Heat medium supply device

Abstract

This heat medium supply device (1) comprises: a cooling-side outlet pipe (17) that transfers a heat medium from a cooling-side tank (16) to a cooling device (8); a cooling-side bypass pipe (44) that extends from a cooling-side return pipe (26) to the cooling-side outlet pipe (17) while bypassing the cooling-side tank (16); a cooling-side bypass valve (45) provided to the cooling-side bypass pipe (44); and an operation control unit (35) that controls the operation of the cooling-side bypass valve (45). The operation control unit (35) is configured to open the cooling-side bypass valve (45) when the temperature of the heat medium in the cooling-side return pipe (26) measured by a cooling-side temperature measurement device (41) is within a preset allowable low-temperature range, and to close the cooling-side bypass valve (45) when the temperature of the heat medium in the cooling-side return pipe (26) measured by the cooling-side temperature measurement device (41) is outside the allowable low-temperature range.

Description

Heat medium supply device

[0001] The present invention relates to a heat medium supplying device that supplies a heat medium to a semiconductor manufacturing device such as an etching device, a CVD device, or a PVD device to adjust the temperature of the semiconductor manufacturing device.

[0002] Semiconductor manufacturing equipment (e.g., etching equipment, CVD equipment, and PVD equipment) for manufacturing semiconductor devices is configured to perform manufacturing processes while controlling the processing temperature. For example, in an etching equipment, the processing temperature of the wafer is controlled by flowing a temperature-controlled liquid as a heat medium through a flow path formed in a susceptor that supports the wafer.

[0003] 5 is a schematic diagram showing a conventional example of a heat medium supplying device that supplies a heat medium to semiconductor manufacturing equipment. The heat medium supplying device 500 includes a heating device 501 that heats the heat medium and a cooling device 502 that cools the heat medium. The heat medium is stored in a heating-side tank 504 and a cooling-side tank 505. The heat medium heated by the heating device 501 is transferred to the heating-side tank 504 and then transferred from the heating-side tank 504 into a heat medium mixer 507. Meanwhile, the heat medium stored in the cooling-side tank 505 is transferred to the cooling device 502 and cooled by the cooling device 502. The cooled heat medium is then transferred to the heat medium mixer 507.

[0004] The heated and cooled heat mediums are mixed in heat medium mixer 507 and adjusted to the temperature required for semiconductor manufacturing equipment 510. The temperature-adjusted heat medium is sent to semiconductor manufacturing equipment 510, thereby maintaining semiconductor manufacturing equipment 510 at the target temperature. The heat medium that has passed through semiconductor manufacturing equipment 510 is returned to heat medium mixer 507, where it is divided and transferred to heating-side tank 504 and cooling-side tank 505. In this way, the heat medium circulates between heat medium supply device 500 and semiconductor manufacturing equipment 510.

[0005] JP 2023-98068 A

[0006] The target temperature for wafer processing in semiconductor manufacturing equipment 510 may fluctuate significantly during wafer processing. Such fluctuations in the target temperature may cause a sudden change in the temperature of the heat medium returning from semiconductor manufacturing equipment 510 to heating-side tank 504 and cooling-side tank 505 via heating medium mixer 507. As a result, a high load is temporarily applied to heating device 501 and cooling device 502, and it may take a long time for the temperature of the heat medium supplied to heating medium mixer 507 to stabilize.

[0007] Therefore, the present invention provides a heat medium supplying device that can supply a heat medium at a stable temperature while preventing a high load on a cooling device when the temperature of the heat medium returning from the semiconductor manufacturing equipment changes suddenly.The present invention also provides a heat medium supplying device that can supply a heat medium at a stable temperature while preventing a high load on a heating device when the temperature of the heat medium returning from the semiconductor manufacturing equipment changes suddenly.

[0008] In one aspect, a heat medium supplying device for supplying a heat medium for adjusting the temperature of a semiconductor manufacturing device includes a heating device for heating the heat medium, a cooling device for cooling the heat medium, a heating medium transfer pipe for sending the heated heat medium to the semiconductor manufacturing device, a cooling medium transfer pipe for sending the cooled heat medium to the semiconductor manufacturing device, a heating-side tank and a cooling-side tank for holding the heat medium, a heating-side return pipe for returning the heat medium that has passed through the semiconductor manufacturing device to the heating-side tank, a cooling-side return pipe for returning the heat medium that has passed through the semiconductor manufacturing device to the cooling-side tank, a cooling-side temperature measuring device provided in the cooling-side return pipe for measuring the temperature of the heat medium in the cooling-side return pipe, and a cooling-side tank for transferring the heat medium from the cooling-side tank to the heating-side tank. There is provided a heat medium supply device comprising: a cooling-side outlet pipe that transfers the heat medium to the cooling device; a cooling-side bypass pipe that extends from the cooling-side return pipe to the cooling-side outlet pipe, bypassing the cooling-side tank; a cooling-side bypass valve provided in the cooling-side bypass pipe; and an operation control unit that controls operation of the cooling-side bypass valve, wherein the operation control unit is configured to open the cooling-side bypass valve when the temperature of the heat medium in the cooling-side return pipe measured by the cooling-side temperature measuring device is within a preset allowable low temperature range, and to close the cooling-side bypass valve when the temperature of the heat medium in the cooling-side return pipe measured by the cooling-side temperature measuring device is outside the allowable low temperature range.

[0009] When the temperature of the heat transfer medium in the cooling-side return pipe is outside the allowable low-temperature range, the cooling-side bypass valve is closed, and the heat transfer medium in the cooling-side return pipe is transferred to the cooling-side tank. More specifically, when the temperature of the heat transfer medium in the cooling-side return pipe is lower than the lower limit of the allowable low-temperature range, the low-temperature heat transfer medium flows into the cooling-side tank and is stored there. During operation of the semiconductor manufacturing equipment, relatively high-temperature heat transfer medium may temporarily return through the cooling-side return pipe. When the temperature of the heat transfer medium in the cooling-side return pipe is higher than the upper limit of the allowable low-temperature range, the high-temperature heat transfer medium flows into the cooling-side tank. Since low-temperature heat transfer medium is already present in the cooling-side tank, the high-temperature heat transfer medium mixes with the low-temperature heat transfer medium, and the heat transfer medium that flows into the cooling-side tank and is higher than the upper limit of the allowable low-temperature range is cooled. As a result, the temperature of the heat transfer medium flowing from the cooling-side tank through the cooling-side outlet pipe to the cooling device is lower than the temperature of the heat transfer medium in the cooling-side return pipe, thereby reducing the load on the cooling device compared to when high-temperature heat transfer medium is directly supplied to the cooling device. When the temperature of the heat transfer medium in the cooling-side return pipe is within the allowable low-temperature range, the load on the cooling device is not large. In this way, the cooling-side bypass valve operates based on whether the temperature of the heat transfer medium in the cooling-side return pipe is within the allowable low-temperature range, thereby stabilizing the load on the cooling device.

[0010] In one aspect, the heat medium supplying device further includes a heating-side temperature measuring device provided in the heating-side return pipe that measures the temperature of the heat medium in the heating-side return pipe; a heating-side outlet pipe that transports the heat medium from the heating-side tank to the heating device; a heating-side bypass pipe that extends from the heating-side return pipe to the heating-side outlet pipe, bypassing the heating-side tank; and a heating-side bypass valve provided in the heating-side bypass pipe, wherein the operation control unit is configured to open the heating-side bypass valve when the temperature of the heat medium in the heating-side return pipe measured by the heating-side temperature measuring device is within a predetermined allowable high temperature range, and to close the heating-side bypass valve when the temperature of the heat medium in the heating-side return pipe measured by the heating-side temperature measuring device is outside the allowable high temperature range.

[0011] When the temperature of the heat transfer medium in the heating-side return pipe is outside the allowable high temperature range, the heating-side bypass valve is closed, and the heat transfer medium in the heating-side return pipe is transferred to the heating-side tank. More specifically, when the temperature of the heat transfer medium in the heating-side return pipe is higher than the upper limit of the allowable high temperature range, the high-temperature heat transfer medium flows into the heating-side tank and is stored there. When the temperature of the heat transfer medium in the heating-side return pipe is lower than the lower limit of the allowable high temperature range, the low-temperature heat transfer medium also flows into the heating-side tank. The low-temperature heat transfer medium mixes with the heat transfer medium in the heating-side tank, and the heat transfer medium that flows into the heating-side tank and is lower than the lower limit of the allowable high temperature range is heated. As a result, the temperature of the heat transfer medium flowing from the heating-side tank through the heating-side outlet pipe to the heating device is higher than the temperature of the heat transfer medium in the heating-side return pipe, thereby reducing the load on the heating device compared to when the low-temperature heat transfer medium is directly supplied to the heating device. When the temperature of the heat transfer medium in the heating-side return pipe is within the allowable high temperature range, the load on the heating device is not large. In this way, the heating-side bypass valve operates based on whether or not the temperature of the heat medium in the heating-side return pipe is within the allowable high temperature range, thereby stabilizing the load on the heating device.

[0012] In one aspect, the semiconductor manufacturing equipment is a plurality of semiconductor manufacturing equipment, and the heating medium transfer pipe, the cooling medium transfer pipe, the heating side return pipe, and the cooling side return pipe are each connected to the plurality of semiconductor manufacturing equipment.

[0013] In one aspect, a heat medium supplying device for supplying a heat medium for adjusting the temperature of a semiconductor manufacturing device includes a heating device for heating the heat medium, a cooling device for cooling the heat medium, a heating medium transfer pipe for sending the heated heat medium to the semiconductor manufacturing device, a cooling medium transfer pipe for sending the cooled heat medium to the semiconductor manufacturing device, a heating-side tank and a cooling-side tank for holding the heat medium, a heating-side return pipe for returning the heat medium that has passed through the semiconductor manufacturing device to the heating-side tank, a cooling-side return pipe for returning the heat medium that has passed through the semiconductor manufacturing device to the cooling-side tank, a heating-side temperature measuring device provided in the heating-side return pipe for measuring the temperature of the heat medium in the heating-side return pipe, and a cooling device for transferring heat from the heating-side tank to the cooling-side tank. There is provided a heat medium supply device comprising: a heating-side outlet pipe that transfers the heat medium to the heating device; a heating-side bypass pipe that extends from the heating-side return pipe to the heating-side outlet pipe, bypassing the heating-side tank; a heating-side bypass valve provided in the heating-side bypass pipe; and an operation control unit that controls operation of the cooling-side bypass valve, wherein the operation control unit is configured to open the heating-side bypass valve when the temperature of the heat medium in the heating-side return pipe measured by the heating-side temperature measuring device is within a preset allowable high temperature range, and to close the heating-side bypass valve when the temperature of the heat medium in the heating-side return pipe measured by the heating-side temperature measuring device is outside the allowable high temperature range.

[0014] When the temperature of the heat transfer medium in the heating-side return pipe is outside the allowable high temperature range, the heating-side bypass valve is closed, and the heat transfer medium in the heating-side return pipe is transferred to the heating-side tank. More specifically, when the temperature of the heat transfer medium in the heating-side return pipe is higher than the upper limit of the allowable high temperature range, the high-temperature heat transfer medium flows into the heating-side tank and is stored there. When the temperature of the heat transfer medium in the heating-side return pipe is lower than the lower limit of the allowable high temperature range, the low-temperature heat transfer medium also flows into the heating-side tank. The low-temperature heat transfer medium mixes with the heat transfer medium in the heating-side tank, and the heat transfer medium that flows into the heating-side tank and is lower than the lower limit of the allowable high temperature range is heated. As a result, the temperature of the heat transfer medium flowing from the heating-side tank through the heating-side outlet pipe to the heating device is higher than the temperature of the heat transfer medium in the heating-side return pipe, thereby reducing the load on the heating device compared to when the low-temperature heat transfer medium is directly supplied to the heating device. When the temperature of the heat transfer medium in the heating-side return pipe is within the allowable high temperature range, the load on the heating device is not large. In this way, the heating-side bypass valve operates based on whether or not the temperature of the heat medium in the heating-side return pipe is within the allowable high temperature range, thereby stabilizing the load on the heating device.

[0015] In one aspect, the heat medium supply device further includes a cooling-side temperature measuring device provided in the cooling-side return pipe that measures the temperature of the heat medium in the cooling-side return pipe, a cooling-side outlet pipe that transports the heat medium from the cooling-side tank to the cooling device, a cooling-side bypass pipe that extends from the cooling-side return pipe to the cooling-side outlet pipe, bypassing the cooling-side tank, and a cooling-side bypass valve provided in the cooling-side bypass pipe, and the operation control unit is configured to open the cooling-side bypass valve when the temperature of the heat medium in the cooling-side return pipe measured by the cooling-side temperature measuring device is within a predetermined allowable low temperature range, and to close the cooling-side bypass valve when the temperature of the heat medium in the cooling-side return pipe measured by the cooling-side temperature measuring device is outside the allowable low temperature range.

[0016] When the temperature of the heat transfer medium in the cooling-side return pipe is outside the allowable low-temperature range, the cooling-side bypass valve is closed, and the heat transfer medium in the cooling-side return pipe is transferred to the cooling-side tank. More specifically, when the temperature of the heat transfer medium in the cooling-side return pipe is lower than the lower limit of the allowable low-temperature range, the low-temperature heat transfer medium flows into the cooling-side tank and is stored there. During operation of the semiconductor manufacturing equipment, relatively high-temperature heat transfer medium may temporarily return through the cooling-side return pipe. When the temperature of the heat transfer medium in the cooling-side return pipe is higher than the upper limit of the allowable low-temperature range, the high-temperature heat transfer medium flows into the cooling-side tank. Since low-temperature heat transfer medium is already present in the cooling-side tank, the high-temperature heat transfer medium mixes with the low-temperature heat transfer medium, and the heat transfer medium that flows into the cooling-side tank and is higher than the upper limit of the allowable low-temperature range is cooled. As a result, the temperature of the heat transfer medium flowing from the cooling-side tank through the cooling-side outlet pipe to the cooling device is lower than the temperature of the heat transfer medium in the cooling-side return pipe, thereby reducing the load on the cooling device compared to when high-temperature heat transfer medium is directly supplied to the cooling device. When the temperature of the heat transfer medium in the cooling-side return pipe is within the allowable low-temperature range, the load on the cooling device is not large. In this way, the cooling-side bypass valve operates based on whether the temperature of the heat transfer medium in the cooling-side return pipe is within the allowable low-temperature range, thereby stabilizing the load on the cooling device.

[0017] In one aspect, the semiconductor manufacturing equipment is a plurality of semiconductor manufacturing equipment, and the heating medium transfer pipe, the cooling medium transfer pipe, the heating side return pipe, and the cooling side return pipe are each connected to the plurality of semiconductor manufacturing equipment.

[0018] According to one embodiment of the present invention, the cooling-side bypass valve operates based on whether the temperature of the heat medium in the cooling-side return pipe is within a permissible low-temperature range, thereby stabilizing the load on the cooling device. According to one embodiment of the present invention, the heating-side bypass valve operates based on whether the temperature of the heat medium in the heating-side return pipe is within a permissible high-temperature range, thereby stabilizing the load on the heating device.

[0019] Fig. 1 is a schematic diagram showing an embodiment of a semiconductor manufacturing system including a heat medium supplying device and semiconductor manufacturing equipment; Fig. 2 is a schematic diagram showing another embodiment of a heat medium supplying device; Fig. 3 is a schematic diagram showing yet another embodiment of a heat medium supplying device; Fig. 4 is a schematic diagram showing an embodiment of a semiconductor manufacturing system including a heat medium supplying device and a plurality of semiconductor manufacturing equipment; Fig. 5 is a schematic diagram showing a conventional example of a heat medium supplying device;

[0020] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will now be described with reference to the drawings. Fig. 1 is a schematic diagram showing an embodiment of a semiconductor manufacturing system including a heat medium supplying device 1 and a semiconductor manufacturing apparatus 2. The heat medium supplying device 1 is configured to supply a heat medium to the semiconductor manufacturing apparatus 2 (e.g., an etching apparatus, a CVD apparatus, a PVD apparatus, etc.) to adjust the temperature of the semiconductor manufacturing apparatus 2.

[0021] As shown in Fig. 1, the semiconductor manufacturing system includes a heating medium supplying device 1, a heating medium mixer 5 connected to the heating medium supplying device 1, and semiconductor manufacturing equipment 2 connected to the heating medium mixer 5. The heating medium supplying device 1 is connected to the semiconductor manufacturing equipment 2 via the heating medium mixer 5. In the embodiment shown in Fig. 1, an etching device that performs dry etching on wafers is used as the semiconductor manufacturing equipment 2, but the semiconductor manufacturing equipment 2 is not limited to this embodiment.

[0022] The heat medium supplying device 1 includes a heating device 7 that heats the heat medium, a cooling device 8 that cools the heat medium, a heating medium transfer pipe 11 that sends the heated heat medium to the semiconductor manufacturing equipment 2, a cooling medium transfer pipe 12 that sends the cooled heat medium to the semiconductor manufacturing equipment 2, and a heating-side tank 15 and a cooling-side tank 16 that hold the heat medium. The heat medium supplying device 1 has a heat insulating material 18 that covers the entire outer surface of the heating-side tank 15, and a heat insulating material 19 that covers the entire outer surface of the cooling-side tank 16. The heat insulating materials 18, 19 are configured to maintain the temperature of the heat medium held in the heating-side tank 15 and the cooling-side tank 16.

[0023] The heating medium transfer pipe 11 extends from the heating-side tank 15 to the heating medium mixer 5, and the cooling medium transfer pipe 12 extends from the cooling device 8 to the heating medium mixer 5. The heating medium supplying device 1 further includes a cooling-side outlet pipe 17 that transfers the heating medium from the cooling-side tank 16 to the cooling device 8. The cooling-side outlet pipe 17 extends from the cooling-side tank 16 to the cooling device 8. The cooling-side outlet pipe 17 is located upstream of the cooling medium transfer pipe 12.

[0024] The heating medium transfer pipe 11 and the cooling medium transfer pipe 12 are connected to a heating medium mixer 5 and communicate with the semiconductor manufacturing equipment 2 via the heating medium mixer 5. The heating medium mixer 5 is equipped with a plurality of flow control valves (not shown) that communicate with the heating medium transfer pipe 11 and the cooling medium transfer pipe 12, respectively. The heating medium mixer 5 is configured to adjust the temperature required for the semiconductor manufacturing equipment 2 by mixing the heated and cooled heat mediums while adjusting the flow rates of the heated and cooled heat mediums.

[0025] In one embodiment, a fluorine-based inert liquid is used as the heat medium. An example of the heating device 7 is an electric heater. An example of the cooling device 8 is a vapor compression refrigerator, an absorption refrigerator, etc. Vapor compression refrigerators include turbo refrigerators, screw refrigerators, rotary refrigerators, scroll refrigerators, etc., and any of these can be used. The configurations of the heating device 7 and the cooling device 8 are not particularly limited as long as they can heat and cool the heat medium.

[0026] The heating medium supplying device 1 further includes a tank connecting pipe 20 that connects the heating-side tank 15 and the cooling-side tank 16, a connecting valve 21 provided in the tank connecting pipe 20, a heating-side return pipe 25 that returns the heating medium that has passed through the semiconductor manufacturing apparatus 2 to the heating-side tank 15, and a cooling-side return pipe 26 that returns the heating medium that has passed through the semiconductor manufacturing apparatus 2 to the cooling-side tank 16. The heating-side return pipe 25 extends from the heating medium mixer 5 to the heating-side tank 15. The cooling-side return pipe 26 extends from the heating medium mixer 5 to the cooling-side tank 16.

[0027] The heating device 7 is provided in the heating-side return pipe 25 and is configured to heat the heat medium flowing through the heating-side return pipe 25. The heating device 7 is arranged upstream of the heating-side tank 15. The heat medium heated by the heating device 7 is transferred to the heating-side tank 15 through the heating-side return pipe 25 and stored in the heating-side tank 15. The heat medium supplying device 1 is equipped with a heating-side liquid level detecting device 31 that detects the liquid level of the heat medium in the heating-side tank 15, and a cooling-side liquid level detecting device 32 that detects the liquid level of the heat medium in the cooling-side tank 16.

[0028] The heating medium supplying device 1 includes a heating-side pump 33 connected to a heating medium transfer pipe 11. When the heating-side pump 33 is operated, the heating medium (heated heating medium) in the heating-side tank 15 is sent through the heating medium transfer pipe 11 to the heating medium mixer 5, and then sent from the heating medium mixer 5 to the semiconductor manufacturing apparatus 2.

[0029] The cooling device 8 is disposed downstream of the cooling-side tank 16. More specifically, the cooling device 8 is connected to the cooling medium transfer pipe 12 and the cooling-side outlet pipe 17. The heat medium supplying device 1 includes a cooling-side pump 34 connected to the cooling-side outlet pipe 17. When the cooling-side pump 34 is operated, the heat medium is sent from the cooling-side tank 16 through the cooling-side outlet pipe 17 to the cooling device 8 and cooled by the cooling device 8. The cooled heat medium is sent to the heat medium mixer 5 through the cooling medium transfer pipe 12, and further sent from the heat medium mixer 5 to the semiconductor manufacturing apparatus 2.

[0030] The heated and cooled heat mediums are mixed in the heat medium mixer 5 to generate a heat medium having a predetermined temperature. The heat medium at the predetermined temperature is transferred from the heat medium mixer 5 to the semiconductor manufacturing equipment 2 and heats or cools wafers (not shown) inside the semiconductor manufacturing equipment 2 as it passes through the semiconductor manufacturing equipment 2. The heat medium that has passed through the semiconductor manufacturing equipment 2 is returned to the heat medium mixer 5 and splits into two flows. One of the two flows flows into the heating-side return pipe 25, and the other flows into the cooling-side return pipe 26. The heat medium that has flowed into the heating-side return pipe 25 is heated by the heating device 7 and then flows into the heating-side tank 15. The heat medium that has flowed into the cooling-side return pipe 26 passes through the cooling-side return pipe 26 and flows into the cooling-side tank 16 or the cooling-side outlet pipe 17.

[0031] As the heat medium circulates between the heat medium supplying device 1 and the semiconductor manufacturing device 2, a difference occurs between the liquid level of the heat medium in the heating-side tank 15 and the liquid level of the heat medium in the cooling-side tank 16. The heat medium supplying device 1 of this embodiment is configured to open the communication valve 21 provided in the tank communication pipe 20 when the difference between the liquid level of the heat medium in the heating-side tank 15 and the liquid level of the heat medium in the cooling-side tank 16 exceeds a threshold value.

[0032] The heat medium supplying device 1 includes an operation control unit 35 that controls the operation of the communicating valve 21. The operation control unit 35 includes at least one computer. The operation control unit 35 includes a storage device 35a that stores programs and the like, and an arithmetic unit 35b that performs calculations according to instructions included in the programs. The storage device 35a includes a main storage device such as a random access memory (RAM) and an auxiliary storage device such as a hard disk drive (HDD) or a solid state drive (SSD). Examples of the arithmetic unit 35b include a central processing unit (CPU) and a graphics processing unit (GPU). However, the specific configuration of the operation control unit 35 is not limited to these examples.

[0033] The heat medium supplying device 1 includes a cooling-side temperature measuring device 41 provided in the cooling-side return pipe 26, a cooling-side bypass pipe 44 extending from the cooling-side return pipe 26 to the cooling-side outlet pipe 17, bypassing the cooling-side tank 16, and a cooling-side bypass valve 45 provided in the cooling-side bypass pipe 44. One end of the cooling-side bypass pipe 44 is connected to the cooling-side return pipe 26, and the other end of the cooling-side bypass pipe 44 is connected to the cooling-side outlet pipe 17. A connection point B1 between the cooling-side bypass pipe 44 and the cooling-side outlet pipe 17 is located upstream of the cooling-side pump 34. When the cooling-side bypass valve 45 is closed, the heat medium flows into the cooling-side tank 16 through the cooling-side return pipe 26. When the cooling-side bypass valve 45 is opened, most of the heat medium flowing through the cooling-side return pipe 26 flows into the cooling-side bypass pipe 44. The cooling-side bypass valve 45 is an actuator-driven valve such as an electric valve.

[0034] The cooling-side temperature measuring instrument 41 is configured to measure the temperature of the heat medium in the cooling-side return pipe 26. The cooling-side temperature measuring instrument 41 is electrically connected to the operation control unit 35, and the measured value of the temperature of the heat medium in the cooling-side return pipe 26 is sent to the operation control unit 35. The cooling-side bypass valve 45 is electrically connected to the operation control unit 35, and the operation of the cooling-side bypass valve 45 is controlled by the operation control unit 35.

[0035] The operation control unit 35 is configured to open the cooling-side bypass valve 45 when the temperature of the heat medium in the cooling-side return pipe 26 measured by the cooling-side temperature measuring device 41 is within a preset allowable low temperature range, and to close the cooling-side bypass valve 45 when the temperature of the heat medium in the cooling-side return pipe 26 measured by the cooling-side temperature measuring device 41 is outside the allowable low temperature range.

[0036] In one embodiment, the lower limit of the allowable low temperature range is equal to or less than the minimum operable refrigeration capacity of the cooling device 8, and the upper limit of the allowable low temperature range is equal to or greater than the rated refrigeration capacity of the cooling device 8. The minimum operable refrigeration capacity of the cooling device 8 is a refrigeration capacity that is 10% to 20% of the rated refrigeration capacity of the cooling device 8. When the load (light load) is below this minimum operable refrigeration capacity, the cooling device 8 cannot ensure the target temperature (i.e., the load temperature becomes lower than the target temperature). Furthermore, when the load exceeds the rated refrigeration capacity of the cooling device 8, the cooling device 8 cannot sufficiently cool the load and cannot ensure the target temperature (i.e., the load temperature becomes higher than the target temperature). From this perspective, in one embodiment, the lower limit of the allowable low temperature range is equal to or less than the minimum operable refrigeration capacity of the cooling device 8, and the upper limit of the allowable low temperature range is equal to or greater than the rated refrigeration capacity of the cooling device 8.

[0037] When the temperature of the heat medium in the cooling-side return pipe 26 is outside the allowable low temperature range, the cooling-side bypass valve 45 is closed, and the heat medium in the cooling-side return pipe 26 is transferred into the cooling-side tank 16. More specifically, when the temperature of the heat medium in the cooling-side return pipe 26 is lower than the lower limit of the allowable low temperature range, the low-temperature heat medium flows into the cooling-side tank 16 and is stored therein.

[0038] During operation of the semiconductor manufacturing equipment 2, a relatively high-temperature heat medium may temporarily return through the cooling-side return pipe 26. When the temperature of the heat medium in the cooling-side return pipe 26 is higher than the upper limit of the allowable low-temperature range, the high-temperature heat medium flows into the cooling-side tank 16. Because a low-temperature heat medium is already present in the cooling-side tank 16, the high-temperature heat medium mixes with the low-temperature heat medium, and the heat medium that has flowed into the cooling-side tank 16 and is higher in temperature than the upper limit of the allowable low-temperature range is cooled. As a result, the temperature of the heat medium flowing from the cooling-side tank 16 through the cooling-side outlet pipe 17 to the cooling device 8 is lower than the temperature of the heat medium in the cooling-side return pipe 26, and the load on the cooling device 8 can be reduced compared to when the high-temperature heat medium is directly supplied to the cooling device 8.

[0039] When the temperature of the heat medium in the cooling-side return pipe 26 is within the allowable low temperature range, the load on the cooling device 8 is not large. Therefore, the cooling-side bypass valve 45 is opened, and most of the heat medium flowing through the cooling-side return pipe 26 flows to the cooling-side outlet pipe 17, with very little of it flowing into the cooling-side tank 16. While the cooling-side bypass valve 45 is open, the cooling-side tank 16 is thermally isolated. Normally, the temperature inside the cooling-side tank 16 is significantly different from the temperature around the cooling-side tank 16. Because the entire outer surface of the cooling-side tank 16 is covered with a heat insulating material 19, the temperature inside the cooling-side tank 16 can be maintained even when the cooling-side tank 16 is thermally isolated.

[0040] As described above, the cooling side bypass valve 45 operates based on whether the temperature of the heat medium in the cooling side return pipe 26 is within the allowable low temperature range, thereby stabilizing the load on the cooling device 8.

[0041] In one embodiment, a first lower limit and a second lower limit lower than the first lower limit may be set as lower limits of the allowable low temperature range. The operation control unit 35 may gradually (e.g., stepwise or continuously) close the cooling-side bypass valve 45 as the temperature of the heat medium in the cooling-side return pipe 26 decreases from the first lower limit to the second lower limit. That is, when the temperature of the heat medium in the cooling-side return pipe 26 decreases and reaches the first lower limit, the operation control unit 35 begins to close the cooling-side bypass valve 45 and sends a portion of the heat medium flowing through the cooling-side return pipe 26 to the cooling-side tank 16. Then, when the temperature of the heat medium in the cooling-side return pipe 26 further decreases and reaches the second lower limit, the operation control unit 35 fully closes the cooling-side bypass valve 45. As a result, all of the heat medium flowing through the cooling-side return pipe 26 flows into the cooling-side tank 16.

[0042] Fig. 2 is a schematic diagram showing another embodiment of the heat medium supplying device 1. The configuration and operation of this embodiment that are not particularly described are the same as those of the embodiment described with reference to Fig. 1, and therefore redundant description will be omitted. The heat medium supplying device 1 of the embodiment shown in Fig. 2 includes a heating-side bypass pipe 54 and a heating-side bypass valve 55 instead of the cooling-side bypass pipe 44 and the cooling-side bypass valve 45.

[0043] The cooling medium transfer pipe 12 extends from the cooling-side tank 16 to the heating medium mixer 5. The cooling device 8 is attached to the cooling medium transfer pipe 12 and is configured to cool the heating medium flowing through the cooling medium transfer pipe 12. The heating medium transfer pipe 11 extends from the heating device 7 to the heating medium mixer 5. The heating medium supplying device 1 further includes a heating-side outlet pipe 57 that transfers the heating medium from the heating-side tank 15 to the heating device 7. The heating-side outlet pipe 57 extends from the heating-side tank 15 to the heating device 7. The heating-side outlet pipe 57 is located upstream of the heating medium transfer pipe 11.

[0044] The heating device 7 is disposed downstream of the heating-side tank 15. More specifically, the heating device 7 is connected to the heating medium transfer pipe 11 and the heating-side outlet pipe 57. The heating medium supplying device 1 includes a heating-side pump 33 connected to the heating-side outlet pipe 57. When the heating-side pump 33 is operated, the heating medium is sent from the heating-side tank 15 through the heating-side outlet pipe 57 to the heating device 7, and is heated by the heating device 7. The heated heating medium is sent to the heating medium mixer 5 through the heating medium transfer pipe 11, and further sent from the heating medium mixer 5 to the semiconductor manufacturing apparatus 2.

[0045] The heated and cooled heat mediums are mixed in the heat medium mixer 5 to generate a heat medium having a preset temperature. The heat medium at the preset temperature is transferred from the heat medium mixer 5 to the semiconductor manufacturing equipment 2 and heats or cools wafers (not shown) inside the semiconductor manufacturing equipment 2 as it passes through the semiconductor manufacturing equipment 2. The heat medium that has passed through the semiconductor manufacturing equipment 2 is returned to the heat medium mixer 5 and splits into two flows. One of the two flows flows into the cooling-side return pipe 26, and the other flows into the heating-side return pipe 25. The heat medium that has flowed into the cooling-side return pipe 26 flows into the cooling-side tank 16. The heat medium that has flowed into the heating-side return pipe 25 passes through the heating-side return pipe 25 and flows into the heating-side tank 15 or the heating-side outlet pipe 57.

[0046] The heat medium supplying device 1 includes a heating-side temperature measuring device 51 provided in the heating-side return pipe 25, a heating-side bypass pipe 54 that extends from the heating-side return pipe 25 to a heating-side outlet pipe 57, bypassing the heating-side tank 15, and a heating-side bypass valve 55 provided in the heating-side bypass pipe 54. One end of the heating-side bypass pipe 54 is connected to the heating-side return pipe 25, and the other end of the heating-side bypass pipe 54 is connected to the heating-side outlet pipe 57. A connection point B2 between the heating-side bypass pipe 54 and the heating-side outlet pipe 57 is located upstream of the heating-side pump 33. When the heating-side bypass valve 55 is closed, the heat medium flows into the heating-side tank 15 through the heating-side return pipe 25. When the heating-side bypass valve 55 is opened, most of the heat medium flowing through the heating-side return pipe 25 flows into the heating-side bypass pipe 54. The heating-side bypass valve 55 is an actuator-driven valve such as an electric valve.

[0047] The heating-side temperature measuring device 51 is configured to measure the temperature of the heat medium in the heating-side return pipe 25. The heating-side temperature measuring device 51 is electrically connected to the operation control unit 35, and the measured value of the temperature of the heat medium in the heating-side return pipe 25 is sent to the operation control unit 35. The heating-side bypass valve 55 is electrically connected to the operation control unit 35, and the operation of the heating-side bypass valve 55 is controlled by the operation control unit 35.

[0048] The operation control unit 35 is configured to open the heating side bypass valve 55 when the temperature of the heat medium in the heating side return pipe measured by the heating side temperature measuring device 51 is within a predetermined allowable high temperature range, and to close the heating side bypass valve 55 when the temperature of the heat medium in the heating side return pipe 25 measured by the heating side temperature measuring device 51 is outside the allowable high temperature range.

[0049] In one embodiment, the upper limit of the allowable high temperature range is equal to or less than the minimum operable heating capacity of the heating device 7, and the lower limit of the allowable high temperature range is equal to or greater than the rated heating capacity of the heating device 7. The minimum operable heating capacity of the heating device 7 is a heating capacity that is 10% to 20% of the rated heating capacity of the heating device 7. When the load is below this minimum operable heating capacity (light load), the heating device 7 cannot ensure the target temperature (i.e., the load temperature becomes higher than the target temperature). Furthermore, when the load exceeds the rated heating capacity of the heating device 7, the heating device 7 cannot sufficiently heat the heating device 7 and cannot ensure the target temperature (i.e., the load temperature becomes lower than the target temperature). From this perspective, in one embodiment, the upper limit of the allowable high temperature range is equal to or less than the minimum operable heating capacity of the heating device 7, and the lower limit of the allowable high temperature range is equal to or greater than the rated heating capacity of the heating device 7.

[0050] When the temperature of the heat medium in the heating-side return pipe 25 is outside the allowable high temperature range, the heating-side bypass valve 55 is closed, and the heat medium in the heating-side return pipe 25 is transferred into the heating-side tank 15. More specifically, when the temperature of the heat medium in the heating-side return pipe 25 is higher than the upper limit of the allowable high temperature range, the high-temperature heat medium flows into the heating-side tank 15 and is stored therein.

[0051] Even when the temperature of the heat medium in the heating-side return pipe 25 is lower than the lower limit of the allowable high temperature range, the low-temperature heat medium flows into the heating-side tank 15. Because a high-temperature heat medium is already present in the heating-side tank 15, the low-temperature heat medium is mixed with the heat medium in the heating-side tank 15, and the heat medium that has flowed into the heating-side tank 15 and is lower in temperature than the lower limit of the allowable high temperature range is heated. As a result, the temperature of the heat medium that flows from the heating-side tank 15 through the heating-side outlet pipe 57 to the heating device 7 is higher than the temperature of the heat medium in the heating-side return pipe 25, and the load on the heating device 7 can be reduced compared to when the low-temperature heat medium is supplied directly to the heating device 7.

[0052] When the temperature of the heat medium in the heating-side return pipe 25 is within the allowable high temperature range, the load on the heating device 7 is not large. Therefore, the heating-side bypass valve 55 is opened, and most of the heat medium flowing through the heating-side return pipe 25 flows to the heating-side outlet pipe 57, with very little of it flowing into the heating-side tank 15. While the heating-side bypass valve 55 is open, the heating-side tank 15 is thermally isolated. Normally, the temperature inside the heating-side tank 15 is significantly different from the temperature around the heating-side tank 15. Because the entire outer surface of the heating-side tank 15 is covered with insulating material 18, the temperature inside the heating-side tank 15 can be maintained even when the heating-side tank 15 is thermally isolated.

[0053] As described above, the heating side bypass valve 55 operates based on whether the temperature of the heat medium in the heating side return pipe 25 is within the allowable high temperature range, thereby stabilizing the load on the heating device 7.

[0054] In one embodiment, a first upper limit value and a second upper limit value higher than the first upper limit value may be set as upper limits of the allowable high temperature range. The operation control unit 35 may gradually (e.g., stepwise or steplessly) close the heating-side bypass valve 55 as the temperature of the heat medium in the heating-side return pipe 25 increases from the first upper limit value to the second upper limit value. That is, when the temperature of the heat medium in the heating-side return pipe 25 increases and reaches the first upper limit value, the operation control unit 35 begins to close the heating-side bypass valve 55 and sends a portion of the heat medium flowing through the heating-side return pipe 25 to the heating-side tank 15. Then, when the temperature of the heat medium in the heating-side return pipe 25 further increases and reaches the second upper limit value, the operation control unit 35 fully closes the heating-side bypass valve 55. As a result, all of the heat medium flowing through the heating-side return pipe 25 flows into the heating-side tank 15.

[0055] Fig. 3 is a schematic diagram showing yet another embodiment of the heat medium supplying device 1. The embodiment shown in Fig. 3 is a combination of the embodiment described with reference to Fig. 1 and the embodiment described with reference to Fig. 2. That is, the heat medium supplying device 1 of the embodiment shown in Fig. 3 includes a cooling-side bypass pipe 44, a cooling-side bypass valve 45, a heating-side bypass pipe 54, and a heating-side bypass valve 55. The configuration and operation of this embodiment, which are not particularly described, are the same as those of the embodiment described with reference to Figs. 1 and 2, and therefore, redundant description thereof will be omitted.

[0056] The cooling medium transfer pipe 12 extends from the cooling device 8 to the heating medium mixer 5, and the cooling-side outlet pipe 17 extends from the cooling-side tank 16 to the cooling device 8. The heating medium transfer pipe 11 extends from the heating device 7 to the heating medium mixer 5, and the heating-side outlet pipe 57 extends from the heating-side tank 15 to the heating device 7. The heating device 7 is disposed downstream of the heating-side tank 15 and is connected to the heating medium transfer pipe 11 and the heating-side outlet pipe 57. The cooling device 8 is disposed downstream of the cooling-side tank 16 and is connected to the cooling medium transfer pipe 12 and the cooling-side outlet pipe 17.

[0057] The heat transfer medium supply device 1 includes a cooling-side temperature measuring device 41 provided in the cooling-side return pipe 26, a cooling-side bypass pipe 44 that extends from the cooling-side return pipe 26 to the cooling-side outlet pipe 17, bypassing the cooling-side tank 16, a cooling-side bypass valve 45 provided in the cooling-side bypass pipe 44, a heating-side temperature measuring device 51 provided in the heating-side return pipe 25, a heating-side bypass pipe 54 that extends from the heating-side return pipe 25 to the heating-side outlet pipe 57, bypassing the heating-side tank 15, and a heating-side bypass valve 55 provided in the heating-side bypass pipe 54.

[0058] The operation control unit 35 is configured to open the cooling side bypass valve 45 when the temperature of the heat medium in the cooling side return pipe 26 measured by the cooling side temperature measuring device 41 is within a predetermined allowable low temperature range, and to close the cooling side bypass valve 45 when the temperature of the heat medium in the cooling side return pipe 26 measured by the cooling side temperature measuring device 41 is outside the allowable low temperature range.

[0059] Furthermore, the operation control unit 35 is configured to open the heating side bypass valve 55 when the temperature of the heat medium in the heating side return pipe 25 measured by the heating side temperature measuring device 51 is within a predetermined allowable high temperature range, and to close the heating side bypass valve 55 when the temperature of the heat medium in the heating side return pipe 25 measured by the heating side temperature measuring device 51 is outside the allowable high temperature range.

[0060] According to this embodiment, the cooling-side bypass valve 45 operates based on whether the temperature of the heat medium in the cooling-side return pipe 26 is within the allowable low temperature range, and the heating-side bypass valve 55 operates based on whether the temperature of the heat medium in the heating-side return pipe 25 is within the allowable high temperature range. As a result, the loads on the cooling device 8 and the heating device 7 can be stabilized.

[0061] 4 is a schematic diagram showing another embodiment of a semiconductor manufacturing system including a heat medium supplying device 1 and a plurality of semiconductor manufacturing apparatuses 2. The heat medium supplying device 1 is the heat medium supplying device 1 of any of the embodiments described with reference to FIGS. 1 to 3. As shown in FIG. 4, the heat medium supplying device 1 is connected to a plurality of semiconductor manufacturing apparatuses 2 via a plurality of heat medium mixers 5. More specifically, the heating medium transfer pipe 11, the cooling medium transfer pipe 12, the heating side return pipe 25, and the cooling side return pipe 26 of the heat medium supplying device 1 are each connected to a plurality of semiconductor manufacturing apparatuses 2 via a plurality of heat medium mixers 5. The heat medium supplying device 1 of this embodiment can adjust the processing temperatures of the plurality of semiconductor manufacturing apparatuses 2.

[0062] The above-described embodiments have been described for the purpose of enabling a person of ordinary skill in the art to practice the present invention. Various modifications of the above-described embodiments would be obvious to a person skilled in the art, and the technical concept of the present invention may be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is to be interpreted in the broadest scope in accordance with the technical concept defined by the claims.

[0063] The present invention can be used in a heat medium supplying device that supplies a heat medium to semiconductor manufacturing equipment, such as an etching equipment, a CVD equipment, or a PVD equipment, to adjust the temperature of the semiconductor manufacturing equipment.

[0064] REFERENCE SIGNS LIST 1 Heating medium supply device 2 Semiconductor manufacturing device 5 Heating medium mixer 7 Heating device 8 Cooling device 11 Heating medium transfer pipe 12 Cooling medium transfer pipe 15 Heating side tank 16 Cooling side tank 17 Cooling side outlet pipe 18, 19 Heat insulating material 20 Tank connecting pipe 21 Connecting valve 25 Heating side return pipe 26 Cooling side return pipe 31 Heating side liquid level detection device 32 Cooling side liquid level detection device 33 Heating side pump 34 Cooling side pump 35 Operation control unit 41 Cooling side temperature measuring device 44 Cooling side bypass pipe 45 Cooling side bypass valve 51 Heating side temperature measuring device 54 Heating side bypass pipe 55 Heating side bypass valve 57 Heating side outlet pipe

Claims

1. A heat medium supplying device for supplying a heat medium for adjusting a temperature of a semiconductor manufacturing equipment, comprising: a heating device for heating the heat medium; a cooling device for cooling the heat medium; a heating medium transfer pipe for sending the heated heat medium to the semiconductor manufacturing equipment; a cooling medium transfer pipe for sending the cooled heat medium to the semiconductor manufacturing equipment; a heating-side tank and a cooling-side tank for holding the heat medium; a heating-side return pipe for returning the heat medium that has passed through the semiconductor manufacturing equipment to the heating-side tank; a cooling-side return pipe for returning the heat medium that has passed through the semiconductor manufacturing equipment to the cooling-side tank; a cooling-side temperature measuring device provided in the cooling-side return pipe for measuring the temperature of the heat medium in the cooling-side return pipe; a cooling-side outlet pipe for transporting the heat medium from the cooling-side tank to the cooling equipment; a cooling-side bypass pipe extending from the cooling-side return pipe to the cooling-side outlet pipe, bypassing the cooling-side tank; a cooling-side bypass valve provided in the cooling-side bypass pipe; and an operation control unit for controlling the operation of the cooling-side bypass valve, the cooling-side bypass valve is opened when the temperature of the heat medium in the cooling-side return pipe measured by the cooling-side temperature measuring device is within a preset allowable low temperature range, and the cooling-side bypass valve is closed when the temperature of the heat medium in the cooling-side return pipe measured by the cooling-side temperature measuring device is outside the allowable low temperature range.

2. The heat medium supply device according to claim 1, further comprising: a heating side temperature measuring device provided in the heating side return pipe for measuring the temperature of the heat medium in the heating side return pipe; a heating side outlet pipe for transporting the heat medium from the heating side tank to the heating device; a heating side bypass pipe extending from the heating side return pipe to the heating side outlet pipe, bypassing the heating side tank; and a heating side bypass valve provided in the heating side bypass pipe, wherein the operation control unit is configured to open the heating side bypass valve when the temperature of the heat medium in the heating side return pipe measured by the heating side temperature measuring device is within a preset allowable high temperature range, and to close the heating side bypass valve when the temperature of the heat medium in the heating side return pipe measured by the heating side temperature measuring device is outside the allowable high temperature range.

3. The heat medium supply device according to claim 1, wherein the semiconductor manufacturing equipment is a plurality of semiconductor manufacturing equipment, and each of the heating medium transfer pipe, the cooling medium transfer pipe, the heating side return pipe, and the cooling side return pipe is connected to the plurality of semiconductor manufacturing equipment.

4. A heat medium supplying device for supplying a heat medium for adjusting a temperature of a semiconductor manufacturing equipment, comprising: a heating device for heating a heat medium; a cooling device for cooling the heat medium; a heating medium transfer pipe for sending the heated heat medium to the semiconductor manufacturing equipment; a cooling medium transfer pipe for sending the cooled heat medium to the semiconductor manufacturing equipment; a heating-side tank and a cooling-side tank for holding the heat medium; a heating-side return pipe for returning the heat medium that has passed through the semiconductor manufacturing equipment to the heating-side tank; a cooling-side return pipe for returning the heat medium that has passed through the semiconductor manufacturing equipment to the cooling-side tank; a heating-side temperature measuring device provided in the heating-side return pipe for measuring the temperature of the heat medium in the heating-side return pipe; a heating-side outlet pipe for transferring the heat medium from the heating-side tank to the heating equipment; a heating-side bypass pipe extending from the heating-side return pipe to the heating-side outlet pipe, bypassing the heating-side tank; a heating-side bypass valve provided in the heating-side bypass pipe; and an operation control unit for controlling the operation of the cooling-side bypass valve, the heating-side bypass valve is opened when the temperature of the heat medium in the heating-side return pipe measured by the heating-side temperature measuring device is within a preset allowable high temperature range, and the heating-side bypass valve is closed when the temperature of the heat medium in the heating-side return pipe measured by the heating-side temperature measuring device is outside the allowable high temperature range.

5. The heat medium supply device according to claim 4, further comprising: a cooling-side temperature measuring device provided in the cooling-side return pipe for measuring the temperature of the heat medium in the cooling-side return pipe; a cooling-side outlet pipe for transporting the heat medium from the cooling-side tank to the cooling device; a cooling-side bypass pipe extending from the cooling-side return pipe to the cooling-side outlet pipe, bypassing the cooling-side tank; and a cooling-side bypass valve provided in the cooling-side bypass pipe, wherein the operation control unit is configured to open the cooling-side bypass valve when the temperature of the heat medium in the cooling-side return pipe measured by the cooling-side temperature measuring device is within a preset allowable low temperature range, and to close the cooling-side bypass valve when the temperature of the heat medium in the cooling-side return pipe measured by the cooling-side temperature measuring device is outside the allowable low temperature range.

6. The heat medium supply device according to claim 4, wherein the semiconductor manufacturing equipment is a plurality of semiconductor manufacturing equipment, and each of the heating medium transfer pipe, the cooling medium transfer pipe, the heating side return pipe, and the cooling side return pipe is connected to the plurality of semiconductor manufacturing equipment.

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