Power conversion device

Abstract

A power conversion device, comprising a housing, and a first circuit board, one or more switching transistors, one or more inductors and multiple capacitors which are located in the housing. The first circuit board is arranged opposite to a bottom plate of the housing in a first direction; the one or more switching transistors, the one or more inductors, and the multiple capacitors are all fixed to the first circuit board and located between the first circuit board and the bottom plate of the housing; the bottom plate of the housing comprises a first cavity, a second cavity, and a third cavity which are communicated in sequence; the first cavity is used for accommodating the multiple capacitors, the second cavity is used for accommodating the one or more switching transistors, and the third cavity is used for accommodating the one or more inductors; and in the first direction, the depth of the second cavity is less than the depth of the first cavity and less than the depth of the third cavity.

Description

Power conversion device

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on November 16, 2023, with application number 202311551941.X and invention name “Power Conversion Device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of photovoltaic energy, and in particular to a power conversion device. Background Art

[0003] Inverters convert AC and DC power, achieving this through circuits composed of various semiconductor components. During operation, the power devices within the inverter generate heat. The higher the inverter power, the greater the heat generated by the devices. Current inverters typically consist of a sheet metal cover, a sheet metal cavity, an inductor heat sink, and the power devices, resulting in poor heat dissipation.

[0004] Summary of the Invention

[0005] The technical problem to be solved by the embodiments of the present application is to provide a power conversion device that can help improve heat dissipation capability.

[0006] In a first aspect, the present application discloses a power conversion device, comprising a housing and a first circuit board, one or more switching tubes, one or more inductors, and multiple capacitors located within the housing, wherein the first circuit board and the bottom plate of the housing are arranged relative to each other in a first direction; the one or more switching tubes, one or more inductors, and multiple capacitors are all fixed to the first circuit board and are all located between the first circuit board and the bottom plate; the bottom plate includes a first chamber, a second chamber, and a third chamber that are connected in sequence; the first chamber is used to accommodate multiple capacitors, the second chamber is used to accommodate one or more switching tubes, and the third chamber is used to accommodate one or more inductors; in the first direction, the depth of the second chamber is less than the depth of the first chamber and less than the depth of the third chamber.

[0007] A first chamber, a second chamber, and a third chamber are formed by the bottom plate. In the first direction, the depth of the second chamber is less than the depth of the first chamber and less than the depth of the third chamber, so as to respectively adapt to the sizes of the inductor, capacitor, and switch tube. Compared with a flat plate structure in which the bottom plate is parallel to the first circuit board, the bottom plate with different chambers is conducive to achieving a compact layout of the internal space of the shell, saving space, thereby reducing the proportion of air inside the shell, shortening the heat conduction path between the switch tube, capacitor, and inductor and the shell respectively, and the heat generated by the switch tube, capacitor, and inductor during operation can be transferred from the shell to the outside of the shell more quickly, thereby improving the heat dissipation capacity of the power conversion device as a whole and improving the power density of the power conversion device; and, the first chamber and the third chamber are located on both sides of the second chamber, so that the capacitor and inductor are arranged on both sides of the switch tube, reducing the influence of the heat generated by the inductor on the capacitor.

[0008] In combination with the first aspect, in a possible implementation, the housing includes a base plate, at least four side plates and a cover plate, wherein the cover plate and the base plate are arranged opposite to each other in a first direction, and at least four side plates connect the edge of the cover plate and the edge of the base plate; the base plate includes multiple bending structures and multiple flat plate structures, wherein one end of the first bending structure is connected to the first side plate to enclose a first chamber, the other end of the first bending structure is connected to one end of the first flat plate structure, and the first flat plate structure encloses a second chamber, one or more switch tubes are located between the first flat plate structure and the first circuit board, the other end of the first flat plate structure is connected to the second bending structure, and the second bending structure encloses a third chamber.

[0009] In this possible implementation, multiple bending structures and multiple flat plate structures are formed on the bottom plate, and the multiple bending structures include a first bending structure and a second bending structure. The first flat plate structure is connected between the first bending structure and the second bending structure, so that the first chamber corresponding to the first bending structure, the second chamber enclosed by the first flat plate structure, and the third chamber enclosed by the second bending structure have different depths extending along the first direction. Compared with a bottom plate as a flat plate structure, a bottom plate with a bending structure is conducive to achieving a compact layout of the internal space of the shell, saving space, thereby reducing the proportion of air inside the shell, shortening the heat conduction path between the switch tube, capacitor and inductor and the shell respectively, and the heat generated by the switch tube, capacitor and inductor during operation can be transferred from the shell to the outside of the shell more quickly, thereby improving the heat dissipation capacity of the power conversion device as a whole and improving the power density of the power conversion device.

[0010] In combination with the first aspect, in a possible implementation, the power conversion device includes a fan, and the fan is provided on a side of the first flat plate structure facing away from the cover plate.

[0011] In this possible implementation, a fan is provided on the side of the first flat plate structure facing away from the cover plate to accelerate the air flow on the side of the first flat plate structure facing away from the cover plate, thereby improving the heat dissipation efficiency of the switching tube, capacitor and inductor, thereby facilitating the improvement of the heat dissipation capacity and heat dissipation efficiency of the power conversion device.

[0012] In combination with the first aspect, in a possible implementation, the base plate further includes heat dissipation fins, which are arranged on a surface of the base plate facing away from the cover plate, and along the first direction, the fan is arranged opposite to the heat dissipation fins arranged on the first flat plate structure.

[0013] In this possible implementation, the heat dissipation capacity of the power conversion device is improved by integrating heat dissipation fins on the surface of the base plate facing away from the cover plate, and the heat dissipation fins on the first flat plate structure are arranged relative to the fan in the first direction, thereby enhancing the air flow around the heat dissipation fins around the first flat plate structure, thereby further improving the heat dissipation capacity and heat dissipation efficiency of the power conversion device.

[0014] In combination with the first aspect, in a possible implementation, the first bending structure includes a first connecting portion and a first protruding portion, the first connecting portion is connected between the first protruding portion and the first side plate, the first connecting portion is farther away from the cover plate in the first direction relative to the first flat plate structure, one end of the first protruding portion away from the first connecting portion is connected to the first flat plate structure, the first protruding portion is protruded toward the cover plate along the first direction relative to the first connecting portion, the first side plate, the first connecting portion and the first protruding portion are arranged to form a first cavity, and a plurality of capacitors are accommodated between the first connecting portion and the first circuit board.

[0015] In this possible implementation, the first bending structure is composed of a first protrusion and a first connecting portion that protrude toward the cover plate along the first direction, wherein the first connecting portion is farther away from the cover plate in the first direction relative to the first flat plate structure, that is, in the first direction, the depth of the second chamber is smaller than the depth of the first chamber, so that the gap between one or more switching tubes in the second chamber and the first flat plate structure is smaller, shortening the heat conduction path of the switching tube to the bottom plate, and improving the heat dissipation capacity of the power conversion device.

[0016] In combination with the first aspect, in one possible implementation, the second bending structure includes a second connecting portion and a second protruding portion, the second connecting portion is farther away from the cover plate in the first direction relative to the first flat plate structure, the second protruding portion is protruded toward the cover plate along the first direction relative to the second connecting portion, the second protruding portion is connected between the first flat plate structure and the second connecting portion, and the second connecting portion and the second protruding portion enclose a third cavity; one or more inductors are accommodated between the second connecting portion and the first circuit board.

[0017] In this possible implementation, the second bending structure is composed of a second protrusion and a second connecting portion protruding along the first direction toward the cover plate, wherein the second connecting portion is farther away from the cover plate in the first direction relative to the first flat plate structure, that is, in the first direction, the depth of the third chamber is greater than the depth of the second chamber, and the inductor in the third chamber can be set to be larger, which is beneficial to improving the power density of the power conversion device, and the heat generated by the inductor in the third chamber can be dissipated to the outside of the shell through the second connecting portion and the second protrusion, making full use of the second connecting portion and the second protrusion to dissipate heat from the inductor, thereby improving the heat dissipation capacity of the power conversion device; in addition, the third chamber is used to accommodate the inductor, and the sizes of the input inductor and the output inductor can be set to the same, which simplifies the setting of the inductor structure.

[0018] In combination with the first aspect, in a possible implementation, the second bending structure also includes a third protrusion connected to the second connecting portion, the third protrusion, the third protrusion is protruded toward the cover plate along the first direction relative to the second connecting portion, the third protrusion and the second protrusion are arranged opposite to each other, and the third protrusion, the second connecting portion and the second protrusion form a third chamber.

[0019] In this possible implementation, the two opposite ends of the second connecting portion are respectively connected to the third protrusion and the second protrusion. The third protrusion separates the third chamber from the chamber inside the shell away from the side of the first side plate, which is beneficial to reducing the impact of the heat generated by the inductor on other components in the shell.

[0020] In combination with the first aspect, in a possible implementation, the base plate also includes a second flat plate structure, the second flat plate structure is connected to the second bending structure, the second flat plate structure is farther away from the cover plate in the first direction relative to the first flat plate structure, and the second flat plate structure is enclosed to form a fourth cavity; the power conversion device also includes a DC switch and a relay, the DC switch and the relay are both arranged on the first circuit board and extend toward the base plate along the first direction, and the DC switch and the relay are both accommodated in the fourth cavity.

[0021] In this possible implementation, the second flat plate structure is farther away from the cover plate relative to the first flat plate structure in the first direction, so that the depth of the fourth chamber enclosed by the second flat plate structure along the first direction is greater than the depth of the second chamber along the first direction. The fourth chamber can accommodate devices with low heat generation, such as DC switches and relays. The depth of the fourth chamber can be determined according to the height of the DC switch and relay extending along the first direction, reducing the proportion of air in the fourth chamber, so that the heat in the fourth chamber can be dissipated from the second flat plate structure to the outside of the casing more quickly, thereby improving the heat dissipation capacity of the power conversion device.

[0022] In combination with the first aspect, in a possible implementation, the base plate also includes a third bending structure, the third bending structure includes a connected third connection portion and a fourth protrusion portion, the third connection portion is farther away from the cover plate in the first direction relative to the second flat plate structure, the fourth protrusion portion is protruded toward the cover plate along the first direction relative to the third connection portion, the fourth protrusion portion is connected between the second flat plate structure and the third connection portion, one end of the third connection portion is connected to the second side plate, the second side plate and the first side plate are arranged opposite to each other, the third connection portion, the fourth protrusion portion and the second side plate are arranged to form a fifth chamber; the power conversion device also includes a second circuit board, the second circuit board is connected to the first circuit board and is arranged vertically, and the second circuit board is accommodated in the fifth chamber.

[0023] In this possible implementation, the third connecting portion is farther away from the cover plate relative to the second flat plate structure in the first direction, and the depth of the fifth chamber along the first direction is greater than the depth of the fourth chamber along the first direction, so that the second circuit board perpendicular to the first circuit board can be placed in the fifth chamber, and the heat emitted by the second circuit board can be dissipated to the outside of the shell through the fourth protrusion, the third connecting portion and the second side plate, and the second circuit board is close to the second side plate, which facilitates the second circuit board to pass through the second side plate and be electrically connected to the external circuit, reducing the internal cable layout and simplifying the assembly, wherein the first circuit board and the second circuit board can be electrically connected through the gold finger to realize a cable-free assembly design between the internal circuit boards, simplifying the assembly process, improving manufacturing efficiency, and helping to reduce the manufacturing cost of the power conversion device; in addition, the fourth protrusion is protruded toward the cover plate in the first direction relative to the second flat plate structure, and is connected between the second flat plate structure and the third connecting portion, that is, there is no baffle separation on the side of the fourth chamber facing the fifth chamber, which facilitates the device in the fourth chamber to extend into the fifth chamber and be electrically connected to the second circuit board.

[0024] In combination with the first aspect, in a possible implementation, the power conversion device further includes a plurality of through-wall terminals, and the plurality of through-wall terminals pass through the second side plate and are connected to the second circuit board.

[0025] In this possible implementation, multiple through-wall terminals are used to achieve electrical connection between the second circuit board and the external circuit. No cables are required between the second circuit board and the external circuit, which simplifies the assembly process between the circuit boards, improves manufacturing efficiency, and helps reduce the manufacturing cost of the power conversion device.

[0026] In combination with the first aspect, in a possible implementation, the bottom plate, the first side plate, and the second side plate are an integrally formed structure.

[0027] In this possible implementation, the first side panel is fixedly connected to the bottom panel, and the first side panel, the second side panel and the bottom panel are integrated into one, which simplifies the structural form of the housing and is beneficial to reducing the manufacturing cost of the power conversion device. No sealing rubber is required at the connection between the first side panel and the bottom panel and at the connection between the second side panel and the bottom panel. On the one hand, the heat in the first chamber is made shorter through the heat conduction path between the first side panel and the bottom panel, and the heat conduction path between the second side panel and the bottom panel. On the other hand, the heat dissipation capacity of the components inside the housing can be shared, which is beneficial to improving the heat dissipation capacity of the power conversion device. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0029] FIG1 is a schematic diagram of a network of a photovoltaic storage system in a large-scale ground power station or industrial and commercial application scenario provided by an embodiment of the present application;

[0030] FIG2 is a schematic diagram of the three-dimensional structure of a power conversion device provided in one embodiment of the present application;

[0031] FIG3 is a schematic diagram of a partial structure of the power conversion device shown in FIG2 from one perspective;

[0032] FIG4 is a plan view of the power conversion device shown in FIG3 ;

[0033] FIG5 is a front view of a partial structure of the power conversion device shown in FIG2 ;

[0034] FIG6 is a schematic diagram of a partial structure of the power conversion device shown in FIG5 from one perspective;

[0035] FIG7 is a schematic diagram of the three-dimensional structure of a power conversion device provided in one embodiment of the present application.

[0036] Explanation of the reference numerals: A, first direction; B, second direction; C, third direction; 100, power conversion device; 200, photovoltaic module; 300, photovoltaic inverter; 400, box-type substation; 500, booster station; 600, power grid; 700, energy storage system; 800, energy storage converter; 10, housing; 11, bottom plate; 111, recessed portion; 112, first flat plate structure; 113, second flat plate structure; 114, first bending structure; 1141, first connecting portion; 1142, first protruding portion; 115, second bending structure; 1151, second connecting portion; 1152, second protruding portion; 1153, third protruding portion; 116, Third bending structure; 1161, third connecting portion; 1162, fourth protrusion; 12, side panel; 121, first side panel; 122, second side panel; 123, third side panel; 124, fourth side panel; 125, notch; 13, cover; 14, plug hole; 15, heat dissipation fin; 16, inner cavity; 161, first chamber; 162, second chamber; 163, third chamber; 164, fourth chamber; 165, fifth chamber; 20, fan; 30, DC switch; 40, through-wall terminal; 50a, first circuit board; 50b, second circuit board; 60, switch tube; 70, inductor; 80, capacitor; 90, relay. DETAILED DESCRIPTION

[0037] Refer to Figure 1, which is a network diagram of a photovoltaic storage system in a large-scale ground power station or industrial and commercial application scenario provided by an embodiment of the present application. Among them, the photovoltaic module 200 converts solar energy into direct current through the photovoltaic effect, and the photovoltaic inverter 300 converts the direct current output of the photovoltaic module 200 into alternating current and further transmits the alternating current to the box-type substation 400. After the box-type substation 400 converts the low-voltage alternating current output by the photovoltaic inverter 300 into medium-voltage alternating current, it further transmits the alternating current to the booster station 500 (grid 600) or the box-type substation 400 corresponding to the energy storage system 700. The energy storage system 700 is used to store unstable electrical energy from the photovoltaic module 200, and output stable electrical energy to the grid 600 through the energy storage converter 800 and the corresponding box-type substation 400.

[0038] In the photovoltaic storage system shown in Figure 1, the photovoltaic inverter 300 and the energy storage converter 800 are the core devices for power conversion, and are collectively referred to as the power conversion device 100. The structure of the power conversion device 100 provided in this application will be described in detail below with reference to the accompanying drawings. It is worth mentioning that the power conversion device 100 provided in this application can also be applied to household photovoltaic systems. Since the networking method of household photovoltaic systems is similar to that of Figure 1, this application will not elaborate on it.

[0039] Please refer to Figure 2, which is a schematic diagram of the three-dimensional structure of a power conversion device 100 provided in one embodiment of the present application. The power conversion device 100 includes a housing 10, heat sink fins 15, a fan 20, a DC switch 30, and a through-wall terminal 40. The heat sink fins 15 are disposed on a base plate 11 and are used to dissipate heat from the power conversion device 100. The fan 20 is connected to the housing 10 and is disposed opposite the heat sink fins 15. The fan 20 is used to enhance air flow around the heat sink fins 15. The DC switch 30 and the through-wall terminal 40 both partially extend out of the housing 10.

[0040] The housing 10 includes a bottom plate 11, at least four side plates 12, a cover plate 13, and a socket 14. The bottom plate 11 and the cover plate 13 are arranged opposite each other in a first direction A. The at least four side plates 12 connect the edges of the bottom plate 11 and the edges of the cover plate 13. The socket 14 can be provided on any of the at least four side plates 12. The socket 14 passes through the housing 10 and is used to connect the power conversion device 100 to an external circuit board.

[0041] Optionally, the housing 10 may be integrally formed of an aluminum profile, which can improve the heat conduction and heat dissipation capabilities of the housing 10 .

[0042] The bottom plate 11 is formed with a recessed portion 111, and the multiple side walls surrounding the recessed portion 111 are each provided with heat dissipation fins 15. Notches 125 are formed at positions corresponding to the recessed portion 111 on the third side plate 123 and the fourth side plate 124, respectively. Notches 125 communicate with the recessed portion 111. The provision of the recessed portion 111 helps reduce the volume of the housing 10, thereby achieving a lightweight design for the power conversion device 100.

[0043] The connection between the cover plate 13 and at least four side plates 12 can be sealed by a sealing gasket, thereby achieving a high degree of protection and sealing inside the power conversion device 100. The number of side plates 12 can be four, and the four side plates 12 are respectively a first side plate 121, a second side plate 122, a third side plate 123, and a fourth side plate 124. The four side plates 12, the bottom plate 11, and the cover plate 13 together form a rectangular housing 10. It is understood that the number of side plates 12 can be more than four to form a polygonal housing 10.

[0044] The first side panel 121 is provided at one end of the bottom panel 11 in the second direction B, and the second side panel 122 is provided at the other end of the bottom panel 11 in the second direction B. The first side panel 121 and the second side panel 122 are opposite each other in the second direction B. The third side panel 123 is provided at one end of the bottom panel 11 in the third direction C, and the fourth side panel 124 is provided at the other end of the bottom panel 11 in the third direction C. The third side panel 123 and the fourth side panel 124 are opposite each other in the third direction C. The insertion hole 14 can be provided on any one of the first side panel 121, the second side panel 122, the third side panel 123, and the fourth side panel 124.

[0045] It should be noted that the first direction A can be the height direction of the power conversion device 100, the second direction B can be the length direction of the power conversion device 100, and the third direction C can be the width direction of the power conversion device 100. The first direction A, the second direction B and the third direction C are perpendicular to each other.

[0046] The first side panel 121, the second side panel 122 and the bottom panel 11 are integrally formed. The first side panel 121, the second side panel 122 and the bottom panel 11 are integrated into one body, which simplifies the structural form of the housing 10 and helps reduce the manufacturing cost of the power conversion device 100. No sealing rubber is required at the connection between the first side panel 121 and the bottom panel 11, and at the connection between the second side panel 122 and the bottom panel 11. On the one hand, the heat conduction path of the heat in the power conversion device 100 through the first side panel 121 and the bottom panel 11, and the heat conduction path between the second side panel 122 and the bottom panel 11 are shortened. On the other hand, the power devices can share the heat dissipation capability, which helps improve the heat dissipation capability of the power conversion device 100.

[0047] The third side plate 123 and the fourth side plate 124 are both connected to the first side plate 121 and the second side plate 122, that is, the third side plate 123 is connected to both the first side plate 121 and the second side plate 122, and the fourth side plate 124 is connected to both the first side plate 121 and the second side plate 122. Sealing gaskets are provided at the connection between the third side plate 123 and the first side plate 121, the connection between the third side plate 123 and the second side plate 122, the connection between the fourth side plate 124 and the first side plate 121, and the connection between the fourth side plate 124 and the second side plate 122 to achieve a high-protection seal inside the power conversion device 100.

[0048] The heat dissipation fins 15 are arranged on the side of the base plate 11 away from the cover plate 13 in the first direction A. The heat dissipation fins 15 and the cover plate 13 are located on opposite sides of the base plate 11 in the first direction A. By integrating the heat dissipation fins 15 on the base plate 11, the heat dissipation capacity of the power conversion device 100 is further improved through the heat dissipation fins 15.

[0049] Integrating the heat sink 15 with the housing 10, compared to providing a separate heat sink and housing 10, facilitates sharing the heat dissipation capacity of the heat-generating power components within the housing 10, thereby improving the heat dissipation capacity of the power conversion device 100. Furthermore, integrating the heat sink 15 with the housing 10 reduces the number of assembly processes between components, thereby improving the production efficiency of the power conversion device 100.

[0050] In one embodiment, in the first direction A, the height of the third side panel 123 and the height of the fourth side panel 124 are both greater than the height of the heat dissipating fins 15, and there is a height difference between the third side panel 123 and the heat dissipating fins 15, and between the fourth side panel 124 and the heat dissipating fins 15. The heat dissipated to the outside of the power conversion device 100 through the heat dissipating fins 15 can be dissipated through the third side panel 123 and the fourth side panel 124.

[0051] Referring to Figures 3 and 4 , in one embodiment, the fan 20 is located within the recess 111 and can be connected and fixed to the third side plate 123 and the fourth side plate 124. Placing the fan 20 within the recess 111 makes the overall structure of the power conversion device 100 compact. The fan 20 faces the heat dissipation fins 15 within the recess 111, enhancing air flow around the heat dissipation fins 15, improving the heat dissipation capacity of the power conversion device 100, and improving the heat dissipation efficiency of the power conversion device 100.

[0052] Please refer to Figures 5 and 6. The power conversion device 100 further includes a first circuit board 50a, a second circuit board 50b, one or more switching transistors 60, one or more inductors 70, a plurality of capacitors 80, and a relay 90, located within the housing 10. The first circuit board 50a is a flat plate structure perpendicular to the first direction A. The first circuit board 50a is fixed to the housing 10 and electrically connected to the second circuit board 50b. The first circuit board 50a and the second circuit board 50b are arranged vertically. The one or more switching transistors 60, one or more inductors 70, a plurality of capacitors 80, and the relay 90 are all electrically connected to the first circuit board 50a. The one or more switching transistors 60, one or more inductors 70, a plurality of capacitors 80, and the relay 90 all extend along the first direction A toward the base plate 11.

[0053] The base plate 11, at least four side plates 12, and the cover plate 13 collectively enclose an inner cavity 16. The inner cavity 16 includes a first cavity 161, a second cavity 162, a third cavity 163, a fourth cavity 164, and a fifth cavity 165, which are interconnected and arranged in sequence along the second direction B. The first circuit board 50a extends from the first cavity 161 to the fifth cavity 165. Multiple capacitors 80 are housed in the first cavity 161; one or more switching tubes 60 are housed in the second cavity 162; one or more inductors 70 are housed in the third cavity 163; the DC switch 30 and the relay 90 are housed in the fourth cavity 164; and the second circuit board 50b is housed in the fifth cavity 165.

[0054] Among them, along the first direction A, the depth of the second chamber 162 is smaller than the depth of the first chamber 161 and smaller than the depth of the third chamber 163, so as to respectively adapt to the external sizes of the inductor 70, the capacitor 80 and the switching tube 60. Compared with the flat plate structure of the bottom plate 11 parallel to the first circuit board 50a, the bottom plate 11 with different chambers is conducive to achieving a compact layout of the internal space of the shell 10, saving space, thereby reducing the proportion of air inside the shell 10, shortening the heat conduction path between the switching tube 60, the capacitor 80 and the inductor 70 and the shell 10 respectively, and the heat generated by the switching tube 60, the capacitor 80 and the inductor 70 during operation can be transferred from the shell 10 to the outside of the shell 10 more quickly, thereby improving the heat dissipation capacity of the power conversion device 100 as a whole and improving the power density of the power conversion device 100.

[0055] The bottom plate 11 includes multiple flat structures and multiple bent structures, wherein the multiple flat structures of the bottom plate 11 include a first flat structure 112 and a second flat structure 113 ; the multiple bent structures include a first bent structure 114 , a second bent structure 115 and a third bent structure 116 .

[0056] Among them, the first bending structure 114, the first flat plate structure 112, the second bending structure 115, the second flat plate structure 113 and the third bending structure 116 are arranged in sequence in the second direction B, that is, one end of the first bending structure 114 is connected to the first side plate 121, and the other end of the first bending structure 114 is connected to the first flat plate structure 112; the other end of the first flat plate structure 112 is connected to one end of the second bending structure 115; the other end of the second bending structure 115 is connected to one end of the second flat plate structure 113; the other end of the second flat plate structure 113 is connected to one end of the third bending structure 116; and the other end of the third bending structure 116 is connected to the second side plate 122.

[0057] The first bent structure 114 and the first side plate 121 enclose a first chamber 161 , the first flat plate structure 112 encloses a second chamber 162 , and the second bent structure 115 encloses a third chamber 163 ; the second flat plate structure 113 encloses a fourth chamber 164 ; and the third bent structure 116 and the second side plate 122 enclose a fifth chamber 165 .

[0058] By forming a plurality of bent structures and a plurality of flat plate structures on the bottom plate 11, the bottom plate 11 is set to a high and low concave and convex structure, so that the first cavity 161 formed by the first bent structure 114, the second cavity 162 surrounded by the first flat plate structure 112, and the third cavity 163 surrounded by the second bent structure 115 have different depths extending along the first direction A to respectively adapt to the layout and matching size of the inductor 70, the capacitor 80 and the switch tube 60. Compared with the bottom plate 11 being a flat plate parallel to the first circuit board 50a, the bottom plate 11 is provided with a plurality of bent structures and a plurality of flat plate structures. In terms of the plate structure, the bottom plate 11 provided with a bent structure facilitates a compact layout of the inner cavity 16, saving space, thereby reducing the proportion of air within the housing 10 and shortening the heat conduction path between the switching tube 60, capacitor 80, and inductor 70 and the housing 10. The heat generated by the switching tube 60, capacitor 80, and inductor 70 during operation can be transferred from the housing 10 to the outside of the housing 10 more quickly, thereby improving the heat dissipation capacity of the power conversion device 100 and facilitating an increase in the power density of the power conversion device 100. In addition, the first bent structure 114 and the second bent structure 115 are respectively connected to the two ends of the first flat plate structure 112, that is, the first cavity 161 and the third cavity 163 are located on both sides of the second cavity 162, so that the capacitor 80 and the inductor 70 are arranged on both sides of the switching tube 60, which helps to reduce the impact of the heat generated by the inductor 70 on the capacitor 80.

[0059] Specifically, the first flat plate structure 112 and its corresponding part of the cover plate 13 together enclose a second chamber 162 , and the depth of the second chamber 162 along the first direction A is determined according to the height of one or more switch tubes 60 extending along the first direction A to adapt to the size of the one or more switch tubes 60 .

[0060] The first flat plate structure 112 and the first circuit board 50a are arranged relative to each other along the third direction C. For example, the first flat plate structure 112 and the first circuit board 50a are both flat plate structures perpendicular to the first direction A. For another example, the first flat plate structure 112 is arranged obliquely relative to the first circuit board 50a, which can be determined according to the layout of one or more switch tubes 60 in the second chamber 162.

[0061] The second plate structure 113 and the corresponding portion of the cover plate 13 together enclose a fourth chamber 164. The second plate structure 113 is arranged parallel to the first plate structure 112. For example, the second plate structure 113 is a plate structure perpendicular to the first direction A.

[0062] The second flat plate structure 113 is farther away from the cover plate 13 along the first direction A relative to the first flat plate structure 112, that is, along the first direction A, the depth of the fourth chamber 164 is greater than the depth of the second chamber 162, which is specifically determined according to the height of the DC switch 30 and the relay 90 extending along the first direction A, so as to reduce the proportion of air in the fourth chamber 164, so that the heat in the fourth chamber 164 can be dissipated from the second flat plate structure 113 to the outside of the housing 10 more quickly, thereby improving the heat dissipation capacity of the power conversion device 100.

[0063] Heat dissipation fins 15 are provided on the surfaces of the first and second flat plate structures 112, 113 on the side facing away from the cover plate 13 in the first direction A. This improves the heat dissipation capacity and efficiency of the first and second flat plate structures 112, 113. Furthermore, a fan 20 is provided on the side of the first flat plate structure 112 facing away from the cover plate 13 to accelerate air flow on the side of the first flat plate structure 112 facing away from the cover plate 13, thereby improving the heat dissipation efficiency of the switching tube 60, the capacitor 80, and the inductor 70, thereby facilitating improved heat dissipation capacity and efficiency of the power conversion device 100.

[0064] Along the first direction A, the fan 20 is disposed opposite to the heat dissipation fins 15 disposed on the first plate structure 112 to enhance the air flow around the heat dissipation fins 15 around the first plate structure 112 and further improve the heat dissipation capacity and heat dissipation efficiency of the power conversion device 100 .

[0065] The first bending structure 114 includes a first connecting portion 1141 and a first protruding portion 1142. The first connecting portion 1141 is connected between the first protruding portion 1142 and the first side plate 121. The end of the first protruding portion 1142 away from the first connecting portion 1141 is connected to the first flat plate structure 112. The first connecting portion 1141, the first side plate 121 and the first protruding portion 1142 are together arranged to form a first chamber 161. Multiple capacitors 80 are accommodated in the first chamber 161 and are located between the first connecting portion 1141 and the first circuit board 50a.

[0066] The first connecting portion 1141 can be parallel to the first flat plate structure 112. The first connecting portion 1141 is farther away from the cover plate 13 relative to the first flat plate structure 112 in the first direction A. That is, along the first direction A, the depth of the second chamber 162 is less than the depth of the first chamber 161, so that the gap between the one or more switching tubes 60 in the second chamber 162 and the first flat plate structure 112 is smaller, thereby shortening the heat conduction path from the switching tube 60 to the bottom plate 11 and improving the heat dissipation capacity of the power conversion device 100.

[0067] The first protrusion 1142 is provided relative to the first connection portion 1141 and protrudes toward the cover plate 13 along the first direction A. In one embodiment, the first connection portion 1141 is perpendicular to the first side plate 121 and the first protrusion 1142 , and the first bending structure 114 is an L-shaped structure as a whole.

[0068] In one embodiment, heat dissipation fins 15 are provided on the surface of the first connection portion 1141 and / or the first protrusion portion 1142 facing away from the first chamber 161 to improve the heat dissipation capacity and heat dissipation efficiency at the first connection portion 1141 and / or the first protrusion portion 1142.

[0069] The second bending structure 115 includes a second connecting portion 1151, a second protruding portion 1152, and a third protruding portion 1153. The second protruding portion 1152 and the third protruding portion 1153 are respectively connected to opposite ends of the second connecting portion 1151. The second protruding portions 1152, the second connecting portion 1151, and the third protruding portions 1153 collectively form a third cavity 163. One or more inductors 70 are housed in the third cavity 163 and are located between the second connecting portion 1151 and the first circuit board 50a.

[0070] Among them, the second connecting portion 1151 can be parallel to the first flat plate structure 112, and the second connecting portion 1151 is farther away from the cover plate 13 in the first direction A relative to the first flat plate structure 112, that is, the depth of the third chamber 163 along the first direction A is greater than the depth of the second chamber 162 along the first direction A. The inductor 70 in the third chamber 163 can be set to be larger, which is beneficial to improving the power density of the power conversion device 100.

[0071] The inner wall surface of the second connecting portion 1151 facing the third chamber 163 can be configured as a curved surface to match the outer contour of the inductor 70, so that the distance between each part of the inductor 70 and the inner wall surface of the second connecting portion 1151 facing the third chamber 163 is equal. This helps to shorten the heat conduction path between the inductor 70 and the second connecting portion 1151, thereby improving the heat dissipation capability. When filling the third chamber 163 with thermally conductive material, the amount of thermally conductive material can be effectively reduced, thereby reducing the heat dissipation cost.

[0072] In one embodiment, along the first direction A, the distance between the second connection portion 1151 and the first circuit board 50 a is less than or equal to the distance between the first connection portion 1141 and the first circuit board 50 a.

[0073] In other embodiments, along the first direction A, the distance between the second connecting portion 1151 and the first circuit board 50a is greater than the distance between the first connecting portion 1141 and the first circuit board 50a. In this way, the depth of the third chamber 163 along the first direction A is greater than the depth of the first chamber 161 along the first direction A, so that the inductor 70 in the third chamber 163 can be set to be larger, which is beneficial to improving the power density of the power conversion device 100; in addition, the third chamber 163 is used to accommodate the inductor 70, and the sizes of the input inductor and the output inductor can be set to the same, which simplifies the setting of the inductor 70 structure.

[0074] The second connection portion 1151 is also connected to the second flat plate structure 113 , and a third protrusion 1153 is connected to the connection between the second connection portion 1151 and the second flat plate structure 113 .

[0075] The second protrusion 1152 is protruded toward the cover plate 13 along the first direction A relative to the second connecting portion 1151. The second protrusion 1152 is connected between the first flat structure 112 and the second connecting portion 1151. The second protrusion 1152 and the second connecting portion 1151 form an "L"-shaped structure as a whole. The second protrusion 1152 and the first protrusion 1142 are opposite to and spaced apart from each other in the second direction B. In this way, when the heat in the first chamber 161 is conducted from the first protrusion 1142 to the outside of the housing 10, the influence on the inductor 70 in the third chamber 163 can be reduced. Similarly, when the heat in the third chamber 163 is conducted from the second protrusion 1152 to the outside of the housing 10, the influence on the capacitor 80 in the first chamber 161 can also be reduced.

[0076] The heat generated by the inductor 70 in the third cavity 163 can be dissipated to the outside of the housing 10 through the second connecting portion 1151 and the second protruding portion 1152 , thereby fully utilizing the second connecting portion 1151 and the second protruding portion 1152 to dissipate heat from the inductor 70 and improving the heat dissipation capability of the power conversion device 100 .

[0077] In one embodiment, heat dissipation fins 15 are provided on the surface of the second connection portion 1151 and / or the second raised portion 1152 facing away from the third chamber 163 to improve the heat dissipation capacity and efficiency of the second connection portion 1151 and / or the second raised portion 1152. The first raised portion 1142, the first flat plate structure 112, and the second raised portion 1152 are formed into a recessed portion 111 on the side facing away from the inner chamber 16.

[0078] The third protrusion 1153 protrudes relative to the second connection portion 1151 along the first direction A toward the cover plate 13. The third protrusion 1153 faces the first protrusion 1142 along the second direction B. The third protrusion 1153, the second connection portion 1151, and the second protrusion 1152 enclose a third chamber 163. The third protrusion 1153 faces away from the first protrusion 1142 along the second direction B. The third protrusion 1153 and the second flat plate structure 113 enclose a fourth chamber 164. Specifically, the third protrusion 1153 separates the third chamber 163 from the fourth chamber 164, thereby reducing the effect of heat generated by the inductor 70 on the relay 90 and DC switch 30 within the fourth chamber 164.

[0079] In one embodiment, the height of the third protrusion 1153 along the first direction A may be equal to the height of the second protrusion 1152 along the first direction A.

[0080] In one embodiment, the spacing between the inner wall surface of the second connecting portion 1151 and the inductor 70, the spacing between the inner wall surface of the second protrusion 1152 and the inductor 70, and the spacing between the walls of the third protrusion facing the inductor 70 are all the same, and the spacing size can be designed according to the insulation requirements and voltage; when the outer surface of the inductor 70 is provided with insulating material, the spacing size can be set to 0, that is, the inductor 70 is in contact with the second connecting portion 1151, the second protrusion 1152 and the third protrusion 1153 to shorten the heat conduction path between the inductor 70 and the base plate 11; when the outer surface of the inductor 70 is not provided with insulating material, the spacing size can be set according to the voltage required by the inductor 70. For example, when the voltage is 200V, the spacing size can be set to 1mm, and when the inductance size is 400V, the spacing size can be set to 2mm.

[0081] The third bending structure 116 includes a third connecting portion 1161 and a fourth protruding portion 1162. Opposite ends of the third connecting portion 1161 are connected to the fourth protruding portion 1162 and the second side plate 122, respectively. The third connecting portion 1161, the fourth protruding portion 1162, and the second side plate 122 collectively form a fifth chamber 165. A portion of the through-wall terminal 40 and the second circuit board 50b are accommodated within the fifth chamber 165 and located between the third connecting portion 1161 and the first circuit board 50a. The through-wall terminal 40 is electrically connected to the second circuit board 50b.

[0082] The third connection portion 1161 is further away from the cover plate 13 relative to the second flat structure 113 in the first direction A. That is, the depth of the fifth chamber 165 along the first direction A is greater than the depth of the fourth chamber 164 along the first direction A. This facilitates placement of the second circuit board 50b, perpendicular to the first circuit board 50a, within the fifth chamber 165. The distance between the third connection portion 1161 and the first circuit board 50a along the first direction A can be determined based on the height of the second circuit board 50b along the first direction A, thereby reducing the air volume within the fifth chamber 165 and improving heat dissipation.

[0083] The fourth protrusion 1162 connects the third connection portion 1161 and the second flat plate structure 113. The fourth protrusion 1162 protrudes from the third connection portion 1161 along the first direction A toward the cover plate 13. The third connection portion 1161 and the fourth protrusion 1162 are an "L"-shaped structure as a whole. Compared with the extension direction of the fourth protrusion 1162 from the third connection portion 1161 toward the side of the cover plate 13, which deviates from the first direction A, the fourth protrusion 1162 extends along the first direction A, reducing the proportion of air in the fifth chamber 165 and improving the heat dissipation capacity of the power conversion device 100.

[0084] In addition, the fourth protrusion 1162 protrudes toward the cover plate 13 in the first direction A relative to the second flat plate structure 113, and is connected between the second flat plate structure 113 and the third connection portion 1161. That is, there is no baffle on the side of the fourth chamber 164 facing the fifth chamber 165, which facilitates the devices in the fourth chamber 164 to extend into the fifth chamber 165 and be electrically connected to the second circuit board 50b.

[0085] In one embodiment, heat dissipation fins 15 are provided on the surface of the third connection portion 1161 and / or the fourth protrusion 1162 facing away from the fifth chamber 165 to improve the heat dissipation capacity and efficiency of the third connection portion 1161 and / or the fourth protrusion 1162 .

[0086] In one embodiment, a thermal conductive material may be provided between the first circuit board 50a and the cover plate 13. For example, a thermal conductive material may be provided at a position on the first circuit board 50a where a high-heat-generating power device is electrically connected. On the one hand, reducing the provision of thermal conductive material can effectively reduce the heat dissipation cost; on the other hand, the high-heat-generating power device can be conducted to the cover plate 13 and then to the outside of the cover plate 13 through the first circuit board 50a and the thermal conductive material, thereby increasing the heat conduction path of the high-heat-generating device and effectively improving the heat dissipation capacity and efficiency.

[0087] The second circuit board 50b is located near the second side panel 122, allowing the through-wall terminals 40 on the second circuit board 50b to pass through the second side panel 122 and electrically connect to the external circuit, thereby reducing internal wiring and simplifying assembly. The second circuit board 50b can be electrically connected to the first circuit board 50a via gold fingers, achieving a cable-free assembly design for the internal circuits. This simplifies the assembly process, improves manufacturing efficiency, and helps reduce the manufacturing cost of the power conversion device 100.

[0088] Please refer to Figure 7, which is a schematic diagram of the three-dimensional structure of the power conversion device 100 provided in an embodiment of the present application. In one embodiment, the fan 20 can also be set on the third side plate 123. For example, the fan 20 can be set at a position corresponding to the recessed portion 111 on the third side plate 123. Optionally, the fan 20 can also be set on one or more of the fourth side plate 124, the first side plate 121 and the second side plate 122. Specifically, it can be set according to the position where the heat transfer inside the power conversion device 100 is more concentrated, so as to enhance the heat dissipation capacity of the power conversion device 100. Among them, the number of fans 20 can be increased or decreased according to the heat consumption requirements of the power conversion device 100.

[0089] In this application, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can mean fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0090] The first, second and various numerical numbers involved in this document are only for the convenience of description and are not intended to limit the scope of this application.

[0091] It should be understood that in the various embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0092] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A power conversion device, characterized in that: It comprises a housing and a first circuit board, one or more switch tubes, one or more inductors, and a plurality of capacitors located in the housing; wherein: The first circuit board and the bottom plate of the housing are arranged opposite to each other in a first direction; One or more of the switch tubes, one or more of the inductors, and a plurality of the capacitors are all fixed to the first circuit board and are all located between the first circuit board and the bottom plate; The bottom plate comprises a first chamber, a second chamber and a third chamber which are connected in sequence; The first chamber is used to accommodate a plurality of the capacitors, the second chamber is used to accommodate one or more switch tubes, and the third chamber is used to accommodate one or more inductors; In the first direction, a depth of the second chamber is smaller than a depth of the first chamber and smaller than a depth of the third chamber.

2. The power conversion device according to claim 1, characterized in that: The housing comprises the bottom plate, at least four side plates and a cover plate, wherein the cover plate and the bottom plate are arranged opposite to each other in the first direction, and at least four side plates connect the edge of the cover plate and the edge of the bottom plate; The bottom plate includes multiple bending structures and multiple flat plate structures, wherein one end of the first bending structure is connected to the first side plate to enclose the first chamber, the other end of the first bending structure is connected to one end of the first flat plate structure, the first flat plate structure encloses the second chamber, one or more switching tubes are located between the first flat plate structure and the first circuit board, the other end of the first flat plate structure is connected to the second bending structure, and the second bending structure encloses the third chamber.

3. The power conversion device according to claim 2, characterized in that: The power conversion device comprises a fan, and the fan is arranged on a side of the first flat plate structure away from the cover plate.

4. The power conversion device according to claim 3, characterized in that: The base plate further includes heat dissipation fins, which are arranged on a surface of the base plate facing away from the cover plate. Along the first direction, the fan is arranged opposite to the heat dissipation fins arranged on the first flat plate structure.

5. The power conversion device according to any one of claims 2 to 4, characterized in that: The first bending structure includes a first connecting portion and a first protruding portion, the first connecting portion is connected between the first protruding portion and the first side plate, the first connecting portion is farther away from the cover plate in the first direction relative to the first flat plate structure, one end of the first protruding portion away from the first connecting portion is connected to the first flat plate structure, the first protruding portion is protruded toward the cover plate along the first direction relative to the first connecting portion, the first side plate, the first connecting portion and the first protruding portion enclose the first chamber, and the plurality of capacitors are accommodated between the first connecting portion and the first circuit board.

6. The power conversion device according to any one of claims 2 to 5, characterized in that: The second bending structure includes a second connecting portion and a second protruding portion, the second connecting portion is farther away from the cover plate in the first direction relative to the first flat plate structure, the second protruding portion is protruded toward the cover plate along the first direction relative to the second connecting portion, the second protruding portion is connected between the first flat plate structure and the second connecting portion, and the second connecting portion and the second protruding portion enclose the third chamber; one or more of the inductors are accommodated between the second connecting portion and the first circuit board.

7. The power conversion device according to claim 6, characterized in that: The second bending structure also includes a third protrusion connected to the second connecting portion, the third protrusion is protruded toward the cover plate along the first direction relative to the second connecting portion, the third protrusion and the second protrusion are arranged opposite to each other, and the third protrusion, the second connecting portion and the second protrusion form the third chamber.

8. The power conversion device according to any one of claims 2 to 7, characterized in that: The base plate also includes a second flat plate structure, which is connected to the second bending structure. The second flat plate structure is farther away from the cover plate in the first direction relative to the first flat plate structure, and the second flat plate structure is arranged to form a fourth chamber; the power conversion device also includes a DC switch and a relay, which are both arranged on the first circuit board and extend toward the base plate along the first direction, and the DC switch and the relay are both accommodated in the fourth chamber.

9. The power conversion device according to claim 8, characterized in that: The bottom plate also includes a third bending structure, the third bending structure includes a connected third connection portion and a fourth protrusion, the third connection portion is farther away from the cover plate in the first direction relative to the second flat plate structure, the fourth protrusion is protruded toward the cover plate along the first direction relative to the third connection portion, the fourth protrusion is connected between the second flat plate structure and the third connection portion, one end of the third connection portion is connected to the second side plate, the second side plate and the first side plate are arranged opposite to each other, the third connection portion, the fourth protrusion and the second side plate are surrounded by a fifth chamber; the power conversion device also includes a second circuit board, the second circuit board is connected to the first circuit board and is vertically arranged, and the second circuit board is accommodated in the fifth chamber.

10. The power conversion device according to claim 9, characterized in that: The power conversion device further includes a plurality of through-wall terminals, and the plurality of through-wall terminals are arranged through the second side plate and connected to the second circuit board.

11. The power conversion device according to claim 9 or 10, characterized in that: The bottom plate, the first side plate and the second side plate are an integrally formed structure.

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