Electronic component

Abstract

[Problem] To improve insulation between coils in an electronic component having a structure in which a plurality of coils are embedded in an element body that contains a magnetic material. [Solution] A coil component 100 comprises: conductor layers L1-L3 which are embedded in a coil-embedding layer 10A of an element body 10; conductor bumps B1-B4 which are embedded in a bump-embedding layer 10B of the element body 10; and an insulating coating layer 19 which covers a mounting surface 15 of the element body 10 without covering at least some of the conductor bumps B1-B4. The element body 10 includes a magnetic material portion 17 comprising a magnetic material, and a resin material portion 18 comprising a resin material. The resin material portion 18 is positioned between the conductor layers L1-L3 and the magnetic material portion 17. The side faces 11-14 of the element body 10 include a region A comprising the coil-embedding layer 10A and a region B comprising the bump-embedding layer 10B. The conductor layers L1-L3 are embedded in the element body 10 without being exposed from the region A.

Description

Electronic Components

[0001] The present disclosure relates to electronic components.

[0002] Patent Document 1 discloses an electronic component having a structure in which multiple coils are embedded in an element body containing a magnetic material, with both ends of the multiple coils connected to columnar conductor bumps embedded in the element body.

[0003] Japanese Patent Application Laid-Open No. 2021-068825

[0004] This disclosure describes a technique for improving insulation between coils in an electronic component having a structure in which multiple coils are embedded in an element body containing a magnetic material.

[0005] An electronic component according to one aspect of the present disclosure includes an element body including a coil-embedding layer and a bump-embedding layer, the element body having a mounting surface formed by the bump-embedding layer and a plurality of side surfaces perpendicular or substantially perpendicular to the mounting surface; at least one conductor layer embedded in the coil-embedding layer of the element body and constituting a first coil and a second coil; a first conductor bump embedded in the bump-embedding layer of the element body, one end connected to one end of the first coil and the other end exposed on the mounting surface; a second conductor bump embedded in the bump-embedding layer of the element body, one end connected to the other end of the first coil and the other end exposed on the mounting surface; and a third conductor embedded in the bump-embedding layer of the element body, one end connected to one end of the second coil and the other end exposed on the mounting surface. a fourth conductor bump embedded in a bump embedding layer of the base body, one end of which is connected to the other end of the second coil and the other end of which is exposed on the mounting surface; and an insulating coating layer that covers the mounting surface without covering at least a portion of the first conductor bump, at least a portion of the second conductor bump, at least a portion of the third conductor bump, and at least a portion of the fourth conductor bump, wherein the base body includes a magnetic material portion made of a magnetic material and a resin material portion made of a resin material, and the resin material portion is arranged between the conductor layer and the magnetic material portion, and the multiple side surfaces include a first region made of the coil embedding layer and a second region made of the bump embedding layer, and the conductor layer is embedded in the base body without being exposed from the first region.

[0006] According to the present disclosure, a technique for improving insulation between coils in an electronic component having a structure in which multiple coils are embedded in an element body containing a magnetic material is provided.

[0007] FIG. 1 is a schematic see-through perspective view illustrating the structure of an electronic component (coil component 100) according to an embodiment of the technology disclosed herein. FIG. 2 is an equivalent circuit diagram of the coil component 100. FIG. 3 is a schematic perspective view illustrating the structure of side surfaces 11 to 14 of an element body 10. FIG. 4 is a schematic plan view illustrating the structure of a conductor layer L1. FIG. 5 is a schematic plan view illustrating the structure of a conductor layer L2. FIG. 6 is a schematic plan view illustrating the structure of a conductor layer L3. FIG. 7 is a schematic plan view illustrating the structure of a conductor layer L4. FIG. 8 is a schematic plan view illustrating the position where an insulating coating layer 19 is formed. FIG. 9 is a schematic cross-sectional view taken along line D-D shown in FIG. 8. FIG. 10 is a schematic plan view illustrating the position where an insulating coating layer 19 is formed according to a first modified example. FIGS. 11( a) to 11(d) are process diagrams illustrating a method for manufacturing the coil component 100. FIGS. 12(a) to 12(d) are process diagrams illustrating a method for manufacturing the coil component 100. FIG. 13 is a schematic plan view showing the structure of a conductor layer L4 and element body 10 according to a second modified example. FIG. 14 is a schematic plan view showing the structure of a conductor layer L4 and element body 10 according to a third modified example. FIGS. 15(a) to 15(c) are process diagrams for explaining a method for manufacturing a coil component 100 in which the conductor layer L4 has the structure shown in FIG. 14. FIG. 16 is a schematic plan view showing the structure of a conductor layer L0 according to a fourth modified example. FIG. 17 is a schematic plan view showing the structure of a conductor layer L11 according to a fifth modified example. FIG. 18 is a schematic plan view showing the structure of a conductor layer L12 according to the fifth modified example. FIG. 19 is a schematic plan view showing the structure of a conductor layer L13 according to the fifth modified example. FIG. 20 is a schematic plan view showing the structure of a conductor layer L14 according to the fifth modified example.

[0008] Hereinafter, embodiments of the technology according to the present disclosure will be described in detail with reference to the accompanying drawings.

[0009] Fig. 1 is a schematic perspective view illustrating the structure of an electronic component (coil component 100) according to an embodiment of the technology disclosed herein. Fig. 2 is an equivalent circuit diagram of the coil component 100.

[0010] The coil component 100 illustrated in FIGS. 1 and 2 is a four-terminal chip component and includes an element body 10 and two coils C1 and C2 embedded in the element body 10. The element body 10 has side surfaces 11 and 12 that form a YZ plane and are located opposite each other, side surfaces 13 and 14 that form an XZ plane and are located opposite each other, and a mounting surface 15 and a top surface 16 (opposing surfaces facing the mounting surface) that form an XY plane and are located opposite each other. The mounting surface 15 and each of the side surfaces 11 to 14 may be orthogonal to each other or may have an angle within a range from orthogonal (e.g., within a manufacturing error range based on orthogonality). The mounting surface 15 faces a circuit board when mounted, and four terminal electrodes 21 to 24 are exposed on the mounting surface 15. The terminal electrode 24 is not illustrated in FIG. 1. In a plan view of the element body 10 from the Z direction, the X direction is the longitudinal direction and the Y direction is the lateral direction. The terminal electrodes 21 and 22 are adjacent to each other in the Y direction, and the terminal electrodes 23 and 24 are adjacent to each other in the Y direction. The terminal electrodes 21 and 23 are adjacent to each other in the X direction, and the terminal electrodes 22 and 24 are adjacent to each other in the X direction.

[0011] The element body 10 has a coil-embedding layer 10A in which the coils C1 and C2 are embedded, a bump-embedding layer 10B that constitutes the mounting surface 15, and a support layer 10C that constitutes the top surface 16. The coil-embedding layer 10A is sandwiched in the Z direction between the bump-embedding layer 10B and the support layer 10C. With this configuration, each of the side surfaces 11 to 14 is composed of a region A made up of the coil-embedding layer 10A, a region B made up of the bump-embedding layer 10B, and a region C made up of the support layer 10C, as shown in the schematic diagram of FIG.

[0012] A plurality of conductor layers L1 to L3 stacked in the Z direction are embedded in the coil-embedding layer 10A of the element body 10. Coils C1 and C2 are formed by conductor patterns located on the conductor layers L1 to L3. The axial directions of the coils C1 and C2 are both in the Z direction. The coils C1 and C2 are also arranged in the X direction, which is their longitudinal direction. A conductor layer L4 is embedded in the bump-embedding layer 10B of the element body 10. Conductor bumps B1 to B4, which will be described later, are formed on the conductor layer L4.

[0013] 4 to 7 are schematic plan views for explaining the structures of the conductor layers L1 to L4, respectively.

[0014] In the example shown in Figure 4, the conductor patterns provided on the conductor layer L1 include coil patterns 31 and 32 and dummy patterns 33 and 34. The coil patterns 31 and 32 are conductor patterns that wrap around for approximately one turn, and one end of each is positioned to overlap conductor bumps B2 and B4, respectively, in a plan view seen from the Z direction. The dummy patterns 33 and 34 are provided independently of the coil patterns 31 and 32, and are positioned to overlap conductor bumps B1 and B3, respectively, in a plan view seen from the Z direction. One end and the other end of the coil pattern 31 are connected to the upper conductor layer L2 via via conductors 41 and 42, respectively. One end and the other end of the coil pattern 32 are connected to the upper conductor layer L2 via via conductors 43 and 44, respectively.

[0015] In the example shown in FIG. 5 , the conductor patterns provided on the conductor layer L2 include coil patterns 51 and 52, dummy patterns 53 and 54, and connection patterns 55 and 56. The coil patterns 51 and 52 are conductor patterns that wrap around approximately one turn. One end of the coil patterns 51 and 52 is connected to the other end of the coil patterns 31 and 32 via via conductors 42 and 44, respectively. The dummy patterns 53 and 54 are provided independently of the coil patterns 51 and 52 and are positioned to overlap with the conductor bumps B1 and B3, respectively, in a plan view seen from the Z direction. The connection patterns 55 and 56 are provided independently of the coil patterns 51 and 52 and are positioned to overlap with the conductor bumps B2 and B4, respectively, in a plan view seen from the Z direction. The connection patterns 55 and 56 are connected to one end of the coil patterns 31 and 32 via via conductors 41 and 43, respectively, and are connected to the upper conductor layer L3 via via conductors 61 and 63, respectively. The other ends of the coil patterns 51 and 52 are connected to the upper conductor layer L3 through via conductors 62 and 64, respectively.

[0016] In the example shown in FIG. 6 , the conductor patterns provided on the conductor layer L3 include coil patterns 71 and 72 and connection patterns 73 and 74. The coil patterns 71 and 72 are conductor patterns that wrap around for approximately one turn. One end of the coil patterns 71 and 72 is connected to the other end of the coil patterns 51 and 52 via via conductors 62 and 64, respectively. The other ends of the coil patterns 71 and 72 are positioned to overlap with conductor bumps B1 and B3, respectively, in a plan view seen from the Z direction. The connection patterns 73 and 74 are provided independently of the coil patterns 71 and 72 and are positioned to overlap with conductor bumps B2 and B4, respectively, in a plan view seen from the Z direction. The connection patterns 73 and 74 are connected to connection patterns 55 and 56 via via conductors 61 and 63, respectively, and are connected to the upper conductor layer L4 via via conductors 82 and 84, respectively. The other ends of the coil patterns 71 and 72 are connected to the upper conductor layer L4 via via conductors 81 and 83, respectively.

[0017] In the example shown in FIG. 7 , the conductor patterns provided on the conductor layer L4 include conductor bumps B1 to B4. The conductor bumps B1 to B4 are connected to the other end of the coil pattern 71, the connection pattern 73, the other end of the coil pattern 72, and the connection pattern 74 via via conductors 81 to 84, respectively. Terminal electrodes 21 to 24 made of a plating film or the like are provided on the surfaces of the conductor bumps B1 to B4 that are exposed from the element body 10. The planar sizes of the conductor bumps B2 and B4 are larger than the planar sizes of the connection patterns 73 and 74, respectively. Similarly, the planar sizes of the conductor bumps B1 and B3 are larger than the planar sizes of the other ends of the coil patterns 71 and 72, respectively. This increases the area of ​​the terminal electrodes 21 to 24 on the mounting surface 15, thereby improving the mounting reliability of the coil component 100.

[0018] With this configuration, coil patterns 31, 51, and 71 are connected in series between terminal electrodes 21 and 22, thereby forming coil C1. Furthermore, coil patterns 32, 52, and 72 are connected in series between terminal electrodes 23 and 24, thereby forming coil C2. In the example shown in FIGS. 4 to 6 , the winding direction of coil C1 starting from terminal electrode 21 is opposite to the winding direction of coil C2 starting from terminal electrode 23. Therefore, for example, if terminal electrodes 21 and 23 are connected to a pair of differential signal lines, respectively, and terminal electrodes 22 and 24 are connected to a power supply circuit, coil device 100 prevents differential components (signal components) flowing through the differential signal lines from flowing into the power supply circuit, while DC power supply components pass through coil device 100.

[0019] As shown in FIGS. 4 to 7 , the base body 10 includes a magnetic material portion 17 made of a magnetic material and a resin material portion 18 made of an insulating resin material. The magnetic material portion 17 may be a composite magnetic member containing a metal magnetic filler made of a magnetic material such as iron (Fe) or permalloy and a resin binder. The resin material portion 18 may be a resin material containing an inorganic filler such as silica and a resin binder. In the example shown in FIGS. 4 to 7 , the conductor patterns and conductor bumps formed on the conductor layers L1 to L4 are all covered with the resin material portion 18. In other words, the resin material portion 18 is disposed between the conductor patterns and conductor bumps formed on the conductor layers L1 to L4 and the magnetic material portion 17, and is not in contact with the magnetic material portion 17. Furthermore, most of the inner diameter region surrounded by the coils C1 and C2 and most of the outer region located radially outside the coils C1 and C2 are made of the magnetic material portion 17. For ease of explanation, the resin material portion 18 disposed between the conductor patterns formed on the conductor layers L1 to L3 and the magnetic material portion 17 may be referred to as a first insulating member. Furthermore, the magnetic material portion 17 disposed on the conductor layers L1 to L3 may be referred to as a first magnetic resin. Furthermore, the resin material portion 18 disposed between the conductor patterns (conductor bumps) formed on the conductor layer L4 and the magnetic material portion 17 may be referred to as a second insulating member. Furthermore, the magnetic material portion 17 disposed on the conductor layer L4 may be referred to as a second magnetic resin.

[0020] In the example shown in Figures 4 to 6, the portions of the outer regions of the coils C1 and C2 that constitute the side surfaces 11 to 14 are made of the resin material portion 18. As a result, the entire area of ​​region A of the side surfaces 11 to 14 shown in Figure 3 is made of the resin material portion 18, and the magnetic material portion 17 and the conductor layers L1 to L3 are not exposed. In the example shown in Figure 7, the conductor layer L4 is exposed from the side surfaces 11 to 14, but the entire exposed portion of the element body 10 is made of the resin material portion 18. In other words, the magnetic material portion 17 is not exposed from region B of the side surfaces 11 to 14. For ease of explanation, the resin material portion 18 arranged in region A of the side surfaces 11 to 14 shown in Figure 3 (the portions of the side surfaces 11 to 14 of the element body that correspond to the conductor layers L1 to L3) may be referred to as a third insulating member. For the sake of explanation, the resin material portion 18 arranged in region B of the sides 11 to 14 shown in Figure 3 (the portion of the sides 11 to 14 of the element body that corresponds to the conductor layer L4) may be referred to as the fourth insulating member.

[0021] Furthermore, as shown in FIG. 8 , the mounting surface 15 of the element body 10, on which the conductor bumps B1 to B4 are exposed, is covered with an insulating coating layer 19. The insulating coating layer 19 may be made of an insulating resin material, such as solder resist, different from the resin material constituting the resin material portion 18. Openings 91 to 94 are provided in the insulating coating layer 19 at portions overlapping with the conductor bumps B1 to B4, respectively, and the conductor bumps B1 to B4 are exposed at these portions. The inner peripheral edges of the openings 91 to 94 are located slightly inside the outer peripheral edges of the conductor bumps B1 to B4, respectively. In the example shown in FIG. 8 , the entire surface of the element body 10 exposed on the mounting surface 15 is covered with the insulating coating layer 19, and the outer peripheral portions of the conductor bumps B1 to B4 exposed on the mounting surface 15 are also covered with the insulating coating layer 19.

[0022] FIG. 9 is a schematic cross-sectional view taken along line DD shown in FIG.

[0023] 9 , a terminal electrode 21 is formed on a portion of the surface of the conductor bump B1 that is not covered with the insulating coating layer 19. The terminal electrode 21 can be formed by plating the surface of the conductor bump B1 with a metal such as nickel or tin. When the terminal electrode 21 is formed by electrolytic plating, depending on the plating conditions, the terminal electrode 21 may be formed beyond the surface of the conductor bump B1. Even in this case, the mounting surface 15 of the element body 10 is covered with the insulating coating layer 19, thereby preventing contact between the terminal electrode 21 and the magnetic material portion 17. This makes it possible to ensure sufficient dielectric strength between the terminal electrodes even if the resistance value of the magnetic material portion 17 is lower than the resistance value of the resin material portion 18. In addition, when the distance between conductor bumps connected to different coils (for example, the distance between conductor bump B1 and conductor bump B3, and the distance between conductor bump B2 and conductor bump B4 shown in Figure 7) is greater than the distance between conductor bumps connected to the same coil (for example, the distance between conductor bump B1 and conductor bump B2, and the distance between conductor bump B3 and conductor bump B4 shown in Figure 7), the dielectric strength voltage between terminal electrodes connected to different coils is further increased.

[0024] In the example shown in Figure 8, the entire surface of the magnetic material portion 17 exposed on the mounting surface 15 is covered with the insulating coating layer 19. However, as in the first modified example shown in Figure 10, the insulating coating layer 19 may be selectively provided around the conductor bumps B1 to B4 exposed on the mounting surface 15, leaving the magnetic material portion 17 exposed in areas of the mounting surface 15 that are not covered by the insulating coating layer 19. Even in this case, as long as a sufficient distance is maintained between the outer peripheral edge of the insulating coating layer 19 and the outer peripheral edges of the conductor bumps B1 to B4, contact between the terminal electrodes 21 to 24 and the magnetic material portion 17 can be prevented even if the terminal electrodes 21 to 24 are formed beyond the surfaces of the conductor bumps B1 to B4. Furthermore, according to the example shown in Figure 10, the amount of insulating coating layer 19 required can be reduced.

[0025] 11(a) to 11(d) and 12(a) to 12(d) are process diagrams for explaining a method for manufacturing the coil component 100 illustrated in FIG.

[0026] First, as shown in FIG. 11( a), a conductor layer L1 is formed on the surface of the substrate S on which a resin layer 180 has been formed. The cross section shown in FIG. 11( a) shows one end of the coil patterns 31 and 32. Also shown in FIG. 11( a) is a cross section corresponding to three coil components 100. This also applies to the following process diagrams. A sacrificial pattern 101 is formed between one end of the coil pattern 31 and one end of the coil pattern 32 that belong to the same coil component 100. Of the conductor patterns that make up the conductor layer L1, portions that belong to different coil components 100 are not connected and are separated from each other. The conductor layer L1 having this configuration is covered with a resin layer 181.

[0027] 11B, a conductor layer L2, a resin layer 182, a conductor layer L3, a resin layer 183, a conductor layer L4, and a resin layer 184 are formed in this order on the surface of the conductor layer L1. The resin layers 180 to 184 constitute the resin material portion 18.

[0028] In the cross section shown in FIG. 11( b), connection patterns 55 and 56 are shown on conductor layer L2, connection patterns 73 and 74 are shown on conductor layer L3, and conductor bumps B2 and B4 are shown on conductor layer L4. Conductor layer L2 also includes a sacrificial pattern 102 located between connection patterns 55 and 56 belonging to the same coil component 100. Of the conductor patterns constituting conductor layer L2, portions belonging to different coil components 100 are not connected and are separated from one another. Conductor layer L3 includes a sacrificial pattern 103 located between connection patterns 73 and 74 belonging to the same coil component 100. Of the conductor patterns constituting conductor layer L3, portions belonging to different coil components 100 are not connected and are separated from one another. Conductor layer L4 includes a sacrificial pattern 104 located between conductor bumps B2 and B4 belonging to the same coil component 100. These sacrificial patterns 101 to 104 overlap in plan view and are connected to one another via via conductors provided in resin layers 181 to 183. 11B, the conductor bumps B2 and B4 belonging to adjacent coil components 100 are integrated. In a cross section not shown, the conductor bumps B1 and B3 belonging to adjacent coil components 100 are also integrated.

[0029] Next, as shown in FIG. 11( c), the sacrificial patterns 101-104 are removed using an acid or the like to form a space 110. Next, as shown in FIG. 11( d), a magnetic material portion 17 is formed inside the space 110 and on the surface of the resin layer 184. Here, of the magnetic material portion 17 embedded inside the space 110, the portion located on the conductor layers L1-L3 constitutes the coil-embedded layer 10A, and the portion located on the conductor layer L4 constitutes the bump-embedded layer 10B. Then, as shown in FIG. 12( a), the magnetic material portion 17 formed on the surface of the resin layer 184 is removed by polishing or the like to expose the surfaces of the conductor bumps B1-B4. The polished surfaces of the magnetic material portion 17 constitute the mounting surface 15 of the element body 10.

[0030] 12(b), after the substrate S is peeled off, the magnetic material portion 17 constituting the support layer 10C is formed on the surface of the resin layer 180. The material of the magnetic material portion 17 constituting the support layer 10C may be the same as or different from the material of the magnetic material portions 17 constituting the coil-embedded layer 10A and the bump-embedded layer 10B. Although providing the support layer 10C is not essential, providing the support layer 10C makes it possible to increase the mechanical strength and inductance of the coil component 100.

[0031] Then, when the base body 10 is cut along the dashed lines 120 shown in Fig. 12(c), a plurality of coil components 100 are separated as shown in Fig. 12(d). By the singulation, the conductor bumps B2 and B4 that were integrated together are separated, and the conductor bumps B1 to B4 are exposed from the side surfaces 11 to 14 of the base body 10. In contrast, with regard to the conductor patterns located on the conductor layers L1 to L3, the portions belonging to different coil components 100 are separated from each other without being connected, and therefore the conductor layers L1 to L3 are not exposed from the side surfaces 11 to 14 even after singulation. In other words, the entire surface of region A of the side surfaces 11 to 14 is made up of the resin material portion 18. The entire surface of region C of the side surfaces 11 to 14 is made up of the magnetic material portion 17.

[0032] Then, after the surfaces of the conductor bumps B1 to B4 are exposed by polishing or the like, an insulating coating layer 19 is formed on the mounting surface 15 of the element body 10 before the coil component 100 is singulated. Furthermore, after the coil component 100 is singulated, terminal electrodes 21 to 24 are formed on the surfaces of the conductor bumps B1 to B4 by electrolytic plating or the like. This completes the coil component 100.

[0033] In this way, in the coil component 100 of the above-described embodiment, the conductor patterns located on the conductor layers L1 to L3 are not exposed from the side surfaces 11 to 14 of the base body 10, and therefore the plating does not come into contact with the conductor layers L1 to L3 when the terminal electrodes 21 to 24 are formed by plating. Moreover, of the side surfaces 11 to 14, the magnetic material portion 17 is not exposed in region A made of the coil-embedded layer 10A, and the entire surface is made of the resin material portion 18, so there is no need to form the insulating coating layer 19 on the side surfaces 11 to 14.

[0034] Furthermore, in the coil component 100 of the above-described embodiment, the conductor bumps B1 to B4 are exposed from region B on the side surfaces 11 to 14 of the element body 10. Therefore, when the coil component 100 is mounted on a circuit board using solder, solder fillets are formed on the side surfaces 11 to 14 of the element body 10, which makes it possible to increase the mounting strength.

[0035] FIG. 13 is a schematic plan view showing the structure of the conductor layer L4 and element body 10 according to the second modified example.

[0036] 13 differs from the structure shown in Fig. 7 in that the magnetic material portion 17 is exposed on the side surfaces 11 to 14 in the portions located between the conductor bumps B1 to B4 adjacent in the X or Y direction. According to this example, the volume of the magnetic material portion 17 is increased compared to the structure shown in Fig. 7, making it possible to obtain a higher inductance. In this example, although the magnetic material portion 17 is partially exposed from region B of the side surfaces 11 to 14 of the base body 10, if the widths in the X and Y directions of the resin material portion 18 exposed in region B are sufficiently secured, a decrease in the dielectric strength voltage can be suppressed.

[0037] FIG. 14 is a schematic plan view showing the structure of the conductor layer L4 and element body 10 according to the third modified example.

[0038] 14 differs from the structure shown in Fig. 7 in that the conductor bumps B1 to B4 are not exposed from the side surfaces 11 to 14 of the element body 10 but are covered with the resin material portion 18. According to this example, the entire area B of the side surfaces 11 to 14 of the element body 10 is made of the resin material portion 18, making it possible to obtain a higher dielectric strength voltage.

[0039] 15(a) to 15(c) are process diagrams for explaining a method for manufacturing a coil component 100 in which the conductor layer L4 has the structure shown in FIG.

[0040] 11(a) and 11(b), conductor layer L1, resin layer 181, conductor layer L2, resin layer 182, conductor layer L3, resin layer 183, conductor layer L4, and resin layer 184 are formed in this order on the surface of substrate S on which resin layer 180 has been formed. At this time, as shown in Fig. 15(a), conductor bumps B2 and B4 belonging to adjacent coil components 100 are separated from each other without being integrated. Although not shown, conductor bumps B1 and B3 belonging to adjacent coil components 100 are also separated from each other without being integrated.

[0041] Next, as described with reference to FIGS. 11(c), 11(d), 12(a), and 12(b), the sacrificial patterns 101-104 are removed to form spaces 110, and the spaces 110 are then filled with magnetic material portions 17. The surfaces of the conductor bumps B1-B4 are then exposed by polishing or the like. The substrate S is then peeled off, forming the magnetic material portions 17 that constitute the support layer 10C. Then, by cutting along the dashed lines 120 shown in FIG. 15(b), multiple coil components 100 are separated as shown in FIG. 15(c). In this example, the conductor layers L4 belonging to different coil components 100 are separated from each other without being integrated, and therefore the conductor layers L4 are not exposed from the side surfaces 11-14 even when the coil components 100 are separated into individual components.

[0042] In this way, when the conductor layer L4 shown in Figure 14 is used, the conductor pattern and magnetic material portion 17 are not exposed in region A of the side surfaces 11 to 14, which is made up of the coil-embedded layer 10A, and region B, which is made up of the bump-embedded layer 10B, and the entire surface is made up of the resin material portion 18, so it is possible to further improve the insulation of the side surfaces 11 to 14.

[0043] FIG. 16 is a schematic plan view showing the structure of the conductor layer L0 according to the fourth modification.

[0044] The conductor layer L0 shown in Figure 16 is a conductor layer that can be used in place of the conductor layers L1 to L3 shown in Figures 4 to 6, and includes two coil patterns 131 and 132. The coil patterns 131 and 132 are both conductor patterns that wrap around approximately 1 / 2 turn and form coils C1 and C2, respectively. One end and the other end of the coil pattern 131 are positioned to overlap with the conductor bumps B1 and B2, respectively, in a plan view seen from the Z direction, and are connected to the conductor bumps B1 and B2 via via conductors 133 and 134, respectively. One end and the other end of the coil pattern 132 are positioned to overlap with the conductor bumps B3 and B4, respectively, in a plan view seen from the Z direction, and are connected to the conductor bumps B3 and B4 via via conductors 135 and 136, respectively.

[0045] 16 , the only conductor layer embedded in the coil-embedding layer 10A is conductor layer L0, with conductor layer L4 located directly above it. As illustrated in the fourth modification, the number of conductor layers embedded in the coil-embedding layer 10A is not particularly limited, and may be only one layer. Furthermore, as illustrated in the fourth modification, the conductor patterns constituting the coils C1 and C2 may have less than one turn.

[0046] 17 to 20 are schematic plan views showing the structures of conductor layers L11 to L14 according to the fifth modified example, respectively.

[0047] The conductor layers L11 to L14 shown in Figures 17 to 20 can be used in place of the conductor layers L1 to L3 shown in Figures 4 to 6. That is, in the fifth modification, four conductor layers L11 to L14 are embedded in the coil-embedded layer 10A.

[0048] 17 , the conductor patterns provided on the conductor layer L11 include a coil pattern 140 and dummy patterns 141, 142, and 144. The coil pattern 140 is a conductor pattern that wraps around for approximately one turn, and one end of the coil pattern 140 is positioned to overlap with the conductor bump B3 in a plan view seen from the Z direction. The dummy patterns 141, 142, and 144 are provided independently of the coil pattern 140, and are positioned to overlap with the conductor bumps B1, B2, and B4, respectively, in a plan view seen from the Z direction. One end and the other end of the coil pattern 140 are connected to the upper conductor layer L12 via via conductors 145 and 146.

[0049] As shown in FIG. 18 , the conductor patterns provided on the conductor layer L12 include a coil pattern 150, connection patterns 153 and 155, and dummy patterns 152 and 154. The coil pattern 150 is a conductor pattern that wraps around for approximately one turn so as to overlap the coil pattern 140 in a plan view from the Z direction, and one end of the coil pattern 150 is positioned so as to overlap the conductor bump B1 in a plan view from the Z direction. The connection pattern 153 is provided independently of the coil pattern 150 and is positioned so as to overlap the conductor bump B3 in a plan view from the Z direction. The connection pattern 155 is provided independently of the coil pattern 150 and is positioned so as to overlap the other end of the coil pattern 140 in a plan view from the Z direction. The dummy patterns 152 and 154 are provided independently of the coil pattern 150 and are positioned so as to overlap the conductor bumps B2 and B4, respectively, in a plan view from the Z direction. One end and the other end of the coil pattern 150 are connected to the upper conductor layer L13 via via conductors 156, 157. The connection pattern 153 is connected to one end of the coil pattern 140 via via conductor 145, and is connected to the upper conductor layer L13 via via conductor 158. The connection pattern 155 is connected to the other end of the coil pattern 140 via via conductor 146, and is connected to the upper conductor layer L13 via via conductor 159.

[0050] As shown in FIG. 19 , the conductor patterns provided on the conductor layer L13 include a coil pattern 160, connection patterns 161, 163, 165, and a dummy pattern 162. The coil pattern 160 is a conductor pattern that wraps around for approximately one turn so as to overlap with the coil patterns 140 and 150 in a plan view from the Z direction, and one end of the coil pattern 160 is positioned so as to overlap with the conductor bump B4 in a plan view from the Z direction. The connection patterns 161 and 163 are provided independently of the coil pattern 160 and are positioned so as to overlap with the conductor bumps B1 and B3, respectively, in a plan view from the Z direction. The connection pattern 165 is provided independently of the coil pattern 160 and is positioned so as to overlap with the other end of the coil pattern 150 in a plan view from the Z direction. The dummy pattern 162 is provided independently of the coil pattern 160 and is positioned so as to overlap with the conductor bump B2 in a plan view from the Z direction. One end of coil pattern 160 is connected to the upper conductor layer L14 via via conductor 166. The other end of coil pattern 160 is connected to connection pattern 155 via via conductor 159. Connection pattern 161 is connected to one end of coil pattern 150 via via conductor 156 and is also connected to the upper conductor layer L14 via via conductor 167. Connection pattern 163 is connected to connection pattern 153 via via conductor 158 and is also connected to the upper conductor layer L14 via via conductor 168. Connection pattern 165 is connected to the other end of coil pattern 150 via via conductor 157 and is also connected to the upper conductor layer L14 via via conductor 169.

[0051] As shown in FIG. 20 , the conductor patterns provided on the conductor layer L14 include a coil pattern 170 and connection patterns 171, 173, and 174. The coil pattern 170 is a conductor pattern that winds around for approximately one turn so as to overlap with the coil patterns 140, 150, and 160 in a plan view from the Z direction, and one end of the coil pattern 170 is positioned so as to overlap with the conductor bump B2 in a plan view from the Z direction. The connection patterns 171, 173, and 174 are provided independently of the coil pattern 170 and are positioned so as to overlap with the conductor bumps B1, B3, and B4, respectively, in a plan view from the Z direction. One end of the coil pattern 170 is connected to the upper conductor layer L4 via a via conductor 175. The other end of the coil pattern 170 is connected to the connection pattern 165 via a via conductor 169. The connection pattern 171 is connected to the connection pattern 161 via a via conductor 167 and is also connected to the upper conductor layer L4 via a via conductor 177. Connection pattern 173 is connected to connection pattern 163 through via conductor 168, and is also connected to the upper conductor layer L4 through via conductor 178. Connection pattern 174 is connected to one end of coil pattern 160 through via conductor 166, and is also connected to the upper conductor layer L4 through via conductor 179.

[0052] 7, conductor layer L4 is provided with conductor bumps B1 to B4. Conductor bump B2 is connected to one end of coil pattern 170 via via conductor 175. Conductor bumps B1, B3, and B4 are connected to connection patterns 171, 173, and 174 via via conductors 177, 178, and 179, respectively.

[0053] With this configuration, the coil patterns 140 and 160 constituting the coil C1 and the coil patterns 150 and 170 constituting the coil C2 are alternately stacked in the Z direction, which makes it possible to further enhance the coupling between the coils C1 and C2.

[0054] The above describes embodiments of the technology according to the present disclosure, but the technology according to the present disclosure is not limited to the above embodiments, and various modifications are possible within the scope of the gist of the technology, and it goes without saying that these modifications are also included within the scope of the technology according to the present disclosure.

[0055] The technology according to the present disclosure includes, but is not limited to, the following configuration examples.

[0056] An electronic component according to one aspect of the present disclosure includes an element body including a coil-embedding layer and a bump-embedding layer, the element body having a mounting surface formed by the bump-embedding layer and a plurality of side surfaces perpendicular or substantially perpendicular to the mounting surface; at least one conductor layer embedded in the coil-embedding layer of the element body and constituting a first coil and a second coil; a first conductor bump embedded in the bump-embedding layer of the element body, one end connected to one end of the first coil and the other end exposed on the mounting surface; a second conductor bump embedded in the bump-embedding layer of the element body, one end connected to the other end of the first coil and the other end exposed on the mounting surface; and a third conductor embedded in the bump-embedding layer of the element body, one end connected to one end of the second coil and the other end exposed on the mounting surface. a fourth conductor bump embedded in a bump embedding layer of the element body, one end of which is connected to the other end of the second coil and the other end of which is exposed on the mounting surface, and an insulating coating layer that covers the mounting surface without covering at least a portion of the first conductor bump, at least a portion of the second conductor bump, at least a portion of the third conductor bump, or at least a portion of the fourth conductor bump, wherein the element body includes a magnetic material portion made of a magnetic material and a resin material portion made of a resin material, the resin material portion being disposed between the conductor layer and the magnetic material portion, the plurality of side surfaces including a first region made of the coil embedding layer and a second region made of the bump embedding layer, and the conductor layer is embedded in the element body without being exposed from the first region, thereby enabling improved insulation of the side surfaces of the element body.

[0057] In the electronic component, the first regions on the side surfaces may be entirely made of resin material, thereby further improving the insulating properties of the first regions.

[0058] In the electronic component, the second regions on the side surfaces may be entirely made of the resin material portion, and the magnetic material portion may not be exposed. This can further improve the insulating properties of the second regions.

[0059] In the electronic component, a resin material portion may be disposed between each of the first, second, third, and fourth conductive bumps and the magnetic material portion, thereby improving insulation between each of the first, second, third, and fourth conductive bumps and the magnetic material portion.

[0060] In the electronic component, the distance between the first and third conductor bumps and the distance between the second and fourth conductor bumps may be greater than the distance between the first and second conductor bumps and the distance between the third and fourth conductor bumps, thereby making it possible to increase the dielectric strength between conductor bumps connected to different coils.

[0061] In the electronic component, the magnetic material portion does not have to be exposed from the second regions on the side surfaces, which makes it possible to suppress a decrease in the dielectric strength voltage via the magnetic material portion.

[0062] In the electronic component, the first, second, third, and fourth conductor bumps may be exposed from the second regions of the side surfaces, which allows for the formation of solder fillets when the electronic component is mounted on a circuit board.

[0063] In the electronic component, the second regions on the side surfaces may be entirely made of resin material, thereby further improving the insulating properties of the second regions.

[0064] In the electronic component, the base body may further have a support layer that forms an upper surface located opposite the mounting surface, and the plurality of side surfaces may further include third regions made of the support layer, and the third regions of the plurality of side surfaces may be entirely made of the magnetic material portion. This makes it possible to increase inductance.

[0065] In the electronic component, a resin material portion may be disposed between each of the first, second, third, and fourth conductive bumps and the magnetic material portion, thereby ensuring insulation between the conductive bumps and the magnetic material portion.

[0066] In the electronic component, the insulating coating layer is provided around the first conductive bump exposed on the mounting surface, the second conductive bump exposed on the mounting surface, the third conductive bump exposed on the mounting surface, and the fourth conductive bump exposed on the mounting surface, and the magnetic material portion may be exposed in the area of ​​the mounting surface that is not covered by the insulating coating layer, which makes it possible to reduce the amount of insulating coating layer required.

[0067] In the electronic component, the distance between the first and third conductor bumps and the distance between the second and fourth conductor bumps may be greater than the distance between the first and second conductor bumps and the distance between the third and fourth conductor bumps, thereby making it possible to further increase the dielectric strength between conductor bumps connected to different coils.

[0068] In the above electronic component, the conductor layer includes a first conductor layer and a second conductor layer, the first conductor layer includes a first coil pattern having one end connected to the second conductor bump and a second coil pattern having one end connected to a fourth conductor bump, the second conductor layer includes a third coil pattern having one end connected to the first conductor bump and the other end connected to the other end of the first coil pattern, a fourth coil pattern having one end connected to the third conductor bump and the other end connected to the other end of the second coil pattern, a first connection pattern, and a second connection pattern, one end of the first coil pattern is connected to the second conductor bump via the first connection pattern, and one end of the second coil pattern is connected to the fourth conductor bump via the second connection pattern, and the planar size of the second conductor bump may be larger than the planar size of the first connection pattern, and the planar size of the fourth conductor bump may be larger than the planar size of the second connection pattern. This makes it possible to increase the exposed area of ​​the conductor bumps.

[0069] An electronic component according to another aspect of the present disclosure includes: a coil-embedding layer including at least one conductor layer including a conductor pattern forming a first coil and a conductor pattern forming a second coil; a first magnetic resin in which the conductor layer is embedded; and a first insulating member arranged between the first magnetic resin and the conductor layer; a first conductor bump having one end connected to one end of the first coil; a second conductor bump having one end connected to the other end of the first coil; a third conductor bump having one end connected to one end of the second coil; a fourth conductor bump having one end connected to the other end of the second coil; a second magnetic resin in which at least a portion of the first to fourth bump conductors are embedded; and a second insulating member arranged between the second magnetic resin and the first to fourth bump conductors, and the electronic component includes at least a bump-embedding layer stacked with the coil-embedding layer; and a first insulating member formed in the bump-embedding layer. the other ends of the first, second, third, and fourth conductive bumps are each exposed on the mounting surface, the insulating coating layer covers at least a portion of the mounting surface without covering at least a portion of the first, second, third, and fourth conductive bumps exposed on the mounting surface, the side surfaces each include a first region in which a coil embedding layer is disposed and a second region in which a bump embedding layer is disposed, the conductive layer is not exposed in the first region, at least a portion of the first region is covered by a third insulating member disposed in the coil embedding layer, and at least a portion of the second region is covered by a fourth insulating member disposed in the bump embedding layer. This makes it possible to improve the insulation of the side surfaces of the element body.

[0070] In the electronic component, the first regions of the plurality of side surfaces may be entirely covered with the third insulating member, thereby further improving the insulation of the side surfaces of the element body.

[0071] In the above electronic component, portions of the first conductive bumps, the second conductive bumps, the third conductive bumps, and the fourth conductive bumps may be exposed from the second regions on the side surfaces, and regions of the second regions on the side surfaces adjacent to the portions where the first conductive bumps, the second conductive bumps, the third conductive bumps, and the fourth conductive bumps are exposed may be covered with a fourth insulating member. This further enhances the insulation of the side surfaces of the element body, while providing exposed regions of the bumps, thereby improving reliability when mounted on a substrate using solder or the like.

[0072] In the electronic component, the second regions of the side surfaces may be entirely covered with the fourth insulating member, thereby further improving the insulation of the side surfaces of the element body.

[0073] In the electronic component, the first insulating member and the third insulating member may be integrally formed from the same material, the second insulating member and the fourth insulating member may be integrally formed from the same material, and the first magnetic resin and the second magnetic resin may be integrally formed from the same material. In this way, the reliability of the insulating members is improved by forming the insulating members integrally from the same material.

[0074] This application claims the benefit of Japanese Patent Application No. 2023-169181, filed on September 29, 2023, the entire disclosure of which is incorporated herein by reference.

[0075] 10 Base body 10A Coil-embedded layer 10B Bump-embedded layer 10C Support layer 11-14 Side surface 15 Mounting surface 16 Upper surface 17 Magnetic material portion 18 Resin material portion 19 Insulating coating layer 21-24 Terminal electrodes 31, 32, 51, 52, 71, 72 Coil patterns 33, 34, 53, 54 Dummy patterns 41-44 Via conductors 55, 56 Connection patterns 61-64 Via conductors 73, 74 Connection patterns 81-84 Via conductors 91-94 Openings 100 Coil component (electronic component) 101-104 Sacrificial pattern 110 Space 120 Dashed line 131, 132, 140, 150, 160, 170 Coil patterns 141, 142, 144 Dummy patterns 145, 146 Via conductors 152, 154 Dummy patterns 153, 155 Connection patterns 156 to 159 Via conductors 161, 163, 165 Connection pattern 162 Dummy patterns 166 to 169 Via conductors 171, 173, 174 Connection patterns 175, 177 to 179 Via conductors 180 to 184 Resin layers A, B, C Regions B1 to B4 Conductor bumps C1, C2 Coils L0, L1 to L4, L11 to L14 Conductor layer S Base material

Claims

1. An element body including a coil embedding layer and a bump embedding layer, the element body having a mounting surface formed of the bump embedding layer and a plurality of side surfaces perpendicular or nearly perpendicular to the mounting surface; at least one conductor layer embedded in the coil embedding layer of the element body and constituting a first coil and a second coil; a first conductor bump embedded in the bump embedding layer of the element body, one end connected to one end of the first coil and the other end exposed to the mounting surface; a second conductor bump embedded in the bump embedding layer of the element body, one end connected to the other end of the first coil and the other end exposed to the mounting surface; a third conductor bump embedded in the bump embedding layer of the element body, one end connected to one end of the second coil and the other end exposed to the mounting surface; and a fourth conductor bump embedded in the bump embedding layer of the element body, one end connected to the other end of the second coil and the other end exposed to the mounting surface. an insulating coating layer covering the mounting surface without covering at least a portion of the first conductor bumps, at least a portion of the second conductor bumps, at least a portion of the third conductor bumps, and at least a portion of the fourth conductor bumps; wherein the base body includes a magnetic material portion made of a magnetic material and a resin material portion made of a resin material, the resin material portion being disposed between the conductor layer and the magnetic material portion, the multiple side surfaces including a first region made of the coil embedding layer and a second region made of the bump embedding layer, and the conductor layer is embedded in the base body without being exposed from the first region.

2. The electronic component according to claim 1, wherein the first regions of the plurality of side surfaces are entirely made up of the resin material portion.

3. The electronic component according to claim 2, wherein the second regions of the plurality of side surfaces are entirely made up of the resin material portion, and the magnetic material portion is not exposed.

4. The electronic component according to claim 3, wherein the resin material portion is disposed between the magnetic material portion and each of the first conductive bump, the second conductive bump, the third conductive bump and the fourth conductive bump.

5. The electronic component according to claim 4, wherein the distance between the first conductor bump and the third conductor bump, and the distance between the second conductor bump and the fourth conductor bump, are greater than the distance between the first conductor bump and the second conductor bump, and the distance between the third conductor bump and the fourth conductor bump.

6. The electronic component according to claim 1, wherein the magnetic material portion is not exposed from the second regions of the plurality of side surfaces.

7. The electronic component according to claim 6, wherein the first conductor bump, the second conductor bump, the third conductor bump and the fourth conductor bump are exposed from the second regions of the multiple side surfaces.

8. The electronic component according to claim 6, wherein the second regions of the plurality of side surfaces are entirely made up of the resin material portion.

9. The electronic component according to claim 1, wherein the base body further has a support layer constituting an upper surface located opposite the mounting surface, the plurality of side surfaces further include a third region made of the support layer, and the third region of the plurality of side surfaces is entirely constituted by the magnetic material portion.

10. The electronic component according to claim 1, wherein the resin material portion is disposed between each of the first conductive bump, the second conductive bump, the third conductive bump and the fourth conductive bump and the magnetic material portion.

11. The electronic component described in claim 1, wherein the insulating coating layer is provided around the first conductor bump exposed on the mounting surface, around the second conductor bump exposed on the mounting surface, around the third conductor bump exposed on the mounting surface, and around the fourth conductor bump exposed on the mounting surface, and the magnetic material portion is exposed in areas of the mounting surface that are not covered by the insulating coating layer.

12. The electronic component according to claim 1, wherein the distance between the first conductor bump and the third conductor bump, and the distance between the second conductor bump and the fourth conductor bump, are greater than the distance between the first conductor bump and the second conductor bump, and the distance between the third conductor bump and the fourth conductor bump.

13. The conductor layer includes a first conductor layer and a second conductor layer, the first conductor layer includes a first coil pattern having one end connected to the second conductor bump and a second coil pattern having one end connected to the fourth conductor bump, the second conductor layer includes a third coil pattern having one end connected to the first conductor bump and the other end connected to the other end of the first coil pattern, a fourth coil pattern having one end connected to the third conductor bump and the other end connected to the other end of the second coil pattern, a first connection pattern, and a second connection pattern, the one end of the first coil pattern is connected to the second conductor bump via the first connection pattern, the one end of the second coil pattern is connected to the fourth conductor bump via the second connection pattern, and a planar size of the second conductor bump is larger than a planar size of the first connection pattern, The electronic component according to claim 1 , wherein a planar size of the fourth conductor bump is larger than a planar size of the second connection pattern.

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