Substrate processing device and substrate processing method

Abstract

This substrate processing device comprises a trim machine that divides the peripheral edge of a first substrate of a superposed substrate, which is composed of the first substrate and a second substrate joined to each other, into a plurality of end materials along the peripheral edge of the first substrate and removes the end materials. The trim machine includes: a holding part for holding the superposed substrate; a blade inserted between the first substrate and the second substrate; a rotation part for relatively rotating the blade and the first substrate along the peripheral edge of the first substrate; and an ultrasonic vibrator for vibrating the blade.

Description

Substrate processing device and substrate processing method

[0001] The present disclosure relates to a substrate processing apparatus and a substrate processing method.

[0002] The apparatuses described in Patent Documents 1 and 2 process a laminated substrate. The laminated substrate has a first substrate and a second substrate bonded together. The first substrate has a first dividing surface that divides the first substrate in the radial direction and a plurality of second dividing surfaces that extend radially outward from the first dividing surface, each of which has a modified layer. The apparatus divides and removes the peripheral edge of the first substrate into a plurality of scraps starting from the modified layer.

[0003] International Publication No. 2020 / 105483 International Publication No. 2020 / 246214

[0004] One aspect of the present disclosure provides a technique for preventing scraps from remaining unremoved when dividing the peripheral edge of a substrate into a plurality of scraps and removing them.

[0005] A substrate processing apparatus according to one aspect of the present disclosure includes a trimming machine configured to divide and remove a peripheral edge of a first substrate of an overlapping substrate composed of a first substrate and a second substrate bonded together into a plurality of scraps along the peripheral edge of the first substrate, the trimming machine including a holding unit configured to hold the overlapping substrate, a blade inserted between the first substrate and the second substrate, a rotating unit configured to rotate the blade and the first substrate relatively along the peripheral edge of the first substrate, and an ultrasonic vibrator configured to vibrate the blade.

[0006] According to one aspect of the present disclosure, when the peripheral edge of a substrate is divided into a plurality of scraps and removed, it is possible to prevent scraps from remaining unremoved.

[0007] FIG. 1 is a cross-sectional view showing a substrate processing apparatus according to an embodiment. FIG. 2 is a cross-sectional view showing an example of a laminated substrate after edge trimming. FIG. 3 is a cross-sectional view showing an example of a laminated substrate after thinning. FIG. 4 is a perspective view showing an example of a blade. FIG. 5 is a plan view showing an example of a blade from insertion to removal. FIG. 6 is a plan view showing an enlarged portion of FIG. 5. FIG. 7 is a plan view showing an example of blade insertion. FIG. 8 is a plan view showing an example of blade removal. FIG. 9 is a cross-sectional view showing an example of a third dividing plane. FIG. 10 is a front view showing an example of a crusher. FIG. 11 is a cross-sectional view taken along line XI-XI in FIG. 10. FIG. 12 is an exploded perspective view showing an example of a crusher. FIG. 13 is a flowchart showing an example of the operation timing of the crusher. FIG. 14 is a cross-sectional view showing an example of a feeder, taken along line XIV-XIV in FIG. 15. FIG. 15 is a plan view showing an example of an arrangement of containers on a first turntable. FIG. 16 is a cross-sectional view showing an example of feeding fragments into containers on a second turntable. Figure 17 is a cross-sectional view showing an example of a sealing mechanism. Figure 18 is a cross-sectional view showing an example of an attachment mechanism.

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Note that the same or corresponding components in each drawing are denoted by the same reference numerals, and descriptions thereof may be omitted. In this specification, the X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other. The X-axis direction and the Y-axis direction are horizontal directions, and the Z-axis direction is vertical. The X-axis direction includes the positive X-axis direction and the negative X-axis direction that is opposite to the positive X-axis direction. The Y-axis direction includes the positive Y-axis direction and the negative Y-axis direction that is opposite to the positive Y-axis direction. The Z-axis direction includes the positive Z-axis direction and the negative Z-axis direction that is opposite to the positive Z-axis direction.

[0009] A substrate processing apparatus 2 according to one embodiment will be described with reference to FIGS. 1 to 8 . The substrate processing apparatus 2 processes an overlapping substrate W. The overlapping substrate W includes a first substrate W1 and a second substrate W2 that are bonded together. As shown in FIG. 2 , the substrate processing apparatus 2 divides and removes the peripheral edge W1e of the first substrate W1 along the peripheral edge W1e into a plurality of scraps W1a. This process is called edge trimming. Edge trimming reduces the diameter of the first substrate W1, and moves the peripheral edge W1e of the first substrate W1 radially inward. The scraps W1a have, for example, an arc shape. As shown in FIG. 3 , the bevel of the first substrate W1 can be removed before thinning the first substrate W1, thereby preventing the generation of so-called knife edges (debris indicated by dashed lines in FIG. 3 ).

[0010] The first substrate W1 has, for example, a semiconductor substrate, a device layer, and a bonding layer in this order. The semiconductor substrate is, for example, a silicon wafer or a compound semiconductor wafer. The device layer is, for example, an electronic circuit. The bonding layer is, for example, an oxide layer. The oxide layer is, for example, a silicon oxide layer. The silicon oxide layer is formed of, for example, tetraethyl orthosilicate (TEOS). The second substrate W2, like the first substrate W1, has, for example, a semiconductor substrate, a device layer, and a bonding layer in this order. Note that the second substrate W2 does not necessarily have to have a device layer.

[0011] The laminated substrate W is obtained by bonding the first substrate W1 and the second substrate W2 together with the bonding layer of the first substrate W1 facing the bonding layer of the second substrate W2. After the first substrate W1 and the second substrate W2 are bonded, a modified layer M is formed on the first substrate W1. The modified layer M is formed, for example, by a laser processing device. The laser processing device irradiates the semiconductor substrate with a laser beam from the side opposite the device layer, forming a focal point of the laser beam inside the semiconductor substrate, and forming the modified layer M at the focal point.

[0012] A plurality of modified layers M are formed on each of the first dividing surface D1 and the plurality of second dividing surfaces D2 shown in FIG. 5 . The first dividing surface D1 divides the first substrate W1 in the radial direction. The first dividing surface D1 is a circumferential surface along the peripheral edge W1e of the first substrate W1. The plurality of second dividing surfaces D2 extend radially outward from the first dividing surface D1 in the radial direction. In this embodiment, the number of second dividing surfaces D2 is four, but may be two or more, for example, eight. When the modified layers M are formed, cracks CR are generated that connect the modified layers M to each other. Edge trimming can be performed starting from the modified layers M.

[0013] Note that multiple modified layers M may also be formed on the third dividing surface D3 shown in FIG. 9 . The third dividing surface D3 divides the first substrate W1 in the thickness direction. Multiple modified layers M are formed on the third dividing surface D3 at intervals in the circumferential and radial directions of the first substrate W1, and are arranged concentrically or spirally. The first substrate W1 can be divided in the thickness direction starting from the modified layers M, thereby thinning the first substrate W1. Note that when the first substrate W1 is thinned by grinding, it is not necessary to form modified layers M on the third dividing surface D3.

[0014] As shown in Figure 1, the substrate processing device 2 includes, for example, a trimming machine 10, a crusher 20, an input machine 30, and a control circuit 90. The trimming machine 10 performs edge trimming. The crusher 20 crushes the scrap W1a into a plurality of fragments W1b (see Figure 11). The input machine 30 inputs the fragments W1b into a container (see Figure 14). If the crusher 20 is not provided, the input machine 30 inputs the scrap W1a directly into the container.

[0015] The control circuit 90 is, for example, a computer, and includes an arithmetic unit 91 such as a CPU (Central Processing Unit) and a storage unit 92 such as a memory. The storage unit 92 stores programs that control various processes executed in the substrate processing apparatus 2. The control circuit 90 controls the operation of the substrate processing apparatus 2 by causing the arithmetic unit 91 to execute the programs stored in the storage unit 92.

[0016] The control circuit 90 includes electronic circuits such as a CPU, a field programmable gate array (FPGA), or an application specific integrated circuit (ASIC), and performs the various control operations described in this specification by executing instruction codes stored in a memory or by being a circuit designed for a specific application.

[0017] Next, an example of the trimming machine 10 will be described with reference again to FIGS. 1 to 8 . The trimming machine 10 includes a holder 11, a rotator 12, and a blade 13. The holder 11 holds the superposed substrate W. The holder 11 holds the superposed substrate W horizontally, for example, with the first substrate W1 facing upward. The holder 11 includes, for example, a chuck. The rotator 12 rotates the blade 13 and the first substrate W1 relatively along the peripheral edge W1e of the first substrate W1. The rotator 12 includes, for example, a motor. In this embodiment, the rotator 12 rotates the superposed substrate W together with the holder 11 without rotating the blade 13. However, the blade 13 may also be rotated without rotating the holder 11. In the latter case, the blade 13 is rotated around the center of the first substrate W1. The rotator 12 may be an articulated robot. The blade 13 is inserted between the first substrate W1 and the second substrate W2. The blade 13 is not used to cut the first substrate W1. By inserting the blade 13, the crack CR propagates from the modified layer M. As a result, the edge of the first substrate W1 can be trimmed.

[0018] As shown in Fig. 4, the blade 13 may be plate-shaped. The blade 13 has a horizontal upper surface 13a and a horizontal lower surface 13b. The blade 13 may have a first inclined surface 13c and a second inclined surface 13d at the tip in the insertion direction (i.e., the cutting edge). The first inclined surface 13c and the second inclined surface 13d may each be flat. The first inclined surface 13c has a straight line 13e (described later) at its tip. The second inclined surface 13d has a tapered line 13f (described later) at its tip.

[0019] As shown in Figures 5 and 6, when viewed from the thickness direction of the overlapped substrate W (from the positive side of the Z axis to the negative side of the Z axis), the blade 13 has a straight line 13e and a tapered line 13f at its tip in the insertion direction (i.e., the cutting edge). The straight line 13e is perpendicular to the radial direction of the overlapped substrate W. The tapered line 13f extends radially outward of the overlapped substrate W as it extends from one end of the straight line 13e toward the upstream side in the rotation direction of the overlapped substrate W. The tapered line 13f only needs to be inclined with respect to the straight line 13e. In this embodiment, the tapered line 13f is a straight line, but it may also be a curved line or a combination of a straight line and a curved line. The second inclined surface 13d may not be a flat surface but may be a curved surface, or a combination of a flat surface and a curved surface.

[0020] As shown by the solid line in Fig. 6, when the cutting edge of the blade 13 has a straight line 13e, the contact area between the blade 13 and the superposed substrate W can be increased compared to when the cutting edge of the blade 13 has a circular curve as shown by the two-dot chain line in Fig. 6. For the same force pressing the blade 13 against the superposed substrate W, the larger the contact area, the lower the pressure acting on the superposed substrate W. Therefore, when the cutting edge of the blade 13 has a straight line 13e, the pressure acting on the superposed substrate W can be reduced.

[0021] 6, the tapered line 13f on the cutting edge of the blade 13 allows the first substrate W1 to be separated more gradually from the second substrate W2 as it moves downstream in the direction of rotation of the overlapped substrate W, compared to when the cutting edge has only a straight line 13e, and this prevents the scrap W1a from breaking during removal. If the scrap W1a breaks at a position far from the second dividing surface D2, it becomes difficult to remove the remaining portion of the scrap W1a. The tapered line 13f prevents the scrap W1a from remaining unremoved.

[0022] The control circuit 90 controls the blade 13 to be inserted at a position spaced upstream from one second dividing surface D2 in the rotation direction of the overlapped substrate W, as shown in FIG. 7 , and to be removed at a position spaced downstream from another second dividing surface D2 in the rotation direction of the overlapped substrate W, as shown in FIG. 8 . When the control circuit 90 presses the blade 13 against the first substrate W1 while rotating the first substrate W1, it moves the blade 13 forward and backward so as to avoid the position of the second dividing surface D2. If the blade 13 hits the second dividing surface D2, an impact occurs at that timing because a modified layer M has been formed on the second dividing surface D2. If the impact is strong, the following problems may occur: Unintended cracks may occur, causing scraps W1a to fall at unexpected positions; multiple adjacent scraps W1a may not be separated at the second dividing surface D2 and may fall while remaining connected, resulting in clogging; and the life of the blade 13 may be shortened. According to this embodiment, the control circuit 90 moves the blade 13 forward and backward so as to avoid the position of the second dividing surface D2, thereby solving these problems.

[0023] 5, the trimming machine 10 may include an edge detector 14. The edge detector 14 detects the peripheral edge W1e of the first substrate W1 held by the holder 11. The edge detector 14 has, for example, an image sensor 14a that captures an image of the peripheral edge W1e of the first substrate W1. Note that a displacement sensor or the like can also be used in place of the image sensor 14a.

[0024] The edge detector 14 transmits its detection results (e.g., image data captured by the imaging sensor 14a) to the control circuit 90. The detection results of the edge detector 14 are used, for example, to (A) detect the position of the notch W1n in the rotational direction of the superposed substrate W, (B) detect misalignment (i.e., rotational wobble) between the holding part 11 and the superposed substrate W, or (C) confirm whether removal of the waste material W1a has been completed. (A) and (B) are performed before edge trimming, and (C) is performed after edge trimming. Detection performed before edge trimming is referred to as pre-inspection. Detection performed after edge trimming is referred to as post-inspection.

[0025] By detecting the position of the notch W1n, the control circuit 90 can detect the position of the second dividing surface D2 and control the insertion and removal positions of the blade 13. Furthermore, by detecting misalignment (i.e., rotational wobble) between the holding part 11 and the laminated substrate W, the control circuit 90 can control the X-axis position of the blade 13 for each scrap W1a and suppress fluctuations in the insertion amount of the blade 13.

[0026] Furthermore, the control circuit 90 can determine the quality of the edge-trimmed laminated substrate W by checking whether the removal of the waste material W1a has been completed. If the removal of the waste material W1a has not been completed, that is, if the waste material W1a remains, the control circuit 90 can also change the conditions for the next and subsequent edge trimming (for example, the insertion amount of the blade 13 or the output of the ultrasonic vibrator 15, which will be described later).

[0027] As shown in FIG. 1 , the trimming machine 10 includes an ultrasonic vibrator 15. The ultrasonic vibrator 15 vibrates the blade 13. The ultrasonic vibrator 15 includes, for example, a piezoelectric element. By vibrating the blade 13, the force pressing the blade 13 against the superposed substrate W can be reduced, cracks can be prevented from occurring in unintended positions, and scrap material W1a can be prevented from remaining unremoved. The ultrasonic vibrator 15 preferably vibrates the blade 13 in the insertion direction (positive direction of the X-axis) and the removal direction (negative direction of the X-axis). Compared to vibrating the blade 13 in the thickness direction of the superposed substrate W (positive direction of the Z-axis and negative direction of the Z-axis), chipping at the interface between the first substrate W1 and the second substrate W2 during insertion of the blade 13 can be prevented.

[0028] The trimming machine 10 includes a moving unit 16. The moving unit 16 moves the blade 13 in an insertion direction (positive direction of the X-axis) and a removal direction (negative direction of the X-axis). The moving unit 16 may also move the blade 13 in the thickness direction of the superposed substrate W (positive direction of the Z-axis or negative direction of the Z-axis) so as to insert the cutting edge of the blade 13 into the interface between the first substrate W1 and the second substrate W2. The moving unit 16 moves the blade 13 together with, for example, an ultrasonic vibrator 15. The moving unit 16 may have an elastic body such as a spring to absorb rotational wobble of the superposed substrate W due to misalignment between the holder 11 and the superposed substrate W. The spring is provided between a driving source such as a motor and the ultrasonic vibrator 15.

[0029] The control circuit 90 may perform control to change the output of the ultrasonic vibrator 15 when the blade 13 is inserted and when it is removed. For example, the control circuit 90 may perform control to increase the output of the ultrasonic vibrator 15 when the blade 13 is removed compared to when the blade 13 is inserted. If the output of the ultrasonic vibrator 15 is small when the blade 13 is inserted, it is possible to prevent the vibration of the blade 13 from striking the overlapped substrate W when the cutting edge of the blade 13 is inserted between the first substrate W1 and the second substrate W2. Furthermore, if the output of the ultrasonic vibrator 15 is large when the blade 13 is removed, the scrap W1a is more likely to crack at the second parting surface D2.

[0030] The control circuit 90 may perform control to reduce the output of the ultrasonic vibrator 15 during the period from after insertion to before removal of the blade 13, compared to the period during removal. This can prevent cracks from occurring at unintended positions during the period from after insertion to before removal, and can prevent incomplete removal of the waste material W1a.

[0031] The control circuit 90 may perform control to increase the output of the ultrasonic vibrator 15 in the following order: when inserting the blade 13, during the period from after insertion to before removal, and during removal. The output of the ultrasonic vibrator 15 during the period from after insertion to before removal of the blade 13 may be greater than when inserted and smaller than when removed.

[0032] The trimming machine 10 includes a cup 18. When viewed in the thickness direction of the superposed substrate W held by the holder 11, the cup 18 surrounds the entire periphery W1e of the superposed substrate W and collects scraps W1a. The cup 18 has, for example, a vertical cylindrical portion 18a and a tapered tubular portion 18b that tapers downward from the lower end of the cylindrical portion 18a. The cylindrical portion 18a has an inner diameter larger than the diameter of the superposed substrate W. The scraps W1a are sent from the cup 18 to a crusher 20.

[0033] Next, an example of a shredder 20 will be described with reference to FIGS. 10 to 12. For ease of explanation, the housing 25 shown in FIGS. 11 and 12 is omitted from FIG. 10. The shredder 20 shreds the scrap W1a into multiple fragments W1b along the original periphery W1e. That is, the shredder 20 shreds the scrap W1a into multiple fragments W1b in the longitudinal direction. The fragments W1b are less bulky than the scrap W1a. Therefore, for example, the fragments W1b can be stored in a container (e.g., container C1 shown in FIG. 14) at high density, reducing the frequency of switching between a full container and an empty container. Preferably, the shredder 20 splits the scrap W1a without cutting it. Splitting can reduce the amount of dust generated compared to cutting.

[0034] The crusher 20 includes, for example, a rotating shaft 21, a driving source 22 that rotates the rotating shaft 21, and a rotating roller 23 that rotates together with the rotating shaft 21. The rotating roller 23 has a cylindrical shape. The rotating roller 23 has an annular groove 23a and a storage groove 23b on its outer circumferential surface. The annular groove 23a is provided in an annular shape along the rotation direction of the rotating roller 23. Multiple annular grooves 23a are provided at intervals along the axial direction (X-axis direction) of the rotating shaft 21. The distance between two adjacent annular grooves 23a is shorter than the length of the scrap W1a. The storage groove 23b is formed across the multiple annular grooves 23a and stores the scrap W1a. In this embodiment, the storage groove 23b is linear, but may be curved. The shape of the storage groove 23b may be selected appropriately depending on the shape of the scrap W1a. Multiple storage grooves 23b may be provided at intervals in the rotation direction of the rotating roller 23.

[0035] The crusher 20 is provided with a fixed blade 24 in each of the multiple annular grooves 23a. Similar to the annular grooves 23a, the multiple fixed blades 24 are provided at intervals along the axial direction (X-axis direction) of the rotating shaft 21. As shown in FIG. 11 , the fixed blade 24 is fixed to the housing 25 so as not to rotate with the rotating shaft 21. The fixed blade 24 is, for example, a vertical plate with a notch 24a in the center of its upper end and cutting edges 24b and 24c on either side of the notch 24a. The rotating shaft 21 is inserted into the notch 24a. The cutting edges 24b and 24c may have a cross-sectional shape that tapers upward.

[0036] The fixed blade 24 may be a straight rod, and the configuration of the fixed blade 24 is not particularly limited. The housing 25 rotatably houses the rotating roller 23. The housing 25 is provided with a plurality of insertion grooves 25a spaced apart along the axial direction (X-axis direction) of the rotating shaft 21. One fixed blade 24 is inserted into each of the plurality of insertion grooves 25a and fixed therein. The fixed blades 24 are inserted into the housing 25 from below. The lower surface of the housing 25 is provided with an outlet 25b for discharging the broken pieces W1b. The outlet 25b may be wider as it extends downward.

[0037] The scrap material W1a is supplied from above the shredder 20 and stored in the storage groove 23b of the rotating roller 23. The scrap material W1a is then sandwiched between the rotating roller 23 and the cutting edge 24b of the fixed blade 24 and broken into multiple fragments W1b. The length of the fragments W1b is equal to the distance between two adjacent fixed blades 24. The multiple fragments W1b fall by gravity from the discharge port 25b on the underside of the housing 25 and are supplied to the feeder 30. Note that if the fragments W1b become clogged and the rotating shaft 21 no longer rotates, the drive source 22 may reverse the rotation of the rotating shaft 21. When the cutting edges 24b, 24c are provided on either side of the rotating shaft 21, the scrap material W1a can be crushed regardless of the rotation direction of the rotating shaft 21.

[0038] Next, an example of the operation timing of the crusher 20 will be described with reference to Fig. 13. Steps S101 to S109 shown in Fig. 13 are performed under the control of the control circuit 90. First, a transport device (not shown) loads the laminated substrate W into the substrate processing apparatus 2 (step S101). The control circuit 90 also stops the crusher 20 (step S102). Steps S101 and S102 may be performed either first or simultaneously.

[0039] Next, the control circuit 90 performs a pre-inspection with the crusher 20 stopped (step S103). For example, the edge detector 14 detects the peripheral edge W1e of the first substrate W1 held by the holder 11. The detection result of the edge detector 14 is used, for example, to (A) detect the position of the notch W1n in the rotational direction of the superposed substrate W, and (B) detect misalignment (i.e., rotational wobble) between the holder 11 and the superposed substrate W.

[0040] Next, the control circuit 90 operates the shredder 20 (step S104). For example, the drive source 22 rotates the rotary roller 23 together with the rotary shaft 21. While the shredder 20 is operating, the control circuit 90 performs edge trimming using the trimming machine 10 (step S105). The scrap material W1a generated by the edge trimming is sent to the shredder 20 and crushed into multiple pieces W1b. After S105, the control circuit 90 stops the shredder 20 again (step S106).

[0041] Next, the control circuit 90 performs a post-inspection with the crusher 20 stopped (step S107). For example, the edge detector 14 detects the peripheral edge W1e of the first substrate W1 held by the holder 11. The detection result of the edge detector 14 is used, for example, to confirm whether or not (C) the removal of the waste material W1a has been completed.

[0042] Next, the control circuit 90 operates the crusher 20 again (step S108). Further, a transport device (not shown) carries out the laminated substrate W from the substrate processing apparatus 2 (step S109). Steps S108 and S109 may be performed either first or simultaneously.

[0043] As described above, the control circuit 90 stops the operation of the crusher 20 when the edge detector 14 detects the periphery W1e of the first substrate W1. For example, the control circuit 90 stops the operation of the crusher 20 when the image sensor 14a captures an image of the periphery W1e of the first substrate W1. This prevents the detection accuracy of the edge detector 14 from being reduced by vibrations of the crusher 20, and can improve the detection accuracy. Note that the image captured by the image sensor 14a may be processed while the crusher 20 is in operation.

[0044] The control circuit 90 controls the operation of the crusher 20 when edge trimming is performed by the trimming machine 10. Every time the trimming machine 10 produces an offcut W1a, the crusher 20 crushes the offcut W1a into multiple pieces W1b. This prevents the offcut W1a from clogging the crusher 20. It is preferable that the control circuit 90 keep the crusher 20 operating from the start of edge trimming to the end of edge trimming.

[0045] The control circuit 90 controls the operation of the shredder 20 from after the post-inspection of the kth first substrate W1 (step S107) to before the pre-inspection of the (k+1)th first substrate W1 (step S103). Before the edge trim of the (k+1)th first substrate W1 (step S105), the remaining amount of unshredded scraps W1a can be reduced, preventing the shredder 20 from becoming clogged with scraps W1a.

[0046] Next, an example of the feeder 30 will be described with reference to Figures 14 to 18. The feeder 30 feeds the fragments W1b into the container C1. The container C1 stores the fragments W1b. When the container C1 is filled with the fragments W1b, a lid C2 is attached to the top of the container C1. The container C1 filled with the fragments W1b is then replaced with an empty container C1. The replacement of the container C1 is performed manually or automatically. Note that if the shredder 20 is not present, the feeder 30 feeds the scraps W1a directly into the container C1. The container C1 may store the scraps W1a.

[0047] The feeder 30 has a first rotary table 31 that supports a plurality of containers C1 and a first rotary drive source 32 that rotates the first rotary table 31, and feeds the broken pieces W1b into the plurality of containers C1 in sequence. The plurality of containers C1 are arranged at intervals around the rotation center line of the first rotary table 31, as shown in FIG. 15 . The plurality of containers C1 move in sequence to a position A1 where the broken pieces W1b are fed, a position A2 where the lids C2 are attached, and a position A3 where the containers C1 are replaced with empty containers C1. The arrangement and number of positions A1, A2, and A3 are not particularly limited.

[0048] As described above, the feeder 30 sequentially feeds the fragments W1b into the multiple containers C1 using the first rotary table 31. Therefore, while the fragments W1b are being fed into one container C1, the lid C2 can be attached to the top end of the container C1 filled with the fragments W1b, or the container C1 filled with the fragments W1b can be replaced with an empty container C1, thereby improving the operating rate of the feeder 30.

[0049] The feeder 30 may include a second turntable 33 below the first turntable 31 that supports multiple containers C1, and a second rotary drive source 34 that rotates the second turntable 33. The number of containers C1 can be increased. The rotation center line of the second turntable 33 may be aligned with the rotation center line of the first turntable 31. Although not shown, the multiple containers C1 are arranged at intervals around the rotation center line of the second turntable 33. The multiple containers C1 move sequentially to position A1 where the broken pieces W1b are fed, position A2 where the lids C2 are attached, and position A3 where the containers C1 are replaced with empty containers C1.

[0050] When the inserter 30 has a second turntable 33, a pipe 35 is provided on the first turntable 31. The pipe 35 sends the fragments W1b from above to below the first turntable 31. The pipe 35 is rotated together with the first turntable 31. As shown in Fig. 16, while the pipe 35 is stopped at a specific position A1, the inserter 30 inserts the fragments W1b into a container C1 on the second turntable 33 via the pipe 35.

[0051] As shown in FIG. 17 , the feeder 30 may have a pipe 36 that sends the fragments W1b and a sealing mechanism 37 that seals the passage for the fragments W1b from the lower end of the pipe 36 to the upper end of the container C1. The sealing mechanism 37 can prevent the fragments W1b from scattering. The pipe 36 and the sealing mechanism 37 may be provided above and below the first turntable 31, respectively. Note that, as shown in FIG. 16 , the sealing mechanism 37 may seal the passage for the fragments W1b from the lower end of the pipe 36 to the upper end of the pipe 35. When the shredder 20 is not provided, the sealing mechanism 37 seals the passage for the scraps W1a.

[0052] The piping 36 and the sealing mechanism 37 may be used in combination with a first slide table (not shown) instead of the first rotary table 31. In the latter case, a plurality of containers C1 are arranged at intervals along the sliding direction of the first slide table. A second slide table may be provided below the first slide table instead of the second rotary table 33. In this case, the piping 35 sends the fragments W1b from above to below the first slide table.

[0053] The sealing mechanism 37 includes, for example, a bellows 37a, a cone member 37b, and an elevating mechanism 37c. The bellows 37a is provided at the lower end of the pipe 36. The cone member 37b is provided below the bellows 37a and is tapered upward. The elevating mechanism 37c elevates and lowers the cone member 37b to expand and contract the bellows 37a. The elevating mechanism 37c is, for example, a lifter.

[0054] A ring 37d may be provided at the lower end of the bellows 37a. The weight of the ring 37d stretches the bellows 37a downward. The ring 37d is preferably inserted into the container C1 to prevent the fragments W1b from leaking out of the container C1. A stopper C3 is provided on the inner periphery of the container C1, and the ring 37d is placed on the stopper C3.

[0055] A plurality of protrusions 37e are provided on the inner periphery of the ring 37d. The protrusions 37e are provided at intervals so that the broken pieces W1b can pass through between the protrusions 37e. The protrusions 37e surround the lift shaft 37f. A cone member 37b is provided at the lower end of the lift shaft 37f. The cone member 37b is provided below the protrusions 37e.

[0056] When the lifting mechanism 37c raises the cone member 37b together with the lifting shaft 37f, the cone member 37b pushes up the multiple protrusions 37e. As a result, the ring 37d is pulled out above the container C1, allowing the container C1 to move. Note that as the ring 37d is pushed up, the bellows 37a contracts upward.

[0057] Meanwhile, when the lifting mechanism 37c lowers the cone member 37b together with the lifting shaft 37f, the multiple protrusions 37e and the ring 37d descend due to gravity. The protrusions 37e and the ring 37d continue to descend until the ring 37d hits the stopper C3. Thereafter, the lifting mechanism 37c lowers the cone member 37b together with the lifting shaft 37f, separating the cone member 37b from the protrusions 37e.

[0058] With the cone member 37b separated from the protrusion 37e, the fragments W1b are dropped into the container C1. The fragments W1b fall along the inclined surface of the cone member 37b and are dispersed and contained inside the container C1. The cone member 37b can prevent the fragments W1b from being unevenly distributed. The cone member 37b is disposed inside the container C1.

[0059] The feeder 30 may have a level sensor 38 at the lower end of the cone member 37b. The level sensor 38 detects the height of the fragments W1b contained inside the container C1. The level sensor 38 may have, for example, a proximity sensor or a distance sensor. If the height of the fragments W1b is detected instead of the weight of the fragments W1b, the fragments W1b will not overflow from the container C1 even if the bulk density of the fragments W1b fluctuates. Note that if the crusher 20 is not present, the level sensor 38 detects the height of the scraps W1a.

[0060] When the height level of the fragments W1b reaches a threshold value, the feeder 30 rotates the first turntable 31 or the second turntable 33 to move the container C1. Note that instead of rotating the first turntable 31 or the second turntable 33, the first slide table or the second slide table may slide. In either case, the container C1 can be moved. The feeder 30 feeds the fragments W1b into multiple containers C1 in sequence. Note that if there is no level sensor 38, the container C1 may be moved depending on the number of superimposed substrates W to be processed, etc.

[0061] 18, the feeder 30 may have an attachment mechanism 39 that attaches a lid C2 to the upper end of the container C1. Attaching the lid C2 to the upper end of the container C1 can prevent the fragments W1b from leaking from the inside to the outside of the container C1. The attachment mechanism 39 includes, for example, a cartridge 39a, a transport arm 39b, a suction pad 39c, a lifting mechanism 39d, and a slide mechanism 39e.

[0062] The cartridge 39a accommodates a plurality of stacked lids C2. The plurality of lids C2 are accommodated in through holes that penetrate the cartridge 39a in the vertical direction. The transport arm 39b receives the lids C2 from the cartridge 39a directly below the cartridge 39a and transports the received lids C2 to directly above the container C1. The suction pad 39c adsorbs the lids C2 directly above the container C1. The lifting mechanism 39d raises and lowers the suction pad 39c. The lifting mechanism 39d is, for example, a lifter. The slide mechanism 39e slides the transport arm 39b in the horizontal direction. The slide mechanism 39e includes, for example, a guide that guides the transport arm 39b in the horizontal direction and a motor that slides the transport arm 39b along the guide.

[0063] The transfer arm 39b receives the lid C2 that has fallen off the cartridge 39a directly below the cartridge 39a. The height of the transfer arm 39b is set so that multiple lids C2 do not fall off the cartridge 39a at the same time. The transfer arm 39b then transfers the received lid C2 to directly above the container C1. At this time, the transfer arm 39b supports the lid C2 to be attached to the next container C1 so that it does not fall off the cartridge 39a.

[0064] Next, the lifting mechanism 39d lowers the suction pad 39c and presses it against the lid C2. Subsequently, when the suction pad 39c adsorbs the lid C2, the lifting mechanism 39d raises the suction pad 39c. This separates the lid C2 from the transport arm 39b. In this state, the transport arm 39b slides back to its original position. At this time, the lid C2 to be attached to the next container C1 falls out of the cartridge 39a and is placed on the transport arm 39b.

[0065] Next, the lifting mechanism 39d lowers the suction pad 39c again, and attaches the lid C2 to the container C1. The outer diameter of the lid C2 may be smaller than the inner diameter of the container C1, and the lid C2 may be placed on a stopper C3. The outer diameter of the lid C2 may be larger than the inner diameter of the container C1. After that, when the suction pad 39c releases the suction of the lid C2, the lifting mechanism 39d raises the suction pad 39c to its original position.

[0066] Thereafter, the feeder 30 rotates the first turntable 31 or the second turntable 33 to move the container C1. Note that instead of rotating the first turntable 31 or the second turntable 33, the first slide table or the second slide table may slide. In either case, the container C1 can be moved. The feeder 30 feeds the fragments W1b into the multiple containers C1 in sequence.

[0067] The substrate processing apparatus and substrate processing method according to the present disclosure have been described above, but the present disclosure is not limited to the above-described embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. These naturally fall within the technical scope of the present disclosure.

[0068] This application claims priority based on Japanese Patent Application No. 2023-169273 filed with the Japan Patent Office on September 29, 2023, the entire contents of which are incorporated herein by reference.

[0069] 2 Substrate processing device 10 Trim machine 11 Holding unit 12 Rotating unit 13 Blade 15 Ultrasonic vibrator W Laminated substrate W1 First substrate W1a Scrap material W2 Second substrate

Claims

1. A substrate processing device comprising a trimming machine that divides and removes the edge of a first substrate of an overlapped substrate composed of a first substrate and a second substrate bonded together into a plurality of scrap pieces along the edge of the first substrate, wherein the trimming machine comprises a holding unit that holds the overlapped substrate, a blade that is inserted between the first substrate and the second substrate, a rotating unit that rotates the blade and the first substrate relatively along the edge of the first substrate, and an ultrasonic vibrator that vibrates the blade.

2. The substrate processing device according to claim 1, wherein the ultrasonic vibrator vibrates the blade in an insertion direction and a removal direction.

3. A substrate processing apparatus as described in claim 1 or 2, wherein the rotating section rotates the laminated substrate together with the holding section, and when viewed in the thickness direction of the laminated substrate, the blade has, at its tip in the insertion direction, a straight line perpendicular to the radial direction of the laminated substrate, and a tapered line extending from one end of the straight line toward the upstream side in the rotation direction of the laminated substrate and toward the radially outer side of the laminated substrate.

4. A substrate processing apparatus as described in claim 1 or 2, wherein the trim machine is provided with a moving unit that moves the blade in an insertion direction and a removal direction, the substrate processing apparatus is provided with a control circuit that controls the position of the blade and the output of the ultrasonic vibrator, and the control circuit performs control to change the output of the ultrasonic vibrator when the blade is inserted and removed.

5. The substrate processing apparatus of claim 1 or 2, wherein the trimming machine is provided with a moving unit which moves the blade in an insertion direction and a removal direction; the substrate processing apparatus is provided with a control circuit which controls the position of the blade; the first substrate has a modified layer on each of a first dividing surface which divides the first substrate radially and a plurality of second dividing surfaces which extend radially outward from the first dividing surface, and is divided starting from the modified layer; the rotating unit rotates the laminated substrate together with the holding unit; and the control circuit controls to insert the blade at a position spaced apart from one of the second dividing surfaces upstream in the rotation direction of the laminated substrate, and to remove the blade at a position spaced apart from another of the second dividing surfaces downstream in the rotation direction of the laminated substrate.

6. The substrate processing apparatus according to claim 1 or 2, further comprising a crusher for crushing the scrap material into a plurality of pieces.

7. The substrate processing apparatus of claim 6, wherein the crusher comprises a rotating shaft and a rotating roller which rotates together with the rotating shaft, the rotating roller having on its outer circumferential surface a plurality of annular grooves which are spaced apart along the axial direction of the rotating shaft, and a storage groove which is formed across the plurality of annular grooves and which stores the scrap material, and the crusher comprises a fixed blade which does not rotate together with the rotating shaft in each of the plurality of annular grooves.

8. The substrate processing apparatus of claim 6, wherein the trimmer is equipped with an edge detector that detects the peripheral edge of the first substrate held in the holding portion, and the substrate processing apparatus is equipped with a control circuit that controls operation and stopping of the crusher, and the control circuit controls the operation of the crusher to be stopped when the edge detector detects the peripheral edge of the first substrate.

9. The substrate processing apparatus according to claim 8, wherein the edge detector has an image sensor which images the peripheral edge of the first substrate, and the control circuit controls the operation of the crusher to be stopped when the image of the peripheral edge of the first substrate is captured by the image sensor.

10. The substrate processing apparatus according to claim 8, wherein the control circuit performs edge trimming by the trimmer to divide and remove the peripheral edge of the first substrate into a plurality of scrap pieces, and controls the operation of the crusher when the edge trimming is performed.

11. The substrate processing apparatus of claim 8, wherein the control circuit performs edge trimming in which the trimmer divides and removes the peripheral edge of the first substrate into a plurality of scraps, a pre-inspection in which the edge detector detects the peripheral edge of the first substrate before the edge trim, and a post-inspection in which the edge detector detects the peripheral edge of the first substrate after the edge trim, and the control circuit controls the operation of the crusher from after the post-inspection of a kth first substrate to before the pre-inspection of a (k+1)th first substrate.

12. The substrate processing apparatus according to claim 1 or 2, further comprising a feeder for feeding the scrap material or crushed pieces thereof into a container.

13. The substrate processing apparatus according to claim 12, wherein the loading machine has a first rotating table that supports a plurality of the containers and loads the fragments or scraps into the plurality of containers in sequence.

14. The substrate processing apparatus of claim 13, wherein the loading machine has a second rotating table below the first rotating table that supports a plurality of the containers, and the first rotating table is provided with piping for transporting the fragments or scraps from above to below the first rotating table.

15. The substrate processing apparatus of claim 12, wherein the feeding machine has a pipe for transporting the fragments or scraps, and a sealing mechanism for sealing the passage for the fragments or scraps from the lower end of the pipe to the upper end of the container, the sealing mechanism having a bellows provided at the lower end of the pipe, a cone member provided below the bellows and tapering upward, and a lifting mechanism for expanding and contracting the bellows by raising and lowering the cone member.

16. The substrate processing apparatus according to claim 15, wherein the feeder has a level sensor at the lower end of the cone member for detecting the height level of the fragments or scraps contained inside the container.

17. The substrate processing apparatus according to claim 12, wherein the inserting machine has an attachment mechanism for attaching a lid to the upper end of the container.

18. A substrate processing method comprising: dividing the peripheral edge of the first substrate into a plurality of scrap pieces and removing the divided pieces using the substrate processing apparatus according to claim 1 or 2.

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