Electronic device comprising sealant

Abstract

This electronic device comprises: a housing including a first surface, a second surface opposite to the first surface, and a hole penetrating from the first surface toward the second surface; a display module including a screen display area and a black matrix (BM) area surrounding the screen display area, and disposed on the first surface of the housing; a sealing tape disposed between the housing and the display module; and a sealant filled in the hole of the housing and disposed adjacent to the housing and the sealing tape. Various other embodiments are possible.

Description

Electronic devices containing sealants

[0001] Various embodiments disclosed in this document relate to electronic devices including sealants.

[0002] With the advancement of wireless communication technology, electronic devices utilizing wireless communication, including at least one antenna, have become widely used. Since the commercialization of communication systems for portable wireless communication devices, wireless communication technology in electronic devices has been utilized and developed in a variety of fields.

[0003] However, the above-described content should not be construed as the applicant's recognition of the content described in this document as prior art, but should only be construed as technology (related art) related to the invention described in this document.

[0004] An electronic device according to one embodiment includes a housing including a first surface, a second surface opposite to the first surface, and a hole extending from the first surface toward the second surface, a screen display area, and a BM (black matrix) area surrounding the screen display area, and may include a display module disposed on the first surface of the housing, a sealing tape disposed between the housing and the display module, and a sealant filled in the hole of the housing and disposed adjacent to the housing and the sealing tape. In one embodiment, the sealant may overlap the BM area of ​​the display module and the sealing tape when facing the first surface.

[0005] Alternatively, an electronic device according to one embodiment may include a housing including a first surface, a second surface opposite to the first surface, and a hole extending from the first surface toward the second surface, a screen display area, and a BM (black matrix) area surrounding the screen display area, and may include a display module disposed on the first surface of the housing, a sealing tape disposed between the housing and the display module, and a sealant filled in the hole of the housing and disposed adjacent to the housing and the sealing tape. In one embodiment, the sealant may totally overlap the BM area of ​​the display module when viewed from the first surface.

[0006] The above and other aspects, features and advantages of specific embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings.

[0007] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0008] FIG. 2 is a block diagram of a display module according to one embodiment.

[0009] FIG. 3A is a front perspective view of an electronic device according to one embodiment.

[0010] FIG. 3b is a rear perspective view of an electronic device according to one embodiment.

[0011] FIG. 3c is an exploded perspective view of an electronic device according to one embodiment.

[0012] FIG. 4A is an exploded perspective view of an electronic device according to one embodiment.

[0013] FIG. 4b is an enlarged view of an electronic device according to one embodiment.

[0014] Figure 4c is a cross-sectional perspective view of the electronic device in the AA direction of Figure 4b.

[0015] FIG. 5A is an enlarged view of a portion of a configuration of an electronic device according to one embodiment.

[0016] FIG. 5b is an enlarged view of a portion of a configuration of an electronic device according to one embodiment.

[0017] FIG. 5c is an enlarged view of a portion of a configuration of an electronic device according to one embodiment.

[0018] FIG. 6A is an enlarged view of a portion of a configuration of an electronic device according to one embodiment.

[0019] Figure 6b is a cross-sectional perspective view of the electronic device in the BB direction of Figure 6a.

[0020] Figure 7 is an enlarged view of an electronic device according to one embodiment.

[0021] Hereinafter, embodiments will be described in detail with reference to the attached drawings. In the description with reference to the attached drawings, identical components are assigned the same reference numerals regardless of the drawing numbers, and redundant descriptions thereof will be omitted.

[0022] The various embodiments and terminology used herein are not intended to limit the technical features described in the present disclosure to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In the present disclosure, each of the phrases "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0023] The term "module" used in various embodiments may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, in one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0024] Various embodiments may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., the internal memory (136) or the external memory (138) of FIG. 1) readable by a machine (e.g., an electronic device). For example, a processor of the machine (e.g., an electronic device) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0025] In one embodiment, the method according to the various embodiments disclosed in the present disclosure may be provided as included in a computer program product. The computer program product may be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0026] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0027] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to one embodiment.

[0028] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network).

[0029] In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). In one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197).

[0030] In one embodiment, the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added.

[0031] In one embodiment, some of these components (e.g., a sensor module (176), a camera module (180), or an antenna module (197)) may be integrated into one component (e.g., a display module (160)). The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations.

[0032] In one embodiment, as at least part of data processing or calculation, the processor (120) may store commands or data received from another component (e.g., a sensor module (176) or a communication module (190)) in the volatile memory (132), process the commands or data stored in the volatile memory (132), and store resulting data in the non-volatile memory (134). In one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that may operate independently or together therewith.

[0033] For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0034] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)).

[0035] In one embodiment, the auxiliary processor (123) (e.g., a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, in the electronic device (101) itself on which the artificial intelligence model is executed, or may be performed through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0036] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0037] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0038] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0039] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0040] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0041] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. In one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0042] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. In one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0043] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0044] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). In one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0045] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0046] The camera module (180) can capture still images and videos. In one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0047] The power management module (188) can manage power supplied to the electronic device (101). In one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0048] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0049] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. In one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0050] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). In one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL) each, or 1 ms or less for round trip) for URLLC realization.

[0051] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0052] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0053] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0054] In one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). In one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. In one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0055] FIG. 2 is a block diagram (200) of a display module (160) according to various embodiments.

[0056] Referring to FIG. 2, the display module (160) may include a display (210) and a display driver IC (DDI) (230) for controlling the display (210). The DDI (230) may include an interface module (231), a memory (233) (e.g., a buffer memory), an image processing module (235), or a mapping module (237). The DDI (230) may receive, for example, image data or image control signals corresponding to commands for controlling the image data, from other components of the electronic device 101 through the interface module (231). For example, according to one embodiment, image information may be received from a processor (120) (e.g., a main processor (121) (e.g., an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit) that operates independently of the function of the main processor (121). The DDI (230) may communicate with the touch circuit (250) or the sensor module (176) through the interface module (231). In addition, the DDI (230) may store at least some of the received image information in the memory (233), for example, in units of frames. The image processing module (235) may, for example, perform preprocessing or postprocessing (e.g., resolution, brightness, or size adjustment) on at least some of the image data based at least on the characteristics of the image data or the characteristics of the display (210). The mapping module (237) may generate a voltage value or a current value corresponding to the image data preprocessed or postprocessed through the image processing module (135). According to one embodiment, the voltage value or The generation of the current value may be performed based at least in part on the properties of the pixels of the display (210), for example, the arrangement of the pixels (RGB stripe or pentile structure), or the size of each of the sub-pixels.At least some pixels of the display (210) may be driven based at least in part on, for example, the voltage value or current value, so that visual information (e.g., text, an image, or an icon) corresponding to the image data may be displayed through the display (210).

[0057] According to one embodiment, the display module (160) may further include a touch circuit (250). The touch circuit (250) may include a touch sensor (251) and a touch sensor IC (253) for controlling the same. The touch sensor IC (253) may control the touch sensor (251) to detect, for example, a touch input or a hovering input for a specific location of the display (210). For example, the touch sensor IC (253) may detect a touch input or a hovering input by measuring a change in a signal (e.g., voltage, light quantity, resistance, or charge quantity) for a specific location of the display (210). The touch sensor IC (253) may provide information (e.g., location, area, pressure, or time) regarding the detected touch input or hovering input to the processor (120). According to one embodiment, at least a portion of the touch circuit (250) (e.g., touch sensor IC (253)) may be included as part of the display driver IC (230), or as part of the display (210), or as part of another component (e.g., auxiliary processor (123)) disposed external to the display module (160).

[0058] According to one embodiment, the display module (160) may further include at least one sensor (e.g., a fingerprint sensor, an iris sensor, a pressure sensor, or an illuminance sensor) of the sensor module (176), or a control circuit therefor. For example, the at least one sensor or the control circuit therefor may be embedded in a part of the display module (160) (e.g., the display (210) or the DDI (230)) or a part of the touch circuit (250). For example, if the sensor module (176) embedded in the display module (160) includes a biometric sensor (e.g., a fingerprint sensor), the biometric sensor may obtain biometric information (e.g., a fingerprint image) associated with a touch input through a part of the display (210). In one embodiment, if the sensor module (176) embedded in the display module (160) includes a pressure sensor, the pressure sensor may obtain pressure information associated with a touch input through a part or the entire area of ​​the display (210). According to one embodiment, the touch sensor (251) or sensor module (176) may be positioned between pixels of a pixel layer of the display (210), or above or below the pixel layer.

[0059] FIG. 3a is a front perspective view of an electronic device (301) according to one embodiment, FIG. 3b is a rear perspective view of an electronic device (301) according to one embodiment, and FIG. 3c is an exploded perspective view of an electronic device (301) according to one embodiment.

[0060] Referring to FIGS. 3A, 3B, and 3C, an electronic device (301) according to one embodiment (e.g., the electronic device (101) of FIG. 1 or the electronic device (200) of FIG. 2) may include a housing (310) that forms an exterior and accommodates components therein.

[0061] Hereinafter, any content overlapping with the above will be omitted for explanation, and it is to be understood that, in the electronic device (301), some configurations and structures may be replaced, added, or omitted within a range easily understandable to those skilled in the art by referring to the drawings and descriptions below. In addition, at least one configuration or feature of the embodiments described above may be combined in the electronic device (301) unless it is technically clearly impossible.

[0062] In one embodiment, the housing (310) may include a housing (310) having a front side (310a), a rear side (310b), and a side side (311c) surrounding an interior space between the front side (310a) and the rear side (310b). The housing (310) may include a plurality of side sides (311c) extending from the front side (310a) to the rear side (310b), and the plurality of side sides (311c) may include a lower side (311c-1), an upper side (311c-2), a right side (311c-3), and a left side (311c-4).

[0063] In one embodiment, the front surface (310a) may be formed by a front plate (311a) that is at least partially substantially transparent. For example, the front plate (311a) may include a glass plate or a polymer plate that includes at least one coating layer. In one embodiment, the back surface (310b) may be formed by a back plate (311b) that is substantially opaque.

[0064] For example, the back plate (311b) may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination thereof. The side surface (311c) may be formed by a side member (340) that is joined to the front plate (311a) and the back plate (311b) and includes a metal and / or polymer. In one embodiment, the back plate (311b) and the side member (340) may be formed seamlessly as one piece. In one embodiment, the back plate (311b) and the side member (340) may be formed of substantially the same material (e.g., aluminum).

[0065] In one embodiment, the front plate (311a) may include at least some of a plurality of first edge regions (312a-1), a plurality of second edge regions (312a-2), and a plurality of third edge regions (312a-3).

[0066] In one embodiment, a plurality of first edge regions (312a-1) may extend roundly from a portion of the front surface (310a) of the front plate (311a) in one direction (e.g., in the X-axis direction) and toward the rear plate (311b). A plurality of second edge regions (312a-2) may extend roundly from a portion of the front surface (310a) of the front plate (311a) in another direction (e.g., in the Y-axis direction) and toward the rear plate (311b). And, a plurality of third edge regions (312a-3) may extend roundly from a portion of the front surface (310a) of the front plate (311a) toward the rear plate (311b) between the plurality of first edge regions (312a-1) and the plurality of second edge regions (312a-2).

[0067] In one embodiment, the back plate (311b) may include at least some of a plurality of fourth edge regions (312b-1), a plurality of fifth edge regions (312b-2), and a plurality of sixth edge regions (312b-3).

[0068] In one embodiment, a plurality of fourth edge regions (312b-1) may extend roundly from a portion of the rear surface (310b) of the rear plate (311b) in one direction (e.g., in the X-axis direction) and toward the front plate (311a). A plurality of fifth edge regions (312b-2) may extend roundly from a portion of the rear surface (310b) of the rear plate (311b) in another direction (e.g., in the Y-axis direction) and toward the front plate (311a). A plurality of sixth edge regions (312b-3) may extend roundly from a portion of the rear surface (310b) of the rear plate (311b) toward the front plate (311a) between the plurality of fourth edge regions (312b-1) and the plurality of fifth edge regions (312b-2).

[0069] In one embodiment, the side member (340) may surround at least a portion of the interior space between the front (310a) and the rear (310b). The side member (340) may include a first support structure (341) disposed on at least a portion of the side (311c) and a second support structure (342) connected to the first support structure (341) and forming a placement space for components of the electronic device (301).

[0070] In one embodiment, the first support structure (341) may connect the edges of the front plate (311a) and the rear plate (311b) and surround the space between the front plate (311a) and the rear plate (311b) to form a side surface (311c) of the housing (310). In one embodiment, the second support structure (342) may be disposed inside (or a body portion) of the electronic device (301). The second support structure (342) may be formed integrally with the first support structure (341), or may be formed separately and connected to the first support structure (341). In one embodiment, the first support structure (341) and / or the second support structure (342) may be a component of the housing (310).

[0071] In one embodiment, at least one PCB assembly (351, 352) may be disposed on the second support structure (342). The second support structure (342) may be connected to a ground of, for example, at least one PCB assembly (351, 352).

[0072] In one embodiment, a display (361) may be positioned on one surface of the second support structure (342) (e.g., the lower surface (+Z-axis direction surface) of FIG. 3c), and a rear plate (311b) may be positioned on the other surface of the second support structure (342) (e.g., the upper surface (-Z-axis direction surface) of FIG. 3c).

[0073] In one embodiment, the side member (340) may be formed at least in part from a conductive material. For example, the first support structure (341) may be formed from a metal and / or a conductive polymer material. In one embodiment, the second support structure (342) may be formed from a metal and / or a conductive polymer material, similar to the first support structure (341).

[0074] In one embodiment, the rear plate (311b) of the housing (310) may include a camera hole (375) for arranging a second camera module (380b) and a flash (380c), and the housing (310) may include a camera deco (373) that protects the second camera module (380b) and the flash (380c). The camera deco (373) may be coupled to the rear plate (311b) and may be arranged in the camera hole (375) so as to be visually exposed to the outside of the housing (310).

[0075] In one embodiment, the electronic device (301) may include a display (361) (e.g., the display module (160) of FIG. 1). In one embodiment, the display (361) may be positioned on the front surface (310a). In one embodiment, the display (361) may be exposed through at least a portion of the front plate (311a) (e.g., a plurality of first edge regions (312a-1), a plurality of second edge regions (312a-2), and a plurality of third edge regions (312a-3). In one embodiment, the display (361) may have a shape substantially the same as the shape of an outer edge of the front plate (311a).

[0076] In one embodiment, the edge of the display (361) may substantially coincide with the outer rim of the front plate (311a). Although not shown in the drawings, the display (361) of various embodiments may include a touch detection circuit (not shown), a pressure sensor (not shown) capable of sensing the intensity (pressure) of a touch, and / or a digitizer (not shown) that detects a magnetic field-type stylus pen (not shown).

[0077] In one embodiment, the display (361) may include a screen display area (361a) that is visually exposed and displays content through pixels or a plurality of cells. In one embodiment, the screen display area (361a) may include a sensing area (361a-1) and a camera area (361a-2). For example, the sensing area (361a-1) may overlap with at least a portion of the screen display area (361a). The sensing area (361a-1) may allow transmission of an input signal related to a sensor module (376) (e.g., the sensor module (176) of FIG. 1). The sensing area (361a-1) may display content similarly to a screen display area (361a) that does not overlap the sensing area (361a-1).

[0078] For example, the sensing area (361a-1) can display content while the sensor module (376) is not operating. The camera area (361a-2) can overlap with at least a portion of the screen display area (361a). The camera area (361a-2) can allow transmission of optical signals related to the camera modules (380a, 380b) (e.g., the camera module (180) of FIG. 1). The camera area (361a-2) can display content similarly to the screen display area (361a) that does not overlap with the camera area (361a-2). For example, the camera area (361a-2) can display content while the camera modules (380a, 380b) are not operating.

[0079] In one embodiment, the electronic device (301) may include a sensor module (376). The sensor module (376) may sense a signal applied to the electronic device (301). The sensor module (376) may be located, for example, on the front side (310a) of the electronic device (301). The sensor module (376) may form a sensing area (361a-1) in at least a portion of the screen display area (361a).

[0080] For example, the sensor module (376) may be arranged to perform its function without being visually exposed through the display (361) in the internal space of the electronic device (301). The sensor module (376) may receive an input signal that passes through the sensing region (361a-1) and generate an electrical signal based on the received input signal. For example, the input signal may have a specified physical quantity (e.g., heat, light, temperature, sound, pressure, ultrasound). In one embodiment, the input signal may include a signal related to the user's biometric information (e.g., the user's fingerprint, voice, etc.).

[0081] In one embodiment, the electronic device (301) may include a camera module (380a, 380b) (e.g., the camera module (180) of FIG. 1). In one embodiment, the camera module (380a, 380b) may include a first camera module (380a) and a second camera module (380b), and in various embodiments, may further include a flash (380c).

[0082] In one embodiment, the first camera module (380a) may be arranged to be visually visible to the outside through the front (310a) of the housing (310), and the second camera module (380b) and the flash (380c) may be arranged to be visually visible to the outside through the rear (310b) of the housing (310). In one embodiment, at least a portion of the first camera module (380a) may be arranged in the housing (310) to be covered by the display (361). For example, the first camera module (380a) may include an under-display camera (UDC). In one embodiment, the first camera module (380a) may receive an optical signal that passes through the camera area (361a-2). In one embodiment, the second camera module (380b) may include multiple cameras (e.g., a dual camera, a triple camera, or a quad camera). In one embodiment, the flash (380c) may include a light emitting diode or a xenon lamp.

[0083] In one embodiment, the electronic device (301) may include an input module (350) (e.g., the input module (150) of FIG. 1). The input module (350) may receive a user's manipulation signal. The input module (350) may include, for example, at least one key input device that is positioned so as to be exposed on a side surface (311c) of the housing (310).

[0084] In one embodiment, the electronic device (301) may include a connection terminal (378) (e.g., the connection terminal (178) of FIG. 1). In one embodiment, the connection terminal (378) may be disposed on an outer surface of the housing (310), for example, may be disposed on a lower surface (311c-1) of the electronic device (301) as illustrated in FIG. 3A. Specifically, when the electronic device (301) is viewed in one direction (e.g., the +Y-axis direction of FIG. 3A), the connection terminal (378) may be disposed at a central portion of the lower surface (311c-1).

[0085] As illustrated in FIGS. 3a and 3b, the connection terminal (378) may be arranged on the side (311c) of the housing (310) forming the exterior of the electronic device (301), but in actual implementation, the present invention is not limited thereto, and at least some of the connection terminals may be arranged on the front (310a) or rear (310b) of the housing (310), or may be arranged inside the housing (310). For example, although not illustrated in the drawing, the housing (310) of one embodiment may include a cover (not illustrated) for replacing the battery (389).

[0086] In one embodiment, the electronic device (301) may include at least one PCB assembly (351, 352) made of one or more printed circuit boards and a battery (389) (e.g., battery (189) of FIG. 1).

[0087] In one embodiment, the electronic device (301) may include a plurality of PCB assemblies (351, 352), for example, the plurality of PCB assemblies (351, 352) may be composed of two PCB assemblies spaced apart from each other. For example, the plurality of PCB assemblies (351, 352) may include a first circuit board assembly (351) and a second circuit board assembly (352).

[0088] In one embodiment, the first circuit board assembly (351) may be a main board of an electronic device (301) accommodated in a first board slot (342a) of a second support structure (342), and the second circuit board assembly (352) may be a sub-board of an electronic device (301) accommodated in a second board slot (342b) of a second support structure (342).

[0089] In one embodiment, the battery (389) may be accommodated in a battery slot (345) of a second support structure (342) formed between a first substrate slot (342a) and a second substrate slot (342b).

[0090] FIG. 4a is an exploded perspective view of an electronic device (401) according to one embodiment, FIG. 4b is an enlarged view of an electronic device (401) according to one embodiment, and FIG. 4c is a cross-sectional perspective view of the electronic device (401) taken along the AA direction of FIG. 4b.

[0091] Referring to FIGS. 4A, 4B, and 4C, an electronic device (401) according to an embodiment (e.g., the electronic device (101) of FIGS. 1 and 2 or the electronic device (301) of FIGS. 3A, 3B, and 3C) may include a housing (410) (e.g., the housing (310) of FIGS. 3A, 3B, and 3C), a display module (430) (e.g., the display module (160) of FIGS. 1 and 2 or the display (361) of FIGS. 3A, 3B, and 3C).

[0092] Hereinafter, any content overlapping with the above will be omitted for explanation, and it is to be understood that, in the electronic device (401), some configurations and structures may be replaced, added, or omitted within a range easily understandable to those skilled in the art by referring to the drawings and descriptions below. In addition, at least one configuration or feature of the embodiments described above may be combined in the electronic device (401) unless it is technically clearly impossible.

[0093] In one embodiment, the electronic device (401) may be a display device including a display. In the drawing, the electronic device (401) is depicted in the form of a smartphone, which is a portable communication device, but the electronic device (401) of various embodiments of the present document is not limited thereto. For example, the electronic device (401) may be a tablet PC, a notebook PC, or a personal digital assistant (PDA), or may be a TV, a monitor device, a smart TV, a smart watch, or a wearable device.

[0094] In one embodiment, the housing (410) may form an exterior of the electronic device (401). Alternatively, the housing (410) may house or protect electrical components of the electronic device (401). The housing (410) may include a first side (411) facing a first direction (e.g., a +Z direction), a second side (412) facing a second direction opposite to the first direction (e.g., a -Z direction), and a side surface (413) extending from the first side (411) to the second side (412).

[0095] In one embodiment, the display module (430) may be disposed on the first surface (411) of the housing (410). The display module (430) may include a screen display area (431) (or active area) for displaying a screen and a black matrix (BM) area (or inactive area) surrounding the screen display area (431). The BM area (435) may be a portion of an area where a screen is not displayed, an edge area of ​​the display module (430), or a portion of a side surface of the display module (430).

[0096] In one embodiment, a sealing tape (450) may be placed between the housing (410) and the display module (430). The sealing tape (450) may be made of a waterproof material. The sealing tape (450) may be attached to an edge or side area of ​​the back surface (e.g., the surface in the -Z direction) of the display module (430). For example, the sealing tape (450) may be a waterproof tape, and specifically, may be a side waterproof tape.

[0097] In one embodiment, the housing (410) may include a hole (415). The hole (415) may be an opening or a through hole extending from the first side (411) toward the second side (412). The hole (415) may be formed adjacent to a side surface (413) of the housing (410) on the first side (411). For example, the hole (415) may be formed adjacent to a lower edge (e.g., in the -Y direction) of the first side of the housing (410). Alternatively, the hole (415) may be formed opposite the BM region (435) of the display module (430). For example, the hole (415) may be a cure in place gasket (CIPG) hole.

[0098] In one embodiment, the sealant (460) can be filled into the hole (415) of the housing (410). For example, the sealant (460) can be filled into the hole (415) of the housing (410) in a liquid state and then hardened to form.

[0099] In one embodiment, the sealant (460) may be made of a waterproof material. For example, the sealant (460) may be a cure-in-place gasket (CIPG) bonding member. The sealant (460) may be made of silicone or rubber. The sealant (460) may assist in the waterproofing function of the display module (430) of the electronic device (401).

[0100] In one embodiment, a groove (419) may be formed in the housing (410) of the electronic device (401), and an auxiliary sealant (470) may be placed in the groove (419). The groove (419) and the auxiliary sealing tape (470) are described with reference to FIGS. 5A, 5B, and 5C.

[0101] In one embodiment, the sealant (460) may be positioned adjacent to the housing (410) and the sealing tape (450). For example, the sealant (460) may be positioned so as to overlap the BM area (435) of the display module (430) and the sealing tape (450) when facing the first side (411). Alternatively, the sealant (460) may be positioned so as not to overlap the screen display area (431) of the display module (430) when facing the first side (411).

[0102] In one embodiment of the present document, the sealant (460) overlaps the BM area (435) and the sealing tape (450), thereby preventing or reducing degradation of the image quality of the display module (430) due to the hole (415) of the housing (410) and the sealant (460). For example, the sealant (460) overlaps the BM area (435) and the sealing tape (450), thereby preventing or reducing wrinkles or light refraction in the screen display area (431).

[0103] In one embodiment, the sealant (460) may be totally spaced from the display module (430). The sealant (460) may be spaced from the rear surface (e.g., the surface in the -Z direction) of the display module (430) by the sealing tape (450) and other components (e.g., the display molding (480) of FIGS. 6A and 6B). The sealant (460) may be positioned so as not to be in direct contact with the display module (430), thereby implementing the waterproof function of the display module (430) while preventing or reducing deterioration of the image quality of the display module (430).

[0104] In one embodiment, the sealant (460) may be positioned to entirely overlap the BM area (435) of the display module (430) when viewed from the first side (411). In one embodiment of the present document, the sealant (460) may not overlap the screen display area (431), thereby preventing or reducing the occurrence of wrinkles or light refraction in the screen display area (431). Alternatively, the sealant (460) may prevent or reduce water or foreign substances from entering the screen display area (431) of the display module (430) from the outside of the electronic device (401).

[0105] In one embodiment, the auxiliary sealing tape (470) may be positioned so that at least a portion of the sealing tape (450) overlaps with the first side (411) when viewed from the side. For example, as illustrated in FIG. 4c, the sealing tape (450) and the auxiliary sealing tape (470) may include an area that overlaps with each other in a vertical direction (e.g., in the Z-axis direction).

[0106] In one embodiment, the overlapping arrangement of the sealing tape (450) and the auxiliary-sealing tape (470) can prevent the liquid sealant (460) from flowing through the sealing tape (450) and the auxiliary-sealing tape (470) to the display module (430).

[0107] For example, the sealant (460) may be formed by filling and hardening the hole (415) in a liquid or fluid state. The overlapping area of ​​the sealing tape (450) and the auxiliary sealing tape (470) may impede the flow of the sealant (460) or limit the flow range.

[0108] In one embodiment, the sealant (460) may be cured while being introduced to the middle of the overlapping area of ​​the sealing tape (450) and the auxiliary sealing tape (470). As illustrated in FIG. 4C, some areas of the sealant (460) may overlap simultaneously with the sealing tape (450) and the auxiliary sealing tape (470).

[0109] For example, if the sealing tape (450) and the auxiliary sealing tape (470) do not overlap, there is a possibility that the liquid sealant (460) may flow into the display module (430), and to prevent this, the injection amount of the sealant (460) may be limited. If the injection amount of the sealant (460) is insufficient, the waterproof performance may be limited.

[0110] In one embodiment of the present document, the sealing tape (450) and the auxiliary sealing tape (470) are arranged to overlap at least some areas, thereby limiting the movement of the liquid sealant (460), and consequently, the sealant (460) can be injected into the housing (410) in a sufficient amount.

[0111] FIG. 5A is an enlarged view of a part of a configuration of an electronic device (401) according to an embodiment, FIG. 5B is an enlarged view of a part of a configuration of an electronic device (401) according to an embodiment, and FIG. 5C is an enlarged view of a part of a configuration of an electronic device (401) according to an embodiment.

[0112] Specifically, FIG. 5a is an enlarged view of the housing (410), FIG. 5b is an enlarged view of the housing (410) and the sealing tape (450), and FIG. 5c is an enlarged view of the housing (410), the sealing tape (450), the sealant (460), and the auxiliary sealing tape (470).

[0113] Referring to FIGS. 5a, 5b and 5c, an electronic device (401) according to one embodiment may further include a groove (419) and an auxiliary sealing tape (470).

[0114] Hereinafter, any content overlapping with the above will be omitted for explanation, and it is to be understood that, in the electronic device (401), some configurations and structures may be replaced, added, or omitted within a range easily understandable to those skilled in the art by referring to the drawings and descriptions below. In addition, at least one configuration or feature of the embodiments described above may be combined in the electronic device (401) unless it is technically clearly impossible.

[0115] In one embodiment, a groove (419) may be formed on a first surface (411) of a housing (410). A hole (415) may be disposed within the groove (419). Alternatively, one end of the groove (419) may be in contact with a boundary of the hole (415). Alternatively, the groove (419) may have a shape extending from a portion of the boundary of the hole (415) on the first surface (411) of the housing (410).

[0116] For example, as illustrated in FIG. 5A, the hole (415) may be positioned inside an end of one side (e.g., in the +X direction) of the groove (419). Alternatively, an end of one side (e.g., in the +X direction) of the groove (419) may be in contact with an end of one side (e.g., in the -X direction) of the boundary of the hole (415).

[0117] In one embodiment, the groove (419) can guide the direction in which the liquid sealant (460) advances on the first surface (411) of the housing (410) during the process of filling the hole (415) with the liquid sealant (460).

[0118] For example, the sealant (460) can be formed by filling the hole (415) in a liquid state toward the second surface (412) of the housing (410) and hardening. The groove (419) can guide the liquid sealant (460) to flow into the groove (419). By the groove (419), the liquid sealant (460) can be hardened at a position overlapping the BM area (e.g., the BM area (435) of FIGS. 4a, 4b, and 4c) without flowing to the screen display area (e.g., the screen display area (431) of FIGS. 4a, 4b, and 4c) of the display module (e.g., the display module (430) of FIGS. 4a, 4b, and 4c).

[0119] In one embodiment, as illustrated in FIG. 5b, the hole (415) of the housing (410) may be arranged to overlap the sealing tape (450) entirely when viewed from the first side (411). The sealing tape (450) may guide the liquid sealant (460) so that the liquid sealant (460) does not flow toward the display module (430). Accordingly, the sealant (460) may be formed to substantially overlap the sealing tape (450).

[0120] However, "substantially" in this document may mean the same level, reflecting tolerances or errors in typical manufacturing processes. Alternatively, "substantially" may refer to a range that includes any of + / -0.1%, + / -0.5%, + / -1%, + / -3%, + / -5%, + / -7%, + / -10%, + / -15%, and + / -20%, based on the literal equivalent 0%.

[0121] In one embodiment, an auxiliary sealing tape (470) may be placed in the groove (419). The auxiliary sealing tape (470) may be made of a waterproof material. The auxiliary sealing tape (470) may be attached to the groove (419), and the groove (419) may be formed in a downward direction (e.g., in the -Y direction) of the first surface of the housing (410).

[0122] For example, the auxiliary sealing tape (470) may be a waterproof tape, and specifically, may be a lower waterproof tape. The auxiliary sealing tape (470) may prevent or reduce water or foreign substances from entering the display module (430) in the lower direction of the housing (410).

[0123] In one embodiment, as illustrated in FIG. 5c, at least a portion of the sealant (460) may be positioned to overlap the groove (419) when viewed from the first side (411). The liquid sealant (460) may pass through the hole (415) and be guided by the sealing tape (450) to be cured in the groove (419). Accordingly, the sealant (460) may be positioned to overlap the hole (415) and the groove (419) as a whole.

[0124] In one embodiment, the sealing tape (450) may be adhered to the display module (430), and the sealant (460) may be adhered to the housing (410) and the sealing tape (450). The sealant (460) may support the display module (430) through the sealing tape (450).

[0125] For example, since the sealing tape (450) is placed on top of the hole (415) of the housing (410), the liquid sealant (460) can be injected into the hole (415), hardened, and adhered to the sealant (460). The sealant (460) can be simultaneously bonded to the housing (410) and the sealing tape (450), and the sealing tape (450) can be simultaneously bonded to the sealant (460) and the display module (430). Therefore, the sealant (460) can serve as an adhesive that bonds the display module (430) to the housing (410).

[0126] In one embodiment, the sealant (460) can be adhered to the auxiliary sealing tape (470), and the auxiliary sealing tape (470) can be adhered to the housing (410). By the auxiliary sealing tape (470), the adhesion between the housing (410) and the sealant (460) can be improved.

[0127] In one embodiment of the present document, the electronic device (401) may omit a separate bond or bonding member for bonding to the display module (430) by means of a sealant (460). The space efficiency of the electronic device (401) may be improved, and the display module (430) may reduce the area of ​​the BM region (435).

[0128] For example, when using a separate bond or bonding member, the display module (430) may require an area expansion of the BM region (435) to bond it. The sealant (460) may omit the separate bond or bonding member by bonding the display module (430) to the housing (410).

[0129] FIG. 6a is an enlarged view of a part of the configuration of an electronic device (401) according to one embodiment, and FIG. 6b is a cross-sectional perspective view of the electronic device (401) in the BB direction of FIG. 6a.

[0130] Referring to FIGS. 6A and 6B, an electronic device (401) according to one embodiment may further include a display molding (480).

[0131] Hereinafter, any content overlapping with the above will be omitted for explanation, and it is to be understood that, in the electronic device (401), some configurations and structures may be replaced, added, or omitted within a range easily understandable to those skilled in the art by referring to the drawings and descriptions below. In addition, at least one configuration or feature of the embodiments described above may be combined in the electronic device (401) unless it is technically clearly impossible.

[0132] In one embodiment, the display molding (480) can be coupled to a side (e.g., a side in the -Z direction or a back side) of the display module (430) that faces the first side (411) of the housing (410). The display molding (480) can be coupled to a lower side (e.g., a -Y direction) of the display module (430).

[0133] For example, the display molding (480) may be a display molding. The display molding (480) may prevent or reduce water or foreign substances from entering the display module (430).

[0134] In one embodiment, the display molding (480) may be arranged so as to be non-overlapping with the sealant (460) when viewed from the first side (411). For example, the display molding (480) may be arranged to face the auxiliary sealing tape (470). The auxiliary sealing tape (470) and the display molding (480) may be arranged to be substantially in close contact with each other. The liquid sealant (460) may not flow into the space between the auxiliary sealing tape (470) and the display molding (480), and the sealant (460) may be non-overlapping with the display molding (480).

[0135] In one embodiment, the display molding (480) can prevent or reduce the inflow of the sealant (460) toward the display module (430). The display molding (480) is coupled to the back surface of the display module (430), thereby protecting the display module (430) from the liquid sealant (460) passing through the sealing tape (450) and the auxiliary sealing tape (470) and directly bonding to the display module (430). The sealant (460) and the display module (430) can be entirely separated by the display molding (480).

[0136] In one embodiment, as illustrated in FIG. 6B, the sealant (460) may be filled through the overlapping areas of the sealing tape (450) and the auxiliary sealing tape (470). Some areas of the sealant (460) may be in contact with the display molding (480). For example, the sealant (460) and the display molding (480) may be adjacent to each other in a lateral direction (e.g., in the XY plane direction).

[0137] In one embodiment, a display molding (480) is placed between the display module (430) and the sealant (460) to prevent contact between the display module (430) and the sealant (460), thereby increasing the amount of sealant (460) injected.

[0138] For example, if the amount of sealant (460) injected increases, there is a possibility that the liquid sealant (460) may flow through the overlapping area of ​​the sealing tape (450) and the auxiliary sealing tape (470) and into the display module (430). To prevent this, the amount of sealant (460) injected may be limited. If the amount of sealant (460) injected is insufficient, the waterproof performance may be limited.

[0139] In one embodiment of the present invention, the display molding (480) can physically limit contact between the sealant (460) and the display module (430), resulting in a sufficient amount of sealant (460) being injected into the housing (410).

[0140] In one embodiment, at least a portion of the sealant (460) may be adhered to the display molding (480). The sealant (460) may support the display module (430) through the display molding (480). The sealant (460) may be adhered to the housing (410), the sealing tape (450), the auxiliary sealing tape (470), and the display molding (480), thereby stably adhering the display module (430) to the housing (410).

[0141] Figure 7 is an enlarged view of an electronic device (401) according to one embodiment.

[0142] Referring to FIG. 7, the auxiliary sealing tape (470) according to one embodiment may be placed at a predetermined distance from the boundary of the groove (419) and the boundary of the hole (415).

[0143] Hereinafter, any content overlapping with the above will be omitted for explanation, and it is to be understood that, in the electronic device (401), some configurations and structures may be replaced, added, or omitted within a range easily understandable to those skilled in the art by referring to the drawings and descriptions below. In addition, at least one configuration or feature of the embodiments described above may be combined in the electronic device (401) unless it is technically clearly impossible.

[0144] In one embodiment, the auxiliary sealing tape (470) may be positioned at a predetermined distance from the boundary of the groove (419) and the boundary of the hole (415). The auxiliary sealing tape (470) and the groove (419) may form a flow path through which the liquid sealant (460) flows.

[0145] For example, liquid sealant (460) injected through the hole (415) of the housing (410) can pass through the boundary of the auxiliary sealing tape (470) and the hole (415) and flow between the boundary of the auxiliary sealing tape (470) and the groove (419).

[0146] In one embodiment of the present document, the auxiliary sealing tape (470) can guide the direction in which the liquid sealant (460) flows by being positioned inside the groove (419) and away from the boundary of the groove (419). The auxiliary sealing tape (470) can assist in preventing the sealant (460) from flowing into the display module (430).

[0147] In one embodiment, the auxiliary sealing tape (470) may be spaced apart from the boundary of the hole (415) by a first distance (G1). The first distance (G1) may be the shortest distance from the auxiliary sealing tape (470) to the boundary of the hole (415). Alternatively, the first distance (G1) may be the average distance from one side of the auxiliary sealing tape (470) facing the hole (415) to the boundary of the hole (415).

[0148] In one embodiment, the auxiliary sealing tape (470) may be spaced from the boundary of the groove (419) by a second distance (G2). The second distance (G2) may be the shortest distance from the auxiliary sealing tape (470) to the boundary of the groove (419). Alternatively, the second distance (G2) may be the average distance from one side of the auxiliary sealing tape (470) facing the groove (419) to the boundary of the groove (419).

[0149] In one embodiment, the second interval (G2) may include a first sub-interval (G21) and a second sub-interval (G22). The first sub-interval (G21) may be an interval located relatively closer to the hole (415) than the second sub-interval (G22), and the second sub-interval (G22) may be an interval located relatively farther from the hole (415) than the first sub-interval (G21).

[0150] In one embodiment, the second gap (G2) may be smaller than the first gap (G1). As the second gap (G2) is formed to be smaller than the first gap (G1), the width of the flow path through which the liquid sealant (460) flows may be narrowed.

[0151] In one embodiment, at least one of the first sub-spacing (G21) and the second sub-spacing (G22) may be smaller than the first spacing (G1). For example, the first sub-spacing (G21) may be equal to or smaller than the first spacing (G1). The second sub-spacing (G22) may be smaller than the first sub-spacing (G21) and / or the first spacing (G1). When the first sub-spacing (G21) is smaller than the first spacing (G1) and the second sub-spacing (G22) is smaller than the first sub-spacing (G21), the width of the flow path through which the liquid sealant (460) flows may gradually narrow.

[0152] In one embodiment of the present document, if the width of the path through which the liquid sealant (460) flows is narrowed, the direction and amount of flow of the liquid sealant (460) may be limited. Accordingly, the auxiliary sealing tape (470) may be cured at a position where the liquid sealant (460) overlaps the BM area (e.g., the BM area (435) of FIGS. 4a, 4b, and 4c) without flowing to the screen display area (e.g., the screen display area (431) of FIGS. 4a, 4b, and 4c) of the display module (e.g., the display module (430) of FIGS. 4a, 4b, and 4c).

[0153] An electronic device (401) according to one embodiment may include a housing (410) including a first surface (411), a second surface (412) opposite to the first surface (411) and a hole (415) extending from the first surface (411) toward the second surface (412), a screen display area (431) and a BM (black matrix) area surrounding the screen display area (431), a display module (430) disposed on the first surface (411) of the housing (410), a sealing tape (450) disposed between the housing (410) and the display module (430), and a sealant (460) filled in the hole (415) of the housing (410) and disposed adjacent to the housing (410) and the sealing tape (450). In one embodiment, the sealant (460) may overlap the BM area (435) of the display module (430) and the sealing tape (450) when facing the first surface (411).

[0154] In one embodiment, the sealant (460) may be totally spaced from the display module (430).

[0155] In one embodiment, the sealant (460) may be arranged to overlap the entire BM area (435) of the display module (430) when facing the first surface (411).

[0156] In one embodiment, the hole (415) of the housing (410) may overlap entirely with the sealing tape (450) when viewed from the first side (411).

[0157] In one embodiment, the sealing tape (450) and the sealant (460) may be made of a waterproof material.

[0158] In one embodiment, the housing (410) may further include a groove (419) formed on the first surface (411). In one embodiment, the electronic device (401) may further include an auxiliary sealing tape (470) disposed in the groove (419).

[0159] In one embodiment, the auxiliary sealing tape (470) may overlap at least a portion of the sealing tape (450) when facing the first side (411).

[0160] In one embodiment, a portion of the sealant (460) may overlap simultaneously with the sealing tape (450) and the auxiliary sealing tape (470) when viewed from the first side (411).

[0161] In one embodiment, the hole (415) may be positioned inside the groove (419).

[0162] In one embodiment, at least a portion of the sealant (460) may overlap the groove (419) when viewed from the first side (411).

[0163] In one embodiment, the auxiliary sealing tape (470) may be placed at a predetermined distance from the boundary of the groove (419) and the boundary of the hole (415).

[0164] In one embodiment, the auxiliary sealing tape (470) may be spaced apart from the boundary of the hole (415) by a first distance (G1). In one embodiment, the auxiliary sealing tape (470) may be spaced apart from the boundary of the groove (419) by a second distance (G2) smaller than the first distance (G1).

[0165] In one embodiment, the electronic device (401) may further include a display molding (480) coupled to one side of the display module (430) facing the first side (411) of the housing (410).

[0166] In one embodiment, the display molding (480) may be non-overlapping with the sealant (460) when viewed from the first side (411).

[0167] In one embodiment, the sealing tape (450) may be adhered to the display module (430). In one embodiment, the sealant (460) may be adhered to the housing (410) and the sealing tape (450) to support the display module (430).

[0168] Alternatively, an electronic device (401) according to one embodiment may include a housing (410) including a first surface (411), a second surface (412) opposite to the first surface (411) and a hole (415) extending from the first surface (411) toward the second surface (412), a screen display area (431) and a BM (black matrix) area surrounding the screen display area (431), a display module (430) disposed on the first surface (411) of the housing (410), a sealing tape (450) disposed between the housing (410) and the display module (430), and a sealant (460) filled in the hole (415) of the housing (410) and disposed adjacent to the housing (410) and the sealing tape (450). In one embodiment, the sealant (460) may totally overlap with the BM area (435) of the display module (430) when viewed from the first side (411).

[0169] In one embodiment, the housing (410) may further include a groove (419) formed on the first surface (411). In one embodiment, the electronic device (401) may further include an auxiliary sealing tape (470) disposed in the groove (419).

[0170] In one embodiment, the auxiliary sealing tape (470) may overlap at least a portion of the sealing tape (450) when facing the first side (411).

[0171] In one embodiment, the electronic device (401) may further include a display molding (480) coupled to one side of the display module (430) facing the first side (411) of the housing (410).

[0172] In one embodiment, the display molding (480) may be non-overlapping with the sealant (460) when viewed from the first side (411).

[0173] Although the preferred embodiments have been illustrated and described above, the present disclosure is not limited to the specific embodiments described above, and various modifications may be made by a person having ordinary skill in the art to which the present disclosure pertains without departing from the scope of the claims. Furthermore, such modifications should not be individually understood from the technical idea or perspective.

Claims

1. In an electronic device (401), A housing (410) including a first surface (411), a second surface (412) opposite to the first surface (411), and a hole (415) extending from the first surface (411) toward the second surface (412); A display module (430) including a screen display area (431) and a BM (black matrix) area surrounding the screen display area (431), and arranged on a first surface (411) of the housing (410); A sealing tape (450) placed between the housing (410) and the display module (430); and It includes a sealant (460) that is filled in the hole (415) of the housing (410) and is arranged adjacent to the housing (410) and the sealing tape (450). The above sealant (460) is An electronic device (401) that overlaps the BM area (435) of the display module (430) and the sealing tape (450) when viewed from the first side (411).

2. In paragraph 1, The above sealant (460) is An electronic device (401) totally separated from the display module (430).

3. In paragraph 1 or 2, The above sealant (460) is An electronic device (401) that is arranged to overlap the entire BM area (435) of the display module (430) when viewed from the first side (411).

4. In any one of paragraphs 1 to 3, The hole (415) of the above housing (410) is An electronic device (401) that overlaps entirely with the sealing tape (450) when viewed from the first side (411).

5. In any one of paragraphs 1 to 4, The above sealing tape (450) and the sealant (460) are made of a waterproof material, and are an electronic device (401).

6. In any one of paragraphs 1 to 5, The above housing (410) further includes a groove (419) formed on the first surface (411), The electronic device (401) further includes an auxiliary sealing tape (470) disposed in the groove (419).

7. In any one of paragraphs 1 to 6, The above auxiliary sealing tape (470) is An electronic device (401) having at least a portion of the sealing tape (450) overlapped when viewed from the first side (411).

8. In any one of paragraphs 1 to 7, Some areas of the above sealant (460) are An electronic device (401) that overlaps simultaneously with the sealing tape (450) and the auxiliary sealing tape (470) when viewed from the first side (411).

9. In any one of paragraphs 1 to 8, The above hole (415) is An electronic device (401) disposed inside the above groove (419).

10. In any one of paragraphs 1 to 9, At least a portion of the above sealant (460) An electronic device (401) that overlaps the groove (419) when viewed from the first surface (411).

11. In any one of paragraphs 1 to 10, The above auxiliary sealing tape (470) is An electronic device (401) arranged at a predetermined distance from the boundary of the groove (419) and the boundary of the hole (415).

12. In any one of paragraphs 1 to 11, The above auxiliary sealing tape (470) is It is spaced apart from the boundary of the above hole (415) by a first interval (G1), An electronic device (401) spaced apart from the boundary of the groove (419) by a second gap (G2) smaller than the first gap (G1).

13. In any one of paragraphs 1 to 12, The above electronic device (401) An electronic device (401) further comprising a display molding (480) coupled to one side of the display module (430) facing the first side (411) of the housing (410).

14. In any one of paragraphs 1 to 13, The above display molding (480) is An electronic device (401) that is non-overlapping with the sealant (460) when viewed from the first side (411).

15. In any one of paragraphs 1 to 14, The above sealing tape (450) is adhered to the display module (430), The above sealant (460) is adhered to the housing (410) and the sealing tape (450) to support the display module (430), an electronic device (401).

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