Transfer method, method for manufacturing electronic device, and transfer member

Abstract

Provided is a transfer method wherein a transfer member (107) is bonded to an adherend (104) on a first substrate (101) by being pressed against the adherend (104), the adherend (104) that is bonded to the transfer member (107) is separated from the first substrate (101) by moving the transfer member (107) away from the first substrate (101), the adherend (104) is bonded to a second substrate (110) by moving the transfer member (107), a second bonding portion (105b) is separated from the adherend (104) while a first bonding portion (105a) remains bonded to the adherend (104) by moving the transfer member (107) away from the second substrate (110), and then the first bonding portion (105a) is separated from the adherend (104) by moving the transfer member (107) away from the second substrate (110).

Description

Transfer method, electronic device manufacturing method, and transfer member

[0001] The present disclosure relates to a transfer method, a method for manufacturing an electronic device, and a transfer member.

[0002] Conventionally, a method has been known in which a composite integrated film (also referred to as an "adherend") formed on a growth substrate is separated from the growth substrate using a stamp (also referred to as a "transfer member"), the adherend is abutted against an apparatus substrate and bonded by intermolecular forces, and the transfer member is then separated from the adherend (see, for example, Patent Document 1).

[0003] JP 2022-79295 A (see FIG. 11, paragraphs 0063-0067)

[0004] However, when the transfer member is separated from the adherend bonded to the device substrate, the adherend may be damaged.

[0005] An object of the present disclosure is to provide a transfer method and a transfer member that make it possible to reduce the risk of damage to an adherend when the transfer member is separated from the adherend.

[0006] Another object of the present disclosure is to provide a method for manufacturing an electronic device that makes it possible to reduce the risk of damage to an adherend when a transfer member is separated from the adherend.

[0007] The transfer method of the present disclosure is a method of transferring an adherend on a first substrate onto a second substrate, the method comprising: pressing a transfer member including a first bonding portion and a second bonding portion against the adherend on the first substrate, thereby elastically deforming the first bonding portion and bonding the first bonding portion and the second bonding portion to the adherend; moving the transfer member away from the first substrate, thereby separating the adherend from the first substrate while the first bonding portion and the second bonding portion remain bonded to the adherend; moving the transfer member toward the second substrate, thereby bonding the adherend to the second substrate; moving the transfer member away from the second substrate, thereby separating the second bonding portion from the adherend while the first bonding portion remains bonded to the adherend; and, after the second bonding portion is separated, further moving the transfer member away from the second substrate, thereby separating the first bonding portion from the adherend.

[0008] The method for manufacturing an electronic device according to the present disclosure includes pressing a transfer member including a first bonding portion and a second bonding portion against an adherend on the first substrate, thereby elastically deforming the first bonding portion and bonding the first bonding portion and the second bonding portion to the adherend; moving the transfer member away from the first substrate, thereby separating the adherend from the first substrate while the first bonding portion and the second bonding portion remain bonded to the adherend; moving the transfer member toward the second substrate, thereby bonding the adherend to the second substrate; moving the transfer member away from the second substrate, thereby separating the second bonding portion from the adherend while the first bonding portion remains bonded to the adherend; and after the second bonding portion is separated, further moving the transfer member away from the second substrate, thereby separating the first bonding portion from the adherend and providing the adherend on the second substrate.

[0009] The transfer member disclosed herein has a joining member that is joined to an adherend by being pressed against the adherend, and the joining member includes a first joining portion that can be joined to the adherend, and a second joining portion that can be joined to the adherend when the first joining portion is joined to the adherend, and is characterized in that the joining member is configured such that when the first joining portion is pressed against the adherend and elastically deforms, the first joining portion and the second joining portion are joined to the adherend, and when the specified pressure is released and the first joining portion restores its original shape, the second joining portion separates from the adherend.

[0010] According to the present disclosure, it is possible to make it difficult for the adherend to be damaged when the transfer member is separated from the adherend.

[0011] 7 is a schematic cross-sectional view showing a growth substrate (first base material) used to form an adherend, which is a transfer target, in a transfer method (electronic device manufacturing method) according to embodiment 1. (A) and (B) are a schematic cross-sectional view and a schematic plan view showing an epitaxial layer formed on a semiconductor wafer, which is a growth substrate. (A) and (B) are a schematic cross-sectional view and a schematic plan view showing a process of forming an adherend including a semiconductor layer. A schematic perspective view showing an example of a composite integrated film as an adherend. A schematic plan view showing a semiconductor wafer on which a plurality of adherends are formed. A schematic perspective view showing a stamp as a transfer member used in the transfer method according to embodiment 1. A schematic cross-sectional view showing an etching treatment of a growth substrate (a portion below the adherend). A schematic cross-sectional view showing the state after the etching treatment of FIG. 7. A schematic cross-sectional view showing a process of bonding a first bonding portion of a bonding member (elastic body) of a stamp according to embodiment 1 to an adherend. An explanatory diagram showing the maximum surface roughness of the contact surface of the bonding member of the stamp and the maximum surface roughness of the adherend. A schematic cross-sectional view showing a process of bonding a second bonding portion of a bonding member of the stamp according to embodiment 1 to an adherend. 1 is a schematic cross-sectional view showing a step (part 1) of moving a bonding member of a stamp according to embodiment 1 while it is bonded to an adherend. FIG. 2 is a schematic cross-sectional view showing a step (part 2) of moving a bonding member of a stamp according to embodiment 1 while it is bonded to an adherend. FIG. 3 is a schematic cross-sectional view showing a step (part 3) of moving a bonding member of a stamp according to embodiment 1 while it is bonded to an adherend. FIG. 4 is a schematic cross-sectional view showing a step (part 1) of bonding an adherend to a device substrate (second base material) using a stamp according to embodiment 1. FIG. 5 is a schematic cross-sectional view showing a step (part 2) of bonding an adherend to a device substrate using a stamp according to embodiment 1. FIG. 6 is a schematic cross-sectional view showing a step (part 1) of separating a stamp according to embodiment 1 from an adherend bonded to a device substrate. FIG. 7 is a schematic cross-sectional view showing a step (part 2) of separating a stamp according to embodiment 1 from an adherend bonded to a device substrate. FIG. 8(A) and FIG. 8(B) are a schematic cross-sectional view and a schematic plan view showing the shape and dimensions of a bonding member (elastic body) of a stamp according to embodiment 1. FIG. 9 is a block diagram showing a schematic configuration of an apparatus for performing a transfer method according to embodiment 1.1 is a flowchart showing a transfer method according to embodiment 1. FIG. 2 is a schematic perspective view showing a stamp as a transfer member used in a transfer method (electronic device manufacturing method) according to embodiment 2. FIG. 3 is a schematic perspective view showing another stamp used in the transfer method according to embodiment 2. FIG. 4 is a schematic cross-sectional view showing a step of bonding a first bonding portion of a bonding member of a stamp to an adherend according to embodiment 2. FIG. 5 is a schematic cross-sectional view showing a step of bonding a second bonding portion of a bonding member of a stamp to an adherend according to embodiment 2. FIG. 6 is a schematic cross-sectional view showing a step (part 1) of moving a bonding member of a stamp in a state bonded to an adherend according to embodiment 2. FIG. 7 is a schematic cross-sectional view showing a step (part 2) of moving a bonding member of a stamp in a state bonded to an adherend according to embodiment 2. FIG. 8 is a schematic cross-sectional view showing a step (part 3) of moving a bonding member of a stamp in a state bonded to an adherend according to embodiment 2. FIG. 9 is a schematic cross-sectional view showing a step (part 1) of bonding an adherend to a device substrate (second base material) by the stamp according to embodiment 2. FIG. 10 is a schematic cross-sectional view showing a step (part 2) of bonding an adherend to a device substrate by the stamp according to embodiment 2. 1 is a schematic cross-sectional view showing a first step of separating a stamp according to a second embodiment from an adherend bonded to a device substrate; FIG. 2 is a schematic cross-sectional view showing a second step of separating a stamp according to a second embodiment from an adherend bonded to a device substrate; FIG. 3 is a schematic cross-sectional view showing a shape and dimensions of a bonding member of a stamp according to a second embodiment; FIG. 4 is a schematic perspective view showing a stamp as a transfer member used in a transfer method (a method for manufacturing an electronic device) according to a third embodiment; FIG. 5 is a schematic cross-sectional view showing a step of bonding a first bonding portion of a bonding member of a stamp according to a third embodiment to an adherend; FIG. 6 is a schematic cross-sectional view showing a step of bonding a second bonding portion of a bonding member of a stamp according to a third embodiment to an adherend; FIG. 7 is a schematic cross-sectional view showing a first step of moving a bonding member of a stamp according to a third embodiment while it is bonded to an adherend; FIG. 8 is a schematic cross-sectional view showing a second step of moving a bonding member of a stamp according to a third embodiment while it is bonded to an adherend;10 is a schematic cross-sectional view showing a first step of bonding an adherend to a device substrate (second base material) using a stamp according to embodiment 3. FIG. 11 is a schematic cross-sectional view showing a second step of bonding an adherend to a device substrate using a stamp according to embodiment 3. FIG. 12 is a schematic cross-sectional view showing a first step of separating the stamp according to embodiment 3 from an adherend bonded to a device substrate. FIG. 13 is a schematic cross-sectional view showing a second step of separating the stamp according to embodiment 3 from an adherend bonded to a device substrate. FIG. 14 is a schematic cross-sectional view showing the shape and dimensions of a bonding member of a stamp according to embodiment 3. FIG. 15 is a schematic cross-sectional view showing a step of bonding a first bonding portion of a bonding member of a stamp as a transfer member used in a transfer method (electronic device manufacturing method) according to embodiment 4 to an adherend. FIG. 16 is a schematic cross-sectional view showing a step of bonding a second bonding portion of a bonding member of a stamp according to embodiment 4 to an adherend. FIG. 17 is a schematic cross-sectional view showing a first step of moving the bonding member of a stamp according to embodiment 4 while it is bonded to an adherend. FIG. 10 is a schematic cross-sectional view showing a step (part 3) of moving a bonding member of a stamp according to embodiment 4 while the bonding member is bonded to an adherend. FIG. 11 is a schematic cross-sectional view showing a step (part 1) of bonding an adherend to a device substrate by a stamp according to embodiment 4. FIG. 12 is a schematic cross-sectional view showing a step (part 2) of bonding an adherend to a device substrate by a stamp according to embodiment 4. FIG. 13 is a schematic cross-sectional view showing a step (part 1) of separating the stamp according to embodiment 4 from the adherend bonded to the device substrate. FIG. 14 is a schematic cross-sectional view showing a step (part 2) of separating the stamp according to embodiment 4 from the adherend bonded to the device substrate.

[0012] A transfer method, a manufacturing method of an electronic device, and a transfer member according to embodiments of the present disclosure will be described below with reference to the drawings. The following embodiments are merely examples, and the embodiments can be appropriately combined and modified.

[0013] The diagrams show coordinate axes of an xyz Cartesian coordinate system to facilitate understanding of the relationships between the diagrams. The x-axis and y-axis are coordinate axes parallel to the surface of the growth substrate as the first base material or the surface of the device substrate as the second base material. The z-axis is the coordinate axis in the thickness direction (i.e., the height direction or depth direction) of the stamp as the transfer member. The -z direction is also referred to as the first direction.

[0014] The transfer method according to the embodiment is a method of transferring an adherend (e.g., a structure) on a first substrate onto a second substrate using a transfer member that can be moved by a transfer device. The adherend is, for example, a structure. The structure is a material that does not have a function by itself, such as a semiconductor film including an epitaxially grown film. The adherend may also be, for example, a functional unit including a semiconductor device. The functional unit is a material that has a function including a metal or organic material other than a semiconductor film, such as a composite integrated film or a wafer.

[0015] The method for manufacturing an electronic device according to the embodiment is a method for transferring an adherend on a first substrate onto a second substrate using a transfer member that can be moved by a transfer device. The adherend is, for example, a semiconductor film including an epitaxially grown film. The electronic device includes a μLED display having a plurality of μLEDs (micro light emitting diodes), a light source device having μLEDs, etc.

[0016] The transfer member according to the embodiment includes a bonding member that bonds to an adherend. The bonding member has a first bonding portion (first bonding region) and a second bonding portion (second bonding region), and bonds to an adherend on a first substrate, separates the adherend from the first substrate, and transfers the adherend to a second substrate. The transfer member includes, for example, an elastic bonding member and a support that supports the elastic bonding member. The bonding member supported by the support is preferably integrally formed from the same material. However, the bonding member can also be formed from a combination of different materials. For example, the base portion on the support side and the deformable portion on the adherend side may be formed from different materials. The support is made of a material harder than the bonding member.

[0017] <<1>> First Embodiment <<1-1>> Adherend and Stamp (Transfer Member)> An adherend (for example, a structure) as a transfer target to be transferred by the transfer method according to the first embodiment will be described.

[0018] 1 is a schematic cross-sectional view showing a growth substrate 101 as a first base material used to form an adherend 104, which is a transfer target in the transfer method according to embodiment 1. The growth substrate 101 is, for example, a silicon substrate whose crystal growth surface (the upper surface in FIG. 1 ) is the (111) plane, i.e., a Si(111) substrate.

[0019] 2A and 2B are schematic cross-sectional and plan views showing an epitaxial layer formed on a semiconductor wafer serving as a growth substrate 101. As shown in FIGS. 2A and 2B, an AlN (aluminum nitride) layer 102 serving as a buffer layer is epitaxially grown on the growth substrate 101, and a GaN (gallium nitride) layer 103 is epitaxially grown thereon to form an epitaxially grown film (also referred to as a "semiconductor film"). The structure of the laminated semiconductor serving as the epitaxially grown film is not limited to the illustrated example. The epitaxially grown film may have three or more semiconductor layers. The epitaxially grown layer may include, in addition to a GaN layer, an AlGaAs (aluminum gallium arsenide) layer, an AlInGaP (aluminum indium gallium phosphide) layer, an InP (indium phosphide) layer, or a Si (silicon) layer.

[0020] 3A and 3B are schematic cross-sectional and plan views illustrating a process for forming an adherend 104 including a semiconductor layer. FIG. 4 is a schematic perspective view illustrating an example of a composite integrated film as the adherend 104. FIG. 5 is a schematic plan view illustrating a semiconductor wafer on which multiple adherends 104 are formed. A patterning photoresist (not shown) is formed on the upper surface of the laminated semiconductor shown in FIG. 2A, and then patterned into an element shape by dry etching, thereby forming the adherend 104, which is an element-shaped structure, shown in FIGS. 3A and 3B and 5. During patterning, etching is performed down to the growth substrate 101, which is a Si substrate. The overetching length t at this time is within the range of 50 to 10,000 nm. As shown in FIG. 5, multiple adherends are formed on the semiconductor wafer, regularly arranged (e.g., in a matrix).

[0021] The adherend 104 may be a composite integrated film as shown in FIG. 4. The composite integrated film has a configuration in which multiple components (e.g., a wiring layer, an electrode layer, etc.) are provided on a thin substrate film. The adherend 104 can be transferred to both adherends with an uneven surface and adherends with a flat surface. The preferred shape of the adherend 104 is a flat surface with high smoothness.

[0022] FIG. 6 is a schematic perspective view showing a stamp 107 as a transfer member used in the transfer method according to the first embodiment. The stamp 107 in FIG. 6 includes multiple bonding members (elastic bodies) 105 formed at positions corresponding to the multiple adherends 104 in FIG. 5 and a support 106 supporting the multiple bonding members 105. As shown in FIG. 6, the bonding member 105 includes a first bonding portion 105a that protrudes in the −z direction (i.e., higher in the −z direction) and a second bonding portion 105b that is lower than the first bonding portion 105a. In other words, a recess 105c is formed in the −z direction of the second bonding portion 105b. The first bonding portion 105a is a portion that is always bonded to the adherend 104 except for when it is separated from the adherend 104 during the transfer process. The contact surface of the second bonding portion 105b is located closer to the support 106 than the contact surface of the first bonding portion 105a. The second bonding portion 105b is bonded to the adherend 104 when separating the adherend 104 from the growth substrate 101 or when bonding the adherend 104 to the device substrate 110. The bonding member 105 is a portion for picking up the adherend 104 as a semiconductor thin film. The bonding member 105 is made of silicone such as PDMS (dimethylpolysiloxane). The support 106 is made of a rigid material that is harder than the bonding member 105. A glass substrate or the like can be used as the support 106.

[0023] Fig. 7 is a schematic cross-sectional view showing the etching treatment of the growth substrate 101. Fig. 8 is a schematic cross-sectional view showing the state after the etching treatment of Fig. 7. The growth substrate 101 shown in Fig. 3(A) is anisotropically etched using an etching solution such as a potassium hydroxide (KOH) aqueous solution, thereby etching a portion of the growth substrate 101 (the portion indicated by 101a) in the horizontal direction, as shown in Fig. 7. As a result, as shown in Fig. 8, the sacrificial layer portion is etched, and the AlN layer 102 of the adherend 104 is placed on the growth substrate 101 in a separated state, not bonded to the growth substrate 101.

[0024] The adherend 104 is not limited to the AlN layer 102 and GaN layer 103 as buffer layers on the growth substrate 101, but may have a structure in which, for example, an AlAs layer is used as a sacrificial layer and an AlGaAs layer or an AlInGaP layer is epitaxially grown thereon. In this case, for example, hydrochloric acid or hydrofluoric acid can be used to etch the sacrificial layer. Furthermore, the adherend 104 may be, for example, an Al ２ O ３ Alternatively, a composite film may be used in which an organic film, a semiconductor film, or an inorganic film is accumulated on a sacrificial layer made of Al, Ti, Au, AuGeNi, or the like. In this case, the sacrificial layer can be etched using, for example, hydrochloric acid, hydrofluoric acid, phosphoric acid, or an iodine-based etchant. The thickness of the adherend 104 is preferably 1 to 100 μm.

[0025] <<1-2>> Transfer Method Fig. 9 is a schematic cross-sectional view showing a step of bonding the first bonding portion 105a of the bonding member 105 of the stamp 107 according to the first embodiment to the adherend 104. Fig. 11 is a schematic cross-sectional view showing a step of bonding the second bonding portion 105b of the bonding member 105 of the stamp 107 to the adherend 104. As shown in Fig. 9, the stamp 107 including the first bonding portion 105a and the second bonding portion 105b is pressed against the adherend 104 on the growth substrate 101, thereby elastically deforming the first bonding portion 105a, and as shown in Fig. 11, the first bonding portion 105a and the second bonding portion 105b are bonded to the adherend 104.

[0026] As shown in FIG. 9, the stamp 107 is brought into contact with the adherend 104, and at this time, the area S of the contact region of the first bonding portion 105a of the bonding member 105 is １ is, for example, 1666 μm ２ 11, when the stamp 107 is further moved downward (in the −z direction), the second bonding portion 105b of the bonding member 105 comes into contact with the adherend 104. At this time, the area S of the region where both the first bonding portion 105a and the second bonding portion 105b of the bonding member 105 come into contact is, for example, 2500 μm ２ 9 is smaller than the area of ​​the region where the adherend 104 and the joining member 105 contact each other in FIG.

[0027] 11 , the amount of movement of the bonding member 105 so that the first bonding portion 105a and the second bonding portion 105b are entirely brought into close contact with the adherend 104 is adjusted in advance based on experiments or the like, and is controlled by a transfer device (shown in FIG. 20 , which will be described later) that stores the amount of movement. The bonding member 105 is made of a material that has extensibility and flexibility, such as PDMS. PDMS has delayed elastic recovery properties, meaning that when stress is released after significant deformation, rapid recovery does not occur, and the PDMS recovers to approximately its original shape after a predetermined time has passed.

[0028] 10 is an explanatory diagram showing the maximum surface roughness of the contact surface of the stamp 107 with the joining member 105 and the maximum surface roughness of the adherend. １０４ is the maximum surface roughness R of the contact surface of the first bonding portion 105a of the bonding member 105 of the stamp 107 that contacts the adherend surface. １０５ａ It is desirable that the maximum surface roughness R １０４ is the maximum surface roughness R of the contact surface of the second bonding portion 105b of the bonding member 105 of the stamp 107 that contacts the adherend surface of the adherend 104. １０５ｂ It is desirable that the maximum surface roughness R105a, R105b is the difference between the most protruding part in the +z direction and the most protruding part in the -z direction on the contact surface (surface) of the joining member 105. Furthermore, the maximum surface roughness R104 is the difference between the most protruding part in the +z direction and the most protruding part in the -z direction on the adherend surface (surface) of the adherend 104. Furthermore, the maximum surface roughness R １０５ａ and maximum surface roughness R １０５ｂ Each of the heights H １ Smaller is preferable.

[0029] 12 to 14 are schematic cross-sectional views showing steps (1 to 3) of moving the bonding member 105 of the stamp 107 according to the first embodiment while it is bonded to the adherend 104. FIG. 12 shows the stamp 107 when it starts to move upward (in the +z direction). FIG. 13 shows the stamp 107 when it starts to move upward (in the +z direction) and peels the adherend 104 from the growth substrate 101. FIG. 14 shows the bonding member 105 restored to its original shape.

[0030] As shown in FIG. 12 , the stamp 107 is moved upward (in the +z direction). At this time, the bonding member 105, which had been elastically deformed by being pressed down from above, attempts to return to its original shape when it is no longer subjected to pressure from above. During this process, the end of the bonded member 105 contacts the adherend 104 due to deformation and is bonded to it by adhesive force. As shown in FIG. 13 , the adherend 104 peels off from the growth substrate 101, starting from the end of the adherend 104. Each figure is a schematic diagram and is depicted in a deformed form. Subsequently, as shown in FIG. 14 , due to its characteristics, the end of the adherend 104 peels off from the growth substrate 101 due to deformation recovery, and the bond between the end of the bonding member 105 and the adherend 104 also peels off. However, the peeling between the lower part of the adherend 104 and the growth substrate 101 is completed before the end of the bonding member 105 peels off.

[0031] 15 and 16 are schematic cross-sectional views showing steps (parts 1 and 2) of bonding an adherend 104 (e.g., a functional unit) to a device substrate 110 (second base material) using a stamp 107 according to embodiment 1. Fig. 15 shows a state in which the adherend 104 is in contact with the device substrate 110. Fig. 16 shows a state in which the bonding member 105 is deformed when the adherend 104 is attached by applying a further load from the state shown in Fig. 15 .

[0032] 17 and 18 are schematic cross-sectional views showing steps (parts 1 and 2) of separating the stamp 107 according to the first embodiment from the adherend 104 bonded to the device substrate. Fig. 17 shows the process of the stamp 107 peeling off from the adherend 104 after the adherend 104 has been attached to the device substrate 110. Fig. 18 shows the state in which the stamp 107 has been separated from the adherend 104 after the adherend 104 has been attached to the device substrate 110.

[0033] 19A and 19B are a schematic cross-sectional view and a schematic plan view showing the shape and dimensions of the bonding member 105 of the stamp 107 according to the first embodiment.

[0034] 14 , after the adherend 104 is peeled off, the bonding member 105 returns to its original shape. The first bonding portion 105 a and the second bonding portion 105 b of the bonding member 105 of the stamp 107 return to their original shapes with respect to the picked-up adherend 104, and hold the adherend 104.

[0035] Next, as shown in Fig. 15, the adherend 104 is transferred onto the device substrate 110 using a stamp 107. At this time, the end of the bonding member 105 is not in contact with the adherend 104, so the bonding member 105 sticks to the adherend 104 from the center. The contact area of ​​the bonding member 105 at this time is S shown in Fig. 19(B). １ In the first embodiment, the area is S １ is 1666 μm ２ is.

[0036] 16, a downward force is applied from above to deform the first bonding portion 105a and the second bonding portion 105b of the bonding member 105, and by pressing down until they come into contact with the end of the adherend 104, the second bonding portion 105b (the end in the first embodiment) also comes into close contact with the device substrate 110. At this time, the contact area of ​​the bonding member 105 is the area of ​​area S shown in FIG. 19(B), and in the first embodiment, area S is 2500 μm ２ 16. Therefore, the contact area between the adherend 104 and the joining member 105 in FIG. 15 is smaller than the contact area between the adherend 104 and the joining member 105 in FIG.

[0037] Finally, as shown in Fig. 17, the stamp 107 is moved upward (in the +z direction), and the second bonding portion 105b of the bonding member 105 is peeled off from the end. At this time, since the end of the bonding member 105 is inside the end of the adherend 104, the adherend 104 is stabilized without being subjected to a force in the direction of peeling after transfer. Finally, as shown in Fig. 18, the stamp 107 is separated, completing the transfer. When the stamp 107 is separated, the W shown in Fig. 19(A) ２The second joining portion 105b (the end region 108 of the joining member 105 in FIG. 16) has a width of W １ The first bonding portion 105a having a width of W １ When the adherend 104 is held down by the first bonding portion 105a having a width of W, the deformation recovery occurs by separating from the end portion. １ The width part also peels off.

[0038] The joining member 105 in Fig. 19A is made of PDMS and has, for example, the following properties: Shore hardness A = 55 [Hs] Young's modulus E = 3.0 [MPa] Vertical spring constant k = 85 [N / m] Adhesion force D = 0.1 [MPa]

[0039] For example, the width W of the joining member 105 ２ The projected area of ​​the part indicated by is S in the following formula. １ + (W ２ ×2) ２ = S Width of protrusion W １ The area of ​​the part indicated by is calculated by S １ Let's say. １ =W １ ×W １ = S × (2 / 3) Area S is 2500 μm ２ If so, the area S １ is 1666 μm ２ Area S １ and the area ratio of area S is a ｒ Then, a ｒ = 2 / 3, the area of ​​the recess is S ３ Then, S ３ = S-S １ = 834 μm ２ In addition, the height H １ is 10 μm.

[0040] Area S １ The force required to crush the first joint portion 105a, which is the region of the repulsive force, can be calculated as follows: Repulsive force = k (vertical spring constant) × H １ = 85 x 10 x 10 －６ [N] =8.5×10 －４ [N] Area S ３The repulsive pressure acting on the area is P ３ Then, the repulsive pressure P ３ = (8.5 x 10 －４ ) / (834 x 10 －１２ ) / 10 －６ = 1.0 [MPa].

[0041] Therefore, a pressure of 1 MPa per unit area is applied to crush the bonding member 105 from the state in Fig. 9 to the state in Fig. 11. When the stamp 107 is peeled off from that state, as shown in Figs. 12 and 13, if the end portion peels off, the stamp returns to its original shape when it is pulled upward (in the +z direction) with an adhesive force exceeding 0.1 MPa, but if the adhesive force is 0.1 MPa or less, a force that peels off the adherend 104 is applied to the end portion.

[0042] The relationship can be expressed as the following equation: S １ = a ｒ ・S (1) S ３ = (1 - a ｒ )×S (2) K=E・S １ / H (3) F=k・H １ (4) P = F / S ３ >D (5) P=E・S １ ・H １ / S ３ ・H>D (6) P=a ｒ ・E.S.H. １ / (1-a ｒ ) S・H>D (7) D<a ｒ E.H. １ / (1-a ｒ ) H (8) a ｒ E.H. １ >D.H.a ｒ ・D・H (9) a ｒ >D.H. / (E.H. １ +D・H) (10)

[0043] When the dimensions are calculated using the above formula, the values ​​(unit: μm) are shown in Table 1 below.

[0044]

[0045] Also, H １ and H ２ It is desirable that H satisfies the following relationship: １ ×20≧H ２ ≧H １ ×2

[0046] Furthermore, the adhesive strength of the joining member 105 to the support 106 relative to the weight of the joining member 105 is necessary and sufficient, so the joining member 105 will not peel off from the support 106 regardless of the thickness of the joining member 105. Furthermore, the adhesive strength of the joining member 105 to the adherend 104 relative to the weight of the adherend 104 is necessary and sufficient, so the joining member 105 will not peel off from the joining member 105 regardless of the thickness of the adherend 104.

[0047] The width of the first bonding portion 105a is narrower than the width of the adherend 104, and the width W １ and the width W of the two second joints 105b ２ The sum of the values ​​(in FIG. 19A, W １ +2・W ２ ) is preferably equal to or greater than the width of the adherend 104.

[0048] As described above, when the joining member 105 of the stamp 107 is peeled off from the adherend 104, the entire stamp 107 is deformed to form a tightly adhered state, and the entire upper surface of the adherend 104 is peeled off by the joining member 105 with a weak force (0.1 MPa or less). At this time, the edge of the adherend 104 is reliably peeled off. Next, the joining member 105 is pulled up with a strong force while the elastic deformation of the joining member 105 returns to its original state, and the entire adherend 104 is stably peeled off.

[0049] By removing the portion of the growth substrate 101 below the adherend 104, the bonding strength between the adherend 104 and the growth substrate 101 is sufficiently weaker than the adhesive strength of PDMS, which is 0.1 MPa. The bonding strength between the adherend 104 and the device substrate 110 is stronger than the bonding strength between the stamp 107 and the adherend 104, being 0.1 MPa or more.

[0050] As described above, by pulling up the stamp 107 after the concave portions have naturally peeled off due to the elasticity of the convex portions, the stamp 107 can be peeled off without the outer periphery of the bonding member 105 pulling on the adherend 104.

[0051] Fig. 20 is a block diagram showing a schematic configuration of a transfer device 150 that performs the transfer method according to embodiment 1. As shown in Fig. 20, the transfer device 150 has a control unit 151, a stamp moving unit 152 that includes a mechanism for moving the stamp 107, and the stamp 107. The control unit 151 includes a control circuit that controls the operation of the stamp moving unit 152. The control unit 151 may have a processor that operates according to a software program. The control unit 151 may be a computer.

[0052] 21 is a flowchart showing the transfer method according to embodiment 1. First, an adherend 104 is formed as an adherend on a growth substrate 101 as a first base material, and a portion of the growth substrate 101 below the adherend 104 is etched (step ST11).

[0053] Next, the transfer device 150 presses the stamp 107 including the first bonding portion 105a and the second bonding portion 105b against the adherend 104 on the growth substrate 101, thereby elastically deforming the first bonding portion 105a and bonding the first bonding portion 105a and the second bonding portion 105b to the adherend 104 (step ST12).

[0054] Next, the transfer device 150 separates the adherend 104 bonded to the stamp 107 from the growth substrate 101 by moving the stamp 107 away from the growth substrate 101 (in embodiment 1, by lifting it up) (step ST13).

[0055] Next, the transfer device 150 moves the stamp 107 to bond the adherend 104 to the device substrate 110 (step ST14). Bonding is achieved by intermolecular bonding forces, and no adhesive is required.

[0056] Next, the transfer device 150 moves the stamp 107 away from the device substrate 110, thereby separating the second bonding portion 105b from the adherend 104 while leaving the first bonding portion 105a bonded to the adherend 104 (step ST15).

[0057] Next, the transfer device 150 separates the first bonding portion 105a from the adherend 104 by moving the stamp 107 away from the device substrate 110 after the second bonding portion 105b has been separated (step ST16).

[0058] The moving speed of the stamp 107 when moving the stamp 107 away from the growth substrate 101 in step ST13 is preferably faster than the moving speed of the stamp 107 when moving the stamp 107 away from the device substrate 110 in steps ST15 and ST16. By increasing the moving speed away from the growth substrate 101 in step ST13, the adherend 104 can be peeled off from the growth substrate 101 before the second bonding portion 105b naturally peels off. On the other hand, by slowly separating the adherend 104 from the stamp 107 after bonding it to the device substrate 110, only the stamp 107 is peeled off after the second bonding portion 105b naturally peels off. This method allows the adherend 104 to be bonded to the device substrate 110 without damaging the edge. Therefore, it is preferable to create a difference in the moving speed.

[0059] <<1-3>> Effects As described above, according to the first embodiment, by forming the stamp 107 from an elastic material such as PDMS and providing a step at the edge of the stamp 107, it is possible to make it difficult for cracks to occur at the edge of the adherend 104 due to stress both when peeling the adherend 104 from the growth substrate 101 and when peeling the stamp 107 from the adherend 104 bonded to the device substrate 110. In addition, transfer can be performed from the edge when peeling, and from the center when attaching.

[0060] 1 to 5, 7, and 8, the block diagram of the transfer device 150 shown in Fig. 20, and the flowchart shown in Fig. 21 also apply to embodiment 2. Embodiment 2 differs from embodiment 1 in the structure of the stamp 207.

[0061] FIG. 22 is a schematic perspective view showing a stamp 207 as a transfer member used in the transfer method (electronic device manufacturing method) according to embodiment 2. FIG. 23 is a schematic perspective view showing another stamp 207 used in the transfer method according to embodiment 2. The stamp in FIG. 23 differs from the stamp in FIG. 22, which has non-penetrating grooves, in that the recesses are grooves that penetrate through the stamp. The stamp 207 in FIG. 22 or 23 includes multiple bonding members (elastic bodies) 205 formed at positions corresponding to the multiple adherends 104 in FIG. 5, and a support 106 that supports the multiple bonding members 205. As shown in FIG. 22 or 23, the bonding member 205 includes a first bonding portion 205a that is convex and protrudes in the −z direction (i.e., higher in the −z direction) and a second bonding portion 205b that is lower than the first bonding portion 205a. In other words, a recess 205c is formed in the −z direction of the second bonding portion 205b. The recess 205c has an inclined surface that becomes shallower as it approaches the end. The bonding member 205 is a portion for picking up the semiconductor thin film as the adherend 104. The material of the bonding member 205 is the same as that of the first embodiment.

[0062] 24 is a schematic cross-sectional view showing a step of bonding a first bonding portion 205a of a bonding member 205 of a stamp 207 according to embodiment 2 to an adherend 104. Fig. 24 shows a state in which the first bonding portion 205a of the bonding member 205 has moved toward the adherend 104 and has come into contact with the adherend 104.

[0063] 25 is a schematic cross-sectional view showing a step of bonding second bonding portion 205b of bonding member 205 of stamp 207 according to embodiment 2 to adherend 104. Fig. 25 is a view showing a state in which bonding member 205 is deformed and second bonding portion 205b is in close contact with adherend 104.

[0064] 26 to 28 are schematic cross-sectional views showing steps (1 to 3) of moving the bonding member 205 of the stamp 207 according to the second embodiment while it is bonded to the adherend 104. FIG. 26 shows the stamp 207 when it starts to move upward (in the +z direction). FIG. 27 shows the stamp 207 when it has moved upward (in the +z direction) and has started to peel the adherend 104 from the growth substrate 101. FIG. 28 shows the bonding member 205 when it has restored its original shape.

[0065] 29 and 30 are schematic cross-sectional views showing steps (parts 1 and 2) of bonding the adherend 104 to the device substrate 110 (second base material) using the stamp 207 according to embodiment 2. Fig. 29 shows a state in which the adherend 104 is in contact with the device substrate 110. Fig. 30 shows a state in which the bonding member 205 is deformed when the adherend 104 is attached by applying a further load from the state shown in Fig. 29 .

[0066] 31 and 32 are schematic cross-sectional views showing steps (parts 1 and 2) of separating the stamp 207 according to the second embodiment from the adherend 104 bonded to the device substrate. Fig. 31 shows the process of the stamp 207 peeling off from the adherend 104 after the adherend 104 has been attached to the device substrate 110. Fig. 32 shows the state in which the stamp 207 has been separated from the adherend 104 after the adherend 104 has been attached to the device substrate 110.

[0067] FIG. 33 is a schematic cross-sectional view showing the shape and dimensions of a bonding member 205 of a stamp 207 according to the second embodiment.

[0068] In the second embodiment, first, as shown in FIG. 24 , a stamp 207 composed of a bonding member 205 and a support 106 is brought into contact with the adherend 104. Then, as shown in FIG. 25 , the stamp 207 is moved downward (in the −z direction) until the contact surfaces of the first bonding portion 205 a and the second bonding portion 205 b of the bonding member 205 and the adherend 104 become parallel. The amount of movement is adjusted based on the results of a previous experiment, etc., so that the bonding member 205 elastically deforms and comes into complete contact, as shown in FIG. 25 . The transfer device 150, which has memorized the amount of movement, moves the stamp 207. As in the first embodiment, the contact area between the bonding member 205 and the adherend 104 in FIG. 24 is smaller than the contact area between the bonding member 205 and the adherend 104 in FIG. 25 . The material of the bonding member 205 is the same as that in the first embodiment.

[0069] Next, as shown in FIG. 26 , the stamp 207 is moved upward (in the +z direction). At this time, the bonding member 205, which had been elastically deformed by being pressed down from above, attempts to return to its original shape when it is no longer subjected to pressure from above. At this time, the deformation causes the end of the bonding member 205 to come into contact with the adherend 104 and bond it to it via adhesive force, so the adherend 104 peels off from the growth substrate 101, starting from the end of the adherend 104. The figure is a schematic diagram, so it is depicted in a deformed manner. Thereafter, as shown in FIG. 27 , due to its properties, the end of the adherend 104 peels off from the growth substrate 101 due to deformation recovery, and the bond between the end of the bonding member 105 and the adherend 104 also peels off. However, the peeling between the lower part of the adherend 104 and the growth substrate 101 is completed before the end of the bonding member 105 peels off.

[0070] 28 , after the adherend 104 is peeled off, the bonding member 205 returns to its original shape. The first bonding portion 205 a and the second bonding portion 205 b of the bonding member 205 of the stamp 207 return to their original shapes with respect to the picked-up adherend 104, and hold the adherend 104.

[0071] Next, as shown in Fig. 29 , the adherend 104 is transferred onto the device substrate 110 using a stamp 207. At this time, too, the end of the bonding member 205 is not in contact with the adherend 104, so the bonding member 205 adheres to the center of the adherend 104. Furthermore, as shown in Fig. 30 , a downward force is applied from above, causing the first bonding portion 205a and the second bonding portion 205b of the bonding member 205 to deform and press down until they come into contact with the end of the adherend 104, thereby causing the end to also adhere tightly to the device substrate 110. As in the first embodiment, the contact area between the bonding member 205 and the adherend 104 in Fig. 30 is larger than the contact area between the bonding member 205 and the adherend 104 in Fig. 31 .

[0072] Finally, as shown in Fig. 31, the stamp 207 is moved upward (in the +z direction), and the second bonding portion 205b of the bonding member 205 is peeled off from the end. At this time, since the end contact portion of the bonding member 205 is partially inside the end of the adherend 104, the adherend 104 is stabilized without being subjected to a force in the direction of peeling after transfer. Finally, as shown in Fig. 32, the stamp 207 is separated to complete the transfer. When the stamp 207 is separated, the W shown in Fig. 33 ２ The second joining portion 205b (the end region 210 of the joining member 205 in FIG. 30) has a width of W １ The first bonding portion 205a having a width of W １ When the adherend 104 is held down by the first bonding portion 205a having a width of W, the deformation recovery occurs by separating from the end portion. １ The width part also peels off.

[0073] The dimension H of the joining member 205 shown in FIG. １ , H ２ , W １ , W ２ The relationship between the widths of the first bonding portions 205a and the width W of the first bonding portions 205a is the same as that in the first embodiment. １ and the width W of the second joint portion 205b ２ The total value of (in Figure 33, 3.W １ +6・W ２) is desirably equal to or greater than the width of the adherend 104. Furthermore, since the adhesive strength of the joining member 205 to the support 106 is necessary and sufficient relative to the weight of the joining member 205, the joining member 205 will not peel off from the support 106 regardless of the thickness of the joining member 205. Furthermore, since the adhesive strength of the joining member 205 to the adherend 104 is necessary and sufficient relative to the weight of the adherend 104, the joining member 205 will not peel off from the joining member 205 regardless of the thickness of the adherend 104.

[0074] As described above, when the bonding member 205 of the stamp 207 is peeled off from the adherend 104, the entire stamp 207 deforms to form a tightly adhered state, and the entire upper surface of the adherend 104 is peeled off by the bonding member 205 with a weak force (0.1 MPa or less). At this time, the edge of the adherend 104 is reliably peeled off. Next, the elastic deformation of the bonding member 205 returns to its original state, and the entire adherend 104 is stably peeled off by pulling it up with a strong force.

[0075] After removing the portion of the growth substrate 101 below the adherend 104, the bonding strength between the adherend 104 and the growth substrate 101 is sufficiently weaker than the adhesive strength of PDMS, which is 0.1 MPa. The bonding strength between the adherend 104 and the device substrate 110 is stronger than that between the stamp 207 and the adherend 104, being 0.1 MPa or more.

[0076] As described above, by pulling up the stamp 207 from a state in which the recessed portion, which is the second bonding portion 205b of the bonding member 205, naturally peels off due to the elasticity of the convex portion, which is the first bonding portion 205a of the bonding member 205, the stamp 207 can be peeled off without the outer periphery of the bonding member 205 pulling on the adherend 104.

[0077] <<2-2>> Effects As described above, according to the second embodiment, in addition to the effects of the first embodiment, by constructing the stamp 207 from an elastic material such as PDMS and providing holes in multiple locations from the center to the edges of the stamp 207, the contact area between the first bonding portion in FIG. 31 and the adherend 104 can be reduced, and when the stamp 207 is peeled off from the adherend 104, cracks due to stress can be made less likely to occur in the center of the adherend 104.

[0078] 1 to 5, 7, and 8, the block diagram of the transfer device 150 shown in Fig. 20, and the flowchart shown in Fig. 21 also apply to embodiment 3. Embodiment 3 differs from embodiment 1 in the structure of the stamp 307.

[0079] FIG. 34 is a schematic perspective view showing a stamp 307 as a transfer member used in the transfer method (electronic device manufacturing method) according to the third embodiment. The stamp 307 in FIG. 34 includes multiple bonding members (elastic bodies) 305 formed at positions corresponding to the multiple adherends 104 in FIG. 5 and a support 106 supporting the multiple bonding members 305. As shown in FIG. 34, the bonding member 305 includes a first bonding portion 305a that protrudes in the −z direction (i.e., higher in the −z direction) and a second bonding portion 305b that is lower than the first bonding portion 305a. In other words, a recess 305c is formed in the −z direction of the second bonding portion 305b. The recess 305c has an inclined surface that becomes shallower as it approaches the end. The bonding member 305 is used to pick up the adherend 104, which is a semiconductor thin film. The material of the bonding member 305 is the same as that of the first embodiment.

[0080] 35 is a schematic cross-sectional view showing a step of bonding first bonding portion 305a of bonding member 305 of stamp 307 according to embodiment 3 to adherend 104. Fig. 35 shows a state in which first bonding portion 305a of bonding member 305 has moved toward and come into contact with adherend 104.

[0081] 36 is a schematic cross-sectional view showing a step of bonding second bonding portion 305b of bonding member 305 of stamp 307 according to embodiment 3 to adherend 104. Fig. 36 is a view showing a state in which bonding member 305 is deformed and second bonding portion 305b is in close contact with adherend 104.

[0082] 37 to 39 are schematic cross-sectional views showing steps (1 to 3) of moving the bonding member 305 of the stamp 307 according to the third embodiment while it is bonded to the adherend 104. FIG. 37 shows the stamp 307 as it starts to move upward (in the +z direction). FIG. 38 shows the stamp 307 as it moves upward (in the +z direction) and begins to peel the adherend 104 from the growth substrate 101. FIG. 39 shows the bonding member 305 restored to its original shape.

[0083] 40 and 41 are schematic cross-sectional views showing steps (parts 1 and 2) of bonding the adherend 104 to the device substrate 110 (second base material) using the stamp 307 according to embodiment 3. Fig. 40 shows a state in which the adherend 104 is in contact with the device substrate 110. Fig. 41 shows a state in which the bonding member 305 is deformed when the adherend 104 is attached by applying a further load from the state shown in Fig. 40 .

[0084] 42 and 43 are schematic cross-sectional views showing steps (parts 1 and 2) of separating the stamp 307 according to embodiment 3 from the adherend 104 bonded to the device substrate. Fig. 42 shows the process of the stamp 307 peeling off from the adherend 104 after the adherend 104 has been attached to the device substrate 110. Fig. 43 shows the state in which the stamp 307 has been separated from the adherend 104 after the adherend 104 has been attached to the device substrate 110.

[0085] FIG. 44 is a schematic cross-sectional view showing the shape and dimensions of a bonding member 305 of a stamp 307 according to the third embodiment.

[0086] In the third embodiment, first, as shown in FIG. 35 , a stamp 307 composed of a bonding member 305 and a support 106 is brought into contact with the adherend 104. Then, as shown in FIG. 36 , the stamp 307 is moved downward (in the −z direction) until the first bonding portion 305 a and the second bonding portion 305 b of the bonding member 305 are parallel to the contact surface of the adherend 104. As in the first embodiment, the contact area between the bonding member 305 and the adherend 104 in FIG. 35 is smaller than the contact area between the bonding member 305 and the adherend 104 in FIG. 36 . The amount of movement is adjusted based on the results of a previous experiment so that the bonding member 305 elastically deforms and comes into complete contact as shown in FIG. 36 , and the stamp 307 is moved by the transfer device 150 that has stored the amount of movement. The material of the bonding member 305 is the same as that in the first embodiment.

[0087] Next, as shown in FIG. 37 , the stamp 307 is moved upward (in the +z direction). At this time, the bonding member 305, which had been elastically deformed by being pressed down from above, attempts to return to its original shape when it is no longer subjected to pressure from above. During this process, the deformation causes the end of the bonded member 305 to come into contact with the adherend 104 and adherend 104 to be adhesively bonded thereto. Therefore, the adherend 104 peels off from the growth substrate 101, starting from the end of the bonded member 305. Note that each figure is a schematic diagram and is depicted in a deformed form. Subsequently, as shown in FIG. 38 , due to its properties, the end of the bonded member 305 gradually peels off from the growth substrate 101 due to recovery from deformation, and the bonded end of the bonded member 105 to the adherend 104 also peels off. However, the peeling between the lower part of the bonded member 104 and the growth substrate 101 is completed before the end of the bonded member 105 peels off.

[0088] 39 , after the adherend 104 is peeled off, the bonding member 305 returns to its original shape. The first bonding portion 305 a and the second bonding portion 305 b of the bonding member 305 of the stamp 307 return to their original shapes with respect to the picked-up adherend 104, and hold the adherend 104.

[0089] Next, as shown in Fig. 40 , the adherend 104 is transferred onto the device substrate 110 using a stamp 307. At this time, too, the end of the bonding member 305 is not in contact with the adherend 104, so the bonding member 305 adheres to the center of the adherend 104. Furthermore, as shown in Fig. 41 , a downward force is applied from above, causing the first bonding portion 305a and the second bonding portion 305b of the bonding member 305 to deform and press down until they come into contact with the end of the adherend 104, so that the end also adheres tightly to the device substrate 110. As in the first embodiment, the contact area between the bonding member 305 and the adherend 104 in Fig. 40 is smaller than the contact area between the bonding member 305 and the adherend 104 in Fig. 41 .

[0090] 42, the stamp 307 is moved upward (in the +z direction), and the second bonding portion 305b of the bonding member 305 is gradually peeled off from the end of the convex portion. At this time, since the end of the bonding member 305 is located inside the end of the adherend 104, the adherend 104 is stabilized without being subjected to a force in the peeling direction after transfer.

[0091] Finally, as shown in Fig. 43, the stamp 307 is separated to complete the transfer. When the stamp 307 is separated, the W ２ The second joining portion 305b (the end region 310 of the joining member 305 in FIG. 41) has a width of W １ The first bonding portion 305a having a width of W １ When the adherend 104 is held down by the first bonding portion 305a having a width of W, the deformation recovery occurs by separating from the end portion. １ The width part also peels off.

[0092] As shown in FIG. 44, the dimension H of the joining member 305 １ , H ２ , W １ , W ２ The relationship between the width of the first bonding portion 305a and the width of the adherend 104 is the same as that in the first embodiment. １ and the width W of the two second joints 305b ２ The sum of the values ​​(in FIG. 44, W １ +2・W ２) is preferably equal to or greater than the width of the adherend 104.

[0093] The adhesive strength of the joining member 305 to the support 106 relative to the weight of the joining member 305 is necessary and sufficient, so the joining member 305 will not peel off from the support 106 regardless of the thickness of the joining member 305. Furthermore, the adhesive strength of the joining member 305 to the adherend 104 relative to the weight of the adherend 104 is necessary and sufficient, so the joining member 305 will not peel off from the joining member 305 regardless of the thickness of the adherend 104.

[0094] As described above, when the bonding member 305 of the stamp 307 is peeled off from the adherend 104, the entire stamp 307 is deformed to form a tightly adhered state, and the bonding member 305 peels off the entire upper surface of the adherend 104 with a weak force (0.1 MPa or less). At this time, the edge of the adherend 104 is peeled off reliably, and then the bonding member 305 is pulled up with a strong force while the elastic deformation of the bonding member 305 returns to its original state, and the entire adherend 104 is peeled off stably.

[0095] After removing the portion of the growth substrate 101 below the adherend 104, the bonding strength between the adherend 104 and the growth substrate 101 is sufficiently weaker than the adhesive strength of PDMS, which is 0.1 MPa. The bonding strength between the adherend 104 and the device substrate 110 is stronger than that between the stamp 307 and the adherend 104, being 0.1 MPa or more.

[0096] As described above, the elasticity of the convex portion of the second bonding portion 305b of the bonding member 305 causes the concave portion to naturally peel off from the adherend 104, and then by pulling up the stamp 307, the stamp 307 can be peeled off without the outer periphery of the bonding member 305 pulling on the adherend 104.

[0097] <<3-2>> Effects As described above, according to the third embodiment, in addition to the effects of the first embodiment, by constructing the stamp 307 from an elastic material such as PDMS and providing an inclination in the recess 305c, when the adherend 104 peels off from the second bonding portion 305b due to the deformation recovery of the first bonding portion 305a, the adherend 104 peels off gradually from the deeper side to the shallower side of the recess 305c, making it less likely that cracks will occur at the end of the adherend 104 due to stress.

[0098] 1 to 4, 7, and 8, the block diagram of the transfer device 150 shown in Fig. 20, and the flowchart shown in Fig. 21 also apply to embodiment 4. Embodiment 4 differs from embodiment 1 in the structure of the stamp 407.

[0099] 45 is a schematic cross-sectional view showing a step of bonding a first bonding portion 405a of a bonding member 405 (elastic body) of a stamp 407 serving as a transfer member used in a transfer method (electronic device manufacturing method) according to embodiment 4 to an adherend 104. Fig. 45 shows a state in which the stamp 407, which is composed of the bonding member 405 and the support 106, is brought into contact with the adherend 104.

[0100] 46 is a schematic cross-sectional view showing a step of bonding the second bonding portion 405b of the bonding member 405 of the stamp 407 according to the fourth embodiment to the adherend 104. Fig. 46 shows a state in which the bonding member 405 is deformed and comes into close contact with the adherend 104.

[0101] 47 to 49 are schematic cross-sectional views showing steps (1 to 3) of moving the bonding member 405 of the stamp 407 according to the fourth embodiment while it is bonded to the adherend 104. FIG. 47 shows the stamp 407 when it starts to move upward (in the +z direction). FIG. 48 shows the state in which the stamp 407 has been moved upward (in the +z direction) and the adherend 104 has been peeled off from the growth substrate 101. FIG. 49 shows the state in which the bonding member 405 has restored to its original shape.

[0102] 50 and 51 are schematic cross-sectional views showing steps (parts 1 and 2) of bonding the adherend 104 to the device substrate 110 using the stamp 407 according to embodiment 4. Fig. 50 shows a state in which the adherend 104 is in contact with the device substrate 110. Fig. 51 shows a state in which the bonding member 405 is deformed when the adherend 104 is attached by applying a further load from the state shown in Fig. 50.

[0103] 52 and 53 are schematic cross-sectional views showing steps (parts 1 and 2) of separating the stamp 407 according to embodiment 4 from the adherend 104 bonded to the device substrate. Fig. 52 shows the process of the stamp 407 peeling off from the adherend 104 after the adherend 104 has been attached to the device substrate 110. Fig. 53 shows the state in which the stamp 407 has been separated from the adherend 104 after the adherend 104 has been attached to the device substrate 110.

[0104] In the fourth embodiment, first, as shown in FIG. 45 , a stamp 407 composed of a bonding member 405 and a support 106 is brought into contact with the adherend 104. Then, as shown in FIG. 46 , the stamp 407 is moved downward (in the −z direction) until the first bonding portion 405 a and the second bonding portion 405 b of the bonding member 405 elastically deform and the contact surface with the adherend 104 becomes flat. As in the first embodiment, the contact area between the bonding member 405 and the adherend 104 in FIG. 45 is smaller than the contact area between the bonding member 405 and the adherend 104 in FIG. 46 . The amount of movement of the bonding member 405 is adjusted based on previously obtained experimental results so that the bonding member 405 elastically deforms and achieves complete contact, as shown in FIG. 46 . The stamp 407 is operated by the transfer device 150 that stores the amount of movement. The material of the bonding member 405 is the same as that in the first embodiment.

[0105] Next, as shown in FIG. 47 , the stamp 407 is moved upward (in the +z direction). At this time, the bonding member 405, which had been elastically deformed by being pressed down from above, attempts to return to its original shape when it is no longer subjected to pressure from above. At this time, because the end of the bonded member 405 is in contact with the adherend 104 and bonded by adhesive force due to the deformation, the adherend 104 peels off from the growth substrate 101, starting from the end of the adherend 104. Note that each figure is a schematic diagram and is depicted in a deformed form. Subsequently, as shown in FIG. 48 , due to its characteristics, the end of the adherend 104 peels off from the growth substrate 101 due to deformation recovery, and the bond between the end of the bonding member 105 and the adherend 104 also peels off. However, the peeling between the lower part of the adherend 104 and the growth substrate 101 is completed before the end of the bonding member 105 peels off.

[0106] 49, after the adherend 104 is peeled off, the bonding member 405 attempts to restore its original shape. The first bonding portion 405a and the second bonding portion 405b of the bonding member 405 of the stamp 407 return to their original shapes with respect to the picked-up adherend 104, and the adherend 104 is held in a state where the restoring elastic force of the first bonding portion 405a is balanced with the adhesive force of the first bonding portion 405a and the rigidity of the adherend 104. At this time, since the original shape of the bonding member 405 is a curved bottom, the adherend 104 is held in a slightly warped state as shown in the figure.

[0107] Next, as shown in Fig. 50 , the adherend 104 held by the stamp 407 is transferred onto the device substrate 110. At this time, the adherend 104 is slightly warped by the bonding member 405, so that the center of the adherend 104 is adhered to. Furthermore, as shown in Fig. 51 , a downward force is applied from above, causing the first bonding portion 405a and the second bonding portion 405b of the bonding member 405 to deform and press down until they come into contact with the edge of the adherend 104, thereby causing the edge to also adhere tightly to the device substrate 110. As in the first embodiment, the contact area between the bonding member 405 and the adherend 104 in Fig. 50 is smaller than the contact area between the bonding member 405 and the adherend 104 in Fig. 51 .

[0108] 52, the stamp 407 is moved upward (in the +z direction), and the bonding member 405 is gradually peeled off from the adherend 104 from the edge toward the center. Finally, as shown in FIG. 53, the stamp 407 is separated from the adherend 104, completing the transfer.

[0109] <<4-2>> Effects As described above, by forming the stamp 407 from an elastic material such as PDMS and curving the first bonding portion 405a and the second bonding portion 405b, it is possible to reduce the likelihood of cracks occurring at the edge of the adherend 104 due to stress both when peeling the adherend 104 from the growth substrate 101 and when peeling the stamp 407 from the adherend 104 bonded to the device substrate 110. In addition, transfer can be performed from the edge when peeling, and from the center when attaching.

[0110] <5> Modifications In the first to fourth embodiments, PDMS is used as the stamp bonding material, but any other material may be used as long as it is an elastic and viscous material. Furthermore, with regard to the shape of the stamp bonding material, other shapes may be adopted as long as there is a step or the like at the end and the shape of the elastic material is such that the end does not come into contact with the adherend 104 before deformation.

[0111] <6> Supplementary Notes Below, various aspects of the present disclosure are summarized as supplementary notes. (Supplementary Note 1) A method for transferring an adherend on a first substrate onto a second substrate, comprising: pressing a transfer member including a first bonding portion and a second bonding portion against the adherend on the first substrate, thereby elastically deforming the first bonding portion and bonding the first bonding portion and the second bonding portion to the adherend; moving the transfer member away from the first substrate, thereby separating the adherend from the first substrate while the first bonding portion and the second bonding portion remain bonded to the adherend; moving the transfer member toward the second substrate, thereby bonding the adherend to the second substrate; moving the transfer member away from the second substrate, thereby separating the second bonding portion from the adherend while the first bonding portion remains bonded to the adherend; and after the second bonding portion is separated, further moving the transfer member away from the second substrate, thereby separating the first bonding portion from the adherend. (Supplementary Note 2) The transfer method according to Supplementary Note 1, characterized in that the movement speed of the transfer member when moving the transfer member away from the first substrate is faster than the movement speed of the transfer member when moving the transfer member away from the second substrate. (Supplementary Note 3) The transfer method according to Supplementary Note 1 or 2, characterized in that the width of the first bonded portion is narrower than the width of the adherend, and the sum of the widths of the first bonded portion and the second bonded portion is equal to or greater than the width of the adherend. (Supplementary Note 4) The transfer method according to any one of Supplementary Notes 1 to 3, characterized in that the contact area between the transfer member and the adherend when the first bonded portion and the second bonded portion are bonded to the adherend is larger than the contact area between the transfer member and the adherend when the transfer member is moved away from the second substrate after the second bonded portion is separated.(Supplementary Note 5) A method for manufacturing an electronic device, comprising: pressing a transfer member including a first bonding portion and a second bonding portion against an adherend on a first substrate, thereby elastically deforming the first bonding portion and bonding the first bonding portion and the second bonding portion to the adherend; moving the transfer member away from the first substrate, thereby separating the adherend from the first substrate while the first bonding portion and the second bonding portion remain bonded to the adherend; moving the transfer member toward a second substrate, thereby bonding the adherend to the second substrate; moving the transfer member away from the second substrate, thereby separating the second bonding portion from the adherend while the first bonding portion remains bonded to the adherend; and after the second bonding portion is separated, further moving the transfer member away from the second substrate, thereby separating the first bonding portion from the adherend and providing the adherend on the second substrate. (Supplementary Note 6) The method for manufacturing an electronic device according to Supplementary Note 5, wherein the moving speed of the transfer member when moving it away from the first substrate is faster than the moving speed of the transfer member when moving it away from the second substrate. (Supplementary Note 7) The method for manufacturing an electronic device according to Supplementary Note 5 or 6, wherein the width of the first bonding portion is narrower than the width of the adherend, and the sum of the widths of the first bonding portion and the second bonding portion is equal to or greater than the width of the adherend. (Supplementary Note 8) The method for manufacturing an electronic device according to any one of Supplementary Notes 5 to 7, wherein the contact area between the transfer member and the adherend when the first bonding portion and the second bonding portion are bonded to the adherend is larger than the contact area between the transfer member and the adherend when the transfer member is moved away from the second substrate after the second bonding portion is separated.(Appendix 9) A transfer member comprising a joining member that joins to an adherend when pressed against the adherend, the joining member comprising: a first joining portion that can be joined to the adherend; and a second joining portion that can be joined to the adherend when the first joining portion is joined to the adherend, the joining member being configured such that the first joining portion and the second joining portion join to the adherend when the first joining portion is pressed against the adherend and elastically deformed, and the second joining portion separates from the adherend when the pressure is released and the first joining portion restores its original shape. (Appendix 10) The transfer member according to Appendix 9, further comprising a support that supports the joining member, the height of the first joining portion being greater than the height of the second joining portion in a first direction from the support toward the adherend. (Appendix 11) The transfer member according to Appendix 10, wherein the second joining portion has a recess whose depth direction is the first direction. (Appendix 12) The transfer member according to any one of Appendices 9 to 11, wherein the second joint is provided on the end side (outside) of the first joint. (Appendix 13) The transfer member according to Appendices 10 or 11, wherein the support is harder than the joining member. (Appendix 14) The transfer member according to any one of Appendices 9 to 13, wherein the width of the second joint is at least half the height of the first joint and not more than 1.5 times the width of the first joint. (Appendix 15) The transfer member according to any one of Appendices 9 to 13, wherein the width of the first joint is at least the height of the first joint. (Appendix 16) The transfer member according to any one of Appendices 9 to 13, wherein the sum of the widths of the first joint and the second joint is at least the value obtained by subtracting the height of the first joint from the height of the joining member including the first joint and the second joint. (Appendix 17) A transfer member described in any one of Appendices 9 to 13, characterized in that the height of the joining member including the first joining portion and the second joining portion is between 2 and 20 times the height of the first joining portion.(Appendix 18) The transfer member according to any one of Appendices 9 to 17, wherein the transfer member satisfies the following conditional formula (A1), and when the first bonding portion is released from a predetermined pressure and deforms, the second bonding portion separates from the adherend. a. １ >A.H. / (E.H. １ + A·H) ... (A1) However, a １ : contact area between the first bonding portion and the adherend A: adhesive strength of the bonding member E: Young's modulus of the bonding member H １ : height of the first bonding portion H: height of the bonding member. (Appendix 19) The transfer member according to any one of Appendices 9 to 17, characterized in that the transfer member satisfies the following conditional formula (A2), and when the first bonding portion is released from a predetermined pressure and deformed, the second bonding portion separates from the adherend. ２ <E.H. １ / (E.H. １ + A·H) ... (A2) However, a ２ : contact area between the second bonding portion and the adherend A: adhesive strength of the bonding member E: Young's modulus of the bonding member H １ : height of the first joint portion H: height of the joint member.

[0112] 101 Growth substrate (first base material), 104 Functional unit (adherend), 105, 205, 305, 405 Bonding member (elastic body), 105a, 205a, 305a, 405a First bonding portion, 105b, 205b, 305b, 405b Second bonding portion, 105c Recess (step portion), 205c, 305c Recess, 106 Support, 107, 207, 307, 407 Stamp (transfer member), 110 Device substrate (second base material).

Claims

1. A method for transferring an adherend on a first substrate onto a second substrate, comprising: pressing a transfer member including a first bonding portion and a second bonding portion against the adherend on the first substrate, thereby elastically deforming the first bonding portion to bond the first bonding portion and the second bonding portion to the adherend; moving the transfer member away from the first substrate, thereby separating the adherend from the first substrate with the first bonding portion and the second bonding portion still bonded to the adherend; moving the transfer member toward the second substrate, thereby bonding the adherend to the second substrate; moving the transfer member away from the second substrate, thereby separating the second bonding portion from the adherend with the first bonding portion still bonded to the adherend; and after the second bonding portion is separated, further moving the transfer member away from the second substrate, thereby separating the first bonding portion from the adherend.

2. The transfer method according to claim 1, characterized in that the moving speed of the transfer member when moving the transfer member away from the first substrate is faster than the moving speed of the transfer member when moving the transfer member away from the second substrate.

3. The transfer method according to claim 1 or 2, characterized in that the width of the first joint is narrower than the width of the adherend, and the sum of the widths of the first joint and the second joint is equal to or greater than the width of the adherend.

4. A transfer method as described in any one of claims 1 to 3, characterized in that the contact area between the transfer member and the adherend when the first bonding portion and the second bonding portion are bonded to the adherend is greater than the contact area between the transfer member and the adherend when the transfer member is moved away from the second base material after the second bonding portion is separated.

5. A method for manufacturing an electronic device, comprising: pressing a transfer member including a first bonding portion and a second bonding portion against an adherend on a first substrate, thereby elastically deforming the first bonding portion to bond the first bonding portion and the second bonding portion to the adherend; moving the transfer member away from the first substrate, thereby separating the adherend from the first substrate with the first bonding portion and the second bonding portion still bonded to the adherend; moving the transfer member toward a second substrate, thereby bonding the adherend to the second substrate; moving the transfer member away from the second substrate, thereby separating the second bonding portion from the adherend with the first bonding portion still bonded to the adherend; and after the second bonding portion is separated, further moving the transfer member away from the second substrate, thereby separating the first bonding portion from the adherend and providing the adherend on the second substrate.

6. The method for manufacturing an electronic device described in claim 5, characterized in that the moving speed of the transfer member when moving the transfer member away from the first substrate is faster than the moving speed of the transfer member when moving the transfer member away from the second substrate.

7. The method for manufacturing an electronic device described in claim 5 or 6, characterized in that the width of the first joint is narrower than the width of the adherend, and the sum of the widths of the first joint and the second joint is greater than or equal to the width of the adherend.

8. A method for manufacturing an electronic device as described in any one of claims 5 to 7, characterized in that the contact area between the transfer member and the adherend when the first bonding portion and the second bonding portion are bonded to the adherend is greater than the contact area between the transfer member and the adherend when the transfer member is moved away from the second base material after the second bonding portion is separated.

9. A transfer member having a joining member which is joined to an adherend by being pressed against the adherend, the joining member including: a first joining portion which can be joined to the adherend; and a second joining portion which can be joined to the adherend when the first joining portion is joined to the adherend; and the joining member is configured such that the first joining portion and the second joining portion are joined to the adherend when the first joining portion is pressed against the adherend and elastically deformed, and the second joining portion is separated from the adherend when the pressure is released and the first joining portion restores its original shape.

10. The transfer member according to claim 9, further comprising a support for supporting the joining member, wherein in a first direction from the support toward the adherend, the height of the first joining portion is higher than the height of the second joining portion.

11. The transfer member according to claim 10, characterized in that the second joint portion has a recess with the first direction as a depth direction.

12. A transfer member according to any one of claims 9 to 11, characterized in that the second joint portion is provided on the end side of the first joint portion.

13. The transfer member according to claim 10 or 11, characterized in that the support is harder than the joining member.

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