Optical interconnect, chip package, computing system, and artificial intelligence device

Abstract

The present invention provides an optical interconnect, a chip package, a computing system, and an artificial intelligence device. The optical interconnect comprises: a first optical distribution tree, wherein the first optical distribution tree comprises an optical input port and multiple optical output ports, the first optical distribution tree is configured to distribute light from the optical input port to the multiple optical output ports, and the multiple optical output ports include a first optical output port and a second optical output port; and multiple optical transmission links, wherein each optical transmission link among the multiple optical transmission links comprises an optical transmitter, a second optical distribution tree, and multiple optical receivers, the second optical distribution tree is configured to form an optical information transmission channel between the optical transmitter and the multiple optical receivers, the multiple optical transmission links include a first optical transmission link and a second optical transmission link, the first optical transmission link is coupled to the first optical output port, and the second optical transmission link is coupled to the second optical output port.

Description

Optical interconnects, chip packaging, computing systems, artificial intelligence equipment

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on October 30, 2023, with application number 202311424121.4 and application name “Optical interconnects, chip packaging, computing systems, and artificial intelligence devices,” the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present invention relates to the field of chips, and more specifically, to an optical interconnect, a chip package, a computing system, and an artificial intelligence device. Background Art

[0003] Computations performed on electronic data encoded in analog or digital form in electrical signals are typically implemented using electronic computing hardware, such as on integrated circuits (e.g., processors, application-specific integrated circuits (ASICs), or systems on a chip (SoCs)), electronic circuit boards, or other electronic circuits. The use of optical signals in computing systems is subject to a number of limitations.

[0004] Summary of the Invention

[0005] The present invention provides a photonic optical interconnect, chip packaging, computing system, and artificial intelligence equipment to address the above-mentioned defects in the prior art.

[0006] In a first aspect, an embodiment of the present invention provides an optical interconnect, comprising a first optical distribution tree, the first optical distribution tree including an optical input port and multiple optical output ports, the first optical distribution tree being configured to distribute light from the optical input port to the multiple optical output ports, the multiple optical output ports including a first optical output port and a second optical output port; multiple optical transmission links, each of the multiple optical transmission links including an optical transmitter, a second optical distribution tree, and multiple optical receivers, the second optical distribution tree being configured to form an optical information transmission channel between the optical transmitter and the multiple optical receivers; the multiple optical transmission links including a first optical transmission link and a second optical transmission link, the first optical transmission link being coupled to the first optical output port, the second optical transmission link being coupled to the second optical output port, the optical transmitter of the first optical transmission link being configured to receive light from the first optical output port, and the optical transmitter of the second optical transmission link being configured to receive light from the second optical output port.

[0007] In a second aspect, an embodiment of the present invention provides a chip package, comprising the optical interconnect, and a first chip, comprising a plurality of clusters, each of the clusters comprising a plurality of cores; wherein, for each of the cores of the plurality of clusters, the optical interconnect is configured to provide an information transmission channel between the core and each of the plurality of clusters.

[0008] In a third aspect, an embodiment of the present invention further provides a chip package, comprising the optical interconnect and a chip; wherein the optical interconnect carries the chip.

[0009] In a fourth aspect, an embodiment of the present invention further provides an artificial intelligence device, comprising the chip package described in any one of the above.

[0010] In a fifth aspect, an embodiment of the present invention further provides a computing system comprising any one of the chip packages described above.

[0011] In a sixth aspect, an embodiment of the present invention further provides an information transmission method, the method using an optical interconnection to perform information transmission, wherein the optical interconnection comprises: a first optical distribution tree, the first optical distribution tree comprising an optical input port and a plurality of optical output ports, the first optical distribution tree being configured to distribute light from the optical input port to the plurality of optical output ports, the plurality of optical output ports comprising a first optical output port and a second optical output port; a plurality of optical transmission links, each of the plurality of optical transmission links comprising an optical transmitter, a second optical distribution tree, and a plurality of optical receivers, the second optical distribution tree being configured to form an optical information transmission channel between the optical transmitter and the plurality of optical receivers; the plurality of optical transmission links comprising a first optical transmission link and a second optical transmission link, the first optical transmission link being coupled to the first optical output port, the second optical transmission link being coupled to the second optical output port, the first optical transmission link being coupled to the second optical output port, The optical transmitter of the first optical transmission link is configured to receive light from the first optical output port, and the optical transmitter of the second optical transmission link is configured to receive light from the second optical output port; the information transmission method includes: providing light to the optical input port of the first optical distribution tree, so that the first optical distribution tree distributes the light from the optical input port to the multiple optical output ports, the multiple optical output ports including a first optical output port and a second optical output port; the optical transmitter of the first optical transmission link receives a first electrical signal, which carries information to be transmitted; the optical transmitter of the first optical transmission link receives light from the first optical transmission port and modulates the light from the first optical transmission port according to the first electrical signal to generate an optical signal for transmission; the second optical distribution tree of the first optical transmission link distributes the modulated optical signal to the corresponding multiple optical receivers.

[0012] According to the embodiments of the present invention, at least one of the following technical effects can be achieved: it can be achieved that the cores in the cluster can independently send information in the form of light through optical interconnects, and then propagate the information to multiple clusters in the form of light, which is suitable for simply controlling the core to send information to the cluster, or transmit information, and also has advantages such as simplified interface layout. In addition, the cluster can further transmit information to the core within the cluster. In some embodiments, in the information transmission channel from the core to the cluster, an optical interconnect can be used to provide an optical information transmission channel. After receiving the information from the optical interconnect, the cluster transmits the information to multiple cores in the cluster through an electrical signal, so as to transmit the information from one core to another core in the cluster via the cluster. In addition, the light can be distributed to a number of optical transmission links through the first optical distribution tree to optimize the input of light. Advantages also include delivering light to different suitable locations through the layout of the second optical distribution tree to adapt to, for example, the location distribution of different clusters. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] FIG1 is a side view of a chip package according to an embodiment of the present invention.

[0014] FIG2 is a schematic diagram of a first chip according to an embodiment of the present invention.

[0015] FIG3 is a schematic diagram of a cluster according to an embodiment of the present invention.

[0016] FIG4 is a schematic diagram of an optical transmission link according to an embodiment of the present invention.

[0017] FIG5 is a schematic diagram showing the connection relationship of components in the first optical distribution tree.

[0018] FIG6 is a schematic diagram showing the approximate positions and connection relationships of components in an optical transmission link. DETAILED DESCRIPTION

[0019] In order to facilitate understanding of the various aspects, features and advantages of the technical solution of the present invention, the present invention is described in detail below with reference to the accompanying drawings. It should be understood that the various embodiments described below are only for illustration and are not intended to limit the scope of protection of the present invention.

[0020] The terms used herein are for the purpose of describing specific embodiments and are not intended to limit the present invention. As used herein, the wording "a" is intended to include plural cases unless the context clearly indicates a single quantity. The terms "first," "second," or other similar expressions are used to distinguish objects and do not imply an order or sequence unless the order is clearly indicated. When referring to an inventor, this refers to the inventor of the present disclosure (this application).

[0021] The embodiments of the present invention do not impose any particular limitation on the order in which the steps are executed, as long as the purpose or function of the invention can be achieved. Some steps or orders may be executed in parallel, sequentially, or alternately.

[0022] When the number of a component or element is not specifically indicated in the following embodiments of the present disclosure, it means that the component or element can be one or more, or can be understood as at least one. "At least one" means one or more, and "more" means at least two.

[0023] In order to make the objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0024] FIG1 shows a chip package 1000 including a first chip 100 and an optical interconnect 300. Optionally, the chip package 1000 further includes a substrate 500. The first chip 100 is mounted on the optical interconnect 300, and the optical interconnect 300 can be used to support the first chip 100. The substrate 500 is used to support the optical interconnect 300 and the first chip 100. The first chip 100 can be electrically connected to the optical interconnect 300 via bonding layers 1041 and 1042. For example, the optical interconnect 300 communicates with the first chip 100 via the bonding layers 1041 and 1042, for example, receiving electrical signals from the first chip 100 via the bonding layer 1041 and sending electrical signals to the first chip 100 via the bonding layer 1042. For example, the first chip 100 can be, for example, a bare chip.

[0025] Illustratively, the chip package 1000 includes one or more chips, and the optical interconnect 300 can support at least one chip, for example, the first chip 100 .

[0026] In FIG. 2 , it is shown that the first chip 100 includes eight clusters, namely, clusters 112 a , 112 b , 112 c , 112 d , 112 e , 112 f , 112 g , and 112 h .

[0027] FIG3 shows one of the clusters 112 a, which includes multiple cores. FIG3 shows that cluster 112 a includes eight cores. The first chip 100 may include multiple clusters, each cluster including multiple cores. For each core in the multiple clusters, the optical interconnect is configured to provide an information transmission channel between the core and each of the multiple clusters. Exemplarily, each cluster includes an electrical signal receiving port, and the optical interconnect is configured to provide an information transmission channel between the core and the electrical signal receiving port of each of the multiple clusters.

[0028] In this example, first chip 100 includes eight clusters, each of which includes eight cores, meaning that first chip 100 has a total of 64 cores. A core can be, for example, a computing core (or processing core) that performs computing functions. For example, for core A01 in cluster 112a, optical interconnect 300 is configured to provide an information transmission channel between core A01 and each of the multiple clusters. Core A01 can transmit information to each of the eight clusters (i.e., clusters 112a through 112h), and can further transmit information to each core within the cluster through the clusters.

[0029] FIG4 illustrates an optical transmission link 330, which schematically illustrates the connection relationship between various components. In some embodiments, the optical interconnect 300 includes multiple optical transmission links 330, each corresponding to the multiple cores of the multiple clusters, such that each core in the multiple clusters is coupled to one of the optical transmission links 330. Each optical transmission link is configured to couple to one of the multiple cores in the multiple clusters and to each cluster in the multiple clusters, providing an information transmission channel between the core and each cluster in the multiple clusters (e.g., between the core and the electrical signal receiving port of each cluster). Exemplarily, the optical interconnect 300 includes 64 optical transmission links corresponding to the 64 cores of the first chip 100. Each core is coupled to one of the 64 optical transmission links, which is also coupled to each of the eight clusters, providing an information transmission channel between the core and each of the eight clusters. Thus, each core can independently transmit information in the form of light through the optical interconnect (the corresponding optical transmitter), and then transmit the information in the form of light to the cluster.

[0030] The embodiments of the present invention establish a light propagation channel or information propagation mode that matches the core to the cluster. In addition, unnecessary input ports and output ports can be reduced, and the waveguide number requirement for the core-core optical waveguide connection can be lowered.

[0031] In some embodiments, each of the optical transmission links 330 includes an optical transmitter 331, an optical distribution tree 332, and multiple optical receivers, such as optical receivers 333a, 333b, 333c, 333d, 333e, 333f, 333g, and 333h in FIG3 , wherein the optical distribution tree 332 is configured to form an optical information transmission channel between the optical transmitter and the multiple optical receivers (333a to 333h); and, for each of the optical transmission links 330, the optical transmitter is configured to receive a first electrical signal and generate an optical signal for transmission based on the first electrical signal, wherein the first electrical signal carries information to be transmitted from one of the cores; each of the multiple optical receivers is coupled to one of the multiple clusters, wherein each optical receiver is configured to generate a second electrical signal based on the received optical signal to provide information for transmission to the corresponding cluster. For example, taking the optical transmission link 330 corresponding to core A01 as an example, it includes an optical transmitter 331, an optical distribution tree 332 and 8 optical receivers (333a~333h). The optical distribution tree 332 is configured to form an optical information transmission channel between the optical transmitter 331 and the 8 optical receivers (333a~333h). The 8 optical receivers output the information carried by the second electrical signal. The second electrical signal of the optical receiver can be directly output to the corresponding cluster to transmit information, or it can be converted into an electrical signal (for example, converted into a third electrical signal) and then output to the corresponding cluster to transmit information.

[0032] In some embodiments, the optical transmitter generates an optical signal carrying the information by modulating the first electrical signal. For example, the optical transmitter 331 includes a modulator that can modulate an initial optical signal that does not carry information based on the first electrical signal. The initial optical signal can come from a waveguide 351. The modulated light, i.e., the optical signal carrying the information, is output to the optical distribution tree 332 via a waveguide 352. Exemplarily, light from a light source (not shown) can be coupled to the waveguide 351 via a grating coupler.

[0033] Exemplarily, the optical distribution tree 332 may include an optical splitter, and seven optical splitters are shown in FIG4 , namely, optical splitters 341 to 347. The optical splitter may include at least one of a Y-shaped beam splitter, a multi-mode interferometer (MMI), and a directional coupler. The optical splitter may distribute the input light. For example, the optical splitter 341 distributes the input light according to 50%:50% and then outputs it. The coupling (connection) between the optical splitters in the figure adopts a waveguide connection. For example, the optical splitter 341 is connected to the optical splitter 342 and the optical splitter 343 through the waveguide 353 and the waveguide 354, respectively. The optical splitters 344, 345, 346, and 347 are respectively connected to the optical receivers corresponding to the optical receivers through waveguides. For example, the optical splitter 344 is connected to the optical receivers 333a and 333b through the waveguide 355 and the waveguide 356, respectively. Exemplarily, optical splitters 341-347 each split the input light at a 50%:50 ratio, so that 1 / 8 (i.e., 12.5% ​​of the optical power) of the light input to optical distribution tree 332 via waveguide 352 is output to each optical receiver. For example, optical receiver 333a receives 1 / 8 (i.e., 12.5%) of the input light of optical distribution tree 332 via waveguide 353. For first chip 100, it includes 8 clusters, each cluster includes 8 cores, that is, first chip 100 has a total of 64 cores. Optical interconnect 300 includes 64 optical transmission links 330 corresponding to the 64 cores of first chip 100. Each core is coupled to one of the 64 optical transmission links 330. This optical transmission link 330 is also coupled to each of the 8 clusters to provide an information transmission channel between the core and each of the 8 clusters. Each cluster can include an electrical signal receiving port to receive electrical signals output by an optical receiver. For example, for optical transmission link 330 corresponding to core A01, cluster 112a corresponds to optical receiver 333a to receive information from core A01, and cluster 112b corresponds to optical receiver 333b to receive information from core A01. To enable each core to transmit information, each core can include an electrical signal transmitting port, i.e., each of the 64 cores corresponds to 64 electrical signal transmitting ports. To ensure that each cluster is configured to receive information from 64 cores, each cluster can include 64 electrical signal receiving ports (corresponding to the 64 cores), with a total of 64×8=512 electrical signal receiving ports for the eight clusters. For example, since there is no need to design optical interconnects for direct core-to-core interconnection (which would require 64×64 ports), the number of interfaces between the optical interconnect and the first chip can be reduced, particularly reducing the design requirements for the transmitting interface. At the same time, the requirements for core-to-cluster transmission and the requirements for cluster transmission to cores within the cluster are guaranteed.

[0034] In some embodiments, each of the plurality of clusters is configured to transmit information received from the optical interconnect to the plurality of cores in the cluster via electrical signals. Thus, the optical interconnect can be used to provide an optical information transmission channel for information transmission from the core to the cluster. After receiving the information from the optical interconnect, the cluster then transmits the information to the plurality of cores within the cluster via electrical signals, thereby transmitting the information from one core to another core in the cluster. Each core can independently transmit information in the form of light via the optical interconnect (the corresponding optical transmitter). This process involves both optical information transmission and electrical signal transmission within the cluster.

[0035] In some embodiments, each of the plurality of clusters is configured to receive a second electrical signal from the optical interconnect and propagate the information carried by the second electrical signal to the plurality of cores within the cluster via the electrical signal. For example, taking cluster 112a among the plurality of clusters as an example, cluster 112a receives a second electrical signal from the optical interconnect. Within cluster 112a, the information carried by the second electrical signal is propagated via the electrical signal to the plurality of cores, namely, cores A01 to A08 (a total of eight cores). Similarly, clusters 112b to 112h each receive a corresponding second electrical signal carrying information, and then, within each cluster, transmit the information to the plurality of cores within the cluster in the form of an electrical signal.

[0036] In some embodiments, to enable the cluster to receive and read the appropriate electrical signal, the second electrical signal can be converted into a third electrical signal, which is then output to the corresponding cluster. This conversion can be achieved by an output electrical signal conversion circuit, and the third electrical signal can be suitable for reception by the cluster. Exemplarily, the electrical signal conversion circuit can be provided in a signal conversion chip. Exemplarily, chip package 1000 can include a signal conversion chip, which includes the output electrical signal conversion circuit.

[0037] In some embodiments, the optical transmitter generates an optical signal carrying the information by modulation according to the first electrical signal.

[0038] In some embodiments, the plurality of cores of the plurality of clusters are configured to work collaboratively to solve execution problems of artificial intelligence workloads.

[0039] In some implementations, the plurality of cores of the plurality of clusters are configured to work collaboratively to process a tensor, and each of the cores is configured to work on a different portion of a given tensor.

[0040] In some embodiments, the plurality of clusters includes a first cluster, the first cluster including a first core and a second core, and the chip package is configured to: execute a first portion of a computing task at the first core to generate a first result; and execute a second portion of the computing task at the second core to generate a second result. For example, core A01 (denoted as the first core) in cluster 112a executes the first portion of the computing task, and core A02 (denoted as the second core) executes the second portion of the computing task executed at the second core.

[0041] In some embodiments, alternatively, some of the eight clusters in Figure 2 are located on the first chip, while others are located on the second chip, and optical interconnects are used to transmit information between the multiple cores and the clusters. For example, the multiple clusters are not distributed on the first chip, but are distributed on multiple chips, and the optical interconnects are used to carry the multiple chips and transmit information between the multiple cores and the clusters.

[0042] In an exemplary embodiment, a chip package includes: a plurality of chips, a plurality of clusters distributed across the plurality of chips, each chip including at least one of the plurality of clusters, each of the clusters including a plurality of cores; and an optical interconnect. For each core in the plurality of clusters, the optical interconnect is configured to provide an information transmission channel between the core and each of the plurality of clusters. Exemplarily, the optical interconnect supports the plurality of chips. Exemplarily, a substrate supports the plurality of chips and the optical interconnect.

[0043]

Optical Interconnects

[0044] The optical interconnect 300 may include a photonic integrated circuit, which may include an optical transmission link 330 . The optical interconnect 300 may be a photonic integrated circuit chip, for example, manufactured using a semiconductor process.

[0045] Optical interconnect 300 or optical transmission link 330 may include at least one photonic device selected from the group consisting of an optical coupling structure, a waveguide, an optoelectronic conversion unit, an electro-optical conversion unit, an optical splitter, and a light source. The number of various photonic devices can be configured as needed, and may be one or more. The optical transmitter of optical transmission link 330 may include an electro-optical conversion unit, and the optical receiver may include an optoelectronic conversion unit. The electro-optical conversion unit may, for example, include a modulator to convert an electrical signal into an optical signal. The optical coupling structure may, for example, be used to optically couple with a laser or optical fiber to input or output an optical signal into or from the optical interconnect 300. For example, optical fiber may be used to input or output optical signals. The optical coupling structure may include a grating coupler, an end-face coupler, or the like. Waveguides may, for example, be used to propagate optical signals, serving as channels for information transmission. The optoelectronic conversion unit may, for example, include a photodetector to convert an optical signal into an electrical signal. The photodetector may include, for example, a photodiode. Optical interconnect 300 may, for example, include a light source. Light generated by the light source may be coupled to the waveguide and modulated by an electrical signal.

[0046] In an exemplary embodiment, an artificial intelligence device is provided, comprising the chip package.

[0047] In an exemplary embodiment, a computing system is provided, including the chip package.

[0048] In an exemplary embodiment, an information transmission method is provided, comprising:

[0049] The optical interconnect receives a first electrical signal, the first electrical signal carrying information to be transmitted from a first core of a first cluster among the plurality of clusters;

[0050] The optical interconnect transmits the information via an optical transmission link, wherein the optical transmission link includes an optical transmitter, an optical distribution tree, and a plurality of optical receivers;

[0051] The transmitting of the information through the optical transmission link includes: the optical transmitter receiving a first electrical signal and generating an optical signal for transmission based on the first electrical signal; the optical distribution tree distributing light from the optical transmitter to a plurality of optical receivers; each of the plurality of optical receivers being coupled to one of the plurality of clusters; wherein each optical receiver generates a second electrical signal based on the received optical signal to provide information transmitted to the corresponding cluster.

[0052] The information transmission method can be implemented according to the chip package in the embodiment of the present invention, and can include corresponding functional methods (steps) that can be implemented by the chip package.

[0053] Figure 5 shows a first optical distribution tree 310. This first optical distribution tree 310 can be used to input light into at least two of the multiple optical transmission links to provide the optical transmission links with initial optical signals that can be modulated to generate optical signals carrying information. To distinguish them, the optical distribution tree in the optical transmission links is named "second optical distribution tree."

[0054] In FIG5 , a first optical distribution tree 310 includes an optical input port 301 , and distributes light from the optical input port 301 to a plurality of optical output ports 305a , 305b , 305c , 305d , 305e , 305f , 305g , and 305h ( 305a - h ).

[0055] First optical distribution tree 310 may include optical splitters. Figure 5 shows seven optical splitters, namely, optical splitters 311 to 317. The optical splitters may include at least one of a Y-splitter, an MMI, and a directional coupler. The optical splitters may distribute input light. For example, optical splitter 341 distributes the input light at a 50%:50 ratio and then outputs the light. The coupling (connection) between the optical splitters in the figure utilizes waveguide connections. For example, optical splitter 311 is connected to optical splitter 312 and optical splitter 313 via waveguide 323 and waveguide 324, respectively. Optical splitters 314, 315, 316, and 317 each have two optical output ports.

[0056] Exemplarily, the optical splitters 311 to 317 all distribute the input light in a 50%:50% ratio, so that 1 / 8 (i.e., 12.5% ​​optical power) of the light input to the first optical distribution tree 310 via the optical input port 301 is output to each optical output port (i.e., ports 305a to 305h). Taking the optical output port 305a as an example, it receives 1 / 8=12.5% ​​of the input light of the first optical distribution tree 310.

[0057] The multiple optical output ports of the first optical distribution tree 310 can be connected to multiple optical transmission links respectively. The optical output ports of the first optical distribution tree 310 are optically coupled to the optical transmitters of the corresponding optical transmission links to provide the optical transmitters with initial optical signals. The optical transmitters modulate the initial optical signals according to the electrical signals to generate optical signals for transmission.

[0058] In some embodiments, the first optical distribution tree may have another number of optical output ports, such as 16. For example, light from the optical input port may be evenly distributed to the 16 optical output ports. For example, the number of optical output ports may be 12, 20, or 32. Distribution may be proportional as needed and is not limited to even distribution.

[0059] Exemplarily, the multiple optical propagation links include a first optical propagation link and a second optical propagation link, the first optical propagation link is coupled to the first optical output port 305a, and the second optical propagation link is coupled to the second optical output port 305b, the optical transmitter of the first optical propagation link is configured to receive light from the first optical output port 305a, and the optical transmitter of the second optical propagation link is configured to receive light from the second optical output port 305b.

[0060] In some embodiments, a first optical distribution tree 310 may include a sufficient number of optical output ports (e.g., not less than the number of optical transmission links), each of the multiple optical transmission links may be coupled to an optical output port of the first optical distribution tree 310, and the first optical distribution tree 310 provides light (input of optical energy) for the multiple optical transmission links. For example, the first optical distribution tree 310 includes 16 optical output ports, and the number of the multiple optical transmission links is 16, which may be coupled one by one to the 16 optical output ports.

[0061] In some embodiments, multiple first optical distribution trees 310 can be used to provide a sufficient number of optical output ports, thereby providing light for multiple optical transmission links. For example, if one first optical distribution tree 310 includes 16 optical output ports, and the number of optical transmission links is 64, four first optical distribution trees 310 (each including 16 optical output ports) can be used, with each first optical distribution tree 310 coupled to 16 optical transmission links to provide optical input for them. The light input to the optical transmission link can be further modulated to carry information, for example, by an optical transmitter to generate an optical signal carrying the information, which is then transmitted within the optical transmission link.

[0062] Figure 6 illustrates the approximate location distribution and connection relationships of components in an optical transmission link 330. Optical transmission link 330 includes an optical transmitter 331, an optical distribution tree (which may be referred to as a second optical distribution tree to distinguish it from the first optical distribution tree), and multiple optical receivers, such as optical receivers 333a, 333b, 333c, 333d, 333e, 333f, 333g, and 333h. The optical distribution tree 332 is configured to form an optical information transmission channel between the optical transmitter and the multiple optical receivers (333a-333h). The optical distribution tree may include optical splitters. Figure 6 shows seven optical splitters, namely, optical splitters 341-347. The locations of optical receivers 333a-333h roughly correspond to the locations of multiple clusters (i.e., clusters 112a-112h).

[0063] Referring to FIG4 for a more intuitive connection relationship between the components in optical transmission link 330, in FIG6 , optical transmitter 331 can be connected to optical splitter 341 via a waveguide. Optical splitter 341 is connected to optical splitters 342 and 343 via waveguides, respectively. Optical splitter 342 is connected to optical splitter 344 and 345 via waveguides, respectively. Optical splitter 343 is connected to optical splitter 346 and 347 via waveguides. Optical splitter 344, 345, 346, and 347 are each connected to two optical receivers.

[0064] For example, taking the optical transmission link corresponding to core A01 as an example, it includes an optical transmitter, an optical distribution tree and 8 optical receivers. The optical distribution tree is configured to form an optical information transmission channel between the optical transmitter and the 8 optical receivers. The optical receiver generates a second electrical signal based on the received optical signal, and the 8 optical receivers output the information carried by the second electrical signal. The second electrical signal of the optical receiver can be directly output to the corresponding cluster to transmit information, or it can be converted into an electrical signal (for example, converted into a third electrical signal) and then output to the corresponding cluster to transmit information.

[0065] In the optical transmission direction of the optical transmission link (or optical distribution tree), the optical distribution tree 332 (second optical distribution tree) can sequentially include a first bend 601, a second bend 602, and a third bend 603. It also includes a first optical splitter (optical splitter 341 in Figure 6) located between the first bend 601 and the second bend 602, and a second optical splitter (optical splitter 343 in Figure 6) located after the third bend. The arrangement of the bends can effectively distribute light to optical receivers at specific locations. In addition, this arrangement is suitable for transmission to the location of a cluster.

[0066] In an exemplary embodiment, a method for transmitting information is provided, which can transmit information using the optical interconnection components of the present invention. The information transmission method includes:

[0067] providing light to the optical input port of the first optical distribution tree so that the first optical distribution tree distributes the light from the optical input port to the plurality of optical output ports, the plurality of optical output ports including a first optical output port and a second optical output port;

[0068] The optical transmitter of the first optical transmission link receives a first electrical signal, where the first electrical signal carries information to be transmitted;

[0069] The optical transmitter of the first optical transmission link receives light from the first optical transmission port and modulates the light from the first optical transmission port according to the first electrical signal to generate an optical signal for transmission;

[0070] The second optical distribution tree of the first optical transmission link distributes the modulated optical signal to the corresponding plurality of optical receivers.

[0071] In some embodiments, each of the optical receivers of the first optical transmission link generates a second electrical signal based on a received optical signal.

[0072] In some embodiments, the information to be transmitted carried by the first electrical signal comes from the first core of a first cluster among multiple clusters of a first chip; the multiple optical receivers correspond to the multiple clusters respectively; and each of the optical receivers generates a second electrical signal based on the received optical signal to provide information transmitted to the corresponding cluster.

[0073] Those skilled in the art should understand that what is disclosed above is merely an embodiment of the present invention, and certainly cannot be used to limit the scope of rights for which the present invention is requested for patent protection. Equivalent changes made based on the embodiment of the present invention still fall within the scope covered by the claims of the present invention.

Claims

1. An optical interconnect, comprising a first optical distribution tree, the first optical distribution tree comprising an optical input port and a plurality of optical output ports, the first optical distribution tree being configured to distribute light from the optical input port to the plurality of optical output ports, the plurality of optical output ports comprising a first optical output port and a second optical output port; a plurality of optical transmission links, each of the plurality of optical transmission links comprising an optical transmitter, a second optical distribution tree, and a plurality of optical receivers, wherein the second optical distribution tree is configured to form an optical information transmission channel between the optical transmitter and the plurality of optical receivers; The multiple optical propagation links include a first optical propagation link and a second optical propagation link, the first optical propagation link is coupled to the first optical output port, the second optical propagation link is coupled to the second optical output port, the optical transmitter of the first optical propagation link is configured to receive light from the first optical output port, and the optical transmitter of the second optical propagation link is configured to receive light from the second optical output port.

2. The optical interconnect as claimed in claim 1, wherein: The optical transmitter of the first optical transmission link is configured to modulate the light received from the first optical output port and send the modulated optical signal to the corresponding second optical distribution tree; The optical transmitter of the second optical transmission link is configured to modulate the light received from the second optical output port and send the modulated optical signal to the corresponding second optical distribution tree.

3. The optical interconnect as claimed in claim 2, wherein for each of the optical transmission links, the optical transmitter is configured to receive a first electrical signal and generate an optical signal for transmission according to the first electrical signal, wherein: The first electrical signal carries information to be transmitted, wherein each of the optical receivers is configured to generate a second electrical signal according to the received optical signal.

4. The optical interconnect as described in claim 3, in the optical transmission direction of the optical propagation link, the second optical distribution tree includes a first bend, a second bend and a third bend, and also includes a first splitter located between the first bend and the second bend, and a second splitter after the third bend.

5. The optical interconnect as claimed in claim 3, wherein: The optical receiver includes a photodiode to generate the second electrical signal according to the received optical signal.

6. The optical interconnection according to any one of claims 1 to 3, wherein: The first optical distribution tree includes a plurality of optical splitters.

7. The optical interconnect of claim 6, wherein: The optical splitter includes at least one of a Y-shaped beam splitter, a multimode interferometer and a directional coupler.

8. The optical interconnect as claimed in any one of claims 1 to 3, wherein: The second optical distribution tree includes a plurality of optical splitters.

9. The optical interconnect of claim 8, wherein: The optical splitter includes at least one of a Y-shaped beam splitter, a multimode interferometer and a directional coupler.

10. The optical interconnect according to any one of claims 1 to 3, wherein: The optical interconnect is a photonic integrated circuit chip.

11. A chip package, comprising the optical interconnection component according to any one of claims 1 to 10, and A first chip includes a plurality of clusters, each of the clusters includes a plurality of cores; in, For each of the cores of the plurality of clusters, the optical interconnect is configured to provide an information transmission channel between the core and each of the plurality of clusters.

12. The chip package according to claim 11, wherein: Each of the clusters includes an electrical signal receiving port; The plurality of optical transmission links of the optical interconnect respectively correspond to the plurality of cores of the plurality of clusters, such that each core in the plurality of clusters is coupled to one of the optical transmission links; Each of the optical transmission links is configured to be coupled to a plurality of cores in the plurality of clusters. a core and coupled to each of the plurality of clusters to provide an information transmission channel between the core and the electrical signal receiving port of each of the plurality of clusters; For each of the optical transmission links, the optical transmitter is configured to receive a first electrical signal and generate an optical signal for transmission based on the first electrical signal, wherein the first electrical signal carries information to be transmitted from one of the cores, and each of the plurality of optical receivers is coupled to one of the plurality of clusters, wherein each of the optical receivers is configured to generate a second electrical signal based on the received optical signal to provide information to be transmitted to the corresponding cluster.

13. The chip package according to claim 12, wherein: The optical interconnect carries the first chip.

14. A chip package comprising the optical interconnection component according to claim 1, and chip; in, The optical interconnect carries the chip.

15. An artificial intelligence device, comprising the chip package as claimed in any one of claims 11 to 14.

16. A computing system comprising the chip package according to any one of claims 11 to 14.

17. A method for information transmission, the method using an optical interconnection to perform information transmission, wherein the optical interconnection comprises: a first optical distribution tree, the first optical distribution tree comprising an optical input port and a plurality of optical output ports, the first optical distribution tree being configured to distribute light from the optical input port to the plurality of optical output ports, the plurality of optical output ports comprising a first optical output port and a second optical output port; a plurality of optical transmission links, each of the plurality of optical transmission links comprising an optical transmitter, a second optical distribution tree, and a plurality of optical receivers, wherein the second optical distribution tree is configured to form an optical information transmission channel between the optical transmitter and the plurality of optical receivers; The plurality of optical transmission links include a first optical transmission link and a second optical transmission link, wherein the first optical transmission link is coupled to the first optical output port, and the second optical transmission link is coupled to the first optical output port. two optical output ports, the optical transmitter of the first optical transmission link is configured to receive light from the first optical output port, and the optical transmitter of the second optical transmission link is configured to receive light from the second optical output port; The information transmission method comprises: providing light to the optical input port of the first optical distribution tree so that the first optical distribution tree distributes the light from the optical input port to the plurality of optical output ports, the plurality of optical output ports including a first optical output port and a second optical output port; The optical transmitter of the first optical transmission link receives a first electrical signal, the first electrical signal carrying information to be transmitted; The optical transmitter of the first optical transmission link receives light from the first optical transmission port, and modulates the light from the first optical transmission port according to the first electrical signal to generate an optical signal for transmission; The second optical distribution tree of the first optical transmission link distributes the modulated optical signal to the corresponding plurality of optical receivers.

18. The information transmission method according to claim 17, wherein: Each of the optical receivers of the first optical transmission link generates a second electrical signal according to a received optical signal.

19. The information transmission method according to claim 17, wherein: The information to be transmitted carried by the first electrical signal comes from a first core of a first cluster among multiple clusters of a first chip; The plurality of optical receivers correspond to the plurality of clusters respectively; Each of the optical receivers generates a second electrical signal according to the received optical signal to provide information to be transmitted to the corresponding cluster.

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