Substrate holding device

Abstract

Provided in the present invention is a substrate holding device, comprising: a cup configured to bear a substrate; a pressing disk configured to press against the back surface of the substrate to cause the substrate and the cup to be relatively fixed so as to hold the substrate; a pressing disk driving device connected to the pressing disk and driving the pressing disk to descend or ascend, such that the pressing disk presses the back surface of the substrate to clamp the substrate or the pressing disk moves away from the back surface of the substrate; and a sealing member arranged on the pressing disk and comprising: a fixing portion configured to fix the sealing member on the pressing disk, and a first sealing portion protruding downwards from the fixing portion, wherein the cross-sectional shape of the first sealing portion is the cross-sectional shape of a gap between the peripheral side of the pressing disk and the cup when the pressing disk abuts against the cup, and the first sealing portion abuts against an upper end surface of the cup when being pressed by the pressing disk, so as to define a sealing area. In the present invention, multiple seals are formed under the combined action of a first sealing portion, a second sealing portion and a third sealing portion of a sealing member, a sealing effect is further guaranteed, and then the electroplating quality is guaranteed.

Description

Substrate holding device Technical Field

[0001] The present invention belongs to the technical field of integrated circuit manufacturing, and in particular relates to a substrate holding device. Background Art

[0002] In the semiconductor integrated circuit manufacturing process, the chemical electroplating process of the substrate is an essential process for high-quality integrated circuits. In the chemical electroplating process, in order to achieve high-quality substrate electroplating, it is first necessary to ensure that there are no bubbles retained on the electroplating surface of the substrate after the substrate enters the electroplating solution. Once bubbles are retained on the electroplating surface of the substrate, many problems will arise. The area with bubbles on the substrate electroplating surface is not exposed to the electroplating solution, and electroplating will not occur in this area. The resulting electroplating defects may manifest as no electroplating or reduced electroplating thickness in the area with bubbles, depending on the time the bubbles stay on the substrate and the length of time the bubbles stay in this area. In an inverted (substrate electroplating surface facing down) configuration, buoyancy tends to pull bubbles upward onto the electroplating surface of the substrate. Bubbles are difficult to remove from the substrate surface because there is no relevant mechanism in the electroplating chamber to drive the bubbles to the edge of the substrate, and the edge of the substrate is the only path for bubbles to leave the substrate surface. Therefore, when the substrate holder is lowered into the plating solution, it is typically rotated while controlling the substrate to tilt at a certain angle before adjusting the substrate to a horizontal angle (parallel to the plating solution surface). This tilt angle allows air bubbles to escape and prevents them from being trapped on the plating surface of the substrate. When the substrate holder holds the substrate and places it in contact with the plating solution at an angle, the plating solution can easily enter the substrate holder through the gap between the pressure plate and the cup of the substrate holder and come into contact with the conductive area of ​​the substrate, causing a voltage increase during the electroplating process.

[0003] Summary of the Invention

[0004] In order to prevent the electroplating liquid from entering the substrate holding device through the gap between the peripheral side of the pressure plate and the upper end surface of the cup body when the substrate holding device fixes the substrate into the electroplating liquid, thereby affecting the electroplating quality, the present invention proposes a substrate holding device.

[0005] A substrate holding device, comprising:

[0006] a cup body configured to carry a substrate;

[0007] a pressure plate configured to press against the back surface of the substrate to fix the substrate relative to the cup body, so as to hold the substrate;

[0008] a pressure plate driving device connected to the pressure plate, the pressure plate driving device driving the pressure plate to descend or ascend so that the pressure plate is pressed against the back surface of the substrate to clamp the substrate or the pressure plate is moved away from the back surface of the substrate;

[0009] a sealing member, disposed on the pressure plate;

[0010] Wherein, the sealing element comprises:

[0011] a fixing portion configured to fix the sealing member to the pressure plate;

[0012] and a first sealing portion protruding downward from the fixing portion, wherein the cross-sectional shape of the first sealing portion is the cross-sectional shape of the gap between the peripheral side of the pressure plate and the cup body when the pressure plate abuts against the cup body, and the first sealing portion abuts against the upper end surface of the cup body when pressed by the pressure plate to define a sealing area.

[0013] According to a specific implementation of the embodiment of the present application, the sealing element is an elastomer.

[0014] According to a specific implementation of the embodiment of the present application, the sealing member further includes a second sealing portion extending downward and outward from an outer edge of the fixing portion.

[0015] According to a specific implementation of the embodiment of the present application, the lower end surface of the second sealing portion is lower than the lower end surface of the first sealing portion, and the second sealing portion abuts against the upper end surface of the cup body when pressed by the pressure plate to define a sealing area.

[0016] According to a specific implementation of the embodiment of the present application, when the second sealing portion abuts against the upper end surface of the cup body, part of the second sealing portion is pressed to a horizontal state, and the end of the second sealing portion is roughly flush with the edge of the cup body.

[0017] According to a specific implementation of the embodiment of the present application, the sealing member further includes a third sealing portion formed by protruding downward from the lower end surface of the sealing member; the third sealing portion is located between the first sealing portion and the second sealing portion.

[0018] According to a specific implementation of the embodiment of the present application, the lower end surface of the third sealing portion is lower than the lower end surface of the first sealing portion.

[0019] According to a specific implementation of the embodiment of the present application, the sealing member is arranged on the peripheral side of the pressure plate.

[0020] According to a specific implementation of the embodiment of the present application, the fixing part includes a limiting groove, the limiting groove is arranged on the inner side wall of the fixing part, and the outer side wall of the pressure plate is provided with a limiting protrusion, and the limiting groove matches the limiting protrusion to fix the seal on the peripheral side of the pressure plate.

[0021] According to a specific implementation of the embodiment of the present application, the top end of the fixing portion is clamped in a fixing groove provided on the lower end surface of the pressure plate.

[0022] According to a specific implementation of the embodiment of the present application, the pressure plate further includes a protective cover, which is formed on the edge of the pressure plate and surrounds the outer side of the pressure plate driving device.

[0023] According to a specific implementation of the embodiment of the present application, the sealing member is provided on the protective cover in the corresponding area of ​​the upper end surface of the cup body.

[0024] According to a specific implementation of the embodiment of the present application, a through hole is opened on the side wall of the pressure plate.

[0025] According to a specific implementation of the embodiment of the present application, the lower surface of the pressure plate is provided with a protrusion extending downward.

[0026] The substrate holding device of the present invention is provided by arranging a sealing member on the peripheral side of the pressure plate. The shape of the sealing member is the cross-sectional shape of the gap between the peripheral side of the pressure plate and the upper area of ​​the cup body. When the pressure plate and the cup body are in abutment with each other, the gap between the peripheral side of the pressure plate and the upper end face of the cup body is blocked to form a fluid seal, thereby achieving a better sealing effect, protecting the substrate, and improving the electroplating quality of the substrate.

[0027] At the same time, the seal is provided with multiple seals. When the pressure plate moves from the top plate toward the cup body, the second sealing part first comes into close contact with the upper end surface of the cup body, realizing the first seal. When the pressure plate continues to move toward the cup body, the lower end surface of the third sealing part comes into close contact with the upper end of the cup body, realizing the second seal. As the pressure plate continues to move toward the cup body, the first sealing part comes into contact with the upper end surface of the cup body and is pressed between the gaps, realizing the third seal. When the pressure plate abuts against the cup body, the vertical force from the pressure plate further compresses the seal to form a fluid seal. Multiple seals are formed under the joint action of the first, second, and third sealing parts of the seal. When the fluid seal is simultaneously achieved in different directions, in different forms, and at different action sites, the sealing effect is further guaranteed.

[0028] The third sealing portion and the second sealing portion are located on the outer peripheral side of the gap, and the defined sealing area is larger. At the same time, the third sealing portion and the second sealing portion contact the upper end surface of the cup body before the first sealing portion, which can ensure a better sealing effect.

[0029] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or will be understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures pointed out in the description and the drawings.

[0030] Summary of the Figures

[0031] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0032] FIG1 shows a schematic structural diagram of a substrate holding device according to an embodiment of the present invention;

[0033] FIG2 is a schematic diagram showing a partial structure of a sealing member according to an embodiment of the present invention;

[0034] FIG3 is a schematic structural diagram showing the relative positions of the sealing member and the pressure plate according to an embodiment of the present invention;

[0035] FIG4 shows a schematic diagram of the assembly structure of the seal and the pressure plate according to an embodiment of the present invention;

[0036] FIG5 is a schematic structural diagram showing a state of a sealing member when the pressure plate and the cup body abut against each other according to an embodiment of the present invention;

[0037] FIG6 shows another schematic structural diagram of a substrate holding device according to an embodiment of the present invention;

[0038] FIG7 is a schematic diagram showing a three-dimensional structure of a pressure plate with a through hole according to an embodiment of the present invention;

[0039] FIG8 shows a bottom view of a pressure plate according to an embodiment of the present invention; and

[0040] FIG9 shows a schematic diagram of a bump structure according to an embodiment of the present invention.

[0041] Preferred embodiments of the present invention

[0042] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0043] The present invention proposes a substrate holding device. Please refer to Figure 1, which shows a schematic structural diagram of a substrate holding device 100 according to an embodiment of the present invention. The substrate holding device 100 includes a cup body 101, a pressure plate 102, a pressure plate driving device 106 and a sealing member 107. The cup body 101 is configured to carry a substrate 400. The pressure plate 102 is configured to press against the back side of the substrate 400 (the upper surface in the figure) so that the substrate 400 and the cup body 101 are relatively fixed to hold the substrate 400. The pressure plate driving device 106 is connected to the pressure plate 102, and the pressure plate drives the pressure plate 102 to descend or ascend so that the pressure plate 102 is pressed against the back side of the substrate 400 to clamp the substrate 400 or to move the pressure plate 102 away from the back side of the substrate 400. The bottom of the cup body 101 is wrapped with a sealing lip 105. When the cup body 101 contains the substrate 400 and the pressure plate drive device 106 provides a vertical force between the cup body 101 and the pressure plate 102, so that the substrate 400 is fixed in the cup body 101 by the pressure plate 102, the substrate 400 abuts against the sealing lip 105, forming a fluid seal to isolate the edge of the substrate 400 from the plating solution. The cup body 101 is supported by a support rod 103, which is connected to the top plate 104. For the purposes of this discussion, the assembly including components 101-107 is collectively referred to as the substrate holding device 100. However, it is noted that the concept of "substrate holding device" generally extends to various combinations and sub-combinations of components that abut against the substrate 400 and allow it to be moved and positioned.

[0044] As described above, the cup 101 is supported via the support rods 103 and the top plate 104. Typically, the cup 101 provides a support member 1011 on which the substrate 400 rests. The cup 101 includes an opening through which the plating solution can contact the plating surface of the substrate 400. Note that the substrate 400 has a front surface (the lower surface in the figure), on which the plating is performed. The periphery of the substrate 400 rests on the support member 1011 of the cup 101, and the pressure plate 102 presses downwardly on the back surface of the substrate 400 to hold the substrate 400 between the pressure plate 102 and the cup 101.

[0045] To load the substrate 400 onto the substrate holding device 100, the platen 102 is raised from its depicted position via the platen drive 106, creating a certain accommodation space between the cup 101 and the platen 102, into which the substrate 400 can be inserted, thereby being loaded into the cup 101. Then, as depicted, the platen 102 is lowered to abut against the outer periphery of the cup 101 while the lower end surface of the platen 102 abuts against the substrate 400. The platen drive 106 transmits a vertical force that causes the platen 102 to abut against the substrate 400. These transmitted forces are indicated by the arrows in FIG. 1 .

[0046] In one embodiment, the sealing lip 105 provided at the bottom of the cup 101 is an elastic body with a certain degree of deformation. When the pressure plate 102 is lowered to abut against the cup 101, and the two cooperate to clamp the substrate 400, the sealing lip 105 is squeezed by the substrate 400 and elastically deforms, forming a tight seal with the substrate 400. The sealing lip 105 prevents the electrolyte from contacting the back of the substrate 400, thereby ensuring electroplating quality.

[0047] In one embodiment, the seal 107 is an elastomer. In the embodiment of the present invention, the material for preparing the seal 107 is selected from fluororubber (such as perfluoro or fluororubber), silicone rubber, etc. Specifically, the seal 107 can be made of different materials according to different process applications. For example, when electroplating copper, a semi-fluororubber (such as Viton fluororubber) with good sealing and low hardness can be used, while in high-temperature electroplating processes such as electroplating nickel or gold, perfluororubber can be used. In other embodiments, the seal 107 is hydrophobic by performing a hydrophobic treatment to make the seal 107 hydrophobic, thereby reducing the adhesion of the plating solution on the surface of the seal 107. The seal 107 can be hydrophobic in a variety of ways, for example: 1) the seal 107 uses a hydrophobic material (such as Teflon); 2) a hydrophobic coating is applied to the surface of the seal 107 (such as a Teflon coating); 3) a hydrophobic material is doped into the seal 107 (such as doped Teflon).

[0048] As shown in FIG1 , when the edge of the platen 102 abuts the upper region of the cup 101, the seal 107 is located on the circumference of the platen 102 and forms a seal with the upper end surface of the cup 101, thereby protecting the back surface of the substrate 400 and preventing any electrolyte from entering the interior of the substrate holding device 100 through the gap 200. Here, the gap 200 is the space between the upper end surface of the cup 101 and the circumference of the platen 102 when the platen 102 and the upper end surface of the cup 101 abut.

[0049] The seal 107 is a three-dimensional annular structure as a whole, and more details of the seal 107 will be described in detail below. Figure 2 shows a schematic diagram of the local structure of the seal in an embodiment of the present invention; Figure 3 shows a schematic diagram of the relative position structure of the seal and the pressure plate in an embodiment of the present invention. As shown in Figures 2 and 3, the seal 107 includes a fixed portion 1071 and a first sealing portion 1072. The fixed portion 1071 is the main body of the seal 107, and 107 is fixed on the circumferential side of the pressure plate 102. The first sealing portion 1072 protrudes downward from the fixed portion 1071. The cross-sectional shape of the first sealing portion 1072 is the same as the cross-sectional shape of the gap 200. When the pressure plate 102 abuts against the cup body 101, and the edge of the pressure plate 102 abuts against the upper area of ​​the cup body 101, the gap 200 is formed between the circumferential side of the pressure plate 102 and the upper area of ​​the cup body 101. For example, as shown in FIG3 , when the cross-sectional shape of the gap 200 is triangular, the shape of the first sealing portion 1072 is approximately prism-shaped, with a triangular cross-sectional shape that matches the cross-sectional shape of the gap 200. It should be understood that when the cross-sectional shape of the gap 200 is rectangular, the first sealing portion 1072 is a cuboid with a rectangular cross-sectional shape. The cross-sectional shape of the gap 200 can be designed according to actual needs. Therefore, the shape of the first sealing portion 1072 can be any shape that matches the gap 200. When pressed by the pressure plate 102, the first sealing portion 1072 abuts against the upper end surface of the cup body 101 to block the gap 200, thereby defining a sealed area. The plating solution is substantially excluded from the sealed area during the electroplating process. Specifically, referring to Figures 2 and 3 , the fixing portion 1071 includes a limiting groove 109A provided on the inner sidewall of the fixing portion 1071. The outer sidewall of the pressure plate 102 is provided with a limiting protrusion 109B that matches the limiting groove 109A. The limiting groove 109A and the limiting protrusion 109B are matched and arranged to limit and fix the sealing member 107 to the circumference of the pressure plate 102. In conjunction with Figure 1 , when the pressure plate 102 is driven to abut against the cup body 101 by the vertical force provided by the pressure plate driving device 106, the vertical force from the pressure plate 102 compresses the sealing member 107 to form a fluid-tight seal. The cross-sectional shape of the first sealing portion 1072 of the seal 107 matches the cross-sectional shape of the gap 200 between the peripheral side of the pressure plate 102 and the upper end surface of the cup body 101. Therefore, when the pressure plate 102 and the cup body 101 are in abutment with each other, the first sealing portion 1072 is tightly pressed between the gap 200, forming a fluid seal, preventing the electroplating liquid from entering the interior of the substrate holding device 100 through the gap 200 between the pressure plate 102 and the cup body 101, thereby affecting the quality of electroplating.

[0050] 4 , the top end of the fixing portion 1071 is engaged with a fixing groove 109C formed on the lower end surface of the pressure plate 102. By engaging the fixing portion 1071 with the fixing groove 109C, the seal 107 is secured in the left-right direction. The matching arrangement of the limiting groove 109A and the limiting protrusion 109B secures the seal 107 in the up-down direction, thereby ensuring the stability of the seal 107 during installation.

[0051] In another embodiment, the seal 107 further includes a second sealing portion 1073 extending downward and outward from the outer edge of the fixing portion 1071. Continuing to refer to FIG. 2 and in conjunction with FIG. 4 , the second sealing portion 1073 extending downward and outward from the outer edge of the fixing portion 1071 is designed as a slope. Furthermore, the lower end surface of the second sealing portion 1073 is lower than the lower end surface of the first sealing portion 1072, that is, when the pressure plate 102 moves from the top plate 104 toward the cup body 101, the second sealing portion 1073 first contacts the cup body 101. This design enables the second sealing portion 1073 to have a sealing function while also having a blocking effect. When the plating liquid splashes onto the upper end surface of the cup body 101, it directly falls onto the flattened upper end surface of the second sealing portion 1073. When the platen drive device 106 drives the platen 102 to move toward the top plate 104, the second sealing portion 1073 returns to a sloped shape, thereby draining the plating liquid that falls on the second sealing portion 1073 to the outside of the cup body 101, preventing the splashed plating liquid from being retained on the upper end surface of the cup body 101, thereby eliminating the possibility of the plating liquid flowing into the interior of the cup body 101. Secondly, the second sealing portion 1073 is an elastic body with a sloped design. When the platen 102 is against the cup body 101, the vertical force from the platen 102 compresses the seal 107, causing the second sealing portion 1073 to be horizontally set to fit tightly against the upper end surface of the cup body 101 to form a fluid seal. A secondary seal is formed by the joint action of the first sealing portion 1072 and the second sealing portion 1073 of the seal 107, which makes the sealing effect better.

[0052] Furthermore, to further ensure that the plating solution deposited on the second sealing portion 1073 is drained to the outside of the cup body 101 when the platen driving device 106 drives the platen 102 toward the top plate 104, the end of the second sealing portion 1073 pressed to a horizontal position is required to be substantially flush with the edge of the cup body 101. It should be understood that in some cases, the horizontal distance between the end of the second sealing portion 1073 pressed to a horizontal position and the edge of the cup body 101 can be between approximately 0.01 and 5 mm.

[0053] 2 , in another embodiment, the sealing member 107 further includes a third sealing portion 1074 formed by a downwardly protruding lower end surface of the sealing member 107 (more specifically, the fixing portion 1071). The third sealing portion 1074 is located between the first sealing portion 1072 and the second sealing portion 1073. Furthermore, the lower end surface of the third sealing portion 1074 is lower than the lower end surface of the first sealing portion 1072. When the pressure plate 102 moves from the top plate 104 toward the cup body 101, the second sealing part 1073 first comes into close contact with the upper end surface of the cup body 101, realizing the first sealing; when the pressure plate 102 continues to move toward the cup body 101, the lower end surface of the third sealing part 1074 then comes into close contact with the upper end of the cup body 101, realizing the second sealing; as the pressure plate 102 continues to move toward the cup body 101, the first sealing part 1072 comes into contact with the upper end surface of the cup body 101 and is pressed between the gap 200, realizing the third sealing; when the pressure plate 102 abuts against the cup body 101, the vertical force from the pressure plate 102 further compresses the seal 107 to form a fluid seal. When the pressure plate driving device 106 drives the pressure plate 102 to completely abut against the cup body 101, and the first sealing part 1072, the second sealing part 1073 and the third sealing part 1074 all form a seal with the upper end surface of the cup body 101, as shown in Figure 5, Figure 5 shows a schematic diagram of the sealing structure when the pressure plate and the cup body are abutted in accordance with an embodiment of the present invention. Multiple seals are formed under the joint action of the first sealing part 1072, the second sealing part 1073 and the third sealing part 1074 of the sealing member 107, and the sealing effect is further guaranteed by achieving the effect of fluid sealing in different directions, different forms and different action parts at the same time. The third sealing part 1074 and the second sealing part 1073 are located on the outer peripheral side of the gap 200, and the sealing area defined by them is larger. At the same time, the third sealing part 1074 and the second sealing part 1073 contact the upper end surface of the cup body 101 before the first sealing part 1072, which can ensure a better sealing effect.

[0054] Furthermore, there are two or more third sealing portions 1074. The sealing member 107 is an elastomer with a certain elasticity, and can produce a slight deformation under the vertical pressure of the pressure plate 102, so that the multiple sealing portions of the sealing member 107 can simultaneously achieve fluid sealing with the upper end surface of the cup body 101, thereby realizing multi-level sealing between the cup body 101 and the pressure plate 102, achieving a better sealing effect.

[0055] Furthermore, referring to FIG6 , the platen 102 further includes a protective cover 500 , which is formed on the edge of the platen 102 and surrounds the outer side of the platen drive device 106 . The protective cover 500 can be manufactured integrally with the platen 102 , or it can be independently provided relative to the platen 102 , with the platen 102 and the protective cover 500 being fixedly connected by fixing members. For example, in this embodiment, the protective cover 500 is fixedly connected to the platen 102 by bolts. The protective cover 500 can protect the platen 102 and the platen drive device 106 to which the platen 102 is connected, preventing the plating solution from splashing onto the upper end surface of the platen 102 , thereby preventing the plating solution from corroding the platen 102 and the platen drive device 106 to which the platen 102 is connected under a long-term process environment, thereby affecting the safety and service life of the equipment. In the depicted embodiment, the protective cover 500 is a straight cylinder, sleeved on the outer side of the platen 102 , and fixedly connected to the platen 102 by bolts. When the pressure plate driving device 106 drives the pressure plate 102 to move up and down, the protective cover 500 moves up and down following the pressure plate 102 .

[0056] Furthermore, in order to prevent the protective cover 500 from affecting the normal operation of the substrate holding device 100 itself, a certain distance is set between the inner wall of the protective cover 500 and the edge of the top plate 104. For example, the distance between the inner wall of the protective cover 500 and the edge of the top plate 104 is 2 mm.

[0057] Furthermore, referring to Figures 1 and 7, at least one through-hole 1021 is provided on the sidewall of the pressure plate 102. When the pressure plate 102 abuts against the cup body 101, the sealing lip 105 provided at the bottom of the cup body 101 and the seal 107 provided between the pressure plate 102 and the cup body 101 simultaneously act as a fluid seal, thereby forming a negative pressure environment (compared to the pressure within the electroplating equipment during the electroplating process) within the space 300. When the pressure plate 102 needs to be separated from the substrate 400, the substrate 400 is easily attracted by the pressure plate 102, making it difficult to separate the pressure plate 102 from the substrate 400. Therefore, the provision of the through-hole 1021 allows the air pressure within the space 300 to be balanced with the air pressure of the electroplating environment within the external electroplating equipment, thereby facilitating separation of the pressure plate 102 from the substrate 400.

[0058] Furthermore, referring to Figures 8 and 9 , the lower surface of the pressure plate 102 is further provided with protrusions 1022 that protrude toward the substrate 400. When the pressure plate 102 is in contact with the substrate 400, only the protrusions 1022 on the lower surface of the pressure plate 102 come into contact with the back surface of the substrate 400, while the remaining portion of the lower surface of the pressure plate 102 does not come into contact with the substrate 400. This design not only reduces the contact area between the pressure plate 102 and the substrate 400, thereby reducing scratches and contamination on the back surface of the substrate 400, but also helps equalize the pressure on the back surface of the substrate 400 with the ambient pressure, facilitating separation of the substrate 400 from the pressure plate 102 when unloading. During the manufacturing process, it was discovered that the design of the bump 1022 effectively reduces scratches and contamination on the back of the substrate 400. However, when unloading the substrate 400, the bump 1022 would occasionally stick to the substrate 400, resulting in less-than-ideal separation between the substrate 400 and the platen 102. To address this issue, researchers created a groove 1023 on the lower surface of the bump 1022 to further reduce the contact area between the bump 1022 and the substrate 400. This further reduces the possibility of scratches and contamination on the back of the substrate 400 and further facilitates separation of the substrate 400 from the platen 102 during unloading. It is worth noting that when creating the groove 1023, it should be symmetrically arranged about the center of the bump 1022 to ensure more stable and uniform contact between the bump 1022 and the substrate 400.

[0059] In another embodiment, referring to Figure 6, the sealing member 107 is disposed on the protective cover 500. When the sealing member 107 is disposed on the protective cover 500, the manner of disposition is the same as that of disposition on the pressure plate 102, and will not be described in detail here.

[0060] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A substrate holding device, characterized in that: include: A cup body configured to carry a substrate; A pressure plate, configured to press against the back side of the substrate to fix the substrate relative to the cup body, so as to hold the substrate; A pressure plate driving device, connected to the pressure plate, and driving the pressure plate to descend or ascend, so that the pressure plate is pressed on the back side of the substrate to clamp the substrate or the pressure plate is moved away from the back side of the substrate; A sealing member, disposed on the pressure plate; Wherein, the sealing element comprises: A fixing portion fixed on the pressure plate; A first sealing portion protrudes downward from the fixing portion, wherein the cross-sectional shape of the first sealing portion is the same as the cross-sectional shape of the gap between the peripheral side of the pressure plate and the cup body when the pressure plate abuts against the cup body, and the first sealing portion abuts against the upper end surface of the cup body when pressed by the pressure plate to define a sealing area.

2. The substrate holding device according to claim 1, characterized in that: The sealing element is an elastomer.

3. The substrate holding device according to claim 2, characterized in that: The sealing member further includes a second sealing portion extending downwardly and outwardly from an outer edge of the fixing portion.

4. The substrate holding device according to claim 3, characterized in that: Before the pressure plate abuts against the cup body, the lower end surface of the second sealing portion is lower than the lower end surface of the first sealing portion, and the second sealing portion abuts against the upper end surface of the cup body when pressed by the pressure plate to define a sealing area.

5. The substrate holding device according to claim 4, characterized in that: When the second sealing portion abuts against the upper end surface of the cup body, part of the second sealing portion is pressed to a horizontal state, and the end of the second sealing portion is substantially flush with the edge of the cup body.

6. The substrate holding device according to claim 3, characterized in that: The sealing member further includes a third sealing portion which is formed by protruding downward from a lower end surface of the fixing portion, and the third sealing portion is located between the first sealing portion and the second sealing portion.

7. The substrate holding device according to claim 6, characterized in that: Before the pressure plate abuts against the cup body, the lower end surface of the third sealing portion is lower than the lower end surface of the first sealing portion.

8. The substrate holding device according to claim 1, characterized in that: The sealing member is disposed on the peripheral side of the pressure plate.

9. The substrate holding device according to claim 8, characterized in that: The fixing part comprises a limiting groove, the limiting groove is arranged on the inner side wall of the fixing part, the outer side wall of the pressure plate is provided with a limiting protrusion, the limiting groove matches the limiting protrusion to fix the fixing part to the peripheral side of the pressure plate.

10. The substrate holding device according to claim 9, characterized in that: The top end of the fixing portion is clamped in a fixing groove formed on the lower end surface of the pressure plate.

11. The substrate holding device according to claim 1, characterized in that: The pressure plate further includes a protective cover formed at an edge of the pressure plate and surrounding an outer side of the pressure plate driving device.

12. The substrate holding device according to claim 11, characterized in that: The sealing member is arranged on the protective cover in the corresponding area of ​​the upper end surface of the cup body.

13. The substrate holding device according to claim 1, characterized in that: A through hole is provided on the side wall of the pressure plate.

14. The substrate holding device according to claim 1, characterized in that: The lower surface of the pressure plate is provided with a protrusion extending downward.

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