Mounting device and mounting method

Abstract

Provided is a technology related to a mounting device capable of suppressing occurrence of mounting failure and also suppressing generation of dust. A mounting device 1 comprises: first movable pieces (22Ac, 22Bc...) provided in an upper die (20) and capable of moving up and down for applying pressure to upper surfaces of respective electronic components (CH11, CH21...); and at least one second movable piece (23Ac, 23Bc...) provided in the upper die (20) and capable of moving up and down independently of the first movable pieces (22Ac, 22Bc...). The mounting device (1) is configured such that the second movable pieces (23Ac, 23Bc...) apply pressure to upper surfaces of substrates (SB1, SB2...) and bonding materials (SN11, SN21...) that protrude from lower surfaces of the corresponding electronic components (CH11, CH21...) to the upper surfaces of the substrates (SB1, SB2...).

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