Capillary replacement method and wire bonding device

Abstract

A capillary replacement method according to the present invention comprises: a step for drawing the tip of a bonding wire into a capillary through hole of a used capillary; a step for replacing the used capillary with a replacement capillary; and a step for conducting preparation for resuming bonding using the replacement capillary. In the replacement step, whether or not the type of the replacement capillary is identical with the type of a reference capillary is determined by observing the replacement capillary with a camera. In the preparation step, whether or not the bonding wire is in a state in which a bonding operation can be resumed is determined by observing, with a camera, a protruding part of the bonding wire that is protruding from the tip of the replacement capillary.

Description

Capillary replacement method and wire bonding apparatus

[0001] The present invention relates to a method for replacing a capillary and a wire bonding apparatus.

[0002] A wire bonding device electrically connects the electrodes of a semiconductor chip to a lead frame using a wire. The wire is pressed against the electrodes of the semiconductor chip from a component called a capillary, and heat or ultrasonic waves are applied as needed. As a result, the wire is bonded to the electrodes of the semiconductor chip. This bonding operation is called bonding.

[0003] When bonding is repeated, it becomes difficult to obtain the desired bonding results due to wear at the tip of the capillary, etc. Therefore, the capillary is replaced every time a replacement condition set based on the number of bonding operations, etc. is met.

[0004] Patent Documents 1 to 3 each disclose techniques related to wire bonding. Patent Document 1 discloses an apparatus and method that allows continuous bonding while replacing the capillary, which is the bonding tool. Patent Document 2 discloses an apparatus and method that accurately detects the position of the capillary. Patent Document 3 discloses a method that more effectively suppresses wire dislodgment and wire bending.

[0005] Japanese Patent No. 4700595 Japanese Patent Publication No. 2001-249007 Japanese Patent No. 4467631

[0006] The capillary replacement process involves more than simply replacing a used capillary with a new one; it also includes restoring the wire to the new capillary so that bonding can resume. Automatic capillary replacement requires the process of threading the wire through the capillary, but it is desirable to quickly restore the capillary to a state where bonding is possible after the wire is automatically threaded through the capillary. Furthermore, automating the capillary replacement process, which was previously performed manually, is expected to not only reduce labor costs but also shorten the capillary replacement process.

[0007] The present invention provides a method for replacing a capillary and a wire bonding apparatus that can reduce the number of people required and shorten the time required for capillary replacement.

[0008] A method for replacing a capillary, which is one form of the present invention, includes the steps of: pulling the tip of the wire into a capillary through-hole provided in the used capillary in preparation for replacing the used capillary, which is inserted into a horn and has a wire threaded therethrough, with a replacement capillary; replacing the used capillary with a replacement capillary; and performing preparations for resuming bonding using the replacement capillary.In the replacement step, the replacement capillary inserted into the horn is observed with a camera to determine whether the type of the replacement capillary inserted into the horn is the same as the type of the reference capillary, which is the capillary to be used in the resumed bonding.In the preparation step, the wire protruding portion protruding from the tip of the replacement capillary is observed with a camera to determine whether the wire is in a state where the bonding operation can be resumed.

[0009] According to the above method, in the step of replacing a used capillary with a replacement capillary, it is determined whether the type of the replacement capillary is the same as the type of the reference capillary. Furthermore, according to the above method, in the step of performing preparations for resuming bonding after replacing the capillary, it is determined whether the wire is in a state in which the bonding operation can be resumed. As a result, the used capillary can be automatically replaced with the capillary to be used in the resumed bonding, and after the wire is automatically threaded through the capillary, it can be quickly restored to a state in which bonding is possible. Therefore, it is possible to reduce labor and shorten the capillary replacement work.

[0010] In the above-described capillary replacement method, the replacing step may include the steps of: acquiring shape information indicating the shape of the replacement capillary by observing the replacement capillary inserted into the horn with a camera; acquiring reference shape information indicating the shape of the reference capillary; and determining whether the type of the replacement capillary inserted into the horn is the same as the type of the reference capillary by comparing the shape information with the reference shape information. These steps enable accurate determination of whether the type of the replacement capillary is the same as the type of the reference capillary.

[0011] In the above-described capillary replacement method, the preparation step may include the steps of: measuring the protruding length of the wire protruding from the tip of the replacement capillary by observing the protruding portion of the wire with a camera; feeding the wire toward the tip of the replacement capillary if the protruding length is shorter than a lower limit; and retracting the wire into the replacement capillary if the protruding length is longer than an upper limit. This step allows the wire length to be set to a predetermined length when bonding using the replaced capillary is resumed.

[0012] In the above-described capillary replacement method, the preparation step may include a step of forming a ball at the tip of the wire protrusion, and a step of observing the ball formed at the tip of the wire protrusion with a camera to determine whether the ball satisfies the condition for resuming bonding operation. This step allows the shape of the wire tip to be a predetermined shape when bonding using the replaced capillary is resumed.

[0013] In the above capillary replacement method, the step of determining whether the ball satisfies the condition for resuming the bonding operation may include the steps of measuring the diameter of the ball formed at the tip of the wire protrusion by observing it with a camera, and determining whether the ball satisfies the condition for resuming the bonding operation based on the diameter. By using these steps, the diameter of the ball can be set to a predetermined value when bonding using the replacement capillary is resumed.

[0014] In the above-described capillary replacement method, the preparation step may include the steps of: acquiring the axial position of the replacement capillary by observing the replacement capillary inserted into the horn with a camera; and adjusting the position of the replacement capillary relative to the camera based on the acquired axial position of the replacement capillary. These steps enable the replacement capillary to be positioned in a predetermined position relative to the camera when bonding using the replacement capillary is resumed.

[0015] In the above-described capillary replacement method, the preparation step may include a step of adjusting operating conditions to correct variations in bonding operation results caused by individual differences in the replacement capillary. According to this step, the operating conditions in the resumed bonding are conditions corresponding to the replacement capillary, so that the resumed bonding can be performed accurately.

[0016] In the above-described capillary replacement method, the step of adjusting the operating conditions may include the steps of forming a ball at the tip of the wire protrusion, contacting the ball formed at the tip of the wire protrusion with a bonding target, applying ultrasonic vibrations to the ball while the ball is in contact with the target, measuring a change in load applied to the ball while the ultrasonic vibrations are being applied, and adjusting the ultrasonic vibration oscillation conditions when performing bonding using the replacement capillary so that the difference between the minimum load value and a set value in the load change approaches a reference value. By these steps, the ultrasonic vibration oscillation conditions when resuming bonding using the replacement capillary can be set to a predetermined value.

[0017] In the above capillary replacement method, the step of adjusting the operating conditions may include the steps of forming a ball at the tip of the wire protrusion, acquiring the height of the target of bonding using the replacement capillary by contacting the ball formed at the tip of the wire protrusion with the target of bonding, and adjusting the height at which bonding is performed on the target based on the acquired target height. These steps allow the height at which bonding is performed on the target when bonding using the replacement capillary is resumed to be a predetermined height.

[0018] In the above-described capillary replacement method, the replacing step may include a transport operation of moving the used capillary removed from the horn and the replacement capillary inserted into the horn along the axis of the used capillary attached to the horn, and a rotation operation of rotating the used capillary and the replacement capillary so that a replacement position for replacing the used capillary removed from the horn with the replacement capillary inserted into the horn is defined and a second orientation of the used capillary and the replacement capillary positioned at the replacement position is different from a first orientation of the used capillary attached to the horn. These steps allow the space required for the device to replace the used capillary with the replacement capillary to be compact.

[0019] In the above-described capillary replacement method, the replacing step may include a pull-out operation in which the used capillary, which is located at the replacement position and in the second position, is moved in a pull-out direction along the axis of the used capillary in the second position, and an insertion operation in which, after the pull-out operation, the replacement capillary is moved in an insertion direction opposite to the pull-out direction. These steps also make it possible to make the space required for the device to replace the used capillary with the replacement capillary compact.

[0020] In the above-described capillary replacement method, the replacing step may include a rotation step of rotating the used capillary located at the replacement position so that the used capillary assumes the second posture after a transport operation of moving the used capillary along the axis of the used capillary when attached to the horn has started and while the transport operation is continuing. These steps allow the used capillary to be replaced with a replacement capillary using a simple configuration.

[0021] In the above-described capillary replacement method, the replacement step may simultaneously start a transport operation for moving the replacement capillary along the axis of the used capillary when attached to the horn and a rotation operation for rotating the replacement capillary so that the replacement capillary in the second position assumes the first position. These steps allow the replacement capillary to be smoothly inserted into the horn.

[0022] In the above-described method for replacing a capillary, the axis of the used capillary in the second position may form an angle of 90 degrees with the axis of the used capillary in the first position. This arrangement also makes it possible to make compact the space required for the device for replacing the used capillary with a replacement capillary.

[0023] Another form of the present invention is a wire bonding apparatus comprising: a used capillary that is attached to a horn and into which a wire is inserted; a replacement unit that replaces the used capillary with a replacement capillary; and a control unit that controls the replacement unit. The control unit performs the following operations: pulling the tip of the wire into a capillary through-hole provided in the used capillary; replacing the used capillary with a replacement capillary; and performing preparations for resuming bonding using the replacement capillary. In the replacement operation, the control unit observes the replacement capillary inserted into the horn with a camera to determine whether the type of the replacement capillary inserted into the horn is the same as the type of a reference capillary, which is the capillary to be used in the resumed bonding. In the preparation operation, the control unit observes the wire protruding portion protruding from the tip of the replacement capillary with a camera to determine whether the wire is in a state in which the bonding operation can be resumed.

[0024] According to the above-described device, in the operation of replacing a used capillary with a replacement capillary, it is determined whether the type of the replacement capillary is the same as the type of the reference capillary. Furthermore, according to the above-described method, in the operation of performing preparations for resuming bonding after replacing the capillary, it is determined whether the wire is in a state in which the bonding operation can be resumed. As a result, the used capillary can be automatically replaced with the capillary to be used in the resumed bonding, and after the wire is automatically threaded through the capillary, it can be quickly restored to a state in which bonding is possible. Therefore, it is possible to reduce labor and shorten the capillary replacement operation.

[0025] According to the present invention, there are provided a method for replacing a capillary and a wire bonding apparatus that can reduce the number of workers and shorten the time required for capillary replacement.

[0026] FIG. 1 is a perspective view showing the configuration of a wire bonding apparatus according to an embodiment. FIG. 2 is a side view showing the configuration of a horn holder and an ultrasonic horn. FIG. 3 is an enlarged plan view showing the tip of the ultrasonic horn. FIGS. 4(a), 4(b), 4(c), and 4(d) are plan views illustrating the capillary removal operation. FIGS. 5(a), 5(b), 5(c), and 5(d) are diagrams illustrating the movement of the capillary during the bonding operation. FIGS. 6(a), 6(b), 6(c), 6(d), and 6(e) are diagrams illustrating the wire retraction operation performed by the wire bonding apparatus. FIGS. 7(a), 7(b), 7(c), 7(d), and 7(e) are diagrams illustrating the wire retraction operation performed by the wire bonding apparatus. FIG. 8 is a diagram illustrating the imaging operation performed by the wire bonding apparatus. FIG. 9 is a diagram schematically illustrating the configuration of a capillary replacement unit. 10(a), 10(b), 10(c), and 10(d) are diagrams for explaining a first transport operation performed by the capillary exchange unit. 11(a), 11(b), 11(c), and 11(d) are diagrams for explaining a second transport operation performed by the capillary exchange unit. 12(a) and 12(b) are diagrams for explaining a pulling operation performed by the capillary exchange unit. 13(a), 13(b), 13(c), and 13(d) are diagrams for explaining a replacement operation performed by the capillary exchange unit. 14 is a functional block diagram of a controller provided in the wire bonding apparatus of the embodiment. 15 is a flowchart showing main steps of a method for replacing a capillary according to the embodiment. 16 is a flowchart showing in detail steps for preparing for automatic capillary exchange in FIG. 15. 17(a) is a diagram showing an operation of moving a capillary onto a disposable bond stage. Fig. 17(b) is a diagram showing the operation of advancing the sub-base toward the capillary exchange unit, Fig. 17(c) is a diagram showing the operation of retracting the sub-base, and Fig. 18 is a flowchart showing in detail the steps of performing automatic capillary exchange in Fig. 15.19(a), 19(b), 19(c), and 19(d) are diagrams illustrating the steps of automatically replacing a capillary, from advancing the sub-base to moving the transport carriage to the replacement position. 20(a), 20(b), 20(c), and 20(d) are diagrams illustrating the steps of automatically replacing a capillary, from rotating the release pin to moving the replacement table in the insertion direction. 21(a), 21(b), 21(c), and 21(d) are diagrams illustrating the steps of automatically replacing a capillary, from lowering the transport carriage to a predetermined position to retracting the sub-base. 22 is a flowchart illustrating in detail an example of a step of determining the type of replacement capillary in FIG. 18. 23 is a diagram illustrating an example of an image of a replacement capillary. 24 is a flowchart illustrating in detail a step of preparing for bonding in FIG. 15. FIG. 25 is a flowchart showing in detail the process of adjusting the position of the replacement capillary in FIG. 24 . FIG. 26 is a diagram showing another example of an image of the replacement capillary. FIG. 27 is a flowchart showing in detail the process of determining the protrusion length in FIG. 24 . FIG. 28 is a flowchart showing in detail the process of adjusting the first operating condition in FIG. 24 . FIG. 29 is a diagram showing a schematic diagram of a change in load during bonding. FIG. 30 is a flowchart showing in detail the process of determining the shape of the ball in FIG. 24 . FIG. 31 is a flowchart showing in detail the process of adjusting the second operating condition in FIG. 24 . FIGS. 32( a) and 32(b) are diagrams for explaining the operation of acquiring the electrode height in the process of adjusting the second operating condition. FIGS. 33( a) and 33(b) are diagrams for explaining the operation of acquiring the electrode height in the process of adjusting the second operating condition. FIG. 34 is a flowchart showing in detail another example of the process of determining the type of the replacement capillary in FIG. 18 .

[0027] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same elements are designated by the same reference numerals, and duplicated explanations will be omitted.

[0028] 1 is a perspective view showing a wire bonding apparatus according to an embodiment of the present invention. The wire bonding apparatus 1 includes a wire bonding unit 2, a bonding stage 3, a camera unit 4, a capillary exchange unit 5, and a controller 6.

[0029] The wire bonding unit 2 bonds a bonding wire 12 (see FIG. 6 , etc.) to a target 11 on which bonding is to be performed. In this embodiment, the target includes a substrate 11a serving as a lead frame and a semiconductor chip 11b mounted on the substrate 11a. The bonding stage 3 sequentially moves the substrates 11a and the semiconductor chips 11b mounted on each of the substrates 11a, which are the targets of wire bonding, to the working area of ​​the wire bonding unit 2. A reference pin RP1 (see FIG. 23 , etc.) used to adjust the position of a capillary 243 (described later) is provided at the end of the bonding stage 3. The reference pin RP1 extends, for example, vertically from the upper surface of the bonding stage 3. The camera unit 4 captures images for controlling the operation of the wire bonding unit 2. The capillary replacement unit 5 replaces a used capillary that needs to be replaced after multiple wire bonding operations with a new replacement capillary. The controller 6 includes various control units that control the operation of each unit of the wire bonding apparatus 1 and perform various processes.

[0030] The wire bonding unit 2 has a main base 21, a tool XY stage 22, and a sub-base 23. The wire bonding unit 2 further has a bonding module 24, a Z-axis drive unit 25, a module base 26, a lower wire clamper 27, and an upper wire clamper 28.

[0031] The tool XY stage 22 is attached to the main base 21. The sub-base 23 is attached to a movable stage of the tool XY stage 22. The tool XY stage 22 moves the sub-base 23 in the X-axis direction and the Y-axis direction. A bonding module 24, a lower wire clamper 27, an upper wire clamper 28, and a camera unit 4 are attached to the sub-base 23. For example, when the sub-base 23 is moved in the X-axis direction by the tool XY stage 22, the bonding module 24, the lower wire clamper 27, the upper wire clamper 28, and the camera unit 4 also move integrally in the X-axis direction.

[0032] More specifically, the sub-base 23 includes a sub-base main surface 23a and a sub-base wall surface 23b. A Z-axis drive unit 25 is attached to the sub-base main surface 23a, and a module base 26 is attached to the Z-axis drive unit 25. A bonding module 24 and a lower wire clamper 27 are attached to the module base 26. Meanwhile, an upper wire clamper 28 and a camera unit 4 are attached to the sub-base wall surface 23b without intermediate members such as the Z-axis drive unit 25 and the module base 26. With this configuration, the bonding module 24 and the lower wire clamper 27 are reciprocated in the Z-axis direction by the Z-axis drive unit 25. More specifically, the tip of the bonding module 24 and the tip of the lower wire clamper 27 can perform reciprocating arc motion around the Z-axis drive unit 25. During this reciprocating arc motion, the relative position of the lower wire clamper 27 with respect to the bonding module 24 is maintained. On the other hand, the upper wire clamper 28 and the camera unit 4 are not reciprocated in the Z-axis direction by the Z-axis drive unit 25 .

[0033] In short, the bonding module 24 and the lower wire clamper 27 move in the X-axis direction, the Y-axis direction, and the Z-axis direction. In contrast, the upper wire clamper 28 and the camera unit 4 move in the X-axis direction and the Y-axis direction. In the example of this embodiment, the upper wire clamper 28 and the camera unit 4 do not move in the Z-axis direction. However, it is also possible to adopt a configuration in which the upper wire clamper 28 and the camera unit 4 are movable in the Z-axis direction.

[0034] <Bonding module 24> The bonding module 24 has a horn holder 241, an ultrasonic horn 242, a capillary 243, and a load sensor 244. The base end side of the horn holder 241 is attached to the Z-axis drive unit 25. The ultrasonic horn 242 is attached to the tip side of the horn holder 241. The capillary 243 is detachably attached to the tip side of the ultrasonic horn 242.

[0035] In this embodiment, as shown in FIG. 2 , the horn holder 241 has a base end 241a attached to the Z-axis drive unit 25, a tip end 241b to which the ultrasonic horn 242 is attached, and a connecting portion 241c connecting the base end 241a and the tip end 241b. The connecting portion 241c is flexible. The connecting portion 241c has a notch of a predetermined thickness formed in the upper surface of the horn holder 241, and a notch of a predetermined thickness formed in the lower surface of the horn holder 241. In other words, the connecting portion 241c is formed in a thin plate shape. Because the horn holder 241 is locally thin at the connecting portion 241c, the tip end 241b is configured to bend relative to the base end 241a.

[0036] 2, a recess 241d for attaching the ultrasonic vibrator 242a of the ultrasonic horn 242 is formed on the underside of the horn holder 241. The ultrasonic vibrations emitted from the ultrasonic vibrator 242a are applied to the ball 122 formed at the tip of the bonding wire 12 via the ultrasonic horn 242 and the capillary 243. The ultrasonic vibrator 242a may be, for example, a piezoelectric vibrator.

[0037] 3, a capillary mounting hole H1 and a pin insertion hole H2 are formed at the tip of the ultrasonic horn 242. The capillary mounting hole H1 and the pin insertion hole H2 pass through the ultrasonic horn 242 along the Z axis. In this embodiment, the capillary mounting hole H1 is provided closer to the tip of the ultrasonic horn 242 than the pin insertion hole H2. However, the pin insertion hole H2 may also be provided closer to the tip of the ultrasonic horn 242 than the capillary mounting hole H1.

[0038] The capillary attachment hole H1 and the pin insertion hole H2 are in communication with each other. In this embodiment, the capillary attachment hole H1 and the pin insertion hole H2 are in communication with each other via a slit S1. The slit S1 passes through the ultrasonic horn 242 in the Z-axis direction.

[0039] Furthermore, a slit S2 is formed in the ultrasonic horn 242. The slit S2 is in communication with the pin insertion hole H2. The slit S2 is formed closer to the base end of the ultrasonic horn 242 than the pin insertion hole H2. The slit S2 passes through the ultrasonic horn 242 in the Z-axis direction. In this way, the capillary mounting hole H1, the slit S1, the pin insertion hole H2, and the slit S2 are in communication with one another.

[0040] The capillary 243 is inserted into the capillary mounting hole H1. The ultrasonic horn 242 is made of an elastically deformable material. As shown in FIG. 4A, the capillary mounting hole H1 is smaller than the outer diameter of the capillary 243 when the capillary 243 is not inserted. The ultrasonic horn 242 can grip the capillary 243 inserted into the capillary mounting hole H1 by its elastic force, by expanding the capillary mounting hole H1. In other words, the capillary 243 is inserted into the capillary mounting hole H1 in a state where the capillary mounting hole H1 is expanded.

[0041] As shown in FIG. 4A , the pin insertion hole H2 is an elliptical hole. The release pin 511 of the release module 51 can be inserted into the pin insertion hole H2. The release pin 511 is inserted into the pin insertion hole H2 to release the grip of the capillary 243 by the ultrasonic horn 242. As shown in FIGS. 3 and 4A , the inner wall surface of the pin insertion hole H2 includes a first surface W1 and a second surface W2 that face each other. The first surface W1 and the second surface W2 face each other in the short direction of the elliptical pin insertion hole H2. The slit S1 and the slit S2 face each other in the long direction of the elliptical pin insertion hole H2. When the release pin 511 of the release module 51 is not inserted into the pin insertion hole H2, the length of the pin insertion hole H2 in the short direction is shorter than the length L1 of the release pin 511 in the first direction (longitudinal direction). The capillary attachment hole H1 communicates with the longitudinal end of the elliptical pin insertion hole H2 via a slit S1.

[0042] The capillary 243, which is a bonding tool, bonds the bonding wire 12 to the target 11. The capillary 243 has a capillary body 243a and a capillary taper 243b. The capillary body 243a is cylindrical and is held at the tip of the ultrasonic horn 242. The capillary taper 243b is conical and tapers toward the tip, and the tip of the capillary taper 243b is pressed against a pad or the like of the semiconductor chip 11b. The capillary 243 has a capillary through-hole 243h formed in it, which extends from the base end surface of the capillary body 243a to the tip surface of the capillary taper 243b. The bonding wire 12 is inserted through the capillary through-hole 243h.

[0043] The load sensor 244 is disposed between the base end side of the horn holder 241 to which the Z-axis drive unit 25 is attached and the tip end side of the horn holder 241 to which the ultrasonic horn 242 is attached. Specifically, the load sensor 244 is disposed so as to be sandwiched between the base end side and the tip end side of the horn holder 241. In the wire bonding apparatus 1, when a load acts on the tip end of the capillary 243 due to a reaction force from the target 11 of wire bonding, the tip end 241b bends relative to the base end 241a, and the load can be detected by the load sensor 244. The load sensor 244 may be, for example, a piezoelectric load sensor.

[0044] [Capillary Movement] The movement of the capillary 243 during the bonding operation will be described with reference to Figure 5. In this embodiment, the bonding operation will be described using an example in which an electrode 11b1 (first target) of the semiconductor chip 11b is connected to an electrode 11a1 (second target) of the substrate 11a. In the wire bonding apparatus 1, the bonding wire 12 is inserted into the capillary 243. The bonding operation is performed with a ball 122 formed at the tip of the bonding wire 12. The ball 122 has a diameter R1 that falls within a predetermined range.

[0045] In the bonding operation, first, the capillary 243 is moved to a first point P1 located above the electrode 11b1 of the semiconductor chip 11b (FIG. 5A). The first point P1 is located, for example, directly above a first bonding point P2, which is the position on the electrode 11b1 where the bonding wire 12 is bonded. Hereinafter, the height of the first point P1 may be referred to as height Z1. The movement to the first point P1 is performed by the tool XY stage 22.

[0046] Next, the capillary 243 is lowered from the first point P1 to the first bonding point P2, so that the ball 122 comes into contact with the electrode 11b1 (FIG. 5B). The lowering to the first bonding point P2 is performed by the Z-axis driving unit 25, and the speed at which the capillary 243 is lowered is controlled by the Z-axis driving unit 25. For example, the speed at which the capillary 243 is lowered may be changed or constant during the descent.

[0047] Next, the capillary 243 is raised to a first point P1. The raising to the first point P1 is performed by the Z-axis driver 25, similar to the lowering to the first bonding point P2. Next, the capillary 243 is moved from the first point P1 to a second point P3 located above the electrode 11a1 of the substrate 11a (FIG. 5C). The second point P3 is located, for example, directly above the second bonding point P4, where the bonding wire 12 is bonded to the electrode 11a1. As shown in FIG. 5C, the first point P1 and the second point P3 are located, for example, at the same height. That is, the height of the second point P3 is height Z1. The movement to the second point P3 is performed by the tool XY stage 22, similar to the movement to the first point P1.

[0048] Next, the capillary 243 is lowered from the second point P3 to the second bonding point P4, bringing the ball 122 into contact with the electrode 11a1 (FIG. 5(d)). The lowering to the second bonding point P4 is performed by the Z-axis driver 25, similar to the lowering to the first bonding point P2. Next, the capillary 243 is raised to the second point P3. The raising to the second point P3 is also performed by the Z-axis driver 25, similar to the lowering to the second bonding point P4. By repeatedly performing the above-described operations, bonding is performed on the substrate 11a and the semiconductor chip 11b that have been moved sequentially into the working area of ​​the wire bonding unit 2.

[0049] <Lower Wire Clamp 27 and Upper Wire Clamp 28> The lower wire clamper 27 and the upper wire clamper 28 can be switched between a state in which they grip the bonding wire 12 and a state in which they do not grip the bonding wire 12. As described above, the lower wire clamper 27 is movable along the Z-axis direction. Therefore, with respect to the upper wire clamper 28, whose position along the Z-axis direction is fixed, the position of the lower wire clamper 27 can be switched between a position close to the upper wire clamper 28 (close position 2N) and a position far from the upper wire clamper 28 (far position 2F). By switching between the gripping state and the release state and between the close position 2N and the far position 2F, the lower wire clamper 27 and the upper wire clamper 28 can perform an operation of drawing the bonding wire 12 from the capillary through-hole 243h (drawing operation) and an operation of feeding the bonding wire 12 into the capillary through-hole 243h (feeding operation).

[0050] [Pull-in Operation] The pull-in operation will be described with reference to FIG. 6. First, the lower wire clamper 27 located at the approach position 2N is opened, and the upper wire clamper 28 is closed (FIG. 6(a)). Next, the open lower wire clamper 27 and the capillary 243 are moved downward toward the separated position 2F (FIG. 6(b)). At this time, the bonding wire 12 is held by the upper wire clamper 28 and does not move. The downward movement of the capillary 243 relative to the stationary bonding wire 12 means that, from the perspective of the bonding wire 12, the bonding wire 12 moves upward relative to the capillary 243. In other words, the bonding wire 12 is pulled into the capillary 243. Next, the lower wire clamper 27 located at the separated position 2F is closed, and the upper wire clamper 28 is opened (FIG. 6(c)). Next, the closed lower wire clamper 27 and the capillary 243 are moved upward toward the approach position 2N (FIG. 6(d)). At this time, since the bonding wire 12 is held by the lower wire clamper 27, the bonding wire 12 also moves upward as the lower wire clamper 27 moves. As a result, comparing the state of FIG. 6(a) with the state of FIG. 6(b), the position of the capillary 243 is the same, but the tip of the bonding wire 12 has moved upward. In other words, the bonding wire 12 is being drawn into the capillary 243. The operations of FIG. 6(a) to FIG. 6(d) are repeated until a predetermined drawn-in length is reached. The drawn-in length is the distance D1 from the tip of the bonding wire 12 located inside the capillary through-hole 243h to the tip of the capillary 243, as shown in FIG. 6(e).

[0051] [Feed-Out Operation] The feed-out operation will be described with reference to FIG. 7 . First, the lower wire clamper 27 located at the approach position 2N is closed, and the upper wire clamper 28 is opened ( FIG. 7( a)). Next, the closed lower wire clamper 27 and the capillary 243 are moved downward toward the separated position 2F ( FIG. 7( b)). At this time, the bonding wire 12 is held by the lower wire clamper 27, so the bonding wire 12 also moves as the lower wire clamper 27 moves downward. Next, the lower wire clamper 27 located at the separated position 2F is opened, and the upper wire clamper 28 is closed ( FIG. 7( c)). Next, the opened lower wire clamper 27 and the capillary 243 are moved upward toward the approach position 2N ( FIG. 7( d)). At this time, the bonding wire 12 is not held by the lower wire clamper 27. The bonding wire 12 does not move as the lower wire clamper 27 moves upward. The upward movement of the capillary 243 relative to the immovable bonding wire 12 means that, from the perspective of the bonding wire 12, the bonding wire 12 moves downward relative to the capillary 243. In other words, the bonding wire 12 is fed out to the capillary 243. As a result, when the state of FIG. 7( a) is compared with the state of FIG. 7(d), the position of the capillary 243 is the same, but the tip of the bonding wire 12 has moved downward. In other words, the bonding wire 12 is fed out to the capillary 243. The operations of FIG. 7(a) to FIG. 7(d) are repeated until a predetermined extension length D2 is reached. The extension length D2 is the distance from the tip of the capillary 243 to the tip of the bonding wire 12, as shown in FIG. 7(e).

[0052] <Camera Unit> The camera unit 4 captures an image of the target 11 (substrate 11a and semiconductor chip 11b). The captured image of the target 11 is used to position the capillary 243 when wire bonding is performed on the target 11. In this way, the camera unit 4 functions as a wire bonding camera unit used to perform wire bonding.

[0053] The camera unit 4 is also used for automatic replacement of the capillary 243 by the capillary replacement unit 5. For example, the camera unit 4 is used for positioning the release pin portion 511 (described later) when switching the ultrasonic horn 242 from a locked state to a released state. The camera unit 4 is used for determining the type of the capillary 243. The camera unit 4 is used for adjusting the position of the capillary 243. The camera unit 4 is used for determining whether the state of the bonding wire 12 protruding from the tip of the capillary 243 is such that bonding can be resumed. The camera unit 4 is used for determining whether the shape of the ball 122 formed at the tip of the bonding wire 12 is such that bonding can be resumed.

[0054] The camera unit 4 has a camera 41 having an imaging element, a camera arm 42 that supports the camera 41, the tool XY stage 22, and a camera control unit 67. The base end of the camera arm 42 is attached to the tool XY stage 22. The camera 41 is attached to the tip end of the camera arm 42. The camera arm 42 supports the camera 41 at a position above the bonding stage 3.

[0055] The camera unit 4 may acquire elevation images of each part by combining optical path changing means such as a mirror or a prism. For example, as shown in FIG. 8 , a case where the periphery of the tip of the capillary 243 is imaged is illustrated. The capillary 243 protrudes from the underside of the ultrasonic horn 242. Therefore, if the camera 41 is located directly above the ultrasonic horn 242, it will not be able to image the periphery of the tip of the capillary 243. Therefore, the camera 41 is positioned so as not to overlap with the ultrasonic horn 242. As shown in FIG. 8 , when the camera 41 and the capillary 243 are viewed from the front, an arrangement in which the axis of the capillary 243 and the optical axis of the camera 41 are offset is sometimes referred to as an offset arrangement. An optical component 43, such as a prism or mirror, that changes the direction of light is located directly below the camera 41. With such an optical system, the periphery of the tip of the capillary 243 can be imaged using the offset-positioned camera 41. Note that a light source component 44, such as a laser diode, may be provided as needed. In this case, the capillary 243 is disposed between the optical component 43 and the light source component 44 .

[0056] The camera 41 and the camera arm 42 are attached to the tool XY stage 22 via the sub-base 23. That is, the camera 41 and the camera arm 42 are driven by the tool XY stage 22, and are capable of translation along the XY plane together with the capillary 243 and the like. In this way, the tool XY stage 22 functions as a part of the components of the wire bonding unit 2, and also functions as a part of the components of the camera unit 4. The camera control unit 67 controls various operations of the camera unit 4 and executes various processes. Details of the control performed by the camera control unit 67 will be described later.

[0057] <Capillary Replacement Unit> The capillary replacement unit 5 collects a used capillary 243E attached to the ultrasonic horn 242 and attaches a new replacement capillary 243T to the ultrasonic horn 242. In other words, the capillary 243 replacement operation includes the operation of collecting the capillary 243 and the operation of attaching the capillary 243. This capillary 243 replacement operation is automatically performed when a preset condition is met. For example, the condition may be the number of bonding operations. In other words, the capillary 243 replacement operation may be performed every time a predetermined number of bonding operations are performed.

[0058] 9 is a conceptual diagram showing the components constituting the capillary replacement unit 5. The capillary replacement unit 5 has a release module 51, a transport module 52, a replacement module 53, and a supply module 54. The release module 51, the transport module 52, and the replacement module 53 are housed in a replacement unit main body 50 so as to be an integrated device. The replacement unit main body 50 has a module slot 50a into which the supply module 54 is inserted.

[0059] <Release Module> The release module 51 has a release pin portion 511 , a release shaft 512 , and a release drive portion 513 .

[0060] The release module 51 switches the state in which the capillary 243 is constrained by the ultrasonic horn 242 to the state in which the capillary 243 is released from the ultrasonic horn 242 (release operation). Furthermore, the release module 51 switches the state in which the capillary 243 is released from the ultrasonic horn 242 to the state in which the capillary 243 is constrained by the ultrasonic horn 242 (lock operation).

[0061] When the capillary 243 is constrained by the ultrasonic horn 242, the capillary 243 cannot be removed from the ultrasonic horn 242. When the capillary 243 is released from the ultrasonic horn 242, the capillary 243 can be removed from the ultrasonic horn 242. Furthermore, when the capillary 243 is released from the ultrasonic horn 242, the capillary 243 can be attached to the ultrasonic horn 242.

[0062] [Release Operation] Next, a description will be given of a grip release operation for releasing the grip of the capillary 243 by the ultrasonic horn 242. This grip release operation is performed by the release module 51. As shown in Fig. 4(a), the ultrasonic horn 242 grips the capillary 243 inserted into the capillary attachment hole H1 by elastic force. When this grip is to be released, the release pin portion 511 of the release module 51 is inserted into the pin insertion hole H2 of the ultrasonic horn 242. The insertion operation of the release module 51 into the pin insertion hole H2 is performed by the release drive unit 513.

[0063] As shown in FIG. 4B , with the release pin 511 inserted into the pin insertion hole H2, the release pin 511 is rotated 90 degrees around the Z axis. This causes both ends of the release pin 511 in the first direction (both ends in the longitudinal direction of the elliptical shape) to press against the first surface W1 and the second surface W2. Pressing the first surface W1 and the second surface W2 by the release pin 511 elastically deforms the ultrasonic horn 242. This widens the gap between the first surface W1 and the second surface W2 of the pin insertion hole H2. The rotation of the release module 51 is performed by the release drive unit 513.

[0064] Here, the pin insertion hole H2 and the capillary attachment hole H1 communicate with each other via the slit S1. Therefore, as the release pin 511 widens the gap between the first surface W1 and the second surface W2, the capillary attachment hole H1 is also widened. Widening the capillary attachment hole H1 releases the grip of the capillary 243 by the ultrasonic horn 242. That is, the grip release operation is an operation of rotating the release module 51 with the release pin 511 inserted into the pin insertion hole H2. The grip release operation is an operation of pressing the first surface W1 and the second surface W2 with both ends of the release pin 511 in the first direction (both ends in the longitudinal direction of the elliptical shape), thereby widening the gap between the first surface W1 and the second surface W2 and widening the capillary attachment hole H1. In this way, the release module 51 widens the pin insertion hole H2 and the capillary attachment hole H1, thereby releasing the grip of the capillary 243 by the ultrasonic horn 242.

[0065] As shown in FIG. 4( b), with the capillary mounting hole H1 being expanded by the release module 51, the capillary 243 is removed from the ultrasonic horn 242, and a new capillary 243 is inserted into the capillary mounting hole H1. This replacement of the capillary 243 is performed by the capillary replacement unit 5. Then, as shown in FIG. 4( c), the release pin 511 is rotated 90 degrees around the Z axis to release the pressure applied by the release pin 511 to the first surface W1 and the second surface W2. In other words, the gripping release operation is released. This causes the pin insertion hole H2 and the capillary mounting hole H1 to return to their original shapes shown in FIG. 4( a). Due to the elastic force of the capillary 243 attempting to return to its original shape, the capillary 243 inserted into the capillary mounting hole H1 is gripped by the inner wall surface of the capillary mounting hole H1.

[0066] 4D, the release pin 511 is removed from the pin insertion hole H2. In this manner, the ultrasonic horn 242 can grip and release the capillary 243 using the release module 51.

[0067] <Transport Module> Referring again to Fig. 9, the transport module 52 includes a transport carriage 521, a transport linear shaft 522, and a transport driver 523. The transport module 52 further includes a transport carousel 524 and a transport rotary pinion 525.

[0068] The transport module 52 pulls out the used capillary 243E from the ultrasonic horn 242 at the exchange position 52S. Furthermore, the transport module 52 transports the pulled out used capillary 243E from the exchange position 52S to the replacement position 52E.

[0069] The transport module 52 receives the replacement capillary 243T at the replacement position 52E from the replacement module 53. The transport module 52 transports the replacement capillary 243T from the replacement position 52E to the replacement position 52S. The transport module 52 inserts the replacement capillary 243T into the ultrasonic horn 242 at the replacement position 52S.

[0070] Thus, the movement of the transport carriage 521 includes linear movement between the replacement position 52S and the exchange position 52E and rotational movement that changes the attitude of the used capillary 243E. In this embodiment, the entire period of rotational movement overlaps with a portion of the period of linear movement. In other words, the period of linear movement includes a period of linear movement only and a period in which linear movement and rotational movement occur in parallel.

[0071] [First Transport Operation] Here, the case where the used capillary 243E is transported from the exchange position 52S to the replacement position 52E is referred to as the first transport operation. In the first transport operation, first, a linear movement downward is started, and only linear movement is performed until the transport carriage 521 reaches the transport carousel 524.

[0072] The linear movement is performed by a conveying linear shaft 522 and a conveying driver 523. The conveying carriage 521 and the conveying linear shaft 522 constitute a so-called feed screw mechanism. When the conveying driver 523 rotates the conveying linear shaft 522, the conveying carriage 521 mounted on the conveying linear shaft 522, which is a screw shaft, moves linearly. The movement direction of the conveying carriage 521 is determined by the rotation direction of the conveying linear shaft 522.

[0073] After the transport carriage 521 reaches the transport carousel 524, linear movement and clockwise rotational movement are carried out in parallel.

[0074] More specifically, a transport carousel 524 is provided at the lower end of the transport linear shaft 522. As shown in FIG. 10( a), when the transport carriage 521 at the replacement position 52S approaches the lower end of the transport linear shaft 522, the transport rotation pinion 525 provided on the transport carriage 521 engages with the transport carousel 524 as shown in FIG. 10( b). As a result, the transport carriage 521 rotates in a predetermined direction as the transport carriage 521 moves (see FIG. 10( c)). For example, as shown in FIG. 10( d), the transport carriage 521 rotates 90 degrees clockwise. As a result, the posture of the used capillary 243E that has moved to the replacement position 52E is different from the posture of the used capillary 243E at the replacement position 52S. The posture of the used capillary 243E here may be defined as the angle of the axis A1 of the used capillary 243E based on the Z-axis direction. For example, the orientation of the used capillary 243E at the replacement position 52S is such that the angle with respect to the Z-axis direction is 0 degrees. For example, the orientation of the used capillary 243E at the replacement position 52E is such that the angle with respect to the Z-axis direction is 90 degrees.

[0075] Note that if a definition of direction is added to the axis A1 of the used capillary 243E, the posture of the used capillary 243E can be defined in more detail. For example, the direction from the base end to the tip end of the used capillary 243E is defined as positive. In this case, too, the posture of the used capillary 243E at the replacement position 52S is at an angle of 0 degrees with respect to the Z-axis direction. For example, if the rotation of the transport carriage 521 causes the tip end of the used capillary 243E to be on the upper side and the base end to be on the lower side, the posture of the used capillary 243E at the replacement position 52S can be said to be at an angle of 180 degrees with respect to the Z-axis direction.

[0076] [Second Transport Operation] Next, the case where the replacement capillary 243T is transported from the replacement position 52E to the replacement position 52S is referred to as the second transport operation. As shown in Figures 11(a) and 11(b), in the second transport operation, upward linear movement is started and counterclockwise rotational movement is simultaneously performed. While the transport carriage 521 is engaged with the transport carousel 524, the linear movement and rotational movement are performed in parallel. Then, as shown in Figures 11(c) and 11(d), after the transport carriage 521 is no longer engaged with the transport carousel 524, only upward linear movement is performed.

[0077] <Replacement Module> The replacement module 53 has a replacement table 531 , a replacement drive unit 532 , a replacement linear motion shaft 533 , a replacement shaft 534 , a replacement operating piece 535 , and a replacement fixed piece 536 .

[0078] [Pull-out Operation] The replacement module 53 pulls out the used capillary 243E transported to the replacement position 52E from the transport carriage 521. More specifically, the replacement table 531 and the replacement movable piece 535 move together away from the replacement fixed piece 536 due to the operation of the replacement drive unit 532 and the replacement linear motion shaft 533 (see FIG. 12B). Since the replacement movable piece 535 is hooked on the capillary taper portion 243b of the capillary 243, when the replacement movable piece 535 moves in a direction away from the replacement fixed piece 536, the capillary 243 also moves in a direction away from the replacement fixed piece 536 in accordance with the movement of the replacement movable piece 535. As a result, the capillary 243 is pulled out from the transport carriage 521.

[0079] [Replacement Operation] Furthermore, the replacement module 53 inserts the replacement capillary 243T into the transport carriage 521 from which the used capillary 243E has been pulled out. More specifically, the replacement table 531 and the replacement operating piece 535 move together toward the replacement fixed piece 536 through the operation of the replacement drive unit 532 and the replacement linear motion shaft 533. This operation of the replacement table 531 and the replacement operating piece 535 moving toward the replacement fixed piece 536 includes several steps, which will be described below.

[0080] In the first stage (see FIG. 13(a)), as the replacement table 531 moves, the upright portion 531a of the replacement table 531 approaches the replacement fixed piece 536 while pressing against the base end surface of the replacement capillary 243T located at the capillary supply port 54b. As a result, the replacement capillary 243T falls from the capillary supply port 54b onto the replacement table 531 (see FIG. 13(b)). In the second stage, as the replacement table 531 moves, the replacement operating piece 535 comes into contact with the replacement fixed piece 536 (see FIG. 13(c)). In the third stage, as the replacement table 531 moves, the replacement table 531 moves even closer to the replacement fixed piece 536. In this third stage, the replacement operating piece 535 abuts against the replacement fixed piece 536, so the replacement operating piece 535 does not move. Therefore, in the third stage, the replacement table 531 carrying the replacement capillary 243T approaches the replacement operating piece 535 that abuts against the replacement fixed piece 536. In other words, in the third stage, the distance from the replacement table 531 carrying the replacement capillary 243T to the replacement operating piece 535 that abuts against the replacement fixed piece 536 gradually decreases. In the fourth stage (see FIG. 13D), as the replacement table 531 moves, the capillary taper portion 243b of the replacement capillary 243T carried on the replacement table 531 passes through the replacement operating piece 535 and the replacement fixed piece 536 and is inserted into the transport carriage 521.

[0081] <Supply Module> The supply module 54 has a capillary receiving portion 54a and a capillary supply port 54b.

[0082] As described above, the supply module 54 is inserted into the module slot 50a of the replacement unit main body 50. The supply module 54 can be removed from the module slot 50a as needed. The supply module 54 accommodates a plurality of replacement capillaries 243T in the capillary accommodation section 54a. The supply module 54 supplies replacement capillaries 243T one by one from the capillary supply port 54b to the replacement module 53 in accordance with the operation of the replacement module 53.

[0083] <Controller> The controller 6 controls the operations of the wire bonding unit 2 and the capillary replacement unit 5. The controller 6 is a computer having a processor that executes various programs and a memory that stores the programs and desired databases. The controller 6 receives information provided by various sensors provided in the wire bonding apparatus 1. Then, the controller 6 uses the received information to output control signals for controlling the operations of the wire bonding unit 2 and the capillary replacement unit 5.

[0084] The controller 6 executes the capillary replacement program to perform the functions of several functional components shown in FIG. 14 . Specifically, the controller 6 includes a bonding control unit 61, a clamper control unit 62, an oscillation control unit 63, a release control unit 64, a transport control unit 65, and a replacement control unit 66. The bonding control unit 61 processes the load acquired from the load sensor 244. The bonding control unit 61 outputs a control signal G61a to the Z-axis drive unit 25 and a control signal G61b to the tool XY stage 22. The clamper control unit 62 outputs a control signal G62a to the lower wire clamper 27 and a control signal G62b to the upper wire clamper 28. The oscillation control unit 63 outputs a control signal G63 to the ultrasonic vibrator 242a. The release control unit 64 outputs a control signal G64 to the release drive unit 513 of the capillary replacement unit 5. The transport control unit 65 outputs a control signal G65 to the transport drive unit 523 of the capillary replacement unit 5. The replacement control unit 66 outputs a control signal G66 to the replacement drive unit 532 of the capillary replacement unit 5.

[0085] The controller 6 has, as functional components, a camera control unit 67 and a detection sensor control unit 68. The camera control unit 67 processes the planar images and elevation images acquired by the camera 41. As a result, the position of each part in the X, Y, and Z directions is detected.

[0086] The detection sensor control unit 68 receives detection data from a plurality of detection sensors 50S provided in the capillary replacement unit 5. For example, the detection sensor 50S confirms that the used capillary 243E and the replacement capillary 243T, which are sequentially transported inside the capillary replacement unit 5, are present at predetermined positions. After confirming that the used capillary 243E and the replacement capillary 243T are present at the predetermined positions, the controller 6 proceeds to the next operation.

[0087] <Method for Replacing a Capillary> The method for replacing a capillary, which will be described below, is executed by the functional components of the controller 6 shown in Fig. 14. In the following, the manner in which the method for replacing a capillary is executed by the controller 6 will be described in detail. The flowchart in Fig. 15 shows the main steps of the method for replacing a capillary. The three main steps constituting the method for replacing a capillary are shown in detail in Figs. 16, 18, and 24, respectively.

[0088] <Preparation for Capillary Replacement> First, the controller 6 determines whether the conditions for capillary replacement are met (S1). When the controller 6 determines that the conditions for capillary replacement are not met (S1: NO), it resumes bonding without replacing the capillary 243 in use (S5). When the controller 6 determines that the conditions for capillary replacement are met (S1: YES), it proceeds to the operation of replacing the used capillary 243E (S2, S3, S4).

[0089] The controller 6 prepares for capillary replacement (S2). More specifically, as shown in Fig. 16, the controller 6 first ends bonding (S21). The controller 6 outputs a control signal G61a to the Z-axis driver 25 to stop the arc reciprocating motion of the bonding module 24.

[0090] Next, the controller 6 forms a straight tail (S22). A straight tail is a portion of the bonding wire 12 that protrudes from the tip of the capillary 243 and does not have a ball 122 (see FIG. 7D) formed at its tip. If a ball 122 is formed, the tip of the bonding wire 12 cannot be drawn into the capillary through-hole 243h. However, with a straight tail, the tip of the bonding wire 12 can be drawn into the capillary through-hole 243h. In other words, forming a straight tail means removing the ball 122, and the operation of removing the ball 122 is called a so-called throw-away bond operation.

[0091] First, the controller 6 moves the capillary 243 above the sacrificial bond stage 15 ( FIG. 17A , S221). Next, the controller 6 opens the upper wire clamper 28 and lowers the capillary 243 together with the open lower wire clamper 27. As a result, the ball 122 is bonded to the sacrificial bond stage 15. Next, the controller 6 closes the upper wire clamper 28 and raises the capillary 243 together with the open lower wire clamper 27. Next, the controller 6 opens the upper wire clamper 28 and closes the lower wire clamper 27. Then, the controller 6 raises the capillary 243 together with the closed lower wire clamper 27. As a result, the bonding wire 12 is cut at a location where its strength is relatively reduced. For example, since the strength of the neck portion where the ball 122 and the bonding wire 12 are connected is likely to be reduced by bonding, the bonding wire 12 is cut at this location.

[0092] Then, the controller 6 draws the tip of the bonding wire 12 into the used capillary 243E (S23). This step S23 is the "drawing operation" described above with reference to FIG.

[0093] 18, the controller 6 advances the sub-base 23 toward the capillary exchange unit 5 (S301, see FIGS. 17(b) and 19(a)). This action moves the capillary 243 from above the temporary bond stage 15 onto the capillary exchange unit 5. Next, the controller 6 lowers the ultrasonic horn 242 to insert the used capillary 243E into the capillary guide portion 55 (S302, see FIG. 19(b)).

[0094] Next, the controller 6 inserts the release pin portion 511 into the pin insertion hole H2 (S303, see FIG. 19(c)). In this operation, the release pin portion 511 is simply inserted into the pin insertion hole H2, and a release operation by rotating the release pin portion 511 is not performed. Therefore, in this operation, the capillary 243 is constrained by the ultrasonic horn 242. Next, the controller 6 moves the transport carriage 521 upward (S304, see FIG. 19(d)). As a result, the capillary 243 is inserted into the transport carriage 521. Once the capillary 243 is inserted, the transport carriage 521 holds the capillary 243. Next, the controller 6 rotates the release pin portion 511 forward (S305, see FIG. 20(a)). This step S305 is the "release operation" described above with reference to FIG. 4. As a result, the capillary 243 is released from the state of being restrained by the ultrasonic horn 242 (release state).

[0095] Next, the controller 6 moves the transport carriage 521 from the exchange position 52S to the replacement position 52E (S306, see FIG. 20(b)). This step S306 is the "first transport operation" described above with reference to FIG. 10. As a result of this step S306, the used capillary 243E moves from the exchange position 52S to the replacement position 52E, and the posture of the used capillary 243E becomes a first posture at an angle of 0 degrees with respect to the Z axis, and a second posture at an angle of 90 degrees with respect to the Z axis.

[0096] Next, the controller 6 moves the replacement table 531 in the pull-out direction (S307, see FIG. 20(c)). This step S307 is the "pull-out operation" described above with reference to FIG. 12. Next, the controller 6 moves the replacement table 531 in the insert-in direction (S308, see FIG. 20(d)). This step S308 is the "replacement operation" described above with reference to FIG. 12. As a result of the pull-out operation (S307) and the replacement operation (S308), the used capillary 243E held by the transport carriage 521 at the second position is replaced with the replacement capillary 243T.

[0097] Next, the controller 6 moves the transport carriage 521 from the replacement position 52E to the replacement position 52S (S309, see FIG. 21(a)). This step S309 is the "second transport operation" described above with reference to FIG. 11. As a result of this step S309, the replacement capillary 243T moves from the replacement position 52E to the replacement position 52S, and the posture of the replacement capillary 243T changes from the second posture at an angle of 90 degrees with respect to the Z axis to the first posture at an angle of 0 degrees with respect to the Z axis. The rising replacement capillary 243T is guided by the capillary guide unit 55 to the capillary through-hole 243h of the ultrasonic horn 242. Since the used capillary 243E is withdrawn from the ultrasonic horn 242 while being in contact with the capillary guide 55, it can be said that the position of the used capillary 243E is preserved by the capillary guide 55. Therefore, the replacement capillary 243T, which is guided by the capillary guide 55 that preserves the position of the used capillary 243E, can be accurately inserted into the position of the used capillary 243E. Similarly, when the used capillary 243E is withdrawn, the bonding wire 12 is not affected in any way. Therefore, the tip of the bonding wire 12 is guided into the capillary through-hole 243h of the replacement capillary 243T, which is inserted so as to be in the same position as the used capillary 243E.

[0098] Next, the controller 6 reversely rotates the release pin portion 511 (S310, see FIG. 21(b)). This reverse rotation switches the ultrasonic horn 242 from the release state to the lock state. As a result, the replacement capillary 243T is fixed to the ultrasonic horn 242. Next, the controller 6 lowers the transport carriage 521 to a predetermined position (S311, see FIG. 21(c)). Then, the controller 6 pulls out the release pin portion 511 from the pin insertion hole H2 (S312, see FIG. 21(c)). Next, the controller 6 raises the ultrasonic horn 242 to pull out the replacement capillary 243T from the capillary guide portion 55 (S313, see FIG. 21(d)). Then, the controller 6 retracts the sub-base 23 (S314, see FIG. 17(c)).

[0099] Next, the controller 6 determines the type of the automatically replaced replacement capillary 243T (S315). Specifically, the controller 6 determines whether the type of the replacement capillary 243T inserted into the ultrasonic horn 242 is the same as the type of the reference capillary, which is the capillary to be used in the resumed bonding. In this embodiment, the controller 6 determines whether the type of the replacement capillary 243T is the same as the type of the reference capillary by comparing the shape information of the replacement capillary 243T with the reference shape information of the reference capillary. The shape information is information that indicates the shape of the replacement capillary 243T, and the reference shape information is information that indicates the shape of the reference capillary.

[0100] More specifically, as shown in FIG. 22 , first, the controller 6 irradiates the replacement capillary 243T with light (S3151). When irradiating the replacement capillary 243T with light, the light source component 44 irradiates the replacement capillary 243T with light. For example, the light source component 44 may irradiate the replacement capillary 243T with light toward the camera 41 from behind the replacement capillary 243T. In other words, the replacement capillary 243T may be imaged in a backlit state. With this arrangement, the replacement capillary 243T appears in the image as a shadow, making it easy to extract the outer shape of the replacement capillary 243T in subsequent image processing. Next, the controller 6 acquires an image IG1 of the replacement capillary 243T (S3152). The image IG1 is captured by the camera 41 and the optical component 43 with the replacement capillary 243T irradiated with light from the light source component 44. For example, image IG1 is captured with the replacement capillary 243T positioned above the reference pin RP1. Image IG1 is an image including the tip portion 243Ta of the replacement capillary 243T and the reference pin RP1, as shown in Fig. 23 . The tip portion 243Ta includes, for example, a portion extending from the tip of the replacement capillary 243T to a predetermined length. Therefore, the tip portion 243Ta has a predetermined length in the Z-axis direction.

[0101] Next, the controller 6 analyzes the acquired image IG1 to acquire the diameter R2 of the replacement capillary 243T (S3153). As shown in FIG. 23 , the diameter R2 is the length of the tip portion 243Ta in the X-axis direction. The diameter R2 may also be the length of the tip portion 243Ta in the Y-axis direction. In this embodiment, the controller 6 acquires the diameter R2 at multiple positions on the tip portion 243Ta and acquires the average value of the acquired multiple diameters R2 as the shape information of the replacement capillary 243T. The controller 6 may also acquire the diameter R2 at a predetermined position on the tip portion 243Ta and acquire the acquired diameter R2 as the shape information of the replacement capillary 243T.

[0102] Next, the controller 6 acquires the diameter of the reference capillary (S3154). That is, in this embodiment, the controller 6 acquires the diameter of the reference capillary as reference shape information of the reference capillary. For example, the controller 6 may accept the diameter of the reference capillary input by the user, may receive the diameter of the reference capillary sent from another computer, or may read the diameter of the reference capillary pre-stored in memory. As with the diameter R2 of the replacement capillary 243T, in this embodiment, the reference shape information is the average value of multiple diameters acquired at multiple positions on the tip portion of the reference capillary. The reference shape information may also be the diameter acquired at a predetermined position on the tip portion of the reference capillary.

[0103] Next, the controller 6 calculates the difference between the average value of the diameter R2 of the replacement capillary and the average value of the diameter of the replacement capillary 243T (S3155). In other words, in this embodiment, the controller 6 calculates this difference by comparing the shape information of the replacement capillary 243T with the reference shape information of the reference capillary. Next, the controller 6 determines whether the calculated difference is within a predetermined range (S3156). In other words, the controller 6 compares the shape information of the replacement capillary 243T with the reference shape information of the reference capillary to determine whether the type of the replacement capillary 243T is the same as the type of the reference capillary. In this embodiment, the controller 6 also determines whether the type of the replacement capillary 243T is the same as the type of the reference capillary based on the calculated difference. If the calculated difference is not within the predetermined range (S3156: NO), the controller 6 outputs information indicating that the type of the replacement capillary 243T is different from the type of the reference capillary (S3157). If the calculated difference is within a predetermined range (S3156: YES), the controller 6 determines that the type of the replacement capillary 243T and the type of the reference capillary are the same, thereby completing the automatic capillary replacement.

[0104] <Preparation for Bonding: S4> Then, the controller 6 performs the preparation for bonding shown in Fig. 24 (S4). The flowchart in Fig. 24 shows the main steps performed in the preparation for bonding. The main steps performed in the preparation for bonding are described in detail in Figs. 25, 27, 28, 30, and 31, respectively.

[0105] First, the controller 6 resets the apparatus status of the wire bonding apparatus 1 after automatically replacing the capillary (S41). The apparatus status includes various information about bonding using the used capillary 243E, such as the capillary count and the height at which bonding is performed on the target 11. The capillary count is the number of times the capillary 243 has been used and is incremented by "1" each time bonding is performed. The height at which bonding is performed on the target 11 is also referred to as the bond level. As described above, in this embodiment, the target 11 includes the substrate 11a and the semiconductor chip 11b. Therefore, in this embodiment, the bond level includes the height at which bonding is performed on the substrate 11a and the height at which bonding is performed on the semiconductor chip 11b.

[0106] Next, the controller 6 adjusts the position of the replacement capillary 243T. More specifically, as shown in FIG. 25 , first, the controller 6 irradiates the replacement capillary 243T and the reference pin RP1 with light (S421). When irradiating the replacement capillary 243T and the reference pin RP1 with light, the light source component 44 irradiates the replacement capillary 243T and the reference pin RP1 with light. Next, the controller 6 acquires an image IG2 capturing the replacement capillary 243T and the reference pin RP1 (S422). The image IG2 is captured by the camera 41 and the optical component 43 with the light from the light source component 44 irradiating the replacement capillary 243T and the reference pin RP1. As shown in FIG. 26 , the image IG2 is an image including the tip portion 243Ta of the replacement capillary 243T and the reference pin RP1. The image IG1 and the image IG2 may be the same image. That is, the controller 6 may acquire the image IG1 used when determining the type of the replacement capillary 243T as the image IG2.

[0107] Next, the controller 6 analyzes the acquired image IG2 to acquire the position of the axis A2 of the replacement capillary 243T (S423). Next, the controller 6 adjusts the position of the replacement capillary 243T (S424). The controller 6 adjusts the position of the replacement capillary 243T based on the acquired position of the axis A2 of the replacement capillary 243T. Specifically, the controller 6 adjusts the position of the replacement capillary 243T so that the axis A3 of the reference pin RP1 and the axis A2 are on the same line within the image IG2. That is, the controller 6 adjusts the position of the replacement capillary 243T relative to the camera 41 based on the positions of the axis A2 and the axis A3. Next, the controller 6 stores the adjusted position of the replacement capillary 243T relative to the camera 41 (S425). The stored position of the replacement capillary 243T is used in subsequent processing, for example, when photographing the replacement capillary 243T with the camera 41. In this way, by using the adjusted position in subsequent processing as well, the position of the replacement capillary 243T in the image can be made the same.

[0108] Next, the controller 6 determines the protrusion length D2 of the bonding wire 12 protruding from the tip of the capillary 243 (S43). More specifically, as shown in FIG. 27 , the controller 6 first executes a feeding operation (S431). This step S431 corresponds to the "feeding operation" described above with reference to FIG. 7 . Next, the controller 6 moves the replacement capillary 243T to the stored post-adjustment position (S432). This allows subsequent measurements of the protrusion length to be performed accurately. For example, if the position of the replacement capillary 243T has not been changed since the above-described position adjustment, this movement of the replacement capillary 243T may be omitted.

[0109] Next, the controller 6 executes protrusion length measurement (S433). This protrusion length measurement may use an image captured using the camera 41 and the optical component 43, as shown in Fig. 6. The controller 6 obtains the protrusion length D2 by analyzing the image.

[0110] Next, the controller 6 determines whether the wire extension length D2 is longer than the lower limit (S434). When the controller 6 determines that the extension length D2 is not longer than the lower limit (S434: NO), that is, when the extension length D2 is shorter than the lower limit, the controller 6 executes the feeding operation (S435). Then, the controller 6 executes the extension length measurement again (S433). On the other hand, when the controller 6 determines that the extension length D2 is longer than the lower limit (S434: YES), the controller 6 determines whether the extension length D2 of the bonding wire 12 is shorter than the upper limit (S436).

[0111] When the controller 6 determines that the protrusion length D2 is not shorter than the upper limit (S436: NO), that is, when the protrusion length D2 is longer than the upper limit, the controller 6 executes the retraction operation (S437). Then, the controller 6 executes the protrusion length measurement again (S433). When the controller 6 determines that the protrusion length D2 is shorter than the upper limit (S436: YES), the controller 6 completes the determination of the protrusion length D2.

[0112] That is, by the controller 6 executing steps S433 to S437, it is possible to obtain a protrusion length D2 that is in the range of not less than the lower limit value and not more than the upper limit value.

[0113] Next, the controller 6 adjusts the first operating conditions when performing bonding using the replacement capillary (S44). The first operating conditions are ultrasonic vibration oscillation conditions when resuming bonding using the replaced capillary 243, i.e., the replacement capillary 243T. In this embodiment, the oscillation conditions include at least the value of the set current supplied to the ultrasonic vibrator 242a and the value of the set voltage applied to the ultrasonic vibrator 242a.

[0114] In the wire bonding apparatus 1, ultrasonic vibrations emitted from the ultrasonic vibrator 242a are applied to the ball 122 via the ultrasonic horn 242 and the replacement capillary 243T. Individual differences exist among replacement capillaries 243T. For example, even replacement capillaries 243T of the same type may have different lengths, diameters, shapes, etc. Furthermore, the state of binding of the replacement capillaries 243T to the ultrasonic horn 242 may also differ. Such variations in the individual differences among replacement capillaries 243T change the way in which ultrasonic vibrations are applied to the ball 122. For example, variations in the length of the replacement capillaries 243T cause variations in the natural frequency of the replacement capillaries 243T. As a result, although individual differences among replacement capillaries 243T are slight, even such slight differences can change the way in which ultrasonic vibrations are applied to the ball 122. As described above, even if the required processing accuracy is met when manufacturing the replacement capillary 243T, there may be cases where the required accuracy in the ultrasonic vibration oscillation conditions is not met. Therefore, when setting the ultrasonic vibration oscillation conditions, it is necessary to take into account the above-mentioned individual differences in the replacement capillary 243T and the constraint state of the replacement capillary 243T. For these reasons, the controller 6 adjusts the ultrasonic vibration oscillation conditions when performing bonding using the automatically replaced replacement capillary 243T in order to correct for the variations in the bonding operation results caused by the individual differences in the replacement capillary 243T.

[0115] 28 , the controller 6 forms a ball 122 at the tip of the bonding wire 12 (S4401). The controller 6 moves the tip of the bonding wire 12 to a discharge area of ​​a discharge device. Then, the controller 6 operates the discharge device to form the ball 122 at the tip of the bonding wire 12.

[0116] Next, the controller 6 moves the replacement capillary 243T to a first point P1 above the electrode 11b1 of the semiconductor chip 11b (S4402, see FIG. 4A). Next, the controller 6 measures the load applied to the ball 122 (S4403). The controller 6 also measures the load at predetermined time intervals in the subsequent processing. Next, the controller 6 lowers the replacement capillary 243T (S4404). Specifically, the controller 6 lowers the replacement capillary 243T toward the electrode 11b1.

[0117] Next, the controller 6 determines whether the ball 122 has contacted the electrode 11b1 (S4404). In this embodiment, the controller 6 determines whether the ball 122 has contacted the electrode 11b1 based on the load measured by the load sensor 244. When the ball 122 has contacted the electrode 11b1, a reaction force from the electrode 11b1 acts on the tip of the replacement capillary 243T, and the load measured by the load sensor 244 increases. Therefore, the controller 6 determines that the ball 122 has contacted the electrode 11b1 when the measured load exceeds a predetermined threshold.

[0118] When the controller 6 does not determine that the ball 122 has contacted the electrode 11b1 (S4405: NO), it again lowers the replacement capillary 243T. That is, the controller 6 lowers the replacement capillary 243T until the ball 122 contacts the electrode 11b1. When the controller 6 determines that the ball 122 has contacted the electrode 11b1 (S4405: YES), it controls the operation of the Z-axis driver 25 so that the load approaches a set value (S4406). Specifically, the controller 6 is connected to a servo amplifier that supplies power to the Z-axis driver 25, and feedback-controls the operation of the Z-axis driver 25 so that the load measured by the load sensor 244 approaches a predetermined set value.

[0119] Next, the controller 6 supplies power to the ultrasonic vibrator 242a to generate ultrasonic vibrations. These ultrasonic vibrations are applied to the ball 122 formed at the tip of the bonding wire 12 via the ultrasonic horn 242. That is, the controller 6 supplies power to the ultrasonic vibrator 242a while the ball 122 is in contact with the electrode 11b1 to apply ultrasonic vibrations to the ball 122 (S4407). The controller 6 measures the change in load during the period in which the ultrasonic vibrations are applied to the ball 122 (S4408). For example, the controller 6 measures the change in load during a predetermined period, including the period in which the ultrasonic vibrations are applied to the ball 122.

[0120] FIG. 29 shows the change in the position of the replacement capillary 243T in the Z direction, the change in the measured value of the load sensor 244, the change in the current value supplied to the Z-axis driver 25, and the change in the ultrasonic vibration emitted from the ultrasonic vibrator 242a. In FIG. 29, change G1 shows the change in the position of the replacement capillary 243T in the Z direction. Change G2 shows the change in the measured value of the load sensor 244. Change G3 shows the change in the current supplied to the Z-axis driver 25. Change G4 shows the change in the ultrasonic vibration emitted from the ultrasonic vibrator 242a. In FIG. 29, time t1 shows the time when the ball 122 contacts the electrode 11b1. Time t2 shows the time when application of ultrasonic vibration to the ball 122 begins. Time t3 shows the time when the load returns to the set value. Time t4 shows the time when application of ultrasonic vibration to the ball 122 ends. 29, the changes G2 and G3 show similar changes from time t1 to time t4. Therefore, as the change in load, the change in the actual measurement value of the load sensor 244 may be used, or the change in the value of the current supplied to the Z-axis drive unit 25 may be used.

[0121] As shown in FIG. 29 , when the ball 122 is in contact with the electrode 11b1, the ball 122 softens due to the load and ultrasonic energy, and the measured load decreases. As described above, the controller 6 feedback-controls the operation of the Z-axis driver 25 so that the load measured by the load sensor 244 approaches the set value. Therefore, the decreased load quickly returns to the set value. Next, the controller 6 calculates the difference between the minimum value during the period in which the load decreased and the set value at which the load returns (S4409). The period in which the load decreased indicates, for example, the period from when the ball 122 contacts the electrode 11b1 to when the measured load returns to the set value. By measuring the difference between the minimum value during the period in which the load decreased and the set value at which the load returns, i.e., the change in load from when the load decreased to when the load returns to the set value, the characteristics of the ultrasonic horn 242 can be visualized.

[0122] Next, the controller 6 determines whether the calculated difference is greater than a reference value (S4410). When the controller 6 determines that the calculated difference is greater than the reference value (S4410: YES), the controller 6 reduces the set current supplied to the ultrasonic vibrator 242a or the set voltage applied to the ultrasonic vibrator 242a. This causes the difference between the minimum value during the period in which the load was reduced and the set value to be restored to approach the reference value. That is, in step S4411, the controller 6 adjusts the set current supplied to the ultrasonic vibrator 242a or the set voltage applied to the ultrasonic vibrator 242a so that the difference between the minimum value of the load and the set value approaches the reference value.

[0123] On the other hand, when the controller 6 determines that the calculated difference is not greater than the reference value (S4410: NO), it increases the set current supplied to the ultrasonic vibrator 242a or the set voltage applied to the ultrasonic vibrator 242a (S4412). This changes the difference between the minimum value during the period when the load was reduced and the set value at which the load is restored so as to approach the reference value. In other words, also in step S4412, the controller 6 adjusts the set current supplied to the ultrasonic vibrator 242a or the set voltage applied to the ultrasonic vibrator 242a so that the difference between the minimum value of the load and the set value approaches the reference value.

[0124] Next, the controller 6 determines whether the termination condition is satisfied (S4413). The termination condition may be set, for example, based on the relationship between the calculated difference and the reference value. In this example, it may be determined that the termination condition is satisfied when the calculated difference falls within a predetermined range including the reference value. Alternatively, the termination condition may be set based on the number of times the ultrasonic vibration oscillation condition has been adjusted, i.e., the number of times step S4411 or step S4414 has been performed. In this example, it may be determined that the termination condition is satisfied when, for example, the number of times the oscillation condition has been adjusted exceeds a predetermined number. When it is determined that the termination condition is satisfied (S4413: YES), the controller 6 completes the adjustment of the first operating condition.

[0125] Next, the controller 6 determines the shape of the ball 122 formed at the tip of the bonding wire 12 (S45). More specifically, as shown in FIG. 30 , the controller 6 removes the ball 122 formed in the adjustment of the first operating conditions by waste bonding (S451). Next, the controller 6 forms the ball 122 at the tip of the bonding wire 12 (S452). The controller 6 moves the tip of the bonding wire 12 to a discharge region of a discharge device. Then, the controller 6 operates the discharge device to form the ball 122 at the tip of the bonding wire 12.

[0126] Next, the controller 6 moves the replacement capillary 243T to the stored adjusted position. This allows for accurate subsequent determination of the shape of the ball 122. Next, the controller 6 irradiates the replacement capillary 243T with light (S454). When irradiating the replacement capillary 243T with light in step S454, the light source component 44 irradiates the replacement capillary 243T with light, as in step S3151. Next, the controller 6 acquires an image of the replacement capillary 243T (S455). The image is captured by the camera 41 and the optical component 43 with the light from the light source component 44 irradiating the replacement capillary 243T. The image includes at least the ball 122. Next, the controller 6 analyzes the acquired image and measures the diameter R1 of the ball 122 (S456). The diameter R1 of the ball 122 is an example of information about the shape of the ball 122, so it can be said that the controller 6 acquires information about the shape of the ball 122 in step S456.

[0127] Next, the controller 6 determines whether the measured diameter R1 of the ball 122 is within a predetermined range (S457). That is, the controller 6 determines the shape of the ball 122. If the measured diameter R1 of the ball 122 is not within the predetermined range (S457: NO), the controller 6 performs a dummy bonding and measures the diameter R1 of a new ball 122 again. That is, steps S451 to S456 are repeatedly executed until the diameter R1 of the ball 122 falls within the predetermined range. If the measured diameter R1 of the ball 122 is within the predetermined range (S457: YES), the controller 6 determines that the shape of the ball 122 is the predetermined shape and ends the determination of the shape of the ball 122.

[0128] Next, the controller 6 adjusts the second operating condition when performing bonding using the replacement capillary 243T (S46). The second operating condition is the height at which bonding is performed on the target 11 (the substrate 11a and the semiconductor chip 11b). In other words, the second operating condition is the bond level. As described above, there are individual differences among replacement capillaries 243T, and even replacement capillaries 243T of the same type may have different lengths, diameters, shapes, etc. Due to such individual variations among replacement capillaries 243T, the height at which bonding is performed also changes. For example, if the length of the replacement capillary 243T is shorter than the length of the used capillary 243E, there is a risk that the target 11 and the replacement capillary 243T will not come into contact when bonding is performed at the height set for the used capillary 243E. That is, variations in the length of the replacement capillary 243T can be a factor in variations in the height (bond level) at which bonding is performed on the target 11. As such, even if the required processing accuracy is met when manufacturing the replacement capillary 243T, there may be cases where the required accuracy in the bond level is not met. Therefore, when setting the height at which bonding is performed on the target 11, it is necessary to take into account the above-mentioned variations in individual differences between the replacement capillaries 243T. For these reasons, the controller 6 adjusts the height at which bonding is performed on the target 11 to correct for variations in the bonding operation results caused by individual differences between the replacement capillaries 243T.

[0129] 31, first, the controller 6 moves the replacement capillary 243T to a first point P1 above the electrode 11b1 of the semiconductor chip 11b (S4601, see FIG. 4A). Next, the controller 6 lowers the replacement capillary 243T at a first speed (S4602). Specifically, the controller 6 controls the Z-axis drive unit 25 to lower the replacement capillary 243T toward the electrode 11b1 at the first speed. Next, the controller 6 changes the lowering speed of the replacement capillary 243T from the first speed to a second speed (S4603). Then, the controller 6 lowers the replacement capillary 243T at the second speed (S4604). The second speed is slower than the first speed. For example, the controller 6 changes the lowering speed of the replacement capillary 243T from the first speed to the second speed after a predetermined time has elapsed since the replacement capillary 243T started to lower.

[0130] Next, the controller 6 determines whether the ball 122 has contacted the electrode 11b1 (S4605). If the ball 122 has contacted the electrode 11b1, the ball 122 receives a reaction force from the electrode 11b1, causing the descent speed of the replacement capillary 243T to be slower than the second speed. In this embodiment, the controller 6 determines whether the ball 122 has contacted the electrode 11b1 based on this change in the descent speed of the replacement capillary 243T. In one example, the controller 6 determines that the ball 122 has contacted the electrode 11b1 if the change from the second speed is greater than a predetermined threshold. If the controller 6 does not determine that the ball 122 has contacted the electrode 11b1 (S4605: NO), the controller 6 continues the descent of the replacement capillary 243T at the second speed. In step S4605, instead of the determination based on the change in the second speed, a determination based on the load in step S4404 may be performed.

[0131] When the controller 6 determines that the ball 122 has contacted the electrode 11b1 (S4605: YES), it acquires the position P5 of the replacement capillary 243T when the ball 122 has contacted the electrode 11b1 (S4606, see FIG. 32(a)). For example, the controller 6 may acquire an image of the replacement capillary 243T when the ball 122 has contacted the electrode 11b1, and analyze the image to acquire the position P5.

[0132] Next, the controller 6 acquires the height of the electrode 11b1 based on the position P5 of the replacement capillary 243T when it contacts the electrode 11b1 (S4607). Specifically, the controller 6 acquires the height of the electrode 11b1 based on the height Z1 of the first point P1 and the height Z2 of the position P5. Since the height Z2 is the height of the position P5 of the replacement capillary 243T when it contacts the electrode 11b1, it can be said that the controller 6 acquires the height of the electrode 11b1 by bringing the replacement capillary 243T into contact with the electrode 11b1. Note that if the replacement capillary 243T continues to descend after the ball 122 contacts the electrode 11b1, the ball 122 presses against the electrode 11b1 at a speed slower than the second speed, causing the ball 122 to be crushed (see FIG. 32(b)). The position of the replacement capillary 243T then becomes position P6, which is lower than position P5.

[0133] Next, the controller 6 adjusts the height at which bonding is performed for the electrode 11b1 based on the height of the electrode 11b1 (S4608). For example, the controller 6 sets the acquired height of the electrode 11b1 as the height at which bonding is performed for the electrode 11b1. That is, the controller 6 sets the acquired height of the electrode 11b1 as the bond level in bonding for the electrode 11b1.

[0134] Next, the controller 6 raises the replacement capillary 243T to a first point P1 (S4609). Then, the controller 6 moves the replacement capillary 243T to a second point P3 above the electrode 11a1 of the substrate 11a (S4610, see FIG. 4C). Next, the controller 6 lowers the replacement capillary 243T at a first speed (S4611). The lowering at the first speed in step S4611 is performed in the same manner as in step S4602. Next, the controller 6 changes the lowering speed of the replacement capillary 243T from the first speed to a second speed (S4612). The change in processing speed in step S4612 is also performed in the same manner as in step S4603. Then, the controller 6 lowers the replacement capillary 243T at the second speed (S4613).

[0135] Next, the controller 6 determines whether the ball 122 has contacted the electrode 11a1 (S4614). The determination in step S4614 is performed in the same manner as the determination in step S4605. That is, the controller 6 determines that the ball 122 has contacted the electrode 11a1 when the amount of change from the second speed is greater than a predetermined threshold. When the controller 6 does not determine that the ball 122 has contacted the electrode 11a1 (S4614: NO), the controller 6 continues to lower the replacement capillary 243T at the second speed.

[0136] When the controller 6 determines that the ball 122 has contacted the electrode 11a1 (S4614: YES), it acquires the position P7 of the replacement capillary 243T when the ball 122 has contacted the electrode 11a1 (S4615, see FIG. 33(a)). For example, the controller 6 may acquire an image of the replacement capillary 243T when the ball 122 has contacted the electrode 11a1, and analyze the image to acquire the position P7.

[0137] Next, the controller 6 acquires the height of the electrode 11a1 based on the position P7 of the replacement capillary 243T when it contacts the electrode 11a1 (S4616). Specifically, the controller 6 acquires the height of the electrode 11a1 based on the height Z1 of the second point P3 and the height Z3 of the position P5. Since the height Z3 is the height of the position P7 of the replacement capillary 243T when it contacts the electrode 11a1, it can be said that the controller 6 acquires the height of the electrode 11a1 by bringing the replacement capillary 243T into contact with the electrode 11a1. Note that if the replacement capillary 243T continues to descend after the ball 122 contacts the electrode 11a1, the ball 122 presses against the electrode 11a1 at a speed slower than the second speed, causing the ball 122 to be crushed (see FIG. 32(b)). The position of the replacement capillary 243T then becomes position P8, which is lower than position P7.

[0138] Next, the controller 6 adjusts the height at which bonding is performed on the electrode 11a1 based on the height of the electrode 11a1 (S4617). For example, the controller 6 sets the acquired height of the electrode 11a1 as the height at which bonding is performed on the electrode 11a1. That is, the controller 6 sets the acquired height of the electrode 11a1 as the bond level in bonding to the electrode 11a1.

[0139] Next, the controller 6 raises the replacement capillary 243T to the second point P3 (S4618). Then, the controller 6 moves the replacement capillary 243T from the second point P3 to the first point P1 (S4619). This completes preparations for resuming bonding. Then, the controller 6 resumes bonding (S5).

[0140] <Effects> The method for replacing the capillary 243 includes the steps of: drawing the tip of the bonding wire 12 into the capillary through-hole 243h provided in the used capillary 243E in preparation for replacing the used capillary 243E, which is inserted into the ultrasonic horn 242 and through which the bonding wire 12 is inserted, with a replacement capillary 243T (S23); replacing the used capillary 243E with the replacement capillary 243T (S3); and preparing to resume bonding using the replacement capillary 243T (S4). In the replacement step (S3), it is determined whether the type of the replacement capillary 243T inserted into the ultrasonic horn 242 is the same as the type of the reference capillary, which is the capillary to be used in the resumed bonding. In the preparation step (S4), the protruding portion of the bonding wire 12 protruding from the tip of the replacement capillary 243T is observed with a camera 41 to determine whether the bonding wire 12 is in a state in which the bonding operation can be resumed.

[0141] According to the above method, in the step (S3) of replacing the used capillary 243E with the replacement capillary 243T, it is determined whether the type of the replacement capillary 243T is the same as the type of the reference capillary. Furthermore, according to the above method, in the step (S4) of performing preparations for resuming bonding after replacing the capillary 243, it is determined whether the bonding wire 12 is in a state in which the bonding operation can be resumed. As a result, the used capillary 243E can be automatically replaced with the capillary to be used in the resumed bonding, and the bonding wire 12 can be quickly restored to a state in which bonding is possible after automatically passing it through the replacement capillary 243T. Therefore, it is possible to reduce labor and shorten the capillary replacement work.

[0142] The replacing step (S2) includes steps (S3153, S3152A) of acquiring shape information indicating the shape of the replacement capillary 243T by observing the replacement capillary 243T inserted into the ultrasonic horn 242 with the camera 41, steps (S3154, S3153A) of acquiring reference shape information indicating the shape of the reference capillary, and steps (S3156, S3155A) of comparing the shape information with the reference shape information to determine whether the type of the replacement capillary inserted into the horn is the same as the type of the reference capillary. These steps enable accurate determination of whether the type of the replacement capillary 243T is the same as the type of the reference capillary.

[0143] The preparation step (S4) includes the steps of: measuring the protruding length D2 of the bonding wire 12 protruding from the tip of the replacement capillary 243T by observing the protruding portion of the bonding wire 12 with a camera 41 (S433); feeding the bonding wire 12 toward the tip of the replacement capillary 243T if the protruding length D2 is shorter than the lower limit (S435); and retracting the bonding wire 12 into the replacement capillary 243T if the protruding length D2 is longer than the upper limit (S437). These steps allow the length of the bonding wire 12 to be set to a predetermined length when bonding using the replacement capillary 243T is resumed.

[0144] The preparation step (S4) includes a step (S452) of forming a ball at the tip of the protruding portion of the bonding wire 12, and a step of determining whether the ball formed at the tip of the protruding portion of the bonding wire 12 satisfies the conditions for resuming the bonding operation by observing the ball with the camera 41. These steps allow the shape of the tip of the bonding wire 12 to be a predetermined shape when bonding using the replacement capillary 243T is resumed.

[0145] The step of determining whether the ball 122 satisfies the condition for resuming the bonding operation includes a step (S456) of measuring the diameter R2 of the ball 122 by observing the ball 122 formed at the tip of the protruding portion of the bonding wire 12 with the camera 41, and a step (S457) of determining whether the ball 122 satisfies the condition for resuming the bonding operation based on the diameter R2. According to these steps, the diameter R2 of the ball 122 can be set to a predetermined value when resuming bonding using the replacement capillary 243T.

[0146] The preparation step (S4) includes a step (S423) of acquiring the position of the axis A2 of the replacement capillary 243T by observing the replacement capillary 243T inserted into the ultrasonic horn 242 with the camera 41, and a step (S424) of adjusting the position of the replacement capillary 243T relative to the camera 41 based on the acquired position of the axis A2 of the replacement capillary 243T. According to these steps, the position of the replacement capillary 243T relative to the camera 41 can be set to a predetermined position when bonding using the replacement capillary 243T is resumed.

[0147] The preparation step (S4) may include steps (S44, S46) of adjusting the operating conditions to correct for variations in the bonding operation results caused by individual differences in the replacement capillary 243T. According to this step, the operating conditions for the resumed bonding correspond to the conditions for the replacement capillary 243T, so that the resumed bonding can be performed accurately.

[0148] The step (S44) of adjusting the operating conditions may include the steps of: forming a ball 122 at the tip of the protruding portion of the bonding wire 12 (S4401); bringing the ball 122 formed at the tip of the protruding portion into contact with the bonding target 11 (S4405); applying ultrasonic vibrations to the ball 122 while the ball 122 is in contact with the target 11 (S4407); measuring a change in the load applied to the ball 122 during the period in which the ultrasonic vibrations are applied (S4408); and adjusting the oscillation conditions of the ultrasonic vibrations when performing bonding using the replacement capillary 243T so that the difference between the minimum load value and the set value in the load change approaches a reference value (S4411, S4414). These steps allow the oscillation conditions of the ultrasonic vibrations to be set to predetermined values ​​when bonding using the replacement capillary is resumed.

[0149] The step (S46) of adjusting the operating conditions includes the steps of forming a ball 122 at the tip of the protruding portion of the bonding wire 12, acquiring the height of the target 11 to be bonded using the replacement capillary 243T by bringing the ball 122 formed at the tip of the protruding portion into contact with the target 11 (S4607, S4616), and adjusting the height at which bonding is performed on the target based on the acquired height of the target 11 (S4608, S4617). These steps enable the height at which bonding is performed when bonding using the replacement capillary is resumed to be set to a predetermined value.

[0150] The replacement process (S3) includes a transport operation (S304, S309) for moving the used capillary 243E pulled out from the ultrasonic horn 242 and the replacement capillary 243T inserted into the ultrasonic horn 242 along the axis of the used capillary 243E when attached to the ultrasonic horn 242, and a rotation operation (S304, S309) for defining a replacement position 52E for replacing the used capillary 243E pulled out from the ultrasonic horn 242 with the replacement capillary 243T inserted into the ultrasonic horn 242, and rotating the used capillary 243E and the replacement capillary 243T so that the second posture of the used capillary 243E and the replacement capillary 243T positioned at the replacement position 52E is different from the first posture of the used capillary 243E when attached to the ultrasonic horn 242. According to these steps, the space required for the capillary replacement unit 5 to replace the used capillary 243E with the replacement capillary 243T can be made compact.

[0151] The replacing step (S3) includes a pulling-out operation (S307) for moving the used capillary 243E, which is located at the replacement position 52E and in the second position, in the pulling-out direction along the axis of the used capillary 243E in the second position, and an inserting operation (S308) for moving the replacement capillary 243T in the inserting direction opposite to the pulling-out direction after the pulling-out operation. These steps also make it possible to make the space of the capillary replacement unit 5 required for replacing the used capillary 243E with the replacement capillary 243T compact.

[0152] In the replacing step (S3), after the start of a transport operation that moves the used capillary 243E along the axis of the used capillary 243E when attached to the ultrasonic horn 242, and while the transport operation is continuing, a rotation operation is performed that rotates the used capillary 243E located at the replacement position 52E so that the used capillary 243E assumes the second posture. According to these steps, the used capillary 243E can be replaced with the replacement capillary 243T with a simple configuration.

[0153] In the replacement step (S3), a transport operation is started simultaneously to move the replacement capillary 243T along the axis of the used capillary 243E when attached to the ultrasonic horn 242, and a rotation operation is started simultaneously to rotate the replacement capillary 243T so that the replacement capillary 243T, which is in the second position, assumes the first position. These steps allow the replacement capillary 243T to be smoothly inserted into the ultrasonic horn 242.

[0154] The angle between the axis of the used capillary 243E in the second position and the axis of the used capillary 243E in the first position is 90 degrees. This arrangement also makes it possible to make compact the space of the capillary replacement unit 5 required to replace the used capillary 243E with the replacement capillary 243T.

[0155] The wire bonding apparatus 1 includes a capillary 243 attached to an ultrasonic horn 242 and into which a bonding wire 12 is inserted, a capillary replacement unit 5 that replaces a used capillary 243E with a replacement capillary 243T, and a controller 6 that controls the capillary replacement unit 5. The controller 6 performs the following operations: pulling the tip of the bonding wire 12 into a capillary through-hole 243h provided in the used capillary 243E; replacing the used capillary 243E with the replacement capillary 243T; and preparing to resume bonding using the replacement capillary 243T. In the replacement operation, the replacement capillary 243T inserted into the ultrasonic horn 242 is observed with a camera 41 to determine whether the type of the replacement capillary 243T inserted into the ultrasonic horn 242 is the same as the type of a reference capillary that is to be used in the resumed bonding. In the preparation operation, the protruding portion of the bonding wire 12 protruding from the tip of the replacement capillary 243T is observed by the camera 41 to determine whether the bonding wire 12 is in a state in which the bonding operation can be resumed.

[0156] According to the above-described device, in the operation of replacing the used capillary 243E with the replacement capillary 243T, it is determined whether the type of the replacement capillary 243T is the same as the type of the reference capillary. Furthermore, according to the above-described method, in the operation of performing preparations for resuming bonding after replacing the capillary 243, it is determined whether the bonding wire 12 is in a state in which the bonding operation can be resumed. As a result, the used capillary 243E can be automatically replaced with the capillary to be used in the resumed bonding, and the bonding wire 12 can be quickly restored to a state in which bonding is possible after automatically passing it through the replacement capillary 243T. Therefore, it is possible to reduce labor and shorten the capillary replacement operation.

[0157] <Modifications> Although examples of the capillary replacement method and wire bonding apparatus according to the present invention have been described above, the capillary replacement method and wire bonding apparatus are not limited to the above-described embodiments.

[0158] In the embodiment described above, the diameter R2 of the replacement capillary 243T is used as the shape information of the replacement capillary 243T in step S315, but the shape information of the replacement capillary 243T is not limited to the diameter R2. For example, an image of the replacement capillary 243T itself may be used as the shape information of the replacement capillary 243T. Hereinafter, with reference to FIG. 34 , a process in which an image of the replacement capillary 243T is used as the shape information of the replacement capillary 243T will be described.

[0159] First, the controller 6 irradiates the replacement capillary 243T with light (S3151A). Step S3151A is executed, for example, in the same manner as step S3151. Next, the controller 6 acquires an image IG1 of the replacement capillary 243T (S3152A). Step S3152A is executed, for example, in the same manner as step S3152. Next, the controller 6 acquires a reference image, which is an image of the reference capillary (S3153A). The reference image is captured, for example, after the reference capillary attached to the tip side of the ultrasonic horn 242 is positioned above the reference pin RP1. When capturing the reference image, the reference capillary is positioned so that its position is the same as the position of the replacement capillary 243T in image IG1. For example, the controller 6 may accept a reference image input by a user, may receive a reference image sent from another computer, or may read a reference image pre-stored in memory.

[0160] Next, the controller 6 calculates the similarity between the image IG1 and the reference image (S3154A). The similarity is an index indicating how similar the image IG1 is to the reference image. In this modification, the more similar the image IG1 is to the reference image, the higher the similarity. For example, the controller 6 extracts feature points from each of the image IG1 and the reference image, and extracts feature point information indicating the extracted feature points from the image IG1 and the reference image. A feature point is a virtual point that serves as a clue to identifying an object present in the image. The controller 6 then determines the degree to which the feature point information of the image IG1 matches the feature point information of the reference image, and calculates the similarity between the image IG1 and the reference image based on the result.

[0161] Next, the controller 6 determines whether the calculated similarity is equal to or greater than a threshold value (S3155A). That is, in this modified example, the controller 6 determines whether the type of the replacement capillary 243T is the same as the type of the reference capillary based on the calculated similarity. When the calculated similarity is not equal to or greater than the threshold value (S3155A: NO), that is, when the calculated similarity is smaller than the threshold value, the controller 6 outputs information indicating that the type of the replacement capillary 243T is different from the type of the reference capillary (S3157A). When the calculated difference is within a predetermined range (S3155A: YES), the controller 6 determines that the type of the replacement capillary 243T and the type of the reference capillary are the same. This completes the automatic capillary replacement.

[0162] In the above-described embodiment, all of steps S41 to S46 are executed in preparation for resuming bonding. However, some of steps S41 to S46 may not be executed in preparation for resuming bonding. That is, step S4 may include at least one of steps S41 to S46.

[0163] In the embodiment described above, in step S44, the ball 122 is brought into contact with the electrode 11b1 to adjust the oscillation conditions of the ultrasonic vibrations. However, the object with which the ball 122 is brought into contact is not limited to the electrode 11b1. For example, in step S44, the ball 122 may be brought into contact with the electrode 11a1 to adjust the oscillation conditions of the ultrasonic vibrations. Note that even when the ball 122 is brought into contact with the electrode 11a1, the oscillation conditions of the ultrasonic vibrations may be adjusted in the same manner as when the ball 122 is brought into contact with the electrode 11b1.

[0164] 1...wire bonding device, 41...camera, 52E...replacement position, 122...ball, 243...capillary, 243E...used capillary, 243h...capillary through-hole, 243T...replacement capillary, A1...axis, A2...axis, A3...axis.

Claims

1. A method for replacing a capillary, comprising the steps of: pulling the tip of the wire into a capillary through hole provided in a used capillary in preparation for replacing a used capillary inserted into a horn and through which a wire is threaded, with a replacement capillary; replacing the used capillary with a replacement capillary; and making preparations for resuming bonding using the replacement capillary, wherein in the replacing step, a camera is used to observe the replacement capillary inserted into the horn to determine whether the type of the replacement capillary inserted into the horn is the same as the type of a reference capillary, which is the capillary to be used in the resumed bonding, and in the making preparations, a camera is used to observe the wire protruding portion protruding from the tip of the replacement capillary to determine whether the wire is in a state in which bonding operation can be resumed.

2. A method for replacing a capillary as described in claim 1, wherein the replacing step includes the steps of: acquiring shape information indicating the shape of the replacement capillary by observing the replacement capillary inserted into the horn with the camera; acquiring reference shape information indicating the shape of the reference capillary; and determining whether the type of the replacement capillary inserted into the horn is the same as the type of the reference capillary by comparing the shape information with the reference shape information.

3. A method for replacing a capillary as described in claim 1 or 2, wherein the step of carrying out the preparation includes the steps of: measuring the extension length of the wire protruding from the tip of the replacement capillary by observing the wire extension portion with the camera; sending the wire toward the tip of the replacement capillary if the extension length is shorter than a lower limit; and retracting the wire into the replacement capillary if the extension length is longer than an upper limit.

4. A method for replacing a capillary as described in any one of claims 1 to 3, wherein the step of performing the preparation includes the steps of: forming a ball at the tip of the wire extension; and determining whether the ball formed at the tip of the wire extension satisfies the conditions for resuming the bonding operation by observing the ball with the camera.

5. A method for replacing a capillary as described in claim 4, wherein the step of determining whether or not the ball satisfies the condition for resuming the bonding operation includes the steps of: measuring the diameter of the ball by observing the ball formed at the tip of the wire protrusion with the camera; and determining whether or not the ball satisfies the condition for resuming the bonding operation based on the diameter.

6. A method for replacing a capillary according to any one of claims 1 to 5, wherein the step of performing the preparation includes the steps of: acquiring the position of the axis of the replacement capillary by observing the replacement capillary inserted into the horn with the camera; and adjusting the position of the replacement capillary relative to the camera based on the acquired position of the axis of the replacement capillary.

7. A method for replacing a capillary as described in any one of claims 1 to 6, wherein the step of performing the preparation includes a step of adjusting operating conditions to compensate for variations in the results of the bonding operation caused by individual differences in the replacement capillary.

8. The method for replacing a capillary as described in claim 7, wherein the step of adjusting the operating conditions includes the steps of: forming a ball on the tip of the wire extension; bringing the ball formed on the tip of the wire extension into contact with an object of bonding; applying ultrasonic vibrations to the ball while the ball is in contact with the object; measuring a change in load applied to the ball during the period in which the ultrasonic vibrations are applied; and adjusting the oscillation conditions of the ultrasonic vibrations when performing the bonding using the replacement capillary so that the difference between the minimum value of the load and a set value in the change in load approaches a reference value.

9. A method for replacing a capillary as described in claim 7 or 8, wherein the step of adjusting the operating conditions includes the steps of: forming a ball at the tip of the wire extension; acquiring a height of the target of bonding using the replacement capillary by contacting the ball formed at the tip of the wire extension with the target of bonding; and adjusting a height at which the bonding is performed on the target based on the acquired height of the target.

10. A method for replacing a capillary according to any one of claims 1 to 9, wherein the replacing step includes: a transporting operation for moving the used capillary pulled out of the horn and the replacement capillary to be inserted into the horn along an axis of the used capillary when attached to the horn; and a rotating operation for rotating the used capillary and the replacement capillary such that a replacement position for replacing the used capillary pulled out of the horn with the replacement capillary to be inserted into the horn is defined, and a second posture of the used capillary and the replacement capillary positioned at the replacement position is different from a first posture of the used capillary when attached to the horn.

11. A method for replacing a capillary as described in claim 10, wherein the replacing step includes: a pulling-out operation for moving the used capillary located at the replacement position and in the second position in a pulling-out direction along the axis of the used capillary in the second position; and an insertion operation for moving the replacement capillary in an insertion direction opposite to the pulling-out direction after the pulling-out operation.

12. A method for replacing a capillary as described in claim 10 or 11, wherein in the replacing step, after the transport operation is started, which moves the used capillary along the axis of the used capillary when attached to the horn, and during the period during which the transport operation is continuing, the rotation operation is performed, which rotates the used capillary so that the used capillary located at the replacement position is in the second position.

13. A method for replacing a capillary as described in any one of claims 10 to 12, wherein in the replacing step, the transport operation for moving the replacement capillary along the axis of the used capillary when attached to the horn and the rotation operation for rotating the replacement capillary so that the replacement capillary, which is in the second position, is in the first position, are started simultaneously.

14. A method for replacing a capillary according to any one of claims 10 to 13, wherein an angle between the axis of the used capillary when in the second position and the axis of the used capillary when in the first position is 90 degrees.

15. A wire bonding apparatus comprising: a used capillary that is attached to a horn and into which a wire is inserted; a replacement unit that replaces the used capillary with a replacement capillary; and a control unit that controls the replacement unit, wherein the control unit performs the following operations: an operation of drawing the tip of the wire into a capillary through hole provided in the used capillary; an operation of replacing the used capillary with a replacement capillary; and an operation of making preparations for resuming bonding using the replacement capillary, wherein the operation of replacing comprises observing the replacement capillary inserted into the horn with a camera to determine whether the type of the replacement capillary inserted into the horn is the same as the type of a reference capillary which is the capillary to be used in the bonding to be resumed, and the operation of making preparations comprises observing a wire protruding portion protruding from the tip of the replacement capillary with the camera to determine whether the wire bonding operation can be resumed.

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