Semiconductor structure and manufacturing method therefor, radio frequency apparatus, and electronic device
WO2025055734A1PCT designated stage expired Publication Date: 2025-03-20HUAWEI TECH CO LTD
-1 Cites -1 Cited by
Patent Information
- Application Number
- PCT/CN2024/115282
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-09-11
- Filing Date
- 2024-08-28
- Publication Date
- 2025-03-20
Smart Images

Figure CN2024115282_20032025_PF_FP_ABST
Abstract
A semiconductor structure and a manufacturing method therefor, a radio frequency apparatus, and an electronic device, aiming at solving the problem of low backoff efficiency. An active region structure (201) is arranged on a substrate (101), the active region structure (201) comprises a barrier layer (202) and a channel layer (203) which are stacked, an electrode layer (301) is stacked on the active region structure (201), the electrode layer (301) comprises a first electrode (302) and a second electrode (303) spaced apart from each other, and the first electrode (302) and the second electrode (303) are both connected to the barrier layer (202); in a direction parallel to a current, the width of an interface (204) of the channel layer (203) and the barrier layer (202) in a direction perpendicular to the current gradually decreases, and in an on state, the flow velocity of electrons gradually increases as the width of the interface (204) decreases, so that the electrons can reach a saturation drift velocity more quickly, thereby obtaining a saturation current, decreasing knee point voltage, and improving the backoff efficiency of the semiconductor structure.
Need to check novelty before this filing date? Find Prior Art