Activating agent, bonding layer curing agent, and repair process for integrated repair of hot end part

Abstract

The present invention relates to the field of repair of a hot end part of a heavy-duty gas turbine. Disclosed are an activating agent, bonding layer curing agent, and repair process for integrated repair of a hot end part. The activating agent comprises at least the following elements, in percentage by mass: Cr (16.2%-19.7%), Co (19.1%-25.8%), Al (1.3%-2.8%), Ru (1.1%-2.9%), Ti (10.1%-13.3%), Ta (0.2%-1.8%), Mo (4.2%-7.8%), Hf (0%-0.1%), Zr (0%-0.1%), Y (0%-0.1%), and Ce (0%-0.1%). The bonding layer curing agent comprises at least the following elements, in percentage by mass: Ni (25.0%-30.0%), Cr (25.0%-30.0%), Al (12.1%-14.9%), and X (0%-1.5%), where "X" is selected from one or a combination of Y, Ta, Hf, Zr, and Ce, and the balance is Co or / and inevitable impurity elements. The repair process mainly comprises defect grinding, base material framework shaping, bonding layer framework shaping, activating agent shaping, metallurgical temperature preservation, and post-treatment. According to the present invention, the high-temperature performance of a base material repair area can be improved, so that a bonding interface is in good connection and has high-strength bonding. In addition, the procedures of bonding layer removal and recoating on the surface of the hot end part are omitted, thus shortening the repair period, improving the repair efficiency, and saving repair costs.

Description

Activator, bonding layer curing agent and repair process for integrated repair of hot end components Technical Field

[0001] The present invention relates to the field of repairing hot end components of heavy-duty gas turbines, in particular to an activator, an adhesive layer curing agent and a repair process for integrated repair of hot end components. Background Art

[0002] Heavy-duty gas turbines are core equipment in the power generation and propulsion sectors, known as the "crown jewel" of the equipment manufacturing industry and a concentrated reflection of a country's industrial prowess. Operating at temperatures exceeding 1000°C, these equipment's hot-end components (such as turbine blades and burners) are constructed from high-performance, high-value nickel / cobalt-based superalloys. To further enhance these hot-end components' thermal performance and protect them from extreme environmental damage, they are coated with MCrAlX coatings or MCrAlX coatings combined with thermal barrier coatings (TBCs). "M" can be any metal or combination of metals, such as Fe, Ni, or Co; "X" is typically Y, but can also be selected from one or a combination of Y, Ta, Hf, Ti, and Zr. However, this protection is limited. Over extended service, foreign object impact, airflow erosion, and thermal fatigue can cause coating delamination and substrate damage, such as thinning and cracking.

[0003] Repairing damaged hot-end components can significantly reduce unit operation and maintenance costs. Typically, repairing hot-end components with substrate thinning or cracking requires first removing the MCrAlX bond coat and thermal barrier coating from the surface, then reshaping the substrate, and then re-spraying the coating. This coating stripping and re-spraying not only prolongs the repair cycle but also significantly increases repair costs, often accounting for over 40% of the total cost.

[0004] Summary of the Invention

[0005] The purpose of the present invention is to provide an activator, an adhesive layer curing agent and a repair process for the integrated repair of hot end components in response to the above-mentioned problems, thereby improving the high-temperature performance of the substrate repair area, making the bonding interface well connected and having high-strength bonding; eliminating the removal and re-spraying steps of the adhesive layer on the surface of the hot end component, shortening the repair cycle, improving the repair efficiency and saving the repair cost.

[0006] The technical solution adopted by the present invention is as follows: an activator for integrated repair of hot end components, the preparation of the activator includes at least the following elements in mass percentage:

[0007] Cr (16.2%-19.7%), Co (19.1%-25.8%), Al (1.3%-2.8%), Ru (1.1%-2.9%), Ti (10.1%-13.3%), Ta (0.2%-1.8%), Mo (4.2%-7.8%), Hf (0%-0.1%), Zr (0%-0.1%), Y (0%-0.1%), Ce (0%-0.1%), and the rest is Ni and / or unavoidable impurity elements.

[0008] A bonding layer curing agent for integrated repair of hot end components, the preparation of the curing agent comprises at least the following elements in percentage by mass:

[0009] Ni (25.0%-30.0%), Cr (25.0%-30.0%), Al (12.1%-14.9%), X (0%-1.5%);

[0010] Wherein, "X" is selected from one of Y, Ta, Hf, Zr, Ce or a combination thereof, and the rest is Co and / or unavoidable impurity elements.

[0011] A repair process for integrated repair of hot end components, utilizing the activator for integrated repair of hot end components and the bonding layer curing agent for integrated repair of hot end components; the hot end components include a substrate and a bonding layer located on the surface of the substrate, the substrate being a precipitation-strengthened nickel-based cast high-temperature alloy, and the bonding layer being a NiCoCrAlX coating, wherein "X" is selected from one of Y, Ta, Hf, Ti, Zr, or a combination thereof; and comprising the following steps:

[0012] S1: Defect grinding; cleaning of damaged areas of hot end components;

[0013] S2: substrate skeleton shaping;

[0014] Mix the base material curing agent and the adhesive in the required proportion and fill them into the damaged area of ​​the hot end component, and dry them to obtain the base material skeleton;

[0015] S3: bonding layer skeleton shaping;

[0016] The bonding layer curing agent and the bonding agent are mixed in a required proportion and then filled into the base material skeleton, and then dried to obtain the bonding layer skeleton;

[0017] S4: activator shaping;

[0018] Mix the activator and the adhesive in the required proportion and fill them on the square of the adhesive layer skeleton, shape it into a "hill" shape and then dry it;

[0019] S5: Metallurgical insulation;

[0020] The hot end component after step S4 is placed in a vacuum environment with a vacuum degree better than 1×10-3 Pa for heat preservation, and then cooled with the furnace after the heat preservation is completed;

[0021] S6: Post-processing: Performing heat treatment to restore the performance of the hot end component after completing step S5, repairing the shape, and completing the repair of the damaged area of ​​the hot end component.

[0022] Furthermore, in step S2, the substrate curing agent and the binder are mixed in a mass ratio of 20:1 to form a paste-like substrate shaping paste, and the substrate shaping paste is dried to obtain a substrate skeleton, the surface of the substrate skeleton is flush with the surface of the substrate.

[0023] Furthermore, the substrate curing agent is M-21 commercial alloy powder or detitaniumized GTD111 commercial customized alloy powder, and the particle size range is 85 μm to 106 μm.

[0024] Furthermore, in step S3, the bonding layer curing agent and the bonding agent are mixed in a mass ratio of 20:1 to form a paste-like bonding layer shaping paste, and the bonding layer shaping paste is dried to obtain a bonding layer skeleton, the surface of the bonding layer skeleton is flush with the surface of the bonding layer.

[0025] Furthermore, in step S4, the amount of the activator used is about 60% to 80% of the weight of the substrate skeleton.

[0026] Furthermore, the binder in steps S2, S3, and S4 is commercially available NICROBRAZ S-BINDR.

[0027] Furthermore, the drying environment of the drying treatment in steps S2, S3, and S4 is an atmospheric environment at 70°C, and the drying time is 1-2 hours.

[0028] Furthermore, the metallurgical insulation temperature is 1170° C.-1210° C., and the insulation time is 30 min to 45 min.

[0029] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0030] 1. Compared with traditional low-melting-point filling materials, the activator provided by the present invention does not add high concentrations of B, Si, Hf, and Zr as melting point depressants. Instead, it adjusts the mass ratio of high-temperature alloy strengthening elements to achieve high entropy of the alloy, thereby achieving the purpose of activator melting point suppression. The obtained substrate repair area has good interface connection and does not contain low-melting-point B-, Si-, Hf-, Zr-rich compounds and / or eutectic phases, and the high-temperature performance of the substrate repair area is significantly improved;

[0031] 2. The activator used in the present invention can be combined in various ways depending on the elemental content of the adhesive layer of different hot-end components. When used in combination with the adhesive layer curing agent provided by the present invention, the resulting adhesive layer repair area has a composition very similar to that of the adhesive layer of the hot-end component, and also has a protective effect on the hot-end component. Furthermore, the interface between the original adhesive layer and the repaired adhesive layer is well connected.

[0032] 3. The repair process disclosed in the present invention can achieve integrated repair of the substrate and adhesive layer of the damaged part without removing the adhesive coating on the surface of the hot end component. Compared with existing repair processes, it eliminates the removal and re-spraying steps of the adhesive layer on the surface of the hot end component, greatly shortening the repair cycle, improving the repair efficiency, and saving the repair cost.

[0033] 4. The substrate repair area and the bonding layer repair area obtained by the repair process disclosed in the present invention are formed through integrated repair, thereby achieving a high-strength connection between the substrate repair area and the bonding layer repair area. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The present invention will now be described by way of example with reference to the accompanying drawings, in which:

[0035] Figure 1 is a schematic diagram of the hot end component structure that needs to be repaired;

[0036] FIG2 is a schematic diagram of the hot end components of step S1;

[0037] FIG3 is a schematic diagram of the hot end components of step S2;

[0038] FIG4 is a schematic diagram of the hot end components of step S3;

[0039] FIG5 is a schematic diagram of the hot end components of step S4;

[0040] FIG6 is a schematic diagram of the hot end components in step S5;

[0041] FIG7 is a schematic diagram of the hot end components of step S6;

[0042] Markings in the figure: 1-substrate; 2-coating; 3-damaged area of ​​hot end component; 4-substrate skeleton; 5-bonding layer skeleton; 6-activator shaping paste. DETAILED DESCRIPTION

[0043] All features disclosed in this specification, or all steps in the disclosed methods or processes, except mutually exclusive features and / or steps, can be combined in any manner.

[0044] Any feature disclosed in this specification, unless otherwise stated, may be replaced by other equivalent or similar features. That is, unless otherwise stated, each feature is only an example of a series of equivalent or similar features.

[0045] Example 1

[0046] An activator for integrated repair of hot end components, the preparation of the activator comprises at least the following elements in percentage by mass:

[0047] Cr (16.2% - 19.7%), Co (19.1% - 25.8%), Al (1.3% - 2.8%), Ru (1.1% - 2.9%), Ti (10.1% - 13.3%), Ta (0.2% - 1.8%), Mo (4.2% - 7.8%), Hf (0% - 0.1%), Zr (0% - 0.1%), Y (0% - 0.1%), Ce (0% - 0.1%), and the rest is Ni and / or unavoidable impurity elements.

[0048] In this embodiment, the activator can be prepared by an atomization method, with a particle size of 23 μm to 30 μm and a melting temperature range of 1120° C. to 1160° C. The activator will melt during metallurgical insulation.

[0049] It should be noted that the atomization method for preparing the activator is known to those skilled in the art, and the specific steps will not be described in detail in this specification.

[0050] For the activator proposed in this example, in order to further clearly illustrate and describe the technical solution of the present invention, the following non-limiting implementation methods are provided, as shown in Table 1 for details.

[0051] Table 1 Implementation Methods of Activators

[0052] In this embodiment, as shown in Table 1, high concentrations of B, Si, Hf, and Zr were not added to the activators DFB-L, DFB-O, DFB-V, and DFB-E to act as melting point depressants. Instead, the mass ratio of the superalloy strengthening elements was adjusted to achieve high entropy in the alloy, thereby achieving activator melting point suppression. As a result, the resulting substrate repair area exhibits excellent interface connectivity and is free of low-melting-point B-, Si-, Hf-, and Zr-rich compounds and / or eutectic phases, significantly improving the high-temperature performance of the repaired substrate area.

[0053] Example 2

[0054] A bonding layer curing agent for integrated repair of hot end components, the preparation of the bonding layer curing agent includes at least the following elements in percentage by mass:

[0055] Ni (25.0%-30.0%), Cr (25.0%-30.0%), Al (12.1%-14.9%), X (0%-1.5%);

[0056] Wherein, "X" is selected from one of Y, Ta, Hf, Zr, Ce or a combination thereof, and the rest is Co and / or unavoidable impurity elements.

[0057] In this embodiment, the bonding layer curing agent can be prepared by a rotating motor method, and the particle size of the prepared bonding layer curing agent is 30 μm to 75 μm; the rotating electrode method is known to those skilled in the art and will not be described in detail in this specification.

[0058] Regarding the bonding layer curing agent proposed in this embodiment, in order to further clearly illustrate and describe the technical solution of the present invention, the following non-limiting implementation methods are provided, as shown in Table 2 for details.

[0059] Table 2 Implementation Methods of Adhesive Layer Curing Agent

[0060] In this embodiment, the activator used in Example 1 can produce a variety of combinations according to the element content of the bonding layer of different hot end components. When used in combination with the bonding layer curing agent, the obtained bonding layer repair area is very close in composition to the bonding layer of the hot end component, and also has a protective effect on the hot end component, and the interface between the original bonding layer and the repaired bonding layer is well connected.

[0061] Example 3

[0062] A repair process for integrated repair of a hot end component utilizes the activator for integrated repair of a hot end component described in Example 1 and the bonding layer curing agent for integrated repair of a hot end component described in Example 2. The hot end component comprises a substrate 1 and a bonding layer located on the surface of the substrate 1. The substrate 1 is a precipitation-strengthened nickel-based cast high-temperature alloy, such as Mar-M247, CM247LC, IN738LC, IN939, MGA2400, GTD-111, GTD-222, or other nickel-based alloys. The bonding layer is a NiCoCrAlX coating 2, wherein "X" is selected from one of Y, Ta, Hf, Ti, and Zr, or a combination thereof. The process comprises the following steps:

[0063] S1: Defect polishing; cleaning the damaged area 3 of the hot end component;

[0064] Remove the oxide layer of the damaged area 3 of the hot end component by mechanical grinding. The length × width × height of the damaged area after grinding shall not exceed 30mm × 5mm × 5mm. Place it in an alcohol or acetone solution for ultrasonic cleaning for 60 minutes, take it out and blow dry it for later use.

[0065] S2: Shaping the substrate skeleton 4; specifically, steps S21 to S25:

[0066] S21: Selection of shaping material for the base skeleton 4; use M-21 commercial alloy powder with a particle size of 85μm to 106μm or de-titaniumized GTD111 commercial customized alloy powder as the base curing agent; use NICROBRAZ S-BINDR commercial type as the binder;

[0067] S22: preparing a base material shaping paste; fully mixing the base material curing agent and the binder in a mass ratio of 20:1 to prepare a base material shaping paste in a paste form;

[0068] S23: Filling the base material shaping paste; filling the damaged area 3 of the hot end component after polishing and cleaning in step S1 with the base material shaping paste, and scraping off excess paste until the paste height is flush with the hot end component surface;

[0069] S24: drying treatment; placing the hot end component filled with the substrate shaping paste in an atmospheric environment at 70°C for 1-2 hours to obtain a substrate skeleton 4, and an atmospheric furnace can be used to provide a drying environment;

[0070] S25: shaping; using a shaping knife to scrape off 0.1 to 1.0 mm (equivalent to the thickness of the bonding layer) of the surface of the substrate skeleton 4 so that the surface of the substrate skeleton 4 is flush with the surface of the substrate 1 .

[0071] S3: shaping the bonding layer skeleton 5; specifically, steps S31-S35;

[0072] S31: Selection of the shaping material of the bonding layer skeleton 5; the bonding layer curing agent disclosed in Example 2; and the commercial NICROBRAZ S-BINDR type as the bonding agent;

[0073] S32: preparing a bonding layer shaping paste; fully mixing the bonding layer curing agent and the bonding agent in a mass ratio of 20:1 to prepare a bonding layer shaping paste in a paste form;

[0074] S33: Filling the adhesive layer shaping paste; filling the adhesive layer shaping paste to fill the base material skeleton 4 portion scraped off in step S2;

[0075] S34: drying treatment; the hot end component filled with the adhesive layer shaping paste is placed in an atmospheric environment at 70°C and dried for 1-2h to obtain an adhesive layer skeleton 5. An atmospheric furnace can be used to provide a drying environment;

[0076] S35: removing material; scraping off excess adhesive layer skeleton 5 with a trimming knife or other tools until the adhesive layer skeleton 5 is flush with the adhesive layer surface.

[0077] S4: Shaping with an activator; specifically, steps S41-S44;

[0078] S41: Selection and dosage of activator shaping material; the activator disclosed in Example 1 is selected, and the amount of the activator is 60% to 80% by weight of the substrate skeleton 4; NICROBRAZ S-BINDR commercial type is selected as the binder;

[0079] S42: preparing an activator shaping paste 6; the activator and the binder are fully mixed in a mass ratio of 20:1 to prepare an activator shaping paste 6 in a paste form;

[0080] S43: stacking the activator shaping paste 6; placing the activator shaping paste 6 directly above the bonding layer skeleton 5 in step S3, and shaping it into a nearly "hill" shape;

[0081] S44: drying treatment; the hot end component stacked with the activator shaping paste 6 is dried in an atmospheric environment at 70°C for 1-2h, and an atmospheric furnace can be used to provide a drying environment.

[0082] S5: Metallurgical insulation;

[0083] Place the hot end component after step S4 in a vacuum chamber with a pressure of better than 1×10 -3 Pa vacuum environment insulation, the metallurgical insulation temperature is 1170 ℃ -1210 ℃, the insulation time is 30min ~ 45min; after the insulation is completed, the furnace is cooled; a vacuum furnace can be used to provide a vacuum environment;

[0084] S6: post-processing;

[0085] The hot end component that has completed step S5 is subjected to performance recovery heat treatment, and a trimming knife is used to trim the shape and remove excess metal, thereby completing the integrated reshaping of the substrate 1-adhesive layer in the damaged area.

[0086] It should be noted that the paste is viscous and has low fluidity. When filling the base material shaping paste, the bonding layer paste, and the activator shaping paste 6, the filling position is stable to avoid deviation from the repair position; and the viscous base material shaping paste, the bonding layer paste, and the activator shaping paste 6 are more convenient to fill. Specifically, the viscous state has a certain fluidity. When the base material shaping paste, the bonding layer paste, and the activator shaping paste 6 fill the corresponding position, due to its fluidity, it can change its own shape according to the size of the filling position, meet the filling of irregular areas, and can be completely filled under the action of its own fluidity, reducing the existence of defective gaps.

[0087] In this embodiment, the damaged substrate 1 and adhesive layer can be repaired in an integrated manner without removing the adhesive coating 2 on the surface of the hot end component. Compared to repair processes that do not utilize one or more of the features described herein, this eliminates the need for adhesive layer removal and re-coating on the hot end component, significantly shortening the repair cycle, improving repair efficiency, and reducing repair costs.

[0088] In this embodiment, the substrate repair area and the bonding layer repair area obtained by the above-mentioned repair process are formed by integrated repair, so that a high-strength connection between the substrate repair area and the bonding layer repair area can be achieved.

[0089] Example 4

[0090] Based on Example 3, a specific application implementation method of the repair process on the N4 guide vane is proposed.

[0091] The base material 1 of the N4 guide vane is IN738LC precipitation-strengthened nickel-based cast high-temperature alloy with a nominal chemical composition of Ni-16wt% Cr-8.5wt% Co-2.5wt% W-3.5wt% Al-3.5wt% Ti-1.7wt% Ta-1.7wt% Mo-0.8wt% Nb-0.09wt% C-0.01wt% B-0.05wt% Zr; the protective coating 2 (bonding layer) on the blade surface is NiCoCrAlY with a chemical composition of Ni-28wt% Co-23wt% Cr-8.5wt% Al-0.6wt% Y.

[0092] The repair process is carried out according to the steps described in Example 3; wherein:

[0093] The selected substrate curing agent is de-titaniumized GTD111 commercial custom alloy powder with a particle size of 85μm-106μm and the following composition:

[0094] C (0.1wt%), Cr (14.0wt%), Co (9.5wt%), Mo (1.6wt%), W (3.8wt%), Ta (2.8wt%), Al (3.0wt%), Zr (0.02wt%), B (0.012wt%);

[0095] The adhesive layer curing agent selected is the adhesive layer curing agent with the brand DF-L in Example 2, with a particle size of 30 μm to 75 μm;

[0096] The activator selected is the activator with the brand name DFB-L in Example 1, and the particle size is 23 μm to 30 μm.

[0097] The thickness of the adhesive layer skeleton 5 is 0.5 mm.

[0098] The amount of activator used is about 60% of the weight of the skeleton.

[0099] The metallurgical holding temperature is 1190°C and the holding time is 40 minutes.

[0100] After the repair was completed, the repaired area of ​​the substrate was made into a tensile part, and the room temperature tensile strength was measured to be 875 MPa, reaching 87.7% of the strength of substrate 1. The high temperature tensile strength at 900°C reached 486 MPa, reaching 85.9% of the strength of substrate 1.

[0101] After the repair is completed, EDS spectrum analysis is performed on the repaired area of ​​the bonding layer, and the results are as follows:

[0102] Cr (22.7wt%), Co (23.6wt%), Al (9.9wt%), Ti (4.4wt%), Ta (0.7wt%), Hf (0.2wt%), Ru (1.2wt%), Mo (3.1wt%), Y (0.8wt%).

[0103] Example 5

[0104] On the basis of Example 3, a specific application implementation method of the repair process is proposed when repairing Mar-m247 precipitation-strengthened nickel-based cast high-temperature alloy structural parts with NiCoCrAlY coating 2 (bonding layer).

[0105] The nominal chemical composition of the Mar-m247 precipitation-strengthened nickel-based cast high-temperature alloy is Ni-8wt%Cr-10wt%Co-10wt%W-5.5wt%Al-1wt%Ti-3wt%Ta-1.5wt%Hf-0.6wt%Mo-0.15wt%C-0.015wt%B-0.03wt%Zr; the chemical composition of the NiCoCrAlY coating 2 is Ni-28wt%Co-25wt%Cr-8.8wt%Al-0.6wt%Y.

[0106] The repair process is carried out according to the steps described in Example 3; wherein:

[0107] The selected substrate curing agent is M-21 commercial alloy powder with a particle size of 75μm-150μm and a nominal chemical composition of:

[0108] C (0.13wt%), B (0.02wt%), Cr (5.7wt%), Mo (2.0wt%), Al (6.0wt%), W (11.0wt%), Nb (1.5wt%), Zr (0.12wt%);

[0109] The adhesive layer curing agent selected is the adhesive layer curing agent with the brand DF-0 in Example 2, with a particle size of 30 μm to 75 μm;

[0110] The activator selected is the activator with the brand name DFB-0 in Example 1, and the particle size is 23 μm to 30 μm.

[0111] The thickness of the adhesive layer skeleton 5 is 0.5 mm.

[0112] The amount of the activator used is about 65% of the weight of the substrate skeleton 4.

[0113] The metallurgical holding temperature is 1210°C and the holding time is 30 minutes.

[0114] After the repair was completed, the repaired area of ​​the substrate was made into a tensile part, and the room temperature tensile strength was measured to be 825 MPa, reaching 84.9% of the strength of substrate 1, and the high temperature tensile strength at 900°C reached 491 MPa, reaching 75.8% of the strength of substrate 1.

[0115] After the repair is completed, EDS spectrum analysis is performed on the repaired area of ​​the bonding layer, and the results are as follows:

[0116] Cr (22.5wt%), Co (29.5wt%), Al (9.4wt%), Ti (4.7wt%), Ta (0.6wt%), Ru (0.4wt%), Y (0.8wt%).

[0117] The present invention is not limited to the aforementioned specific embodiments, but extends to any new features or any new combination disclosed in this specification, as well as any new method or process steps or any new combination disclosed.

Claims

1. An activator for integrated repair of hot end components, characterized in that: The preparation of the activator includes at least the following elements in mass percentage: Cr (16.2% -19.7%), Co (19.1% -25.8%), Al (1.3% -2.8%), Ru (1.1% -2.9%), Ti (10.1% -13.3%), Ta (0.2% -1.8%), Mo (4.2% -7.8%), Hf (0% -0.1%), Zr (0% -0.1%), Y (0% -0.1%), Ce (0% -0.1%), and the rest is Ni and / or unavoidable impurity elements.

2. The activator according to claim 1, characterized in that: The preparation of the activator includes at least the following elements in mass percentage: Cr (16.2%), Co (19.1%), Al (2.8%), Ru (2.9%), Ti (10.9%), Ta (1.4%), Mo (7.8%), Hf (0.1%), Y (0.1%), and the rest is Ni and / or inevitable impurity elements.

3. The activator according to claim 1, characterized in that: The preparation of the activator includes at least the following elements in mass percentage: Cr (18.7%), Co (21.8%), Al (2.8%), Ru (1.1%), Ti (11.7%), Ta (1.3%), Mo (6.2%), Zr (0.1%), Y (0.1%), and the rest is Ni and / or inevitable impurity elements.

4. The activator according to claim 1, characterized in that: The preparation of the activator includes at least the following elements in mass percentage: Cr (16.8%), Co (25.8%), Al (1.8%), Ru (1.3%), Ti (10.1%), Ta (0.5%), Mo (5.1%), Ce (0.1%), and the rest is Ni and / or inevitable impurity elements.

5. The activator according to claim 1, characterized in that: The preparation of the activator includes at least the following elements in mass percentage: Cr (19.7%), Co (23.8%), Al (1.3%), Ru (1.5%), Ti (13.3%), Ta (0.2%), Mo (4.2%), Zr (0.1%), and the rest is Ni and / or inevitable impurity elements.

6. [Corrected 30.05.2024 in accordance with Rule 91] The activator according to claim 1, characterized in that: The melting point of the activator is 1120°C-1160°C.

7. [Corrected 30.05.2024 in accordance with Rule 91] The activator according to claim 1, characterized in that: The activator is prepared by an atomization method and has a particle size of 23 μm to 30 μm.

8. [Corrected 30.05.2024 in accordance with Rule 91] An adhesive layer curing agent for integrated repair of hot end components, used in combination with an activator for integrated repair of hot end components according to any one of claims 1 to 7, characterized in that: The preparation of the bonding layer curing agent includes at least the following elements in percentage by mass: Ni (25.0%-30.0%), Cr (25.0%-30.0%), Al (12.1%-14.9%), X (0%-1.5%); Wherein, "X" is selected from one of Y, Ta, Hf, Zr, Ce or a combination thereof, and the rest is Co and / or unavoidable impurity elements.

9. [Corrected 30.05.2024 in accordance with Rule 91] The bonding layer curing agent according to claim 8, characterized in that: The preparation of the bonding layer curing agent includes at least the following elements in percentage by mass: Ni (30.0%), Cr (27.0%), Al (14.9%), Y (1.3%), Hf (0.2%), and the remainder is Co and / or inevitable impurity elements.

10. [Corrected 30.05.2024 in accordance with Rule 91] The bonding layer curing agent according to claim 8, characterized in that: The preparation of the bonding layer curing agent includes at least the following elements in percentage by mass: Ni (25.0%), Cr (25.0%), Al (13.8%), Y (1.3%), Ta (0.2%), and the remainder is Co and / or inevitable impurity elements.

11. [Corrected 30.05.2024 in accordance with Rule 91] The bonding layer curing agent according to claim 8, characterized in that: The preparation of the bonding layer curing agent includes at least the following elements in percentage by mass: Ni (24.8%), Cr (30.0%), Al (12.1%), Y (1.5%), and the remainder is Co and / or inevitable impurity elements.

12. [Corrected 30.05.2024 in accordance with Rule 91] The bonding layer curing agent according to claim 8, characterized in that: The preparation of the bonding layer curing agent includes at least the following elements in percentage by mass: Ni (24.8%), Cr (30.0%), Al (12.1%), Y (1.5%), and the remainder is Co and / or inevitable impurity elements.

13. [Corrected 30.05.2024 in accordance with Rule 91] The bonding layer curing agent according to claim 8, characterized in that: The preparation of the bonding layer curing agent includes at least the following elements in percentage by mass: Ni (27.0%), Cr (28.8%), Al (13.6%), Y (1.3%), Zr (0.2%), and the rest is Co and / or inevitable impurity elements.

14. [Corrected 30.05.2024 in accordance with Rule 91] The bonding layer curing agent according to claim 8, characterized in that: The preparation of the bonding layer curing agent includes at least the following elements in percentage by mass: Ni (26.0%), Cr (29.0%), Al (14.2%), Y (1.3%), Ce (0.2%), and the rest is Co and / or inevitable impurity elements.

15. The adhesive layer curing agent according to claim 8, characterized in that: The melting point of the bonding layer curing agent is 1460°C-1487°C.

16. The adhesive layer curing agent according to claim 8, characterized in that: The bonding layer curing agent is prepared by a rotary motor method, and the particle size of the bonding layer curing agent is 30 μm to 75 μm.

17. A repair process for integrated repair of hot end components, characterized in that: The method comprises using the activator for integrated repair of hot end components as described in any one of claims 1 to 7 and the bonding layer curing agent for integrated repair of hot end components as described in any one of claims 8 to 16; the hot end components comprise a substrate (1) and a bonding layer located on the surface of the substrate (1), the substrate (1) is a precipitation-strengthened nickel-based cast high-temperature alloy, the bonding layer is a NiCoCrAlX coating (2), wherein "X" is selected from one of Y, Ta, Hf, Ti, Zr or a combination thereof; and the method comprises the following steps: S1: Defect polishing; cleaning the damaged area (3) of the hot end component; S2: shaping of the substrate skeleton (4); Mixing the substrate curing agent and the adhesive in a required proportion and filling the mixture into the damaged area (3) of the hot end component, and drying the mixture to obtain a substrate skeleton (4); S3: shaping of the bonding layer skeleton (5); The adhesive layer curing agent and the adhesive are mixed in a required proportion and then filled into the base material skeleton (4), and then dried to obtain the adhesive layer skeleton (5); S4: activator shaping; The activator and the adhesive are mixed in the required proportion and then filled onto the top of the adhesive layer skeleton (5), and then shaped into a "hill" shape and dried; S5: Metallurgical insulation; The hot end component after step S4 is placed in a vacuum environment with a vacuum degree better than 1×10-3Pa for heat preservation, and then cooled with the furnace after the heat preservation is completed; S6: post-processing; performing a performance recovery heat treatment on the hot end component that has completed step S5, repairing the hot end component damaged area (3) to complete the repair.

18. The repair process according to claim 17, characterized in that: In step S2, the substrate curing agent and the binder are mixed in a mass ratio of 20:1 to form a paste-like substrate shaping paste, and the substrate shaping paste is dried to obtain a substrate skeleton (4), the surface of the substrate skeleton (4) is flush with the surface of the substrate (1).

19. The repair process according to claim 18, characterized in that: The substrate curing agent is M-21 commercial alloy powder or detitaniumized GTD111 commercial customized alloy powder, and the particle size range is 85 μm to 106 μm.

20. The repair process according to claim 17, characterized in that: In step S3, the bonding layer curing agent and the bonding agent are mixed in a mass ratio of 20:1 to form a bonding layer shaping paste in a paste-like state. The bonding layer shaping paste is dried to obtain a bonding layer skeleton (5), and the surface of the bonding layer skeleton (5) is flush with the surface of the bonding layer.

21. The repair process according to claim 17, characterized in that: In step S4, the amount of the activator used is 60% to 80% of the weight of the substrate skeleton (4).

22. The repair process according to any one of claims 17 to 21, characterized in that: The binder in steps S2, S3 and S4 is commercially available NICROBRAZ S-BINDR.

23. The repair process according to any one of claims 17 to 21, characterized in that: The drying environment of the drying treatment in steps S2, S3, and S4 is an atmospheric environment at 70°C, and the drying time is 1-2 hours.

24. The repair process according to claim 17, characterized in that: The metallurgical insulation temperature is 1170° C.-1210° C., and the insulation time is 30 min to 45 min.

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