Flue gas purification device having adsorbent cooling function

Abstract

Disclosed is a flue gas purification device having an adsorbent cooling function, comprising a tower cylinder. An adsorption zone and a cooling zone are defined in an inner cavity of the tower cylinder, and the tower cylinder is provided with a flue gas inlet, a clean flue gas outlet and a discharge port that are communicated with the adsorption zone, and a cooling medium inlet, a cooling medium outlet and a feed port that are communicated with the cooling zone. A cooling medium exchanges heat with an adsorbent in the cooling zone so as to cool the adsorbent to a low-temperature adsorbent at or below room temperature, and the low-temperature adsorbent enters the adsorption zone and adsorbs low-temperature flue gas to purify the low-temperature flue gas into clean flue gas.

Description

Flue gas purification device with adsorbent cooling function

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Chinese patent application No. 2023115183818 filed in China on November 14, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to the field of flue gas purification technology, and in particular to a flue gas purification device with an adsorbent cooling function. Background Art

[0004] Coal-fired flue gas produces a large amount of pollutants, which is a major threat to the atmospheric environment and human health. To protect the environment and human health, flue gas adsorption towers are often used to remove pollutants from flue gas. Traditional flue gas adsorption is usually high-temperature adsorption, where the flue gas discharged from the boiler is cooled to approximately 200°C in a cooling tower before entering the flue gas adsorption tower for high-temperature adsorption purification. However, high-temperature flue gas adsorption suffers from high adsorbent consumption, poor adsorption effect, and high nitrogen oxide content in the clean flue gas after adsorption, making it impossible to achieve near-zero emissions.

[0005] To overcome the problem of high-temperature adsorption, related technologies have proposed low-temperature flue gas adsorption technology, which involves cooling the flue gas to a low-temperature level, such as below room temperature, and then removing the pollutant components in the flue gas through adsorption. In low-temperature adsorption, the adsorption capacity of the adsorbent increases exponentially in a low-temperature environment, greatly improving the adsorption purification rate compared to conventional high-temperature flue gas adsorption, and achieving near-zero flue gas emissions. However, during the low-temperature flue gas adsorption process, the adsorption effect of the flue gas is highly sensitive to the adsorption temperature. Therefore, in actual engineering applications, providing an ideal low-temperature adsorption environment is of great significance to ensuring the adsorption effect of the flue gas.

[0006] Summary of the Invention

[0007] The present disclosure is based on the inventors' findings and understanding of the following facts and problems:

[0008] The low-temperature flue gas adsorption system in the related art adopts an adsorption tower to purify the flue gas by adsorption, and a regeneration tower to heat and regenerate the adsorbent. The adsorbent after heating and regeneration is sent back to the adsorption tower to continue adsorption. However, the temperature of the adsorbent after heating and regeneration is relatively high. The high-temperature adsorbent is sent into the adsorption tower to contact the low-temperature flue gas, which greatly affects the low-temperature adsorption efficiency and adsorption effect in the adsorption tower. In order to reduce the temperature of the adsorbent after regeneration, a regeneration tower with a cooling section is proposed in the related art, that is, the heated and regenerated adsorbent is sent into the cooling section for cooling and then output. However, the temperature of the adsorbent after cooling in the cooling section is still higher than the temperature of the low-temperature flue gas (below room temperature) (about 60°C-100°C), and its impact on low-temperature adsorption cannot be ignored.

[0009] The present disclosure aims to solve one of the technical problems in the related art to at least a certain extent. To this end, an embodiment of the present disclosure provides a flue gas purification device with an adsorbent cooling function.

[0010] The flue gas purification device with adsorbent cooling function of the embodiment of the present disclosure includes: a tower, the inner cavity of the tower defines an adsorption zone and a cooling zone, the tower is provided with a flue gas inlet, a clean flue gas outlet and a discharge port connected to the adsorption zone, and a cooling medium inlet, a cooling medium outlet and a feeding port connected to the cooling zone, the cooling medium inlet is used to input cooling medium into the cooling zone, the feeding port is used to feed adsorbent into the cooling zone, the cooling medium and the adsorbent exchange heat in the cooling zone to cool the adsorbent to a low-temperature adsorbent with a temperature at or below room temperature, the cooling medium outlet is used to discharge the cooling medium after heat exchange, the flue gas inlet is used to input low-temperature flue gas with a temperature below room temperature into the adsorption zone, the low-temperature adsorbent enters the adsorption zone and adsorbs the low-temperature flue gas to purify the low-temperature flue gas into clean flue gas, the clean flue gas outlet is used to output the clean flue gas, and the discharge port is used to discharge the adsorbent saturated with adsorption.

[0011] The flue gas purification device provided by the embodiment of the present disclosure is provided with an adsorption zone and a cooling zone in the tower. In the cooling zone, the cold energy in the cooling medium is used to cool the adsorbent entering the tower. After the adsorbent is cooled to a low-temperature adsorbent, it enters the adsorption zone to adsorb the low-temperature flue gas. The cooling of the adsorbent reduces its contact temperature with the low-temperature flue gas, and the temperature of the adsorbent can be cooled to a temperature close to that of the low-temperature flue gas. The reduction in the contact temperature between the adsorbent and the flue gas is conducive to improving the adsorption efficiency of the adsorbent on the flue gas during the low-temperature adsorption process, while improving the low-temperature adsorption effect and achieving near-zero flue gas emissions.

[0012] In addition, since the adsorbent can be cooled by exchanging heat with the cooling medium after entering the tower body, the cooling load of the cooling section of the regeneration tower is also reduced, thereby reducing the structural complexity and regeneration cost of the regeneration tower.

[0013] In some embodiments, the feed port is located above the cooling zone, the discharge port is located below the adsorption zone, and the adsorption zone is located below the cooling zone, and the low-temperature adsorbent in the cooling zone is discharged toward the top of the adsorption zone. The regenerated adsorbent enters the cooling zone from the feed port and flows downward under the action of gravity. During the downward flow, the adsorbent contacts and exchanges heat with the cooling medium in the cooling zone. The adsorbent is cooled to a low-temperature adsorbent and continues to flow downward into the adsorption zone. In the adsorption zone, the low-temperature adsorbent flows downward under the action of gravity, contacts the flue gas in the adsorption zone, adsorbs the pollutants in the flue gas, and gradually becomes saturated with adsorption. The saturated adsorbent is discharged from the discharge port at the bottom of the adsorption zone and sent to the regeneration device for regeneration.

[0014] In some embodiments, the cooling medium outlet is located vertically above the cooling medium inlet, so that the cooling medium fills the cooling zone.

[0015] In some embodiments, the cooling medium and the adsorbent perform contact heat exchange, and the cooling medium is a gas. This can increase the heat exchange area between the cooling medium and the adsorbent and improve the heat exchange efficiency while protecting the adsorption efficiency of the adsorbent; alternatively, the cooling medium and the adsorbent perform indirect heat exchange, and the cooling medium is a liquid.

[0016] In some embodiments, an interlayer area for transferring the low-temperature adsorbent is provided between the cooling area and the adsorption area. The low-temperature adsorbent in the interlayer area is used to isolate the cooling medium in the cooling area and the flue gas in the adsorption area, thereby preventing the flue gas in the adsorption area from entering the cooling area and causing gas cross-talk.

[0017] In some embodiments, the thickness of the interlayer region is 150 mm to 250 mm. The resistance provided by the cryogenic adsorbent filled in the interlayer region can effectively prevent the cooling medium (cooling gas) in the cooling region from flowing downwardly into the adsorption region along with the cryogenic adsorbent, and can also effectively prevent the flue gas in the adsorption region from flowing upwardly into the cooling region.

[0018] In some embodiments, the cooling medium and the adsorbent are in contact heat exchange, and the flue gas purification device includes a first distributor and a first distributor. The first distributor is located below the cooling zone and is used to evenly distribute the low-temperature adsorbent to the interlayer zone. The first distributor is located below the interlayer zone and is used to evenly distribute the low-temperature adsorbent in the interlayer zone to the adsorption zone to reduce the stacking angle formed in the interlayer zone due to falling materials.

[0019] In some embodiments, the first distributor includes a plurality of drop funnels arranged in parallel above the interlayer area, and the cooling medium inlet is arranged horizontally corresponding to the first distributor; the first distributor includes a distribution plate and a plurality of first distribution pipes arranged at intervals, and a plurality of distribution holes are provided on the distribution plate, and the tops of the plurality of first distribution pipes are connected to the distribution holes one by one and extend downward, and the clean flue gas outlet is arranged horizontally corresponding to the first distribution pipe and is located above the adsorption bed in the adsorption area.

[0020] In some embodiments, the flue gas purification device includes several feed pipes and a second distributor. The feed pipes are located within the cooling zone and spaced apart. The feed pipes are used to deliver adsorbent to the interlayer zone to reduce the stacking angle caused by material falling within the interlayer zone. A cooling medium circulates between the feed pipes and the tower. The second distributor is located below the interlayer zone and is used to evenly distribute the low-temperature adsorbent in the interlayer zone to the adsorption zone.

[0021] In some embodiments, the flue gas purification device further includes a first baffle and a second baffle, wherein the first baffle is connected to the top of the feed pipe, and the second baffle is connected to the bottom of the feed pipe. The first baffle, the second baffle, the feed pipe, and the tower define a chamber for circulating a cooling medium. The first baffle and the second baffle are used to restrict the flow of adsorbent along the feed pipe. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] FIG1 is a schematic structural diagram of a flue gas purification device in an embodiment of the present disclosure.

[0023] FIG2 is a schematic structural diagram of a flue gas purification device in another embodiment of the present disclosure.

[0024] Figure numerals: tower 100, adsorption zone 110, flue gas inlet 111, clean flue gas outlet 112, discharge port 113, cooling zone 120, cooling medium inlet 121, cooling medium outlet 122, feeding port 123, interlayer zone 130, adsorption bed 200, first distributor 300, blanking funnel 310, first distributor 400, first distribution pipe 410, first distribution plate 420, discharge pipe 500, first partition 510, second partition 520, second distributor 600, second distribution plate 610, second distribution pipe 620, deflector 700. DETAILED DESCRIPTION

[0025] The embodiments of the present disclosure are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to be used to explain the present disclosure, but should not be understood as limiting the present disclosure.

[0026] The following describes a flue gas purification device with adsorbent cooling function provided by an embodiment of the present disclosure based on Figures 1 and 2.

[0027] The flue gas purification device includes a tower 100, the inner cavity of the tower 100 defines an adsorption zone 110 and a cooling zone 120, and the tower 100 is provided with a flue gas inlet 111, a clean flue gas outlet 112 and a discharge port 113 connected to the adsorption zone 110, and a cooling medium inlet 121, a cooling medium outlet 122 and a feeding port 123 connected to the cooling zone 120.

[0028] The cooling medium inlet 121 is used to input cooling medium into the cooling zone 120. The feed port 123 is used to feed adsorbent into the cooling zone 120. The cooling medium and adsorbent exchange heat in the cooling zone 120 to cool the adsorbent to a low-temperature adsorbent at or below room temperature. The cooling medium outlet 122 is used to discharge the cooling medium after the heat exchange. The flue gas inlet 111 is used to input low-temperature flue gas at a temperature below room temperature into the adsorption zone 110. The low-temperature adsorbent enters the adsorption zone 110 and adsorbs the low-temperature flue gas to purify it into clean flue gas. The clean flue gas outlet 112 is used to output the clean flue gas. The discharge port 113 is used to discharge the saturated adsorbent.

[0029] The flue gas purification device provided by the embodiment of the present disclosure is provided with an adsorption zone and a cooling zone in the tower. In the cooling zone, the cold energy in the cooling medium is used to cool the adsorbent entering the tower. After the adsorbent is cooled to a low-temperature adsorbent, it enters the adsorption zone to adsorb the low-temperature flue gas. The cooling of the adsorbent reduces its contact temperature with the low-temperature flue gas, and the temperature of the adsorbent can be cooled to a temperature close to that of the low-temperature flue gas. The reduction in the contact temperature between the adsorbent and the flue gas is conducive to improving the adsorption efficiency of the adsorbent on the flue gas during the low-temperature adsorption process, while improving the low-temperature adsorption effect and achieving near-zero flue gas emissions.

[0030] In addition, since the adsorbent can be cooled by exchanging heat with the cooling medium after entering the tower body, the cooling load of the cooling section of the regeneration tower is also reduced, thereby reducing the structural complexity and regeneration cost of the regeneration tower.

[0031] In some embodiments, after entering the tower body, the adsorbent exchanges heat with the cooling medium, and its temperature drops below room temperature, close to the temperature of the low-temperature flue gas entering the adsorption zone 110 .

[0032] In some embodiments, as shown in Figures 1 and 2, the feed port 123 is located above the cooling zone 120, and the discharge port 113 is located below the adsorption zone 110. The adsorption zone 110 is located below the cooling zone 120, and the low-temperature adsorbent in the cooling zone 120 is discharged toward the top of the adsorption zone 110. The regenerated adsorbent enters the cooling zone 120 from the feed port 123 and flows downward under the action of gravity. During the downward flow, the adsorbent contacts and exchanges heat with the cooling medium in the cooling zone 120. The adsorbent is cooled to become low-temperature adsorbent and continues to flow downward into the adsorption zone 110. In the adsorption zone 110, the low-temperature adsorbent flows downward under the action of gravity, contacts the flue gas in the adsorption zone 110, and adsorbs pollutants in the flue gas. The adsorbent gradually becomes saturated with adsorption. The saturated adsorbent is discharged from the discharge port 113 at the bottom of the adsorption zone 110 and sent to the regeneration device for regeneration.

[0033] In some embodiments, to ensure that the cooling medium fills the cooling zone 120, as shown in Figures 1 and 2, the cooling medium outlet 122 is vertically located above the cooling medium inlet 121. The cooling medium enters the cooling zone 120 from the cooling medium inlet 121 and flows upward to fill the cooling zone 120, thereby better exchanging heat with the adsorbent. After heat exchange, the cooling medium overflows from the cooling medium outlet 122 above.

[0034] In the cooling zone 120, the heat exchange between the adsorbent and the cooling medium can be either contact heat exchange or indirect heat exchange. Contact heat exchange refers to direct contact between the adsorbent and the cooling medium to exchange heat, while indirect heat exchange refers to isolation between the adsorbent and the cooling medium, without direct contact, and through indirect heat transfer.

[0035] In some embodiments, the cooling medium and adsorbent undergo contact heat exchange, and the cooling medium is a gas. This is because the adsorbent is a solid substance and cannot come into contact with liquids. Therefore, using a gas as the cooling medium can increase the heat exchange area between the cooling medium and the adsorbent while protecting the adsorption efficiency of the adsorbent, thereby improving heat exchange efficiency. In some embodiments, the cooling medium is a gas such as air or nitrogen that does not react with the adsorbent. In other words, the gas must not contaminate the adsorbent. Both air and nitrogen meet this requirement.

[0036] In other embodiments, the cooling medium and the adsorbent exchange heat indirectly, and the cooling medium is a liquid, or alternatively, a gas. In some embodiments, when the cooling medium and the adsorbent exchange heat indirectly, the cooling medium is a liquid, such as cooling water. This is because liquid cooling is relatively inexpensive and easier to implement.

[0037] In some embodiments, to prevent flue gas from the adsorption zone 110 from entering the cooling zone 120 and causing cross-flow, as shown in Figures 1 and 2, an interlayer area 130 is provided between the cooling zone 120 and the adsorption zone 110. The interlayer area 130 is used to transfer the low-temperature adsorbent. In other words, the low-temperature adsorbent output from the cooling zone 120 first enters the interlayer area 130 for transfer and then enters the adsorption zone 110 from the interlayer area 130. The low-temperature adsorbent in the interlayer area 130 is used to isolate the cooling medium in the cooling zone 120 from the flue gas in the adsorption zone 110. At the same time, the interlayer area 130 also acts as an adsorbent buffer, controlling the flow rate of the adsorbent and preventing it from moving too quickly.

[0038] In some embodiments, the thickness of the interlayer region 130 is 150 mm to 250 mm. When the thickness of the interlayer region 130 is between 150 mm and 250 mm, the resistance of the cryogenic adsorbent filled in the interlayer region 130 can effectively prevent the cooling medium (cooling gas) in the cooling region 120 from flowing downward into the adsorption region 110 along with the cryogenic adsorbent, and can also effectively prevent the flue gas in the adsorption region 110 from flowing upward into the cooling region 120. If the thickness of the interlayer region 130 is less than 150 mm, the cryogenic adsorbent filled in the interlayer region 130 cannot form sufficient resistance to prevent gas flow. If the thickness of the interlayer region 130 is greater than 250 mm, the height occupied by the interlayer region 130 is high, resulting in reduced effective space utilization within the tower 100. The longer circulation path and time of the cryogenic adsorbent in the interlayer region 130 may cause its temperature to recover, affecting adsorption efficiency.

[0039] The following describes a flue gas purification device with adsorbent cooling function in a specific embodiment of the present disclosure based on Figures 1 and 2.

[0040] Example 1:

[0041] The following describes a flue gas purification device with adsorbent cooling in this embodiment, based on Figure 1. The interior of the flue gas purification device's tower 100 is divided, from top to bottom, into a cooling zone 120, an interlayer zone 130, and an adsorption zone 110. In cooling zone 120, the cooling medium and the adsorbent exchange heat in contact. In this embodiment, the cooling medium is low-temperature air.

[0042] As shown in Figure 1 , the top of the tower 100 is provided with a feed port 123 corresponding to the cooling zone 120, and the bottom of the tower 100 is provided with a discharge port 113 corresponding to the adsorption zone 110. The sidewalls of the tower 100 are provided with a cooling medium inlet 121 and a cooling medium outlet 122 corresponding to the cooling zone 120, with the cooling medium inlet 121 vertically located below the cooling medium outlet 122. The sidewalls of the tower 100 are provided with a flue gas inlet 111 and a clean flue gas outlet 112 corresponding to the adsorption zone 110, with the flue gas inlet 111 vertically located below the clean flue gas outlet 112.

[0043] The regenerated adsorbent (temperature is about 60℃-100℃) enters the cooling zone 120 from the feeding port 123 to form a pile layer in the cooling zone 120. The low-temperature air enters the cooling zone 120 from the cooling medium inlet 121 to exchange heat with the adsorbent in the cooling zone 120, and cools the adsorbent to a low-temperature adsorbent with a temperature below room temperature. In the heat exchange process, the adsorbent in the pile layer flows downward under the action of gravity, and the air flows upward. The air after heat exchange is discharged from the tower 100 from the cooling medium outlet 122, and the low-temperature adsorbent after heat exchange enters the interlayer area 130 downward for transfer, and then continues to enter the adsorption area 110 for pile up to form an adsorption bed 200. Containing SO2, NO x Low-temperature flue gas containing pollutants such as chlorinated hydrocarbons enters adsorption zone 110 through flue gas inlet 111 and comes into contact with adsorption bed 200. The low-temperature adsorbent in adsorption bed 200 absorbs the pollutants in the low-temperature flue gas, converting the flue gas into clean flue gas, which is then discharged through clean flue gas outlet 112. After the adsorbent at the bottom of adsorption bed 200 reaches saturation, it is discharged from the bottom of the tower for regeneration.

[0044] In this embodiment, the adsorption bed 200 is a counter-current adsorption bed, that is, the low-temperature adsorbent and the low-temperature flue gas flow in the opposite direction in the adsorption bed 200. The low-temperature adsorbent flows downward under the action of gravity, and the low-temperature flue gas flows upward.

[0045] In some other embodiments, the adsorption bed 200 may also be a cross-flow adsorption bed or a fixed bed.

[0046] As shown in FIG1 , the flue gas purification device in this embodiment includes a first distributor 300 and a first distributor 400. The first distributor 300 is located below the cooling zone 120 and is used to evenly distribute the low-temperature adsorbent to the interlayer zone 130 to reduce the stacking angle formed by the falling material in the interlayer zone 130. The first distributor 400 is located below the interlayer zone 130 and is used to evenly distribute the low-temperature adsorbent in the interlayer zone 130 to the adsorption zone 110 to reduce the stacking angle formed by the falling material at the top of the adsorption bed 200 and reduce the ineffective height of the adsorption zone 110.

[0047] As shown in Figure 1, the first distributor 300 includes several hoppers 310 arranged in parallel above the interlayer zone 130. The cooling medium inlet 121 is horizontally aligned with the first distributor 300. Specifically, the cross-sectional area of ​​the top feed opening of the hopper 310 is larger than the cross-sectional area of ​​its bottom discharge opening, and the tops and bottoms of the hoppers 310 are flush. The hoppers 310 are spaced apart (not shown) to allow low-temperature air to pass through. The cooling medium inlet 121 is vertically located between the top and bottom of the hoppers 310. Low-temperature air enters the cavity formed between the hoppers 310 from the cooling medium inlet 121 and passes through the gaps between the hoppers 310 upward into the cooling zone 120. The cryogenic adsorbent in the cooling zone 120 enters the top feed opening of the hopper 310, falls along the hopper 310, and then falls through the bottom discharge opening of the hopper into the interlayer zone 130. The plurality of discharge funnels 310 are used to evenly distribute the cryogenic adsorbent into the interlayer area 130 .

[0048] As shown in Figure 1, the first distributor 400 includes a first distribution plate 420 and several spaced-apart first distribution tubes 410. The first distribution plate 420 is provided with a plurality of distribution holes. The tops of the first distribution tubes 410 are connected to the distribution holes on the first distribution plate 420 and extend downward. The clean flue gas outlet 112 is horizontally aligned with the first distribution tubes 410 and located above the adsorption bed 200 in the adsorption zone 210. Specifically, the top feed openings and bottom discharge openings of the first distribution tubes 410 are flush, and the adsorption bed 200 is located below the first distributor 400. The clean flue gas outlet 112 is vertically located between the top and bottom of the first distribution tubes 410. Clean flue gas discharged from the top of the adsorption bed 200 enters the cavity formed between the first distribution tubes 410 and is discharged through the clean flue gas outlet 112. The low-temperature adsorbent in the interlayer region 130 passes through the distribution holes in the first distribution plate 420, moves downward along the first distribution pipe 410, and is discharged from the bottom outlet of the first distribution pipe 410, thereby evenly distributing the low-temperature adsorbent to the top of the adsorption bed 200. The first distribution plate 420 also prevents clean flue gas from entering the interlayer region 130.

[0049] The flue gas purification device with adsorbent cooling in this embodiment combines adsorbent cooling and flue gas adsorption. Low-temperature air is used to directly purge and cool the adsorbent. The adsorption stage utilizes the low-temperature adsorbent to purify the flue gas. This significantly increases the adsorption capacity of low-temperature adsorbents for pollutants, achieving integrated removal of multiple pollutants from the flue gas. Direct heat exchange improves heat exchange efficiency, reduces cooling loss, and achieves energy savings and consumption reductions.

[0050] Example 2:

[0051] The following describes a flue gas purification device with adsorbent cooling in this embodiment, using Figure 2. The interior of the flue gas purification device's tower 100 is divided, from top to bottom, into a cooling zone 120, an interlayer zone 130, and an adsorption zone 110. In cooling zone 120, the cooling medium indirectly exchanges heat with the adsorbent. In this embodiment, the cooling medium is cooling water.

[0052] As shown in Figure 2, the top of the tower 100 is provided with a feeding port 123 corresponding to the cooling zone 120, and the bottom of the tower 100 is provided with a discharge port 113 corresponding to the adsorption zone 110. The sidewalls of the tower 100 are provided with a cooling medium inlet 121 and a cooling medium outlet 122 corresponding to the cooling zone 120, with the cooling medium inlet 121 vertically located below the cooling medium outlet 122. The sidewalls of the tower 100 are provided with a flue gas inlet 111 and a clean flue gas outlet 112 corresponding to the adsorption zone 110, with the flue gas inlet 111 vertically located below the clean flue gas outlet 112.

[0053] As shown in Figure 2, the flue gas purification device includes several feed pipes 500 and a second distributor 600. The feed pipes 500 are located in the cooling zone 120 and are spaced apart. The feed pipes 500 extend vertically. The feed pipes 500 are used to transport adsorbent to the interlayer zone 130. The cavity between the feed pipes 500 and the tower 100 is used to circulate the cooling medium. In other words, the cooling medium inlet 121 and the cooling medium outlet 122 are connected to the cavity between the feed pipes 500 and the tower 100. The cooling medium inlet 121 is located vertically below the cooling medium outlet 122. The feed pipes 500 are used to evenly distribute the low-temperature adsorbent to the interlayer zone 130 to reduce the stacking angle formed by the material falling in the interlayer zone 130.

[0054] The flue gas purification device also includes a first baffle 510 and a second baffle 520. The first baffle 510 is connected to the top of the discharge pipe 500, and the second baffle 520 is connected to the bottom of the discharge pipe 500. The first baffle 510, the second baffle 520, the discharge pipe 500, and the tower 100 define a chamber for the circulation of the cooling medium. It will be understood that each of the first baffle 510 and the second baffle 520 has openings corresponding to the discharge pipe 500. The first baffle 510 and the second baffle 520 are used to limit the flow of adsorbent along the discharge pipe 500. A cloth layer is formed above the first baffle 510.

[0055] The second distributor 600 is located below the interlayer area 130 and is used to evenly distribute the cryogenic adsorbent in the interlayer area 130 to the adsorption area 110. The second distributor 600 includes a second distribution plate 610 and a plurality of spaced-apart second distribution tubes 620. The second distribution plate 610 is provided with a plurality of distribution holes. The tops of the plurality of second distribution tubes 620 are connected to the plurality of distribution holes on the second distribution plate 610 in a one-to-one correspondence and extend downward. The clean flue gas outlet 112 is horizontally arranged corresponding to the second distribution tubes 620 and is located above the adsorption bed 200 in the adsorption area 210. Specifically, the top feed openings of the plurality of second distribution tubes 620 are flush with each other, as are the bottom discharge openings. The adsorption bed 200 is located below the second distributor 600.

[0056] The clean flue gas outlet 112 is vertically located between the top and bottom of the second distribution tubes 620. Clean flue gas discharged from the top of the adsorption bed 200 enters the cavity formed between the second distribution tubes 620 and is discharged from the clean flue gas outlet 112. The cryogenic adsorbent in the interlayer area 130 passes through the distribution holes in the second distribution plate 610, moves downward along the second distribution tubes 620, and is discharged from the bottom outlet of the second distribution tubes 620, evenly distributing the cryogenic adsorbent to the top of the adsorption bed 200. The second distribution plate 610 also prevents clean flue gas from entering the interlayer area 130.

[0057] The regenerated adsorbent (temperature is about 60℃-100℃) enters the cooling zone 120 from the feed port 123 and flows downward along the discharge pipe 500. Cooling water enters the cavity between the discharge pipe 500 and the tower 100 from the cooling medium inlet 121 and contacts the adsorbent in the discharge pipe 500 for heat exchange, cooling the adsorbent to a low-temperature adsorbent with a temperature below room temperature. And in the heat exchange process, the adsorbent in the discharge pipe 500 flows downward under the action of gravity. The cooling water after heat exchange is discharged from the tower 100 from the cooling medium outlet 122, and the low-temperature adsorbent after heat exchange goes downward into the interlayer area 130 for transfer, and then enters the adsorption area 110 through the second distributor 600 to form an adsorption bed 200. Containing SO2, NO x The low-temperature flue gas containing pollutants to be adsorbed enters the adsorption zone 110 from the flue gas inlet 111 and contacts the adsorption bed 200. The low-temperature adsorbent in the adsorption bed 200 adsorbs the pollutants in the low-temperature flue gas, and the flue gas becomes clean flue gas, which is discharged from the clean flue gas outlet 112.

[0058] In this embodiment, the adsorption bed 200 is a counter-current adsorption bed, that is, the low-temperature adsorbent and the low-temperature flue gas flow in the opposite direction in the adsorption bed 200. The low-temperature adsorbent flows downward under the action of gravity, and the low-temperature flue gas flows upward.

[0059] In some other embodiments, the adsorption bed 200 may also be a cross-flow adsorption bed or a fixed bed.

[0060] In some embodiments, the temperature of the low-temperature flue gas entering the tower 100 from the flue gas inlet 111 is below zero, for example, -80°C to -5°C.

[0061] In some embodiments, the temperature of the low-temperature flue gas is -20°C to -5°C. The inventors have discovered through research that the lower the flue gas temperature, the more beneficial it is for adsorption purification. However, too low a flue gas temperature complicates the structure of the flue gas cooling equipment and increases energy consumption. For example, insulation layers are required for the cooling equipment, adsorption tower, and pipelines, requiring high sealing performance, which increases costs. Furthermore, excessively low temperatures can easily lead to condensation in the adsorption tower, causing the adsorbent to stick and clog, affecting adsorption. Therefore, cooling the flue gas to a temperature of -20°C to -5°C is advantageous.

[0062] Several baffles 700 are also provided in the cooling zone 120. The baffles 700 are arranged horizontally, and several baffles 700 are arranged at intervals in the vertical direction to limit the flow channel of the circulating cooling medium to a serpentine flow channel, thereby extending the flow path of the cooling medium and the residence time in the cooling zone 120, thereby improving the heat exchange efficiency.

[0063] The flue gas purification device with adsorbent cooling function in this embodiment realizes adsorbent cooling and low-temperature adsorption purification of exhaust gas in the same tower, and utilizes the adsorbent to cool SO2 and NO in a low-temperature environment. x The performance of pollutant adsorption capacity is greatly improved, and various pollutants in exhaust gas can be removed in an integrated manner.

[0064] In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present disclosure.

[0065] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. Throughout the present disclosure, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0066] In this disclosure, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections, electrical connections, or communication between them; direct connections or indirect connections through an intermediate medium; and internal communication between two elements or interaction between two elements, unless otherwise expressly limited. Those skilled in the art will understand the specific meanings of the above terms in this disclosure based on specific circumstances.

[0067] In the present disclosure, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0068] In the present disclosure, the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0069] Although the embodiments of the present disclosure have been shown and described above, it is understood that the above embodiments are illustrative and are not to be construed as limitations on the present disclosure. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present disclosure.

Claims

1. A flue gas purification device with adsorbent cooling function, characterized in that: include: A tower, wherein the inner cavity of the tower defines an adsorption zone and a cooling zone, and the tower is provided with a flue gas inlet, a clean flue gas outlet and a discharge port connected to the adsorption zone, and a cooling medium inlet, a cooling medium outlet and a feeding port connected to the cooling zone, the cooling medium inlet is used to input cooling medium into the cooling zone, the feeding port is used to feed adsorbent into the cooling zone, the cooling medium exchanges heat with the adsorbent in the cooling zone to cool the adsorbent into a low-temperature adsorbent at room temperature or below, the cooling medium outlet is used to discharge the cooling medium after heat exchange, the flue gas inlet is used to input low-temperature flue gas at a temperature below room temperature into the adsorption zone, the low-temperature adsorbent enters the adsorption zone and adsorbs the low-temperature flue gas to purify the low-temperature flue gas into clean flue gas, the clean flue gas outlet is used to output the clean flue gas, and the discharge port is used to discharge the adsorbent saturated with adsorption.

2. The flue gas purification device with adsorbent cooling function according to claim 1, characterized in that: The feeding port is located above the cooling zone, the discharging port is located below the adsorption zone, the adsorption zone is located below the cooling zone, and the low-temperature adsorbent in the cooling zone falls toward the top of the adsorption zone.

3. The flue gas purification device with adsorbent cooling function according to claim 1 or 2, characterized in that: The cooling medium outlet is located above the cooling medium inlet in a vertical direction.

4. The flue gas purification device with adsorbent cooling function according to any one of claims 1 to 3, characterized in that: The cooling medium and the adsorbent perform contact heat exchange, and the cooling medium is a gas; or the cooling medium and the adsorbent perform indirect heat exchange, and the cooling medium is a liquid.

5. The flue gas purification device with adsorbent cooling function according to any one of claims 1 to 4, characterized in that: An interlayer area for transferring the low-temperature adsorbent is provided between the cooling area and the adsorption area. The low-temperature adsorbent in the interlayer area is used to isolate the cooling medium in the cooling area and the flue gas in the adsorption area.

6. The flue gas purification device with adsorbent cooling function according to claim 5, characterized in that: The thickness of the interlayer area is 150mm-250mm.

7. The flue gas purification device with adsorbent cooling function according to claim 5 or 6, characterized in that: The cooling medium and the adsorbent perform contact heat exchange, and the flue gas purification device includes a first distributor and a first distributor, the first distributor is located below the cooling zone and is used to evenly distribute the low-temperature adsorbent to the interlayer zone, and the first distributor is located below the interlayer zone and is used to evenly distribute the low-temperature adsorbent in the interlayer zone to the adsorption zone.

8. The flue gas purification device with adsorbent cooling function according to claim 7, characterized in that: The first distributor includes a plurality of drop hoppers arranged in parallel above the interlayer area, and the cooling medium inlet is arranged corresponding to the first distributor in the horizontal direction; the first distributor includes a distribution plate and a plurality of first distribution pipes arranged at intervals, and the distribution plate is provided with a plurality of distribution holes, and the tops of the plurality of first distribution pipes are connected to the distribution holes one by one and extend downward, and the clean flue gas outlet is arranged corresponding to the first distribution pipe in the horizontal direction and is located above the adsorption bed in the adsorption area.

9. The flue gas purification device with adsorbent cooling function according to claim 5 or 6, characterized in that: The flue gas purification device includes a plurality of feed pipes and a second distributor, wherein the plurality of feed pipes are located in the cooling zone and are arranged at intervals, the feed pipes are used to transport the adsorbent to the interlayer zone, the cooling medium is circulated between the feed pipes and the tower, and the second distributor is located below the interlayer zone and is used to evenly distribute the low-temperature adsorbent in the interlayer zone to the adsorption zone.

10. The flue gas purification device with adsorbent cooling function according to claim 9, characterized in that: It also includes a first partition and a second partition, wherein the first partition is connected to the top of the feed pipe, and the second partition is connected to the bottom of the feed pipe, and the first partition, the second partition, the feed pipe and the tower define a chamber for circulating cooling medium.

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