LED device, preparation method for LED device, backlight module and display apparatus

Abstract

An LED device, a preparation method for an LED device, a backlight module and a display apparatus. The LED device comprises a lead frame, an LED chip and a lens, wherein the lead frame comprises a substrate and a supporting member; an accommodating recess is formed by means of enclosure of the substrate and the supporting member; a limiting groove is formed on the supporting member; the LED chip is arranged in the accommodating recess; and the lens is provided with a limiting portion, the limiting portion being snap-fitted with the limiting groove.

Description

LED device, method for manufacturing LED device, backlight module and display device

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on September 27, 2023, with application number 202311272317.6 and invention name “LED device, method for preparing LED device, backlight module and display device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of display technology, and in particular to an LED device, a method for preparing an LED device, a backlight module, and a display device. Background Art

[0003] In the LCD (Liquid Crystal Display) backlighting field, LEDs (Light-Emitting Diodes) are widely used due to their numerous advantages, including small size, high luminous efficiency, and long life. Common LED light distribution curves generally conform to the Lambertian distribution, with beam angles typically ranging from 110 to 130 degrees. However, this narrow beam angle cannot meet the light pattern requirements of direct-lit backlight applications. Therefore, when using LEDs in backlighting applications, a larger lens must be attached above the LED chip to improve the light pattern. Technical issues

[0004] The LED chip is small and the lens cannot be accurately mounted above the LED chip. Technical Solutions

[0005] In a first aspect, an embodiment of the present application provides an LED device, comprising:

[0006] A lead frame, the lead frame comprising a substrate and a support member, the substrate and the support member are arranged to form a receiving groove, and the support member is provided with a limiting groove;

[0007] An LED chip, wherein the LED chip is disposed in the receiving groove;

[0008] The lens has a limiting portion, and the limiting portion is engaged with the limiting groove.

[0009] In a second aspect, an embodiment of the present application further provides an LED device, comprising:

[0010] A lead frame, the lead frame comprising a substrate and a support member, the substrate and the support member forming a receiving groove, and the support member being provided with a limiting portion;

[0011] An LED chip, wherein the LED chip is disposed in the receiving groove;

[0012] The lens has a limiting groove, and the limiting portion is engaged with the limiting groove.

[0013] In a third aspect, an embodiment of the present application further provides a method for preparing an LED device, for preparing an LED device, the method for preparing an LED device comprising:

[0014] A lead frame assembly is provided, the lead frame assembly comprising a plurality of lead frames, the plurality of lead frames being sequentially connected along a first direction, the lead frame comprising a substrate and a support member, the substrate and the support member forming a receiving groove, and the support member being provided with a limiting groove;

[0015] Provide multiple LED chips;

[0016] Each of the LED chips is placed in one of the receiving grooves, and the plurality of lead frames correspond to the plurality of LED chips one by one;

[0017] Providing a lens assembly, the lens assembly comprising a plurality of lenses, the plurality of lenses being sequentially connected along the first direction, and the lenses having a limiting portion;

[0018] The limiting portion is clamped with the limiting groove, the multiple lenses correspond to the multiple lead frames one by one, and each lens cover is provided on one LED chip;

[0019] The lead frame assembly and the lens assembly are cut along a second direction to separate a plurality of the lead frames and a plurality of the lenses connected in sequence, wherein the first direction intersects with the second direction.

[0020] In a fourth aspect, an embodiment of the present application further provides a backlight module, comprising an LED device, wherein the LED device comprises:

[0021] A lead frame, the lead frame comprising a substrate and a support member, the substrate and the support member are arranged to form a receiving groove, and the support member is provided with a limiting groove;

[0022] An LED chip, wherein the LED chip is disposed in the receiving groove;

[0023] The lens has a limiting portion, and the limiting portion is engaged with the limiting groove.

[0024] In a fifth aspect, an embodiment of the present application further provides a backlight module, comprising an LED device, wherein a method for preparing the LED device comprises:

[0025] A lead frame assembly is provided, the lead frame assembly comprising a plurality of lead frames, the plurality of lead frames being sequentially connected along a first direction, the lead frame comprising a substrate and a support member, the substrate and the support member forming a receiving groove, and the support member being provided with a limiting groove;

[0026] Provide multiple LED chips;

[0027] Each of the LED chips is placed in one of the receiving grooves, and the plurality of lead frames correspond to the plurality of LED chips one by one;

[0028] Providing a lens assembly, the lens assembly comprising a plurality of lenses, the plurality of lenses being sequentially connected along the first direction, and the lenses having a limiting portion;

[0029] The limiting portion is clamped with the limiting groove, the multiple lenses correspond to the multiple lead frames one by one, and each lens cover is provided on one LED chip;

[0030] The lead frame assembly and the lens assembly are cut along a second direction to separate a plurality of the lead frames and a plurality of the lenses connected in sequence, wherein the first direction intersects with the second direction.

[0031] In a sixth aspect, an embodiment of the present application further provides a display device, comprising a backlight module, wherein the backlight module comprises an LED device, wherein the LED device comprises:

[0032] A lead frame, the lead frame comprising a substrate and a support member, the substrate and the support member are arranged to form a receiving groove, and the support member is provided with a limiting groove;

[0033] An LED chip, wherein the LED chip is disposed in the receiving groove;

[0034] The lens has a limiting portion, and the limiting portion is engaged with the limiting groove. Beneficial effects

[0035] In the LED device provided in the embodiments of the present application, the device includes a lead frame, an LED chip, and a lens. The lead frame includes a substrate and a support member. The substrate and support member enclose a receiving groove, and the support member is provided with a limiting groove. The lens has a limiting portion that, when engaged with the limiting groove, can fix the relative position of the lens and the LED chip. Therefore, in the embodiments of the present application, the combination of the lead frame and the lens enables the lens to be accurately mounted on the LED chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] FIG1 is a schematic flow chart of the steps of a method for preparing an LED chip provided in an embodiment of the present application.

[0037] FIG2 is a schematic diagram of a first process flow of a method for preparing an LED chip provided in an embodiment of the present application.

[0038] FIG3 is a schematic diagram of the structure of the LED chip provided in an embodiment of the present application.

[0039] FIG4 is a schematic diagram of a second process flow of the method for preparing an LED chip provided in an embodiment of the present application.

[0040] Implementation Methods of the Application

[0041] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts are within the scope of protection of this application.

[0042] In the display backlighting field, LEDs (Light-Emitting Diodes) are widely used due to their numerous advantages, including small size, high luminous efficiency, and long lifespan. Common LED light distribution curves generally conform to the Lambertian distribution, with beam angles typically ranging from 110 to 130 degrees. However, this insufficient beam angle cannot meet the light pattern requirements of direct-lit backlighting applications. Therefore, LED backlighting applications require the installation of larger lenses above the LEDs to improve the light pattern. However, LED devices manufactured using this method require individual lenses to be installed on the LED chips, resulting in high production costs and high efficiency.

[0043] To improve the efficiency of LED device manufacturing, the following two technical solutions are implemented in related technologies: one is to fix the LED chip to the lead frame, then apply high-viscosity glue on the LED chip, allowing the glue to naturally form a hemispherical lens through surface tension. The structure of the lens formed in this way is difficult to control, so the improvement in the LED chip's light-emitting angle is small and the consistency is poor. The other method is to use a mold to directly mold a silicone lens on the LED chip. This method only accurately processes the light-emitting surface of the lens, but cannot design and process the light-entering surface of the lens. Although it can increase the light-emitting angle to a certain extent, the improvement in the light-emitting angle is relatively limited.

[0044] Therefore, the embodiments of the present application provide an LED device, a method for manufacturing an LED device, a backlight module, and a display device. The LED device manufacturing method greatly improves the efficiency of lens mounting by batch-arranging lenses on an array of LED chips. A detailed description is provided below with reference to the accompanying drawings.

[0045] Please refer to Figures 1 and 2. Figure 1 is a schematic diagram of the step flow of the method for preparing an LED chip provided in an embodiment of the present application. Figure 2 is a schematic diagram of the first process flow of the method for preparing an LED chip provided in an embodiment of the present application.

[0046] An embodiment of the present application provides a method for preparing an LED device 1000 , and the method for preparing the LED device 1000 includes the following steps.

[0047] S1. Provide a lead frame assembly 100. The lead frame assembly 100 includes a plurality of lead frames 10, and the plurality of lead frames 10 are connected in sequence along a first direction X. The lead frame 10 is a chip carrier, and is also a key structural component that uses bonding materials (gold wire, aluminum wire, copper wire) to achieve electrical connection between the internal circuit lead end of the chip and the external lead to form an electrical circuit. The lead frame 10 serves as a bridge connecting to external wires and is an important basic material in the electronic information industry. A plurality of lead frames 10 are connected by metal ribs or metal segments to form a lead frame assembly 100. The lead frames 10 can be arranged in an array, and the number of the lead frames 10 can be two or more, for example, two, four, or seven.

[0048] S2. Provide multiple LED chips 20. The LED chips 20, also known as LED light-emitting chips, are made of semiconductor material. The multiple LED chips 20 form light-emitting units, providing point light sources. The multiple LED chips 20 are independent of each other.

[0049] S3. Each LED chip 20 is placed on a lead frame 10, with multiple lead frames 10 corresponding to multiple LED chips 20. The LED chips 20 can be attached to the lead frames 10, that is, the LED chips 20 can be attached to the lead frames 10 using a die-bonding adhesive.

[0050] S4. Provide a lens assembly 300. The lens assembly 300 includes a plurality of lenses 30, and the plurality of lenses 30 are sequentially connected along the first direction X. The number of the lenses 30 can be two or more, for example, two, four, or seven. The lenses 30 can be arranged in an array. The lens assembly 300 can be molded, that is, the lenses 30 can be prepared in advance through a unified and standard process so that the shape and material of each lens 30 are almost the same, which can ensure the consistency of the light distribution of the LED chip 20 through the lens 30, thereby improving the overall light output effect. The plurality of lenses 30 can be connected to each other by a silicone film. It can be understood that the lens assembly 300 can be formed by molding or injection molding silicone, and the plurality of lenses 30 in the lens assembly 300 can be connected to each other by a silicone film.

[0051] S5. Connect the lens assembly 300 to the lead frame assembly 100, with the multiple lenses 30 corresponding one-to-one to the multiple lead frames 10, and each lens 30 covering one LED chip 20 along the second direction Y. The arrangement of the multiple lead frames 10 is consistent with the arrangement spacing of the multiple lenses 30. It will be understood that since the multiple lenses 30 are connected to each other and the multiple lead frames 10 are connected to each other, as long as one or two groups of lenses 30 are aligned with the lead frames 10, a one-to-one correspondence between the multiple lenses 30 and the multiple lead frames 10 can be achieved.

[0052] The lens 30 can change the light distribution of the LED chip 20. Therefore, in the embodiment of the present application, the existing process of protecting the LED chip 20 by dispensing glue on the LED chip 20 is removed, that is, the embodiment of the present application does not need to perform individual dispensing on the LED chips 20 one by one, but can directly perform secondary optical design on the light source emitted by the LED chip 20 through the lens 30. As mentioned above, the lens 30 is not formed by directly controlling the volume of the silicone at points on the LED chip 20 and utilizing the fluidity of the silicone, but can be prepared in advance through a unified and standard process, and when used, it is fixed above the LED lens 30 by adopting the above method, thereby ensuring the consistency of the light distribution of each LED chip 20 through the lens 30, so that the combination of multiple LED chips 20 can improve the overall light output effect.

[0053] S6. Cut the lead frame assembly 100 and the lens assembly 300 along the second direction Y to separate the plurality of lead frames 10 and the plurality of lenses 30 that are sequentially connected, thereby forming individual LED devices 1000. The first direction X intersects the second direction Y. It will be appreciated that the cutting method disconnects the connecting material between the plurality of lead frames 10 and the plurality of lenses 30 to form individual LED devices 1000. The LED device 1000 includes a lead frame 10, an LED chip 20, and a lens 30. The LED chip 20 is fixed to the lead frame 10. The lens 30 is disposed over the LED chip 20 and is connected to the lead frame 10. The first direction X and the second direction Y may be perpendicular.

[0054] Specifically, this step is also called a punching and blanking process, in which the interconnected materials between the lead frame 10 array and the lens 30 array are punched and cut apart by a punching die to form a single LED device 1000 .

[0055] Subsequently, the LED device 1000 is tested and taped for packaging before the backlight module mounting process can be carried out.

[0056] It can be seen that the present application first matches multiple lead frames 10 connected to each other with multiple lenses 30 connected to each other one by one, and then cuts the lead frame assembly 100 and the lens assembly 300 to form multiple independent LED devices 1000, thereby reducing the process of mounting lenses 30 on multiple LED chips 20 one by one, greatly improving the efficiency of mounting lenses 30, that is, when the LED device 1000 is processed, only one LED lens 30 mounting is required, which can greatly reduce the production cost of the mounting and improve production efficiency.

[0057] The LED chip 20 in this embodiment can be a DBR chip with an integrated DBR (Distributed Bragg Reflection) layer, or it can be an ordinary LED chip 20 (which can also be understood as a bare chip) without an integrated DBR layer. And the light color of the LED chip 20 in the embodiment of the present application can be flexibly set according to the specific application requirements. For example, it can be a blue LED chip 20, or it can be set to an ultraviolet LED chip, a green LED chip, a red LED chip, etc. according to the requirements. Of course, it can also be set to a combination of at least two of the various colors of LED chips 20 in the above examples according to the requirements. The LED chips 20 in the embodiment of the present application can be distinguished by size as Mini LED (Mini Light-Emitting Diode) chips, Micro LED (Micro Light Emitting Diode) chips or ordinary large-size LED chips. According to the electrode distribution of the LED chip 20, they can all be upright LED chips, flip-chip LED chips or vertical LED chips. They can be flexibly set according to the application requirements and have good versatility.

[0058] Please refer to FIG3 , which is a schematic diagram of the structure of the LED chip provided in an embodiment of the present application.

[0059] In some embodiments, each lead frame 10 includes a substrate 11 and a support member 12. Multiple substrates 11 are connected along a first direction X. Each substrate 11 and a support member 12 form a receiving groove 13. The support member 12 is provided with a limiting groove 121. The limiting groove 121 can be provided on a side of the support member 12 away from the receiving groove 13. Each lens 30 includes a limiting portion 32 that can be engaged with the limiting groove 121.

[0060] In order to achieve a one-to-one correspondence between the plurality of lead frames 10 and the plurality of lenses 30, the support member 12 is provided with a limiting groove 121 for engaging with the lens 30. In some cases, the support member 12 may be provided with a limiting portion 32, and the lens 30 may be provided with a limiting groove 121, and the limiting portion 32 may be engaged with the limiting groove 121.

[0061] It is understandable that if the lead frame 10 is a planar structure and the LED chip 20 needs to be set on the optical axis of the lens 30, that is, the lens 30 needs to be set directly above the LED chip 20, it is more difficult for the lens 30 to find the correct position due to the lack of a benchmark or reference object.

[0062] Therefore, in order to prevent mistakes and improve installation efficiency, a support member 12 is provided on the substrate 11. The support member 12 protrudes from one side of the substrate 11. The support member 12 includes a first connecting portion and a second connecting portion. The first connecting portion is connected to the second connecting portion, the first connecting portion is connected to the substrate 11, and the second connecting portion is connected to the side of the first connecting portion away from the substrate 11. The first connecting portion and the second connecting portion are both axially symmetrical structures. The symmetry axis of the first connecting portion perpendicular to the substrate 11 and the symmetry axis of the second connecting portion perpendicular to the substrate 11 are collinear. The orthographic projection of the second connecting portion on the substrate 11 is located in the orthographic projection of the first connecting portion on the substrate 11. The first connecting portion and the second connecting portion enclose a limiting groove 121, which is symmetrically arranged around the accommodating groove 13. The side of the first connecting portion away from the substrate 11 forms the bottom surface 34 of the limiting groove 121, and the side surface of the second connecting portion forms the side surface of the limiting groove 121.

[0063] Accordingly, the lens 30 has a stopper 32 that matches the shape of the stopper groove 121, i.e., the stopper 32 engages with the stopper groove 121. Through this structural concave-convex fit, the lens 30 can be quickly aligned with the lead frame 10, improving the alignment accuracy between the light-emitting surface of the LED chip 20 and the optical axis of the lens 30, increasing assembly yield and improving installation efficiency.

[0064] In other words, the lens 30 includes a main body 31 and a limiting portion 32 , wherein the limiting portion 32 extends from the main body 31 toward the substrate 11 . The limiting portion 32 matches the shape of the limiting groove 121 .

[0065] 4 is a schematic diagram of a second process flow of the method for preparing an LED chip according to an embodiment of the present application. Before providing the lens assembly 300 , the method for preparing the LED device 1000 further includes: coating adhesive glue 60 on the wall of the limiting groove 121 .

[0066] After the lens assembly 300 is covered on the lead frame assembly 100, the preparation method of the LED device 1000 also includes curing the adhesive glue 60 to form an adhesive layer between the limiting portion 32 and the groove wall of the limiting groove 121 to fix the relative position of the lens 30 and the corresponding LED chip 20.

[0067] In the embodiment of the present application, the lens 30 can be fixed on the lead frame 10 by an adhesive layer, so that the LED chip 20 can be completely sealed inside the lens 30, isolating the LED chip 20 from contact with the external environment, thereby protecting the LED chip 20. The adhesive layer can fix the relative positions of the lead frame 10, the LED chip 20, and the lens 30. In this embodiment, the specific material of the adhesive layer is not limited. The absolute value of the difference between the refractive index of the adhesive layer and the refractive index of the lens 30 is less than or equal to 2, that is, the difference between the refractive index of the adhesive layer and the refractive index of the lens 30 is small to ensure uniformity during light propagation. For example, the refractive index of the adhesive layer is greater than the refractive index of the lens 30, such as 0.9, 1.15, 1.2, 1.5, etc.; for example, the refractive index of the adhesive layer is less than the refractive index of the lens 30, such as 0.9, 1.15, 1.2, 1.5, etc.; for example, the refractive index of the adhesive layer is equal to the refractive index of the lens 30.

[0068] In some embodiments, a positive electrode and a negative electrode are also provided on each lead frame 10. After providing multiple LED chips 20, the preparation method of the LED device 1000 also includes connecting the positive electrode to the positive terminal of the LED chip 20, and electrically connecting the negative electrode of the lead frame 10 to the negative terminal of the LED chip 20.

[0069] The above steps are the wire bonding process. The lead frame 10 can play a supporting and mounting role. The lead frame 10 is plated with a first conductive layer and a second conductive layer, which can be used as a positive electrode (positive electrode pad) and a negative electrode (negative electrode pad), respectively, for being electrically connected to an external power supply device. The LED chip 20 is used to emit light and serve as a light source. The positive electrode and the negative electrode of the LED chip 20 are electrically connected to the positive electrode and the negative electrode, respectively. Specifically, in the embodiment of the present application, the LED device 1000 also includes two metal bonding wires 70, wherein the two ends of one metal bonding wire 70 are respectively used to connect the positive electrode and the positive electrode of the LED chip 20, and the two ends of the other metal bonding wire 70 are respectively used to connect the negative electrode and the negative electrode of the LED chip 20, thereby realizing circuit connectivity between the LED chip 20 and the positive electrode and the negative electrode, and realizing circuit conduction of the LED chip 20.

[0070] Among them, please continue to refer to Figure 4. In some scenarios, the preparation method of the LED device 1000 mainly includes the following six steps. The first step is the crystal fixing step, specifically, fixing the LED chip 20 assembly to the lead frame assembly 100 through the crystal fixing glue. The second step is the wire bonding step, specifically, the metal bonding wire 70 connects the positive and negative poles of the LED chip 20 with the positive and negative poles of the lead frame 10 to form electrical conduction. The third step is the glue dispensing step, in which an appropriate amount of glue mixed with phosphor or transparent glue is dispensed into the receiving groove 13 of the lead frame 10 through a glue dispenser. The fourth step is the step of applying glue 60 to the lens 30, in which an appropriate amount of glue 60 is applied around the receiving groove 13 of the LED lead frame 10 to prepare for bonding the lens 30. The fifth step involves bonding the entire lens 30 assembly, aligning and bonding the lens assembly 300 to the lead frame assembly 100. To ensure precise bonding positioning, a retaining groove 121 is provided on the lead frame 10 to align with the retaining portion 32 of the lens 30. The sixth step involves punching and blanking, using a punching die to separate the interconnecting material between the lead frame 10 array and the lens 30 array. The resulting individual LED chips 20 with lenses 30, or LED devices 1000, are then tested and taped for assembly into the backlight module SMT process.

[0071] In the preparation method of the LED device 1000 provided in the embodiment of the present application, a lead frame assembly 100 is first provided, and the lead frame assembly 100 includes a plurality of lead frames 10 connected in sequence; then a plurality of LED chips 20 are provided; each LED chip 20 is fixed on a lead frame 10; then a lens assembly 300 is provided, and the lens assembly 300 includes a plurality of lenses 30 connected in sequence; secondly, the lens assembly 300 is covered on the lead frame assembly 100, and the plurality of lenses 30 correspond one-to-one to the plurality of lead frames 10, and each lens 30 is covered on an LED chip 20; finally, the lead frame assembly 100 and the lens assembly 300 are cut to separate the plurality of lead frames 10 and the plurality of lenses 30 connected in sequence. It can be seen that the present application first matches multiple lead frames 10 connected to each other with multiple lenses 30 connected to each other one by one, and then cuts the lead frame assembly 100 and the lens assembly 300 to form multiple independent LED devices 1000, thereby reducing the process of mounting lenses 30 on multiple LED chips 20 one by one, and greatly improving the efficiency of mounting lenses 30.

[0072] Continuing with Figures 1 to 4 , the present invention also provides an LED device 1000 , which is fabricated using the method for fabricating the LED device 1000 described in the aforementioned embodiment. The LED device 1000 includes a lead frame 10 , an LED chip 20 , and a lens 30 . Each LED chip 20 is secured to the lead frame 10 , and the lens 30 covers the LED chip 20 and is connected to the lead frame 10 .

[0073] In some embodiments, the lead frame 10 includes a substrate 11 and a support member 12. The substrate 11 and the support member 12 enclose a receiving groove 13. The support member 12 is provided with a limiting groove 121. The LED chip 20 is disposed within the receiving groove 13. The lens 30 has a limiting portion 32 that engages with the limiting groove 121 to fix the relative position of the lens 30 and the LED chip 20. In some cases, the limiting portion 32 may be provided on the support member 12, and the limiting groove 121 may be provided on the lens 30, and the limiting portion 32 may engage with the limiting groove 121.

[0074] It is understandable that if the lead frame 10 is a planar structure and the LED chip 20 needs to be set on the optical axis of the lens 30, that is, the lens 30 needs to be set squarely to the LED chip 20, it is more difficult for the lens 30 to find the correct position due to the lack of a benchmark or reference object.

[0075] Therefore, in order to prevent mistakes and improve installation efficiency, a support member 12 is provided on the substrate 11. The support member 12 protrudes from one side of the substrate 11, and the support member 12 and the substrate 11 enclose a receiving groove 13. The support member 12 includes a first connecting portion and a second connecting portion. The first connecting portion is connected to the second connecting portion, the first connecting portion is connected to the substrate 11, and the second connecting portion is connected to the side of the first connecting portion away from the substrate 11. The first connecting portion and the second connecting portion are both axially symmetrical structures. The symmetry axis of the first connecting portion perpendicular to the substrate 11 and the symmetry axis of the second connecting portion perpendicular to the substrate 11 are collinear. The orthographic projection of the second connecting portion on the substrate 11 is located within the orthographic projection of the first connecting portion on the substrate 11. The first connecting portion and the second connecting portion enclose a limiting groove 121. In other words, the side of the first connecting portion away from the substrate 11 forms the bottom surface 34 of the limiting groove 121, and the side surface of the second connecting portion forms the side surface of the limiting groove 121.

[0076] Accordingly, the lens 30 has a stopper 32 extending from the lens 30 toward the lead frame 10. The stopper 32 matches the shape of the stopper groove 121. This structural fit ensures that the lens 30 is accurately aligned with the lead frame 10, preventing errors and improving installation efficiency.

[0077] The LED device 1000 further includes an encapsulating adhesive layer 40 disposed within the receiving groove 13 and covering the LED chip 20. It is understood that the encapsulating adhesive layer 40 can be used to seal and encapsulate the LED chip 20. The encapsulating adhesive layer 40 can be configured with a fluorescent adhesive layer of a corresponding color based on specific luminous color requirements. The encapsulating adhesive layer 40 can be a transparent silicone adhesive layer, a transparent silicone resin adhesive layer, or a transparent epoxy resin adhesive layer. Silicone, silicone resin, or epoxy resin are all transparent adhesive materials that can prevent interference with the light emitted by the LED chip 20.

[0078] The LED device 1000 further includes phosphor particles 50, which are dispersed in the encapsulating adhesive layer 40. The second transparent adhesive layer can be disposed in the receiving groove 13 and coated on the outside of the LED chip 20, and the phosphor particles 50 are disposed in the encapsulating adhesive layer 40. It is understandable that the encapsulating adhesive layer 40 can serve as a base material layer, and the color and proportion of the phosphor particles 50 can be adjusted according to specific luminous chromaticity requirements. Specifically, by adding phosphor particles 50 of a specific proportion to the transparent adhesive and stirring them evenly to form a mixture, the mixture is applied to the receiving groove 13 and coated on the outside of the LED chip 20, and then the mixture is dried and solidified to form an encapsulating adhesive layer 40 on the outside of the LED chip 20, and the phosphor particles 50 are disposed in the encapsulating adhesive layer 40. In this way, the LED chip 20 can be protected, and the chromaticity of the light emitted by the LED chip 20 can be adjusted by the phosphor particles 50 to obtain the luminous requirements required for production.

[0079] In addition, adding fluorescent powder to one of the silicone transparent adhesive layer, silicone resin transparent adhesive layer or epoxy resin transparent adhesive layer can ensure the normal dimming of the fluorescent powder, and can play a good sealing role with good insulation effect, which can ensure the insulation and sealing effect of the LED chip 20, ensure the quality of the finished product of the LED device 1000, and ensure the safety of the finished product of the LED device 1000. In addition, silicone, silicone resin or epoxy resin is inexpensive and suitable for industrial production.

[0080] The lens 30 has a top surface 33 and a bottom surface 34, with a stopper 32 disposed on the bottom surface 34. The bottom surface 34 is provided with a light source cavity 341 for accommodating an LED light source. The lens 30 has an optical axis, the line along which the optical axis lies being the axis of rotational symmetry between the lens 30 and the light source cavity 341. The inner surface of the light source cavity 341 serves as the light incident surface of the lens 30, while the top surface 33 serves as the light exiting surface of the lens 30. The light source cavity 341 is in communication with the receiving slot 13.

[0081] The main body 31 of the lens 30 has a top surface 33 and a bottom surface 34, and the limiting portion 32 is connected to the bottom surface 34; the bottom surface 34 is provided with a light source cavity 341 for accommodating an LED light source; the main body 31 has an optical axis, and the straight line where the optical axis lies is the rotational symmetry axis of the main body 31 and the light source cavity 341. The inner surface of the light source cavity 341 is configured as the light incident surface 342 of the main body 31, and the top surface 33 is configured as the light emitting surface of the main body 31; the light source cavity 341 is connected to the accommodating groove 13. The light source cavity 341 can be in the shape of an arch. It is worth noting that in order to meet the needs of different light types, the diameter and height of the light incident surface 342, the light emitting surface, and the main body 31 can be optimized and designed in a targeted manner, and this optimized design is also included in the protection scope of the embodiments of the present application.

[0082] In the embodiment of the present application, the light source cavity 341 is an inverted groove, the notch of which is located on the bottom surface 34 of the lens 30 (the side close to the lead frame 10). When the lens 30 is aligned with the lead frame 10, the light source cavity 341 covers the LED chip 20.

[0083] It is worth noting that in the embodiment of the present application, there is no restriction on the specific shape of the light source cavity 341. Of course, in order to further improve the overall light mixing and light emission effect of the lens 30, at least a portion of the inner wall of the light source cavity 341 can be set to a rough surface. Optionally, in order to further improve the light emission effect of the lens 30, the central area of ​​the top surface 33 of the lens 30 (the side away from the lead frame 10) is further provided with a recessed portion, and the recessed portion can be rotationally symmetrical with the optical axis as the axis of symmetry. By setting the recessed portion, it is possible to avoid the light emitted by the LED chip 20 from being concentrated in the central area of ​​the top surface 33 of the lens 30, thereby further improving the uniformity of the overall light emission of the lens 30.

[0084] In some embodiments, in order to fix the relative positions of the lead frame 10, the LED chip 20, and the lens 30, the LED device 1000 further includes an adhesive layer, which is disposed between the limiting portion 32 and the wall of the limiting groove 121. In this embodiment, the specific material of the adhesive layer is not limited. The absolute value of the difference between the refractive index of the adhesive layer and the refractive index of the lens 30 is less than or equal to 2. In other words, the difference between the refractive index of the adhesive layer and the refractive index of the lens 30 is small, so as to ensure uniformity during light propagation. For example, the refractive index of the adhesive layer is greater than the refractive index of the lens 30, such as 0.9, 1.15, 1.2, 1.5, etc.; for example, the refractive index of the adhesive layer is less than the refractive index of the lens 30, such as 0.9, 1.15, 1.2, 1.5, etc.; for example, the refractive index of the adhesive layer is equal to the refractive index of the lens 30.

[0085] In some embodiments, the material of the lens 30 is silicone, so the lens 30 can be prepared by molding and other processes, which can achieve large-scale production with high efficiency.

[0086] In some embodiments, the lead frame 10 has a positive electrode and a negative electrode. The positive electrode is connected to the positive terminal of the LED chip 20, and the negative electrode of the lead frame 10 is electrically connected to the negative terminal of the LED chip 20. It is understood that the lead frame 10 can serve as a supporting installation. The lead frame 10 is plated with a first conductive layer and a second conductive layer, which can serve as a positive electrode (positive electrode pad) and a negative electrode (negative electrode pad), respectively, for electrically connecting to an external power supply device. The LED chip 20 is used to emit light and serves as a light source. The positive electrode and the negative electrode of the LED chip 20 are electrically connected to the positive electrode and the negative electrode, respectively. Specifically, in the embodiment of the present application, the LED device 1000 further includes two metal bonding wires 70, wherein the two ends of one metal bonding wire 70 are respectively used to connect the positive electrode and the positive electrode of the LED chip 20, and the two ends of the other metal bonding wire 70 are respectively used to connect the negative electrode and the negative electrode of the LED chip 20, thereby achieving circuit connectivity between the LED chip 20 and the positive electrode and the negative electrode, thereby achieving circuit conduction of the LED chip 20.

[0087] The present application also provides a light bar, comprising a circuit board and LED devices 1000 electrically connected to the circuit board. The LED devices 1000 may be LED devices 1000 prepared using the method for preparing an LED device in the above embodiment, or may be LED devices 1000 in the above embodiment. The LED devices 1000 may be arranged in an array on the circuit board.

[0088] The embodiment of the present application further provides a backlight module, comprising the LED device 1000 in the above embodiment. The backlight module is also called a light-emitting device or a light-emitting component.

[0089] In some embodiments, the backlight module is a direct-lit backlight module or an edge-lit backlight module. The backlight module further includes a diffuser disposed between the reflector and the optical film, and the LED device 1000 is disposed between the reflector and the diffuser. The backlight module further includes a light guide plate disposed between the reflector and the optical film, and the LED device 1000 is located on the side wall of the back plate at the side end face of the light guide plate. Those skilled in the art may select different backlight modules based on actual production conditions.

[0090] Among them, the optical film may include a diffuser, a prism, a composite prism, a microlens 30 array film, and / or a polarized light brightening film, so that the light emitted by the LED device 1000 can be further coupled to form a surface light source. After the surface light source is refracted by the prism, the light is concentrated on the display panel, thereby enhancing the front display brightness of the display device.

[0091] The present application also provides a display device comprising the backlight module of the aforementioned embodiment. The display device may be a liquid crystal display device. The display device includes a housing, a liquid crystal module disposed within the housing, and a backlight module. The light generated by the backlight module is used to illuminate the liquid crystal module. The backlight module is the backlight module of the aforementioned embodiment. Because the backlight module utilizes all of the technical solutions of the aforementioned embodiment, it possesses at least all of the beneficial effects brought about by the technical solutions of the aforementioned embodiment, and no further details will be given here.

[0092] In some cases, the display device includes the backlight module in the above embodiment, and the display device can be any product or component with display function, such as a liquid crystal panel, electronic paper, OLED panel, LCD TV, LCD display, digital photo frame, mobile phone, tablet computer, etc.

[0093] In the LED device 1000 provided in the embodiment of the present application, the LED device 1000 includes a lead frame 10, an LED chip 20 and a lens 30. The lead frame 10 includes a substrate 11 and a support member 12. The substrate 11 and the support member 12 are arranged to form a receiving groove 13, and a limiting groove 121 is provided on the side of the support member 12 away from the receiving groove 13. The lens 30 has a limiting portion 32, and the limiting portion 32 is engaged with the limiting groove 121 to fix the relative position of the lens 30 and the LED chip 20. In the embodiment of the present application, the cooperation between the lead frame 10 and the lens 30 can achieve the accurate installation of the lens 30 on the LED chip 20. In the above embodiments, the description of each embodiment has its own emphasis. For the part that is not described in detail in a certain embodiment, please refer to the relevant description of other embodiments.

[0094] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include one or more features.

[0095] The above describes in detail the LED device, method for preparing the LED device, backlight module, and display device provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is intended only to facilitate understanding of the present application. Furthermore, those skilled in the art will appreciate that, based on the concepts of the present application, variations in the specific implementation methods and scope of application may occur. In summary, the contents of this specification should not be construed as limiting the present application.

Claims

1. An LED device, comprising: A lead frame, the lead frame comprising a substrate and a support member, the substrate and the support member are arranged to form a receiving groove, and a limiting groove is provided on the support member; An LED chip, wherein the LED chip is disposed in the receiving groove; The lens comprises a limiting portion, and the limiting portion is engaged with the limiting groove.

2. The LED device according to claim 1, wherein: It also includes a packaging glue layer, which is arranged in the containing groove and covers the LED chip.

3. The LED device according to claim 2, wherein: The packaging adhesive layer is one of a silicone transparent adhesive layer, a silicone resin transparent adhesive layer or an epoxy resin transparent adhesive layer.

4. The LED device according to claim 2, wherein: It also includes fluorescent powder particles, which are dispersed in the packaging glue layer.

5. The LED device according to claim 1, wherein: The support member includes a first connecting portion and a second connecting portion, the first connecting portion is connected to the second connecting portion, the first connecting portion is connected to the substrate, the second connecting portion is connected to a side of the first connecting portion away from the substrate, and the first connecting portion and the second connecting portion enclose the limiting groove.

6. The LED device according to claim 1, wherein: The lens has a top surface and a bottom surface, and the limiting portion is arranged on the bottom surface; the bottom surface is provided with a light source cavity, and the light source cavity is used to accommodate the LED light source; the lens has an optical axis, and the straight line where the optical axis is located is the rotational symmetry axis of the lens and the light source cavity; The inner surface of the light source cavity is configured as a light incident surface of the lens, and the top surface is configured as a light emitting surface of the lens; The light source cavity is communicated with the accommodating groove.

7. The LED device according to claim 6, wherein: At least a portion of the inner wall of the light source cavity is a rough surface.

8. The LED device according to claim 6, wherein: A concave portion is also provided in the central area of ​​the top surface, and the concave portion is rotationally symmetrical with the optical axis as the axis of symmetry.

9. The LED device according to claim 1, wherein: It also includes an adhesive layer, which is arranged between the limiting portion and the groove wall of the limiting groove.

10. The LED device according to claim 9, wherein: An absolute value of a difference between a refractive index of the adhesive layer and a refractive index of the lens is less than or equal to 2.

11. The LED device according to claim 1, wherein: The lead frame has a positive electrode and a negative electrode. The positive electrode is connected to the positive electrode terminal of the LED chip, and the negative electrode of the lead frame is electrically connected to the negative electrode terminal of the LED chip.

12. The LED device according to claim 1, wherein: The material of the lens is silicone.

13. An LED device, comprising: A lead frame, the lead frame comprising a substrate and a support member, the substrate and the support member are arranged to form a receiving groove, and a limiting portion is arranged on the support member; An LED chip, wherein the LED chip is disposed in the receiving groove; The lens has a limiting groove, and the limiting portion is engaged with the limiting groove.

14. A method for preparing an LED device, which is used for an LED device, the method for preparing an LED device comprising: A lead frame assembly is provided, the lead frame assembly comprising a plurality of lead frames, the plurality of lead frames are sequentially connected along a first direction, the lead frame comprises a substrate and a support member, the substrate and the support member are surrounded to form a receiving groove, and a limiting groove is provided on the support member; Provide multiple LED chips; Each of the LED chips is arranged in one of the receiving grooves, and the plurality of lead frames correspond to the plurality of LED chips one by one; Providing a lens assembly, the lens assembly comprising a plurality of lenses, the plurality of lenses are sequentially connected along the first direction, and the lenses have a limiting portion; The limiting part is clamped with the limiting groove, the multiple lenses correspond to the multiple lead frames one by one, and each lens cover is arranged on one LED chip; The lead frame assembly and the lens assembly are cut along a second direction to separate a plurality of the lead frames and a plurality of the lenses connected in sequence, wherein the first direction intersects with the second direction.

15. The method for preparing an LED device according to claim 14, wherein: Before providing the lens assembly, the method for preparing the LED device further includes: coating adhesive glue on the groove wall of the limiting groove; After the lens assembly is covered on the lead frame assembly, the method for preparing the LED device further includes: curing the adhesive glue to form an adhesive layer between the limiting portion and the groove wall of the limiting groove.

16. The method for preparing an LED device according to claim 14, wherein: Each of the lead frames is also provided with a positive electrode and a negative electrode. After providing a plurality of LED chips, the method for preparing the LED device further includes connecting the positive electrode to the positive terminal of the LED chip, and electrically connecting the negative electrode of the lead frame to the negative terminal of the LED chip.

17. The method for preparing an LED device according to claim 14, wherein: After each of the LED chips is arranged in one of the receiving grooves, the method for preparing the LED device further includes: adding phosphor particles into transparent glue, stirring evenly to form a mixture, applying the mixture into the receiving groove to cover the outside of the LED chip, and then curing the mixture to form a packaging glue layer on the outside of the LED chip, wherein the phosphor particles are arranged in the packaging glue layer.

18. A backlight module, comprising an LED device, wherein the LED device comprises: A lead frame, the lead frame comprising a substrate and a support member, the substrate and the support member are arranged to form a receiving groove, and a limiting groove is provided on the support member; An LED chip, wherein the LED chip is disposed in the receiving groove; The lens comprises a limiting portion, and the limiting portion is engaged with the limiting groove.

19. A backlight module comprising an LED device, wherein the preparation method of the LED device comprises: A lead frame assembly is provided, the lead frame assembly comprising a plurality of lead frames, the plurality of lead frames are sequentially connected along a first direction, the lead frame comprises a substrate and a support member, the substrate and the support member are surrounded to form a receiving groove, and a limiting groove is provided on the support member; Provide multiple LED chips; Each of the LED chips is arranged in one of the receiving grooves, and the plurality of lead frames correspond to the plurality of LED chips one by one; Providing a lens assembly, the lens assembly comprising a plurality of lenses, the plurality of lenses are sequentially connected along the first direction, and the lenses have a limiting portion; The limiting part is clamped with the limiting groove, the multiple lenses correspond to the multiple lead frames one by one, and each lens cover is arranged on one LED chip; The lead frame assembly and the lens assembly are cut along a second direction to separate a plurality of the lead frames and a plurality of the lenses connected in sequence, wherein the first direction intersects with the second direction.

20. A display device, comprising a backlight module, wherein the backlight module comprises an LED device, and the LED device comprises: A lead frame, the lead frame comprising a substrate and a support member, the substrate and the support member are arranged to form a receiving groove, and a limiting groove is provided on the support member; An LED chip, wherein the LED chip is disposed in the receiving groove; The lens comprises a limiting portion, and the limiting portion is engaged with the limiting groove.

Images