Aluminum-based vapor chamber heat sink with highly efficient heat dissipation and preparation method, and communication device

Abstract

Provided in the present invention are an aluminum-based vapor chamber heat sink with highly efficient heat dissipation and a preparation method, and a communication device. The aluminum-based vapor chamber heat sink comprises a lower shell plate. A grooved wick is machined on the upper portion of the lower shell plate by means of a skiving process, and the wick has a groove depth of 1 mm, a groove width of 0.1 mm, and a channel spacing of 0.2 mm. The wick is subjected to sandblasting treatment, thereby improving the surface roughness of the wick. The lower portion of the lower shell plate has fins having a spacing of 7 mm and a thickness of 3 mm; micro-protrusions are provided between the fins, thereby increasing the specific surface area of the whole heat sink, and improving convective heat transfer efficiency; grooves are provided on the micro-protrusions by means of CNC machining, thereby improving the natural convective heat transfer coefficient; and the fins are first subjected to coarse sandblasting treatment to improve the surface roughness, and are then subjected to nano-carbon spray coating, thus improving the radiation intensity of the fins. The lower surface of a lower shell is in contact with the external environment, and the improved surface roughness increases the radiation intensity of the whole aluminum-based vapor chamber to the outside, and also improves convective heat transfer intensity.

Description

Aluminum-based heat sink with high heat dissipation efficiency, preparation method, and communication equipment Technical Field

[0001] The present invention relates to the field of chip heat dissipation, and in particular to an aluminum-based vapor chamber radiator with high-efficiency heat dissipation, a preparation method thereof, and communication equipment. Background Art

[0002] With the rapid development of the microelectronics industry, the size of optoelectronic components has continued to decrease, resulting in a large heat flux density in electronic chips when communication equipment is running, causing the electronic chips to overheat and cause frequency loss and overclocking.

[0003] Most traditional communication equipment adopts an internal cooling system design, and uses a plastic shell to protect the internal cooling system. The shell is opened or the thickness of the body is increased to increase the natural convection heat exchange capacity of the internal system to reduce the temperature of the electronic chip; but the above cooling system faces the following problems: 1. Increasing the number of openings will cause dust to enter the interior of the communication equipment after long-term use, and the accumulation of dust will affect the life of the product; 2. In order to avoid the shell temperature of the communication equipment being too high, the size of the shell is increased, and this design is thicker and less beautiful and delicate; 3. As the chip integration of communication equipment increases, the heat flux density of the chip continues to increase. In a natural convection environment, this cooling system cannot effectively dissipate heat for the chip, and the communication equipment will not be able to operate effectively.

[0004] It can be seen that the use of heat dissipation devices with better heat dissipation performance through conduction, convection and radiation as well as higher heat dissipation efficiency in the narrow space of communication equipment has become a research focus.

[0005] Summary of the Invention

[0006] In order to improve multiple technical problems, the present invention provides an aluminum-based heat sink heat dissipation device with fins and micro-protrusions and a communication device comprising the product. From the perspective of the overall design of the communication equipment, the thin and small structure is maintained, the opening link is eliminated, and the heat dissipation efficiency of the electronic chip of the communication equipment is improved.

[0007] The present invention provides the following technical solutions:

[0008] First aspect:

[0009] The present invention provides an aluminum-based heat spreader radiator with high heat dissipation efficiency, which comprises a lower shell plate, a sandwich plate and an upper shell plate. The upper portion of the lower shell plate is provided with a liquid-absorbing core, which is manufactured by a shovel tooth process, and the liquid-absorbing core is subjected to fine sandblasting treatment. The lower portion of the lower shell plate is provided with ribs with a spacing of 7 mm and a tooth thickness of 3 mm. There are small micro-protrusions between adjacent ribs, and CNC-machined grooves between the micro-protrusions. This surface is subjected to coarse sandblasting treatment, and nano-carbon is sprayed on this surface. The sandwich plate acts as a supporting column, thereby improving the strength of the radiator. The upper shell plate is larger in size than the length and width of the sandwich plate and the lower shell plate, and the upper shell plate and the lower shell plate are provided with mounting holes. The upper shell plate, the sandwich plate and the lower shell plate are welded to form an aluminum-based heat spreader.

[0010] In the above embodiment, the liquid absorbent core is manufactured by the shovel tooth process, which has the advantages of high efficiency and Products can be processed efficiently to improve production efficiency; the tooth-scaling process can control the processing accuracy, providing higher processing accuracy and surface quality; the tooth spacing limit of the tooth-scaling process can reach 0.05mm, and the distance between the two tooth surfaces of the grooved liquid wick is 0.15mm, which is conducive to generating a larger capillary pressure. Combined with the manufacturing process of the tooth-scaling process, the tooth thickness and the tooth surface spacing are both 0.1mm to obtain a larger capillary pressure; the lower shell plate is subjected to fine sandblasting treatment to improve the roughness of the surface of the liquid wick. The increase in surface roughness increases the contact angle of the liquid and strengthens the water absorption, which is conducive to the upward climbing of the liquid in the aluminum-based heat sink under counter-gravity; the chip in the middle of the liquid wick is conducive to the chip introducing heat into the evaporation end of the aluminum-based heat sink through heat conduction, the liquid at the evaporation end vaporizes into water vapor, and the gas at the condensation end liquefies into liquid. The liquid climbs to the evaporation end under the action of the capillary force of the liquid wick. The length of the liquid wick should not be distributed too high to avoid the phenomenon that the liquid cannot climb to the evaporation end, thereby reducing the situation of dry burning.

[0011] In the above embodiment, the lower shell is processed into a radiator with an overall size of 7mm, wherein the fin height is 3mm, which not only enables the convective heat transfer performance, but also enables the support of the entire electronic device; the ploughing method is used to cut isosceles triangle microstructures with a height of 0.55mm, a width of 0.38mm and a spacing of 0.6mm between the fins as micro-protrusions. Before the cutting process, the plowing tool needs to be modeled and manufactured, and CNC grooves are processed in the micro-protrusions. The lower part of the lower shell is first subjected to coarse sandblasting treatment, and the coarse sandblasting will grind off the edges of the micro-protrusions. , thus increasing the overall roughness. The fin structure is large in size and will not affect the deformation of the fin. When the fluid flows around the surface roughness, vortices will be generated in the rough layer. The vortices will be strengthened with the speed of the fluid. In addition, the fins and micro-protrusions are in the rough microchannels. Due to the resistance of the fluid in the rough layer, the flow velocity in the rough area is reduced. Based on the flow continuity condition, it is bound to increase the flow velocity in the mainstream area. The increase in the velocity in the mainstream area improves the convective heat transfer capacity of the fins. For natural convection on the vertical wall, when the flow begins to form at the bottom of the wall, the local surface heat transfer coefficient h x As the height increases, the heat transfer coefficient decreases. If the fluid gradually changes from laminar flow to turbulent state at a high enough height, the local heat transfer coefficient increases. When the local surface heat transfer coefficient reaches the vigorous turbulent state, it is almost a constant. Therefore, machining small grooves between the micro-protrusions is beneficial to start the fluid back to the state just formed with the wall, that is, to re-trigger the boundary layer, thereby improving the local heat transfer coefficient and the convective heat transfer effect.

[0012] In the above embodiment, the fins and micro-protrusions are subjected to coarse sandblasting treatment and then sprayed with nano-carbon for surface treatment. The structure of the micro-protrusions increases the specific surface area of ​​the overall radiator, making the radiation area larger, and the surface emissivity of the nano-carbon is close to 1. Based on the above two points, the radiation heat exchange capacity of the radiator to external objects is greatly improved.

[0013] Second aspect:

[0014] The present invention also provides a communication device including the above-mentioned heat dissipation system, whose main parts are designed from left to right as a first shell, a PCB board, an electronic chip, a screen cover, a thermal pad, a middle frame and an aluminum-based heat sink heat dissipation device; the aluminum-based heat sink heat sink with ribs and a micro-protrusion structure is assembled with the middle frame using bolts.

[0015] In the above embodiment, the aluminum-based heat spreader heat sink is directly exposed to the external environment, and the main heat-generating electronic chip is installed under the PCB. The chip generates heat when working and is transferred to the aluminum-based heat spreader heat sink through heat conduction. The aluminum-based heat spreader heat sink has excellent thermal conductivity, and the heat of the chip is evenly distributed around. The heat of the aluminum-based heat spreader heat sink increases and conducts convection heat exchange with the surrounding cold air. The convection heat exchange between the aluminum-based heat spreader heat sink and the surrounding air causes the surrounding air temperature to rise, and the air expands upward due to the heat. The air pressure here is relatively small, and the cold air below flows upward under the action of pressure; the communication equipment is placed vertically so that the direction of gravity is parallel to the direction of the fins. The design of the direction of the fins being parallel to the wind speed can reduce wind resistance, make the air flow more uniform and smooth, maximize the convection heat transfer coefficient between the heat exchange area and the fluid, and improve the heat transfer efficiency.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The present invention provides an aluminum-based heat spreader radiator and communication equipment with high heat dissipation efficiency. Compared with the existing technology, the aluminum-based heat spreader adopts a shovel tooth process for its liquid wick. This process manufacturing method is efficient and can process products efficiently, improve production efficiency, and the processing accuracy can be controlled, providing higher processing accuracy and surface quality. The liquid wick is subjected to fine sandblasting treatment, which not only does not damage the structure of the liquid wick, but also increases the surface roughness of the liquid wick, helps to use the heat dissipation device against gravity, and improves the heat dissipation performance of the radiator; the outside of the radiator has a fin structure, and the triangular micro-protrusion structure is cut between the fins by plowing. Before cutting, the plowing tool needs to be modeled and manufactured, and grooves are machined between the micro-protrusions to re-trigger the boundary layer and improve the local heat transfer coefficient; its surface is first subjected to coarse sandblasting treatment, and the coarse sandblasting increases the surface roughness. The resistance in the rough layer makes it The flow velocity in the zone is reduced, and the flow velocity in the mainstream zone is increased, which improves the convective heat transfer efficiency; on the basis of coarse sandblasting, nano-carbon is sprayed on the fins and micro-protrusions. Sandblasting increases the overall heat transfer area. The surface emissivity of nano-carbon is close to 1. The combination of the two greatly improves the overall radiation heat transfer capacity of the radiator; the designed radiator is used as a shell in communication equipment. When the electronic chip is working, it generates heat and the gas expands, forming heat convection in the direction against gravity. The communication equipment is placed vertically, which greatly improves the convective heat transfer capacity between the air and the radiator. The heat generated by the chip is transferred to the radiator through heat conduction. The radiator is directly exposed to the outside world and can directly radiate energy to objects with lower external temperature to achieve better heat dissipation effect. This design avoids the disadvantages of openings in communication equipment and greatly optimizes the heat dissipation system of communication equipment, making the communication equipment thinner and more beautiful. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] FIG1 is a schematic diagram of a radiator according to a first embodiment of the present invention.

[0019] FIG2 is an overall exploded view of a communication device according to a second embodiment of the present invention.

[0020] FIG3 is a schematic diagram of the manufacturing process of the heat sink according to the first embodiment of the present invention.

[0021] FIG4 is a schematic diagram of the dimensions of the liquid absorbent core according to the first embodiment of the present invention.

[0022] FIG5 is a partial schematic diagram of the size of the wick A in FIG4 .

[0023] FIG6 is a schematic diagram of ribs and micro-protrusions according to the first embodiment of the present invention.

[0024] FIG. 7 is a partial schematic diagram of B in FIG. 6 .

[0025] FIG8 is a partial schematic diagram of C in FIG7 .

[0026] Figure 9 is a partial schematic diagram of D in Figure 7. Figure 10 is a diagram showing the local heat transfer coefficient of natural convection along the vertical wall of the radiator according to the first embodiment of the present invention.

[0027] FIG11 is a schematic diagram of the placement of communication equipment according to the second embodiment of the present invention.

[0028] FIG12 is a schematic diagram of external fluid of a communication device according to a second embodiment of the present invention. DETAILED DESCRIPTION

[0029] The present invention is described in detail below with reference to the embodiments and accompanying drawings. However, it should be understood that the embodiments and accompanying drawings are merely exemplary descriptions of the present invention and do not constitute any limitation on the scope of protection of the present invention. All reasonable variations and combinations within the scope of the inventive concept of the present invention fall within the scope of protection of the present invention.

[0030] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", "front", "rear", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the devices or components referred to must have a specific direction, be constructed and operate in a specific direction, and therefore should not be understood as limiting the present invention. The terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. In addition, unless otherwise expressly specified and limited, the terms "disposed", "installed", "connected", and "connected" should be understood in a broad sense. For example, they can be fixedly connected, detachably connected, or integrally connected; they can be mechanically connected or electrically connected; they can be directly connected or indirectly connected through an intermediate medium, or they can be internal communication between two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] The present invention will be further described below with reference to the accompanying drawings.

[0032] Example 1

[0033] As shown in FIG1 , the present invention provides an aluminum-based vapor chamber heat sink having high thermal conductivity, good convective heat transfer performance, and strong radiative heat transfer capacity. The entire manufacturing process of the heat sink is shown in the flow chart of FIG3 . First, CNC machining is performed on the lower shell plate 101 having fins 102 and micro-protrusions. Then, a tooth-cutting process is used to process a grooved liquid wick 105 on the other side of the lower shell plate 101. The surface of the liquid wick 105 is treated by blasting fine sand to increase the surface roughness of the liquid wick 105. The side of the lower shell plate 101 having the fins 102 is first blasted with coarse sand. Then, nano-carbon is sprayed on it to increase the specific surface area and radiation intensity. The lower shell plate 101, the interlayer plate 106, and the upper shell plate 104 are welded together. Then, vacuuming, liquid injection, secondary exhaust, head welding, and finally inspection and testing are performed.

[0034] The upper part of the liquid wick 105 of the lower shell plate 101 is manufactured by a scraping process. The scraping process is efficient and can process products efficiently, thereby improving production efficiency. The scraping process can control the processing accuracy, provide higher processing accuracy and surface quality, and the tooth spacing limit of the scraping process can reach 0.05mm. The distance between the two tooth surfaces of the liquid wick 105 is 0.15mm, which is conducive to generating a larger capillary pressure. Combined with the manufacturing process of the scraping process, the tooth thickness and the tooth surface spacing are both 0.1mm, as shown in Figures 4 and 5, to obtain a larger capillary pressure. On this basis, fine sand blasting is performed. Fine sand blasting Not only does it improve the roughness of the surface of the wick 105, but it also does not damage the structure of the wick 105. The improvement of the surface roughness increases the contact angle of the liquid, and the water absorbency becomes stronger, which is beneficial to the upward climbing of the liquid in the aluminum-based heat spreader under the condition of counter-gravity; the chip in the middle of the wick 105 is beneficial for the chip to conduct heat to the evaporation end of the aluminum-based heat spreader, the liquid at the evaporation end is vaporized into water vapor, and the gas at the condensation end is liquefied into liquid, and the liquid climbs to the evaporation end under the action of the capillary force of the wick 105. The length of the wick 105 should not be distributed too high to avoid the phenomenon that the liquid cannot climb to the evaporation end, and the dry burning situation is reduced.

[0035] As shown in Figures 6 and 7, the lower part of the lower shell plate 101 is processed with ribs 102 with a spacing of 7mm and a tooth thickness of 3mm, which not only enables the convective heat transfer effect, but also enables the support of the entire electronic equipment; as shown in Figure 8, the plowing method is used to cut isosceles triangular micro-protrusions with a height of 0.55mm, a width of 0.38mm and a spacing of 0.6mm between the ribs. Before the cutting process, the plowing tool must be modeled and manufactured, and the grooves shown in Figure 9 are CNC-machined in the micro-protrusions; as shown in Figure 10, for natural convection on the vertical wall, when the flow at the lower part of the wall just begins to form, the local surface heat transfer coefficient h xAs the height increases, it decreases. If the fluid gradually changes from laminar flow to turbulent state at a high enough height, the local heat transfer coefficient increases. When the local surface heat transfer coefficient reaches the vigorous turbulent state, it is almost a constant. Therefore, machining small grooves between the micro-protrusions is beneficial to re-starting the state where the fluid has just formed with the wall, that is, re-triggering the boundary layer, thereby improving the local heat transfer coefficient and the convective heat transfer effect. The lower part of the lower shell plate 101 in the figure is first subjected to coarse sandblasting. The coarse sandblasting will grind off the edges and corners of the triangular micro-protrusions 103, thereby increasing the overall roughness. The fins 102 have a large structural size and will not affect the deformation of the fins 102. When the fluid flows around the surface roughness, vortices will be generated in the rough layer, and the vortices will be strengthened with the speed of the fluid. The fins 102 and micro-protrusions 103 are in the rough microchannel. Due to the resistance of the fluid in the rough layer, the flow rate in the rough area is reduced. Based on the flow continuity condition, that is, the flow rate through any flow section in the pipe is equal, it is bound to cause the flow rate in the mainstream area to increase. The increase in the speed in the mainstream area improves the convective heat transfer capacity of the fins 102. After the coarse sandblasting treatment is completed, the heat dissipation fins 102 and micro-protrusions 103 on the lower part of the lower shell plate 101 are sprayed with nano-carbon for surface treatment. The structure of the micro-protrusions increases the specific surface area of ​​the overall radiator, making the radiation area larger. The surface emissivity of the nano-carbon is close to 1. Based on the above two points, the radiation heat transfer capacity of the radiator to external objects is greatly improved. Example 2

[0036] As shown in Figure 2, the aluminum-based vapor chamber heat sink provided by the present invention is applied to a router. The router comprises, from left to right, a first housing 201 and a PCB board 202. A main heat-generating chip 203 is provided on the right side of the PCB board 202. The chip 203 is protected by a screen cover 204. The chip 203 and the screen cover 204 are connected as a whole to the heat sink 207 through a thermal pad 205. The thermal pad 205 reduces the contact thermal resistance generated between the heat source surface and the contact surface of the heat dissipation device, and fills the gap between the contact surfaces very well. The heat sink 207 is assembled with the second housing 206 by bolts. The first housing 201 and the second housing 206 both have buckles, which are fully buckled together, as shown in Figure 11.

[0037] The heat dissipation method of the entire router heat dissipation system: As shown in Figure 12, the main heat-generating electronic chip is installed under the PCB. The chip generates heat when working and is transferred to the radiator through heat conduction. The radiator dissipates heat for the entire router chip. The radiator is a gas-liquid phase change structure with a thermal conductivity of about 5000W / (m·K). Compared with aluminum alloy, it has better temperature uniformity and avoids the concentration of chip hot spots. The radiator absorbs the heat emitted by the chip and conducts heat to the surrounding area. The heat of the radiator rises and conducts heat convection with the surrounding cold air. The radiator conducts heat convection with the surrounding air, which makes the surrounding air temperature rise. The air expands upward due to the heat. The air pressure here is relatively small, and the cold air below flows upward under the action of pressure. The router is placed vertically so that the direction of gravity is parallel to the direction of ribs 102. The design of the fins 102 being parallel to the wind speed can reduce wind resistance, making the air flow more uniform and smooth, which can maximize the convection heat transfer coefficient between the heat exchange area and the fluid, and improve the heat transfer efficiency; one side of the radiator with the fins 102 is exposed to the external environment, and the fins 102 and micro-protrusions of the radiator can directly exchange heat with the external air through natural convection. The air flow rate in the external environment is much greater than that inside the shell, and direct exposure to the outside world greatly improves the natural convection heat transfer effect; when the chip is running, the temperature of the radiator is higher than the temperature of the surrounding environment, and the side of the radiator with the fins 102 is sprayed with nano-carbon to increase the surface emissivity ε, and the coarse sandblasting treatment increases the overall specific surface area A, thereby greatly improving the radiation heat transfer energy of the radiator to external low-temperature objects.

[0038] The entire heat transfer system can be simplified as follows: the energy Q of chip heating 输入 Some of them lose Q through other means 损失 , part of which is transferred to the radiator Q 散热器 Another part causes the chip temperature to rise Q 芯片 ; Part of the energy transferred to the radiator increases the radiator temperature Q 热量 Part of the radiator conducts convection heat exchange with the air Q 对流换热 Another part is the radiator and the external environment Q 辐射 Radiation heat transfer, that is: Q 输入 =Q 损失 +Q 散热器 +Q 芯片 Q 散热器 =Q 热量 +Q 对流换热 +Q 辐射

[0039] Compared with the traditional aluminum plate radiator, the aluminum-based heat sink with fins and micro protrusions 103 has a high thermal conductivity. After reaching a steady state, the energy absorbed by the radiator is high, i.e., Q 散热器 , at input power Q输入 Under the same conditions, the chip temperature Q 芯片 Aluminum-based heat spreader fins and micro-protrusions 103 are sandblasted and then sprayed with nano-carbon to improve the convective heat transfer efficiency and radiation heat transfer effect, ie Q 对流换热 and Q 辐射 The value of Q 热量 The decrease in the value of will reduce the temperature of the radiator. The lower the temperature of the radiator, the input energy of the chip will be transferred to the radiator, reducing part of the energy that increases the temperature of the chip, forming a positive feedback regulation.

[0040] The communication equipment provided by this invention utilizes a heat dissipation system using an aluminum-based vapor chamber phase-change heat sink with fins and micro-protrusions. This heat sink not only has a high thermal conductivity for achieving a uniform temperature, but also offers excellent convective heat transfer performance and high radiation intensity. Compared to traditional router cooling systems, this system can make routers thinner and more aesthetically pleasing, avoids dust accumulation caused by openings, and provides heat dissipation for high-power chips, ensuring normal operation at 5G and higher chip powers.

[0041] Example 3

[0042] The aluminum-based vapor chamber heat sink provided by the present invention is applied to small communication base stations. At present, the chip power of small communication base stations is relatively low, and the heat dissipation path is simple. The base station shell is made of metal material, and the energy of the internal chip is transferred to the surface of the chassis through heat sinks or heat dissipation ribs, and heat convection is carried out with the air. The current base station power is relatively low, and metal materials can meet the chip's heat dissipation and heat dissipation capabilities. With the advent of 5G, the chip power will increase and relying solely on metal materials for temperature uniformity will not be able to meet the requirements. Therefore, using an aluminum-based vapor chamber heat sink as the shell will solve this problem. This aluminum-based vapor chamber heat sink The thermal conductivity of the hot plate radiator is dozens of times that of the metal heat sink with fins. The surface micro-protrusions processed between the fins increase the flow velocity in the mainstream area, increase the specific surface area, and have better convective heat transfer performance than metal heat sinks. After the aluminum-based heat sink is sprayed with nano-carbon, its surface emissivity is close to 1, while the surface emissivity of the aluminum profile is between 0.05-0.2. This aluminum-based heat sink greatly improves the radiation heat transfer capacity. Based on the above points, the aluminum-based heat sink can be used in 5G small base stations with larger power chips and has better heat dissipation effect.

[0043] The above embodiments are merely preferred embodiments of the present invention, and the scope of protection of the present invention is not limited to the above embodiments. All technical solutions that fall within the scope of protection of the present invention are within the scope of protection of the present invention. It should be noted that improvements and modifications that can be made by a person skilled in the art without departing from the principles of the present invention are also considered to be within the scope of protection of the present invention.

Claims

1. An aluminum-based vapor chamber heat sink with high heat dissipation efficiency, characterized in that: The invention comprises, from bottom to top, a lower shell plate (101), a sandwich plate (106) and an upper shell plate (104), wherein the upper portion of the lower shell plate (101) is provided with a liquid wick (105); the lower portion of the lower shell plate (101) is provided with ribs (102) with a spacing of 7 mm, a tooth thickness of 3 mm and a tooth height of 3 mm, micro protrusions (103) are provided between adjacent ribs (102), and nano-carbon is sprayed on the surface of the ribs (102); the upper shell plate (104) is larger in size than the sandwich plate (106) and the lower shell plate (101) in length and width, and the upper shell plate (104) is provided with a mounting hole (107).

2. According to claim 1, an aluminum-based vapor chamber heat sink with high heat dissipation efficiency, characterized in that: The lower shell plate (106) has a mounting hole.

3. A communication device, characterized in that: It comprises a first shell (201), a second shell (206), a PCB board (202), an electronic chip (203), a screen cover (204), and a thermal conductive pad (205); The second shell (206) is connected with the aluminum-based heat sink with high heat dissipation efficiency as described in claim 1 or 2 by bolts to form a lower shell, and the heat sink with one end of the rib (102) is exposed to the external environment. The PCB board (202) is located on one side of the first shell (201), and there are electronic devices on one side of the PCB board (202), which are protected by an external shield (204), and the shield (204) is directly connected to the lower shell through a thermally conductive gasket (205).

4. A communication device according to claim 3, characterized in that: The communication device is placed in a direction in which the housing ribs (102) are consistent with gravity.

5. The method for preparing the aluminum-based vapor chamber heat sink with high heat dissipation efficiency according to claim 1 or 2, characterized in that: The entire manufacturing process of the radiator firstly adopts an extrusion process to process the ribs (102), then adopts a plowing method to process the micro-protrusions (103) between the ribs, and finally adopts CNC to process the grooves of the lower shell plate (101) between the micro-protrusions (103), and then adopts a tooth-cutting process to process the groove liquid-absorbing core (105) on the other side of the lower shell plate (101), and the surface of the liquid-absorbing core (105) is treated by blasting fine sand to increase the surface roughness of the liquid-absorbing core (105), and firstly blasts coarse sand on one side of the lower shell plate (101) with the rib (102) structure, and then sprays nano-carbon, and then welds the lower shell plate (101), the sandwich plate (106) and the upper shell plate (104) into one, and then vacuumizes, injects liquid, performs secondary exhaust, and welds the head, and finally performs detection and testing.

6. The method for preparing the aluminum-based vapor chamber heat sink with high heat dissipation efficiency according to claim 5, characterized in that: When the micro-protrusions (103) of the ribs (102) are processed by the plowing method, a plowing tool is first modeled and manufactured, and then an isosceles triangle microstructure with a height of 0.55 mm, a width of 0.38 mm, and a spacing of 0.6 mm is cut between the ribs (102) to serve as the micro-protrusions (103).

7. The method for preparing the aluminum-based vapor chamber heat sink with high heat dissipation efficiency according to claim 5, characterized in that: The lower shell plate (101), the sandwich plate (106) and the upper shell plate (104) are all made of 1060 aluminum profiles.

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