Electronic device and method for manufacturing electronic device

Abstract

This electronic device includes: a first connection object; a first connection member having a first connecting part connected, on a first side in a thickness direction, to the first connection object and a first loop part linked to the first connecting part, a first metal being used as a principal component of the first connection member; and a second connection member having a second connecting part connected to the first connecting part and a second loop part linked to the second connecting part and spaced apart from the first loop part, a second metal having a different thermoelectric power from that of the first metal being used as a principal component of the second connection member. The first connecting part has: a first peak-shaped section which has a protruding shape on the first side in the thickness direction and which extends in a first direction intersecting the thickness direction; and two first extending sections which extend on both sides in a direction intersecting the first direction.

Description

Electronic device and method for manufacturing the same

[0001] FIELD OF THE DISCLOSURE The present disclosure relates to electronic devices and methods for manufacturing electronic devices.

[0002] Patent Document 1 discloses a semiconductor device as an example of a conventional electronic device. The semiconductor device disclosed in this document includes a plurality of first switching elements and a plurality of second switching elements, which are examples of electronic elements. The semiconductor device is configured as a power module that performs power conversion. Wires are connected to each of the plurality of first switching elements and the plurality of second switching elements.

[0003] Japanese Patent Application Laid-Open No. 2023-89252

[0004] [Summary] For example, in order to detect the temperature of a first switching element or a second switching element, multiple connecting members for thermocouples may be connected. It is preferable that the space required for connecting the multiple connecting members for thermocouples is small. It is desirable to improve the accuracy of temperature detection.

[0005] An object of the present disclosure is to provide an electronic device and a manufacturing method thereof that are improved over conventional devices. In particular, in view of the above-mentioned circumstances, an object of the present disclosure is to provide an electronic device and a manufacturing method thereof that can reduce the space required for connecting multiple connecting members for thermocouples and improve the temperature detection accuracy.

[0006] An electronic device provided by a first aspect of the present disclosure includes: a first connection member having a first connection portion connected to a first side in a thickness direction of the first connection object and a first loop portion connected to the first connection portion, the first connection member being mainly composed of a first metal; and a second connection member having a second connection portion connected to the first connection portion and a second loop portion connected to the second connection portion and spaced from the first loop portion, the second connection member being mainly composed of a second metal having a thermoelectric power different from that of the first metal. The first connection portion has a first peak portion that is convex toward the first side in the thickness direction and extends in a first direction intersecting the thickness direction, and two first extension portions that extend on both sides in a direction intersecting the first direction.

[0007] A method for manufacturing an electronic device provided by a second aspect of the present disclosure includes a step of connecting a first connection member mainly composed of a first metal to a first connection object using a wedge bonding tool, and a step of connecting a second connection member mainly composed of a second metal to a first connection portion, which is the portion of the first connection member connected to the first connection object.

[0008] Other features and advantages of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings.

[0009] FIG. 1 is a plan view showing an electronic device according to a first embodiment of the present disclosure. FIG. 2 is a bottom view showing an electronic device according to a first embodiment of the present disclosure. FIG. 3 is a side view showing an electronic device according to a first embodiment of the present disclosure. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 1. FIG. 5 is a cross-sectional view taken along line V-V in FIG. 1. FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. 1. FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. 1. FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 1. FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. 1. FIG. 10 is a cross-sectional view taken along line XX in FIG. 1. FIG. 11 is a cross-sectional view taken along line XI-XI in FIG. 1. FIG. 12 is a partial plan view showing an electronic device according to a first embodiment of the present disclosure. FIG. 13 is a partial plan view showing an electronic device according to a first embodiment of the present disclosure. FIG. 14 is a partially enlarged plan view showing an electronic device according to a first embodiment of the present disclosure. FIG. 15 is a partially enlarged plan view showing the electronic device according to the first embodiment of the present disclosure. FIG. 16 is a partially enlarged side view showing the electronic device according to the first embodiment of the present disclosure. FIG. 17 is a partially enlarged perspective view showing the electronic device according to the first embodiment of the present disclosure. FIG. 18 is a partially enlarged plan view showing the electronic device according to the first embodiment of the present disclosure. FIG. 19 is a partially enlarged cross-sectional view taken along line XIX-XIX of FIG. 18. FIG. 20 is a partially enlarged side view showing a method for manufacturing the electronic device according to the first embodiment of the present disclosure. FIG. 21 is a partially enlarged cross-sectional view showing a method for manufacturing the electronic device according to the first embodiment of the present disclosure. FIG. 22 is a partially enlarged perspective view showing a method for manufacturing the electronic device according to the first embodiment of the present disclosure. FIG. 23 is a partially enlarged side view showing a method for manufacturing the electronic device according to the first embodiment of the present disclosure. FIG. 24 is a partially enlarged cross-sectional view showing a method for manufacturing the electronic device according to the first embodiment of the present disclosure. FIG. 25 is a partially enlarged cross-sectional view showing a first modified example of the electronic device according to the first embodiment of the present disclosure. FIG. 26 is a partially enlarged cross-sectional view showing a second modified example of the electronic device according to the first embodiment of the present disclosure. Fig. 27 is a partially enlarged plan view showing a third modified example of the electronic device according to the first embodiment of the present disclosure. Fig. 28 is a partially enlarged cross-sectional view taken along line XXVIII-XXVIII in Fig. 27. Fig. 29 is a partially enlarged plan view showing a fourth modified example of the electronic device according to the first embodiment of the present disclosure. Fig. 30 is a partially enlarged cross-sectional view taken along line XXX-XXX in Fig. 29.FIG. 31 is a partially enlarged plan view showing a fifth modified example of the electronic device according to the first embodiment of the present disclosure. FIG. 32 is a partially enlarged cross-sectional view taken along line XXXII-XXXII in FIG. 31 . FIG. 33 is a partially enlarged cross-sectional view showing a sixth modified example of the electronic device according to the first embodiment of the present disclosure. FIG. 34 is a partially enlarged cross-sectional view showing a seventh modified example of the electronic device according to the first embodiment of the present disclosure. FIG. 35 is a partially enlarged plan view showing an eighth modified example of the electronic device according to the first embodiment of the present disclosure. FIG. 36 is a partially enlarged plan view showing a ninth modified example of the electronic device according to the first embodiment of the present disclosure. FIG. 37 is a partially enlarged plan view showing a tenth modified example of the electronic device according to the first embodiment of the present disclosure. FIG. 38 is a partially enlarged plan view showing an eleventh modified example of the electronic device according to the first embodiment of the present disclosure. FIG. 39 is a partially enlarged plan view showing an electronic device according to the second embodiment of the present disclosure. FIG. 40 is a partially enlarged cross-sectional view taken along line XL-XL in FIG. 39 . FIG. 41 is a partially enlarged plan view showing an electronic device according to the third embodiment of the present disclosure. Fig. 42 is a partially enlarged plan view showing an electronic device according to a fourth embodiment of the present disclosure. Fig. 43 is a partially enlarged plan view showing a first modified example of the electronic device according to the fourth embodiment of the present disclosure. Fig. 44 is a partially enlarged plan view showing a second modified example of the electronic device according to the fourth embodiment of the present disclosure. Fig. 45 is a partially enlarged plan view showing an electronic device according to a fifth embodiment of the present disclosure.

[0010] Preferred embodiments of the present disclosure will now be described in detail with reference to the drawings.

[0011] The terms "first," "second," "third," etc. in this disclosure are used for identification purposes only and are not intended to impose any ranking on their objects.

[0012] In this disclosure, unless otherwise specified, "a certain object A is formed on a certain object B" and "a certain object A is formed on a certain object B" include "a certain object A is formed directly on a certain object B" and "a certain object A is formed on a certain object B with another object interposed between the certain object A and the certain object B." Similarly, "a certain object A is disposed on a certain object B" and "a certain object A is disposed on a certain object B" include "a certain object A is disposed directly on a certain object B" and "a certain object A is disposed on a certain object B with another object interposed between the certain object A and the certain object B" unless otherwise specified. Similarly, "a certain object A is located on a certain object B" includes "a certain object A is located on a certain object B with a certain object A in contact with the certain object B" and "a certain object A is located on a certain object B with another object interposed between the certain object A and the certain object B." Furthermore, unless otherwise specified, the phrase "an object A overlaps an object B when viewed in a certain direction" includes "an object A overlaps the entire object B" and "an object A overlaps a part of an object B." Furthermore, in the present disclosure, "a surface A faces in direction B (one side or the other side of direction B)" is not limited to the case where the angle of surface A with respect to direction B is 90°, but also includes the case where surface A is tilted with respect to direction B.

[0013] 1 to 19 show an electronic device according to a first embodiment of the present disclosure. The electronic device A100 of this embodiment includes a plurality of first switching elements 21, a plurality of second switching elements 22, a first connecting member 61, a second connecting member 62, a first connecting member 65, and a second connecting member 66. The electronic device A100 may include a support member 10A, a support member 10B, a first main conductive member 31, a second main conductive member 32, a third main conductive member 33, a plurality of sub-conductive members 41 to 48, a plurality of main connecting members 51A and 51B, a plurality of main connecting members 52A and 52B, a plurality of sub-connecting members 63, 64, 67, and 68, and a sealing resin 7.

[0014] In the present embodiment, each of the plurality of first switching elements 21 and the plurality of second switching elements 22 is an example of a first connection object of the present disclosure, and further an example of an electronic element of the present disclosure.

[0015] The application and specific configuration of the electronic device according to the present disclosure are not limited in any way. The electronic device A100, for example, functions to convert a DC power supply voltage applied to the first main conductive member 31 and the third main conductive member 33 into AC power using a plurality of first switching elements 21 and a plurality of second switching elements 22. The converted AC power is input from the second main conductive member 32 to a power supply target such as a motor. Such an electronic device A100 constitutes part of a power conversion circuit such as an inverter.

[0016] FIG. 1 is a plan view showing the electronic device A100. FIG. 2 is a bottom view showing the electronic device A100. FIG. 3 is a side view showing the electronic device A100. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 1. FIG. 5 is a cross-sectional view taken along line V-V in FIG. 1. FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. 1. FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. 1. FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 1. FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. 1. FIG. 10 is a cross-sectional view taken along line XX in FIG. 1. FIG. 11 is a cross-sectional view taken along line XI-XI in FIG. 1. FIG. 12 is a partial plan view showing the electronic device A100. FIG. 13 is a partial plan view showing the electronic device A100. FIG. 14 is a partially enlarged plan view showing the electronic device A100. Fig. 15 is a partially enlarged plan view showing the electronic device A100. Fig. 16 is a partially enlarged side view showing the electronic device A100. Fig. 17 is a partially enlarged perspective view showing the electronic device A100. Fig. 18 is a partially enlarged plan view showing the electronic device A100. Fig. 19 is a partially enlarged cross-sectional view taken along line XIX-XIX in Fig. 18.

[0017] In these figures, for example, the z direction is an example of the thickness direction in the present disclosure. For example, the first side in the z direction is referred to as the z1 side, and the second side opposite the first side in the z direction is referred to as the z2 side. The x direction is orthogonal to the z direction. For example, the first side in the x direction is referred to as the x1 side, and the second side opposite the x1 side is referred to as the x2 side. The y direction is orthogonal to the z direction and the x direction. For example, the first side in the y direction is referred to as the y1 side, and the second side opposite the y1 side is referred to as the y2 side.

[0018] In Fig. 1, the sealing resin 7 is shown by an imaginary two-dot chain line. The sealing resin 7 is omitted in Figs. 12 to 19. For ease of understanding, Fig. 16 shows the first switching element 21, the first connecting member 61, and the second connecting member 62. For ease of understanding, Fig. 17 shows the first connecting member 61 and the second connecting member 62.

[0019] In this embodiment, the support member 10A includes a first conductive layer 1A, an insulating layer 101, a support layer 102, and a heat dissipation layer 103. However, the specific configuration of the support member 10A is not limited in any way. In this embodiment, for example, the insulating layer 101, the support layer 102, and the heat dissipation layer 103 may form a DBC (Direct Bonded Copper) substrate or an AMB (Active Metal Brazing) substrate. The support member 10A is covered with a sealing resin 7 except for a portion of the heat dissipation layer 103. The support member 10A is located on the x1 side in the x direction.

[0020] The first conductive layer 1A has a first main surface 11A. The first main surface 11A faces the z1 side in the z direction. In the illustrated example, the first main surface 11A is a flat surface. The first conductive layer 1A is made of a conductive material, for example, copper (Cu).

[0021] The insulating layer 101 is located on the z2 side of the first conductive layer 1A in the z direction. The insulating layer 101 includes a portion located between the support layer 102 and the heat dissipation layer 103 in the z direction. The insulating layer 101 may be made of a material with higher thermal conductivity. For example, the insulating layer 101 may be made of ceramics containing aluminum nitride (AlN). The thickness of the insulating layer 101 is thinner than the thickness of the first conductive layer 1A.

[0022] The support layer 102 is located between the insulating layer 101 and the first conductive layer 1A in the z direction. The composition of the support layer 102 includes, for example, Cu (copper). When viewed in the z direction, the support layer 102 is surrounded by the periphery of the insulating layer 101. The support layer 102 is joined to the first conductive layer 1A via, for example, solder. Note that the support layer 102 of the support member 10A may also serve as the first conductive layer 1A.

[0023] The heat dissipation layer 103 is located on the opposite side of the insulating layer 101 from the support layer 102 in the z direction. A portion of the heat dissipation layer 103 is exposed from the sealing resin 7. When the electronic device A100 is in use, for example, a heat sink (not shown) is bonded to the heat dissipation layer 103. The composition of the heat dissipation layer 103 includes Cu (copper). When viewed in the z direction, the heat dissipation layer 103 is surrounded by the periphery of the insulating layer 101.

[0024] In this embodiment, the support member 10B includes a second conductive layer 1B, an insulating layer 101, a support layer 102, and a heat dissipation layer 103. However, the specific configuration of the support member 10B is not limited in any way. In this embodiment, for example, the insulating layer 101, the support layer 102, and the heat dissipation layer 103 may have the same configuration as the insulating layer 101, the support layer 102, and the heat dissipation layer 103 of the support member 10A, and may form a DBC (Direct Bonded Copper) substrate or an AMB (Active Metal Brazing) substrate. The support member 10B is covered with a sealing resin 7 except for a portion of the heat dissipation layer 103. The support member 10B is located on the x2 side in the x direction relative to the support member 10A.

[0025] The second conductive layer 1B has a second main surface 11B. The second main surface 11B faces the z1 side in the z direction. In the illustrated example, the second main surface 11B is a flat surface. The second conductive layer 1B is a conductive material, and contains, for example, Cu (copper). Note that the support member 10B may not include the second conductive layer 1B, for example. In this case, the support layer 102 may also function as the support member 10B.

[0026] The first main conductive member 31 includes a first main terminal 311 and a first pillow member 319. As shown in FIGS. 1, 2, and 6, the first main terminal 311 protrudes toward the x1 side in the x direction and has a portion exposed from the sealing resin 7. The first main terminal 311 is located at a position shifted toward the x1 side in the x direction with respect to the first conductive layer 1A. The first main terminal 311 is also located at a position shifted toward the y1 side in the y direction with respect to the first conductive layer 1A. The first main terminal 311 is located on the z1 side in the z direction with respect to the first main surface 11A and is spaced apart from the first conductive layer 1A. The first main terminal 311 overlaps the first main surface 11A when viewed in the z direction. The first main terminal 311 includes Cu (copper). The first main terminal 311 is provided with a first mounting hole 3111. The first mounting hole 3111 penetrates the first main terminal 311 in the z direction.

[0027] 1 and 6 , the first pillow material 319 is interposed between the first conductive layer 1A and the first main terminal 311. The composition of the first pillow material 319 includes, for example, Cu (copper). The first pillow material 319 is conductively joined to the first main surface 11A of the first conductive layer 1A and the first main terminal 311. The method of conductive joining is not limited in any way, and a method using a conductive joining material such as solder, a method such as welding, or the like may be adopted as appropriate.

[0028] The second main conductive member 32 includes a second main terminal 321 and a second pillow member 329. As shown in FIGS. 1 to 6 , the second main terminal 321 protrudes toward the x2 side in the x direction and has a portion exposed from the sealing resin 7. The second main terminal 321 is located at a position shifted toward the x2 side in the x direction with respect to the second conductive layer 1B. The center position of the second main terminal 321 in the y direction substantially coincides with the center position of the second conductive layer 1B in the y direction. The second main terminal 321 is located on the z1 side in the z direction with respect to the second main surface 11B and is spaced apart from the second conductive layer 1B. The second main terminal 321 overlaps the second main surface 11B when viewed in the z direction. The second main terminal 321 includes Cu (copper). The second main terminal 321 has a second mounting hole 3211. The second mounting hole 3211 penetrates the second main terminal 321 in the z direction.

[0029] 1 and 4 to 6, the second pillow material 329 is interposed between the second conductive layer 1B and the second main terminal 321. The composition of the second pillow material 329 includes Cu (copper). The second pillow material 329 is conductively joined to the second main surface 11B of the second conductive layer 1B and the second main terminal 321. The method of conductive joining is not limited in any way, and a method using a conductive joining material such as solder, a method such as welding, or the like may be adopted as appropriate.

[0030] As shown in FIGS. 1, 4 to 7, and 12, the multiple first switching elements 21 are bonded to the first main surface 11A of the first conductive layer 1A. The multiple first switching elements 21 may all be the same element or may be different elements. The multiple first switching elements 21 are, for example, MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors). Alternatively, the multiple first switching elements 21 may be field-effect transistors including MISFETs (Metal-Insulator-Semiconductor Field-Effect Transistors), bipolar transistors such as IGBTs (Insulated Gate Bipolar Transistors), or the like.

[0031] In the description of the electronic device A100, the multiple first switching elements 21 are n-channel MOSFETs with a vertical structure. The multiple first switching elements 21 include a compound semiconductor substrate. The compound semiconductor substrate contains silicon carbide (SiC). The multiple first switching elements 21 are arranged along the y direction.

[0032] As shown in FIGS. 1, 5, 6, 12, 14, 16 and 18, the first switching element 21 has a second electrode 211, a first electrode 212, a third electrode 213 and a fourth electrode 214.

[0033] The second electrode 211 faces the first main surface 11A of the first conductive layer 1A. A current corresponding to the power before being converted by the first switching elements 21 can flow through the second electrode 211. The second electrode 211 corresponds to the drain electrode of the first switching elements 21. The second electrode 211 is conductively bonded to the first main surface 11A via a conductive bonding layer 29. As a result, the second electrodes 211 of the multiple first switching elements 21 are electrically connected to the first main conductive member 31. The conductive bonding layer 29 is, for example, solder. Alternatively, the conductive bonding layer 29 may be a sintered metal containing silver or the like.

[0034] The first electrode 212 is located on the z1 side in the z direction opposite to the second electrode 211. A current corresponding to the power converted by the first switching element 21 flows through the first electrode 212. The first electrode 212 corresponds to the source electrode of the first switching element 21.

[0035] The specific configuration of the first electrode 212 is not limited in any way. In this embodiment, as shown in FIG. 19 , the first electrode 212 has a first layer 2121, a second layer 2122, and a third layer 2123. The first layer 2121 is located closest to the z1 side in the z direction. The first layer 2121 contains Cu (copper), for example, copper phosphate. The thickness of the first layer 2121 is, for example, 10 μm or more and 100 μm or less. The second layer 2122 is located on the z2 side in the z direction relative to the first layer 2121. The second layer 2122 contains Ni (nickel), for example. The thickness of the second layer 2122 is, for example, 0.1 μm or more and 5 μm or less. The third layer 2123 is located closest to the z2 side in the z direction. The third layer 2123 contains, for example, an AlCu alloy (aluminum copper alloy). The thickness of the third layer 2123 is, for example, not less than 5 μm and not more than 200 μm.

[0036] The third electrode 213 is located on the same side (z1 side) as the first electrode 212 in the z direction. The third electrode 213 is located on the y1 side in the y direction with respect to the first electrode 212 as viewed in the z direction. A gate voltage for driving the first switching element 21 is applied to the third electrode 213. The third electrode 213 corresponds to the gate electrode of the first switching element 21. As shown in FIG. 14 , the area of ​​the third electrode 213 is smaller than the area of ​​the first electrode 212 as viewed in the z direction.

[0037] The fourth electrode 214 is located on the same side (z1 side) as the first electrode 212 in the z direction. The fourth electrode 214 is located on the y1 side in the y direction with respect to the first electrode 212 as viewed in the z direction. In the illustrated example, two fourth electrodes 214 are located on both sides of the third electrode 213 in the x direction. The fourth electrode 214 is electrically connected to the first electrode 212 in the first switching element 21 and is a so-called source sense electrode. As shown in FIG. 14 , the area of ​​the fourth electrode 214 is smaller than the area of ​​the first electrode 212 as viewed in the z direction.

[0038] 1, 4 to 6, 13, and 15, the second switching elements 22 are bonded to the second main surface 11B of the second conductive layer 1B. The second switching elements 22 may be the same as or different from the first switching elements 21. The second switching elements 22 may be field-effect transistors, including metal-insulator-semiconductor field-effect transistors (MISFETs), and bipolar transistors, such as insulated gate bipolar transistors (IGBTs).

[0039] In this embodiment, the second switching elements 22 are n-channel MOSFETs with a vertical structure. The second switching elements 22 include a compound semiconductor substrate. The compound semiconductor substrate contains silicon carbide (SiC). The second switching elements 22 are arranged along the y direction.

[0040] The plurality of second switching elements 22 each have a sixth electrode 221 , a fifth electrode 222 , a seventh electrode 223 and an eighth electrode 224 .

[0041] The sixth electrode 221 faces the second main surface 11B of the second conductive layer 1B. A current corresponding to the power before being converted by the second switching elements 22 can flow through the sixth electrode 221. The sixth electrode 221 corresponds to the drain electrode of the second switching elements 22. The sixth electrode 221 is conductively bonded to the second main surface 11B via the conductive bonding layer 29. Therefore, the sixth electrodes 221 of the multiple second switching elements 22 are electrically connected to the second main conductive member 32.

[0042] The fifth electrode 222 is located on one side opposite to the sixth electrode 221 in the z direction. A current corresponding to the power converted by the second switching element 22 can flow through the fifth electrode 222. The fifth electrode 222 corresponds to the source electrode of the second switching element 22. The specific configuration of the fifth electrode 222 is not limited in any way, and may be the same as the configuration of the first electrode 212 described with reference to FIG. 19 , for example.

[0043] The seventh electrode 223 is located on the same side (z1 side) as the fifth electrode 222 in the z direction. The seventh electrode 223 is located on the y2 side in the y direction with respect to the fifth electrode 222 as viewed in the z direction. A gate voltage for driving the second switching element 22 can be applied to the seventh electrode 223. The seventh electrode 223 corresponds to the gate electrode of the second switching element 22. As shown in FIG. 15 , the area of ​​the seventh electrode 223 is smaller than the area of ​​the fifth electrode 222 as viewed in the z direction.

[0044] The eighth electrode 224 is located on the same side (z1 side) as the fifth electrode 222 in the z direction. The eighth electrode 224 is located on the y2 side in the y direction relative to the fifth electrode 222 as viewed in the z direction. In the illustrated example, two eighth electrodes 224 are located on both sides of the seventh electrode 223 in the x direction. The eighth electrode 224 is electrically connected to the fifth electrode 222 in the second switching element 22 and is a so-called source sense electrode. As shown in FIG. 15 , the area of ​​the eighth electrode 224 is smaller than the area of ​​the fifth electrode 222 as viewed in the z direction.

[0045] 1, 2, 4 to 7, and 12, the third main conductive member 33 includes an extension 332 and a third main terminal 331. The third main conductive member 33 is made of a conductive material and includes, for example, Cu (copper).

[0046] The third main terminal 331 has a portion that protrudes from the sealing resin 7 to the x1 side in the x direction. The third main terminal 331 is located on the y2 side in the y direction with respect to the first main terminal 311. The third main terminal 331 is located at a position shifted to the x1 side in the x direction with respect to the second conductive layer 1B. The third main terminal 331 is located on the z1 side in the z direction with respect to the first main surface 11A and is spaced apart from the first conductive layer 1A. The third main terminal 331 overlaps the first main surface 11A when viewed in the z direction. A third mounting hole 3311 is provided in the third main terminal 331. The third mounting hole 3311 penetrates the third main terminal 331 in the z direction.

[0047] The extending portion 332 extends from the third main terminal 331 to the x2 side in the x direction, and is covered with the sealing resin 7. The extending portion 332 in this embodiment includes a first portion 3321, a second portion 3322, and a third portion 3323.

[0048] In the illustrated example, as shown in FIGS. 4 and 5 , the distance z1 of the first portion 3321 from the first main surface 11A in the z direction is smaller than the distance z0 from the first main surface 11A to the third main terminal 331 in the z direction. The magnitude of the distance z1 is, for example, 0.1 mm or more. As shown in FIGS. 1 , 2 , and 4 to 7 , the first portion 3321 is located between the plurality of first switching elements 21 and the plurality of second switching elements 22 in the x direction. As shown in FIG. 5 , in the illustrated example, the distance z1 is larger than the distance z2 from the first main surface 11A in the z direction to one end of the first switching element 21 on one side in the z direction. For example, the distance z2 is approximately 0.5 mm, while the distance z1 is approximately 0.8 mm to 1.2 mm.

[0049] The shape of the first portion 3321 is not limited in any way, and in this embodiment, it is a shape extending in the y direction, for example, a flat band shape. In the example shown, the first portion 3321 overlaps the first main surface 11A (first conductive layer 1A) when viewed in the z direction. In the example shown, the x2-side edge of the first portion 3321 in the x direction is located on the x1-side in the x direction with respect to the x2-side edge of the first main surface 11A in the x direction.

[0050] The second portion 3322 is connected to the third main terminal 331. The second portion 3322 extends from the third main terminal 331 along the x direction toward the x2 side in the x direction. The shape of the second portion 3322 is not limited in any way and may be, for example, a flat band shape. The distance from the first main surface 11A to the second portion 3322 in the z direction is the same as (or approximately the same as) the distance z0. The second portion 3322 is located on the y2 side in the y direction with respect to the multiple first switching elements 21.

[0051] The third portion 3323 is interposed between the first portion 3321 and the second portion 3322. Due to the inclusion of the third portion 3323, the extending portion 332 has a bent shape when viewed in the y direction. In the illustrated example, the third portion 3323 is part of the x1-side edge of the first portion 3321 in the x direction and is connected to a portion closer to the y2-side end in the y direction.

[0052] The sub-conductive members 41-48 are electrically connected to either the first switching elements 21 or the second switching elements 22. As shown in FIGS. 1 to 7 , 12 , and 13 , the sub-conductive members 41-48 of this embodiment each extend in the y direction when viewed in the z direction and are arranged in the x direction. The sub-conductive members 41-48 are made of a conductive material, for example, containing Cu (copper). In the following description, the sub-conductive members 41-48 are classified as a first sub-conductive member 41, a second sub-conductive member 42, a third sub-conductive member 43, a fourth sub-conductive member 44, a fifth sub-conductive member 45, a sixth sub-conductive member 46, a seventh sub-conductive member 47, and an eighth sub-conductive member 48.

[0053] The first sub-conductive member 41 is electrically connected to the first electrode 212 of the first switching element 21. The first sub-conductive member 41 is located on the x1 side of the x2-side edge of the first conductive layer 1A in the x-direction. The first sub-conductive member 41 has a first sub-terminal portion 411 and a first sub-wiring portion 412. The first sub-terminal portion 411 protrudes from the sealing resin 7 and, in the illustrated example, extends to the z1 side in the z-direction. The first sub-wiring portion 412 is covered by the sealing resin 7. The shape and size of the first sub-wiring portion 412 are not limited in any way. In the illustrated example, the first sub-wiring portion 412 is located on the y1 side in the y-direction with respect to the first conductive layer 1A and the support member 10A.

[0054] The second sub-conductive member 42 is electrically connected to the first electrode 212 of the first switching element 21. The second sub-conductive member 42 is located on the x1 side in the x direction with respect to the first sub-conductive member 41. The second sub-conductive member 42 has a second sub-terminal portion 421 and a second sub-wiring portion 422. The second sub-terminal portion 421 protrudes from the sealing resin 7 and, in the illustrated example, extends to the z1 side in the z direction. The second sub-wiring portion 422 is covered by the sealing resin 7. The shape and size of the second sub-wiring portion 422 are not limited in any way. In the illustrated example, the second sub-wiring portion 422 is located on the y1 side in the y direction with respect to the first conductive layer 1A and the support member 10A.

[0055] The third sub-conductive member 43 is electrically connected to the third electrode 213 of the first switching element 21. The third sub-conductive member 43 is located between the first sub-conductive member 41 and the second sub-conductive member 42 in the x-direction. The third sub-conductive member 43 has a third sub-terminal portion 431 and a third sub-wiring portion 432. The third sub-terminal portion 431 protrudes from the sealing resin 7 and, in the illustrated example, extends to the z1 side in the z-direction. The third sub-wiring portion 432 is covered by the sealing resin 7. The shape and size of the third sub-wiring portion 432 are not limited in any way. In the illustrated example, the third sub-wiring portion 432 overlaps the first conductive layer 1A when viewed in the z-direction. The third sub-wiring portion 432 has a portion facing the x1 side in the x-direction with respect to the multiple first switching elements 21.

[0056] The fourth sub-conductive member 44 is electrically connected to the fourth electrode 214 of the first switching element 21. The fourth sub-conductive member 44 is located between the first sub-conductive member 41 and the second sub-conductive member 42 in the x-direction. The fourth sub-conductive member 44 is located between the second sub-conductive member 42 and the third sub-conductive member 43 in the x-direction. The fourth sub-conductive member 44 has a fourth sub-terminal portion 441 and a fourth sub-wiring portion 442. The fourth sub-terminal portion 441 protrudes from the sealing resin 7 and, in the illustrated example, extends to the z1 side in the z-direction. The fourth sub-wiring portion 442 is covered by the sealing resin 7. The shape and size of the fourth sub-wiring portion 442 are not limited in any way. In the illustrated example, the fourth sub-wiring portion 442 overlaps the first conductive layer 1A when viewed in the z-direction. The fourth sub-wiring portion 442 has a portion facing the x1 side in the x-direction with respect to the multiple first switching elements 21.

[0057] The fifth sub-conductive member 45 is electrically connected to the fifth electrode 222 of the second switching element 22. The fifth sub-conductive member 45 is located on the x2 side of the x1-side edge of the second conductive layer 1B in the x-direction. The fifth sub-conductive member 45 has a fifth sub-terminal portion 451 and a fifth sub-wiring portion 452. The fifth sub-terminal portion 451 protrudes from the sealing resin 7 and, in the illustrated example, extends to the z1 side in the z-direction. The fifth sub-wiring portion 452 is covered by the sealing resin 7. The shape and size of the fifth sub-wiring portion 452 are not limited in any way. In the illustrated example, the fifth sub-wiring portion 452 is located on the y1 side in the y-direction with respect to the second conductive layer 1B and the support member 10B.

[0058] The sixth sub-conductive member 46 is electrically connected to the fifth electrode 222 of the second switching element 22. The sixth sub-conductive member 46 is located on the x2 side in the x direction relative to the fifth sub-conductive member 45. The sixth sub-conductive member 46 has a sixth sub-terminal portion 461 and a sixth sub-wiring portion 462. The sixth sub-terminal portion 461 protrudes from the sealing resin 7 and, in the illustrated example, extends to the z1 side in the z direction. The sixth sub-wiring portion 462 is covered by the sealing resin 7. The shape and size of the sixth sub-wiring portion 462 are not limited in any way. In the illustrated example, the sixth sub-wiring portion 462 is located on the y1 side in the y direction relative to the second conductive layer 1B and the support member 10B.

[0059] The seventh sub-conductive member 47 is electrically connected to the seventh electrode 223 of the second switching element 22. The seventh sub-conductive member 47 is located between the fifth sub-conductive member 45 and the sixth sub-conductive member 46 in the x-direction. The seventh sub-conductive member 47 has a seventh sub-terminal portion 471 and a seventh sub-wiring portion 472. The seventh sub-terminal portion 471 protrudes from the sealing resin 7 and, in the illustrated example, extends to the z1 side in the z-direction. The seventh sub-wiring portion 472 is covered by the sealing resin 7. The shape and size of the seventh sub-wiring portion 472 are not limited in any way. In the illustrated example, the seventh sub-wiring portion 472 overlaps the second conductive layer 1B when viewed in the z-direction. The seventh sub-wiring portion 472 has a portion facing the x2 side in the x-direction with respect to the multiple second switching elements 22.

[0060] The eighth sub-conductive member 48 is electrically connected to the eighth electrode 224 of the second switching element 22. The eighth sub-conductive member 48 is located between the fifth sub-conductive member 45 and the sixth sub-conductive member 46 in the x-direction. The eighth sub-conductive member 48 is located between the sixth sub-conductive member 46 and the seventh sub-conductive member 47 in the x-direction. The eighth sub-conductive member 48 has an eighth sub-terminal portion 481 and an eighth sub-wiring portion 482. The eighth sub-terminal portion 481 protrudes from the sealing resin 7 and, in the illustrated example, extends to the z1 side in the z-direction. The eighth sub-wiring portion 482 is covered by the sealing resin 7. The shape and size of the eighth sub-wiring portion 482 are not limited in any way. In the illustrated example, the eighth sub-wiring portion 482 overlaps the second conductive layer 1B when viewed in the z-direction. The eighth sub-wiring portion 482 has a portion facing the x2 side in the x-direction with respect to the multiple second switching elements 22.

[0061] As shown in FIGS. 1 , 5 , 12 , 13 , and 14 , the multiple main connection members 51 individually connect the multiple first switching elements 21 to the second conductive layer 1B. The main connection members 51 are connected to the first electrodes 212 of the first switching elements 21 and the second main surface 11B of the second conductive layer 1B. The specific configuration of the main connection members 51 is not limited, and examples thereof include wires and ribbons primarily composed of Cu (copper), Al (aluminum), or alloys thereof. In the example shown below, the main connection members 51 are wires. The main connection members 51 in this example are primarily composed of Cu (copper). The diameter Da of the main connection members 51 is not limited, and is, for example, 150 μm or more and 400 μm or less. The number of the multiple main connection members 51 is not limited, and in the illustrated example, two main connection members 51 are connected to the first electrode 212 of one first switching element 21.

[0062] The main connection member 51 has a connection portion 511, a connection portion 512, and a loop portion 510. The connection portion 511 is a portion connected to the first electrode 212. In the present embodiment, the connection portion 511 corresponds to the first connection portion of the present disclosure. In the illustrated example, the connection portions 511 of two main connection members 51 are aligned in the x-direction on one first electrode 212. The connection portion 512 is a portion connected to the second major surface 11B of the second conductive layer 1B. In the present embodiment, the connection portion 512 corresponds to the second connection portion of the present disclosure. In the illustrated example, the connection portions 512 of two main connection members 51 connected to one first electrode 212 are aligned in the x-direction. The loop portion 510 is connected to the connection portion 511 and the connection portion 512, and has a curved shape that is convex toward the z1 side in the z-direction. As shown in FIGS. 5 and 16 , in this embodiment, the loop portion 510 straddles the first portion 3321 of the extending portion 332 of the third main conductive member 33 .

[0063] As shown in FIGS. 1 , 4 , 6 , 12 , 13 , and 15 , the multiple main connection members 52 individually connect the multiple second switching elements 22 to the third main conductive member 33. The main connection members 52 are connected to the fifth electrodes 222 of the second switching elements 22 and the first portions 3321 of the extensions 332 of the third main conductive member 33. The specific configuration of the multiple main connection members 52 is not limited, and may be wires, ribbons, or plate materials primarily composed of a first main metal. In the example shown below, the main connection members 52 are wires. Examples of the first main metal include copper (Cu), aluminum (Al), and alloys thereof. The first main metal of the main connection members 52 in this example is copper (Cu). The diameter Da of the main connection members 52 is not limited, and may be, for example, 150 μm or more and 400 μm or less. The number of the main connection members 52 is not limited in any way, and in the illustrated example, two main connection members 52 are connected to the fifth electrode 222 of one second switching element 22 .

[0064] The main connection member 52 has a connection portion 521, a connection portion 522, and a loop portion 520. The connection portion 521 is a portion connected to the fifth electrode 222. In the present embodiment, the connection portion 521 corresponds to the first connection portion of the present disclosure. In the illustrated example, the connection portions 521 of two main connection members 52 are aligned in the x-direction on one fifth electrode 222. The connection portion 522 is a portion connected to the first portion 3321 of the extension portion 332 of the third main conductive member 33. In the present embodiment, the connection portion 522 corresponds to the second connection portion of the present disclosure. In the illustrated example, the connection portions 522 of two main connection members 52 connected to one fifth electrode 222 are aligned in the x-direction. The loop portion 520 is connected to the connection portion 521 and the connection portion 522 and has a curved shape that is convex toward the z1 side in the z-direction.

[0065] The first connecting member 61, the second connecting member 62, the first connecting member 65, and the second connecting member 66 are used to detect the temperature of the first connection object of the present disclosure using the thermocouple principle. In this embodiment, the first connection object of the first connecting member 61 and the second connecting member 62 is the first switching element 21, and the first connection object of the first connecting member 65 and the second connecting member 66 is the second switching element 22. The first connecting member 61 and the second connecting member 62 and the first connecting member 65 and the second connecting member 66 may have the same material, connection form, etc., or may be different. The electronic device A100 may be configured to include only one of the first connecting member 61 and the second connecting member 62 and the first connecting member 65 and the second connecting member 66.

[0066] As shown in FIGS. 1, 12, 14, and 16 to 19, the first connection member 61 electrically connects the first switching element 21 and the first sub-conductive member 41. In the illustrated example, the first connection member 61 is connected to the first electrode 212 of the first switching element 21 located closest to the y1 side in the y direction and the first sub-wiring portion 412 of the first sub-conductive member 41. The first sub-wiring portion 412 of the first sub-conductive member 41 corresponds to the second connection object in this disclosure. The specific configuration of the first connection member 61 is not limited in any way and may be a wire or ribbon containing a first metal as its main component. Examples of the first metal include Cu (copper), Al (aluminum), Ni (nickel), and alloys thereof. In this example, the first metal of the first connection member 61 is constantan, an example of an alloy of Cu (copper), Al (aluminum), Ni (nickel), and the like. The thickness of the first connecting member 61 is not limited in any way, and for example, the diameter D1 of the first loop portion 610 shown in FIG. 18 is not less than 10 μm and not more than 200 μm, for example, about 150 μm.

[0067] The first connecting member 61 has a first connecting portion 611 , a third connecting portion 612 and a first loop portion 610 .

[0068] The first connection portion 611 is a portion connected to the first electrode 212 of the first switching element 21. The position at which the first connection portion 611 is connected on the first electrode 212 is not limited in any way. In the example shown, the first connection portion 611 is located on the x1 side in the x direction and on the y1 side in the y direction with respect to the two connection portions 511 on the first electrode 212. This position is between one corner of the first electrode 212 and the connection portion 511.

[0069] 17 to 19 , the first connecting portion 611 has a first ridge-like portion 6111 and two first extending portions 6112. Furthermore, in this embodiment, the first connecting portion 611 has a first terminal end 6113 and a first base end 6114.

[0070] The first ridge portion 6111 has a convex shape on the z1 side in the z direction, and a first center line O1 extends in the first direction N1. The cross-sectional shape of the first ridge portion 6111 is generally mountain-shaped, generally triangular, or the like, as shown in FIG. 19 . The first direction N1 is a direction that intersects with the z direction and, in this embodiment, is perpendicular to the z direction. The relationship between the first direction N1 and the x and y directions is not limited in any way. In the illustrated example, the first direction N1 is inclined with respect to the x and y directions.

[0071] The two first extending portions 6112 extend from the first ridge portion 6111 to both sides in a direction intersecting the first direction N1. The first extending portion 6112 is smaller in size in the z direction than the first ridge portion 6111. Note that the shapes of the first ridge portion 6111 and the two first extending portions 6112 shown in FIG. 17 are merely examples. The specific shape of the first ridge portion 6111 can be changed in various ways depending on the material of the first connecting member 61, the connection method and connection conditions of the first connecting portion 611, etc.

[0072] The first end portion 6113 is connected to the tip side of the first ridge portion 6111. The first base end portion 6114 is connected to the opposite side of the first ridge portion 6111 from the first end portion 6113, and is connected to the first loop portion 610. The first end portion 6113 and the first base end portion 6114 are portions that have not been subjected to significant plastic deformation processing compared to the first ridge portion 6111 and the first extending portion 6112 in the manufacturing method of the electronic device A100 described below. Note that the first connecting portion 611 may have either or neither the first end portion 6113 and the first base end portion 6114.

[0073] As shown in FIG. 12 , the third connection portion 612 is a portion connected to the first sub-wiring portion 412 of the sub-conductive member 41. As shown in FIGS. 12 , 14 , and 16 to 18 , the first loop portion 610 is a portion interposed between the first connection portion 611 and the third connection portion 612. The first loop portion 610 has a curved shape that is convex toward the z1 side in the z direction. As shown in FIG. 18 , the first loop portion 610 extends in a third direction N3 when viewed in the z direction. The relationship between the third direction N3 and the first direction N1 is not limited in any way and may be parallel (or approximately parallel) to each other or may intersect with each other. In the illustrated example, the third direction N3 intersects with the first direction N1, and the first connection portion 611 and the first loop portion 610 are bent. The angle between the first direction N1 and the third direction N3 is, for example, 90° or greater and 180° or less.

[0074] As shown in FIGS. 1 , 12 , 14 , and 16 to 19 , the second connection member 62 electrically connects the first switching element 21 and the second sub-conductive member 42. In the illustrated example, the second connection member 62 electrically connects the first electrode 212 of the first switching element 21 located closest to the y1 side in the y direction to the second sub-wiring portion 422 of the second sub-conductive member 42. The second sub-wiring portion 422 of the second sub-conductive member 42 corresponds to the third connection object of the present disclosure. The specific configuration of the second connection member 62 is not limited in any way and may be a wire, ribbon, or the like containing a second metal as its main component. The second metal is a metal with a different thermoelectric power from the first metal, and includes, for example, copper (Cu), aluminum (Al), nickel (Ni), and alloys thereof. In this example, the second metal of the second connection member 62 is copper (Cu). When the first metal is constantan and the second metal is copper (Cu), the first metal is harder than the second metal. The thickness of the second connection member 62 is not limited, and for example, the diameter D2 of the second loop portion 620 shown in FIG. 18 is 200 μm or more and 500 μm or less, e.g., approximately 400 μm. In this example, the diameter D2 is larger than the diameter D1.

[0075] The second connecting member 62 has a second connecting portion 621 , a fourth connecting portion 622 , and a second loop portion 620 .

[0076] The second connection portion 621 is a portion connected to the first connection portion 611. The second connection portion 621 is in contact with the first connection portion 611 and is fixed to the first connection portion 611 by a manufacturing method described below. The second connection portion 621 may or may not be in contact with the first electrode 212. The second connection portion 621 is electrically connected to the first electrode 212 at least via the first connection portion 611.

[0077] 17 to 19 , the second connecting portion 621 in the illustrated example has a second ridge-like portion 6211 and two second extending portions 6212. Furthermore, in the present embodiment, the second connecting portion 621 has a second distal end portion 6213 and a second proximal end portion 6214. Note that the specific configuration of the second connecting portion 621 is not limited in any way.

[0078] The second ridge portion 6211 has a convex shape toward the z1 side in the z direction, and a second center line O2 extends in the second direction N2. The cross-sectional shape of the second ridge portion 6211 is generally mountain-shaped or generally triangular, as shown in FIG. 19 . The second direction N2 intersects with the z direction and, in this embodiment, is perpendicular to the z direction. The relationship between the second direction N2 and the x direction and the y direction is not limited in any way. In the illustrated example, the second direction N2 is inclined with respect to the x direction and the y direction. The relationship between the second direction N2 and the first direction N1 is not limited in any way. In the illustrated example, the first direction N1 and the second direction N2 are parallel (or generally parallel) to each other. The positional relationship between the first center line O1 and the second center line O2 is not limited in any way. In the illustrated example, the first center line O1 and the second center line O2 coincide when viewed in the z direction. In the illustrated example, the second ridge 6211 overlaps with the first ridge 6111 and the two first extensions 6112 when viewed in the z direction. The second ridge 6211 overlaps with the first distal end 6113 and the first proximal end 6114 when viewed in the z direction.

[0079] The two second extending portions 6212 extend from the second ridge portion 6211 to both sides in a direction intersecting the second direction N2. The second extending portion 6212 is smaller in size in the z direction than the second ridge portion 6211. Note that the shapes of the second ridge portion 6211 and the two second extending portions 6212 shown in FIG. 17 are merely examples. The specific shape of the second ridge portion 6211 can be changed in various ways depending on the material of the second connecting member 62, the connection method and connection conditions of the second connecting portion 621, etc.

[0080] The two second extending portions 6212 may each be in contact with the first electrode 212, or either one may be in contact with the first electrode 212, or neither may be in contact with the first electrode 212. In the example shown in the figure, the two second extending portions 6212 each are in contact with the first electrode 212.

[0081] The second terminal end 6213 is connected to the tip side of the second ridge-like portion 6211. The second base end 6214 is connected to the opposite side of the second ridge-like portion 6211 from the second terminal end 6213, and is connected to the second loop portion 620. The second terminal end 6213 and the second base end 6214 are portions that have not been subjected to significant plastic deformation processing compared to the second ridge-like portion 6211 and the second extending portion 6212 in the manufacturing method of the electronic device A100 described below. Note that the second connecting portion 621 may have either or neither the second terminal end 6213 or the second base end 6214.

[0082] The size of the first ridge-shaped portion 6111 and the size of the second ridge-shaped portion 6211 generally depend on the relationship between the diameter D1 and the diameter D2. The size of the first extension portion 6112 and the size of the second extension portion 6212 generally depend on the relationship between the diameter D1 and the diameter D2. In this example, the diameter D2 is larger than the diameter D1. The second ridge-shaped portion 6211 is larger than the first ridge-shaped portion 6111, and the second extension portion 6212 is larger than the first extension portion 6112. The second extension portion 6212 extends beyond the first extension portion 6112 to the outside in a direction intersecting the first direction N1 and the second direction N2, and makes contact with the first electrode 212.

[0083] As shown in FIG. 12 , the fourth connection portion 622 is connected to the second sub-wiring portion 422 of the second sub-conductive member 42. As shown in FIGS. 12 , 14 , and 16 to 18 , the second loop portion 620 is located between the second connection portion 621 and the fourth connection portion 622. The second loop portion 620 has a curved shape that is convex toward the z1 side in the z direction. As shown in FIGS. 14 and 16 , the first loop portion 610 and the second loop portion 620 are spaced apart. As shown in FIG. 18 , the second loop portion 620 extends in a fourth direction N4 when viewed in the z direction. The relationship between the fourth direction N4 and the second direction N2 is not limited in any way and may be parallel (or approximately parallel) to each other or may intersect. In the illustrated example, the fourth direction N4 intersects with the second direction N2, and the second connection portion 621 and the second loop portion 620 are bent. The angle formed between the second direction N2 and the fourth direction N4 is, for example, greater than or equal to 90° and less than or equal to 180°.

[0084] In the illustrated example, the bending direction of the first connection portion 611 and the first loop portion 610 is opposite to the bending direction of the second connection portion 621 and the second loop portion 620. As a result, when viewed in the z direction, the farther away from the first connection portion 611 and the second connection portion 621 in the first direction N1 or the second direction N2 the farther apart the first loop portion 610 and the second loop portion 620 are.

[0085] As shown in FIGS. 1 , 13 , and 15 , the first connection member 65 electrically connects the second switching element 22 and the sub-conductive member 45. In the illustrated example, the first connection member 65 is connected to the fifth electrode 222 of the second switching element 22 located closest to the y1 side in the y direction and the fifth sub-wiring portion 452 of the sub-conductive member 45. The fifth sub-wiring portion 452 of the sub-conductive member 45 corresponds to the second connection object in this disclosure. The specific configuration of the first connection member 65 is not limited and may be a wire, ribbon, or the like primarily composed of a first metal. Examples of the first metal include copper (Cu), aluminum (Al), nickel (Ni), and alloys thereof. In this example, the first metal of the first connection member 65 is constantan, an example of an alloy of copper (Cu) and nickel (Ni). The thickness of the first connection member 65 is not limited and may be the same as the diameter D1 of the first loop portion 650 of the first connection member 61.

[0086] The first connecting member 65 has a first connecting portion 651 , a third connecting portion 652 , and a first loop portion 650 .

[0087] The first connection portion 651 is a portion connected to the fifth electrode 222 of the second switching element 22. The position at which the first connection portion 651 is connected on the fifth electrode 222 is not limited in any way. In the example shown, the first connection portion 651 is located on the x2 side in the x direction and on the y1 side in the y direction with respect to the two connection portions 521 on the fifth electrode 222. This position is between one corner of the fifth electrode 222 and the connection portion 521.

[0088] The specific configuration of the first connecting portion 651 is not limited in any way, and may be the same as the specific configuration of the first connecting portion 611 described with reference to FIGS. 17 to 19, for example.

[0089] 13 , the third connection portion 652 is a portion connected to the fifth sub-wiring portion 452 of the sub-conductive member 45. As shown in FIGS. 13 and 15 , the first loop portion 650 is a portion interposed between the first connection portion 651 and the third connection portion 652. The first loop portion 650 has a curved shape that is convex toward the z1 side in the z direction. The specific configuration of the first loop portion 650 may be similar to the specific configuration of the first loop portion 610 described above, for example.

[0090] As shown in FIGS. 1 , 13 , and 15 , the second connection member 66 electrically connects the second switching element 22 and the sub-conductive member 46. In the illustrated example, the second connection member 66 electrically connects the fifth electrode 222 of the second switching element 22 located closest to the y1 side in the y direction to the sixth sub-wiring portion 462 of the sub-conductive member 46. The sixth sub-wiring portion 462 of the sub-conductive member 46 corresponds to the third connection object in the present disclosure. The specific configuration of the second connection member 66 is not limited, and may be a wire, ribbon, or the like primarily composed of a second metal. The second metal is a metal having a thermoelectric power different from that of the first metal, and includes, for example, copper (Cu), aluminum (Al), nickel (Ni), and alloys thereof. In this example, the second metal of the second connection member 66 is copper (Cu). The thickness of the second connection member 66 is not limited, and may be the same as the diameter D2 of the second loop portion 620 of the second connection member 62.

[0091] The second connecting member 66 has a second connecting portion 661 , a fourth connecting portion 662 , and a second loop portion 660 .

[0092] The second connection portion 661 is a portion connected to the first connection portion 651. The second connection portion 661 is in contact with the first connection portion 651 and is fixed to the first connection portion 651 by a manufacturing method described below. The second connection portion 661 may or may not be in contact with the fifth electrode 222. The second connection portion 661 is electrically connected to the fifth electrode 222 via the first connection portion 651. The specific configuration of the second connection portion 661 may be the same as the specific configuration of the second connection portion 621 described above. The specific relationship between the first connection portion 651 and the second connection portion 661 may be the same as the specific relationship between the first connection portion 611 and the second connection portion 621 described above. In modified examples and other embodiments described below, the content described using the first connection member 61 and the second connection member 62 as specific examples can be appropriately adopted as specific examples of the first connection member 65 and the second connection member 66.

[0093] As shown in Fig. 13 , the fourth connection portion 662 is a portion connected to the sixth sub-wiring portion 462 of the sub-conductive member 46. As shown in Figs. 13 and 15 , the second loop portion 660 is a portion interposed between the second connection portion 661 and the fourth connection portion 662. The second loop portion 660 has a curved shape that is convex toward the z1 side in the z direction. As shown in Fig. 15 , the first loop portion 650 and the second loop portion 660 are spaced apart.

[0094] The specific configurations of the first direction N1, second direction N2, third direction N3, and fourth direction N4 and the first center line O1 and second center line O2 for the first connecting member 61 and the second connecting member 62 are the same as those for the first connecting member 65 and the second connecting member 66.

[0095] The plurality of auxiliary connection members 63 , 64 , 67 , 68 are electrically connected to either the plurality of first switching elements 21 or the plurality of second switching elements 22 .

[0096] As shown in FIGS. 1 , 12 , and 14 , the sub-connecting member 63 electrically connects the first switching elements 21 and the third sub-conductive member 43. In the illustrated example, the sub-connecting members 63 are connected to the third electrodes 213 of the first switching elements 21 and the third sub-wiring portions 432 of the third sub-conductive members 43. The specific configuration of the sub-connecting members 63 is not limited, and they may be wires, ribbons, or the like containing a third sub-metal as a main component. Examples of the third sub-metal include copper (Cu), aluminum (Al), nickel (Ni), and alloys thereof. In this example, the third sub-metal of the sub-connecting member 63 is aluminum (Al). The thickness of the sub-connecting member 63 is not limited, and the width when viewed in the z direction is, for example, approximately 150 μm.

[0097] As shown in FIGS. 1 , 12 , and 14 , the sub-connecting member 64 electrically connects the first switching elements 21 and the fourth sub-conductive member 44. In the illustrated example, the multiple sub-connecting members 64 are connected to the fourth electrodes 214 of the multiple first switching elements 21 and the fourth sub-wiring portions 442 of the fourth sub-conductive members 44. The specific configuration of the sub-connecting member 64 is not limited, and it may be a wire, ribbon, or the like containing a fourth sub-metal as its main component. Examples of the fourth sub-metal include Cu (copper), Al (aluminum), Ni (nickel), and alloys thereof. In this example, the fourth sub-metal of the sub-connecting member 64 is Cu (copper). The thickness of the sub-connecting member 64 is not limited, and for example, the width when viewed in the z direction is approximately 150 μm.

[0098] As shown in FIGS. 1 , 13 , and 15 , the sub-connecting member 67 electrically connects the second switching elements 22 and the seventh sub-conductive member 47. In the illustrated example, the sub-connecting members 67 are connected to the seventh electrodes 223 of the second switching elements 22 and the seventh sub-wiring portions 472 of the seventh sub-conductive members 47. The specific configuration of the sub-connecting members 67 is not limited, and may be a wire, ribbon, or the like containing a seventh sub-metal as its main component. Examples of the seventh sub-metal include copper (Cu), aluminum (Al), nickel (Ni), and alloys thereof. In this example, the seventh sub-metal of the sub-connecting member 67 is aluminum (Al). The thickness of the sub-connecting member 67 is not limited, and the width when viewed in the z direction is, for example, approximately 150 μm.

[0099] As shown in FIGS. 1 , 13 , and 15 , the sub-connecting member 68 electrically connects the second switching elements 22 and the eighth sub-conductive member 48. In the illustrated example, the multiple sub-connecting members 68 are connected to the eighth electrodes 224 of the multiple second switching elements 22 and the eighth sub-wiring portion 482 of the eighth sub-conductive member 48. The specific configuration of the sub-connecting member 68 is not limited, and it may be a wire, ribbon, or the like containing an eighth sub-metal as its main component. Examples of the eighth sub-metal include Cu (copper), Al (aluminum), Ni (nickel), and alloys thereof. In this example, the eighth sub-metal of the sub-connecting member 68 is Cu (copper). The thickness of the sub-connecting member 68 is not limited, and for example, the width when viewed in the z direction is approximately 150 μm.

[0100] As shown in FIGS. 1 to 11 , the sealing resin 7 covers a portion of the support member 10A, a portion of the support member 10Bb, the first switching elements 21, the second switching elements 22, the main connecting members 51A, the main connecting members 52A, the first connecting member 61, the second connecting member 62, the first connecting member 65, the second connecting member 66, and the sub-connecting members 63, 64, 67, and 68. The sealing resin 7 also covers a portion of each of the first main conductive member 31, the second main conductive member 32, and the third main conductive member 33, as well as a portion of each of the sub-conductive members 41 to 48. The sealing resin 7 is electrically insulating. The sealing resin 7 may be made of a material containing, for example, black epoxy resin. The sealing resin 7 has a top surface 71, a bottom surface 72, a first side surface 73, a second side surface 74, a third side surface 75, and a fourth side surface 76.

[0101] The top surface 71 faces the z1 side in the z direction, and the bottom surface 72 faces the z2 side in the z direction.

[0102] The first side surface 73 faces the x1 side in the x direction. The first main terminal 311 and the third main terminal 331 protrude from the first side surface 73. The second side surface 74 faces the x2 side in the x direction. The second main terminal 321 protrudes from the second side surface 74.

[0103] The third side surface 75 faces the y1 side in the y direction. The fourth side surface 76 faces the y2 side in the y direction. A plurality of secondary conductive members 41 to 48 protrude from the third side surface 75.

[0104] Next, a method for manufacturing the electronic device A100 will be described below with reference to FIGS.

[0105] 20 shows the first switching element 21 as viewed from the side (a direction perpendicular to the first direction N1 and the second direction N2). The first switching element 21 is in a state where it has been completely mounted on the support member 10A. For ease of understanding, the support member 10A is omitted from the drawing. FIG. 21 is a partially enlarged cross-sectional view of a cross section perpendicular to the first direction N1 and the second direction N2 and passing through the first wedge bonding tool WT1.

[0106] First, a first wedge bonding tool WT1 is used to connect the tip portion of the first connecting member 61 to the first electrode 212 of the first switching element 21. At this time, wedge bonding is performed by applying a load and vibration with the first wedge bonding tool WT1 to the first connecting member 61 in contact with the first electrode 212. As shown in FIG. 22 , the first connecting portion 611 described above is formed on the first connecting member 61. The first peak portion 6111 and the two first extending portions 6112 of the first connecting portion 611 are formed by pressing the first wedge bonding tool WT1 against a portion of the first connecting member 61.

[0107] Next, as shown in FIGS. 23 and 24 , a second wedge bonding tool WT2 is used to connect the tip portion of the second connection member 62 to the first connection portion 611. At this time, wedge bonding is performed by applying a load and vibration from the second wedge bonding tool WT2 to the second connection member 62 in contact with the first connection portion 611. A second connection portion 621 is formed on the second connection member 62. The second peak portion 6211 and two second extensions 6212 of the second connection portion 621 are formed by pressing the second wedge bonding tool WT2 against a portion of the second connection member 62. The application of the load and vibration from the second wedge bonding tool WT2 may cause slight deformation of the first connection portion 611 of the first connection member 61.

[0108] Next, the operation of the electronic device A100 will be described.

[0109] 14 and 16 to 19, the second connection portion 621 is connected to the first connection portion 611. This eliminates the need to provide space for connecting only the second connection portion 621 to the first electrode 212, which is the first connection object. Because the second connection portion 621 is in direct contact with the first connection portion 611, it is possible to reduce errors in the detected temperature. This makes it possible to reduce the space required to connect the first connection member 61 and the second connection member 62 and improve the temperature detection accuracy.

[0110] The first connection portion 611 has a first peak portion 6111 and two first extension portions 6112, and is connected using a first wedge bonding tool WT1. This prevents the first connection portion 611 from protruding excessively toward the z1 side in the z direction. The first loop portion 610 extends in the third direction N3 relative to the first connection portion 611, and does not extend toward the z1 side in the z direction. This allows the second connection portion 621 to be connected appropriately and easily to the first connection portion 611.

[0111] The second connection portion 621 has a second ridge portion 6211 and two second extension portions 6212, and is connected using a second wedge bonding tool WT2. As a result, when forming the second connection portion 621, a load and vibration are applied from the second wedge bonding tool WT2 to the first connection portion 611 and the second connection member 62. This makes it possible to increase the bonding strength between the first connection portion 611 and the second connection portion 621.

[0112] The diameter D2 of the second loop portion 620 is larger than the diameter D1 of the first loop portion 610. This allows the second connection portion 621 to be formed as a larger portion than the first connection portion 611, and allows the second connection portion 621 to cover a larger portion of the first connection portion 611. This makes it possible to increase the connection strength between the second connection portion 621 and the first connection portion 611, and to prevent the second connection portion 621 from peeling off, for example.

[0113] Cu (copper), an example of the second metal, is softer than constantan, an example of the first metal. This allows the second connecting member 62 to deform more significantly to fit into the first connecting portion 611 when connecting the second connecting member 62. This is therefore preferable for increasing the connection strength between the first connecting portion 611 and the second connecting portion 621.

[0114] Both of the two second extending portions 6212 are in contact with the first electrode 212. This is preferable for increasing the connection strength of the second connecting portion 621.

[0115] The first direction N1 and the second direction N2 are parallel (or approximately parallel) to each other, which makes it possible to increase the overlapping ratio between the first connection portion 611 and the second connection portion 621 when viewed in the z direction, and is therefore preferable for increasing the connection strength of the second connection portion 621.

[0116] A configuration in which the first center line O1 and the second center line O2 are aligned when viewed in the z direction is preferable for increasing the degree of overlap between the first connection portion 611 and the second connection portion 621 when viewed in the z direction, and is suitable for increasing the connection strength of the second connection portion 621.

[0117] The third direction N3 intersects with the first direction N1. This allows the third connection portion 612 to be positioned farther away from the fourth connection portion 622. This increases the degree of freedom in the position of the second object. The fourth direction N4 intersects with the second direction N2. This allows the fourth connection portion 622 to be positioned farther away from the third connection portion 612. This increases the degree of freedom in the position of the third object.

[0118] The above-described functions are similarly exhibited by the first connecting member 65 and the second connecting member 66 .

[0119] 25 to 45 show modified examples and other embodiments of the present disclosure. In these figures, elements that are the same as or similar to those in the above-described embodiment are given the same reference numerals. The configurations of the various parts in each modified example and each embodiment can be combined with each other as appropriate within the scope of not causing technical contradictions.

[0120] First Modification of First Embodiment: FIG. 25 shows a first modification of the electronic device A100. In the electronic device A101 of this modification, the second connection portion 621 does not contact the first electrode 212, which is the first connection object. The second connection member 62 is electrically connected to the first electrode 212 via the first connection portion 611 (first connection member 61). The entire second connection portion 621 of this modification is separated from the first electrode 212 and is supported by the first connection portion 611. The second connection portion 621 has the above-described second peak portion 6211 and two second extension portions 6212. However, in the process using the above-described second wedge bonding tool WT2, the second connection portion 621 does not contact the first electrode 212. Therefore, the degree of deformation by the second wedge bonding tool WT2 is relatively small, and the two second extending portions 6212 are smaller than the second extending portions 6212 of the electronic device A100. Furthermore, the second connecting portion 621 may have a shape that does not include the second extending portions 6212.

[0121] This modification can reduce the space required to connect the first connection member 61 and the second connection member 62 and improve the temperature detection accuracy. As can be understood from this modification, the second connection portion 621 may be spaced apart from the first electrode 212, which is the first connection object.

[0122] 26 shows a second modification of the electronic device A100. In the electronic device A102 of this modification, one of the two second extensions 6212 of the second connection portion 621 is in contact with the first electrode 212, and the other is spaced apart from the first electrode 212. This type of second connection portion 621 can be formed, for example, in the process using the second wedge bonding tool WT2 described above, when the second connection member 62 is slightly misaligned with respect to the second wedge bonding tool WT2.

[0123] This modification can reduce the space required for connecting the first connecting member 61 and the second connecting member 62 and improve the temperature detection accuracy. The overlapping relationship between the first connecting portion 611 and the second connecting portion 621 can be in various forms, including the forms shown in Figures 19, 25, and 26. The overlapping relationship between the first connecting portion 611 and the second connecting portion 621 may be one of the forms shown in Figures 19, 25, and 26 at a certain location in the first direction N1 (second direction N2), and may be another of the forms shown in Figures 19, 25, and 26 at another location in the first direction N1 (second direction N2).

[0124] 27 and 28 show a third modification of the electronic device A100. In this modification, the diameter D1 of the first loop portion 610 is larger than the diameter D2 of the second loop portion 620. In this modification, the entire second connection portion 621 overlaps the first connection portion 611 when viewed in the z direction.

[0125] This modification can reduce the space required to connect the first connecting member 61 and the second connecting member 62 and improve the temperature detection accuracy. As can be understood from this modification, the thickness relationship between the first connecting member 61 and the second connecting member 62 is not limited in any way.

[0126] 29 and 30 show a fourth modification of the electronic device A100. In this modification, the diameter D1 of the first loop portion 610 and the diameter D2 of the second loop portion 620 are the same (or approximately the same).

[0127] This modification can reduce the space required to connect the first connecting member 61 and the second connecting member 62 and improve the temperature detection accuracy. As can be understood from this modification, the thickness relationship between the first connecting member 61 and the second connecting member 62 is not limited in any way.

[0128] 31 and 32 show a fifth modification of the electronic device A100. In the electronic device A105 of this modification, the positional relationship between the first center line O1 and the second center line O2 differs from that of the electronic device A100.

[0129] In this modification, the first center line O1 and the second center line O2 are spaced apart from each other when viewed in the z direction. The first center line O1 is located above the second center line O2 (on one side in the direction perpendicular to the first direction N1 and the second direction N2). When viewed in the z direction, the first loop portion 610 (third direction N3) is inclined so that it is positioned higher in the figure (on one side in the direction perpendicular to the first direction N1 and the second direction N2) as it moves away from the first connection portion 611. Meanwhile, the second loop portion 620 (fourth direction N4) is inclined so that it is positioned lower in the figure (on the other side in the direction perpendicular to the first direction N1 and the second direction N2) as it moves away from the second connection portion 621.

[0130] This modification can reduce the space required to connect the first connecting member 61 and the second connecting member 62 and improve the temperature detection accuracy. As can be understood from this modification, the positional relationship between the first center line O1 and the second center line O2 is not limited in any way.

[0131] Sixth Modification of the First Embodiment: FIG. 33 illustrates a sixth modification of the electronic device A100. In this modification, the electronic device A106 has a first center line O1 and a second center line O2 spaced apart, similar to the electronic device A105. A gap 69 exists between the first connecting portion 611 and the second connecting portion 621. The illustrated cross section overlaps the first base end 6114 of the first connecting portion 611 and the second connecting portion 621 of the second connecting member 62. The gap 69 is located between the right-hand portion of the first base end 6114 in the figure and the second connecting portion 621 (the second extending portion 6212). This gap 69 can be formed depending on the connection conditions, etc., used in the process using the second wedge bonding tool WT2. For ease of understanding, the sealing resin 7 is omitted from the figure. In the electronic device A106, a portion of the sealing resin 7 is filled into the gap 69.

[0132] This modification can reduce the space required to connect the first connecting member 61 and the second connecting member 62 and improve the temperature detection accuracy. As can be understood from this modification, the first connecting portion 611 and the second connecting portion 621 are not limited to being in close contact over the entire area. This disclosure also includes cases where the gap 69 exists over the entire length of the first connecting portion 611 and the second connecting portion 621 in the first direction N1 and the second direction N2, or where the gap 69 exists over part of the entire length of the first connecting portion 611 and the second connecting portion 621 in the first direction N1 and the second direction N2.

[0133] Seventh Modification of First Embodiment: Figure 34 shows a seventh modification of the electronic device A100. In the electronic device A107 of this modification, the first center line O1 and the second center line O2 are spaced apart, similar to the electronic device A105 described above. In this modification, a portion of the first connection portion 611 is exposed from the second connection portion 621. More specifically, a portion of the first connection portion 611 (first base end portion 6114) is exposed from the second connection portion 621 in a direction perpendicular to the first center line O1.

[0134] This modification can reduce the space required to connect the first connecting member 61 and the second connecting member 62 and improve the temperature detection accuracy. As can be understood from this modification, when the first center line O1 and the second center line O2 are spaced apart, a part of the first connecting portion 611 may be exposed from the second connecting portion 621.

[0135] Eighth Modification of First Embodiment: FIG. 35 illustrates an eighth modification of the electronic device A100. In the electronic device A108 of this modification, the first center line O1 is shifted downward in the figure relative to the second center line O2 (toward the other side in the direction perpendicular to the first direction N1 and the second direction N2). As viewed in the z direction, the first loop portion 610 (third direction N3) is tilted upward in the figure (toward one side in the direction perpendicular to the first direction N1 and the second direction N2) as it moves away from the first connection portion 611. Meanwhile, the second center line O2 is shifted upward in the figure relative to the first center line O1 (toward one side in the direction perpendicular to the first direction N1 and the second direction N2). The second loop portion 620 (fourth direction N4) is tilted downward in the figure (toward the other side in the direction perpendicular to the first direction N1 and the second direction N2) as it moves away from the second connection portion 621.

[0136] This modification can reduce the space required to connect the first connecting member 61 and the second connecting member 62 and improve the temperature detection accuracy. As can be understood from this modification, the combination of the direction in which the first center line O1 and the second center line O2 move away from each other and the directions of the third direction N3 and the fourth direction N4 is not limited in any way.

[0137] Ninth Modification of First Embodiment: FIG. 36 shows a ninth modification of the electronic device A100. In the electronic device A109 of this modification, the first center line O1 (first direction N1) and the second center line O2 (second direction N2) intersect with each other. When viewed in the z direction, the second ridge-shaped portion 6211 overlaps with the first ridge-shaped portion 6111. Meanwhile, at least a portion of the first end portion 6113 extends beyond the second end portion 6213. In the illustrated example, not all of the first end portion 6113 overlaps with the second end portion 6213. At least a portion of the first base end portion 6114 extends beyond the second base end portion 6214. In the illustrated example, not all of the first base end portion 6114 overlaps with the second base end portion 6214.

[0138] In this example, the third direction N3 is parallel (or approximately parallel) to the first direction N1. When viewed in the z direction, the first loop portion 610 is connected to the first connection portion 611 without a bent portion. The fourth direction N4 is parallel (or approximately parallel) to the second direction N2. When viewed in the z direction, the second loop portion 620 is connected to the second connection portion 621 without a bent portion.

[0139] This modification reduces the space required to connect the first connecting member 61 and the second connecting member 62 and improves temperature detection accuracy. As can be seen from this modification, the first center line O1 (first direction N1) and the second center line O2 (second direction N2) may intersect with each other. In this case, even if bent portions are not provided between the first loop portion 610 and the first connecting portion 611 and between the second loop portion 620 and the second connecting portion 621, the first loop portion 610 and the second loop portion 620 extend in directions away from each other from the first connecting portion 611 and the fourth connecting portion 622. This allows the first connecting member 61 and the second connecting member 62 to be properly connected to the sub-conductive member 41 (first sub-wiring portion 412: second connecting object) and the second sub-conductive member 42 (second sub-wiring portion 422: third connecting object), which are located at positions away from each other.

[0140] Tenth Modification of First Embodiment: FIG. 37 shows a tenth modification of the electronic device A100. In the electronic device A110 of this modification, the first center line O1 (first direction N1) and the second center line O2 (second direction N2) intersect with each other, similar to the electronic device A109. In this example, the third direction N3 is slightly inclined with respect to the first direction N1. When viewed in the z direction, the first loop portion 610 is connected to the first connection portion 611 via a bent portion. The fourth direction N4 is slightly inclined with respect to the second direction N2. When viewed in the z direction, the second loop portion 620 is connected to the second connection portion 621 via a bent portion. In this example, the first loop portion 610 and the second loop portion 620 are spaced farther apart from each other than if they extended along the first direction N1 and the third direction N3, respectively.

[0141] This modification can reduce the space required to connect the first connecting member 61 and the second connecting member 62 and improve the temperature detection accuracy. In addition to the first center line O1 (first direction N1) and the second center line O2 (second direction N2) intersecting each other, bending portions are provided between the first connecting portion 611 and the first loop portion 610 and between the second connecting portion 621 and the second loop portion 620, so that the first connecting member 61 and the second connecting member 62 can be appropriately connected to a second connecting object and a third connecting object that are located further away.

[0142] Eleventh Modification of First Embodiment: Figure 38 shows an eleventh modification of the electronic device A100. In the electronic device A111 of this modification, the first center line O1 (first direction N1) and the second center line O2 (second direction N2) intersect with each other, similar to the electronic device A109. In this example, the third direction N3 is slightly inclined with respect to the first direction N1 in the opposite direction to the electronic device A110. The fourth direction N4 is slightly inclined with respect to the second direction N2 in the opposite direction to the electronic device A110.

[0143] This modification can reduce the space required to connect the first connecting member 61 and the second connecting member 62 and improve the temperature detection accuracy. As can be understood from this modification, the relationship between the first direction N1 and the third direction N3 and the relationship between the second direction N2 and the fourth direction N4 are not limited in any way.

[0144] 39 and 40 show an electronic device according to a second embodiment of the present disclosure. In an electronic device A200 of this embodiment, the configuration of a second connection member 62 differs from that of the above-described embodiment.

[0145] The second connection member 62 of this embodiment is connected by ball bonding. The second connection portion 621 has a circular shape when viewed in the z direction and bulges out toward the z1 side in the z direction. The second loop portion 620 includes a portion extending from the second connection portion 621 toward the z1 side in the z direction and a portion extending from that portion in the fourth direction N4. In the illustrated example, the first direction N1 and the third direction N3 are parallel (or approximately parallel) to each other. The first loop portion 610 is connected to the first connection portion 611 without a bent portion.

[0146] This embodiment can reduce the space required to connect the first connecting member 61 and the second connecting member 62 and improve the temperature detection accuracy. As can be understood from this embodiment, the method for connecting the second connecting member 62 is not limited in any way, and may be a method using the above-mentioned second wedge bonding tool WT2 or a method using ball bonding.

[0147] 41 shows an electronic device according to a second embodiment of the present disclosure. In the electronic device A300 of this embodiment, the first connection object is different from that in the above-described embodiments.

[0148] In this embodiment, the first connection portion 611 is connected to the first main surface 11A of the first conductive layer 1A of the support member 10A. The second connection portion 621 is connected to the first connection portion 611. The position on the first main surface 11A to which the first connection portion 611 is connected is a position close to the first switching element 21.

[0149] This embodiment can reduce the space required to connect the first connecting member 61 and the second connecting member 62 and improve the temperature detection accuracy. As can be understood from this embodiment, the first connection object of the present disclosure is not limited in any way. For example, if the first connection object is connected to the first main surface 11A (first conductive layer 1A, support member 10A) located near the first switching element 21, the temperature of the support member 10A can be detected, thereby indirectly detecting the temperature of the first switching element 21.

[0150] 42 shows an electronic device according to a fourth embodiment of the present disclosure. In an electronic device A400 of this embodiment, the configuration of a first connection portion 611 differs from that of the above-described embodiments.

[0151] In this embodiment, the first connecting portion 611 has a first ridge-like portion 6111, two first extending portions 6112, a third ridge-like portion 6115, and two third extending portions 6116. Furthermore, in this embodiment, the first connecting portion 611 has a first terminal end portion 6113, a first base end portion 6114, and a first relay portion 6117.

[0152] Similar to the first ridge 6111, the third ridge 6115 has a convex shape on the z1 side in the z direction, and extends so that its center line overlaps with the center line of the first ridge 6111. In the figure, the center line is indicated by a dashed dotted line. Similar to the cross-sectional shape of the first ridge 6111, the third ridge 6115 has a generally mountain-like or generally triangular shape, etc. The third ridge 6115 is located closer to the base end than the first ridge 6111.

[0153] The two third extending portions 6116 extend from the third ridge portion 6115 on both sides in a direction intersecting the center line. Like the first extending portion 6112, the third extending portions 6116 are smaller in size in the z direction than the third ridge portion 6115. The specific shape of the third ridge portion 6115 can be changed in various ways depending on the material of the first connecting member 61, the connection method and connection conditions of the first connecting portion 611, etc.

[0154] The first end portion 6113 is connected to the tip side of the first ridge portion 6111. The first base end portion 6114 is connected to the third ridge portion 6115 on the opposite side from the first end portion 6113, and is connected to the first loop portion 610. The first link portion 6117 is interposed between the first ridge portion 6111 and the third ridge portion 6115.

[0155] The third ridge-like portion 6115 and the two third extensions 6116 are formed by a method similar to the above-described connection method for the first connection portion 611. For example, the third ridge-like portion 6115 and the two third extensions 6116 are formed by pressing a portion of the first connection member 61 against the first electrode 212 with a first wedge bonding tool WT1 shown in Fig. 20. The first relay portion 6117 may be a loop-shaped portion that bulges out in the z-direction from the first electrode 212 before the second connection portion 621 is formed, for example.

[0156] In this embodiment, the second ridge 6211 overlaps with at least a portion of each of the first ridge 6111, the two first extensions 6112, the first ridge 61115, and the two third extensions 6116 when viewed in the z direction. In the example shown, the second ridge 6211 and the two first electrodes 212 overlap with all of the first ridge 6111, the two first extensions 6112, the first ridge 61115, and the two third extensions 6116 when viewed in the z direction. The second ridge 6211 overlaps with the first relay portion 6117 when viewed in the z direction.

[0157] According to this embodiment, the space required for connecting the first connecting member 61 and the second connecting member 62 can be reduced and temperature detection accuracy can be improved. The first connecting portion 611 has the third ridge portion 6115 and two third extending portions 6116, thereby increasing the bonding strength of the first connecting portion 611. When the second connecting portion 621 is positioned so as to overlap the first connecting portion 611 as viewed in the z direction, electrical continuity with the first connecting portion 611 is achieved. Therefore, the second connecting portion 621 can be positioned away from the first loop portion 610. This can reduce interference between the second wedge bonding tool WT2 shown in FIG. 23 and the first loop portion 610, thereby suppressing damage to the first loop portion 610.

[0158] The second ridge portion 6211 and the two six first electrodes 212 overlap with all of the first ridge portion 6111, the two first extension portions 6112, the first ridge portion 61115 and the two third extension portions 6116 when viewed in the z direction, thereby enabling the first connection portion 611 and the third connection portion 612 to be joined more reliably.

[0159] 43 shows a first modification of the electronic device A400. In the electronic device A401 of this modification, the relationship between the first connecting portion 611 and the third connecting portion 612 differs from that of the electronic device A400.

[0160] In this modified example, the second ridge portion 6211 and the two first electrodes 212 overlap with a portion of each of the first ridge portion 6111, the two first extension portions 6112, the first ridge portion 61115 and the two third extension portions 6116 when viewed in the z direction.

[0161] According to this modification, it is possible to reduce the space required to connect the first connecting member 61 and the second connecting member 62 and improve the temperature detection accuracy. It is also possible to suppress damage to the first loop portion 610. As can be understood from this modification, there are no limitations on how the first connecting portion 611 and the third connecting portion 612 overlap when viewed in the z direction.

[0162] 44 shows a second modification of the electronic device A400. In the electronic device A402 of this modification, the relationship between the first connecting portion 611 and the third connecting portion 612 is different from that in the above-described example.

[0163] In this modification, the second ridge 6211 and the two sixth first electrodes 212 overlap with the first ridge 6111 and the two first extensions 6112 when viewed in the z direction, but do not overlap with the first ridge 61115 and the two third extensions 6116. The second ridge 6211 and the two sixth first electrodes 212 overlap with the entire first ridge 6111 and the two first extensions 6112 when viewed in the z direction. The second ridge 6211 and the two sixth first electrodes 212 overlap with at least a portion of the first relay portion 6117 when viewed in the z direction.

[0164] According to this modification, it is possible to reduce the space required to connect the first connecting member 61 and the second connecting member 62 and improve the temperature detection accuracy. It is also possible to suppress damage to the first loop portion 610. In this modification, the second peak-shaped portion 6211 and the two second extending portions 6212 can be formed at positions farther away from the first loop portion 610 than the second connecting portion 621. This is therefore preferable for suppressing damage to the first loop portion 610.

[0165] 45 shows an electronic device according to a fifth embodiment of the present disclosure. In an electronic device A500 of this embodiment, the configuration of the third connection portion 612 differs from that of the above-described embodiments. The configuration of the third connection portion 612 of this embodiment can be combined with the above-described embodiments.

[0166] In this embodiment, the third connection portion 612 has a fourth ridge portion 6121, two fourth extension portions 6122, a fifth ridge portion 6125, two fifth extension portions 6126, a fourth end portion 6123, a fourth base end portion 6124 and a second relay portion 6127.

[0167] The fourth ridge portion 6121 and the two fourth extension portions 6122 have the same configuration as the above-described first ridge portion 6111 and the two first extension portions 6112. The fifth ridge portion 6125 and the two fifth extension portions 6126 have the same configuration as the above-described third ridge portion 6115 and the two third extension portions 6116. The fourth distal end portion 6123, the fourth proximal end portion 6124, and the second link portion 6127 have the same configuration as the above-described first distal end portion 6113, the first proximal end portion 6114, and the first link portion 6117, respectively.

[0168] This embodiment can reduce the space required to connect the first connecting member 61 and the second connecting member 62 and improve the temperature detection accuracy. It also reduces damage to the first loop portion 610. This embodiment can increase the bonding strength of the third connecting portion 612. The configuration of this embodiment may be employed, for example, in the third connecting portion 652.

[0169] The electronic device and the method for manufacturing the electronic device according to the present disclosure are not limited to the above-described embodiments. The specific configurations of the electronic device and the method for manufacturing the electronic device according to the present disclosure can be freely designed in various ways. The present disclosure includes the embodiments described in the following appendices.

[0170] Supplementary Note 1. A first connection object; a first connection member (61) having a first connection portion (611) connected to a first side in a thickness direction of the first connection object and a first loop portion (610) connected to the first connection portion (611), the first connection member (61) being mainly composed of a first metal; and a second connection member (62) having a second connection portion (621) connected to the first connection portion (611) and a second loop portion (620) connected to the second connection portion (621) and spaced from the first loop portion (610), the second connection member (62) being mainly composed of a second metal having a thermoelectric power different from that of the first metal, The electronic device (A100) according to Supplementary Note 1, wherein the first connection portion (611) has a first ridge portion (6111) that is convex toward the first side in the thickness direction and extends in a first direction (N1) that intersects the thickness direction, and two first extension portions (6112) that extend on both sides of the direction that intersects the first direction (N1). Supplementary Note 2: The electronic device (A100) according to Supplementary Note 1, wherein the second connection portion (621) has a second ridge portion (6211) that is convex toward the first side in the thickness direction and extends in a second direction (N2) that intersects the thickness direction, and two second extension portions (6212) that extend on both sides of the direction that intersects the second direction (N2). Supplementary Note 3: The electronic device (A102) according to Supplementary Note 2, wherein at least one of the two second extension portions (6212) contacts the first connection object. Supplementary Note 4. The electronic device (A100) according to Supplementary Note 2, wherein each of the two second extension portions (6212) contacts the first connection object. Supplementary Note 5. The electronic device (A100) according to any one of Supplements 2 to 4, wherein the first direction (N1) and the second direction (N2) are parallel to each other. Supplementary Note 6. The electronic device (A100) according to Supplementary Note 5, wherein a first center line (O1) that is the center line of the first connection portion (611) and a second center line (O2) that is the center line of the second connection portion (621) coincide with each other when viewed in the thickness direction. Supplementary Note 7. The electronic device (A105) according to Supplementary Note 5, wherein the first center line (O1) that is the center line of the first connection portion (611) and the second center line (O2) that is the center line of the second connection portion (621) are offset from each other when viewed in the thickness direction.Supplementary Note 8. The electronic device (A100) according to any one of Supplementary Notes 5 to 7, wherein, when viewed in the thickness direction, the first loop portion (610) extends along a third direction (N3) intersecting the first direction (N1), and the second loop portion (620) extends along a fourth direction (N4) intersecting the second direction (N2). Supplementary Note 9. The electronic device (A100) according to any one of Supplementary Notes 2 to 4, wherein the first direction (N1) and the second direction (N2) intersect with each other. Supplementary Note 10. The electronic device (A1009) according to Supplementary Note 9, wherein, when viewed in the thickness direction, the first loop portion (610) extends along the first direction (N1), and the second loop portion (620) extends along the second direction (N2). Supplementary Note 11. The electronic device (A100) according to Supplementary Note 1 or 2, wherein the second loop portion (620) is thicker than the first loop portion (610). Supplementary Note 12. The electronic device (A100) according to any one of Supplements 1 to 11, wherein the first metal is harder than the second metal. Supplementary Note 13. The electronic device (A100) according to Supplementary Note 12, wherein the first metal includes constantan, and the second metal includes Cu. Supplementary Note 14. The electronic device (A400) according to Supplementary Note 1, wherein the first connection portion (611) has a third ridge portion (6115) that is convex toward the first side in the thickness direction and extends in the first direction (N1), and two third extension portions (6116) that extend on both sides in a direction intersecting the first direction (N1). Supplementary Note 14-1. The electronic device (A400) according to Appendix 14, wherein the second connection portion (621) overlaps with at least a portion of each of the first ridge portion (6111), the two first extension portions (6112), the third ridge portion (6115), and the two third extension portions (6116) when viewed in the thickness direction. Appendix 14-2. The electronic device (A400) according to Appendix 14, wherein the second connection portion (621) overlaps with all of the first ridge portion (6111), the two first extension portions (6112), the third ridge portion (6115), and the two third extension portions (6116) when viewed in the thickness direction.Supplementary Note 14-3. The electronic device (A401) according to Supplementary Note 14, wherein the second connection portion (621) overlaps with a portion of each of the first ridge portion (6111), the two first extension portions (6112), the third ridge portion (6115), and the two third extension portions (6116) when viewed in the thickness direction. Supplementary Note 14-4. The electronic device (A402) according to Supplementary Note 14, wherein the second connection portion (621) overlaps with at least a portion of each of the first ridge portion (6111) and the two first extension portions (6112) when viewed in the thickness direction, but does not overlap with the third ridge portion (6115) and the two third extension portions (6116). Supplementary Note 15. The electronic device (A100) according to any one of Supplements 1 to 14, wherein the first connection object is an electronic element. Supplementary Note 16. A method for manufacturing an electronic device, comprising: connecting a first connection member (61) mainly composed of a first metal to a first connection object using a wedge bonding tool; and connecting a second connection member (62) mainly composed of a second metal to a first connection portion (611) that is a portion of the first connection member (61) connected to the first connection object. Appendix 17. The electronic device (A101) according to Appendix 1, wherein the second connection portion (621) is spaced from the first connection object. Appendix 18. The electronic device (A103) according to Appendix 1, wherein the second loop portion (620) is thinner than the first loop portion (610). Appendix 19. The electronic device (A104) according to Appendix 1, wherein the thickness of the first loop portion (610) and the thickness of the second loop portion (620) are equal to each other. Appendix 20. The electronic device (A100) according to Appendix 15, wherein the electronic element is a switching element. Supplementary Note 21. The electronic device (A100) according to Supplementary Note 20, wherein the switching element has a drain electrode, a source electrode, and a gate electrode, and the first connection portion (611) is connected to the source electrode. Supplementary Note 22. The electronic device (A300) according to any one of Supplements 1 to 21, further comprising an electronic element, and the first connection object is a support member on which the electronic element is mounted.Supplementary Note 23. The electronic device (A100) according to any one of Supplementary Notes 1 to 22, further comprising a second connection object and a third connection object, wherein the first connection member (61) has a third connection portion (612) connected to the second connection object, and the second connection member (62) has a fourth connection portion (622) connected to the third connection object.

[0171] A100, A101, A102, A103, A104, A105, A106, A107, A108, A109, A110, A111, A200, A300, A400, A401, A402, A500: electronic device 1A: first conductive layer 1B: second conductive layer 7: sealing resin 10A: support member 10B: support member 10Bb: support member 11A: first main surface 11B: second main surface 21: first switching element (first connection object, electronic element) 22: second switching element (first connection object, electronic element) 29: conductive bonding layer 31: first main conductive member 32: second main conductive member 33: third main conductive member 41: first sub-conductive member 42: second sub-conductive member 43: Third sub-conductive member 44: Fourth sub-conductive member 45: Fifth sub-conductive member 46: Sixth sub-conductive member 47: Seventh sub-conductive member 48: Eighth sub-conductive member 51, 51A, 51B, 52, 52A, 52B: Main connecting member 61: First connecting member 62: Second connecting member 63: Sub-connecting member 64: Sub-connecting member 65: First connecting member 66: Second connecting member 67: Sub-connecting member 68: Sub-connecting member 69: Gap 71: Top surface 72: Bottom surface 73: First side surface 74: Second side surface 75: Third side surface 76: Fourth side surface 101: Insulating layer 102: Support layer 103: Heat dissipation layer 211: Second electrode 212: First electrode 213: Third electrode 214: Fourth electrode 221: Sixth electrode 222: Fifth electrode 223: Seventh electrode 224: Eighth electrode 311: First main terminal 319: First bolster 321: Second main terminal 329: Second bolster 331: Third main terminal 332: Extension portion 411: First sub-terminal portion 412: First sub-wiring portion (second connection object) 421: Second sub-terminal portion 422: Second sub-wiring portion (third connection object) 431: Third sub-terminal portion 432: Third sub-wiring portion 441: Fourth sub-terminal portion 442: Fourth sub-wiring portion 451: Fifth sub-terminal portion 452: Fifth sub-wiring portion (second connection object) 461: Sixth sub-terminal portion 462: Sixth sub-wiring portion (third connection object) 471: Seventh sub-terminal portion 472: Seventh sub-wiring portion 481: Eighth sub-terminal portion 482: Eighth sub-wiring portion 510: Loop portion 511: Connection portion 512: Connection portion 520: Loop portion 521: Connection portion 522: Connection portion610: First loop portion 611: First connecting portion 612: Third connecting portion 620: Second loop portion 621: Second connecting portion 622: Fourth connecting portion 650: First loop portion 651: First connecting portion 652: Third connecting portion 660: Second loop portion 661: Second connecting portion 662: Fourth connecting portion 2121: First layer 2122: Second layer 2123: Third layer 3111: First mounting hole 3211: Second mounting hole 3311: Third mounting hole 3321: First portion 3322: Second portion 3323: Third portion 6111: First ridge portion 6112: First extending portion 6113: First distal end portion 6114: First proximal end portion 6211: Second ridge portion 6212: Second extension portion 6213: Second terminal end portion 6214: Second base end portion N1: First direction N2: Second direction N3: Third direction N4: Fourth direction O1: First center line O2: Second center line WT1: First wedge bonding tool WT2: Second wedge bonding tool z0, z1, z2: Distance

Claims

1. An electronic device comprising: a first connection object; a first connection member having a first connection portion connected to a first side in a thickness direction of the first connection object and a first loop portion connected to the first connection portion, the first connection member being primarily composed of a first metal; and a second connection member having a second connection portion connected to the first connection portion and a second loop portion connected to the second connection portion and spaced from the first loop portion, the second connection member being primarily composed of a second metal having a thermoelectric power different from that of the first metal, wherein the first connection portion has a first peak portion that is convex toward the first side in the thickness direction and extends in a first direction intersecting the thickness direction, and two first extension portions that extend on both sides in a direction intersecting the first direction.

2. The electronic device described in claim 1, wherein the second connection portion has a second peak portion that is convex toward the first side in the thickness direction and extends in a second direction intersecting the thickness direction, and two second extension portions that extend on both sides in a direction intersecting the second direction.

3. The electronic device according to claim 2, wherein at least one of the two second extension portions contacts the first connection object.

4. The electronic device according to claim 2, wherein each of the two second extension portions contacts the first connection object.

5. The electronic device according to any one of claims 2 to 4, wherein the first direction and the second direction are parallel to each other.

6. The electronic device according to claim 5, wherein a first center line that is a center line of the first connection portion and a second center line that is a center line of the second connection portion coincide with each other when viewed in the thickness direction.

7. The electronic device according to claim 5, wherein a first center line that is a center line of the first connection portion and a second center line that is a center line of the second connection portion are offset from each other when viewed in the thickness direction.

8. An electronic device as described in any one of claims 5 to 7, wherein, when viewed in the thickness direction, the first loop portion extends along a third direction intersecting the first direction, and the second loop portion extends along a fourth direction intersecting the second direction.

9. The electronic device according to claim 2, wherein the first direction and the second direction intersect with each other.

10. The electronic device of claim 9, wherein, when viewed in the thickness direction, the first loop portion extends along the first direction, and the second loop portion extends along the second direction.

11. The electronic device of claim 1 or 2, wherein the second loop portion is thicker than the first loop portion.

12. The electronic device of claim 1, wherein the first metal is harder than the second metal.

13. The electronic device of claim 12, wherein the first metal comprises constantan and the second metal comprises Cu.

14. The electronic device of claim 1, wherein the first connection portion has a third ridge portion that is convex toward the first side in the thickness direction and extends in a first direction intersecting the thickness direction, and two third extension portions that extend on both sides in a direction intersecting the first direction.

15. The electronic device according to any one of claims 1 to 14, wherein the first connection object is an electronic element.

16. A method for manufacturing an electronic device, comprising: a step of connecting a first connection member, the main component of which is a first metal, to a first connection object using a wedge bonding tool; and a step of connecting a second connection member, the main component of which is a second metal, to a first connection portion, which is a portion of the first connection member that is connected to the first connection object.

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