Laser processing device

Abstract

This laser processing device is provided with: a processing head that irradiates a workpiece with a laser beam; an air nozzle that discharges a compressed gas onto the workpiece to remove a scattered substance scattered by the irradiation of the laser beam onto the workpiece; a compressed gas supply source that supplies the compressed gas; a valve provided in a supply path for the compressed gas; a valve controller that controls the aperture of the valve; and a discharge control unit that determines whether the scattered substance has been generated, and instructs the valve controller to increase or decrease the aperture of the valve in accordance with the determination result. The discharge control unit increases the aperture of the valve to increase the discharge amount of the compressed gas onto the workpiece if it is determined that the scattered substance has been generated, and decreases the aperture of the valve to reduce the discharge amount of the compressed gas onto the workpiece if it is determined that the scattered matter has not been generated.

Description

Laser Processing Equipment

[0001] The present disclosure relates to a laser processing apparatus.

[0002] Conventionally, laser processing devices have been known that perform processes such as cutting and welding on workpieces by irradiating them with laser light. It is known that when such laser processing devices cut or weld metal workpieces using high-power laser light, flying debris such as spatter (molten metal droplets) and welding fumes are generated. If such flying debris adheres to the workpiece, it can lead to a decrease in product quality. Therefore, a known method involves spraying compressed air or various gases to blow away and remove the flying debris (see, for example, Patent Document 1).

[0003] Furthermore, if flying matter such as spatter or welding fumes adheres to a protective window or the like that is provided at the laser beam irradiation port of the processing head that irradiates the laser beam and through which the laser beam passes, the transmission of the laser beam is hindered, causing deformation of the beam diameter, etc., and degrading the quality of the welding. As a method for suppressing the adhesion of flying matter to the protective window or the like, for example, a method is known in which an air nozzle or the like is provided in the processing head and a gas such as compressed air is discharged toward the welding point to blow away the spatter.

[0004] Japanese Patent Application Laid-Open No. 2006-326615

[0005] However, in conventional laser processing devices employing the above-described method, gas is continuously released from the start to the end of operation of the processing device, which causes problems such as a large amount of gas being used and a large amount of energy being required to compress the gas, as gas is released even when no debris is being generated.

[0006] Therefore, it is desired to provide a processing device that can reduce the amount of energy required to compress the gas released to remove flying particles such as spatter and welding fumes.

[0007] The laser processing apparatus of the present disclosure comprises a processing head that irradiates a workpiece with laser light, an air nozzle that releases compressed gas onto the workpiece in order to remove debris that is scattered by the irradiation of the laser light onto the workpiece, a compressed gas supply source that supplies the compressed gas, a valve that is provided in the compressed gas supply path and that adjusts the amount of compressed gas supplied by increasing or decreasing its opening, a valve controller that controls the opening of the valve, and a release control unit that determines whether or not debris is being generated and instructs the valve controller to increase or decrease the opening of the valve based on the determination result, wherein the release control unit, when determining that debris is being generated, increases the opening of the valve to increase the amount of compressed gas released onto the workpiece, and when determining that debris is not being generated, decreases the opening of the valve to decrease the amount of compressed gas released onto the workpiece.

[0008] It is a diagram for explaining the configuration of the laser processing apparatus of the first embodiment. It is a diagram for explaining the configuration of the laser processing apparatus of the second embodiment. It is a diagram for explaining the configuration of the laser processing apparatus of the third embodiment. It is a diagram for explaining the configuration of the laser processing apparatus of the fourth embodiment.

[0009] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings, etc. Each of the drawings shown below, including Fig. 1, is a schematic diagram, and the size and shape of each part are appropriately exaggerated for ease of understanding.

[0010] 1 is a diagram illustrating the configuration of a laser processing apparatus according to a first embodiment. The laser processing apparatus 1 includes a processing apparatus control unit 10, a laser light source 12, a processing head 13, a valve controller 15, a compressed gas supply source 16, a valve 17, and an air nozzle 18. In this embodiment, the laser processing apparatus 1 is described as an example of an apparatus that irradiates a workpiece W, which is a metal workpiece, with laser light L from the processing head 13 to perform welding.

[0011] The processing device control unit 10 is a control unit that controls the operation of each unit of the laser processing device 1. The processing device control unit 10 includes a laser light control unit 11 and an emission control unit 14, and controls the operation of the laser light source 12 and the valve controller 15. The processing device control unit 10 is configured using a computer that includes memories such as a read-only memory (ROM) and a read-access memory (RAM), a central processing unit (CPU), an input unit, a communication device, etc. The processing device control unit 10 executes various functions in cooperation with each piece of hardware by appropriately reading and executing an operating system (OS) and various application programs stored in the internal memory or external memory.

[0012] The laser light control unit 11 controls the operation of the laser light source 12. The laser light control unit 11 issues commands to the laser light source 12 to oscillate or stop oscillating the laser light L used for welding processing. The laser light control unit 11 also controls the output of the laser light source 12 to adjust the intensity of the laser light L irradiated onto the workpiece W.

[0013] The laser light source 12 oscillates and generates a laser beam L internally in response to an instruction from the laser beam control unit 11, and supplies the laser beam L to the processing head 13. The laser light source 12 may be a fiber laser oscillator, a direct diode laser (DDL) oscillator, a CO ２ A laser oscillator, a solid-state laser (YAG laser) oscillator, or the like may be selected as appropriate depending on the material of the workpiece W to be processed. The wavelength of the laser light L may also be selected as appropriate depending on the material of the workpiece W to be processed.

[0014] The processing head 13 irradiates the workpiece W with laser light L at a predetermined beam diameter. A lens (not shown) and the like are arranged inside the housing of the processing head 13 for adjusting the focal position of the laser light L and the like. The processing head 13 can change the irradiation position of the laser light on the workpiece W by being moved by a robot (not shown) and the like. The means for moving the processing head may be, for example, a linear axis using a ball screw.

[0015] A protective window 131 is provided at the irradiation port of the laser light L of the processing head 13. This protective window 131 is made of transparent glass and prevents flying debris S, such as spatter (molten metal droplets) and welding fumes, generated when the laser light L is irradiated onto the workpiece W, from entering the processing head 13.

[0016] The workpiece W is a metal workpiece. The workpiece W is placed on a table (not shown). In this embodiment, an example will be described in which the workpiece W is a plate-shaped member, but the shape of the workpiece W is not limited to this. In this embodiment, the laser light L is irradiated onto a position tA on the workpiece W.

[0017] The emission control unit 14 executes a program called from memory or the like based on various information such as the material of the workpiece W, the wavelength and intensity of the laser light L, and the beam diameter of the laser light L on the workpiece W input from an input unit (not shown) of the processing device control unit 10, and determines whether or not flying debris S such as spatter or welding fumes are generated.

[0018] When the emission control unit 14 determines that scattered matter S has been generated, it instructs the valve controller 15 to increase the opening of the valve 17 in synchronization with the start of supply of the laser light L to the processing head 13. The emission control unit 14 also instructs the valve controller 15 to decrease the opening of the valve 17 in synchronization with the end of supply of the laser light L to the processing head 13. The emission control unit 14 may also be configured to instruct the valve controller 15 to close the valve 17 in synchronization with the end of supply of the laser light L to the processing head 13.

[0019] The valve controller 15 controls the opening degree of the valve 17 in response to an instruction from the release control unit 14. That is, the valve controller 15 controls the increase or decrease of the opening degree of the valve 17.

[0020] The compressed gas supply source 16 is a device that supplies air A (compressed air) and is a so-called compressor. The compressed gas supply source 16 is connected to the valve 17 and the air nozzle 18 by a pipe 161 and supplies air A to the air nozzle 18. Note that in this embodiment, the compressed gas supply source 16 will be described by taking an example in which it supplies air A, but this is not limiting. Various gases, such as nitrogen, argon, carbon dioxide, or a mixture thereof, may be compressed and supplied. The valve 17 is provided in the air A supply path and increases or decreases the amount of air A supplied to the air nozzle 18 or starts or stops the supply of air A by increasing or decreasing its opening. The valve 17 increases or decreases its opening in response to an instruction from the valve controller 15.

[0021] When the valve 17 opens, air A is supplied to the air nozzle 18 through the pipe 161, and the air A is released from the air nozzle 18. As the opening of the valve 17 increases, the degree to which air A is released from the air nozzle 18, i.e., the amount of air A released, increases. On the other hand, as the opening of the valve 17 decreases, the amount of air A supplied to the air nozzle 18 decreases, and the degree to which air A is released from the air nozzle 18, i.e., the amount of air A released, decreases. When the opening of the valve 17 reaches 0 and the valve 17 closes, the supply of air A to the air nozzle 18 stops, and the release of air A from the air nozzle 18 stops.

[0022] The air nozzle 18 releases air A onto the workpiece W. The phrase "release air onto the workpiece (object to be processed)" is broadly interpreted and is not limited to the case where air A is released toward the surface of the workpiece W, but also includes, for example, the case where air A is released parallel to the surface of the workpiece W. The air nozzle 18 of this embodiment is fixed in a position within the laser processing apparatus 1 so that the released air A can sufficiently reach the irradiation position of the laser light L on the workpiece W, and the relative positional relationship with the workpiece W does not change. Alternatively, an air nozzle unit (not shown) formed by an array of multiple air nozzles 18 may be arranged in the laser processing apparatus 1.

[0023] In Figure 1, the direction of spraying air A is shown as an example in which it is parallel to the surface of the workpiece W and intersects with the irradiation direction of the laser light L, but it is not limited to this and can be set appropriately depending on the surface shape of the workpiece W and the direction in which you want to blow away flying debris S, etc.

[0024] The irradiation of laser light L and the release of air A in the laser processing device 1 will be described. The processing device control unit 10 instructs the laser light control unit 11 to irradiate the workpiece W with laser light L. In response to this instruction, the laser light control unit 11 instructs the laser light source 12 to oscillate laser light L, and the laser light source 12 oscillates and generates laser light L of a predetermined output. The generated laser light L is emitted from the laser light source 12 via a mirror or the like (not shown) and supplied to the processing head 13, and passes through a protective window 131 from the processing head 13 to be irradiated onto the welding processing location of the workpiece W. The beam diameter and output of the irradiated laser light L are appropriately controlled by the laser light control unit 11.

[0025] As described above, the release control unit 14 determines by calculation whether or not scattered matter S has been generated. For example, when a laser emission command is issued based on the processing program, the release control unit 14 determines that scattered matter S has been generated at the processing point irradiated with the laser light L. Then, when the release control unit 14 determines that scattered matter S has been generated, in response to the laser light irradiation command issued by the processing device control unit 10 to the laser light control unit 11, the release control unit 14 issues an instruction to the valve controller 15 so as to synchronize the start of supply of laser light L to the processing head 13 with the increase in the opening of the valve 17.

[0026] In response to an instruction from the emission control unit 14, the valve controller 15 synchronizes the increase in the opening of the valve 17 with the start of supply of the laser light L to the processing head 13. This causes air A to be sprayed from the air nozzle 18 onto the workpiece W. Specifically, for example, the laser processing device 1 may start supplying the laser light L to the processing head 13 and increase (open) the opening of the valve 17 simultaneously, or may open the valve 17 X1 seconds before the start of supplying the laser light L to the processing head 13.

[0027] Furthermore, for example, the laser processing device 1 may simultaneously terminate the supply of laser light L to the processing head 13 and reduce the opening of the valve 17, or may perform the operation of reducing the opening of the valve 17 X2 seconds after the supply of laser light L to the processing head 13 is terminated. In this case, the numerical values ​​entered in X1 and X2 can be appropriately set by the emission control unit 14 according to the welding conditions of the workpiece W.

[0028] In this embodiment, when the laser light L is irradiated onto the workpiece W, debris S is generated, but because air A is emitted from the air nozzle 18 onto the workpiece W, the debris S is blown away and removed by the air A, and adhesion of the debris S to the protective window 131 can be suppressed. This makes it possible to improve the quality of welding processing by the laser processing apparatus 1.

[0029] Furthermore, in conventional laser processing devices, air A is constantly released at a constant rate, and continues to be released even when no debris S is being generated, such as when laser light L is not being irradiated. However, as described above, in the laser processing device 1 of this embodiment, an increase in the opening of the valve 17 is synchronized with the start of supply of laser light L to the processing head 13, and a decrease in the opening of the valve 17 is synchronized with the end of supply of laser light L to the processing head 13. Furthermore, in the laser processing device 1, the end of supply of laser light L to the processing head 13 can be synchronized with the closing of the valve 17.

[0030] Therefore, in the laser processing device 1, while the laser light L is being irradiated onto the workpiece W, sufficient air A is emitted to remove the flying debris S, and during the time when the laser light L is not being irradiated (for example, the time when the processing head 13 is moving to a different welding location on the workpiece W), the emission of air A can be reduced or stopped.

[0031] As a result, according to this embodiment, the laser processing device 1 can reduce the amount (total amount) of air A released during operation, and can suppress the energy consumed in compressing the air A in the compressed gas supply source 16. Furthermore, according to this embodiment, the laser processing device 1 can stop releasing air A while not irradiating laser light L, so the release time of air A can be made shorter than in conventional laser processing devices, and the effect of reducing the energy consumed in compressing air A in the compressed gas supply source 16 can be enhanced.

[0032] 2 is a diagram illustrating the configuration of a laser processing apparatus 2 according to a second embodiment. The laser processing apparatus 2 according to the second embodiment differs from the laser processing apparatus 1 according to the first embodiment in that it includes a detector 22 for detecting flying objects S and the like. Therefore, parts that perform the same functions as those in the first embodiment described above are given the same reference numerals, and redundant explanations will be omitted as appropriate.

[0033] The laser processing device 2 of the second embodiment includes a processing device control unit 10 having a laser light control unit 11 and an emission control unit 14, a laser light source 12, a processing head 13, a valve controller 15, a compressed gas supply source 16, a valve 17, an air nozzle 18, a detector control unit 21, a detector 22, etc.

[0034] The detector 22 monitors the location on the workpiece W where the laser light L is irradiated (i.e., the welding location) and detects the generation of debris S. When the detector 22 detects debris S, it transmits a signal to the detector control unit 21. Because the debris S is observed as shining brightly, the detector 22 is preferably made of, for example, a photodiode or an image sensor such as a CCD or CMOS. The detector control unit 21 has the function of turning the detector 22 on and off and transmitting a signal emitted by the detector 22 to the emission control unit 14. The detector control unit 21 may be provided in the processing device control unit 10.

[0035] In the laser processing device 2 of the second embodiment, similarly to the laser processing device 1 of the first embodiment, the laser light control unit 11 instructs the laser light source 12 to emit laser light L, and the laser light L is irradiated from the processing head 13 onto the workpiece W. The detector 22 monitors the welding point of the workpiece W, i.e., the point irradiated with the laser light L, and transmits a signal to the detector control unit 21 when it detects the generation of scattered matter S. The detector control unit 21 transmits the received signal to the emission control unit 14.

[0036] When the release control unit 14 receives information from the detector control unit 21 that the detector 22 has detected flying matter S, it determines that flying matter S has been generated and instructs the valve controller 15 to increase the opening of the valve 17. In response to the instruction from the release control unit 14, the valve controller 15 opens the valve 17, and air A is sprayed from the air nozzle 18 onto the workpiece W.

[0037] If the workpiece W is irradiated with the laser light L but no flying matter S is generated, the detector 22 does not detect the flying matter S and therefore does not send a signal to the detector control unit 21, and the detector control unit 21 does not send a signal to the release control unit 14. The release control unit 14 determines that no flying matter S is being generated because it does not receive a signal from the detector control unit 21, and instructs the valve controller 15 to reduce the opening of the valve 17. In response to the instruction from the release control unit 14, the valve controller 15 reduces the opening of the valve 17, and the amount of air A released from the air nozzle 18 onto the workpiece W decreases. At this time, the release control unit 14 may instruct the valve controller 15 to close the valve 17 and stop the release of air A from the air nozzle 18.

[0038] Furthermore, when the irradiation of the laser light L stops, the detector 22 does not detect any flying matter S, and therefore the detector 22 does not send a signal to the detector control unit 21, and the detector control unit 21 does not send a signal to the release control unit 14. Since the release control unit 14 does not receive a signal from the detector control unit 21, it determines that no flying matter S has been generated and instructs the valve controller 15 to reduce the opening of the valve 17. The valve controller 15 reduces the opening of the valve 17 in response to a signal from the release control unit 14. At this time, it is preferable that the release control unit 14 instructs the valve controller 15 to close the valve 17 and stop the release of air A from the air nozzle 18.

[0039] In the laser processing device 2 of this embodiment, the scattered material S is removed by the air A, and the scattered material S can be prevented from adhering to the protective window 131 of the processing head 13. This improves the quality of the welding processing on the workpiece W.

[0040] Furthermore, the laser processing apparatus 2 of this embodiment continues to release air A onto the workpiece W when the detector 22 detects flying debris S, and does not release air A or can significantly reduce the amount released when the detector 22 does not detect flying debris S. Therefore, the laser processing apparatus 2 of this embodiment can reduce the amount of air A released and suppress the energy consumed to compress the air A in the compressed gas supply source 16 compared to conventional laser processing apparatuses. In particular, according to the second embodiment, the laser processing apparatus 2 releases air A only when flying debris S such as spatter or welding fumes is actually detected, making it possible to further reduce the release time and amount of air A compared to the first embodiment. Therefore, the laser processing apparatus 2 of this embodiment can further suppress the energy consumed to compress the air in the compressed gas supply source 16.

[0041] 3 is a diagram illustrating a laser processing apparatus 3 according to a third embodiment. The laser processing apparatus 3 according to the third embodiment is different from the laser processing apparatus 1 according to the first embodiment in that it includes a deflection mechanism 34 that deflects the laser light L and a deflection mechanism control unit 33 that controls the deflection mechanism, and that a plurality of valves 17 and air nozzles 18 are provided. Therefore, parts that perform the same functions as those in the first embodiment described above are denoted by the same reference numerals, and duplicated explanations will be omitted as appropriate.

[0042] The laser processing device 3 of the third embodiment includes a processing device control unit 10, a laser light source 12, a processing head 13, a valve controller 15, a compressed gas supply source 16, valves 17 (17A, 17B), and air nozzles 18 (18A, 18B). The laser processing device 3 also includes a deflection mechanism control unit 33 in addition to the laser light control unit 11 and the emission control unit 14 within the processing device control unit 10, and a deflection mechanism 34 within the housing of the processing head 13.

[0043] The deflection mechanism control unit 33 controls the operation of a deflection mechanism 34 in the processing head 13 based on information such as the welding location input to an input unit (not shown) of the processing device control unit 10, so that the laser light L is irradiated to a predetermined position (coordinates) on the workpiece W. The deflection mechanism 34 is a mechanism that deflects the irradiation direction, etc. of the laser light L according to instructions from the deflection mechanism control unit 33 so that the laser light L can be irradiated to a predetermined position (coordinates) on the workpiece W. A galvanometer scanner, a polygon mirror, etc. can be used as such a deflection mechanism.

[0044] The laser processing device 3 can irradiate a predetermined position on the workpiece W with the laser light L using the deflection mechanism 34 and deflection mechanism control unit 33 described above, without moving the processing head 13 by a robot. Furthermore, the laser processing device 3 can move the irradiation position while irradiating the workpiece W with the laser light L using the deflection mechanism 34. For example, the laser processing device 3 can sweep and irradiate the laser light L on the workpiece W in the direction of arrow d.

[0045] The laser processing apparatus 3 also includes a plurality of valves 17 (17A, 17B) and air nozzles 18 (18A, 18B). While FIG. 3 shows an example in which the laser processing apparatus 3 is provided with two sets of valves 17 and air nozzles 18, the present invention is not limited to this configuration and three or more sets may be provided. The valve 17A opens and closes the supply path of air A to the air nozzle 18A. The valve 17B opens and closes the supply path of air to the air nozzle 18B. The valves 17A and 17B increase or decrease their opening degrees in response to instructions from the valve controller 15. The air nozzle 18A is provided near a position tA on the workpiece W, and the air nozzle 18B is provided near a position tB on the workpiece W. The positions tA and tB are located opposite each other on the workpiece W in the direction of arrow d.

[0046] In the laser processing device 3, when the laser light control unit 11 issues an instruction to the laser light source 12 to oscillate laser light L in response to an instruction from the processing device control unit 10, the laser light source 12 oscillates and supplies laser light L to the processing head 13. Based on the instruction from the processing device control unit 10, the deflection mechanism control unit 33 adjusts the deflection mechanism 34 so that the laser light L is irradiated onto a predetermined position on the workpiece W. As a result, the laser light L is irradiated onto the predetermined position on the workpiece W.

[0047] When the laser light L is irradiated to the position tA, the emission control unit 14 instructs the valve controller 15 to increase the opening of the valve 17A closest to the position tA in response to an instruction from the processing device control unit 10 to the laser light control unit 11. At this time, the emission control unit 14 instructs the valve controller 15 to increase the opening of the valve 17A so that the increase in the opening of the valve 17A is synchronized with the start of the supply of the laser light L to the processing head 13. Furthermore, the emission control unit 14 instructs the valve controller 15 to decrease the opening of the valve 17A so that the decrease is synchronized with the end of the supply of the laser light L to the processing head 13. Note that the emission control unit 14 may also instruct the valve controller 15 to synchronize the closing of the valve 17A with the end of the supply of the laser light L to the processing head 13.

[0048] Next, when the laser beam L is irradiated at position tB, the emission control unit 14 instructs the valve controller 15 to open the valve 17B closest to position tB in response to an instruction from the processing device control unit 10 to the laser beam control unit 11. At this time, the emission control unit 14 instructs the valve controller 15 to synchronize an increase in the opening of the valve 17B with the start of supply of the laser beam L to the processing head 13. The emission control unit 14 also instructs the valve controller 15 to decrease the opening of the valve 17B so as to synchronize with the end of supply of the laser beam L to the processing head 13. The emission control unit 14 may also instruct the valve controller 15 to synchronize the closing of the valve 17B with the end of supply of the laser beam L to the processing head 13. The synchronization between the increase or decrease in the opening of each valve 17A, 17B and the start or end of supply of the laser beam L to the processing head 13 is the same as in the first embodiment.

[0049] Therefore, in the laser processing device 3, when the laser beam L is irradiated to the position tA, the aperture of the valve 17A provided at a position close to the position tA increases, and air A is released from the air nozzle 18A onto the workpiece W. Also, in the laser processing device 3, when the laser beam L is irradiated to the position tB, the aperture of the valve 17B near the position tB increases, and air A is released from the air nozzle 18B onto the workpiece W.

[0050] Depending on the irradiation position of the laser light L on the workpiece W and the direction in which the air A is emitted from the air nozzles 18A and 18B, the emission control unit 14 may output an instruction to the valve controller 15 to increase the opening of both the valves 17A and 17B. This allows the laser processing device 3 to emit air A from both the air nozzles 18A and 18B.

[0051] Furthermore, as described above, the laser processing device 3 can use the deflection mechanism 34 to sweep and irradiate the laser beam L onto the workpiece w, for example, from position tA to position tB along the direction of arrow d. At this time, the emission control unit 14 selects the valve 17 closest to the irradiation position of the laser beam L according to the irradiation position, and instructs the valve controller 15 to increase or decrease the opening of the valves 17A and 17B. This allows the laser processing device 3 to synchronously irradiate the workpiece W with the laser beam L and emit air A onto the workpiece W. The shape of the sweep irradiation of the laser beam L on the workpiece W can be selected as appropriate, such as a straight line, a curved line, or a combination of these.

[0052] Therefore, the scattered material S generated by the irradiation of the laser light L is removed by the air A, and the laser processing device 3 can suppress adhesion of the scattered material S to the protective window 131. This improves the quality of welding processing on the workpiece W by the laser processing device 3.

[0053] Furthermore, similar to the laser processing device 1 of the first embodiment, the laser processing device 3 of this embodiment increases or decreases the amount of air A emitted in synchronization with the irradiation of the laser light L. Therefore, according to this embodiment, the laser processing device 3 emits a reduced amount of air A compared to conventional laser processing devices, and the energy consumed in compressing the air A in the compressed gas supply source 16 can be suppressed.

[0054] Furthermore, the laser processing device 3 of this embodiment has multiple sets of air nozzles 18 and corresponding valves 17 provided at different positions relative to the workpiece W. The air nozzle 18 that sprays air A can be selected according to the irradiation position of the laser light L, and the opening of the corresponding valve 17 can be increased or decreased. Therefore, according to this embodiment, the laser processing device 3 can select the optimal valve 17 according to the irradiation position of the laser light L and adjust its opening, thereby more efficiently removing the scattered debris S.

[0055] In this embodiment, the laser processing device 3 may be configured to include the detector 22 and the detector control unit 21 as shown in the second embodiment.

[0056] (Fourth embodiment) Figure 4 is a diagram illustrating the configuration of a laser processing apparatus 4 of a fourth embodiment. The laser processing apparatus 4 of the fourth embodiment is provided with a plurality of sets of air nozzles 18 and corresponding valves 17, similar to the laser processing apparatus 3 of the third embodiment. Furthermore, the laser processing apparatus 4 of the fourth embodiment differs from the laser processing apparatus 1 of the first embodiment in that it is provided with a motor 46 that drives a table T on which a workpiece W is placed and a motor control unit 45 that controls this motor 46. Therefore, parts that perform the same functions as those of the first and third embodiments described above are given the same reference numerals, and duplicated explanations will be omitted as appropriate.

[0057] The laser processing device 4 of this embodiment includes a processing device control unit 10, a laser light source 12, a processing head 13, a valve controller 15, a compressed gas supply source 16, valves 17A and 17B, air nozzles 18A and 18B, and a motor 46. Furthermore, the processing device control unit 10 includes a motor control unit 45 in addition to the laser light control unit 11 and the emission control unit 14.

[0058] The motor 46 is a drive source that drives the table T on which the workpiece W is placed. The motor 46 drives the table T in a predetermined direction at a set speed. The motor control unit 45 controls the driving of the motor 46. The motor control unit 45 drives the motor 46 so that the irradiation position of the laser light L on the workpiece W placed on the table T is located at predetermined coordinates.

[0059] The air nozzles 18A and 18B are provided at different positions so as to face each other in the direction of arrow d. The air nozzles 18A and 18B are provided by a support member (not shown) or the like so that their relative positions with respect to the table T and the workpiece W remain constant regardless of the driving of the table T. Therefore, when the table T is driven by the motor 46, the air nozzles 18A and 18B move integrally with the table T.

[0060] In the laser processing device 4 of this embodiment, the processing device control unit 10 instructs the motor control unit 45 to move the table T so that the planned welding location of the workpiece W is located at a predetermined position. Based on this instruction, the motor control unit 45 drives the motor 46 to move the table T and place the workpiece W at the predetermined position. Next, in response to an instruction from the processing device control unit 10, the laser light control unit 11 instructs the laser source 12 to emit laser light L, and the laser source 12 emits laser light L and supplies it to the processing head 13. As a result, the laser light L is irradiated onto a predetermined position on the workpiece W, for example, position tB in the example shown in FIG. 4 .

[0061] The emission control unit 14 instructs the valve controller 15 to increase the opening of the valve 17B closest to the position tB in response to an instruction from the processing device control unit 10 to the laser light control unit 11. At this time, the emission control unit 14 instructs the valve controller 15 to increase the opening of the valve 17B so that the increase in the opening of the valve 17B is synchronized with the start of supply of the laser light L to the processing head 13. The emission control unit 14 also instructs the valve controller 15 to decrease the opening of the valve 17B so that the decrease is synchronized with the end of supply of the laser light L to the processing head 13. The emission control unit 14 may also instruct the valve controller 15 to synchronize the closing of the valve 17B with the end of supply of the laser light L to the processing head 13. The synchronization between the increase / decrease in the opening of the valve 17B and the start or end of supply of the laser light L to the processing head 13 is the same as in the first embodiment.

[0062] Furthermore, when the table T is driven by the motor 46 and the laser light L is irradiated onto the position tA, the emission control unit 14 instructs the valve controller 15 to increase the opening of the valve 17A closest to the position tA in synchronization with the start of supply of the laser light L to the machining head 13. The emission control unit 14 also instructs the valve controller 15 to decrease the opening of the valve 17A in synchronization with the end of supply of the laser light L to the machining head 13. The emission control unit 14 may also instruct the valve controller 15 to synchronize the closing of the valve 17A with the end of supply of the laser light L to the machining head 13. The synchronization between the increase / decrease in the opening of the valve 17A and the start or end of supply of the laser light L to the machining head 13 is the same as in the first embodiment.

[0063] Furthermore, the laser processing device 4 can sweep-irradiate the laser light L by driving the table T with the motor 46 while the laser light L is irradiated onto the workpiece W. For example, when the laser processing device 4 sweep-irradiates the laser light L from position tA to position tB along the direction of arrow d, the emission control unit 14 selects the valve 17 closest to the irradiation position of the laser light L according to the irradiation position, and instructs the valve controller 15 to increase the opening of that valve 17. This allows the laser processing device 4 to irradiate the workpiece W with the laser light L and to increase or decrease the amount of air A emitted onto the workpiece W in synchronization. The shape of the sweep of the laser light L can be selected as appropriate, such as a straight line, a curved line, or a combination thereof.

[0064] Depending on the irradiation position of the laser light L on the workpiece W and the direction in which the air A is emitted from the air nozzles 18A and 18B, the emission control unit 14 may output to the valve controller 15 to synchronize the emission of the laser light L from the laser light source 12 with the increase in the opening of both the valves 17A and 17B. This allows the laser processing device 3 to emit air A from both the air nozzles 18A and 18B.

[0065] In this embodiment, as in the first and third embodiments, the laser processing device 4 synchronizes the supply of laser light L to the processing head 13 with the increase or decrease in the amount of air A emitted, so that the amount of air A emitted can be reduced compared to conventional laser processing devices. This allows the energy consumed to compress the air A in the compressed gas supply source 16 to be reduced.

[0066] Furthermore, in this embodiment, the laser processing device 4 is provided with a plurality of sets of valves 17 and air nozzles 18, each of which is disposed at a different position relative to the workpiece W. The laser processing device 4 can select the valve 17 and air nozzle 18 that emits air A according to the irradiation position of the laser light L. Therefore, according to this embodiment, the laser processing device 4 can select the optimum valve 17 and air nozzle 18 according to the irradiation position of the laser light L, and can remove the scattered debris S more efficiently.

[0067] In this embodiment, the laser processing device 4 may be configured to include the detector 22 and the detector control unit 21 as shown in the second embodiment.

[0068] (Modified Embodiment) In each embodiment, an example has been shown in which the valve 17 is located upstream of the air nozzle 18 in the supply direction of the air A. However, this is not limiting, and the valve 17 may be incorporated inside the air nozzle 18. By adopting such a configuration, the time from when the valve 17 is opened until the air A is released can be minimized, thereby improving the accuracy of removing the flying debris S. The speed of the electrical signal used to increase or decrease the opening of the valve 17 is approximately half the speed of light, and further, the speed at which the air A flows through the piping 161 is approximately the speed of sound, which is slower than the speed of light and the speed of the electrical signal. Therefore, the closer the valve 17 is positioned to the outlet of the air nozzle, the greater the effect of improving the accuracy of removing the flying debris S.

[0069] Furthermore, in each embodiment, the valve 17 may be a valve incorporating a piezoelectric actuator, i.e., a so-called piezo valve. A piezo valve has a built-in piezo actuator and converts its contraction into displacement to open. Compared to a normal solenoid valve, which drives a plunger using electromagnetic force and a spring, a piezo valve can respond faster. Therefore, by using a piezo valve for the valve 17, the time from when the valve controller 15 issues a command to open the valve 17 to when air A is released from the nozzle of the air nozzle 18 can be shortened. This improves the accuracy of removing the scattered debris S.

[0070] Furthermore, in each embodiment, the laser processing apparatuses 1, 2, 3, and 4 have been described as performing welding on the workpiece W, but the present invention is not limited to this and may be configured to perform cutting on the workpiece W.

[0071] The following supplementary notes are further disclosed regarding the above embodiment: (Supplementary Note 1) A processing head (13) that irradiates a workpiece (W) with a laser beam (L), an air nozzle (18) that releases compressed gas (A) onto the workpiece to remove scattered material (S) that is scattered by the irradiation of the laser beam onto the workpiece, a compressed gas supply source (16) that supplies the compressed gas, a valve (17) that is provided in a supply path of the compressed gas and that adjusts the supply amount of the compressed gas depending on the opening degree, a valve controller (15) that controls the opening degree of the valve, and a device for removing the scattered material. and a release control unit (14) that determines whether or not scattering matter is occurring and instructs the valve controller to increase or decrease the opening of the valve based on the determination result, wherein the release control unit increases the opening of the valve to increase the amount of compressed gas released onto the workpiece when it determines that scattering matter is occurring, and decreases the opening of the valve to decrease the amount of compressed gas released onto the workpiece when it determines that scattering matter is not occurring.

[0072] (Supplementary Note 2) The laser processing apparatus according to Supplementary Note 1, wherein the emission control unit (14) instructs the valve controller (15) to synchronize the start of supply of the laser light (L) to the processing head (13) with an increase in the opening of the valve (17), and instructs the valve controller to synchronize the end of supply of the laser light to the processing head with a decrease in the opening of the valve.

[0073] (Appendix 3) A laser processing apparatus as described in Appendix 1, comprising a detector (22) that detects the generation of the flying matter (S), and a detector control unit (21) that receives a detection signal from the detector and transmits the detection signal to the release control unit (14), wherein the release control unit, upon receiving the detection signal from the detector control unit, determines that the flying matter has been generated and instructs the valve controller to increase the opening of the valve (17), and, upon not receiving the detection signal from the detector control unit, determines that the flying matter has not been generated and instructs the valve controller to decrease the opening of the valve.

[0074] (Supplementary Note 4) The laser processing device according to Supplementary Note 1, wherein the valve (17) is disposed inside the air nozzle (18).

[0075] (Supplementary Note 5) The laser processing device according to Supplementary Note 1, wherein the valve (17) is a piezo valve that increases or decreases the opening degree by displacement of a piezo actuator.

[0076] (Supplementary Note 6) The laser processing device according to Supplementary Note 1, wherein a plurality of sets of the air nozzles (18) and the corresponding valves (17) are provided and arranged at different positions, the processing head (13) is provided with a deflection mechanism (34) that adjusts the irradiation direction of the laser light (L), and the emission control unit (14) instructs the valve controller to synchronize the start of supply of the laser light to the processing head with an increase in the opening of the valve corresponding to the air nozzle close to the irradiation position of the laser light, and instructs the valve controller to synchronize the end of supply of the laser light to the processing head with a decrease in the opening of the valve corresponding to the air nozzle close to the irradiation position of the laser light.

[0077] (Appendix 7) The laser processing device described in Appendix 1, wherein the release control unit (14) closes the valve (17) and stops the release of the compressed air (A) onto the workpiece (W) when it determines that no flying debris (S) is being generated.

[0078] Although the present disclosure has been described in detail, the present disclosure is not limited to the individual embodiments described above. Various additions, substitutions, modifications, partial deletions, etc. are possible in these embodiments without departing from the gist of the present disclosure or the spirit of the present disclosure derived from the content of the claims and their equivalents. These embodiments can also be implemented in combination. For example, in the above-described embodiments, the order of each operation and the order of each process are shown as examples and are not limited to these. The same applies when numerical values ​​or mathematical expressions are used in the description of the above-described embodiments.

[0079] 1, 2, 3, 4 Laser processing device 10 Processing device control unit 11 Laser light control unit 12 Laser light source 13 Processing head 14 Emission control unit 15 Valve controller 16 Compressed gas supply source 17, 17A, 17B Valve 18, 18A, 18B Air nozzle 21 Detector control unit 22 Detector 33 Deflection mechanism control unit 34 Deflection mechanism 45 Motor control unit 46 Motor T Table W Workpiece

Claims

a valve provided in a supply path for the compressed gas and adjusting the amount of the compressed gas supplied by increasing or decreasing its opening; a valve controller for controlling the opening of the valve; and a release control unit for determining whether or not the scattered matter has been generated and for instructing the valve controller to increase or decrease the opening of the valve based on the determination result, wherein the release control unit increases the opening of the valve when it determines that the scattered matter has been generated, thereby increasing the amount of the compressed gas released onto the workpiece, and decreases the opening of the valve when it determines that the scattered matter has not been generated.

2. The laser processing apparatus of claim 1, wherein the emission control unit instructs the valve controller to synchronize the start of supply of the laser light to the processing head with an increase in the opening of the valve, and instructs the valve controller to synchronize the end of supply of the laser light to the processing head with a decrease in the opening of the valve.

3. A laser processing apparatus as described in claim 1, comprising: a detector that detects the occurrence of the flying matter; and a detector control unit that receives a detection signal from the detector and transmits the detection signal to the release control unit, wherein the release control unit, upon receiving the detection signal from the detector control unit, determines that the flying matter has occurred and instructs the valve controller to increase the opening of the valve; and, upon not receiving the detection signal from the detector control unit, determines that the flying matter has not occurred and instructs the valve controller to decrease the opening of the valve.

4. The laser processing device according to claim 1, wherein the valve is disposed inside the air nozzle.

5. The laser processing device according to claim 1, wherein the valve is a piezo valve that increases or decreases the opening degree according to the displacement of a piezo actuator.

6. The laser processing apparatus of claim 1, wherein a plurality of sets of the air nozzles and the corresponding valves are provided, each set being arranged at a different position; the processing head is provided with a deflection mechanism for adjusting the irradiation direction of the laser light; and the emission control unit instructs the valve controller to synchronize the start of supply of the laser light to the processing head with an increase in the opening of the valve corresponding to the air nozzle close to the irradiation position of the laser light, and instructs the valve controller to synchronize the end of supply of the laser light to the processing head with a decrease in the opening of the valve corresponding to the air nozzle close to the irradiation position of the laser light.

7. The laser processing device according to claim 1, wherein the release control unit closes the valve and stops the release of the compressed gas onto the workpiece when it determines that no flying objects are being generated.

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