Surface enhanced liquid cooling cold plate for pluggable I / O module

Abstract

An input / output (I / O) system for thermal management is described. The I / O system includes one or more pluggable I / O modules and a cooling plate configured to couple to the pluggable I / O modules to cool the pluggable I / O modules during operation. The cooling plate includes at least one or more channels through which coolant is configured to be routed. The one or more channels include a conductive powder sintered surface in some embodiments, or a surface modified to have a surface roughness (Ra) of approximately 10 µm to 20 µm. The coolant can be a dielectric fluid having a boiling point between 30° C and 70° C.

Description

SURFACE ENHANCED LIQUID COOLING COLD PLATE FOR PLUGGABLE I / O MODULEBACKGROUND

[0001] Thermal problems with input / output (I / O) connectors can arise in various electronic and electrical systems. I / O connectors are used to establish electrical and data connections between different components in a system. These connectors can be susceptible to thermal-related issues that can affect performance of the system which can be caused due to overheating, thermal expansion and contraction, mismatched thermal expansion, insulation breakdown, increased contact resistance, corrosion, and so forth. In some instances, it can be desirable to providing cooling apparatuses to maintain ideal operating temperatures.BRIEF SUMMARY

[0002] Various embodiments are disclosed for surface enhanced liquid cooling cold plates for thermal management that can be used in conjunction with pluggable I / O modules as well as like devices and systems. In a first aspect, a system is disclosed, including a pluggable I / O module, and a cooling plate configured to couple to the pluggable I / O module to cool the pluggable I / O module during operation. The cooling plate includes at least one channel through which coolant is configured to be routed. The at least one channel includes a conductive powder sintered surface.

[0003] In some aspects, the system comprises the coolant, and the coolant is a dielectric fluid having a boiling point between 30° C and 70° C. For instance, the dielectric fluid can be 3M HFE-7000 or Chemours SF-33, and the boiling point can be approximately 34° C. The cooling plate can include a coolant chamber, where at least a portion of the pluggable I / O module can be positioned within the coolant chamber such that the coolant comes into contact with the portion of the pluggable I / O module positioned within the coolant chamber.

[0004] The pluggable I / O module can include at least one I / O connector and a heat sink having a plurality of fins, and the portion of the pluggable I / O module positioned within the coolant chamber can be at least a portion of the plurality of fins. The cooling plate can includea plurality of channels defined by a plurality of channel walls, where each of the plurality of fins is positioned to contact a corresponding one of the plurality of channel walls.

[0005] In some aspects, the plurality of channels comprises an inlet channel, an outlet channel, and a plurality of intermediary channels that fluidly couple the inlet channel to the outlet channel, the plurality of intermediary channels being positioned between the inlet channel and the outlet channel. A fluid inlet can be fluidly coupled to the inlet channel, and a fluid outlet can be fluidly coupled to the outlet channel.

[0006] The pluggable I / O module can be one of a plurality of pluggable I / O modules. The plurality of pluggable I / O modules are positioned on a substrate such that a bottom surface of the plurality of pluggable I / O modules contacts the substrate, and the cooling plate is positioned, at least partially, on top of the plurality of pluggable I / O modules. In some aspects, the conductive powder sintered surface is a copper powder sintered surface. In other aspects, the conductive powder sintered surface is an aluminum powder sintered surface.

[0007] In a second aspect, a system is described, including a pluggable I / O module, and a cooling plate configured to couple to the pluggable I / O module to cool the pluggable I / O module during operation. The cooling plate includes at least one channel through which coolant is configured to be routed. The at least one channel includes a surface roughness (Ra) of approximately 10 pm to 20 pm.

[0008] In some aspects, the system includes the coolant, and the coolant is a dielectric fluid having a boiling point between 30° C and 70° C. The dielectric fluid can be 3M HFE- 7000 or Chemours SF-33, and the boiling point can be approximately 34° C.

[0009] The cooling plate includes a coolant chamber, where at least a portion of the pluggable I / O module is positioned within the coolant chamber such that the coolant comes into contact with the portion of the pluggable I / O module positioned within the coolant chamber. The pluggable I / O module can include at least one I / O connector and a heat sink having a plurality of fins, and the portion of the pluggable I / O module positioned within the coolant chamber is at least a portion of the plurality of fins.

[0010] The cooling plate can include a plurality of channels defined by a plurality of channel walls, wherein each of the plurality of fins is positioned to contact a corresponding one of the plurality of channel walls. The plurality of channels includes an inlet channel, an outlet channel, and a plurality of intermediary channels that fluidly couple the inlet channelto the outlet channel, the plurality of intermediary channels being positioned between the inlet channel and the outlet channel.

[0011] The cooling plate can further include a fluid inlet fluidly coupled to the inlet channel, and a fluid outlet fluidly coupled to the outlet channel. The pluggable I / O module can be one of a plurality of pluggable I / O modules. The plurality of pluggable I / O modules are positioned on a substrate such that a bottom surface of the plurality of pluggable I / O modules contacts the substrate, and the cooling plate is positioned, at least partially, on top of the plurality of pluggable I / O modules. The surface roughness (Ra) can be approximately 18.88 pm.

[0012] In a third aspect, a method is described, including: providing a cooling plate configured to couple to a pluggable I / O module to cool the pluggable I / O module during operation, the cooling plate comprising at least one channel through which coolant is configured to be routed; and sintering a surface of the at least one channel using a conductive powder such that the at least one channel comprises a conductive powder sintered surface. The conductive powder is a copper powder or an aluminum powder.

[0013] In a fourth aspect, a method is described, including: providing a cooling plate configured to couple to a pluggable I / O module to cool the pluggable I / O module during operation, the cooling plate comprising at least one channel through which coolant is configured to be routed; and modifying a surface of the at least one channel such that the at least one channel comprises a surface roughness (Ra) of approximately 10 pm to 20 pm. The surface roughness (Ra) can be approximately 18.88 pm.BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Many aspects of the present disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily to scale, with emphasis instead being placed upon clearly illustrating the principles of the disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.

[0015] FIG. 1 is a top perspective view of an input / output system having a plurality of pluggable modules, a heat sink, and a cooling plate in accordance with various embodiments of the present disclosure.

[0016] FIG. 2 is another top perspective view of the input / output system of FIG. 1 with a top surface of the cooling plate omitted from view in accordance with various embodiments of the present disclosure.

[0017] FIG. 3 is another top perspective view of the input / output system of FIG. 1 with the cooling plate omitted from view in accordance with various embodiments of the present disclosure.

[0018] FIGS. 4-7 are various views of a cooling plate body of the cooling plate of FIG. 1 in accordance with various embodiments of the present disclosure.

[0019] FIG. 8 is a top perspective view of the cooling plate body of FIGS. 4-7 having fins of a heat sink disposed therein in accordance with various embodiments of the present disclosure.

[0020] FIG. 9 is a side cross-section view of the I / O system having a pluggable module, a heat sink, and a cooling plate in accordance with various embodiments of the present disclosure.

[0021] FIGS. 10 is a scanning electronic microscopic (SEM) image of a copper powder sintered channel in accordance with various embodiments of the present disclosure.

[0022] FIGS. 11 and 12 are photographic images of a non-roughened channel and a highly roughened channel, respectively, in accordance with various embodiments of the present disclosure.

[0023] FIGS. 13 and 14 are charts showing thermal measurements as compared between a cooling plate body and a cooling plate body with a channel having a conductive powder sintered surface in accordance with various embodiments of the present disclosure.

[0024] FIGS. 15 and 16 are charts showing thermal measurements as compared between a cooling plate body and a cooling plate body with a channel having a high surface roughness in accordance with various embodiments of the present disclosure.DETAILED DESCRIPTION

[0025] The present disclosure relates to surface enhanced liquid cooling cold plates that can be used for thermal management in conjunction with pluggable I / O modules as well as like devices and systems. When I / O connectors overheat, several issues can arise potentially leading to system malfunctions, data loss, or damage to the connectors themselves.Overheating can lead to a decrease in the reliability of the connectors, which can cause intermittent connectivity issues and make it difficult to maintain a stable data transfer or power supply. High temperatures can degrade the quality of electrical signals passing through the connectors. This can result in data corruption, signal noise, or even data loss, affecting the performance of connected devices.

[0026] Furthermore, prolonged exposure to high temperatures can physically damage the connectors. For instance, plastic and metal components of an I / O connector can warp, melt, or become brittle, rendering the connector unusable. Overheating can accelerate contact wear and corrosion within the connectors, leading to increased electrical resistance. This can result in voltage drops, reduced current flow, and, ultimately, connectivity problems.

[0027] In cases where overheating affects the connectors coupled to storage devices (e.g., hard drives, solid-state drives, or flash drives), it can result in data loss or corruption. Overheating can degrade the storage medium and can make data recovery more challenging. In some instances, extreme temperatures can pose a fire hazard, particularly if the connectors come into close proximity with flammable materials. Finally, high temperatures can significantly reduce the lifespan of electronic components, including I / O connectors. Premature failure of these components can result in costly replacements and downtime.

[0028] Accordingly, various embodiments are disclosed herein for a cooling apparatus having improved thermal characteristics that can be used in conjunction with pluggable modules having an I / O connector, as well as other heat-generating devices, such as processors, circuit boards, or like electrical devices. The cooling apparatus provides a cooling effect, thereby improving the performance of the I / O connector or like electrical device.

[0029] In some embodiments, an input / output system is disclosed. The I / O system includes a pluggable module and a cooling plate configured to couple to the pluggable module and cool an I / O connector of the pluggable module (or other component) during operation. The cooling plate includes at least one or more channels through which coolant can be routed. The one or more channels of the cooling plate can include a conductive powder sintered surface in some embodiments, or a surface modified to have a high surface roughness. The coolant can be a dielectric fluid having a boiling point between 30° C and 70° C. As will be described, the use of a sintered metal powder or highly rough surface in combination with a dielectric fluid can reduce temperature rise of existing connectors by as much as 25-60% asper preliminary tests. Moreover, the use of dielectric fluid can reduce or eliminate the risk of leakage.

[0030] Turning now to the drawings, FIG. 1 is an example of an I / O system 10 according to various embodiments. Generally, the I / O system 10 can include a substrate 50, one or more pluggable modules 75a...75n (collectively “pluggable modules 75” or “pluggable I / O modules 75”), and a cooling plate 100. The substrate 50 can include a circuit board, printed circuit board (PCB), or like device on which the pluggable modules 75 can be connected or otherwise mounted. In some embodiments, the pluggable modules 75 can form a physical and electrical connection with electrical traces on the substrate 50, a receptacle module on the substrate 50, or so forth.

[0031] The pluggable modules 75 can be one of a multitude of connector types, as can be appreciated. Generally, each pluggable module 75 can include a wire 77, a housing 79, a release latch 81, among other components as will be described. It is understood that the housing 79 can include one or more terminal connectors (not shown) disposed therein that contact other terminal connectors, such as those electrically coupled to the substrate 50 or electronics associated therewith.

[0032] The cooling plate 100 generally includes a cooling plate body 103 (or body 103) and a cooling plate cover 106 detachably attached to the cooling plate body 103. In some embodiments, the cooling plate body 103 includes tabs 109 that extend from the cooling plate body 103 having an aperture 112. A connection mechanism, such as a screw 115 and a biasing spring 118, can be positioned through the aperture 112 to couple the tabs 109 (and the cooling plate body 103) to the substrate 50, sandwiching the pluggable modules 75 therebetween. Biasing provided by the biasing spring 118 can protect the pluggable modules 75 if the screws 115 are coupled too tightly to the substrate 50. The screw 115 can include a wide textured head suitable for turning by a hand of an operator, although other types of screws 115 can be employed. As shown in FIG. 1, the pluggable modules 75 are positioned on the substrate 50 such that a bottom surface of the pluggable modules 75 contacts the substrate 50, and the cooling plate 100 is positioned, at least partially, on top of the pluggable modules 75.

[0033] Moving along, FIG. 2 is a top perspective view of the I / O system 10 with the cooling plate cover 106 of the cooling plate 100 omitted from view, and FIG. 3 is a top perspective view of the I / O system 10 with the cooling plate 100 omitted from view inaccordance with various embodiments of the present disclosure. Referring first to FIG. 2, the cooling plate body 103 can further include a fluid inlet 121 and a fluid outlet 124, which can include a fitting capable of coupling to a tube for fluid communication with a heat exchanger, pump, and / or other devices. The fluid inlet 121 and / or the fluid outlet 124 can include fittings or nozzles external to and cantilevered with respect to the cooling plate body 103. A fluid (not shown), such as water or a dielectric fluid, can be pumped or otherwise forced through the fluid inlet 121, through the cooling plate body 103, and out the fluid outlet 124, as can be appreciated.

[0034] The cooling plate body 103 can include a coolant chamber 127 in fluid communication with the fluid inlet 121 and the fluid outlet 124. As will be described in greater detail below, at least a portion of the pluggable modules 75 can be positioned within the coolant chamber 127 such that coolant comes into contact with the portion of the pluggable modules 75 positioned therein, which will apply a cooling effect to the pluggable modules 75 and any components therein (e.g., connector electronics).

[0035] The cooling plate 100 can include a coolant chamber. The coolant chamber can include channels 130 defined by various channel walls 133. Referring collectively to FIGS. 2 and 3, in some embodiments, the pluggable modules 75 include one or more heat sinks 84. For instance, in some implementations, a single integral heat sink 84 can be positioned across multiple pluggable modules 75. The heat sink 84 can be formed of a conductive material, such as aluminum, copper, or other like material, which absorbs heat emitted by the pluggable modules 75 and / or components therein. The heat sink 84 can include a multitude of fins 87 that extend vertically with respect to the heat sink 84. Further, the heat sink 84 can include recesses 90, or empty areas, that separate the fins 87 from one another. Generally, the recesses 90 allow air to pass between the fins 87 and cool heat absorbed by the heat sink 84.

[0036] Referring again to FIG. 2, the heat sink 84 and the cooling plate body 103 can each be sized and positioned such that each of the fins 87 of the heat sink 84 is positioned to contact a corresponding one of the channel walls 133. Thus, in some implementations, a number of the fins 87 (e.g., ten) can be equal to a number of the channel walls 133 (e.g., ten). It is understood that the number of the fins 87 and the channel walls 133 can vary depending on the particular implementation. As the cooling plate body 103 can be formed of a conductive material, such as copper or aluminum, any heat residing in the fins 87 is absorbedby the cooling plate body 103. Moreover, heat can be absorbed by fluid flowing through the channels 130, as will be described.

[0037] FIGS. 4-7 are various views of the cooling plate body 103 of the cooling plate 100 in accordance with various embodiments of the present disclosure. Specifically, FIG. 4 is a top perspective view, FIG. 5 is a top elevation view, FIG. 6 is a bottom perspective view, and FIG. 7 is a bottom elevation view of the cooling plate body 103 according to various embodiments. The channels 130 can include particular arrangements that facilitate the absorption of heat, which provides a cooling effect to the pluggable modules 75. As shown in FIG. 4, in some embodiments, the channels 130 can include an inlet channel 136, an outlet channel 139, and one or more intermediary channels 142a...142n (FIG. 5) (collectively “intermediary channels 142”) that fluidly couple the inlet channel 136 to the outlet channel 139. Moreover, the intermediary channels 142 permit the flow of coolant between the fins 87 and the channel walls 133, as can be seen in FIG. 2.

[0038] With reference to FIG. 5, the inlet channel 136 and the outlet channel 139 can extend vertically or parallel to side walls of the cooling plate body 103. The intermediary channels 142, on the other hand, can be approximately orthogonal with respect to the inlet channel 136 and / or the outlet channel 139. In other words, the intermediary channels 142 can be positioned parallel to top and bottom walls of the cooling plate body 103.

[0039] The fluid inlet 121 and the fluid outlet 124 (FIG. 2) can be fluidly coupled to the inlet channel 136 and the outlet channel 139, respectively, via an inlet aperture 145 and an outlet aperture 148. As can be understood, a coolant can be directed through the inlet aperture 145, into the inlet channel 136, through the intermediary channels 142 (and cooling fins 87 as the coolant travels through the intermediary channels 142), into the outlet channel 139, and out the outlet aperture 148. Once exiting the cooling plate body 103, the coolant can be directed through a heat exchanger or like device, which can be recycled back into use via the inlet aperture 145, and so on. Referring to FIGS. 6 and 7, the cooling plate body 103 can include bottom surface apertures 151. The fins 87 of the heat sink 84 can extend through the bottom surface apertures 151 to be positioned near and / or contact the channel walls 133.

[0040] Turning now to FIG. 8, FIG. 8 is a top perspective view of the cooling plate body 103 showing the fins 87 of the heat sink 84 disposed therein in accordance with various embodiments of the present disclosure. Specifically, the fins 87 are shown being positionedsuch that each of the fins 87 contacts a channel wall 133. To further facilitate the heat management qualities of the cooling plate 100, surfaces of the channels 130 (e.g., channels 136, 139, and / or 142) can be modified according to various embodiments. For instance, in some embodiments, a surface of the channels 130 (e.g., bottom or side surfaces of the channels 130) can be sintered with a layer of conductive powder. The conductive powder can include, for example, copper powder, aluminum powder, gold powder, silver powder, or other conductive powders. In alternative embodiments, the surface of the channels 130 can be “highly roughened.” In other words, a surface of the channels 130 can be modified to have a surface roughness (Ra) of approximately 18.88 pm (e.g., ± 20%). In some aspects, the surface roughness (Ra) can be approximately 10 pm, 11 pm, 12 pm, 13 pm, 14 pm, 15 pm, 16 pm, 17 pm, 18 pm, 19 pm, or 20 pm.

[0041] Further, in some embodiments, instead of using water as a coolant, a dielectric fluid can be utilized. For instance, a dielectric fluid that boils at approximately 34 °C (e.g., ±3 °C) can be utilized. In some examples, such dielectric fluid can include 3M® HFE-7000, Chemours® SF-33, or like fluid. Through use of such dielectric fluid, leakage is reduced or eliminated, and latent heat of evaporation is utilized.

[0042] Referring next to FIG. 9, FIG. 9 is a side cross-sectional view of the I / O system 10 according to various embodiments. The I / O system 10 is shown including the substrate 50, a pluggable module 75, and a cooling plate 100. The pluggable module 75 can include an I / O connector 93 (e.g., one or more terminal connectors), a chip 96 capable of producing heat during operation, and a thermal pad 99. As shown in FIG. 9, the thermal pad 99 can be positioned on top of the chip 96. The heat sink 84 can be positioned on top of the thermal pad 99, which can increase heat transfer from the chip 96 to the heat sink 84.

[0043] The substrate 50 can include a printed circuit board or like device on which the pluggable module 75 can be connected or otherwise mounted. For instance, the I / O connector of the pluggable module 75 can form a physical and electrical connection with electrical traces on the substrate 50, a receptacle module welded on the substrate 50, or so forth.

[0044] The cooling plate cover 106 of the cooling plate 100 can detachably attach to the cooling plate body 103 via one or more cover screws 152. It is understood that other types of connections can be utilized. In some embodiments, gaskets 155 can be provided that are positioned between the cooling plate cover 106 of the cooling plate 100 and the cooling platebody 103, preventing or reducing leakage. The screw 115 (FIG. 2) and the biasing spring 118 (FIG. 2) can be positioned through the aperture 112 to couple the cooling plate body 103 to the substrate 50, sandwiching the pluggable module 75 therebetween. Further, this arrangement sandwiches the thermal pad 99 between the heat sink 84 and the cooling plate 100. The channels 130 are shown as having a modified surface 158. The modified surface 158 can include a conductive powder sintered surface or a highly roughened surface, as described herein.

[0045] FIG. 10 is a scanning electronic microscopic (SEM) image 300 of a channel 130 of the cooling plate body 103 sintered with a copper powder 303 in accordance with various embodiments of the present disclosure. The conductive powder, such as copper powder 303, can enhance the nucleation boiling effect where heat transfer is increased due to the enhanced mixing caused by the turbulence near a heated surface (e.g., fins 87) due to bubble formation. Sintering of a conductive powder or material can include, for example, placing conductive powder on a channel and performing a compaction, isostatic compaction, extrusion, or forging. In some embodiments, a layer of the conductive powder is applied having a width of approximately 0.5 mm (e.g., ± 0.2 mm), where a width of the sintered channel 130 can be approximately 4 mm (e.g., ± 2 mm).

[0046] FIG. 11 is a photograph of a channel 130 without a surface modification, and FIG. 12 is a photograph of a channel 130 with a highly roughened surface. Specifically, the channel 130 of FIG. 12 is modified to have a surface roughness (Ra) of approximately 18.88 pm. However, other degrees of surface roughness can be employed. In various embodiments, the channel 130 of the cooling plate 100 can be modified using electrical discharge machining (EDM) to make the highly rough channel surfaces, although it is understood that other techniques can be employed.

[0047] FIGS. 13 and 14 are charts showing thermal measurements as compared between a standard cooling plate body and a cooling plate body 103 with a channel 130 having a conductive powder sintered surface in accordance with various embodiments of the present disclosure. Specifically, FIGS. 13 and 14 show results of a copper powder sintered surface. Various tests were conducted at two heat rates, namely, 53 W and 79 W, and at a fixed flow rate (e.g., 250 ml / min). A significant reduction in T rise (up to 60%) can be observed whenusing the dielectric fluid with a copper powder sintered surface, as compared to water without a sintered copper surface of channel 130.

[0048] FIGS. 15 and 16 are charts showing thermal measurements as compared between a traditional cooling plate body and a cooling plate body 103 with a channel 130 having a high surface roughness in accordance with various embodiments of the present disclosure. Various tests were conducted at two heat rates, namely, 53 W and 79 W, and at a fixed flow rate (e.g., 250 ml / min). A reduction in T rise (up to 25%) can be observed when using a dielectric fluid in combination with a highly roughed channel as compared to use of water with a traditional and smooth channel.

[0049] The features, structures, or characteristics described above may be combined in one or more embodiments in any suitable manner, and the features discussed in the various embodiments may be interchangeable, if possible. In the following description, numerous specific details are provided in order to fully understand the embodiments of the present disclosure. However, a person skilled in the art will appreciate that the technical solution of the present disclosure may be practiced without one or more of the specific details, or other methods, components, materials, and the like may be employed. In other instances, well- known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of the present disclosure.

[0050] Although the relative terms such as “on,” “below,” “upper,” and “lower” are used in the specification to describe the relative relationship of one component to another component, these terms are used in this specification for convenience only, for example, as a direction in an example shown in the drawings. It should be understood that if the device is turned upside down, the “upper” component described above will become a “lower” component. When a structure is “on” another structure, it is possible that the structure is integrally formed on another structure, or that the structure is “directly” disposed on another structure, or that the structure is “indirectly” disposed on the other structure through other structures.

[0051] In this specification, the terms such as “a,” “an,” “the,” and “said” are used to indicate the presence of one or more elements and components. The terms “comprise,” “include,” “have,” “contain,” and their variants are used to be open ended, and are meant toinclude additional elements, components, etc., in addition to the listed elements, components, etc. unless otherwise specified in the appended claims.

[0052] The terms “first,” “second,” etc. are used only as labels, rather than a limitation for a number of the objects. It is understood that if multiple components are shown, the components may be referred to as a “first” component, a “second” component, and so forth, to the extent applicable.

[0053] The above-described embodiments of the present disclosure are merely possible examples of implementations set forth for a clear understanding of the principles of the disclosure. Many variations and modifications may be made to the above-described embodiment(s) without departing substantially from the spirit and principles of the disclosure. All such modifications and variations are intended to be included herein within the scope of this disclosure and protected by the following claims.

Claims

CLAIMSTherefore, the following is claimed:

1. A system, comprising: a pluggable I / O module; and a cooling plate configured to couple to the pluggable I / O module to cool the pluggable I / O module during operation, the cooling plate comprising at least one channel through which coolant is configured to be routed, wherein the at least one channel comprises a conductive powder sintered surface.

2. The system according to any of the preceding claims, wherein the system comprises the coolant, and the coolant is a dielectric fluid having a boiling point between 30° C and 70° C.

3. The system according to any of the preceding claims, wherein the dielectric fluid is 3M HFE-7000 or Chemours SF-33, and the boiling point is approximately 34° C.

4. The system according to any of the preceding claims, wherein the cooling plate comprises a coolant chamber, wherein at least a portion of the pluggable I / O module is positioned within the coolant chamber such that the coolant comes into contact with the portion of the pluggable I / O module positioned within the coolant chamber.

5. The system according to any of the preceding claims, wherein: the pluggable I / O module comprises at least one I / O connector and a heat sink having a plurality of fins; and the portion of the pluggable I / O module positioned within the coolant chamber is at least a portion of the plurality of fins.

6. The system according to any of the preceding claims, wherein the cooling plate comprises a plurality of channels defined by a plurality of channel walls, wherein each of the plurality of fins is positioned to contact a corresponding one of the plurality of channel walls.

7. The system according to any of the preceding claims, wherein the plurality of channels comprises an inlet channel, an outlet channel, and a plurality of intermediary channels that fluidly couple the inlet channel to the outlet channel, the plurality of intermediary channels being positioned between the inlet channel and the outlet channel.

8. The system according to any of the preceding claims, further comprising a fluid inlet fluidly coupled to the inlet channel, and a fluid outlet fluidly coupled to the outlet channel.

9. The system according to any of the preceding claims, wherein the pluggable I / O module is one of a plurality of pluggable I / O modules.

10. The system according to any of the preceding claims, wherein the plurality of pluggable I / O modules are positioned on a substrate such that a bottom surface of the plurality of pluggable I / O modules contacts the substrate, and the cooling plate is positioned, at least partially, on top of the plurality of pluggable I / O modules.

11. The system according to any of the preceding claims, wherein the conductive powder sintered surface is a copper powder sintered surface.

12. The system according to any of the preceding claims, wherein the conductive powder sintered surface is an aluminum powder sintered surface.

13. A system, comprising: a pluggable I / O module; and a cooling plate configured to couple to the pluggable I / O module to cool the pluggable I / O module during operation, the cooling plate comprising at least one channel through which coolant is configured to be routed, wherein the at least one channel comprises a surface roughness (Ra) of approximately 10 pm to 20 pm.

14. The system according to any of the preceding claims, wherein the system comprises the coolant, and the coolant is a dielectric fluid having a boiling point between 30° C and 70° C.

15. The system according to any of the preceding claims, wherein the dielectric fluid is 3M HFE-7000 or Chemours SF-33, and the boiling point is approximately 34° C.

16. The system according to any of the preceding claims, wherein the cooling plate comprises a coolant chamber, wherein at least a portion of the pluggable I / O module is positioned within the coolant chamber such that the coolant comes into contact with the portion of the pluggable I / O module positioned within the coolant chamber.

17. The system according to any of the preceding claims, wherein: the pluggable I / O module comprises at least one I / O connector and a heat sink having a plurality of fins; and the portion of the pluggable I / O module positioned within the coolant chamber is at least a portion of the plurality of fins.

18. The system according to any of the preceding claims, wherein the cooling plate comprises a plurality of channels defined by a plurality of channel walls, wherein each of the plurality of fins is positioned to contact a corresponding one of the plurality of channel walls.

19. The system according to any of the preceding claims, wherein the plurality of channels comprises an inlet channel, an outlet channel, and a plurality of intermediary channels that fluidly couple the inlet channel to the outlet channel, the plurality of intermediary channels being positioned between the inlet channel and the outlet channel.

20. The system according to any of the preceding claims, further comprising a fluid inlet fluidly coupled to the inlet channel, and a fluid outlet fluidly coupled to the outlet channel.

21. The system according to any of the preceding claims, wherein the pluggable I / O module is one of a plurality of pluggable I / O modules.

22. The system according to any of the preceding claims, wherein the plurality of pluggable I / O modules are positioned on a substrate such that a bottom surface of the plurality of pluggable I / O modules contacts the substrate, and the cooling plate is positioned, at least partially, on top of the plurality of pluggable I / O modules.

23. The system according to any of the preceding claims, wherein the surface roughness (Ra) is approximately 18.88 pm.

24. A method, comprising: providing a cooling plate configured to couple to a pluggable I / O module to cool the pluggable I / O module during operation, the cooling plate comprising at least one channel through which coolant is configured to be routed; and sintering a surface of the at least one channel using a conductive powder such that the at least one channel comprises a conductive powder sintered surface.

25. The method according to any of the preceding claims, wherein the conductive powder is a copper powder or an aluminum powder.

26. A method, comprising:providing a cooling plate configured to couple to a pluggable I / O module to cool the pluggable I / O module during operation, the cooling plate comprising at least one channel through which coolant is configured to be routed; and modifying a surface of the at least one channel such that the at least one channel comprises a surface roughness (Ra) of approximately 10 pm to 20 pm.

27. The method according to any of the preceding claims, wherein the surface roughness (Ra) is approximately 18.88 pm.

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