Device having a substrate, method for providing a device having a substrate, and method for operating a device having a substrate

Abstract

The invention relates to a device having a substrate, at least one first integrated circuit arranged on the substrate, and a second integrated circuit arranged on the substrate, wherein the first integrated circuit and the second integrated circuit at least partly have the same function and / or structure, and the second integrated circuit is arranged on the substrate differently than the first integrated circuit.

Description

[0001] Description

[0002] title

[0003] Device comprising a substrate, method for providing a device comprising a substrate and method for operating a device comprising a substrate

[0004] State of the art

[0005] The disclosure relates to a device comprising a substrate.

[0006] The disclosure further relates to a method for providing a device comprising a substrate.

[0007] The disclosure further relates to a method for operating a device comprising a substrate.

[0008] Disclosure of the invention

[0009] Exemplary embodiments relate to a device comprising a substrate, at least one first integrated circuit arranged on the substrate, and a second integrated circuit arranged on the substrate, wherein the first integrated circuit and the second integrated circuit at least partially have the same function and / or structure, wherein the second integrated circuit is arranged differently on the substrate than the first integrated circuit. In further exemplary embodiments, this enables an increase in the robustness of the device, for example with regard to the execution of functions, e.g., for data processing.

[0010] In further exemplary embodiments, the first integrated circuit has the same structure as the second integrated circuit. For example, the first and second circuits may be identical parts or components that have a largely identical structure and / or functionality.

[0011] In further exemplary embodiments, it is provided that the first integrated circuit and the second integrated circuit are designed to process the same input data, for example simultaneously or at least partially overlapping in time, for example in each case in the same way or by means of at least one identical functional unit.

[0012] In further exemplary embodiments, the device comprises a comparator configured to compare output data from the first integrated circuit and the second integrated circuit. In further exemplary embodiments, this makes it possible to detect, for example, faulty data processing by at least one of the integrated circuits, which can be used, for example, for a redundancy-based data processing concept.

[0013] In further exemplary embodiments, it is provided that the first integrated circuit and the second integrated circuit are each designed as a chip, for example a chiplet, wherein, for example, the first integrated circuit and the second integrated circuit are designed or usable as redundant chiplets, for example for dual computing, for example for redundancy-based dual computing.

[0014] In further exemplary embodiments, it is provided that the second integrated circuit has a different, for example geometric, angular orientation than the first integrated circuit.

[0015] In further exemplary embodiments, it is provided that the second integrated circuit is arranged on the substrate rotated by a non-vanishing first angle relative to the first integrated circuit, for example with respect to a first axis of rotation which is, for example, orthogonal to a first surface of the substrate on which the first integrated circuit and the second integrated circuit are arranged. In further exemplary embodiments, it is provided that the second integrated circuit is arranged on the substrate rotated by a non-vanishing second angle relative to the first integrated circuit with respect to a second axis of rotation which is not orthogonal to one or the first surface of the substrate, wherein, for example, the second axis of rotation is parallel to the first surface or wherein, for example, the second axis of rotation encloses an acute angle with the first surface.

[0016] In further exemplary embodiments, it is provided that the first integrated circuit and the second integrated circuit are each arranged on different surfaces of the substrate.

[0017] In further exemplary embodiments, the first integrated circuit and the second integrated circuit can also be arranged stacked on top of one another, for example, as so-called "stacked dies".

[0018] In further exemplary embodiments it is provided that a) the first angle is a, for example, integer, multiple of 45°, for example 90°, and / or that b) the second angle is a, for example, integer, multiple of 45°, for example 90°.

[0019] Further exemplary embodiments relate to a product, for example a control unit, for example for a motor vehicle, comprising at least one device according to the embodiments.

[0020] Further exemplary embodiments relate to a vehicle, for example a motor vehicle, comprising at least one device according to the embodiments and / or at least one product, for example a control unit, according to the embodiments.

[0021] Further exemplary embodiments relate to a method for providing a device comprising a substrate, at least a first integrated circuit arranged on the substrate and a second integrated circuit arranged on the substrate, wherein the first integrated circuit and the second integrated circuit at least partially have the same function and / or structure, for example providing a device according to the embodiments, the method comprising: providing the substrate, arranging the first integrated circuit on the substrate, arranging the second integrated circuit on the substrate such that the second integrated circuit is arranged differently on the substrate than the first integrated circuit.

[0022] In further exemplary embodiments, it is provided that the arrangement is carried out such that the second integrated circuit has a different angular orientation than the first integrated circuit.

[0023] Further exemplary embodiments relate to a method for operating a device comprising a substrate, at least a first integrated circuit arranged on the substrate and a second integrated circuit arranged on the substrate, wherein the first integrated circuit and the second integrated circuit at least partially have the same function and / or structure, wherein the second integrated circuit is arranged differently on the substrate than the first integrated circuit, for example of a device according to the embodiments, wherein the method comprises: processing the same input data, for example simultaneously or at least partially overlapping in time, by means of the first integrated circuit and the second integrated circuit, for example in each case in the same way orby means of at least one identical functional unit, and, optionally, evaluating, for example comparing, output data of the first integrated circuit and the second integrated circuit.

[0024] Further exemplary embodiments relate to a use of the device according to the embodiments and / or the product according to the embodiments and / or the vehicle according to the embodiments and / or the method according to the embodiments for at least one of the following elements: a) reducing an influence of electromagnetic radiation, for example electromagnetic interference, for example on a function of the device, b) increasing a robustness of the device, for example against common mode interference, for example common mode interference, c) increasing, for example functional, security, for example safety, with regard to functions that can be executed by means of the device, d) enabling dual computing, for example redundancy-based dual computing, by means of a device having a plurality of chips, for example chiplets.

[0025] Further features, possible applications, and advantages of the invention will become apparent from the following description of exemplary embodiments of the invention, which are illustrated in the figures of the drawing. All described or illustrated features, individually or in any combination, constitute the subject matter of the invention, regardless of their summary in the claims or their references, as well as regardless of their wording or representation in the description or in the drawing.

[0026] The drawing shows:

[0027] Fig. 1 schematically shows a simplified plan view according to exemplary embodiments,

[0028] Fig. 2 schematically shows a simplified plan view according to exemplary embodiments,

[0029] Fig. 3 schematically shows a simplified side view according to exemplary embodiments,

[0030] Fig. 4 schematically shows a simplified side view according to exemplary embodiments,

[0031] Fig. 5 schematically shows a simplified flow diagram according to exemplary embodiments,

[0032] Fig. 6 schematically shows a simplified plan view according to exemplary embodiments,

[0033] Fig. 7 schematically shows a simplified block diagram according to exemplary embodiments, Fig. 8 schematically shows a simplified block diagram according to exemplary embodiments,

[0034] Fig. 9 schematically shows a simplified flow diagram according to exemplary embodiments,

[0035] Fig. 10 schematically shows a simplified flow diagram according to exemplary embodiments,

[0036] Fig. 11 schematically illustrates aspects of uses according to exemplary embodiments.

[0037] Example embodiments, Fig. 1 , relate to a device 100 comprising a substrate 110, at least a first integrated circuit 120-1 arranged on the substrate 110 and a second integrated circuit 120-2 arranged on the substrate 110, wherein the first integrated circuit 120-1 and the second integrated circuit 120-2 at least partially have the same function and / or structure, wherein the second integrated circuit 120-2 is arranged differently on the substrate 110 than the first integrated circuit 120-1. In further example embodiments, this enables an increase in the robustness of the device 100, for example with regard to the execution of functions, e.g. for processing data.

[0038] In further exemplary embodiments, it is provided that the first integrated circuit 120-1 has the same structure as the second integrated circuit 120-2. For example, the first and second circuits 120-1, 120-2 may be identical parts or components that have a predominantly identical structure and / or functionality.

[0039] In further exemplary embodiments, it is provided that the first integrated circuit 120-1 and the second integrated circuit 120-2 are designed to process the same input data, for example simultaneously or at least partially overlapping in time, for example in each case in the same way or by means of at least one identical functional unit (not shown).

[0040] In further exemplary embodiments, Fig. 1 , it is provided that the device 100 has a comparator 130, which is designed to compare output data of the first integrated circuit 120-1 and the second integrated circuit 120-2 with one another. In further exemplary embodiments, this makes it possible, for example, to detect faulty processing of data by at least one of the integrated circuits, which can be used, for example, for a redundancy-based data processing concept.

[0041] In further exemplary embodiments, Fig. 1 , it is provided that the first integrated circuit 120-1 and the second integrated circuit 120-2 are each designed as a chip, for example a chiplet, wherein, for example, the first integrated circuit 120-1 and the second integrated circuit 120-2 are designed or usable as redundant chiplets, e.g. for dual computing, e.g. for redundancy-based dual computing. Optionally, in further exemplary embodiments, at least one data connection DV can be provided, e.g. on the substrate 110, between the chiplets 120-1, 120-2.

[0042] In further exemplary embodiments, Fig. 1 , it is provided that the second integrated circuit 120-2 has a different angular orientation than the first integrated circuit 120-1 , cf. the angle a-1 between the respective reference axes, for example longitudinal axes, 120-1 -LA, 120-2-LA.

[0043] In further exemplary embodiments, Fig. 1 , it is provided that the second integrated circuit 120-2 is arranged on the substrate 110 rotated relative to the first integrated circuit 120-1 by a or the non-vanishing first angle a-1, for example with respect to a first axis of rotation DA-1, which is, for example, orthogonal to a first surface 112-1 of the substrate 110 on which the first integrated circuit 120-1 and the second integrated circuit 120-2 are arranged.

[0044] Fig. 2 shows an example of a configuration according to further exemplary

[0045] Embodiments. A device 100a is depicted with a substrate 110 on which the two chiplets 120-1, 120-2 are arranged, for example, orthogonally to one another with respect to their reference axes (see Fig. 1), whereby the first angle a-1 is thus 90°.

[0046] In further exemplary embodiments, Fig. 3, it is provided that the second integrated circuit 120-2 is arranged on the substrate 110' rotated relative to the first integrated circuit 120-1 by a non-zero second angle a-2 with respect to a second axis of rotation DA-2, which is not orthogonal to one or the first surface 112-1 of the substrate 110', wherein, for example, the second axis of rotation DA-2 is parallel to the first surface 112-1 (see Fig. 3) or wherein, for example, the second axis of rotation DA-2 encloses an acute angle with the first surface 112-1 (not shown).

[0047] In further exemplary embodiments, Fig. 4, it is provided that the first integrated circuit 120-1 and the second integrated circuit 120-2 are each arranged on different surfaces 112-1, 112-2 of the substrate 110". Optionally, a data connection DV can again be provided between the integrated circuits 120-1, 120-2, which can be arranged, for example, on corresponding surfaces of the substrate 110" and / or in an interior of the substrate 110".

[0048] In further exemplary embodiments, Fig. 1, 2, 3, 4 it is provided that a) the first angle a-1 is a, for example, integer, multiple of 45°, for example 90°, and / or that b) the second angle a-2 is a, for example, integer, multiple of 45°, for example 90°.

[0049] Fig. 5 schematically shows a simplified flow diagram according to exemplary embodiments, which illustrates exemplary functional aspects of the device according to the embodiments. Element E1 symbolizes input data that is fed to two chiplets E2, E3 arranged on the same substrate, for example for redundant processing by the two chiplets E2, E3. Element E4 symbolizes a comparator device (e.g. similar to component 130 according to Fig. 1) for comparing output data of the two chiplets E2, E3, as obtained, for example, when the two chiplets E2, E3 process the same input data E1. Element E5 symbolizes a result of the processing, e.g. the output data, and element E6 symbolizes an error that can be determined by means of the comparator device E4, for example based on differing output data of the chiplets E2, E3 when the same input data E1 is processed in the same way.For example, such an error can occur when a disturbance occurs, e.g. in the form of electromagnetic waves radiated onto the device.

[0050] Due to the different arrangement (e.g. different angular orientation) of both chiplets E2, E3 according to the principle according to the embodiments, it can be achieved, for example in the case of common-mode interference, e.g. common-mode interference, in further exemplary embodiments that these interferences have different effects on the two chiplets E2, E3, so that, for example, an error E6 can be detected by means of the comparator E5.

[0051] In contrast, in conventional approaches with identically arranged components, it may happen that the common-mode interference influences the identically arranged components in a comparable manner, so that no different, but for example identical, output data are determined, whereby such an error is not detectable in the conventional approaches.

[0052] In contrast, the principle according to the embodiments in further exemplary embodiments of the device has the effect that the plurality of chiplets or their functional unit(s) are not detected and influenced in the same way by the said disturbances, so that despite the same input data E1 and, for example, the same processing of the same input data, an error E6 can be determined based on different output data obtained due to the disturbance.

[0053] Fig. 6 schematically shows a simplified top view of a device according to exemplary embodiments. Element E10 symbolizes a substrate on which, in the present case, four integrated circuits, e.g., chiplets, E11, E12, E13, E14 are arranged, which can be connected to one another, e.g., by means of optional data connections E15, E16, E17. Elements E18, E19 symbolize interference, e.g., resulting from electromagnetic waves radiated onto substrate E10 or the device comprising substrate 110. It can be seen from Fig. 6 that interference E18, E19 is incident on the device from different directions.

[0054] Due to the exemplary relative arrangement of the chiplets E11, E13 to one another, in the present case, for example, with an angular alignment of their reference axes of, for example, 90° to one another, the chiplets E11, E13 are influenced by both the disturbance E18 and the disturbance E19 in different ways, which, for example, enables the detection of errors if, for example, both chiplets E11, E13 are functionally and / or structurally similar and, for example, process the same input data at least in an overlapping manner.

[0055] Similar applies to further exemplary embodiments for the other two chiplets E12, E13.

[0056] Further exemplary embodiments, Fig. 7, relate to a product, for example a control unit, 1000 for example for a motor vehicle 10 (Fig. 8), comprising at least one device 100 (Fig. 7) according to the embodiments.

[0057] Further exemplary embodiments, Fig. 8, relate to a vehicle, for example a motor vehicle, 10 comprising at least one device according to the embodiments and / or at least one product, for example a control unit, 1000 according to the embodiments.

[0058] Further exemplary embodiments, Fig. 9, relate to a method for providing a device 100 (Fig. 1) comprising a substrate 110, at least a first integrated circuit 120-1 arranged on the substrate 110 and a second integrated circuit 120-2 arranged on the substrate 110, wherein the first integrated circuit and the second integrated circuit at least partially have a similar function and / or structure, for example providing a device according to the embodiments, wherein the method comprises: providing 200 the substrate 110, arranging 202 the first integrated circuit 120-1 on the substrate 110, arranging 204 the second integrated circuit 120-2 on the substrate 110 such that the second integrated circuit 120-1 is arranged differently on the substrate 110 than the first integrated circuit 120-1, e.g.in a different angular orientation relative to a respective reference axis.

[0059] In further exemplary embodiments, Fig. 9, it is thus provided, for example, that the arrangement 204 is carried out 204a such that the second integrated circuit 120-2 has a different angular orientation than the first integrated circuit 120-1. In further exemplary embodiments, the order of the aspects 200, 202, 204 can also be provided differently than described above by way of example with reference to Fig. 9.

[0060] Further exemplary embodiments, Fig. 10, relate to a method for operating a device 100 comprising a substrate 110, at least a first integrated circuit 120-1 arranged on the substrate 110 and a second integrated circuit 120-2 arranged on the substrate 110, wherein the first integrated circuit and the second integrated circuit at least partially have the same function and / or structure, wherein the second integrated circuit is arranged differently on the substrate than the first integrated circuit, for example of a device according to the embodiments, wherein the method comprises: processing 250 the same input data ED, for example simultaneously or at least partially overlapping in time, by means of the first integrated circuit 120-1 and the second integrated circuit 120-2, for example in each case in the same way or by means of at least one similar oridentical functional unit, and, optionally, evaluating 252, for example comparing, output data AD-1, AD-2 of the first integrated circuit 120-1 and the second integrated circuit 120-2.

[0061] Further exemplary embodiments, Fig. 11 , relate to a use 300 of the device according to the embodiments and / or of the product 1000 according to the embodiments and / or of the vehicle 10 according to the embodiments and / or of the method according to the embodiments for at least one of the following elements: a) reducing 301 an influence of electromagnetic radiation, for example electromagnetic interference, for example on a function of the device, b) increasing 302 a robustness of the device, for example against common-mode interference, for example common-mode interference, c) increasing 303 a, for example functional, security, for example safety, with regard to functions that can be executed by means of the device, d) enabling 304 dual computing, for example redundancy-based dual computing, by means of a device having a plurality of chips, for example chiplets.

[0062] The principle according to the embodiments enables, for example, an increase in the robustness of chiplet-based devices or

[0063] Architectures, for example for control units 1000, for example against common-mode errors, and can thus lead to an increase in safety

[0064] (functional safety) and / or integrity, e.g. data integrity.

Claims

Claims 1. Device (100; 100a; 100b; 100c) comprising a substrate (110), at least a first integrated circuit (120-1) arranged on the substrate (110) and a second integrated circuit (120-2) arranged on the substrate (110), wherein the first integrated circuit (120-1) and the second integrated circuit (120-2) have at least partially the same function and / or structure, wherein the second integrated circuit (120-1) is arranged differently on the substrate (110) than the first integrated circuit (120-1).

2. The device (100; 100a; 100b; 100c) according to claim 1, wherein the first integrated circuit (120-1) has the same structure as the second integrated circuit (120-2).

3. Device (100; 100a; 100b; 100c) according to at least one of the preceding claims, wherein the first integrated circuit (120-1) and the second integrated circuit (120-2) are designed to process the same input data (ED), for example simultaneously or at least partially overlapping in time, for example in each case in the same way or by means of at least one identical functional unit.

4. Device (100; 100a; 100b; 100c) according to claim 3, comprising a comparator device (130) which is designed to compare output data (AD-1, AD-2) of the first integrated circuit (120-1) and the second integrated circuit (120-2) with one another.

5. Device (100; 100a; 100b; 100c) according to at least one of the preceding claims, wherein the first integrated circuit (120-1) and the second integrated circuit (120-2) are each designed as a chip, for example a chiplet, wherein for example the first integrated circuit (120-1) and the second integrated circuit (120-2) are designed as redundant chiplets, eg for dual computing, eg for redundancy-based dual computing, wherein, for example, the first integrated circuit (120-1) and the second integrated circuit (120-2) are arranged stacked on top of one another.

6. Device (100; 100a; 100b; 100c) according to at least one of the preceding claims, wherein the second integrated circuit (120-1) has a different angular orientation than the first integrated circuit (120-2).

7. Device (100; 100a; 100b; 100c) according to claim 6, wherein the second integrated circuit (120-1) is arranged on the substrate rotated relative to the first integrated circuit (120-2) by a non-zero first angle (α-1), for example with respect to a first axis of rotation (DA-1) which is orthogonal to a first surface (112-1) of the substrate (110) on which the first integrated circuit (120-1) and the second integrated circuit (120-2) are arranged.

8. Device (100; 100a; 100b; 100c) according to claim 6 or 7, wherein the second integrated circuit (120-1) is arranged on the substrate (110) rotated relative to the first integrated circuit (120-2) by a non-zero second angle (α-2) with respect to a second axis of rotation (DA-2) which is not orthogonal to one or the first surface (112-1) of the substrate (110), wherein, for example, the second axis of rotation (DA-2) is parallel to the first surface (112-1) or wherein, for example, the second axis of rotation (DA-2) encloses an acute angle with the first surface (112-1).

9. The device (100; 100a; 100b; 100c) of claim 8, wherein the first integrated circuit (120-1) and the second integrated circuit (120-2) are each arranged on different surfaces (112-1, 112-2) of the substrate (110).

10. Device (100; 100a; 100b; 100c) according to at least one of claims 7 to 9, wherein a) the first angle (a-1) is a, for example, integer, multiple of 45°, for example 90°, and / or wherein b) the second angle (a-2) is a, for example, integer, multiple of 45°, for example 90°.

11. Product, for example a control unit (1000), for example for a motor vehicle (10), comprising at least one device (100; 100a; 100b; 100c) according to at least one of the preceding claims.

12. Vehicle, for example a motor vehicle, (10), comprising at least one device (100; 100a; 100b; 100c) according to at least one of claims 1 to 10 and / or at least one product, for example a control unit, (1000) according to claim 11.

13. A method for providing a device (100; 100a; 100b; 100c) comprising a substrate (110), at least a first integrated circuit (120-1) arranged on the substrate (110), and a second integrated circuit (120-2) arranged on the substrate (110), wherein the first integrated circuit (120-1) and the second integrated circuit (120-2) have at least partially the same function and / or structure, the method comprising: providing (200) the substrate (110), arranging (202) the first integrated circuit (120-1) on the substrate (110), arranging (204) the second integrated circuit (120-2) on the substrate (110 such that the second integrated circuit (120-1) is arranged differently on the substrate (110) than the first integrated circuit (120-1).

14. The method of claim 13, wherein the arranging (204) is carried out (204a) such that the second integrated circuit (120-1) has a different angular orientation than the first integrated circuit (120-2).

15. A method for operating a device (100; 100a; 100b; 100c) comprising a substrate (110), at least a first integrated circuit (120-1) arranged on the substrate (110) and a second integrated circuit (120-2) arranged on the substrate (110), wherein the first integrated circuit (120-1) and the second integrated circuit (120-2) at least partially have the same function and / or structure, wherein the second integrated circuit (120-1) is arranged differently on the substrate (110) than the first integrated circuit (120-1), the method comprising: processing (250) the same input data (ED), for example simultaneously or at least partially overlapping in time, by means of the first integrated circuit (120-1) and the second integrated circuit (120-2), for example in each case in the same way or by means of at least one identical functional unit, and, optionally, evaluating (252), for example comparing (302a), output data (AD-1, AD-2) of the first integrated circuit (120-1) and the second integrated circuit (120-2).

16. Use (300) of the device (100; 100a; 100b; 100c) according to at least one of claims 1 to 10 and / or of the product (1000) according to claim 11 and / or of the vehicle (10) according to claim 12 and / or of the method according to at least one of claims 13 to 15 for at least one of the following elements: a) reducing (301) an influence of electromagnetic radiation, for example electromagnetic interference, for example on a function of the device (100; 100a; 100b; 100c), b) increasing (302) a robustness of the device (100; 100a; 100b; 100c), for example against common mode interference, for example common mode interference, c) increasing (303) for example functional safety, for example safety, with regard to the device (100; 100a; 100b;100c) executable functions, d) enabling (304) dual computing, for example redundancy-based dual computing, by means of a device (100; 100a; 100b; 100c) having a plurality of chips, for example chiplets;

Images