Position adjustment system, position adjustment method, and position adjustment program

Abstract

A position mark (40) is provided to a second member (12) or a second holding unit (22). A light source (50) is attached to a first holding unit (21), and projects an optical pattern (55) onto the second member (12) or the second holding unit (22). An imaging unit (60) captures an image of an imaging region that includes the position mark (40) and the optical pattern (55) to obtain a region image indicative of said imaging region. A control unit (80) performs position adjustment processing for adjusting the positional relationship between a first member (11) and the second member (12) by controlling a drive mechanism (30) on the basis of the positional relationship between the position mark (40) and the optical pattern (55) included in the region image.

Description

Position adjustment system, position adjustment method, and position adjustment program

[0001] The technology disclosed herein relates to a position adjustment technology.

[0002] Japanese Patent Application Laid-Open No. 2003-144222 discloses a mounting device that mounts a semiconductor chip at a predetermined position on a substrate based on an alignment mark provided on one side of the semiconductor chip and an alignment mark provided on the substrate.

[0003] In this mounting device, a dual-view camera having an upward-facing camera and a downward-facing camera is positioned between a mounting head and a mounting stage that are spaced apart and facing each other in the vertical direction. The upward-facing camera captures an image of the semiconductor chip adsorbed to the mounting head, and the downward-facing camera captures an image of the substrate adsorbed to the mounting stage. Next, the alignment mark positions of the semiconductor chip are detected based on the image obtained by the upward-facing camera, and the alignment mark positions of the substrate are detected based on the image obtained by the downward-facing camera. Then, the positioning mechanism of the mounting stage is controlled so that the current value of the alignment position of the semiconductor chip relative to the alignment mark position of the substrate (current alignment mark position) becomes a pre-stored setting value (set alignment mark position).

[0004] Japanese Patent Application Laid-Open No. 2008-109057

[0005] In the device of Patent Document 1, the positional relationship between the semiconductor chip and the substrate is adjusted based on two types of images (an image of the semiconductor chip and an image of the substrate). The results of processing based on the two types of images contain errors (calibration errors) due to misalignment between the two types of images. This makes it difficult to accurately adjust the positional relationship between the semiconductor chip and the substrate. The semiconductor chip is an example of a first member, and the substrate is an example of a second member.

[0006] The technology disclosed herein relates to a position adjustment system that adjusts the positional relationship between a first member and a second member, and this position adjustment system includes a first holding unit that holds the first member, a second holding unit that holds the second member so that the second member and the first member held in the first holding unit face each other, a drive mechanism that moves at least one of the first holding unit and the second holding unit, a position mark provided on the second member or the second holding unit, a light source attached to the first holding unit that projects an optical pattern onto the second member or the second holding unit, an imaging unit that obtains an area image indicative of an imaging area by imaging the imaging area including the position mark and the optical pattern, and a control unit that performs position adjustment processing by controlling the drive mechanism to adjust the positional relationship between the first member and the second member based on the positional relationship between the position mark and the optical pattern included in the area image.

[0007] The technology disclosed herein also relates to a position adjustment method for adjusting the positional relationship between the first member and the second member using a position adjustment system including: a first holding unit that holds a first member; a second holding unit that holds the second member so that the second member and the first member held by the first holding unit face each other; a drive mechanism that moves at least one of the first holding unit and the second holding unit; a position mark provided on the second member or the second holding unit; a light source attached to the first holding unit that projects an optical pattern onto the second member or the second holding unit; and an imaging unit attached to the first holding unit that captures an imaging area including the position mark and the optical pattern to obtain an area image indicating the imaging area. This position adjustment method includes controlling the light source to project the optical pattern onto the second member or the second holding unit, controlling the imaging unit to capture an imaging area including the optical pattern and the position mark, and controlling the drive mechanism to adjust the positional relationship between the first member and the second member based on the positional relationship between the position mark and the optical pattern included in the area image obtained by the imaging unit.

[0008] The technology disclosed herein also relates to a position adjustment program that causes a computer to execute the position adjustment method.

[0009] According to the technique disclosed herein, the positional relationship between the first member and the second member can be adjusted with high precision.

[0010] 1 is a schematic diagram illustrating a configuration of a position adjustment system of embodiment 1. FIG. 1 is a schematic diagram illustrating a configuration of a first drive mechanism. FIG. 2 is a schematic diagram illustrating a configuration of a second drive mechanism. FIG. 3 is a block diagram illustrating an electrical connection relationship between a control unit and each unit of the position adjustment system. FIG. 4 is a schematic diagram illustrating an imaging region and a region image. FIG. 5 is a schematic diagram illustrating a relationship between the parallelism between a first member and a second member and the distortion of an optical pattern projected onto the second member. FIG. 6 is a schematic diagram illustrating a relationship between the parallelism between the first member and a second member and the distortion of a position mark in a region image. FIG. 7 is a schematic diagram illustrating a relationship between the distance between the first member and a second member and the size of an optical pattern in a region image. FIG. 8 is a flowchart illustrating processing by a control unit. FIG. 9 is a schematic diagram illustrating a configuration of a position adjustment system of embodiment 2. FIG. 10 is a schematic diagram illustrating a relationship between the distance between the first member and a second member and the positional relationship between the first optical pattern and the second optical pattern. FIG. 11 is a schematic diagram illustrating a relationship between the distance between the first member and a second member and the positional relationship between the first optical pattern and the second optical pattern in a second modification of embodiment 2. FIG. 10 is a schematic diagram illustrating the configuration of a main part of a position adjustment system according to another embodiment.

[0011] Hereinafter, the embodiments will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are designated by the same reference numerals and their description will not be repeated.

[0012] 1 illustrates an example of the configuration of a position adjustment system 10 according to embodiment 1. The position adjustment system 10 adjusts the positional relationship between a first member 11 and a second member 12. For example, the position adjustment system 10 is installed in a production line facility that produces semiconductor products using semiconductor chips.

[0013] In this example, the position adjustment system 10 adjusts the positional relationship between the first member 11 and the second member 12 in the XY plane defined by the mutually perpendicular X-axis direction (left-right direction in Figure 1) and Y-axis direction (direction perpendicular to the paper surface in Figure 1), the parallelism between the first member 11 and the second member 12 that face each other in the Z-axis direction (up-down direction in Figure 1) that is perpendicular to both the X-axis direction and the Y-axis direction, and the distance between the first member 11 and the second member 12 in the Z-axis direction.

[0014] In this example, the first member 11 is a semiconductor chip, and the second member 12 is a substrate. In the position adjustment system 10, the positional relationship between the first member 11 and the second member 12 is adjusted so that the "first member 11, which is a semiconductor chip" faces the "predetermined area of ​​the second member 12, which is a substrate" in the Z-axis direction, and the first member 11 is mounted (bonded) to the predetermined area of ​​the second member 12.

[0015] Specifically, solder bumps are formed on electrodes formed on the bonding surface of the semiconductor chip (the surface that is bonded to the substrate), and the semiconductor chip is mounted (flip-chip mounted) on a predetermined area of ​​the substrate so that the "electrodes formed on the bonding surface of the semiconductor chip" and the "electrodes formed in a predetermined area of ​​the chip mounting surface of the substrate (the surface on which the semiconductor chip is mounted)" are joined by the "solder bumps."

[0016] In this example, a reference plane for determining the attitude (tilt) of each of the first member 11 and the second member 12 is defined for each of the first member 11 and the second member 12. For example, if the first member 11 is a semiconductor chip and the second member 12 is a substrate, the bonding surface of the semiconductor chip serves as the reference plane for the first member 11, and the chip mounting surface of the substrate serves as the reference plane for the second member 12.

[0017] The position adjustment system 10 includes a first holding unit 21 , a second holding unit 22 , a drive mechanism 30 , a position mark 40 , a light source 50 , an imaging unit 60 , a storage unit 70 , and a control unit 80 .

[0018] [First Holding Unit] The first holding unit 21 holds the first member 11. For example, the first holding unit 21 is a head that holds the first member 11 by suction using an adsorption means such as air suction. In this example, the first holding unit 21 holds the semiconductor chip, which is the first member 11, so that the bonding surface of the semiconductor chip faces downward. The first holding unit 21 is movable in the X-axis direction and the Z-axis direction.

[0019] [Second Holding Unit] The second holding unit 22 holds the second member 12 so that the second member 12 and the first member 11 held by the first holding unit 21 face each other. For example, the second holding unit 22 is a stage that holds the second member 12 by suction using an adsorption means such as air suction. In this example, the second holding unit 22 holds the substrate, which is the second member 12, so that the chip mounting surface of the substrate faces upward. The second holding unit 22 also has a mounting surface on which the second member 12 is placed, which is movable in the X-axis direction and the Y-axis direction, and which is tiltable with respect to the Z-axis direction and rotatable about a rotation axis Q (see FIG. 3 ) perpendicular to the mounting surface.

[0020] [Drive Mechanism] The drive mechanism 30 drives at least one of the first holding unit 21 and the second holding unit 22. In this example, the drive mechanism 30 includes a first drive mechanism 31 that drives the first holding unit 21 and a second drive mechanism 35 that drives the second holding unit 22.

[0021] The first driving mechanism 31 moves the first holding part 21 in the X-axis direction and the Z-axis direction. As shown in Figures 1 and 2, the first driving mechanism 31 has an X-axis linear actuator 32 and a Z-axis linear actuator 33.

[0022] The X-axis linear actuator 32 is an actuator for moving the first holding part 21 in the X-axis direction, and has a fixed part 32a fixed to a support member (not shown) and a movable part 32b that is movable in the X-axis direction. For example, a linear actuator such as the X-axis linear actuator 32 is composed of a movable table, a ball screw that screws into the movable table, a motor that rotates the ball screw, and a drive circuit that drives the motor.

[0023] The Z-axis linear actuator 33 is an actuator for moving the first holding part 21 in the Z-axis direction, and has a fixed part 33a fixed to the movable part 32b of the X-axis linear actuator 32, and a movable part 33b that is movable in the Z-axis direction. The first holding part 21 is fixed to the movable part 33b of the Z-axis linear actuator 33.

[0024] The second drive mechanism 35 moves the second holding unit 22 in the X-axis direction and the Y-axis direction. The second drive mechanism 35 also tilts the second holding unit 22 with respect to the Z-axis direction. The second drive mechanism 35 also rotates the second holding unit 22 about the rotation axis Q. As shown in FIGS. 1 and 3 , the second drive mechanism 35 has an X-axis linear actuator 36, a Y-axis linear actuator 37, a tilt actuator 38, and a rotary actuator 39.

[0025] The X-axis linear actuator 36 is an actuator for moving the second holding unit 22 in the X-axis direction, and has a fixed unit 36a fixed to a support base (not shown) and a movable unit 36b that can move in the X-axis direction. The Y-axis linear actuator 37 is an actuator for moving the second holding unit 22 in the Y-axis direction, and has a fixed unit 37a fixed to the movable unit 36b of the X-axis linear actuator 36, and a movable unit 37b that can move in the Y-axis direction.

[0026] The tilt actuator 38 is an actuator for tilting the second holding part 22 in the Z-axis direction, and has a fixed part 38a fixed to the movable part 37b of the Y-axis linear actuator 37, and a plurality of expansion / contraction parts 38b, each of which is expandable and contractible in the Z-axis direction. For example, the tilt actuator 38 is configured with an expansion / contraction mechanism expandable and contractible in the Z-axis direction, a motor that drives the expansion / contraction mechanism, and a drive circuit that drives the motor.

[0027] The rotary actuator 39 is an actuator for rotating the second holding part 22 about a rotation axis Q that is perpendicular to the mounting surface of the second holding part 22, and has a fixed part 39a supported by multiple expansion and contraction parts 38b of the tilt actuator 38, and a movable part 39b that can rotate about the rotation axis Q. The second holding part 22 is fixed to the movable part 39b of the rotary actuator 39. For example, the rotary actuator 39 is composed of a movable table, a motor that rotates the movable table, and a drive circuit that drives the motor.

[0028] [Position Mark] The position mark 40 is provided on the second member 12 or the second holding portion 22 .

[0029] In this example, the position mark 40 is provided on the second member 12. Specifically, the position mark 40 is provided in the vicinity of a predetermined region (a region where the first member 11, which is a semiconductor chip, is to be mounted) on the periphery of the second member 12, which is a substrate. As shown in FIG. 5 , the position mark 40 is formed in a cross shape.

[0030] [Light Source] The light source 50 is attached to the first holding portion 21 and projects an optical pattern 55 onto the second member 12 or the second holding portion 22 .

[0031] In this example, the light source 50 projects an optical pattern 55 onto the second member 12. The light projection direction of the light source 50 is along the Z-axis direction. Furthermore, the light source 50 projects the optical pattern 55 onto the second member 12 so that the size of the optical pattern 55 projected onto the second member 12 is maintained constant, regardless of the distance between the light source 50 and the second member 12 in the Z-axis direction. Specifically, the light source 50 projects the optical pattern 55 onto the second member 12 by irradiating directional light (e.g., laser light) in the light projection direction.

[0032] Furthermore, the light source 50 projects the optical pattern 55 onto the second member 12 so that the shape of the optical pattern 55 has a desired shape. For example, the light source 50 has a diffractive optical element (DOE) and projects the optical pattern 55 of a desired shape onto the second member 12 by irradiating light in the projection direction through a diffraction grating element.

[0033] In this example, the optical pattern 55 is a single optical pattern. As shown in Fig. 5, the optical pattern 55 is formed in a cross shape. The optical pattern 55 is not a random pattern but a solid pattern (an optical pattern formed of light of a single wavelength and a single brightness).

[0034] [Imaging Unit] The imaging unit 60 obtains an area image indicating the imaging area by capturing an image of the imaging area including the position mark 40 and the optical pattern 55. As shown in Fig. 5 , the area image P60 is an image (specifically, image data indicating an image) of an imaging area R60, which is a partial area of ​​the second member 12. For example, the imaging unit 60 is configured by a camera having an image sensor such as a CCD image sensor or a CMOS image sensor.

[0035] In this example, the imaging direction of the imaging unit 60 is the Z-axis direction. The imaging unit 60 is supported by a support member (a member configured to prevent the vibrations of the first holding unit 21 and the second holding unit 22 from propagating; not shown) that is independent of the first holding unit 21 and the second holding unit 22. In this example, a reference plane for determining the attitude (tilt) of the imaging unit 60 is defined in the imaging unit 60. For example, the light receiving surface of the imaging unit 60 serves as the reference plane of the imaging unit 60.

[0036] [Storage Unit] The storage unit 70 stores various types of information and various types of data used in the position adjustment system 10. In this example, the storage unit 70 stores area images (image data) obtained by the imaging unit 60, control information used in various processes in the position adjustment system 10, result data indicating the results of various processes in the position adjustment system 10, and the like.

[0037] [Control Unit] The control unit 80 performs various processes. Specifically, as shown in Fig. 4, the control unit 80 is connected to each unit of the position adjustment system 10 so that signals can be transmitted. The control unit 80 controls each unit of the position adjustment system 10 based on the area image obtained by the imaging unit 60, various information stored in the storage unit 70, information provided from the outside, etc. The processes performed by the control unit 80 will be described in detail later.

[0038] For example, the control unit 80 includes a processor and a memory (storage medium) that stores a program for operating the processor. The processor executes the program to realize various functions of the control unit 80. In other words, the control unit 80 has various functional blocks that realize various functions. The processing by the control unit 80 is an example of a position adjustment method. The control unit 80 is an example of a computer. The above program is an example of a position adjustment program that causes a computer to execute the position adjustment method. [Positional Relationship Between Position Mark and Optical Pattern] Next, with reference to FIG. 5 , the relationship between the "positional relationship between the position mark 40 and the optical pattern 55" and the "positional relationship between the first member 11 and the second member 12" will be described. In the example of FIG. 5 , the position mark 40 and the light source 50 are arranged so that the position of the position mark 40 coincides with the position of the optical pattern 55 when predetermined regions of the first member 11 and the second member 12 (regions where the first member 11 is to be mounted) face each other in the Z-axis direction.

[0039] For the sake of simplicity, in the example of Figure 5, the parallelism between the first member 11 and the second member 12 is assumed to be a predetermined parallelism (parallelism that allows appropriate position adjustment in the XY plane).

[0040] 5 , the positional deviation of the optical pattern 55 from the position of the position mark 40 changes depending on the deviation of the current position of the first member 11 from the target position of the first member 11 (a position facing the predetermined region of the second member 12 in the Z-axis direction). In this example, the greater the deviation of the current position of the first member 11 from the target position of the first member 11, the greater the deviation of the position of the optical pattern 55 from the position mark 40. Furthermore, the direction of the deviation of the position of the optical pattern 55 from the position mark 40 changes depending on the direction of the deviation of the current position of the first member 11 from the target position of the first member 11.

[0041] 5 , the current position of the first member 11 is shifted in the upper right direction (positive direction in the X-axis direction and negative direction in the Y-axis direction) from the target position of the first member 11. Similarly, the position of the optical pattern 55 is shifted in the upper right direction from the position of the position mark 40.

[0042] Therefore, it is possible to derive the positional relationship between the first member 11 and the second member 12 (positional relationship in the XY plane) based on the positional relationship between the position mark 40 and the optical pattern 55. Furthermore, by adjusting the positional relationship between the position mark 40 and the optical pattern 55, it is possible to adjust the positional relationship between the first member 11 and the second member 12 (positional relationship in the XY plane).

[0043] [Distortion of Projected Optical Pattern] Next, with reference to FIG. 6, the relationship between "distortion of the optical pattern 55 projected onto the second member 12" and "parallelism between the first member 11 and the second member" will be described.

[0044] 6 , the distortion of the optical pattern 55 projected onto the second member 12 changes depending on the tilt of the second member 12 with respect to the first member 11. In this example, the greater the amount of tilt of the second member 12 with respect to the first member 11, the greater the amount of distortion of the optical pattern 55 projected onto the second member 12. Furthermore, the direction of the distortion of the optical pattern 55 projected onto the second member 12 changes depending on the direction of tilt of the second member 12 with respect to the first member 11.

[0045] In the example of "Tilt: Present (Parallelism: Low)" in Fig. 6 , the first member 11 is perpendicular to the Z-axis direction. The second member 12 gradually tilts in the positive direction of the Z-axis direction (upward in Fig. 6 ) as it approaches the positive direction of the X-axis direction (rightward in Fig. 6 ). The direction of distortion of the optical pattern 55 projected onto the second member 12 is the negative direction of the X-axis direction (leftward in Fig. 6 ).

[0046] Furthermore, the greater the inclination of the second member 12 relative to the first member 11, the lower the parallelism between the first member 11 and the second member 12. Therefore, it is possible to derive the inclination of the second member 12 relative to the first member 11 based on the distortion of the optical pattern 55 projected onto the second member 12, and it is also possible to derive the parallelism between the first member 11 and the second member 12. Furthermore, it is possible to adjust the parallelism between the first member 11 and the second member 12 by adjusting the distortion of the optical pattern 55 projected onto the second member 12.

[0047] [Distortion of Position Mark in Area Image] Next, with reference to FIG. 7, the relationship between "distortion of position mark 40 in area image" and "parallelism between first member 11 and second member" will be described.

[0048] 7 , the distortion of the position mark 40 in the area image obtained by the imaging unit 60 changes depending on the inclination of the second member 12 with respect to the imaging unit 60. In this example, the greater the amount of inclination of the second member 12 with respect to the imaging unit 60, the greater the amount of distortion of the position mark 40 in the area image obtained by the imaging unit 60. Furthermore, the direction of the distortion of the position mark 40 in the area image obtained by the imaging unit 60 changes depending on the direction of inclination of the second member 12 with respect to the imaging unit 60. Note that the same can be said about the distortion of the optical pattern 55 in the area image as about the distortion of the position mark 40 in the area image.

[0049] In the example of "Tilt: Present (Parallelism: Low)" in Fig. 7 , the first member 11 is perpendicular to the Z-axis direction. The second member 12 is gradually tilted in the positive direction of the Z-axis direction (upward in Fig. 7 ) as it approaches the positive direction of the X-axis direction (rightward in Fig. 7 ). The direction of distortion of the optical pattern 55 projected onto the second member 12 is the negative direction of the X-axis direction (leftward in Fig. 7 ).

[0050] Furthermore, the greater the inclination of the second member 12 relative to the imaging unit 60, the lower the parallelism between the imaging unit 60 and the second member 12. Therefore, it is possible to derive the inclination of the second member 12 relative to the imaging unit 60 based on the distortion of the position mark 40 in the area image, and it is also possible to derive the parallelism between the imaging unit 60 and the second member 12.

[0051] Furthermore, when the inclination of the first member 11 relative to the imaging unit 60 is a known inclination (predetermined value) and the parallelism between the imaging unit 60 and the first member 11 is a known parallelism (predetermined value), it is possible to derive the parallelism between the first member 11 and the second member 12 based on the "parallelism between the imaging unit 60 and the first member 11," which is a known predetermined value, and the "parallelism between the imaging unit 60 and the second member 12," which is derived based on the distortion of the position mark 40 in the area image.

[0052] As described above, it is possible to derive the parallelism between the first member 11 and the second member 12 based on the distortion of the position mark 40 in the area image. Furthermore, it is possible to adjust the parallelism between the first member 11 and the second member 12 by adjusting the distortion of the position mark 40 in the area image. Similarly, it is possible to derive the parallelism between the first member 11 and the second member 12 based on the distortion of the optical pattern 55 in the area image. Furthermore, it is possible to adjust the parallelism between the first member 11 and the second member 12 by adjusting the distortion of the optical pattern 55 in the area image.

[0053] [Size of Optical Pattern in Area Image] Next, the relationship between the "size of the optical pattern 55 in the area image (or the size of the position mark 40)" and the "distance in the Z-axis direction between the first member 11 and the second member 12" will be described with reference to Fig. 8. Hereinafter, the distance in the Z-axis direction between the first member 11 and the second member 12 will be simply referred to as the "distance between the first member 11 and the second member 12."

[0054] 8, the size of the position mark 40 in the area image changes depending on the distance (distance in the Z-axis direction) between the imaging unit 60 (e.g., the light receiving surface of the imaging unit 60) and the second member 12. In this example, the size of the position mark 40 in the area image decreases as the distance between the imaging unit 60 and the second member 12 increases. Note that the same can be said about the size of the optical pattern 55 in the area image as about the size of the position mark 40 in the area image.

[0055] Furthermore, when the distance between the imaging unit 60 and the first member 11 is a known distance (predetermined value), it is possible to derive the distance between the first member 11 and the second member 12 based on the known predetermined value "the distance between the imaging unit 60 and the first member 11" and the "distance between the imaging unit 60 and the second member 12" derived based on the size of the position mark 40 in the area image.

[0056] As described above, it is possible to derive the distance between the first member 11 and the second member 12 based on the size of the position mark 40 in the area image. Furthermore, it is possible to adjust the distance between the first member 11 and the second member 12 by adjusting the size of the position mark 40 in the area image. Similarly, it is possible to derive the distance between the first member 11 and the second member 12 based on the size of the optical pattern 55 in the area image. Furthermore, it is possible to adjust the distance between the first member 11 and the second member 12 by adjusting the size of the position mark 40 in the area image.

[0057] [Processing by Control Unit] Next, a description will be given of processing by the control unit 80. In this example, the control unit 80 performs an adjustment preparation process, a parallelism adjustment process, a position adjustment process, a distance adjustment process, and a mounting process.

[0058] <Adjustment Preparation Process> In the adjustment preparation process, the control unit 80 controls the drive mechanism 30 to adjust the position and attitude of each of the first holding unit 21 and the second holding unit 22 so that the first member 11 held by the first holding unit 21 and the second member 12 held by the second holding unit 22 face each other in the Z axis direction. The control unit 80 also controls the light source 50 to project the optical pattern 55, and controls the imaging unit 60 to image the imaging area.

[0059] <Parallelism Adjustment Process> In the parallelism adjustment process, the control unit 80 controls the drive mechanism 30 to adjust the parallelism between the first member 11 and the second member 12 based on at least one of the distortion of the position mark 40 and the distortion of the optical pattern 55 contained in the area image.

[0060] The parallelism adjustment process is an example of a process related to the parallelism between the first member 11 and the second member 12. In this example, in the parallelism adjustment process, a parallelism derivation process is performed to derive the parallelism between the first member 11 and the second member 12 based on at least one of the distortion of the position mark 40 included in the area image and the distortion of the optical pattern 55. The parallelism derivation process is an example of a process related to the parallelism between the first member 11 and the second member 12.

[0061] <Position Adjustment Process> In the position adjustment process, the control unit 80 controls the drive mechanism 30 to adjust the positional relationship between the first member 11 and the second member 12 based on the positional relationship between the position mark 40 and the optical pattern 55 included in the area image.

[0062] The position adjustment process is an example of a process related to the positional relationship between the first member 11 and the second member 12. In this example, in the position adjustment process, a positional relationship derivation process is performed to derive the positional relationship between the first member 11 and the second member 12 based on the positional relationship between the position mark 40 included in the area image and the optical pattern 55. The positional relationship derivation process is an example of a process related to the positional relationship between the first member 11 and the second member 12.

[0063] <Distance adjustment process> In the distance adjustment process, the control unit 80 controls the drive mechanism 30 to adjust the distance (distance in the Z-axis direction) between the first member 11 and the second member 12 based on at least one of the size of the position mark 40 included in the area image and the size of the optical pattern 55.

[0064] The distance adjustment process is an example of a process related to the distance between the first member 11 and the second member 12. In this example, in the distance adjustment process, a distance derivation process is performed to derive the distance between the first member 11 and the second member 12 based on at least one of the size of the position mark 40 included in the area image and the size of the optical pattern 55. The distance derivation process is an example of a process related to the distance between the first member 11 and the second member 12.

[0065] <Mounting process> In the mounting process, the control unit 80 controls the drive mechanism 30 so that predetermined areas of the first member 11 and the second member 12, which face each other in the Z-axis direction, come into contact with each other, and the first member 11 is mounted in the predetermined area of ​​the second member 12.

[0066] <Processing Cycle> The control unit 80 performs each of the parallelism adjustment control, the position adjustment process, and the distance adjustment control in a cycle that is equal to or shorter than the vibration cycle of the first holding unit 21 or the vibration cycle of the second holding unit 22 (in this example, the vibration cycle of the first holding unit 21). For example, the control unit 80 performs each of the parallelism adjustment control, the distance adjustment control, and the position adjustment process in a cycle of 10 ms or less.

[0067] [Processing Flow by Control Unit] The processing flow by the control unit 80 will be described in detail with reference to Fig. 9. For example, when a command to start processing is input from outside to the control unit 80, the control unit 80 performs the following processing. Note that step S11 corresponds to an adjustment preparation process, steps S21 to S23 correspond to a parallelism adjustment process, steps S31 to S33 correspond to a position adjustment process, and steps S41 to S43 correspond to a distance adjustment process.

[0068] <Step S11> The control unit 80 performs an adjustment preparation process. Specifically, the control unit 80 performs the following process.

[0069] First, the control unit 80 controls the drive mechanism 30 so that the first holding unit 21 is positioned at a supply position (not shown) where the first member 11 is supplied. Next, the control unit 80 controls the first holding unit 21 so that the first member 11 is held at the supply position.

[0070] Furthermore, the control unit 80 controls the second holding unit 22 so as to hold the second member 12 that has been transported to the second holding unit 22 by a transport mechanism (not shown). Then, the control unit 80 controls the drive mechanism 30 so that the position and posture of the second holding unit 22 are in the initial state (predetermined initial position and initial posture).

[0071] Next, the control unit 80 controls the imaging unit 60 to capture an image of the imaging area (a part of the second member 12 including the position mark 40). The control unit 80 also controls the light source 50 to project light from the optical pattern 55 (irradiate light in the projection direction).

[0072] Next, the control unit 80 performs processing (optical pattern recognition processing) on ​​the area image obtained by the imaging unit 60 to recognize the optical pattern 55 from within the area image. The control unit 80 then determines whether the optical pattern 55 is included in the area image obtained by the imaging unit 60. If the optical pattern 55 is not included in the area image, the control unit 80 controls the drive mechanism 30 so that the position of the first holding unit 21 is set to the initial state (a predetermined initial position). As a result, the first holding unit 21 moves from the supply position toward the initial position. When the first holding unit 21 reaches the initial position, the optical pattern 55 is included in the area image. When the optical pattern 55 is included in the area image obtained by the imaging unit 60, the processing of step S21 is performed.

[0073] <Step S21> The control unit 80 controls the imaging unit 60 to capture an image of an imaging area including the position mark 40 and the optical pattern 55. As a result, an area image showing the imaging area including the position mark 40 and the optical pattern 55 is obtained.

[0074] <Step S22> Next, the control unit 80 performs a parallelism derivation process. In the parallelism derivation process, the control unit 80 performs a process for recognizing the position mark 40 from the area image obtained in step S21 (position mark recognition process) and a process for recognizing the optical pattern 55 from the area image (optical pattern recognition process). The control unit 80 then derives the parallelism between the first member 11 and the second member 12 based on at least one of the distortion of the position mark 40 recognized by the position mark recognition process and the distortion of the optical pattern 55 recognized by the optical pattern recognition process (in this example, the distortion of the optical pattern 55).

[0075] Next, the control unit 80 determines whether the parallelism between the first member 11 and the second member 12 falls within a predetermined parallelism range. In this example, the predetermined parallelism range is a range of parallelism with a predetermined parallelism (parallelism that allows position adjustment in the XY plane to be performed appropriately) as a reference value, and is a range of parallelism that is considered to allow position adjustment in the XY plane to be performed appropriately. If the parallelism between the first member 11 and the second member 12 does not fall within the predetermined parallelism range, the process of step S23 is performed; if not, the process of step S31 is performed.

[0076] <Step S23> If the parallelism between the first member 11 and the second member 12 is not within the predetermined distortion range, the control unit 80 derives the "correction direction and correction amount for the tilt of the second member 12 relative to the first member 11" necessary to bring the parallelism (current value) between the first member 11 and the second member 12 derived in step S22 closer to the predetermined parallelism (target value). The correction direction and correction amount indicate the "direction" and "amount" by which the tilt of the second member 12 relative to the first member 11 should be corrected. Then, the control unit 80 controls the drive mechanism 30 based on the derived correction direction and correction amount to adjust the parallelism between the first member 11 and the second member 12. Next, the processing of step S21 is performed.

[0077] <Step S31> In step S31, similarly to step S21, the imaging unit 60 is controlled to capture an image of the imaging area including the position mark 40 and the optical pattern 55.

[0078] <Step S32> Next, the control unit 80 performs a positional relationship derivation process. In the positional relationship derivation process, the control unit 80 performs a position mark recognition process and an optical pattern recognition process on the area image obtained in step S41. Then, the control unit 80 derives the positional relationship (amount of positional deviation and direction of positional deviation) between the first member 11 and the second member 12 based on the positional relationship (amount of positional deviation and direction of positional deviation) between the position mark 40 recognized by the position mark recognition process and the optical pattern 55 recognized by the optical pattern recognition process.

[0079] Next, the control unit 80 determines whether the positional relationship between the first member 11 and the second member 12 is a predetermined positional relationship. In this example, the predetermined positional relationship is a positional relationship in which the amount of misalignment between the first member 11 and the second member 12 is less than a predetermined amount of misalignment. The predetermined amount of misalignment is a positional relationship in which predetermined regions of the first member 11 and the second member 12 are considered to be facing each other in the Z-axis direction (for example, flip-chip mounting is possible). If the positional relationship between the first member 11 and the second member 12 is not the predetermined positional relationship, the process of step S33 is performed; if not, the process of step S41 is performed.

[0080] <Step S33> If the positional relationship between the first member 11 and the second member 12 is not a predetermined positional relationship, the control unit 80 derives a "correction direction and correction amount for the positional relationship between the first member 11 and the second member 12" necessary to bring the positional relationship between the first member 11 and the second member 12 (current value) derived in step S42 closer to the predetermined positional relationship (target value). This correction direction and correction amount indicate "in which direction" and "by what amount" the position of the second member 12 (or the position of the first member 11) should be corrected. Then, the control unit 80 controls the drive mechanism 30 based on the derived correction direction and correction amount to adjust the positional relationship between the first member 11 and the second member. Next, the process proceeds to step S31.

[0081] <Step S41> In step S41, similarly to step S21, the imaging unit 60 is controlled to capture an image of the imaging area including the position mark 40 and the optical pattern 55.

[0082] <Step S42> Next, the control unit 80 performs a distance derivation process. In the distance derivation process, the control unit 80 performs a position mark recognition process and an optical pattern recognition process on the area image obtained in step S31. The control unit 80 then derives the distance between the first member 11 and the second member 12 (the distance in the Z-axis direction) based on at least one of the size of the position mark 40 recognized by the position mark recognition process and the size of the optical pattern 55 recognized by the optical pattern recognition process (in this example, the size of the optical pattern 55).

[0083] Next, the control unit 80 determines whether the distance between the first member 11 and the second member 12 falls within a predetermined distance range. In this example, the predetermined distance range is a distance range based on a predetermined distance (a distance at which the mounting process can be performed appropriately) and is a distance range at which the mounting process can be performed appropriately. If the distance between the first member 11 and the second member 12 does not fall within the predetermined distance range, the process of step S33 is performed. If not, the process of step S41 is performed.

[0084] The predetermined distance and predetermined distance range may be determined taking into consideration the contact state between the first member 11 and the second member 12 during the mounting process. For example, if the first member 11 is a semiconductor chip and the second member 12 is a substrate, the degree of crushing of the "solder bumps" formed on the electrodes of the semiconductor chip, which is the first member 11, changes depending on the distance between the first member 11 and the second member 12. Therefore, the predetermined distance (the distance at which the mounting process can be performed appropriately) may be set to a distance at which poor contact, such as solder bump protrusion or insufficient contact, can be kept within an allowable range during the mounting process.

[0085] <Step S43> If the distance between the first member 11 and the second member 12 is not within the predetermined distance range, the control unit 80 derives a "correction direction and correction amount for the distance between the first member 11 and the second member 12" necessary to bring the distance between the first member 11 and the second member 12 (current value) derived in step S32 closer to the predetermined distance (target value). This correction direction and correction amount indicate "in which direction" and "by what amount" the position of the first member 11 (or the position of the second member 12) should be corrected. Then, the control unit 80 controls the drive mechanism 30 to adjust the distance between the first member 11 and the second member 12 based on the derived correction direction and correction amount. Next, the process proceeds to step S41.

[0086] <Step S51> Meanwhile, when the distance between the first member 11 and the second member 12 falls within a predetermined distance range, the control unit 80 performs a mounting process. In the mounting process, the control unit 80 controls the drive mechanism 30 to bring the first member 11 closer to the second member 12 so that the first member 11 and the second member 12 come into contact with each other in predetermined regions, and the first member 11 is mounted in the predetermined region of the second member 12. As a result, for example, "electrodes formed on the bonding surface of the semiconductor chip, which is the first member 11" and "electrodes formed in a predetermined region on the chip mounting surface of the substrate, which is the second member 12," are joined by "solder bumps." In this way, the first member 11 is mounted on the second member.

[0087] Effect of First Embodiment As described above, in the position adjustment system 10 of the first embodiment, the control unit 80 performs a position adjustment process that controls the drive mechanism 30 to adjust the positional relationship between the first member 11 and the second member 12 based on the positional relationship between the position mark 40 and the optical pattern 55 included in the area image.

[0088] According to the above configuration, the positional relationship between the first member 11 and the second member 12 can be adjusted based on a region image (common image) including the position mark 40 and the optical pattern 55, thereby eliminating errors (calibration errors caused by misalignment between the two types of images) that occur when adjusting the positional relationship between the semiconductor chip and the board based on two types of images (an image of the semiconductor chip and an image of the board) as in Patent Document 1. This makes it possible to adjust the positional relationship between the first member 11 and the second member 12 with higher precision than in the above case.

[0089] Furthermore, in the position adjustment system 10 of the first embodiment, the control unit 80 performs each of the parallelism adjustment process, the position adjustment process, and the distance adjustment process at a period equal to or shorter than the vibration period of the first holding unit 21 or the vibration period of the second holding unit 22. In other words, the period of the position adjustment process is equal to or shorter than the above-mentioned vibration period. The same applies to the period of the parallelism adjustment process and the period of the distance adjustment process.

[0090] According to the above configuration, the position adjustment process can be performed in accordance with the vibrations of the first holding unit 21 and the second holding unit 22, so that the position adjustment process can be performed without waiting for the vibrations of the first holding unit 21 and the second holding unit 22 to converge. This allows the position adjustment process to be started quickly. The same can be said for the parallelism adjustment process and the distance adjustment process.

[0091] Furthermore, in the position adjustment system 10 of embodiment 1, the control unit 80 performs processing related to the parallelism between the first member 11 and the second member 12 (specifically, parallelism adjustment processing, parallelism derivation processing, etc.) based on at least one of the distortion of the position mark 40 included in the area image and the distortion of the optical pattern 55.

[0092] According to the above configuration, it is possible to appropriately perform processing related to the parallelism between the first member 11 and the second member 12 based on at least one of the distortion of the position mark 40 and the distortion of the optical pattern 55 included in the area image.

[0093] Furthermore, in the position adjustment system 10 of embodiment 1, the control unit 80 performs processing (specifically, distance adjustment processing, distance derivation processing, etc.) regarding the distance between the first member 11 and the second member 12 in the opposing direction (Z-axis direction) of the first member 11 and the second member 12 based on at least one of the size of the position mark 40 included in the area image and the size of the optical pattern 55.

[0094] According to the above configuration, it is possible to appropriately process the distance between the first member 11 and the second member 12 in the opposing direction (Z-axis direction) of the first member 11 and the second member 12 based on at least one of the size of the position mark 40 included in the area image and the size of the optical pattern 55.

[0095] Furthermore, in the position adjustment system 10 of the first embodiment, it is possible to freely set the projection position of the optical pattern 55 and the projection direction of the light source 50. This improves the design freedom (flexibility) of the position adjustment system 10.

[0096] Furthermore, in the position adjustment system 10 of the first embodiment, it is possible to freely set the image capturing direction of the image capturing unit 60. This makes it possible to improve the degree of freedom (flexibility) in designing the position adjustment system 10.

[0097] Furthermore, when adjusting the positional relationship (positional relationship in the XY plane) between the first member 11 and the second member 12, if the parallelism between the first member 11 and the second member 12 is not ensured (the parallelism is not within a predetermined range of parallelism), it becomes difficult to adjust the positional relationship between the first member 11 and the second member 12 with high precision.

[0098] Furthermore, if the parallelism between the first member 11 and the second member 12 is not ensured when mounting the first member 11 to the second member 12, variations in pressure on the mounting surfaces (joint surfaces) of the first member 11 and the second member 12 may result in poor contact between the first member 11 and the second member 12. In such a case, it may be possible to provide a pressure sensor that detects the pressure acting on the mounting surfaces of the first member 11 and the second member 12. However, providing a pressure sensor increases costs.

[0099] On the other hand, in the position adjustment system 10 of embodiment 1, by performing the parallelism adjustment process, it is possible to ensure the parallelism between the first member 11 and the second member 12 in the position adjustment process, and therefore it is possible to accurately adjust the positional relationship between the first member 11 and the second member 12. Furthermore, by performing the parallelism adjustment process, it is possible to ensure the parallelism between the first member 11 and the second member 12 in the mounting process, and therefore it is possible to avoid an increase in cost due to the addition of the pressure sensor as described above.

[0100] The substrate that becomes the second member 12 has height variation (dimensional variation in the Z-axis direction). Therefore, it is preferable to observe the distance between the first member 11 and the second member 12 (distance in the Z-axis direction). For example, in order to observe the distance between the first member 11 and the second member 12 and the parallelism between the first member 11 and the second member 12, it is conceivable to provide multiple sensors in each of the first holding unit 21 and the second holding unit 22 so that all of the "position in the X-axis direction," "position in the Y-axis direction," and "position in the Z-axis direction" can be observed. However, providing multiple sensors in the first holding unit 21 increases the weight of the first holding unit 21, resulting in problems such as increased costs for the first drive mechanism 31 (such as a motor) that drives the first holding unit 21, a decrease in the movement speed of the first holding unit 21, and increased power consumption.

[0101] On the other hand, in the position adjustment system 10 of the first embodiment, it is not necessary to provide a large number of sensors as described above, and therefore the above-mentioned problems can be avoided.

[0102] 10 illustrates an example of the configuration of a position adjustment system 10 according to a second embodiment. The position adjustment system 10 according to the second embodiment differs from the position adjustment system 10 according to the first embodiment in the configuration and processing related to the light source 50. The other configurations and processing of the position adjustment system 10 according to the second embodiment are the same as those of the position adjustment system 10 according to the first embodiment.

[0103] In the second embodiment, the optical pattern 55 includes a first optical pattern 56 and a second optical pattern 57. The light source 50 includes a first light source 51 and a second light source 52. The first light source 51 projects the first optical pattern 56 onto the second member 12 or the second holding unit 22. The second light source 52 projects the second optical pattern 57 onto the second member 12 or the second holding unit 22. The light projection direction of the second light source 52 is inclined with respect to the light projection direction of the first light source 51.

[0104] [Positional Relationship Between First Optical Pattern and Second Optical Pattern] Next, with reference to Fig. 11 , the relationship between the "positional relationship between the first optical pattern 56 and the second optical pattern 57" and the "distance between the first member 11 and the second member 12 (distance in the Z-axis direction)" will be described. Note that in the example of Fig. 11 , for the sake of simplicity, the position of the light-projection surface of the first light source 51 (position in the Z-axis direction) and the position of the light-projection surface of the second light source 52 are the same, and the positions of these light-projection surfaces are referred to as "the position of the reference plane of the first member 11 in the Z-axis direction." Furthermore, the shape of each of the first optical pattern 56 and the second optical pattern 57 is referred to as "circular."

[0105] As shown in Figure 11, the light projection direction of the first light source 51 and the light projection direction of the second light source 52 are different from each other, so when the distance between the first member 11 (the first member 11 held by the first holding portion 21 to which the first light source 51 and the second light source 52 are attached) and the second member 12 changes, the positional relationship between the first optical pattern 56 and the second optical pattern 57 projected onto the second member 12 changes.

[0106] 11 , the light projection direction of the first light source 51 is "a direction along the Z-axis direction," and the light projection direction of the second light source 52 is "a direction along a direction inclined toward the X-axis direction with respect to the Z-axis direction." As the distance between the first member 11 and the second member 12 increases in the order of "first distance D1," "second distance D2," and "third distance," the second optical pattern 57 moves toward the negative side in the X-axis direction (the left side in FIG. 11 ) in the imaging area captured by the imaging unit 60. Note that the position of the first optical pattern 56 is constant.

[0107] Specifically, when the distance between the first member 11 and the second member 12 is a "first distance D1," the second optical pattern 57 is located on the negative side in the X-axis direction (the left side in FIG. 11 ) of the first optical pattern 56 in the imaging area captured by the imaging unit 60. When the distance between the first member 11 and the second member 12 is a "second distance D2" that is longer than the first distance D1, the second optical pattern 57 overlaps with the first optical pattern 56 in the imaging area captured by the imaging unit 60. When the distance between the first member 11 and the second member 12 is a "third distance D3" that is longer than the second distance D2, the second optical pattern 57 is located on the positive side in the X-axis direction (the right side in FIG. 11 ) of the first optical pattern 56 in the imaging area captured by the imaging unit 60.

[0108] Therefore, it is possible to derive the distance between the first member 11 and the second member 12 based on the positional relationship (amount of positional deviation and direction of positional deviation) between the first optical pattern 56 and the second optical pattern 57 projected onto the second member 12. Furthermore, it is possible to adjust the distance between the first member 11 and the second member 12 by adjusting the positional relationship between the first optical pattern 56 and the second optical pattern 57 projected onto the second member 12.

[0109] [Processing by Control Unit] The processing by the control unit 80 of the second embodiment differs from the processing by the control unit 80 of the first embodiment in the parallelism adjustment processing and distance adjustment processing. The other processing by the control unit 80 of the second embodiment is similar to the processing by the control unit 80 of the first embodiment.

[0110] <Parallelism Adjustment Process> In the parallelism adjustment process of the second embodiment, the control unit 80 controls the drive mechanism 30 to adjust the parallelism between the first member 11 and the second member 12 based on at least one of the distortion of the position mark 40 included in the area image, the distortion of the first optical pattern 56, and the distortion of the second optical pattern 57. The process related to the distortion of the first optical pattern 56 and the process related to the distortion of the second optical pattern 57 are each similar to the process related to the distortion of the optical pattern 55 of the first embodiment.

[0111] <Distance adjustment process> In the distance adjustment process of embodiment 2, the control unit 80 controls the drive mechanism 30 to adjust the distance (distance in the Z-axis direction) between the first member 11 and the second member 12 based on the positional relationship between the first optical pattern 56 and the second optical pattern 57 included in the area image.

[0112] In the distance adjustment process in the second embodiment, the control unit 80 performs a distance derivation process. In the distance projection process in the second embodiment, the control unit 80 derives the distance between the first member 11 and the second member 12 based on the positional relationship between the first optical pattern 56 and the second optical pattern 57 included in the area image. Subsequent processes in the distance adjustment process in the second embodiment (processes performed after the distance derivation process) are the same as the subsequent processes in the distance adjustment process in the first embodiment.

[0113] Effects of the Second Embodiment The position adjustment system 10 of the second embodiment can achieve the same effects as the position adjustment system 10 of the first embodiment. For example, the positional relationship between the first member 11 and the second member 12 can be adjusted with high precision.

[0114] Furthermore, in the position adjustment system 10 of the second embodiment, the optical pattern 55 includes a first optical pattern 56 and a second optical pattern 57. The light source 50 includes a first light source 51 that projects the first optical pattern 56 onto the second member 12 or the second holding unit 22, and a second light source 52 that projects the second optical pattern 57 onto the second member 12 or the second holding unit 22. The light projection direction of the second light source 52 is inclined with respect to the light projection direction of the first light source 51.

[0115] According to the above configuration, by using a plurality of optical patterns (first optical pattern 56 and second optical pattern 57), processing based on the optical patterns can be performed appropriately.

[0116] Furthermore, in the position adjustment system 10 of embodiment 2, the control unit 80 performs processing related to the parallelism between the first member 11 and the second member 12 (specifically, parallelism adjustment processing, parallelism derivation processing, etc.) based on at least one of the distortion of the position mark 40 included in the area image, the distortion of the first optical pattern 56, and the distortion of the second optical pattern 57.

[0117] According to the above configuration, processing regarding the parallelism between the first member 11 and the second member 12 can be appropriately performed based on at least one of the distortion of the position mark 40 included in the area image, the distortion of the first optical pattern 56, and the distortion of the second optical pattern 57.

[0118] Furthermore, in the position adjustment system 10 of embodiment 2, the control unit 80 performs processing (specifically, distance adjustment processing, distance derivation processing, etc.) regarding the distance between the first member 11 and the second member 12 in the opposing direction (Z-axis direction) of the first member 11 and the second member 12 based on the positional relationship between the first optical pattern 56 and the second optical pattern 57 included in the area image.

[0119] According to the above configuration, processing can be appropriately performed regarding the distance between the first member 11 and the second member 12 in the opposing direction of the first member 11 and the second member 12 based on the positional relationship between the first optical pattern 56 and the second optical pattern 57 contained in the area image.

[0120] (Variation of Second Embodiment) In the position adjustment system 10 of the second embodiment, the wavelength of the second optical pattern 57 may be different from the wavelength of the first optical pattern 56. For example, the wavelength of light emitted from the second light source 52 corresponding to the second optical pattern 57 may be different from the wavelength of light emitted from the first light source 51 corresponding to the first optical pattern 56. In this way, even when the first optical pattern 56 and the second optical pattern 57 overlap each other, it becomes easy to individually recognize (identify) the first optical pattern 56 and the second optical pattern 57.

[0121] Furthermore, in the position adjustment system 10 of the second embodiment, the shape of the second optical pattern 57 may be different from the shape of the first optical pattern 56. In this way, even if the first optical pattern 56 and the second optical pattern 57 overlap each other, it becomes easy to recognize (identify) the first optical pattern 56 and the second optical pattern 57 individually.

[0122] 12 , in the position adjustment system 10 of the second embodiment, the first optical pattern 56 and the second optical pattern projected onto the second member 12 (or the second holding unit 22) may not overlap each other, regardless of the distance in the Z axis direction between the first light source 51 and the second light source 52 and the second member 12 (or the second holding unit 22). In other words, the light projection direction of the second light source 52 does not have to intersect with the light projection direction of the first light source 51. In this way, it becomes easier to individually recognize (identify) the first optical pattern 56 and the second optical pattern 57 than when the first optical pattern 56 and the second optical pattern 57 overlap each other.

[0123] (Other Embodiments) In the above description, the following configurations may be adopted.

[0124] In the parallelism adjustment process, the control unit 80 may control the drive mechanism 30 to adjust the parallelism between the first member 11 and the second member 12 so that at least one of the amount of distortion of the position mark 40 and the amount of distortion of the optical pattern 55 included in the area image obtained by the imaging unit 60 falls within a predetermined distortion range. For example, the predetermined distortion range is a range of distortion amounts based on a predetermined distortion amount (the distortion amount when the parallelism between the first member 11 and the second member 12 is the predetermined parallelism), and is a range of distortion amounts that is considered to allow appropriate position adjustment in the XY plane.

[0125] In the distance adjustment process, the control unit 80 may control the drive mechanism 30 to adjust the distance (distance in the Z-axis direction) between the first member 11 and the second member 12 so that at least one of the size of the position mark 40 and the size of the optical pattern 55 included in the area image obtained by the imaging unit 60 falls within a predetermined size range. For example, the predetermined size range is a size range based on a predetermined size (the size when the distance between the first member 11 and the second member is a predetermined distance), and is a size range that is considered to allow appropriate position adjustment in the XY plane.

[0126] In the position adjustment process, the control unit 80 may control the drive mechanism 30 to adjust the positional relationship between the first member 11 and the second member 12 so that the positional relationship between the position mark 40 and the optical pattern 55 included in the area image obtained by the imaging unit 60 becomes a predetermined positional relationship. For example, the predetermined positional relationship is a positional relationship in which the amount of misalignment between the position mark 40 and the optical pattern 55 is less than a predetermined amount of misalignment. The predetermined amount of misalignment is a misalignment amount at which predetermined areas of the first member 11 and the second member 12 are considered to be facing each other in the Z-axis direction (for example, flip-chip mounting is possible).

[0127] The order in which the parallelism adjustment process, position adjustment process, and distance adjustment process are performed is not limited to the order in Fig. 9. For example, the position adjustment process may be performed before the parallelism adjustment process (or the distance adjustment process).

[0128] The shape of the position mark 40 may be other than a cross shape. For example, the shape of the position mark 40 may be a circle, an L-shape, or the like. The shape of the optical pattern 55 may be other than a cross shape. Furthermore, the shape of the optical pattern 55 may be the same as (or a corresponding shape to) the shape of the position mark 40, or may be a different shape from the shape of the position mark 40. The same applies to the first optical pattern 56 and the second optical pattern 57.

[0129] 13 , the position adjustment system 10 may be provided with a plurality of position marks 40. Furthermore, a plurality of optical patterns 55 corresponding to the plurality of position marks 40 may be projected onto the second member 12 or the second holding unit 22. For example, the position adjustment system 10 may be provided with a plurality of light sources 50 that project a plurality of optical patterns 55. The plurality of light sources 50 may be arranged on both sides of the first holding unit 21 (on both sides in the X-axis direction in the example of FIG. 13 ), or may be arranged together on one side of the first holding unit 21.

[0130] 13 , the position adjustment system 10 may be provided with a plurality of imaging units 60 that capture images of different imaging areas. Each of the plurality of imaging areas may include one position mark 40 (or a plurality of position marks 40) and one optical pattern 55 (or a plurality of optical patterns 55).

[0131] The imaging unit 60 may be configured to move in conjunction with the first holding unit 21. For example, the imaging unit 60 may be attached to the first holding unit 21. The drive mechanism 30 may be configured to move the imaging unit 60. As shown in FIG. 13 , the imaging direction of the imaging unit 60 may be a direction other than the Z-axis direction (for example, a direction inclined with respect to the Z-axis direction).

[0132] The control unit 80 may be configured with a single processor or multiple processors working together. Similarly, the storage unit 70 may be configured with a single memory or multiple memories.

[0133] Furthermore, the above-described embodiments and modifications may be combined as appropriate. The above-described embodiments and modifications are essentially preferred examples and are not intended to limit the scope of the technology disclosed herein, its applications, or its uses.

[0134] As described above, the technology disclosed herein is useful as a position adjustment control technology.

[0135] REFERENCE SIGNS LIST 10 Position adjustment system 11 First member 12 Second member 21 First holding section 22 Second holding section 30 Drive mechanism 31 First drive mechanism 32 X-axis linear actuator 33 Z-axis linear actuator 35 Second drive mechanism 36 X-axis linear actuator 37 Y-axis linear actuator 38 Tilt actuator 39 Rotary actuator 40 Position mark 50 Light source 51 First light source 52 Second light source 55 Optical pattern 56 First optical pattern 57 Second optical pattern 60 Imaging section 70 Storage section 80 Control section R60 Imaging area P60 Area image

Claims

1. A position adjustment system for adjusting the positional relationship between a first member and a second member, comprising: a first holding part that holds the first member; a second holding part that holds the second member so that the second member and the first member held in the first holding part face each other; a drive mechanism that moves at least one of the first holding part and the second holding part; a position mark provided on the second member or the second holding part; a light source attached to the first holding part and that projects an optical pattern onto the second member or the second holding part; an imaging part that obtains an area image indicative of an imaging area by imaging an imaging area including the position mark and the optical pattern; and a control part that performs position adjustment processing to adjust the positional relationship between the first member and the second member by controlling the drive mechanism based on the positional relationship between the position mark and the optical pattern included in the area image.

2. A position adjustment system according to claim 1, wherein said control section performs said position adjustment process at a period equal to or shorter than the vibration period of said first holding section and the vibration period of said second holding section.

3. A position adjustment system according to claim 1 or 2, wherein the control unit performs processing relating to the parallelism between the first member and the second member based on at least one of the distortion of the position mark and the distortion of the optical pattern contained in the area image.

4. A position adjustment system according to any one of claims 1 to 3, wherein the control unit processes the distance between the first member and the second member in the opposing direction of the first member and the second member based on at least one of the size of the position mark and the size of the optical pattern included in the area image.

5. A position adjustment system according to any one of claims 1 to 4, wherein the optical pattern includes a first optical pattern and a second optical pattern, the light source includes a first light source that projects the first optical pattern onto the second member or the second holding section, and a second light source that projects the second optical pattern onto the second member or the second holding section, and the projection direction of the second light source is inclined with respect to the projection direction of the first light source.

6. A position adjustment system according to claim 5, wherein the control unit processes the distance between the first member and the second member in the opposing direction of the first member and the second member based on the positional relationship between the first optical pattern and the second optical pattern contained in the area image.

7. A position adjustment system according to claim 5 or 6, wherein the control unit performs processing relating to the parallelism between the first member and the second member based on at least one of the distortion of the position mark contained in the area image, the distortion of the first optical pattern, and the distortion of the second optical pattern.

8. The position adjustment system according to any one of claims 5 to 7, wherein the wavelength of the second optical pattern is different from the wavelength of the first optical pattern.

9. The position adjustment system according to any one of claims 5 to 8, wherein the shape of the second optical pattern is different from the shape of the first optical pattern.

10. A position adjustment method for adjusting a positional relationship between a first member and a second member using a position adjustment system including a first holding part that holds a first member, a second holding part that holds a second member such that a second member and the first member held in the first holding part face each other, a drive mechanism that moves at least one of the first holding part and the second holding part, a position mark provided on the second member or the second holding part, a light source attached to the first holding part and that projects an optical pattern onto the second member or the second holding part, and an imaging part attached to the first holding part and that obtains an area image indicating the imaging area by imaging an imaging area including the position mark and the optical pattern, the position adjustment method comprising: controlling the light source to project the optical pattern onto the second member or the second holding part; controlling the imaging part to image an imaging area including the optical pattern and the position mark; and controlling the drive mechanism to adjust the positional relationship between the first member and the second member based on the positional relationship between the position mark and the optical pattern included in the area image obtained by the imaging part.

11. A position adjustment program that causes a computer to execute the position adjustment method according to claim 10.

Images