Substrate inspection apparatus and method using plasma

Abstract

The present disclosure relates to a substrate inspection apparatus and method using plasma. The method may comprise the steps of: moving, in a preset direction, the surface of a substrate in which a metal layer is protected by an insulating sheet, and jetting gas emitted through a plasma generator; measuring signals generated from the substrate while the gas is jetted; and analyzing the characteristics of the measured signals so as to determine whether the metal layer is exposed to the outside.

Description

Device and method for substrate inspection using plasma

[0001] The present disclosure relates to a substrate inspection device and method, and more particularly, to a substrate inspection device and method using plasma.

[0002] As demand for electric vehicles has increased recently, development and demand for secondary batteries are also increasing.

[0003] Typically, secondary batteries can degrade in performance depending on temperature, and there is a risk of overheating and explosion, especially when the temperature rises.

[0004] Moreover, since various flammable substances are embedded inside the secondary battery, the overheating or explosion of the secondary battery may cause ignition or explosion of other external components, which may result in damage to life and property.

[0005] Additionally, if the temperature of the secondary battery increases and the shape of components such as the separator is deformed, an internal short circuit between the positive and negative electrodes may occur, resulting in fire or explosion.

[0006] Therefore, a close inspection of components used in secondary batteries is necessary, and a technology needs to be developed that can quickly and easily inspect substrates applicable to secondary batteries while also enabling more accurate defect detection.

[0007] (Patent Document 1) Korean Patent Publication No. 10-2020-0007292 (Published: January 22, 2020)

[0008] The present disclosure provides a substrate inspection device and method using plasma, which can detect defective factors and filter out defective products by inspecting the substrate quickly and easily in a non-contact / non-destructive manner using plasma.

[0009] The problems to be solved by the present disclosure are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

[0010] A method for inspecting a substrate using plasma according to one aspect of the present disclosure for achieving the above-described technical task may include a step of moving the surface of a substrate in which a metal layer is protected by an insulating sheet in a preset direction and irradiating a gas emitted through a plasma generator; a step of measuring a signal generated from the substrate while irradiating the gas; and a step of analyzing the characteristics of the measured signal to determine whether the metal layer is exposed to the outside.

[0011] Meanwhile, a method for inspecting a substrate using plasma according to one aspect of the present disclosure may include a plasma generator that moves in a preset direction along the surface of a substrate in which a metal layer is protected by an insulating sheet and irradiates gas emitted through the plasma generator; a measuring unit that measures a signal generated from the substrate while irradiating the gas; and a determining unit that analyzes the characteristics of the measured signal to determine whether the metal layer is exposed to the outside.

[0012] In addition, a computer program stored in a computer-readable recording medium for executing a method for implementing the present disclosure may be further provided.

[0013] In addition, a computer-readable recording medium recording a computer program for executing a method for implementing the present disclosure may be further provided.

[0014] According to the above-described problem solving means of the present disclosure, a substrate can be inspected quickly and easily in a non-contact / non-destructive manner using plasma, thereby detecting defective factors and filtering out defective products.

[0015] The effects of the present disclosure are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description below.

[0016] FIG. 1 is a drawing showing the configuration of a substrate inspection device using plasma according to one embodiment of the present disclosure.

[0017] FIG. 2 is a drawing showing a substrate inspection method using plasma according to one embodiment of the present disclosure.

[0018] FIG. 3 is a drawing showing a specific operation for determining whether a metal layer is externally exposed on a substrate according to one embodiment of the present disclosure.

[0019] FIG. 4 is a drawing showing the structure of a substrate according to one embodiment of the present disclosure.

[0020] FIG. 5 is a schematic diagram schematically showing a process for inspecting a substrate according to one embodiment of the present disclosure.

[0021] The advantages and features of the present disclosure, and methods for achieving them, will become clearer with reference to the embodiments described below in detail with the accompanying drawings. However, the present disclosure is not limited to the embodiments disclosed below and may be implemented in various different forms. These embodiments are provided solely to ensure that the present disclosure is complete and to fully inform those skilled in the art of the scope of the present disclosure, and the present disclosure is defined solely by the scope of the claims.

[0022] The terminology used herein is for the purpose of describing embodiments only and is not intended to limit the present disclosure. In this specification, the singular also includes the plural unless specifically stated otherwise. As used herein, the terms "comprises" and / or "comprising" do not exclude the presence or addition of one or more other components in addition to the mentioned components. Like reference numerals refer to like components throughout the specification, and "and / or" includes each and any combination of one or more of the mentioned components. Although "first", "second", etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another. Therefore, it should be understood that a first component mentioned below may also be a second component within the technical spirit of the present disclosure.

[0023] Unless otherwise defined, all terms (including technical and scientific terms) used herein may be used in their common sense to those of ordinary skill in the art to which this disclosure pertains. Furthermore, terms defined in commonly used dictionaries are not to be interpreted ideally or excessively unless explicitly and specifically defined otherwise.

[0024] Throughout this disclosure, the same reference numerals denote the same components. This disclosure does not describe all elements of the embodiments, and general contents in the technical field to which this disclosure belongs or contents overlapping between embodiments are omitted. The term "part" or "module" as used in the specification means a hardware component such as a software or FPGA or ASIC, and the "part" or "module" performs certain roles. However, the "part" or "module" is not limited to software or hardware. The "part" or "module" may be configured to be in an addressable storage medium and may be configured to play one or more processors. Thus, as an example, the "part" or "module" includes components such as software components, object-oriented software components, class components, and task components, processes, functions, attributes, procedures, subroutines, segments of program code, drivers, firmware, microcode, circuits, data, databases, data structures, tables, arrays, and variables. The functionality provided within the components and “sub-components” or “modules” may be combined into a smaller number of components and “sub-components” or “modules” or further separated into additional components and “sub-components” or “modules”.

[0025] Throughout the specification, when a part is said to be "connected" to another part, this includes not only direct connection but also indirect connection, and indirect connection includes connection via a wireless communication network.

[0026] Additionally, when a part is said to "include" a component, this does not mean that it excludes other components, but rather that it may include other components, unless otherwise specifically stated.

[0027] Throughout the specification, when we say that an element is "on" another element, this includes not only cases where the element is in contact with the other element, but also cases where another element exists between the two elements.

[0028] The terms first, second, etc. are used to distinguish one component from another, and the components are not limited by the aforementioned terms.

[0029] Singular expressions include plural expressions unless the context clearly indicates otherwise.

[0030] The identification codes for each step are used for convenience of explanation and do not describe the order of each step. Each step may be performed in a different order than specified unless the context clearly indicates a specific order.

[0031] The operating principle and embodiments of the present disclosure are described below with reference to the attached drawings.

[0032] FIG. 1 is a drawing showing the configuration of a substrate inspection device using plasma according to one embodiment of the present disclosure.

[0033] Referring to FIG. 1, a substrate inspection device (hereinafter referred to as “inspection device”) (100) using plasma according to one embodiment of the present disclosure may include a plasma generator (110), a measuring unit (120), and a determination unit (130).

[0034] First, the plasma generator (110) moves in a preset direction and emits gas to irradiate the surface of the substrate, which is the inspection target. Here, the substrate includes a metal layer and an insulating layer, and the insulating layer is composed of an insulating sheet, assuming a configuration that protects the metal layer from being exposed to the outside. The substrate may be a substrate or film used in a battery, and for example, may be a substrate or film of a pouch-type battery. Meanwhile, the insulating layer may be located on one or both sides of the metal layer. In addition, the gas may be in one of various forms, such as anions, cations, negative charges, positive charges, neutrons, and radicals. At this time, the generated plasma may be atmospheric pressure plasma.

[0035] As an example, when a plurality of substrates are arranged in a row, the plasma generator (110) can sequentially move each substrate in one direction along which the plurality of substrates are arranged and emit gas to irradiate the substrates. Alternatively, the substrates can be arranged in a row in the external appearance inspection step, and the plurality of substrates can be sequentially moved to undergo external appearance inspection by the plasma generator.

[0036] In another embodiment, the plasma generators (110) may be configured in a form in which a plurality of plasma generators (110) are arranged in a row. In this case, the plurality of plasma generators (110) may move along a single direction and emit gas to irradiate the substrate. For example, the length of the plurality of plasma generators (110) arranged may cover the length of one side of the substrate, and the plurality of plasma generators (110) may move in a direction perpendicular to the arranged direction to emit gas, thereby covering the entire surface of the substrate. Meanwhile, the gas may be emitted in a straight line or radially.

[0037] Meanwhile, the measuring unit (120) measures a signal generated from the substrate while the plasma generator (110) irradiates gas. To this end, a probe is connected to an area where the metal layer of the substrate is exposed, for example, both sides that are not folded, so that the measuring unit (120) can measure a signal including current and voltage. Accordingly, the occurrence of noise due to unevenness in signal measurement in the insulated area, i.e., the insulating layer, can be suppressed. Meanwhile, in a case where the entire area of ​​both sides of the substrate is protected by an insulating layer, a dummy area can be perforated for inspection to expose the metal layer and measure the signal.

[0038] The determination unit (130) analyzes the characteristics of the signal measured by the measurement unit (120) to determine whether the metal layer is exposed externally. At this time, the analysis of the characteristics of the signal may include peak value derivation, displacement occurrence, waveform change, etc.

[0039] For example, the determination unit (130) checks the waveform of the measured signal and compares the displacement value with a preset threshold. If a change greater than the preset threshold is detected (if the displacement value is greater than the preset threshold), it is determined that the metal layer is exposed to the outside, and the corresponding board is classified as a defective product. If only the waveform according to the dielectric constant of the insulating sheet is detected (if the displacement value is less than or equal to the preset threshold), it is determined that the metal layer is not exposed to the outside, and the corresponding board is classified as a normal product.

[0040] Meanwhile, although not shown in FIG. 1, the inspection device (100) may be configured to include a communication unit, a storage unit, and a sensor unit.

[0041] The communication unit transmits and receives at least one piece of information or data to and from at least one device / terminal. Here, at least one device / terminal may be a device / terminal that wishes to receive inspection results from the inspection device (100), and its type and form are not limited.

[0042] Additionally, this communication unit can perform communication with other devices, and transmit and receive wireless signals in a communication network according to wireless Internet technologies.

[0043] Wireless Internet technologies include, for example, WLAN (Wireless LAN), Wi-Fi (Wireless-Fidelity), Wi-Fi (Wireless Fidelity) Direct, DLNA (Digital Living Network Alliance), WiBro (Wireless Broadband), WiMAX (World Interoperability for Microwave Access), HSDPA (High Speed ​​Downlink Packet Access), HSUPA (High Speed ​​Uplink Packet Access), LTE (Long Term Evolution), LTE-A (Long Term Evolution-Advanced), etc., and the inspection device (100) transmits and receives data according to at least one wireless Internet technology, including Internet technologies not listed above.

[0044] As for short range communication, short range communication can be supported using at least one of Bluetooth™, RFID (Radio Frequency Identification), Infrared Data Association (IrDA), UWB (Ultra Wideband), ZigBee, NFC (Near Field Communication), Wi-Fi (Wireless-Fidelity), Wi-Fi Direct, and Wireless USB (Wireless Universal Serial Bus) technologies. Such short range wireless communication networks (Wireless Area Networks) can support wireless communication between the inspection device (100) and at least one terminal. In this case, the short range wireless communication network can be a short range wireless personal area network (Wireless Personal Area Network).

[0045] The storage unit may store data for at least one process (algorithm) for inspecting a substrate using plasma, or a program that reproduces the process. Furthermore, the storage unit may further store processes for performing other operations, without limitation.

[0046] Meanwhile, the storage unit can store at least one pre-learning model (including a language model) used to inspect a substrate using plasma, and various information / data supporting various functions of the inspection device (100).

[0047] In addition, the storage unit can store a plurality of application programs (or applications) driven by the inspection device (100), data for the operation of the inspection device (100), and commands. At least some of these application programs can be downloaded from an external server via wireless communication. Meanwhile, the application programs can be stored in at least one memory provided in the storage unit, installed on the inspection device (100), and driven to perform operations (or functions) by at least one processor stored in the storage unit.

[0048] Meanwhile, at least one memory may include at least one type of storage medium among a flash memory type, a hard disk type, a multimedia card micro type, a card type memory (e.g., SD or XD memory, etc.), a random access memory (RAM), a static random access memory (SRAM), a read-only memory (ROM), an electrically erasable programmable read-only memory (EEPROM), a programmable read-only memory (PROM), a magnetic memory, a magnetic disk, and an optical disk. In addition, the memory may store information temporarily, permanently, or semi-permanently, and may be provided as a built-in or removable type.

[0049] This storage may also be further integrated with other separate external servers.

[0050] Meanwhile, the sensor unit may be configured to include at least one vision sensor, and may detect a scratch on the surface by scanning the surface using the at least one vision sensor before irradiating gas onto the surface of the substrate. In this case, the plasma generator (110) irradiates gas onto the area where the scratch is detected. For example, when a scratch is detected, the plasma generator (110) may move along the direction of the scratch using the vision sensor and irradiate gas.

[0051] FIG. 2 is a drawing showing a substrate inspection method using plasma according to one embodiment of the present disclosure.

[0052] Referring to Fig. 2, the surface of a substrate where a metal layer is protected by an insulating sheet is moved in a preset direction and a gas emitted through a plasma generator (110) is irradiated (S101), and while the gas is irradiated, a measuring unit (120) measures a signal generated from the substrate (S103).

[0053] Next, the determination unit (130) analyzes the characteristics of the signal measured by step S103 to determine whether the metal layer is exposed externally (S105).

[0054] Meanwhile, although not illustrated in FIG. 2, an operation of scanning the surface of the substrate using at least one vision sensor may be performed prior to step S101. This makes it possible to accurately detect defects such as scratches on the surface of the substrate.

[0055] FIG. 3 is a drawing showing a specific operation for determining whether a metal layer is externally exposed on a substrate according to one embodiment of the present disclosure, and illustrates step S105 of FIG. 2 in more detail. However, this is limited to the case of detecting whether displacement has occurred as a characteristic of a signal, and if other characteristics are used, the detailed operation may vary and is not limited thereto.

[0056] Referring to FIG. 3, the determination unit (130) checks the waveform of the signal measured by the measurement unit (120) (S1051), and compares the displacement value (A) and the preset threshold value (B) based on the result of the check (S1052).

[0057] Next, as a result of the comparison by step S1052, if the displacement value is greater than the preset threshold (A>B), it is determined that the metal layer is exposed to the outside, and the corresponding board is classified as a defective product (S1053). If the displacement value is less than or equal to the preset threshold (A≤B), it is determined that the metal layer is not exposed to the outside, and the corresponding board is classified as a normal product (S1054).

[0058] FIG. 4 is a drawing showing the structure of a substrate according to one embodiment of the present disclosure.

[0059] Referring to FIG. 4, the substrate (10) may be composed of a total of seven layers: polypropylene (201), adhesive (202), anti-corrosion layer (203), aluminum foil (corresponding to a metal layer) (204), anti-corrosion layer (205), adhesive (206), and nylon (207).

[0060] FIG. 5 is a schematic diagram schematically illustrating a process for inspecting a substrate according to one embodiment of the present disclosure.

[0061] Referring to FIG. 5, a plasma generator (110) moves across the surface of a substrate (10) protected by an aluminum foil (204) as an insulating sheet and irradiates gas emitted through a head.

[0062] At this time, the plasma generator (110) can have a preset movement direction, and can move the surface of the substrate (10) based on the preset movement direction and irradiate the gas.

[0063] While the gas is being irradiated, the measuring unit (120) measures a signal generated from the substrate (10). To this end, a probe is connected to the non-insulated side area (211) of the substrate (10), thereby enabling the measuring unit (120) to measure the signal.

[0064] If the metal layer is exposed to the outside due to a defective factor on the substrate (10), the gas irradiated from the plasma generator (110) comes into contact with the aluminum foil (204), causing a sudden and rapid signal change.

[0065] That is, the determination unit (130) can determine whether the metal layer is exposed externally by detecting such abrupt signal changes through analysis of the signal waveform.

[0066] The above-described program may include codes coded in a computer language, such as C, C++, JAVA, or machine language, that can be read by the processor (CPU) of the computer through the device interface of the computer, so that the computer reads the program and executes the methods implemented as a program. Such codes may include functional codes related to functions that define functions necessary for executing the methods, and may include control codes related to execution procedures necessary for the processor of the computer to execute the functions according to a predetermined procedure. In addition, such codes may further include memory reference-related codes regarding which location (address address) of the internal or external memory of the computer should reference additional information or media necessary for the processor of the computer to execute the functions. In addition, if the processor of the computer needs to communicate with any other computer or server located remotely in order to execute the functions, the code may further include communication-related code regarding how to communicate with any other computer or server located remotely using the communication module of the computer, and what information or media to send and receive during communication.

[0067] The above storage medium refers to a medium that stores data semi-permanently and can be read by a device, rather than a medium that stores data for a short period of time, such as a register, cache, or memory. Specifically, examples of the storage medium include, but are not limited to, ROM, RAM, CD-ROM, magnetic tape, floppy disk, and optical data storage device. That is, the program can be stored in various recording media on various servers that the computer can access or in various recording media on the user's computer. In addition, the medium can be distributed across network-connected computer systems, so that computer-readable code can be stored in a distributed manner.

[0068] The steps of a method or algorithm described in connection with the embodiments of the present disclosure may be implemented directly in hardware, implemented as a software module executed by hardware, or implemented by a combination thereof. The software module may reside in a random access memory (RAM), a read only memory (ROM), an erasable programmable ROM (EPROM), an electrically erasable programmable ROM (EEPROM), a flash memory, a hard disk, a removable disk, a CD-ROM, or any other form of computer-readable recording medium well known in the art to which the present disclosure pertains.

[0069] While the embodiments of the present disclosure have been described above with reference to the attached drawings, those skilled in the art will appreciate that the present disclosure can be implemented in other specific forms without altering the technical spirit or essential features thereof. Therefore, the embodiments described above should be understood to be illustrative in all respects and not restrictive.

Claims

1. In a method for inspecting a substrate using plasma, performed by a device, A step of moving the surface of a substrate protected by an insulating sheet with a metal layer in a preset direction and irradiating the gas emitted through a plasma generator. A step of measuring a signal generated from the substrate while investigating the gas; and It is characterized by including a step of analyzing the characteristics of the measured signal to determine whether the metal layer is exposed externally. Method for inspecting substrates using plasma.

2. In paragraph 1, The above signal is, Characterized in that it is measured by connecting a probe to an area where the metal layer of the above substrate is exposed. Method for inspecting substrates using plasma.

3. In paragraph 1, The step of determining whether the above metal layer is exposed externally is as follows: When the waveform of the measured signal is checked and a change exceeding a preset threshold is detected, the substrate is judged as a defective product, and when only the waveform according to the dielectric constant of the insulating sheet is detected, the substrate is judged as a normal product. Method for inspecting substrates using plasma.

4. In paragraph 1, The above substrate inspection method is, Characterized in that it further comprises a step of scanning the surface of the substrate using a vision sensor prior to the step of investigating the gas. Method for inspecting substrates using plasma.

5. In paragraph 4, The above scanning steps are: characterized in that a scratch is detected on the surface of the substrate through the vision sensor. Method for inspecting substrates using plasma.

6. In paragraph 5, The step of investigating the above gas is: characterized in that it is performed in the area where the above scratch is detected, Method for inspecting substrates using plasma.

7. In paragraph 6, The step of investigating the above gas is: When the above scratch is detected, the vision sensor is used to move along the direction of the scratch and investigate the gas. Method for inspecting substrates using plasma.

8. In paragraph 1, The above plasma generator, Characterized by being arranged in a row in multiples, Method for inspecting substrates using plasma.

9. In paragraph 1, The above substrate is, It is listed in multiples, The step of determining whether the above metal layer is exposed externally is as follows: A method characterized in that a plurality of substrates are sequentially moved in one direction while examining the gas. Method for inspecting substrates using plasma.

10. A plasma generator that moves the surface of a substrate protected by an insulating sheet in a predetermined direction and irradiates the gas emitted through the plasma generator. A measuring unit for measuring a signal generated from the substrate while investigating the gas; and It is characterized by including a determination unit that analyzes the characteristics of the measured signal to determine whether the metal layer is exposed externally. A substrate inspection device using plasma.

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