500). For example, the intermediate substrate (20) may further include a resonant capacitor (2114). In addition, components included in the intermediate substrate (20) may be electrically connected to components included in the inverter substrate (30) via a connector of the inverter substrate (30).

[0228] According to one embodiment, the intermediate substrate (20) may include a resonant capacitor (2114). Of course, this is one embodiment, and the resonant capacitor (2114) may also be included in the inverter substrate (30) according to design specifications. The resonant capacitor (2114) may induce an eddy current in the cooking vessel (101) placed on the top plate (5) of the induction heating device (2000) by resonating with the heating coil (2120) by switching of the inverter (2113). As shown in FIG. 3, if there are multiple heating coils (2120), the number of resonant capacitors (2114) may be plural to correspond to the heating coils (2120).

[0229] The processor (2200) of the intermediate substrate (20) can determine the switching frequency (turn-on / turn-off frequency) of the switching circuit included in the inverter (2113) based on the output strength (power level) of the induction heating device (2000). The processor (2200) can generate a driving control signal for turning the switching circuit on / off according to the determined switching frequency. The induction heating device (2000) can include a driving processor separate from the processor (2200) to control the operation of the driving unit (2110) including the inverter (2113) during the operation of the processor (2200). However, this is only one embodiment, and the operation of the driving processor may be replaced by the processor (2200).

[0230] The processor (2200) controls the overall operation of the induction heating device (2000).

[0231] The processor (2200) is a hardware device that controls the overall operation of the induction heating device (2000). The processor (2200) may include one processor or may include multiple processors. The processor (2200) according to one embodiment of the present disclosure may be a hardware processing circuit including at least one of a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), an Accelerated Processing Unit (APU), a Many Integrated Core (MIC), a Digital Signal Processor (DSP), an integrated circuit, and a Neural Processing Unit (NPU). The processor (2200) may be implemented in the form of an integrated system on a chip (SoC) including one or more electronic components. When the processor (2200) includes multiple processors, each processor may be implemented as a separate hardware (H / W). The processor (2200) may be expressed as a Microprocessor controller (MICOM), a Microprocessor unit (MPU), or a Micro Controller Unit (MCU). The processor (2200) according to one embodiment of the present disclosure is a hardware device that may be implemented as a single core processor or a multicore processor. The processor (2200) may control the driving unit (2110), the communication interface (2300), the user interface (2400), and the memory (2500) by executing programs stored in the memory (2500).

[0232] According to one embodiment of the present disclosure, the induction heating device (2000) may be equipped with an artificial intelligence (AI) processor. The AI ​​processor may be manufactured in the form of a dedicated hardware chip for artificial intelligence (AI), or may be manufactured as part of an existing general-purpose processor (e.g., CPU or application processor) or a graphics-only processor (e.g., GPU) and equipped in the induction heating device (2000).

[0233] The processor (2200) can establish a short-range wireless communication channel (e.g., a BLE communication channel) with the cooking vessel (101) through the communication interface (2300) when the unique identification information of the cooking vessel (101) is stored in the memory (2500).

[0234] The processor (2200) can perform asymmetric control between multiple heating coils (2120). In one embodiment, when the operating frequency of the first heating coil (2120_1) of FIG. 3 is f1 and the operating frequency of the second heating coil (2120_2) is f2 (f1 < f2), the processor (2200) can control the operating frequency of the second heating coil (2120_2) so that f2 = f1. At the same time, the processor (2200) can perform asymmetric control to set the turn-on / turn-off duty of the third switch (2113_3) and the fourth switch (2113_4) differently when the operating frequency is f1 so that the output from the burner corresponding to the second heating coil (2120_2) when the operating frequency of the second heating coil (2120_2) is f2 is the same as the output when the operating frequency of the second heating coil (2120_2) is f1.

[0235] The communication interface (2300) of the intermediate substrate (20) may include one or more components that enable communication between the induction heating device (2000) and the cooking vessel (101), the induction heating device (2000) and a server (not shown), or the induction heating device (2000) and a user terminal (not shown). For example, the communication interface (2300) may include a short-range wireless communication interface (2310) and a long-range communication interface (2320). The short-range communication unit (2310) may include, but is not limited to, a Bluetooth communication unit, a BLE (Bluetooth Low Energy) communication unit, a near field communication interface, a WLAN (Wi-Fi) communication unit, a Zigbee communication unit, an IrDA (infrared Data Association) communication unit, a WFD (Wi-Fi Direct) communication unit, an UWB (Ultra Wideband) communication unit, an ANT+ communication unit, etc. The long-range communication unit (2320) may be used to communicate with a server (not shown) when the cooking vessel (101) is remotely controlled by a server in an IoT (Internet of Things) environment. The long-range communication unit (2320) may include the Internet, a computer network (e.g., LAN or WAN), and a mobile communication unit. The mobile communication unit transmits and receives a wireless signal with at least one of a base station, an external terminal, and a server on a mobile communication network. Here, the wireless signal may include various types of data, such as voice call signals, video call signals, or text / multimedia message transmission and reception. The mobile communication unit may include, but is not limited to, a 3G module, a 4G module, an LTE module, a 5G module, a 6G module, an NB-IoT module, an LTE-M module, etc.

[0236] The memory (2500) may store a program for the operation and control of the induction heating device (2000) of the processor (2200), and may store input / output data (e.g., unique identification information of the cooking vessel (101), variable identification information of the cooking vessel (101), multiple power transmission patterns, cooking progress information of the cooking vessel (101), material information of the cooking vessel (101), etc.). The memory (2500) may store a coded command regarding a switching operation for driving the inverter (2113). In addition, the memory (2500) may also store an artificial intelligence model.

[0237] The memory (2500) may include at least one type of storage medium among a flash memory type, a hard disk type, a multimedia card micro type, a card type memory (e.g., SD or XD memory, etc.), a RAM (Random Access Memory), a SRAM (Static Random Access Memory), a ROM (Read-Only Memory), an EEPROM (Electrically Erasable Programmable Read-Only Memory), a PROM (Programmable Read-Only Memory), a magnetic memory, a magnetic disk, and an optical disk. In addition, the induction heating device (2000) may also operate a web storage or cloud server that performs a storage function on the Internet.

[0238] FIG. 23 is a flowchart of creating a heating coil substrate according to one embodiment of the present disclosure.

[0239] In step 2301, a laminated substrate is created, which includes a patterned container detection coil layer, a plurality of patterned heating coil layers in which heating coils are printed, and an insulating layer for insulating and bonding between the container detection coil layer and the plurality of heating coil pattern layers. The insulating layer can be created by laminating at least two prepreg insulating layers. The thickness of the insulating layer when pressed can be 130 um to 140 um or less. In addition, the thickness of the container detection coil layer can be 110 um or less when pressed.

[0240] The container detection coil layer may be located on the uppermost layer of the laminated substrate, and an insulating layer may be inserted between the container detection coil layer and the uppermost layer among the plurality of heating coil pattern layers. The insulating layer may include two prepreg insulating layers. In addition, at least two prepreg insulating layers may be inserted between the plurality of heating coil pattern layers. The preceding prepreg insulating layer may have a thickness of 65 um or less before pressing. In addition, a signal layer for connector connection may be included on the lowermost layer of the laminated substrate. An insulating layer may be inserted between the signal layer for connector connection and the lowermost layer among the plurality of heating coil pattern layers. The insulating layer may be formed by stacking at least two prepreg insulating layers. The thickness of the insulating layer at the time of pressing may be 130 um to 140 um or less. In addition, the thickness of the signal layer for connector connection may be 110 um or less at the time of pressing.

[0241] At this time, the PCB original for creating the laminated substrate can be 1020(mm)x1200(mm) or 1020(mm)x1020(mm) in size, and the PCB original used for manufacturing the heating coil substrate uses 2 ounces or more of copper. The PCB original used for the container detection coil layer and the signal layer for connector connection can use 0.5 to 1 ounce of copper.

[0242] Each prepreg insulation layer contains 60% to 80% resin content.

[0243] Each layer of the laminated substrate may include a hole through which a temperature sensor for sensing the temperature of the cooking vessel may pass.

[0244] In step 2303, the laminated substrate is hot pressed to produce a heating coil substrate. Even when the laminated substrate is hot pressed, since the prepreg insulating layer is composed of at least two layers, contact between the conductors of the plurality of heating coil pattern layers and the reinforcing fibers of the prepreg insulating layer is not made, thereby maintaining insulation. The thickness of the heating coil substrate produced by hot pressing may be 3.3 mm or less.

[0245] According to one embodiment of the present disclosure, an induction heating device is disclosed, which includes a patterned container detection coil layer having a plurality of container detection coils printed thereon for detecting a cooking vessel. In one embodiment, the induction heating device may include a plurality of heating coil pattern layers having a plurality of heating coils printed thereon and a patterned heating coil layer, and an insulating layer positioned between the plurality of heating coil pattern layers and the container detection coil layer to insulate the plurality of heating coil pattern layers and the container detection coil layer. In one embodiment, the container detection coil layer, the plurality of heating coil pattern layers, and the insulating layer may be laminated and pressed to form a heating coil substrate. In one embodiment, the insulating layer may have a thickness of 140 μm or less after pressing.

[0246] According to one embodiment of the present disclosure, the insulating layer may comprise 60% to 80% of the resin content of the total components.

[0247] According to one embodiment of the present disclosure, the height of the conductors of the plurality of heating coil pattern layers may be 60 μm or more. According to one embodiment, in a heating coil substrate formed by stacking and pressing a container detection coil layer, a plurality of heating coil pattern layers, and an insulating layer, the conductors of the uppermost layer of the plurality of heating coil pattern layers or the conductors of the container detection coils may not come into contact with the reinforcing fibers of the insulating layer, thereby maintaining insulation.

[0248] According to one embodiment of the present disclosure, the heating coil substrate may include a hole through which a temperature sensor for detecting the temperature of the cooking vessel may pass.

[0249] According to one embodiment of the present disclosure, the insulating layer may be formed by laminating at least two prepreg insulating layers.

[0250] According to one embodiment of the present disclosure, a first end of each of the plurality of container detection coils may be connected to the lowermost layer of the heating coil substrate through a via hole. According to one embodiment, a second end of each of the plurality of container detection coils may be connected to a connector terminal on the container detection coil layer.

[0251] According to one embodiment of the present disclosure, the induction heating device may further include at least one processor. According to one embodiment, the at least one processor may detect at least one of the material of a cooking vessel placed on the top plate of the induction heating device, the position of the cooking vessel, and the presence or absence of the cooking vessel through a plurality of container detection coils.

[0252] According to one embodiment of the present disclosure, at least one processor can detect the material of a cooking vessel by a change in inductance according to the cooking vessel detected by a container detection coil.

[0253] According to one embodiment of the present disclosure, a display may be further included. According to one embodiment, at least one processor may control the display to display a grade of the cooking vessel based on the material of the detected cooking vessel.

[0254] According to one embodiment of the present disclosure, the plurality of heating coil pattern layers may be eight or more layers.

[0255] According to one embodiment of the present disclosure, the thickness of the heating coil substrate may be 3.3 mm or less.

[0256] According to one embodiment of the present disclosure, the container sensing coil layer may further include a temperature sensor for measuring the temperature of the heating coil substrate.

[0257] According to one embodiment of the present disclosure, the induction heating device may further include at least one processor that controls to reduce the heating output through the heating coil substrate when the temperature of the heating coil substrate measured by the temperature sensor exceeds a predetermined overheating reference temperature.

[0258] According to one embodiment of the present disclosure, the temperature sensor may include a PTC thermistor or an NTC thermistor.

[0259] According to one embodiment of the present disclosure, an inverter substrate connected to the heating coil substrate via a connector may be further included. According to one embodiment, the lowermost layer of the heating coil substrate may further include a signal layer for connector connection to be connected to the inverter substrate via a connector.

[0260] According to one embodiment of the present disclosure, a first end of each of the plurality of container sensing coils may be connected to a signal layer for connector connection through a via hole and connected to a heating substrate connector vertically connected to the signal layer for connector connection. According to one embodiment, a second end of each of the plurality of container sensing coils may be connected to a terminal of the heating substrate connector on the container sensing coil layer.

[0261] According to one embodiment of the present disclosure, the inverter substrate may include at least one inverter substrate connector connected to the heating substrate connector and mounted vertically on the inverter substrate.

[0262] According to one embodiment of the present disclosure, an intermediate substrate may be further included between a heating coil substrate and an inverter substrate, the intermediate substrate including a memory storing a program for controlling the operation of an induction heating device and at least one processor for executing the program stored in the memory to control the induction heating device. According to one embodiment, the intermediate substrate may include a hole through which a heating substrate connector passes.

[0263] According to one embodiment of the present disclosure, at least two prepreg insulating layers may be included between each of the plurality of heating coil pattern layers to insulate and bond each of the plurality of heating coil pattern layers.

[0264] According to one embodiment of the present disclosure, a method for producing a heating coil substrate including a patterned vessel sensing coil layer in an induction heating device is disclosed. According to one embodiment, the laminated substrate may include a step of producing a plurality of heating coil pattern layers in which heating coils are printed and patterned, and an insulating layer positioned between the plurality of heating coil pattern layers and the vessel sensing coil layer to insulate and bond the plurality of heating coil pattern layers and the vessel sensing coil layer. According to one embodiment of the present disclosure, a method for producing a heating coil substrate including a patterned vessel sensing coil layer in an induction heating device may include a step of pressing the laminated substrate to produce the heating coil substrate. According to one embodiment, the insulating layer may have a thickness of 140 um or less after pressing.

[0265] A method according to an embodiment of the present disclosure may be implemented in the form of program commands that can be executed through various computer means and recorded on a computer-readable medium. The computer-readable medium may include program commands, data files, data structures, etc., alone or in combination. The program commands recorded on the medium may be those specially designed and configured for the present disclosure or may be those known and available to those skilled in the art of computer software. Examples of computer-readable recording media include magnetic media such as hard disks, floppy disks, and magnetic tapes, optical media such as CD-ROMs and DVDs, magneto-optical media such as floptical disks, and hardware devices specially configured to store and execute program commands, such as ROMs, RAMs, and flash memories. Examples of program commands include not only machine language codes generated by a compiler, but also high-level language codes that can be executed by a computer using an interpreter, etc.

[0266] Some embodiments of the present disclosure may also be implemented in the form of a recording medium containing computer-executable instructions, such as program modules, executed by a computer. Computer-readable media may be any available media that can be accessed by a computer, and include both volatile and nonvolatile media, removable and non-removable media. Furthermore, computer-readable media may include both computer storage media and communication media. Computer storage media includes both volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information, such as computer-readable instructions, data structures, program modules, or other data. Communication media typically includes computer-readable instructions, data structures, program modules, or other data in a modulated data signal, such as a carrier wave, or other transport mechanism, and includes any information delivery media. Furthermore, some embodiments of the present disclosure may also be implemented as a computer program or computer program product containing computer-executable instructions, such as a computer program that is executed by a computer.

[0267] A device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, the term "non-transitory storage medium" simply means a tangible device that does not contain signals (e.g., electromagnetic waves). This term does not distinguish between cases where data is permanently stored in the storage medium and cases where data is temporarily stored. For example, a "non-transitory storage medium" may include a buffer in which data is temporarily stored.

[0268] According to one embodiment, the method according to the embodiments disclosed in the present document may be provided as a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product (e.g., a downloadable app) may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

Claims

1. A patterned container detection coil layer in which multiple container detection coils are printed to detect a cooking vessel located on an induction heating device; A plurality of heating coil pattern layers in which the heating coil is printed and patterned; and Including an insulating layer positioned between the plurality of heating coil pattern layers and the container detection coil layer to insulate the plurality of heating coil pattern layers and the container detection coil layer, The above container detection coil layer, the plurality of heating coil pattern layers, and the insulating layer are laminated and form a pressed heating coil substrate, An induction heating device, wherein the insulating layer has a thickness of 140 um or less after compression.

2. In paragraph 1, An induction heating device, wherein the insulating layer comprises a resin content of 60% to 80% of the total components.

3. In paragraph 1 or 2, The above insulating layer comprises reinforcing fibers, The above plurality of heating coil pattern layers include a conductor having a height of 60 um or more, An induction heating device in which the reinforcing fibers of the insulating layer are insulated by not making contact with the conductors of the uppermost layer of the plurality of heating coil pattern layers or the conductors of the container sensing coils.

4. In any one of paragraphs 1 to 3, An induction heating device, wherein the heating coil substrate includes a hole through which a temperature sensor for detecting the temperature of the cooking vessel can pass.

5. In any one of paragraphs 1 to 4, An induction heating device, wherein the insulating layer comprises at least two laminated prepreg insulating layers.

6. In any one of paragraphs 1 to 5, Further comprising a connector terminal on the above container sensing coil layer, The first end of each of the plurality of container detection coils is connected to the lowest layer of the heating coil substrate through a via hole, An induction heating device, wherein the second end of each of the plurality of container detection coils is connected to the connector terminal.

7. In any one of paragraphs 1 to 6, The top plate on which the above cooking vessel is placed, At least one processor, and Further comprising a memory storing instructions to be executed individually or collectively by at least one processor, The above command causes the induction heating device to detect at least one of the material of the cooking vessel placed on the top plate, the position of the cooking vessel, and the presence or absence of the cooking vessel through the plurality of container detection coils.

8. In paragraph 7, An induction heating device, wherein the instructions executed by the at least one processor cause the induction heating device to detect a material of the cooking vessel by a change in inductance according to the cooking vessel detected by the vessel detection coil.

9. In paragraph 7 or 8, Including more displays, An induction heating device, wherein the command executed by the at least one processor controls the induction heating device to display the grade of the cooking vessel on the display according to the material of the cooking vessel detected.

10. In any one of paragraphs 1 to 9, An induction heating device wherein the above-mentioned plurality of heating coil pattern layers are eight or more layers.

11. In any one of paragraphs 1 to 10, An induction heating device wherein the thickness of the heating coil substrate is 3.3 mm or less.

12. In any one of paragraphs 1 to 11, An induction heating device, wherein the container sensing coil layer further includes a temperature sensor for measuring the temperature of the heating coil substrate.

13. In paragraph 12, At least one processor comprising a processing circuit, and An induction heating device comprising a memory for storing a command, wherein the command, when individually or collectively executed by the at least one processor, causes the induction heating device to control heating output through the heating coil substrate to be reduced when the temperature of the heating coil substrate measured by the temperature sensor exceeds a predetermined overheating reference temperature.

14. In any one of paragraphs 1 to 13, Further comprising an inverter board connected to the above heating coil board by a connector, An induction heating device, wherein the lowermost layer of the heating coil substrate further includes a signal layer for connector connection to be connected to the inverter substrate and the connector.

15. In paragraph 14, The first end of each of the plurality of container detection coils is connected to a signal layer for connector connection through a via hole and is connected to a heating board connector vertically connected to the signal layer for connector connection. An induction heating device, wherein the second end of each of the plurality of container detection coils is connected to a terminal of a heating plate connector on the container detection coil layer.

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