Electronic device and communication performing method using same

Abstract

According to one embodiment, an electronic device may comprise: a temperature sensor; a plurality of power amplifiers; a memory; and a processor operatively connected to the temperature sensor, the plurality of power amplifiers and the memory. The processor can: use a first power amplifier from among the plurality of power amplifiers so as to perform first communication; use a second power amplifier from among the plurality of power amplifiers so as to perform second communication; use the temperature sensor so as to check the temperature of the electronic device while the first communication and the second communication are performed; respond to a situation in which the temperature of the electronic device exceeds a set first threshold temperature, so as to terminate the second communication; and change a power amplifier that is to perform the first communication. Other various embodiments are possible.

Description

Electronic devices and methods for performing communication using the same

[0001] Embodiments of the present disclosure relate to an electronic device and a method for performing communication using the same.

[0002] Electronic devices that support wireless communication can transmit or receive communication signals based on a set communication frequency band for data transmission and reception with a base station. Recently, electronic devices can support not only stand-alone (SA) communication based on a single communication method, but also non-stand-alone (NSA) communication based on multiple communication methods. For example, electronic devices can support composite communication methods, such as ENDC (E-UTRA NR dual connectivity) communication and NEDC (NR E-UTRA dual connectivity) communication, based on multiple antennas and multiple power amplifiers (PAs). For example, ENDC communication can be a communication method that increases data transmission speed by utilizing both LTE communication and NR communication (e.g., 5G communication) based on LTE communication (e.g., 4G communication, LTE anchor) set as the main communication method. ENDC communication is a communication method in which an electronic device is simultaneously connected to an LTE base station and an NR base station, and the LTE base station can be set as the master base station. For example, NEDC communication can be a communication method that utilizes both NR and LTE communication to increase data transmission speeds, based on NR communication (e.g., 5G communication, NR anchor) established as the primary communication method. NEDC communication allows electronic devices to be connected to both NR and LTE base stations simultaneously, with the NR base station being designated as the master base station.

[0003] In one embodiment, the speed of communication (e.g., data communication) based on a composite communication method (e.g., ENDC, NEDC) may be relatively faster than the speed of communication based on a single communication method.

[0004] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above-described matters constitute prior art related to the present disclosure.

[0005] In a situation where multiple communication frequency bands are utilized simultaneously (e.g., EN-DC, NE-DC), if EN-DC-based communication is maintained, the internal temperature of the electronic device may rise and exceed a set temperature limit. For example, if the internal temperature of the electronic device exceeds the temperature limit, the electronic device may perform an LTE fallback function from the EN-DC communication mode to the LTE communication mode. For example, if the communication mode is switched from the EN-DC communication mode to the LTE communication mode, the communication performance may relatively deteriorate, and the internal temperature of the electronic device may decrease. If the internal temperature of the electronic device drops below the recovery temperature, the electronic device may switch back from the LTE communication mode to the EN-DC communication mode. If the communication mode is switched from the LTE communication mode to the EN-DC communication mode, the communication performance may be improved compared to the LTE communication mode, and the internal temperature of the electronic device may increase more quickly than the LTE communication mode.

[0006] In one embodiment, when the internal temperature of an electronic device exceeds a threshold, the electronic device performs an LTE fallback function from the EN-DC communication mode to the LTE communication mode. Since the temperature of the electronic device that has switched to the LTE communication mode decreases slowly, the duration of time that the LTE communication mode is maintained may be prolonged. This decrease in communication speed may be perceived by the user as lasting for a long time, which may reduce satisfaction with the communication speed.

[0007] The technical tasks to be achieved in this document are not limited to the technical tasks mentioned above, and other technical tasks not mentioned will be clearly understood by those with ordinary skill in the technical field to which this document pertains from the description below.

[0008] According to one embodiment, an electronic device may include a temperature sensor, a plurality of power amplifiers, a memory, and a processor operatively connected to the temperature sensor, the plurality of power amplifiers, and the memory. According to one embodiment, the processor may perform a first communication (e.g., LTE communication) using a first power amplifier among the plurality of power amplifiers. The processor may perform a second communication (e.g., NR communication) using a second power amplifier among the plurality of power amplifiers. The processor may check a temperature of the electronic device using the temperature sensor while performing the first communication and the second communication. The processor may release the second communication connection in response to a situation where the temperature of the electronic device exceeds a set first threshold temperature (e.g., a limit temperature). The processor may change a power amplifier that performs the first communication.

[0009] According to one embodiment, a method for performing communication in an electronic device may include an operation of performing a first communication using a first power amplifier among a plurality of power amplifiers, an operation of performing a second communication using a second power amplifier among the plurality of power amplifiers, an operation of checking a temperature of the electronic device (101) using a temperature sensor while performing the first communication and the second communication, an operation of releasing the second communication in response to a situation in which the temperature of the electronic device exceeds a set first threshold temperature, and an operation of changing a power amplifier to perform the first communication.

[0010] According to one embodiment, a non-transitory computer-readable storage medium (or, computer program product) storing one or more programs for executing a method for performing communication of an electronic device may be described. According to one embodiment, the one or more programs may include instructions that, when executed by a processor of the electronic device, perform an operation of performing a first communication using a first power amplifier among a plurality of power amplifiers, an operation of performing a second communication using a second power amplifier among the plurality of power amplifiers, an operation of checking a temperature of the electronic device (101) using a temperature sensor while performing the first communication and the second communication, an operation of releasing the second communication in response to a situation in which the temperature of the electronic device exceeds a set first threshold temperature, and an operation of changing a power amplifier to perform the first communication.

[0011] According to one embodiment, in response to the performance of an LTE fallback function, an electronic device can perform LTE communication by utilizing an unused power amplifier or a power amplifier having a relatively low temperature among a plurality of power amplifiers (e.g., a power amplifier (PA), a PAM), thereby rapidly lowering the internal temperature of the electronic device.

[0012] According to one embodiment, an electronic device may support multiple communication schemes based on a communication circuit including a plurality of power amplifiers. Each of the multiple power amplifiers is operatively connected to an antenna corresponding to at least one communication scheme and may be utilized for communication based on the antenna. For example, in a specific communication environment, some of the power amplifiers may not be utilized for communication. According to one embodiment, the electronic device may change the power amplifier utilized for LTE communication in a situation where NR communication is released and LTE communication is maintained, in response to the performance of an LTE fallback function. For example, the electronic device may select a power amplifier that is not utilized, a power amplifier that is relatively cool, or a power amplifier that has a relatively low utilization ratio among the multiple power amplifiers, and maintain LTE communication based on the selected power amplifier.

[0013] According to one embodiment, in response to the execution of an LTE fallback function, an electronic device may change a power amplifier (PAM) utilized for LTE communication, thereby relatively quickly lowering the internal temperature of the electronic device. As the internal temperature of the electronic device is rapidly lowered, the timing at which ENDC communication resumes may be advanced, thereby improving communication utilization of the electronic device. According to one embodiment, in a situation where the communication environment changes due to an increase in the internal temperature (e.g., LTE fallback), the electronic device may change the power amplifier utilized for LTE communication to lower the internal temperature.

[0014] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0015] In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0016] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.

[0017] FIG. 2 is an exemplary diagram illustrating a situation in which an ENDC communication situation according to one embodiment of the present disclosure is switched to LTE communication by an LTE fallback function, and then changed back from LTE communication to ENDC communication.

[0018] FIG. 3 is a block diagram of an electronic device according to one embodiment of the present disclosure.

[0019] FIG. 4 is a flowchart illustrating a first method for changing a power amplifier used for LTE communication in response to performance of an LTE fallback function according to one embodiment of the present disclosure.

[0020] FIG. 5 is a flowchart illustrating a second method for changing a power amplifier used for LTE communication in response to performance of an LTE fallback function according to one embodiment of the present disclosure.

[0021] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0022] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0023] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0024] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0025] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0026] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0027] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0028] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0029] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0030] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0031] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0032] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0033] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0034] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0035] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0036] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0037] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0038] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0039] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0040] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0041] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0042] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0043] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0044] FIG. 2 is an exemplary diagram illustrating a situation in which an ENDC communication situation according to one embodiment of the present disclosure is switched to LTE communication by an LTE fallback function, and then changed back from LTE communication to ENDC communication.

[0045] Referring to FIG. 2, an electronic device (e.g., an electronic device (101) of FIG. 1) may include a plurality of antennas (e.g., a first antenna (311) and a second antenna (312) of FIG. 3) that support a plurality of communication methods (e.g., LTE communication, NR communication) and a power amplifier (e.g., a power amplification module (320) of FIG. 3, a power amplifier (PA)) individually connected to each of the plurality of antennas. For example, the electronic device may support ENDC (E-UTRA NR dual connectivity) communication. ENDC communication may be a communication method that increases a data transmission speed by utilizing both LTE communication and NR communication (e.g., 5G communication) based on LTE communication (e.g., 4G communication, LTE anchor) that is set as a main communication method.

[0046] According to one embodiment, in a state of performing ENDC communication, the electronic device (101) can transmit and receive control signals and data signals based on a first communication (e.g., LTE communication), and can transmit and receive data signals based on a second communication (e.g., NR communication). In an ENDC communication situation, the communication speed according to data communication can be improved.

[0047] In operation 201, the electronic device (101) may be in an ENDC communication state that uses both LTE communication and NR communication. For example, the electronic device (101) may perform ENDC communication based on an antenna that supports LTE communication and an antenna that supports NR communication. According to one embodiment, ENDC communication may be performed faster than LTE communication, and the internal temperature of the electronic device (101) may rise more quickly.

[0048] In operation 202, if the internal temperature of the electronic device (101) exceeds a threshold temperature (e.g., a set first threshold temperature), the electronic device (101) may perform an LTE fallback function in operation 203. For example, if the LTE fallback function is performed, when ENDC communication (e.g., LTE communication + NR communication) is being performed, the LTE communication may be maintained while the NR communication is released. According to one embodiment, when the internal temperature of the electronic device (101) rises while exceeding a certain temperature (e.g., a threshold temperature), the electronic device (101) may perform the LTE fallback function to lower the internal temperature. When the electronic device (101) is performing LTE communication and NR communication, the communication method may be changed to perform only LTE communication.

[0049] If the internal temperature of the electronic device (101) is below the limit temperature in operation 202, the electronic device (101) can maintain ENDC communication in operation 201.

[0050] In operation 203, the electronic device (101) performs only LTE communication by the LTE fallback function, and the internal temperature of the electronic device (101) may drop. According to one embodiment, the electronic device (101) may change the type of power amplifier (PAM) when performing LTE communication by the LTE fallback function. The electronic device (101) may check a plurality of power amplifiers that support LTE communication, and may change an existing power amplifier to another power amplifier. For example, the electronic device (101) may check the temperature corresponding to each of the power amplifiers, and may change the existing power amplifier to a power amplifier having a relatively low temperature. As another example, the electronic device (101) may check the transmission / reception ratio corresponding to each of the power amplifiers, and may change the existing power amplifier to a power amplifier having a relatively low transmission / reception ratio. The electronic device (101) may perform LTE communication using the changed power amplifier. For example, the electronic device (101) may check the internal temperature periodically or aperiodically.

[0051] In operation 204, if the internal temperature of the electronic device (101) falls below the recovery temperature (e.g., the set second threshold temperature), the electronic device (101) may resume ENDC communication in operation 201. In response to the situation where the internal temperature falls below the recovery temperature, the electronic device (101) may change LTE communication to ENDC communication to improve communication efficiency.

[0052] According to one embodiment, the electronic device (101) can detect a situation in which the internal temperature exceeds the limit temperature due to the use of ENDC communication, and in response to the detection of the situation, can perform an LTE fallback function. In response to the performance of the LTE fallback function, the electronic device (101) can select a power amplifier that can lower the internal temperature relatively quickly from among a plurality of power amplifiers, and can perform LTE communication using the selected power amplifier. For example, the electronic device (101) can select a power amplifier whose temperature is calculated to be relatively low based on the temperatures corresponding to each of the plurality of power amplifiers. When performing LTE communication using a power amplifier whose temperature is calculated to be low, the internal temperature of the electronic device (101) can drop more quickly. According to one embodiment, in response to the performance of the LTE fallback function, the electronic device (101) can lower the internal temperature more quickly and reduce the time required to resume ENDC. According to one embodiment, the electronic device (101) can quickly resolve a heat generation problem caused by ENDC communication and provide an efficient communication service to a user.

[0053] FIG. 3 is a block diagram of an electronic device according to one embodiment of the present disclosure.

[0054] The electronic device (101) of FIG. 3 (e.g., the electronic device (101) of FIG. 1) may be at least partially similar to the electronic device (101) of FIG. 1, or may further include other embodiments of the electronic device. The electronic device (101) may include a plurality of antennas (e.g., a first antenna (311), a second antenna (312)) for supporting communication based on a plurality of communication frequency bands. The processor of the electronic device (101) (e.g., the processor (120) of FIG. 1) may perform ENDC communication that simultaneously performs LTE communication and NR communication by utilizing a plurality of communication frequency bands (e.g., an LTE frequency band, an NR frequency band). For example, the processor (120) may perform LTE communication based on an LTE frequency band corresponding to the first antenna (311), and NR communication based on an NR frequency band corresponding to the second antenna (312).

[0055] Referring to FIG. 3, the electronic device (101) may include a processor (e.g., processor (120) of FIG. 1), a memory (e.g., memory (130) of FIG. 1), a power amplification module (320), a temperature sensor (370), and / or a communication circuit (390) (e.g., communication module (190) of FIG. 1). The communication circuit (390) may include a plurality of electrically connected antennas (e.g., a first antenna (311), a second antenna (312)). A power amplification module (320) may be disposed between the processor (120) and the antenna. The power amplification module (320) may include a plurality of power amplifiers (e.g., PAM1 (321), PAM2 (322), PAM3 (323)). The power amplification module (320) may be a component including at least one power amplifier. For example, the processor (120) may utilize a first power amplifier (321) (PAM1) operatively or electrically connected to the first antenna (311) to perform network communication (e.g., LTE communication) based on a communication frequency band (e.g., LTE frequency band) corresponding to the first antenna (311). For another example, the processor (120) may utilize a second power amplifier (322) (PAM2) operatively or electrically connected to the second antenna (312) to perform network communication (e.g., NR communication) based on a communication frequency band (e.g., NR frequency band) corresponding to the second antenna (312). According to one embodiment, the electronic device (101) may perform ENDC communication that substantially simultaneously utilizes a plurality of communication methods (e.g., LTE communication, NR communication) based on a plurality of antennas.

[0056] According to one embodiment, the processor (120) of the electronic device (101) may execute a program (e.g., program (140) of FIG. 1) stored in the memory (130) to control at least one other component (e.g., hardware or software component) and perform various data processing or calculations. For example, the processor (120) may use a temperature sensor (370) to check the internal temperature of the electronic device (101), and, based on temperature-related information (331) stored in the memory (130), determine whether the checked internal temperature exceeds a set first threshold temperature. If the processor (120) determines that the internal temperature exceeds the set first threshold temperature, the processor (120) may change a communication method in the electronic device (101) based on communication connection information (332) stored in the memory (130). For example, the processor (120) may change a power amplifier (e.g., PAM1 (321), PAM2 (322), PAM3 (323)) connected to a first antenna (311) utilized for a first communication method (e.g., LTE communication) in response to a situation in which the internal temperature exceeds a set first threshold temperature. The processor (120) may change the power amplifier corresponding to the first communication method in order to lower the internal temperature of the electronic device (101) more quickly. According to one embodiment, the processor (120) may be operatively, functionally, and / or electrically connected to the memory (130), the power amplification module (320), and / or the communication circuit (390).

[0057] According to one embodiment, the memory (130) may store temperature-related information (331) related to the internal temperature of the electronic device (101) and communication connection information (332) related to the communication method of the electronic device (101). For example, the temperature-related information (331) may include a limit temperature (e.g., a first threshold temperature) at which the operation of the electronic device (101) is partially restricted and a recovery temperature (e.g., a second threshold temperature) at which the restriction on the operation of the electronic device (101) is released. For example, the communication connection information (332) may include, when communication according to the first communication method is performed in the electronic device (101), the type of antenna corresponding to the first communication method, the type of power amplifier connected to the corresponding antenna, and connection information between internal components corresponding to the first communication method.

[0058] According to one embodiment, the processor (120) may periodically or aperiodically check the internal temperature of the electronic device (101) using the temperature sensor (370). When ENDC communication is performed, the processor (120) may detect whether the internal temperature of the electronic device (101) exceeds a first threshold temperature (e.g., a limit temperature). In response to a situation in which the internal temperature of the electronic device (101) exceeds the first threshold temperature, the processor (120) may change a power amplifier connected to an antenna corresponding to the first communication method in order to lower the internal temperature more quickly. The processor (120) may select a power amplifier to be changed based on the communication connection information (332) and may connect the selected power amplifier to the antenna corresponding to the first communication method.

[0059] According to one embodiment, the power amplification module (320) may include at least one power amplifier (e.g., PAM1 (321), PAM2 (322), PAM3 (323)). For example, the power amplifier may perform a function of at least partially amplifying a transmission signal transmitted externally through an antenna and a function of processing a reception signal obtained through the antenna. For example, when performing a first communication method, the processor (120) may select a first antenna (311) supporting the first communication method and identify one power amplifier connected to the selected first antenna (311). The processor (120) may identify a connection structure between components corresponding to a specific communication method based on communication connection information (332).

[0060] According to one embodiment, the electronic device (101) may include a plurality of power amplifiers (e.g., PAM1 (321), PAM2 (322), PAM3 (323)), and each power amplifier may be utilized under the conditions set forth in Table 1 below.

[0061] Power amplifier frequency band communication method PAM3 (323) UHBNR communication PAM2 (322) MB, HBLTE communication, NR communication PAM1 (321) LB, MBLTE communication HBLTE communication, NR communication

[0062] (Referring to Table 1), the processor (120) can perform NR communication (e.g., 5G communication) corresponding to the UHB (ultra-high band) frequency band (e.g., ultra-high frequency band) based on the antenna to which PAM3 (323) is connected. The processor (120) can perform a communication method (e.g., LTE communication, NR communication) corresponding to the MB (middle band) frequency band (e.g., intermediate frequency band) and the HB (high band) frequency band (e.g., high frequency band) based on the antenna to which PAM2 (322) is connected. The processor (120) can perform LTE communication (e.g., 4G communication) corresponding to the LB (low band) frequency band (e.g., low frequency band) and the MB (middle band) frequency band (e.g., intermediate frequency band) based on the antenna to which PAM1 (321) is connected, and can perform a communication method (e.g., LTE communication, NR communication) corresponding to the HB (high band) frequency band (e.g., high frequency band) based on the antenna to which PAM1 (321) is connected. For example, LTE communication (e.g., 4G communication) can be performed based on the LB frequency band, the MB frequency band, and the HB frequency band. NR communication (e.g., 5G communication) can be performed based on the MB frequency band, the HB frequency band, and the UHB frequency band.

[0063] According to one embodiment, when NR communication corresponding to a UHB frequency band is performed, the electronic device (101) may electrically connect PAM3 (323) to an antenna corresponding to the NR communication. When LTE communication corresponding to an HB frequency band is performed, the electronic device (101) may electrically connect either PAM2 (322) or PAM1 (321) to an antenna corresponding to the LTE communication. For example, when ENDC communication (e.g., LTE communication + NR communication) is performed, the electronic device (101) may connect PAM1 (321) to a first antenna (311) corresponding to LTE communication, and PAM3 (323) may be connected to a second antenna (312) corresponding to NR communication.

[0064] According to one embodiment, the first antenna (311) of the communication circuit (390) may include an antenna that supports the first communication (e.g., LTE communication), and the second antenna (312) of the communication circuit (390) may support the second communication (e.g., NR communication). When performing ENDC communication, the electronic device (101) may perform the first communication (e.g., LTE communication) based on the first antenna (311) and the second communication (e.g., NR communication) based on the second antenna (312).

[0065] According to one embodiment, when ENDC communication is performed, the electronic device (101) may perform first communication (e.g., LTE communication) based on a first communication frequency (e.g., a frequency band for LTE communication) using a first power amplifier (e.g., PAM1 (321)) among a plurality of power amplifiers, and may perform second communication (e.g., NR communication) based on a second communication frequency (e.g., a frequency band for NR communication) using a third power amplifier (e.g., PAM3 (323)) among a plurality of power amplifiers. When performing ENDC communication, the electronic device (101) may substantially perform the first communication (e.g., LTE communication) and the second communication (e.g., NR communication) together.

[0066] According to one embodiment, the temperature sensor (370) can be at least partially disposed inside the electronic device (101) and can measure the internal temperature of the electronic device (101). The processor (120) can measure the internal temperature of the electronic device (101) using the temperature sensor (370) and, based on the measured internal temperature, can at least partially control the operation of the electronic device (101).

[0067] According to one embodiment, in a situation where ENDC communication is being performed, the processor (120) of the electronic device (101) may measure the internal temperature of the electronic device (101) using the temperature sensor (370). The processor (120) may detect a situation where the measured internal temperature exceeds a set first threshold temperature (e.g., a limit temperature), and in response to detecting the situation, may perform an LTE fallback function. For example, the LTE fallback function may be a function that releases NR communication and maintains only LTE communication in a state where LTE communication (e.g., 4G communication) and NR communication (e.g., 5G communication) are being performed simultaneously (e.g., an ENDC communication state). LTE communication may be performed based on a first antenna (311) and a first power amplifier (e.g., PAM1 (321)) connected to the first antenna (311), and NR communication may be performed based on a second antenna (312) and a third power amplifier (e.g., PAM3 (323)) connected to the second antenna (312). According to one embodiment, in response to the performance of the LTE fallback function, the electronic device (101) may release the NR communication based on the second antenna (312) and maintain only the LTE communication based on the first antenna (311). The processor (120) may change the power amplifier electrically or operatively connected to the first antenna (311) in response to the performance of the LTE fallback function. For example, the processor (120) may change an existing power amplifier (e.g., a first power amplifier, PAM1 (321)) connected to the first antenna (311) to a second power amplifier (e.g., PAM2 (322)) not used for ENDC communication, or may change the existing power amplifier to a third power amplifier (e.g., PAM3 (323)) utilized in the released NR communication.In one embodiment, the second power amplifier (PAM2) may be at a relatively lower temperature than the first power amplifier (PAM1) because it is not utilized in ENDC communication.

[0068] According to one embodiment, in a situation where ENDC communication is being performed, the processor (120) may perform LTE communication using a first power amplifier (e.g., PAM1 (321)) based on a frequency division duplexing (FDD) scheme, and may perform NR communication using a second power amplifier (e.g., PAM2 (322)) based on a time division duplexing (TDD) scheme. In response to performing the LTE fallback function, the processor (120) may release the NR communication using the second power amplifier (e.g., PAM2 (322)) and maintain only the LTE communication using the first power amplifier (e.g., PAM1 (321)). In response to performing the LTE fallback function, the processor (120) may change the first power amplifier (321) electrically or operatively connected to the first antenna (311) to another power amplifier. For example, the first power amplifier (321) according to the frequency division method may have a relatively higher temperature than the second power amplifier (322) according to the time division method. Accordingly, the processor (120) may change the first power amplifier (321) electrically or operatively connected to the first antenna (311) to the second power amplifier (322) in response to the performance of the LTE fallback function. According to one embodiment, the processor (120) may change the first power amplifier (321) being used for LTE communication to the second power amplifier (322) in response to the performance of the LTE fallback function, and may perform LTE communication using the changed second power amplifier (322).

[0069] According to one embodiment, in a situation where ENDC communication is being performed, the processor (1120) may perform LTE communication using the first power amplifier (321) based on a time division duplex (TDD) scheme, and may perform NR communication using the second power amplifier (322) based on a time division duplex (TDD) scheme. In response to the performance of the LTE fallback function, the processor (120) may release the NR communication using the second power amplifier (e.g., PAM2 (322)) and maintain only the LTE communication using the first power amplifier (e.g., PAM1 (321)). In response to the performance of the LTE fallback function, the processor (120) may calculate a first transmission / reception rate (e.g., first duty rate) corresponding to the first power amplifier (321) and a second transmission / reception rate (e.g., second duty rate) corresponding to the second power amplifier (322). The processor (120) can compare and analyze the first transmission / reception ratio and the second transmission / reception ratio, and select a power amplifier having a relatively low transmission / reception ratio. For example, a low transmission / reception ratio may mean that the power amplifier is relatively less utilized in a communication situation, and that the temperature of the power amplifier is relatively low. According to one embodiment, when the second transmission / reception ratio is lower than the first transmission / reception ratio, the processor (120) can change the first power amplifier (321) being used for LTE communication to the second power amplifier (322) when performing the LTE fallback function, and perform LTE communication using the changed second power amplifier (322).

[0070] According to one embodiment, an electronic device (e.g., electronic device (101) of FIGS. 1 and 3) may include a temperature sensor (e.g., temperature sensor (370) of FIG. 3), a plurality of power amplifiers (e.g., PAM1 (321), PAM2 (322), PAM3 (323) of FIG. 3), a memory (e.g., memory (130) of FIGS. 1 and 3), and a processor (e.g., processor (120) of FIGS. 1 and 3) operatively connected to the temperature sensor (370), the power amplification module (320), and the memory (130). According to one embodiment, the processor (120) may perform a first communication (e.g., LTE communication) using a first power amplifier (321) among the plurality of power amplifiers (321, 322, 323). The processor (120) can perform second communication (e.g., NR communication) using a second power amplifier (322) among a plurality of power amplifiers (321, 322, 323). While performing the first communication and the second communication, the processor (120) can check the temperature (e.g., internal temperature) of the electronic device (101) using a temperature sensor (370). The processor (120) can release the second communication in response to a situation in which the temperature of the electronic device (101) exceeds a set first threshold temperature. The processor (120) can change the power amplifier that performs the first communication.

[0071] According to one embodiment, the processor (120) can identify a third power amplifier (323) that is not used for the first communication and the second communication among the plurality of power amplifiers (321, 322, 323). In response to a situation in which the temperature of the electronic device (101) exceeds a set first threshold temperature, the processor (120) can change the first power amplifier (321) to the third power amplifier (323). The processor (120) can perform the first communication using the changed third power amplifier (323).

[0072] According to one embodiment, the processor (120) may change the first power amplifier (321) corresponding to the first communication to a second power amplifier (322) in response to the release of the second communication. The second power amplifier (322) may be supplied with relatively lower power than the first power amplifier (321) in a communication situation.

[0073] According to one embodiment, the processor (120) may change the first power amplifier (321) corresponding to the first communication to a second power amplifier (322) in response to the release of the second communication. The first power amplifier (321) may support the first communication based on frequency division duplexing (FDD), and the second power amplifier (322) may support the second communication based on time division duplexing (TDD).

[0074] According to one embodiment, the processor (120) may, in response to a situation in which the temperature of the electronic device (101) exceeds a set first threshold temperature, determine a first transmission / reception ratio corresponding to the first communication and a second transmission / reception ratio corresponding to the second communication. Based on the first transmission / reception ratio and the second transmission / reception ratio, the processor (120) may change the first power amplifier (321) connected to the first communication to the second power amplifier (322) if the first transmission / reception ratio is relatively higher than the second transmission / reception ratio.

[0075] According to one embodiment, the processor (120) may maintain the first power amplifier (321) corresponding to the first communication based on the first transmission / reception ratio and the second transmission / reception ratio, if the first transmission / reception ratio is relatively lower than the second transmission / reception ratio.

[0076] In one embodiment, the processor (120) may, in response to the release of the second communication, determine the temperature of the electronic device (101) using the temperature sensor (370). The processor (120) may, in response to a situation where the temperature of the electronic device (101) drops below a set second threshold temperature, resume performing the second communication.

[0077] According to one embodiment, the processor (120) may resume performing a second communication based on a second power amplifier (322) when a first communication is being performed based on a first power amplifier (321).

[0078] According to one embodiment, the processor (120) may change the first power amplifier (321) corresponding to the first communication to the second power amplifier (322) in response to a situation in which the temperature of the electronic device (101) drops below a set second threshold temperature. The processor (120) may resume performing the second communication based on the first power amplifier (321).

[0079] According to one embodiment, the processor (120) can transmit and receive control signals and data signals based on the first communication. The processor (120) can transmit and receive data signals based on the second communication. The processor (120) can determine whether to release a communication connection corresponding to the second communication through a control signal based on the first communication.

[0080] FIG. 4 is a flowchart illustrating a first method for changing a power amplifier used for LTE communication in response to performing an LTE fallback function according to an embodiment of the present disclosure. FIG. 5 is a flowchart illustrating a second method for changing a power amplifier used for LTE communication in response to performing an LTE fallback function according to an embodiment of the present disclosure.

[0081] In the following examples, the operations may be performed sequentially, but are not necessarily sequential. For example, the order of the operations may be changed, and at least two operations may be performed in parallel.

[0082] According to one embodiment, some of the operations illustrated in FIG. 4 may be performed identically to the operations illustrated in FIG. 5, and some of the operations in FIG. 5 may be replaced with the description of the operations in FIG. 4.

[0083] According to one embodiment, operations 401 to 413 illustrated in FIG. 4 and operations 501 to 515 illustrated in FIG. 5 may be understood to be performed in a processor (e.g., processor (120) of FIGS. 1 and 3) of an electronic device (e.g., electronic device (101) of FIGS. 1 and 3).

[0084] The electronic device (101) of FIGS. 4 and 5 may be at least partially similar to the electronic device (101) of FIGS. 1 and 3, or may further include other embodiments of the electronic device. The electronic device (101) may include a plurality of antennas (e.g., the first antenna (311) and the second antenna (312) of FIG. 3) to support communication (e.g., LTE communication, NR communication) based on a plurality of communication frequency bands (e.g., LTE frequency band, NR frequency band). The processor (120) of the electronic device (101) may perform ENDC communication that performs LTE communication and NR communication simultaneously by utilizing the plurality of communication frequency bands (e.g., LTE frequency band, NR frequency band). For example, the processor (120) may perform LTE communication based on the LTE frequency band corresponding to the first antenna (311), and simultaneously perform NR communication based on the NR frequency band corresponding to the second antenna (312). A power amplification module (e.g., power amplification module (320) of FIG. 3) including at least one power amplifier (e.g., PAM1 (321), PAM2 (322), PAM3 (323) of FIG. 3) may be disposed between the processor (120) and the antenna. According to one embodiment, a first power amplifier (e.g., PAM1 (321), a power amplifier supporting an LTE frequency band) may be operatively or electrically connected to a first antenna (311) (e.g., an LTE antenna). A second power amplifier (e.g., PAM3 (323), a power amplifier supporting an NR frequency band) may be operatively or electrically connected to a second antenna (312) (e.g., an NR antenna).

[0085] Referring to FIG. 4, in operation 401, the processor (120) of the electronic device (101) may perform first communication (e.g., LTE communication) based on a first communication frequency (e.g., LTE frequency band) using a first power amplifier (e.g., PAM1 (321)). For example, the processor (120) may perform LTE communication corresponding to the LTE frequency band based on a first antenna (311) (e.g., LTE antenna). The first power amplifier (e.g., PAM1 (321)) may be operatively or electrically connected to the first antenna (311) and may be utilized for transmission signals and reception signals according to LTE communication.

[0086] In operation 403, the processor (120) may perform second communication (e.g., NR communication) based on a second communication frequency (e.g., NR frequency band) using a second power amplifier (e.g., PAM3 (323)). For example, the processor (120) may perform NR communication corresponding to the NR frequency band based on a second antenna (312) (e.g., NR antenna). The second power amplifier (e.g., PAM3 (323)) may be operatively or electrically connected to the second antenna (312) and may be utilized for transmission signals and reception signals according to NR communication.

[0087] In operations 401 and 403, the processor (120) may be in an ENDC (E-UTRA NR dual connectivity) communication state in which the first communication and the second communication are substantially used together. For example, the ENDC communication may be a communication method that increases a data transmission speed by utilizing LTE communication and NR communication (e.g., the second communication of operation 403, 5G communication) together based on LTE communication (e.g., the first communication of operation 401, 4G communication, LTE anchor) set as the main communication method.

[0088] In operation 405, the processor (120) may measure the temperature (e.g., internal temperature) of the electronic device (101) using a temperature sensor (e.g., temperature sensor (370) of FIG. 3) and determine whether the temperature exceeds a set first threshold temperature (e.g., limit temperature). For example, the set first threshold temperature may be stored in a memory (e.g., memory (130) of FIGS. 1 and 3). According to one embodiment, a situation in which the internal temperature of the electronic device (101) exceeds the set first threshold temperature may include a situation in which the electronic device (101) is overheated due to ENDC communication.

[0089] If the internal temperature of the electronic device (101) exceeds the set first threshold temperature in operation 405, the processor (120) may disconnect the second communication (e.g., NR communication) in operation 407. Operation 407 may include a situation in which an LTE fallback function is performed in an ENDC communication state. For example, the processor (120) may stop the ENDC communication. The processor (120) may maintain the first communication (e.g., LTE communication) while disconnecting the second communication (e.g., NR communication).

[0090] In operation 409, the processor (120) may change the power amplifier used for the first communication (e.g., LTE communication). For example, the processor (120) may change the first power amplifier (e.g., PAM1 (321)) used for the first communication to another power amplifier (e.g., PAM2 (322) or PAM3 (323)). For example, the other power amplifier (e.g., PAM2 (322) or PAM3 (323)) to be changed may be supplied with relatively lower power than the first power amplifier (e.g., PAM1 (321)). The processor (120) may perform a switching operation so that the first power amplifier (e.g., PAM1 (321)) connected to the first antenna (311) is changed to another power amplifier (e.g., PAM2 (322) or PAM3 (323)). According to one embodiment, the processor (120) may change the first power amplifier (e.g., PAM1 (321)) to another power amplifier that is not used in the first communication (e.g., LTE communication) and the second communication (e.g., MR communication). According to one embodiment, the processor (120) may select a power amplifier having a relatively low temperature among a plurality of power amplifiers, and change the first power amplifier (e.g., PAM1 (321)) to the selected power amplifier. According to one embodiment, when the electronic device (101) performs the first communication (e.g., LTE communication), by using the changed power amplifier, the internal temperature of the electronic device (101) may be lowered relatively quickly.

[0091] In operation 411, the processor (120) may perform a first communication (e.g., LTE communication) based on a first communication frequency (e.g., LTE frequency band) using a modified power amplifier (e.g., PAM2 (322)). In response to performing the LTE fallback function, the processor (120) may maintain only the first communication (e.g., LTE communication) while releasing the second communication (e.g., NR communication).

[0092] In operation 413, the processor (120) may determine whether the temperature of the electronic device (101) is below a set second threshold temperature (e.g., recovery temperature). For example, in a situation where the first communication (e.g., LTE communication) is maintained by LTE fallback, the processor (120) may periodically or aperiodically check the internal temperature of the electronic device (101) based on the temperature sensor (370). If the internal temperature of the electronic device (101) is determined to be below the set second threshold temperature, the processor (120) may resume ENDC communication in operation 401. For example, the processor (120) may perform a switching operation so that the second communication (e.g., NR communication) is performed simultaneously with the first communication (e.g., LTE communication). For example, when resuming ENDC communication, a PAM3 (323) corresponding to a second power amplifier may be connected to the second antenna (312), and a second communication (e.g., NR communication) may be performed using the PAM3 (323). In operation 413, the processor (120) may be performing the first communication using the changed power amplifier (e.g., PAM2 (322)), and in operation 401, the processor (120) may continue to perform the first communication while maintaining the changed power amplifier (e.g., PAM2 (322)). According to one embodiment, when resuming ENDC communication, the processor (120) may connect a PAM1 (321) corresponding to the first power amplifier to the first antenna (311), and may perform the first communication (e.g., LTE communication) using the PAM1 (321).

[0093] Referring to FIG. 5, operations 501 to 507 are the same operations as operations 401 to 407 of FIG. 4 described above, and thus may be replaced with descriptions related to operations 401 to 407.

[0094] In operation 501, the processor (120) may perform a first communication (e.g., LTE communication) based on a first communication frequency (e.g., LTE frequency band) using a first power amplifier (e.g., PAM1 (321)). For example, the first power amplifier (e.g., PAM1 (321)) may be operatively or electrically connected to a first antenna (311) and may support communication in the LTE frequency band.

[0095] In operation 503, the processor (120) may perform a second communication (e.g., NR communication) based on a second communication frequency (e.g., NR frequency band) using a second power amplifier (e.g., PAM2 (322)). For example, the second power amplifier (e.g., PAM2 (322)) may be operatively or electrically connected to a second antenna (312) and may support communication in the NR frequency band.

[0096] In operations 501 and 503, the processor (120) may be in an ENDC (E-UTRA NR dual connectivity) communication state in which the first communication and the second communication are substantially used together. The processor (120) may perform the first communication (e.g., LTE communication) using PAM1 (321), and may perform the second communication (e.g., NR communication) together with the first communication using PAM2 (322).

[0097] In operation 505, the processor (120) may use the temperature sensor (370) to measure the temperature (e.g., internal temperature) of the electronic device (101) and determine whether the temperature exceeds a set first threshold temperature (e.g., limit temperature).

[0098] If the internal temperature of the electronic device (101) exceeds the set first threshold temperature in operation 505, the processor (120) may disconnect the second communication (e.g., NR communication) in operation 507. Operation 507 may be a situation in which the LTE fallback function is performed in the ENDC communication state.

[0099] In operation 509, the processor (120) may determine whether a first duty ratio (e.g., a first transmission / reception ratio) corresponding to a first communication (e.g., an LTE communication) is higher than a second duty ratio (e.g., a second transmission / reception ratio) corresponding to a second communication (e.g., an NR communication). For example, the processor (120) may check a first transmission / reception ratio corresponding to a first power amplifier (e.g., a PAM1 (321)) connected to a first antenna (311) and a second transmission / reception ratio corresponding to a second power amplifier (e.g., a PAM2 (322)) connected to a second antenna (312). In response to the performance of the LTE fallback function, the processor (120) may select a power amplifier whose transmission / reception ratio is checked to be relatively low in order to lower the internal temperature of the electronic device (101) more quickly. For example, a low transmission / reception ratio may mean that the power amplifier is relatively less utilized in a communication situation, and may mean that the temperature of the power amplifier is relatively low. According to one embodiment, the processor (120) may compare a first duty ratio (e.g., a first transmission / reception ratio) and a second duty ratio (e.g., a second transmission / reception ratio) to select a power amplifier having a relatively low temperature.

[0100] If the first duty ratio (e.g., the first transmission / reception ratio) is higher than the second duty ratio (e.g., the second transmission / reception ratio) in operation 509, the processor (120) may change the first power amplifier (e.g., PAM1 (321)) being used for the first communication (e.g., LTE communication) to the second power amplifier (e.g., PAM2 (322)) in operation 511, and perform the first communication (e.g., LTE communication) based on the first communication frequency (e.g., LTE frequency band) based on the changed power amplifier (e.g., PAM2 (322)). For example, the fact that the first duty ratio (e.g., the first transmission / reception ratio) is relatively higher than the second duty ratio (e.g., the second transmission / reception ratio) may include that the temperature of the PAM1 (321) corresponding to the first power amplifier is relatively higher than the temperature of the PAM2 (322) corresponding to the second power amplifier. It can be confirmed that the PAM1 (321), which corresponds to the first power amplifier, has a relatively higher temperature than the PAM2 (322), which corresponds to the second power amplifier. According to one embodiment, in response to the performance of the LTE fallback function, the electronic device (101) can select a power amplifier having a relatively lower temperature among a plurality of power amplifiers to maintain LTE communication, and can perform LTE communication using the selected power amplifier. By using a power amplifier having a lower temperature, the internal temperature of the electronic device (101) can be lowered relatively quickly.

[0101] According to one embodiment, when the second communication (e.g., NR communication) is performed based on time division duplexing (TDD), the processor (120) can compare and analyze a first duty ratio (e.g., a first transmission / reception ratio) corresponding to the first communication (e.g., LTE communication) and a second duty ratio (e.g., a second transmission / reception ratio) corresponding to the second communication (e.g., NR communication). For example, when the second communication (e.g., NR communication) is performed based on a high band (HB) frequency band (e.g., a high frequency band), the second communication may be performed according to a time division duplexing (TDD) method. Referring to the above-described (Table 1), PAM1 (321) and PAM2 (322) can support NR communication (e.g., the second communication) based on the HB frequency band (e.g., a high frequency band).

[0102] According to one embodiment, in a situation where a second communication (e.g., NR communication) is performed using PAM1 (321) and PAM2 (322), the processor (120) can compare a first transmission / reception ratio corresponding to the first communication and a second transmission / reception ratio corresponding to the second communication, and select a power amplifier having a relatively low transmission / reception ratio (e.g., a relatively low temperature). According to one embodiment, in response to the performance of the LTE fallback function, the electronic device (101) can perform LTE communication using a power amplifier having a relatively low transmission / reception ratio (e.g., a relatively low temperature), and can lower the internal temperature of the electronic device (101) more quickly.

[0103] According to one embodiment, when a first communication (e.g., LTE communication) is performed based on a frequency division duplexing (FDD) scheme and a second communication (e.g., NR communication) is performed based on a time division duplexing (TDD) scheme, a power amplifier corresponding to the second communication may be confirmed to have a relatively lower temperature than a power amplifier corresponding to the first communication. For example, when an LTE fallback function is performed in a state in which an LTE communication according to a frequency division duplexing (FDD) scheme and an NR communication according to a time division duplexing (TDD) scheme are performed (e.g., ENDC communication), operation 509 of FIG. 5 may be omitted. The processor (120) of the electronic device (101) can change the first power amplifier used in the first communication (e.g., (FDD)_LTE communication) to the second power amplifier used in the second communication (e.g., (TDD)_NR communication) without comparing the transmission and reception ratios, and can perform the first communication based on the changed second power amplifier.

[0104] If the first duty ratio (e.g., the first transmission / reception ratio) is lower than the second duty ratio (e.g., the second transmission / reception ratio) in operation 509, the processor (120) may perform the first communication (e.g., LTE communication) based on the first communication frequency (e.g., LTE frequency band) while maintaining the first power amplifier (e.g., PAM1 (321)) being used for the first communication (e.g., LTE communication) in operation 513. The fact that the first transmission / reception ratio is lower than the second transmission / reception ratio may mean that the temperature of the PAM1 (321) corresponding to the first power amplifier is relatively lower than that of the PAM2 (322) corresponding to the second power amplifier. According to one embodiment, the electronic device (101) may, in response to performing the LTE fallback function, select a power amplifier having a relatively lower temperature among a plurality of power amplifiers while maintaining the LTE communication, and perform the LTE communication using the selected power amplifier. By using a low temperature power amplifier, the internal temperature of the electronic device (101) can be lowered relatively quickly.

[0105] In operation 515, the processor (120) may determine whether the temperature of the electronic device (101) is below a set second threshold temperature (e.g., recovery temperature). For example, in a situation where the first communication (e.g., LTE communication) is maintained by LTE fallback, the processor (120) may periodically or aperiodically check the internal temperature of the electronic device (101) based on the temperature sensor (370). If the internal temperature of the electronic device (101) is determined to be below the set second threshold temperature, the processor (120) may resume ENDC communication in operation 501. For example, the processor (120) may perform a switching operation so that the second communication (e.g., NR communication) is performed simultaneously with the first communication (e.g., LTE communication). For example, when resuming ENDC communication, a PAM2 (322) corresponding to a second power amplifier may be connected to the second antenna (312), and a second communication (e.g., NR communication) may be performed using the PAM2 (322). In operation 513, the processor (120) may be performing the first communication using the changed power amplifier (e.g., PAM2 (322)), and in operation 501, the processor (120) may change the changed power amplifier (e.g., PAM2 (322)) back to the first power amplifier (e.g., PAM1 (321)) and perform the first communication using the first power amplifier. According to one embodiment, the processor (120) may electrically connect the PAM1 (321) corresponding to the first power amplifier to the first antenna (311) to resume ENDC communication, and perform the first communication (e.g., LTE communication) using the PAM1 (321).

[0106] A method for performing communication in an electronic device according to one embodiment may include an operation of performing a first communication using a first power amplifier (321) among a plurality of power amplifiers (321, 322, 323), an operation of performing a second communication using a second power amplifier (322) among the plurality of power amplifiers (321, 322, 323), an operation of checking a temperature of the electronic device (101) using a temperature sensor (370) while performing the first communication and the second communication, an operation of releasing the second communication in response to a situation in which the temperature of the electronic device (101) exceeds a set first threshold temperature, and an operation of changing a power amplifier to perform the first communication.

[0107] A method according to one embodiment may further include an operation of identifying a third power amplifier (323) that is not used for the first communication and the second communication among the plurality of power amplifiers (321, 322, 323), an operation of changing the first power amplifier (321) to the third power amplifier (323) in response to a situation in which the temperature of the electronic device (101) exceeds a set first threshold temperature, and an operation of performing the first communication using the changed third power amplifier (323).

[0108] An operation of changing the power amplifier corresponding to the first communication according to one embodiment may include an operation of changing the first power amplifier (321) corresponding to the first communication to the second power amplifier (322) in response to the release of the second communication. According to one embodiment, the second power amplifier (322) may be supplied with relatively lower power than the first power amplifier (321) in a communication situation.

[0109] An operation of changing the power amplifier corresponding to the first communication according to one embodiment may include an operation of changing the first power amplifier (321) corresponding to the first communication to the second power amplifier (322) in response to the release of the second communication. According to one embodiment, the first power amplifier (321) may support the first communication based on a frequency division duplexing (FDD) scheme, and the second power amplifier (322) may support the second communication based on a time division duplexing (TDD) scheme.

[0110] According to one embodiment, the method may further include, in response to a situation in which the temperature of the electronic device (101) exceeds the set first threshold temperature, an operation of checking a first transmission / reception ratio corresponding to the first communication and a second transmission / reception ratio corresponding to the second communication; an operation of changing the first power amplifier (321) connected to the first communication to the second power amplifier (322) if the first transmission / reception ratio is relatively higher than the second transmission / reception ratio based on the first transmission / reception ratio and the second transmission / reception ratio; and an operation of maintaining the first power amplifier (321) corresponding to the first communication if the first transmission / reception ratio is relatively lower than the second transmission / reception ratio based on the first transmission / reception ratio and the second transmission / reception ratio.

[0111] A method according to one embodiment may further include an operation of checking the temperature of the electronic device (101) using the temperature sensor (370) in response to the release of the second communication, and an operation of resuming the performance of the second communication in response to a situation in which the temperature of the electronic device (101) drops below a set second threshold temperature.

[0112] A method according to one embodiment may further include an operation of resuming performance of the second communication based on the second power amplifier (322) when the first communication is being performed based on the first power amplifier (321).

[0113] A method according to one embodiment may further include, in response to a situation in which the temperature of the electronic device (101) drops below a set second threshold temperature, an operation of changing the first power amplifier (321) corresponding to the first communication to the second power amplifier (322), and an operation of resuming performance of the second communication based on the first power amplifier (321).

[0114] A method according to one embodiment may further include an operation of transmitting and receiving a control signal and a data signal based on the first communication, an operation of transmitting and receiving a data signal based on the second communication, and an operation of determining whether to release a communication connection corresponding to the second communication through a control signal based on the first communication.

[0115] According to one embodiment, a non-transitory computer-readable storage medium storing one or more programs for executing a method for performing communication of an electronic device (101) may be described. According to one embodiment, the one or more programs may include instructions that, when executed by a processor (120) of the electronic device (101), perform a first communication using a first power amplifier (321) among a plurality of power amplifiers (321, 322, 323), perform a second communication using a second power amplifier (322) among the plurality of power amplifiers (321, 322, 323), check a temperature of the electronic device (101) using a temperature sensor (370) while performing the first communication and the second communication, release the second communication in response to a situation in which the temperature of the electronic device (101) exceeds a set first threshold temperature, and change a power amplifier that performs the first communication.

[0116] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0117] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0118] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0119] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0120] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0121] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, Temperature sensor (370); A plurality of power amplifiers (321, 322, 323); memory (130); and It includes a processor (120) operatively connected to the temperature sensor (370), the plurality of power amplifiers (321, 322, 323), and the memory (130). The above processor (120) The first communication is performed using the first power amplifier (321) among the above multiple power amplifiers, The second communication is performed using the second power amplifier (322) among the above multiple power amplifiers, During the above first communication and the above second communication, the temperature of the electronic device (101) is checked using the temperature sensor (370), In response to a situation where the temperature of the electronic device (101) exceeds a set first threshold temperature, the second communication is released, An electronic device for changing a power amplifier to perform the first communication.

2. In paragraph 1, The above processor (120) Among the above multiple power amplifiers (321, 322, 323), the third power amplifier (323) that is not used for the first communication and the second communication is identified. In response to a situation where the temperature of the electronic device (101) exceeds a set first threshold temperature, the first power amplifier (321) is changed to the third power amplifier (323), An electronic device performing the first communication using the above-mentioned modified third power amplifier (323).

3. In paragraph 1, The above processor (120) In response to the release of the second communication, the first power amplifier (321) corresponding to the first communication is changed to the second power amplifier (322), The second power amplifier (322) is an electronic device supplied with relatively lower power than the first power amplifier (321) in a communication situation.

4. In paragraph 1, The above processor (120) In response to the release of the second communication, the first power amplifier (321) corresponding to the first communication is changed to the second power amplifier (322), The above first power amplifier (321) supports the first communication based on frequency division duplexing (FDD), The second power amplifier (322) is an electronic device that supports the second communication based on time division duplexing (TDD).

5. In paragraph 1, The above processor (120) In response to a situation where the temperature of the electronic device (101) exceeds the set first threshold temperature, the first transmission / reception ratio corresponding to the first communication and the second transmission / reception ratio corresponding to the second communication are checked, An electronic device that changes the first power amplifier (321) connected to the first communication to the second power amplifier (322) based on the first transmission / reception ratio and the second transmission / reception ratio, if the first transmission / reception ratio is relatively higher than the second transmission / reception ratio. An electronic device that maintains the first power amplifier (321) corresponding to the first communication, if the first transmission / reception ratio is relatively lower than the second transmission / reception ratio, based on the first transmission / reception ratio and the second transmission / reception ratio.

6. In paragraph 1, The above processor (120) In response to the release of the second communication, the temperature of the electronic device (101) is checked using the temperature sensor (370), An electronic device that resumes performing the second communication in response to a situation where the temperature of the electronic device (101) drops below a set second threshold temperature.

7. In paragraph 6, The above processor (120) An electronic device that resumes performance of the second communication based on the second power amplifier (322) when the first communication is being performed based on the first power amplifier (321).

8. In paragraph 6, The above processor (120) In response to a situation where the temperature of the electronic device (101) drops below a set second threshold temperature, the first power amplifier (321) corresponding to the first communication is changed to the second power amplifier (322), An electronic device that resumes performance of the second communication based on the first power amplifier (321).

9. In paragraph 1, The above processor (120) Based on the above first communication, control signals and data signals are transmitted and received, Based on the above second communication, data signals are transmitted and received, An electronic device that determines whether to release a communication connection corresponding to the second communication through a control signal based on the first communication.

10. In a method for performing communication in an electronic device, An operation of performing a first communication using a first power amplifier (321) among a plurality of power amplifiers (321, 322, 323); An operation of performing a second communication using a second power amplifier (322) among the above-mentioned plurality of power amplifiers (321, 322, 323); An operation of checking the temperature of the electronic device (101) using a temperature sensor (370) while performing the first communication and the second communication; An operation of releasing the second communication in response to a situation where the temperature of the electronic device (101) exceeds a set first threshold temperature; and A method comprising: an operation of changing a power amplifier to perform the first communication; 11. In Article 10, An operation of checking a third power amplifier (323) among the plurality of power amplifiers (321, 322, 323) that is not used for the first communication and the second communication; An operation of changing the first power amplifier (321) to the third power amplifier (323) in response to a situation where the temperature of the electronic device (101) exceeds a set first threshold temperature; and A method further comprising: performing the first communication using the modified third power amplifier (323); 12. In paragraph 10, The operation of changing the power amplifier corresponding to the above first communication is as follows: In response to the release of the second communication, an operation of changing the first power amplifier (321) corresponding to the first communication to the second power amplifier (322); A method characterized in that the second power amplifier (322) is supplied with relatively lower power than the first power amplifier (321) in a communication situation.

13. In paragraph 10, The operation of changing the power amplifier corresponding to the above first communication is as follows: In response to the release of the second communication, an operation of changing the first power amplifier (321) corresponding to the first communication to the second power amplifier (322); The above first power amplifier (321) supports the first communication based on frequency division duplexing (FDD), A method characterized in that the second power amplifier (322) supports second communication based on time division duplexing (TDD).

14. In paragraph 10, An operation of checking a first transmission / reception ratio corresponding to the first communication and a second transmission / reception ratio corresponding to the second communication in response to a situation where the temperature of the electronic device (101) exceeds the set first threshold temperature; Based on the first transmission / reception ratio and the second transmission / reception ratio, if the first transmission / reception ratio is relatively higher than the second transmission / reception ratio, an operation of changing the first power amplifier (321) connected to the first communication to the second power amplifier (322); and A method further comprising: an operation of maintaining the first power amplifier (321) corresponding to the first communication, if the first transmission / reception ratio is relatively lower than the second transmission / reception ratio, based on the first transmission / reception ratio and the second transmission / reception ratio; 15. In a non-transitory computer-readable storage medium storing one or more programs for executing a method of performing communication of an electronic device (101), The above one or more programs, when executed by the processor (120) of the electronic device (101), An operation of performing a first communication using a first power amplifier (321) among a plurality of power amplifiers (321, 322, 323); An operation of performing a second communication using a second power amplifier (322) among the above-mentioned plurality of power amplifiers (321, 322, 323); An operation of checking the temperature of the electronic device (101) using a temperature sensor (370) while performing the first communication and the second communication; An operation of releasing the second communication in response to a situation where the temperature of the electronic device (101) exceeds a set first threshold temperature; and A computer-readable storage medium that causes a computer to execute an operation of changing a power amplifier to perform the first communication.

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