Electronic device and control method thereof

Abstract

This electronic device comprises: a substrate; an input / output interface including an input connector and an output connector disposed on the upper surface of the substrate; a conversion module disposed on the lower surface of the substrate; and at least one processor, wherein the at least one processor acquires an input image through the input connector, converts the input image into a converted image on the basis of setting information related to image output, and displays the converted image through a display module.

Description

Electronic device and method of controlling the same

[0001] The present disclosure relates to an electronic device and a control method thereof, and more particularly, to an electronic device that processes an input image received through a connector and a control method thereof.

[0002] Digital video signals can be received via cables to display images received from external devices. There is a need to minimize transmission loss in a high-speed signal interface that includes a connector to receive digital video signals.

[0003] Serial Digital Interface (SDI) is a method for transmitting uncompressed digital video signals over cables. SDI can transmit video at various resolutions (e.g., SD, HD, FHD, UHD, etc.).

[0004] Recently, with the increasing transmission of high-resolution video signals (e.g., 4K 60Hz 12Gbps, 4K 30Hz 6Gbps, etc.) via SDI, the importance of circuit design to improve high-speed signal transmission efficiency has increased. This is because the maximum distance required to transmit high-resolution video increases depending on the circuit design.

[0005] A receiving device (e.g., set-top box) that uses SDI to transmit high-resolution video signals transmitted through a cable can normally display SD, HD, FHD-level resolution or 6Gbps 4K 30hz video signals on a 200M cable and a 70M cable (based on the test specification).

[0006] However, there is a problem that the 12Gbps 4K 60Hz video intermittently cuts off the video on the 70M Cable, making it impossible to provide normal video service.

[0007] A typical SDI connector is positioned on the top surface of the circuit board, and the connector pins can create impedance discontinuities (stub sections). This can lead to a sharp drop in signal quality in these impedance discontinuities.

[0008] The present disclosure is designed to improve the above-described problem, and an object of the present disclosure is to provide an electronic device including a substrate having a connector for receiving an input image and a module for processing the input image arranged on opposite sides, and a method for controlling the same.

[0009] According to one embodiment, an electronic device includes a substrate, an input / output interface including an input connector and an output connector disposed on an upper surface of the substrate, a conversion module disposed on a lower surface of the substrate, and at least one processor, wherein the at least one processor obtains an input image through the input connector, converts the input image into a converted image based on setting information related to image output through the conversion module, and displays the converted image through a display module.

[0010] The electronic device further includes a transmission module connected to the conversion module, and the at least one processor can transmit the converted image to the display module through the transmission module.

[0011] The electronic device further includes a timing module disposed on a lower surface of the substrate, and the at least one processor can obtain compensation information for compensating for a time delay corresponding to the converted image through the timing module, and transmit the converted image and the compensation information to an external device through the output connector. The setting information can include at least one of size information of the display module that will display the converted image, resolution information of the display module, or color information of the display module.

[0012] The pins of the above input connector and the pins of the above output connector can be connected to the lower surface of the above substrate through the above substrate.

[0013] The substrate includes a first capacitor arranged between a pin of the input connector corresponding to a lower surface of the substrate and the conversion module, and a second capacitor arranged between a pin of the output connector corresponding to a lower surface of the substrate and the timing module, and the at least one processor can filter noise through the first capacitor and the second capacitor.

[0014] The at least one processor transmits the input image to the conversion module through a first impedance connecting the pin of the input connector and the first capacitor and a second impedance connecting the first capacitor and the conversion module,

[0015] The converted image can be transmitted to the transmission module through a third impedance connecting the conversion module and the transmission module.

[0016] The at least one processor can transmit the converted image to the timing module through a fourth impedance connecting the transmission module and the timing module, and transmit the converted image and the compensation information to the output connector through a fifth impedance connecting the timing module and the second capacitor and a sixth impedance connecting the second capacitor and a pin of the output connector.

[0017] An electronic device wherein the size of the first impedance is smaller than the size of the second impedance, and the size of the sixth impedance is smaller than the size of the fifth impedance.

[0018] The substrate includes a first discharge element disposed between a pin of the input connector corresponding to a lower surface of the substrate and the first capacitor, and a second discharge element disposed between a pin of the output connector corresponding to a lower surface of the substrate and the second capacitor, and the at least one processor can filter static electricity through the first discharge element and the second discharge element.

[0019] According to one embodiment, a control method of an electronic device including an input / output interface including an input connector and an output connector disposed on an upper surface of a substrate and a conversion module disposed on a lower surface of the substrate includes the steps of: acquiring an input image through the input connector; converting the input image into a conversion image based on setting information related to image output through the conversion module; and displaying the conversion image through a display module.

[0020] The electronic device may further include a transmission module connected to the conversion module, and the control method may further include a step of transmitting the converted image to the display module through the transmission module.

[0021] The electronic device may further include a timing module disposed on a lower surface of the substrate, and the control method may further include a step of obtaining compensation information for compensating for a time delay corresponding to the converted image through the timing module and a step of transmitting the converted image and the compensation information to an external device through the output connector. The setting information may include at least one of size information of the display module that will display the converted image, resolution information of the display module, or color information of the display module.

[0022] The pins of the above input connector and the pins of the above output connector can be connected to the lower surface of the above substrate through the above substrate.

[0023] The substrate includes a first capacitor arranged between a pin of the input connector corresponding to a lower surface of the substrate and the conversion module, and a second capacitor arranged between a pin of the output connector corresponding to a lower surface of the substrate and the timing module.

[0024] The above control method may further include a step of filtering noise through the first capacitor and the second capacitor.

[0025] The control method may further include a step of transmitting the input image to the conversion module through a first impedance connecting the pin of the input connector and the first capacitor and a second impedance connecting the first capacitor and the conversion module, and a step of transmitting the converted image to the transmission module through a third impedance connecting the conversion module and the transmission module.

[0026] The control method may further include a step of transmitting the converted image to the timing module through a fourth impedance connecting the transmission module and the timing module, and a step of transmitting the converted image and the compensation information to the output connector through a fifth impedance connecting the timing module and the second capacitor and a sixth impedance connecting the second capacitor and a pin of the output connector.

[0027] The size of the first impedance may be smaller than the size of the second impedance, and the size of the sixth impedance may be smaller than the size of the fifth impedance.

[0028] The substrate includes a first discharge element disposed between a pin of the input connector corresponding to a lower surface of the substrate and the first capacitor, and a second discharge element disposed between a pin of the output connector corresponding to a lower surface of the substrate and the second capacitor, and the control method may further include a step of filtering static electricity through the first discharge element and the second discharge element.

[0029] FIG. 1 is a drawing for explaining an operation of providing an image through an electronic device according to one embodiment.

[0030] FIG. 2 is a drawing for explaining an operation of providing an image through an electronic device according to one embodiment.

[0031] FIG. 3 is a block diagram illustrating an electronic device according to one embodiment.

[0032] FIG. 4 is a block diagram illustrating an electronic device according to one embodiment.

[0033] FIG. 5 is a diagram for explaining a process of processing an image in an electronic device according to one embodiment.

[0034] FIG. 6 is a diagram for explaining a process of processing an image in an electronic device according to one embodiment.

[0035] FIG. 7 is a drawing for explaining a substrate on which some modules for image processing are arranged at the bottom, according to one embodiment.

[0036] FIG. 8 is a drawing for explaining a substrate on which some modules for image processing are arranged at the bottom, according to one embodiment.

[0037] FIG. 9 is a drawing illustrating some impedances connected to a connector according to one embodiment.

[0038] FIG. 10 is a drawing illustrating some impedances connected to a connector according to one embodiment.

[0039] FIG. 11 is a drawing for explaining impedance on a substrate on which some modules for image processing are arranged on top, according to one embodiment.

[0040] FIG. 12 is a drawing for explaining impedance on a substrate on which some modules for image processing are arranged at the bottom, according to one embodiment.

[0041] FIG. 13 is a diagram for explaining loss values ​​according to frequency depending on the arrangement of modules according to various embodiments.

[0042] FIG. 14 is a drawing for explaining the arrangement of capacitors according to various embodiments.

[0043] FIG. 15 is a diagram for explaining changes in impedance depending on the arrangement of modules according to various embodiments.

[0044] FIG. 16 is a diagram for explaining loss values ​​according to frequency depending on the arrangement of modules according to various embodiments.

[0045] FIG. 17 is a drawing for explaining an eye diagram according to the arrangement of modules according to various embodiments.

[0046] FIG. 18 is a drawing for explaining test results according to the type of image and cable length according to various embodiments.

[0047] FIG. 19 is a drawing for explaining the layout structure of a substrate according to one embodiment.

[0048] FIG. 20 is a flowchart for explaining a method for controlling an electronic device, according to one embodiment.

[0049] Hereinafter, the present disclosure will be described in detail with reference to the attached drawings.

[0050] The terms used in the embodiments of this disclosure have been selected from widely used, current terms, taking into account the functions of this disclosure. However, these terms may vary depending on the intentions of those skilled in the art, precedents, the emergence of new technologies, etc. Furthermore, in certain cases, terms may be arbitrarily selected by the applicant, and in such cases, their meanings will be described in detail in the description of the relevant disclosure. Therefore, the terms used in this disclosure should not be defined simply as names of terms, but rather based on the meanings of the terms and the overall content of this disclosure.

[0051] In this specification, expressions such as “has,” “can have,” “includes,” or “may include” indicate the presence of a feature (e.g., a number, function, operation, or component such as a part), and do not exclude the presence of additional features.

[0052] The expression "at least one of A and / or B" should be understood to mean either "A" or "B" or "A and B".

[0053] As used herein, the expressions “first,” “second,” “first,” or “second,” etc., may describe various components, regardless of order and / or importance, and are only used to distinguish one component from another, but do not limit the components.

[0054] When it is said that a component (e.g., a first component) is “(operatively or communicatively) coupled with / to” or “connected to” another component (e.g., a second component), it should be understood that the component may be directly coupled to the other component, or may be connected through another component (e.g., a third component).

[0055] Singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, terms such as "comprise" or "consist of" are intended to indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but should be understood not to preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0056] In the present disclosure, a "module" or "part" performs at least one function or operation and may be implemented as hardware or software, or as a combination of hardware and software. Furthermore, multiple "modules" or multiple "parts" may be integrated into at least one module and implemented as at least one processor (not shown), excluding any "modules" or "parts" that need to be implemented as specific hardware.

[0057] In this specification, the term user may refer to a person using an electronic device or a device using an electronic device (e.g., an artificial intelligence electronic device).

[0058] An embodiment of the present disclosure will be described in more detail with reference to the attached drawings below.

[0059] FIG. 1 is a drawing for explaining an operation of providing an image through an electronic device (100) according to one embodiment.

[0060] The system (1000) may include an electronic device (100) and an image providing device (200). The electronic device (100) may be a device that provides (or displays) an image to a user.

[0061] The electronic device (100) may include a display or display device. The electronic device (100) may receive an image through the image enhancement device (200) and output the received image through the display or display device. The electronic device (100) may be a device that provides content (e.g., broadcast video). The electronic device (100) may be described as a signage device or a digital signage device.

[0062] The video providing device (200) may be a set-top box. The video providing device (200) may receive video through an external server. The video providing device (200) may provide the received video to the electronic device (100).

[0063] The video providing device (200) may refer to an external server. The video providing device (200) may provide a video to the electronic device (100).

[0064] The electronic device (100) may include at least one display device (100-1, 100-2, 100-3). At least one display device (100-1, 100-2, 100-3) may provide an image received from an image providing device (200).

[0065] The electronic device (100) can transmit an image to the first display device (100-1).

[0066] The first display device (100-1) can receive an image from the electronic device (100). The first display device (100-1) can output the received image. The first display device (100-1) can then transmit the received image to the second display device (100-2).

[0067] The second display device (100-2) can receive images from the first display device (100-1). The second display device (100-2) can output the received images. The second display device (100-2) can then transmit the received images to the third display device (100-3).

[0068] The third display device (100-3) can output the received image.

[0069] The image can be described as image information, image information, image data, frame, frame information, etc.

[0070] For example, at least one display device (100-1, 100-2, 100-3) can provide the same image received from the image providing device (200). Each of at least one display device (100-1, 100-2, 100-3) can output the same image.

[0071] For example, at least one display device (100-1, 100-2, 100-3) may divide and provide an image received from an image providing device (200). A first display device (100-1) may output a first part of the image, a second display device (100-2) may output a second part of the image, and a third display device (100-3) may output a third part of the image. The electronic device (100) may divide the received image based on the arrangement structure of each of the display devices (100-1, 100-2, 100-3). The electronic device (100) may control the division of the image information to be transmitted to each of the display devices (100-1, 100-2, 100-3).

[0072] In FIG. 1, the electronic device (100) is described as including at least one display device (100-1, 100-2, 100-3). According to various embodiments, the electronic device (100) may mean at least one display device (100-1, 100-2, 100-3).

[0073] FIG. 2 is a drawing for explaining an operation of providing an image through an electronic device (100) according to one embodiment.

[0074] The system (2000) may include an electronic device (100) and an image providing device (200). Some operations for the electronic device (100) and the image providing device (200) are described in FIG. 1.

[0075] An electronic device (100) may include at least one image processing device (100-4, 100-5, 100-6) used prior to transmitting an image to at least one display device (100-1, 100-2, 100-3).

[0076] At least one image processing device (100-4, 100-5, 100-6) can perform a processing operation related to an image received through an image providing device (200). The processing operation related to the image may include an operation of converting feature information of the image or an operation of compensating for a time delay of the image. The feature information may include one of an image size, an image brightness, and an image color. A time delay may refer to a problem in which data signals are not synchronized as they are transmitted when data is output from multiple devices. The time delay compensation may include an operation of correcting the time delay so that data is output in sync from the multiple devices.

[0077] The image providing device (200) can receive an input image from the electronic device (100). The received input image can be described as an original image, a source image, image content, source information, etc. The electronic device (100) can transmit the input image to the first image processing device (100-4).

[0078] The first image processing device (100-4) can receive an input image. The first image processing device (100-4) can convert the received input image into a first converted image based on first setting information of the first display device (100-1). The first setting information can include at least one of size information of the first display device (100-1), resolution information that can be provided by the first display device (100-1), and color information that can be provided by the first display device (100-1). The first image processing device (100-4) can transmit the first converted image to the first display device (100-1). The first display device (100-1) can receive the first converted image from the first image processing device (100-4). The first display device (100-1) can output the first converted image. The first image processing device (100-4) can generate (or obtain) first compensation information for compensating for a time delay for the first transformed image. The first image processing device (100-4) can transmit the first transformed image and the first compensation information to the second image processing device (100-5).

[0079] The second image processing device (100-5) can receive a first converted image and first compensation information. The second image processing device (100-5) can convert the received first converted image into a second converted image based on second setting information of the second display device (100-2). The second setting information can include at least one of size information of the second display device (100-2), resolution information that can be provided by the second display device (100-2), and color information that can be provided by the second display device (100-2). The second image processing device (100-5) can transmit the second converted image and the first compensation information to the second display device (100-2). The second display device (100-2) can receive the second converted image and the first compensation information from the second image processing device (100-5). The second display device (100-2) can output the second converted image based on the first compensation information. The second image processing device (100-5) can generate (or obtain) second compensation information for compensating for time delay for the second transformed image. The second image processing device (100-5) can transmit the second transformed image and the second compensation information to the third image processing device (100-6).

[0080] The third image processing device (100-6) can receive a second converted image and second compensation information. The third image processing device (100-6) can convert the received second converted image into a third converted image based on third setting information of the third display device (100-3). The third setting information can include at least one of size information of the third display device (100-3), resolution information that can be provided by the third display device (100-3), and color information that can be provided by the third display device (100-3). The third image processing device (100-6) can transmit the third converted image and the second compensation information to the third display device (100-3). The third display device (100-3) can receive the third converted image and the second compensation information from the third image processing device (100-6). The third display device (100-3) can output the third converted image based on the second compensation information.

[0081] The display device (100-1) may be described as a display module. The image processing device (100-4) may be described as an image processing module.

[0082] According to one embodiment, the first display device (100-1) and the first image processing device (100-4) may be included in the first device. The second display device (100-2) and the second image processing device (100-5) may be included in the second device. The third display device (100-3) and the third image processing device (100-6) may be included in the third device.

[0083] According to one embodiment, the first display device (100-1) may include a first image processing device (100-4). The second display device (100-2) may include a second image processing device (100-5). The third display device (100-3) may include a third image processing device (100-6).

[0084] FIG. 3 is a block diagram illustrating an electronic device (100) according to one embodiment.

[0085] The electronic device (100) may include at least one of a conversion module (30), a transmission module (40), a timing module (50), and an input / output interface (160). The input / output interface (160) may include at least one of an input connector (11) and an output connector (12).

[0086] The conversion module (30), the transmission module (40), the timing module (50), and the input / output interface (160) may be arranged on a substrate (10) included in an electronic device (100). The substrate (10) may be composed of at least one layer and may include a top surface and a bottom surface. The top surface may refer to the uppermost layer, and the bottom surface may refer to the lowermost layer. The substrate (10) may include at least one of a conductive region and an insulator region. The substrate (10) may be described as a circuit board or a printed circuit board.

[0087] In one embodiment, the top surface may be described as the first surface and the bottom surface may be described as the second surface. The input connector (11) and the output connector (12) may be arranged on the first surface of the substrate (10), and the conversion module (30) and / or the timing module (50) may be arranged on the second surface (different from the first surface) of the substrate (10).

[0088] According to one embodiment, at least one processor (120) may be included in the conversion module (30), the transmission module (40), and the timing module (50). The at least one processor (120) may be a concept including at least one integrated circuit. The at least one processor (120) may be described as a processor group, a processor module, a processor unit, etc.

[0089] At least one processor (120) can control various operations performed in the electronic device (100). For example, at least one processor (120) can receive an input image from an external device (or an external source or device) through an input / output interface (160). At least one processor (120) can process the input image according to a preset method or generate (or obtain) compensation information for time delay through a conversion module (30), a transmission module (40), a timing module (50), etc.

[0090] An electronic device (100) may include a substrate (10), an input / output interface (160) including an input connector (11) and an output connector (12) disposed on an upper surface of the substrate (10), a conversion module (30) disposed on a lower surface of the substrate (10), a transmission module (40) connected to the substrate (10), a timing module (50) disposed on the lower surface of the substrate (10), and at least one processor (120) connected to the conversion module (30), the transmission module (40), or the timing module (50).

[0091] The substrate (10) may be a circuit board for arranging at least one hardware component included in an electronic device (100). The substrate (10) may include at least one of a conductor and an insulator. Specific structures related to the substrate (10) are described in FIGS. 9 and 14.

[0092] At least one processor (120) can obtain an input image through an input connector (11), convert the input image into a converted image based on setting information related to image output through a conversion module (30), transmit the converted image to a display module through a transmission module (40), obtain compensation information for compensating for a time delay corresponding to the converted image through a timing module (50), and transmit the converted image and compensation information to an external device through an output connector (12).

[0093] At least one processor (120) can receive an input image through an input connector (11). The at least one processor (120) can obtain the input image from an external source. The external source may be a content providing device that provides content. For example, the external source may be a device that stores content and provides the content directly. For example, the external source may be a device that receives content through an external server and provides the received content. The input image may be described as an original image, a source image, image content, source information, etc.

[0094] The input image may include at least one of an image signal and an audio signal. For example, the input image may include both an image signal and an audio signal. The input image may be described as input content, input source, input information, input signal, etc.

[0095] The conversion module (30) may be an EQ (Equalization) module. The conversion module (30) may include an equalizer module. The conversion module (30) may convert characteristic information of an image. The conversion module (30) may convert an image based on setting information of a display device to which the image is output. The image output by the conversion module (30) may be described as a converted image (or a first converted image).

[0096] A converted image may include at least one of a converted image signal and a converted audio signal. For example, the converted image may include both a converted image signal and a converted audio signal. The converted image may be described as converted content, modified content, converted information, etc.

[0097] The conversion module (30) can be described as a signal conversion module, a content conversion module, a restoration module, etc.

[0098] The conversion module (30) can extract feature information from an input signal and change the extracted feature information based on setting information related to the display device (or display module).

[0099] The image received by the conversion module (30) may include both an image signal and an audio signal. The conversion module (30) may perform a conversion operation on at least one of the image signal and the audio signal included in the received image.

[0100] The transformation module (30) can perform a function of restoring a received input image. The restoration function may include an operation of transforming the original image into an input image suitable for a display device (or display module).

[0101] The configuration information may include at least one of size information of the display module that will display the converted image, resolution information of the display module, or color information of the display module.

[0102] The configuration information may include specification information of the display module on which the converted image will be displayed. The specification information may include at least one of size information, resolution information, color information, ratio information, refresh rate information, and brightness information supported by the display module.

[0103] The action of converting the input image into a converted image may be to provide a suitable screen (or a screen intended by the user) to the viewer through the display module.

[0104] The transmission module (40) may include a bridge integrated circuit. The transmission module (40) may perform an operation of transmitting a converted image to a display module (display or display device).

[0105] According to one embodiment, the transmission module (40) may be placed on the upper surface of the substrate (10). A description related to this is described in FIG. 7.

[0106] According to one embodiment, the transmission module (40) may be placed on the lower surface of the substrate (10). A description related to this is described in FIG. 8.

[0107] The timing module (50) may be a module that performs a compensation operation for a time delay. The electronic device (100) may include multiple displays or multiple display devices. A compensation operation for a time delay may be performed to synchronize images output from multiple displays (or display devices). The timing module (50) may obtain compensation information (or first compensation information). The compensation information may be described as time compensation information, delay information for time compensation, timing information, sync information, etc.

[0108] Descriptions related to the conversion module (30), transmission module (40), timing module (50), etc. are described in Fig. 5.

[0109] At least one processor (120) can transmit a converted image to a display module through a transmission module (40) and control the display module to display the converted image.

[0110] According to one embodiment, a display module may be included in an electronic device (100). At least one processor (120) may transmit a converted image to the display module via a transmission module (40). At least one processor (120) may transmit the converted image to an image processor included in the electronic device (100). The image processor may perform some processing operations necessary to display the converted image on the display module. The image processor may process the converted image and transmit it to the display module. For convenience of explanation, an image before a processing operation of the image processor may be described as a converted image (or a converted image, a first converted image), and an image after a processing operation of the image processor may be described as a processed image (or a processed image, a second converted image).

[0111] According to one embodiment, the display module may be included in an external display device. At least one processor (120) may transmit a converted image to the external display device via the transmission module (40).

[0112] For example, the electronic device (100) and the external display device may be connected with separate connectors. The electronic device (100) and the external display device may transmit the converted image to the external display device using a separate connector other than the input connector (12) and the output connector (11).

[0113] For example, the electronic device (100) and the external display device may be connected via a wired or wireless communication interface. A communication session may be established between the electronic device (100) and the external display device via a wired communication interface (e.g., a communication line) or a wireless communication interface (e.g., a short-range communication method). At least one processor (120) may transmit a converted image to the external display device via the wired or wireless communication interface. The external display device may receive the converted image and display the converted image via a display module.

[0114] The pin (11-1) of the input connector (11) and the pin of the output connector can be connected to the lower surface of the substrate (10) through the substrate (10). Descriptions related to this are described in FIGS. 6, 7, and 8.

[0115] The electronic device (100) may include a first capacitor (21) arranged between a pin (11-1) of an input connector (11) corresponding to the lower surface of the substrate (10) and a conversion module (30).

[0116] The electronic device (100) may include a second capacitor (22) disposed between a pin (12-1) of an output connector (12) corresponding to the lower surface of the substrate (10) and a timing module (50).

[0117] At least one processor (120) can filter noise through the first capacitor (21) and the second capacitor (22).

[0118] The first capacitor (21) and the second capacitor (22) can remove noise or stabilize impedance. The first capacitor (21) and the second capacitor (22) can be described as a noise filter, a decoupling capacitor, etc.

[0119] At least one processor (120) can transmit an input image to a conversion module (30) through a first impedance connecting a pin (11-1) of an input connector (11) and a first capacitor (21) and a second impedance connecting the first capacitor (21) and a conversion module (30), and can transmit a converted image to a transmission module (40) through a third impedance connecting the conversion module (30) and the transmission module (40). Descriptions related to this are described in the embodiment (710) of FIG. 7 and the embodiment (810) of FIG. 8.

[0120] At least one processor (120) can transmit a converted image to the timing module (50) through a fourth impedance connecting the transmission module (40) and the timing module (50), and can transmit the converted image and compensation information to the output connector (12) through a fifth impedance connecting the timing module (50) and the second capacitor (22) and a sixth impedance connecting the second capacitor (22) and the pin (12-1) of the output connector (12). Descriptions related to this are described in the embodiment (720) of FIG. 7 and the embodiment (820) of FIG. 8.

[0121] The magnitude of the first impedance may be smaller than the magnitude of the second impedance, and the magnitude of the sixth impedance may be smaller than the magnitude of the fifth impedance. A description thereof is provided in FIGS. 9 and 10.

[0122] The electronic device (100) may include a first discharge element disposed between a pin (11-1) of an input connector (11) corresponding to the lower surface of a substrate (10) and a first capacitor (21), and a second discharge element disposed between a pin (12-1) of an output connector (12) corresponding to the lower surface of a substrate (10) and a second capacitor (22).

[0123] The discharge element may be described as an ESD (Electrostatic Discharge) diode, a discharge diode, etc.

[0124] At least one processor (120) can filter static electricity through the first discharge element and the second discharge element. A description related to this is described in FIG. 19.

[0125] The input / output interface (160) may be a serial digital interface (SDI).

[0126] The interface structure of the electronic device (100) can resolve impedance imbalance. The electronic device (100) can reduce transmission loss and increase data transmission efficiency. Details related to this are described in FIGS. 11, 12, 13, 14, 15, 16, 17, and 18.

[0127] The electronic device (100) can improve the quality of an image provision service by minimizing signal transmission loss in a high-speed signal I / F (BW Freq. 10 Gbps or higher) using a Dip Type connector. A device for transmitting an image signal (e.g., a driver) and a device for receiving an image signal (e.g., a receiver) can transmit (or receive) an image signal through an improved circuit board.

[0128] FIG. 4 is a block diagram illustrating an electronic device (100) according to one embodiment.

[0129] Referring to FIG. 4, the electronic device (100) may include at least one of a memory (110), at least one processor (120), a communication interface (130), a display (140), an operation interface (150), an input / output interface (160), a speaker (170), a microphone (180), and a camera (190). The display (140) may be described as a display module or a display device.

[0130] The memory (110) may be implemented as an internal memory such as a ROM (e.g., an electrically erasable programmable read-only memory (EEPROM)) or a RAM included in at least one processor (120), or may be implemented as a separate memory from at least one processor (120). In this case, the memory (110) may be implemented as a memory embedded in the electronic device (100) or as a memory detachable from the electronic device (100) depending on the purpose of data storage. For example, data for driving the electronic device (100) may be stored in a memory embedded in the electronic device (100), and data for expanding functions of the electronic device (100) may be stored in a memory detachable from the electronic device (100).

[0131] In the case of memory embedded in the electronic device (100), it may be implemented as at least one of volatile memory (e.g., dynamic RAM (DRAM), static RAM (SRAM), or synchronous dynamic RAM (SDRAM)), non-volatile memory (e.g., one time programmable ROM (OTPROM), programmable ROM (PROM), erasable and programmable ROM (EPROM), electrically erasable and programmable ROM (EEPROM), mask ROM, flash ROM, flash memory (e.g., NAND flash or NOR flash), etc.), hard drive, or solid state drive (SSD), and in the case of memory that can be attached or detached to the electronic device (100), it may be implemented in the form of a memory card (e.g., compact flash (CF), secure digital (SD), micro secure digital (Micro-SD), mini secure digital (Mini-SD), extreme digital (xD), multi-media card (MMC), etc.), external memory that can be connected to a USB port (e.g., USB memory), etc.

[0132] The memory (110) can store at least one instruction. Based on the instruction stored in the memory (110), at least one processor (120) can perform various operations.

[0133] At least one processor (120) may be implemented as a digital signal processor (DSP), a microprocessor, or a time controller (TCON) that processes digital signals. However, the present invention is not limited thereto, and may include one or more of a central processing unit (CPU), a micro controller unit (MCU), a micro processing unit (MPU), a controller, an application processor (AP), a graphics-processing unit (GPU), a communication processor (CP), or an advanced reduced instruction set computer (RISC) machines (ARM) processor, or may be defined by the relevant terminology. At least one processor (120) may be implemented as a system on chip (SoC) having a built-in processing algorithm, a large scale integration (LSI), or may be implemented in the form of a field programmable gate array (FPGA). At least one processor (120) may perform various functions by executing computer executable instructions stored in a memory.

[0134] The communication interface (130) is a component that performs communication with various types of external devices according to various types of communication methods. The communication interface (130) may include a wireless communication module or a wired communication module. Each communication module may be implemented in the form of at least one hardware chip.

[0135] A wireless communication module may be a module that communicates wirelessly with an external device. For example, the wireless communication module may include at least one of a Wi-Fi module, a Bluetooth module, an infrared communication module, or other communication modules.

[0136] Wi-Fi and Bluetooth modules can communicate via Wi-Fi and Bluetooth, respectively. When using a Wi-Fi or Bluetooth module, various connection information, such as the service set identifier (SSID) and session key, is first transmitted and received. This information is then used to establish a communication connection before various other information can be transmitted and received.

[0137] Infrared communication modules perform communication based on infrared communication (IrDA, infrared Data Association) technology, which transmits data wirelessly over short distances using infrared light, which is between visible light and millimeter waves.

[0138] In addition to the above-described communication method, other communication modules may include at least one communication chip that performs communication according to various wireless communication standards such as zigbee, 3G (3rd Generation), 3GPP (3rd Generation Partnership Project), LTE (Long Term Evolution), LTE-A (LTE Advanced), 4G (4th Generation), 5G (5th Generation), etc.

[0139] A wired communication module may be a module that communicates with an external device via a wire. For example, the wired communication module may include at least one of a Local Area Network (LAN) module, an Ethernet module, a paired cable, a coaxial cable, a fiber optic cable, or an Ultra Wide-Band (UWB) module.

[0140] According to various embodiments, the communication interface (130) may utilize the same communication module (e.g., a Wi-Fi module) to communicate with an external device such as a remote control device and an external server.

[0141] According to various embodiments, the communication interface (130) may utilize different communication modules to communicate with external devices, such as remote control devices, and external servers. For example, the communication interface (130) may utilize at least one of an Ethernet module or a Wi-Fi module to communicate with an external server, and may also utilize a Bluetooth module to communicate with an external device, such as a remote control device. However, this is merely an embodiment, and the communication interface (130) may utilize at least one of various communication modules when communicating with multiple external devices or external servers.

[0142] The display (140) may be implemented as a display in various forms, such as a liquid crystal display (LCD), an organic light emitting diode (OLED) display, a plasma display panel (PDP), etc. The display (140) may also include a driving circuit, a backlight unit, etc., which may be implemented in forms such as an a-si TFT (amorphous silicon thin film transistor), an LTPS (low temperature poly silicon) TFT, an OTFT (organic TFT), etc. The display (140) may be implemented as a touch screen combined with a touch sensor, a flexible display, a three-dimensional display (3D display, three-dimensional dispaly), etc. According to an embodiment of the present disclosure, the display (140) may include not only a display panel that outputs an image, but also a bezel that houses the display panel. In particular, according to an embodiment of the present disclosure, the bezel may include a touch sensor (not shown) for detecting user interaction.

[0143] The operating interface (150) may be implemented as a device such as a button, a touch pad, a mouse, and a keyboard, or as a touch screen capable of performing the above-described display function and operating input function. The button may be a mechanical button, a touch pad, a wheel, or any other type of button formed in any area of ​​the front, side, or back of the main body of the electronic device (100).

[0144] The input / output interface (160) may be any one of HDMI (High Definition Multimedia Interface), MHL (Mobile High-Definition Link), USB (Universal Serial Bus), DP (Display Port), Thunderbolt, VGA (Video Graphics Array) port, RGB port, D-SUB (D-subminiature), and DVI (Digital Visual Interface). The input / output interface (160) may input / output at least one of audio and video signals. Depending on the implementation example, the input / output interface (160) may include a port that inputs / outputs only audio signals and a port that inputs / outputs only video signals as separate ports, or may be implemented as a single port that inputs / outputs both audio signals and video signals. The electronic device (100) may transmit at least one of the audio and video signals to an external device (e.g., an external display device or an external speaker) through the input / output interface (160). An output port included in the input / output interface (160) can be connected to an external device, and the electronic device (100) can transmit at least one of an audio and video signal to the external device through the output port.

[0145] The input / output interface (160) can be connected to a communication interface. The input / output interface (160) can transmit information received from an external device to the communication interface or transmit information received through the communication interface to the external device.

[0146] The speaker (170) may be a component that outputs various audio data as well as various notification sounds or voice messages.

[0147] The microphone (180) is a component that receives a user's voice or other sounds and converts them into audio data. The microphone (180) can receive the user's voice in an activated state. For example, the microphone (180) can be formed integrally on the upper side, the front side, the side side, etc. of the electronic device (100). The microphone (180) can include various components such as a microphone that collects the user's voice in analog form, an amplifier circuit that amplifies the collected user's voice, an A / D conversion circuit that samples the amplified user's voice and converts it into a digital signal, and a filter circuit that removes noise components from the converted digital signal.

[0148] The camera (190) is a device configured to capture a subject and generate a captured image, wherein the captured image includes both moving images and still images. The camera (190) can acquire images for at least one external device and can be implemented with a camera, a lens, an infrared sensor, or the like.

[0149] The camera (190) may include a lens and an image sensor. The type of lens may include a general-purpose lens, a wide-angle lens, a zoom lens, etc., and may be determined according to the type, characteristics, usage environment, etc. of the electronic device (100). The image sensor may include a complementary metal oxide semiconductor (CMOS) and a charge-coupled device (CCD).

[0150] According to various embodiments, the electronic device (100) may include a display (140). The electronic device (100) may directly display an acquired image or content on the display (140).

[0151] According to various embodiments, the electronic device (100) may not include a display (140). The electronic device (100) may be connected to an external display device and may transmit images or content stored in the electronic device (100) to the external display device.

[0152] The electronic device (100) can transmit an image or content to an external display device along with a control signal for controlling the display of the image or content on the external display device. The external display device can be connected to the electronic device (100) via a communication interface (130) or an input / output interface (160). For example, the electronic device (100) may not include a display, such as a set-top box (STB).

[0153] The electronic device (100) may include only a small display capable of displaying simple information such as text information. The electronic device (100) may transmit images or content to an external display device via a communication interface (130) wired or wirelessly, or transmit the images or content to the external display device via an input / output interface (160).

[0154] There may be various embodiments in which the electronic device (100) performs an action corresponding to a user voice signal received through a microphone (180).

[0155] According to various embodiments, the electronic device (100) may control the display (140) based on a user voice signal received through the microphone (180). For example, when a user voice signal for displaying content A is received, the electronic device (100) may control the display (140) to display content A.

[0156] According to various embodiments, the electronic device (100) may control an external display device connected to the electronic device (100) based on a user voice signal received through the microphone (180). The electronic device (100) may generate a control signal for controlling the external display device so that an operation corresponding to the user voice signal is performed on the external display device, and transmit the generated control signal to the external display device. The electronic device (100) may store a remote control application for controlling the external display device. In addition, the electronic device (100) may transmit the generated control signal to the external display device using at least one communication method among Bluetooth, Wi-Fi, and infrared. For example, when a user voice signal for displaying content A is received, the electronic device (100) may transmit a control signal to the external display device so that the content A is displayed on the external display device. The electronic device (100) may refer to various terminal devices on which a remote control application can be installed, such as a smartphone or an AI speaker.

[0157] According to various embodiments, the electronic device (100) may use a remote control device to control an external display device connected to the electronic device (100) based on a user voice signal received through a microphone (180). The electronic device (100) may transmit a control signal to the remote control device for controlling the external display device so that an operation corresponding to the user voice signal is performed on the external display device. In addition, the remote control device may transmit the control signal received from the electronic device (100) to the external display device. For example, when a user voice signal for displaying content A is received, the electronic device (100) may transmit a control signal to the remote control device for controlling the display of content A on the external display device, and the remote control device may transmit the received control signal to the external display device.

[0158] The electronic device (100) can receive a user voice signal in various ways.

[0159] According to various embodiments, the electronic device (100) can receive a user voice signal through a microphone (180) included in the electronic device (100).

[0160] According to various embodiments, the electronic device (100) may receive a user voice signal from an external device including a microphone. The external device may refer to a remote control device or a smartphone, etc. The received user voice signal may be a digital voice signal, but may also be an analog voice signal depending on the implementation example. The electronic device (100) may receive the user voice signal via a wireless communication method such as Bluetooth or Wi-Fi.

[0161] The electronic device (100) can convert the user voice signal in various ways.

[0162] According to various embodiments, the electronic device (100) may obtain text information corresponding to a user voice signal from an external server. The electronic device (100) may transmit the user voice signal (audio signal or digital signal) to the external server. The external server may refer to a voice recognition server. The voice recognition server may convert the user voice signal into text information using STT (Speech To Text). Then, the external server may transmit text information corresponding to the converted user voice signal to the electronic device (100).

[0163] According to various embodiments, the electronic device (100) can independently acquire text information corresponding to a user voice signal. The electronic device (100) can also directly apply a STT (Speech To Text) function to a digital voice signal to convert it into text information and transmit the converted text information to an external server.

[0164] An external server can transmit information to the electronic device (100) in a variety of ways.

[0165] According to various embodiments, an external server may transmit text information corresponding to a user voice signal to an electronic device (100). The external server may be a server that performs a voice recognition function that converts a user voice signal into text information.

[0166] According to various embodiments, the external server may transmit at least one of text information corresponding to the user voice signal or search result information corresponding to the text information to the electronic device (100). The external server may be a server that performs a search result providing function that provides search result information corresponding to the text information in addition to a voice recognition function that converts the user voice signal into text information. For example, the external server may be a server that performs both a voice recognition function and a search result providing function. In another example, the external server may perform only a voice recognition function and the search result providing function may be performed by a separate server. The external server may transmit text information to a separate server to obtain a search result and obtain a search result corresponding to the text information from the separate server.

[0167] The electronic device (100) can communicate with external devices and external servers in various ways.

[0168] According to various embodiments, communication modules for communication with external devices and external servers may be implemented identically. For example, the electronic device (100) may communicate with an external device using a Bluetooth module, and the external server may also communicate using a Bluetooth module.

[0169] According to various embodiments, communication modules for communication with external devices and external servers may be implemented separately. For example, the electronic device (100) may communicate with external devices using a Bluetooth module and with external servers using an Ethernet modem or Wi-Fi module.

[0170] FIG. 5 is a drawing for explaining a process of processing an image in an electronic device (100) according to one embodiment.

[0171] Referring to FIG. 5, the electronic device (100) may include a substrate (10). The substrate (10) may be a plate on which various hardware modules are arranged.

[0172] The substrate (10) may include at least one of an input connector (11), an output connector (12), a first capacitor (21), a second capacitor (22), a conversion module (30), a transmission module (40), a timing module (50), and an image processor (60).

[0173] The electronic device (100) can receive an input image through an input connector (11). The electronic device (100) can receive the input image and transmit it to the first capacitor (21).

[0174] The input connector (11) may be a connector that receives data (e.g., video) from an external device. The input connector (11) may be an input connector of an SDI (Serial Digital Interface).

[0175] The electronic device (100) can transmit an input image to the first capacitor (21) using the first impedance (1).

[0176] The first capacitor (21) may be a decoupling capacitor. The first capacitor (21) may be a noise filter connected to the input connector (11) to remove noise.

[0177] After the input image passes through the first capacitor (21), the electronic device (100) can transmit the input image to the conversion module (30) using the second impedance (2).

[0178] The electronic device (100) can convert (or change or process) an input image into a first converted image using a conversion module (30).

[0179] The conversion module (30) may be an EQ (Equalization) module. The conversion module (30) may convert the characteristic information of the image. The conversion module (30) may convert the image based on the setting information of the display device to which the image is output. The image output by the conversion module (30) may be described as a converted image. The setting information may include at least one of the size information, resolution information, and color information of the display or display device.

[0180] The electronic device (100) can transmit the first converted image obtained from the conversion module (30) to the transmission module (40). The electronic device (100) can transmit the first converted image to the transmission module (40) using the third impedance (3).

[0181] The transmission module (40) may include a bridge integrated circuit. The transmission module (40) may perform an operation of transmitting the first converted image to a display or display device.

[0182] The electronic device (100) can transmit a first converted image to an image processor (60) from a transmission module (40). The transmission module (40) can transmit the first converted image to the image processor (60) using a seventh impedance (7).

[0183] The image processor (60) can control a display or display device so that the first converted image is output.

[0184] The image processor (60) may be included in at least one processor (120) included in the electronic device (100).

[0185] According to one embodiment, the image processor (60) may be included in an image processing device. The image processing device may include a substrate (10). The image processor (60) may be placed on the substrate (10) included in the image processing device.

[0186] According to one embodiment, the image processor (60) may be included in the display device. The image processor (60) may not be included in the substrate (10) included in the image processing device. The image processor (60) may be arranged in the display device.

[0187] The image processing device may be described as an image processing module, and the display device may be described as a display module.

[0188] The electronic device (100) can transmit the first converted image from the conversion module (30) to the timing module (50). The electronic device (100) can transmit the first converted image from the conversion module (30) to the timing module (50) using the fourth impedance (4).

[0189] The timing module (50) may be a module that performs a compensation operation for a time delay. The electronic device (100) may include multiple displays or multiple display devices. There is a need to synchronize images to output images to multiple displays. However, since it takes time for the image to be transmitted, a problem of synchronization may occur. A compensation operation for a time delay may be performed to synchronize images output from multiple displays (or display devices). The timing module (50) may obtain first compensation information. The compensation information may be described as time compensation information, delay information for time compensation, timing information, sync information, etc.

[0190] The electronic device (100) can transmit the first converted image and the first compensation information from the timing module (50) to the second capacitor (22). The electronic device (100) can transmit the first converted image and the first compensation information from the timing module (50) to the second capacitor (22) using the fifth impedance (5).

[0191] The second capacitor (22) may be a decoupling capacitor. The second capacitor (22) may be a noise filter connected to the output connector (12) to remove noise.

[0192] After the first conversion image and the first compensation information pass through the second capacitor (22), the electronic device (100) can transmit the first conversion image and the first compensation information to the output connector (12) using the sixth impedance (6).

[0193] The electronic device (100) can transmit the first converted image and the first compensation information to an external device or external module through the output connector (12).

[0194] The output connector (12) may be a connector that transmits (or outputs) data (e.g., video) to an external device. The output connector (12) may be an SDI output connector.

[0195] SDI is a technology for transmitting uncompressed digital video signals over a single cable. SDI serializes 10-bit words of uncompressed digital video signals and transmits them over a cable (e.g., a 75Ω coaxial cable). SDI can transmit video signals over long distances with relatively low transmission loss.

[0196] The input connector (11) or the output connector (12) may be described as an SDI connector or an SDI BNC (Bayonet Neill-Concelman) connector.

[0197] The electronic device (100) can receive an input image through an input connector (11). The image signal can be transmitted to a conversion module (30) through an SDI Single Line. The image signal received by the conversion module (30) can be converted into a Differential Line signal. The converted image signal can be transmitted to a transmission module (40) and / or a timing module (50).

[0198] The video signal (or converted video) transmitted to the timing module (50) can be converted back into an SDI Single Line signal. The converted video signal can be transmitted to the output connector (12).

[0199] There is a high possibility that transmission loss may occur in the section where the video signal moves from the input connector (11) to the conversion module (30) and in the section where the video signal moves from the timing module (50) to the output connector (12). High-resolution video services can be provided only when the transmission loss is low.

[0200] Dip Type SDI BNC connectors may have difficulty maintaining stable impedance due to the influence of the connector pins and solder joints. The pins included in the connector may be arranged to penetrate the substrate. The SDI PCB (Printed Circuit Board) pattern and the conversion module (30) and / or the timing module (50) may be arranged on the lower surface of the substrate (10).

[0201] The video signal can be received through the input connector (11). The video signal can be transmitted to the conversion module (30) through the first capacitor (21). A problem may arise in that an impedance drop occurs when passing through the first capacitor (21). Accordingly, there is a need to compensate (or correct) the impedance. The substrate (10) can be designed so that the second impedance (2) is greater than the first impedance (1). The size (or value) of the second impedance (2) can be greater than the size (or value) of the first impedance (1).

[0202] Impedance compensation may also be required during the process of outputting a video signal. The size (or value) of the sixth impedance (6) may be greater than the size (or value) of the fifth impedance (5).

[0203] The magnitude of the first impedance (1) and the sixth impedance (6) may be a first value (or a first range).

[0204] The magnitude of the first impedance (1) and the fifth impedance (5) may be a second value (or a second range).

[0205] The magnitudes of the third impedance (3), the fourth impedance (4), and the seventh impedance (7) may be a third value (or a third range).

[0206] The second value (or the mean of the second range) may be greater than the first value (the mean of the first range). The third value (or the mean of the third range) may be greater than the second value (or the mean of the second range).

[0207] FIG. 6 is a drawing for explaining a process of processing an image in an electronic device (100) according to one embodiment.

[0208] Example (600) of Fig. 6 shows a situation in which the substrate (10) is viewed from the first side. The detailed structure of the substrate (10) related thereto is explained through examples (610, 620).

[0209] Embodiments (610) and (620) of FIG. 6 show a structure in which a first capacitor (21), a second capacitor (22), a conversion module (30), and a transmission module (40) are arranged on the upper surface of a substrate (10).

[0210] In embodiment (610), at least one of an input connector (11), a first capacitor (21), a conversion module (30), and a transmission module (40) may be arranged on the upper surface of the substrate (10). The input connector (11) may include a connector pin (11-1). The connector pin (11-1) may be arranged from the upper surface to the lower surface of the substrate (10). In embodiment (610), an impedance discontinuity section (stub section) may occur depending on the arrangement of the connector pin (11-1).

[0211] In embodiment (620), at least one of an output connector (12), a second capacitor (22), a timing module (50), and a transmission module (40) may be arranged on the upper surface of the substrate (10). The output connector (12) may include a connector pin (12-1). The connector pin (12-1) may be arranged from the upper surface to the lower surface of the substrate (10). In embodiment (620), an impedance discontinuity section (stub section) may occur depending on the arrangement of the connector pin (12-1).

[0212] FIG. 7 is a drawing for explaining a substrate on which some modules for image processing are arranged at the bottom, according to one embodiment.

[0213] Example (700) of Fig. 7 shows a situation in which the substrate (10) is viewed from the first side. The detailed structure of the substrate (10) related thereto is explained through examples (710, 720).

[0214] In embodiment (710), at least one of an input connector (11), a first capacitor (21), and a conversion module (30) may be arranged on the lower surface of the substrate (10). A transmission module (40) may be arranged on the upper surface of the substrate (10). The input connector (11) may include a connector pin (11-1). The connector pin (11-1) may be arranged from the upper surface to the lower surface of the substrate (10). In embodiment (710), the connector pin (11-1) may be connected to an impedance arranged on the lower surface of the substrate (10). In embodiment (710), an impedance discontinuity section (stub section) may not occur.

[0215] In embodiment (720), at least one of an output connector (12), a second capacitor (22), and a timing module (50) may be disposed on the upper surface of the substrate (10). A transmission module (40) may be disposed on the upper surface of the substrate (10). The output connector (12) may include a connector pin (12-1). The connector pin (12-1) may be disposed from the upper surface to the lower surface of the substrate (10). In embodiment (720), the connector pin (12-1) may be connected to an impedance disposed on the lower surface of the substrate (10). In embodiment (720), an impedance discontinuity section (stub section) may not occur.

[0216] FIG. 8 is a drawing for explaining a substrate on which some modules for image processing are arranged at the bottom, according to one embodiment.

[0217] Example (800) of Fig. 8 shows a situation in which the substrate (10) is viewed from the first side. The detailed structure of the substrate (10) related thereto is explained through examples (810, 820).

[0218] In embodiment (810), at least one of an input connector (11), a first capacitor (21), a conversion module (30), and a transmission module (40) may be arranged on the lower surface of the substrate (10). The input connector (11) may include a connector pin (11-1). The connector pin (11-1) may be arranged from the upper surface to the lower surface of the substrate (10). In embodiment (810), the connector pin (11-1) may be connected to an impedance arranged on the lower surface of the substrate (10). In embodiment (810), an impedance discontinuity section (stub section) may not occur.

[0219] In embodiment (820), at least one of an output connector (12), a second capacitor (22), a timing module (50), and a transmission module (40) may be arranged on the upper surface of the substrate (10). The output connector (12) may include a connector pin (12-1). The connector pin (12-1) may be arranged from the upper surface to the lower surface of the substrate (10). In embodiment (820), the connector pin (12-1) may be connected to an impedance arranged on the lower surface of the substrate (10). In embodiment (820), an impedance discontinuity section (stub section) may not occur.

[0220] According to one embodiment, a substrate (10) can be implemented in which the embodiment (710) of FIG. 7 and the embodiment (820) of FIG. 8 are combined.

[0221] According to one embodiment, a substrate (10) can be implemented in which the embodiment (720) of FIG. 7 and the embodiment (810) of FIG. 8 are combined.

[0222] According to one embodiment, a substrate (10) can be implemented in which the embodiment (610) of FIG. 6 and the embodiment (720) of FIG. 7 are combined.

[0223] According to one embodiment, a substrate (10) can be implemented in which the embodiment (610) of FIG. 6 and the embodiment (820) of FIG. 8 are combined.

[0224] According to one embodiment, a substrate (10) can be implemented in which the embodiment (620) of FIG. 6 and the embodiment (710) of FIG. 7 are combined.

[0225] According to one embodiment, a substrate (10) can be implemented in which the embodiment (620) of FIG. 6 and the embodiment (780) of FIG. 8 are combined.

[0226] FIG. 9 is a drawing illustrating some impedances connected to a connector according to one embodiment.

[0227] Embodiment (900) of Fig. 9 shows a situation in which the substrate (10) is viewed from the second side. Embodiment (900) of Fig. 9 shows a situation in which the input connector (11) or the output connector (12) of the transmission module (40) is viewed. The detailed structure of the substrate (10) related thereto is described through embodiments (910, 920, 930, 940).

[0228] The substrate (10) may include a first layer (L1), a second layer (L2), a third layer (L3), and a fourth layer (L4). The first layer (L1) may be described as an upper layer. The fourth layer (L4) may be described as a lower layer.

[0229] The first layer (L1) may include an insulating region and a conductive region. The first layer (L1) may include a first sub-layer and a second sub-layer. The entire area of ​​the first sub-layer may be a conductive region. The entire area of ​​the second sub-layer may be an insulating region.

[0230] The second layer (L2) may include an insulating region and a conductive region. The second layer (L2) may include a first sub-layer and a second sub-layer. The entire area of ​​the first sub-layer may be a conductive region. The entire area of ​​the second sub-layer may be an insulating region.

[0231] The third layer (L3) may include an insulating region and a conductive region. The third layer (L3) may include a first sub-layer and a second sub-layer. A portion of the entire area of ​​the first sub-layer may be a conductive region and the remainder may be an insulating region. The entire area of ​​the second sub-layer may be an insulating region.

[0232] The fourth layer (L4) may include a conductive region.

[0233] The impedance may vary depending on the arrangement structure that constitutes the conductor region of the fourth layer (L4). The impedance may vary depending on the width (or horizontal length) of the conductor region.

[0234] The connector pin (11-1) of the input connector (11) can be connected from the first layer (L1) to the fourth layer (L4) of the substrate (10).

[0235] The connector pin (12-1) of the output connector (12) can be connected from the first layer (L1) to the fourth layer (L4) of the substrate (10).

[0236] In the direction of looking at the input connector (11) or the output connector (12) in the transmission module (40), the fourth layer (L4) can be divided into five areas (H1, H2, H3, H4, H5) from the leftmost to the rightmost.

[0237] The first region (H1), the third region (H3), and the fifth region (H5) may be conductive regions.

[0238] The second region (H2) and the fourth region (H4) may be insulator regions.

[0239] The length of the first region (H1) and the length of the fifth region (H5) may be the same.

[0240] The length of the second region (H2) and the length of the fourth region (H4) may be the same.

[0241] The length of the second region (H2) may be greater than the length of the first region (H1).

[0242] The length of the fourth region (H4) may be greater than the length of the fifth region (H5).

[0243] Depending on various embodiments, the length of the third region (H3) may vary. The shorter the length of the third region (H3), the greater the impedance may be. The shorter the length of the third region (H3), the greater the length of the second region (H2) and / or the fourth region (H4).

[0244] Example (910) may represent the first impedance (1) of Example (710) of FIG. 7 or the first impedance (1) of Example (810) of FIG. 8.

[0245] Example (920) may represent the second impedance (2) of Example (710) of FIG. 7 or the second impedance (2) of Example (810) of FIG. 8.

[0246] The length of the first region (H1) corresponding to the first impedance (1) may be the same as the length of the first region (H1) corresponding to the second impedance (2).

[0247] The length of the second region (H2) corresponding to the first impedance (1) may be shorter than the length of the second region (H2) corresponding to the second impedance (2).

[0248] The length of the third region (H3) corresponding to the first impedance (1) may be greater than the length of the third region (H3) corresponding to the second impedance (2).

[0249] The length of the fourth region (H4) corresponding to the first impedance (1) may be shorter than the length of the fourth region (H4) corresponding to the second impedance (2).

[0250] The length of the fifth region (H5) corresponding to the first impedance (1) may be the same as the length of the fifth region (H5) corresponding to the second impedance (2).

[0251] The size of the first impedance (1) may be smaller than the size of the second impedance (2).

[0252] The connector pin (11-1) of the input connector (11) can be brought into contact with a conductor corresponding to the third area (H3).

[0253] Example (930) may represent the fifth impedance (5) of Example (720) of FIG. 7 or the fifth impedance (5) of Example (820) of FIG. 8.

[0254] Example (940) may represent the sixth impedance (6) of Example (720) of FIG. 7 or the sixth impedance (6) of Example (820) of FIG. 8.

[0255] The length of the first region (H1) corresponding to the sixth impedance (6) may be the same as the length of the first region (H1) corresponding to the fifth impedance (5).

[0256] The length of the second region (H2) corresponding to the sixth impedance (6) may be shorter than the length of the second region (H2) corresponding to the fifth impedance (5).

[0257] The length of the third region (H3) corresponding to the sixth impedance (6) may be greater than the length of the third region (H3) corresponding to the fifth impedance (5).

[0258] The length of the fourth region (H4) corresponding to the sixth impedance (6) may be shorter than the length of the fourth region (H4) corresponding to the fifth impedance (5).

[0259] The length of the fifth region (H5) corresponding to the sixth impedance (6) may be the same as the length of the fifth region (H5) corresponding to the fifth impedance (5).

[0260] The size of the sixth impedance (6) may be smaller than the size of the fifth impedance (5).

[0261] The connector pin (12-1) of the output connector (12) can be brought into contact with a conductor corresponding to the third region (H3).

[0262] In one embodiment, the second layer (L2) and the third layer (L3) may be omitted.

[0263] According to one embodiment, the fourth layer (L4) may include an insulator region and a conductor region.

[0264] According to one embodiment, the substrate (10) may be implemented as a single layer.

[0265] FIG. 10 is a drawing illustrating some impedances connected to a connector according to one embodiment.

[0266] Embodiment (1000) of Fig. 10 shows a situation in which the substrate (10) is viewed from the second side. Embodiment (1000) of Fig. 10 shows a situation in which the input connector (11) or the output connector (12) of the transmission module (40) is viewed. The detailed structure of the substrate (10) related thereto is described through embodiments (1010, 1020, 1030, 1040).

[0267] The substrate (10) may include a first layer (L1), a second layer (L2), a third layer (L3), and a fourth layer (L4). A detailed description thereof is provided in Fig. 9. Duplicate descriptions are omitted.

[0268] When looking at the input connector (11) or the output connector (12) in the transmission module (40), the fourth layer (L4) can be divided into five regions (H1, H2, H3, H4, H5) from the leftmost to the rightmost. A detailed description related to this is described in Fig. 9. Duplicate description is omitted.

[0269] Depending on various embodiments, the length of the first region (H1) and / or the fifth region (H5) may vary. As the length of the first region (H1) and / or the fifth region (H5) increases, the magnitude of the impedance may increase. As the length of the first region (H1) and / or the fifth region (H5) increases, the length of the second region (H2) and / or the fourth region (H4) may decrease.

[0270] Example (1010) may represent the first impedance (1) of Example (710) of FIG. 7 or the first impedance (1) of Example (810) of FIG. 8.

[0271] Example (1020) may represent the second impedance (2) of Example (710) of FIG. 7 or the second impedance (2) of Example (810) of FIG. 8.

[0272] The length of the first region (H1) corresponding to the first impedance (1) may be shorter than the length of the first region (H1) corresponding to the second impedance (2).

[0273] The length of the second region (H2) corresponding to the first impedance (1) may be greater than the length of the second region (H2) corresponding to the second impedance (2).

[0274] The length of the third region (H3) corresponding to the first impedance (1) may be the same as the length of the third region (H3) corresponding to the second impedance (2).

[0275] The length of the fourth region (H4) corresponding to the first impedance (1) may be greater than the length of the fourth region (H4) corresponding to the second impedance (2).

[0276] The length of the fifth region (H5) corresponding to the first impedance (1) may be shorter than the length of the fifth region (H5) corresponding to the second impedance (2).

[0277] The size of the first impedance (1) may be smaller than the size of the second impedance (2).

[0278] The connector pin (11-1) of the input connector (11) can be brought into contact with a conductor corresponding to the third area (H3).

[0279] Example (1030) may represent the fifth impedance (5) of Example (720) of FIG. 7 or the fifth impedance (5) of Example (820) of FIG. 8.

[0280] Example (1040) may represent the sixth impedance (6) of Example (720) of FIG. 7 or the sixth impedance (6) of Example (820) of FIG. 8.

[0281] The length of the first region (H1) corresponding to the sixth impedance (6) may be shorter than the length of the first region (H1) corresponding to the fifth impedance (5).

[0282] The length of the second region (H2) corresponding to the sixth impedance (6) may be greater than the length of the second region (H2) corresponding to the fifth impedance (5).

[0283] The length of the third region (H3) corresponding to the sixth impedance (6) may be the same as the length of the third region (H3) corresponding to the fifth impedance (5).

[0284] The length of the fourth region (H4) corresponding to the sixth impedance (6) may be greater than the length of the fourth region (H4) corresponding to the fifth impedance (5).

[0285] The length of the fifth region (H5) corresponding to the sixth impedance (6) may be shorter than the length of the fifth region (H5) corresponding to the fifth impedance (5).

[0286] The size of the sixth impedance (6) may be smaller than the size of the fifth impedance (5).

[0287] The connector pin (12-1) of the output connector (12) can be brought into contact with a conductor corresponding to the third region (H3).

[0288] FIG. 11 is a drawing for explaining impedance on a substrate on which some modules for image processing are arranged on top, according to one embodiment.

[0289] The embodiment (1100) of FIG. 11 is a drawing for explaining the impedance according to the arrangement structure of the substrate (10) in the embodiment (610) of FIG. 6.

[0290] Table (1110) shows the impedance according to the position from the transmission module (40) to the input connector (11). A normal impedance range may exist. The normal impedance range may be described as a preset impedance range. The upper limit of the normal impedance range may be Zu, and the lower limit of the normal impedance range may be zl.

[0291] The impedance may increase at the location (r1) where the first capacitor (21) is placed.

[0292] The impedance may decrease at the location (r2) where the connect pin (11-1) of the input connector (11) is positioned. The impedance of the substrate (10) at the location (r2) may be outside the range of normal impedance. The location (r2) may be included in the impedance mismatch section (stub section) caused by the connect pin (11-1).

[0293] FIG. 12 is a drawing for explaining impedance on a substrate on which some modules for image processing are arranged at the bottom, according to one embodiment.

[0294] Example (1200) of FIG. 12 is a drawing for explaining the impedance according to the arrangement structure of the substrate (10) in Example (710) of FIG. 7.

[0295] Table (1210) shows the impedance according to the position from the transmission module (40) to the input connector (11). A normal impedance range may exist. The normal impedance range may be described as a preset impedance range. The upper limit of the normal impedance range may be Zu, and the lower limit of the normal impedance range may be zl.

[0296] The impedance may increase at the location (r1) where the first capacitor (21) is placed.

[0297] At the position (r2) where the connect pin (11-1) of the input connector (11) is arranged, the impedance may decrease. At the position (r2), the impedance of the substrate (10) may not exceed the range of normal impedance. At the position (r2), the impedance of the substrate (10) may be included in the range of normal impedance. Unlike the embodiment (1100) of Fig. 11, in the embodiment (1200) of Fig. 12, the impedance corresponding to the substrate (10) may fall within the range of normal impedance throughout the entire section.

[0298] FIG. 13 is a diagram for explaining loss values ​​according to frequency depending on the arrangement of modules according to various embodiments.

[0299] Table (1300) of Fig. 13 can represent the degree of transmission loss according to the structure of the substrate (10). The x-axis of the table (1300) represents frequency and the unit can be GHz. The y-axis of the table (1300) represents the transmission loss value and the unit can be dB. dB can represent the ratio of power. The larger the loss value, the smaller the degree of loss, and the smaller the loss value, the greater the degree of loss. The larger the absolute value of the loss value, the greater the degree of loss.

[0300] Embodiment (1310) may correspond to embodiments (610, 620) of FIG. Embodiment (1310) may represent an electronic device (100) in which both the conversion module (30) and the transmission module (40) are disposed on the upper surface of the substrate (10).

[0301] Embodiment (1320) may correspond to embodiment (710, 720) of Fig. 7 or embodiment (810, 820) of Fig. 8. Embodiment (1310) may represent an electronic device (100) in which at least one of a conversion module (30) or a transmission module (40) is disposed on a lower surface of a substrate (10).

[0302] For example, the frequency used to transmit the video signal may be 6 GHz or 12 GHz.

[0303] When the frequency used to transmit the video signal is 6 GHz, the loss value corresponding to embodiment (1310) may be '-1.256444', and the loss value corresponding to embodiment (1320) may be '-0.7364867'. The transmission loss degree of embodiment (1320) may be less than the transmission loss degree of embodiment (1310). The transmission efficiency of embodiment (1320) may be better than that of embodiment (1310).

[0304] When the frequency used to transmit the video signal is 12 GHz, the loss value corresponding to the embodiment (1310) may be '5.965917', and the loss value corresponding to the embodiment (1320) may be '-3.181772'. The transmission loss degree of the embodiment (1320) may be less than the transmission loss degree of the embodiment (1310). The transmission efficiency of the embodiment (1320) may be better than that of the embodiment (1310).

[0305] S-parameters (Scattering Parameters) can be used to calculate the loss value. S-parameters can be expressed in matrix form, and S21 can be calculated as a voltage ratio. The loss obtained through S21 can have a negative value.

[0306] FIG. 14 is a drawing for explaining the arrangement of capacitors according to various embodiments.

[0307] The embodiments (1410, 1420, 1430) of FIG. 14 show a substrate (10) in which the arrangement of the first capacitor (21) is changed from the embodiment (710) of FIG. 7.

[0308] In the direction looking from the conversion module (30) to the timing module (50), the fourth layer (L4) can be divided into three areas (W1, W2, W3) from the leftmost to the rightmost.

[0309] In the direction looking from the first capacitor (21) to the second capacitor (22), the fourth layer (L4) can be divided into three regions (W1, W2, W3) from the leftmost to the rightmost.

[0310] The sixth region (W1) of the fourth layer (L4) may represent a region from a position corresponding to the transmission module (40) to a position corresponding to the conversion module (30). The sixth region (W1) may correspond to the third impedance (3) and / or the fourth impedance (4).

[0311] The seventh region (W2) of the fourth layer (L4) may represent a region from a position corresponding to the conversion module (30) to a position corresponding to the first capacitor (21). The seventh region (W2) may correspond to the second impedance (2) and / or the fifth impedance (5).

[0312] The eighth region (W3) of the fourth layer (L4) may represent a region from a position corresponding to the first capacitor (21) to a position corresponding to the connector pin (11-1) of the input connector (11). The eighth region (W3) may correspond to the first impedance (1) and / or the sixth impedance (6).

[0313] In embodiment (1410), the first capacitor (21) may be arranged so that the length of the seventh region (W2) is smaller than the length of the eighth region (W3).

[0314] In embodiment (1420), the first capacitor (21) may be arranged so that the length of the seventh region (W2) is the same as the length of the eighth region (W3).

[0315] In embodiment (1430), the first capacitor (21) may be arranged so that the length of the seventh region (W2) is greater than the length of the eighth region (W3).

[0316] In the description of FIG. 14, the conversion module (30) can be replaced with a timing module (50), the first capacitor (21) can be replaced with a second capacitor (22), the input connector (11) can be replaced with an output connector (12), and the connector pin (11-1) can be replaced with a connector pin (12-1).

[0317] FIG. 15 is a diagram for explaining changes in impedance depending on the arrangement of modules according to various embodiments.

[0318] Table (1500) of FIG. 15 shows the change in impedance over time in relation to the embodiments (1410, 1420, 1430) of FIG. 14.

[0319] Embodiment (1510) of FIG. 15 may correspond to embodiment (1410) of FIG. 14.

[0320] Embodiment (1520) of FIG. 15 may correspond to embodiment (1420) of FIG. 14.

[0321] Embodiment (1530) of FIG. 15 may correspond to embodiment (1430) of FIG. 14.

[0322] In the embodiment (1510) of FIG. 15, the impedance change over time may be relatively large.

[0323] In the embodiment (1520) of FIG. 15, the impedance change over time may be relatively small.

[0324] In the embodiment (1530) of Fig. 15, the impedance change over time may be relatively large.

[0325] It can be said that the embodiment (1520) with relatively small impedance change has higher impedance stability than the remaining embodiments (1510, 1530). The arrangement structure of the first capacitor (21) of the embodiment (1420) of FIG. 14 corresponding to the embodiment (1520) may have relatively high impedance stability. As in the embodiment (1420) of FIG. 14, the electronic device (100) may have the first capacitor (21) arranged such that the length of the seventh region (W2) is the same as the length of the eighth region (W3).

[0326] FIG. 16 is a diagram for explaining loss values ​​according to frequency depending on the arrangement of modules according to various embodiments.

[0327] Table (1600) of FIG. 16 shows the transmission loss degree according to frequency in relation to the embodiments (1410, 1420, 1430) of FIG. 14. The larger the transmission loss value (Loss, S21) (the smaller the absolute value), the lower the transmission loss degree may be. The smaller the transmission loss value (the larger the absolute value), the higher the transmission loss degree may be.

[0328] Embodiment (1610) of FIG. 16 may correspond to embodiment (1410) of FIG. 14.

[0329] Embodiment (1620) of FIG. 16 may correspond to embodiment (1420) of FIG. 14.

[0330] Embodiment (1630) of FIG. 16 may correspond to embodiment (1430) of FIG. 14.

[0331] In the embodiment (1610) of Fig. 16, the degree of transmission loss depending on the frequency may be relatively large.

[0332] In the embodiment (1620) of Fig. 16, the degree of transmission loss according to frequency may be relatively small.

[0333] In the embodiment (1630) of Fig. 16, the degree of transmission loss depending on the frequency may be relatively large.

[0334] It can be said that the embodiment (1620) with a relatively small change in impedance has a lower transmission loss than the remaining embodiments (1610, 1630). The arrangement structure of the first capacitor (21) of the embodiment (1420) of FIG. 14 corresponding to the embodiment (1620) may have a relatively low transmission loss. As in the embodiment (1420) of FIG. 14, the electronic device (100) may have the first capacitor (21) arranged such that the length of the seventh region (W2) is the same as the length of the eighth region (W3).

[0335] FIG. 17 is a drawing for explaining an eye diagram according to the arrangement of modules according to various embodiments.

[0336] The eye diagram (1710) of FIG. 17 represents an eye diagram according to the embodiment (610, 620) of FIG. 6.

[0337] The eye diagram (1720) of FIG. 17 represents an eye diagram according to the embodiment (710, 720) of FIG. 7 or the embodiment (810, 820) of FIG. 8.

[0338] An eye diagram can be a tool to represent signal quality and stability in the time domain in digital communication systems.

[0339] The x-axis of an eye diagram could be time, and the y-axis could be voltage.

[0340] In the eye diagram (1710), the waveform encroaches on a regular hexagon. In the eye diagram (1720), the waveform does not encroache on a regular hexagon. The waveform in the eye diagram (1720) can be judged to be stable and have little noise.

[0341] The thickness of the waveform of the eye diagram (1710) is greater than the thickness of the waveform of the eye diagram (1720). It can be determined that the waveform of the eye diagram (1720) has less noise and is stable.

[0342] The area of ​​the area (1711) representing the child in the eye diagram (1710) is smaller than the area of ​​the area (1721) representing the child in the eye diagram (1720). It can be determined that the waveform of the eye diagram (1720) has little noise and is stable.

[0343] Therefore, the embodiment (710, 720) of FIG. 7 or the embodiment (810, 820) of FIG. 8 corresponding to the eye diagram (1720) may be more efficient in terms of signal transmission than the embodiment (610, 620) of FIG. 6 corresponding to the eye diagram (1710).

[0344] FIG. 18 is a drawing for explaining test results according to the type of image and cable length according to various embodiments.

[0345] Table (1810) of FIG. 18 shows the CRC (Cyclic Redundancy Check) results according to the embodiments (610, 620) of FIG. 6.

[0346] CRC check can be a tool to determine whether an error occurred during data transmission.

[0347] Table (1820) of FIG. 18 shows the CRC (Cyclic Redundancy Check) results according to the embodiments (710, 720) of FIG. 7 or the embodiments (810, 820) of FIG. 8.

[0348] Referring to Table (1810), the CRC result for a 12-gigabyte 4K video signal failed when the input cable was 70 m.

[0349] Referring to Table (1820), the CRC result for a 12-gigabyte 4K video signal was successful when the input cable was 70 m.

[0350] The embodiments (710, 720) of FIG. 7 corresponding to table (1820) or the embodiments (810, 820) of FIG. 8 may be more stable in terms of signal transmission than the embodiments (610, 620) of FIG. 6 corresponding to table (1810).

[0351] FIG. 19 is a drawing for explaining the layout structure of a substrate according to one embodiment.

[0352] FIG. 19 shows a substrate (10) according to the embodiment (710, 720) of FIG. 7 or the embodiment (810, 820) of FIG. 8.

[0353] An embodiment (1910) of FIG. 19 may represent the upper surface (10-1) of the substrate (10). An input connector (11) may be arranged on the upper surface (10-1) of the substrate (10). An output connector (12) may be arranged on the upper surface (10-1) of the substrate (10).

[0354] The embodiment (1920) of FIG. 19 may represent the lower surface (10-2) of the substrate (10).

[0355] A first capacitor (21) and a conversion module (30) may be placed on the lower surface (10-2) of the substrate (10). A connector pin (11-1) of an input connector (11) may be exposed on the lower surface (10-2).

[0356] According to one embodiment, a first discharge element (71) may be arranged on a lower surface (10-2) of a substrate (10). The first discharge element (71) may be a semiconductor element that performs a function of discharging static electricity. The first discharge element (71) may be described as a first ESD (Electrostatic Discharge) diode, a first discharge diode, or the like. The first discharge element (71) may be arranged within a preset distance from the first capacitor (21). The first discharge element (71) may be connected to a first impedance (1). The first discharge element (71) may be arranged in the eighth region (W3) of FIG. 14.

[0357] A second capacitor (22) and a timing module (50) may be placed on the lower surface (10-2) of the substrate (10). A connector pin (12-1) of the output connector (12) may be exposed on the lower surface (10-2).

[0358] According to one embodiment, a second discharge element may be arranged on the lower surface (10-2) of the substrate (10). The second discharge element may be a semiconductor element that performs a function of discharging static electricity. The second discharge element may be described as a second ESD (Electrostatic Discharge) diode, a second discharge diode, or the like. The second discharge element may be arranged within a preset distance from the second capacitor (22). The second discharge element may be connected to the sixth impedance (6). The second discharge element may be arranged in the eighth region (W3) of FIG. 14.

[0359] If the capacitor component generated at the connector pin overlaps with the input capacitor component at the conversion module (30), image quality may deteriorate. An additional decoupling capacitor (21, 22) and a discharge element (e.g., ESD diode) may be placed between the conversion module (30) and the pin (11-1) of the input connector (11).

[0360] FIG. 20 is a flowchart for explaining a method of controlling an electronic device (100) according to one embodiment.

[0361] Referring to FIG. 20, a control method of an electronic device (100) including an input / output interface (160) including an input connector (11) and an output connector disposed on the upper surface of a substrate (10), a conversion module (30) disposed on the lower surface of the substrate (10), a transmission module (40) connected to the substrate (10), and a timing module (50) disposed on the lower surface of the substrate (10) includes a step (S2010) of obtaining an input image through an input connector (11), a step (S2020) of converting the input image into a converted image based on setting information related to image output through the conversion module (30), a step (S2030) of transmitting the converted image to a display module through the transmission module (40), a step (S2040) of obtaining compensation information for compensating for a time delay corresponding to the converted image through the timing module (50), and a step (S2050) of transmitting the converted image and the compensation information to an external device through the output connector.

[0362] The configuration information may include at least one of size information of the display module that will display the converted image, resolution information of the display module, or color information of the display module.

[0363] The control method may further include a step of controlling the display module to display the converted image.

[0364] The pins of the input connector (11) and the pins of the output connector can be connected to the lower surface of the substrate (10) through the substrate (10).

[0365] The substrate (10) includes a first capacitor (21) arranged between a pin of an input connector (11) corresponding to the lower surface of the substrate (10) and a conversion module (30), and a second capacitor (22) arranged between a pin of an output connector corresponding to the lower surface of the substrate (10) and a timing module (50).

[0366] The control method may further include a step of filtering noise through the first capacitor (21) and the second capacitor (22).

[0367] The control method may further include a step of transmitting an input image to a conversion module (30) through a first impedance connecting a pin of an input connector (11) and a first capacitor (21) and a second impedance connecting the first capacitor (21) and a conversion module (30), and a step of transmitting a converted image to a transmission module (40) through a third impedance connecting the conversion module (30) and the transmission module (40).

[0368] The control method may further include a step of transmitting a converted image to the timing module (50) through a fourth impedance connecting the transmission module (40) and the timing module (50), and a step of transmitting the converted image and compensation information to the output connector through a fifth impedance connecting the timing module (50) and the second capacitor (22) and a sixth impedance connecting the second capacitor (22) and a pin of the output connector.

[0369] The magnitude of the first impedance may be smaller than the magnitude of the second impedance, and the magnitude of the sixth impedance may be smaller than the magnitude of the fifth impedance.

[0370] The substrate (10) includes a first discharge element arranged between a pin of an input connector (11) corresponding to a lower surface of the substrate (10) and a first capacitor (21) and a second discharge element arranged between a pin of an output connector corresponding to a lower surface of the substrate (10) and a second capacitor (22), and the control method may further include a step of filtering static electricity through the first discharge element and the second discharge element.

[0371] The input / output interface (160) may be a serial digital interface (SDI).

[0372] Meanwhile, the methods according to the various embodiments of the present disclosure described above can be implemented in the form of applications that can be installed on existing electronic devices.

[0373] Additionally, the methods according to the various embodiments of the present disclosure described above can be implemented only with a software upgrade or a hardware upgrade for an existing electronic device.

[0374] Additionally, the various embodiments of the present disclosure described above may also be performed through an embedded server provided in an electronic device, or an external server of at least one of the electronic device and the display device.

[0375] Meanwhile, according to a temporary example of the present disclosure, the various embodiments described above can be implemented as software including instructions stored in a machine-readable storage medium that can be read by a machine (e.g., a computer). The device is a device that can call instructions stored in the storage medium and operate according to the called instructions, and may include an electronic device according to the disclosed embodiments. When an instruction is executed by a processor, the processor can perform a function corresponding to the instruction directly or under the control of the processor by using other components. The instruction may include code generated or executed by a compiler or interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' means that the storage medium does not contain a signal and is tangible, but does not distinguish between whether data is stored semi-permanently or temporarily in the storage medium.

[0376] Furthermore, according to one embodiment of the present disclosure, the method according to the various embodiments described above may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or online through an application store (e.g., Play Store™). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0377] In addition, each of the components (e.g., modules or programs) according to the various embodiments described above may be composed of a single or multiple entities, and some of the corresponding sub-components described above may be omitted, or other sub-components may be further included in various embodiments. Alternatively or additionally, some components (e.g., modules or programs) may be integrated into a single entity, which may perform the same or similar functions as those performed by each of the corresponding components prior to integration. Operations performed by modules, programs or other components according to various embodiments may be executed sequentially, in parallel, iteratively or heuristically, or at least some operations may be executed in a different order, omitted, or other operations may be added.

[0378] Although the preferred embodiments of the present disclosure have been illustrated and described above, the present disclosure is not limited to the specific embodiments described above, and various modifications may be made by a person having ordinary skill in the art to which the present disclosure pertains without departing from the gist of the present disclosure as claimed in the claims, and such modifications should not be understood individually from the technical idea or prospect of the present disclosure.

Claims

1. In electronic devices, substrate; An input / output interface including an input connector and an output connector arranged on the upper surface of the substrate; A conversion module arranged on the lower surface of the above substrate; and comprising at least one processor; At least one processor of the above, Through the above input connector, the input image is acquired, Through the above conversion module, the input image is converted into a converted image based on the setting information related to the image output, An electronic device that displays the converted image through a display module.

2. In paragraph 1, Further comprising a transmission module connected to the above conversion module, At least one processor of the above, An electronic device that transmits the converted image to the display module through the transmission module.

3. In paragraph 1, Further comprising a timing module arranged on the lower surface of the above substrate; At least one processor of the above, Through the above timing module, compensation information for compensating for time delay corresponding to the above converted image is obtained, An electronic device that transmits the converted image and the compensation information to an external device through the output connector.

4. In paragraph 1, The above setting information is, An electronic device including at least one of size information of the display module for displaying the converted image, resolution information of the display module, or color information of the display module.

5. In paragraph 3, An electronic device, wherein pins of the input connector and pins of the output connector are connected to a lower surface of the substrate through the substrate.

6. In paragraph 5, The above substrate is, A first capacitor arranged between the pin of the input connector corresponding to the lower surface of the substrate and the conversion module; and A second capacitor is disposed between the pin of the output connector corresponding to the lower surface of the substrate and the timing module; At least one processor of the above, An electronic device for filtering noise through the first capacitor and the second capacitor.

7. In paragraph 6, At least one processor of the above, The input image is transmitted to the conversion module through a first impedance connecting the pin of the input connector and the first capacitor, and a second impedance connecting the first capacitor and the conversion module. An electronic device that transmits the converted image to the transmission module through a third impedance connecting the conversion module and the transmission module.

8. In paragraph 7, At least one processor of the above, Through the fourth impedance connecting the transmission module and the timing module, the converted image is transmitted to the timing module, An electronic device that transmits the converted image and the compensation information to the output connector through a fifth impedance connecting the timing module and the second capacitor and a sixth impedance connecting the second capacitor and the pin of the output connector.

9. In paragraph 8, The magnitude of the above first impedance is, Smaller than the size of the above second impedance, The magnitude of the above sixth impedance is, An electronic device having a size smaller than the fifth impedance.

10. In paragraph 6, The above substrate is, A first discharge element arranged between the pin of the input connector corresponding to the lower surface of the substrate and the first capacitor; and A second discharge element is disposed between the pin of the output connector corresponding to the lower surface of the substrate and the second capacitor; At least one processor of the above, An electronic device that filters static electricity through the first discharge element and the second discharge element.

11. A method for controlling an electronic device including an input / output interface including an input connector and an output connector arranged on the upper surface of a substrate and a conversion module arranged on the lower surface of the substrate, A step of acquiring an input image through the above input connector; A step of converting the input image into a converted image based on setting information related to image output through the above conversion module; and A control method, comprising: a step of displaying the converted image through a display module; 12. In paragraph 11, The above electronic device, Further comprising a transmission module connected to the above conversion module, The above control method is, A control method further comprising: a step of transmitting the converted image to the display module through the transmission module.

13. In paragraph 11, The above electronic device, Further comprising a timing module arranged on the lower surface of the above substrate; The above control method is, A step of obtaining compensation information for compensating for time delay corresponding to the converted image through the timing module; and A control method further comprising: a step of transmitting the converted image and the compensation information to an external device through the output connector.

14. In paragraph 11, The above setting information is, A control method comprising at least one of size information of the display module for displaying the converted image, resolution information of the display module, or color information of the display module.

15. In paragraph 13, A control method, wherein the pins of the input connector and the pins of the output connector are connected to the lower surface of the substrate through the substrate.

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