High frequency waveguide and electronics module

Abstract

According to an example aspect of the present invention, there is provided a circuit package comprising a waveguide (110) and a microchip (100) electromagnetically coupled to the waveguide by means of a probe (101,102) protruding out from a surface of the microchip.

Description

HIGH FREQUENCY WAVEGUIDE AND ELECTRONICS MODULEFIELD

[0001] This invention relates to the field of electronics assembly.BACKGROUND

[0002] Waveguides can be used to transmit electromagnetic waves for example in situations where typical transmission line and cable systems are non-ideal. Such situations occur especially at high frequencies, namely millimetre wave, microwave and terahertz (THz) frequencies, partly due to their high energy, a range in which ordinary methods and transmissions of energy through cables cannot not be considered optimal. Integration and packaging of millimetre wave or THz systems may be a challenge due to high losses and small dimensions of the RF interconnects. As such, information transfer may be hindered if inadequate electronics and transmission line or wire bonds are utilized. On-chip planar antennas mounted on the chip are also possible, but due to their size requirements, downscaling may pose problems. In addition, on-chip antennas are usually poor radiators and require an additional element such as a lens to radiate effectively.

[0003] Microwave monolithic integrated circuits (MMIC) are easy to produce with a variety of fabrication techniques that provide high component density. Furthermore, MMICs can operate at high frequencies in the range of few megahertz to even several terahertz.SUMMARY OF THE INVENTION

[0004] According to a first aspect of the present invention, there is provided a circuit package comprising a waveguide and a microchip electromagnetically coupled to the waveguide by means of a probe protruding out from a surface of the microchip. The waveguide has an H-plane and an E-plane. The probe protrudes substantially perpendicular to the H-plane, and the surface of the microchip is substantially codirectional with the H- plane.

[0005] According to a second aspect of the present invention, there is provided a circuit package comprising a waveguide having a cavity, at least one microchip, and at least one probe connected to a surface of the microchip, wherein the at least one probe is at least partially located inside the cavity of the waveguide. The waveguide has an H-planeand an E-plane. The at least one probe protrudes substantially perpendicular to the biplane, and the surface of the microchip is substantially codirectional with the H-plane.

[0006] According to a third aspect of the present invention, there is provided a circuit package comprising a waveguide, a microchip and a probe protruding out from a surface of the microchip, said probe electromagnetically coupling the microchip and the waveguide. The waveguide has an H-plane and an E-plane. The probe protrudes substantially perpendicular to the H-plane, and the surface of the microchip is substantially codirectional with the H-plane.

[0007] According to a fourth aspect of the present invention, there is provided a circuit package comprising a waveguide having an H-plane and an E-plane, a microchip having a surface substantially codirectional with the H-plane, and a probe protruding out from the surface of the microchip, the probe protruding substantially perpendicular to the H-plane and electromagnetically coupling the microchip to the waveguide.

[0008] The invention is defined by the features of the independent claims. Some specific embodiments are defined in the dependent claims.

[0009] According to some embodiments, the circuit package comprises an H-plane split waveguide, a microchip and an E-plane probe and provides interconnections for electromagnetic waves, such as radiofrequency signals and hardware. By employing a waveguide using an H-plane split design and an E-plane probe on a microchip, the complexity of the circuit package is reduced, allowing for more simple manufacturing schemes. Additionally, the connections may be made shorter and with less interfaces. The microchip may also be at least partially located inside the waveguide, which also provides for the above-mentioned benefits.BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Fig. 1A illustrates a cross-sectional side view of a circuit package in accordance with at least some embodiments of the present invention;

[0011] Fig. IB illustrates a three-dimensional wireframe view of a circuit package in accordance with at least some embodiments of the present invention;

[0012] Fig. 1C illustrates a three-dimensional wireframe view of a circuit package in accordance with at least some embodiments of the present invention;

[0013] Fig. 2A illustrates a cross-sectional side view of a circuit package in accordance with at least some embodiments of the present invention;

[0014] Fig. 2B illustrates a cross-sectional side view of a circuit package in accordance with at least some embodiments of the present invention;

[0015] Fig. 2C illustrates a cross-sectional side view of a circuit package in accordance with at least some embodiments of the present invention;

[0016] Fig. 3A illustrates a three-dimensional view of a dismantled H-plane split circuit package in accordance with at least some embodiments of the present invention;

[0017] Fig. 3B illustrates a three-dimensional view of a dismantled H-plane split circuit package in accordance with at least some embodiments of the present invention;EMBODIMENTS

[0018] In the present disclosure, a circuit package comprising at least one microchip, at least one electromagnetic waveguide, and at least one probe provided on, and protruding from, a surface of the microchip, is disclosed. In the waveguide, an electromagnetic wave of suitable at least one frequency propagates to and / or from the at least one probe. As such, the at least one microchip is electromagnetically coupled to the at least one waveguide using the at least one probe. The at least one probe is an E-plane probe coupling the microchip electromagnetically to the waveguide. An E-plane is any plane defined by the propagation direction of the electromagnetic wave and the electric field component of the said electromagnetic wave. As such, the elongated dimension of an E-plane probe is substantially perpendicular to the propagation direction of the electromagnetic wave and substantially parallel to the electric field component of the electromagnetic wave. An H- plane is defined as any plane perpendicular to the E-plane and along the propagation direction of the electromagnetic wave.

[0019] Fig. 1A illustrates an example cross-sectional side view of a circuit package in accordance with at least some embodiments. In an embodiment, a circuit package comprises a waveguide 110 and a microchip 100 electromagnetically coupled to the waveguide by means of at least one probe 101,102 protruding out from a surface of the microchip 100. Some examples for a microchip 100 include an integrated circuit (IC), monolithic microwave integrated circuit (MMIC), or a microchip fabricated from low-temperature co-fired ceramics (LTCC). The microchip 100 may be connected to a printed circuit board (PCB). Such a printed circuit board (PCB) may form part of the circuit package. The microchip 100 may be positioned inside the waveguide substantially codirectional to the H-plane and substantially perpendicular to the E-plane of the waveguide 110.

[0020] In an embodiment, a microchip 100 is positioned inside the waveguide 110.

[0021] In an embodiment, at least one probe 101,102 protrudes from the surface of the microchip 100 so as to receive and / or transmit electromagnetic waves. In an embodiment, the at least one probe 101,102 is a longitudinal structure that conducts electricity. The at least one probe 101,102 may be, for example, a stack of solder balls or bumps, or a pillar made of copper or other metal, or bond wire. In some embodiments, at least one first probe 101 is connected to an input port of the microchip and at least one second probe 102 to an output port of the microchip.

[0022] In an embodiment, on a surface of the microchip 100 is at least one substantially E-plane-oriented probe 101,102 for receiving and / or transmitting electromagnetic waves from and / or to the waveguide and its possible complementary hardware extensions. The waveguide 110 comprises an H-plane and an E-plane, and the probe 101, 102 protrudes substantially perpendicular to the H-plane. The probe is said to be substantially perpendicular to the H-plane, if the general longitudinal direction of the probe deviates at most ± 40 degrees, preferably ± 20 degrees, from the normal of the H- plane.

[0023] In an embodiment, the at least one probe 101,102 has a diameter between 10 pm to 150 pm, such as 25 to 100 pm, for example 40 pm to 80 pm, and a height between 20 pm to 500 pm, such as 50 pm to 500 pm, for example 100 pm to 300 pm. The height is measured along the general longitudinal direction of the probe and the diameter is the width perpendicular to the general longitudinal direction. In at least some embodiments, the probe 101,102 may be made by stacking solder balls. Other possible manufacturing techniques include stud bumps, metal pillars such as copper pillars, or wire bonds to name a few. The probe 101,102 may be coupled directly to, and protruding from, the microchip 100. In an embodiment, the probe 101, 102 may be on a contact pad of the microchip.

[0024] In an embodiment, a surface of the microchip 100 is substantially codirectional with the H-plane of the waveguide 110 comprising an H-plane and an E- plane. The surface of the microchip 100 is said to be substantially codirectional to the biplane, if the normal of the surface of the microchip 100 has at most a deviation of 40 degrees, preferably 20 degrees, with respect to the normal of the H-plane of the waveguide 110.

[0025] In an embodiment, the microchip 100 in the circuit package is a monolithic microwave integrated circuit (MMIC) configured to receive, transmit and / or process electromagnetic waves on at least one frequency between 10 GHz and 1 THz, for example between 100 GHz and 700 GHz.

[0026] In an embodiment, the waveguide comprises a longitudinal cavity for propagating electromagnetic waves along a longitudinal direction of the cavity. Longitudinal direction refers to the main propagation direction of the electromagnetic wave within the waveguide. Furthermore in an embodiment, a separating structure 120 may divide the cavity in the longitudinal direction into a first portion 111 and a second portion 112, wherein the separating structure 120 substantially prevents the propagation of the electromagnetic wave between the first portion 111 and the second portion 112, as further exemplified in Fig. IB. Prevent is to be understood such that it may include, for example, suppressing, limiting, reducing, reflecting, absorbing, eliminating, and / or minimizing the propagating electromagnetic wave. The separating structure 120 may be a high-impedance structure (HIS) or an electromagnetic band-gap (EBG) structure or, for example, other structure, such as a frequency-selective surface (FSS), for preventing the propagation of electromagnetic waves along the longitudinal direction of the waveguide and the microchip or, as according to an embodiment, between the first portion 111 and second portion 112 of the waveguide 110.

[0027] In an embodiment, the possible destructive interference may be limited with appropriate positioning of the at least one probe 101, 102 on the surface of the microchip 100 with respect to the separating structure 120. The location of the probe 101,102 may be such that destructive interference between a reflection of the electromagnetic wave and the propagating electromagnetic wave is suppressed.

[0028] Fig. IB illustrates a three-dimensional wireframe view of a circuit package in accordance with at least some embodiments. In an embodiment, the probe may comprise atleast one first probe 101 and at least one second probe 102. In one such embodiment, the at least one first probe 101 electromagnetically couples at least one microchip 100 to the first portion of the waveguide cavity 111. Additionally, the at least one second probe 102 electromagnetically couples the at least one microchip 100 to a second portion of the waveguide cavity.

[0029] According to an embodiment, the circuit package comprises at least one waveguide 110 comprising a first portion 111 and a second portion 112, a separating structure 120 between the first portion 111 and second portion 112, a microchip 100, and at least one probe 101,102 protruding from the microchip 100. The separating structure 120 divides the waveguide 110 into at least two portions 111,112 in the longitudinal direction of the waveguide. In an embodiment, the separating structure 120 is positioned adjacent to the microchip 100 and is a high impedance structure (HIS).

[0030] In an embodiment, the high impedance structure (HIS) comprises a corrugated structure having a series of parallel walls separated by gaps between the walls. The walls may comprise metal. These gaps may be defined with a separation between 20 pm to 300 pm, such as between 50 pm to 150 pm. The gaps may be selected such that the propagation of electromagnetic waves is prevented. The walls of the high impedance structure (HIS) may protrude from a wall of the waveguide opposite to the surface of the microchip 100 and extend close to the surface of the microchip 100. The walls of the high impedance structure (HIS) may be between 50% and 100% of the waveguide height. In a preferred embodiment, the height of the walls with respect to the waveguide height is between 65% and 90%. In some embodiments, the height of the walls in the high impedance structure is between 90% and 100% of the waveguide height, for example, wherein the microchip is embedded into a waveguide block. Further, the dimensions of the separating structure 120 may depend on the characteristics of the electromagnetic wave to be affected. For example in an embodiment, the height of the separating structure 120 is close to or equal to a quarter of the wavelength of the electromagnetic wave. In some embodiments, the height of the separating structure 120 may have a deviation less than 20%, for example less than 10%, from the quarter of the wavelength of the electromagnetic wave. As such, for electromagnetic waves in the range of between 0.3-3 mm, resulting in frequencies between 100-1000 GHz, the height of the separating structure 120 amounts to 0.075-0.75 mm in an air-filled waveguide.

[0031] Fig. 1C illustrates an example three-dimensional wireframe view of a circuit package in accordance with at least some embodiments of the present disclosure. According to an embodiment, the circuit package comprises at least one waveguide 110, a separating structure 120 dividing the waveguide into a first portion 111 and second portion 112, a microchip 100, and at least one probe 101,102 protruding from the microchip 100. An embodiment may have an electromagnetic bandgap (EBG) structure as the separating structure 120 positioned adjacent to the microchip 100. The electromagnetic bandgap structure may comprise a set of pins with, for example, rectangular or circular crosssection and dimensions suitable for delimiting the corresponding electromagnetic wave. The set of pins may be separated by gaps using a separation of between 20 pm and 300 pm, for example between 50 pm to 150 pm. Electromagnetic bandgap (EBG) structures include, for example, ridge gaps, groove gaps, or microstrip ridge gaps.

[0032] In an embodiment, the cavity of the waveguide 110 may be delimited by conductive surfaces and at least a portion of a surface of the microchip 100. In an embodiment, the cavity may comprise interlocked blocks. Such blocks may be manufactured from a metal, such as copper, brass, aluminium or other conductive metal, or a conductive alloy or a conductive metal compound. In an embodiment, the cavity or block interior may be of dielectric material, such as silicon, low-temperature co-fired ceramic (LTCC) or printed circuit board (PCB) laminate. Cavity may also be defined at least partially by a groove in a semiconductor material, such as silicon, which groove has a metal surfacing.

[0033] In an embodiment, the waveguide physical cavity dimensions are dependent on the electromagnetic wave, such that half of a wavelength of the electromagnetic wave may be less than the width of the waveguide. For example, the waveguide 110 may be 860 pm in width and 430 pm in height. In general, the height is equal to or less than the width. An embodiment utilizes waveguide 110, microchip 100 and probe 101,102 dimensions and specifications suitable for the utilized electromagnetic waves, such as, for example, millimetre waves (mmwave), radiofrequency (RF) waves, microwaves, or terahertz (THz) waves. For example, the range of the electromagnetic spectrum may be defined for a millimetre wave portion as a frequency range between 30 GHz to 300 GHz, for radio frequencies as 30 kHz and 300 GHz, for micro waves as 300 MHz and 300 GHz, and for terahertz 300 GHz to 30 THz.

[0034] In an embodiment, the microchip 100 is located inside the cavity of the waveguide 110.

[0035] In an embodiment, the probe 101,102 comprises at least one first probe 101 and at least one second probe 102, the at least one first probe 101 being electromagnetically coupled to the first portion 111 of the cavity and the at least one second probe 102 being electromagnetically coupled to the second portion 112 of the cavity. In a further embodiment, the at least one first probe 101 and the at least one second probe 102 protrude out from the surface of the same microchip 100 such that the microchip is electromagnetically coupled to the first portion 111 and the second portion 112 of the cavity. Further, in an embodiment, the at least one first probe 101 may be connected to an input port of the microchip 100 and the at least one second probe 102 to an output port of the microchip 100.

[0036] Fig. 2A illustrates a cross-sectional side view of a circuit package in accordance with at least some embodiments of the present disclosure. In an embodiment, the waveguide comprises at least two waveguides 210, 230 electromagnetically coupled to the same microchip 200.

[0037] Fig. 2B illustrates a cross-sectional side view of a circuit package in accordance with at least some embodiments of the present disclosure. In an embodiment, the microchip 200 is placed at an end of the waveguide 210, and may be interconnected 241 to other devices 240. Examples of these other devices 240 include microchips, such as ICs and MMICs.

[0038] In an embodiment, the waveguide 210 partly encompasses the microchip 200, wherein either the receiving or transmitting end of the microchip 200 may comprise interconnections 241 to extended hardware via, for example, a printed circuit board, a wire bond, an optical fibre and the like. Such an embodiment may be used, for example, to transmit or receive electromagnetic waves, and receive or transmit said signals using other means, respectively.

[0039] Fig. 2C illustrates a cross-sectional side view of a circuit package in accordance with at least some embodiments of the present disclosure. In an embodiment, the microchip comprises a plurality of microchips 200 electromagnetically coupled to the same waveguide 210. In an embodiment, the circuit package comprises a waveguide 210and two microchips 200 electromagnetically coupled to the waveguide 210. The microchip 200 may have interconnections 241 to external hardware devices 240, may transmit and receive electromagnetic waves using a probe 201,202 protruding from the surface of the microchip 200 and may comprise separating structures 220 to prevent propagation of electromagnetic waves.

[0040] Fig. 3A illustrates a three-dimensional view of two waveguide blocks prior to attachment along an H-plane split in accordance with at least some embodiments of the present disclosure. According to an embodiment, the circuit package comprises at least one waveguide comprising two blocks 310a, 310b, a microchip 300, and at least one probe 301, 302 protruding from the microchip 300. In an embodiment, the longitudinal waveguide comprises a first block 310a having a first groove 315a and a second block 310b having a second groove 315b against the first groove such that the first and second grooves define the longitudinal cavity. Further, in an embodiment, the separating structure 320 may be formed as part of the first block or mechanically attached to the first block. The microchip 300 may be mechanically attached to the second block 310b. The first block 310a and second block 310b may be bonded using, for example, using wafer-level bonding technique for silicon wafers. In an embodiment, the second block 310b may be connected to the first block 310a along a surface that is codirectional to that of the H-plane of the waveguide. In an embodiment, the height of the separating structure 320 is equal to the height of the first block 310a as illustrated in Fig. 3B. In an embodiment, the height of the separating structure 320 is less than the height of the first block 310a.

[0041] In some embodiments, a high-impedance structure, HIS, is employed to the longitudinal sides of the waveguide blocks to minimize the leakage of the electromagnetic wave from a gap caused by an imprecise clearance and / or fit between the adjacent blocks comprising the waveguide.

[0042] According to some embodiments, there is provided a circuit package comprising a waveguide 110 having a cavity, at least one microchip 100, and at least one probe 101,102 connected to a surface of the microchip 100, wherein the at least one probe 101,102 is at least partially located inside the cavity of the waveguide 110, wherein the waveguide 110 has an H-plane and an E-plane, the at least one probe 101,102 protrudes substantially perpendicular to the H-plane, and the surface of the microchip 100 is substantially codirectional with the H-plane.

[0043] According to some embodiments, there is provided a circuit package comprising a waveguide 110, a microchip 100 and a probe 101,102 protruding out from a surface of the microchip, said probe 101,102 electromagnetically coupling the microchip 100 and the waveguide 110, wherein the waveguide 110 has an H-plane and an E-plane, the probe 101,102 protrudes substantially perpendicular to the H-plane, and the surface of the microchip 100 is substantially codirectional with the H-plane.

[0044] In an embodiment, the waveguide 110 has an H-plane and an E-plane and the probe 101 protrudes substantially perpendicular to the H-plane.

[0045] In an embodiment, the waveguide 110 has an H-plane and an E-plane and the surface of the microchip 100 is substantially codirectional with the H-plane.

[0046] In an embodiment, the microchip 100 is a monolithic microwave integrated circuit, MMIC.

[0047] In an embodiment, the waveguide 110 comprises a longitudinal cavity for propagating electromagnetic wave along a longitudinal direction of the cavity and the circuit package comprises a separating structure 120 in the cavity, the separating structure dividing the cavity in the longitudinal direction into a first portion 111 and a second portion 112, the separating structure substantially preventing propagation of the electromagnetic wave between the first portion and the second portion.

[0048] In an embodiment, the separating structure comprises a high impedance structure HIS, the high impedance structure comprising a corrugated structure having a series of parallel walls separated by gaps between the walls.

[0049] In an embodiment, the separating structure comprises an electromagnetic bandgap EBG, the electromagnetic bandgap comprising a set of pins separated by gaps.

[0050] In an embodiment, the cavity is delimited by conductive surfaces and at least a portion of the surface of the microchip 100.

[0051] In an embodiment, the microchip 100 is at least partially located inside the cavity. In another embodiment, the microchip 100 is at least partially embedded inside a wall of the waveguide 110. In a further embodiment, the microchip 100 is at least partially located inside the cavity and at least partially embedded inside a wall of the waveguide

[0052] In an embodiment, the probe comprises at least one first probe 101 and at least one second probe 102, the at least one first probe 101 is electromagnetically coupled to the first portion of the cavity 111, and the at least one second probe 102 is electromagnetically coupled to the second portion of the cavity 112.

[0053] In an embodiment, the at least one first probe 101 and the at least one second probe 102 protrude out from the surface of the same microchip 100 such that the microchip is electromagnetically coupled to the first portion 111 and the second portion of the cavity 112.

[0054] In an embodiment, the at least one first probe 101 is connected to an input port of the microchip 100, and the at least one second probe 102 is connected to an output port of the microchip 100.

[0055] In an embodiment, the circuit package comprises a first block 310a having a first groove 315a and a second block 310b having a second groove 315b against the first groove such that the first and second grooves define the longitudinal cavity, the separating structure 320 is formed as part of the first block 310a or mechanically attached to the first block 310a, and the microchip 100 is mechanically attached to the second block 310b.

[0056] In an embodiment, the first block 310a is connected to the second block 310b along a surface that is codirectional with the H-plane of the waveguide.

[0057] In an embodiment, the separating structure 320 protrudes from a wall of the waveguide opposite to the surface of the microchip and extend close to the surface of the microchip.

[0058] In an embodiment, the probe 101,102 comprises a stack of solder balls.

[0059] In an embodiment, the probe 101,102 comprises a metal pillar.

[0060] In an embodiment, the probe 101,102 is on a contact pad of the microchip 100.

[0061] In an embodiment, the waveguide 110 comprises at least two waveguides electromagnetically coupled to the same microchip.

[0062] In an embodiment, the microchip 100 comprises at least two microchips electromagnetically coupled to the same waveguide 110.

[0063] In an embodiment, the probe 101,102 has a diameter and a height such that the diameter is 10 to 150 pm, such as 40 to 80 pm, and the height is 20 to 500 pm, such as 100 to 300 pm.

[0064] It is to be understood that the embodiments of the invention disclosed are not limited to the particular structures, process steps, or materials disclosed herein, but are extended to equivalents thereof as would be recognized by those ordinarily skilled in the relevant arts. It should also be understood that terminology employed herein is used for the purpose of describing particular embodiments only and is not intended to be limiting.

[0065] Reference throughout this specification to “one embodiment” or “an embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, appearances of the phrases “in one embodiment” or “in an embodiment” in various places throughout this specification are not necessarily all referring to the same embodiment.

[0066] As used herein, a plurality of items, structural elements, compositional elements, and / or materials may be presented in a common list for convenience. However, these lists should be construed as though each member of the list is individually identified as a separate and unique member. Thus, no individual member of such list should be construed as a de facto equivalent of any other member of the same list solely based on their presentation in a common group without indications to the contrary. In addition, various embodiments and example of the present invention may be referred to herein along with alternatives for the various components thereof. It is understood that such embodiments, examples, and alternatives are not to be construed as de facto equivalents of one another, but are to be considered as separate and autonomous representations of the present invention.

[0067] Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided, such as examples of lengths, widths, shapes, etc., to provide a thorough understanding of embodiments of the invention. One skilled in the relevant art will recognize, however, that the invention can be practiced without one or more of the specific details, or with other methods, components, materials,etc. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of the invention.

[0068] While the forgoing examples are illustrative of the principles of the present invention in one or more particular applications, it will be apparent to those of ordinary skill in the art that numerous modifications in form, usage and details of implementation can be made without the exercise of inventive faculty, and without departing from the principles and concepts of the invention. Accordingly, it is not intended that the invention be limited, except as by the claims set forth below.

[0069] The verbs “to comprise” and “to include” are used in this document as open limitations that neither exclude nor require the existence of also un-recited features. The features recited in depending claims are mutually freely combinable unless otherwise explicitly stated. Furthermore, it is to be understood that the use of "a" or "an", i.e. a singular form, throughout this document does not exclude a plurality.INDUSTRIAL APPLICABILITY

[0070] The disclosed embodiments may be used to limit losses of RF signals, limit the overall complexity of a waveguide RF module and enable high isolation within or between monolithic microwave integrated circuits.ACRONYMS LISTREFERENCE SIGNS LIST

Claims

CLAIMS:

1. A circuit package comprising a waveguide (110) and a microchip (100) electromagnetically coupled to the waveguide (110) by means of a probe (101,102) protruding out from a surface of the microchip, wherein the waveguide (110) has an H-plane and an E-plane; the probe (101,102) protrudes substantially perpendicular to the H-plane; and the surface of the microchip (100) is substantially codirectional with the H- plane.

2. The circuit package according to claim 1, wherein the microchip (100) is a monolithic micro wave integrated circuit, MMIC.

3. The circuit package according to any one of the preceding claims, wherein the waveguide (110) comprises a longitudinal cavity for propagating electromagnetic wave along a longitudinal direction of the cavity.

4. The circuit package according to claim 3, wherein the probe (101,102) is at least partially located inside the cavity of the waveguide (110).

5. The circuit package according to claim 3 or 4, wherein the circuit package comprises a separating structure (120) in the cavity, the separating structure (120) dividing the cavity in the longitudinal direction into a first portion (111) and a second portion (112), the separating structure (120) substantially preventing propagation of the electromagnetic wave between the first portion (111) and the second portion (112).

6. The circuit package according to claim 5, wherein the separating structure (120) comprises a high impedance structure (HIS), the high impedance structure comprising a corrugated structure having a series of parallel walls separated by gaps between the walls.

7. The circuit package according to claim 5 or 6, wherein the separating structure (120) comprises an electromagnetic bandgap (EBG), the electromagnetic bandgap comprising a set of pins separated by gaps.

8. The circuit package according to any one of claims 5 to 7, wherein the circuit package comprises a first block (310a) having a first groove (315a) and a second block (310b) having a second groove (315b) against the first groove (315a) such that the first and second grooves define the longitudinal cavity; the separating structure (320) is formed as part of the first block (310a) or mechanically attached to the first block (310a); and the microchip (100) is mechanically attached to the second block (310b).

9. The circuit package of claim 8, wherein the first block (310a) is connected to the second block (310b) along a surface that is codirectional with the H-plane of the waveguide.

10. The circuit package according to any one of claims 5 to 9, wherein the separating structure (320) protrudes from a wall of the waveguide opposite to the surface of the microchip and extends close to the surface of the microchip.

11. The circuit package according to any one of claims 3 to 7, wherein the circuit package comprises a first block (310a) having a first groove (315a) and a second block (310b) having a second groove (315b) against the first groove (315 a) such that the first and second grooves define at least a portion of the longitudinal cavity, wherein the first block (310a) is connected to the second block (310b) along a surface that is codirectional with the H-plane of the waveguide.

12. The circuit package according to any one of claims 3 to 11, wherein the probe comprises at least one first probe (101) and at least one second probe (102); the at least one first probe (101) is electromagnetically coupled to the first portion of the cavity (111); and the at least one second probe (102) is electromagnetically coupled to the second portion of the cavity (112).

13. The circuit package of claim 12, wherein the at least one first probe (101) and the at least one second probe (102) protrude out from the surface of the same microchip (100) such that the microchip is electromagnetically coupled to the first portion (111) and the second portion of the cavity (112).

14. The circuit package of claim 12 or 13, wherein the at least one first probe (101) is connected to an input port of the microchip (100); and the at least one second probe (102) is connected to an output port of the microchip (100).

15. The circuit package according to any one of claims 3 to 14, wherein the cavity is delimited by conductive surfaces and at least a portion of the surface of the microchip (100).

16. The circuit package according to any one of claims 3 to 15, wherein the microchip (100) is at least partially located inside the cavity and / or wherein the microchip (100) is at least partially embedded inside a wall of the waveguide (110).

17. The circuit package according to any one of claims 3 to 16, wherein the cavity is delimited by conductive surfaces and at least a portion of the surface of the microchip (100), and wherein the probe (101,102) is located inside the waveguide protruding from said portion of the surface of the microchip (100).

18. The circuit package according to any one of the preceding claims, wherein the probe(101,102) is located inside the waveguide (110).

19. The circuit package according to any one of the preceding claims, wherein the probe(101,102) comprises a stack of solder balls.

20. The circuit package according to any one of the preceding claims, wherein the probe(101,102) comprises a metal pillar.

21. The circuit package according to any one of the preceding claims, wherein the probe(101,102) is on a contact pad of the microchip (100).

22. The circuit package according to any one of the preceding claims, wherein the waveguide (110) comprises at least two waveguides electromagnetically coupled to the same microchip.

23. The circuit package according to any one of the preceding claims, wherein the microchip (100) comprises at least two microchips electromagnetically coupled to the same waveguide (110).

24. The circuit package according to any one of the preceding claims, wherein the probe (101,102) has a diameter and a height such that the diameter is 10 to 150 pm, such as 40 to 80 pm, and the height is 20 to 500 pm, such as 100 to 300 pm.

25. The circuit package according to any one of the preceding claims, wherein the waveguide (110) has an H-plane split.

26. The circuit package according to any one of the preceding claims, wherein the waveguide (110) has an H-plane split, the probe (101,102) is located inside the waveguide (110), and a surface of the microchip (100) forms part of the surface delimiting the waveguide (110).

27. A circuit package comprising a waveguide (110) having a cavity, at least one microchip (100), and at least one probe (101,102) connected to a surface of the microchip, wherein the at least one probe (101,102) is at least partially located inside the cavity of the waveguide (110); the waveguide (110) has an H-plane and an E-plane; the at least one probe (101, 102) protrudes substantially perpendicular to the H-plane; and the surface of the microchip (100) is substantially codirectional with the H- plane.

28. A circuit package comprising a waveguide (110), a microchip (100) and a probe (101,102) protruding out from a surface of the microchip (100), said probe (101) electromagnetically coupling the microchip (100) and the waveguide (110) wherein the waveguide (110) has an H-plane and an E-plane; the probe (101,102) protrudes substantially perpendicular to the H-plane; and the surface of the microchip (100) is substantially codirectional with the H- plane.

29. A circuit package comprising: a waveguide (110) having an H-plane and an E-plane; a microchip (100) having a surface substantially codirectional with the H- plane; and a probe (101,102) protruding out from the surface of the microchip (100), the probe (101,102) protruding substantially perpendicular to the H-plane and electromagnetically coupling the microchip (100) to the waveguide (110).

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