Heat dissipation member, method for manufacturing heat dissipation member, and electronic device including heat dissipation member

Abstract

According to various embodiments, an electronic device may comprise: a first structure; a second structure spaced apart from the first structure; and a heat dissipation member thermally connecting the first structure and the second structure. The heat dissipation member may comprise: carbon fibers at least partially aligned to have directionality; thermally conductive wires at least partially thermally connecting the carbon fibers; and a polymer film at least partially applied to the carbon fibers and the thermally conductive wires.

Description

Heat dissipation member, method for manufacturing heat dissipation member, and electronic device including heat dissipation member

[0001] Embodiments of the present disclosure relate to a heat dissipation member, a method of manufacturing a heat dissipation member, and an electronic device including a heat dissipation member.

[0002] Electronic devices may include a heat source (e.g., a heat generating element), and the heat generated from the heat source needs to be efficiently dissipated to the surroundings through a heat dissipation member. The heat dissipation member may require a flexible structure that can accommodate the operating modes of electronic devices that operate in various ways (e.g., foldable electronic devices, slideable electronic devices, and / or rollable electronic devices).

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] As the functional gap between manufacturers significantly narrows, electronic devices are becoming increasingly slimmer to meet consumer purchasing demands. These devices are also being improved to increase their rigidity, enhance their design, and differentiate their functional elements. These electronic devices are moving beyond their standard rectangular form factor and evolving into diverse shapes. For example, electronic devices may have a transformable structure that allows for portability while also enabling the use of large-screen displays. These transformable electronic devices may include foldable and / or rollable electronic devices, which have variable display areas.

[0005] A flexible electronic device may include a heat source (e.g., a processor), and the heat generated from the heat source can be rapidly dissipated to the surroundings through a heat dissipation member disposed within the electronic device, thereby reducing user discomfort and helping to improve the performance of the electronic device. Typically, such a heat dissipation member is disposed beneath the flexible display, and the heat collected by the heat dissipation member can be rapidly dissipated to the surroundings.

[0006] Carbon-based heat-dissipating materials (e.g., graphite sheets), generally known for their excellent thermal conductivity, lack elasticity and can break or tear when bent (or folded) in conjunction with a flexible display. Furthermore, even when bent, heat-dissipating materials can remain in a bent state, permanently deforming without any self-restoring force. Therefore, electronic devices may require space to accommodate these bent shapes, which can hinder the slimming of electronic devices.

[0007] Various embodiments of the present disclosure can provide a heat dissipating member configured to have elongation characteristics, a method for manufacturing the heat dissipating member, and an electronic device including the heat dissipating member.

[0008] Various embodiments may provide a heat dissipation member configured to have elastic restoring force that can flexibly respond to bending and / or folding operations of a flexible display, a method for manufacturing the heat dissipation member, and an electronic device including the heat dissipation member.

[0009] Various embodiments can provide a heat dissipation member configured to have excellent thermal conductivity, a method for manufacturing the heat dissipation member, and an electronic device including the heat dissipation member.

[0010] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be expanded in various ways without departing from the spirit and scope of this disclosure.

[0011] According to various embodiments, the heat dissipation member may include carbon fibers aligned at least partially directionally, thermally conductive wires configured to thermally connect at least some of the carbon fibers, and a polymer film at least partially coating the carbon fibers and the thermally conductive wires.

[0012] According to various embodiments, an electronic device comprises a heat dissipation member comprising carbon fibers aligned at least partially directionally, thermally conductive wires configured to thermally connect at least some of the carbon fibers, and a polymer film at least partially coated on the carbon fibers and the thermally conductive wires; a first structure; and a second structure spaced apart from the first structure, wherein the heat dissipation member is capable of thermally connecting the first structure and the second structure.

[0013] According to various embodiments, a method for manufacturing a heat dissipation member may include an operation of introducing a composite composition including carbon fibers and thermally conductive wires into an organic solvent and stirring the composite composition, an operation of introducing the stirred composite composition into ultrapure water and aligning the composite composition in a water phase, an operation of drying the composite composition in a water phase and then coating the dried composite composition in a water phase with an elastic polymer.

[0014] According to various embodiments, an electronic device may include a first structure, a second structure spaced apart from the first structure, and a heat dissipation member thermally connecting the first structure and the second structure. The heat dissipation member may include carbon fibers that are aligned at least partially directionally, thermally conductive wires that at least partially thermally connect the carbon fibers, and a polymer film that at least partially coats the carbon fibers and the thermally conductive wires.

[0015] According to various embodiments, the heat dissipation member may include carbon fibers aligned at least partially directionally, thermally conductive wires at least partially thermally connecting the carbon fibers, and a polymer film at least partially coating the carbon fibers and the thermally conductive wires.

[0016] According to various embodiments, a method for manufacturing a heat dissipation member may include an operation of adding a composite composition including carbon fiber, a thermally conductive wire, and an elastomer to an organic solvent and stirring the composite composition, an operation of adding a mixed solution including the stirred composite composition to ultrapure water and aligning the composite composition in a water phase, and an operation of drying the composite composition in a water phase and then coating an elastic polymer.

[0017] A heat dissipation member according to exemplary embodiments of the present disclosure has high thermal conductivity through a composite composition including carbon fiber, thermally conductive wire, and elastomer, and is configured as a heat-conductive network that is stretchable, so that the arrangement of the heat dissipation member must be considered and it can be flexibly applied to a part that requires deformation or bending without structural changes that hinder slimming of the electronic device.

[0018] In addition, various effects may be provided, either directly or indirectly, through this document.

[0019] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0020] In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0021] FIG. 1A is a front perspective view of an electronic device illustrating a folded state or unfolded state according to various embodiments of the present disclosure.

[0022] FIG. 1b is a plan view illustrating the front of an electronic device in an unfolded state according to various embodiments of the present disclosure.

[0023] FIG. 1C is a plan view illustrating the rear surface of an electronic device in an unfolded state according to various embodiments of the present disclosure.

[0024] FIG. 2A is a perspective view of an electronic device illustrating a folded state according to various embodiments of the present disclosure.

[0025] FIG. 2b is a perspective view of an electronic device illustrating an intermediate state according to various embodiments of the present disclosure.

[0026] FIG. 3 is an exploded perspective view of a flexible display according to various embodiments of the present disclosure.

[0027] FIG. 4 is a cross-sectional view of a portion of an electronic device taken along line 4-4 of FIG. 1A according to various embodiments of the present disclosure.

[0028] FIG. 5 is a process diagram illustrating a manufacturing sequence of a heat dissipation member according to various embodiments of the present disclosure.

[0029] FIG. 6A is an enlarged photograph of carbon fiber according to various embodiments of the present disclosure.

[0030] FIG. 6b is an enlarged photograph of a carbon nanotube according to various embodiments of the present disclosure.

[0031] FIG. 6c is an enlarged photograph of stirred carbon fibers and carbon nanotubes according to various embodiments of the present disclosure.

[0032] FIG. 6d is an enlarged photograph showing a carbon fiber-to-carbon fiber connection structure through carbon nanotubes according to various embodiments of the present disclosure.

[0033] FIG. 6e is a photograph showing a state in which a composite composition is aligned through a surfactant according to various embodiments of the present disclosure.

[0034] FIG. 6f is an enlarged photograph showing a carbon fiber-to-carbon fiber connection structure through silver nanowires according to various embodiments of the present disclosure.

[0035] FIG. 7A is a plan view of an electronic device in a slide-in state according to various embodiments of the present disclosure.

[0036] FIG. 7b is a cross-sectional view of an electronic device taken along line 7b-7b of FIG. 7a according to various embodiments of the present disclosure.

[0037] FIG. 7c is a plan view of an electronic device in a slide-out state according to various embodiments of the present disclosure.

[0038] FIG. 7d is a cross-sectional view of an electronic device taken along line 7d-7d of FIG. 7c according to various embodiments of the present disclosure.

[0039] FIG. 7e is a schematic diagram of a flexible display having a heat dissipation member arranged thereon according to various embodiments of the present disclosure.

[0040] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0041] FIG. 1A is a front perspective view of an electronic device in an unfolded state according to various embodiments of the present disclosure. FIG. 1B is a plan view illustrating the front of the electronic device in an unfolded state according to various embodiments of the present disclosure. FIG. 1C is a plan view illustrating the rear of the electronic device in an unfolded state according to various embodiments of the present disclosure.

[0042] FIG. 2A is a perspective view of an electronic device illustrating a folded state according to various embodiments of the present disclosure. FIG. 2B is a perspective view of an electronic device illustrating an intermediate state according to various embodiments of the present disclosure.

[0043] Referring to FIGS. 1A to 2B, an electronic device (100) (e.g., a foldable electronic device) may include a first housing (110) (e.g., a first housing portion or a first housing structure) and a second housing (120) (e.g., a second housing portion or a second housing structure) that are foldably coupled to each other based on a hinge (or hinge device) (e.g., a hinge device (HA) of FIG. 1B). In one embodiment, the first housing (110), the second housing (120), and the hinge device (HA) may include a foldable housing (e.g., a housing, a foldable housing structure, or a housing structure). In one embodiment, the hinge device (HA) may be arranged in the x-axis direction or the y-axis direction. In one embodiment, the electronic device (100) may include a first display (130) (e.g., a flexible display, a foldable display, or a main display) disposed in a region (e.g., a recess) formed by the first and second housings (110, 120). In one embodiment, the first housing (110) and the second housing (120) may be disposed on opposite sides with respect to a folding axis (F) and may have a shape that is substantially symmetrical with respect to the folding axis (F). In one embodiment, the angle or distance between the first housing (110) and the second housing (120) may vary depending on a state of the electronic device (100). For example, the angle or distance between the first housing (110) and the second housing (120) may vary depending on whether the electronic device is in an unfolded state (flat state), a folded state, or an intermediate state.

[0044] According to various embodiments, the first housing (110) may include a first surface (111) facing a first direction (e.g., front direction) (z-axis direction) and a second surface (112) facing a second direction (e.g., rear direction) (-z-axis direction) opposite to the first surface (111) in an unfolded state of the electronic device (100). In one embodiment, the second housing (120) may include a third surface (121) facing a first direction (z-axis direction) and a fourth surface (122) facing a second direction (-z-axis direction) in an unfolded state of the electronic device (100). In one embodiment, in an unfolded state of the electronic device (100), the first surface (111) of the first housing (110) and the third surface (121) of the second housing (120) may face substantially the same first direction (z-axis direction). In one embodiment, in the folded state of the electronic device (100), the first side (111) of the first housing (110) and the third side (121) of the second housing (120) may face each other. In one embodiment, in the unfolded state of the electronic device (100), the second side (112) of the first housing (110) and the fourth side (122) of the second housing (120) may face substantially the same second direction (-z-axis direction). In one embodiment, in the folded state of the electronic device (100), the second side (112) of the first housing and the fourth side (122) of the second housing (120) may face opposite directions. For example, in the folded state of the electronic device (100), the second side (112) may face the first direction (z-axis direction) and the fourth side (122) may face the second direction (-z-axis direction). In this case, the first display (130) may not be visible from the outside (in folding mode). In one embodiment, the electronic device (100) may be folded so that the second side (112) of the first housing (110) and the fourth side (122) of the second housing (120) face each other. In this case, the first display (130) may be arranged to be visible from the outside (out folding mode).

[0045] According to various embodiments, the first housing (110) (e.g., the first housing structure) may include a first side member (113) that at least partially forms an exterior of the electronic device (100), and a first rear cover (114) (e.g., the first rear cover) that is coupled to the first side member (113) and forms at least a portion of a second side (112) of the electronic device (100). In one embodiment, the first side member (113) may include a first side surface (113a), a second side surface (113b) extending from one end of the first side surface (113a), and a third side surface (113c) extending from the other end of the first side surface (113a). In one embodiment, the first side member (113) may be formed into a rectangular (e.g., square or rectangular) shape through the first side (113a), the second side (113b), and the third side (113c).

[0046] According to various embodiments, the second housing (120) (e.g., the second housing structure) may include a second side member (123) that at least partially forms an exterior of the electronic device (100), and a second rear cover (124) (e.g., the second rear cover) that is coupled to the second side member (123) and forms at least a portion of a fourth side (122) of the electronic device (100). In one embodiment, the second side member (123) may include a fourth side (123a), a fifth side (123b) extending from one end of the fourth side (123a), and a sixth side (123c) extending from the other end of the fourth side (123a). In one embodiment, the second side member (123) may be formed into a rectangular shape through the fourth side (123a), the fifth side (123b), and the sixth side (123c).

[0047] According to various embodiments, the first housing (110) and the second housing (120) are not limited to the shapes and combinations shown, and may be implemented by combinations and / or combinations of other shapes or parts. In one embodiment, the first side member (113) may be formed integrally with the first rear cover (114), and the second side member (123) may be formed integrally with the second rear cover (124).

[0048] According to various embodiments, in the unfolded state of the electronic device (100), the second side (113b) of the first side member (113) and the fifth side (123b) of the second side member (123) may be connected without a gap. In one embodiment, in the unfolded state of the electronic device (100), the third side (113c) of the first side member (113) and the sixth side (123c) of the second side member (123) may be connected without a gap. In one embodiment, in the unfolded state of the electronic device (100), the sum of the lengths of the second side (113b) and the fifth side (123b) may be configured to be longer than the lengths of the first side (113a) and / or the fourth side (123a). In one embodiment, in the unfolded state of the electronic device (100), the sum of the lengths of the third side (113c) and the sixth side (123c) may be configured to be longer than the lengths of the first side (113a) and / or the fourth side (123a).

[0049] Referring to FIGS. 2A and 2B , the first side member (113) and / or the second side member (123) may be formed of metal or may be formed of a polymer that is injected into the metal. In one embodiment, the first side member (113) and / or the second side member (123) may also include at least one conductive portion (116 and / or 126) that is electrically segmented via at least one segment (1161, 1162 and / or 1261, 1262) formed of polymer. In such a case, the at least one conductive portion (116 and / or 126) may be used as at least a portion of an antenna that operates in at least one designated band (e.g., a legacy band or a new radio (NR) band) by being electrically connected to a wireless communication circuit included in the electronic device (100).

[0050] According to various embodiments, the first rear cover (114) and / or the second rear cover (124) may be formed by, for example, at least one or a combination of at least two of coated or colored glass, ceramic, polymer, or metal (e.g., aluminum, stainless steel (STS), or magnesium).

[0051] According to various embodiments, the first display (130) may be arranged to extend from the first surface (111) of the first housing (110) across the hinge device (HA) to at least a portion of the third surface (121) of the second housing (120). In one embodiment, the first display (130) may include a first region (130a) substantially corresponding to the first surface (111), a second region (130b) substantially corresponding to the second surface (112), and a third region (130c) (e.g., a folding region or a bendable region) connecting the first region (130a) and the second region (130b). In one embodiment, the third region (130c) may be arranged at a position corresponding to the hinge device (HA) as a part of the first region (130a) and / or the second region (130b). In one embodiment, the electronic device (100) may include a hinge housing (141) (e.g., a hinge cover) that supports a hinge device (HA). In one embodiment, the hinge housing (141) may be arranged so that at least a portion thereof is visually exposed to the outside when the electronic device (100) is in a folded state, and is inserted into the internal space of the first housing (110) and the internal space of the second housing (120) when the electronic device (100) is in an unfolded state, thereby being invisible from the outside.

[0052] According to various embodiments, the electronic device (100) may include a second display (131) (e.g., a sub-display) arranged separately from the first display (130). In one embodiment, the second display (131) may be arranged so as to be at least partially visually exposed on the second surface (112) of the first housing (110). In one embodiment, when the electronic device (100) is in a folded state, the second display (131) may replace at least a portion of the display function of the first display (130) to display at least a portion of the status information of the electronic device (100). In one embodiment, the second display (131) may be arranged so as to be visible from the outside through at least a portion of the first rear cover (114). In one embodiment, the second display (131) may also be arranged on the fourth surface (122) of the second housing (120). In this case, the second display (131) may be arranged so as to be visible from the outside through at least a portion of the second rear cover (124).

[0053] According to various embodiments, the electronic device (100) may include at least one of an input device (103) (e.g., a microphone), an audio output device (101, 102), a sensor module (104), a camera device (105, 108), a key input device (106), or a connector port (107). In the illustrated embodiment, the input device (103) (e.g., a microphone), an audio output device (101, 102), a sensor module (104), a camera device (105, 108), a key input device (106), or a connector port (107) is illustrated as a hole or a circular element formed in the first housing (110) or the second housing (120), but this is an exemplary illustration for description and is not limited thereto. According to various embodiments, the input device (103) may include at least one microphone (103) disposed in the second housing (120). In one embodiment, the input device (103) may include a plurality of microphones (103) arranged to detect the direction of sound. In one embodiment, the plurality of microphones (103) may be arranged at appropriate locations in the first housing (110) and / or the second housing (120). In one embodiment, the audio output device (101, 102) may include at least one speaker (101, 102). In one embodiment, the at least one speaker (101, 102) may include a call receiver (101) arranged in the first housing (110) and a speaker (102) arranged in the second housing (120). In one embodiment, the input device (103), the audio output device (101, 102), and the connector port (107) are arranged in a space provided in the first housing (110) and / or the second housing (120) of the electronic device (100), and can be exposed to the external environment through at least one hole formed in the first housing (110) and / or the second housing (120). In one embodiment, at least one connector port (107) can be used to transmit and receive power and / or data with an external electronic device.In one embodiment, at least one connector port (e.g., an ear jack hole) may accommodate a connector (e.g., an ear jack) for transmitting and receiving audio signals with an external electronic device. In one embodiment, the holes formed in the first housing (110) and / or the second housing (120) may be used in common for the input device (103) and the audio output devices (101, 102). In one embodiment, the audio output devices (101, 102) may include a speaker (e.g., a piezo speaker) that is not exposed through the holes formed in the first housing (110) and / or the second housing (120).

[0054] According to various embodiments, the sensor module (104) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (100) or an external environmental state. In one embodiment, the sensor module (104) may detect an external environment through a first surface (111) of the first housing (110). In one embodiment, the electronic device (100) may further include at least one sensor module arranged to detect an external environment through a second surface (112) of the first housing (110). In one embodiment, the sensor module (104) (e.g., an illuminance sensor) may be arranged under the first display (130) to detect an external environment through the first display (130). In one embodiment, the sensor module (104) may include at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, an ambient light sensor, a proximity sensor, a biometric sensor, an ultrasonic sensor, or an ambient light sensor (104).

[0055] According to various embodiments, the camera devices (105, 108) may include a first camera device (105) (e.g., a front camera device) disposed on a first side (111) of the first housing (110) and a second camera device (108) disposed on a second side (112) of the first housing (110). In one embodiment, the electronic device (100) may further include a flash (109) disposed near the second camera device (108). In one embodiment, the camera devices (105, 108) may include at least one lens, an image sensor, and / or an image signal processor. In one embodiment, the camera device (105, 108) may be arranged such that two or more lenses (e.g., a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and two or more image sensors are positioned on one side (e.g., a first side (111), a second side (112), a third side (121), or a fourth side (122)) of the electronic device (100). In one embodiment, the camera device (105, 108) may also include lenses and / or image sensors for time of flight (TOF).

[0056] According to various embodiments, the key input device (106) (e.g., a key button) may be disposed on the third side (113c) of the first side member (113) of the first housing (110). In one embodiment, the key input device (106) may be disposed on at least one of the other side surfaces (113a, 113b) of the first housing (110) and / or the side surfaces (123a, 123b, 123c) of the second housing (120). In one embodiment, the electronic device (100) may not include some or all of the key input devices (106), and the key input devices (106) that are not included may be implemented in another form, such as a soft key, on the first display (130). In one embodiment, the key input device (106) may be implemented using a pressure sensor included in the first display (130).

[0057] According to various embodiments, some of the camera devices (105, 108) (e.g., the first camera device (105)) or the sensor module (104) may be arranged to be visually exposed through the first display (130). In one embodiment, the first camera device (105) or the sensor module (104) may be optically exposed to the outside through an opening (e.g., a through hole) at least partially formed in the first display (130) in the internal space of the electronic device (100). In one embodiment, at least a portion of the sensor module (104) may be arranged to not be visually exposed through the first display (130) in the internal space of the electronic device (100).

[0058] Referring to FIG. 2B, the electronic device (100) can operate to maintain at least one designated folding angle in an intermediate state via the hinge device (HA). For example, the electronic device (100) can control the first display (130) to display different contents in a display area corresponding to the first side (111) and a display area corresponding to the third side (121). In one embodiment, the electronic device (100) can operate in a substantially unfolded state (e.g., the unfolded state of FIG. 1A) and / or a substantially folded state (e.g., the folded state of FIG. 2A) based on a predetermined folding angle (e.g., the angle between the first housing (110) and the second housing (120) when the electronic device (100) is in the intermediate state) via the hinge device (HA). In one embodiment, the electronic device (100) can be operated to transition to an unfolded state (e.g., the unfolded state of FIG. 1a) when a pressure is applied in the unfolding direction (direction A) from a state unfolded at a constant folding angle through the hinge device (HA). In one embodiment, the electronic device (100) can be operated to transition to a folded state (e.g., the folded state of FIG. 2a) when a pressure is applied in the folding direction (direction B) from a state unfolded at a constant folding angle through the hinge device (HA). In one embodiment, the electronic device (100) can be operated to maintain an unfolded state (not shown) at various folding angles through the hinge device (HA) (free stop function).

[0059] FIG. 3 is an exploded perspective view of a flexible display according to various embodiments of the present disclosure.

[0060] A flexible display according to exemplary embodiments of the present disclosure (e.g., the first display (130) of FIG. 1A) may include an unbreakable (UB) type OLED display (e.g., a curved display). However, the flexible display is not limited thereto, and the flexible display (130) may also include a flat type display of an on-cell touch AMOLED (active matrix organic light-emitting diode) (OCTA) type or other suitable flexible display types.

[0061] Referring to FIG. 3, the flexible display (130) (e.g., the first display (130) of FIG. 1A) may include a window layer (410), a polarizing layer (POL (polarizer)) (420) (e.g., a polarizing film) sequentially disposed on the back surface (e.g., in the -z-axis direction) of the window layer (410), a display panel (430), a heat dissipation member (440), a support plate (450), and a reinforcing plate (470). In one embodiment, the display panel (430) may include a polymer layer. In one embodiment, the reinforcing plate (470) may include a first reinforcing plate (471) disposed at a position corresponding to at least a portion of the first housing (110) and a second reinforcing plate (472) disposed at a position corresponding to at least a portion of the second housing (120). In one embodiment, the flexible display (130) may include a digitizer (460) disposed between the support plate (450) and the reinforcing plate (470). In some embodiments, the digitizer (460) may be separately disposed to correspond to the first housing (110) and the second housing (120), respectively. In some embodiments, the digitizer (460) may be omitted. In one embodiment, at least one of the polarizing layer (420), the display panel (430), the support plate (450), the digitizer (460), or the first reinforcing plate (471) may be disposed therebelow, and may include a perforated opening (4201, 4301, 4501, 4601, 4701) for at least one optical module (e.g., a camera device or a sensor module) disposed to detect an external environment through the flexible display (130).

[0062] According to various embodiments, the window layer (410) may include a glass layer. In one embodiment, the window layer (410) may include ultra thin glass (UTG) (or foldable thin glass (FTG)). In some embodiments, the window layer (410) may include a polymer. In this case, the window layer (410) may include polyethylene terephthalate (PET) or polyimide (PI). In some embodiments, the window layer (410) may be arranged as a plurality of layers to include a glass layer and a polymer. In some embodiments, the flexible display (130) may further include a coating layer formed on at least a portion of the top, back, or side of the glass layer formed as part of the window layer (410) or a polymer (e.g., a protective film layer) arranged on top of the glass layer. In such cases, the coating layer may include a hard coating layer, an anti-reflection (AR) / low reflection (LR) coating layer, a shatterproof (SP) coating layer, and / or an anti-fingerprint (AF) coating layer. In some embodiments, the coating layer may be formed on at least one of a portion between the polymer and the glass layer, a side surface of the polymer, and a back surface or side surface of the glass layer.

[0063] According to various embodiments, the window layer (410), the polarizing layer (420), the display panel (430), the heat dissipation member (440), and the support plate (450) may be arranged to cross at least a portion of a first surface (e.g., the first surface (211) of FIG. 1A) of the first housing (e.g., the first housing (110) of FIG. 1A) and a third surface (e.g., the third surface (221) of FIG. 1A) of the second housing (e.g., the second housing (220) of FIG. 1A). In one embodiment, the reinforcing plate (470) provides rigidity for the flexible display (130) and may be used as a ground to prevent or reduce malfunction of the flexible display (130). In one embodiment, the window layer (410), the polarizing layer (420), the display panel (430), the heat dissipation member (440), the support plate (450), and the reinforcing plate (470) may be attached to each other via an adhesive member (or adhesive) (P). For example, the adhesive member may include at least one of an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), a heat-reactive adhesive, a general adhesive, or a double-sided tape.

[0064] According to various embodiments, the display panel (430) may include a plurality of pixels and a wiring structure (e.g., an electrode pattern). In one embodiment, the display panel (430) may further include a polymer layer disposed thereunder. In one embodiment, the polymer layer may be disposed under the display panel (430) to provide a dark background for ensuring the visibility of the display panel (430) and may be formed as a buffer material for buffering. In some embodiments, the polymer layer may be removed or disposed under the support plate (450) to ensure waterproofing of the flexible display (130). In some embodiments, the polymer layer may be omitted when the support plate (450) and / or the heat dissipation member (440) are formed of an opaque material. In one embodiment, the polarizing layer (420) may selectively transmit light generated from a light source of the display panel (430) and vibrating in a certain direction. In one embodiment, the display panel (430) and the polarizing layer (420) may be formed integrally. In one embodiment, the flexible display (130) may include a touch panel (not shown).

[0065] According to various embodiments, the support plate (450) can provide bending characteristics to the flexible display (130). For example, the support plate (450) can be formed of a non-metallic thin-plate material, such as fiber reinforced plastics (FRP) (e.g., carbon fiber reinforced plastics (CFRP) or glass fiber reinforced plastics (GFRP)) having rigid characteristics for supporting the display panel (430). In one embodiment, the support plate (450) can include a first planar portion (451) corresponding to a first housing (e.g., the first housing (110) of FIG. 1A), a second planar portion (452) corresponding to a second housing (e.g., the second housing (220) of FIG. 1A), and a flexible portion (453) (flexible portion or bending portion) connecting the first planar portion (451) and the second planar portion (452). In one embodiment, the flexible portion (453) may be formed to have a pattern (e.g., a plurality of openings and / or recesses) for improving flexibility. In some embodiments, the support plate (450) may be formed of a metal material such as SUS (steel use stainless) (e.g., STS (stainless steel)), Cu, Al, or a metal CLAD (e.g., a laminated member in which SUS and Al are alternately arranged). In one embodiment, the support plate (450) may help reinforce the rigidity of an electronic device (e.g., the electronic device (100) of FIG. 1A), shield ambient noise, and may be used to disperse heat emitted from surrounding heat-emitting components.

[0066] According to various embodiments, the heat dissipation member (440) may be disposed between two structures of the electronic device (e.g., the display panel (430) and the support plate (450)), at least partially overlapping a folding area of ​​the flexible display (130) (e.g., the third area (130c) of FIG. 1A), and may be bendably disposed together with the flexible display (130). In some embodiments, the heat dissipation member (440) may have high thermal conductivity through a composite composition including carbon fibers, thermally conductive wires, and an elastomer, and may be configured as a stretchable thermally conductive network, so that the placement of the heat dissipation member may be considered and it may be flexibly applied to an area requiring deformation or bending without structural changes that impede slimming of the electronic device. In one embodiment, the heat dissipation member (440) may be advantageous in manufacturing because the heat transfer direction is determined through a water-phase alignment method after stirring carbon fibers, thermally conductive wires, and elastomers through an organic solvent including dimethylformamide (N,N-dimethylmethanamide, DMF) and decamethylcyclopentasiloxane (D5) having a specified mixing ratio. In one embodiment, the heat dissipation member (440) is formed to have elastic restoring force through a polymer film, so that it can be adaptively applied to a corresponding part of an electronic device that is capable of structural change (e.g., bending or folding) without breakage or permanent deformation.

[0067] FIG. 4 is a cross-sectional view of a portion of an electronic device taken along line 4-4 of FIG. 1A according to various embodiments of the present disclosure.

[0068] An electronic device (100) includes a heat dissipation member (440), a first structure (e.g., a first housing (110)), and a second structure (e.g., a first housing (120)) spaced apart from the first structure. The heat dissipation member (440) is configured to thermally connect the first structure and the second structure. That is, the heat dissipation member can be connected to the first structure and the second structure so that heat can move between the first structure and the second structure through the heat dissipation member.

[0069] The heat dissipation member (440) comprises carbon fibers aligned at least partially oriented, thermally conductive wires configured to thermally interconnect at least some of the carbon fibers (i.e., the thermally conductive wires interconnect the carbon fibers such that heat can be transferred between the connected carbon fibers via the thermally conductive wires), and a polymer film configured to at least partially coat the carbon fibers and the thermally conductive wires.

[0070] Referring to FIG. 4, the electronic device (100) may include a first housing (110) including a first side member (113), a second housing (120) including a second side member (123), and a flexible display (130) arranged to be supported by the first housing (110) and the second housing (120). In one embodiment, the flexible display (130) may be arranged to be supported by a first hinge plate (e.g., a first wing plate) at least partially coupled to the first housing and a second hinge plate (e.g., a second wing plate) coupled to the second housing. In one embodiment, the first hinge plate (311) and the second hinge plate (312) may be arranged to support a portion of the back surface of the flexible display (130) so that the folding area (130c) of the flexible display (130) has a standardized bending shape (e.g., a water drop shape) when the electronic device (100) is in a folded state. In one embodiment, when the electronic device (100) is in an unfolded state, the first housing (110), the first hinge plate (311), the second housing (120), and the second hinge plate (312) may form substantially the same plane to support the flexible display (130).

[0071] According to various embodiments, the flexible display (130) may include a first region (130a) (e.g., a first planar region) corresponding to at least a portion of the first housing (110), a second planar region (130b) (e.g., a second planar region) corresponding to at least a portion of the second housing (120), and a third region (130c) (e.g., a folding region) connecting the first region (130a) and the second region (130b) and being bendably arranged with respect to a folding axis (F). In one embodiment, the flexible display (130) may include a window layer (410), a polarizing layer (420) sequentially arranged below the window layer (410), a display panel (430), a heat dissipation member (440), a support plate (450), and reinforcing plates (471, 472). In one embodiment, the support plate (450) may include a pattern (4531) including at least one opening formed at a specified interval in the folding area (130c) to provide flexibility to the flexible display (130). In some embodiments, the pattern (4531) may include at least one recess formed lower than the outer surface. In one embodiment, the flexible display (130) may include a blocking member (4532) disposed under the support plate (450) in an area corresponding at least to the folding area (130c) and disposed to block a plurality of openings of the pattern (4531). In one embodiment, the blocking member (4532) may include a thermoplastic polyurethane (TPU) attached to the support plate (450). In one embodiment, the reinforcing plates (471, 472) may include a first reinforcing plate (471) positioned under the support plate (450) in an area corresponding to at least a portion of the first housing (110) and a second reinforcing plate (472) positioned under the support plate (450) in an area corresponding to at least a portion of the second housing (120).

[0072] According to various embodiments, the heat dissipation member (440) may be disposed between the display panel (430) and the support plate (450), from at least a portion of the first region (130a) across the third region (130c) to at least a portion of the second region (130b). For example, when the flexible display (130) is folded based on the folding axis (F), the heat dissipation member (440) may also be bent together. In one embodiment, the heat dissipation member (440) may be disposed so that the collected heat moves from the first region (130a) in the direction of the second region (130b) (e.g., in the -y-axis direction) or from the second region (130b) in the direction of the first region (130a) (e.g., in the y-axis direction). In one embodiment, the heat dissipation member may be elongated (e.g., deformed) in a specified direction (e.g., in the ±y-axis direction) and with a specified elongation amount when bent together with the flexible display, and may be formed to have excellent thermal conductivity even in this case. In one embodiment, the heat dissipation member (440) may be set to have a thermal conductivity of about 700 W / mK or more. In one embodiment, the heat dissipation member (440) may be set to have an elongation amount of about 14% or more. In one embodiment, the heat dissipation member (440) may be restored to its original state when the flexible display (130) is transitioned to an unfolded state, so that a portion permanently deformed by bending may not occur. This may mean that the layout design of an existing electronic device, which requires providing space for a portion permanently deformed by the heat dissipation member (440), does not need to be considered, and may help to slim down the electronic device (100). The heat dissipation member (440) is not limited to being positioned between the display panel (430) and the support plate (450) and may be positioned elsewhere in the electronic device (100). For example, in some embodiments, the heat dissipation member (440) may be positioned between the support plate (450) and the reinforcing plates (471, 472).For example, in some embodiments, a heat dissipation member (440) may be positioned between the reinforcing plates (471, 472) and the housings (110, 130).

[0073] FIG. 5 is a process diagram illustrating a manufacturing sequence of a heat dissipation member according to various embodiments of the present disclosure.

[0074] FIG. 6A is an enlarged photograph of carbon fibers according to various embodiments of the present disclosure. FIG. 6B is an enlarged photograph of carbon nanotubes according to various embodiments of the present disclosure. FIG. 6C is an enlarged photograph of stirred carbon fibers and carbon nanotubes according to various embodiments of the present disclosure. FIG. 6D is an enlarged photograph showing a connection structure between carbon fibers through carbon nanotubes according to various embodiments of the present disclosure. FIG. 6E is a photograph showing a state in which a composite composition is aligned through a surfactant according to various embodiments of the present disclosure. FIG. 6F is an enlarged photograph showing a connection structure between carbon fibers through silver nanowires according to various embodiments of the present disclosure.

[0075] A method for manufacturing a heat dissipating member includes a step of adding a composite composition including carbon fiber, a thermally conductive wire, and an elastomer to an organic solvent and stirring it, a step of adding the stirred composite composition to ultrapure water and aligning it in a water phase, a step of drying the composite composition in a water phase and then coating the dried composite composition in a water phase with an elastic polymer.

[0076] At least some of the carbon fibers may have different lengths. For example, the composite composition may include carbon fibers of a first length (or range of lengths) and carbon fibers of a second length (or range of lengths) that is different from the first length (or range of lengths). This is merely exemplary, and it will be appreciated that carbon fibers of two or more different lengths (or ranges of lengths) may be included.

[0077] Although some of the detailed descriptions in FIG. 5 below refer to carbon nanotubes and / or silver nanowires, it will be appreciated that these are merely examples and that the same methods can be used with other types of thermally conductive wires (e.g., other metal nanowires).

[0078] Referring to FIGS. 5 to 6F, a method for manufacturing a heat dissipation member (440) may include a first operation (510) of pretreating carbon fibers (e.g., first operation), a second operation (513) of immersing pretreated carbon fibers, thermally conductive wires (e.g., carbon nanotubes and / or silver nanowires), and (optional) elastomers in an organic solvent and then stirring them (e.g., second operation), a third operation (515) of aligning the stirred composite composition after placing it in ultrapure water (e.g., third operation), a fourth operation (517) of drying the aligned composite composition (e.g., fourth operation), and a fifth operation (519) of forming a polymer film on the dried composite composition (e.g., fifth operation).

[0079] Below, each action (e.g. process) will be described in detail.

[0080] Carbon fiber pretreatment

[0081] According to various embodiments, prior to the process for manufacturing the heat dissipation member (440), the carbon fiber (441) illustrated in FIG. 6A may be pretreated. For example, the carbon fiber (441) may be surface treated prior to introducing the composite composition. The surface treatment may include, for example, silane coating or plasma treatment. In one embodiment, the carbon fiber may be coated with a silane coating, such as APTES (aminopropyl triethoxysilane), on its surface for effective filling of carbon nanotubes (442) and / or silver nanowires illustrated in FIG. 6B into the carbon fiber (441) structure. In one embodiment, such a silane coating may improve the surface bonding strength of the carbon fiber (441). For example, silane (e.g., an inorganic compound having SiH4) has a strong tendency to interact with transition metals (e.g., gold, silver, etc.) due to the polarization of the molecule caused by the difference in electronegativity between silicon (Si) and hydrogen (H), and at the same time, silicon (Si) has an electronic structure similar to carbon (C), which can induce the formation of a complex through a stable chemical bond on the surface of carbon fibers (441). The complex formed in this way not only increases the surface energy itself, but also helps increase the physical contact area with other substances by forming a uniform surface layer, and can induce strong interactions between other substances. For this reason, the silane-coated carbon fiber can improve the mixing force with the elastomer, carbon nanotube (442) and / or silver nanowire, thereby improving the maximum filling ratio to 80% by volume and 90% by mass, and at the same time relatively lowering the viscosity of the resin, which can help improve the productivity of heat-radiating members (e.g., carbon composite structures).

[0082] According to various embodiments, another method for effectively filling carbon nanotubes (442) and / or silver nanowires into carbon fibers (441) may include a surface treatment method using a plasma method. In one embodiment, plasma (O2) treatment through reactive ion etching on carbon fibers (441) helps to induce or create COO- and CO- functional groups on the surface, and since these functional groups improve surface energy, they can improve the dispersibility of carbon nanotubes (442) or silver nanowires in the empty spaces within the entangled carbon fiber structure, thereby helping to increase the filling ratio. This can improve the maximum filling ratio up to 80% by volume and up to 90% by mass. In addition, the functional groups formed on the surface of the carbon fiber (441) through plasma treatment not only improve thermal conductivity by creating a strong interconnected surface with the dispersed material, but also increase the roughness of the surface, thereby increasing the interfacial contact area and phonon coupling with the elastomer, thereby improving thermal conductivity. Therefore, it is possible to manufacture a composite network structure of a heat dissipation member including carbon fiber, carbon nanotube, and / or silver nanowire, with a reduced production cost due to a certain amount of carbon nanotubes in the network structure.

[0083] According to various embodiments, the thermal conductivity of the network structure of the heat dissipation member composed only of rope-shaped carbon fibers (441) is calculated to be about 0.78 in terms of the material shape characteristics, even if the structure is formed by aligning the carbon fibers in an exemplary water-aligned manner of the present disclosure, since the filling ratio per unit volume of the carbon fibers is less than 1 due to the structural characteristics, and this can result in a significant decrease in heat transfer efficiency to about 22% due to a decrease in the heat transfer area.

[0084] According to an exemplary embodiment of the present disclosure, the filling ratio may also be adjusted to increase the heat transfer efficiency of the heat dissipation member (440). For example, carbon nanotubes (442) having a high thermal conductivity of about 3000 W / mK and a diameter of several nm (e.g., diameters in the range of 1 to 10 nm) may be used to at least partially fill the voids existing within the network structure composed of carbon fibers having a diameter of several μm (e.g., diameters in the range of 1 to 10 μm). In one embodiment, it may be difficult for the carbon nanotubes (442) to efficiently fill the voids within the network structure composed of carbon fibers by themselves because the carbon nanotubes (442) have a strong tendency to bond to each other due to the van der Waals force. Accordingly, the aggregation of carbon nanotubes (442) can be evenly dispersed after being introduced into an organic solvent and then decomposed through ultrasonic treatment, and then introduced into an organic solvent containing carbon fibers (e.g., a mixture of DMF and D5) to fill the empty spaces of the network structure. In one embodiment, the addition of carbon nanotubes (442) can not only improve the filling rate, but also, as illustrated in FIG. 6d, help improve the heat transfer efficiency of the heat dissipation member (440) because they act as heat transfer bridges between carbon fibers (441).

[0085] Stirring of carbon fibers, carbon nanotubes, and elastomers using organic solvents

[0086] According to various embodiments, a composite composition comprising carbon fibers, carbon nanotubes, and (optionally) an elastomer in a predetermined ratio may be placed in a vessel containing an organic solvent and then stirred. At this time, the composition including the carbon fibers and carbon nanotubes may comprise about 20% to 50% of the entire composite composition. To enhance heat transfer properties, the carbon fibers may be aligned such that they are at least partially oriented relative to one another (i.e., at least not completely randomly oriented). The carbon fibers may be aligned such that they are (at least partially) oriented along the heat transfer direction of the heat dissipation member. In one embodiment, the degree of alignment within the carbon fibers may act as a dominant factor in heat transport within the network structure. According to an exemplary embodiment of the present disclosure, the degree of alignment of the carbon fibers may be controlled by utilizing a float assembly method (float assembly) utilizing the Marangoni effect. The float assembly may include introducing a surfactant to the stirred composite composition floating in ultrapure water. In one embodiment, the organic solvent is a polar solvent, dimethylformamide (N,N-dimethylmethanamide, DMF), and a non-polar solvent, decamethylcyclopentasiloxane (D5), in a ratio of 1:x (1 <x<3) 비율로 섞인 혼합 용액을 포함할 수 있다. 동일한지 않은 DMF 및 D5의 혼합 비율은 탄소 섬유의 완벽한 정렬을 방지함으로써, 열확산 경로 유지에 도움을 줄 수 있다. 일 실시예에서, 도 6c에 도시된 바와 같이, 탄소 섬유, 탄소나노튜브 및 엘라스토머(elastomer)는 DMF와 D5가 적절히 혼합된 유기 용제내에 투입된 후, 물리적인 방법을 통해 1차적으로 교반될 수 있다.

[0087] According to various embodiments, DMF is a highly polar solvent that contains various functional groups such as polar amines, aldehydes, or alcohols in its molecular structure. Therefore, it has a strong tendency to be adsorbed on the surface of a material and can prevent deposition between materials after being adsorbed on the surface, thereby inducing high dispersibility. In particular, DMF molecules form bonds through various interactions such as hydrogen, benzene ring, or benzamide bonds on the surface of carbon-based materials, so it has very high affinity and adsorptivity with carbon-based materials. In addition, because DMF has excellent isomer stability, it has an excellent ability to strongly interact with natural organic pollutants and dissolve them, and can also maintain a chemically stable state while the natural organic pollutants are dissolved. Therefore, DMF can be an optimal solvent that can be used in the process of forming a heat-radiating member (e.g., carbon composite material) due to its high dispersibility and surface adsorptivity with carbon fibers.

[0088] In various embodiments, D5 can improve dispersibility through interaction with the elastomer and induce improvement of the physical properties of the elastomer itself. In one embodiment, D5 can advantageously interact with the elastomer by forming attractive and hydrogen bonds with the elastomer due to various functional groups such as silanol, carbonyl, or alkyl groups in the molecule. For example, the relatively small molecular size of D5 allows it to easily penetrate between the molecules of the elastomer, which can form intermolecular interactions in the flexible polymer structure of the elastomer to improve its own physical properties, as well as increase the adhesion of the elastomer present on the surface to make the surface smooth. In addition, D5 has an appropriate viscosity of 2-5 centistokes (1 centistokes based on water), so it has appropriate fluidity, which can help reduce defects or roughness on the surface of the elastomer and induce easy processing. In one embodiment, when the carbon fibers are perfectly aligned, the lack of contact area during ductility can cause the thermal diffusion path to disappear, so an appropriate degree of alignment of the carbon fibers may be required. For this reason, D5, which has an appropriate viscosity, can be advantageous in easily controlling the degree of alignment of the carbon fibers. In some embodiments, DMF may be replaced with ethanol or pyridine. In some embodiments, D5 may be replaced with toluene.

[0089] array

[0090] According to various embodiments, a carbon composition comprising carbon fibers, carbon nanotubes, and an elastomer, introduced into an organic solvent containing DMF and D5 mixed at a predetermined ratio, can be secondarily and evenly dispersed again through sonication for 6 hours (secondary stirring). In one embodiment, the sonication time can be set to a maximum of 6 hours to prevent destruction of the carbon fibers and carbon nanotubes.

[0091] According to various embodiments, a mixed solution including a complex composition stirred through DMF and D5 may be injected over the entire surface of deionized water as a solvent. In one embodiment, the mixed solution may be injected at an appropriate rate for even distribution. For example, the injection rate of the mixed solution may include about 24 ml / min. Then, when a surfactant (e.g., octylphenoxypolyethoxyethanol or another detergent) is injected into the center of the interface evenly distributed over the surface of the mixed solution, as illustrated in FIG. 6e, the difference in surface tension between the center and the periphery of the interface causes carbon fibers and carbon nanotubes present throughout the interface to gradually flow and accumulate with a certain level of directionality at the periphery of the interface. Since the added surfactant is a driving force that causes the carbon fibers on the interface to flow by generating a surface tension difference within the interface, the concentration of the surfactant relative to the solvent may be important. In one embodiment, the effect may increase to some extent as the concentration of surfactant relative to the solvent increases, but excessive concentration may compromise stability, so the surfactant may be added once every two seconds at a concentration of 0.1% relative to the solvent (e.g., ultrapure water).

[0092] dry

[0093] When a carbon composition properly aligned through a surfactant is dried at room temperature, the alignment of carbon fibers within the existing network structure is controlled to a certain extent, thereby producing a heat-radiating member (e.g., a heat-radiating sheet) having a network structure in which the heat transfer direction is intentionally controlled.

[0094] Formation of elastic polymer film

[0095] In various embodiments, the heat dissipating member (e.g., heat dissipating sheet) may have a structure in which, when elongation characteristics are required, the bent or entangled carbon fibers may straighten or move in the elongation direction, causing elongation of the structure. Since this is not an elastic behavior but a simple flow of the carbon fibers within the structure, self-restoration may not be possible after elongation. Therefore, the manufactured heat dissipating member (e.g., heat dissipating sheet) may have a polymer film, such as polydimethylsiloxane (PDMS) or polyurethane, which exhibits elastic behavior, coated (or at least partially coated) on the surface of the network structure. In one embodiment, the mechanical properties of the coated polymer films may be controlled through heat treatment, typically below 250 degrees Celsius, although the heat processing temperature may vary depending on the thickness or type, and various coating methods, such as spin, spray, or brush, may be applied to facilitate thickness control of the uniform and thin polymer film.

[0096] Alternatives to carbon nanotubes

[0097] In various embodiments, carbon nanotubes are complex to manufacture and are formed at high temperatures, resulting in complex processes and high production costs. Therefore, metal nanowires can be used as a material that can perform the same role (i.e., act as thermally conductive wires) and thus can at least partially replace carbon nanotubes in the heat dissipation member described above. In one embodiment, the metal nanowires may include silver nanowires having high thermal conductivity. For example, the silver nanowires may have a diameter size of approximately 100 nm or less, as illustrated in FIG. 6F. The silver nanowires may act as thermal bridges between carbon fibers. In one embodiment, the silver nanowires may have a high thermal conductivity of 429 W / mK due to the high free electron density therein, which activates heat transfer by electron-electron interactions, which is one of the main factors in heat transfer, and may have the property of maintaining high thermal conductivity for a long time because the oxidation rate is very slow and a very stable oxide is formed on the surface. Therefore, carbon nanotubes and silver nanowires can be used in a certain ratio as materials that can maximize heat transfer efficiency through the filling rate of the network structure of a heat dissipation member that acts as a heat conductive wire and is composed of carbon fibers and acts as a heat transfer bridge. That is, the heat dissipation member can include a heat conductive wire. The heat conductive wire can include carbon nanotubes and / or metal (e.g., silver) nanowires. In some embodiments, the carbon nanotubes can be partially or entirely replaced by silver nanowires.

[0098] FIG. 7A is a plan view of an electronic device in a slide-in state according to various embodiments of the present disclosure. FIG. 7B is a cross-sectional view of the electronic device taken along line 8b-8b of FIG. 8A according to various embodiments of the present disclosure.

[0099] FIG. 7C is a plan view of an electronic device in a slide-out state according to various embodiments of the present disclosure. FIG. 7D is a cross-sectional view of the electronic device taken along line 7d-7d of FIG. 8C according to various embodiments of the present disclosure.

[0100] Referring to FIGS. 7A to 7D , the electronic device (700) may include a first housing (710) and a second housing (720) that is slidably coupled to the first housing (710) in a designated direction and a designated reciprocating distance. The second housing (720) may be slidably coupled to the first housing (710), so that the electronic device (700) may transition between a retracted state and a retracted state. In one embodiment, the electronic device (700) may include a flexible display (730) that is fixed to at least a portion of the second housing (720) and slides in or out of an internal space (7101) of the first housing (710) according to a sliding motion of the second housing (720), thereby having a variable display area. For example, the flexible display (730) may have a first display area when the second housing (720) is pulled out from the first housing (710) in a first direction (e.g., direction ①). In one embodiment, the flexible display (730) may have a second display area smaller than the first display area when the second housing (720) is inserted in a second direction (e.g., direction ②) opposite to the first direction (e.g., direction ①).

[0101] According to various embodiments, the flexible display (730) may include a first flat portion (730a) fixed to a second housing (720), a bending portion (730b) extending from the first flat portion (730a) and exposed to be visible to the outside in a pulled-out state and introduced into an internal space (7101) of the first housing (710) through a bending motion in a pulled-in state so as to be invisible to the outside, and a second flat portion (730c) extending from the bending portion (730b), not always exposed to the outside, and positioned in the internal space (7101) of the first housing (710).

[0102] FIG. 7e is a schematic diagram of a flexible display having a heat dissipation member arranged thereon according to various embodiments of the present disclosure.

[0103] Referring to FIG. 7E, the flexible display (730) may include a heat dissipation member (440) (e.g., the heat dissipation member (440) of FIG. 7) disposed in a manner attached to the back surface of the display panel (731). In one embodiment, the heat dissipation member (440) may be deformed in a bendable manner together with the display panel (731) when the electronic device (700) transitions from the retracted state to the withdrawn state or from the withdrawn state to the withdrawn state. In one embodiment, the heat dissipation member (440) is configured as a heat-conductive network having high thermal conductivity and being stretchable through a composite composition including carbon fibers, thermally conductive wires, and an elastomer, thereby performing a heat dissipation function with high thermal conductivity in the internal space of the electronic device (700) and being flexibly bendable together with the display panel (730) of the flexible display (730).

[0104] According to various embodiments (e.g., the first embodiment), the electronic device includes a first structure (e.g., the first housing (110) of FIG. 4 or a part of the interior space of the first housing), a second structure spaced apart from the first structure (e.g., the second housing (120) of FIG. 4 or a part of the interior space of the second housing), and a heat dissipation member (e.g., the heat dissipation member (440) of FIG. 4) thermally connecting the first structure and the second structure, wherein the heat dissipation member may include carbon fibers (e.g., the carbon fibers (441) of FIG. 6a) that are aligned to have at least a partial directionality, thermally conductive wires (e.g., the carbon nanotubes (442) of FIG. 6b) that at least partially thermally connect the carbon fibers, and a polymer film at least partially coating the carbon fibers and the thermally conductive wires.

[0105] According to various embodiments (e.g., a second embodiment based on the first embodiment), the thermally conductive wires may include at least one of silver nanowires or carbon nanotubes.

[0106] According to various embodiments (e.g., a third embodiment based on the first or second embodiment), at least some of the carbon fibers may have different lengths.

[0107] According to various embodiments (e.g., a fourth embodiment based on any one of the first to third embodiments), the carbon fibers may include a silane-coated coating layer.

[0108] According to various embodiments (e.g., a fifth embodiment based on any one of the first to third embodiments), the polymer membrane may comprise at least one of polydimethyl siloxane (PDMS) or polyurethane.

[0109] According to various embodiments (e.g., a sixth embodiment based on any one of the first to fifth embodiments), the carbon fibers can be aligned to have the directionality along the heat transfer direction of the heat dissipation member.

[0110] According to various embodiments (e.g., the seventh embodiment), a flexible display (e.g., the flexible display (130) of FIG. 4) including a first housing (e.g., the first housing (110) of FIG. 4), a second housing (e.g., the second housing (120) of FIG. 4) foldably connected to the first housing via a hinge device (e.g., the hinge device (HA) of FIG. 1a), and a display panel (e.g., the display panel (430) of FIG. 4) arranged to support the first housing and the second housing, wherein the heat dissipation member (e.g., the heat dissipation member (440) of FIG. 4) is arranged between the display panel and the first and second housings, and at least a portion of the heat dissipation member can be arranged to be bendable together with the display panel.

[0111] According to various embodiments (e.g., the eighth embodiment), a flexible display (e.g., the flexible display (730) of FIG. 7a) including a first housing (e.g., the first housing (710) of FIG. 7a), a second housing (e.g., the second housing (720) of FIG. 7a) slidably coupled from the first housing, and a display panel (e.g., the display panel (731) of FIG. 7e) accommodated in a manner that is at least partially supported by the second housing and, in a slide-in state, bends into the first housing so that at least a portion of the display area is not visible from the outside, wherein the heat dissipation member may be arranged on a rear surface of the display panel so as to be bendable together with the display panel.

[0112] According to various embodiments (e.g., embodiment 9), the heat dissipation member may include carbon fibers aligned at least partially directionally (e.g., carbon fibers (441) in FIG. 6a), thermally conductive wires at least partially thermally connecting the carbon fibers (e.g., carbon nanotubes (442) in FIG. 6b), and a polymer film at least partially coating the carbon fibers and the thermally conductive wires.

[0113] According to various embodiments (e.g., a tenth embodiment based on the ninth embodiment), the thermally conductive wires may include at least one of silver nanowires or carbon nanotubes.

[0114] According to various embodiments (e.g., an eleventh embodiment based on the ninth or tenth embodiments), the polymer membrane may comprise at least one of polydimethyl siloxane (PDMS) or polyurethane.

[0115] According to various embodiments (e.g., the 12th embodiment), a method for manufacturing a heat dissipation member may include an operation of adding a composite composition including carbon fibers (e.g., carbon fibers (441) of FIG. 6a), thermally conductive wires (e.g., carbon nanotubes (442) of FIG. 6b), and an elastomer to an organic solvent and then stirring, an operation of adding a mixed solution including the stirred composite composition to ultrapure water and then aligning the mixed solution in a water phase, and an operation of drying the aligned composite composition in a water phase and then coating an elastic polymer.

[0116] According to various embodiments (e.g., a thirteenth embodiment based on the twelfth embodiment), an operation of surface treating the carbon fibers may be further included prior to introducing the composite composition.

[0117] According to various embodiments (e.g., a fourteenth embodiment based on the thirteenth embodiment), the surface treatment operation may include silane coating or plasma treatment.

[0118] According to various embodiments (e.g., a 15th embodiment based on any one of the 12th to 14th embodiments), prior to introducing the composite composition, an operation of dispersing the composite composition through ultrasonic treatment may be further included.

[0119] According to various embodiments (e.g., a 16th embodiment based on any one of the 12th to 15th embodiments), the organic solvent may include dimethylformamide (N,N-dimethylmethanamide, DMF) and decamethylcyclopentasiloxane (D5) mixed in a specified ratio.

[0120] According to various embodiments (e.g., the 17th embodiment based on the 16th embodiment), the mixing ratio of the DMF and the D5 is 1:x (1 <x<3)의 범위를 포함할 수 있다.

[0121] According to various embodiments (e.g., an eighteenth embodiment based on any one of the twelfth to seventeenth embodiments), the stirring operation can be performed within six hours via ultrasonic stirring.

[0122] According to various embodiments (e.g., a nineteenth embodiment based on any one of the twelfth to eighteenth embodiments), the aligning operation may include an operation of introducing a surfactant into a mixed solution including the complex composition floating on the ultrapure water.

[0123] According to various embodiments (e.g., a 20th embodiment based on the 19th embodiment), the surfactant may include an operation of adding the surfactant once every 2 seconds at a concentration of 0.1% relative to the concentration of the ultrapure water.

[0124] In a first embodiment, a heat dissipation member is provided comprising carbon fibers aligned at least partially to have a directionality, thermally conductive wires configured to thermally connect at least some of the carbon fibers, and a polymer film at least partially coated on the carbon fibers and the thermally conductive wires.

[0125] In a second embodiment, the heat dissipation member of the first embodiment is provided, wherein the thermally conductive wires include at least one of silver nanowires or carbon nanotubes.

[0126] In a third embodiment, a heat dissipating member of the first or second embodiment is provided, wherein at least some of the carbon fibers have different lengths.

[0127] In a fourth embodiment, the carbon fibers are provided with a heat dissipating member of any one of the first to third embodiments including a silane-coated coating layer.

[0128] In a fifth embodiment, the polymer film is provided with a heat dissipation member according to any one of the first to fourth embodiments, wherein the polymer film comprises at least one of polydimethyl siloxane (PDMS) or polyurethane.

[0129] In the sixth embodiment, a heat dissipation member according to any one of the first to fifth embodiments is provided, wherein the carbon fibers are aligned to have the directionality along the heat transfer direction of the heat dissipation member.

[0130] In a seventh embodiment, an electronic device is provided, comprising a heat dissipation member of any one of the first to sixth embodiments, a first structure, and a second structure spaced apart from the first structure, wherein the heat dissipation member thermally connects the first structure and the second structure.

[0131] In an eighth embodiment, an electronic device according to a seventh embodiment is provided, comprising a first housing, a second housing foldably connected to the first housing via a hinge device, and a flexible display including a display panel arranged to support the first housing and the second housing, wherein the heat dissipation member is arranged between the display panel and the first and second housings, and at least a portion of the heat dissipation member is arranged to be bendable together with the display panel.

[0132] In a ninth embodiment, an electronic device according to the seventh embodiment is provided, comprising a first housing, a second housing slidably coupled from the first housing so that the electronic device can transition between a retracted state and an extended state, and a flexible display including a display panel, the second housing being arranged to at least partially support the second housing, and in a slide-in state, at least a portion of a display area of ​​the flexible display is accommodated in a manner that it bends into the first housing so that it is not visible from the outside of the electronic device, and the heat dissipation member is arranged on a rear surface of the display panel so as to be bendable together with the display panel.

[0133] In a tenth embodiment, a method for manufacturing a heat dissipating member is provided, including an operation of adding a composite composition including carbon fibers and a thermally conductive wire to an organic solvent and then stirring it, an operation of adding the stirred composite composition to ultrapure water and then aligning it in a water phase, an operation of drying the composite composition in a water phase and then coating the dried composite composition in a water phase with an elastic polymer.

[0134] In the eleventh embodiment, the method of the tenth embodiment is provided, which further includes an operation of surface treating the carbon fiber (441) before introducing the composite composition.

[0135] In the twelfth embodiment, the surface treatment operation is provided by the method of the eleventh embodiment including silane coating or plasma treatment.

[0136] In the 13th embodiment, a method of any one of the 10th to 12th embodiments is provided, further comprising at least one of an operation of dispersing the composite composition through ultrasonic decomposition before introducing the composite composition into the organic solvent, and an operation of dispersing the composite composition through ultrasonic decomposition after introducing the composite composition into the organic solvent.

[0137] In the 14th embodiment, the organic solvent is composed of dimethylformamide (N,N-dimethylmethanamide), DMF and decamethylcyclopentasiloxane, D5 mixed at a specific ratio, wherein the specific ratio of DMF and D5 is in the range of 1:x, wherein 1 <x<3인 제10 내지 제13실시예 중 어느 하나의 방법이 제공된다.

[0138] In the fifteenth embodiment, the operation of aligning the water is provided by any one of the methods of the tenth to fourteenth embodiments, which includes an operation of adding a surfactant to the stirred complex composition floating in the ultrapure water.

[0139] In addition, the embodiments of the present disclosure disclosed in this specification and drawings are merely specific examples to easily explain the technical contents according to the embodiments of the present disclosure and to help understand the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Therefore, the scope of the various embodiments of the present disclosure should be interpreted as including all changes or modified forms derived based on the technical ideas of the various embodiments of the present disclosure in addition to the embodiments disclosed herein.

Claims

1. There is a heat dissipation member (440). Carbon fibers (441) aligned at least partially directionally; Thermally conductive wires (442) configured to thermally connect at least some of the carbon fibers; and A heat dissipation member comprising a polymer film at least partially coated on the carbon fibers and the thermally conductive wires.

2. In paragraph 1, The above thermally conductive wires (442) are heat dissipation members (440) including at least one of silver nanowires or carbon nanotubes.

3. In paragraph 1 or 2, A heat dissipation member (440) wherein at least some of the carbon fibers (441) have different lengths.

4. In any one of paragraphs 1 to 3, The above carbon fibers (441) are a heat dissipating member (440) including a silane-coated coating layer.

5. In any one of paragraphs 1 to 4, The above polymer film is a heat dissipating member440) comprising at least one of polydimethyl siloxane (PDMS) or polyurethane.

6. In any one of paragraphs 1 to 5, A heat dissipation member (440) in which the above carbon fibers (441) are aligned to have the above directionality along the heat transfer direction of the heat dissipation member (440).

7. In electronic devices, A heat dissipation member (440) according to any one of claims 1 to 6; First structure (110); and Including a second structure (120) spaced apart from the first structure (110), The above heat dissipation member (440) is an electronic device that thermally connects the first structure and the second structure.

8. In paragraph 7, 1st housing (110); A second housing (120) foldably connected to the first housing (110) through a hinge device (HA); and A flexible display (130) is positioned to be supported by the first housing (110) and the second housing (120), and includes a display panel (430). The above heat dissipation member (440) is placed between the display panel (430) and the first and second housings (110, 120). An electronic device in which at least a portion of the heat dissipation member (440) is arranged to be bendable together with the display panel (430).

9. In paragraph 7, 1st housing (710); A second housing (720) slidably coupled from the first housing (710) so that the electronic device can transition between an inlet state and an outlet state; and A flexible display (730) including a display panel (731) is disposed to be supported at least partially by the second housing, and is accommodated in a manner that at least a part of the display area of ​​the flexible display (730) is bent into the first housing (710) so that it is not visible from the outside of the electronic device in a slide-in state. An electronic device in which the heat dissipation member is arranged on the back surface of the display panel so as to be bendable together with the display panel.

10. In a method for manufacturing a heat dissipation member (440), An action of adding a composite composition including carbon fiber (441) and a thermally conductive wire (442) to an organic solvent and then stirring the mixture; The operation of putting the above stirred complex composition into ultrapure water and then aligning the water phase; and A method comprising drying the above-described water-aligned composite composition, and then coating the dried water-aligned composite composition with an elastic polymer.

11. In paragraph 10, A method further comprising an action of surface treating the carbon fiber (441) prior to introducing the composite composition.

12. In paragraph 11, The above surface treatment operation is a method including silane coating or plasma treatment.

13. In any one of paragraphs 10 to 12, An operation of dispersing the above complex composition through ultrasonic treatment decomposition before putting it into the organic solvent; and A method further comprising at least one operation of dispersing the complex composition through ultrasonic decomposition after introducing the complex composition into the organic solvent.

14. In any one of paragraphs 10 to 13, The above organic solvent is composed of dimethylformamide (N,N-dimethylmethanamide), DMF and decamethylcyclopentasiloxane, D5, mixed in a specific ratio. Here, the specific ratio of DMF and D5 is in the range of 1:x, where 1 <x<3인 방법.

15. In any one of paragraphs 10 to 14, A method wherein the above-mentioned water-aligning operation includes an operation of introducing a surfactant into the stirred complex composition floating in the ultrapure water.

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