Electronic device including partition wall

Abstract

An electronic device according to various embodiments of the present disclosure may include: a frame including a first seating surface and a second seating surface; a partition wall disposed to extend in a first direction on the boundary between the first seating surface and the second seating surface, and spaced apart from the first seating surface and the second seating surface in a second direction perpendicular to the first seating surface and the second seating surface; and a heat dissipation member disposed on the first seating surface, and passing between the partition wall and the frame to extend onto the second seating surface.

Description

Electronic devices containing bulkheads

[0001] The present disclosure relates to an electronic device, and more particularly, to an electronic device including a bulkhead.

[0002] An electronic device may include a frame that supports components within the electronic device. The frame may include a partition that secures each component placed on the frame and prevents collisions between the plurality of components.

[0003] Electronic devices may include components that generate heat during operation, such as an application processor (AP), a graphic processing unit (GPU), a neural processing unit (NPU), or a battery. The heat generated by these components may cause a temperature rise in the electronic device, which may result in a decrease in performance, a shortened lifespan, malfunction, and / or damage to components of the electronic device.

[0004] The electronic device may include a heat dissipation member configured to disperse heat generated from the above-described components over a wide area of ​​the frame and dissipate it to the exterior of the electronic device. The heat dissipation member may be positioned between the above-described heat-generating components and the frame, and may be in contact with the above-described heat-generating components and the frame, respectively.

[0005] When placing a heat dissipation member in an electronic device, the area of ​​the heat dissipation member may be limited due to a partition wall located between each component. For example, if a partition wall exists around the area where the circuit board assembly of the frame is placed, the area of ​​the heat dissipation member placed between the circuit board assembly and the frame may be blocked by the partition wall, thereby limiting the improvement in the heat dissipation performance of the electronic device.

[0006] According to various embodiments of the present invention, an electronic device having a partition structure that facilitates expansion of the area of ​​a heat dissipation member can be provided.

[0007] An electronic device according to various embodiments of the present disclosure may include a frame including a first mounting surface and a second mounting surface, a partition wall disposed to extend in a first direction on a boundary between the first mounting surface and the second mounting surface, and spaced apart from the first mounting surface and the second mounting surface in a second direction that is perpendicular to the first mounting surface and the second mounting surface, and a heat dissipation member disposed on the first mounting surface and extending onto the second mounting surface through a gap between the partition wall and the frame.

[0008] A circuit board assembly according to various embodiments of the present invention may include a partition wall disposed at one end of the circuit board assembly and including a substrate joint portion coupled to the one end.

[0009] According to various embodiments of the present disclosure, an electronic device can be provided in which a gap is formed between a bulkhead and a frame and a heat dissipation member extends through the gap, thereby improving the area of ​​the heat dissipation member and thus the heat dissipation performance.

[0010] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0011] FIGS. 2A, 2B, 2C, 2D, and 2E are diagrams illustrating electronic devices according to various embodiments of the present disclosure.

[0012] FIG. 3A is an internal plan view showing an electronic device according to various embodiments of the present invention.

[0013] FIG. 3b is a plan view showing a frame of an electronic device according to various embodiments of the present invention.

[0014] FIG. 3c is an exploded perspective view of an electronic device according to various embodiments of the present invention.

[0015] FIG. 3D is a cross-sectional view of an electronic device according to various embodiments of the present invention.

[0016] FIG. 4A is a perspective view showing a bulkhead of an electronic device according to various embodiments of the present invention.

[0017] FIGS. 4b and 4c are perspective views showing the combination of a bulkhead and a frame of an electronic device according to various embodiments of the present invention.

[0018] FIG. 5A is a perspective view showing a heat dissipation member and a bulkhead of an electronic device according to various embodiments.

[0019] FIG. 5b is an enlarged plan view showing a heat dissipation member and a bulkhead of an electronic device according to various embodiments.

[0020] FIG. 5c is a cross-sectional view of an electronic device according to various embodiments.

[0021] FIG. 6A is a perspective view showing a circuit board assembly and a bulkhead of an electronic device according to various embodiments.

[0022] FIG. 6b is a cross-sectional view of an electronic device according to various embodiments.

[0023] Figure 6c is a schematic diagram showing the operation of combining a circuit board assembly and a bulkhead.

[0024] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0025] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0026] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0027] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0028] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0029] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0030] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0031] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0032] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0033] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0034] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0035] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0036] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0037] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0038] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0039] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0040] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0041] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0042] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197). According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0043] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0044] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0045] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0046] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0047] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0048] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0049] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0050] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0051] FIGS. 2A, 2B, 2C, 2D, and 2E are diagrams illustrating an electronic device (200) according to various embodiments of the present disclosure.

[0052] FIG. 2A is a perspective view of an electronic device in a flat state (or unfolded state) according to various embodiments of the present disclosure. FIG. 2B is a plan view illustrating a front side of an electronic device in a flat state according to one embodiment of the present disclosure. FIG. 2C is a plan view illustrating a rear side of an electronic device in a unfolded state according to one embodiment of the present disclosure. FIG. 2D is a perspective view of an electronic device in a folded state according to one embodiment of the present disclosure. FIG. 2E is a perspective view of an electronic device in an intermediate state according to one embodiment of the present disclosure.

[0053] Referring to FIGS. 2A to 2E, the electronic device (200) may include first and second housings (210, 220) (e.g., a foldable housing structure) that are foldably coupled to each other based on a hinge device (e.g., the hinge device (240) of FIG. 2B). In one embodiment, the hinge device (e.g., the hinge device (240) of FIG. 2B) may be arranged in the X-axis direction or the Y-axis direction. In one embodiment, the electronic device (200) may include a first display (230) (e.g., a flexible display, a foldable display, or a main display) arranged in a region (e.g., a recess) formed by the first and second housings (210, 220). In one embodiment, the first housing (210) and the second housing (220) may be arranged on both sides with respect to the folding axis (F) as the center, and may have a shape that is substantially symmetrical with respect to the folding axis (F). In one embodiment, the angle or distance between the first housing (210) and the second housing (220) may vary depending on the state of the electronic device (200). For example, the angle or distance between the first housing (210) and the second housing (220) may vary depending on whether the electronic device is in a flat state or unfolded state, a folded state, or an intermediate state.

[0054] In one embodiment, the first housing (210) may include a first surface (211) facing a first direction (e.g., a front direction) (z-axis direction) in an unfolded state of the electronic device (200) and a second surface (212) facing a second direction (e.g., a rear direction) (-z-axis direction) opposite to the first surface (211). In one embodiment, the second housing (220) may include a third surface (221) facing a first direction (z-axis direction) and a fourth surface (222) facing a second direction (-z-axis direction) in an unfolded state of the electronic device (200). In one embodiment, in the unfolded state of the electronic device (200), the first side (211) of the first housing (210) and the third side (221) of the second housing (220) may face substantially the same first direction (z-axis direction). In one embodiment, in the folded state of the electronic device (200), the first side (211) of the first housing (210) and the third side (221) of the second housing (220) may face each other. In one embodiment, in the unfolded state of the electronic device (200), the second side (212) of the first housing (210) and the fourth side (222) of the second housing (220) may face substantially the same second direction (-z-axis direction). In one embodiment, in the folded state of the electronic device (200), the second side (212) of the first housing and the fourth side (222) of the second housing (220) may face in opposite directions. For example, in the folded state of the electronic device (200), the second side (212) may face the first direction (z-axis direction) and the fourth side (222) may face the second direction (-z-axis direction). In this case, the first display (230) may not be visible from the outside (in folding mode). In one embodiment, the electronic device (200) may be folded such that the second side (212) of the first housing (210) and the fourth side (222) of the second housing (220) face each other. In this case, the first display (230) may be arranged to be visible from the outside (out folding mode).

[0055] According to one embodiment, the first housing (210) (e.g., the first housing structure) may include a first side member (213) that at least partially forms an exterior of the electronic device (200) and a first rear cover (214) that is coupled to the first side member (213) and forms at least a portion of a second side (212) of the electronic device (200). In one embodiment, the first side member (213) may include a first side surface (213a), a second side surface (213b) extending from one end of the first side surface (213a), and a third side surface (213c) extending from the other end of the first side surface (213a). In one embodiment, the first side member (213) may be formed into a rectangular (e.g., square or rectangular) shape through the first side (213a), the second side (213b), and the third side (213c).

[0056] According to one embodiment, the second housing (220) (e.g., the second housing structure) may include a second side member (223) that at least partially forms an exterior of the electronic device (200) and a second rear cover (224) that is coupled to the second side member (223) and forms at least a portion of a fourth side (222) of the electronic device (200). In one embodiment, the second side member (223) may include a fourth side (223a), a fifth side (223b) extending from one end of the fourth side (223a), and a sixth side (223c) extending from the other end of the fourth side (223a). In one embodiment, the second side member (223) may be formed into a rectangular shape through the fourth side (223a), the fifth side (223b), and the sixth side (223c).

[0057] According to one embodiment, the first and second housings (210, 220) are not limited to the shapes and combinations shown, and may be implemented by other shapes or combinations and / or combinations of parts. In one embodiment, the first side member (213) may be formed integrally with the first rear cover (214), and the second side member (223) may be formed integrally with the second rear cover (224).

[0058] According to one embodiment, in the unfolded state of the electronic device (200), the second side (213b) of the first side member (213) and the fifth side (223b) of the second side member (223) may be connected without a gap. In one embodiment, in the unfolded state of the electronic device (200), the third side (213c) of the first side member (213) and the sixth side (223c) of the second side member (223) may be connected without a gap. In one embodiment, in the unfolded state of the electronic device (200), the sum of the lengths of the second side (213b) and the fifth side (223b) may be configured to be longer than the lengths of the first side (213a) and / or the fourth side (223a). In one embodiment, in the unfolded state of the electronic device (200), the sum of the lengths of the third side (213c) and the sixth side (223c) may be configured to be longer than the lengths of the first side (213a) and / or the fourth side (223a).

[0059] Referring to FIGS. 2d and 2e, the first side member (213) and / or the second side member (223) may be formed of metal or may further include a polymer that is injected into the metal. In one embodiment, the first side member (213) and / or the second side member (223) may also include at least one conductive portion (216 and / or 226) that is electrically segmented via at least one segment (2161, 2162 and / or 2261, 2262) formed of polymer. In such a case, the at least one conductive portion (216 and / or 226) may be used as at least a portion of an antenna that operates in at least one designated band (e.g., a legacy band) by being electrically connected to a wireless communication circuit included in the electronic device (200).

[0060] According to one embodiment, the first rear cover (214) and / or the second rear cover (224) may be formed by, for example, at least one or a combination of two of coated or colored glass, ceramic, polymer, or metal (e.g., aluminum, stainless steel (STS), or magnesium).

[0061] In one embodiment, the first display (230) may be arranged to extend from a first side (211) of the first housing (210) across a hinge device (e.g., hinge device (240) of FIG. 2B) to at least a portion of a third side (221) of the second housing (220). In one embodiment, the first display (230) may include a first region (230a) substantially corresponding to the first side (211), a second region (230b) substantially corresponding to the second side (212), and a third region (230c) (e.g., a bendable region or a folding region) connecting the first region (230a) and the second region (230b). In one embodiment, the third region (230c) may be disposed at a position corresponding to a hinge device (e.g., hinge device (240) of FIG. 2B) as part of the first region (230a) and / or the second region (230b). In one embodiment, the electronic device (200) may include a hinge housing (241) (e.g., hinge cover) that supports the hinge device (e.g., hinge device (240) of FIG. 2B). In one embodiment, the hinge housing (241) may be disposed so as to be exposed to the outside when the electronic device (200) is in a folded state, and may be inserted into the internal space of the first housing (210) and the internal space of the second housing (220) when the electronic device (200) is in an unfolded state, thereby being invisible from the outside.

[0062] According to one embodiment, the electronic device (200) may include a second display (231) (e.g., a sub-display) that is arranged separately from the first display (230). In one embodiment, the second display (231) may be arranged so as to be at least partially exposed on the second side (212) of the first housing (210). In one embodiment, when the electronic device (200) is in a folded state, the second display (231) may replace at least a portion of the display function of the first display (230) to display at least a portion of status information of the electronic device (200). In one embodiment, the second display (231) may be arranged so as to be visible from the outside through at least a portion of the first rear cover (214). In one embodiment, the second display (231) may also be arranged on the fourth side (222) of the second housing (220). In this case, the second display (231) may be arranged to be visible from the outside through at least a portion of the second rear cover (224).

[0063] According to one embodiment, the electronic device (200) may include at least one of an input device (203) (e.g., a microphone), an audio output device (201, 202), a sensor module (204), a camera device (205, 208), a key input device (206), or a connector port (207). In the illustrated embodiment, the input device (203) (e.g., a microphone), an audio output device (201, 202), a sensor module (204), a camera device (205, 208), a key input device (206), or a connector port (207) is illustrated as a hole or a circular element formed in the first housing (210) or the second housing (220), but this is an exemplary illustration for description and is not limited thereto. According to one embodiment, the input device (203) may include at least one microphone (203) disposed in the second housing (220). In one embodiment, the input device (203) may include a plurality of microphones (203) arranged to detect the direction of sound. In one embodiment, the plurality of microphones (203) may be arranged at appropriate locations in the first housing (210) and / or the second housing (220). In one embodiment, the audio output device (201, 202) may include at least one speaker (201, 202). In one embodiment, the at least one speaker (201, 202) may include a call receiver (201) arranged in the first housing (210) and a speaker (202) arranged in the second housing (220). In one embodiment, the input device (203), the audio output device (201, 202), and the connector port (207) are arranged in a space provided in the first housing (210) and / or the second housing (220) of the electronic device (200), and can be exposed to the external environment through at least one hole formed in the first housing (210) and / or the second housing (220). In one embodiment, at least one connector port (207) can be used to transmit and receive power and / or data with an external electronic device.In one embodiment, at least one connector port (e.g., an ear jack hole) may accommodate a connector (e.g., an ear jack) for transmitting and receiving audio signals with an external electronic device. In one embodiment, the holes formed in the first housing (210) and / or the second housing (220) may be shared for the input device (203) and the audio output devices (201, 202). In one embodiment, the audio output devices (201, 202) may include a speaker (e.g., a piezo speaker) that is not exposed through the holes formed in the first housing (210) and / or the second housing (220).

[0064] According to one embodiment, the sensor module (204) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. In one embodiment, the sensor module (204) may detect an external environment through a first surface (211) of the first housing (210). In one embodiment, the electronic device (200) may further include at least one sensor module arranged to detect the external environment through a second surface (212) of the first housing (210). In one embodiment, the sensor module (204) (e.g., an illuminance sensor) may be arranged under the first display (230) to detect the external environment through the first display (230). In one embodiment, the sensor module (204) may include at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, an ambient light sensor, a proximity sensor, a biometric sensor, an ultrasonic sensor, or an ambient light sensor (204).

[0065] According to one embodiment, the camera devices (205, 208) may include a first camera device (205) (e.g., a front camera device) disposed on a first side (211) of the first housing (210) and a second camera device (208) disposed on a second side (212) of the first housing (210). In one embodiment, the electronic device (200) may further include a flash (209) disposed near the second camera device (208). In one embodiment, the camera devices (205, 208) may include at least one lens, an image sensor, and / or an image signal processor. In one embodiment, the camera device (205, 208) may be arranged such that two or more lenses (e.g., a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and two or more image sensors are positioned on one side (e.g., a first side (211), a second side (212), a third side (221), or a fourth side (222)) of the electronic device (200). In one embodiment, the camera device (205, 208) may also include lenses and / or image sensors for time of flight (TOF).

[0066] According to one embodiment, the key input device (206) (e.g., a key button) may be disposed on a third side (213c) of the first side member (213) of the first housing (210). In one embodiment, the key input device (206) may also be disposed on at least one of the other sides (213a, 213b) of the first housing (210) and / or the sides (223a, 223b, 223c) of the second housing (220). In one embodiment, the electronic device (200) may not include some or all of the key input devices (206), and the key input devices (206) that are not included may be implemented in another form, such as a soft key, on the first display (230). In one embodiment, the key input device (206) may be implemented using a pressure sensor included in the first display (230).

[0067] According to one embodiment, some of the camera devices (205, 208) (e.g., the first camera device (205)) or the sensor module (204) may be arranged to be exposed through the first display (230). In one embodiment, the first camera device (205) or the sensor module (204) may be optically exposed to the outside through an opening (e.g., a through hole) at least partially formed in the first display (230) in the internal space of the electronic device (200). In one embodiment, at least a portion of the sensor module (204) may be arranged so as not to be visually exposed through the first display (230) in the internal space of the electronic device (200). Referring to FIG. 2B, the electronic device (200) may be operable to maintain at least one designated folding angle in an intermediate state through a hinge device (e.g., the hinge device (240) of FIG. 2B). In this case, the electronic device (200) can control the first display (230) to display different contents in the display area corresponding to the first side (211) and the display area corresponding to the third side (221). In one embodiment, the electronic device (200) can operate in a substantially unfolded state (e.g., unfolded state of FIG. 2a) and / or a substantially folded state (e.g., folded state of FIG. 2d) based on a certain folding angle (e.g., angle between the first housing (210) and the second housing (220) when the electronic device (200) is in an intermediate state) through a hinge device (e.g., hinge device (240) of FIG. 2b). In one embodiment, the electronic device (200) can be operated to transition from an unfolded state (e.g., the unfolded state of FIG. 2a) to an unfolded state (e.g., the unfolded state of FIG. 2a) when a pressure is applied in the unfolding direction (B1 direction) from an unfolded state at a constant folding angle through a hinge device (e.g., the hinge device (240) of FIG. 2b).In one embodiment, the electronic device (200) can be operated to transition to a folded state (e.g., the folded state of FIG. 2d) when a pressure is applied in the folding direction (B2 direction) from an unfolded state at a certain folding angle through a hinge device (e.g., the hinge device (240) of FIG. 2b). In one embodiment, the electronic device (200) can be operated to maintain an unfolded state (not shown) at various folding angles through a hinge device (e.g., the hinge device (240) of FIG. 2b) (free stop function).

[0068] FIG. 3A is an internal plan view showing an electronic device (300) according to various embodiments of the present invention.

[0069] FIG. 3b is a plan view showing a frame (310) of an electronic device (300) according to various embodiments of the present invention.

[0070] FIG. 3c is an exploded perspective view of an electronic device (300) according to various embodiments of the present invention.

[0071] FIG. 3d is a cross-sectional view of an electronic device (300) according to various embodiments of the present invention.

[0072] The cross-section of Fig. 3d is a cross-section taken along the AA direction of Fig. 3a.

[0073] Referring to FIGS. 3A and 3C, an electronic device (300) according to various embodiments of the present invention (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIGS. 2A to 2E) may include a frame (310), a circuit board assembly (340), a battery (350), and a bulkhead (320).

[0074] The frame (310) may be a member that supports internal components of the electronic device (300), such as a circuit board assembly (340) and a battery (350), and provides a space for the components to be seated. In various embodiments, the frame (310) may be integrally formed with or joined to a side member (318) of the electronic device (300) (e.g., the first side member (213) and / or the second side member (223) of FIGS. 2A to 2E ).

[0075] A circuit board assembly (340) may include one or more circuit boards (e.g., an upper board (341) and a lower board (342)) and one or more electrical components (343) disposed thereon. The circuit board may be a member that electrically connects the electrical components (343) disposed on the circuit board to each other. The circuit board assembly (340) may also be referred to as a printed board assembly (PBA).

[0076] The battery (350) may be a component that stores and provides power required for the operation of the electronic device (300). The battery (350) may include, for example, a jelly roll-type lithium ion battery. The battery (350) may be located in one area of ​​the frame (310) (e.g., the second mounting surface (312)).

[0077] A partition wall (320) (also referred to as a bulkhead) may be a member positioned between various components (e.g., a circuit board assembly (340) and / or a battery (350)) disposed inside an electronic device (300) to reduce or prevent contact and / or collision between the various components. For example, the partition wall (320) may limit movement of components inside the electronic device (300) and prevent collision between components when acceleration and / or impact are applied from the outside of the electronic device (300). In various embodiments, the partition wall (320) may extend in a first direction (e.g., an x-direction). In various embodiments, the electronic device (300) may include a fastener (309) (e.g., a screw) for fixing the partition wall (320). In various embodiments, the bulkhead (320) may have a dimension (which may be referred to as a 'height') (H1) in a second direction (e.g., the z-direction) perpendicular from the first mounting surface (311) and the second mounting surface (312) of the frame (310) that is greater than or equal to 75% of the height (H2) of the battery (350). Accordingly, the bulkhead (320) may effectively limit movement and collision of components such as the battery (350).

[0078] Referring to FIG. 3B, the frame (310) of the electronic device (300) may include a first mounting surface (311) and a second mounting surface (312). The first mounting surface (311) may be a portion where an internal component of the electronic device (300), such as a circuit board assembly (340), is positioned. For example, the circuit board assembly (340) may be positioned to overlap the first mounting surface (311) when viewed in a second direction (e.g., the z direction in the drawing). For example, a heat dissipation member (330) may be positioned on the first mounting surface (311) of the frame (310), and the circuit board assembly (340) may be positioned on the heat dissipation member (330). For example, a heat dissipation member (330) may be placed between the first mounting surface (311) of the frame (310) and the circuit board assembly (340).

[0079] A component such as a battery (350) may be positioned on the second mounting surface (312). For example, the battery (350) may be positioned so as to overlap the second mounting surface (312) described later when viewed in the second direction (e.g., the z direction in the drawing). For example, a heat dissipation member (330) described later may be positioned on the second mounting surface (312) of the frame (310), and the battery (350) may be positioned on the heat dissipation member (330). For example, the heat dissipation member (330) may be positioned between the second mounting surface (312) of the frame (310) and the battery (350).

[0080] The first and second mounting surfaces (312) may be positioned substantially on the same plane. For example, the frame (310) may include a recess formed to have a surface perpendicular to the second direction (e.g., the z direction in the drawing), and areas on the inner surface of the recess may be defined as the first mounting surface (311) and the second mounting surface (312).

[0081] Referring to FIGS. 3C and 3D , the electronic device (300) may include a heat dissipation member (330). The heat dissipation member (330) may be a member that distributes heat generated in the electronic device (300) (e.g., an application processor (AP), a memory (e.g., a memory (130) and / or a battery (350) of FIG. 1 )) to reduce or prevent a temperature rise in a specific area of ​​the electronic device (300) and improves the heat dissipation performance of the electronic device (300) by allowing heat to be released from a wider surface of the electronic device (300).

[0082] In various embodiments, the heat dissipation member (330) may include a highly thermally conductive material, such as a metal (e.g., copper, gold, silver, and / or aluminum), carbon fiber (e.g., graphite sheet), diamond, and / or silicone. In various embodiments, the heat dissipation member (330) may include a structure having high thermal conductivity, such as a heat pipe and / or a vapor chamber.

[0083] Referring to FIG. 3D, in various embodiments, the bulkhead (320) may be spaced apart from the frame (310). For example, the bulkhead (320) may be spaced apart from a plane forming the first mounting surface (311) and the second mounting surface (312) of the frame (310) in a second direction (e.g., the z direction) by a first gap (D1). The first gap (D1) may have a size sufficient to allow the heat dissipation member (330) to pass through. For example, the first gap (D1) may be about 0.1 to 10 mm. The heat dissipation member (330) may be disposed on the first mounting surface (311) and may extend through the lower portion of the bulkhead (320) through the first gap to the second mounting surface (312). As the heat dissipation member (330) extends from the first mounting surface (311) to the second mounting surface (312) through the lower portion of the bulkhead (320), the area of ​​the heat dissipation member (330) can be expanded, and heat generated from the substrate or battery (350) can be distributed and released over a relatively wide area through the heat dissipation member (330) of the expanded area, so that the heat dissipation performance of the electronic device (300) can be improved.

[0084] In various embodiments, the bulkhead (320) may include a rigid reinforcement portion (321). The rigid reinforcement portion (321) may be, for example, a portion formed by bending an end portion of the bulkhead (320) facing in a second direction (e.g., in the z direction) and / or in a direction opposite to the second direction (e.g., in the -z direction). By bending as described above, the rigidity of the bulkhead (320) is improved, thereby effectively restricting movement of components within the electronic device (300).

[0085] FIG. 4a is a perspective view showing a bulkhead (320) of an electronic device (300) according to various embodiments of the present invention.

[0086] FIG. 4b and FIG. 4c are perspective views showing the combination of a bulkhead (320) and a frame (310) of an electronic device (300) according to various embodiments of the present invention.

[0087] Figure 4b is an enlarged view of area B of Figure 3b and area E of Figure 4a, and Figure 4c is an enlarged view of area C of Figure 3b and area F of Figure 4a.

[0088] Referring to FIG. 4a, the partition wall (320) according to various embodiments may include fastening portions (322) positioned at both ends of the partition wall (320) (e.g., ends in a first direction (x direction) and a direction opposite to the first direction (-x direction)). In various embodiments, the fastening portions (322) may be portions that are fixed to a fastening member (309) so that the partition wall (320) can be fixed to a frame (310). For example, the fastening portions (322) may include a fastening hole (322a) formed so that the fastening member (309) passes through.

[0089] Referring again to FIGS. 3B, 4B, and 4C, the frame (310) may include a bulkhead joint (315). The bulkhead joint (315) may be, for example, a portion located at both ends of a boundary line between the first mounting surface (311) and the second mounting surface (312) and configured to be fastened with a fastening member (309). For example, the bulkhead joint (315) may include a tap hole (319) formed in the frame (310) to fasten the fastening member (309) (e.g., a screw). By fastening the fastening member (322) to the bulkhead joint (315) by the fastening member (309), the bulkhead (320) may be fixed to the frame (310), and mutual collision or movement of components located on the first mounting surface (311) and / or the second mounting surface (312) may be limited.

[0090] FIG. 5A is a perspective view showing a heat dissipation member (330) and a bulkhead (320) of an electronic device (300) according to various embodiments.

[0091] FIG. 5b is an enlarged plan view showing a heat dissipation member (330) and a bulkhead (320) of an electronic device (300) according to various embodiments.

[0092] FIG. 5c is a cross-sectional view of an electronic device (300) according to various embodiments.

[0093] Figure 5b is an enlarged view of area G of Figure 5a.

[0094] Referring to FIGS. 5A to 5C, the bulkhead (320) may be coupled to the heat dissipation member (330). For example, the heat dissipation member (330) may include a metal material, and the bulkhead (320) may be joined (e.g., soldered, brazed, and / or welded) to a surface of the heat dissipation member (330). In some embodiments, the bulkhead (320) may be welded to the surface of the heat dissipation member (330) by a means such as spot welding. Spot welding may secure the bulkhead (320) to the heat dissipation member (330) without damaging the structure and thermal conductivity of the heat dissipation member (330) (e.g., vapor chamber). A plurality of spot welds (331) may be formed between the bulkhead (320) and the heat dissipation member (330) by spot welding.

[0095] Since the bulkhead (320) is coupled to the heat dissipation member (330), the operation of positioning the heat dissipation member (330) on the frame (310) and the operation of positioning the bulkhead (320) are performed as a single operation when assembling the electronic device (300), so that the assembly productivity of the electronic device (300) can be improved. In addition, when the heat dissipation member (330) is correctly positioned on the frame (310), the position of the bulkhead (320) is also fixed, so that defects in which the bulkhead (320) is displaced from the correct position during assembly can be reduced or prevented.

[0096] The first mounting portion (311) and the second mounting portion (312), the circuit board assembly (340), and the battery (350) illustrated in FIG. 5c are described with reference to FIGS. 3a to 3d.

[0097] FIG. 6A is a perspective view showing a circuit board assembly (340) and a bulkhead (320) of an electronic device (300) according to various embodiments.

[0098] FIG. 6b is a cross-sectional view of an electronic device (300) according to various embodiments.

[0099] Figure 6c is a schematic diagram showing the operation of combining a circuit board assembly (340) and a bulkhead (320).

[0100] Referring to FIGS. 6A and 6B, the bulkhead (320) may be coupled to the circuit board assembly (340). For example, the bulkhead (320) may include a substrate coupling portion (323) coupled to the circuit board assembly (340). The substrate coupling portion (323) may be coupled to one side of the circuit board assembly (340), thereby coupling the bulkhead (320) to the circuit board assembly (340). The bulkhead (320) may be coupled to the circuit board assembly (340) by means such as soldering or SMT (surface mount technology). For example, the solder (349) may be positioned in an area where the substrate coupling portion (323) and the circuit board assembly (340) come into contact and may secure the substrate coupling portion (323) of the bulkhead (320) to the circuit board assembly (340).

[0101] Since the bulkhead (320) is coupled to the circuit board assembly (340), the operation of positioning the circuit board assembly (340) on the frame (310) and the operation of positioning the bulkhead (320) are performed as a single operation when assembling the electronic device (300), thereby improving the assembly productivity of the electronic device (300) and preventing or reducing incorrect assembly of the bulkhead (320).

[0102] In various embodiments, the partition wall (320) may have a shock absorbing space (324). The shock absorbing space (324) may be a space that absorbs a shock applied in a third direction (e.g., y direction) toward the side of the circuit board assembly (340). For example, the partition wall (320) may include a first bending portion (325) formed by bending in the third direction and a second bending portion (326) formed by bending (e.g., in the -y direction) an end portion of the first bending portion (325). A substrate joining portion (323) may be positioned at an end portion of the second bending portion (326). The first bending portion (325) and the second bending portion (326) may be spaced apart from each other by a second gap (D2). A shock absorbing space (324) can be formed in the bulkhead (320) by spacing the first bending portion (325) and the second bending portion (326) apart from each other. The second gap (D2) can define the size of the shock absorbing space (324) in the third direction (e.g., the y-axis direction dimension). For example, the second gap (D2) can be about 0.1 to 10 millimeters.

[0103] By combining the bulkhead (320) with the circuit board assembly (340), the impact applied to the bulkhead (320) can be transmitted to the circuit board assembly (340). Accordingly, since the bulkhead (320) has a shock absorbing space (324), the impact applied to the bulkhead (320) can be at least partially absorbed by the shock absorbing space (324), thereby reducing and / or eliminating the impact transmitted to the circuit board assembly (340).

[0104] Referring to FIG. 6C, the bulkhead (320) can be coupled to a circuit board assembly (340) by SMT. The circuit board assembly (340) can include one or more electrical components (343) (e.g., active circuit components such as APs, PMICs, DDIs, or passive circuit components such as resistors, inductors, and capacitors). In various embodiments, the circuit board assembly (340) can be manufactured by positioning the electrical components (343) and the bulkhead (320) on a substrate (e.g., an upper substrate (341) and / or a lower substrate (342)) and coupling the electrical components (343) and the bulkhead (320) to the circuit board assembly (340) by SMT. In various embodiments, during the manufacture of the circuit board assembly (340), solder paste (345) may be applied to the area where the circuit board assembly (340) and the substrate bonding portion (323) of the partition wall (320) come into contact. When the circuit board assembly (340) is heated to mount the electrical component (343) of the circuit board assembly (340) on the substrate (e.g., to melt the solder balls (344) of the electrical component (343) to bond the electrical component (343) to the circuit board assembly (340), the solder paste (345) may melt or partially melt to bond the partition wall (320) to the circuit board assembly (340). Therefore, the bonding of the circuit board assembly (340) and the bulkhead (320) by the above-described operation can be performed together with the SMT process of placing the electrical component (343) on the circuit board assembly (340), so that the time and cost required for manufacturing the electronic device (300) can be reduced and productivity can be improved.

[0105] An electronic device (300) according to various embodiments of the present invention may include a frame (310) including a first mounting surface (311) and a second mounting surface (312), a partition wall (320) arranged to extend in a first direction on a boundary between the first mounting surface (311) and the second mounting surface (312), but spaced apart from the first mounting surface (311) and the second mounting surface (312) in a second direction that is perpendicular to the first mounting surface (311) and the second mounting surface (312); and a heat dissipation member (330) arranged on the first mounting surface (311) and the second mounting surface (312), and arranged between the partition wall (320) and the frame (310).

[0106] An electronic device (300) according to various embodiments of the present invention may include a frame (310) including a first mounting surface (311) and a second mounting surface (312), a partition wall (320) that is arranged to extend in a first direction on a boundary between the first mounting surface (311) and the second mounting surface (312), but is spaced apart from the first mounting surface (311) and the second mounting surface (312) in a second direction that is perpendicular to the first mounting surface (311) and the second mounting surface (312), and a heat dissipation member (330) that is arranged on the first mounting surface (311) and extends between the partition wall (320) and the frame (310) onto the second mounting surface (312).

[0107] In various embodiments, the partition wall (320) includes a fastening portion (322) formed at the first end of the partition wall (320), the frame (310) includes a partition wall connecting portion (315) that is connected to the fastening portion (322), and may include a fastening member (309) that connects the fastening portion (322) to the partition wall connecting portion (315).

[0108] In various embodiments, the electronic device (300) may include a circuit board assembly (340) arranged to overlap the first mounting surface (311) when viewed from the second direction, and the partition wall (320) may include a board coupling portion (323) coupled to the circuit board assembly (340).

[0109] In various embodiments, the bulkhead (320) may be configured to have a shock absorbing space (324) that absorbs shock applied in a third direction that is perpendicular to the first direction and the second direction.

[0110] In various embodiments, the partition wall (320) includes a first bending portion (325) formed by bending an end portion of the partition wall (320) in a third direction that is perpendicular to the first direction and the second direction, and a second bending portion (326) formed by bending an end portion of the first bending portion (325) so as to be parallel to the second direction, and the substrate coupling portion (323) may be located at an end portion of the second bending portion (326).

[0111] In various embodiments, the first bending portion (325) and the second bending portion (326) may be spaced apart from each other by a second gap (D2).

[0112] In various embodiments, the substrate joint (323) may be joined to the circuit board assembly (340) by soldering.

[0113] In various embodiments, the substrate bonding portion (323) may be bonded to the circuit board assembly (340) by surface mount technology (SMT).

[0114] In various embodiments, the electronic device (300) includes electrical components (343) disposed on the circuit board assembly (340), and the circuit board assembly (340) can be manufactured by an operation of joining the bulkhead (320) and the plurality of electrical components (343) to the circuit board assembly (340) by SMT.

[0115] In various embodiments, the bulkhead (320) may include a rigid reinforcement member (321).

[0116] In various embodiments, the rigid reinforcement member (321) may be formed by bending the end of the partition wall (320) facing the second direction.

[0117] In various embodiments, the heat dissipation member (330) includes a metal material, and the partition wall (320) can be bonded to a surface of the heat dissipation member (330).

[0118] In various embodiments, the bulkhead (320) may be joined to the surface of the heat dissipation member (330) by spot welding.

[0119] In various embodiments, the heat dissipation member (330) may include a vapor chamber.

[0120] In various embodiments, the electronic device (300) includes a battery (350) arranged to overlap the second mounting surface (312) when viewed in the second direction, and a dimension from the frame (310) to the second-direction end of the bulkhead (320) may be 75% or more of a dimension from the frame (310) to the second-direction end of the battery (350).

[0121] A circuit board assembly (340) according to various embodiments of the present invention may include a partition wall (320) disposed at one end of the circuit board assembly (340) and including a substrate coupling portion (323) coupled to the one end.

[0122] In various embodiments, the bulkhead (320) may be configured to have a shock absorbing space (324) that absorbs shock applied in a third direction that is perpendicular to the first direction and the second direction.

[0123] In various embodiments, the circuit board assembly (340) further includes an electrical component (343) and can be manufactured by an operation of joining the bulkhead (320) and the electrical component (343) to the circuit board assembly (340) by SMT.

[0124] In various embodiments, the partition wall (320) includes a first bending portion (325) formed by bending an end portion of the partition wall (320) in a third direction that is perpendicular to the first direction and the second direction, and a second bending portion (326) formed by bending an end portion of the first bending portion (325) so as to be parallel to the second direction, and the substrate coupling portion (323) may be located at an end portion of the second bending portion (326).

[0125] In various embodiments, the first bending portion (325) and the second bending portion (326) may be spaced apart from each other by a second interval.

[0126] And the embodiments disclosed in this document disclosed in this specification and drawings are only specific examples to easily explain the technical contents according to the embodiments disclosed in this document and to help understand the embodiments disclosed in this document, and are not intended to limit the scope of the embodiments disclosed in this document. Therefore, the scope of the various embodiments disclosed in this document should be interpreted as including all changes or modified forms derived based on the technical ideas of the various embodiments disclosed in this document in addition to the embodiments disclosed herein.

Claims

1. A frame (310) including a first mounting surface (311) and a second mounting surface (312); A partition (320) arranged to extend in a first direction parallel to the boundary of the first mounting surface (311) and the second mounting surface (312), but spaced apart from the first mounting surface (311) and the second mounting surface (312) in a second direction perpendicular to the first mounting surface (311) and the second mounting surface (312); and An electronic device (300) including a heat dissipation member (330) disposed on the first mounting surface (311) and extending between the bulkhead (320) and the frame (310) to the second mounting surface (312).

2. In paragraph 1, The above bulkhead (320) includes a fastening portion (322) formed at the first direction end of the above bulkhead (320), The above frame (310) includes a bulkhead joint (315) that is joined to the above fastening member (322), An electronic device (300) including a fastening member (309) that fastens the fastening portion (322) to the bulkhead fastening portion (315).

3. In paragraph 1 or 2, When viewed from the second direction, it includes a circuit board assembly (340) arranged to overlap the first mounting surface (311), The above bulkhead (320) is an electronic device (300) including a substrate joining portion (323) coupled to the circuit board assembly (340).

4. In paragraph 3, The above bulkhead (320) is It includes a first bending portion (325) formed by bending the end of the partition wall (320) in a third direction that is perpendicular to the first direction and the second direction, and a second bending portion (326) formed by bending the end of the first bending portion (325) so that it is parallel to the second direction. The above substrate bonding portion (323) is an electronic device (300) located at the end of the second bending portion (326).

5. In paragraph 4, The first bending portion (325) and the second bending portion (326) are spaced apart from each other by a second interval in an electronic device (300).

6. In any one of paragraphs 3 to 5, The above substrate joint (323) is an electronic device (300) that is joined to the circuit board assembly (340) by soldering.

7. In the first paragraph, an electrical component (343) is included that is arranged on the circuit board assembly (340), The above substrate bonding portion (323) is bonded to the circuit board assembly (340) by SMT (surface mount technology). The above circuit board assembly (340) is An electronic device (300) manufactured by an operation of bonding the above bulkhead (320) and the plurality of electrical components (343) to the circuit board assembly (340) by SMT.

8. In any one of paragraphs 1 to 7, An electronic device (300) in which the above bulkhead (320) is configured to have a shock absorbing space (324) configured to absorb shock applied in a third direction that is perpendicular to the first direction and the second direction.

9. In paragraph 1 or 2, The above bulkhead (320) includes a rigid reinforcement member (321), The above rigid reinforcement member (321) is an electronic device (300) formed by bending the end of the bulkhead (320) facing the second direction.

10. In any one of paragraphs 1 to 9, The above heat dissipation member (330) comprises a metal material, The above bulkhead (320) is an electronic device (300) bonded to the surface of the heat dissipation member (330).

11. In Article 10, The above bulkhead (320) is an electronic device (300) joined to the surface of the heat dissipation member (330) by spot welding.

12. In any one of paragraphs 1 to 11, The above heat dissipation member (330) is an electronic device (300) including a vapor chamber.

13. In any one of paragraphs 1 to 12, When viewed from the second direction, it further includes a battery (350) arranged to overlap the second mounting surface (312), An electronic device (300) in which a dimension from the frame (310) to the second end of the bulkhead (320) is 75% or more of a dimension from the frame (310) to the second end of the battery (350).

14. In a circuit board assembly (340) of an electronic device (300), A circuit board assembly (340) including a partition wall (320) disposed at one end of the circuit board assembly (340) and including a board joining portion (323) coupled with the one end.

15. A frame (310) including a first anchoring surface (311) and a second anchoring surface (312); A partition (320) arranged to extend in a first direction on the boundary between the first mounting surface (311) and the second mounting surface (312), but spaced apart from the first mounting surface (311) and the second mounting surface (312) in a second direction that is perpendicular to the first mounting surface (311) and the second mounting surface (312); and An electronic device (300) including a heat dissipation member (330) disposed on the first mounting surface (311) and the second mounting surface (312) and disposed between the bulkhead (320) and the frame (310).

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