Mounting device for electronic component and mounting method for electronic component

Abstract

This mounting device (10) for an electronic component (60) comprises a stage (11), a mounting head (21), an infrared camera (41), and a first infrared source (31). The stage (11) has a main surface (11A) on which a substrate (50) can be placed. The mounting head (21) is for mounting the electronic component (60) on the substrate (50). The infrared camera (41) can detect infrared light. The first infrared source (31) can emit at least infrared light. The mounting head (21) is movable within a two-dimensional range parallel to the main surface (11A). The infrared camera (41) can photograph the inside of the mounting region of the electronic component (60).

Description

Electronic component mounting device and electronic component mounting method

[0001] The present disclosure relates to an electronic component mounting device and an electronic component mounting method.

[0002] The component mounting system described in Patent Document 1 includes a solder printing device, an adhesive dispensing device, an inspection device, and a component mounting machine. A board on which an electronic component is to be mounted undergoes various processes while being transported between devices arranged along a transport line. The solder printing device prints a predetermined amount of solder onto the electrode pattern of the board. The adhesive dispensing device applies adhesive to predetermined locations on the board. The inspection device inspects the solder printing condition on the board and the adhesive application condition on the board. The component mounting machine mounts electronic components onto boards that have been determined to be non-defective by the inspection device.

[0003] JP 2018-182070 A

[0004] In a component mounting system such as that described in Patent Document 1, the component mounting machine and the inspection device are separate devices. Therefore, in order to complete both the mounting of electronic components on a board and the inspection, it is necessary to transport the board between each device. Therefore, transporting the board requires time and effort.

[0005] In order to solve the above problems, the present disclosure provides an electronic component mounting device comprising: a stage having a main surface on which a substrate can be placed; a mounting head for mounting electronic components on the substrate; an infrared camera capable of detecting infrared rays; and a first infrared source capable of emitting at least infrared rays, wherein the mounting head is movable within a two-dimensional range parallel to the main surface, and the infrared camera is capable of capturing images within the mounting area of ​​the electronic components.

[0006] In addition, in order to solve the above-mentioned problems, the present disclosure provides a method for mounting electronic components using a mounting device including a stage having a main surface on which a substrate can be placed, a mounting head for mounting electronic components on the substrate, an infrared camera capable of detecting infrared rays, and an infrared source capable of emitting at least infrared rays, wherein the mounting head is movable within a two-dimensional range parallel to the main surface, and the infrared camera is capable of capturing images within a mounting area for the electronic components, the method comprising: a substrate mounting step of placing the substrate on the main surface of the stage; a mounting step of mounting the electronic components on the substrate via an adhesive layer while moving the mounting head relative to the substrate on the stage; and an inspection step of inspecting the substrate, the electronic components, and the adhesive layer by capturing images of the substrate, the electronic components, and the adhesive layer with the infrared camera while emitting infrared rays from the infrared source after the mounting step has started.

[0007] According to the above configuration, it is possible to save time and effort required to transport the substrate.

[0008] FIG. 1 is a schematic diagram of a mounting device. FIG. 2 is a cross-sectional view of an electronic component. FIG. 3 is a flowchart showing a mounting method for an electronic component. FIG. 4 is a diagram explaining the mounting method for an electronic component. FIG. 5 is a diagram explaining the mounting method for an electronic component. FIG. 6 is a diagram explaining the mounting method for an electronic component. FIG. 7 is a diagram explaining the mounting method for an electronic component. FIG. 8 is a diagram explaining the manner in which infrared rays are incident on an electronic component. FIG. 9 is a schematic diagram of a mounting device according to a modified example. FIG. 10 is a schematic diagram of a mounting device according to a modified example.

[0009] An embodiment of an electronic component mounting device will be described below with reference to the drawings. The drawings may show components enlarged for ease of understanding. The dimensional proportions of the components may differ from those in the actual device or from those in other drawings.

[0010] <Overall Configuration> As shown in FIG. 1 , the mounting device 10 includes a stage 11 and a mounting head 21 .

[0011] The stage 11 is a substantially square plate material. The stage 11 has a main surface 11A on which the substrate 50 can be placed. The main surface 11A of the stage 11 is substantially square. Note that the main surface 11A here is the surface of the stage 11 with the largest area, and is the surface that faces upward when the mounting device 10 is placed on a floor surface or the like. The material of the stage 11 is, for example, metal. Note that, although not shown, the substrate 50 placed on the stage 11 can be fixed so as to be unable to move relative to the stage 11 using a clamping mechanism or the like.

[0012] The mounting head 21 is used to mount electronic components 60 on the substrate 50. In this embodiment, the electronic components 60 are so-called semiconductor electronic components. Specifically, the mounting head 21 has a suction mechanism (not shown). By driving the suction mechanism, the mounting head 21 holds the electronic components 60 by negative pressure. Furthermore, by stopping the suction mechanism, the mounting head 21 releases the electronic components 60.

[0013] The mounting head 21 is supported by an arm and a frame (not shown). The mounting head 21 is movable within a two-dimensional range parallel to the main surface 11A by power from a power source such as an electric motor. The mounting head 21 is movable within a region including a first region A1 in a direction parallel to the main surface 11A. In this embodiment, the first region A1 corresponds to the region in which the substrate 50 is located when the substrate 50 is placed on the stage 11. For example, the first region A1 may be a range of φ300 mm corresponding to a substrate 50 with a diameter of φ300 mm. The mounting head 21 is also movable in a direction perpendicular to the main surface 11A. The movement mechanism of the mounting head 21 is publicly known, as disclosed in, for example, Japanese Patent Application Laid-Open No. 2001-127500, and therefore a detailed description thereof will be omitted.

[0014] The mounting device 10 includes a first infrared source 31, a second infrared source 32, and an infrared camera 41. The first infrared source 31 is capable of emitting infrared light. The infrared light has a wavelength detectable by the infrared camera 41. For example, the first infrared source 31 is an infrared light-emitting diode (LED), a halogen light source, or the like. The first infrared source 31 is located within a movable range of the mounting head 21 in a direction parallel to the main surface 11A. More specifically, the first infrared source 31 is located within an area parallel to the main surface 11A where the electronic component 60 can be mounted on the substrate 50, i.e., within the mounting area of ​​the electronic component 60. In this embodiment, the electronic component 60 can be mounted over the entire main surface of the substrate 50. Therefore, the first infrared source 31 is located within a first range A1. In this embodiment, the first infrared source 31 has a circular shape with a diameter of 300 mm. The first infrared source 31 is positioned directly above the substrate 50 when the substrate 50 is fixed to the stage 11. The first infrared source 31 irradiates the substrate 50 with infrared rays from directly above to below. The infrared rays irradiated from the first infrared source 31 have diffusive properties. In other words, the infrared rays irradiated from the first infrared source 31 do not have strong directionality like so-called laser light.

[0015] As described above, the mounting head 21 is movable in a direction perpendicular to the main surface 11A. The position of the upper end of the mounting head 21 when the mounting head 21 is farthest from the stage 11 in the direction perpendicular to the main surface 11A is defined as the uppermost position P. The first infrared source 31 is located on the side farther from the main surface 11A than the uppermost position P in the direction perpendicular to the main surface 11A, i.e., on the upper side.

[0016] The second infrared source 32 is capable of emitting infrared light with the same wavelength as the first infrared source 31. The wavelength of the infrared light is a wavelength detectable by the infrared camera 41. For example, the second infrared source 32 is an infrared LED. The second infrared source 32 is ring-shaped. Specifically, the second infrared source 32 extends so as to surround the stage 11 from the outside. The ring-shaped imaginary central axis of the second infrared source 32 passes through approximately the center of the main surface 11A of the stage 11. Note that FIG. 1 illustrates only a portion of the left and right sides of the second infrared source 32 when viewed from the end. The second infrared source 32 is located outside the mounting area of ​​the electronic component 60 in a direction parallel to the main surface 11A. In other words, the second infrared source 32 is located outside the first range A1. Here, in a direction perpendicular to the main surface 11A, a range from the position of the first infrared source 31 closest to the main surface 11A to the main surface 11A is defined as a second range A2. The second infrared source 32 is located within a second range A2 in a direction perpendicular to the main surface 11A.

[0017] In this embodiment, the second infrared source 32 irradiates infrared rays toward the center of the ring shape of the second infrared source 32. The infrared rays irradiated from the second infrared source 32 have diffusivity, similar to the infrared rays irradiated from the first infrared source 31. Therefore, the infrared rays irradiated from the second infrared source 32 are incident obliquely on the main surface 11A. In other words, with the substrate 50 fixed to the stage 11, the second infrared source 32 irradiates the substrate 50 with infrared rays from a position oblique to the substrate 50.

[0018] The infrared camera 41 is capable of detecting and capturing infrared rays. That is, the infrared camera 41 is capable of detecting infrared rays emitted from the first infrared source 31 and the second infrared source 32 and reflected by the electronic components 60, etc. The infrared camera 41 is capable of detecting infrared rays with a wavelength of, for example, 1 μm or more and 15 μm or less.

[0019] The infrared camera 41 is supported by an arm and a frame (not shown). The infrared camera 41 is movable within a two-dimensional range parallel to the main surface 11A by power from a power source such as an electric motor. Specifically, the infrared camera 41 is movable within a first range A1, which is the mounting area for the electronic components 60. In other words, the infrared camera 41 is capable of capturing images at least within the mounting area for the electronic components 60. Furthermore, the infrared camera 41 is movable in a direction perpendicular to the main surface 11A. The infrared camera 41 is movable independently from the mounting head 21. Note that a movement mechanism similar to that of the mounting head 21 can be used as the movement mechanism for the infrared camera 41.

[0020] <Regarding Board and Electronic Components> Hereinafter, the electronic components 60 mounted by the mounting device 10 and the board 50 on which the electronic components 60 are mounted will be described.

[0021] As shown in FIG. 1 , the substrate 50 is plate-shaped. The substrate 50 is circular and has a diameter of 300 mm. The substrate 50 is transported onto the stage 11 by a carrier such as a conveyor. The surface of the substrate 50 is covered with an adhesive layer 51. Specifically, when the substrate 50 is fixed to the stage 11, the adhesive layer 51 is located on the side opposite the stage 11. The adhesive layer 51 is made of an organic material such as silicone resin, epoxy resin, or polyimide resin. The thickness of the adhesive layer 51 is 20 μm or less. The thickness of the adhesive layer 51 is, for example, 5 μm, and more preferably 2.5 μm. An electronic component 60 is mounted on the substrate 50 via the adhesive layer 51.

[0022] As shown in FIG. 2 , the electronic component 60 includes a substrate 61, a barrier metal 62, and a wiring layer 63. The overall thickness of the electronic component 60 is, for example, 50 μm. The main component of the substrate 61 is metallic silicon. That is, the material of the substrate 61 is a material that can transmit infrared rays. Note that "transmissive" means that the maximum transmittance for infrared rays with wavelengths of 1 μm or more and 15 μm or less is 40% or more. Furthermore, light transmittance depends on the band gap inherent to a material. In other words, light with a wavelength that is equal to or less than the material's band gap can transmit through the material. For example, the band gap of metallic silicon is 1.1 eV. Therefore, light with a wavelength of 1100 nm or more is significantly transmitted through silicon.

[0023] The barrier metal 62 is located on the surface of the substrate 61. The barrier metal 62 is interposed between the wiring layer 63 and the substrate 61. The barrier metal 62 is a thin film. The wiring layer 63 is located on the surface of the substrate 61 via the barrier metal 62. The material of the wiring layer 63 is a conductive metal such as aluminum. In other words, infrared rays do not pass through the wiring layer 63. When the electronic component 60 is mounted on the substrate 50, it is mounted so that the wiring layer 63 faces the substrate 50.

[0024] 3, the mounting method of the electronic component 60 includes a substrate mounting step S11, a mounting step S12, an inspection step S13, and a retraction step S14. The mounting method of the electronic component 60 is performed using a mounting device 10.

[0025] When mounting electronic components 60 on substrate 50, first, a substrate mounting step S11 is performed. As shown in Fig. 4 , in substrate mounting step S11, substrate 50 having adhesive layer 51 formed on its surface is mounted on main surface 11A of stage 11 using a conveyor or the like (not shown). At this time, substrate 50 is mounted so that adhesive layer 51 is on the opposite side from stage 11, i.e., the upper side. Then, substrate 50 is fixed on main surface 11A with a clamp or the like. Note that mounting head 21 and infrared camera 41 are not shown in Fig. 4 .

[0026] Next, as shown in FIG. 3 , a mounting step S12 is performed. As shown in FIG. 5 , in the mounting step S12, the mounting head 21 is moved relative to the substrate 50 on the stage 11, while mounting the electronic component 60 on the substrate 50. Specifically, first, the suction mechanism is driven outside the first range A1 to hold the electronic component 60 with the mounting head 21. Then, while holding the electronic component 60, the mounting head 21 is moved within the first range A1 to a position where the electronic component 60 is to be mounted. Note that at this time, the mounting head 21 is positioned within the second range A2 in a direction perpendicular to the main surface 11A. Furthermore, the mounting head 21 is lowered so that the electronic component 60 is placed toward the substrate 50. Then, the suction mechanism is stopped to release the electronic component 60 from the mounting head 21. As a result, the electronic component 60 is placed on the substrate 50. Note that after releasing the electronic component 60, the mounting head 21 preferably moves from directly above the electronic component 60. In the mounting step S12, this series of steps is repeatedly performed, thereby mounting a plurality of electronic components 60 on the substrate 50. Note that the infrared camera 41 is not shown in FIG.

[0027] Next, as shown in FIG. 3 , an inspection step S13 is performed. As shown in FIG. 6 , in the inspection step S13, the first infrared source 31 and the second infrared source 32 emit infrared rays, and the infrared camera 41 captures an image of the electronic component 60 mounted on the substrate 50 and its surroundings. Then, the infrared camera 41 captures an image of the electronic component 60, thereby inspecting the substrate 50, the electronic component 60, and the adhesive layer 51 between the substrate 50 and the electronic component 60. Specifically, the infrared camera 41 is first moved within the first range A1 and directly above the electronic component 60 to be imaged. At this time, the infrared camera 41 is positioned within the second range A2 in a direction perpendicular to the main surface 11A. In this state, the infrared camera 41 is used to capture an image of the electronic component 60 and its surroundings. After capturing an image of one electronic component 60, the infrared camera 41 is moved directly above another electronic component 60 that has already been mounted on the substrate 50 but has not yet been imaged. In this way, in the inspection step S13, the inspection is performed by repeatedly moving and photographing the infrared camera 41. Note that, using the images photographed by the infrared camera 41, it is possible to inspect, for example, the appearance of the electronic component 60 after mounting, the mounting position accuracy of the electronic component 60, the presence or absence of voids in the adhesive layer 51, the presence or absence of foreign matter, etc.

[0028] Furthermore, the inspection process S13 is started after the start of the mounting process S12 for the first electronic component 60. For convenience, Fig. 3 illustrates the inspection process S13 as being performed after the mounting process S12. However, in this embodiment, the inspection process S13 is performed for the electronic component 60 already mounted on the substrate 50 in parallel with the mounting head 21 performing the mounting process S12 for the electronic component 60 that has not yet been mounted on the substrate 50.

[0029] Next, as shown in Fig. 3, after the mounting step S12 for all electronic components 60 to be mounted on the substrate 50 is completed, a retraction step S14 is performed. As shown in Fig. 7, in the retraction step S14, the mounting head 21 is moved out of the first range A1. Note that, in this embodiment, the retraction step S14 is performed in parallel with the inspection step S13, in which the infrared camera 41 inspects the electronic components 60 already mounted on the substrate 50. Note that, when the inspection step S13 for all electronic components 60 is completed, the infrared camera 41 is also moved out of the first range A1.

[0030] 8 , the infrared rays IR1 emitted from the first infrared source 31 mainly travel straight in a direction perpendicular to the main surface 11A. However, the infrared rays IR1 do not pass through the wiring layer 63. Therefore, the infrared rays IR1 do not reach a location directly below the wiring layer 63.

[0031] On the other hand, as described above, the infrared rays IR2 emitted from the second infrared source 32 are diffused and incident obliquely on the main surface 11A. That is, the infrared rays IR2 emitted from the second infrared source 32 are also incident obliquely on the electronic component 60. Therefore, a portion of the infrared rays IR2 can reach the adhesive layer 51 without colliding with the wiring layer 63. The infrared rays IR2 that reach the adhesive layer 51 are reflected by the surfaces of the adhesive layer 51 and the substrate 50 and detected by the infrared camera 41. Note that in FIG. 8 , infrared rays IR1 represent a portion of the infrared rays emitted from the first infrared source 31. The same is true for the infrared rays IR2.

[0032] <Effects of this embodiment> (1) In the above embodiment, the infrared camera 41 moves within the same range as the first range A1, which is the mounting area for the electronic components 60. That is, the infrared camera 41 can capture images at least within the first range A1. With this configuration, the electronic components 60 can be mounted on the substrate 50 and the image can be captured by the infrared camera 41 without moving the substrate 50 on the stage 11. As a result, the time and effort required to transport the substrate 50 can be saved.

[0033] (2) In the above embodiment, the first infrared source 31 is located farther from the main surface 11A than the uppermost position P in the direction perpendicular to the main surface 11A. In other words, the first infrared source 31 is located in a position that does not interfere with the mounting head 21. This configuration can prevent the control of the movement of the mounting head 21 from becoming complicated.

[0034] (3) In the above embodiment, the first infrared source 31 is located within the first range A1 in a direction parallel to the main surface 11A. Therefore, the first infrared source 31 can easily irradiate the entire substrate 50 on the main surface 11A with infrared rays from directly above the main surface 11A. Furthermore, the second infrared source 32 is located outside the first range A1. That is, the second infrared source 32 can irradiate the substrate 50 at an angle different from that of the first infrared source 31. As a result, the second infrared source 32 can irradiate infrared rays to areas that the infrared rays of the first infrared source 31 cannot reach. In this way, the first infrared source 31 and the second infrared source 32 as a whole can be treated as an omnidirectional, shadowless light source. Furthermore, because the second infrared source 32 is located outside the first range A1, it does not interfere with the mounting head 21 in the mounting process S12.

[0035] (4) In the above embodiment, the second infrared source 32 is located within the second range A2 in the direction perpendicular to the main surface 11A. Therefore, the second infrared source 32 irradiates the substrate 50 with infrared rays at a position closer to the main surface 11A than the first infrared source 31. Therefore, the infrared rays from the second infrared source 32 reach the substrate 50 without being blocked by the first infrared source 31. Specifically, the second infrared source 32 can irradiate the adhesive layer 51 directly below the electronic component 60 with infrared rays.

[0036] (5) In the above embodiment, the mounting head 21 performs the mounting step S12 for the electronic components 60 that have not yet been mounted on the substrate 50, while simultaneously performing the inspection step S13 for the electronic components 60 that have already been mounted on the substrate 50. This configuration makes it possible to shorten the time required from the start of the mounting step S12 to the end of the inspection step S13.

[0037] (6) In the above embodiment, the material of the substrate 61 of the electronic component 60 is a material that is transparent to infrared rays. This configuration is suitable for inspecting the adhesive layer 51 directly below the electronic component 60.

[0038] <Modifications> The above embodiment and the following modifications can be implemented in combination with each other within the scope of technical compatibility.

[0039] <Modifications of the Electronic Component Mounting Apparatus> The configuration of the stage 11 is not limited to the example of the above embodiment. For example, the stage 11 may be circular. Furthermore, the stage 11 does not need to have a mechanism for fixing the substrate 50 as long as the substrate 50 can be placed on the main surface 11A.

[0040] The mounting head 21 only needs to be movable within at least a two-dimensional range parallel to the main surface 11A. Furthermore, the movable range of the mounting head 21 is not limited to the range on the substrate 50. In other words, the first range A1 may include an area outside the substrate 50. Furthermore, the first range A1 may be an area smaller than the area of ​​the substrate 50.

[0041] The mechanism by which the mounting head 21 mounts the electronic component 60 on the substrate 50 is not limited to a suction mechanism. For example, the mounting head 21 may have viscosity, and may be able to mount the electronic component 60 on the substrate 50 by utilizing this viscosity. Alternatively, the mounting head 21 may have a clamping mechanism, and may clamp and hold the electronic component 60 with this mechanism.

[0042] The wavelength of the infrared light detected by the infrared camera 41 in the above embodiment is merely an example. The wavelength detected by the infrared camera 41 can be changed as appropriate in accordance with the transmission characteristics of each infrared light source and the inspection target.

[0043] The infrared camera 41 only needs to be able to capture images of at least the area where the electronic components 60 are mounted. That is, the infrared camera 41 only needs to be able to move in an area including the first range A1 in a direction parallel to the main surface 11A. Furthermore, the infrared camera 41 does not need to be able to move as long as it can capture images of the entire area where the electronic components 60 are mounted with the required resolution.

[0044] In the above embodiment, the configuration of the first infrared source 31 is not limited to the example of the above embodiment. For example, the shape of the first infrared source 31 may be circular, ring-shaped, or the like. Furthermore, the first infrared source 31 does not have to face the main surface 11A as a whole. The first infrared source 31 may be located outside the first range A1.

[0045] The second infrared source 32 may be located within the first range A1 or outside the second range A2. The configuration of the second infrared source is not limited to the example of the above embodiment. For example, in the example shown in FIG. 9 , the second infrared source 33 is ring-shaped. Note that FIG. 9 illustrates only a portion of the second infrared source 33. The second infrared source 33 is located outside the mounting area of ​​the electronic component 60 in a direction parallel to the main surface 11A. That is, the second infrared source 33 is located outside the first range A1. The second infrared source 33 is located at approximately the same position as the first infrared source 31 in a direction perpendicular to the main surface 11A. In the example shown in FIG. 9 , the second infrared source 33 as a whole faces obliquely with respect to the main surface 11A. Furthermore, the second infrared source 33 irradiates infrared light obliquely toward the main surface 11A of the stage 11, which is located on the center side of the ring shape of the second infrared source 33. Therefore, in this modified example, most of the infrared light emitted from the second infrared source 33 is irradiated onto the substrate 50 .

[0046] The second infrared source may be movable. For example, in the example shown in FIG. 10 , the second infrared source 34 is fixed to the infrared camera 41. In this example, the second infrared source 34 is ring-shaped. The lens of the infrared camera 41 is located inside the ring-shaped second infrared source 34. In this example, the second infrared source 34 is movable together with the infrared camera 41. In this configuration, the infrared rays emitted from the second infrared source 34 are less likely to be blocked by the infrared camera 41. In addition, the second infrared source 34 can efficiently emit infrared rays into the shooting range of the infrared camera 41.

[0047] In the above embodiment, the positional relationship between the first infrared source 31 and the second infrared source 32 is not limited. For example, both the first infrared source 31 and the second infrared source 32 may be located outside the first range A1, or may be located within the first range A1. Furthermore, it is sufficient that there is one or more infrared sources, and the second infrared source 32 can be omitted.

[0048] <Modifications to the Substrate and Electronic Components> The configuration of the substrate 50 is not limited to the example of the above embodiment. For example, the material of the substrate 50 may be a material containing glass, SiC, or other synthetic resin as a main component. Furthermore, the shape and dimensions of the substrate 50 may be different from those of the above embodiment. For example, the substrate 50 may be a square plate with a side length of 1000 mm.

[0049] In the above embodiment, the material of the adhesive layer 51 is not limited to the example in the above embodiment. For example, the adhesive layer 51 may contain an insulating filler. The adhesive layer 51 may also be solder or the like. In other words, the main component of the adhesive layer 51 is not limited to an organic substance.

[0050] The configuration of the electronic component 60 is not limited to the example of the above embodiment. For example, the barrier metal 62 can be omitted from the electronic component 60. Furthermore, the electronic component 60 can use an insulating resin or the like instead of the barrier metal 62. The material of the wiring layer 63 is also not limited. The material of the base material 61 can be an infrared-transmitting material such as SiC, GaN, Ge, GaAs, InP, or gallium oxide.

[0051] The surface of the substrate 50 does not have to be covered with the adhesive layer 51. In this case, it is sufficient that the surface of the electronic component 60 that faces the substrate 50 is covered with the adhesive layer 51. In other words, it is sufficient that the electronic component 60 is mounted on the substrate 50 via the adhesive layer 51.

[0052] <Modifications to the Method of Mounting Electronic Components> In the above embodiment, the substrate 50 having the adhesive layer 51 formed on its surface is placed on the main surface 11A of the stage 11, but the adhesive layer 51 may be formed on the top surface of the substrate 50 after the substrate 50 is placed on the main surface 11A of the stage 11. Even in this case, it can be said that the substrate 50 having the adhesive layer 51 formed thereon is placed on the main surface 11A.

[0053] In the above embodiment, the retraction step S14 can be omitted. That is, the mounting head 21 does not need to be moved outside the first range A1. For example, after the mounting step S12 is completed, the mounting head 21 may be moved to a position other than directly above the mounted electronic component 60.

[0054] The inspection process S13 may be started after the mounting process S12 has been completed for all of the electronic components 60. Even in this case, the mounting process S12 and the inspection process S13 can be performed without moving the substrate 50 on the stage 11, thereby saving the time and effort required to transport the substrate 50.

[0055] <Supplementary Notes> The technical concepts that can be derived from the above-described embodiments and modified examples are described below. [1] An electronic component mounting device comprising: a stage having a main surface on which a substrate can be placed, a mounting head for mounting electronic components on the substrate, an infrared camera capable of detecting infrared rays, and a first infrared source capable of emitting at least infrared rays, wherein the mounting head is movable within a two-dimensional range parallel to the main surface, and the infrared camera is capable of capturing images within a mounting area for the electronic components.

[0056] [2] The electronic component mounting device described in [1], wherein the mounting head is movable in a direction perpendicular to the main surface, and when the position of the mounting head when it is farthest from the stage in the direction perpendicular to the main surface is defined as the uppermost position, the first infrared source is located on the side farther from the main surface than the uppermost position in the direction perpendicular to the main surface.

[0057] [3] The electronic component mounting device according to [2], further comprising a second infrared source capable of emitting at least infrared light, the first infrared source being positioned within the mounting area of ​​the electronic component in a direction parallel to the main surface, and the second infrared source being positioned outside the mounting area of ​​the electronic component in a direction parallel to the main surface.

[0058] [4] The electronic component mounting device described in [3], wherein the second infrared source is located within a range from the position of the first infrared source closest to the main surface to the main surface in a direction perpendicular to the main surface.

[0059] [5] A method for mounting electronic components using a mounting device including a stage having a main surface on which a substrate can be placed, a mounting head for mounting electronic components on the substrate, an infrared camera capable of detecting infrared rays, and an infrared source capable of emitting at least infrared rays, wherein the mounting head is movable within a two-dimensional range parallel to the main surface, and the infrared camera is capable of photographing an area within which the electronic components will be mounted, the method comprising: a substrate mounting step of placing the substrate on the main surface of the stage; a mounting step of mounting the electronic components on the substrate via an adhesive layer while moving the mounting head relative to the substrate on the stage; and an inspection step of inspecting the substrate, the electronic components, and the adhesive layer after the start of the mounting step by emitting infrared rays from the infrared source and photographing the substrate, the electronic components, and the adhesive layer with the infrared camera.

[0060] [6] The method for mounting electronic components according to [5], wherein the mounting head performs the mounting process for electronic components that have not yet been mounted on the substrate, while simultaneously performing the inspection process for electronic components that have already been mounted on the substrate.

[0061] [7] The electronic component mounting method according to [5] or [6], wherein the electronic component comprises a substrate and a wiring layer located on a surface of the substrate, and the material of the substrate is a material that is transparent to infrared rays.

[0062] A1: First range; A2: Second range; P: Uppermost position; 10: Mounting device; 11: Stage; 11A: Main surface; 21: Mounting head; 31: First infrared source; 32: Second infrared source; 41: Infrared camera; 50: Substrate; 60: Electronic component;

Claims

1. An electronic component mounting device comprising: a stage having a main surface on which a substrate can be placed; a mounting head for mounting electronic components on the substrate; an infrared camera capable of detecting infrared rays; and a first infrared source capable of emitting at least infrared rays, wherein the mounting head is movable within a two-dimensional range parallel to the main surface, and the infrared camera is capable of capturing images within the mounting area for the electronic components.

2. The electronic component mounting device according to claim 1, wherein the mounting head is movable in a direction perpendicular to the main surface, and when the position of the mounting head when it is farthest from the stage in the direction perpendicular to the main surface is defined as the uppermost position, the first infrared source is located on the side farther from the main surface than the uppermost position in the direction perpendicular to the main surface.

3. The electronic component mounting device according to claim 1 or 2, further comprising a second infrared source capable of emitting at least infrared light, the first infrared source being positioned within the mounting area for the electronic component in a direction parallel to the main surface, and the second infrared source being positioned outside the mounting area for the electronic component in a direction parallel to the main surface.

4. The electronic component mounting device according to claim 3, wherein the second infrared source is located within a range from a position on the first infrared source closest to the main surface to the main surface in a direction perpendicular to the main surface.

5. A method for mounting electronic components using a mounting device comprising: a stage having a main surface on which a substrate can be placed; a mounting head for mounting electronic components on the substrate; an infrared camera capable of detecting infrared rays; and an infrared source capable of emitting at least infrared rays, wherein the mounting head is movable within a two-dimensional range parallel to the main surface, and the infrared camera is capable of photographing an area within which the electronic components will be mounted, the method comprising: a substrate mounting step of mounting the substrate on the main surface of the stage; a mounting step of mounting the electronic components on the substrate via an adhesive layer while moving the mounting head relative to the substrate on the stage; and an inspection step of inspecting the substrate, the electronic components, and the adhesive layer by photographing the substrate, the electronic components, and the adhesive layer with the infrared camera while emitting infrared rays from the infrared source after the start of the mounting step.

6. The method for mounting electronic components according to claim 5, further comprising the step of inspecting electronic components already mounted on the board while the mounting head is performing the mounting step for electronic components not yet mounted on the board.

7. The method for mounting an electronic component according to claim 5 or claim 6, wherein the electronic component comprises a substrate and a wiring layer located on a surface of the substrate, and the substrate is made of a material that is transparent to infrared rays.

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