Cooling assembly

By designing the double-layer flow and bidirectional flow structure of the shell and cooling plate in the cooling assembly, the problems of complex structure and excessive temperature gradient of traditional cooling assembly are solved, and the effect of reducing material costs and space occupation is achieved, ensuring module performance and life.

WO2025050301A1PCT designated stage expired Publication Date: 2025-03-13DELTA ELECTRONICS INC(CN)
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Patent Information

Application Number
PCT/CN2023/117108
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-09-05
Publication Date
2025-03-13

AI Technical Summary

Technical Problem

Traditional cooling components have complex structures, difficult to reduce material cost and space usage, and water cooling systems are prone to excessive temperature gradients, resulting in insufficient cooling of modules, reduced performance or damage, and material fatigue.

Method used

A cooling assembly is designed, including a housing, a power module and a cooling plate, with a first chamber and a second chamber in the housing, and the cooling plate has a linear flow channel and a curved flow channel to realize the bilayer flow and bidirectional flow of the working fluid, ensuring that the fluid has the same average temperature per unit area along different cross-sections of the cooling plate width direction.

Benefits of technology

Through the bilayer flow and bidirectional flow design, the material cost and space occupation are reduced, excessive temperature gradient is avoided, and the performance and service life of the module are ensured.

✦ Generated by Eureka AI based on patent content.

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Abstract

Provided in the present invention is a cooling assembly, which comprises a housing, at least one power module and a cooling plate. The housing is internally provided with a first chamber and a second chamber. The top portions of the ends of a same side of the first chamber and the second chamber are respectively provided with an outlet and an inlet. The power module is located in the housing and at least partially overlaps the first chamber and the second chamber. The cooling plate is arranged on the power module. The cooling plate comprises at least two linear flow channels and a curved flow channel communicated with the ends of a same side of the two linear flow channels. When a working fluid flows from the first chamber to the second chamber successively through the outlet of the first chamber, an inlet of the cooling plate, one of the two linear flow channels, the curved flow channel, the other one of the two linear flow channels, an outlet of the cooling plate and the inlet of the second chamber, the working fluid has a same unit area average temperature along different cross sections in the width direction of the cooling plate.
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Description

Cooling components Technical Field

[0001] The present disclosure relates to a cooling assembly, and more particularly to a cooling assembly for cooling a power module. Background Art

[0002] An automotive power supply may include a power module, a capacitor module for DC input, and a bus module for AC output. To effectively cool these modules, the cooling assembly typically requires a complex structure. For example, conventional cooling assemblies, in addition to a housing, require multiple cooling plates to provide water cooling to the power module, capacitor module, and bus module, respectively. This results in difficulties in reducing material costs and space requirements, limiting the application of in-vehicle systems.

[0003] Water cooling systems typically supply low-temperature water at the inlet of the housing and discharge high-temperature water at the outlet after flowing through high-temperature components. Because the water's temperature rises due to heat accumulation while flowing through high-temperature components (such as the modules mentioned above), if the flow path and the inlet and outlet locations are not carefully designed, the water can easily develop a large temperature gradient. This can cause insufficient cooling of modules near the outlet, resulting in reduced performance or even damage, and can also cause material fatigue.

[0004] Summary of the Invention

[0005] According to some embodiments of the present disclosure, a cooling assembly includes a shell, at least one power module and a cooling plate. The shell has a first chamber and a second chamber therein. The tops of the same side ends of the first chamber and the second chamber respectively have an outlet and an inlet. The power module is located in the shell and at least partially overlaps with the first chamber and the second chamber. The cooling plate is arranged on the power module. One side of the cooling plate has an inlet and an outlet. The cooling plate includes at least two straight flow channels and a curved flow channel connecting the same side ends of the two straight flow channels. When the working fluid flows from the first chamber to the second chamber in sequence through the outlet of the first chamber, the inlet of the cooling plate, one of the two straight flow channels, the curved flow channel, the other of the two straight flow channels, the outlet of the cooling plate, and the inlet of the second chamber, the working fluid has the same average temperature per unit area in different cross sections along the width direction of the cooling plate.

[0006] According to some embodiments of the present disclosure, a cooling assembly includes a shell, at least one power module and a cooling plate. The shell has a first chamber and a second chamber therein. The tops of the same side ends of the first chamber and the second chamber respectively have an outlet and an inlet. The power module is located in the shell and at least partially overlaps with the first chamber and the second chamber. The cooling plate is arranged on the power module. One side of the cooling plate has an inlet and an outlet. The cooling plate includes at least two linear flow channels and a curved flow channel connecting the same side ends of the two linear flow channels. One of the two linear flow channels is connected to the inlet of the cooling plate, and the other is connected to the outlet of the cooling plate. When the working fluid flows through one of the two linear flow channels, the temperature of the working fluid gradually increases in the direction away from the inlet of the cooling plate, and when the working fluid flows through the other of the two linear flow channels, the temperature of the working fluid gradually decreases in the direction away from the outlet of the cooling plate.

[0007] In the above-mentioned embodiment of the present disclosure, since the tops of the same side ends of the first and second chambers of the shell each have an outlet and an inlet, the cooling plate includes two linear flow channels and a curved flow channel, and one side of the cooling plate has an inlet and an outlet, when the working fluid flows from the first chamber to the second chamber in sequence through the outlet of the first chamber, the inlet of the cooling plate, one of the two linear flow channels, the curved flow channel, the other of the two linear flow channels, the outlet of the cooling plate, and the inlet of the second chamber, it is possible to achieve double-layer flow of the working fluid in the lower shell and the upper cooling plate, bidirectional flow in the first and second chambers of the shell, and bidirectional flow in the two linear flow channels of the cooling plate. Through the above design, different cross-sections of the working fluid along the width direction of the cooling plate can have the same average temperature per unit area, for example, the temperature of the working fluid gradually increases in the direction away from the inlet of the cooling plate in the linear flow channel and gradually decreases in the direction away from the outlet of the cooling plate in the other linear flow channel. The cooling assembly, with a single cooling plate, provides water cooling for the power module and other electronic components (such as capacitor modules and bus modules) housed within the housing. This effectively reduces material costs and space requirements, benefiting the vehicle's system. Furthermore, the cooling assembly's dual-layer and bidirectional flow prevents excessive temperature gradients in the working fluid, maintaining module performance and extending its lifespan. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The embodiments of the present disclosure are best understood from the following detailed description when read in conjunction with the accompanying drawings. Note that, in accordance with standard practice in this industry, various features are not drawn to scale. In fact, the dimensions of the various features may be arbitrarily increased or decreased for clarity of discussion.

[0009] FIG1 shows a perspective view of a cooling assembly according to an embodiment of the present disclosure;

[0010] FIG2 shows an exploded view of the cooling assembly of FIG1 ;

[0011] FIG3 is a schematic diagram showing the path of the working fluid flowing under the housing of FIG1 ;

[0012] FIG4 is a perspective view of the cooling assembly of FIG1 omitting the upper cover of the cooling plate;

[0013] FIG5 is a schematic diagram showing the path of the working fluid when it flows along the cross section of line segment 5-5 of the cooling assembly of FIG1;

[0014] FIG6 is a schematic diagram showing the path of the working fluid when flowing in the cooling plate of FIG1 ;

[0015] FIG7 shows a top view of the cooling assembly of FIG1 ;

[0016] FIG8 shows a top view of a cooling plate according to another embodiment of the present disclosure without the top cover.

[0017] Description of Figure Numbers:

[0018] 100: Cooling component

[0019] 110: Shell

[0020] 112: First chamber

[0021] 114: Second chamber

[0022] 120a, 120b, 120c: Power modules

[0023] 130,130a:Cooling plate

[0024] 131a, 131b, 131c, 131d, 131e, 131f: Straight flow channel

[0025] 132: Base

[0026] 133,133a,133b,133c: curved flow channel

[0027] 134: Upper cover

[0028] 136,136a,136b,136c: Partition

[0029] 140:Capacitor module

[0030] 150: Bus module

[0031] 5-5: Line Segment

[0032] A1,A2,A3,B1,B2,B3,C1,C2,C3,D1,D2,D3: area

[0033] F1, F2, F3, F4, F5, F6: Water flow

[0034] L1, L2, L3: cross section

[0035] O1: Exit

[0036] O11: Entrance

[0037] O2: Entrance

[0038] O22: Exit

[0039] O in :Water Inlet

[0040] O out :Water outlet DETAILED DESCRIPTION

[0041] The embodiments disclosed below provide many different embodiments, or examples, for implementing the different features of the subject matter provided. Specific examples of components and arrangements are described below to simplify the present invention. Of course, these examples are merely examples and are not intended to be limiting. In addition, the present invention may repeat element symbols and / or letters in each example. This repetition is for the purpose of simplicity and clarity and does not, in itself, specify the relationship between the various embodiments and / or configurations discussed.

[0042] Spatially relative terms such as "below," "beneath," "lower," "above," "upper," and the like may be used herein for descriptive purposes to describe one element or feature's relationship to another element or feature as illustrated in the accompanying drawings. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the accompanying drawings. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein should likewise be interpreted accordingly.

[0043] FIG1 shows a perspective view of a cooling assembly 100 according to an embodiment of the present disclosure. FIG2 shows an exploded view of the cooling assembly 100 of FIG1 . Referring to FIG1 and FIG2 simultaneously, the cooling assembly 100 includes a housing 110, power modules 120a, 120b, 120c, and a cooling plate 130. The power modules 120a, 120b, 120c and the cooling plate 130 are located in the housing 110, and the cooling plate 130 is disposed on the power modules 120a, 120b, 120c. The cooling plate 130 may include a base 132 and an upper cover 134 located on the base 132. The upper cover 134 is tightly fitted with the base 132 to allow the working fluid to flow therein and prevent the working fluid from leaking. Although FIG2 shows three power modules 120a, 120b, 120c, their number is not intended to limit the present disclosure. The cooling assembly 100 can be applied to an in-vehicle drive. In addition to housing the power modules 120a, 120b, and 120c, the housing 110 can also accommodate capacitor modules for DC input and bus modules for AC output on either side of the cooling plate 130, respectively. However, this is not intended to limit the present disclosure. The cooling assembly 100 has a lower flow channel and an upper flow channel. The lower flow channel is located in the bottom of the housing 110, while the upper flow channel is located in the cooling plate 130. The structures of the housing 110 and the cooling plate 130 will be described in detail below.

[0044] FIG3 is a schematic diagram showing the path of the working fluid flowing under the housing 110 of FIG1 . The dotted area may be a portion of the bottom plate of the housing 110 . Referring to FIG2 and FIG3 , the housing 110 has a first chamber 112 and a second chamber 114 therein. The first chamber 112 and the second chamber 114 are located in the lower layer of the housing 110 and can be regarded as the lower layer flow channel. The first chamber 112 and the second chamber 114 are separated from each other and are not directly connected. In addition, the first chamber 112 is connected to the water inlet O in The second chamber 114 is connected to the water outlet O out , and the top of the same side end of the first chamber 112 and the second chamber 114 respectively has an outlet O1 and an inlet O2, as shown on the right side of Figure 2 and the bottom side of Figure 3. in After flowing into the first chamber 112, a water flow F1 is formed. The water flow F1 can flow out of the first chamber 112 through the outlet O1 to the cooling plate 130 on the upper layer of the housing 110 without flowing into the second chamber 114. In addition, the water flow passing through the cooling plate 130 (to be described later) can flow into the second chamber 114 from the inlet O2 of the second chamber 114, forming a water flow F6. The water flow F6 can flow out of the outlet O out The liquid flows out of the first chamber 112 and does not flow back into the first chamber 112 .

[0045] In this embodiment, the power modules 120a, 120b, and 120c at least partially overlap with the first and second chambers 112 and 114. Therefore, the water flows F1 and F6 can dissipate heat from the bottoms of the power modules 120a, 120b, and 120c. Furthermore, the housing 110 may include at least one flow-guiding rib 113 located within the first chamber 112. This rib 113 provides a flow-rectifying function, modulating the flow distribution and velocity of the working fluid within the first chamber 112. While Figure 3 shows three flow-guiding ribs 113, their number, orientation angle, or dimensions are not intended to limit this disclosure.

[0046] In the following description, the flow mechanism of the water flows F1 to F6 will be described in detail.

[0047] FIG4 shows a perspective view of the cooling assembly 100 of FIG1 omitting the upper cover 134 of the cooling plate 130. FIG5 shows a schematic diagram of the path of the working fluid flowing through the cross-section of the cooling assembly 100 of FIG1 along line segment 5-5. Referring to FIG4 and FIG5 together, the cooling plate 130 includes a base 132 and an upper cover 134 located on the base 132. The upper cover 134 and the base 132 are tightly fitted to ensure that the working fluid flows therein and prevent leakage. The cooling plate 130 has an inlet O11 and an outlet O22 on one side thereof adjacent to the outlet O1 of the first chamber 112 and the inlet O2 of the second chamber 114. The inlet O11 and the outlet O22 of the cooling plate 130 extend through the base 132. In this embodiment, the inlet O11 of the cooling plate 130 at least partially overlaps with the outlet O1 of the first chamber 112, and the outlet O22 of the cooling plate 130 at least partially overlaps with the inlet O2 of the second chamber 114. For example, the inlet O11 of the cooling plate 130 and the outlet O1 of the first chamber 112 can be vertically aligned, and the outlet O22 of the cooling plate 130 and the inlet O2 of the second chamber 114 can be vertically aligned. Furthermore, for example, the inlet O11 of the cooling plate 130 and the outlet O1 of the first chamber 112 can be mated in a male-female configuration. With this arrangement, the upper cooling plate 130 can communicate with the lower first and second chambers 112 and 114.

[0048] The cooling plate 130 includes at least two linear channels 131a and 131b and a curved channel 133. The curved channel 133 connects the ends of the two linear channels 131a and 131b on the same side (as shown on the left side of Figure 4). For example, the overall top view shape of the two linear channels 131a and 131b and the curved channel 133 is U-shaped. In this embodiment, the base 132 of the cooling plate 130 has a partition 136 extending along its length. The linear channels 131a and 131b and the curved channel 133 are defined by the partition 136, the base 132 and the upper cover 134 (also shown in Figure 1), so that the working fluid can flow along the linear channels 131a, the curved channel 133 and the linear channel 131b. The linear flow channels 131a, 131b and the curved flow channel 133 are located in the upper layer of the housing 110 relative to the first chamber 112 and the second chamber 114 (see FIG3 ) and can be considered upper-layer flow channels. In other embodiments, the cooling plate 130 may include more linear flow channels and curved flow channels, and the number of such channels is not intended to limit the present disclosure, as shown in FIG8 .

[0049] Figure 6 schematically illustrates the path of the working fluid flowing through the cooling plate 130 of Figure 1 . Referring to Figures 5 and 6 , the end of the linear channel 131a, distal from the curved channel 133, connects to the inlet O11 of the cooling plate 130. Therefore, the water flow F1 in Figure 3 flows through the outlet O1 of the first chamber 112 and the inlet O11 of the cooling plate 130 into the linear channel 131a, forming a vertical water flow F2 and a water flow F3 flowing along the linear channel 131a. The water flow F3 then deflects through the curved channel 133 to form a water flow F4 flowing along the linear channel 131b. The water flows F3 and F4 dissipate heat from the tops of the power modules 120a, 120b, and 120c. One end of the linear channel 131b away from the curved channel 133 is connected to the outlet O22 of the cooling plate 130 , so that the water flow F4 can flow into the second chamber 114 through the outlet O22 of the cooling plate 130 and the inlet O2 of the second chamber 114 to form a vertical water flow F5 .

[0050] Then, the water flow F5 flows into the second chamber 114 to form the water flow F6 shown in FIG. 3 .

[0051] Specifically, since the top of the first chamber 112 and the second chamber 114 of the housing 110 have an outlet O1 and an inlet O2 at the same side end respectively, the cooling plate 130 includes straight flow channels 131a, 131b and a curved flow channel 133, and one side of the cooling plate 130 has an inlet O11 and an outlet O22, when the working fluid flows from the first chamber 112 through the outlet O1 of the first chamber 112, the inlet O11 of the cooling plate 130, the straight flow channel 131a, and the curved flow channel 133, the working fluid flows from the first chamber 112 through the outlet O1 of the first chamber 112, the inlet O11 of the cooling plate 130, the straight flow channel 131b, and the curved flow channel 133. When the working fluid flows through the curved flow channel 131a, the curved flow channel 133, the straight flow channel 131b, the outlet O22 of the cooling plate 130, and the inlet O2 of the second chamber 114 to the second chamber 114, double-layer flow of the working fluid in the lower shell 110 and the upper cooling plate 130, bidirectional flow in the first chamber 112 and the second chamber 114 of the shell 110, and bidirectional flow in the straight flow channels 131a and 131b of the cooling plate 130 can be achieved.

[0052] It should be understood that the connection relationship, materials and functions of the components already described will not be repeated, and will be described first. In the following description, the functions of the above-mentioned flow path design will be explained.

[0053] FIG7 shows a top view of the cooling assembly 100 of FIG1. in After flowing in, the water flow F1 of FIG. 3, the water flow F2 of FIG. 5, the water flow F3, F4 of FIG. 6, the water flow F5 of FIG. 5 and the water flow F6 of FIG. 6 are sequentially formed, and finally the water flow F1 of FIG. 3, the water flow F2 of FIG. 5, the water flow F3, F4 of FIG. 6, the water flow F5 of FIG. 5 and the water flow F6 of FIG. 6 are sequential outFlow out. The working fluid has the same average temperature per unit area in different cross-sections L1, L2, and L3 along the width direction of the cooling plate 130. Specifically, the heat generated by each power module 120a, 120b, and 120c is approximately the same. Therefore, when the working fluid flows into the first chamber 112 (see Figure 3), the temperature of the working fluid in regions A1, A2, and A3 of the first chamber 112 gradually increases as it flows sequentially below the power modules 120a, 120b, and 120c. In other words, the temperature of the working fluid gradually increases toward the outlet O1 of the first chamber 112. Next, when the working fluid flows through the linear flow channel 131a (see Figure 6), the temperature of the working fluid in regions B3, B2, and B1 of the linear flow channel 131a gradually increases as it flows sequentially above the power modules 120c, 120b, and 120a. In other words, the temperature of the working fluid gradually increases away from the inlet O11 of the cooling plate 130. Next, as the working fluid flows through the linear flow channel 131b (see FIG6 ), the temperature of the working fluid in regions C1, C2, and C3 of the linear flow channel 131b gradually increases as it sequentially flows over the power modules 120a, 120b, and 120c. In other words, the temperature of the working fluid gradually decreases as it moves away from the outlet O22 of the cooling plate 130. Next, as the working fluid flows into the second chamber 114 (see FIG3 ), the temperature of the working fluid in regions D3, D2, and D1 of the second chamber 114 gradually increases as it sequentially flows under the power modules 120c, 120b, and 120a. In other words, the temperature of the working fluid gradually increases as it moves away from the inlet O2 of the second chamber 114.

[0054] In this way, the temperature of the working fluid gradually increases along regions A1, A2, A3, B3, B2, B1, C1, C2, C3, D3, D2, and D1, such that the average temperature per unit area of ​​regions A1, B1, C1, and D1 through which the working fluid passes in section L1, the average temperature per unit area of ​​regions A2, B2, C2, and D2 through which the working fluid passes in section L2, and the average temperature per unit area of ​​regions A3, B3, C3, and D3 through which the working fluid passes in section L3 are substantially the same. For example, "average temperatures per unit area being substantially the same" may mean that, per unit area, the ratio of (the sum of the average temperatures of regions B1 and C1): (the sum of the average temperatures of regions B2 and C2): (the sum of the average temperatures of regions B3 and C3) is substantially 1:1:1. For another example, within each region, the ratio of (the average temperature sum of regions A1, B1, C1, and D1): (the average temperature sum of regions A2, B2, C2, and D2): (the average temperature sum of regions A3, B3, C3, and D3) is essentially 1:1:1. This arrangement ensures a more consistent heat dissipation environment for each power module 120a-120c, preventing a significant temperature difference between 120a and 120c.

[0055] Referring to Figures 3 and 7 , in some embodiments, the cooling assembly 100 may further include a capacitor module 140 and a bus module 150. The capacitor module 140 and the bus module 150 are disposed within the housing 110. For example, the capacitor module 140 at least partially overlaps with the first chamber 112, and the bus module 150 at least partially overlaps with the second chamber 114. This allows water flow F1 to simultaneously dissipate heat from the capacitor module 140 when flowing through areas A1, A2, and A3, and water flow F6 to simultaneously dissipate heat from the bus module 150 when flowing through areas D3, D2, and D1. Furthermore, in other embodiments, the driver board, EMC shielding plate, and control board may be further disposed on the cooling plate 130 to facilitate cooling, but this is not intended to limit the present disclosure. It should be noted that the primary heat source for the vehicle power supply is the power module. Therefore, the minimum unit of the present invention is sufficient to allow at least one power module 120a to pass through areas B1 and C1 of the two linear flow channels 131a and 131b in cross section L1. Furthermore, the placement of at least two power modules 120a-120b in a row can be configured to at least partially overlap with the two continuous linear flow channels 131a and 131b, with the fluids flowing in the flow channels flowing in substantially opposite directions. This allows for the achievement of a similar average temperature per unit area (the average temperature of regions C1 and B1 relative to the average temperature of regions C2 and B2). Furthermore, the cooling assembly 100 can include a cooling structure in addition to the cooling plate 130, and this, combined with the continuous flow channels, can achieve a similar average temperature per unit area, which is the concept underlying the present invention.

[0056] Through the above design, cooling assembly 100, with only a single cooling plate 130, can provide water cooling for the power modules 120c, 120b, and 120a and other electronic components (such as capacitor module 140 and bus module 150) housed in housing 110. This effectively reduces material costs and space requirements, benefiting the vehicle system. Furthermore, because cooling assembly 100 implements dual-layer and bidirectional flow, the working fluid is less likely to experience significant temperature gradients, maintaining module performance and extending its lifespan.

[0057] FIG8 illustrates a top view of a cooling plate 130a according to another embodiment of the present disclosure, omitting the aforementioned upper cover 134. This embodiment differs from the aforementioned cooling plate 130 in that the cooling plate 130a in FIG8 includes four linear channels 131c, 131d, 131e, and 131f, and three curved channels 133a, 133b, and 133c. Curved channel 133a connects the ends of two linear channels 131c and 131d on the same side (as shown in the upper portion of FIG8 ), curved channel 133b connects the ends of two linear channels 131d and 131e on the same side (as shown in the lower portion of FIG8 ), and curved channel 133c connects the ends of two linear channels 131e and 131f on the same side (as shown in the upper portion of FIG8 ). In this embodiment, the base 132 of the cooling plate 130a has three partitions 136a, 136b, and 136c extending along its length. Partition 136a is located between the linear channels 131c and 131d, partition 136b is located between the linear channels 131d and 131e, and partition 136c is located between the linear channels 131e and 131f. The working fluid can flow along the linear channel 131c, the curved channel 133a, the linear channel 131d, the curved channel 133b, the linear channel 131e, the curved channel 133c, and the linear channel 131f. The cooling plate 130a can also be used in the cooling assembly 100 described in Figures 1 to 7. In other variations, the cooling plate can also have three linear channels.

[0058] The foregoing summarizes the features of several embodiments so that those skilled in the art can better understand the embodiments of the present disclosure. Those skilled in the art will appreciate that they can easily use this disclosure as a basis for designing or modifying other processes and structures to achieve the same purposes and / or achieve the same advantages as the embodiments described herein. Those skilled in the art will also appreciate that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that various changes, substitutions, and modifications may be made herein without departing from the spirit and scope of the present disclosure.

Claims

1. A cooling assembly, comprising: A shell having a first chamber and a second chamber therein, wherein the tops of the same side ends of the first chamber and the second chamber respectively have an outlet and an inlet; At least one power module is located in the housing and at least partially overlaps the first chamber and the second chamber; as well as A cooling plate is arranged on the power module, and one side of the cooling plate has an inlet and an outlet. The cooling plate includes at least two straight flow channels and a curved flow channel connecting the same side ends of the two straight flow channels, wherein when the working fluid flows from the first chamber to the second chamber in sequence through the outlet of the first chamber, the inlet of the cooling plate, one of the two straight flow channels, the curved flow channel, the other of the two straight flow channels, the outlet of the cooling plate, and the inlet of the second chamber, the working fluid has the same average temperature per unit area in different sections along the width direction of the cooling plate. 2 . The cooling assembly of claim 1 , wherein the inlet of the cooling plate at least partially overlaps the outlet of the first chamber, and the outlet of the cooling plate at least partially overlaps the inlet of the second chamber.

3. The cooling component according to claim 1, wherein one of the two linear flow channels is connected to the inlet of the cooling plate, and when the working fluid flows through the two linear flow channels, the temperature of the working fluid gradually increases in a direction away from the inlet of the cooling plate.

4. The cooling assembly according to claim 1, wherein one of the two linear flow channels is connected to the outlet of the cooling plate, and when the working fluid flows through the two linear flow channels, the temperature of the working fluid gradually decreases in a direction away from the outlet of the cooling plate. 5 . The cooling assembly according to claim 1 , wherein when the working fluid flows into the first chamber, a temperature of the working fluid gradually increases toward the outlet of the first chamber. 6 . The cooling assembly according to claim 1 , wherein when the working fluid flows into the second chamber, a temperature of the working fluid gradually increases in a direction away from the inlet of the second chamber.

7. The cooling assembly according to claim 1, wherein the cooling plate comprises a base and an upper cover located on the base, the base has a partition extending along its length direction, and the partition is located between the two linear flow channels.

8. The cooling assembly of claim 7, wherein the inlet and the outlet of the cooling plate penetrate through the base.

9. The cooling assembly of claim 1, wherein the housing further comprises: At least one flow guiding rib is located in the first chamber. 10 . The cooling assembly according to claim 1 , wherein the overall top view shape of the two straight flow channels and the curved flow channel is U-shaped.

11. The cooling assembly according to claim 1, wherein the two straight flow channels and the curved flow channel are located at an upper layer of the shell, the first chamber and the second chamber are located at a lower layer of the shell, and the first chamber is separated from the second chamber.

12. The cooling assembly of claim 1, further comprising: The capacitor module is disposed in the housing and at least partially overlaps with the first chamber.

13. The cooling assembly according to claim 1 further comprising: The bus module is disposed in the housing and at least partially overlaps with the second chamber.

14. A cooling assembly comprising: A shell having a first chamber and a second chamber therein, wherein the tops of the same side ends of the first chamber and the second chamber respectively have an outlet and an inlet; At least one power module is located in the housing and at least partially overlaps the first chamber and the second chamber; as well as A cooling plate is arranged on the power module, and one side of the cooling plate has an inlet and an outlet. The cooling plate includes at least two straight flow channels and a curved flow channel connecting the same side ends of the two straight flow channels, wherein one of the two straight flow channels is connected to the inlet of the cooling plate, and the other is connected to the outlet of the cooling plate. When the working fluid flows through the two straight flow channels, the temperature of the working fluid gradually increases in the direction away from the inlet of the cooling plate, and when the working fluid flows through the other of the two straight flow channels, the temperature of the working fluid gradually decreases in the direction away from the outlet of the cooling plate.

15. The cooling assembly of claim 14, wherein the inlet of the cooling plate at least partially overlaps the outlet of the first chamber, and the outlet of the cooling plate at least partially overlaps the inlet of the second chamber. 16 . The cooling assembly of claim 14 , wherein when the working fluid flows into the first chamber, a temperature of the working fluid gradually increases toward the outlet of the first chamber. 17 . The cooling assembly of claim 14 , wherein when the working fluid flows into the second chamber, a temperature of the working fluid gradually increases in a direction away from the inlet of the second chamber.

18. The cooling assembly according to claim 14, wherein the cooling plate comprises a base and an upper cover located on the base, the base has a partition extending along the length direction thereof, and the partition is located between the two linear flow channels.

19. The cooling assembly according to claim 14, wherein the two straight flow channels and the curved flow channel are located at an upper layer of the shell, the first chamber and the second chamber are located at a lower layer of the shell, and the first chamber is separated from the second chamber.

20. The cooling assembly of claim 14, wherein the housing further comprises: At least one flow guiding rib is located in the first chamber.

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