Fan module, heat dissipation structure, and power electronic device

Abstract

Provided are a fan module, a heat dissipation structure, and a power electronic device. The fan module comprises a module support (1) and a plurality of heat dissipation fans (3), each heat dissipation fan (3) is provided with a first electrical connection part (31); and the module support (1) is provided with a second electrical connection part (13) and third electrical connection parts (14), wherein the second electrical connection part (13) is configured to be electrically connected to a control circuit in a device housing (2), and the third electrical connection parts (14) are configured to be adaptively connected to the first electrical connection parts (31); the heat dissipation fans (3) are mounted at fan mounting positions on the module support (1), each fan mounting position is provided with a third electrical connection part (14), and at least two third electrical connection parts (14) are connected to the second electrical connection part (13) by means of a bus component (15). According to the fan module, relevant electronic components in the whole power electronic device do not need to be dismounted, making wiring operation of electrical connection simpler and more convenient, and improving the convenience of dismounting, mounting, and maintenance of the heat dissipation fans on the power electronic device.

Description

A fan module, heat dissipation structure and power electronic equipment

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on October 31, 2023, with application number 202322943325.0 and application name “A fan module, heat dissipation structure and power electronic device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of equipment heat dissipation, and more specifically, to a fan module, a heat dissipation structure, and a power electronic device. Background Art

[0003] As the power of power electronic devices increases, forced air cooling is required for the heat dissipation area of ​​the power electronic devices. Taking the inverter, a common power electronic device, as an example, to meet the air cooling requirements, the inverter often requires an external cooling fan. Since the cooling fan is exposed to the natural environment, it is prone to failure and requires regular maintenance or replacement.

[0004] However, the current disassembly and assembly process of the cooling fan is very inconvenient. It is often necessary to disassemble the entire electronic device related electronic components in the power electronic device to maintain the cooling fan. The disassembly and maintenance work is very tedious, resulting in a poor user experience.

[0005] Therefore, how to solve the problem of inconvenient disassembly, assembly and maintenance of the cooling fan on the power electronic device has become a technical problem that needs to be solved urgently by those skilled in the art.

[0006] Application Contents

[0007] In view of this, the present application provides a fan module, a heat dissipation structure and a power electronic device to solve the problem of inconvenient disassembly and maintenance of the heat dissipation fan on the power electronic device.

[0008] To achieve the above objectives, this application provides the following technical solutions:

[0009] A fan module comprises a module bracket and a plurality of cooling fans detachably mounted on the module bracket, wherein the cooling fans have a first electrical connection portion electrically connected to the cooling fans via a flexible cable;

[0010] The module bracket is detachably mounted on the outside of the device housing. The module bracket is provided with a second electrical connection portion and a third electrical connection portion electrically connected to the second electrical connection portion. The second electrical connection portion is used to electrically connect to the control circuit in the device housing. The third electrical connection portion is used to adapt and connect to the first electrical connection portion in a one-to-one correspondence.

[0011] Among them, a plurality of fan mounting positions are provided on the module bracket, the cooling fan is installed at the fan mounting position, each of the fan mounting positions is provided with the third electrical connection part, and at least two of the third electrical connection parts are connected to the second electrical connection part through a confluence component.

[0012] Optionally, the fan mounting position is configured as a mounting slot, and the heat dissipation fan is inserted and fixed in the mounting slot.

[0013] Optionally, the cooling fan is fixed after being inserted into the cooling fan by means of snap-fitting and / or fastener fixing.

[0014] Optionally, the adaptive connection mode between the first electrical connection portion and the third electrical connection portion is configured as a plug-in connection, an abutment connection or an elastic overlap-fit ​​fixing structure.

[0015] Compared with the background technology introduction, the above-mentioned fan module includes a module bracket and a plurality of cooling fans detachably arranged on the module bracket, the cooling fan has a first electrical connection part, and the first electrical connection part is electrically connected to the cooling fan through a flexible cable; the module bracket is detachably arranged on the outside of the equipment casing, and a second electrical connection part and a third electrical connection part electrically connected to the second electrical connection part are provided on the module bracket, the second electrical connection part is used to be electrically connected to the control circuit in the equipment casing, and the third electrical connection part is used to adapt and connect with the first electrical connection part in a one-to-one correspondence; wherein, a plurality of fan mounting positions are provided on the module bracket, the cooling fans are installed at the fan mounting positions, each fan mounting position is provided with a third electrical connection part, and each third electrical connection part is connected to the second electrical connection part through a busbar component. In actual application of the fan module, since the first electrical connection part on the heat dissipation fan is electrically connected to the heat dissipation fan through a flexible cable, and the module bracket is provided with a third electrical connection part adapted to the first electrical connection part, the heat dissipation fan can be adapted to be connected and fixed with the third electrical connection part before, after or during installation to the corresponding fan installation position on the module bracket, and the third electrical connection part is connected to the second electrical connection part through a converging component. Therefore, when the heat dissipation fan is disassembled, overhauled or maintained from the module bracket, there is no need to disassemble the relevant electronic components of the whole machine inside the power electronic device, only The electrical connection of each cooling fan can be achieved by electrically connecting the second electrical connection part to the control circuit in the device casing. The wiring operation of the electrical connection is simpler and more convenient, which greatly improves the convenience of disassembly, assembly and maintenance of the cooling fan on the power electronic device. In addition, since at least two third electrical connection parts are connected to the second electrical connection part connected to the control circuit in the device casing through the busbar component, the number of second electrical connection parts arranged on the control circuit can be reduced, which helps to simplify the structure, and the first electrical connection part can directly use the wiring port of the cooling fan, without the need for additional special wiring port, which helps to save costs.

[0016] In addition, this application also provides a heat dissipation structure comprising a device housing and a radiator and a fan module mounted on the device housing. The fan module is a fan module described in any of the above solutions. Since the above fan module has the above technical effects, the heat dissipation structure having this fan module should also have corresponding technical effects, which will not be described in detail here.

[0017] Optionally, the module bracket of the fan module is detachably arranged on the outside of the device casing, and a fourth electrical connection part connected to the control circuit in the device casing is provided on the outside of the device casing. When the module bracket is installed on the outside of the device casing, the second electrical connection part on the module bracket and the fourth electrical connection part are just adapted and connected, and the cooling fan and the radiator are fitted into place.

[0018] Optionally, the module bracket is configured as a sliding connection in a detachable manner on the outside of the device casing. When the module bracket slides to a preset assembly position, the second electrical connection part and the fourth electrical connection part are just adapted and connected, and the cooling fan and the radiator are fitted into place.

[0019] Optionally, a guide slide is provided on the outer side of the device housing, and the module bracket is slidably matched with the guide slide and can slide out from the guide slide.

[0020] Optionally, the module bracket has a first end side and a second end side arranged opposite to each other in the extension direction of the guide slide, wherein one of the first end side and the second end side is configured as a sliding-in end side, and the other is configured as a non-sliding-in end side, and the module bracket can only slide into the guide slide through the sliding-in end side.

[0021] Optionally, the module bracket and the sliding structures formed on both sides of the guide slide are arranged asymmetrically.

[0022] Optionally, the guide slide and the outer shell wall of the equipment casing are an integrated structure or a split fixed connection structure.

[0023] Optionally, the sliding direction of the module bracket relative to the guide slide is the same as the axial direction of the air outlet surface of the cooling fan;

[0024] Alternatively, the sliding direction of the module bracket relative to the guide slideway is arranged at an angle to the axial direction of the air outlet surface of the heat dissipation fan.

[0025] Optionally, it also includes a heat dissipation cover arranged on the outside of the device casing. When the module bracket is in a preset assembly position, the heat dissipation cover can cover the radiator and the module bracket, and the heat dissipation cover is provided with an air inlet opening adapted to the air inlet side of the cooling fan.

[0026] Optionally, the heat dissipation shell, the radiator and the outer shell wall of the equipment housing form a placement space for the module bracket, and the heat dissipation shell is provided with a first process opening for disassembly and assembly of the module bracket.

[0027] Optionally, a push-pull handle is provided on the non-sliding end side of the module bracket, and a limiting end surface adapted to the outer edge of the first process opening is formed on the side where the push-pull handle is connected to the module bracket.

[0028] Optionally, the module bracket is configured as a sliding connection in a detachable manner on the outside of the device casing. When the module bracket slides to a preset assembly position, the second electrical connection part and the fourth electrical connection part are just adapted and connected, and the cooling fan and the radiator are fitted into place.

[0029] Optionally, it further includes a fan grille provided on the air inlet side of the heat dissipation fan;

[0030] Wherein, the fan mesh cover is arranged on the heat dissipation shell cover corresponding to the air inlet opening;

[0031] And / or, the fan grille is arranged on the module bracket corresponding to the air inlet side of the cooling fan;

[0032] And / or, the fan grille is arranged on the cooling fan and located on the air inlet side of the cooling fan.

[0033] Optionally, the second electrical connection portion and the fourth electrical connection portion are connected in a plug-in connection, an abutment connection or an elastic overlap connection.

[0034] Furthermore, this application provides a power electronic device including a heat dissipation structure, wherein the heat dissipation structure includes at least one set of the heat dissipation structures described in the above embodiment. Since the heat dissipation structure has the above-described technical effects, the power electronic device having the heat dissipation structure should also have the corresponding technical effects, which will not be further described here. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0036] FIG1 is a schematic diagram of the axial structure of a heat dissipation fan provided in an embodiment of the present application;

[0037] FIG2 is a schematic diagram of the structure of a heat dissipation fan provided in an embodiment of the present application from a side perspective;

[0038] FIG3 is a schematic diagram of the axial structure of a fan module provided in an embodiment of the present application;

[0039] FIG4 is a schematic diagram of the split structure of the fan module provided in an embodiment of the present application;

[0040] FIG5 is a schematic diagram of the split structure of the heat dissipation structure provided in an embodiment of the present application;

[0041] FIG6 is a schematic diagram of the assembly structure of the heat dissipation structure provided in an embodiment of the present application;

[0042] FIG7 is a schematic structural diagram of a fan module provided in an embodiment of the present application ready to be installed in a device housing;

[0043] FIG8 is a schematic structural diagram of the adaptive connection between the second electrical connection portion and the fourth electrical connection portion provided in an embodiment of the present application.

[0044] Among them, in Figures 1 to 8:

[0045] Module bracket 1, sliding end side 11, non-sliding end side 12, second electrical connection part 13, third electrical connection part 14, and converging component 15;

[0046] Equipment housing 2, fourth electrical connection portion 21, guide slide 22, heat dissipation cover 23, air inlet opening 230, first process opening 231, second process opening 24, circuit board 25;

[0047] Cooling fan 3, flexible cable 30, first electrical connection portion 31;

[0048] Radiator 4;

[0049] Fixing component 5;

[0050] Push-pull handle 6;

[0051] Fan guard 7;

[0052] Second sealing ring 8. DETAILED DESCRIPTION

[0053] The core of this application is to provide a fan module, a heat dissipation structure and a power electronic device to solve the problem of inconvenient disassembly and maintenance of the heat dissipation fan on the power electronic device.

[0054] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0055] 3 and 4, in combination with FIG5-7, the present application provides a fan module, including a module bracket 1 and a plurality of (i.e., at least two) cooling fans 3 detachably arranged on the module bracket 1, the cooling fan 3 having a first electrical connection portion 31, the first electrical connection portion can be electrically connected to the cooling fan 3 through a flexible cable 30; the module bracket 1 is detachably arranged on the outside of the device casing 2 (such as on the outer shell wall), the module bracket 1 is provided with a second electrical connection portion 13 and a third electrical connection portion 14 electrically connected to the second electrical connection portion 13, the second electrical connection portion 13 is used to electrically connect to the control circuit (such as the circuit board 25) in the device casing 2, and the third electrical connection part 14 is used to adapt and connect with the first electrical connection part 33 in a one-to-one correspondence; wherein, a plurality of fan mounting positions are provided on the module bracket 1, and the cooling fan 3 is installed at the fan mounting position, and each fan mounting position is provided with a third electrical connection part 14, and at least two third electrical connection parts 14 are connected to the second electrical connection part 13 through the busbar component 15, that is, two, more than two, or all of the third electrical connection parts 14 are connected to the second electrical connection part 13 through the busbar component 15. For example, the cooling fan 3 and the module bracket 1 are plug-in compatible, and the first electrical connection part 33 and the third electrical connection part 14 use plug-in terminals. Before, after, or during the insertion of the cooling fan 3 into the module bracket 1, the first electrical connection part 31 and the third electrical connection part 14 can be plug-in connected. Since the first electrical connection part 31 is connected to the cooling fan 3 using a flexible cable 30, the position adjustment of the first electrical connection part 31 is more convenient, and it is more convenient to adapt it to the third electrical connection 14.

[0056] In actual application of the fan module, since the first electrical connection portion 31 on the heat dissipation fan 3 is electrically connected to the heat dissipation fan 3 through the flexible cable 30, and the module bracket 1 is provided with a third electrical connection portion 14 that is adapted to the first electrical connection portion 31 in a one-to-one correspondence, the heat dissipation fan 3 can be fixedly connected to the first electrical connection portion 31 and the third electrical connection portion 14 in a one-to-one correspondence before, after, or during installation of the heat dissipation fan 3 to the corresponding fan installation position on the module bracket 1, and the third electrical connection portion 14 is connected to the second electrical connection portion 13 through the confluence component 15. Therefore, when the heat dissipation fan 3 is removed from the module bracket 1 during assembly, inspection, and maintenance, there is no need to disassemble the entire power electronic device. For related electronic devices, it is only necessary to electrically connect the second electrical connection part 13 to the control circuit in the device casing 2 to achieve the electrical connection of each cooling fan 3. The wiring operation of the electrical connection is simpler and more convenient, which greatly improves the convenience of disassembly, assembly and maintenance of the cooling fan on the power electronic device; in addition, since at least two third electrical connection parts 14 are connected to the second electrical connection part 13 connected to the control circuit in the device casing 2 through the busbar component 15, the number of second electrical connection parts 13 on the control circuit can be reduced, which helps to simplify the structure, and the first electrical connection part 31 can directly use the wiring port of the cooling fan 3, without the need for additional special wiring port, which helps to save costs.

[0057] It should be noted that, referring to Figures 1 and 2, in combination with Figures 5 to 7, in addition to being connected by a flexible cable 30, the first electrical connection part 31 on the cooling fan 3 can also be designed as a hard wiring block structure, or the first electrical connection part 31 can be directly integrated into the outer casing of the cooling fan 3. In this case, it can be designed that when the cooling fan 3 is installed to the designated installation position of the corresponding fan installation position on the module bracket 1, the first electrical connection part 31 is just adapted to be connected with the third electrical connection part 13. This structural form can eliminate the wiring operation of the electrical connection of the cooling fan 3, and the assembly process and electrical connection are completed simultaneously, making the operation more convenient. In addition, those skilled in the art should be able to understand that the cooling fan 3 is mainly used to cooperate with the radiator 4 on the outer shell wall of the equipment casing 2 to achieve forced air cooling and heat dissipation. Among them, the specific structure of the radiator 4 may include a heat dissipation substrate and heat dissipation fins. Of course, the heat dissipation fins are not necessary, and there may be no heat dissipation fins. It is just that when the heat dissipation fins are provided, the heat dissipation effect is better when combined with the heat dissipation fan. When the radiator 4 has heat dissipation fins, the specific structural form of the cooperation between the heat dissipation fan 3 and the radiator 4 can be that the heat dissipation fan 3 is close to or fitted to one side of the heat dissipation fins, so that when the heat dissipation fan 3 rotates, the airflow between the heat dissipation fins can be updated, thereby achieving the purpose of forced air cooling and heat dissipation of the radiator 4.

[0058] In some specific embodiments, as shown in Figures 3 and 4, the fan mounting position can be specifically configured as a mounting slot, and the heat dissipation fan 3 is inserted and fixed in the mounting slot, and the fixing method of the heat dissipation fan 3 after insertion can include at least one of the following methods: snap-fitting fixation, fastener fixation, etc. Of course, it can be understood that this plug-in matching method is only an example of the detachable connection structure of the fan installation between the heat dissipation fans 3 in the embodiment of the present application. In actual application, it can also be designed into other structural forms, such as directly designing a snap-fit ​​connection structure, or directly using a fastener connection structure, etc. By designing the above-mentioned fan mounting position, it is more convenient to install the heat dissipation fan 3 to the module bracket 1.

[0059] It should be noted that the adaptive connection method between the above-mentioned first electrical connection part 31 and the third electrical connection part 14 can be configured as a plug-in connection. Specifically, one of the first electrical connection part 33 and the third electrical connection part 14 is configured as a male plug-in terminal, and the other is a female plug-in terminal, and the male plug-in terminal and the female plug-in terminal are plugged together to realize electrical connection. By designing the above-mentioned plug-in connection method, the electrical connection between the first electrical connection part 31 and the third electrical connection part 14 is more stable and reliable. It should be noted that the plug-in terminals corresponding to the above-mentioned first electrical connection part 31 and the third electrical connection part 14 can be designed as, but not limited to, a board-mounted structure, that is, a PCB is used instead of a wire to fix the terminal and connect the current; of course, it can also be designed as a separate plug-in terminal, but when it is designed as a separate plug-in terminal, it is necessary to consider the fixation of the plug-in terminal. In actual application, the configuration can be selected according to actual needs. It should also be noted that the connection method between the first electrical connection part 31 and the third electrical connection part 14 can also be configured as abutment connection or elastic overlap (such as spring overlap) combined with other methods such as a fixed structure, as long as the electrical connection between the two can be achieved. In actual application, the configuration can be selected according to actual needs, and no more specific restrictions are made here.

[0060] In addition, this application also provides a heat dissipation structure, referring to Figures 5-7 in conjunction with Figures 1-4 , which specifically may include a device housing 2, a radiator 4 mounted on the device housing 2, and a fan module, wherein the fan module is the fan module described in any of the above-mentioned solutions. Since the aforementioned fan module has the aforementioned technical effects, the heat dissipation structure having this fan module should also have corresponding technical effects, which will not be further described here.

[0061] In some specific embodiments, referring to Figures 5-7, in combination with Figures 1-4, the module bracket 1 of the above-mentioned fan module is detachably arranged on the outside of the device casing 2 (such as on the outer shell wall), and the outside of the device casing 2 is provided with a fourth electrical connection portion 21 connected to the control circuit in the device casing 2. When the module bracket 1 is installed on the outside of the device casing 2 (such as on the outer shell wall), the second electrical connection portion 13 on the module bracket 1 and the fourth electrical connection portion 21 are just adapted and connected, and at the same time, the cooling fan 3 and the radiator 4 on the fan module are in place. By designing the heat dissipation structure into the above-mentioned structural form, it is more convenient to install the fan module to the device casing 2, eliminating the operation of additional wiring of the fan module and the control circuit in the device casing 2, and greatly improving the convenience of disassembly and assembly of the heat dissipation structure.

[0062] It should be noted that those skilled in the art should be able to understand the basic structure and working principle of the power electronic device: Referring to Figure 5, the power electronic device includes a device casing 2, and electronic devices such as a circuit board 25 are installed inside the device casing 2, and the heat dissipation substrate of the radiator 4 is mainly used to dissipate heat from the relevant electronic devices in the device casing 2. Therefore, a corresponding opening should be opened on the device casing 2, and the heat dissipation substrate is located in the opening. One side of the heat dissipation substrate will be located on the inner side of the device casing 2, and the other side will be located on the outer side of the device casing 2. The side of the heat dissipation substrate located on the outer side of the device casing 2 is cooled by a heat dissipation fan. It should also be noted that a fourth electrical connection portion 21 connected to the control circuit (such as the circuit board 25) in the device casing 2 can be provided on the outer side of the device casing 2 (such as the outer shell wall), and when the module bracket 1 is installed on the outer side of the device casing 2 (such as the outer shell wall), the second electrical connection portion 13 is adapted to be connected to the fourth electrical connection portion 21, and the heat dissipation fan 3 and the radiator 4 are in place.

[0063] In a further embodiment, the heat dissipation structure may further include a fixing component 5, wherein the module bracket 1 is slidably connected to the outside of the device casing 2 (such as the outer shell wall) in a detachable manner, and the fixing component 5 is used to lock the module bracket 1 that has slid to a preset assembly position on the outer shell wall of the device casing 2; wherein, when the module bracket 1 slides to the preset assembly position, the second electrical connection portion 13 and the fourth electrical connection portion 21 are just adapted and connected, and the cooling fan 3 and the radiator 4 are in place. By designing the structure in which the fixing component 5 is locked, it is only necessary to loosen the fixing component 5 during disassembly, and then remove the module bracket 1 and the cooling fan 3 installed thereon by sliding the module bracket 1; when installation is required, the module bracket 1 equipped with the cooling fan 3 is slid relative to the device casing 2 to a preset mating position, and then locked by the fixing component 5, making the assembly and disassembly of the module bracket 1 more convenient. It should be noted that the above-mentioned fixing component 5 can specifically adopt locking fasteners, such as bolts or nuts that can be manually twisted, or can be designed as a fixing method such as a snap, and the fixed position of the module bracket 1 can be selected to be fixed on the outer wall of the device casing 2, or can be designed on the radiator 4, or on other components that are fixed relative to the outer wall of the device casing 2, such as the heat dissipation shell cover 23 mentioned below. In actual application, the arrangement can be selected according to actual needs, and no more specific restrictions are made here. In addition, it should be noted that the detachable connection between the above-mentioned module bracket 1 and the device casing 2 can be configured as a sliding connection method, and can also be designed as other movable connection structures. As long as it can be detachable, no more specific restrictions are made here.

[0064] In a further embodiment, referring to Figures 5-7, a guide slide 22 can be provided on the outside of the device casing 2 (for example, on the outer shell wall), and the module bracket 1 slides with the guide slide 22 and can slide out from the guide slide 22. By designing the structural form of the above-mentioned guide slide 22, the sliding fit of the module bracket 1 relative to the device casing 2 is more stable and reliable, the installation and positioning are more accurate and convenient, and the module bracket 1 is more convenient to remove from the device casing 2. It should be noted that the guide slide 22 and the outer shell wall of the device casing 2 can be designed as an integral structure, or can be designed as a split fixed connection structure, such as a fastener connection. It can also be understood that the structural form of the above-mentioned guide slide 22 is only an example of the sliding connection structure in the embodiment of the present application. In actual application, it can also be designed as other guide structures to achieve sliding. For example, a slide rail can be provided on the outer shell wall of the above-mentioned device casing 2, and a sliding part can be provided on the module bracket 1. The sliding part and the slide rail constitute a pair of sliding pairs and other sliding connection structures. No more specific limitations are given here.

[0065] In a further embodiment, referring to FIG3 in conjunction with FIG5-7, the module bracket 1 has a first end side and a second end side arranged opposite to each other in the extension direction of the guide slide 22, wherein one of the first end side and the second end side is configured as a sliding end side 11, and the other is configured as a non-sliding end side 12. To ensure foolproof assembly between the module bracket 1 and the device housing 2, the module bracket 1 can be designed to slide into the guide slide 22 only through the sliding end side 11. By designing this structural form, it is possible to prevent the module bracket 1 from being installed upside down.

[0066] In a further embodiment, the foolproof structure assembled between the module support 1 and the guide slide 22 can be asymmetrically arranged with the sliding structures formed on both sides of the module support 1 and the guide slide 22. For example, the sliding cooperation structure between the module support 1 and the first side of the guide slide 22 and the sliding cooperation structure between the module support 1 and the second side of the guide slide 22 can be designed to have different heights.

[0067] In some specific implementation schemes, the sliding direction of the module bracket 1 relative to the guide slide 22 and the axial direction of the air outlet surface of the cooling fan 3 can be designed to be the same; or they can be designed to be in different directions, that is, the sliding direction of the module bracket 1 relative to the guide slide 22 and the axial direction of the air outlet surface of the cooling fan 3 are arranged at an angle. For example, referring to Figures 3 and 4, combined with Figures 5-7, they are arranged at a 90° angle. In actual application, the configuration can be selected according to specific needs, and no further specific restrictions are made here.

[0068] In some other specific embodiments, referring to Figures 5 to 7, the heat dissipation structure may further include a heat dissipation cover 23 provided on the outside of the device housing 2 (e.g., on the outer wall of the housing). When the module bracket 1 is in the preset assembly position, the heat dissipation cover 23 can cover the radiator 4 and the module bracket 1. The heat dissipation cover 23 is provided with an air inlet opening 230 adapted to the air inlet side of the cooling fan 3. Of course, it is understandable that the heat dissipation cover 23 should also be provided with an air outlet opening. By designing the heat dissipation cover 23, on the one hand, it can provide a certain degree of protection for the radiator 4 and the cooling fan 3. On the other hand, the heat dissipation cover 23 can guide the airflow, which is more conducive to the orderly circulation of the airflow and helps to improve the uniformity of the cooling and heat dissipation of the radiator 4 by the cooling fan 32.

[0069] In some specific embodiments, referring to Figures 5-7 , the heat sink housing 23, the radiator 4, and the outer wall of the device housing 2 enclose a space for housing the module support 1. Furthermore, the heat sink housing 23 is provided with a first process opening 231 for disassembling and assembling the module support 1. This structural design allows for disassembly and assembly of the module support 1 through the first process opening 231, allowing the module support 1 to be removed without removing the heat sink housing 23, making disassembly and assembly more convenient.

[0070] In a further embodiment, referring to Figures 3 and 4, in combination with Figures 5 to 7, a push-pull handle 6 can be provided on the non-sliding end side of the above-mentioned module bracket 1, and a limiting end face that matches the outer edge of the first process opening 231 is formed on the side where the push-pull handle 6 is connected to the module bracket 1. By designing the above-mentioned structural form, the push-pull handle 6 not only has the purpose of facilitating disassembly and assembly operations, but also can play a certain limiting role in the sliding position of the module assembly 1, making it more convenient to determine the locking position of the module bracket 1. Specifically, the above-mentioned fixing assembly 5 can be designed to connect and fix the outer edge of the first process opening 231 and the limiting end face. For example, the outer edge of the first process opening 231 and the limiting end face can be connected by fasteners.

[0071] In some other specific implementation schemes, the above-mentioned heat dissipation structure may also include a fan mesh cover 7 arranged on the air inlet side of the heat dissipation fan 3; by designing the fan mesh cover 7, it can play a role in removing dust and preventing debris from entering the heat dissipation air duct in the heat dissipation fan 3, thereby reducing the risk of blockage of the heat dissipation air duct.

[0072] Among them, the fan mesh cover 7 can be specifically arranged on the heat dissipation shell 23 at the position corresponding to the air inlet opening 230. Its specific arrangement can be designed as a structural form integrally formed with the heat dissipation shell 23, or a structure fixedly connected to the heat dissipation shell 23 in a split manner, such as being fixed to the heat dissipation shell 23 by fasteners. Of course, it is understandable that the above-mentioned fan mesh cover 7 can also be arranged on the module bracket 1 on the air inlet side corresponding to the heat dissipation fan 3, or the fan mesh cover 7 can be arranged on the heat dissipation fan 3 and located on the air inlet side of the heat dissipation fan 3. In actual application, the arrangement can be selected according to actual needs, and no more specific restrictions are made here. In addition, the fan mesh cover 7 is preferably designed as an independent structure and is connected and fixed to the corresponding position in a split connection manner. Such a structure makes it more convenient to disassemble and clean the fan mesh cover 7.

[0073] It should be noted that the connection method between the above-mentioned second electrical connection part 13 and the fourth electrical connection part 21 can be configured as a plug-in connection method. For example, the second electrical connection part 13 and the fourth electrical connection part 21 are designed as a male and female plug-in terminal structure, or can be designed as a butt connection, or elastic overlap (spring clip overlap as shown in Figure 8), etc. In actual application, the arrangement can be selected according to actual needs.

[0074] In a further embodiment, in order to prevent the electrical performance of the second electrical connection part 13 and the fourth electrical connection part 21 from being affected by the external environment after the connection is made, a first sealing ring can be provided on the second electrical connection part 13 and / or the fourth electrical connection part 21 to achieve joint sealing after the second electrical connection part 13 and the fourth electrical connection part 21 are connected, thereby better ensuring the electrical connection performance.

[0075] In other specific embodiments, as shown in FIG8 , the device housing 2 is generally provided with a second process opening 24 for the fourth electrical connection portion 21 to pass through. The fourth electrical connection portion 21 and the second process opening 24 are sealed together by a second sealing ring 8. The design of the second sealing ring 8 can seal and isolate the control circuit (e.g., circuit board 25) within the device housing 2 from the outside of the device housing 2, effectively preventing the adverse external environment from affecting the internal electronic components of the device housing 2.

[0076] In addition, this application also provides a power electronic device including a heat dissipation structure, wherein the heat dissipation structure includes at least one set of heat dissipation structures described in any of the above solutions. Since the above heat dissipation structure has the above technical effects, the power electronic device having the heat dissipation structure should also have the corresponding technical effects.

[0077] The power electronic device may specifically be, but is not limited to, a power conversion device such as an inverter, and its application scenario may be a power station, such as the power electronic device required to be equipped in a photovoltaic power station.

[0078] It should be noted that the various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the various embodiments can be referenced to each other.

[0079] As used in this application and the claims, unless the context clearly indicates an exception, the terms "a," "an," "an," and / or "the" are not intended to refer to the singular and may include the plural, unless the context clearly indicates otherwise. Generally speaking, the terms "comprises" and "include" only indicate the inclusion of the steps and elements specifically identified, and these steps and elements do not constitute an exclusive list. A method or apparatus may also include other steps or elements. The phrase "comprises a..." does not preclude the presence of additional identical elements in the process, method, product, or apparatus that includes the elements.

[0080] In the description of the embodiments of this application, unless otherwise specified, " / " represents or. For example, A / B can represent A or B. "And / or" in this article is simply a description of the association relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, in the description of the embodiments of this application, "plurality" means two or more than two.

[0081] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, features defined as "first" or "second" may explicitly or implicitly include one or more of the features.

[0082] This document uses specific examples to illustrate the principles and implementation methods of this application. The description of the above examples is only intended to help understand the core ideas of this application. It should be noted that for those skilled in the art, without departing from the principles of this application, various improvements and modifications can be made to this application, and such improvements and modifications also fall within the scope of protection of the claims of this application.

Claims

1. A fan module, characterized in that: The invention comprises a module support (1) and a plurality of cooling fans (3) detachably arranged on the module support (1), wherein the cooling fans (3) have a first electrical connection portion (31), and the first electrical connection portion (31) is electrically connected to the cooling fans (3) via a flexible cable (30); The module bracket (1) is detachably arranged on the outside of the device housing (2), and the module bracket (1) is provided with a second electrical connection portion (13) and a third electrical connection portion (14) electrically connected to the second electrical connection portion (13), the second electrical connection portion (13) being used to be electrically connected to a control circuit in the device housing (2), and the third electrical connection portion (14) being used to be adapted and connected to the first electrical connection portion (31) in a one-to-one correspondence manner; Wherein, a plurality of fan mounting positions are arranged on the module bracket (1), the cooling fan (3) is installed on the fan mounting position, each of the fan mounting positions is provided with the third electrical connection part (14), and at least two of the third electrical connection parts (14) are connected to the second electrical connection part (13) via a converging component (15).

2. The fan module according to claim 1, characterized in that: The fan installation position is configured as a mounting slot, and the heat dissipation fan (3) is inserted and fixed in the mounting slot.

3. The fan module according to claim 2, characterized in that: The fixing method of the cooling fan (3) after insertion includes snap-fit ​​fixing and / or fastener fixing.

4. The fan module according to claim 1, characterized in that: The adaptable connection mode between the first electrical connection part (31) and the third electrical connection part (14) is configured as a plug-in connection, abutment connection or an elastic overlap fitting fixing structure.

5. A heat dissipation structure, comprising a device housing (2) and a radiator (4) and a fan module installed on the device housing (2), characterized in that: The fan module is the fan module according to any one of claims 1 to 4.

6. The heat dissipation structure according to claim 5, characterized in that: The module bracket (1) of the fan module is detachably arranged on the outside of the device casing (2), and a fourth electrical connection part (21) connected to the control circuit in the device casing (2) is arranged on the outside of the device casing (2). When the module bracket (1) is installed on the outside of the device casing (2), the second electrical connection part (13) on the module bracket (1) and the fourth electrical connection part (21) are just adapted and connected, and at the same time, the cooling fan (3) and the radiator (4) are in place.

7. The heat dissipation structure according to claim 6, characterized in that: The module bracket (1) is configured as a sliding connection in a detachable manner on the outside of the device casing (2). When the module bracket (1) slides to a preset assembly position, the second electrical connection part (13) and the fourth electrical connection part (21) are just adapted to be connected, and the cooling fan (3) and the radiator (4) are fitted into place.

8. The heat dissipation structure according to claim 7, characterized in that: A guide slide (22) is provided on the outer side of the equipment housing (2), and the module bracket (1) is slidably matched with the guide slide (22) and can slide out from the guide slide (22).

9. The heat dissipation structure according to claim 8, characterized in that: The module bracket (1) has a first end side and a second end side which are arranged opposite to each other in the extension direction of the guide slide (22), wherein one of the first end side and the second end side is configured as a sliding-in end side (11) and the other is configured as a non-sliding-in end side (12), and the module bracket (1) can only slide into the guide slide (22) through the sliding-in end side (11).

10. The heat dissipation structure according to claim 9, characterized in that: The sliding structure formed by the module bracket (1) and the two sides of the guide slideway (22) is arranged asymmetrically.

11. The heat dissipation structure according to claim 8, characterized in that: The guide slideway (22) and the outer shell wall of the equipment casing (2) are an integrated structure or a split fixed connection structure.

12. The heat dissipation structure according to claim 8, characterized in that: The sliding direction of the module bracket (1) relative to the guide slideway (22) is the same as the axial direction of the air outlet surface of the cooling fan (3); Alternatively, the sliding direction of the module bracket (1) relative to the guide slideway (22) is arranged at an angle to the axial direction of the air outlet surface of the cooling fan (3).

13. The heat dissipation structure according to claim 7, characterized in that: It also includes a heat dissipation shell (23) arranged on the outside of the device casing (2); when the module bracket (1) is in a preset assembly position, the heat dissipation shell (23) can cover the radiator (4) and the module bracket (1); and the heat dissipation shell (23) is provided with an air inlet opening (230) adapted to the air inlet side of the heat dissipation fan (3).

14. The heat dissipation structure according to claim 13, characterized in that: The heat dissipation shell cover (23), the heat sink (4) and the outer shell wall of the equipment housing (2) are arranged to form a placement space for the module bracket (1), and the heat dissipation shell cover (23) is provided with a first process opening (231) for disassembling and assembling the module bracket (1).

15. The heat dissipation structure according to claim 14, characterized in that: A push-pull handle (6) is provided on the non-sliding end side of the module bracket (1), and a limiting end surface adapted to the outer edge of the first process opening (231) is formed on one side of the push-pull handle (6) connected to the module bracket (1).

16. The heat dissipation structure according to claim 15, characterized in that: It also includes a fixing component (5), which is used to connect and fix the outer edge of the first process opening (231) and the limiting end surface to lock the module bracket (1) that slides to a preset assembly position on the outside of the equipment housing (2).

17. The heat dissipation structure according to claim 13, characterized in that: It also includes a fan grille (7) arranged on the air inlet side of the heat dissipation fan (3); The fan grille (7) is arranged on the heat dissipation housing (23) and corresponds to the air inlet opening. At the mouth (230); And / or, the fan grille (7) is arranged on the module bracket (1) corresponding to the air inlet side of the cooling fan (3); And / or, the fan grille (7) is arranged on the cooling fan (3) and is located on the air inlet side of the cooling fan (3).

18. The heat dissipation structure according to claim 6, characterized in that: The connection mode between the second electrical connection portion (13) and the fourth electrical connection portion (21) is configured as a plug-in connection, an abutment connection or an elastic overlap connection.

19. A power electronic device, comprising a heat dissipation structure, characterized in that: The heat dissipation structure comprises at least one group of heat dissipation structures as described in any one of claims 5-18.

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