Electronic device

Abstract

Provided in the present application is an electronic device, relating to the technical field of electronic devices; the electronic device is thinner, and has a centrally disposed outer end opening of a sound pickup channel. The electronic device comprises a screen, a middle frame, a sound pickup channel, and a microphone. The screen comprises a display surface. The middle frame and the sound pickup channel are both disposed on the side of the screen facing away from the display surface. The sound pickup channel comprises a first channel section and a second channel section. A first end of the first channel section is located on an outer side surface of the middle frame; the first channel section extends, from the first end to a second end of the first channel section, towards the center of the middle frame; and, along the direction perpendicular to the screen, the second end is closer to the screen compared with the first end. A third end of the second channel section is connected to the second end; the second channel section extends, from the third end to a fourth end of the second channel section, in the direction away from the screen; and the fourth end penetrates the surface of the middle frame facing away from the screen. The microphone is located on the side of the middle frame facing away from the screen, the microphone having a sound pickup hole, and the sound pickup hole being in communication with the fourth end.

Description

An electronic device

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on October 30, 2023, with application number 202311428260.4 and invention name “An Electronic Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the technical field of electronic equipment, and in particular to an electronic device with a sound pickup function. Background Art

[0003] Currently, a microphone (MIC) is usually installed in the shell of electronic devices such as mobile phones and tablets. The shell is provided with a sound pickup channel connecting the inside and outside of the shell. The sound pickup hole of the MIC is connected to the sound pickup channel, so that sound signals from the external environment can enter the MIC through the sound pickup channel to achieve sound pickup.

[0004] To improve the feel and appearance of electronic devices, they are becoming increasingly thinner. Furthermore, the opening of the sound pickup channel, which connects to the exterior of the housing, is typically located on the outer side of the housing. This opening is required to be centered along the thickness of the electronic device. However, existing technologies often fail to simultaneously meet these two requirements.

[0005] Summary of the Invention

[0006] The present application provides an electronic device, which can make the outer end opening of a sound pickup channel centered along the thickness direction of the electronic device while reducing the thickness of the electronic device.

[0007] To achieve the above objectives, the present application provides an electronic device, which includes a screen, a middle frame, a sound pickup channel and a microphone.

[0008] The screen includes a display surface, and the middle frame and the sound pickup channel are both arranged on the side of the screen facing away from the display surface.

[0009] The sound pickup channel includes a first channel section and a second channel section. The first channel section has a first end and a second end. The first end is located on the outer side of the middle frame. From the first end to the second end, the first channel section extends toward the center of the middle frame, perpendicular to the screen. The second end is closer to the screen than the first end. The second channel section has a third end and a fourth end. The third end connects to the second end. From the third end to the fourth end, the second channel section extends away from the screen. The fourth end extends through the surface of the middle frame facing away from the screen.

[0010] The microphone is located on a side of the middle frame facing away from the screen. The microphone has a sound pickup hole that is connected to the fourth end.

[0011] In this way, sound signals outside the electronic device can enter the microphone via the sound pickup channel and be picked up by the microphone. Because the second end is closer to the screen than the first end, and the third end of the second channel section is connected to the second end, while ensuring that the outer end opening of the sound pickup channel is centered along the thickness direction of the electronic device on the outer side surface, the second channel section can be brought closer to the screen. Under the premise that the length of the second channel section along the thickness direction of the electronic device is constant, the thickness of the middle frame can be reduced, thereby facilitating the thinning of the electronic device. In this way, the thinning of the electronic device can be achieved while the outer end opening is centered.

[0012] Optionally, the middle frame may be a metal middle frame. The metal middle frame may be made of materials including, but not limited to, stainless steel, aluminum alloy, magnesium alloy, and titanium alloy. Metal materials are relatively hard, and can ensure the structural strength of the middle frame and the electronic device, thereby preventing deformation, even when the middle frame is thinned.

[0013] Optionally, the first channel segment extends closer to the screen from the first end to the second end. This shortens the first channel segment, increasing the microphone's peak frequency, broadening its operating frequency band, and enhancing its high-frequency performance. Furthermore, the first channel segment has a simpler structure and is easier to manufacture.

[0014] Optionally, the first channel section includes a first linear channel section and a second linear channel section. The first linear channel section extends from the outer side of the middle frame toward the middle portion of the middle frame and is inclined toward the screen. The second linear channel section is connected between the end of the first linear channel section facing the screen and the third end. The second linear channel section is parallel to the screen; alternatively, from the first linear channel section to the second linear channel section, the second linear channel section is inclined toward the screen, and the inclination angle of the second linear channel section relative to the screen is smaller than the inclination angle of the first linear channel section relative to the screen. In this way, from the first end to the second end, the first channel section arches away from the corner position of the surface of the middle plate facing away from the screen, thereby increasing the distance between the first channel section and the corner position, thereby ensuring the molding yield of the first channel section without increasing the thickness of the middle frame. This facilitates the thinning of the middle frame and even the electronic device, while ensuring the storage capacity of the cavity.

[0015] Optionally, the first straight channel section, the second straight channel section and the second channel section are all arranged in the middle frame. This structure is simple and the layout is reasonable.

[0016] Based on the above, optionally, the middle frame includes a middle plate and a frame disposed at the edge of the middle plate, with the surface of the frame facing away from the middle plate forming the aforementioned outer side surface. In a direction perpendicular to the screen, the distance from the surface of the frame facing away from the screen to the screen is greater than the distance from the surface of the middle plate facing away from the screen to the screen. The first linear channel segment is disposed in the frame, and at least a portion of the second linear channel segment and the second channel segment are disposed in the middle plate. Specifically, a portion of the second linear channel segment is disposed within the middle plate, while the remaining portion is located within the frame. This layout is rational and simple to implement.

[0017] Optionally, a first linear channel segment is disposed within the middle frame, with the end of the first linear channel segment facing the screen extending through the screen-facing surface of the middle frame. A second channel segment is disposed within the middle frame, with the third end of the second channel segment extending through the screen-facing surface of the middle frame. The electronic device further includes a sealing ring disposed between the screen and the middle frame, with the area surrounded by the sealing ring forming the second linear channel segment. In this manner, while maintaining a constant length of the second channel segment along the thickness direction of the electronic device, the thickness of the middle frame can be further reduced, thereby facilitating a thinner electronic device.

[0018] Optionally, the first channel segment includes a first straight channel segment, a second straight channel segment, and a third straight channel segment. The first straight channel segment extends from the outer side of the middle frame toward the middle of the middle frame. The third straight channel segment extends from one end of the first straight channel segment facing the middle of the middle frame toward the screen. The second straight channel segment extends from one end of the third straight channel segment facing the screen toward the middle of the middle frame. In this way, from the first end to the second end, the first channel segment approaches the screen in a step-like manner. It is also possible to increase the distance between the first channel segment and the above-mentioned corner position while ensuring that the thickness of the middle plate remains unchanged, thereby ensuring the molding yield of the first channel segment.

[0019] Optionally, the first straight channel section, the second straight channel section, the third straight channel section and the second channel section are all arranged in the middle frame. This structure is simple and the layout is reasonable.

[0020] Optionally, the first and third linear channel segments are disposed within the middle frame, with the screen-facing end of the third linear channel segment extending through the screen-facing surface of the middle frame. The second channel segment is disposed within the middle frame, with the third end of the second channel segment extending through the screen-facing surface of the middle frame. The electronic device further includes a sealing ring disposed between the screen and the middle frame, with the area surrounded by the sealing ring forming the second linear channel segment. In this manner, while maintaining a constant length of the second channel segment along the thickness direction of the electronic device, the thickness of the middle frame can be further reduced, thereby facilitating a thinner electronic device.

[0021] Optionally, the second linear channel segment extends through the surface of the middle frame facing the screen to form an opening, and the screen covers the opening. In this way, the screen forms the sidewall of the second linear channel segment. While ensuring the height of the second linear channel segment along the thickness direction of the electronic device and the distance from the first channel segment to the aforementioned corner position, the thickness of the middle plate can be further reduced, thereby facilitating a thinner middle frame and, consequently, the electronic device.

[0022] Optionally, a sealing ring is provided between the screen and the middle frame, and the sealing ring is arranged around the opening. In this way, the airtightness of the second linear channel section can be ensured by means of the sealing ring.

[0023] Optionally, both the first and second channel segments are disposed within the middle frame. The first channel segment extends in a straight line and, from the first end to the second end, is inclined toward the screen. This allows the first channel segment to continuously approach the screen from the first end to the second end, resulting in a simple shape for the sound pickup channel and ease of fabrication. Furthermore, keeping the first channel segment as short as possible increases the microphone's peak frequency, broadens its operating frequency band, and enhances its high-frequency performance.

[0024] Optionally, the electronic device further includes a circuit board, which is located on a side of the middle frame facing away from the screen. The circuit board is provided with a first through hole, which is opposite to and connected to the fourth end. The microphone is provided on the circuit board, and the sound pickup hole of the microphone is connected to the first through hole. In this way, with the help of the circuit board, the microphone can be conveniently electrically connected to other electronic components such as a controller and a memory. Based on this, a first through hole is provided on the circuit board, and the first through hole is opposite to and connected to the fourth end, and the sound pickup hole is connected to the first through hole. This layout is reasonable and can improve the compactness of the layout of electronic components in the electronic device.

[0025] Optionally, a dust screen is provided between the middle frame and the circuit board. The dust screen includes a mesh body, at least a portion of which is located between the fourth end and the first through hole. Thus, the dust screen can prevent foreign matter from outside the electronic device from entering the microphone along the sound pickup channel, thereby ensuring microphone performance and extending its service life.

[0026] Optionally, the mesh body includes a middle portion and an edge portion surrounding the middle portion, and the middle portion is located between the fourth end and the first through hole. The dustproof net also includes a first sealing adhesive layer, a second sealing adhesive layer and an elastic sealing layer. The first sealing adhesive layer is bonded between the edge portion and the middle frame. The second sealing adhesive layer is bonded between the edge portion and the elastic sealing layer. The elastic sealing layer is located between the second sealing adhesive layer and the circuit board. Based on this, the circuit board can be fixedly connected to the middle frame with the help of connectors such as screws to squeeze the elastic sealing layer and put the elastic sealing layer in a compressed state to achieve sealing and ensure airtightness at the dustproof net.

[0027] Optionally, the circuit board further comprises a second through-hole spaced apart from the first through-hole; the microphone and the second channel section are located on the same side of the circuit board, and the microphone's sound pickup hole is opposite and connected to the second through-hole. The electronic device further comprises a sealing cover located on a side of the circuit board facing away from the microphone and the second channel section. The sealing cover and the circuit board enclose an airflow cavity, which is connected to both the first through-hole and the second through-hole. In this manner, the first through-hole, the airflow cavity, and the second through-hole form a U-shaped channel connecting the sound pickup channel and the sound pickup hole. Sound signals external to the electronic device can be transmitted to the microphone via the sound pickup channel and the U-shaped channel, and further converted into electrical signals by the microphone. Furthermore, the height of the sealing cover can be less than the height of the microphone in a direction perpendicular to the circuit board, thereby reducing the overall stacking thickness of the device and achieving a thinner electronic device. Furthermore, since the microphone and the second channel section are located on the same side of the circuit board, and the second channel section is disposed on the middle plate, and the back cover and the middle plate are located on opposite sides of the circuit board, the microphone and back cover are located on opposite sides of the circuit board. In this way, the microphone can be protected by the circuit board to prevent the microphone from being damaged by external force from the back cover, thereby eliminating the need to provide a special protective cover for the microphone.

[0028] Optionally, a relief groove is provided on the surface of the middle frame facing away from the screen, and the microphone is accommodated in the relief groove. This relief groove allows the circuit board to be closer to the middle frame, preventing the microphone from overlapping the middle frame, thereby reducing the thickness of the electronic device and improving its portability and usability.

[0029] Optionally, the cross-sectional area of ​​the first through-hole is larger than that of the second through-hole. This allows the sound signal, after entering the accommodating cavity through the sound pickup channel, to smoothly pass through the first through-hole into the airflow cavity and then into the sound pickup hole through the second through-hole. Because the cross-sectional area of ​​the sound pickup hole is smaller, the cross-sectional area of ​​the second through-hole opposite the sound pickup hole is also smaller. This increases the contact area between the circuit board and the microphone substrate, ensuring support stability. This layout is rational and provides excellent performance.

[0030] Optionally, the height of the sealing cover is less than the height of the microphone in a direction perpendicular to the circuit board. This reduces the stacking height of the electronic components on the side of the mid-board facing away from the screen, which helps reduce the overall stacking thickness of the device, achieving a thinner electronic device and improving portability and user experience.

[0031] Optionally, the sealing cover is made of metal. Specifically, the metal includes, but is not limited to, iron, iron alloys, copper, copper alloys, aluminum, or aluminum alloys. Metals are relatively hard, and while ensuring the structural strength of the sealing cover, the wall thickness of the sealing cover can be reduced, thereby increasing the height of the airflow chamber while reducing the height of the sealing cover.

[0032] Optionally, the sealing cover includes a top plate, side plates, and an annular bottom plate. The side plates are arranged around the edge of the top plate, and the annular bottom plate is connected to the end of the side plates away from the top plate. The annular bottom plate is also connected to the circuit board. In this way, the sealing cover has a roughly cylindrical shell-like structure, which is simple. Moreover, provided that the height of the sealing cover along the thickness direction of the electronic device is constant, a larger space can be formed inside. When used in an electronic device, the volume of the airflow cavity is guaranteed, thereby increasing the peak frequency of the microphone.

[0033] Optionally, the annular bottom plate includes an inner edge, and one end of the side plate away from the top plate is located in the area surrounded by the annular bottom plate and connected to the inner edge. The sealing cover has a simple structure and can be stamped, which is conducive to simplifying the molding difficulty.

[0034] Optionally, an annular connection pad is provided on the circuit board, and the annular base plate is welded to the annular connection pad. In this way, the sealing cover and the circuit board are fixedly connected by welding, the connection is more stable, and the circumference of the annular base plate and the circumference of the annular connection pad can be welded, which can achieve a certain degree of sealing.

[0035] Optionally, the annular bottom plate further includes an outer edge, and a sealant is provided on a side of the outer edge away from the inner edge, and the sealant is bonded to both the outer edge and the circuit board.

[0036] Optionally, the side panel includes a first curved side panel, a second curved side panel, a first transition panel, and a second transition panel. The first curved side panel is located on a side of the first through hole away from the second through hole and extends along the circumference of the first through hole. The second curved side panel is located on a side of the second through hole away from the first through hole and extends along the circumference of the second through hole. The radius of the curved inner wall surface of the first curved side panel is greater than the radius of the curved inner wall surface of the second curved side panel. The two ends of the first curved side panel along the circumference of the first through hole are respectively a first end and a second end. The two ends of the second curved side panel along the circumference of the second through hole are respectively a third end and a fourth end. The first transition panel is connected between the first end and the third end, and the second transition panel is connected between the second end and the fourth end. In this way, the shape of the sealing cover is roughly spindle-shaped, the internal space at one end of the spindle-shaped structure is larger, and the internal space at the other end is smaller. The end with the larger internal space is connected to the first through hole with a larger diameter, and the end with the smaller internal space is connected to the second through hole with a smaller diameter. This layout is reasonable and can reduce the volume of the sealing cover while helping to increase the peak frequency of the microphone.

[0037] Optionally, both the first transition plate and the second transition plate are flat plates, with the first transition plate being tangent to the first end of the first curved side plate and the third end of the second curved side plate, and the second transition plate being tangent to the second end of the first curved side plate and the fourth end of the second curved side plate. This simplifies the structure of the side plates, facilitates processing, and helps reduce costs. Furthermore, the internal airflow cavity has a smooth transition at all circumferential positions, which can reduce noise.

[0038] Optionally, the first through hole and the second through hole are both circular holes. The center line of the circle corresponding to the first arc-shaped side panel is collinear with the center line of the circle of the first through hole, and the center line of the circle corresponding to the second arc-shaped side panel is collinear with the center line of the circle of the second through hole. Along the radial direction of the first through hole, the distance between the arc-shaped inner wall surface of the first arc-shaped side panel and the inner wall surface of the first through hole is a first distance; along the radial direction of the second through hole, the distance between the arc-shaped inner wall surface of the second arc-shaped side panel and the inner wall surface of the second through hole is a second distance; the second distance is equal to the first distance. In this way, the layout is reasonable and can minimize the board area occupied by the sealing cover on the circuit board, so as to reduce the volume of the airflow cavity in the sealing cover, thereby facilitating the improvement of the peak frequency of the microphone.

[0039] Optionally, the electronic device is a foldable screen device. In this way, while ensuring that the outer end opening of the sound pickup channel is centrally located, the thickness of the foldable screen device can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] FIG1 is a perspective view of an electronic device in an unfolded state provided by some embodiments of the present application;

[0041] FIG2 is a front view of the electronic device shown in FIG1 in a folded state;

[0042] FIG3 is a schematic diagram of a cross-sectional structure of the electronic device shown in FIG1 along line AA;

[0043] FIG4 is a schematic diagram of a cross-sectional structure of an electronic device provided in yet other embodiments of the present application;

[0044] FIG5 is a schematic diagram of a cross-sectional structure of an electronic device provided in yet other embodiments of the present application;

[0045] FIG6 is a top view of the middle frame shown in FIG5 ;

[0046] FIG7 is a schematic diagram of a cross-sectional structure of an electronic device provided in some other embodiments of the present application;

[0047] FIG8 is a schematic diagram of a cross-sectional structure of an electronic device provided in yet other embodiments of the present application;

[0048] FIG9 is a schematic diagram of a cross-sectional structure of an electronic device provided in yet other embodiments of the present application;

[0049] FIG10 is a schematic diagram of a cross-sectional structure of an electronic device provided in yet other embodiments of the present application;

[0050] FIG11 is a schematic diagram of a cross-sectional structure of an electronic device provided in yet other embodiments of the present application;

[0051] FIG12 is a schematic cross-sectional view of a MIC in an electronic device according to some embodiments of the present application;

[0052] FIG13 is a schematic diagram of a cross-sectional structure of an electronic device provided in yet other embodiments of the present application;

[0053] FIG14 is a partial enlarged view of area I in the electronic device shown in FIG13;

[0054] FIG15 is a schematic diagram of a cross-sectional structure of an electronic device provided in yet other embodiments of the present application;

[0055] FIG16 is a schematic cross-sectional view of the sealing cover of the electronic device shown in FIG15 ;

[0056] FIG17 is a bottom view of the circuit board in the electronic device shown in FIG15 ;

[0057] FIG18 is a schematic cross-sectional view of the connection structure between the sealing cover and the circuit board in the electronic device shown in FIG15 ;

[0058] FIG19 is a top view of the sealing cover inside the electronic device shown in FIG15 .

[0059] Reference numerals:

[0060] 100. Electronic equipment;

[0061] 10. Screen; S0. Display surface; 20. Housing; 201. First housing; 202. Second housing; 203. Rotating shaft mechanism;

[0062] A, middle frame; A1, middle plate; A2, frame; L1, first edge; L2, second edge; L3, third edge; L4, fourth edge; O, geometric center; K1, first boundary line; K2, second boundary line; K3, third boundary line; K4, fourth boundary line; A0, middle; m1, outer side; m2, first surface; m3, second surface; m4, third surface;

[0063] B. Back cover; C. Accommodation cavity;

[0064] 30. MIC; 30a. Sound pickup hole; 31. Housing; 32. Substrate; 33. Microphone chip; 34. Integrated circuit;

[0065] 40, sound pickup channel; 40a, outer end opening; 41, first channel segment; 411, first linear channel segment; 412, second linear channel segment; 413, third linear channel segment; 42, second channel segment; D1, first end; D2, second end; D3, third end; D4, fourth end;

[0066] 50. Protective cover;

[0067] 60. Circuit board; 61. First through hole; 62. Second through hole;

[0068] 70. Dustproof net; 71. Net body; 71a. Middle portion; 71b. Edge portion; 72. First sealant layer; 73. Second sealant layer; 74. Elastic sealing layer;

[0069] 80, sealing cover; 81, top plate; 82, side plate; 821, first curved side plate; x1, first end; x2, second end; 822, second curved side plate; x3, third end; x4, fourth end; 823, first transition plate; 824, second transition plate; 83, annular bottom plate; n1, inner edge; n2, outer edge; K, sealant;

[0070] 90. Airflow cavity. DETAILED DESCRIPTION

[0071] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature specified as "first," "second," "third," or "fourth" may explicitly or implicitly include one or more of the features.

[0072] In the embodiments of the present application, the terms "comprises," "comprising," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0073] In the embodiments of the present application, unless otherwise specified, the description "parallel" means approximately parallel within a certain error range, which can be a range of a deviation angle of less than or equal to 5° relative to absolute parallelism. The description "perpendicular" means approximately perpendicular within a certain error range, which can be a range of a deviation angle of less than or equal to 5° relative to absolute perpendicularity. The description "collinear" means approximately collinear within a certain error range, which can be a range of a deviation distance of less than 0.1 mm relative to absolute collinearity.

[0074] The present application provides an electronic device that is a type of electronic device with a sound pickup function. Specifically, the electronic device includes, but is not limited to, mobile phones, tablet computers, laptop computers, desktop computers, large-screen display devices, vehicle-mounted devices, and smart wearable devices. Among them, smart wearable devices include, but are not limited to, smart watches, bracelets, smart glasses, smart clothing, etc. The embodiments of the present application are illustratively described using a foldable screen device as the electronic device. The foldable screen device can be, for example, a foldable screen mobile phone.

[0075] Please refer to Figure 1, which is a perspective view of an electronic device 100 provided in some embodiments of the present application in an unfolded state. When the electronic device 100 is in the unfolded state, a large screen display can be achieved to provide users with a better visual experience.

[0076] The electronic device 100 is approximately in the shape of a rectangular flat plate in the unfolded state. Based on this, in order to facilitate the description of the various embodiments below, an XYZ coordinate system is established for the electronic device 100 in the unfolded state, defining the length direction of the electronic device 100 as the X-axis direction, the width direction of the electronic device 100 as the Y-axis direction, and the thickness direction of the electronic device 100 as the Z-axis direction. It is understandable that the coordinate system setting of the electronic device 100 can be flexibly set according to actual needs and is not specifically limited here. In some other embodiments, the shape of the electronic device 100 in the unfolded state can also be a square flat plate, a circular flat plate, an elliptical flat plate, etc.

[0077] Referring to FIG. 1 , an electronic device 100 includes a screen 10 and a housing 20 .

[0078] The screen 10 is used to display information such as images and videos. The screen 10 can be an organic light-emitting diode (OLED) screen, a micro organic light-emitting diode (OLED) screen, a quantum dot light-emitting diode (QLED) screen, or a liquid crystal display (LCD).

[0079] The screen 10 includes a display surface S0 , through which a user can view images or videos displayed on the screen 10 .

[0080] The housing 20 is located on a side of the screen 10 facing away from the display surface S0 and is used to support the screen 10 .

[0081] Continuing to refer to FIG. 1 , the housing 20 includes a first housing 201 , a second housing 202 and a rotating shaft mechanism 203 .

[0082] The first housing 201 is used to support a portion of the screen 10, and the second housing 202 is used to support another portion of the screen 10. A hinge mechanism 203 is connected between the first housing 201 and the second housing 202 to achieve relative rotation between the first housing 201 and the second housing 202 to support the screen 10 from the unfolded state shown in Figure 1 to the folded state.

[0083] The first shell 201 can be rotated relative to the second shell 202 from the unfolded state shown in Figure 1 to the back of the screen 10 (that is, folded outward) to fold into the folded state, and can also be rotated relative to the second shell 202 toward the screen 10 (that is, folded inward) to fold into the folded state.

[0084] This application is exemplified by the first housing 201 being folded inward relative to the second housing 202 to a folded state. Referring to Figure 2 , Figure 2 is a front view of the electronic device 100 shown in Figure 1 in a folded state.

[0085] When the electronic device is in the folded state, the first housing 201 and the second housing 202 are stacked, and the electronic device is small in size and easy to carry.

[0086] The first housing 201 and the second housing 202 may include a middle frame and a back cover. The screen 10 is supported on the middle frame, and the back cover is located on the side of the middle frame facing away from the screen 10. The back cover and the middle frame form a cavity for accommodating electronic components such as a microphone (MIC) 30, a battery, a vibration motor, a speaker module, and a camera module.

[0087] The back cover of the first housing 201 and the back cover of the second housing 202 may be a physical back cover or a display screen, and the display surface of the display screen may be opposite to the display surface S0 of the screen 10. In this way, when the electronic device is in the folded state, a small screen display can be realized with the help of the display screen. Specifically, the display screen can be used to display incoming calls, message reminders, time, weather, date, and memos.

[0088] In the above embodiment, the MIC 30 can be disposed within the first housing 201 or within the second housing 202. Referring to Figures 1 and 2, this embodiment and the following embodiments are described illustratively with the MIC 30 disposed within the first housing 201. Therefore, to facilitate the description of the following embodiments, the middle frame of the first housing 201 is labeled as middle frame A, the back cover of the first housing 201 is labeled as back cover B, and the internal accommodating cavity of the first housing 201 is labeled as accommodating cavity C.

[0089] Please refer to Figure 3, which is a schematic cross-sectional view of the electronic device 100 along line AA shown in Figure 1. A sound pickup channel 40 is provided on the middle frame A, through which sound signals outside the electronic device 100 can enter the interior of the electronic device 100.

[0090] The sound pickup channel 40 has an opening at one end connected to the outside of the electronic device 100, which is an outer opening 40a. The outer opening 40a is located on the outer side m1 of the middle frame A. The outer side m1 of the middle frame A refers to the surface of the middle frame A away from the internal accommodating cavity C and is visible to the user.

[0091] To ensure the neat and aesthetically pleasing appearance of the electronic device 100, the outer end opening 40a is required to be centered on the outer side surface m1 along the Z-axis. This ensures the neat and aesthetically pleasing appearance of the electronic device 100. This is particularly true when the outer side surface m1 is a curved surface as shown in FIG4 . When a user views the electronic device 100 from the display side, the outer end opening 40a is invisible to the user, thereby ensuring the neat and aesthetically pleasing appearance of the electronic device 100. The display side of the electronic device 100 refers to the side facing the display surface S0 of the screen 10 and the side facing the display surface of the display screen.

[0092] Based on the above, referring to Figures 3 and 4 , MIC 30 is located on the side of the middle frame A facing away from the screen 10 and is housed within the accommodating cavity C. MIC 30 has a sound pickup hole 30a, which communicates with a sound pickup channel 40. Thus, MIC 30 can pick up sound signals from the sound pickup channel 40 and convert them into electrical signals.

[0093] To prevent the impact force from the back cover B from affecting the MIC 30, as shown in Figures 3 and 4, the electronic device 100 further includes a protective cover 00. The protective cover 00 is disposed between the MIC 30 and the back cover B and can be fixed to the middle frame A. In this way, the impact force from the back cover B first acts on the protective cover 00 and does not directly impact the MIC 30, thereby ensuring the performance of the MIC 30 and extending its service life.

[0094] Continuing with Figures 3 and 4 , the sound pickup channel 40 extends along an L-shaped path. Specifically, the sound pickup channel 40 includes a first channel segment 41 and a second channel segment 42. The first channel segment 41 extends from the outer side surface m1 along the Y-axis toward the center of the middle frame A, while the second channel segment 42 extends from the end of the first channel segment 41 facing the center of the middle frame A along the Z-axis away from the screen 10. Therefore, assuming that the outer end opening 40a is centered on the outer side surface m1, the thickness of the electronic device 100 can be twice the sum of the radius of the first channel segment 41, the length of the second channel segment 42, the thickness of the MIC 30, the thickness of the protective cover 00, and the thickness of the back cover B. This relatively large thickness is not conducive to the thinning of the electronic device 100.

[0095] Therefore, the electronic device 100 cannot be thinned while the outer end opening is centrally located.

[0096] To solve the above problem, please refer to FIG5 , which is a schematic cross-sectional view of an electronic device 100 according to some embodiments of the present application. In this embodiment, the sound pickup channel 40 includes a first channel section 41 and a second channel section 42 .

[0097] The first channel section 41 has a first end D1 and a second end D2 .

[0098] The first end D1 is located on the outer side m1 of the middle frame A, forming the outer opening of the sound pickup channel 40. In some embodiments, referring to FIG5 , the geometric center of the opening of the first end D1 can be centered on the outer side m1 along the Z-axis. This improves the appearance of the electronic device 100.

[0099] The first channel section 41 extends toward the middle of the middle frame A from the first end D1 to the second end D2 .

[0100] The middle portion of the middle frame A refers to the portion where the geometric center of the middle frame A in the XY plane is located. Specifically, the middle portion of the middle frame A refers to the portion enclosed by the boundaries formed by moving the four edges of the middle frame A toward the geometric center of the middle frame A by 1 / 2 times the distance.

[0101] For example, refer to Figure 6, which is a top view of the middle frame A shown in Figure 5. The four edges of the middle frame A may include a first edge L1, a second edge L2, a third edge L3, and a fourth edge L4. The geometric center of the middle frame A in the XY plane is labeled O. The distance from the first edge L1 to the geometric center O is a first distance d1, the distance from the second edge L2 to the geometric center O is a second distance d2, the distance from the third edge L3 to the geometric center O is a third distance d3, and the distance from the fourth edge L4 to the geometric center O is a fourth distance d4. The first edge L1 is moved toward the geometric center O by ½ the first distance d1 to form a first boundary line K1; the second edge L2 is moved toward the geometric center O by ½ the second distance d2 to form a second boundary line K2; the third edge L3 is moved toward the geometric center O by ½ the third distance d3 to form a third boundary line K3; and the fourth edge L4 is moved toward the geometric center O by ½ the fourth distance d4 to form a fourth boundary line K4. Based on this, the middle portion A0 of the middle frame A refers to a portion of the middle frame surrounded by the first boundary line K1 , the second boundary line K2 , the third boundary line K3 and the fourth boundary line K4 .

[0102] Based on the above, referring back to FIG. 5 , along a direction perpendicular to the screen 10 (i.e., the Z-axis), the second end D2 is closer to the screen 10 than the first end D1. In other words, along the Z-axis, the distance from the second end D2 to the screen 10 is shorter than the distance from the first end D1 to the screen 10.

[0103] Based on the above, please continue to refer to Figure 5. The second channel section 42 has a third end D3 and a fourth end D4, respectively. The third end D3 connects to the second end D2. From the third end D3 to the fourth end D4, the second channel section 42 extends away from the screen 10. The fourth end D4 penetrates the surface of the middle frame A facing away from the screen 10, forming the inner end opening of the sound pickup channel 40.

[0104] 5 , the MIC 30 is located on the side of the middle frame A facing away from the screen 10 . Specifically, the MIC 30 may be located in the accommodating cavity C. The sound pickup hole 30 a of the MIC 30 is connected to the fourth end D4 .

[0105] In this way, sound signals from outside the electronic device 100 can enter the MIC 30 via the sound pickup channel 40 and be picked up by the MIC 30. Because the second end D2 is closer to the screen 10 than the first end D1, and the third end D3 of the second channel segment 42 is connected to the second end D2, this ensures that the outer opening of the sound pickup channel 40 is centered along the Z-axis on the outer side surface m1, allowing the second channel segment 42 to be closer to the screen 10. While maintaining a constant length along the Z-axis, the thickness of the middle frame A can be reduced, facilitating a thinner electronic device. This allows the outer opening to be centered while also achieving a thinner electronic device 100.

[0106] The middle frame A serves as the supporting "skeleton" within the electronic device 100, supporting the screen 10 and the electronic components within the housing C. Therefore, the hardness of the middle frame A affects the overall structural strength of the electronic device 100. Therefore, to ensure the structural strength of the middle frame A after its thickness is reduced, in some embodiments, the middle frame A may be made of metal. Metal middle frames may be made of materials including, but not limited to, stainless steel, aluminum alloy, magnesium alloy, and titanium alloy. The greater hardness of metal ensures the structural strength of the middle frame A, and therefore the electronic device 100, while reducing its thickness, thereby preventing deformation.

[0107] The extension path of the first channel section 41 includes but is not limited to a straight path, a broken line path, a curved path, a partial straight path and another partial curved path, as long as the second end D2 is closer to the screen 10 than the first end D1.

[0108] Moreover, along the Z-axis direction, a portion of the middle section of the first channel section 41 may be closer to the screen 10 than the second end D2 , or may be farther away from the screen 10 than the first end D1 .

[0109] In some embodiments, referring to FIG. 5 , the first channel segment 41 approaches the screen 10 from the first end D1 to the second end D2. Specifically, of any two adjacent middle segments along the extension path of the first channel segment 41, the middle segment closer to the first end D1 is the first segment, and the middle segment closer to the second end D2 is the second segment, with the second segment being flush with the first segment. Alternatively, along the Z-axis, the second segment is closer to the screen 10 than the first segment. "Flush" means that the distances from the two segments to the screen 10 along the Z-axis are approximately equal.

[0110] In this way, the first channel section 41 is shorter, which can increase the peak frequency fh of the MIC 30, improve the operating frequency band of the MIC 30, and enhance the high-frequency performance of the MIC 30. In addition, the structure of the first channel section 41 is simpler and easier to manufacture.

[0111] In the above embodiment, from the first end D1 to the second end D2 , the first channel section 41 may approach the screen 10 continuously or in a step-by-step manner.

[0112] In some embodiments, as shown in FIG5 , the first channel segment 41 can extend in a straight line, and from the first end D1 to the second end D2, the first channel segment 41 can be inclined toward the screen 10. This allows the first channel segment 41 to continuously approach the screen 10 from the first end D1 to the second end D2, simplifying the shape of the sound pickup channel 40 and making it easier to manufacture. Furthermore, keeping the first channel segment 41 as short as possible increases the peak frequency fh of the MIC 30, broadening the operating frequency range of the MIC 30 and enhancing its high-frequency performance.

[0113] 5 , the inclination angle θ1 of the first channel segment 41 toward the screen 10 may be greater than or equal to 0° and less than or equal to 60°. Specifically, the inclination angle θ may be 0°, 5°, 10°, 15°, 20°, 25°, 30°, 35°, 40°, 45°, 50°, 55°, or 60°.

[0114] In this way, under the premise that the length of the first channel section 41 in the Y-axis direction is constant, the height of the first channel section 41 in the Z-axis direction is relatively small, which is conducive to the thinning of the middle frame A and even the electronic device 100.

[0115] In some other embodiments, in order to make the first channel section 41 continuously approach the screen 10, the first channel section 41 may also extend along an arc, and the arc may be arched toward the screen 10 or toward the back cover B. This application does not make any specific limitation on this.

[0116] The first channel section 41 and the second channel section 42 can be disposed in the middle frame A, or partially disposed in the middle frame A and partially disposed between the middle frame A and the screen 10. FIG5 illustrates an example in which both the first channel section 41 and the second channel section 42 are disposed in the middle frame A.

[0117] 5 , the middle frame A includes a middle plate A1 and a frame A2 . The frame A2 is disposed at the edge of the middle plate A1 , and the surface of the frame A2 facing away from the middle plate A1 forms the outer side surface m1 .

[0118] Continuing with Figure 5, perpendicular to the screen 10, the surface of the frame A2 facing away from the screen 10 is the first surface m2, and the surface of the middle panel A1 facing away from the screen 10 is the second surface m3. The distance from the first surface m2 to the screen 10 is greater than the distance from the second surface m3 to the screen 10. Thus, on the side of the middle frame A facing away from the screen 10, the middle panel A1 and the frame A2 form a groove. This groove forms an opening on the side facing away from the screen 10. The back cover B covers this opening, forming the aforementioned accommodating cavity C with the middle panel A1 and the frame A2. This eliminates the need for side frames along the edges of the back cover B, simplifying its structure.

[0119] Based on the above, referring to FIG. 5 , a portion of the first channel section 41 is disposed on the frame A2 , and another portion of the first channel section 41 and the second channel section 42 are disposed on the middle plate A1 .

[0120] The sound pickup channel 40 has a reasonable layout and a simple structure.

[0121] Based on the above, please refer to Figure 5, the surface of the frame A2 facing the accommodating cavity C is the third surface m4, the third surface m4 is connected between the first surface m2 and the second surface m3, and the corner position between the third surface m4 and the second surface m3 is position P.

[0122] Based on this, the distance from the first channel segment 41 to the position P affects the molding yield of the first channel segment 41 , as well as the thickness of the middle frame A or the accommodating capacity of the accommodating cavity C.

[0123] Specifically, the shorter the distance between the first channel section 41 and the position P, the less material of the portion of the middle frame located between the first channel section 41 and the position P, and the lower the structural strength. During the forming process of the first channel section 41 through the rotary hole process, the middle frame is prone to local perforation or deformation, and therefore the processing yield is low.

[0124] To ensure the yield rate, the distance between the first channel section 41 and the position P needs to be increased. Therefore, the second surface m3 needs to be moved downward, or the third surface m4 needs to be moved into the accommodating cavity C. This increases the thickness of the middle plate A1 and the frame A2, which is not conducive to the thinning of the middle frame A, or compresses the volume of the accommodating cavity C, reducing the accommodating capacity of the accommodating cavity C.

[0125] To solve the above problem, please refer to FIG7 , which is a schematic cross-sectional view of an electronic device 100 according to some embodiments of the present application. In this embodiment, the first channel section 41 includes a first straight channel section 411 and a second straight channel section 412 .

[0126] The first straight channel section 411 extends from the outer side surface m1 of the middle frame A toward the middle of the middle frame A and is inclined toward the screen 10 .

[0127] The second straight channel section 412 is connected between the end of the first straight channel section 411 facing the screen 10 and the third end D3 , and the second straight channel section 412 is parallel to the screen 10 .

[0128] In this way, please refer to Figure 7. From the first end D1 to the second end D2, the first channel section 41 is arched in the direction away from the position P, thereby increasing the distance between the first channel section 41 and the position P, thereby ensuring the molding yield of the first channel section 41, and at the same time, there is no need to increase the thickness of the middle plate A1 and the frame A2, which is conducive to the thinning of the middle frame A and even the electronic device, while ensuring the accommodating capacity of the accommodating cavity C.

[0129] In the above embodiment, the first linear channel segment 411, the second linear channel segment 412, and the second channel segment 42 can all be disposed within the middle frame A, or a portion can be disposed within the middle frame A and the other portion can be disposed between the screen 10 and the middle frame A. The embodiment shown in FIG7 is illustrative of an embodiment in which the first linear channel segment 411, the second linear channel segment 412, and the second channel segment 42 are all disposed within the middle frame A, and this is not to be considered a special limitation of the present application.

[0130] Based on the above embodiment, as shown in FIG7 , the first linear channel section 411 can be disposed within the frame A2, and at least a portion of the second linear channel portion 412 can be disposed within the middle plate A1. Specifically, a portion of the second linear channel portion 412 can be disposed within the middle plate A1, and another portion within the frame A2. This layout is reasonable and simple to implement.

[0131] In some other embodiments, please refer to Figure 8, which is a schematic diagram of the cross-sectional structure of the electronic device 100 provided in some other embodiments of the present application. In this embodiment, the first linear channel segment 411 is disposed within the middle frame A. Specifically, at least a portion of the first linear channel segment 411 can be disposed within the frame A2. The end of the first linear channel segment 411 facing the screen 10 passes through the surface of the middle frame A facing the screen 10. The second channel segment 42 is also disposed within the middle frame A. Specifically, the second channel segment 42 can be disposed within the middle plate A1. The third end D3 of the second channel segment 42 passes through the surface of the middle frame A facing the screen 10.

[0132] Based on the above, please continue to refer to Figure 8 . The electronic device 100 also includes a sealing ring 50. Materials for the sealing ring 50 include, but are not limited to, adhesive, adhesive backing, foam, nitrile rubber, silicone rubber, and fluororubber. The sealing ring 50 is positioned between the screen 10 and the middle frame A, and the area surrounded by the sealing ring 50 forms a second linear channel section 412. This allows the thickness of the middle frame A to be further reduced, while maintaining a constant length along the Z-axis, thereby facilitating a thinner electronic device 100.

[0133] In yet other embodiments, please refer to FIG9 , which is a schematic cross-sectional view of an electronic device 100 according to yet other embodiments of the present application. This embodiment differs from the embodiment shown in FIG7 in that, in this embodiment, from the first linear channel segment 411 to the second channel segment 42 , the second linear channel segment 412 is inclined toward the screen 10 , and the inclination angle θ2 of the second linear channel segment 412 relative to the screen 10 is less than the inclination angle θ1 of the first linear channel segment 411 relative to the screen 10 .

[0134] In this way, the first channel section 41 is also arched in the direction away from the position P, which increases the distance between the first channel section 41 and the position P, thereby ensuring the molding yield of the first channel section 41. At the same time, there is no need to increase the thickness of the middle plate A1 and the frame A2, which is conducive to the thinning of the middle frame A and even the electronic device, and at the same time can ensure the accommodating capacity of the accommodating cavity C.

[0135] In the above embodiment, the first linear channel segment 411, the second linear channel segment 412, and the second channel segment 42 may all be disposed within the middle frame A, or may be partially disposed within the middle frame A and partially disposed between the screen 10 and the middle frame A. For example, the first linear channel segment 411 and the second linear channel segment 42 are disposed within the middle frame A, and the second linear channel segment 412 is surrounded by a sealing ring disposed between the screen 10 and the middle frame A. The embodiment shown in FIG9 is illustrative of an embodiment in which the first linear channel segment 411, the second linear channel segment 412, and the second channel segment 42 are all disposed within the middle frame A, and this is not to be considered a special limitation of the present application.

[0136] In some other embodiments, please refer to Figure 10, which is a schematic cross-sectional view of an electronic device 100 according to some other embodiments of the present application. In this embodiment, the first channel section 41 includes a first straight channel section 411, a second straight channel section 412, and a third straight channel section 413.

[0137] The first straight channel section 411 extends from the outer side surface m1 of the middle frame A to the middle of the middle frame A.

[0138] The third linear channel section 413 extends from one end of the first linear channel section 411 facing the middle of the middle frame A toward the screen 10 .

[0139] The second linear channel section 412 extends from the end of the third linear channel section facing the screen 10 toward the middle of the middle frame A.

[0140] In this way, referring to Figure 10, from the first end D1 to the second end D2, the first channel section 41 approaches the screen 10 in a step-by-step manner. Under the premise of ensuring that the thickness of the middle plate A1 remains unchanged, the distance between the first channel section 41 and the position P can be increased, thereby ensuring the molding yield of the first channel section 41.

[0141] In the above embodiment, the first linear channel segment 411, the second linear channel segment 412, the third linear channel segment 413, and the second channel segment 42 may all be disposed within the middle frame A, or a portion thereof may be disposed within the middle frame A and the remaining portion thereof may be disposed between the screen 10 and the middle frame A. The embodiment shown in FIG10 is illustrative of an embodiment in which the first linear channel segment 411, the second linear channel segment 412, the third linear channel segment 413, and the second channel segment 42 are all disposed within the middle frame A, and this is not to be construed as a special limitation of the present application.

[0142] In some other embodiments, please refer to Figure 11, which is a schematic diagram of the cross-sectional structure of the electronic device 100 provided in some other embodiments of the present application. In this embodiment, the first straight channel segment 411 and the third straight channel segment 413 are arranged in the middle frame A. Specifically, the first straight channel segment 411 and the third straight channel segment 413 can be at least partially arranged in the frame A2. The end of the third straight channel segment 413 facing the screen 10 passes through the surface of the middle frame A facing the screen 10. The second channel segment 42 is also arranged in the middle frame A. Specifically, the second channel segment 42 can be arranged in the middle plate A1. The third end D3 of the second channel segment 42 passes through the surface of the middle frame A facing the screen 10.

[0143] Based on the above, please continue to refer to Figure 11 . The electronic device 100 also includes a sealing ring 50. Materials for the sealing ring 50 include, but are not limited to, adhesive, adhesive backing, foam, nitrile rubber, silicone rubber, and fluororubber. The sealing ring 50 is positioned between the screen 10 and the middle frame A, and the area surrounded by the sealing ring 50 forms a second linear channel section 412. This allows the thickness of the middle frame A to be further reduced, while maintaining a constant length along the Z-axis, thereby facilitating a thinner electronic device 100.

[0144] Based on the embodiment shown in FIG. 7 , FIG. 9 or FIG. 10 , the second straight channel segment 412 may penetrate the surface of the middle frame A facing the screen 10 to form an opening a, and the screen 10 covers the opening a.

[0145] In this way, the screen 10 forms the side wall of the second straight channel section 412. On the premise of ensuring the height of the second straight channel section 412 in the Z-axis direction and the distance from the first channel section 41 to the position P, the thickness of the middle plate A1 can be further reduced, which is conducive to the thinning of the middle frame A and even the electronic device 100.

[0146] At the same time, the opening a can simplify the setting of the sound pickup channel 40. Specifically, the sound pickup channel 40 can be processed by a computer numerical control (CNC) machine tool, which can perform operations such as hole turning and milling.

[0147] For example, for the sound pickup channel 40 in the electronic device 100 shown in FIG7 , a hole can first be drilled from the outer side m1 of the middle frame A toward the center of the middle frame A to form a first linear channel segment 411. Then, a milling process is used to mill a second linear channel segment 412 from the surface of the middle frame A that connects to the screen 10, with the end of the second linear channel segment 412 facing the outer side m1 connected to the first linear channel segment 411. Finally, a hole is drilled from the bottom surface of the end of the second linear channel segment 412 away from the outer side m1 toward the surface of the middle frame A facing away from the screen 10 to form the second channel segment 42. This operation is simple and easy to implement.

[0148] The sound pickup channel 40 in the electronic device 100 shown in FIG. 9 may be formed in the same manner as the sound pickup channel 40 in the electronic device 100 shown in FIG. 7 , and will not be described in detail herein.

[0149] As another example, for the sound pickup channel 40 in the electronic device 100 shown in FIG10 , a hole can first be drilled from the outer side m1 of the middle frame A toward the center of the middle frame A to form a first linear channel segment 411. Next, a milling process is used to mill a second linear channel segment 412 from the surface of the middle frame A that connects to the screen 10. Then, a hole is drilled from the bottom surface of the second linear channel segment 412 at the end facing the outer side m1 toward the first linear channel segment 411 to form a third linear channel segment 413. Finally, a hole is drilled from the bottom surface of the second linear channel segment 412 at the end facing away from the outer side m1 toward the surface of the middle frame A facing away from the screen 10 to form the second channel segment 42. This operation is simple and easy to implement.

[0150] Based on the above, optionally, referring to Figures 7, 9, or 10, a sealing ring 50 is provided between the screen 10 and the middle frame A. Materials for the sealing ring 50 include, but are not limited to, adhesive, adhesive backing, foam, nitrile rubber, silicone rubber, and fluororubber. The sealing ring 50 is disposed around the opening a. This ensures the airtightness of the second linear channel section 412.

[0151] Based on any of the above embodiments, the second channel segment 42 can extend along a straight line, a curve, or a broken line. When the second channel segment 42 extends along a straight line, it can extend along the Z-axis direction or be inclined relative to the Z-axis direction. This application uses the second channel segment 42 extending along the Z-axis direction as an example, and this is not to be considered a special limitation of this application.

[0152] The above embodiments introduce the structure of the sound pickup channel 40. The internal structure of the accommodating cavity C will be introduced below. The internal structure of the accommodating cavity C can be combined with the sound pickup channel 40 described in any of the above embodiments. The following is an introduction based on the combination of the internal structure of the accommodating cavity C and the sound pickup channel 40 in the electronic device 100 shown in Figure 7. This cannot be regarded as a special limitation on the constitution of this application.

[0153] As described above, referring to FIG. 7 , the MIC 30 is disposed in the accommodating cavity C. The MIC 30 has a sound pickup hole 30 a , which is connected to the fourth end D4 of the sound pickup channel 40 .

[0154] The MIC 30 has various structural forms. In some embodiments, the MIC 30 may be a micro-electro-mechanical system (MEMS) microphone. For example, a MEMS microphone may have the following structure:

[0155] Please refer to Figure 12, which is a schematic cross-sectional view of the structure of the MIC 30 in the electronic device 100 according to some embodiments of the present application. The MIC 30 includes a housing 31, a substrate 32, a microphone chip 33, and an integrated circuit 34.

[0156] The sound pickup hole 30a is provided on the substrate 32. The housing 31 and the substrate 32 form a cavity which is in communication with the sound pickup hole 30a. The microphone chip 33 and the integrated circuit 34 are fixed on the substrate 32 and are located in the cavity.

[0157] The microphone chip 33 includes a backplate 331 and a diaphragm 332. The backplate 331 and diaphragm 332 are arranged parallel to and spaced apart from each other to form a parallel plate capacitor. The end of the microphone chip 33 opposite the parallel plate capacitor is open and communicates with the sound pickup hole 30a. An integrated circuit 34 is electrically connected to the microphone chip 33.

[0158] In this way, the sound signal entering from the sound pickup channel 40 can enter the microphone chip 33 through the sound pickup hole 30a, causing the diaphragm 332 to vibrate, thereby changing the capacitance of the parallel plate capacitor and causing the integrated circuit 34 to output an electrical signal, thereby achieving sound-to-electricity conversion.

[0159] The MIC 30 is a bottom-opening MEMS microphone, which has a simple structure and is easy to manufacture.

[0160] Referring to FIG. 7 , the sound pickup hole 30 a can be opposite to and directly connected to the fourth end D4 . This simple structure shortens the path of the sound signal from the sound pickup channel 40 to the MIC 30 , thereby increasing the peak frequency fh of the MIC 30 , improving the operating frequency band of the MIC 30 , and enhancing the high-frequency performance of the MIC 30 .

[0161] In other embodiments, other structures may be provided between the sound pickup hole 30a and the fourth end D4. The other structures may be provided with a communication channel, and the sound pickup hole 30a is communicated with the fourth end D4 via the communication channel.

[0162] For example, please refer to FIG13 , which is a schematic cross-sectional view of an electronic device 100 according to some other embodiments of the present application. In this embodiment, the electronic device 100 further includes a circuit board 60 .

[0163] The circuit board 60 is located on the side of the middle frame A facing away from the screen 10 and can be located within the accommodating cavity C. The circuit board 60 is provided with a first through hole 61. The first through hole 61 can be a circular hole, an elliptical hole, a square hole, a triangular hole, etc., which is not specifically limited in this application. The first through hole 61 is opposite to and connected to the fourth end D4.

[0164] Based on this, referring to FIG. 13 , the MIC 30 may be disposed on a circuit board 60 , and the sound pickup hole 30 a is communicated with the first through hole 61 .

[0165] Thus, the circuit board 60 facilitates electrical connection between the MIC 30 and other electronic components, such as a controller and memory. To this end, a first through hole 61 is provided on the circuit board 60, and the first through hole 61 is aligned with and connected to the fourth end D4. The sound pickup hole 30a is connected to the first through hole 61. This layout is rational and can improve the compactness of the electronic components within the electronic device.

[0166] On the basis of the above embodiments, in order to prevent foreign matter (such as dust, debris, etc.) outside the electronic device 100 from entering the MIC 30 along the sound pickup channel 40, in some embodiments, please refer to Figure 14, which is a partial enlarged view of area I inside the electronic device 100 shown in Figure 13, and a dustproof net 70 is provided between the middle frame A and the circuit board 60.

[0167] The dustproof net 70 includes a net body 71 , and the material of the net body 71 includes but is not limited to metal and plastic. At least a portion of the net body 71 is located between the fourth end D4 and the first through hole 61 .

[0168] In this way, the dustproof net 70 can prevent foreign objects outside the electronic device 100 from entering the MIC 30 along the sound pickup channel 40, thereby ensuring the performance of the MIC 30 and extending its service life.

[0169] In the above embodiment, in order to ensure the airtightness of the dustproof net 70, in some embodiments, please continue to refer to FIG. 14 ,

[0170] The mesh body 71 includes a middle portion 71 a and an edge portion 71 b surrounding the middle portion 71 a. The middle portion 71 a is located between the fourth end D4 and the first through hole 61.

[0171] On the basis of the above, the dustproof net 70 further includes a first sealing adhesive layer 72 , a second sealing adhesive layer 73 and an elastic sealing layer 74 .

[0172] The first sealant layer 72 is bonded between the edge portion 71 b and the middle frame A. The second sealant layer 73 is bonded between the edge portion 71 b and the elastic sealant layer 74 . The elastic sealant layer 74 is located between the second sealant layer 73 and the circuit board 60 .

[0173] The circuit board 60 can be fixedly connected to the middle frame A by means of screws or other connecting parts to squeeze the elastic sealing layer 74 and put the elastic sealing layer 74 in a compressed state to achieve sealing and ensure the airtightness of the dustproof net 70.

[0174] In the above embodiment, referring back to Figure 13 , the MIC 30 can be located on the side of the circuit board 60 facing away from the second channel section 42, with the sound pickup hole 30a of the MIC 30 facing and communicating with the first through-hole 61. This simple structure shortens the path for the sound signal to enter the MIC 30 through the sound pickup channel 40 and the first through-hole 61. This increases the peak frequency fh of the MIC 30, broadens the operating frequency band of the MIC 30, and enhances the high-frequency performance of the MIC 30.

[0175] In some embodiments, other structures may be provided between the sound pickup hole 30 a of the MIC 30 and the first through hole 61 . The other structures may be provided with a communication channel, and the sound pickup hole 30 a is communicated with the first through hole 61 via the communication channel.

[0176] For example, please refer to Figure 15, which is a schematic cross-sectional view of an electronic device 100 provided in some embodiments of the present application. In this embodiment, the circuit board 60 is further provided with a second through hole 62, which includes but is not limited to a circular hole, an elliptical hole, a square hole, a triangular hole, a pentagonal hole, etc.

[0177] The second through hole 62 is spaced apart from the first through hole 61. Referring to Figure 15, the MIC 30 and the second channel section 42 are located on the same side of the circuit board 60, and the sound pickup hole 30a of the MIC 30 is opposite to and communicates with the second through hole 62.

[0178] Based on the above, the electronic device 100 further includes a sealing cover 80. The sealing cover 80 is located on the side of the circuit board 60 facing away from the MIC 30 and the second channel section 42. The sealing cover 80 and the circuit board 60 enclose an airflow cavity 90, which is connected to both the first through hole 61 and the second through hole 62.

[0179] In this way, the first through hole 61, the air flow cavity 90 and the second through hole 62 form a U-shaped channel connected between the sound pickup channel 40 and the sound pickup hole 30a. The sound signal outside the electronic device 100 (as shown by the arrow in Figure 15) can be transmitted to the MIC 30 through the sound pickup channel 40 and the U-shaped channel in sequence, and further converted into an electrical signal with the help of the MIC 30.

[0180] Moreover, along the direction perpendicular to the circuit board 60, that is, the Z-axis direction, the height of the sealing cover 80 can be smaller than the height of the MIC 30. Therefore, compared with the solution shown in Figure 13, it is beneficial to reduce the stacking thickness of the entire machine and achieve a thinner electronic device 100.

[0181] Furthermore, because the MIC 30 and the second channel section 42 are located on the same side of the circuit board 60, and the second channel section 42 is provided on the middle plate A1, and the back cover B and the middle plate A1 are located on opposite sides of the circuit board 60, the MIC 30 and the back cover B are located on opposite sides of the circuit board 60. Thus, the circuit board 60 can protect the MIC 30, preventing damage to the MIC 30 from external forces from the back cover B, eliminating the need for a dedicated protective cover for the MIC 30.

[0182] In some embodiments, referring to FIG. 15 , a clearance groove Q is provided on the surface of the middle frame A facing away from the screen 10, and the MIC 30 is accommodated within the clearance groove Q. The provision of the clearance groove Q allows the circuit board 60 to be closer to the middle frame A, preventing the MIC 30 from overlapping with the middle frame A in thickness. This reduces the thickness of the electronic device 10, thereby improving the portability and usability of the electronic device 100.

[0183] In some embodiments, referring to FIG. 15 , along a direction perpendicular to the circuit board 60 , ie, the Z-axis direction, a height H2 of the sealing cover 80 may be smaller than a height H1 of the MIC 30 .

[0184] In this way, the stacking height of the electronic components located on the side of the middle plate A1 facing away from the screen 10 can be reduced. Compared with the scheme shown in Figure 13, it is beneficial to reduce the stacking thickness of the whole machine, and can realize the thinning of the electronic device 100, thereby improving the portability and feel of the electronic device 100.

[0185] In some embodiments, referring to FIG15 , a height H2 of the sealing cover 80 can be greater than or equal to 0.4 mm and less than or equal to 0.9 mm in a direction perpendicular to the circuit board 60. Specifically, the height H2 of the sealing cover 80 can be 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, or 0.9 mm.

[0186] In this way, the height H2 of the sealing cover 80 is moderate, which can reduce the thickness of the entire device while ensuring the height of the airflow cavity 90, thereby increasing the peak frequency fh of the MIC 30, improving the operating frequency band of the MIC 30, and enhancing the high-frequency performance of the MIC 30.

[0187] In some embodiments, referring to Figure 15 , the wall thickness of the sealing cover 80 may be greater than or equal to 0.08 mm and less than or equal to 0.3 mm. Specifically, the wall thickness of the sealing cover 80 may be 0.08 mm, 0.1 mm, 0.15 mm, 0.18 mm, 0.2 mm, 0.25 mm, 0.28 mm, or 0.3 mm.

[0188] In this way, the wall thickness of the sealing cover 80 is moderate, which can ensure the structural strength of the sealing cover 80 while ensuring the height of the airflow cavity 90, thereby increasing the peak frequency fh of the MIC 30, improving the operating frequency band of the MIC 30, and enhancing the high-frequency performance of the MIC 30.

[0189] In some embodiments, the sealing cover 80 may be made of metal. Specifically, the metal includes, but is not limited to, iron, iron alloys, copper, copper alloys, aluminum, or aluminum alloys. Metals are relatively hard, and while ensuring the structural strength of the sealing cover 80, the wall thickness of the sealing cover 80 can be reduced, thereby increasing the height of the airflow chamber 90 while reducing the height of the sealing cover 80.

[0190] In other embodiments, the sealing cover 80 may be made of plastic. Specifically, the plastic includes but is not limited to polycarbonate (PC), PC+glass fiber, and ABS plastic (acrylonitrile butadiene styrene plastic). Plastic is easy to mold and inexpensive, which helps save costs.

[0191] The following embodiments are described on the basis that the sealing cover 80 is made of metal, which is not to be considered as a special limitation to the present application.

[0192] Based on the above embodiments, the sealing cover 80 may be in the shape of a spherical shell, a cylindrical shell, or the like.

[0193] In some embodiments, referring to FIG16 , FIG16 is a schematic cross-sectional view of the sealing cover 80 in the electronic device 100 shown in FIG15 . The sealing cover 80 includes a top plate 81, a side plate 82, and an annular bottom plate 83. The side plate 82 is disposed along the edge of the top plate 81. The annular bottom plate 83 is connected to the end of the side plate 82 away from the top plate 81, and the annular bottom plate 83 is connected to the circuit board 60 shown in FIG15 .

[0194] Thus, the sealing cover 80 is generally cylindrical and has a simple structure. Furthermore, while maintaining a constant height in the Z-axis direction, the sealing cover 80 can form a relatively large interior space. This ensures the volume of the airflow cavity when used in the electronic device 10, thereby increasing the peak frequency fh of the MIC 30.

[0195] In the above embodiment, the side plates 82 can be perpendicular to the top plate 81, and the annular bottom plate 83 can be parallel to the top plate 81. This structure is simple and easy to process.

[0196] In other embodiments, the side plate 82 and the annular bottom plate 83 may also be inclined relative to the top plate 81. This application is illustrated by taking the example that the side plate 82 is perpendicular to the top plate 81 and the annular bottom plate 83 is parallel to the top plate 81. This cannot be regarded as a special limitation on the constitution of this application.

[0197] The annular bottom plate 83 may be connected to the circuit board 60 by gluing or welding.

[0198] In some embodiments, please refer to Figure 17, which is a bottom view of the circuit board 60 in the electronic device 100 shown in Figure 15. The circuit board 60 is provided with an annular connecting pad 63, and the annular bottom plate 83 is welded to the annular connecting pad 63.

[0199] In this way, the sealing cover 80 and the circuit board 60 are fixedly connected by welding, the connection is relatively stable, and the circle of the annular bottom plate 83 and the circle of the annular connecting pad 63 can be welded, which can achieve sealing to a certain extent.

[0200] In addition, the first through hole 61 and the second through hole 62 can balance the air pressure inside and outside the airflow cavity 90 , thereby preventing the sealing cover 80 from being desoldered due to heating of the air inside the airflow cavity 90 during welding of the sealing cover 80 on the circuit board 60 .

[0201] Specifically, the annular bottom plate 83 can be welded to the annular connecting pad 63 using surface mounted technology (SMT). This can improve welding efficiency and reduce assembly costs.

[0202] The top plate 81, the side plates 82, and the annular bottom plate 83 can be integrally formed, specifically by metal stamping, casting, or other processes. In other embodiments, the top plate 81, the side plates 82, and the annular bottom plate 83 can also be formed separately and fixedly connected by welding or other methods, which is not specifically limited in this application.

[0203] The annular bottom plate 83 includes an inner edge n1 and an outer edge n2 . The inner edge n1 faces the area surrounded by the annular bottom plate 83 , and the outer edge n2 is away from the area surrounded by the annular bottom plate 83 .

[0204] Based on the above, optionally, referring back to Figure 16, the end of the side plate 82 away from the top plate 81 is located in the area surrounded by the annular bottom plate 83 and connected to the inner edge n1. This sealing cover 80 has a simple structure and can be stamped, which is conducive to simplifying the molding difficulty.

[0205] In some other embodiments, the end of the side panel 82 away from the top panel 81 may also be connected to the outer edge n2 of the annular bottom panel 83, or connected to the middle part between the outer edge n2 and the inner edge n1. The subsequent embodiments are further introduced on the basis that the end of the side panel 82 away from the top panel 81 is connected to the inner edge n1, which cannot be regarded as a special limitation of the present application.

[0206] In some embodiments, refer to FIG. 18 , which illustrates a cross-sectional view of the connection structure between the sealing cover 80 and the circuit board 60 within the electronic device 100 shown in FIG. Sealant K is applied to the side of the outer edge n2 away from the inner edge n1 . The sealant K adheres to both the outer edge n2 and the circuit board 60. The sealant K includes, but is not limited to, dispensing glue.

[0207] In this way, the sealing cover 80 can be secondary sealed and reinforced with the help of the sealant K, thereby preventing air leakage from occurring at the connection gap between the annular bottom plate 83 and the circuit board 60 .

[0208] In some embodiments, referring back to Figure 15 , the cross-sectional area of ​​the first through-hole 61 can be larger than that of the second through-hole 62. This allows the sound signal, after entering the accommodating chamber C through the sound pickup channel 40, to smoothly pass through the first through-hole 61 into the airflow chamber 90 and then into the sound pickup hole 30a through the second through-hole 62. Because the cross-sectional area of ​​the sound pickup hole 30a is smaller, the cross-sectional area of ​​the second through-hole 62, which faces the sound pickup hole 30a, is also smaller. This increases the contact area between the circuit board 60 and the substrate 32 of the MIC 30, ensuring support stability. This layout is rational and provides excellent performance.

[0209] Based on the above embodiment, in some embodiments, please refer to Figure 19, which is a top view of the sealing cover 80 in the electronic device 100 shown in Figure 15. In this embodiment, the side panel 82 includes a first curved side panel 821, a second curved side panel 822, a first transition panel 823, and a second transition panel 824.

[0210] The first arcuate side plate 821 is located on a side of the first through hole 61 away from the second through hole 62 and extends circumferentially of the first through hole 61. The second arcuate side plate 822 is located on a side of the second through hole 62 away from the first through hole 61 and extends circumferentially of the second through hole 62.

[0211] The radius r1 of the arc-shaped inner wall surface of the first arc-shaped side plate 821 is greater than the radius r2 of the arc-shaped inner wall surface of the second arc-shaped side plate 822 .

[0212] Based on the above, please continue to refer to Figure 19. The first curved side plate 821 has two ends along the circumference of the first through hole 61, namely the first end x1 and the second end x2. The second curved side plate 822 has two ends along the circumference of the second through hole 62, namely the third end x3 and the fourth end x4. The first transition plate 823 is connected between the first end x1 and the third end x3, and the second transition plate 824 is connected between the second end x2 and the fourth end x4.

[0213] In this way, the shape of the sealing cover 80 is roughly spindle-shaped, with a larger internal space at one end of the spindle-shaped structure and a smaller internal space at the other end. The end with the larger internal space is connected to the first through hole 61 with a larger diameter, and the end with the smaller internal space is connected to the second through hole 62 with a smaller diameter. This reasonable layout can reduce the volume of the sealing cover 80 while helping to increase the peak frequency fh of the MIC 30.

[0214] In the above embodiment, the first transition plate 823 and the second transition plate 824 may be flat plates or curved plates.

[0215] In some embodiments, referring to FIG. 19 , the first transition plate 823 and the second transition plate 824 are both flat plates, and the first transition plate 823 is tangent to the first end x1 of the first curved side plate 821 and the third end x3 of the second curved side plate 822. The second transition plate 824 is tangent to the second end x2 of the first curved side plate 821 and the fourth end x4 of the second curved side plate 822.

[0216] In this way, the side plate 82 has a simple structure and is easy to manufacture, which helps to reduce costs.

[0217] In some embodiments, the first through hole 61 and the second through hole 62 may be circular holes. The sound waves and airflow are transmitted more smoothly in the circular holes, and the sound pickup effect of the MIC 30 is better.

[0218] Based on the above embodiment, please refer to Figure 19 , the center line of the first arcuate side panel 821 is collinear with the center line of the first through hole 61 , and the center line of the second arcuate side panel 822 is collinear with the center line of the second through hole 62 .

[0219] Along the radial direction of the first through hole 61 , the distance between the arc-shaped inner wall surface of the first arc-shaped side plate 821 and the inner wall surface of the first through hole 61 is a first distance M1 .

[0220] Along the radial direction of the second through hole 62 , the distance between the arc-shaped inner wall surface of the second arc-shaped side plate 822 and the inner wall surface of the second through hole 62 is a second distance M2 .

[0221] The second distance M2 is equal to the first distance M1. It should be noted that the second distance M2 being equal to the first distance M1 is not limited to being absolutely equal to the first distance M1. When the absolute value of the difference between the second distance M2 and the first distance M1 is within the range of 0 mm-0.1 mm, the second distance M2 can be considered equal to the first distance M1.

[0222] In this way, the layout is reasonable and can minimize the area occupied by the sealing cover 80 on the circuit board 60 , thereby facilitating a reduction in the volume of the airflow cavity 90 in the sealing cover 80 , thereby facilitating an increase in the peak frequency fh of the MIC 30 .

[0223] In some embodiments, referring to FIG. 19 , the first distance M1 and the second distance M2 can be greater than or equal to 0.2 mm and less than or equal to 0.5 mm. Specifically, the first distance M1 and the second distance M2 can be 0.2 mm, 0.3 mm, 0.4 mm, or 0.5 mm. In this way, the first distance M1 and the second distance M2 are moderate, taking into account both the volume of the sealing cover 80 and the peak frequency fh of the MIC 30.

[0224] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0225] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, characterized in that: include: A screen, wherein the screen comprises a display surface; A middle frame, the middle frame being arranged on a side of the screen facing away from the display surface; A sound pickup channel, the sound pickup channel is located on the side of the screen facing away from the display surface, and the sound pickup channel includes a first channel section and a second channel section; wherein, The two ends of the first channel section are respectively a first end and a second end, the first end is located on the outer side of the middle frame, and from the first end to the second end, the first channel section extends toward the middle of the middle frame, and along a direction perpendicular to the screen, the second end is closer to the screen than the first end; The two ends of the second channel section are respectively a third end and a fourth end, the third end is connected to the second end, the second channel section extends from the third end to the fourth end in a direction away from the screen, and the fourth end passes through a surface of the middle frame facing away from the screen; A microphone is located on a side of the middle frame facing away from the screen, and has a sound pickup hole connected to the fourth end.

2. The electronic device according to claim 1, characterized in that: From the first end to the second end, the first channel section approaches the screen.

3. The electronic device according to claim 2, characterized in that: The first channel section includes a first straight channel section and a second straight channel section; The first straight channel segment extends from the outer surface of the middle frame to the middle of the middle frame and is inclined toward the screen, and the second straight channel segment is connected between one end of the first straight channel segment facing the screen and the third end; The second straight channel section is parallel to the screen; or, From the first straight channel segment to the second channel segment, the second straight channel segment is inclined toward the screen, and an inclination angle of the second straight channel segment relative to the screen is smaller than an inclination angle of the first straight channel segment relative to the screen.

4. The electronic device according to claim 3, characterized in that: The first straight channel segment is disposed in the middle frame, and one end of the first straight channel segment facing the screen passes through a surface of the middle frame facing the screen; The second channel section is disposed in the middle frame, and the third end of the second channel section passes through the surface of the middle frame facing the screen; The electronic device further comprises: A sealing ring is arranged between the screen and the middle frame, and the area surrounded by the sealing ring forms the second straight channel section.

5. The electronic device according to claim 3, characterized in that: The first straight channel section, the second straight channel section and the second channel section are all arranged in the middle frame.

6. The electronic device according to claim 2, characterized in that: The first channel section includes a first straight channel section, a second straight channel section and a third straight channel section; The first straight channel section extends from the outer side of the middle frame to the middle part of the middle frame; The third straight channel section extends from one end of the first straight channel section facing the middle of the middle frame to the Screen extension; The second straight channel segment extends from an end of the third straight channel segment facing the screen toward the middle of the middle frame.

7. The electronic device according to claim 6, characterized in that: The first straight channel segment and the third straight channel segment are arranged in the middle frame, and one end of the third straight channel segment facing the screen passes through the surface of the middle frame facing the screen; The second channel section is arranged in the middle frame, and the third end of the second channel section passes through the surface of the middle frame facing the screen; The electronic device further comprises: A sealing ring is arranged between the screen and the middle frame, and the area surrounded by the sealing ring forms the second straight channel section.

8. The electronic device according to claim 6, characterized in that: The first straight channel segment, the second straight channel segment, the third straight channel segment and the second channel segment are all arranged in the middle frame.

9. The electronic device according to claim 5 or 8, characterized in that: The second straight channel section passes through a surface of the middle frame facing the screen to form an opening, and the screen covers the opening.

10. The electronic device according to claim 9, characterized in that: A sealing ring is provided between the screen and the middle frame, and the sealing ring is arranged around the opening.

11. The electronic device according to claim 2, characterized in that: The first channel section and the second channel section are both arranged in the middle frame; The first channel section extends along a straight line, and from the first end to the second end, the first channel section is inclined toward the screen.

12. The electronic device according to any one of claims 1 to 11, characterized in that: Also includes: A circuit board, the circuit board is located on a side of the middle frame facing away from the screen, the circuit board is provided with a first through hole, and the first through hole is opposite to and connected to the fourth end; The microphone is arranged on the circuit board, and the sound pickup hole of the microphone is communicated with the first through hole.

13. The electronic device according to claim 12, characterized in that: A dustproof net is provided between the middle frame and the circuit board, wherein the dustproof net comprises a net body, and at least a portion of the net body is located between the fourth end and the first through hole.

14. The electronic device according to claim 13, characterized in that: The net body comprises a middle portion and an edge portion surrounding the middle portion, wherein the middle portion is located between the fourth end and the first through hole; The dustproof net also includes a first sealant layer, a second sealant layer and an elastic sealant layer; the first sealant layer is bonded between the edge portion and the middle frame; the second sealant layer is bonded between the edge portion and the elastic sealant layer; the elastic sealant layer is located between the second sealant layer and the circuit board.

15. The electronic device according to any one of claims 12 to 14, characterized in that: The circuit board is further provided with a second through hole, and the second through hole is spaced apart from the first through hole; the microphone and the second channel section are located on the same side of the circuit board, and the sound pickup hole of the microphone is opposite to and connected to the second through hole; The electronic device further comprises: A sealing cover is located on a side of the circuit board facing away from the microphone and the second channel section, and the sealing cover and the circuit board form an airflow cavity, and the airflow cavity and the first through hole and the second through hole All connected.

16. The electronic device according to claim 15, characterized in that: A surface of the middle frame facing away from the screen is provided with an avoidance groove, and the microphone is accommodated in the avoidance groove.

17. The electronic device according to claim 15 or 16, characterized in that: A cross-sectional area of ​​the first through hole is greater than a cross-sectional area of ​​the second through hole.

18. The electronic device according to any one of claims 15 to 17, characterized in that: In a direction perpendicular to the circuit board, a height of the sealing cover is smaller than a height of the microphone.

19. The electronic device according to any one of claims 15 to 18, characterized in that: The sealing cover is made of metal.

20. The electronic device according to any one of claims 15 to 19, characterized in that: The sealing cover comprises a top plate, a side plate and an annular bottom plate; The side plate is arranged along the edge of the top plate, the annular bottom plate is connected to one end of the side plate away from the top plate, and the annular bottom plate is connected to the circuit board.

21. The electronic device according to claim 20, characterized in that: The annular bottom plate comprises an inner edge, and one end of the side plate away from the top plate is located in the area surrounded by the annular bottom plate and is connected to the inner edge.

22. The electronic device according to claim 21, characterized in that: The annular bottom plate further comprises an outer edge, and a sealant is provided on a side of the outer edge away from the inner edge, and the sealant is bonded to both the outer edge and the circuit board.

23. The electronic device according to any one of claims 20 to 22, characterized in that: The side plate comprises a first arc-shaped side plate, a second arc-shaped side plate, a first transition plate and a second transition plate; The first arc-shaped side plate is located on a side of the first through hole away from the second through hole and extends along the circumference of the first through hole, the second arc-shaped side plate is located on a side of the second through hole away from the first through hole and extends along the circumference of the second through hole, and the radius of the arc-shaped inner wall surface of the first arc-shaped side plate is greater than the radius of the arc-shaped inner wall surface of the second arc-shaped side plate; Two ends of the first arc-shaped side plate along the circumference of the first through hole are respectively a first end and a second end, and two ends of the second arc-shaped side plate along the circumference of the second through hole are respectively a third end and a fourth end; The first transition plate is connected between the first end and the third end, and the second transition plate is connected between the second end and the fourth end.

24. The electronic device according to claim 23, characterized in that: The first transition plate and the second transition plate are both flat plates, and the first transition plate is tangent to the first end of the first arcuate side plate and the third end of the second arcuate side plate, and the second transition plate is tangent to the second end of the first arcuate side plate and the fourth end of the second arcuate side plate.

25. The electronic device according to claim 24, characterized in that: The first through hole and the second through hole are both circular holes; The center line of the circle corresponding to the first arc-shaped side plate is collinear with the center line of the circle of the first through hole, and the center line of the circle corresponding to the second arc-shaped side plate is collinear with the center line of the circle of the second through hole; Along the radial direction of the first through hole, the distance between the arcuate inner wall surface of the first arcuate side plate and the inner wall surface of the first through hole is a first distance; along the radial direction of the second through hole, the arcuate inner wall surface of the second arcuate side plate is The distance between the inner wall surface of the second through hole is a second distance; The second distance is equal to the first distance.

26. The electronic device according to any one of claims 1 to 25, characterized in that: The electronic device is a folding screen device.

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