Purge nozzle, substrate processing device, method for purging substrate container, method for manufacturing semiconductor device, and program

Abstract

The present invention comprises: (a) an adhesion part which has an opening in the center and is configured to be capable of adhering to a purge port of a substrate container; (b) a bush which is connected to a surface, of the adhesion part, opposite to the surface that adheres to the purge port, and which has a cylinder part that communicates with the opening; (c) a gas pipe which is gap-fitted to the inner periphery of the cylinder part such that there is a first gap between; (d) a port flange that is fixedly connected to the gas pipe and has a flange surface substantially perpendicular to the pipe axis of the gas pipe; and (e) an elastic member that is provided between the port flange and the bush and biases the bush in a direction away from the port flange, wherein (d1) the port flange has a hole having a diameter corresponding to the outer diameter of the cylinder part in a manner concentric to the gas pipe, and the outer periphery of the cylinder part is gap-fitted to the hole such that there is a second gap therebetween.

Description

Purge nozzle, substrate processing apparatus, substrate container purging method, semiconductor device manufacturing method and program

[0001] The present disclosure relates to a purge nozzle, a substrate processing apparatus, a method for purging a substrate container, a method for manufacturing a semiconductor device, and a program.

[0002] In semiconductor manufacturing equipment, substrates to be processed are sometimes stored in a front opening unified pod (FOUP) serving as a substrate container and then carried into a placement unit. A purge gas may be supplied to the FOUP in the equipment (see, for example, Patent Document 1).

[0003] Japanese Patent Application Laid-Open No. 2015-29057

[0004] Purge gas is supplied to the FOUP by connecting a purge nozzle to a purge port at the bottom of the FOUP, but improved adhesion of the purge nozzle is required.

[0005] The present disclosure provides a technique that can improve the adhesion of a purge nozzle.

[0006] According to one aspect of the present disclosure, there is provided a technology comprising: (a) a contact portion having an opening in the center and configured to be able to contact a purge port of a substrate container; (b) a bushing connected to a surface of the contact portion opposite to the surface that contacts the purge port and having a cylindrical portion that communicates with the opening; (c) a gas pipe that is clearance-fitted to the inner periphery of the cylindrical portion with a first gap; (d) a port flange that is fixedly connected to the gas pipe and has a flange surface that is approximately perpendicular to the pipe axis of the gas pipe; and (e) an elastic member that is provided between the port flange and the bushing and biases the bushing in a direction away from the port flange; and (d1) the port flange has a hole that is concentric with the gas pipe and has a diameter corresponding to the outer diameter of the cylindrical portion, and the outer periphery of the cylindrical portion is clearance-fitted to the hole with a second gap.

[0007] According to the present disclosure, it is possible to improve the adhesion of the purge nozzle.

[0008] FIG. 1 is a perspective view of an accommodation chamber preferably used in an embodiment of the present disclosure. FIG. 2 is a cross-sectional view of a substrate processing apparatus preferably used in an embodiment of the present disclosure. FIG. 3 is a top view of a horizontal drive mechanism preferably used in an embodiment of the present disclosure. FIG. 4 is a rear view of the horizontal drive mechanism preferably used in an embodiment of the present disclosure. FIG. 5 is a configuration diagram of a purge gas supply system preferably used in an embodiment of the present disclosure. FIG. 6 is a vertical cross-sectional view of a purge nozzle preferably used in an embodiment of the present disclosure. FIG. 7 is a schematic configuration diagram of a controller of a substrate processing apparatus preferably used in an embodiment of the present disclosure. FIG. 8 is a flow chart showing a substrate processing process applied in an embodiment of the present disclosure. FIG. 9 is a vertical cross-sectional view of a purge nozzle in a first modified example of an embodiment of the present disclosure. FIG. 10 is a vertical cross-sectional view of a purge nozzle in a second modified example of an embodiment of the present disclosure. FIG. 11 is a vertical cross-sectional view of a purge nozzle in a third modified example of an embodiment of the present disclosure.

[0009] Hereinafter, one embodiment of the present disclosure will be described mainly with reference to FIGS. 1 to 8. It should be noted that all drawings used in the following description are schematic, and the dimensional relationships, ratios, etc. of the elements shown in the drawings do not necessarily correspond to the actual ones. Furthermore, the dimensional relationships, ratios, etc. of the elements do not necessarily correspond between multiple drawings. Furthermore, substantially identical elements are assigned the same reference numerals between multiple drawings, and each element is described in the drawing in which it first appears, and its description is omitted in subsequent drawings unless otherwise necessary. Unless otherwise specified in the specification, each element is not limited to one, and multiple elements may be present.

[0010] (1) Configuration of the Substrate Processing Apparatus As shown in Fig. 1, in this embodiment, the substrate processing apparatus 4 is configured as a vertical processing apparatus (batch-type vertical processing apparatus) that performs processing steps in a semiconductor device manufacturing method. Note that in the vertical processing apparatus to which the present disclosure is applied, a FOUP (hereinafter referred to as a pod) 20 is used as a carrier for transporting wafers W as substrates. The substrate processing apparatus 4 includes a processing furnace 8, an accommodation chamber 12, and a transport chamber 16, which will be described later.

[0011] (Accommodation Chamber) The accommodation chamber 12, which loads and stores the pod 20 into the apparatus, is located at the front side of the housing of the substrate processing apparatus 4. A loading / unloading port 22A, which is an opening for loading and unloading the pod 20 into and out of the accommodation chamber 12, is opened at the front side of the housing of the accommodation chamber 12 so as to communicate between the inside and outside of the housing of the accommodation chamber 12. The loading / unloading port 22A may be configured to be opened and closed by a front shutter. An AGV port (I / O stage) 22 is provided inside the housing of the loading / unloading port 22A. A load port 42, described later, is installed on the wall between the accommodation chamber 12 and the transfer chamber 16. The pod 20 is loaded onto the AGV port 22 into the substrate processing apparatus 4 by an intra-process transfer device (inter-process transfer device) located outside the substrate processing apparatus 4, and is also unloaded from the AGV port 22.

[0012] Above the AGV port 22 at the front of the housing of the accommodation chamber 12, storage shelves (pod shelves) 30A and 30B for storing pods 20 are installed in two upper and lower tiers. Furthermore, at the rear of the housing of the accommodation chamber 12, storage shelves (pod shelves) 30C and 30D for storing pods 20 are installed in two upper and lower tiers. Each of the storage shelves 30C and 30D can store three pods 20, and can also be said to have three shelves. The three shelves of the storage shelf 30C are referred to as storage shelves 30C_1, 30C_2, and 30C_3. The three shelves of the storage shelf 30D are referred to as storage shelves 30D_1, 30D_2, and 30D_3. When the storage shelves 30A, 30B, 30C, and 30D are not to be distinguished from one another, they are collectively referred to as storage shelves 30.

[0013] OHT ports 32A and 32B are installed side by side on the same horizontal line as the upper storage shelf 30A at the front of the housing. When there is no need to distinguish between the OHT ports 32A and 32B, they are referred to as OHT ports 32. The pod 20 is loaded onto and unloaded from the OHT port 32 from above the substrate processing apparatus 4 by an in-process transfer device (inter-process transfer device) outside the substrate processing apparatus 4. The AGV port 22, storage shelf 30, and OHT port 32 are configured so that the pod 20 can be horizontally moved between a placement position and a transfer position by a horizontal drive mechanism 26. A detailed description of the horizontal drive mechanism 26 will be given later.

[0014] 2, the space within the housing of the storage chamber 12 between the front storage shelves 30A, 30B and the rear storage shelves 30C, 30D forms a pod transfer area 14, where pods 20 are transferred and transported. A rail mechanism 40A is formed on the ceiling of the pod transfer area 14 (the ceiling of the storage chamber 12) as a running path for a pod transport mechanism 40 (described later). The transfer position is located within the pod transfer area 14, for example, directly below the pod transport mechanism 40.

[0015] The pod transport mechanism 40 that transports the pod 20 includes a travel unit 40B that travels on a rail mechanism 40A, a holder 40C that holds the pod 20, and a lifting unit 40D that vertically raises and lowers the holder 40C. By detecting the encoder of the motor that drives the travel unit 40B, the position of the travel unit 40B can be detected, and the travel unit 40B can be moved to any desired position. The pod transport mechanism 40 is configured, for example, as a wire-suspended transport machine (hoist).

[0016] A purge gas supply system 23 is provided above the pod 20 placed on the AGV port 22 and below the lower storage shelf 30B. The purge gas supply system 23 will be described in detail later.

[0017] (Transfer Chamber) The transfer chamber 16 is located adjacent to the rear of the accommodation chamber 12. On the transfer chamber 16 side of the accommodation chamber 12, a plurality of wafer loading / unloading ports 44 for loading / unloading wafers W into / from the transfer chamber 16 are horizontally aligned and opened, and load ports 42A, 42B are respectively installed for each wafer loading / unloading port 44. The load ports 42A, 42B horizontally move mounting tables 43A, 43B on which the pod 20 is placed, pressing them against the wafer loading / unloading ports 44 and unfolding the lid of the pod 20. Once the lid of the pod 20 is unfolded, the wafer W is transferred into and out of the pod 20 by the substrate transfer machine 86. When there is no need to distinguish between the load ports 42A, 42B, they are referred to as the load port 42. When there is no need to distinguish between the mounting tables 43A, 43B, they are referred to as the mounting table 43.

[0018] (Processing Furnace) The processing furnace 8 is provided above the transfer chamber 16. The processing furnace 8 has a reaction tube 50 that constitutes a reaction vessel (processing vessel). The reaction tube 50 is made of, for example, quartz (SiO ２ The reaction tube 50 is made of a heat-resistant material such as silicon carbide (SiC) or silicon dioxide (SiO2), and is formed in a cylindrical shape with a closed upper end and an open lower end. A processing chamber 54 is formed in the hollow cylindrical portion of the reaction tube 50. The processing chamber 54 is configured to accommodate wafers W in a boat 58 (described later) in a horizontal position and aligned vertically in multiple stages.

[0019] A seal cap 78 is provided below the reaction tube 50 as a furnace opening cover capable of airtightly closing the lower end opening of the reaction tube 50. The seal cap 78 is a disk-shaped member made of metal such as SUS or stainless steel. The seal cap 78 is configured to abut against the lower end of the reaction tube 50 from below in the vertical direction.

[0020] The boat 58 as a substrate support is configured to support a plurality of wafers W, for example, 25 to 200 wafers W, in a horizontal position and aligned vertically with their centers aligned, i.e., arranged at intervals in multiple stages. The boat 58 is made of a heat-resistant material such as quartz or SiC.

[0021] A rotation mechanism 80 for rotating the boat 58 is installed on the opposite side of the seal cap 78 from the processing chamber 54. A rotation shaft 80A of the rotation mechanism 80 passes through the seal cap 78 and is connected to the boat 58. The rotation mechanism 80 is configured to rotate the boat 58, thereby rotating the wafers W.

[0022] Next, the horizontal drive mechanism 26 of the storage shelf 30, AGV port 22, and OHT port 32 of this embodiment will be described with reference to Figures 3 and 4. As shown in Figure 3, the horizontal drive mechanism 26 is installed on the base 24 and is configured to horizontally move a stage 25, which is a mounting portion (mounting plate) on which the pod 20 is placed. This allows the stage 25 to be positioned within the pod transport area 14, and allows the pod 20 to be placed on the stage 25 by the pod transport mechanism 40.

[0023] The base 24 is composed of a fixed plate 24A, an adjustment plate 24B, a fixing screw 24C, and an adjustment screw 24D. The fixed plate 24A and the adjustment plate 24B are connected by a plurality of adjusters. The adjusters are composed of a fixing screw 24C as a fastening member that fixes the fixed plate 24A and the adjustment plate 24B, and two adjustment screws 24D as horizontal adjustment members that are installed in positions facing the fixing screw 24C. The horizontality of the stage 25 can be adjusted by adjusting the tightness of the adjustment screw 24D.

[0024] As shown in FIG. 3 , the horizontal drive mechanism 26 is composed of a first drive unit 26A, a pair of guide units 26B and 26D, a transmission unit (belt) 26C, a pulley (not shown), a connecting unit (plate) 26E, a first fixed unit (not shown), and a second fixed unit (not shown). The first drive unit 26A is a drive unit that moves the stage 25 horizontally. The pair of guide units 26B and 26D move the stage 25 in parallel. The transmission unit 26C transmits the power of the first drive unit 26A. The pulley is installed inside one of the guide units 26B and is a rotating member that rotates the transmission unit 26C. The connecting unit 26E is flat and connected to the bottom of the stage 25. The first fixed unit secures the connecting unit 26E to the transmission unit 26C. The second fixed unit secures the transmission unit 26C to the adjustment plate 24B. The first drive unit 26A is, for example, an air cylinder or a motor. 4, the tips of the guide portions 26B and 26D are connected to each other and are formed in a U-shape in plan view. The first drive portion 26A is installed approximately in the center between the guide portions 26B and 26D and is configured to press the connecting portion of the guide portions 26B and 26D with the rod 26F.

[0025] The transmission unit 26C is formed of an endless belt-like member and is stretched over a pulley. The transmission unit 26C and the connecting unit 26E are fixed by a block-shaped second fixing portion, and the transmission unit 26C and the adjusting plate 24B are fixed by a block-shaped third fixing portion (not shown). Because the third fixing portion is fixed to the adjusting plate 24B, the transmission unit 26C can be rotated when the guide unit 26B moves. The rotation of the transmission unit 26C causes the stage 25 fixed to the connecting unit 26E to move horizontally. This configuration allows two horizontal movements of the stage 25: the horizontal movement of the guide unit 26B and the horizontal movement of the stage 25 by the transmission unit 26C, to be performed simultaneously. Furthermore, because the stage 25 can be moved horizontally in two stages, space can be saved without increasing the length of the rod 26F of the first driving unit 26A.

[0026] Two sensors 28A and 28B are installed on the outer portion of the guide portion 26B on the adjustment plate 24B. The sensors 28A and 28B are, for example, photosensors. The two sensors 28A and 28B are installed to detect the placement and transfer positions of the stage 25, respectively. A thin plate-shaped detection member 28C is attached to the rear end of the guide portion 26B on the side where the sensor 28B is installed. The position of the stage 25 is detected when the detection member 28C passes through the detection portion of the sensor 28B. By adjusting the installation position of the sensor 28B, the stage 25 can be driven at any stroke, improving controllability. A stopper 27 is attached to the end of the guide portion 26D on the side where the detection member 28C is not attached.

[0027] A sensor 25B is installed on the stage 25 to detect whether or not a pod 20 is placed thereon. The sensor 25B is configured, for example, as a photosensor. When a pod 20 is placed thereon, a pin is pressed by the bottom surface of the pod 20, and the pressed pin passes through the detection portion of the sensor 25B, thereby detecting that the pod 20 has been placed thereon. In addition, an opening 25A is formed on the tip side of the stage 25, and the opening 25A can be used as a handle to carry the stage 25 during maintenance. This configuration improves maintainability.

[0028] At the front of the housing, the upper storage shelf 30A and OHT ports 32A, 32B are mounted so as to be independently drivable on a single long base 24. At the rear of the housing, the storage shelves 30C, 30D are mounted so as to be independently drivable on a single long base 24. Three stages 25 are mounted on each long base 24 so as to be independently drivable.

[0029] The storage shelf 30 and the OHT port 32 are each provided with a purge mechanism that purges the atmosphere within the pod 20 and reduces the oxygen concentration within the pod 20. A purge mechanism may also be provided in the AGV port 22.

[0030] The purge mechanism will be described with reference to FIG. 5 . The storage shelves 30A, 30B, 30C_1 to 30C_3, and 30D_1 to 30D_3 and the OHT ports 32A and 32B each include a stage 25. Each stage 25 is provided with a purge nozzle 410 connectable to the purge port 21 of the pod 20 and an exhaust nozzle 510 connectable to the purge port 21. A gas supply pipe 411 is connected to the purge nozzle 410. A gas filter 413 and a flow control device 412 are provided to the gas supply pipe 411. The flow control device 412 is configured so that the flow rate is controlled by the controller 210, which will be described later. The flow control device 412 is composed of a valve 412a and a mass flow controller (MFC) 412b. A gas exhaust pipe 511 is connected to the exhaust nozzle 510. A pressure sensor 513 and a safety valve (relief valve) 514 are also connected to the gas exhaust pipe 511.

[0031] A gas filter 413 connected to the gas supply pipe 411, and a pressure sensor 513 and a safety valve 514 connected to the gas exhaust pipe 511 are provided on each stage 25. Furthermore, flow rate control devices 412 connected to each gas supply pipe 411 are integrated into a purge gas supply system 23 at the front of the housing. This facilitates operation and improves maintenance workability. The purge gas supply system 23 is an integrated gas supply system that is connected to at least one of the multiple purge nozzles 410 and supplies gas. Furthermore, the controller 210 receives information about the type of pod 20 inserted from a host device and controls the integrated gas supply system to supply gas from a purge port that corresponds to the type of pod 20 placed on the stage 25.

[0032] When the pod 20 is placed on the stage 25 of any of the storage shelves 30A, 30B, 30C, and 30D and the OHT ports 32A and 32B, a sensor 25B provided on the stage 25 detects that the pod 20 has been placed. Upon receiving a signal from the sensor 25B, the controller 210 opens the corresponding valve 412a of the purge gas supply system 23. As a result, purge gas is supplied to the pod 20 from a gas source (not shown) via the gas filter 413, gas supply pipe 411, and purge nozzle 410, and the purge gas is exhausted (discharged) from the exhaust nozzle 510 via the gas exhaust pipe 511. The purge gas is an inert gas, and may be, for example, nitrogen (N ２ ) gas can be used.

[0033] The configuration of the purge nozzle 410 will be described with reference to Fig. 6. The purge nozzle 410 is provided in a mounting hole 25C (see Fig. 3) that passes through the stage 25 in the vertical direction. The purge nozzle 410 includes a piping section 420, a bushing 430, a packing 440 as a contact section, a ring 450, a port flange 460, and a spring 470 as an elastic member.

[0034] The piping unit 420 includes a cylindrical gas pipe 422 having a flow path and a joint 424 having a flow path continuous with the flow path of the gas pipe 422. The gas pipe 422 is inserted through a bushing 430. The joint 424 is disposed below the stage 25 and connected to the gas supply pipe 411. This connects the flow path of the piping unit 420 and the flow path of the gas supply pipe 411, allowing purge gas to flow through the piping unit 420. The piping unit 420 is fixed to the stage 25 by fixing the gas supply pipe 411 to the back surface of the stage 25 using a fixing member or the like. The tip (upper end) of the gas pipe 422 is positioned so as not to protrude above the top surface of the stage 25. The gas supply pipe 411 is configured of SUS piping or PTFE tubing. Note that the piping unit 420 may be, for example, a part of the gas supply pipe 411.

[0035] The bushing 430 has a main body 432. A cylindrical plunger 433 having a cylindrical through-hole is provided inside the main body 432. The gas pipe 422 of the piping unit 420 is inserted into the through-hole of the cylindrical plunger 433. With the gas pipe 422 inserted into the cylindrical plunger 433, the bushing 430 is movable up and down along the gas pipe 422. A first gap G1 is formed between the inner surface of the cylindrical plunger 433 and the outer surface of the gas pipe 422. In other words, the gas pipe 422 is loosely fitted into the inner periphery of the cylindrical plunger 433 with the first gap G1. The sliding surface of the cylindrical plunger 433 with respect to the gas pipe 422 is made of resin and has a smooth cylindrical shape. The low sliding resistance of this resin allows the bushing 430 to move smoothly up and down. The length of the sliding surface in the sliding direction is at least 1.5 times the diameter of the gas pipe 422. This reduces the conductance of the first gap G1. One end (upper end) of the gas pipe 422 is located inside the cylindrical portion 433 and is positioned so that it does not protrude from the bushing 430 when the bushing 430 is pressed in by an external force. No seal ring is provided between the cylindrical portion 433 and the gas pipe 422.

[0036] An annular groove 435 is provided on the underside of the main body 432 so as to surround the tubular portion 433 when viewed from above and below. The upper portion of the spring 470 is disposed in the groove 435. An outwardly protruding flange (brim) 436 is provided on the upper end of the tubular portion 433. In other words, the tubular portion 433 extends through an opening 441 of the packing 440 and has the flange 436 at its tip. The through-hole of the tubular portion 433 communicates with the opening 441. The packing 440 is attached between the lower surface of the flange 436 and the upper surface of the main body 432. In other words, the packing 440 is fixed by fitting a step 442 into the flange 436. An outwardly protruding flange 437 is provided on the lower end of the main body 432. The outer diameter of the flange 437 is smaller than the inner diameter of the ring 450 (described later), forming a third gap G3.

[0037] The packing 440 is annularly formed to surround the cylindrical portion 433 when viewed from above and below. The packing 440 has a thickness in the axial direction that is smaller than the difference between the outer and inner circumferences. The packing 440 has an opening 441 in its center, and a step 442 on the side of the opening 441. The packing 440 is fixed to the main body portion 432 by fitting the step 442 at the lower end of its inner surface into the flange portion 436. The surface (lower surface) of the packing 440 opposite the surface that comes into contact with the purge port 21 connects to the cylindrical portion 433. When the pod 20 is placed on the stage 25, the upper surface of the packing 440 comes into contact with the purge port 21 (see FIG. 5 ) provided on the bottom surface of the pod 20. This allows communication between the gas pipe 422 and the pod 20 via the inner region of the packing 440 and the main body portion 432, enabling the supply of purge gas into the pod 20.

[0038] Since the packing 440 repeatedly comes into contact with the pod 20, it is preferable that it be highly durable. It is also preferable that it is less likely to adhere to the purge port 21 of the pod 20. Furthermore, in order to maintain the cleanliness of the inside of the pod 20, it is preferable that it generates a small amount of outgas. The packing 440 is made of rubber or resin that can meet the above requirements. In this example, the packing 440 is made of fluororubber.

[0039] The ring 450 has a main body portion 451 and a cylindrical portion 452. The main body portion 451 is an annular fixing member having a through-hole 453 at its center. The cylindrical portion 452 extends upward from the upper end of the inner surface of the main body portion 451, and has the through-hole 453 at its center. A restricting portion 454 extending inward is provided at the upper end of the cylindrical portion 452. A bushing 430 is provided in the through-hole 453.

[0040] The port flange 460 has a main body portion 461 and a flange portion 462. The main body portion 461 is an annular fixing member with a through hole 463 provided in its center. The gas pipe 422 is inserted into the through hole 463 and fixed thereto by welding or the like. In other words, the port flange 460 is fixedly connected to the gas pipe. The flange portion 462 has a flange surface that is approximately perpendicular to the pipe axis of the gas pipe 422. The main body portion 461 has a hole 464 that is concentric with the gas pipe 422 and has a diameter corresponding to the outer diameter of the cylindrical portion 433, and the outer periphery of the cylindrical portion 433 is clearance-fitted into the hole 464 with a second gap G2.

[0041] The flange portion 437 of the bushing 430 is disposed between the ring 450 and the port flange 460. As a result, the position of the bushing 430 in the vertical direction is restricted between an upper position where the flange portion 437 abuts against the lower surface of the restricting portion 454 of the ring 450 and a lower position where the flange portion 437 abuts against the upper surface of the port flange 460. In other words, the ring 450 is fixed to the flange surface of the port flange 460, and the restricting portion 454 restricts the bushing 430 from moving more than a predetermined distance from the port flange 460. The ring 450 is fixed to the flange surface of the port flange 460 with screws inserted from the underside of the flange surface. The bushing 430 is located in an upper position when the pod 20 is not placed on the stage 25, and is located between the upper and lower positions when the pod 20 is placed on the stage 25. In other words, the packing 440 can be pushed to a position where it does not protrude from the upper surface of the stage 25. Furthermore, the gas pipe 422 can be pushed in to a position where it does not protrude from the upper surface of the stage 25. As a result, even if the sealing surface of the purge port 21 is flush with the upper surface of the stage 25, the pod 20 can be placed and brought into close contact with the purge nozzle 410.

[0042] The side of the bushing 430 is loosely fitted with the inner circumferential surface of the ring 450, with a third gap G3. The first gap G1, the second gap G2, and the third gap G3 allow the bushing 430 to slide. The third gap G3 is located outside the first gap G1 and the second gap G2, and the diameter of the third gap G3 is, for example, approximately four times larger than the diameters of the first gap G1 and the second gap G2. For example, if the first gap G1, the second gap G2, and the third gap G3 have the same clearance, the cross-sectional flow area of ​​the third gap G3 is greater than the sum of the cross-sectional flow areas of the first gap G1 and the second gap G2. In other words, the conductance of the third gap G3 is greater than the combined conductance of the first gap G1 and the second gap G2. As a result, when the bushing 430 is pressed, gas trapped beneath the bushing 430 is released through the third gap G3. This facilitates sliding of the bushing 430. When sliding of the bushing 430 is performed in the second gap G2 or the third gap G3 instead of the first gap G1, the first gap G1 is set larger than the second gap G2 and the third gap G3.

[0043] The cylindrical portion 433 is inserted into the inner region of the spring 470. The upper end of the spring 470 is disposed in the groove 435 of the bushing 430. The lower end of the spring 470 abuts against the port flange 460. The spring 470 is compressed by the bushing 430 and the port flange 460. As a result, the spring 470 biases the bushing 430 toward the pod 20 (upward) in the vertical direction. In other words, the spring 470 biases the bushing 430 in a direction away from the port flange 460.

[0044] The exhaust nozzle 510 has a configuration similar to that of the purge nozzle 410. The exhaust nozzle 510 is connected to a gas exhaust pipe 511 instead of the gas supply pipe 411, and exhausts the purge gas from the pod 20. The gas exhaust pipe 511 is formed of a tube.

[0045] The operation when the pod 20 is placed on the stage 25 will be described. When the pod 20 approaches the stage 25, first, the packing 440 of the purge nozzle 410 comes into contact with the purge port 21 of the pod 20. More specifically, it comes into contact with the peripheral edge of the opening that constitutes the purge port 21. Then, the packing 440 is pressed down by the pod 20 while the purge port 21 and the packing 440 are kept in close contact with each other by the biasing force of the spring 470. When the pod 20 approaches further to the stage 25, the pod 20 is placed on the stage 25 with the purge port 21 and the packing 440 in close contact with each other. In this way, the spring 470 functions as a position adjustment unit that adjusts the position of the packing 440 in the vertical direction.

[0046] The positional relationship between the purge port 21 and the purge nozzle 410 may change depending on the type of pod 20. For example, the height of the sealing surface of the purge port 21 may differ by several millimeters depending on the pod manufacturer. Even in this case, as long as the purge port 21 of the pod 20 and the packing 440 are in contact with each other, the biasing force of the spring 470 keeps the purge port 21 and the packing 440 in close contact with each other. The packing 440 is then pressed down by the pod 20, automatically adjusting the position of the packing 440 in the vertical direction. This ensures that purge gas can be reliably supplied to the inside of the pod 20 even if the positional relationship between the purge port 21 of the pod 20 and the purge nozzle 410 changes.

[0047] 4, a controller 210, which is a control unit (control means), is configured as a computer including a CPU (Central Processing Unit) 212, a RAM (Random Access Memory) 214, a storage device 216, and an I / O port 218. The RAM 214, the storage device 216, and the I / O port 218 are configured to be able to exchange data with the CPU 212 via an internal bus 220. An input / output device 222 configured as, for example, a touch panel is connected to the controller 210.

[0048] The storage device 216 is composed of, for example, a flash memory, an HDD (Hard Disk Drive), etc. The storage device 216 readably stores a control program for controlling the operation of the substrate processing apparatus, a process recipe describing the procedures and conditions for substrate processing (described later), etc. The process recipe is a combination of procedures in the substrate processing step (described later) that are executed by the controller 210 to obtain a predetermined result, and functions as a program. Hereinafter, the process recipe, control program, etc. are collectively referred to simply as a program. In this specification, the term "program" may refer to only a process recipe, only a control program, or both. The RAM 214 is configured as a memory area (work area) in which programs, data, etc. read by the CPU 212 are temporarily stored.

[0049] The I / O port 218 is connected to the above-mentioned MFC 412b, valve 412a, pressure sensor 513, substrate transfer machine 86, rotation mechanism 80, boat elevator 82, pod transport mechanism 40, sensors 25B, 28A, 28B, horizontal drive mechanism 26, etc.

[0050] The CPU 212 is configured to read and execute a control program from the storage device 216, and to read a process recipe from the storage device 216 in response to input of an operation command from the input / output device 222, etc. The CPU 212 is configured to control, in accordance with the contents of the read process recipe, the wafer transfer operation by the substrate transfer machine 86, the rotation and rotation speed adjustment operation of the boat 58 by the rotation mechanism 80, the lifting and lowering operation of the boat 58 by the boat elevator 82, the pod transfer operation by the pod transfer mechanism 40, and the drive operation of the horizontal drive mechanism 26 based on the sensors 25B, 28A, and 28B. The CPU 212 is further configured to control the flow rate adjustment of the purge gas by the MFC 412b based on the pressure sensor 513, the opening and closing operation of the valve 412a based on the sensor 25B, etc.

[0051] The controller 210 can be configured by installing the above-mentioned program stored in an external storage device 224 (e.g., a magnetic tape, a magnetic disk such as a flexible disk or a hard disk, an optical disk such as a CD or a DVD, a magneto-optical disk such as an MO, or a semiconductor memory such as a USB memory or a memory card) into a computer. The storage device 216 and the external storage device 224 are configured as computer-readable recording media. Hereinafter, these will be collectively referred to as recording media. When the term recording media is used in this specification, it may include only the storage device 216, only the external storage device 224, or both. Note that the program may be provided to the computer using a communication means such as the Internet or a dedicated line, without using the external storage device 224.

[0052] (2) Substrate Processing Process An outline of the substrate processing process for processing substrates using the substrate processing apparatus 4 as a semiconductor manufacturing apparatus will be described below. This substrate processing process is, for example, one process for manufacturing semiconductor devices. In the following description, the operation and processing of each component constituting the substrate processing apparatus 4 are controlled by the controller 210.

[0053] [Substrate Loading Process: S10] (Loading into Load Port: S101) As shown in Figures 1 and 2, when the pod 20 is supplied to the AGV port 22 or the OHT port 32, the pod 20 on the AGV port 22 or the OHT port 32 is loaded onto the loading platform 43 of the load port 42 by the pod transport mechanism 40.

[0054] (Wafer Number Count: S102) The wafer loading / unloading port 44 of the load port 42 is closed by the capping mechanism, and clean air is circulated inside the transfer chamber 16, filling it.

[0055] The pod 20 placed on the mounting table 43 of the load port 42 has its open end pressed against the edge of the opening of the wafer loading / unloading port 44, and the cap is removed by the cap attaching / detaching mechanism, opening the wafer loading / unloading port. Thereafter, the number of wafers W in the pod 20 and the state of the wafers W are counted by a wafer counter device. After the number of wafers W has been counted, the cap is closed by the cap attaching / detaching mechanism.

[0056] (Shelf Purging: S103) Thereafter, the pod 20 is transported to and placed on the storage shelf 30. The pod 20 placed on the storage shelf 30 is purged. Purging may be performed continuously while the pod 20 is placed on the storage shelf 30, or may be performed intermittently at any time. Furthermore, the process of transporting the pod 20 from the AGV port 22 or the OHT port 32 to the storage shelf 30 may be repeated as many times as the number of pods that can be placed on the storage shelf 30.

[0057] (Loading wafers into boat: S104) Of the multiple pods 20 placed on the storage shelf 30, the pod 20 to be subjected to film formation is transferred from the storage shelf 30 to the load port 42 and transferred onto the mounting table 43 of the load port 42. The open end face of the pod 20 placed on the mounting table 43 is pressed against the edge of the opening of the wafer loading / unloading port 44, and the cap is removed by the capping / unloading mechanism, opening the wafer loading / unloading port. Once the pod 20 is opened, the wafer is picked up from the pod 20 through the wafer loading / unloading port by the substrate transfer machine 86, aligned in the circumferential direction by the notch alignment device, and then loaded (charged) into the boat 58. After loading the wafer W into the boat 58, the substrate transfer machine 86 returns to the pod 20 and loads the next wafer W into the boat 58.

[0058] While the substrate transfer machine 86 is loading wafers W from one load port 42 (load port 42A or load port 42B) into the boat 58, another pod 20 is transferred by the pod transfer mechanism 40 from the storage shelf 30 onto the mounting table 43 of the other load port 42 (load port 42B or load port 42A). Simultaneously with the loading of the wafers W, the load port 42 opens the pod 20. The emptied pod 20 is transferred from the load port 42 to the storage shelf 30 and placed thereon. The empty pod 20 placed on the storage shelf 30 may be subjected to the above-described purging. In this manner, the boat 58 is loaded with wafers W.

[0059] When a predetermined number of wafers W are loaded into the boat 58, the bottom end of the processing chamber 54 is opened. Then, the seal cap 78 is raised by the boat elevator 82 (see FIG. 7), and the boat 58 holding the wafers W is loaded into the processing chamber 54 (boat loading).

[0060] (Film Forming Step: S11) Next, a processing gas is supplied to the wafer W in the processing chamber 54, thereby forming a film on the surface of the wafer W.

[0061] (Substrate Unloading Step: S12) Next, the boat 58 on which the wafers W on which the films have been formed are placed is unloaded from the processing chamber .

[0062] According to this aspect, one or more of the following effects can be obtained.

[0063] (a) By providing the first gap G1 and the second gap G2, dust generation due to the up and down movement of the bushing 430 can be reduced.

[0064] (b) By providing the first gap G1 and the second gap G2, the flow path length is increased and the conductance is reduced, thereby doubly suppressing leakage of gas from the gas pipe 422 to the surrounding area.

[0065] (c) Since the thickness of the packing 440 is thin, the packing 440 is less likely to tip over when a lateral force is applied to it, and peeling of the packing 440 and the resulting leakage can be suppressed.

[0066] (d) Since narrowing the gaps and increasing their number reduces conductance, providing three gaps, the first gap G1, the second gap G2, and the third gap G3, further reduces leakage. In other words, gas leakage is triple-reduced by the first gap G1, the second gap G2, and the third gap G3.

[0067] (e) Gas leakage is suppressed, so N as a purge gas is ２ For example, the amount of N used when the gas leakage mechanism (b) and (c) is not provided can be reduced. ２ The gas consumption amount is 18 SLM, whereas the consumption amount in this embodiment is 8 SLM or more and 10 SLM or less.

[0068] (f) Since the bushing 430 slides against the gas pipe 422 instead of the packing 440 or O-ring, which have high friction, the movement is smoother and the adhesion with the purge port 21 is improved.

[0069] (g) The spring 470 maintains the pressing force while allowing the purge nozzle 410 to move over a wide range, so that it is possible to accommodate various pods 20 having different heights of the sealing surface on the rear surface of the pod 20 .

[0070] Although the embodiments of the present disclosure have been specifically described above, the present disclosure is not limited to the above-described embodiments and can be modified in various ways without departing from the spirit of the present disclosure.

[0071] The configuration of the purge nozzle of the modified example will be described with reference to FIGS.

[0072] The purge nozzle of the above-described embodiment is not provided with a sealing member such as a seal ring. As shown in Fig. 9, in a first modification, a seal ring (e.g., an O-ring 480) is provided between the side surface of the flange portion 437 of the bushing 430 and the inner periphery of the cylindrical portion 452 of the ring 450.

[0073] An O-ring 480 disposed in a groove 438 formed in the flange portion 437 of the bushing 430 is compressed by the cylindrical portion 452 of the ring 450 and the flange portion 437 of the bushing 430, and is in close contact with the cylindrical portion 452 and the flange portion 437. That is, the O-ring 480 closes the gap between the ring 450 and the bushing 430 at the through-hole 453. This closes the third gap G3 between the cylindrical portion 452 and the flange portion 437, thereby preventing purge gas from leaking from the third gap G3. This modification also provides the same effects as the above-described embodiment.

[0074] As shown in FIG. 10 , in the second modification, a seal ring (for example, an O-ring 490 ) is provided between the cylindrical portion 433 of the bushing 430 and the gas pipe 422 .

[0075] An O-ring 490 disposed in a groove 436a formed on the inner surface of the cylindrical portion 433 is compressed by the gas pipe 422 and the cylindrical portion 433 and is in close contact with the gas pipe 422 and the cylindrical portion 433. That is, the O-ring 490 closes the gap between the piping portion 420 and the bushing 430. This closes the first gap G1 between the gas pipe 422 and the cylindrical portion 433, thereby preventing purge gas from leaking from the first gap G1. In this modified example, the same effects as those of the above-described embodiment can be obtained.

[0076] 11 , in the third modification, the structure of the packing 440 is changed from that of the purge nozzle 410 of the embodiment, and a bellows 500 is added to seal between the bushing 430 and the port flange 460, with a larger-diameter spring 470 disposed on the outer periphery of the bellows 500. The packing 440 has grooves (thin-walled portions) 443 that act to reduce the elasticity of the surface that abuts the purge port 21 in the direction perpendicular to the surface, making the peripheral portion smaller than the center. This prevents purge gas from leaking. This modification also provides the same effects as the above-described embodiment.

[0077] The above-described embodiments and modifications may be used in combination as appropriate. The processing procedures and processing conditions in such a case may be the same as those of the above-described embodiments and modifications, for example.

[0078] In the above-described embodiment, a batch-type substrate processing apparatus (vertical apparatus) that processes multiple substrates at a time has been described as an example. However, the present disclosure is not limited to the above-described embodiment, and can also be suitably applied to single-wafer and multi-wafer apparatuses equipped with an IBR (Internal Buffer Rack), and apparatuses that process substrates with liquids such as cleaning liquids.

[0079] 410: Purge nozzle 422: Gas pipe 430: Bush 433: Cylinder portion 440: Packing (sealing portion) 441: Opening 460: Port flange 464: Hole 470: Spring (elastic member) G1: First gap G2: Second gap

Claims

(a) a contact portion having an opening in the center and configured to be able to contact a purge port of a substrate container; (b) a bushing connected to the surface of the contact portion opposite the surface that contacts the purge port and having a cylindrical portion communicating with the opening; (c) a gas pipe that is gap-fitted into the inner circumference of the cylindrical portion with a first gap; (d) a port flange fixedly connected to the gas pipe and having a flange surface that is approximately perpendicular to the axis of the gas pipe; and (e) an elastic member provided between the port flange and the bushing and biasing the bushing in a direction away from the port flange; (d1) a purge nozzle comprising: a port flange having a hole concentric with the gas pipe and a diameter corresponding to the outer diameter of the cylindrical portion, and an outer circumference of the cylindrical portion that is gap-fitted into the hole with a second gap.

2. The purge nozzle according to claim 1, wherein the contact portion is formed in an annular shape and has a thickness smaller than the difference between the outer circumference and the inner circumference.

3. A purge nozzle as described in claim 1, wherein the side of the opening of the contact portion has a step, the tubular portion extends within the opening and has a flange at its tip, and the contact portion is fixed by fitting the step and the flange together.

4. A purge nozzle as described in claim 1, further comprising: (f) a ring fixed to the flange surface for restricting the bush from moving away from the port flange more than a predetermined distance.

5. A purge nozzle as described in claim 4, wherein the side surface of the bush is gap-fitted with the inner surface of the ring with a third gap, and gas leakage is triple-restricted by the first gap, the second gap, and the third gap.

6. The purge nozzle according to claim 5, wherein the first gap is set larger than the second gap and the third gap.

7. A purge nozzle according to claim 1, wherein one end of said gas pipe is located within said cylindrical portion and at a position where it does not protrude from said bush when said bush is pressed in by an external force.

8. The purge nozzle according to claim 1, wherein the sliding surface of said cylindrical portion with said gas pipe is made of resin and formed into a smooth cylindrical shape.

9. The purge nozzle according to claim 1, wherein no seal ring is provided between said cylindrical portion and said gas pipe.

10. A purge nozzle according to claim 4, further comprising a seal ring provided between said cylindrical portion and said gas pipe, or between a side surface of said bush and an inner periphery of said ring.

11. A purge nozzle as described in claim 8, wherein the length of the sliding surface in the sliding direction is 1.5 times or more the diameter of the gas pipe.

12. A purge nozzle as described in claim 1, wherein the contact portion has a groove that acts so that the elasticity of the surface that abuts against the purge port in a direction perpendicular to the surface is smaller at the periphery than at the center.

13. A substrate processing apparatus using the purge nozzle of claim 1, comprising: (g) a plurality of mounting plates on which the substrate containers are placed; (h) a purge nozzle provided for each of the mounting plates; and an integrated gas supply system connected to at least one of the plurality of purge nozzles for supplying gas.

14. The substrate processing apparatus according to claim 13, wherein the substrate container is placed on the placement plate by a container transport device of a wire suspension type.

15. The substrate processing apparatus according to claim 13, wherein the tip of the gas pipe does not protrude beyond the mounting plate, and the contact portion can be pushed in to a position where it does not protrude beyond the mounting plate.

16. A substrate processing apparatus as described in claim 13, further comprising: (i) a control unit configured to receive information on the type of the inserted substrate container from a higher-level device and control the integrated gas supply system to supply gas from the purge port corresponding to the type of the substrate container placed on the substrate placement plate.

17. A device comprising: (a) a contact portion having an opening in the center and configured to be able to contact a purge port of a substrate container; (b) a bushing connected to a surface of the contact portion opposite to the surface contacting the purge port and having a cylindrical portion communicating with the opening; (c) a gas pipe gap-fitted to the inner periphery of the cylindrical portion with a first gap; (d) a port flange fixedly connected to the gas pipe and having a flange surface substantially perpendicular to the axis of the gas pipe; (e) an elastic member provided between the port flange and the bushing and biasing the bushing in a direction away from the port flange; (d1) a purge nozzle in the port flange having a hole concentric with the gas pipe and having a diameter corresponding to the outer diameter of the cylindrical portion, the outer periphery of the cylindrical portion gap-fitted to the hole with a second gap; (g) a plurality of mounting plates on which the substrate container is placed; and (h) an integrated gas supply system that supplies gas to at least one of the purge nozzles provided on each of the mounting plates. (i) a control unit configured to receive information on the type of the inserted substrate container from a higher-level device, and to control an integrated gas supply system to supply gas from the purge port corresponding to the type of the substrate container placed on the placement plate, the method comprising: placing the substrate container on the placement plate; and purging the substrate container via the purge nozzle.

18. A device comprising: (a) a contact portion having an opening in the center and configured to be able to contact a purge port of a substrate container; (b) a bushing connected to a surface of the contact portion opposite to the surface contacting the purge port and having a cylindrical portion communicating with the opening; (c) a gas pipe gap-fitted to the inner periphery of the cylindrical portion with a first gap; (d) a port flange fixedly connected to the gas pipe and having a flange surface substantially perpendicular to the axis of the gas pipe; (e) an elastic member provided between the port flange and the bushing and biasing the bushing in a direction away from the port flange; (d1) a purge nozzle in the port flange having a hole concentric with the gas pipe and having a diameter corresponding to the outer diameter of the cylindrical portion, the outer periphery of the cylindrical portion gap-fitted to the hole with a second gap; (g) a plurality of mounting plates on which the substrate container is placed; and (h) an integrated gas supply system that supplies gas to at least one of the purge nozzles provided on each of the mounting plates. (i) a control unit configured to receive information on the type of the inserted substrate container from a higher-level device, and to control an integrated gas supply system to supply gas from the purge port corresponding to the type of the substrate container placed on the placement plate; and a step of placing the substrate container on the placement plate of a substrate processing apparatus comprising the substrate processing apparatus and the purge port; and a step of purging the substrate container via the purge nozzle.

19. A device comprising: (a) a contact portion having an opening in the center and configured to be able to contact a purge port of a substrate container; (b) a bushing connected to a surface of the contact portion opposite to the surface contacting the purge port and having a cylindrical portion communicating with the opening; (c) a gas pipe gap-fitted to the inner periphery of the cylindrical portion with a first gap; (d) a port flange fixedly connected to the gas pipe and having a flange surface substantially perpendicular to the axis of the gas pipe; (e) an elastic member provided between the port flange and the bushing and biasing the bushing in a direction away from the port flange; (d1) a purge nozzle, the port flange having a hole concentric with the gas pipe and having a diameter corresponding to the outer diameter of the cylindrical portion, the outer periphery of the cylindrical portion gap-fitted to the hole with a second gap; (g) a plurality of mounting plates on which the substrate container is placed; and (h) an integrated gas supply system that supplies gas to at least one of the purge nozzles provided for each mounting plate. (i) a control unit configured to receive information on the type of the inserted substrate container from a higher-level device, and control an integrated gas supply system to supply gas from the purge port corresponding to the type of the substrate container placed on the placement plate; and a program for causing a substrate processing apparatus to execute, by a computer, the steps of placing the substrate container on the placement plate of a substrate processing apparatus comprising the substrate container and purging the substrate container via the purge nozzle.

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