Temperature sensing film and manufacturing method therefor, and manufacturing method for temperature and pressure sensing film

Abstract

Disclosed in the present application is a temperature sensing film and a manufacturing method therefor, and a manufacturing method for a temperature and pressure sensing film. The manufacturing method for the temperature sensing film comprises: providing a first sensing portion (210) and a second sensing portion (220) on a surface A and a surface B of a flexible substrate (100), respectively; and providing a through hole (101) and a connecting portion (230) on the flexible substrate (100), wherein the connecting portion (230) is at least partially arranged in the through hole (101) to connect the first sensing portion (210) and the second sensing portion (220). The manufacturing method for a temperature and pressure sensing film comprises: manufacturing a temperature sensing portion (200) by means of the method described above, and providing a pressure sensing portion (300) on the surface A or the surface B of the flexible substrate (100). In the present application, the first sensing portion (210) and the second sensing portion (220) are respectively arranged on different surfaces of the flexible substrate (100), so that the processing and manufacturing of the entire temperature sensing film are simpler and more convenient, and the flexibility of the temperature sensing film is improved.

Description

Temperature sensing film and manufacturing method thereof, and manufacturing method of temperature and pressure sensing film

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on September 20, 2023, with application number 202311222779.7 and invention name “Temperature sensing film and its manufacturing method, temperature and pressure sensing film manufacturing method”, the entire content of which is incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of sensor technology, and in particular to a temperature sensing film and a manufacturing method thereof, and a manufacturing method of a temperature and pressure sensing film. Background Art

[0003] The statements herein merely provide background information related to the present application and do not necessarily constitute prior art.

[0004] As a common type of sensor in daily life, temperature sensors are widely used in people's lives. For example, in the field of new energy, in order to monitor the safety status of the battery, a temperature sensor is usually installed to monitor the battery temperature changes in real time. However, the installation of the temperature sensor not only compresses the installation space of the battery, but also increases the difficulty of integration. At present, in order to solve the problem of large space occupied by temperature sensors, a flexible temperature sensor has emerged. Flexible temperature sensors usually attach multiple smaller temperature sensing elements to the same flexible substrate to achieve the integration of multiple temperature sensing elements. However, if the temperature sensing element is set on the flexible substrate by attaching, the flexibility of the flexible substrate will inevitably be greatly reduced. Technical issues

[0005] One of the purposes of the embodiments of the present application is to provide a temperature sensing film and a manufacturing method thereof, and a manufacturing method of a temperature and pressure sensing film. Technical Solutions

[0006] The technical solution adopted in the embodiment of this application is:

[0007] In a first aspect, a method for manufacturing a temperature sensing film is provided, the manufacturing method comprising the following steps: providing a first sensing portion on surface A of a flexible substrate; providing a second sensing portion on surface B of the flexible substrate; opening a through hole to at least penetrate surface A and surface B of the flexible substrate; the first sensing portion, the second sensing portion, and the through hole are correspondingly provided; providing a connecting portion on the flexible substrate, the connecting portion being at least partially provided in the through hole to connect the first sensing portion and the second sensing portion; wherein the surface A and the surface B are different surfaces of the flexible substrate, the first sensing portion and the second sensing portion are made of different metal materials, the connecting portion and one of the first sensing portion or the second sensing portion are made of the same metal material, and the first sensing portion, the second sensing portion, and the connecting portion form a temperature sensing portion.

[0008] In a second aspect, a temperature sensing film is provided. The temperature sensing film is manufactured by the above-mentioned method for manufacturing a temperature sensing film.

[0009] In a third aspect, a method for manufacturing a temperature and pressure sensing film is provided, wherein the method for manufacturing the temperature and pressure sensing film manufactures a temperature sensing portion by the above-mentioned method for manufacturing a temperature sensing film; the temperature and pressure sensing film also includes a pressure sensing portion, and the pressure sensing portion is arranged on the A surface or the B surface of the flexible substrate. Beneficial effects

[0010] The advantageous effects of the method for manufacturing the temperature sensing film provided in the embodiments of the present application are as follows: the first sensing portion and the second sensing portion are respectively arranged on different sides of the flexible substrate. Compared to the temperature sensing portion being arranged entirely on the same side of the flexible substrate, this arrangement allows the first sensing portion and the second sensing portion to be arranged separately on opposite sides of the flexible substrate. This allows the arrangement of the first sensing portion to be unaffected by the arrangement of the second sensing portion, making the overall processing and manufacturing of the temperature sensing film simpler and more convenient. Furthermore, the first sensing portion and the second sensing portion are arranged on different sides of the flexible substrate, further ensuring the flexibility of the temperature sensing film. Furthermore, this arrangement eliminates the need for the first sensing portion and the second sensing portion of the temperature sensing portion to be arranged on the same side of the flexible substrate, allowing for more temperature sensing portions to be arranged on the flexible substrate. It can be understood that the method for manufacturing the temperature sensing film according to the present application not only improves the flexibility of the temperature sensing film but also reduces the processing difficulty and manufacturing cost of the temperature sensing film.

[0011] The temperature sensing film provided in the embodiment of the present application is manufactured by the above-mentioned method for manufacturing a temperature sensing film, and therefore has the beneficial effects of the method for manufacturing a temperature sensing film.

[0012] The manufacturing method of the temperature and pressure sensing film provided in the embodiment of the present application includes the manufacturing of a temperature sensing portion and a pressure sensing portion, and thus has the beneficial effect of the manufacturing method of the temperature sensing film. At the same time, the beneficial effect of the manufacturing method of the temperature and pressure sensing film also includes: the pressure sensing portion is arranged on the A surface or the B surface of the flexible substrate, so that the pressure sensing portion and the temperature sensing portion can be better integrated on the flexible substrate, while meeting the temperature detection and pressure detection requirements, ensuring the flexibility of the temperature and pressure sensing film. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or exemplary technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0014] FIG1 is an exploded schematic diagram of the structure of a temperature sensing film manufactured by a method for manufacturing a temperature sensing film according to an embodiment of the present application;

[0015] FIG2 is a first structural diagram of a temperature sensing film manufactured by the temperature sensing film manufacturing method provided in an embodiment of the present application;

[0016] FIG3 is a second structural diagram of a temperature sensing film manufactured by the temperature sensing film manufacturing method provided in an embodiment of the present application;

[0017] FIG4 is a third structural diagram of a temperature sensing film manufactured by the temperature sensing film manufacturing method provided in an embodiment of the present application;

[0018] FIG5 is a partial cross-sectional view of one of the temperature sensing films manufactured by the temperature sensing film manufacturing method provided in an embodiment of the present application;

[0019] FIG6 is a partial cross-sectional view of one of the temperature sensing films manufactured by the temperature sensing film manufacturing method provided in an embodiment of the present application;

[0020] FIG7 is a partial cross-sectional view of one of the temperature sensing films manufactured by the temperature sensing film manufacturing method provided in an embodiment of the present application;

[0021] FIG8 is a partial cross-sectional view of one of the temperature sensing films manufactured by the temperature sensing film manufacturing method provided in an embodiment of the present application;

[0022] FIG9 is a partial cross-sectional view of a flexible substrate of a temperature sensing film manufactured by a method for manufacturing a temperature sensing film according to an embodiment of the present application;

[0023] FIG10 is a fourth structural diagram of a temperature sensing film manufactured by the temperature sensing film manufacturing method provided in an embodiment of the present application;

[0024] FIG11 is a fifth structural diagram of a temperature sensing film manufactured by the temperature sensing film manufacturing method provided in an embodiment of the present application;

[0025] FIG12 is a schematic structural diagram of a temperature-pressure sensing film manufactured by a method for manufacturing a temperature-pressure sensing film according to an embodiment of the present application;

[0026] FIG13 is a schematic diagram of the unfolding of a temperature-pressure sensing film manufactured by the temperature-pressure sensing film manufacturing method provided in an embodiment of the present application.

[0027] Description of main component symbols:

[0028] 100-flexible substrate; 101-through hole; 102-signal input terminal; 103-signal output terminal;

[0029] 200 - temperature sensing unit; 210 - first sensing portion; 211 - first sensing terminal; 212 - first signal transmission unit; 220 - second sensing portion; 221 - second sensing terminal; 222 - second signal transmission unit; 230 - connection unit; 240 - thermal insulation layer;

[0030] 300 - pressure sensing unit; 301 - pressure sensing electrode; 302 - pressure signal transmission wire; 303 - flexible pressure-sensitive film. Modes for Carrying Out the Invention

[0031] In order to make the purpose, technical solutions and advantages of this application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit this application.

[0032] It should be noted that when a component is referred to as being "fixed on" or "disposed on" another component, it may be directly on the other component or indirectly on the other component. When a component is referred to as being "connected to" another component, it may be directly or indirectly connected to the other component. The terms "upper", "lower", "left", "right", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of description and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on this application. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to the specific circumstances. The terms "first" and "second" are only used for the purpose of convenience of description and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0033] In order to illustrate the technical solution provided by this application, a detailed description is given below with reference to specific drawings and embodiments.

[0034] Please refer to Figures 1 to 5 together to illustrate the method for manufacturing the temperature sensing film provided in the embodiment of the present application. The method for manufacturing the temperature sensing film includes the following steps:

[0035] A first sensing portion 210 is provided on the A surface of the flexible substrate 100;

[0036] A second sensing portion 220 is provided on the B surface of the flexible substrate 100;

[0037] A through hole 101 is provided to penetrate at least the A surface and the B surface of the flexible substrate 100;

[0038] The first sensing portion 210, the second sensing portion 220 and the through hole 101 are correspondingly arranged;

[0039] The connecting portion 230 is disposed on the flexible substrate 100 . The connecting portion 230 is at least partially disposed in the through hole 101 to connect the first sensing portion 210 and the second sensing portion 220 .

[0040] Surface A and surface B are different surfaces of the flexible substrate 100, the first sensing portion 210 and the second sensing portion 220 are made of different metal materials, the connecting portion 230 and one of the first sensing portion 210 or the second sensing portion 220 are made of the same metal material, and the first sensing portion 210, the second sensing portion 220, and the connecting portion 230 form the temperature sensing portion 200.

[0041] In the present application, the first sensing part 210 and the second sensing part 220 are connected through the connecting part 230. The connecting part 230 connecting the first sensing part 210 and the second sensing part 220 means that the electrical signal transmitted to the first sensing part 210 can be transmitted to the second sensing part 220 through the connecting part 230, and at the same time, the electrical signal transmitted to the second sensing part 220 can be transmitted to the first sensing part 210 through the connecting part 230.

[0042] In the present application, the first sensing portion 210 and the second sensing portion 220 are made of different metal materials, and the connecting portion 230 is made of the same metal material as either the first sensing portion 210 or the second sensing portion 220. Thus, the temperature sensing portion 200 is formed by the first sensing portion 210, the second sensing portion 220, and the connecting portion 230. As an embodiment, the temperature sensing portion 200 in the present application utilizes the thermocouple principle, forming a temperature sensing point by disposing different metal materials and connecting the two metal materials.

[0043] It is understandable that one temperature sensing portion 200 or a plurality of temperature sensing portions 200 may be provided on the flexible substrate 100 , and the number of the temperature sensing portions 200 is set according to specific needs.

[0044] Continuing with FIG. 4 , when multiple temperature sensing portions 200 are provided on the flexible substrate, multiple first sensing portions 210 are provided on surface A of the flexible substrate 100 . Similarly, multiple second sensing portions (not shown) are provided on surface B of the flexible substrate 100 . Multiple through holes are provided corresponding to the unique first sensing portion 210 and the second sensing portion, respectively, so that each connecting portion 230 is connected to the corresponding first sensing portion 210 and second sensing portion.

[0045] Compared to the prior art, the manufacturing method of the temperature sensing film provided in the embodiments of the present application utilizes a first sensing portion 210 and a second sensing portion 220 disposed on different sides of the flexible substrate 100. This arrangement allows the first sensing portion 210 and the second sensing portion 220 to be disposed on opposite sides of the flexible substrate 100, unlike the arrangement in which the entire temperature sensing portion is disposed on the same side of the flexible substrate 100. This arrangement eliminates the need for the first sensing portion 210 and the second sensing portion 220 to be disposed on the same side of the flexible substrate 100. This arrangement allows the first sensing portion 210 and the second sensing portion 220 to be disposed on opposite sides of the flexible substrate 100, simplifying and facilitating the overall fabrication of the temperature sensing film. Furthermore, the first sensing portion 210 and the second sensing portion 220 are disposed on different sides of the flexible substrate 100, further ensuring the flexibility of the temperature sensing film. Furthermore, this arrangement eliminates the need for the first sensing portion 210 and the second sensing portion 220 to be disposed on the same side of the flexible substrate 100, allowing for the installation of more temperature sensing portions 200 on the flexible substrate 100. It can be understood that adopting the manufacturing method of the present application to manufacture the temperature sensing film not only improves the flexibility of the temperature sensing film, but also reduces the processing difficulty and manufacturing cost of the temperature sensing film.

[0046] In the present application, there is no specific restriction on the corresponding arrangement of the first sensing part 210, the second sensing part 220 and the through hole 101, as long as the connecting part 230 can pass through the through hole 101 to connect the first sensing part 210 arranged on the A surface and the second sensing part 220 arranged on the B surface.

[0047] As a preferred embodiment, surface A and surface B are two opposing surfaces of flexible substrate 100, and the projection of first sensing portion 210 on surface B at least partially covers second sensing portion 220. Through hole 101 penetrates first sensing portion 210, flexible substrate 100, and second sensing portion 220. Connecting portion 230 is at least partially disposed within through hole 101 to connect first sensing portion 210 and second sensing portion 220. It can be understood that such a configuration reduces the distance between the first sensing portion 210 and the second sensing portion 220. At the same time, the projection of the first sensing portion 210 on the B surface at least covers a portion of the second sensing portion 220. In this way, the through hole 101 can simultaneously penetrate the first sensing portion 210, the flexible substrate 100, and the second sensing portion 220. It is only necessary to provide a connecting portion 230 in the through hole 101 to connect the first sensing portion 210 and the second sensing portion 220. In other words, the first sensing portion 210 and the second sensing portion 220 can be connected by using fewer connecting portions 230, which is more convenient for processing and manufacturing, and also reduces the cost of providing the connecting portion 230.

[0048] Referring to Figures 5 to 7 , in one embodiment, the connecting portion 230 is partially disposed within the through-hole 101, while another portion of the connecting portion 230 extends from within the through-hole 101 and covers a portion of the first sensing portion 210 or a portion of the second sensing portion 220. It will be appreciated that when the connecting portion 230 and the first sensing portion 210 are made of the same material, the connecting portion 230 extends from within the through-hole 101 and covers the second sensing portion 220, as shown in Figure 6 . When the connecting portion 230 and the second sensing portion 220 are made of the same material, the connecting portion 230 extends from within the through-hole 101 and covers the first sensing portion 210, as shown in Figure 5 . Of course, in other embodiments, as shown in Figure 7 , the connecting portion 230 extends from within the through-hole 101 and covers both the first sensing portion 210 and the second sensing portion 220.

[0049] Referring to Figure 8 , as another embodiment, to avoid increasing the thickness of the temperature sensing film due to the provision of the connection portion 230, the connection portion 230 is entirely disposed within the through-hole 101. As will be appreciated, since the through-hole 101 simultaneously passes through the first sensing portion 210, the flexible substrate 100, and the second sensing portion 220, the connection portion 230 disposed within the through-hole 101 can connect the first sensing portion 210 and the second sensing portion 220. In a specific embodiment, the connection portion 230 is entirely disposed within the through-hole 101, with one end surface of the connection portion 230 flush with the surface of the first sensing portion 210, and the other end surface of the connection portion 230 flush with the surface of the second sensing portion 230.

[0050] To ensure reliable connection between the connecting portion 230 and the first and second sensing portions 210 and 220, the first and second sensing portions 210 and 220 should be minimally thin. To maintain the flexibility of the temperature sensing film, the first and second sensing portions 210 and 220 should be minimally thick. In this application, as an embodiment, the thickness of the first sensing portion 210 (indicated by t1 in FIG. 8 ) is between 5 μm and 30 μm; the thickness of the second sensing portion 220 (indicated by t2 in FIG. 8 ) is between 5 μm and 30 μm. Preferably, the thickness of the first sensing portion 210 is between 10 μm and 20 μm; the thickness of the second sensing portion 220 is between 10 μm and 20 μm.

[0051] Referring to Figure 9 , through-hole 101 has a central axis perpendicular to surface A (as shown in c in Figure 8 ). Through-hole 101 also has a cross-section perpendicular to the central axis. In other words, when flexible substrate 100 is cut along a plane parallel to surface A, a cross-section of through-hole 101 can be obtained. This application does not impose any specific limitations on the cross-sectional shape of through-hole 101; the cross-sectional shape of through-hole 101 can be any of circular, square, polygonal, and elliptical shapes.

[0052] In one embodiment of the present application, the maximum width of the cross section of the through hole 101 is in the range of 0.2 mm to 3 mm. Preferably, the maximum width of the cross section of the through hole 101 is in the range of 1 mm to 2 mm. For example, when the cross section of the through hole 101 is circular, the diameter of the circle is the maximum width of the cross section, and the length of the circular diameter is in the range of 0.2 mm to 3 mm; when the cross section of the through hole 101 is rectangular, the diagonal of the rectangle is the maximum width of the cross section, and the length of the diagonal of the rectangle is in the range of 0.2 mm to 3 mm.

[0053] It is understood that since the connection portion 230 is at least partially disposed within the through hole 101 to connect the first sensing portion 210 and the second sensing portion 220, the through hole 101 should not be too small. An overly small through hole 101 would increase the difficulty of processing and make it difficult to dispose the connection portion 230 within the through hole 101, which would in turn affect the reliability of the temperature sensing portion 200. However, the through hole 101 should not be too large either. An overly large through hole 101 would affect the overall structure of the flexible substrate 100. This embodiment limits the width of the cross section of the through hole 101, thereby minimizing the impact on the overall flexible substrate 100 while meeting the processing requirements and the reliability of the temperature sensing portion 200.

[0054] This application does not impose any specific restrictions on the materials of the first sensing portion 210 and the second sensing portion 220; the first sensing portion 210 and the second sensing portion 220 can be made of different metal materials. In one embodiment, the first sensing portion 210 is made of copper, and the second sensing portion 220 is made of a copper-nickel alloy. In another embodiment, the first sensing portion 210 is made of nickel-chromium, and the second sensing portion 220 is made of nickel-silicon. In another embodiment, the first sensing portion 210 is made of nickel-chromium, and the second sensing portion 220 is made of a copper-nickel alloy. All of the above combinations of materials for the first sensing portion 210 and the second sensing portion 220 exhibit high sensitivity and can meet specific application requirements. It is also understood that the materials of the first sensing portion 210 and the second sensing portion 220 can be interchanged in these combinations to still meet application requirements. For example, the first sensing portion 210 can be made of a copper-nickel alloy, and the second sensing portion 220 can be made of copper.

[0055] In the present application, the purpose of the connecting portion 230 is to connect the first sensing portion 210 and the second sensing portion 220. Therefore, the connecting portion 230 can be made of the same material as the first sensing portion 210, or the same material as the second sensing portion 220. For example, when the first sensing portion 210 is made of copper and the second sensing portion 220 is made of a copper-nickel alloy, the connecting portion 230 can be made of copper, or the same material as the copper-nickel alloy.

[0056] This application does not impose any specific restrictions on the manner in which the first sensing portion 210 is disposed on surface A of the flexible substrate, and the manner in which the second sensing portion 220 is disposed on surface B of the flexible substrate. In one embodiment, the first sensing portion 210 is disposed on surface A of the flexible substrate 100 by sputtering, and the second sensing portion 220 is disposed on surface B of the flexible substrate 100 by sputtering. In another embodiment, the first sensing portion 210 is disposed on surface A of the flexible substrate 100 by printing, and the second sensing portion 220 is disposed on surface B of the flexible substrate 100 by printing. In another embodiment, the first sensing portion 210 is disposed on surface A of the flexible substrate 100 by etching, and the second sensing portion 210 is disposed on surface B of the flexible substrate 100 by etching.

[0057] In one specific embodiment of the present application, the first sensing portion 210 and the second sensing portion 220 are formed by sputtering or printing. Specifically, a first metal paste is applied to surface A of the flexible substrate 100 by sputtering or printing, depositing the first metal paste at a predetermined location on surface A of the flexible substrate. The first metal paste is then dried and sintered to secure the first metal paste to the flexible substrate 100, thereby forming the first sensing portion 210. A second metal paste is applied to surface B of the flexible substrate 100 by sputtering or printing, depositing the second metal paste at a predetermined location on surface B of the flexible substrate. The second metal paste is then dried and sintered to secure the second metal paste to the flexible substrate 100, thereby forming the second sensing portion 220. It will be appreciated that employing this manufacturing process not only allows the first sensing portion 210 and the second sensing portion 220 to be better adhered to the flexible substrate 100, but also allows the first sensing portion 210 and the second sensing portion 220 to better adapt to the flexible and bendable nature of the flexible substrate 100, thereby ensuring the reliability of temperature detection and increasing the service life of the temperature sensing portion.

[0058] As a preferred embodiment, in a specific embodiment of the present application, the first sensing portion 210 is etched onto surface A of the flexible substrate 100, and the second sensing portion 220 is etched onto surface B of the flexible substrate 100. Specifically, a first metal layer is provided on surface A of the flexible substrate 100, and a second metal layer is provided on surface B of the flexible substrate 100, wherein the first metal layer and the second metal layer are made of different metal materials. The first sensing portion 210 is formed by etching the first metal layer, and the second sensing portion 220 is formed by etching the second metal layer. It will be appreciated that if multiple temperature sensing portions 200 are required, multiple first sensing portions 210 can be etched onto surface A of the flexible substrate 100 in a single etching process, and multiple second sensing portions 220 can also be etched onto surface B of the flexible substrate 100 in a single etching process. It is understood that when sputtering or printing is used to form the first sensing portion 210 and the second sensing portion 220, a metal paste must be deposited on the flexible substrate 100 by sputtering or printing, and then the metal paste must be dried and sintered to form the first sensing portion 210 and the second sensing portion 220. The temperature during the drying and sintering of the paste can often reach above 120°C, and such high temperatures often have a certain degree of impact on the flexible substrate 100. In this embodiment, however, the first and second metal layers can be pre-deposited on the flexible substrate 100. In this manner, the first and second sensing portions 210 and 220 only need to be deposited by etching, without the flexible substrate 100 undergoing high-temperature drying and sintering. This configuration simplifies the overall process and places lower demands on the flexible substrate 100.

[0059] Continuing with Figures 1 to 3 , as one embodiment, a flexible substrate 100 is provided with a signal input terminal 102 and a signal output terminal 103 . The signal input terminal 102 and the signal output terminal 103 are used to connect to other devices to transmit electrical signals. A first sensing portion 210 includes a first sensing terminal 211 and a first signal transmission portion 212 . The first sensing terminal 211 corresponds to the through hole 101 , and the first signal transmission portion 212 is used to connect the signal input terminal 102 and the first sensing terminal 211 . A second sensing portion 220 includes a second sensing terminal 221 and a second signal transmission portion 222 . The second sensing terminal 221 corresponds to the through hole 101 , and the second signal transmission portion 222 is used to connect the signal output terminal 103 and the second sensing terminal 221 . A connecting portion 230 connects the first sensing terminal 211 and the second sensing terminal 221 . For example, when the temperature sensing film is connected to its corresponding collector, the collector is connected to the signal input terminal 102 and the signal output terminal 103, and the collector transmits an initial electrical signal to the signal input terminal 102. The initial electrical signal passes through the signal input terminal 102, the first signal transmission part 212, the first sensing terminal 211, the connecting part 230, the second sensing terminal 221, the second signal transmission part 222, and the signal output terminal 103 in sequence. The collector obtains the final electrical signal through the signal output terminal 103, and the corresponding temperature information can be obtained by calculating the final electrical signal and the initial electrical signal.

[0060] As can be understood, the signal input terminal 102 is used to connect to an external device to transmit an electrical signal, and the signal output terminal 103 is used to connect to an external device to obtain an electrical signal. The signal input terminal 102 is connected to the first sensing terminal 211 via the first signal transmission portion 212, and the signal output terminal 103 is connected to the second sensing terminal 221 via the second signal transmission portion 222. Therefore, the signal input terminal 102 can be disposed on the same side of the flexible substrate 100 as the first sensing terminal 211, and the signal input terminal 102 can also be disposed on the same side of the flexible substrate 100 as the second sensing terminal 221; the signal output terminal 103 can also be disposed on the same side of the flexible substrate 100 as the second sensing terminal 221, and the signal output terminal 103 can also be disposed on the same side of the flexible substrate 100 as the first sensing terminal 211.

[0061] As an embodiment, to facilitate connection of the signal input terminal 102 and the signal output terminal 103 with external devices, the signal input terminal 102 and the signal output terminal 103 should be located on the same side of the flexible substrate 100. Specifically, the flexible substrate 100 is further provided with a via (not shown). When the signal input terminal 102 and the signal output terminal 103 are both located on surface A of the flexible substrate 100, the second signal transmission portion 222 passes through the via from surface B and connects to the signal output terminal 103 located on surface A. When the signal input terminal 102 and the signal output terminal 103 are both located on surface B of the flexible substrate 100, the first signal transmission portion 212 passes through the via from surface A and connects to the signal input terminal 102 located on surface B.

[0062] As a preferred embodiment, the projection of the first sensing end 211 on surface B coincides with the second sensing end 221. The through hole 101 is provided corresponding to the first sensing end 211 and the second sensing end 221, and the through hole 101 extends through the first sensing end 211, the flexible substrate 100, and the second sensing end 221. The connecting portion 230 is provided within the through hole 101 so that a portion of the connecting portion 230 is surrounded by the first sensing end 211, and another portion of the connecting portion 230 is surrounded by the second sensing end 221. It will be appreciated that this arrangement can provide a tighter and more reliable connection between the connecting portion 230 and the first sensing end 211 and the second sensing end 221. Furthermore, the connection between the first sensing end 211 and the second sensing end 221 can be achieved by simply providing the connecting portion 230 within the through hole 101, making the overall manufacturing process simpler and more convenient for processing and manufacturing.

[0063] As an embodiment, the first sensing terminal 211 and the first signal transmission unit 212 are integrally molded; the second sensing terminal 221 and the second signal transmission unit 222 are integrally molded. As will be appreciated, the use of an integral molding method not only enhances the connection reliability between the first sensing terminal 211 and the first signal transmission unit 212, and between the second sensing terminal 221 and the second signal transmission unit 222, but also eliminates the need for separate components, reducing the number of manufacturing steps and further improving the production efficiency of the temperature sensing film.

[0064] More specifically, a first metal layer is provided on surface A of the flexible substrate 100, and the first sensing end 211 and the first signal transmission portion 212 are integrally formed by etching; a second metal layer is provided on surface B of the flexible substrate 100, and the second sensing end 221 and the second signal transmission portion 222 are integrally formed by etching.

[0065] 10 and 11 , the temperature sensing film further includes a thermal insulation layer 240 . After the first signal transmission portion 212 is disposed on the flexible substrate 100 , the thermal insulation layer 240 is disposed on surface A of the flexible substrate 100 to cover all or part of the first signal transmission portion 212 . After the second signal transmission portion 222 is disposed on the flexible substrate 100 , the thermal insulation layer 240 is disposed on surface B of the flexible substrate 100 to cover all or part of the second signal transmission portion 222 .

[0066] It can be understood that in this embodiment, the first signal transmission part 212 and the second signal transmission part 222 are only used to transmit signals. Therefore, in order to prevent the first signal transmission part 212 and the second signal transmission part 222 from being affected by temperature and causing adverse effects on the temperature detection results, in this embodiment, an insulation layer 240 is provided to cover all / part of the first signal transmission part 212 and all / part of the second signal transmission part 222, which can further improve the accuracy of the temperature detection results.

[0067] It can be understood that since the area where the first sensing end 211, the connecting portion 230 and the second sensing end 221 are located is the temperature sensing position on the temperature sensing film, the thermal insulation layer 240 should avoid the area where the first sensing end 211, the connecting portion 230 and the second sensing end 221 are located.

[0068] As an embodiment, in order to improve detection accuracy, the thermal insulation layer 240 provided on the A surface covers the entire first signal transmission part 212 , and the thermal insulation layer 240 provided on the B surface covers the entire second signal transmission part 222 .

[0069] As another embodiment, in order to prevent the thermal insulation layer 240 from covering the area where the first sensing end 211, the connecting part 230 and the second sensing end 221 are located, the thermal insulation layer 240 arranged on the A surface covers a portion of the first signal transmission part 212, and the thermal insulation layer 240 is not arranged in the area of ​​the first signal transmission part 212 close to the first sensing end 211; the thermal insulation layer 240 arranged on the B surface covers a portion of the second signal transmission part 222, and the thermal insulation layer 240 is not arranged in the area of ​​the second signal transmission part 222 close to the second sensing end 221.

[0070] As a feasible implementation, the heat insulation layer 240 is provided as follows:

[0071] A thermal insulation slurry is used, and a thermal insulation film is formed on the A side of the flexible substrate 100 by any one of printing, sputtering, or deposition processes, so that the thermal insulation film covers all / part of the first signal transmission part 212, and the thermal insulation film is solidified into the thermal insulation layer 240 by sintering. A thermal insulation film is formed on the B side of the flexible substrate 100 by any one of printing, sputtering, or deposition processes, so that the thermal insulation film covers all / part of the second signal transmission part 222, and the thermal insulation film is solidified into the thermal insulation layer 240 by sintering.

[0072] As another feasible embodiment, the thermal insulation layer 240 is provided as follows: the thermal insulation layer 240 is bonded to the A side and the B side of the flexible substrate 100 respectively, so that the thermal insulation layer 240 provided on the A side covers all / part of the first signal transmission part 212, and the thermal insulation layer 240 provided on the B side covers all / part of the second signal transmission part 222.

[0073] Referring to Figures 12 and 13, the second embodiment of the present application further provides a method for manufacturing a temperature and pressure sensing film. The method for manufacturing the temperature and pressure sensing film includes the manufacturing of a temperature sensing portion and a pressure sensing portion, wherein the temperature sensing portion is manufactured by the above-mentioned method for manufacturing the temperature sensing film, and the pressure sensing portion 300 is disposed on the A side or the B side of the flexible substrate 100. The method for manufacturing the temperature sensing film, the structure of the temperature sensing film manufactured by this method, and the beneficial effects have been described in the above-mentioned embodiments and will not be repeated here. It can be understood that by disposing the pressure sensing portion 300 on the A side or the B side of the flexible substrate 100, the pressure sensing portion 300 and the temperature sensing portion can be better integrated on the flexible substrate 100, while meeting the requirements of temperature detection and pressure detection, and ensuring the flexibility of the temperature and pressure sensing film.

[0074] As an embodiment, the step of providing the pressure sensing portion 300 on the flexible substrate 100 includes:

[0075] A pressure sensing electrode 301 and a pressure signal transmission wire 302 connected to the pressure sensing electrode 301 are provided on surface A or surface B of the flexible substrate 100; a pressure-sensitive film 303 is provided on the side where the pressure sensing electrode 301 is provided. The pressure-sensitive film 303 at least covers the entire pressure sensing electrode 301 to form a pressure sensing area with the pressure sensing electrode 301.

[0076] In one embodiment, the first sensing portion 210 is disposed on surface A of the flexible substrate 100 by etching, the second sensing portion 220 is disposed on surface B of the flexible substrate 100 by etching, and the pressure sensing electrode 301 is disposed on either surface A or surface B of the flexible substrate 100 by etching. More specifically, when the pressure sensing electrode 301 is disposed on surface A, the material of the pressure sensing electrode 301 is the same as that of the first sensing portion 210, and the pressure sensing electrode 301 and the first sensing portion 210 are formed on surface A of the flexible substrate 100 by a single etching process. When the pressure sensing electrode 301 is disposed on surface B, the material of the pressure sensing electrode 301 is the same as that of the second sensing portion 220, and the pressure sensing electrode 301 and the second sensing portion 220 are formed on surface B of the flexible substrate 100 by a single etching process. It can be understood that the material of the pressure sensing electrode 301 is the same as the material of the first sensing part 210 or the second sensing part 220. The pressure sensing electrode 301, the first sensing part 210 and the second sensing part 220 are all set by etching. Such a setting method can further reduce the process of separately setting the pressure sensing electrode 301, save production time and further reduce production costs; at the same time, it can further ensure the flexibility of the produced temperature and pressure sensing film.

[0077] Please continue to refer to Figures 1 to 11. The third embodiment of the present application further provides a temperature sensing film, which is manufactured by the above-mentioned temperature sensing film manufacturing method. The structure and beneficial effects of the temperature sensing film manufactured by the above-mentioned temperature sensing film manufacturing method have been described in the above-mentioned embodiments and will not be repeated here.

[0078] The above are merely optional embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included within the scope of the claims of the present application.

Claims

1. A method for manufacturing a temperature sensing film, characterized in that: The production method comprises the following steps: A first sensing portion (210) is provided on surface A of the flexible substrate (100); A second sensing portion (220) is provided on surface B of the flexible substrate (100); A through hole (101) is provided to penetrate at least the A surface and the B surface of the flexible substrate (100); The first sensing portion (210), the second sensing portion (220) and the through hole (101) are arranged correspondingly; A connecting portion (230) is provided on the flexible substrate (100), wherein at least a portion of the connecting portion (230) is provided in the through hole (101) to connect the first sensing portion (210) and the second sensing portion (220); The A surface and the B surface are different surfaces of the flexible substrate (100); the first sensing portion (210) and the second sensing portion (220) are made of different metal materials; the connecting portion (230) and one of the first sensing portion (210) and the second sensing portion (220) are made of the same metal material; and the first sensing portion (210), the second sensing portion (220) and the connecting portion (230) form a temperature sensing portion (200).

2. The method for manufacturing a temperature sensing film according to claim 1, characterized in that: The A surface and the B surface are two opposite surfaces of the flexible substrate (100); the projection of the first sensing portion (210) on the B surface at least covers a portion of the second sensing portion (220); the through hole (101) passes through the first sensing portion (210), the flexible substrate (100) and the second sensing portion (220); the connecting portion (230) is at least partially disposed in the through hole (101) to connect the first sensing portion (210) and the second sensing portion (220).

3. The method for manufacturing a temperature sensing film according to claim 2, characterized in that: The thickness of the first sensing portion (210) is between 5 μm and 30 μm; the thickness of the second sensing portion (220) is between 5 μm and 30 μm.

4. The method for manufacturing a temperature sensing film according to claim 2, characterized in that: The through hole (101) has a central axis perpendicular to the A surface, and the through hole (101) also has a cross section perpendicular to the central axis, and the maximum width of the cross section ranges from 0.2 mm to 3 mm.

5. The method for manufacturing a temperature sensing film according to claim 1, characterized in that: The material of the first sensing part (210) is copper, and the material of the second sensing part (220) is copper-nickel alloy; Or, the material of the first sensing part (210) is nickel-chromium, and the material of the second sensing part (220) is nickel-silicon; Alternatively, the material of the first sensing part (210) is nickel-chromium, and the material of the second sensing part (220) is copper-nickel alloy.

6. The method for manufacturing a temperature sensing film according to claim 1, characterized in that: A first metal layer is provided on surface A of the flexible substrate (100), and a second metal layer is provided on surface B of the flexible substrate (100), wherein the first metal layer and the second metal layer are different metal material layers; Forming the first sensing portion (210) by etching the first metal layer; The second sensing portion (220) is formed by etching the second metal layer.

7. The method for manufacturing a temperature sensing film according to claim 1, characterized in that: The first sensing portion (210) is disposed on the surface A of the flexible substrate (100) by sputtering, and the second sensing portion (220) is disposed on the surface B of the flexible substrate (100) by sputtering; Alternatively, the first sensing portion (210) is disposed on the surface A of the flexible substrate (100) by printing, and the second sensing portion (220) is disposed on the surface B of the flexible substrate (100) by printing.

8. The method for manufacturing a temperature sensing film according to claim 1 or 2, characterized in that: The flexible substrate (100) is provided with a signal input end (102) and a signal output end (103), and the signal input end (102) and the signal output end (103) are used to connect to other devices to transmit electrical signals; The first sensing portion (210) comprises a first sensing end (211) and a first signal transmission portion (212), the first sensing end (211) corresponds to the through hole (101), and the first signal transmission portion (212) is used to connect the signal input end (102) and the first sensing end (211); The second sensing portion (220) comprises a second sensing end (221) and a second signal transmission portion (222), the second sensing end (221) corresponds to the through hole (101), and the second signal transmission portion (222) is used to connect the signal output end (103) and the second sensing end (221); The connecting portion (230) connects the first sensing end (211) and the second sensing end (221).

9. The method for manufacturing a temperature sensing film according to claim 8, characterized in that: The first sensing end (211) and the first signal transmission part (212) are integrally formed; The second sensing end (221) and the second signal transmission part (222) are integrally formed.

10. The method for manufacturing a temperature sensing film according to claim 8, characterized in that: The temperature sensing film further comprises a heat insulating layer (240); after the first signal transmission part (212) is arranged on the flexible substrate (100), the heat insulating layer (240) is arranged on the A surface of the flexible substrate (100) to cover all / part of the first signal transmission part (212); and after the second signal transmission part (222) is arranged on the flexible substrate (100), the heat insulating layer (240) is arranged on the B surface of the flexible substrate (100) to cover all / part of the second signal transmission part (222).

11. The method for manufacturing a temperature sensing film according to claim 8, characterized in that: The flexible substrate (100) is further provided with vias; When the signal input end (102) and the signal output end (103) are both arranged on the A surface of the flexible substrate (100), the second signal transmission part (222) passes through the via hole from the B surface and is connected to the signal output end (103) arranged on the A surface; When the signal input end (102) and the signal output end (103) are both arranged on the B surface of the flexible substrate (100), the first signal transmission part (212) passes through the via hole from the A surface and is connected to the signal input end (102) arranged on the B surface.

12. A temperature sensing film, characterized in that: The temperature sensing film is manufactured by the method for manufacturing a temperature sensing film according to claim 1.

13. A method for manufacturing a temperature and pressure sensing film, characterized in that: The method for manufacturing the temperature and pressure sensing film comprises manufacturing a temperature sensing portion (200) by the method for manufacturing a temperature sensing film according to claim 1; The temperature and pressure sensing film further comprises a pressure sensing portion (300), wherein the pressure sensing portion (300) is arranged on the A surface or the B surface of the flexible substrate (100).

14. The method for manufacturing the temperature and pressure sensing film according to claim 13, characterized in that: The step of providing a pressure sensing portion (300) on the flexible substrate (100) comprises: A pressure sensing electrode (301) and a pressure signal transmission wire (302) connected to the pressure sensing electrode (301) are provided on the A surface or the B surface of the flexible substrate (100); A pressure-sensitive film (303) is provided on a side where the pressure sensing electrode (301) is provided, and the pressure-sensitive film (303) at least covers the entirety of the pressure sensing electrode (301) to form a pressure sensing area with the pressure sensing electrode (301).

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