Base

Abstract

A base (100), applied to a wavelength conversion device. The base (100) comprises a first surface (100a) and a second surface (100b). The first surface (100a) is provided with a plurality of first holes (100a1). The second surface (100b) and the first surface (100a) are located on two opposite sides of the base (100), respectively. The second surface (100b) is provided with a plurality of second holes (100b1). One of the first holes (100a1) is communicated with at least one of the second holes (100b1). The edge of the at least one of the second holes (100b1) extends laterally beyond the edge of one of the first holes (100a1).

Description

base Technical Field

[0001] The present disclosure relates to a base, and more particularly to a base used in a wavelength conversion device. Background Art

[0002] In recent years, optical projectors have been used in a wide range of fields, from consumer products to high-tech devices. Various optical projectors are also widely used in schools, homes, and businesses to amplify the display images provided by the signal source and display them on the projection screen.

[0003] Optical projectors can utilize a solid-state laser to drive fluorescent materials to emit light. This can be achieved by coating the fluorescent material on a disc and rotating it at high speed using a motor. This reduces the amount of laser energy received by the local fluorescent material per unit time, thereby achieving heat dissipation. However, as the brightness requirements for optical projectors continue to increase, the heat dissipation requirements for the fluorescent material are becoming increasingly stringent.

[0004] Therefore, how to achieve a better heat dissipation method for the wheel and the fluorescent material thereon has become one of the important research and development topics.

[0005] Summary of the Invention

[0006] In view of this, an object of the present disclosure is to provide a base that can solve the above-mentioned problems.

[0007] To achieve the above objectives, according to one embodiment of the present disclosure, a base is provided for use with a wavelength conversion device. The base includes a first surface and a second surface. The first surface has a plurality of first holes defined therein. The second surface is located on opposite sides of the first surface. The second surface has a plurality of second holes defined therein. One of the first holes is connected to at least one of the second holes. An edge of the at least one of the second holes laterally extends beyond an edge of the at least one of the first holes.

[0008] In one or more embodiments of the present disclosure, the number of the at least one of the second holes is plural.

[0009] In one or more embodiments of the present disclosure, one of the second holes is connected to at least one of the first holes, and an edge of the at least one first hole laterally extends beyond an edge of the one of the second holes.

[0010] In one or more embodiments of the present disclosure, the number of the at least one first hole is plural.

[0011] In one or more embodiments of the present disclosure, the width of the first hole is substantially equal to the width of the second hole.

[0012] In one or more embodiments of the present disclosure, the first holes are regularly arranged on the first surface, and the second holes are regularly arranged on the second surface.

[0013] In one or more embodiments of the present disclosure, the first holes are arranged on the first surface based on an array, and the second holes are arranged on the second surface based on the aforementioned array.

[0014] In one or more embodiments of the present disclosure, the depth of the first hole and the depth of the second hole are smaller than the thickness of the base.

[0015] In one or more embodiments of the present disclosure, the base further includes a first substrate and a second substrate. The first hole extends through the first substrate. The second hole extends through the second substrate. The first surface is the surface of the first substrate facing away from the second substrate. The second surface is the surface of the second substrate facing away from the first substrate.

[0016] In one or more embodiments of the present disclosure, the base further includes a third substrate. The third substrate is stacked between the first substrate and the second substrate and has a plurality of through holes. The aforementioned one of the first holes is connected to the aforementioned at least one of the second holes via at least one of the through holes.

[0017] In one or more embodiments of the present disclosure, the base further includes a third substrate. The second substrate is stacked between the first substrate and the third substrate. The third substrate has a plurality of through holes. One of the through holes is connected to at least one of the second holes.

[0018] In one or more embodiments of the present disclosure, one of the first holes and one of the through holes are aligned in the stacking direction of the first substrate, the second substrate, and the third substrate.

[0019] In summary, in the disclosed base, the first holes on the first surface and the second holes on the second surface are connected and laterally staggered. Thus, the disclosed base can achieve at least the following advantages: (1) increasing the specific surface area (SSA) of the base, thereby increasing the overall heat dissipation area; (2) reducing the overall weight of the base, thereby reducing the motor load power; and (3) the staggered holes can further increase the structural rigidity of the base, thereby stably increasing the rotational speed and improving the cavity airflow operation.

[0020] The above description is only used to illustrate the problems to be solved by the present disclosure, the technical means to solve the problems, and the effects produced, etc. The specific details of the present disclosure will be described in detail in the following embodiments and related drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] To make the above and other objects, features, advantages and embodiments of the present disclosure more apparent, the accompanying drawings are described as follows:

[0022] FIG1 is a front view showing a base according to an embodiment of the present disclosure;

[0023] FIG2 is a cross-sectional view showing the base in FIG1 at the cutting line 2-2;

[0024] FIG3 is a front view showing a base according to an embodiment of the present disclosure;

[0025] FIG4 is a cross-sectional view showing the base in FIG3 at the cut plane line 4-4;

[0026] FIG5 is a front view showing a base according to an embodiment of the present disclosure;

[0027] FIG6 is a cross-sectional view showing the base in FIG5 at the cutting line 6-6;

[0028] FIG7 is a front view showing a base according to an embodiment of the present disclosure;

[0029] FIG8 is a cross-sectional view showing the base in FIG7 at the cut plane line 8-8;

[0030] FIG9 is a front view showing a conventional base;

[0031] FIG10 is a graph showing light source power-brightness curves of wavelength conversion devices using different embodiments of the disclosed base and a conventional base;

[0032] FIG. 11 is a graph showing light source power-temperature curves of wavelength conversion devices using different embodiments of the disclosed susceptors and a conventional susceptor.

[0033] Explanation of the accompanying drawings: 100, 200, 300, 400, 900: base 100a, 210a, 410a: first surface 100a1, 210a1, 410a1: first hole 100a2: setting area 100b, 220a, 420a: second surface 100b1, 220a1, 420a1: second hole 210, 410: first substrate 220, 420: second substrate 330, 430: third substrate 330a, 430a: through hole A1: first dimension A2: second dimension D1, D2: depth H: axis hole T: thickness DETAILED DESCRIPTION

[0034] The following drawings illustrate various embodiments of the present disclosure. For clarity, many practical details will be included in the following description. However, it should be understood that these practical details are not intended to limit the present disclosure. In other words, these practical details are not essential to some embodiments of the present disclosure. Furthermore, to simplify the drawings, some conventional structures and components are shown in simplified schematic form.

[0035] Please refer to Figures 1 and 2. Figure 1 is a front view of a base 100 according to an embodiment of the present disclosure. Figure 2 is a cross-sectional view of the base 100 at the cut line 2-2 in Figure 1. As shown in Figures 1 and 2, in this embodiment, the base 100 can be applied to a wavelength conversion device (not shown). For example, the wavelength conversion device is a fluorescent wheel used in a projection device (not shown). The projection device may further include a driving unit and a light source. The base 100 has an axial hole H. The driving unit is, for example, a motor, and the rotating shaft of the motor is engaged with the inner edge of the axial hole H. The wavelength conversion device can be driven to rotate by rotating the rotating shaft of the motor. The light source is configured to emit light and form a light spot that is fixedly irradiated on the base 100. In some embodiments, the light source is a solid-state laser light source, but the present disclosure is not limited to this.

[0036] The wavelength conversion device further includes a phosphor layer (not shown). The phosphor layer is disposed on the base 100 and is configured to receive light emitted by the light source. Specifically, the light emitted by the light source can reach the phosphor layer via a specifically designed optical path (for example, a reflector, a spectroscope, etc.) and generate a light spot on the phosphor layer. As shown in Figures 1 and 2, the base 100 includes a first surface 100a. The first surface 100a has a setting area 100a2. The setting area 100a2 substantially extends along an annular path. The phosphor layer is disposed on the setting area 100a2, so the phosphor layer can also be disposed on the base 100 along the annular path. Thus, when the base 100 rotates, the light spot generated by the light source can be continuously irradiated on the phosphor layer.

[0037] As shown in Figures 1 and 2, in this embodiment, a plurality of first holes 100a1 are defined on the first surface 100a of the base 100. The base 100 further includes a second surface 100b. The second surface 100b is located on opposite sides of the base 100 from the first surface 100a. A plurality of second holes 100b1 are defined on the second surface 100b. One of the first holes 100a1 is connected to at least one of the second holes 100b1. The edge of the at least one second hole 100b1 laterally extends beyond the edge of the at least one first hole 100a1. In other words, the first holes 100a1 on the first surface 100a are connected to the second holes 100b1 on the second surface 100b and are laterally offset.

[0038] Through the aforementioned structural configuration, the base 100 of this embodiment can achieve at least the following advantages: (1) the specific surface area (SSA) of the base 100 can be increased, thereby increasing the overall heat dissipation area; (2) the overall weight of the base 100 can be reduced, thereby reducing the motor load power; and (3) the staggered first holes 100a1 and second holes 100b1 can further increase the structural rigidity of the base 100, thereby steadily increasing the rotation speed and improving the cavity airflow operation. It should be noted that the aforementioned specific surface area refers to the total surface area of ​​the base 100 per unit mass.

[0039] In some embodiments, the specific surface area of ​​the base 100 is at least 20% greater than its geometric area, but this disclosure is not limited thereto. The aforementioned geometric area refers to the total area of ​​the base 100 without the first hole 100a1 and the second hole 100b1. The geometric area can be obtained by summing the orthographic projection areas of each surface of the base 100.

[0040] In some embodiments, the overall weight of the base 100 having the first hole 100 a 1 and the second hole 100 b 1 can be reduced by about 5% to about 60%, but the present disclosure is not limited thereto.

[0041] As shown in FIG1 , the aforementioned one of the first holes 100a1 is connected to three second holes 100b1, but the present disclosure is not limited thereto. In practical applications, the number of second holes 100b1 simultaneously connected to the aforementioned one of the first holes 100a1 can be flexibly increased or decreased.

[0042] In practical applications, there are many groups of structures in which one first hole 100 a 1 is connected to a plurality of second holes 100 b 1 , as shown in FIG. 1 and FIG. 2 .

[0043] As shown in FIG2 , in this embodiment, one of the second holes 100b1 is connected to at least one of the first holes 100a1. The edge of the at least one first hole 100a1 laterally extends beyond the edge of the one of the second holes 100b1. For example, the one of the second holes 100b1 may be connected to three first holes 100a1, but this disclosure is not limited to this. In practical applications, the number of first holes 100a1 that are simultaneously connected to the one of the second holes 100b1 can be flexibly increased or decreased.

[0044] In practical applications, there are many groups of structures in which one second hole 100 b 1 is connected to a plurality of first holes 100 a 1 , as shown in FIG. 2 .

[0045] In practical applications, the aforementioned advantages can be made more significant by making each first hole 100a1 communicate with a plurality of second holes 100b1 and laterally staggered, and at the same time making each second hole 100b1 communicate with a plurality of first holes 100a1 and laterally staggered.

[0046] In some embodiments, the width of the first hole 100a1 is substantially equal to the width of the second hole 100b1. For example, the first hole 100a1 and the second hole 100b1 are both circular holes with substantially the same diameter. Thus, the first hole 100a1 and the second hole 100b1 can be manufactured using the same tool, thereby reducing manufacturing costs.

[0047] In some embodiments, the first holes 100a1 are regularly arranged on the first surface 100a. For example, the first holes 100a1 are arranged on the first surface 100a in an array. The array is defined by a first dimension A1 and a second dimension A2. In other words, the first holes 100a1 are arranged along both the first dimension A1 and the second dimension A2.

[0048] In some embodiments, the second holes 100b1 are regularly arranged on the second surface 100b. For example, the second holes 100b1 are also arranged on the second surface 100b based on the aforementioned array. In other words, when viewing the first surface 100a and the second surface 100b from the front, the pattern formed by the first holes 100a1 and the pattern formed by the second holes 100b1 are identical, and the two patterns can be overlapped by rotation. Therefore, the second holes 100b1 on the second surface 100b can be manufactured in the same manner as the first holes 100a1 on the first surface 100a, thereby simplifying manufacturing and reducing manufacturing costs.

[0049] As shown in FIG2 , in this embodiment, the depth D1 of the first hole 100a1 and the depth D2 of the second hole 100b1 are less than the thickness T of the base 100. In actual manufacturing, the first hole 100a1 can be first excavated perpendicularly to the first surface 100a, and the first hole 100a1 does not penetrate the base 100. Next, the second holes 100b1 can be excavated perpendicularly to the second surface 100b, and each first hole 100a1 is connected to at least one second hole 100b1, and / or each second hole 100b1 is connected to at least one first hole 100a1, thereby completing the fabrication of the base 100. In other words, the first hole 100a1 and the second hole 100b1 are laterally offset and do not overlap in a direction perpendicular to the first surface 100a or the second surface 100b. This provides the aforementioned advantages compared to a design where a single hole penetrates directly.

[0050] In some embodiments, the thickness T of the base 100 is in a range from about 0.5 mm to about 50 mm, but the present disclosure is not limited thereto.

[0051] In some embodiments, the porosity of the base 100 is in a range from about 5% to about 75%, but the present disclosure is not limited thereto.

[0052] In some embodiments, the reflective opaque base 100 comprises a metal material, such as Al, Ag, Cu, Fe, Mo, or any combination thereof, but the present disclosure is not limited thereto.

[0053] In some embodiments, the reflective opaque base 100 comprises a ceramic material, such as AlN, BN, SiC, Al 2 O 3 , etc., but the present disclosure is not limited thereto.

[0054] In some embodiments, the reflective, opaque base 100 comprises a semiconductor material. Examples of the semiconductor material include single-element semiconductor materials (e.g., Si, Ge), binary semiconductor materials (e.g., GaAs, InP, GaN, InAs, ZnSe, ZnS, InSe, etc.), or other multi-element compound semiconductor materials, but the present disclosure is not limited thereto.

[0055] In some embodiments, the material of the translucent base 100 includes glass, quartz, sapphire, or CaF 2 , but the present disclosure is not limited thereto.

[0056] Please refer to Figures 3 and 4. Figure 3 is a front view of a base 200 according to one embodiment of the present disclosure. Figure 4 is a cross-sectional view of the base 200 in Figure 3 taken along the cut plane line 4-4. As shown in Figures 3 and 4, in this embodiment, the base 200 includes a first substrate 210 and a second substrate 220. The first substrate 210 has a first surface 210a distal from the second substrate 220 and a first hole 210a1 extending through the first substrate 210. The second substrate 220 has a second surface 220a distal from the first substrate 210 and a second hole 220a1 extending through the second substrate 220. One of the first holes 210a1 is connected to at least one of the second holes 220a1. The edge of the at least one of the second holes 220a1 laterally extends beyond the edge of the at least one of the first holes 210a1. In other words, the first hole 210a1 on the first surface 210a is connected to the second hole 220a1 on the second surface 220a and is laterally offset. With such a structural configuration, the base 200 of this embodiment can also achieve at least the aforementioned advantages.

[0057] 3 , the aforementioned one of the first holes 210a1 is connected to three second holes 220a1 , but the present disclosure is not limited thereto. In practical applications, the number of second holes 220a1 simultaneously connected to the aforementioned one of the first holes 210a1 can be flexibly increased or decreased.

[0058] In practical applications, there are many groups of structures in which one first hole 210 a 1 is connected to a plurality of second holes 220 a 1 , as shown in FIG. 3 and FIG. 4 .

[0059] As shown in FIG4 , in this embodiment, one of the second holes 220a1 is connected to at least one of the first holes 210a1. The edge of the at least one first hole 210a1 laterally extends beyond the edge of the one of the second holes 220a1. For example, the one of the second holes 220a1 may be connected to three of the first holes 210a1, but this disclosure is not limited thereto. In practical applications, the number of first holes 210a1 that are simultaneously connected to the one of the second holes 220a1 can be flexibly increased or decreased.

[0060] In practical applications, there are many groups of structures in which one second hole 220 a 1 is connected to a plurality of first holes 210 a 1 , as shown in FIG. 4 .

[0061] In practical applications, the aforementioned advantages can be made more significant by making each first hole 210a1 communicate with a plurality of second holes 220a1 and laterally staggered, and at the same time making each second hole 220a1 communicate with a plurality of first holes 210a1 and laterally staggered.

[0062] In some embodiments, the width of the first hole 210a1 is substantially equal to the width of the second hole 220a1. For example, the first hole 210a1 and the second hole 220a1 are both circular holes with substantially the same diameter. Thus, the first hole 210a1 and the second hole 220a1 can be manufactured using the same tool, thereby reducing manufacturing costs.

[0063] In some embodiments, the first holes 210a1 are regularly arranged on the first surface 210a. For example, the first holes 210a1 are arranged on the first surface 210a in an array. The array is defined by a first dimension A1 and a second dimension A2. In other words, the first holes 210a1 are arranged along both the first dimension A1 and the second dimension A2.

[0064] In some embodiments, the second holes 220a1 are regularly arranged on the second surface 220a. For example, the second holes 220a1 are also arranged on the second surface 220a based on the aforementioned array. In other words, when viewing the first surface 210a and the second surface 220a from the front, the pattern formed by the first holes 210a1 and the pattern formed by the second holes 220a1 are identical, and the two patterns can be overlapped by rotation. Therefore, the second holes 220a1 on the second surface 220a can be manufactured in the same manner as the first holes 210a1 on the first surface 210a, thereby simplifying manufacturing and reducing manufacturing costs.

[0065] During the actual manufacturing process, first holes 210a1 can be bored through the first substrate 210, and second holes 220a1 can be bored through the second substrate 220. Then, the first substrate 210 and the second substrate 220 are superimposed so that each first hole 210a1 is connected to at least one second hole 220a1, and / or each second hole 220a1 is connected to at least one first hole 210a1, thereby completing the manufacturing of the base 200.

[0066] Please refer to Figures 5 and 6. Figure 5 is a front view of a base 300 according to an embodiment of the present disclosure. Figure 6 is a cross-sectional view of the base 300 in Figure 5 taken along the cut line 6-6. As shown in Figures 5 and 6, in this embodiment, the base 300 includes a first substrate 210, a second substrate 220, and a third substrate 330. The first substrate 210 and the second substrate 220 are the same as those in the embodiment shown in Figure 3, so reference may be made to the above-mentioned relevant descriptions and will not be repeated here. Specifically, in this embodiment, the third substrate 330 is superimposed between the first substrate 210 and the second substrate 220 and has a plurality of through holes 330a. One of the first holes 210a1 is connected to at least one of the second holes 220a1 via at least one of the through holes 330a. With such a structural configuration, the base 300 of this embodiment can also achieve at least the aforementioned advantages.

[0067] As shown in Figures 5 and 6, the edge of at least one of the through holes 330a laterally extends beyond the edge of the first holes 210a1. In other words, the first holes 210a1 of the first substrate 210 are connected to the through holes 330a of the third substrate 330 and are laterally offset. This further enhances the aforementioned advantages.

[0068] As shown in FIG5 , the aforementioned one of the first holes 210a1 is connected to three through holes 330a, but the present disclosure is not limited thereto. In practical applications, the number of through holes 330a that are simultaneously connected to the aforementioned one of the first holes 210a1 can be flexibly increased or decreased.

[0069] In practical applications, there are many groups of structures in which one first hole 210 a 1 is connected to multiple through holes 330 a , as shown in FIG. 5 .

[0070] In some embodiments, one of the second holes 220a1 communicates with at least one of the through-holes 330a. The edge of the at least one through-hole 330a laterally extends beyond the edge of the one of the second holes 220a1. For example, the one of the second holes 220a1 may communicate with three through-holes 330a, but the present disclosure is not limited to this. In other words, the second hole 220a1 of the second substrate 220 communicates with the through-hole 330a of the third substrate 330 and is laterally offset. This further enhances the aforementioned advantages.

[0071] In practical applications, the number of through holes 330 a communicating with the aforementioned one of the second holes 220 a 1 can be flexibly increased or decreased.

[0072] During the actual manufacturing process, first holes 210a1 can be bored through the first substrate 210, second holes 220a1 can be bored through the second substrate 220, and through holes 330a can be bored through the third substrate 330. The third substrate 330 is then stacked between the first and second substrates 210, 220, such that each first hole 210a1 is connected to at least one second hole 220a1 via at least one through hole 330a, and / or each second hole 220a1 is connected to at least one first hole 210a1 via at least one through hole 330a. This completes the manufacturing of the base 300.

[0073] Please refer to Figures 7 and 8. Figure 7 is a front view of a base 400 according to an embodiment of the present disclosure. Figure 8 is a cross-sectional view of the base 400 in Figure 7 taken along the cut plane line 8-8. As shown in Figures 7 and 8, in this embodiment, the base 400 includes a first substrate 410, a second substrate 420, and a third substrate 430. The first substrate 410 has a first surface 410a distal from the second substrate 420 and a first hole 410a1 extending through the first substrate 410. The second substrate 420 has a second surface 420a distal from the first substrate 410 and a second hole 420a1 extending through the second substrate 420. The first substrate 410 and the second substrate 420 are similar to the first substrate 210 and the second substrate 220 in the embodiment shown in Figure 3. Therefore, reference may be made to the above related description and will not be repeated here. A difference between the combination of the first substrate 410 and the second substrate 420 of this embodiment and that of the embodiment shown in FIG. 3 is that one of the first holes 410 a 1 of this embodiment is connected to four second holes 420 a 1 , but the present disclosure is not limited thereto.

[0074] As shown in Figure 8, in this embodiment, the second substrate 420 is stacked between the first substrate 410 and the third substrate 430. The third substrate 430 has multiple through-holes 430a. One of the through-holes 430a is connected to at least one of the second holes 420a1. The edge of the at least one second hole 420a1 laterally extends beyond the edge of the at least one through-hole 430a. In other words, the through-hole 430a of the third substrate 430 is connected to the second hole 420a1 of the second substrate 420 and is laterally offset. This further enhances the aforementioned advantages.

[0075] In practical applications, the aforementioned one of the through holes 430 a is communicated with the plurality of second holes 420 a 1 , and the number of the second holes 420 a 1 communicated with the aforementioned one of the through holes 430 a can be flexibly increased or decreased.

[0076] In practical applications, there are many groups of structures in which one through hole 430 a connects to a plurality of second holes 420 a 1 , as shown in FIG. 8 .

[0077] In one embodiment, one of the first holes 410a1 and one of the through holes 430a are aligned in the stacking direction of the first substrate 410, the second substrate 420, and the third substrate 430. For example, as shown in Figures 7 and 8, all of the first holes 410a1 and all of the through holes 430a overlap in the stacking direction of the first substrate 410, the second substrate 420, and the third substrate 430.

[0078] During the actual manufacturing process, a first hole 410a1 is bored through the first substrate 410, a second hole 420a1 is bored through the second substrate 420, and a through hole 430a is bored through the third substrate 430. The second substrate 420 is then stacked between the first and third substrates 410, 430, such that each first hole 410a1 is connected to a through hole 430a via at least one second hole 420a1. This completes the manufacturing of the base 400.

[0079] Please refer to Figures 9 to 11. Figure 9 is a front view of an existing base 900. Figure 10 is a light source power-brightness curve diagram of a wavelength conversion device using different embodiments of the base disclosed herein and the existing base 900. Figure 11 is a light source power-temperature curve diagram of a wavelength conversion device using different embodiments of the base disclosed herein and the existing base 900. As shown in Figure 9, the existing base 900 has a plurality of arrow-shaped holes. In order to compare with this existing wavelength conversion device, Figures 10 and 11 are used to conduct actual tests using Example E1 using the base 100 shown in Figure 1 and Example E2 using the base 200 shown in Figure 3. In addition, the curves in Figures 10 and 11 are measured under the same rotational speed conditions for the existing wavelength conversion device and Examples E1 and E2.

[0080] As clearly shown in Figure 10 , for Examples E1 and E2, the brightness (i.e., luminous efficiency) of the phosphor layer does not deteriorate dramatically with increasing light source power (i.e., there is no thermal degradation). Therefore, for projection devices using Examples E1 and E2, at a maximum light source power of 396W, the brightness is significantly improved by approximately 5% compared to conventional wavelength conversion devices. Furthermore, as clearly shown in Figure 11 , the temperature measured at the light spot of Examples E1 and E2 is at least 40°C lower than that of conventional wavelength conversion devices. This effectively prevents thermal degradation of the phosphor layer due to high temperatures.

[0081] From the above detailed description of the specific embodiments of the present disclosure, it can be clearly seen that in the base of the present disclosure, the first holes on the first surface and the second holes on the second surface are connected and laterally staggered. As a result, the base of the present disclosure can achieve at least the following advantages: (1) the base's specific surface area can be increased, thereby increasing the overall heat dissipation area; (2) the base's overall weight can be reduced, thereby reducing the motor load power; and (3) the staggered holes can further increase the base's structural rigidity, thereby stably increasing the rotational speed and improving the cavity airflow operation.

[0082] Although the present disclosure has been disclosed in the above embodiments, it is not intended to limit the present disclosure. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be determined by the scope of the appended claims.

Claims

1. A base, applied to a wavelength conversion device, the base comprising: A first surface, on which a plurality of first holes are formed; and A second surface, located on opposite sides of the base from the first surface, on which a plurality of second holes are formed, wherein one of the plurality of first holes communicates with at least one of the plurality of second holes, and an edge of at least one of the plurality of second holes laterally extends beyond an edge of one of the plurality of first holes.

2. The base according to claim 1, wherein the number of at least one of the plurality of second holes is plural.

3. The base according to claim 1, wherein one of the plurality of second holes communicates with at least one of the plurality of first holes, and an edge of at least one of the plurality of first holes laterally extends beyond an edge of one of the plurality of second holes.

4. The base according to claim 3, wherein the number of at least one of the plurality of first holes is plural.

5. The base according to claim 1, wherein widths of the plurality of first holes are substantially equal to widths of the plurality of second holes.

6. The base according to claim 1, wherein the plurality of first holes are regularly arranged on the first surface, and the plurality of second holes are regularly arranged on the second surface.

7. The base according to claim 6, wherein the plurality of first holes are arranged on the first surface based on an array, and the plurality of second holes are arranged on the second surface based on the array.

8. The base according to claim 1, wherein depths of the plurality of first holes and the plurality of second holes are less than a thickness of the base.

9. The base according to claim 1, further comprising: A first substrate, wherein the plurality of first holes penetrate through the first substrate; and A second substrate, wherein the plurality of second holes penetrate through the second substrate, wherein the first surface is a surface of the first substrate away from the second substrate, and the second surface is a surface of the second substrate away from the first substrate.

10. The base according to claim 9, further comprising a third substrate, the third substrate being stacked between the first substrate and the second substrate and having a plurality of through holes, and one of the plurality of first holes communicates with at least one of the plurality of second holes via at least one of the plurality of through holes.

11. The base according to claim 9, further comprising a third substrate, the second substrate being stacked between the first substrate and the third substrate, the third substrate having a plurality of through holes, and one of the plurality of through holes communicates with at least one of the plurality of second holes.

12. The base according to claim 11, wherein one of the plurality of first holes is aligned with one of the plurality of through holes in a stacking direction of the first substrate, the second substrate and the third substrate.

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