Substrate processing device

Abstract

Provided in the present invention is a substrate processing device, comprising: a reaction chamber; a plurality of substrate supporting members, which are used for bearing a substrate, and which are mounted in the reaction chamber; a transfer assembly, which comprises a motor, a conveying member capable of rotating under the driving action of the motor, and a suspension rod located between the motor and the conveying member, wherein the conveying member is hung in the reaction chamber by means of the suspension rod, and the motor drives the conveying member to rotate such that the conveying member engages with the substrate and transfers the substrate, with which the conveying member engages, between the plurality of substrate supporting members; and a sealing-gas line, which is configured to introduce sealing gas into a gap between the suspension rod and the reaction chamber in order to seal the gap, the suspension rod being inserted into the reaction chamber. Sealing the gap with the sealing gas prevents reaction gas in the reaction chamber from entering inside a corrugated tube through the gap and forming a coating, and subsequently resulting in particles falling onto a substrate during the frequent expansion and contraction of the corrugated tube.

Description

Substrate processing equipment Technical Field

[0001] The invention belongs to the technical field of semiconductors and relates to a substrate processing device. Background Art

[0002] Throughout the entire substrate manufacturing process, the substrate undergoes deposition, etching, baking, and curing inside a chamber. In the vacuum processing chamber of PECVD (plasma enhanced chemical vapor deposition), a stack of layers of different materials is deposited onto the substrate. The chamber must maintain a low vacuum, and reactive gases are continuously introduced into the chamber, allowing the gases to react inside the chamber and deposit a thin film on the substrate surface. However, the PECVD process presents the following problems:

[0003] While introducing the reaction gas into the chamber, the unreacted gas in the chamber needs to be continuously discharged through the gas outlet, so that the gas inside the chamber is in a state of continuous flow, so that the thin film is quickly deposited on the substrate surface. However, there are still particles that are not carried away by the gas in time, which can easily contaminate the substrate surface.

[0004] Therefore, it is necessary to provide a substrate processing device.

[0005] Summary of the Invention

[0006] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a substrate processing device for solving the problem of particles contaminating the surface of the substrate in the prior art.

[0007] To achieve the above-mentioned purpose and other related purposes, a substrate processing device includes: a reaction chamber; a plurality of substrate supports for carrying substrates and installed in the reaction chamber; a transfer assembly including a motor, a conveying member rotating under the drive of the motor, and a hanging rod located between the motor and the conveying member, the conveying member being suspended in the reaction chamber by the hanging rod, the motor driving the conveying member to rotate so that the conveying member engages the substrate and transfers the engaged substrate between a plurality of substrate supports; a sealing gas pipeline configured to pass sealing gas into the gap between the hanging rod and the reaction chamber to seal the gap, wherein the hanging rod is inserted into the reaction chamber.

[0008] Optionally, the transfer assembly further includes a magnetic fluid, the motor is coupled to the transmission member through the magnetic fluid and the suspension rod, one end of the suspension rod is fixedly connected to the transmission member, and the other end is fixedly connected to the magnetic fluid.

[0009] Optionally, the magnetic fluid includes a shaft connected to the motor, and the other end of the shaft is fixedly connected to the suspension rod.

[0010] Optionally, the substrate processing device further comprises a bellows sleeved below the magnetic fluid, the sealing gas pipeline comprises an air inlet pipe connected to the bellows, and the sealing gas flows from the air inlet pipe through the bellows into the gap.

[0011] Optionally, the reaction chamber includes a mounting hole, the hanging rod passes through the mounting hole and is fixedly connected to the conveying member, and the gap is formed between the hanging rod and an inner wall of the mounting hole.

[0012] Optionally, the reaction chamber further includes a recess, the mounting hole is formed at the bottom of the recess, the bellows includes an upper flange and a lower flange located at both ends thereof, the upper flange is fixed to the magnetic fluid, and the lower flange is fixed to the bottom of the recess and is arranged around the mounting hole.

[0013] Optionally, the lower flange is formed with an air inlet, and the air inlet is connected to the air inlet pipe.

[0014] Optionally, the conveying member includes a central portion and a plurality of arms extending outwardly from the central portion, and ends of the arms are used to engage the substrate.

[0015] Optionally, the suspension rod is aligned and connected to the central portion.

[0016] Optionally, the transfer assembly further includes a bearing portion and a lifting power source for driving the transfer assembly to perform lifting motion relative to the reaction chamber, and the lifting power source is installed between the bearing portion and the reaction chamber.

[0017] Optionally, the motor is fixedly connected to the carrying portion, and when the carrying portion performs a lifting movement, the transmission member coupled to the motor performs a lifting movement simultaneously.

[0018] Optionally, the sealing gas is nitrogen.

[0019] As described above, in the substrate processing device of the present invention, the conveying member is suspended in the reaction chamber, and the gap between the suspension rod for suspending the conveying member and the reaction chamber is sealed by sealing gas to prevent the reaction gas from entering the gap and preventing the particles of the coating formed by the bellows from falling onto the substrate during the frequent expansion and contraction of the bellows. Therefore, the sealing gas can keep the inside of the bellows clean.

[0020] Summary of the Figures

[0021] FIG1 is a partial cross-sectional structural diagram of a substrate processing apparatus according to an embodiment of the present invention.

[0022] FIG2 is a schematic structural diagram of a transfer assembly in an embodiment of the present invention.

[0023] FIG3 is a schematic diagram of a conveying member of a transfer assembly in an avoidance position according to an embodiment of the present invention.

[0024] FIG4 is a diagram showing the working state of the conveying member in the embodiment of the present invention.

[0025] FIG5 is a schematic diagram of a bellows according to an embodiment of the present invention.

[0026] Preferred embodiments of the present invention

[0027] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different viewpoints and applications without departing from the spirit of the present invention.

[0028] For example, when describing the embodiments of the present invention, cross-sectional views of device structures may be partially enlarged to scale for ease of explanation. Furthermore, these schematic views are merely illustrative and should not limit the scope of the present invention. Furthermore, in actual manufacturing, three-dimensional dimensions, including length, width, and depth, should be included.

[0029] For ease of description, spatially relative terms such as "under," "below," "below," "below," "above," and "on" may be used herein to describe the relationship of one element or feature to other elements or features shown in the drawings. It will be understood that these spatially relative terms are intended to encompass orientations of the device in use or operation in addition to the orientation depicted in the drawings. Additionally, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers, or one or more intervening layers may be present. As used herein, "between" is inclusive of both endpoints.

[0030] In the context of the present application, a structure described as a first feature being "above" a second feature may include embodiments where the first and second features are formed in direct contact, and may also include embodiments where an additional feature is formed between the first and second features, such that the first and second features may not be in direct contact.

[0031] It should be noted that the illustrations provided in this embodiment are only used to schematically illustrate the basic concept of the present invention. Therefore, the illustrations only show components related to the present invention and are not drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component can be changed at will, and the component layout type may also be more complicated.

[0032] As shown in FIG. 1 , this embodiment provides a substrate processing apparatus, including a reaction chamber 100 and a transfer assembly 200 for transferring a substrate W in the reaction chamber 100 .

[0033] The reaction chamber 100 includes a chamber body 110 (see FIG3 ), and a cover 120 mounted on the chamber body 110 and forming a closed space 112 with the chamber body 110. In this embodiment, the cover 120 and the chamber body form a closed space 112. The shape and size of the cover 120 are not specifically limited, and any cover that can form a closed space with the chamber body is acceptable. For example, in one embodiment, the cover 120 is an upper half shell, and forms a closed space 112 with the chamber body as a lower shell. In another embodiment, the chamber body is a container that defines a space and has an opening, as shown in FIG1 . The cover 120 can seal the opening of the chamber body 110 to form a closed space 112. Here, the reaction chamber 100 needs to be made into a separate structure to facilitate the installation and maintenance of the structures installed inside the reaction chamber (such as the conveyor 240 and the substrate support 140). In addition, the reaction process of the substrate W is completed in the closed space 112 formed by the cover 120 and the chamber body 110. The cover 120 includes a mounting portion 121 extending through its upper and lower surfaces. The mounting portion 121 includes a interconnected recess 1211 and a mounting hole 1212. Specifically, the recess 1212 is formed inward from the surface of the cover 120, and the mounting hole 1212 is formed at the bottom of the recess 1211 and extends through the cover 120. Referring to Figures 3 and 4 , several substrate supports 140 are also provided within the reaction chamber 100 to support substrates W.

[0034] 1 , the transfer assembly 200 includes a motor 210, a transmission member 240 driven to rotate by the motor 210, a magnetic fluid 220 connected between the motor 210 and the transmission member 240, and a suspension rod 230. The magnetic fluid 220 includes a flange 222 extending outward from its outer surface and a shaft 221 capable of rotating relative to the flange 222. The motor 210 is coupled to the transmission member 240 via the shaft 221 and the suspension rod 230. Specifically, the motor 210 is fixedly connected to the shaft 221 of the magnetic fluid 220, and the suspension rod 230 is fixedly connected at one end to the shaft 221 of the magnetic fluid 220 and at the other end to the transmission member 240. Thus, the transmission member 240 can rotate under the drive of the motor 210. 2 , the transfer member 240 includes a central portion 241 aligned with and connected to the suspension rod 230, and a plurality of arms 242 extending outward from the central portion 241. The ends of the arms 242 are formed with loops, hooks, forks, or other designs for engaging the substrate W. In embodiments of the present technology, any number of arms 242 may be included, and the number of arms 242 may be the same as the number of substrate supports 140 in the chamber 110. In the embodiment shown in FIG. 2 to FIG. 4 , for three substrate supports 140, the transfer member 240 includes three arms 242. In embodiments of the present technology, the transfer assembly 200 may engage and / or transfer one, two, three, or any number of substrates W.

[0035] The transfer member 240 rotates to engage a substrate W and transfer the substrate W between the plurality of substrate supports 140. The transfer member 240 can engage with the substrate from above or below, or engage with the outer edge of the substrate and rotate to transfer the substrate W between the plurality of substrate supports 140. As shown in FIG3 , the transfer member 240 is in a stowed position, with the arms 242 of the transfer member 240 positioned between the substrate supports 140. This allows a substrate W to be transferred from outside the chamber into the chamber and placed on a substrate support 140, or allows the substrate W to undergo surface treatment (e.g., deposition of a material on the substrate W). Exemplarily, when the transfer member 240 is in the stowed position, a substrate W is transferred from outside the chamber to one of the substrate supports 140 within the chamber, and then transferred to another substrate support 140 by the transfer member 240. Specifically, in one embodiment, referring to FIG3 , a substrate W is transferred from the opening 111 of the chamber to the first substrate support 140 a within the chamber. The transfer member 240 rotates along its axis from its avoidance position to engage the substrate W on the first substrate support 140 a and transfer it to the second substrate support 140 b (see FIG4 for a working state diagram). In this manner, the transfer member 240 engages one, two, or any number of substrates W and transfers the substrates W between the substrate supports 140 a - 140 c.

[0036] 1 and 2 , the transfer assembly 200 further includes a carrier 270 and a lifting power source 260 mounted on the carrier 270. The lifting power source 260 is used to drive the transfer assembly 200 to move up and down relative to the reaction chamber 100. Exemplarily, the lifting power source 260 drives the carrier 270 to move up and down relative to the reaction chamber 100, and the carrier 270 drives the conveyor 240 coupled to the carrier 270 to move up and down. Specifically, the motor 210 of the transfer assembly 200 is fixedly connected to the carrier 270, and the conveyor 240 is coupled to the motor 210. Thus, when the carrier 270 moves up and down, the conveyor 240 can also move up and down. In the embodiment shown in FIG3 and FIG4 , the transfer assembly 200 drives the substrate W to transfer between the multiple substrate supports 140a-140c. Specifically, referring to FIG3 , the transfer member 240 rotates from the avoidance position to below the substrate W on the first substrate support 140 a and engages with the substrate W. Referring to FIG1 and FIG2 , the lifting power source 260 then drives the supporting portion 270 to ascend, thereby lifting the transfer member 240 and the substrate W on the first substrate support 140 a together, separating the substrate W from the first substrate support 140 a. Referring to FIG4 , the transfer member 240 rotates to the second substrate support 140 b. The lifting power source 260 drives the supporting portion 270 to descend, thereby lowering the transfer member 240 and the substrate W together, placing the substrate W on the second substrate support 140 b. At this point, the substrate W is transferred from the first substrate support 140 a to the second substrate support 140 b. Here, when transferring the substrate W between the substrate supports 140 a - 140 c , it is necessary to lift the substrate W to separate from the substrate supports 140 a - 140 c . This prevents damage to the substrate W caused by friction between the substrate supports 140 a - 140 c during transfer. In an embodiment of the present technology, the lifting power source 260 may be an electric cylinder. Three electric cylinders are evenly distributed between the carrier 270 and the lid 120 of the reaction chamber 100 , ensuring uniform force on the carrier 270 and the lid 120 of the reaction chamber 100 .

[0037] The substrate processing apparatus also includes a bellows 600 positioned beneath the magnetic fluid 220. As shown in Figures 1 and 5 , the upper flange 601 of the bellows 600 is fixedly connected to the flange 222 of the magnetic fluid 220. The lower flange 602 of the bellows 600 is fixedly connected to the bottom of the recess 1211 of the mounting portion 121 and is positioned around the mounting hole 1212. A suspension rod 230 extends through the mounting hole 1212, with one end extending into the bellows 600 and fixedly connected to the axis 221 of the magnetic fluid 220. The other end is aligned and fixedly connected to the center portion 241 of the conveyor 240. As the transfer assembly 200 moves upward and downward, the bellows 600 expands and contracts accordingly. Referring to Figures 1 and 5 , a sealing gas pipeline, which delivers sealing gas to the gap, includes an inlet pipe 500 connected to the bellows 600. Specifically, the lower flange 602 of the bellows 600 is formed with an inlet port 603, which is connected to the inlet pipe 500. 1 , sealing gas flows from the air inlet pipe 500 through the bellows 600 and into the gap 800 between the suspension rod 230 and the lid 120. The sealing gas entering the air inlet pipe 500 may be nitrogen. A supply source C of the sealing gas line is connected to the bellows 600 via the air inlet pipe 500. The air inlet pipe 500 is also provided with an on / off valve A and a flow valve B to regulate and control the flow of the sealing gas. The gap 800 is located where the suspension rod 230 is inserted into the interior of the reaction chamber 100 (e.g., into the lid 120 or cavity 110). More specifically, the gap 800 is located between the suspension rod 230 and the inner wall of the mounting hole 1212. When the sealing gas enters the gap 800 between the suspension rod 230 and the inner wall of the mounting hole 1212, the gas fills the entire gap 800, forming a seal against the cavity 110, preventing particles in the bellows 600 from falling through the gap 800 onto the substrate within the cavity 110.

[0038] During the reaction process within the chamber, a small amount of reactant gas is introduced into the chamber 110, creating a low vacuum state. Simultaneously, unreacted gas within the chamber 110 is evacuated, maintaining a constant flow of reactant gas within the chamber 110. The exhaust port, through which the gas in the chamber 110 is evacuated, is positioned aligned with the central portion 241 of the conveyor 240, allowing a single exhaust port to simultaneously serve multiple substrates W, thereby avoiding the need for multiple exhaust ports to be aligned with each substrate. Consequently, the conveyor 240 is configured to be suspended within the chamber 110.

[0039] In the present invention, during the reaction process in the reaction chamber 100, the conveying member 240 is suspended in the cavity 110, and the gap 800 between the suspension rod 230 for suspending the conveying member 240 and the reaction chamber 100 is sealed by sealing gas to prevent the reaction gas from entering the gap 800 and preventing particles of the coating formed by the bellows 600 from falling onto the substrate during the frequent expansion and contraction of the bellows 600. Therefore, the sealing gas can keep the inside of the bellows clean.

[0040] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed herein are intended to be covered by the claims of the present invention.

Claims

1. A substrate processing device, characterized in that: include: a reaction chamber; A plurality of substrate supporting members, used for carrying substrates and installed in the reaction chamber; A transfer assembly, comprising a motor, a conveyor member rotating under the driving action of the motor, and a suspension rod located between the motor and the conveyor member, wherein the conveyor member is suspended in the reaction chamber by the suspension rod, and the motor drives the conveyor member to rotate so that the conveyor member engages with a substrate and transfers the engaged substrate between the plurality of substrate supporting members; The sealing gas pipeline is configured to pass the sealing gas into the gap between the suspension rod and the reaction chamber to seal the gap, wherein the suspension rod is inserted into the reaction chamber.

2. The substrate processing device according to claim 1, characterized in that: The transfer assembly further comprises a magnetic fluid, through which the motor is coupled to the transmission member through the suspension rod, one end of the suspension rod being fixedly connected to the transmission member, and the other end of the suspension rod being fixedly connected to the magnetic fluid.

3. The substrate processing device according to claim 2, characterized in that: The magnetic fluid comprises a shaft connected to the motor, and the other end of the shaft is fixedly connected to the suspension rod.

4. The substrate processing device according to claim 2, characterized in that: The substrate processing device further comprises a bellows sleeved under the magnetic fluid, the sealing gas pipeline comprises an air inlet pipe connected to the bellows, and the sealing gas flows from the air inlet pipe through the bellows into the gap.

5. The substrate processing device according to claim 4, characterized in that: The reaction chamber comprises a mounting hole, the hanging rod passes through the mounting hole and is fixedly connected to the conveying member, and the gap is formed between the hanging rod and the inner wall of the mounting hole.

6. The substrate processing device according to claim 5, characterized in that: The reaction chamber also includes a recess, the mounting hole is formed at the bottom of the recess, the bellows includes an upper flange and a lower flange located at both ends thereof, the upper flange is fixed to the magnetic fluid, and the lower flange is fixed to the bottom of the recess and is arranged around the mounting hole.

7. The substrate processing device according to claim 6, characterized in that: The lower flange is formed with an air inlet, and the air inlet is connected to the air inlet pipe.

8. The substrate processing apparatus according to claim 1, wherein: The conveyor comprises a central portion and a plurality of arms extending outwardly from the central portion, wherein the ends of the arms are used for engaging the substrate.

9. The substrate processing device according to claim 8, characterized in that: The suspension rod is aligned and connected with the central portion.

10. The substrate processing apparatus according to claim 1, wherein: The transfer assembly further includes a bearing portion and a lifting power source for driving the transfer assembly to perform lifting motion relative to the reaction chamber, and the lifting power source is installed between the bearing portion and the reaction chamber.

11. The substrate processing apparatus according to claim 10, wherein: The motor is fixedly connected to the bearing part, and when the bearing part performs a lifting movement, the transmission member coupled to the motor performs a lifting movement simultaneously.

12. The substrate processing apparatus according to claim 1, wherein: The sealing gas is nitrogen.

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