Wafer transfer method, apparatus and system

Abstract

A wafer transfer method, apparatus and system, comprising: acquiring a wafer pick-and-place requirement of a wafer processing position B; executing the wafer pick-and-place requirement of a wafer processing position Bx, and acquiring the times Ty, Tz respectively required for completing processing of the first two wafer processing positions By, Bz, wherein Ty<Tz; determining whether the times Ty, Tz meet a preset condition; and if the preset condition is met, first executing the wafer pick-and-place requirement of the wafer processing position By; and otherwise, returning to a wafer exchange position A to execute the wafer pick-and-place requirement. The wafer transfer method of the present invention performs determination by calculating the times required for wafer processing positions, the round-trip time of a wafer transfer mechanism, and the like, so as to execute a subsequent wafer pick-and-place action, thereby implementing the function of planning a path in advance. The present invention can be applied to point-to-multipoint and multipoint-to-multipoint wafer transfer modes, ensuring that more wafer transfer requirements can be processed per unit time, and improving the wafer transfer efficiency.

Description

Wafer transfer method, device and system

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on September 12, 2023, with application number 202311178873.7 and invention name “A wafer transfer method, device and system”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present invention relates to the technical field of wafer processing equipment, and in particular to a wafer conveying method, device and system. Background Art

[0003] Currently, in the field of single-wafer transport, wafer transfer mechanisms typically utilize a dual-clamping structure for wafer handling. One clamping structure enables the transfer of a wafer to be processed from wafer exchange station A and places it in wafer processing station B; the other clamping structure enables the transfer of a processed wafer from wafer processing station B and places it in wafer exchange station A. This dual-clamping structure allows efficient wafer transfer in point-to-point transport mode. However, with the rapid development of wafer transport modes, point-to-multipoint and multipoint-to-multipoint transport have become the mainstream. This has led to situations where wafer processing stations Bx and By complete processing at similar times while simultaneously waiting for the wafer transfer mechanism to retrieve and place the wafers. This poor transfer efficiency impacts processing efficiency. Therefore, the current structure is unable to meet the transfer efficiency requirements of the latest transport modes. There is an urgent need to develop new wafer handling mechanisms to meet point-to-multipoint and multipoint-to-multipoint transport requirements.

[0004] Summary of the Invention

[0005] The present invention provides a wafer conveying method, device and system to improve the conveying efficiency of wafers.

[0006] In order to achieve the above object, the present invention provides the following technical solutions:

[0007] In a first aspect, the present invention provides a wafer transfer method, comprising the following steps:

[0008] Obtain wafer pick-and-place requirements for wafer processing position B;

[0009] Execute the wafer pick-and-place requirements of the wafer processing position Bx, and obtain the time required for the two wafer processing positions By and Bz that have completed the processing tasks first to complete the processing tasks as Ty and Tz, Ty <Tz;

[0010] Determine whether the time Ty, Tz and wafer transfer time meet the preset conditions; if the preset conditions are met, go to the wafer processing position By first to execute the wafer pick-and-place requirement; otherwise, return to the wafer exchange position A to execute the wafer pick-and-place requirement.

[0011] Optionally, in the above wafer transfer method, the preset condition includes: Ty≤t1, where:

[0012] t1 is the time required for the wafer transfer device to move between wafer processing positions B.

[0013] Optionally, in the above wafer transfer method, the preset condition further includes: when Ty>t1, and Ty≥T+2t, wherein:

[0014] t1 is the time required for the wafer transfer device to move between wafer processing positions B;

[0015] t is the round-trip time of the wafer transport device from the wafer exchange position A to all wafer processing positions B;

[0016] T is the time required for the wafer transfer device to pick up and place the wafer after it is in place.

[0017] Optionally, in the above wafer transfer method, the preset conditions further include: when Ty>t1, Ty<T+2t, and Tz≥Ty+T+2t, wherein:

[0018] t1 is the time required for the wafer transfer device to move between wafer processing positions B;

[0019] t is the round-trip time of the wafer transport device from the wafer exchange position A to all wafer processing positions B;

[0020] T is the time required for the wafer transfer device to pick up and place the wafer after it is in place.

[0021] Optionally, in the above wafer transfer method, the preset conditions also include: when Ty>t1, Ty<T+2t, Tz<Ty+T+2t, and T 不等 ≥T 等 ,in:

[0022] t1 is the time required for the wafer transfer device to move between wafer processing positions B;

[0023] t is the round-trip time of the wafer transport device from the wafer exchange position A to all wafer processing positions B;

[0024] T 不等 is the processing waiting time for the wafer pick-and-place requirements of the different wafer processing positions By, T 不 等 =T+2t-Ty;

[0025] T 等Waiting time for the wafer to be placed at the wafer processing position By = Ty + 2T + 2t - Tz;

[0026] T is the time required for the wafer transfer device to pick up and place the wafer after it is in place.

[0027] In a second aspect, the present invention provides a wafer transfer device for moving according to any of the above wafer transfer methods, the wafer transfer device comprising a wafer transfer mechanism, a multi-axis robot and a wafer pick-and-place mechanism, wherein:

[0028] The wafer transfer mechanism is used to move between the wafer exchange position and the plurality of wafer processing positions;

[0029] The multi-axis robot is installed on the wafer transfer mechanism to adjust the pick-and-place angle of the wafer pick-and-place mechanism;

[0030] The wafer picking and placing mechanism is arranged on the multi-axis robot to pick and place the wafer.

[0031] Optionally, in the above-mentioned wafer conveying device, the wafer pick-and-place mechanism includes a plurality of pick-and-place clamping structures, and the plurality of pick-and-place clamping structures are arranged from top to bottom.

[0032] Optionally, in the above-mentioned wafer conveying device, the wafer picking and placing mechanism includes four picking and placing clamping structures, namely the first picking and placing clamping structure, the second picking and placing clamping structure, the third picking and placing clamping structure and the fourth picking and placing clamping structure, wherein the first picking and placing clamping structure and the third picking and placing clamping structure form a group, one of which performs the wafer picking action, and the other performs the wafer placing action; the second picking and placing clamping structure and the fourth picking and placing clamping structure form a group, one of which performs the wafer picking action, and the other performs the wafer placing action.

[0033] In a third aspect, the present invention provides a wafer transfer system comprising a wafer exchange station, a plurality of wafer processing stations, a wafer transfer device, and a controller;

[0034] The controller performs the following steps:

[0035] Obtain wafer pick-and-place requirements for wafer processing position B;

[0036] Execute the wafer pick-and-place requirements of the wafer processing position Bx, and obtain the time required for the two leading wafer processing positions By and Bz to complete the processing, which are Ty, Tz, and Ty respectively. <Tz;

[0037] Determine whether the time Ty and Tz meet the preset conditions; if the preset conditions are met, go to the wafer processing position By first to execute the wafer pick-and-place requirements; otherwise, return to the wafer exchange position A to execute the wafer pick-and-place requirements.

[0038] Optionally, in the above-mentioned wafer conveying system, the controller is integrated into the wafer conveying device.

[0039] As can be seen from the above technical solution, the wafer transfer method of the present invention calculates the required time for wafer processing stations and the arrival and return times of the wafer transfer mechanism to determine the subsequent wafer placement and retrieval operations, thus achieving the function of pre-planning the path. It can be applied to point-to-multipoint and multipoint-to-multipoint wafer transfer modes, ensuring that more wafer transfer requests can be handled per unit time, thereby improving wafer transfer efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some examples or embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on the provided drawings without inventive work, and the present invention can also be applied to other similar scenarios based on the provided drawings. Unless otherwise apparent from the language context or otherwise explained, the same reference numerals in the figures represent the same structure or operation.

[0041] FIG1 is a schematic diagram of a conveying route of a single wafer conveying mechanism provided by the prior art;

[0042] FIG2 is a flow chart of a wafer transfer method provided by the prior art.

[0043] FIG3 is a schematic flow chart of a wafer transfer method provided by the present invention;

[0044] FIG4 is a schematic diagram of a wafer conveying route provided by the present invention;

[0045] FIG5 is a schematic flow chart of a wafer transfer method provided by the present invention;

[0046] FIG6 is a schematic diagram of a wafer transfer method provided by the present invention;

[0047] FIG7 is a front view of a wafer conveying device provided by the present invention;

[0048] FIG8 is a side view of a wafer conveying device provided by the present invention;

[0049] In the figure, 100 is a wafer conveying device, 110 is a wafer conveying mechanism, 120 is a multi-axis robot, 130 is a wafer pick-and-place mechanism, 131 is a first pick-and-place clamping structure, 132 is a second pick-and-place clamping structure, 133 is a third pick-and-place clamping structure, and 134 is a fourth pick-and-place clamping structure. DETAILED DESCRIPTION

[0050] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It will be understood that the specific embodiments described herein are intended only to explain the relevant invention and are not intended to limit the invention. The embodiments described are merely some embodiments of the present invention, not all embodiments. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are intended to fall within the scope of protection of the present invention.

[0051] As shown in Figures 1 and 2, the single-wafer conveying mechanism 10 is mainly composed of a multi-axis robot 11 and a wafer pick-and-place mechanism 12. The wafer pick-and-place mechanism 12 is composed of two pick-and-place clamping structures M and N. The multi-axis robot 11 can move linearly or rotationally on the X, Y, and Z axes to realize the mutual movement of the wafer pick-and-place mechanism 12 from the wafer exchange position A to the wafer processing position B. After reaching the position, the wafer pick-and-place action can be performed. The two pick-and-place clamping structures M and N can each realize the action of taking a wafer and placing a wafer. The two pick-and-place clamping structures M and N have clear division of labor. One clamping structure M is specifically responsible for taking the processed wafer from the wafer processing position B and placing the processed wafer on the wafer exchange position A. The other clamping structure N is specifically responsible for taking the wafer to be processed from the wafer exchange position A and placing the wafer to be processed on the wafer processing position B.

[0052] The main conveying mode adopted by the single-chip wafer conveying mechanism 10 is as follows: after receiving the need to pick up and place a wafer from the wafer processing position B, the wafer conveying mechanism is at the wafer exchange position A, and the pick-and-place clamping structure M takes out a wafer P to be processed. After arriving at the wafer processing position B, another pick-and-place clamping structure N takes out the processed wafer Q, and the clamping structure M carrying the wafer P to be processed puts the wafer P to be processed into the processing area. After completion, the single-chip wafer conveying mechanism 10 moves to the wafer exchange position A, and the empty wafer clamping structure M takes out a wafer P to be processed, and the clamping structure N carrying the processed wafer places the wafer Q into the wafer storage area. Then, the pick-and-place demand of the wafer processing position B is received again, and the above actions are repeated to pick up and place the wafer. If there are multiple wafer exchange or processing stations, the single-wafer transfer mechanism 10, which uses a dual-gripping structure, can only handle point-to-point wafer transfer. This means that when a wafer processing station Bn (n is 1, 2, 3, etc.) issues a pick-and-place request, the wafer transfer mechanism 10 is already processing a wafer from another processing station Bx. The mechanism must wait for the wafer processing station Bx to complete its pick-and-place request, then return to wafer exchange station A to retrieve a new wafer to be processed before processing the request from the wafer processing station Bn. This results in overall wafer transfer efficiency failing to keep up with processing efficiency.

[0053] For the above reasons, embodiments of the present invention disclose a wafer transfer method. Referring to FIGS. 3 and 8, in this wafer transfer method, a pick-and-place clamping device picks up two wafers to be processed, namely a first wafer to be processed P1 and a second wafer to be processed P2, and two processed wafers Q, namely a first wafer Q1 and a second wafer Q2. And embodiments of the present invention only introduce the above quantity as an example, and the wafer transfer method of embodiments of the present invention can also transfer other quantities of wafers. The wafer pick-and-place mechanism 130 includes four pick-and-place clamping structures, namely a first pick-and-place clamping structure 131, a second pick-and-place clamping structure 132, a third pick-and-place clamping structure 133, and a fourth pick-and-place clamping structure 134. Among them, the first pick-and-place clamping structure 131 and the third pick-and-place clamping structure 133 are a group, one of which performs the wafer picking action and the other performs the wafer placing action; the second pick-and-place clamping structure 132 and the fourth pick-and-place clamping structure 134 are a group, one of which performs the wafer picking action and the other performs the wafer placing action. The transfer method includes the following steps:

[0054] Step S1: Obtain the wafer pick-and-place requirements at the wafer processing position B. The wafer transfer device is at the wafer exchange position A; the pick-and-place clamping structure picks up two wafers to be processed, namely a first wafer to be processed P1 and a second wafer to be processed P2; after reaching the wafer processing position Bx, the pick-and-place clamping structure picks up the first wafer Q1 that has been processed at the wafer processing position Bx, and the pick-and-place clamping structure carrying the first wafer to be processed P1 places the first wafer to be processed P1 at the wafer processing position Bx for processing.

[0055] Step S2: Execute the wafer pick-and-place requirements at the wafer processing position Bx, and obtain the time required for the two wafer processing positions By and Bz that have completed the processing tasks to complete the processing tasks, namely Ty and Tz, respectively, where Ty < Tz. At this time, the time Ty and Tz (Ty < Tz) required for the wafer processing positions By and Bz to complete the processing are automatically obtained, for example, by setting a timer; or obtained by setting a position sensor to judge and plan the path of the wafer transfer mechanism.

[0056] It should be noted here that in the embodiments of the present application, By and Bz are only used to indicate two wafer processing positions that have completed the processing tasks first, and there is no special requirement for the arrangement relationship between the two wafer processing positions that have completed the processing tasks first, and it is only based on the time to complete the processing tasks. Among them, Ty < Tz is defined to distinguish the sizes.

[0057] Step S3: Judge whether the times Ty and Tz meet the preset conditions; if they meet the preset conditions, then enter Step S4: First go to the wafer processing position By to execute the wafer pick-and-place requirements; otherwise, enter Step S5, as shown in FIGS. 3 to 6.

[0058] In step S3 , the preset conditions include: Ty≤t1, where t1 is the time required for the wafer transfer device to move between wafer processing positions B. When there are z wafer processing positions, the time required for movement between all wafer processing positions is t1.

[0059] At this time, step S3 includes step S31: when Ty≤t1; that is, after the wafer processing position Bx completes the wafer pick-and-place requirement, when it moves to the wafer processing position By, the processing task of the wafer processing position By is completed, and the wafer pick-and-place requirement has been issued. At this time, the wafer conveying mechanism will first go to the wafer processing position By to execute the wafer pick-and-place requirement, and the pick-and-place clamping structure will take out the wafer that has been processed by the wafer processing position By, and the pick-and-place clamping structure carrying the wafer to be processed will place the wafer to be processed into the wafer processing position By for processing. The wafer conveying mechanism then returns to the wafer exchange position A, and then goes to the wafer processing position Bz to execute. After completion, the time required for the two leading wafer processing positions to complete the processing tasks is obtained again, as shown in step ① in Figure 6.

[0060] In step S3, the preset conditions include: when Ty>t1, and Ty≥T+2t, where: t1 is the time required for the wafer conveyor to move between wafer processing positions B; t is the time required for the wafer conveyor to travel from wafer exchange position A to all wafer processing positions B; T is the time required for the wafer conveyor to perform a pick-and-place operation after it is in place.

[0061] At this time, step S3 includes S32: when Ty≥T+2t; that is, after the wafer processing position Bx completes the wafer pick-up and placement requirements, it returns to the wafer exchange position A to pick up and place the wafer, and then runs to By, the processing of the wafer processing position By has not been completed. At this time, after the wafer conveying mechanism moves to the wafer exchange position A, the empty wafer pick-up and placement clamping structure takes out a wafer to be processed, and the pick-up and placement clamping structure carrying the processed wafer places the wafer into the wafer storage area. Then go to the wafer processing position By to wait for the wafer pick-up and placement requirements. After completion, obtain the time required for the two leading wafer processing positions to complete the processing tasks again, as shown in step ② in Figure 6; otherwise, when Ty<T+2t, enter step S33.

[0062] In step S3, the preset conditions include: when Ty>t1, Ty<T+2t, and Tz≥Ty+T+2t, where: t1 is the time required for the wafer conveyor to move between the wafer processing positions B; t is the time required for the wafer conveyor to travel from the wafer exchange position A to all wafer processing positions B; T is the time required for the wafer conveyor to perform a pick-and-place operation after the wafer conveyor is in place.

[0063] At this time, step S3 includes S33: when Tz≥Ty+T+2t; that is, after the wafer processing position By completes the wafer pick-up and placement requirements, it returns to the wafer exchange position A to pick up and place the wafer, and then runs to Bz, the processing of the wafer processing position Bz has not been completed. At this time, in order to reduce the number of times the wafer conveying mechanism moves, the wafer conveying mechanism will first go to the wafer processing position By to execute the wafer pick-up and placement requirements; the pick-up and placement clamping structure takes out the wafer that has completed the processing task of the wafer processing position By, and the pick-up and placement clamping structure carrying the wafer to be processed puts the wafer to be processed into the wafer processing position By for processing. Then the wafer conveying mechanism returns to the wafer exchange position A, and then goes to the wafer processing position Bz to execute. After completion, the time required for the two leading wafer processing positions to complete the processing tasks is obtained again, as shown in step ③ in Figure 6; otherwise, it enters step S34.

[0064] In step S3, the preset conditions include: when Ty>t1, Ty<T+2t, Tz<Ty+T+2t, and T 不等 ≥T 等 , where: t1 is the time required for the wafer transport device to move between wafer processing positions B; t is the round-trip time for the wafer transport device from wafer exchange position A to all wafer processing positions B; T 不等 is the processing waiting time for the wafer pick-and-place requirements of the different wafer processing positions By, T 不等 =T+2t-Ty; T 等 T is the processing waiting time for the wafer to be placed at the wafer processing position By. 等 =Ty+2T+2t-Tz; T is the time required for the wafer transfer device to pick up and place the wafer after it is in place, as shown in step ④ in Figure 6;.

[0065] Step S3 also includes step S34: when T 不等 ≥T 等 When the wafer is ready, the process wastes a lot of time, that is, first return to the wafer exchange position A and then go to the wafer processing position By to pick and place the wafer, and then return to the wafer exchange position A; otherwise, go to step S5 and return to the wafer exchange position A to pick and place the wafer, as shown in step ⑤ in Figure 6.

[0066] If the wafer processing position By does not wait for the wafer pick-up and placement requirements, it returns to the wafer exchange position A first, and then moves to the wafer processing position By. The processing task of the wafer processing position By has been completed and is waiting for wafer pick-up and placement. The processing waiting time is T 不等 =T+2t-Ty.

[0067] If the wafer processing position By is waiting for the wafer pick-up and placement requirements, it will first move to the wafer processing position By to pick up and place the wafer at the wafer processing position By. However, due to the continuous completion of the wafer pick-up and placement requirements of the wafer processing positions Bx and By, the pick-up and placement clamping structure of the wafer conveyor mechanism is in a full state, and it must return to the wafer exchange position A to replenish the wafers to be processed and store the processed wafers. At this time, the processing task of the wafer processing position Bz has been completed and is waiting for wafer pick-up and placement. The processing process waiting time is T 等 =Ty+2T+2t-Tz.

[0068] Step S4: First go to the wafer processing position By to perform wafer pick-and-place requirements.

[0069] Step S5: Return to wafer exchange position A to execute wafer pick-and-place requirements.

[0070] The wafer transfer method of the present invention calculates the wafer processing station's required time and the wafer transfer mechanism's return wait time, then executes subsequent wafer placement operations, achieving pre-planned paths. It can be applied to both point-to-multipoint and multipoint-to-multipoint wafer transfer modes, ensuring that more wafer transfer requests can be processed per unit time, thereby improving wafer transfer efficiency.

[0071] Through the improvement of the wafer transfer structure and the unique wafer transfer method, it can meet more wafer transportation needs, be applied to various wafer processing fields, and replace the original wafer transfer mechanism.

[0072] An embodiment of the present invention also discloses a wafer conveying device, as shown in Figures 4 and 6, which is used to move according to the above-mentioned wafer conveying method. The wafer conveying device 100 includes a wafer conveying mechanism 110, a multi-axis robot 120 and a wafer pick-and-place mechanism 130, wherein: the wafer conveying mechanism 110 is used to move between a wafer exchange position and multiple wafer processing positions; the multi-axis robot 120 is arranged on the wafer conveying mechanism 110 to adjust the pick-and-place angle of the wafer pick-and-place mechanism 130; the wafer pick-and-place mechanism 130 is arranged on the multi-axis robot 120 to pick and place wafers.

[0073] If the preset conditions are met, step S4 is entered, and the wafer is first taken to the wafer processing position By to execute the wafer pick-up and placement requirements. At this time, the wafer conveying mechanism 110 drives the wafer conveying device 100 to move to the wafer processing position By; otherwise, step S5 is entered to return to the wafer exchange position A to execute the wafer pick-up and placement requirements. At this time, the wafer conveying mechanism 110 drives the wafer conveying device 100 to move to the wafer exchange position A.

[0074] In order to improve the pick-and-place efficiency of the wafer pick-and-place mechanism 130, in some embodiments of the present invention, the wafer pick-and-place mechanism 130 includes a plurality of pick-and-place clamping structures, and the plurality of pick-and-place clamping structures are arranged from top to bottom. Or the wafer conveying device 100 is also provided with a structure for storing wafers, and the wafers to be processed are taken out from the wafer exchange position. The wafer pick-and-place mechanism 130 includes four pick-and-place clamping structures, namely a first pick-and-place clamping structure 131, a second pick-and-place clamping structure 132, a third pick-and-place clamping structure 133 and a fourth pick-and-place clamping structure 134, wherein the first pick-and-place clamping structure 131 and the third pick-and-place clamping structure 133 are a group, one of which performs the wafer picking action and the other performs the wafer placing action; the second pick-and-place clamping structure 132 and the fourth pick-and-place clamping structure 134 are a group, one of which performs the wafer picking action and the other performs the wafer placing action.

[0075] The terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include one or more of the features.

[0076] The present invention also discloses a wafer transfer system, comprising a wafer exchange station, a plurality of wafer processing stations, a wafer transfer device as described above, and a controller; the controller performs the following steps:

[0077] Obtain wafer pick-and-place requirements for wafer processing position B;

[0078] Execute the wafer pick-and-place requirements of the wafer processing position Bx, and obtain the time required for the two leading wafer processing positions By and Bz to complete the processing, which are Ty, Tz, and Ty respectively. <Tz;

[0079] Determine whether the time Ty and Tz meet the preset conditions; if the preset conditions are met, go to the wafer processing position By first to execute the wafer pick-and-place requirements; otherwise, return to the wafer exchange position A to execute the wafer pick-and-place requirements.

[0080] The controller includes a processor and memory, wherein the memory stores an operating program; the processor executes the above steps according to the operating program stored in the memory. The controller can be integrated into the wafer transfer device. Alternatively, the controller can be used as a mobile terminal, such as a mobile phone, laptop, PDA, desktop computer, or other terminal device, to coordinate control.

[0081] It should be noted that, for ease of description, only the parts related to the invention are shown in the drawings. In the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other.

[0082] The above description is only a preferred embodiment of the present invention and an illustration of the technical principles used, and is not intended to limit the present invention. For those skilled in the art, the present invention can be modified and varied in various ways. The scope of the invention involved in the present invention is not limited to the technical solutions formed by a specific combination of the above-mentioned technical features, but should also cover other technical solutions formed by any combination of the above-mentioned technical features or their equivalent features without departing from the above-mentioned inventive concept. For example, the above-mentioned features are replaced with the technical features with similar functions disclosed in the present invention (but not limited to) by each other to form a technical solution.

Claims

1. A wafer transfer method, characterized in that: The following steps are involved: Obtain wafer pick-and-place requirements for wafer processing position B; Execute the wafer placement requirements of the wafer processing position Bx, and obtain the time Ty, Tz, Ty required for the two wafer processing positions By and Bz to complete the processing tasks first <Tz; Determine whether Ty, Tz and wafer transfer time meet preset conditions; If the preset conditions are met, go to the wafer processing position By to execute the wafer pick-and-place requirements; Otherwise, return to wafer exchange position A to execute wafer pick-and-place requirements.

2. The wafer transfer method according to claim 1, wherein: The preset conditions include: Ty≤t1, where: t1 is the time required for the wafer transfer device to move between wafer processing positions B.

3. The wafer transfer method according to claim 1, wherein: The preset conditions also include: when Ty>t1, and Ty≥T+2t, where: t1 is the time required for the wafer transfer device to move between wafer processing positions B; t is the round-trip time of the wafer transfer device from the wafer exchange position A to all wafer processing positions B; T is the time required for the wafer transfer device to pick up and place the wafer after it is in place.

4. The wafer transfer method according to claim 1, wherein: The preset conditions also include: when Ty>t1, Ty<T+2t, and Tz≥Ty+T+2t, where: t1 is the time required for the wafer transfer device to move between wafer processing positions B; t is the round-trip time of the wafer transfer device from the wafer exchange position A to all wafer processing positions B; T is the time required for the wafer transfer device to pick up and place the wafer after it is in place.

5. The wafer transfer method according to claim 1, wherein: The preset conditions also include: when Ty>t1, Ty<T+2t, Tz<Ty+T+2t, and T 不等 ≥T 等 ,in: t1 is the time required for the wafer transfer device to move between wafer processing positions B; t is the round-trip time of the wafer transfer device from the wafer exchange position A to all wafer processing positions B; T is the time required for the wafer transfer device to pick up and place the wafer after it is in place; T 不等 is the processing waiting time of the wafer pick-and-place requirements of the different wafer processing positions By, T 不 等 =T+2t-Ty; T 等 The processing waiting time for waiting for the wafer pick-and-place requirement of the wafer processing position By is =Ty+2T+2t-Tz.

6. A wafer conveying device, characterized in that: Used to move according to the wafer transfer method according to any one of claims 1 to 5, the wafer transfer device comprises a wafer transfer mechanism, a multi-axis robot and a wafer pick-and-place mechanism, wherein: The wafer transfer mechanism is used to move between a wafer exchange position and a plurality of wafer processing positions; The multi-axis robot is arranged on the wafer conveying mechanism to adjust the pick-and-place angle of the wafer pick-and-place mechanism; The wafer picking and placing mechanism is arranged on the multi-axis robot to pick and place wafers.

7. The wafer conveying device according to claim 6, characterized in that: The wafer picking and placing mechanism comprises a plurality of picking and placing clamping structures, and the plurality of picking and placing clamping structures are arranged from top to bottom.

8. The wafer conveying device according to claim 7, characterized in that: The wafer picking and placing mechanism includes four picking and placing clamping structures, namely a first picking and placing clamping structure, a second picking and placing clamping structure, a third picking and placing clamping structure and a fourth picking and placing clamping structure, wherein the first picking and placing clamping structure and the third picking and placing clamping structure form a group, one of which performs the wafer picking action, and the other performs the wafer placing action; the second picking and placing clamping structure and the fourth picking and placing clamping structure form a group, one of which performs the wafer picking action, and the other performs the wafer placing action.

9. A wafer transfer system, characterized in that: It comprises a wafer exchange position, a plurality of wafer processing positions, a wafer conveying device as claimed in any one of claims 6 to 8, and a controller; The controller performs the following steps: Obtain wafer pick-and-place requirements for wafer processing position B; Execute the wafer placement requirements of the wafer processing position Bx, and obtain the time required for the two leading wafer processing positions By and Bz to complete the processing as Ty, Tz, Ty respectively. <Tz; Determine whether the time Ty and Tz meet the preset conditions; if the preset conditions are met, go to the wafer processing position By first to execute the wafer pick-up and placement requirements; otherwise, return to the wafer exchange position A to execute the wafer pick-up and placement requirements.

10. The wafer transfer system according to claim 9, wherein: The controller is integrated on the wafer conveying device.

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