Mounting device and mounting method

Abstract

Provided is a technology related to a compact mounting device capable of separating a substrate from a heat source when the substrate is not desired to be heated. A mounting device (1) for mounting electronic components (CH11, CH12, ...) on substrates (SB1, SB2, ...) comprises: a lower die (10) configured to hold the substrates (SB1, SB2, ...) on which the electronic components (CH11, 12, ...) are placed; and an upper die (20) disposed opposite the lower die (10). The lower die (10) is provided with: a cavity plate (11A) that faces the space between the lower die (10) and the upper die (20); a heater (14) that heats the cavity plate (11A); lifter pins (12A, 12B, ...) that hold the substrates (SB1, SB2, ...); and set pins (16) that are pressed by the upper die (20). The lifter pins (12A, 12B, ...) are configured to be able to change the distance (d) between the substrates (SB1, SB2, ...) and the cavity plate (11A) by means of pressing force applied from the upper die (20) to the set pins (16).

Description

Mounting device and mounting method

[0001] The present invention relates to a mounting apparatus and a mounting method using the apparatus.

[0002] There are bonding techniques in which bonding materials or bumps placed between a substrate and an electronic component are heated while being pressurized. For example, sintering bonding sinters the bonding material placed between the substrate and the electronic component by heating the material while being pressurized. Bump bonding melts the bumps placed between the substrate and the electronic component by heating the bumps while being pressurized. In such bonding techniques, heating the bonding material or bumps without being pressurized can reduce the adhesive strength between the substrate and the electronic component.

[0003] In order to prevent the bonding material or bumps from being heated at an undesired time, a device has been proposed that provides a float mechanism in a mold that lifts the substrate and separates the substrate from the heat source until the desired time. For example, Patent Document 1 discloses a bonding device that has movable support pins that can protrude from a heated clamping surface, and that uses the movable support pins to lift a workpiece on which metal bumps such as solder bumps are temporarily bonded to a substrate with an adhesive layer, thereby separating the workpiece from the clamping surface until the time for actual bonding.

[0004] JP 2012-231080 A

[0005] The bonding device disclosed in Patent Document 1 moves movable support pins up and down using an elevating mechanism (not shown). Adding a servo motor or the like as an elevating mechanism increases the number of parts and the size of the device. The present invention has been made in consideration of this problem, and aims to provide technology related to a compact mounting device that can separate a substrate from a heat source when heating the substrate is not desired.

[0006] A mounting apparatus according to one aspect of the present invention is a mounting apparatus for mounting at least one electronic component on at least one substrate, and includes a first mold configured to hold at least one substrate on which at least one electronic component is placed, and a second mold disposed opposite the first mold. The first mold includes a heating plate facing a space between the first mold and the second mold, a heater for heating the heating plate, at least one holding member for holding the at least one substrate, and at least one pressing member pressed against the second mold. The at least one holding member is configured to change the distance between the at least one substrate and the heating plate by the pressing force applied by the second mold to the at least one pressing member.

[0007] A mounting method according to another aspect of the present invention is a mounting method for mounting at least one electronic component on at least one substrate, the method including: preparing a first mold configured to hold at least one substrate on which the at least one electronic component is placed; and preparing a second mold disposed opposite the first mold. The first mold includes a heating plate facing a space between the first mold and the second mold, a heater for heating the heating plate, at least one holding member for holding the at least one substrate, and at least one pressing member for pressing against the second mold. The mounting method further includes causing the at least one holding member to change a distance between the at least one substrate on which the at least one electronic component is placed or mounted and the heating plate by a pressing force applied by the second mold to the at least one pressing member.

[0008] According to the present invention, it is possible to provide a technology relating to a compact mounting device that can separate a substrate from a heat source when heating the substrate is not desired.

[0009] FIG. 1 is a cross-sectional view showing an example of a mounting apparatus according to an embodiment of the present invention. FIG. 2 is a cross-sectional view showing an example of a gas supply port shown in FIG. 1. FIG. 3 is a flow chart showing an example of a mounting method using the mounting apparatus according to an embodiment of the present invention. FIG. 4 is a flow chart continuing from FIG. 3 showing an example of a mounting method using the mounting apparatus according to an embodiment of the present invention. FIG. 5 is a diagram showing the temperature profile of the mounting method shown in FIGS. 3 and 4. FIG. 6 is a cross-sectional view showing a state in which the mold is closed to a second position and an inert gas is supplied while the degassing chamber is closed and degassed. FIG. 7 is a cross-sectional view showing a state in which the mold is closed to a third position and the distance between the substrate and the heating plate is reduced. FIG. 8 is a cross-sectional view showing a state in which the mold is closed to a fourth position and is heated by the heating plate while being pressed by the movable piece. FIG. 9 is a cross-sectional view showing a state in which the mold is opened to the second position and the distance between the substrate and the heating plate is increased.

[0010] A preferred embodiment of the present invention will be described with reference to the accompanying drawings. In each drawing, components with the same reference numerals have the same or similar configurations. In the following description, "upper" and "lower" are defined based on gravity. FIG. 1 is a cross-sectional view showing an example of a mounting apparatus 1 according to an embodiment of the present invention. The mounting apparatus 1 is a mounting apparatus for mounting at least one electronic component on at least one substrate.

[0011] In the illustrated example, the mounting apparatus 1 is configured as a sintering apparatus that heats and pressurizes the bonding materials SN11 and SN12 arranged between the substrate SB1 and the electronic components CH11 and CH12 to sinter them, thereby bonding the substrate SB1 and the electronic components CH11 and CH12. The number of electronic components and bonding materials per substrate is not limited to two as shown in the figure; three or more electronic components may be arranged in a matrix on one substrate, or one electronic component may be arranged on one substrate. In the illustrated example, two substrates are set on the left and right sides as viewed from the operator, but multiple substrates may be set in front and behind the operator. The mounting apparatus 1 is not limited to a sintering apparatus and may be a flip-chip bonder that heats and pressurizes solder bumps or the like arranged between the electronic components SB1 and the substrates CH11 and CH12, or any other mounting apparatus.

[0012] In the following description, the substrate SB1, electronic components CH11, CH12, and bonding materials SN11, SN12 are collectively referred to as the workpiece W1. The mounting device 1 may mount multiple workpieces with a single application of heat and pressure. In the illustrated example, two workpieces W1, W2 are mounted with a single application of heat and pressure. The other workpiece W2 includes the same substrate SB2, electronic components CH21, CH22, and bonding materials SN21, SN22 as the first workpiece W1. The number of electronic components on each substrate is at least one and is not limited to two. It may be one, or three or more.

[0013] In the space between the lower mold 10 and the upper mold 20, the workpiece W1 is supplied so that the board SB1 faces the lower mold 10 and the electronic components CH11 and CH12 face the upper mold 20, and the workpiece W2 is supplied so that the board SB2 faces the lower mold 10 and the electronic components CH21 and CH22 face the upper mold 20. In the following description, the surfaces on which the electronic components CH11, 12, 21, and 22 are mounted may be referred to as the front or top surfaces of the boards SB1 and SB2, and the opposite surfaces may be referred to as the back or bottom surfaces of the boards SB1 and SB2.

[0014] When the mounting apparatus 1 is a sintering apparatus, preferred examples of the substrates SB1 and SB2 include a high-heat-dissipation ceramic insulating (Direct Bonded Copper: DBC) substrate with a copper circuit, a high-heat-dissipation ceramic insulating (Direct Bonded Aluminum: DBA) substrate with an aluminum circuit, etc. The substrate 102 is not limited to a ceramic substrate, and may be a semiconductor substrate such as a silicon substrate, a metal substrate such as a lead frame, or an insulator substrate such as a PCB (Printed Circuit Board) substrate. The thicknesses of the substrates SB1 and SB2 may be different from each other or the same, for example.

[0015] The electronic components CH11, CH12, CH21, and CH22 are, for example, semiconductor chips. The electronic components CH11, CH12, CH21, and CH22 are not limited to semiconductor chips and may be passive elements such as resistors, inductors, capacitors, and quartz oscillators, or active elements such as diodes, transistors, thyristors, and operational amplifiers. The heights of the electronic components CH11 and CH12 may be different from each other or the same. The heights of the electronic components CH21 and CH22 may also be different from each other or the same.

[0016] The bonding materials SN11, SN12, SN21, and SN22 are, for example, sintering materials containing silver (Ag) nanoparticles. The mounting device 1 heats and pressurizes the bonding materials SN11, SN12, SN21, and SN22 to sinter them. The bonding materials SN11, SN12, SN21, and SN22 are not limited to sintering materials, and may be semi-sintering materials, metal solder, organic adhesives, or inorganic adhesives. The bonding material may be, for example, a powder aggregate. The bonding material may be in the form of a liquid, semi-solid, solid, or film.

[0017] 1, the mounting apparatus 1 includes a press device 3 and a mold 2 attached to the press device 3. In the illustrated example, the mounting apparatus 1 further includes degassing chambers 31 and 32. The press device 3 includes a pair of upper and lower platens 4 and 5 connected by tie bars.

[0018] The mold 2 includes an upper mold base 21E fixed to the upper platen 5 and a lower mold base 11F fixed to the lower platen 4. The main plates that make up the mold 2 (support plates 21D, 21C, upper mold chase 21B, lower mold chase 11B, ejector pin plate 11C, retainer plate 11D, etc.) are fixed between the upper mold base 21E and the lower mold base 11F.

[0019] In the following description, the various plates and their parts fixed to the lower die base 11F will be collectively referred to as the lower die 10, and the various plates and their parts fixed to the upper die base 21E will be collectively referred to as the upper die 20. The lower die 10 is an example of a "first die" configured to hold the workpieces W1 and W2, and the upper die 20 is an example of a "second die" arranged opposite the first die.

[0020] The lower mold 10 mainly includes a lower mold base 11F, support pillars 11E, a retainer plate 11D, an ejector pin plate 11C, a lower mold chase 11B, etc. The lower mold chase 11B is fixed above the lower mold base 11F via a plurality of support pillars 11E that protrude in a columnar shape from the lower mold base 11F.

[0021] An ejector pin plate 11C and a retainer plate 11D are disposed below the lower die chase 11B. The ejector pin plate 11C and the retainer plate 11D have holes through which the support pillars 11E pass. The ejector pin plate 11C and the retainer plate 11D are fixed to each other and configured to be slidable up and down between the lower die chase 11B and the lower die base 11F.

[0022] Various parts including the cavity plate 11A are fixed to the lower die chase 11B. In the example shown, the cavity plate 11A, a side block 18 that fixes the cavity plate 11A, a heat insulating member 15 that is arranged to surround the bottom and side surfaces of the cavity plate 11A, a spring 17B, and a spring sleeve 17A are fixed to the lower die chase 11B.

[0023] Both the ejector pin plate 11C and the retainer plate 11D face the cavity plate 11A from the lower side opposite the upper mold 20. A plurality of lifter pins 12A, 12B that can be protruded and retracted from the cavity plate 11A, and a set pin 16 that abuts against the upper mold 20 when the molds are closed are fixed to the ejector pin plate 11C and the retainer plate 11D.

[0024] When the ejector pin plate 11C and the retainer plate 11D both approach the cavity plate 11A, the lifter pins 12A and 12B protrude from the cavity plate 11A, and when the ejector pin plate 11C and the retainer plate 11D both move away from the cavity plate 11A, the lifter pins 12A and 12B retract into the cavity plate 11A. In the following description, the ejector pin plate 11C and the retainer plate 11D may be collectively referred to as movable plates 11C and 11D.

[0025] The cavity plate 11A is formed in a block shape from a material such as alloy tool steel. The cavity plate 11A is located closest to the upper mold 20 and is in contact with the space between the lower mold 10 and the upper mold 20 when the molds are open. A heater 14 is provided inside the cavity plate 11A. When the lower mold 10 and the upper mold 20 are closed, the heater 14 heats the substrates SB1 and SB2 via the cavity plate 11A. This heats the bonding materials SN11, SN12, SN21, and SN22. The cavity plate 11A is an example of a "heating plate" that faces the space between the lower mold 10 and the upper mold 20 and is heated by the heater 14.

[0026] The heat insulating members 15 are provided between the cavity plate 11A and the lower die chase 11B, and between the cavity plate 11A and the side blocks 18. The heat insulating members 15 are made of a material with high thermal resistance, such as glass wool or rock wool, and suppress direct heat conduction from the cavity plate 11A to the lower die chase 11B, and suppress heat conduction from the cavity plate 11A to the lower die chase 11B via the side blocks 18.

[0027] In other words, the heat insulating member 15 is disposed so as to separate the gas pipe provided in the lower die chase 11B from the heater 14, thereby suppressing the temperature rise of the nitrogen gas supplied from the gas supply port 13. The heat insulating member 15 is also disposed so as to separate the spring 17B from the heater 14, thereby suppressing a decrease in the elastic force of the spring 17B. In other words, by limiting the heating target to the cavity plate 11A, the heat insulating member 15 accelerates the temperature rise caused by the heater 14 and makes other components less susceptible to the heat.

[0028] The side blocks 18 are provided outside the cavity plate 11A when viewed from above from the upper mold 20. The side blocks 18 come into contact with the upper mold 20 when the lower mold 10 and the upper mold 20 are closed. In the illustrated example, nitrogen (N ２ ) gas. The gas supply port 13 will be described in detail later with reference to FIG.

[0029] The spring 17B is an example of a "biasing member" and biases the ejector pin plate 11C and retainer plate 11D, which are examples of the aforementioned "movable plates," upward toward the lower die chase 11B. The base end, i.e., the upper end, of the spring sleeve 17A is a shoulder bolt and is fixed to the underside of the lower die chase 11B. The base end of the spring sleeve 17A may be a combination of a washer, sleeve, and bolt. A flange is provided at the tip end, i.e., the lower end, of the spring sleeve 17A.

[0030] The retainer plate 11D has a through hole larger than the tip end of the spring sleeve 17A. The ejector pin plate 11C has a counterbore of the same diameter as the through hole and a through hole at the center of the counterbore through which the base end of the spring sleeve 17A passes. The spring sleeve 17A passes through the through hole of the retainer plate 11D and the through hole of the ejector pin plate 11C.

[0031] The spring 17B is spirally disposed around the spring sleeve 17A between the flange of the spring sleeve 17A and the counterbore of the ejector pin plate 11C. In other words, the spring sleeve 17A is inserted into the spiral spring 17B. The spring 17B exerts an elastic force in a direction that moves the ejector pin plate 11C and the flange at the tip of the spring sleeve 17A away from each other.

[0032] That is, the spring 17B constantly urges the ejector pin plate 11C and the retainer plate 11D toward the lower die chase 11B via the spring sleeve 17A, i.e., presses the ejector pin plate 11C and the retainer plate 11D in a direction to move them upward. The spring 17B is not limited to a coil spring, and may be a leaf spring or the like.

[0033] The lifter pins 12A and 12B are inserted into through holes that penetrate the cavity plate 11A, lower die chase 11B, ejector pin plate 11C, and heat insulating member 15. The lifter pins 12A and 12B are the same length, and three or more lifter pins are used to hold one workpiece W1 in parallel. The tip end is on the upper die 20 side, and the base end is on the lower die base 11F side. The base ends of the lifter pin 12B and set pin 16 are sandwiched between the ejector pin plate 11C and retainer plate 11D and screwed in place. The lifter pin 12B and set pin 16 move up and down in conjunction with the ejector pin plate 11C and retainer plate 11D.

[0034] The lifter pins 12A support the substrate SB1 by bringing their tips into contact with the rear surface of the substrate SB1, and the lifter pins 12B support the substrate SB2 by bringing their tips into contact with the rear surface of the substrate SB2. The lifter pins 12A and 12B are configured to be movable up and down, and move the substrates SB1 and SB2 toward and away from the cavity plate 11A.

[0035] Specifically, the lifter pins 12A, 12B are configured to be able to advance and retreat from the cavity plate 11A relative to the upper mold 20. When the lifter pins 12A, 12B advance into the space between the lower mold 10 and the upper mold 20, i.e., during mold opening, the workpieces W1, W2 supported by the lifter pins 12A, 12B move away from the cavity plate 11A. When the lifter pins 12A, 12B retreat from the space between the lower mold 10 and the upper mold 20, i.e., during mold closing, the workpieces W1, W2 are supported in contact with the cavity plate 11A.

[0036] When the ejector pin plate 11C and the retainer plate 11D approach (move upward) the cavity plate 11A, the tips of the lifter pins 12A and 12B protrude from the cavity plate 11A. That is, the tips of the lifter pins 12A and 12B advance into the space between the lower mold 10 and the upper mold 20.

[0037] When the ejector pin plate 11C and the retainer plate 11D move away from the cavity plate 11A (move downward), the tips of the lifter pins 12A and 12B are housed inside the cavity plate 11A, and the surfaces of the end portions of the lifter pins 12A and 12B become flush with the surface of the cavity plate 11A. In other words, the lifter pins 12A and 12B have retracted from the space between the lower mold 10 and the upper mold 20.

[0038] Each of the lifter pins 12A and 12B is formed in a rod shape. The lifter pins 12A and 12B are an example of a "holding member" that holds the substrates SB1 and SB2. Note that the holding members are not limited to lifter pins. The holding members may be elongated plate-like members that hold the ends of the workpieces.

[0039] The substrates SB1 and SB2 are supported by the tips (upper ends) of the lifter pins 12A and 12B. Each of the lifter pins 12A and 12B is inserted into a through-hole that penetrates the cavity plate 11A and is fixed to the ejector pin plate 11C and the retainer plate 11D, which are movable plates.

[0040] The set pin 16 is inserted into a through-hole that penetrates the side block 18, the lower die chase 11B, and the ejector pin plate 11C. The set pin 16 has a tip end on the upper die 20 side and a base end on the lower die base 11F side. The base end of the set pin 16 is sandwiched between the ejector pin plate 11C and the retainer plate 11D. The tip end of the set pin 16 faces the side block 28 of the upper die 20.

[0041] When the lower mold 10 and the upper mold 20 are closed, the set pins 16 are pressed by the side blocks 28, pushing down the ejector pin plate 11C and the retainer plate 11D. By pushing down the ejector pin plate 11C and the retainer plate 11D, the lifter pins 12B are pushed down in conjunction with each other, and the substrates SB1 and SB2 on the lifter pins 12B move downward. In order to push down the ejector pin plate 11C and the retainer plate 11D in parallel, it is preferable that the set pins 16 be arranged at the four corners of the substrate SB1.

[0042] One of the features of the mounting apparatus 1 of this embodiment is that it includes a float mechanism that lifts the substrates SB1 and SB2 so that the substrates SB1 and SB2 are spaced apart from the cavity plate 11A. In the illustrated example, the float mechanism includes lifter pins 12A and 12B that can contact the back surfaces of the substrates SB1 and SB2 that are inserted into the through holes of the cavity plate 11A, a movable ejector pin plate 11C to which the base ends (lower ends) of the lifter pins 12A and 12B are fixed, a movable retainer plate 11D, a coil spring 17B that biases the movable ejector pin plate 11C and the movable retainer plate 11D toward the cavity plate 11A, and a set pin 16 that, when pressed by the upper mold 20, presses down the movable ejector pin plate 11C and the movable retainer plate 11D against the biasing force of the coil spring 17B.

[0043] The upper mold 20 mainly includes an upper mold base 21E, an upper support plate 21D, a lower support plate 21C, an upper mold chase 21B, and a pressure adjustment mechanism 9. The upper and lower support plates 21D and 21C are fixed to the upper mold base 21E. The upper mold chase 21B is fixed to the upper mold base 21E via the upper support plate 21D and the lower support plate 21C.

[0044] Various parts including the cavity plate 21A are fixed to the upper die chase 21B. In the example shown, the upper die chase 21B is provided with the cavity plate 21A, side blocks 28 that fix the cavity plate 21A, a heat insulating member 25 that is arranged to surround the top and side surfaces of the cavity plate 21A, and part of the pressure adjustment mechanism 9. The pressure adjustment mechanism 9 will be described in detail later.

[0045] The cavity plate 21A is located closest to the lower mold 10. A heater 24 is provided inside the cavity plate 21A. The heater 24 heats movable pieces 22Ab, 22Bb, 22Cb, and 22Db (described later) through the cavity plate 21A.

[0046] When the lower mold 10 and the upper mold 20 are closed, the heater 24 heats the electronic components CH11, CH12, CH21, and CH22 through the movable pieces 22Ab, 22Bb, 22Cb, and 22Db and the film F. This heats the bonding materials SN11, SN12, SN21, and SN22.

[0047] The side block 28 is provided on the side of the upper die chase 21B facing the lower die 10. When viewed from above from the upper die 20, the side block 28 is provided outside the cavity plate 21A. The side block 28 is a portion of the upper die 20 that abuts against the lower die 10 when the lower die 10 and the upper die 20 are closed. The side block 28 fixed to the upper die chase 21B faces the side block 18 fixed to the lower die chase 11B in the vertical direction.

[0048] The set pin 16 described above is an example of a "pressing member" that is pressed against the upper mold 20, which is the second mold. When the lower mold 10 and the upper mold 20 are closed, the side block 28 of the upper mold 20 abuts against and presses the set pin 16. When the lower mold 10 and the upper mold 20 are closed, the side block 28 may be spaced apart from the set pin 16.

[0049] The heat insulating member 25 is provided between the cavity plate 21A and the upper die chase 21B, and between the cavity plate 21A and the side block 28. The heat insulating member 25 suppresses direct heat conduction from the cavity plate 21A to the upper die chase 21B, and suppresses heat conduction from the cavity plate 21A to the upper die chase 21B via the side block 28.

[0050] The heat insulating member 25 prevents thermal deterioration of the springs 23A, 23B, 23C, and 23D by separating the heater 24 from the internal space 23. In other words, by limiting the heating target to the cavity plate 21A, the heat insulating member 25 accelerates the temperature rise caused by the heater 24 and makes other members less susceptible to the heat.

[0051] When performing the mounting process, a film F is stretched on the surface of the cavity plate 21A facing the lower mold 10. Suction holes (not shown) are provided on the lower surface of the cavity plate to suck the film F. The suction holes are connected to an external vacuum suction pump.

[0052] Examples of film F that can be suitably used include film materials that are excellent in heat resistance, ease of peeling, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (ethylene-tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), fluorine-impregnated glass cloth, PP (polypropylene), and PVDC (polyvinylidine chloride).

[0053] The film F prevents powder and gas generated from the bonding materials SN11, SN12, SN21, and SN22 from entering the gaps in the upper die 20, thereby suppressing malfunction of the upper die 20. The film F also functions as a buffer between the movable pieces 22Ab, 22Bb, 22Cb, and 22Db and the electronic components CH11, CH12, CH21, and CH22, and has the effect of suppressing damage to the electronic components CH11, CH12, CH21, and CH22 when pressure is applied.

[0054] The upper mold 20 is equipped with a pressure adjustment mechanism 9 that adjusts the pressure applied to each of the electronic components CH11, CH12, CH21, and CH22 to prevent mounting defects from occurring due to insufficient or excessive pressure on the bonding materials SN11, SN12, SN21, and SN22 caused by differences in the dimensions of the substrates SB1, SB2 and the electronic components CH11, CH12, CH21, and CH22.

[0055] In the illustrated example, the pressure regulating mechanism 9 is made up of movable mechanisms 22A, 22B, 22C, and 22D, springs 23A, 23B, 23C, and 23D, etc. The movable mechanisms 22A, 22B, 22C, and 22D are connected to the springs 23A, 23B, 23C, and 23D and are configured to be movable up and down.

[0056] The pressure adjusting mechanism 9 absorbs the difference in thickness of the boards SB1 and SB2, the difference in height of the electronic components CH11, CH12, CH21, and CH22, and the difference in thickness of the bonding materials SN11, SN12, SN21, and SN22, and applies a substantially uniform pressure to the bonding materials SN11, SN12, SN21, and SN22. The pressures applied to the electronic components CH11, CH12, CH21, and CH22 may be configured to be different from one another by selecting springs 23A, 23B, 23C, and 23D having different spring constants.

[0057] The configuration of the pressure regulating mechanism 9 is not limited to the example shown in the drawing. The configuration of the pressure regulating mechanism 9 may be, for example, a configuration provided with a viscous material such as silicone oil sealed in a closed space within the upper mold 20, a plunger that adjusts the internal pressure by pressurizing the viscous material, and a plurality of pistons that move up and down due to the internal pressure of the viscous material, with movable mechanisms 22A, 22B, 22C, and 22D connected to each of the plurality of pistons.

[0058] In this configuration, a pressure equal to the internal pressure of the viscous material is applied to all pistons, so that differences in the thickness of the substrates SB1 and SB2, differences in the height of the electronic components CH11, CH12, CH21, and CH22, and differences in the thickness of the bonding materials SN11, SN12, SN21, and SN22 can be absorbed, and the bonding materials SN11, SN12, SN21, and SN22 can be pressurized with an equal pressure.

[0059] The rod-shaped members of the movable mechanisms 22A, 22B, 22C, and 22D in the upper mold 20 have their base ends on the base block 21E side and their tip ends on the lower mold 10 side. The base end of the movable mechanism 22A receives the elastic force of the spring 23A, and the tip end of the movable mechanism 22A presses the electronic component CH11 based on the elastic force of the spring 23A. As a result, the bonding material SN11 is pressed by the movable mechanism 22A via the electronic component CH11.

[0060] Similarly, movable mechanism 22B presses electronic component CH12 based on the elastic force of spring 23B, and bonding material SN12 is pressed by movable mechanism 22B via electronic component CH12. Movable mechanism 22C presses electronic component CH21 based on the elastic force of spring 23C, and bonding material SN21 is pressed by movable mechanism 22C via electronic component CH21. Movable mechanism 22D presses electronic component CH22 based on the elastic force of spring 23D, and bonding material SN22 is pressed by movable mechanism 22D via electronic component CH22.

[0061] The movable mechanism 22A has a rod 22Aa and a movable piece 22Ab. Similarly, the movable mechanisms 22B, 22C, and 22D have rods 22Ba, 22Ca, and 22Da and movable pieces 22Bb, 22Cb, and 22Db, respectively. The movable pieces 22Ab, 22Bb, 22Cb, and 22Db press the corresponding electronic components CH11, CH12, CH21, and CH22, respectively.

[0062] In the illustrated example, the number of movable pieces 22Ab, 22Bb, 22Cb, and 22Db corresponds to the number of electronic components CH11, CH12, CH21, and CH22 in a one-to-one relationship. The number of movable pieces 22Ab, 22Bb, 22Cb, and 22Db may be fewer than the number of electronic components CH11, CH12, CH21, and CH22. In this case, one movable piece (e.g., movable piece 22Ab) may press multiple electronic components (e.g., electronic components CH11 and CH12).

[0063] The springs 23A, 23B, 23C, and 23D are compressed in the vertical direction to generate elastic force that pushes down on the movable mechanisms 22A, 22B, 22C, and 22D. The springs 23A, 23B, 23C, and 23D are, for example, coil springs made of a metal material. Note that the springs 23A, 23B, 23C, and 23D are not limited to coil springs and may be leaf springs or the like.

[0064] When performing the mounting process, the sides of the rods 22Ab, 22Bb, 22Cb, 22Db that come into contact with the electronic components CH11, CH12, CH21, CH22 are covered with a continuous film F. The film F prevents dust generated from the bonding materials SN11, SN12, SN21, SN22, etc. from adhering to and contaminating the upper mold 20.

[0065] The heater 24 heats the rods 22Ab, 22Bb, 22Cb, and 22Db via the cavity plate 21A. When the lower mold 10 and the upper mold 20 are combined, the heater 24 heats the electronic components CH11, CH12, CH21, and CH22 via the rods 22Ab, 22Bb, 22Cb, and 22Db. This heats the bonding materials SN11, SN12, SN21, and SN22. The heater 24 is provided inside the block portion 21A. The heater 24 is, for example, a sheathed heater.

[0066] The degassing chambers 31, 32 are openable and closable annular vacuum chambers surrounding the lower mold 10 and the upper mold 20, and are composed of a lower chamber 31 and an upper chamber 32. The lower chamber 31 is erected on the lower mold base 11F of the lower mold 10. When viewed from above from the upper mold 20, the lower chamber 31 is provided outside the side block 18. A degassing path 33, through which degassed gas passes, is provided between the lower chamber 31 and the lower mold chase 11B, ejector pin plate 11C, retainer plate 11D, support pillar 11E, and side block 18.

[0067] The upper chamber 32 is erected facing downward on the upper mold base 21E of the upper mold 20. When viewed from above from the lower mold 10, the upper chamber 32 is provided outside the side block 28. A degassing path 34 through which degassed gas passes is provided between the upper chamber 32 and the upper mold chase 21B, the lower support plate 21C, the upper support plate 21D, and the side block 28.

[0068] The degassing path 34 is connected to a degassing path 27 provided in the upper mold base 21E. The degassing path 27 is connected to a degassing port 29 provided in the upper mold base 21E. The degassing port 29 is connected to a vacuum pump outside the mold. The degassing port 29 degasses the atmosphere around the lower mold 10 and the upper mold 20 in the degassing chamber composed of the lower chamber 31 and the upper chamber 32.

[0069] Fig. 2 is a cross-sectional view showing an example of the gas supply port 13 shown in Fig. 1. As shown in Fig. 2, the gas supply port 13 faces the edge surfaces of the substrates SB1 and SB2 and supplies gas so that it flows along the front and back surfaces of the substrates SB1 and SB2. In the example shown, the lower mold 10 is provided with a plurality of gas supply ports 13. The upper mold 20 may be provided with the gas supply ports 13, or both the lower mold 10 and the upper mold 20 may be provided with the gas supply ports 13.

[0070] The gas supply port 13 supplies nitrogen (N ２) gas is supplied to the cavity plate 11A. The gas supply port 13 is provided on the surface of the cavity plate 11A facing the upper mold 20 and opens toward the upper mold 20. Therefore, the gas supply port 13 quickly removes oxidizing gas from around the workpieces W1 and W2 during heating, and places the workpieces W1 and W2 under a nitrogen atmosphere.

[0071] Furthermore, the gas supply ports 13 apply nitrogen gas to the workpieces W1, W2 during cooling, thereby gas-cooling the workpieces W1, W2. When viewed from above from the upper mold 20, multiple gas supply ports 13 are provided on the outside of the workpieces W1, W2. Gas piping through which the nitrogen gas supplied by the gas supply ports 13 passes is provided in the lower mold chase 11B. The gas supply ports 13 supply inert gas to the space between the lower mold 10 and the upper mold 20.

[0072] The gas supply port 13 described above may be used as a gas supply port for supplying an inert gas into the depressurized degassing chambers 31 and 32. A gas supply port for supplying an inert gas into the depressurized degassing chambers 31 and 32 and a gas supply port 13 dedicated to cooling the substrates SB1, SB2, etc. may be separately provided.

[0073] The inert gas supplied by the gas supply port 13 is not limited to nitrogen gas, and may be carbon gas, fluorocarbon, rare gas, or the like. The gas supply port 13 may directly or indirectly spray the inert gas toward the substrates SB1, SB2, the electronic components CH11, CH12, CH21, CH22, the bonding materials SN11, SN12, SN21, SN22, or the like. The gas supply port 13 may be provided in the cavity plate 11A of the lower mold 10, or may be provided in the cavity plates 11A, 21A of both the lower mold 10 and the upper mold 20. The gas supply port 13 may be provided in the side blocks 18, 28 of at least one of the lower mold 10 and the upper mold 20, or may be provided in the degassing chambers 31, 32 described above.

[0074] Next, a mounting method using the mounting apparatus 1 according to this embodiment will be described with reference to Figures 3 to 9. Figures 3 and 4 are flow charts showing an example of a mounting method using the mounting apparatus 1 according to one embodiment of the present invention, for mounting a plurality of electronic components CH11, CH12, CH21, and CH22 on at least one board SB1 or SB2. Figure 5 is a graph showing a temperature profile of the mounting method according to one embodiment of the present invention. In the graph of Figure 4, the horizontal axis represents time, and the vertical axis represents the temperatures of the workpieces W1 and W2.

[0075] The mounting method shown in Figures 3 and 4 includes preparing a lower mold 10 and an upper mold 20, closing the lower mold 10 and the upper mold 20, pressing the movable plates 11C and 11D with a set pin 16, which is a pressing member, against the biasing force of a coil spring 17B, which is a biasing member, and immersing the lifter pins 12A and 12B, which are holding members, into the cavity plate 11A to change the distance d (shown in Figure 1) between the substrates SB1 and SB2 and the heating plate 11A.

[0076] First, the lower mold 10 and the upper mold 20 are prepared (S11), and preheating of the lower mold 10 and the upper mold 20 begins (S12). As shown in FIG. 4, the temperature of the workpieces W1 and W2 at this time is room temperature (RT). Next, the workpieces W1 and W2 are placed on the lifter pins 12A and 12B (S13). Next, the degassing chambers 31 and 32 are closed to begin degassing (S14), and the supply of nitrogen gas begins (S15). By degassing the joining materials SN11, SN12, SN21, and SN22 before heating them to the sintering treatment temperature and creating a nitrogen gas atmosphere, oxidation of the joining materials SN11, SN12, SN21, and SN22 is suppressed.

[0077] Fig. 6 is a cross-sectional view showing a state in which the mold 2 is closed to the second position h2 and an inert gas is supplied while the degassing chambers 31 and 32 are closed and degassed. As shown in Fig. 6, when the mold 2 is closed from the first position h1 shown in Fig. 1 to the second position h2 shown in Fig. 6 and the degassing chambers 31 and 32 are sealed, the tip of the set pin 16 abuts against the side block 28 of the upper mold 20. However, when the mold is closed at the second position h2, the pressing force of the side block 28 of the upper mold 20 does not press down the movable plates 11C and 11D via the set pin 16.

[0078] Therefore, lifter pins 12A and 12B fixed to movable plates 11C and 11D protrude upward from cavity plate 11A. A distance d (shown in FIG. 1) is provided between substrates SB1 and SB2 and cavity plate 11A of lower mold 10. Electronic components CH11, CH12, CH21, and CH22 are gradually heated by thermal radiation. At this time, the temperature of workpieces W1 and W2 reaches approximately 100°C to 150°C, as shown in FIG. 5.

[0079] Next, the mold 2 is further closed to a third position h3, and the lifter pins 12A and 12B are hardened by the pressing force applied from the upper mold 20 to the set pin 16 (S16). Figure 7 is a cross-sectional view showing a state in which the mold 2 is closed to the third position H3, reducing the distance d (shown in Figure 1) between the substrates SB1 and SB2 and the cavity plate 11A. As shown in Figure 7, as the lower mold 10 and the upper mold 20 approach each other, the tip of the set pin 16 abuts against the side block 28 of the upper mold 20, and the set pin 16 is pressed down.

[0080] The set pin 16 that is pushed down pushes down the ejector pin plate 11C and the retainer plate 11D that are connected to the base end of the set pin 16, and pushes down the lifter pins 12A and 12B that are connected to the ejector pin plate 11C and the retainer plate 11D at their base ends. As a result, the workpieces W1 and W2 come into contact with the cavity plate 11A.

[0081] The substrates SB1 and SB2 are heated by thermal conduction from the cavity plate 11A of the lower mold 10, and the electronic components CH11, CH12, CH21, and CH22 are heated by thermal radiation although they are not in contact with the movable pieces 22Ab, 22Bb, 22Cb, and 22Db of the upper mold 20. As shown in Figure 4, the temperature of the workpieces W1 and W2 at this time is raised from the preheating temperature of 100°C to 150°C to the sintering treatment temperature of 250°C to 300°C.

[0082] Next, the mold 2 is closed to the fourth position h4, and the movable mechanisms 22A, 22B, 22C, and 22D are brought into contact with the electronic components CH11, CH12, CH21, and CH22 (S21). Fig. 8 shows the state in which the mold is closed to the fourth position h4 and heated by the cavity plate 11A while being pressurized by the movable pieces. As shown in Fig. 8, the side blocks 18, 28 of the lower mold 10 and the upper mold 20 come into contact with each other, and when mold closing is complete, the set pin 16 is pushed down to its maximum.

[0083] Movable piece 22Ab of movable mechanism 22A abuts against electronic component CH11 via the film, and rod 22Aa of movable mechanism 22A is pushed up. Similarly, movable pieces 22Bb, 22Cb, and 22Db of movable mechanisms 22B, 22C, and 22D abut against electronic components CH12, CH21, and CH22 via the film, and rods 22Ba, 22Ca, and 22Da of movable mechanisms 22B, 22C, and 22D are pushed up.

[0084] Differences in dimensions among the substrates SB1 and SB2, the bonding materials SN11, SN12, SN21, and SN22, and the electronic components CH11, CH12, CH21, and CH22 are absorbed by the depth of penetration of the rods 22Aa, 22Ba, 22Ca, and 22Da into the internal space 23. At this time, the temperature of the workpieces W1 and W2 is raised from a preheating temperature of 100°C to 150°C to a sintering treatment temperature of 250°C to 300°C, as shown in FIG.

[0085] Next, the mold is opened to the second position h2, and the pressing force applied to the set pin 16 from the upper mold 20 is removed. Figure 9 is a cross-sectional view showing the state in which the mold is opened to the second position h2 and the distance d between the substrates SB1, SB2 and the cavity plate 11A is increased. As shown in Figure 9, when the pressing force applied to the set pin 16 is removed, the biasing force of the spring 17B lifts the movable plates 11C, 11D, and the lifter pins 12A, 12B fixed to the movable plates 11C, 11D also lift (S22).

[0086] Next, the supply of inert gas such as nitrogen gas is stopped, and degassing is stopped (S23). Then, as shown in FIG. 1, the molds 2 and 3 are opened to the first position H1, and the lifter pins 12A and 12B are raised, and the substrates SB1 and SB2 are removed from the mold 2 (S24).

[0087] According to the mounting device 1 of this embodiment configured as described above and the mounting method using this mounting device 1, the pressing force applied to the set pin 16 from the upper mold 20 can drive the lifter pins 12A and 12B, which change the distance d between the substrates SB1 and SB2 and the cavity plate 11A heated by the heater 14.

[0088] Therefore, when heating of the substrates SB1 and SB2 is not desired, the substrates SB1 and SB2 can be separated from the cavity plate 11A, and the bonding materials SN11, SN12, SN21, and SN22 of the sintered bonding and the solder bumps of the soldered bonding can be prevented from being heated in an unpressurized state, thereby preventing a decrease in bonding strength. Furthermore, once the electronic components CH11, CH12, CH21, and CH22 are mounted, the substrates SB1 and SB2 can be quickly separated from the cavity plate 11A, allowing them to be efficiently cooled.

[0089] Since a slide motion such as a multi-stage motion input from a servo motor or the like to the lower die 10 or the upper die 20 can be converted into a movement of the lifter pins 12A, 12B, which are holding members, by the set pin 16, which is a pressing member, there is no need to place an additional servo motor for moving the lifter pins 12A, 12B inside the lower die 10 or the upper die 20. A compact mounting device 1 can be configured.

[0090] Compared to bump bonding, which melts solder bumps, sintering bonding, which sinters bonding materials SN11, SN12, SN21, and SN22, reaches high temperatures. Spring steel, which is the material used for coil springs, etc., is prone to deterioration at high temperatures. In the mounting device 1 of this embodiment, the upper mold 20 does not directly press the lifter pins 12A and 12B that hold the workpieces W1 and W2 to sink the lifter pins 12A and 12B, but rather presses the set pin 16 to indirectly sink the lifter pins 12A and 12B, so the spring 17B, which is a biasing member, is less likely to reach high temperatures.

[0091] The above-described embodiments are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The elements of the embodiments, as well as their arrangement, materials, conditions, shapes, sizes, etc., are not limited to those illustrated and can be modified as appropriate. Furthermore, configurations shown in different embodiments can be partially substituted or combined with each other.

[0092] For example, the pressing member may be configured as a plunger that is pressed by upper die 20 to compress a fluid such as hydraulic oil, and the pressing member and lifter pins 12A, 12B may be connected by a fluid flow path. In this case, when the fluid is compressed by the pressing force applied to the pressing member from upper die 20, lifter pins 12A, 12B, which are holding members, protrude from cavity plate 11A.

[0093] In the above modification, movable plates 11C and 11D may be arranged to act as counterweights for the pressing members, and the pressing members may be configured to return to their initial positions due to the weight of the movable plates 11C and 11D when the pressing force from the upper mold 20 is removed. When the pressing members return to their initial positions, the lifter pins 12A and 12B retract into the cavity plate 11A.

[0094] [Supplementary Note 1] The mounting device 1 is a mounting device for mounting at least one electronic component CH11, CH12, CH21, CH22 on at least one board SB1, SB2, and includes a first mold 10 configured to hold at least one board SB1, SB2 on which at least one electronic component CH11, CH12, CH21, CH22 is placed, and a second mold 20 disposed opposite the first mold 10. The first mold 10 includes a heating plate 11A facing the space between the first mold 10 and the second mold 20, a heater 14 that heats the heating plate 11A, at least one holding member 12A, 12B that holds at least one board SB1, SB2, and at least one pressing member 16 that is pressed against the second mold 20. At least one of the holding members 12A, 12B is configured so that the distance d between at least one of the substrates SB1, SB2 and the heating plate 11A can be changed by the pressing force applied by the second mold 20 to at least one pressing member 16.

[0095] [Supplementary Note 10] The mounting method is a method for mounting at least one electronic component CH11, CH12, CH21, CH22 on at least one board SB1, SB2, and includes preparing a first mold 10 configured to hold at least one board SB1, SB2 on which at least one electronic component CH11, CH12, CH21, CH22 is placed, and preparing a second mold 20 disposed opposite the first mold 10. The first mold 10 includes a heating plate 11A facing a space between the first mold 10 and the second mold 20, a heater 14 that heats the heating plate 11A, at least one holding member 12A, 12B that holds the at least one board SB1, SB2, and at least one pressing member 16 that is pressed against the second mold 20. The mounting method further includes changing the distance d between at least one substrate SB1, SB2 on which at least one electronic component CH11, CH12, CH21, CH22 is placed or mounted and the heating plate 11A by the pressing force applied to at least one pressing member 16 from the second mold 20, causing at least one holding member 12A, 12B to change the distance d between at least one substrate SB1, SB2 on which at least one electronic component CH11, CH12, CH21, CH22 is placed or mounted and the heating plate 11A.

[0096] According to Supplementary Notes 1 and 10, the pressing force applied by the pressing member 16 from the second mold 20 moves the holding members 12A and 12B, which change the distance d between the substrates SB1 and SB2 and the heating plate 11A heated by the heater 14. This allows the substrates SB1 and SB2 to be separated from the heating plate 11A, which is the heat source, when heating the substrates SB1 and SB2 is not desired. This prevents, for example, the bonding materials SN11, SN12, SN21, and SN22 of the sintered bond or the solder bumps of the soldered bond from being heated in an unpressurized state, thereby preventing a decrease in bonding strength. For example, after the electronic components CH11, CH12, CH21, and CH22 are mounted, the substrates SB1 and SB2 can be quickly separated from the heating plate 11A to efficiently cool them. Since there is no need to add a motor or the like to the mold 2 to move the holding members 12A and 12B, a compact mounting device 1 can be provided.

[0097] [Supplementary Note 2] In the above-mentioned Supplementary Note 1, the first mold 10 further includes movable plates 11C and 11D facing the heating plate 11A from the side opposite to the second mold 20, and at least one biasing member 12 that biases the movable plates 11C and 11D toward the heating plate 11A, and at least one holding member 12A and 12B is fixed to the movable plates 11C and 11D in a state where the holding member 12A and 12B are inserted into a through-hole that penetrates the heating plate 11A, and when the movable plates 11C and 11D approach the heating plate 11A by the biasing force of the at least one biasing member 17B, the at least one holding member 12A and 12B biases the movable plates 11C and 11D toward the heating plate 11A. The movable plates 11C, 11D may be configured so that when the movable plates 11C, 11D are pressed against the biasing force of the at least one biasing member 12, the at least one holding member 12A, 12B protrude from the heating plate 11A, increasing the distance d between the heating plate 11A and at least one substrate SB1, SB2 supported by the at least one holding member 12A, 12B, and the at least one substrate SB1, SB2 supported by the at least one holding member 12A, 12B, the at least one holding member 12A, 12B sinks into the heating plate 11A, decreasing the distance d between the heating plate 11A and at least one substrate SB1, SB2 supported by the at least one holding member 12A, 12B.

[0098] According to the above Supplementary Note 2, the mounting device 1 that changes the distance d between the substrates SB1, SB2 and the heating plate 11A by the pressing force from the second mold 20 can be configured compactly.

[0099] [Supplementary Note 3] In the above-mentioned Supplementary Note 2, a heat insulating member 15 may be disposed between the heater 14 and the heating plate 11A and the biasing member 17B.

[0100] According to the above-mentioned supplementary note 3, since the temperature rise of the biasing member 17B can be suppressed, spring steel, which is prone to deterioration at high temperatures, can be used as the material for the biasing member 17B.

[0101] [Appendix 4] In any one of Appendices 1 to 3 above, the at least one holding member 12A, 12B may be a plurality of holding members 12A, 12B, each of the plurality of holding members 12A, 12B being formed in a rod shape, and the at least one substrate SB1, SB2 may be supported at the tip end of the plurality of holding members 12A, 12B.

[0102] According to Supplementary Note 4, the contact area between the lifter pins and the like of the holding members 12A and 12B and the substrates SB1 and SB2 is small, so that the heat transfer from the holding members 12A and 12B is small, and the substrates SB1 and SB2 can be cooled quickly.

[0103] [Appendix 5] In any one of the above Appendices 1 to 4, at least one of the first mold 10 and the second mold 20 may further include a gas supply port 13 that supplies gas toward at least one of the substrates SB1, SB2 and at least one of the electronic components CH11, CH12, CH21, CH22.

[0104] According to the above supplementary note 5, the substrates SB1 and SB2 can be quickly cooled by supplying gas from the gas supply port 13.

[0105] [Supplementary Note 6] In Supplementary Note 5, the gas supply port 13 may supply the gas so that it flows along the upper and lower surfaces of at least one of the substrates SB1 and SB2.

[0106] According to Supplementary Note 6, the upper and lower surfaces of the substrates SB1 and SB2 can be cooled simultaneously, thereby quickly cooling the substrates SB1 and SB2.

[0107] [Supplementary Note 7] In Supplementary Note 5 or 6, the gas supplied from the gas supply port 13 may be an inert gas.

[0108] According to Supplementary Note 7, since an inert gas is blown, oxidation of the substrates SB1, SB2, etc. can be suppressed compared to when air containing oxygen is blown. Furthermore, if the degassing chambers 31, 32 are further provided, the gas supply port 13 that supplies gas for cooling the substrates SB1, SB2 and the gas supply port that fills the atmospheric furnace with inert gas can be shared, so an increase in the number of parts can be suppressed and a compact mounting device 1 can be configured.

[0109] [Appendix 8] In any one of Appendices 1 to 7, the mold may further include openable and closable degassing chambers 31, 32 surrounding the lower mold 10 and the second mold 20, and may be configured to reduce the oxygen concentration in the space within the mold by degassing using the degassing chambers 31, 32 and supplying an inert gas.

[0110] When the substrates SB1, SB2 and the electronic components CH11, CH12, CH21, and CH22 are heated to high temperatures for sintering bonding or the like, the substrates SB1, SB2 and the electronic components CH11, CH12, CH21, and CH22 are oxidized in the air atmosphere. According to Supplementary Note 8 above, the electronic components CH11, CH12, CH21, and CH22 can be mounted on the substrates SB1, SB2 in an inert gas atmosphere with a reduced oxygen concentration.

[0111] [Appendix 9] In any one of the above Appendices 1 to 8, the mounting device 1 may be a sintering device that bonds at least one of the substrates SB1, SB2 and at least one of the electronic components CH11, CH12, CH21, CH22 by heating and pressurizing the bonding material 103 that is placed between the at least one of the substrates SB1, SB2 and at least one of the electronic components CH11, CH12, CH21, CH22.

[0112] According to Supplementary Note 9, if the sintering bonding materials SN11, SN12, SN21, and SN22 are heated without being pressurized, they will become brittle and stick together, but when it is not desired to heat the substrates SN1 and SN2, the substrates SN1 and SN2 can be separated from the heating plate 11A, which is the heat source, and therefore it is possible to prevent a decrease in adhesive strength. Therefore, this is suitable for a sintering device.

[0113] 1...mounting device, 2...mold, 3...pressure device, 4...lower platen, 5...upper platen, 9...pressure adjustment mechanism, 10...lower mold (an example of a first mold), 11A...cavity plate (an example of a heating plate), 11B...lower mold chase, 11C...ejector pin plate (an example of a movable plate), 11D...retainer plate (an example of a movable plate), 11E...support pillar, 11F...lower mold base, 12A, 12B...lifter pin (an example of a holding member), 13...gas supply port, 14...heater, 15...insulating member, 16...set pin (an example of a pressing member), 17A...spring sleeve, 17B...spring, 18...side block, 20...upper mold (an example of a second mold), 21A...cavity plate, 21B...upper die chase, 21C...lower support plate, 21D...upper support plate, 21E...upper die base, 22A, 22B, 22C, 22D...movable mechanism, 22Aa, 22Ba, 22Ca, 22Da...rod, 22Ab, 22Bb, 22Cb, 22Db...movable piece, 23...internal space, 24...heater, 25...insulating member, 27...evacuation path, 28...side block, 29...evacuation port, 31, 32...evacuation chamber, 33, 34...evacuation path, CH11, CH12, CH21, CH22...electronic component, d...distance between substrate and heating plate, h1, h2, h3, h4...first to fourth positions, SB1, SB2...substrate, SN11, SN12, SN21, SN22...bonding material, W1, W2...workpiece.

Claims

1. A mounting device for mounting at least one electronic component on at least one substrate, comprising: a first mold configured to hold the at least one substrate on which the at least one electronic component is placed; and a second mold arranged opposite the first mold, wherein the first mold comprises: a heating plate facing a space between the first mold and the second mold; a heater for heating the heating plate; at least one holding member for holding the at least one substrate; and at least one pressing member pressed against the second mold, wherein the at least one holding member is configured to be able to change the distance between the at least one substrate and the heating plate by the pressing force applied from the second mold to the at least one pressing member.

2. The mounting device described in claim 1, wherein the first mold further comprises a movable plate facing the heating plate from the opposite side to the second mold, and at least one biasing member biasing the movable plate toward the heating plate, the at least one holding member being fixed to the movable plate while being inserted into a through hole penetrating the heating plate, and when the movable plate approaches the heating plate due to the biasing force of the at least one biasing member, the at least one holding member protrudes from the heating plate to increase the distance between the at least one substrate supported by the at least one holding member and the heating plate, and when the pressing member presses the movable plate against the biasing force of the at least one biasing member, the at least one holding member sinks into the heating plate to decrease the distance between the at least one substrate supported by the at least one holding member and the heating plate.

3. The mounting device according to claim 2, wherein a heat insulating member is disposed between the heater and the heating plate and between the biasing member and the heat insulating member.

4. The mounting device according to claim 1, wherein the at least one holding member is a plurality of holding members, each of the plurality of holding members being formed in a rod shape, and the at least one substrate is supported at the tip of the plurality of holding members.

5. The mounting device according to claim 1, wherein at least one of the first mold and the second mold further comprises at least one gas supply port for supplying gas toward the at least one substrate and the at least one electronic component.

6. The mounting device according to claim 5, wherein the at least one gas supply port supplies gas so as to flow along the upper and lower surfaces of the at least one substrate.

7. The mounting apparatus according to claim 5, wherein the gas supplied from the at least one gas supply port is an inert gas.

8. The mounting device according to claim 1, further comprising an openable and closable degassing chamber surrounding the first mold and the second mold, and configured to reduce the oxygen concentration in the space by reducing the pressure inside the degassing chamber and supplying an inert gas therein.

9. The mounting device according to claim 1, wherein the mounting device is a sintering device that bonds the at least one substrate and the at least one electronic component by applying heat and pressure to a bonding material placed between the at least one substrate and the at least one electronic component.

10. A mounting method for mounting at least one electronic component on at least one board, comprising: preparing a first mold configured to hold the at least one board on which the at least one electronic component is placed; and preparing a second mold arranged opposite the first mold, wherein the first mold comprises: a heating plate facing a space between the first mold and the second mold; a heater for heating the heating plate; at least one holding member for holding the at least one board; and at least one pressing member for pressing against the second mold, wherein the mounting method further comprises: the at least one holding member changing a distance between the at least one board on which the at least one electronic component is placed or mounted and the heating plate by a pressing force applied from the second mold to the at least one pressing member.

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