Optical module and light receiving component

Abstract

An optical module (200) and a light receiving component (500). The light receiving component (500) comprises: a base plate (510), a light receiving chip array (520) and a receiving assembly (530). The light receiving chip array (520) is located on one side of the base plate (510), and the receiving assembly (530) is located above the base plate (510). The light receiving assembly (530) comprises: a substrate (531), a deflecting prism (532), a light splitting device (533) and a lens assembly (534). Signal light is incident to the deflecting prism (532) after passing through the light splitting device (533), is deflected by the deflecting prism (532) and then is incident to the lens assembly (534), and is converged to the light receiving chip array (520) by the lens assembly (534). The lens assembly (534) is located inside the substrate (531), an upper surface of the lens assembly (534) is lower than an upper surface of the substrate (531), and a lower surface of the lens assembly (534) is higher than a lower surface of the substrate (531) such that damage to the lens assembly (534) by an external structure can be avoided. An upper surface of the base plate (510) is higher than an upper surface of the light receiving chip array (520), such that the light receiving chip array (520) does not make contact with the light receiving assembly (530), thereby avoiding damage to the light receiving chip array (520). The convergence of the signal light is achieved by means of a group of lenses, which is conducive to reducing the size of the assembly. The deflecting prism (532) is separated from the light splitting device (533) such that the three-dimensional position of the deflecting prism (532) can be adjusted, and the optical coupling efficiency is improved.

Description

Optical modules and optical receiving components

[0001] This application claims the priority of application number 202421462815.7 filed with the China Patent Office on June 25, 2024; the priority of application number 202421670577.9 filed with the China Patent Office on July 15, 2024; the priority of application number 202421655775.8 filed with the China Patent Office on July 12, 2024; and the priority of application number 202323147129.9 filed with the China Patent Office on November 21, 2023; all of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module and an optical receiving component. Background Art

[0003] With the development of new services and application models such as cloud computing, mobile Internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are one of the key components in optical communication equipment, and with the demand for development of optical communication technology, the transmission rate of optical modules continues to increase.

[0004] Summary of the Invention

[0005] An embodiment of the present disclosure provides an optical module, including:

[0006] circuit boards;

[0007] A light receiving component is located above the circuit board, and the light receiving component includes:

[0008] pad;

[0009] a light receiving chip array, located on one side of the pad and on the circuit board;

[0010] A receiving assembly is located above the pad, and the receiving assembly includes:

[0011] a base plate, located above the pad;

[0012] a turning prism, located above the substrate,

[0013] A spectrometer is located above the substrate, and the signal light is incident on the turning prism after passing through the spectrometer;

[0014] A lens assembly is disposed in the substrate and is located below the turning prism, and the lens assembly cover is disposed above the light receiving chip array; the signal light is incident on the lens assembly after being turned by the turning prism, and is then converged by the lens assembly to the light receiving chip array;

[0015] A light emitting component is provided at the notch of the circuit board, and the light emitting component includes:

[0016] A launch shell, wherein a side wall at one end of the launch shell is provided with a first opening, and an electrical connector is provided at the first opening;

[0017] A laser is located inside the transmitting shell;

[0018] Wherein, the electrical connector includes:

[0019] a first connecting portion, wherein a first end of the first connecting portion is located inside the launching shell, and a second end of the first connecting portion is located outside the launching shell;

[0020] a second connecting portion, located above the first connecting portion, wherein the first end of the first connecting portion is flush with the first end of the second connecting portion; and the second end of the first connecting portion protrudes from the first end of the second connecting portion;

[0021] A ground layer is provided on the upper surface of the first connecting portion, and the ground layer covers the first connecting portion;

[0022] The second connecting portion includes:

[0023] a ground pin, located on an upper surface of the second connecting portion and electrically connected to the laser;

[0024] A ground via, one end of the ground via is connected to the ground pin, and the other end is connected to the ground layer.

[0025] An embodiment of the present disclosure provides a light receiving component, including:

[0026] pad;

[0027] A light receiving chip array is located on one side of the pad;

[0028] A receiving assembly is located above the pad, and the receiving assembly includes:

[0029] a base plate, located above the pad;

[0030] a turning prism, located above the substrate,

[0031] A spectrometer is located above the substrate, and the signal light is incident on the turning prism after passing through the spectrometer;

[0032] A lens assembly is located below the turning prism, and the lens assembly is covered above the light receiving chip array; the signal light is incident on the lens assembly after being turned by the turning prism, and is then focused by the lens assembly onto the light receiving chip array;

[0033] The lens assembly is located inside the substrate, the upper surface of the lens assembly is lower than the upper surface of the substrate, and the lower surface of the lens assembly is higher than the lower surface of the substrate;

[0034] The turning prism is arranged separately from the light splitting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0036] FIG1 is a partial architecture diagram of an optical communication system according to some embodiments of the present disclosure;

[0037] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0038] FIG3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0039] FIG4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0040] FIG5 is a schematic diagram of the structure of a light receiving component, a light emitting component and a circuit board according to some embodiments of the present disclosure;

[0041] FIG6 is a schematic structural diagram of a light receiving component provided according to some embodiments of the present disclosure;

[0042] FIG7 is a schematic structural diagram of a light receiving assembly according to some embodiments of the present disclosure;

[0043] FIG8 is a schematic diagram of an optical path of a light receiving component according to some embodiments of the present disclosure;

[0044] FIG9 is a first schematic diagram of a cross-sectional structure of a light receiving component and a circuit board according to some embodiments of the present disclosure;

[0045] FIG10 is a second schematic diagram of a cross-sectional structure of a light receiving component and a circuit board according to some embodiments of the present disclosure;

[0046] FIG11 is a schematic diagram of a structure of a light emitting component and a circuit board according to some embodiments of the present disclosure;

[0047] FIG12 is a partial schematic diagram of a light emitting component and a circuit board according to some embodiments of the present disclosure;

[0048] FIG13 is an exploded schematic diagram of a light emitting component and a circuit board according to some embodiments of the present disclosure;

[0049] FIG14 is an exploded schematic diagram of a light emitting component according to some embodiments of the present disclosure;

[0050] FIG15 is a schematic structural diagram of an electrical connector according to some embodiments of the present disclosure;

[0051] FIG16 is a partial cross-sectional diagram of a light emitting component and a circuit board according to some embodiments of the present disclosure;

[0052] FIG17 is a second cross-sectional diagram of a connection between a light emitting component and a circuit board according to some embodiments of the present disclosure;

[0053] FIG18 is a schematic diagram of a light emitting component, a light receiving component, and a circuit board according to some embodiments of the present disclosure;

[0054] FIG19 is an exploded schematic diagram of a light emitting component, a light receiving component, and a circuit board according to some embodiments of the present disclosure;

[0055] FIG20 is a schematic structural diagram of a light emitting component according to some embodiments of the present disclosure;

[0056] FIG21 is a first exploded schematic diagram of a light emitting component according to some embodiments of the present disclosure;

[0057] FIG22 is a second exploded schematic diagram of a light emitting component according to some embodiments of the present disclosure;

[0058] FIG23 is a schematic structural diagram of an electrical connector according to some embodiments of the present disclosure;

[0059] FIG24 is a cross-sectional schematic diagram of a light emitting component provided according to some embodiments of the present disclosure;

[0060] FIG25 is a schematic diagram of a semiconductor cooler according to some embodiments of the present disclosure;

[0061] FIG26 is a schematic diagram of an optical path of a light emitting assembly according to some embodiments of the present disclosure;

[0062] FIG27 is a structural diagram of a circuit board, a light emitting component, and a light receiving component according to some embodiments of the present disclosure;

[0063] FIG28 is a structural diagram of a circuit board and a light emitting component according to some embodiments of the present disclosure;

[0064] FIG29 is a structural diagram of a light emitting component according to some embodiments of the present disclosure;

[0065] FIG30 is an exploded view of a light emitting component according to some embodiments of the present disclosure;

[0066] FIG31 is an exploded view of another light emitting component according to some embodiments of the present disclosure;

[0067] FIG32 is a structural diagram of an emission substrate provided according to some embodiments of the present disclosure;

[0068] FIG33 is a structural diagram of another emission substrate provided according to some embodiments of the present disclosure;

[0069] FIG34 is a cross-sectional view of a circuit board and a light emitting component according to some embodiments of the present disclosure;

[0070] FIG35 is a structural diagram of an optical fiber assembly according to some embodiments of the present disclosure;

[0071] FIG36 is an exploded view of an optical fiber assembly according to some embodiments of the present disclosure;

[0072] FIG37 is a structural diagram of a cover layer provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0073] Optical communication technology enables information transmission between information processing devices. It loads information onto light and uses the propagation of light to achieve this transmission. Light loaded with information is an optical signal. The propagation of optical signals within information transmission equipment reduces optical power loss, enabling high-speed, long-distance, and low-cost information transmission. The information processed by information processing equipment exists in the form of electrical signals. Optical network terminals / gateways, routers, switches, mobile phones, computers, servers, tablets, and televisions are common information processing devices, and optical fibers and optical waveguides are common information transmission devices.

[0074] The conversion of optical signals and electrical signals between information processing equipment and information transmission equipment is achieved through optical modules. For example, an optical fiber is connected to the optical signal input end and / or optical signal output end of the optical module, and an optical network terminal is connected to the electrical signal input end and / or electrical signal output end of the optical module. A first optical signal from the optical fiber is transmitted into the optical module, and the optical module converts the first optical signal into a first electrical signal, which is then transmitted into the optical network terminal. A second electrical signal from the optical network terminal is transmitted into the optical module, and the optical module converts the second electrical signal into a second optical signal, which is then transmitted into the optical fiber. Since information processing devices can be connected to each other through an electrical signal network, at least one type of information processing device needs to be directly connected to the optical module, and not all types of information processing devices need to be directly connected to the optical module. The information processing device directly connected to the optical module is called the host computer of the optical module.

[0075] Figure 1 is a partial architecture diagram of an optical communication system according to some embodiments of the present disclosure. As shown in Figure 1, the optical communication system partially comprises a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0076] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end connects to the optical interface of optical module 200. Optical signals can undergo total internal reflection within optical fiber 101, maintaining nearly their original optical power as they propagate in the direction of total internal reflection. Multiple total internal reflections within optical fiber 101 transmit optical signals from the direction of remote information processing device 1000 into optical module 200, or transmit light from optical module 200 toward remote information processing device 1000, enabling long-distance, low-power information transmission.

[0077] The number of optical fibers 101 may be one or more (two or more); the optical fiber 101 and the optical module 200 may be connected in a pluggable movable manner or in a fixed manner.

[0078] The host computer 100 has an optical module interface 102, which is configured to connect to the optical module 200, so that the host computer 100 establishes a unidirectional / bidirectional electrical signal connection with the optical module 200; the host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor and control the working status of the optical module 200.

[0079] The host computer 100 has an external electrical interface, such as a Universal Serial Bus (USB) interface and a network cable interface 104, which can be connected to an electrical signal network. For example, the network cable interface 104 is configured to connect to a network cable 103, thereby establishing a unidirectional / bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0080] Optical Network Unit (ONU), Optical Line Terminal (OLT), Optical Network Equipment (ONT) and data center servers are common host computers.

[0081] One end of the network cable 103 is connected to the local information processing device 2000 , and the other end is connected to the host computer 100 . The network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100 .

[0082] For example, the third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted into the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal. The optical module 200 transmits the second optical signal into the optical fiber 101. The second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

[0083] For example, a first optical signal from the direction of the remote information processing device 1000 propagates through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted into the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal into the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal, and the host computer 100 transmits the fourth electrical signal to the local information processing device 2000.

[0084] Optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information remains unchanged, but the encoding and decoding methods of the information can change.

[0085] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly illustrate the connection relationship between the optical module 200 and the host computer 100, FIG2 only shows the structure of the host computer 100 related to the optical module 200. As shown in FIG2, the host computer 100 also includes a PCB circuit board 105 disposed within the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector (not shown) disposed inside the cage 106. The heat sink 107 has a raised structure that increases the heat dissipation area. A fin-like structure is a common raised structure.

[0086] Optical module 200 is inserted into cage 106 of host computer 100. Cage 106 secures optical module 200, and heat generated by optical module 200 is transferred to cage 106 and then dissipated through heat sink 107. After optical module 200 is inserted into cage 106, the electrical interface of optical module 200 connects to the electrical connector inside cage 106.

[0087] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, and Figure 4 is an exploded view of an optical module provided according to some embodiments of the present disclosure. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, a light emitting component 400, and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes either the light emitting component 400 or the light receiving component 500.

[0088] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square.

[0089] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0090] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0091] The direction of the line connecting the two openings 204 and 205 can be consistent with the length of the optical module 200, or it can be inconsistent with the length of the optical module 200. For example, opening 204 is located at the end of the optical module 200 (the right end in Figure 3), and opening 205 is also located at the end of the optical module 200 (the left end in Figure 3). Alternatively, opening 204 is located at the end of the optical module 200, while opening 205 is located on the side of the optical module 200. Opening 204 is an electrical interface, from which the gold fingers of the circuit board 300 extend and are inserted into the electrical connector of the host computer; opening 205 is an optical port, configured to receive the optical fiber 101, so that the optical fiber 101 can connect to the optical emitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0092] The combined assembly of the upper and lower housings 201 and 202 facilitates the installation of components such as the circuit board 300, light emitting component 400, and light receiving component 500 within the housings. These components are encapsulated and protected by the upper and lower housings 201 and 202. Furthermore, during assembly of the circuit board 300, light emitting component 400, and light receiving component 500, positioning components, heat dissipation components, and electromagnetic shielding components are easily positioned, facilitating automated production.

[0093] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0094] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0095] For example, the unlocking member 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes engaging components that mate with the cage 106 of the host computer. When the optical module 200 is inserted into the cage 106, the engaging components of the unlocking member 600 secure the optical module 200 within the cage 106. When the unlocking member 600 is pulled, the engaging components of the unlocking member 600 move accordingly, thereby changing the connection between the engaging components and the host computer, thereby releasing the fixed engagement between the optical module 200 and the host computer, allowing the optical module 200 to be removed from the cage 106.

[0096] The circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include microcontrollers.

[0097] (Microcontroller Unit, MCU), laser driver chip, transimpedance amplifier (Transimpedance Amplifier, TIA), limiting amplifier (Limiting amplifier), clock and data recovery chip (Clock and Data Recovery, CDR), power management chip, digital signal processing (Digital Signal Processing, DSP) chip.

[0098] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board is also easy to insert into the electrical connector in the upper computer cage.

[0099] The circuit board 300 also includes gold fingers formed on its end surfaces. The gold fingers are composed of multiple independent pins. The circuit board 300 is inserted into the cage 106, and the gold fingers are electrically connected to the electrical connector inside the cage 106. The gold fingers can be provided only on one side of the circuit board 300 (such as the top surface shown in FIG4 ), or they can be provided on both the top and bottom surfaces of the circuit board 300 to provide more pins. The gold fingers are configured to establish an electrical connection with the host computer to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc.

[0100] Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0101] The light emitting component 400 and / or the light receiving component 500 are located on the side of the circuit board 300 away from the gold finger; in some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors; in some embodiments, the light emitting component and / or the light receiving component can be directly set on the circuit board 300, can be set on the surface of the circuit board, and can also be set on the side of the circuit board.

[0102] FIG5 is a schematic diagram of a structure of a light receiving component, a light emitting component, and a circuit board according to some embodiments of the present disclosure. As shown in FIG5 , in some embodiments, the light emitting component 400 may be located on the side of the circuit board 300. For example, the light emitting component 400 may be placed in a notch provided in the circuit board 300, but this is not a specific limitation. The light receiving component 500 may be located on the surface of the circuit board 300. The light receiving component 500 may be located on the side of the circuit board 300. As shown in FIG5 , the light receiving component 500 is located on the surface of the circuit board 300.

[0103] FIG6 is a schematic diagram of the structure of a light receiving component according to some embodiments of the present disclosure. As shown in FIG6 , the light receiving component 500 may include a backing plate 510 . The light receiving component 500 may include a light receiving chip array 520 . The light receiving chip array 520 is located on one side of the backing plate 510 .

[0104] In some embodiments, the upper surface of the light receiving chip array 520 is lower than the upper surface of the pad 510. In some embodiments, the light receiving chip array 520 includes a plurality of light receiving chips arranged in parallel.

[0105] The optical receiving component 500 includes a receiving assembly 530. The receiving assembly 530 can be used to convert the receiving signal light from a direction parallel to the circuit board to a direction toward the optical receiving chip array 520, so that the optical receiving chip array 520 can receive the receiving signal light and convert the optical signal into an electrical signal.

[0106] FIG7 is a schematic diagram of the structure of a light receiving assembly according to some embodiments of the present disclosure. As shown in FIG7 , in some embodiments, the receiving assembly 530 may include a substrate 531. The substrate 531 may be located above the backing plate 510. Part of the substrate 531 protrudes from the outside of the backing plate 510.

[0107] In some embodiments, the surface area of ​​the substrate 531 is larger than that of the pad 510, so that a portion of the substrate 531 protrudes outside the pad 510. The light receiving chip array 520 is located below the substrate 531. The light receiving chip array 520 is located within the projection range of the substrate 531.

[0108] In some embodiments, the receiving assembly 530 includes a lens assembly 534. The lens assembly 534 is disposed above the light receiving chip array 520. The lens assembly 534 can be used to achieve convergence of signal light.

[0109] In some embodiments, the lens assembly 534 is disposed within the substrate 531. Specifically, the lens assembly 534 may be integral with the substrate 531. Alternatively, the lens assembly 534 may be separate from the substrate 531.

[0110] The upper surface of the lens assembly 534 is lower than the upper surface of the substrate 531 , which can prevent external structures from contacting the lens assembly 534 and reduce damage to the lens assembly 534 .

[0111] The lower surface of the lens assembly 534 is higher than the lower surface of the substrate 531 , which can prevent external structures from contacting the lens assembly 534 and reduce damage to the lens assembly 534 .

[0112] The lens assembly 534 and the substrate are integrated into one design, and the photosensitive surface of the light receiving chip can be captured by the CCD, thereby achieving high-precision coaxial mounting of the lens assembly 534 and the light receiving chip, thereby improving optical tolerance and coupling efficiency.

[0113] In some embodiments, the substrate 531 may be provided with a glue reservoir. The glue reservoir may be located on the upper surface of the substrate 531, and the lens assembly 534 may be disposed within the glue reservoir. The glue reservoir may be used to fill the optical glue and reduce overflow of the optical glue.

[0114] The substrate 531 is made of a transparent material so that the received signal light can pass through the substrate 531 .

[0115] In some embodiments, the receiving assembly 530 includes a turning prism 532 . The turning prism 532 is located above the lens assembly 534 . The projection of the turning prism 532 covers the lens assembly 534 , so that the signal light redirected by the turning prism enters the lens assembly 534 .

[0116] In some embodiments, the projection of the substrate 531 may cover the turning prism 532. That is, the edge of the substrate 531 may protrude beyond the edge of the turning prism 532, thereby protecting the turning prism 532 from damage during installation. In some embodiments, one edge of the turning prism 532 may be flush with the edge of the substrate 531.

[0117] The projection of the substrate covers the turning prism, the projection of the substrate covers the lens assembly, and the projection of the substrate covers the light receiving chip array.

[0118] In some embodiments, the receiving component 530 includes a light splitter 533. The light splitter 533 is located above the substrate 531. The light splitter 533 can be used to split the received signal light from one beam into multiple beams. For example, the light splitter 533 can be an AWG chip.

[0119] In some embodiments, the receiving assembly 530 includes a first gasket 5351. The first gasket 5351 can be disposed between the substrate 531 and the spectrometer 533. The first gasket 5351 can be used to adjust the position of the spectrometer 533 to improve the coupling accuracy between the spectrometer 533 and the turning prism 532.

[0120] The receiving assembly 530 includes a second gasket 5352 . The second gasket 5352 can be disposed between the substrate 531 and the spectrometer 533 . The second gasket 5352 can be used to adjust the position of the spectrometer 533 to improve the coupling accuracy between the spectrometer 533 and the turning prism 532 .

[0121] The spacer increases the thickness of the glue between substrate 531 and spectrometer 533, preventing stress caused by thin glue that could cause cracking of the substrate or spectrometer 533. The spacer is smaller than substrate 531 and is easily removable, enabling three-dimensional coupling of spectrometer 533.

[0122] In some embodiments, the thickness of the first gasket 5351 is the same as the thickness of the second gasket 5352 to facilitate coupling between the spectrometer 533 and the turning prism 532 .

[0123] The spectrometer 533 is bonded to the substrate 531 , and has a large bonding area, which can effectively absorb bonding stress and avoid cracking at the bonding site.

[0124] In some embodiments of the present disclosure, the spectrometer 533 and the turning prism 532 are separately provided, so that the turning prism 532 can be adjusted in three dimensions, which can effectively absorb the patch tolerance and improve the coupling efficiency.

[0125] Figure 8 is a schematic diagram of the optical path of a light receiving component according to some embodiments of the present disclosure. As shown in Figure 8, signal light is divergent when it enters the turning prism 532 through the optical splitter 533. This signal light is then deflected by the turning prism 532. Upon exiting the turning prism 532, the signal light travels toward the lens assembly 534, which converges the signal light. The converged signal light then enters the light receiving chip array 520. The light receiving chip array 520 converts the signal light into an electrical signal.

[0126] Figure 9 is a schematic diagram (I) of a cross-sectional structure of a light receiving component and a circuit board according to some embodiments of the present disclosure. Figure 10 is a schematic diagram (II) of a cross-sectional structure of a light receiving component and a circuit board according to some embodiments of the present disclosure. As shown in Figures 9 and 10, the light receiving component 500 may include a backing plate 510, a light receiving chip array 520, and a receiving assembly 530. The light receiving chip array 520 is located on one side of the backing plate 510.

[0127] The receiving component 530 can be used to convert the receiving signal light from a direction parallel to the circuit board to a direction toward the optical receiving chip array 520, so that the optical receiving chip array 520 can receive the receiving signal light and convert the optical signal into an electrical signal.

[0128] The backing plate 510 and receiving assembly 530 can be positioned above the circuit board, with the light receiving chip array 520 positioned above the circuit board. As shown in Figure 9 , the backing plate 510 and receiving assembly 530 are positioned above the circuit board. When the light receiving chip array 520 is positioned above the circuit board, the light receiving chip array 520 is positioned to one side of the backing plate 510. The lower surface of the light receiving chip array 520 is flush with the lower surface of the backing plate 510, while the upper surface of the backing plate 510 is higher than the upper surface of the light receiving chip array 520. This prevents the light receiving chip array 520 from contacting the receiving assembly 530. In other words, there is a gap between the light receiving chip array 520 and the lower surface of the receiving assembly 530, preventing damage to the light receiving chip array 520.

[0129] The backing plate 510 and the receiving assembly 530 can be arranged on one side of the circuit board, with the optical receiving chip array 520 located above the circuit board. As shown in Figure 10, the backing plate 510 and the receiving assembly 530 are arranged on one side of the circuit board. When the optical receiving chip array 520 is located above the circuit board, the optical receiving chip array 520 is located on one side of the backing plate 510. The lower surface of the optical receiving chip array 520 is lower than the lower surface of the backing plate 510, and the upper surface of the backing plate 510 is higher than the upper surface of the optical receiving chip array 520, so that the optical receiving chip array 520 does not contact the receiving assembly 530, thereby avoiding damage to the optical receiving chip array 520. That is, the thickness of the backing plate 510 is greater than the sum of the thicknesses of the optical receiving chip array 520 and the circuit board 300. This prevents the optical receiving chip array 520 from contacting the receiving assembly 530, thereby avoiding damage to the optical receiving chip array 520.

[0130] The present disclosure uses a group of lenses to converge the signal light, which is beneficial to reducing the size of the component.

[0131] The present disclosure provides an optical module, comprising: a circuit board and a light receiving component. The light receiving component 500 comprises a pad 510, a light receiving chip array 520 and a receiving assembly 530. The light receiving chip array 520 is located on one side of the pad 510. The receiving assembly 530 can be used to convert the received signal light from a direction parallel to the circuit board to a direction toward the light receiving chip array 520, so that the light receiving chip array 520 can receive the received signal light and convert the optical signal into an electrical signal. Among them, the receiving assembly 530 comprises: a substrate 531, a lens assembly 534, a turning prism 532 and a spectrometer 533. The turning prism 532 and the spectrometer 533 are located on the substrate 531, and the lens assembly 534 is arranged in the substrate 531.

[0132] When the signal light passes through the beam splitter 533 and enters the turning prism 532, it diverges and is then deflected by the turning prism 532. After exiting the turning prism 532, the signal light travels toward the lens assembly 534, which converges the signal light. The converged signal light then enters the optical receiver chip array 520, which converts the signal light into an electrical signal.

[0133] The light receiving chip array 520 is located on one side of the pad 510 and below the substrate 531 . The light receiving chip array 520 is located within the projection range of the substrate 531 .

[0134] The upper surface of the lens assembly 534 is lower than the upper surface of the substrate 531 , and the lower surface of the lens assembly 534 is higher than the lower surface of the substrate 531 , which can prevent external structures from contacting the lens assembly 534 and reduce damage to the lens assembly 534 .

[0135] The optical splitter 533 and the turning prism 532 are separately provided. The turning prism 532 can be adjusted in three dimensions, which can effectively absorb the patch tolerance and improve the coupling efficiency.

[0136] The embodiment of the present disclosure also provides a light emitting component, which can be located on one side of the above-mentioned light receiving component. In order to reduce the size of the optical module, the light emitting component in this example can be set in a gap on the circuit board. Please refer to the following example for specific understanding.

[0137] Figure 11 is a schematic diagram of a light emitting component and circuit board structure according to some embodiments of the present disclosure. Figure 12 is a partial schematic diagram of a light emitting component circuit board according to some embodiments of the present disclosure. Figure 13 is an exploded schematic diagram of a light emitting component circuit board according to some embodiments of the present disclosure. As shown in Figures 11, 12, and 13, the circuit board 300 is provided with a first avoidance opening 302, and the light emitting component is located within the first avoidance opening 302.

[0138] In some embodiments, the first avoidance opening 302 is located on one side of the circuit board, and its opening is communicated with the outside. A signal pin area is provided on the circuit board, and the light emitting component is connected to the signal pin area by wire bonding.

[0139] In some embodiments, the first avoidance opening 302 is located in the middle of the width of the circuit board, and the circuit board is arranged around the first avoidance opening 302 .

[0140] Figure 14 is an exploded schematic diagram of an optical transmitter assembly according to some embodiments of the present disclosure. As shown in Figure 14 , the optical transmitter assembly may include a transmitter housing 410 and an electrical connector 430. A first through-hole 4103 is defined on one sidewall of the transmitter housing 410, and the electrical connector 430 is located on the sidewall opposite the first through-hole 4103. The optical transmitter assembly is housed within the transmitter housing 410.

[0141] The other sidewall of the launch housing 410 may be provided with a first opening 4101 . The electrical connector 430 may be disposed at the first opening 4101 .

[0142] A first through hole 4103 is provided on the transmitting housing 410 . The first through hole 4103 is connected to the inner cavity of the transmitting housing 410 , and the first through hole 4103 is used to connect the optical fiber adapter 700 .

[0143] Exemplarily, the transmitting housing 410 is a transmitting tube housing, which houses an optical transmitting assembly. The optical transmitting assembly may include a laser array 411, a lens array 412, and an optical multiplexing assembly 413. The laser array 411 emits light of different wavelengths. Each beam is sequentially processed by the converging lens in the lens array 412, transitioning from a divergent state to a convergent state. The beams are then combined by the optical multiplexing assembly 413 to form a single beam. This beam is then collimated by the collimating lens in the fiber adapter 700 and converted into parallel light, which is then emitted from the transmitting housing 410 as parallel light.

[0144] In some embodiments, the housing bottom 4102 of the launch housing 410 is connected to the electrical connector 430 to support the electrical connector 430. In some embodiments, the lower surface of the electrical connector 430 may be higher than the housing bottom 4102.

[0145] FIG15 is a schematic diagram of the structure of an electrical connector according to some embodiments of the present disclosure. As shown in FIG15 , the electrical connector 430 may be located at the first opening 4101 .

[0146] A first opening 4101 is provided on the launch shell 410 , and the first through hole 4103 and the first opening 4101 are located on opposite sides of the launch shell.

[0147] In some embodiments, the electrical connector 430 is located at the first opening 4101. One side of the electrical connector 430 is inserted into the launch housing 410 through the first opening 4101, and the other side is exposed outside the launch housing 410, so that the launch housing 410 and the electrical connector are assembled to form a light-emitting cavity. The end of the electrical connector 430 located inside the launch housing is connected to the laser array 411 via a gold wire, and the end of the electrical connector 430 located outside the launch housing is connected to the circuit board via a flexible circuit board 320. The electrical signals and operating signals generated by the circuit board 300 are transferred to the laser array 411 to drive each laser to emit laser beams of different wavelengths. Alternatively, the end of the electrical connector 430 located outside the launch housing is connected to the circuit board via bonding wires.

[0148] Figure 16 is a partial cross-sectional diagram (I) of an optical transmission component and a circuit board according to some embodiments of the present disclosure. Figure 17 is a partial cross-sectional diagram (II) of a connection between an optical transmission component and a circuit board according to some embodiments of the present disclosure. As shown in Figures 16 and 17, electrical connector 430 may include a first connecting portion 431 and a second connecting portion 432. The second connecting portion 432 is located above the first connecting portion 431.

[0149] One end of the first connection portion 431 protrudes from the second connection portion 432 . For purposes of illustration, the end of the first connection portion 431 protruding from the second connection portion 432 is referred to as a supporting plane 4311 .

[0150] In some embodiments, the first end of the second connection portion 432 is flush with the first end of the first connection portion 431 , and the first end of the second connection portion 432 and the first end of the first connection portion 431 are located inside the launch housing 410 .

[0151] The second end of the second connection portion 432 protrudes from the second end of the first connection portion 431 , and the second end of the second connection portion 432 and the second end of the first connection portion 431 are located outside the launching housing 410 .

[0152] A ground layer 434 is disposed on the upper surface of the second connection portion 432 .

[0153] In some embodiments, a ground layer 434 is disposed between the first connection portion 431 and the second connection portion 432 , and the ground layer 434 covers a surface of the second connection portion 432 .

[0154] The electrical connector 430 may include a third connection portion 433. The third connection portion 433 is located above the second connection portion 432 and is connected to the first opening 4101. The width of the third connection portion 433 is smaller than the width of the second connection portion 432, so that a portion of the second connection portion 432 is located inside the launch housing 410 and another portion of the second connection portion 432 is located outside the launch housing 410.

[0155] The portion of the second connection portion 432 located inside the launch housing 410 forms an internal connection portion 4321. The internal connection portion 4321 is electrically connected to the laser array 411. The portion of the second connection portion 432 located outside the launch housing 410 forms an external connection portion 4322. The external connection portion 4322 is electrically connected to the circuit board.

[0156] In some embodiments, the internal connection portion 4321 is provided with a first ground pin, and the first ground pin is electrically connected to the laser array 411 .

[0157] In some embodiments, the first ground pin is wire-bonded to the laser array 411 .

[0158] The first ground pin and the second ground pin may be connected; or the first ground pin and the second ground pin may be a metal wire.

[0159] The external connection portion 4322 may be provided with a second ground pin, which is electrically connected to the circuit board. In some embodiments, a ground pad may be provided on the upper surface of the circuit board, and the second ground pin is connected to the ground pad.

[0160] In some embodiments, a ground pin may be provided on the upper surface of the second connection portion 432, wherein a first end of the ground pin is located inside the emission housing 410 and electrically connected to the laser array 411. A second end of the ground pin is located outside the emission housing 410 and electrically connected to a ground pad on a circuit board.

[0161] In some embodiments, the second connection portion 432 may be provided with a ground via 435 . One end of the ground via 435 is connected to the ground pin, and the other end is connected to the ground layer 434 .

[0162] In some embodiments, the ground via 435 may be located in the inner connection portion 4321 , or the ground via 435 may be located in the outer connection portion 4322 ; or the ground via 435 may be located in both the inner connection portion 4321 and the outer connection portion 4322 .

[0163] The second end of the first connecting portion 431 protrudes from the second connecting portion 432, and the lower surface of the circuit board 300 can be electrically connected to the first connecting portion 431. In some embodiments, the second end of the first connecting portion 431 is electrically connected to the lower surface of the circuit board 300. Conductive adhesive 330 is disposed between the second end of the first connecting portion 431 and the lower surface of the circuit board 300.

[0164] In some embodiments, the thickness of the circuit board body 310 is greater than the thickness of the second connection portion 432 , so the circuit board 300 may include a first extension portion 320 . The thickness of the first extension portion 320 is less than the thickness of the circuit board body 310 .

[0165] The second end of the first connecting portion 431 is connected to the lower surface of the first extending portion 320. The lower surface of the first extending portion 320 is recessed upward so that the thickness of the first extending portion 320 is smaller than the thickness of the circuit board body 310. The second end of the first connecting portion 431 is located below the first extending portion 320.

[0166] The second connecting portion 432 may abut against a sidewall of the first extending portion 320 .

[0167] The upper surface of the second connection portion 432 is flush with the upper surface of the first extension portion 320. A first ground pad may be provided on the upper surface of the first extension portion 320, and the second end of the ground pin may be electrically connected to the first ground pad.

[0168] A grounding metal layer may be provided on the lower surface of the first extension portion 320 , and the grounding metal layer may be connected to the grounding layer 434 via a conductive adhesive.

[0169] The first extension portion 320 may include a circuit via 340 , one end of the circuit via 340 may be connected to the first ground pad, and the other end of the circuit via 340 may be connected to the ground metal layer.

[0170] In some embodiments of the present disclosure, the sum of the thickness of the first connection portion 431 and the thickness of the second connection portion 432 is greater than or equal to the thickness of the circuit board body 310 .

[0171] The thickness of the circuit board body can be 0.9 mm to 1.1 mm. The thickness of the second connecting portion can be 0.45 mm to 0.55 mm. The thickness of the first connecting portion 431 can be 0.6 mm to 1.1 mm.

[0172] The thickness of the first extension portion 320 may be 0.45 mm to 0.55 mm.

[0173] In some embodiments, the thickness of the circuit board body may be greater than or equal to twice the thickness of the second connection portion. The thickness of the circuit board body may be greater than or equal to twice the thickness of the first extension portion 320 .

[0174] In some embodiments of the present disclosure, the ground wire of the laser array is connected to the ground pin of the second connection part through bonding, and the ground pin is connected to the ground layer 434 of the first connection part through the ground via 435. The ground layer 434 can be electrically connected to the ground metal layer on the lower surface of the circuit board through the conductive adhesive 320, and the ground metal layer is connected to the ground pad on the upper surface of the circuit board through the circuit through hole 340, and is connected to the gold finger through the internal wire of the circuit board.

[0175] The signal return path of the laser array can be to return to the ground pin of the second connection part through the ground wire, be conducted to the ground layer 434 through the ground via 435, and then return to the ground pad on the upper surface of the circuit board through the conductive glue 320, the ground metal layer on the lower surface of the circuit board, and the circuit through hole 340.

[0176] In the disclosed embodiment, electrical connector 430 includes a full-surface ground layer 434, which increases the signal return area, facilitates ground return for high-speed signals, and improves signal transmission quality. The vertical distance between ground layer 434 and the upper surface of second connecting portion 432 is less than the thickness of the circuit board, shortening the high-speed signal return path. This facilitates ground return for high-speed signals and improves signal transmission quality.

[0177] In some embodiments, the electrical connector 430 can be connected to a flexible circuit board. The specific example can be configured according to actual needs. For example, the first connecting portion is connected to the first flexible circuit board, the second connecting portion is connected to the second flexible circuit board, the first flexible circuit board is connected to the bottom surface of the circuit board, and the second flexible circuit board is connected to the top surface of the upper road member.

[0178] The disclosed embodiments also provide another light emitting component. Unlike the structure of the light emitting components in the aforementioned embodiments, the light emitting component in this embodiment is located on a pad, and the electrical connector structure provided within the light emitting component is completely different from that in the aforementioned embodiments. By providing first and second solder pad areas at different heights on different sides of the electrical connector, this minimizes the bonding distance to other components and reduces the space required for the light emitting component. The specific structure of the light emitting component can be understood with reference to the following example.

[0179] FIG18 is a schematic diagram of an optical emitting component, an optical receiving component, and a circuit board provided according to some embodiments of the present disclosure. FIG19 is a schematic diagram of an exploded view of an optical emitting component, an optical receiving component, and a circuit board provided according to some embodiments of the present disclosure. As shown in FIG18 and FIG19 , the circuit board 300 is provided with a first avoidance opening 310, and the optical emitting component is located in the first avoidance opening 310. The optical emitting component and the optical receiving component are both located on the upper surface of the circuit board. The optical module also has a pad 420, the optical emitting component is located on the pad 420, and a portion of the pad 420 is located below the circuit board corresponding to the optical receiving component.

[0180] In some embodiments, a first clearance opening 310 is located on one side of the circuit board, with its opening communicating with the outside. A signal pin area 320 is provided on the circuit board, and the light emitting component is wired to the signal pin area 320. A narrow plate area 330 is located on one side of the first clearance opening 310, juxtaposed with the first clearance opening 310 in the width direction of the circuit board. The light receiving component 500 is located in the narrow plate area 330.

[0181] Figure 20 is a schematic diagram of the structure of a light emitting component provided according to some embodiments of the present disclosure. Figure 21 is a first exploded schematic diagram of a light emitting component provided according to some embodiments of the present disclosure. As shown in Figures 20 and 21, the light emitting component may include: a light emitting component including a launch housing 410 and an electrical connector 430. A first through hole 4103 is provided on a side wall of the launch housing 410, and an electrical connector 430 is provided on the side wall opposite the first through hole 4103. A light emitting assembly is provided within the launch housing 410.

[0182] The other sidewall of the launch housing 410 may be provided with a first opening 4105 , and the electrical connector 430 may be disposed at the first opening 4105 .

[0183] A first through hole 4103 is provided on the transmitting housing 410 . The first through hole 4103 is communicated with the inner cavity of the transmitting housing 410 , and the first through hole 4103 is connected to the optical fiber adapter 700 .

[0184] Exemplarily, transmitter housing 410 is a transmitter tube housing, housing an optical transmitter assembly including a laser array 411, a lens array 412, and an optical multiplexing assembly 413. Laser array 411 emits light of varying wavelengths, each of which is sequentially processed by the converging lens in lens array 412, transforming from a divergent state to a convergent state. The light is then combined by optical multiplexing assembly 413, combining the wavelengths into a single beam. This light is then collimated by the collimating lens in fiber adapter 700, converting it into parallel light, which is then emitted from transmitter housing 410 in a parallelized state. The structure of transmitter housing 410 in this example is substantially the same as that of the transmitter housing in the aforementioned embodiment.

[0185] Figure 22 is a second exploded schematic diagram of an optical transmitter component according to some embodiments of the present disclosure. As shown in Figure 22, the transmitter housing 410 may include a transmitter cover 4101 and a tube housing 4102. The transmitter cover 4101 is disposed above the tube housing 4102 to form a transmitter cavity.

[0186] The light emitting assembly may include a photodetection array 415. In some embodiments, the photodetection array 415 may be located on the electrical connector 430 to reduce the volume of the light emitting housing.

[0187] In some embodiments, the light emitting assembly may include a detection pad 416 located on the electrical connector 430 , and the photodetection array 415 may be located on the detection pad 416 . The detection pad 416 may be used to isolate the photodetection array 415 from the electrical connector 430 .

[0188] In some embodiments, the photodetection array 415 may include four photodetectors, and four corresponding detection pads may be provided.

[0189] In some embodiments, the photodetection array 415 may include four photodetectors, corresponding to which two detection pads may be provided, wherein two photodetectors are provided on each detection pad.

[0190] FIG23 is a schematic diagram of the structure of an electrical connector according to some embodiments of the present disclosure. As shown in FIG23 , the electrical connector 430 may include a connecting body 434 . The connecting body 434 is located at the first opening 4105 .

[0191] A first opening 4105 is provided on the launching shell 410 , and the first through hole 4103 and the first opening 4105 are located on opposite sides of the launching shell.

[0192] In some embodiments, the electrical connector 430 is located at the first opening 4105. One side of the electrical connector 430 is inserted into the launch housing 410 through the first opening 4105, while the other side is exposed outside the launch housing 410, so that the launch housing 410 and the electrical connector are assembled to form a light-emitting cavity. The end of the electrical connector 430 located inside the launch housing is connected to the laser array 411 via a gold wire, and the end of the electrical connector 430 located outside the launch housing is connected to the circuit board via a flexible circuit board 302. The electrical signals and operating signals generated by the circuit board 300 are transferred to the laser array 411 to drive each laser to emit laser beams of different wavelengths. Alternatively, the end of the electrical connector 430 located outside the launch housing is connected to the circuit board via bonding wires.

[0193] In some embodiments, the flexible circuit board 302 may be a single circuit board, or may include two circuit boards respectively located above and below the end of the electrical connector 430 extending outside the launch housing.

[0194] The surface of the electrical connector 430 located inside the launch housing 410 forms a first pad area 431 and a second pad area 432. The first pad area 431 protrudes from the second pad area 432. The distance between the first pad area 431 and the laser array 411 is smaller than the distance between the second pad area 432 and the laser array 411.

[0195] A step surface is defined between the second pad region 432 and the first pad region 431 , and an upper surface of the second pad region 432 is higher than an upper surface of the first pad region 431 .

[0196] In some embodiments, a third pad area 433 is formed on the surface of the electrical connector 430 located outside the launch housing 410. The first pad area 431 is electrically connected to the third pad area 433, and the second pad area 432 is electrically connected to the third pad area 433, thereby enabling signal transmission inside and outside the launch housing 410, including the transmission of low-frequency and high-frequency signals. The third pad area 433 includes low-frequency signal lines and high-frequency signal lines. The low-frequency signal lines are used to transmit low-frequency signals, and the high-frequency signal lines are used to transmit high-frequency signals.

[0197] In some embodiments, the photodetection array 415 is located in the first pad region 431 , the second pad region 432 is provided with a detection driving circuit, and the photodetection array 415 and the second pad region 432 are connected by wire bonding.

[0198] Figure 24 is a cross-sectional schematic diagram of a light emitting component provided according to some embodiments of the present disclosure. As shown in Figure 24, the light emitting assembly may include a semiconductor cooler 417. The semiconductor cooler 417 is disposed within the emission housing 410, and the laser array 411 and lens array 412 are disposed on the upper surface of the semiconductor cooler 417.

[0199] FIG25 is a schematic diagram of a semiconductor cooler according to some embodiments of the present disclosure. As shown in FIG25 , the semiconductor cooler 417 may include a first substrate 4171 . The bottom surface of the first substrate 4171 is in contact with the launch housing 410 .

[0200] The semiconductor cooler 417 may include a second substrate 4172. A heat exchange plate is provided between the first substrate 4171 and the second substrate 4172. The laser array 411 and the lens array 412 may be provided on the upper surface of the second substrate 4172.

[0201] In some embodiments, the thickness of the first substrate 4171 is greater than the thickness of the second substrate 4172. The increased thickness of the first substrate 4171 helps to raise the height of the upper surface of the semiconductor cooler 417 so that the laser array 411, the lens array 412 and the fiber optic adapter 700 are at the same height.

[0202] The surface area of ​​the first substrate 4171 is larger than that of the second substrate 4172. In some embodiments, one end of the first substrate 4171 protrudes beyond the projection of the second substrate 4172. Cooler electrodes may be provided on the first substrate 4171, including a positive pin 4175 and a negative pin 4176.

[0203] The projection of the second substrate 4172 does not cover the cooler electrodes.

[0204] In some embodiments, to reduce the bonding length between the laser array 411 and the first pad region 431 , the laser array 411 and the first pad region 431 may be arranged to have the same height.

[0205] The first pad region 431 is connected to the cooler electrode via bonding wires. The first pad region 431 is provided with a cooler power supply pin. To reduce the bonding length between the first pad region 431 and the cooler electrode and shorten the height difference between the first pad region 431 and the cooler electrode, the thickness of the first substrate 4171 can be set to be greater than the thickness of the second substrate 4172.

[0206] In some embodiments of the present disclosure, the cooler electrode may be a metal sheet attached to the surface of the first substrate 4171 .

[0207] When the overall thickness of the semiconductor cooler 417 remains unchanged, the thickness of the first substrate 4171 is increased so that the thickness of the first substrate 4171 is greater than the thickness of the second substrate 4172. This is beneficial to reducing the height difference between the upper surface of the first substrate 4171 and the upper surface of the second substrate 4172, thereby reducing the wire length between the first pad area 431 and the cooler electrode.

[0208] In some embodiments, the height difference between the upper surface of the first substrate 4171 and the first pad area 431 is less than 4 mm, which can meet the bonding requirements of an automatic bonding machine. The height difference between the cooler power pin and the cooler electrode is less than 4 mm, which can meet the bonding requirements of an automatic bonding machine to ensure a wire connection between the cooler power pin and the cooler electrode.

[0209] The height difference between the upper surface of the first substrate 4171 and the first pad area 431 is greater than or equal to 3.2 mm, and the height difference between the upper surface of the first substrate 4171 and the first pad area 431 is less than 4 mm, which can meet the bonding requirements of an automatic bonding machine.

[0210] In some embodiments, a thermal pad 4174 may be provided on the upper surface of the second substrate 4172 . The thermistor 418 is electrically connected to the thermal pad 4174 . The thermal pad 4174 may be electrically connected to the first pad region 431 .

[0211] In some embodiments, to achieve coupling between the photodetection array 415 and the optical multiplexing assembly 413, the optical emitting component 400 may include a lifting substrate 419. The lifting substrate 419 is located below the optical multiplexing assembly 413 to lift the optical multiplexing assembly 413 so that the photodetection array 415 is optically coupled to the optical multiplexing assembly 413.

[0212] In some embodiments, the lifting substrate 419 and the tube shell 4102 can be an integrated structure.

[0213] Figure 26 is a schematic diagram of the optical path of an optical transmission assembly according to some embodiments of the present disclosure. As shown in Figure 26, laser array 411 emits light of different wavelengths, with some directed toward lens array 412 and others toward photodetector array 415. Photodetector array 415 can be used to detect the optical power of the lasers at corresponding locations.

[0214] The multiple beams of light toward the lens array 412 are processed by the converging lens in the lens array 412 and converted from a divergent state to a convergent state. Then, the multiplexer 413 combines the light of different wavelengths into one beam of light.

[0215] In some embodiments of the present disclosure, the cooler electrode is located on one side of the laser array 411 , so that the center of the laser array 411 does not coincide with the center of the emission housing 420 .

[0216] The central axis of the light outlet of optical multiplexing assembly 413 does not coincide with the central axis of fiber optic adapter 700. To achieve optical coupling, the light emitting component may include a displacement prism 414. In some embodiments, displacement prism 414 is located above elevated substrate 419. Displacement prism 414 allows the combined light to enter fiber optic adapter 700.

[0217] The present disclosure provides an optical transmission component, comprising: a transmission housing. A first through hole is provided on one side of the optical transmission housing, and an electrical connector is provided on the sidewall opposite the first through hole. A fiber optic adapter is connected to the first through hole. One side of the electrical connector is located inside the transmission housing, and the other side is located outside the transmission housing. A first solder pad area and a second solder pad area of ​​different heights are provided on the side of the electrical connector located inside the transmission housing. A semiconductor cooler is located within the transmission housing and connected to the bottom of the transmission housing.

[0218] The semiconductor cooler includes a first substrate and a second substrate, wherein the first substrate is connected to the bottom of the launch shell. The first substrate is thicker than the second substrate. A cooler electrode is provided on the upper surface of the first substrate. A first pad region is wire-bonded to the cooler electrode.

[0219] The first pad area is provided with a cooler power supply pin. In order to reduce the wiring length between the first pad area and the cooler electrode and shorten the height difference between the first pad area and the cooler electrode, the thickness of the first substrate can be set to be greater than the thickness of the second substrate.

[0220] A thermal pad is provided on the upper surface of the second substrate, a thermistor is provided on the thermal pad, and the thermal pad is electrically connected to the first pad area.

[0221] The upper surface of the second substrate is provided with a laser array and a lens array. The first pad area carries a detection pad, which is provided with a photodetection array. The photodetection array is wired to the second pad area. The second pad area is higher than the first pad area. The laser array is disposed on the surface of the second substrate, reducing the isolation between the laser array and the semiconductor cooler, thereby improving the temperature control accuracy of the semiconductor cooler on the laser array.

[0222] The present disclosure also provides an optical module structure that improves the structure of the optical emitting component, thereby enhancing the stability of the emitting substrate and optical fiber assembly and the optical path stability of the optical emitting component. The specific structure of the optical emitting component can be understood by referring to the following example.

[0223] In some embodiments, the light emitting component 901 is located on the surface of the circuit board 300, and the light emitting component 901 is used to emit light signals. The driving chip is also located on the surface of the circuit board 300. The solder pads of the laser chip of the light emitting component 901 are higher than the solder pads of the driving chip. The solder pads of the laser chip of the light emitting component 901 are connected to the solder pads of the driving chip by wire bonding.

[0224] In some embodiments, the light emitting component 901 is fixed to the hollowed-out area of ​​the circuit board 300, and the light emitting component 901 is used to emit light signals. The driver chip is located on the surface of the circuit board 300, so that the soldering pads of the laser chip of the light emitting component 901 are flush with the soldering pads of the driver chip, thereby shortening the wiring distance between the soldering pads of the laser chip of the light emitting component 901 and the soldering pads of the driver chip.

[0225] The optical module also includes a light receiving component, which is used to receive optical signals and convert the optical signals into electrical signals.

[0226] In some embodiments, the light receiving component is located on the upper surface of the circuit board 300 .

[0227] FIG27 is a structural diagram of a circuit board, an optical transmitting component, and an optical receiving component provided according to some embodiments of the present disclosure. As shown in FIG27 , in some embodiments, an optical receiving component 902 is located on the lower surface of the circuit board 300 and is fixed to the lower surface of the circuit board 300 via a receiving substrate 926. The optical receiving component 902 includes a fiber collimator assembly 921, a wave splitter 922, a second focusing lens assembly 923, a reflector assembly 924, and an optical receiving chip assembly 925. The fiber collimator assembly 921 collimates the received optical signals and then injects them into the wave splitter 922. The wave splitter 922 splits the optical signals into eight optical signals of different wavelengths. The second focusing lens assembly 923 focuses the eight optical signals of different wavelengths onto the reflector assembly 924. The reflector assembly 924 reflects the eight focused optical signals of different wavelengths onto the optical receiving chip assembly 925. The optical receiving chip assembly 925 converts the eight optical signals of different wavelengths into eight electrical signals.

[0228] In some embodiments, the fiber collimator assembly 921 includes a fiber collimator, a fiber adapter, and a collimating lens. The fiber collimator is used to collimate received optical signals, the fiber adapter is used to receive optical signals, and the collimating lens is used to collimate the optical signals received by the fiber adapter. The fiber adapter and the collimating lens are combined into a fiber collimator, and both the fiber collimator and the fiber collimator are used to collimate received optical signals.

[0229] In some embodiments, the fiber collimator assembly 921 includes two fiber collimators.

[0230] In some embodiments, the fiber optic collimator group 921 includes two fiber optic adapters and two collimating lenses, one fiber optic adapter is set corresponding to one collimating lens, and one fiber optic adapter and one collimating lens are combined into one fiber optic collimator, which is used to collimate the received optical signal.

[0231] However, since it is not easy to actively attach two fiber collimators to the second support protrusion, in some embodiments, the fiber collimator assembly 921 includes one fiber collimator, one fiber adapter, and one collimating lens, or two fiber adapters and two collimating lenses.

[0232] In some embodiments, the second focusing lens group 923 includes eight focusing lenses, one focusing lens focuses one optical signal onto the reflector group 924 , and the second focusing lens group 923 focuses eight optical signals of different wavelengths onto the reflector group 924 .

[0233] In some embodiments, the reflector group 924 includes two reflectors, which reflect the focused four optical signals of different wavelengths to the optical receiving chip group 925. The reflector group 924 reflects the focused eight optical signals of different wavelengths to the optical receiving chip group 925.

[0234] In some embodiments, the optical receiving chipset 925 includes eight optical receiving chips, one optical receiving chip converts one optical signal into one electrical signal. The optical receiving chipset 925 is used to convert eight optical signals of different wavelengths into eight electrical signals.

[0235] Figure 28 is a structural diagram of a circuit board and a light emitting component provided according to some embodiments of the present disclosure. Figure 29 is a structural diagram of a light emitting component provided according to some embodiments of the present disclosure. Figure 30 is an exploded view of a light emitting component provided according to some embodiments of the present disclosure. As shown in Figures 28, 29, and 30, in some embodiments, the light emitting component 901 includes a laser chipset 912, a first focusing lens group 913, and an optical fiber group 914. The laser chipset 912 and the first focusing lens group 913 form a chipset, and the first focusing lens group 913 is located between the laser chipset 912 and the optical fiber group 914. The laser chipset 912 emits 8 optical signals of different wavelengths, and the first focusing lens group 913 focuses the 8 optical signals onto each optical fiber within the optical fiber group 914.

[0236] In some embodiments, the laser chipset 912 includes eight parallel laser chips. For example, the laser chips are 100G EML laser chips. Each 100G EML laser chip emits a 100G optical signal of one wavelength according to the driving current, so that the laser chipset 912 emits eight 100G optical signals of different wavelengths.

[0237] In some embodiments, the first focusing lens group 913 includes eight focusing lenses, and the optical fiber group 914 includes eight optical fibers, with one focusing lens corresponding to one optical fiber. For example, the first focusing lens group 913 focuses eight 100G optical signals onto respective optical fibers within the optical fiber group 914.

[0238] In some embodiments, the light emitting component 901 further includes an emitting substrate 911 , which is fixed to the hollowed-out area 301 of the circuit board 300 . The emitting substrate 911 is provided with a laser chip group 912 , a first focusing lens group 913 and an optical fiber group 914 .

[0239] As shown in Figures 29, 30 and 31, the circuit board 300 includes a hollow area 301, and the emitting substrate 911 of the light emitting component 901 is fixed at the hollow area 301 of the circuit board 300 so that the soldering pads of the laser chip of the light emitting component 901 are flush with the soldering pads of the driver chip.

[0240] In some embodiments, the hollowed-out area 301 includes a first hollowed-out area 311, the length dimension of the first hollowed-out area 311 is greater than the length dimension of the emitting substrate, and the width dimension of the first hollowed-out area 311 is greater than the width dimension of the emitting substrate, so that the emitting substrate of the light emitting component 901 is fixed at the first hollowed-out area 311.

[0241] Because the solder pads of laser chipset 912 are flush with the solder pads of the driver chip, and the laser chips of laser chipset 912 are flush with the optical fibers of optical fiber assembly 914, the optical fibers extending from the optical fiber assembly are flush with the top surface of circuit board 300. If the optical fibers extending from the optical fiber assembly closer to the optical fiber assembly are placed directly on the top surface of circuit board 300, the fibers closer to the optical fiber assembly will bend upward, causing stress damage to the fibers. To mitigate this, in some embodiments, the left side of first hollowed-out region 311 is extended to the left to form second hollowed-out region 312.

[0242] As shown in Figure 28, in some embodiments, the hollow area 301 includes a first hollow area 311 and a second hollow area 312, the first hollow area 311 and the second hollow area 312 are connected, the first hollow area 311 is close to one end of the gold finger in the circuit board 300 relative to the second hollow area 312, the emitting substrate of the light emitting component 901 is fixed at the first hollow area 311, and the second hollow area is used to place the optical fiber extending from the optical fiber group 914, that is, the partial area of ​​the optical fiber extending from the optical fiber group of the light emitting component 901 is placed at the second hollow area 312.

[0243] To enhance the strength of circuit board 300, in some embodiments, the width of second hollowed-out region 312 is smaller than the width of first hollowed-out region 311. The smaller width of second hollowed-out region 312 than first hollowed-out region 311 not only enhances the strength of circuit board 300 but also increases space for wiring or device placement on circuit board 300.

[0244] FIG31 is an exploded view of another optical transmission component provided according to some embodiments of the present disclosure. As shown in FIG31 , in some embodiments, the optical transmission component 901 includes a laser chipset 912, a collimating lens group 915, a wavelength division multiplexer group 916, a third focusing lens group 917, and a fiber adapter 700. The laser chipset 912 and the collimating lens group 915 constitute a chipset. The collimating lens group 915 is located between the laser chipset 912 and the wavelength division multiplexer group 916. The third focusing lens group 917 is located between the wavelength division multiplexer group 916 and the fiber adapter group.

[0245] In some embodiments, the collimating lens assembly 915 includes eight collimating lenses, the wavelength division multiplexer assembly 916 includes two wavelength division multiplexers, the third focusing lens assembly 917 includes two focusing lenses, and the fiber adapter assembly includes two fiber adapters 700. Each fiber adapter 700 corresponds to one focusing lens, each focusing lens corresponds to one wavelength division multiplexer, each wavelength division multiplexer corresponds to four collimating lenses, and each collimating lens corresponds to one laser chip. The collimating lens assembly 915 collimates the eight optical signals. The four collimated optical signals are combined into one optical signal via the wavelength division multiplexer. The two optical signals are then coupled to the fiber adapter assembly via the third focusing lens assembly 917.

[0246] As shown in Figure 31, a laser chip group 912, a collimating lens group 915 and a wavelength division multiplexer group 916 are provided on the emitting substrate 911. The third focusing lens group 917 and the optical fiber adapter 700 can be placed on the emitting substrate 911 or on the circuit board 300.

[0247] Figure 32 is a structural diagram of an emitting substrate provided according to some embodiments of the present disclosure. Figure 33 is a structural diagram of another emitting substrate provided according to some embodiments of the present disclosure. As shown in Figures 32 and 33, in some embodiments, an emitting substrate 911 includes a substrate body 9111. A first placement groove 9112 is provided at the first end of the substrate body 9111. A chipset consisting of a laser chipset 912 and a first focusing lens group 913 is located within the first placement groove 9112.

[0248] The chipset includes not only the laser chipset 912 and the first focusing lens group 913, but also a semiconductor cooler. These two components are located on a supporting substrate attached to the semiconductor cooler. Because both the semiconductor cooler and the supporting substrate have a certain thickness, the first placement slot 9112 is recessed relative to the substrate body 9111 to align the height of the laser chipset 912 with that of the driver chip.

[0249] As shown in FIG. 32 and FIG. 33 , in some embodiments, a support plate is provided at the second end of the substrate body 9111 , on which the optical fiber group 914 is placed, and the support plate protrudes relative to the substrate body 9111 .

[0250] In some embodiments, the bottom surface of the support plate is a flat bonding surface on which glue is applied, and the optical fiber assembly is bonded to the bonding surface. The glue is located between the bonding surface and the optical fiber assembly, and the glue is relatively thin and weak, resulting in poor bonding and poor optical path stability. To address this issue, as shown in Figures 32 and 33, in some embodiments, the support plate includes a glue dispensing boss 9117, which is located at one end of the support plate away from the first storage slot 9112. A first supporting boss 9118 is provided on the glue dispensing boss 9117, and the optical fiber assembly 914 is supported on the first supporting boss 9118. The area of ​​the glue dispensing boss 9117 other than the first supporting boss 9118 is a glue dispensing area, and glue can be dispensed within the glue dispensing area. The glue in the glue dispensing area and the first supporting boss 9118 are in contact and connected with the optical fiber assembly 914. After the glue in the glue dispensing area solidifies, a colloid is formed, which fixes the optical fiber assembly 914 to the support plate. Since the bonding surface for mounting the optical fiber assembly is flat, the area of ​​the glue dispensing boss 9117 other than the first supporting boss 9118 is glued to increase the thickness of the glue. As the thickness of the glue increases, the strength of the glue itself increases, and the adhesive force of the glue is also enhanced, thereby improving the stability of the transmitting substrate and the optical fiber group, and further improving the stability of the optical path. Among them, dispensing refers to dispensing glue.

[0251] In some embodiments, the thickness of the adhesive is equal to the height of the first support boss 9118, and the adhesive application area serves as the bonding surface for the optical fiber assembly 914. The adhesive thickness is equal to the height of the first support boss 9118 and greater than the distance between the bonding surface and the optical fiber assembly. This increases the adhesive strength of the adhesive, thereby improving the stability of the emitting substrate and the optical fiber assembly, and thus enhancing the stability of the optical path.

[0252] In some embodiments, the thickness of the colloid is greater than the height of the first supporting protrusion 9118. This allows the colloid to adhere to the first supporting protrusion 9118 as well. The bonding surface of the colloid that contacts the optical fiber assembly 914 includes not only the adhesive dispensing area but also the first supporting protrusion 9118, thereby increasing the colloid's bonding surface. The colloid's thickness is greater than the height of the first supporting protrusion 9118, which not only increases the colloid's bonding surface but also increases its bonding thickness, further enhancing the colloid's bonding strength and improving the stability of the optical path between the emitting substrate and the optical fiber assembly.

[0253] In some embodiments, at least two first supporting bosses 9118 are provided on the glue-dispensing boss 9117. These first supporting bosses 9118 support the optical fiber assembly 914. Glue can be dispensed in the area between any two first supporting bosses 9118. After the glue solidifies, it forms a colloid that secures the optical fiber assembly 914 to the support plate. Glue can be dispensed in the area between any two first supporting bosses 9118 to ensure contact and connection between the glue and the optical fiber assembly 914, increase the glue thickness, and improve the stability of the transmitting substrate 911 and the optical fiber assembly 914.

[0254] Gluing the area between the two parallel first support bosses 9118 can ensure that the glue is in contact and connected with the optical fiber group 914, increase the thickness of the glue, and improve the stability of the emitting substrate 911 and the optical fiber group 914.

[0255] Dispensing glue in the area between the first supporting bosses 9118 at both ends of the diagonal line can not only ensure the contact and connection between the glue and the optical fiber group 914, thereby improving the stability of the emitting substrate 911 and the optical fiber group 914; it can also make the glue flow around the first supporting boss 9118, thereby increasing the contact area between the glue and the optical fiber group 914, and further improving the stability of the emitting substrate 911 and the optical fiber group 914.

[0256] In some embodiments, at least two first support bosses 9118 include two first support bosses 9118, the two first support bosses 9118 support the optical fiber group 914, the two first support bosses 9118 are arranged in parallel, the two first support bosses 9118 are located at both ends of a diagonal line, and the area between the two first support bosses 9118 is glued.

[0257] In some embodiments, the at least two first support bosses 9118 include three first support bosses 9118, and the three first support bosses 9118 support the optical fiber group 914. Two of the three first support bosses 9118 are located at opposite ends of a diagonal of the glue dispensing boss 9117, and the remaining first support boss 9118 is arranged parallel to the first support boss 9118 located at one end of a diagonal. The area between any two first support bosses 9118 can be glued. For example, glue is dispensed in the area between two first support bosses 9118 located at opposite ends of a diagonal; glue is dispensed in the area between two first support bosses 9118 arranged in parallel; glue is dispensed in the area between two first support bosses 9118 located at opposite ends of a diagonal, and glue is also dispensed in the area between two first support bosses 9118 arranged in parallel.

[0258] In some embodiments, at least two first support bosses 9118 include four first support bosses 9118, and the four first support bosses 9118 support the optical fiber group 914, wherein two first support bosses 9118 are respectively located at the two ends of a diagonal of the glue dispensing boss 9117, and the remaining two first support bosses 9118 are located at the two ends of another diagonal of the glue dispensing boss 9117, and the area between any two first support bosses 9118 can be glued.

[0259] In some embodiments, the shape of the first supporting boss 9118 can be rectangular, square, or circular.

[0260] In order to prevent excessive glue from contaminating the optical fiber end face of the optical fiber group 914, as shown in Figure 33, in some embodiments, the support plate also includes a glue guide groove 9116, which is located around the glue dispensing boss 9117. The glue guide groove 9116 is recessed relative to the glue dispensing boss 9117, and the glue guide groove 9116 is used to guide the flow of glue.

[0261] The protrusions of the glue guide groove 9116, the glue dispensing boss 9117 and the first supporting boss 9118 are successively deepened to prevent excessive glue from contaminating the optical fiber end face of the optical fiber group 914.

[0262] The bottom surface of the optical fiber assembly 914 is in contact with the adhesive on the first support boss 9118 and the adhesive dispensing boss 9117 to define the vertical position of the optical fiber assembly 914 relative to the optical module. To further define the position of the optical fiber assembly 914, in some embodiments, the support plate includes a first limiting plate 9114, which is located between the first storage groove 9112 and the adhesive guide groove 9116. The end of the optical fiber assembly 914 (the end of the optical fiber assembly 914 with the optical fiber end face) is in contact with the first limiting plate 9114 to define the position of the optical fiber assembly 914 in the optical fiber direction (i.e., the left and right direction of the optical module).

[0263] In some embodiments, the support plate also includes a second limiting plate 9115, which is located between the glue guide groove and the edge of the emitting substrate, that is, the second limiting plate 9115 is located at the front end of the support plate or the rear end of the support plate, and the side of the optical fiber group 914 is in contact with the second limiting plate 9115 to limit the position of the optical fiber group 914 in the front and rear directions of the optical module.

[0264] In some embodiments, the support plate includes two second limit plates 9115, one limit plate 9115 is located at the front end of the glue guide groove 9116 and the emitting substrate 911, and the other limit plate 9115 is located at the rear end of the glue guide groove 9116 and the emitting substrate 911, the side of an optical fiber group 914 is in contact and connected with one limit plate 9115, and the side of the other optical fiber group 914 is in contact and connected with the other limit plate 9115.

[0265] As shown in Figures 32 and 33, in some embodiments, the support plate also includes a second support boss 9113, which is located at one end of the support plate close to the first storage slot 9112, and the first limiting plate 9114 is located in the middle of the second support boss 9113, and the second support boss 9113 is recessed relative to the first limiting plate 9114.

[0266] In some embodiments, the light emitting component 901 further includes an isolator, which is located on the second supporting boss 9113 and between the first focusing lens group 913 and the optical fiber group 914. The isolator is used to prevent the optical signal from returning to the laser chip group 912 along the original path.

[0267] As shown in Figures 32 and 33, in some embodiments, a fulcrum groove 9119 is provided at one end of the emitting substrate 911 away from the first storage groove 9112. There is no gap between fulcrum groove 9119 and the edge of the emitting substrate 911; that is, fulcrum groove 9119 is located at the edge of the emitting substrate 911. Fulcrum groove 9119 is located not only at the edge of the emitting substrate 911 but also in the projection area of ​​the optical fiber assembly 914. There is a gap between fulcrum groove 9119 and the optical fiber assembly 914. Fulcrum groove 9119 is located to the left of the glue guide groove 9116, and the edge of the optical fiber assembly 914 extends leftward, over both the glue guide groove 9116 and the fulcrum groove 9119. Fulcrum groove 9119 is located to the left of the glue guide groove 9116, and the edge of the optical fiber assembly 914 extends leftward, over both the glue guide groove 9116 and the fulcrum groove 9119. Therefore, the glue guide groove 9116 is further away from the edge of the optical fiber assembly 914 than the fulcrum groove 9119. Glue guide groove 9116 is further away from the edge of optical fiber assembly 914 than fulcrum groove 9119. A gap exists between fulcrum groove 9119 and optical fiber assembly 914, and fulcrum groove 9119 serves as a fulcrum to facilitate separation of optical fiber assembly 914 from transmitting substrate 911. When removing optical fiber assembly 914, a removal tool uses fulcrum groove 9119 as a fulcrum to pry optical fiber assembly 914 off transmitting substrate 911.

[0268] The above describes the optical fiber assembly 914 supported on the first supporting protrusion 9118 of the transmitting substrate 911. The wavelength division multiplexer assembly 916 can replace the optical fiber assembly 914 and be supported on the first supporting protrusion 9118 of the transmitting substrate 911. Because the transmitting substrate 911 does not need to be modified, or the wavelength division multiplexer assembly 916 can be fixed to the first supporting protrusion 9118 of the transmitting substrate 911 with only minor modifications to the transmitting substrate 911, the structure of the transmitting substrate 911 and the assembly of the transmitting substrate 911 and the wavelength division multiplexer assembly 916 will not be described in detail.

[0269] Figure 34 is a cross-sectional view of a circuit board and light-emitting components according to some embodiments of the present disclosure. As shown in Figure 34 , there is a gap between the second limiting plate 9115 and the edge of the transmitting substrate 911 corresponding to the second limiting plate 9115, and there is a gap between the first storage slot 9112 and the edge of the transmitting substrate 911 corresponding to the first storage slot 9112. The gaps between the second limiting plate 9115 and the first storage slot 9112, respectively, and the edges of the transmitting substrate 911 represent the edge regions of the transmitting substrate 911, which are in contact with the lower surface of the circuit board 300.

[0270] Figure 35 is a structural diagram of an optical fiber assembly according to some embodiments of the present disclosure. Figure 36 is an exploded view of an optical fiber assembly according to some embodiments of the present disclosure. As shown in Figures 35 and 36, in some embodiments, optical fiber assembly 914 includes a bottom plate layer 9141, optical fibers 9143, and a cover plate layer 9142. The cover plate layer 9142 covers the bottom plate layer 9141 to form a second storage slot for accommodating optical fibers 9143.

[0271] In some embodiments, the bottom plate layer 9141 has a second storage groove for placing the optical fiber 9143.

[0272] In some embodiments, the bottom plate layer 9141 has a first storage groove portion and the cover plate layer 9142 has a second storage groove portion, the first storage groove portion and the second storage groove portion form a second storage groove, and the second storage groove is used to place the optical fiber 9143.

[0273] FIG37 is a structural diagram of a cover layer according to some embodiments of the present disclosure. As shown in FIG37 , in some embodiments, the cover layer 9142 has a second placement groove 9145 for placing an optical fiber 9143 .

[0274] In some embodiments, the length dimension of the bottom plate layer 9141 is less than or equal to the length dimension of the cover plate layer 9142 .

[0275] In some embodiments, the length of the bottom plate layer 9141 is greater than the length of the cover plate layer 9142. The bottom plate layer 9141 is located below the optical fibers extending from the optical fiber group 914. The bottom plate layer 9141 provides support for the optical fibers extending from the optical fiber group 914. The optical fibers extending from the optical fiber group 914 are not easily bent downward, thereby reducing stress damage caused by the optical fibers bending downward.

[0276] In order to fix the bottom layer 9141, the cover layer 9142 and the optical fiber 9143, in some embodiments, the optical fiber group 914 also includes a fixing part 9144, one end of the fixing part 9144 fixes the optical fiber 9143 to the bottom layer 9141, and the other end of the fixing part 9144 fixes the cover layer 9142 to the bottom layer 9141.

[0277] In some embodiments, the fixing portion 9144 is a colloid formed after the glue is cured.

[0278] In some embodiments, the fixing portion 9144 is a structural member.

[0279] In some embodiments, the optical module includes a circuit board and a light emitting component, and the light emitting component is connected to the circuit board. The light emitting component includes an emitting substrate, and the emitting substrate includes a first storage slot and a support plate. A laser chip group and a first focusing lens group are provided in the first storage slot. An optical fiber group is provided in the support plate. The optical signal emitted by the laser chip group is coupled to the optical fiber of the optical fiber group after being converged by the first focusing lens group. The support plate includes a glue dispensing boss, and at least two first supporting bosses are provided on the glue dispensing boss. The optical fiber group is supported on the at least two first supporting bosses. In order to achieve the fixation of the optical fiber group to the emitting substrate, in some embodiments, the area of ​​the glue dispensing boss other than the at least two first supporting bosses is a glue dispensing area, and glue can be dispensed in the glue dispensing area, and the glue in the glue dispensing area is in contact and connected with the optical fiber group. Glue is dispensed in the area between the two first supporting bosses to ensure that the glue is in contact and connected with the optical fiber group, increase the thickness of the glue, and then enhance the bonding force of the glue, thereby improving the stability of the emitting substrate and the optical fiber group. In contrast to the planar bonding surface for mounting the optical fiber assembly, the area between the two first supporting bosses is coated with glue to increase the glue thickness, thereby enhancing the adhesive force of the glue, thereby improving the stability of the transmitting substrate and the optical fiber assembly and the stability of the optical path. In some embodiments, the glue dispensing boss is provided with at least two first supporting bosses, each of which supports the optical fiber assembly. Glue is dispensed in the area between the two first supporting bosses to increase the glue thickness, thereby enhancing the adhesive force of the glue, thereby improving the stability of the transmitting substrate and the optical fiber assembly and the stability of the optical path.

[0280] Since the above embodiments are all described by reference in combination with other embodiments, different embodiments have the same parts, and the same and similar parts between the various embodiments in this specification can be referred to each other. No further detailed explanation is given here.

[0281] It should be noted that, in this specification, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a circuit structure, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such circuit structure, article or device. In the absence of further restrictions, the presence of an element defined by the phrase "includes a..." does not exclude the presence of other identical elements in the circuit structure, article or device comprising the element.

[0282] Those skilled in the art will readily appreciate other embodiments of the present invention after considering the specification and practicing the disclosure of this application. This application is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered merely as exemplary, and the true scope and spirit of the present application are indicated by the claims.

[0283] The above-described embodiments of the present application do not constitute a limitation on the scope of protection of the present application.

Claims

1. An optical module, comprising: Circuit boards; A light receiving component is located above the circuit board, and the light receiving component includes: Pads; A light receiving chip array is located on one side of the pad and on the circuit board; A receiving assembly is located above the pad, and the receiving assembly includes: A base plate, located above the pad; A turning prism is located above the substrate, A spectroscopic device is located above the substrate, and the signal light is incident on the turning prism after passing through the spectroscopic device; A lens assembly is disposed in the substrate and is located below the turning prism, and the lens assembly cover is disposed above the light receiving chip array; the signal light is incident on the lens assembly after being turned by the turning prism, and is converged by the lens assembly to the light receiving chip array; A light emitting component is arranged at the notch of the circuit board, and the light emitting component comprises: A launching shell, wherein a first opening is provided on a side wall at one end of the launching shell, and an electrical connector is provided at the first opening; A laser is located inside the transmitting housing; Wherein, the electrical connector comprises: A first connecting portion, wherein a first end of the first connecting portion is located inside the launching shell, and a second end of the first connecting portion is located outside the launching shell; A second connection portion is located above the first connection portion, wherein the first end of the first connection portion is flush with the first end of the second connection portion; and the second end of the first connection portion protrudes from the first end of the second connection portion; A grounding layer is provided on the upper surface of the first connecting portion, and the grounding layer covers the first connecting portion; The second connecting portion comprises: A ground pin, located on an upper surface of the second connecting portion and electrically connected to the laser; A ground via, one end of the ground via is connected to the ground pin, and the other end of the ground via is connected to the ground layer.

2. The optical module according to claim 1, wherein: The lower surface of the light receiving chip array is flush with the lower surface of the pad, and the upper surface of the pad is higher than the upper surface of the light receiving chip.

3. The optical module according to claim 2, wherein: The substrate comprises a glue storage tank, the glue storage tank is located on the upper surface of the substrate, and the lens assembly is arranged in the glue storage tank.

4. The optical module according to claim 2, wherein: The projection of the turning prism covers the lens assembly; the projection of the lens assembly covers the light receiving chip array.

5. The optical module according to claim 2, wherein: The lens assembly is located inside the substrate, the upper surface of the lens assembly is lower than the upper surface of the substrate, and the lower surface of the lens assembly is higher than the lower surface of the substrate.

6. The optical module according to claim 2, wherein: The pad is located on one side of the circuit board; The thickness of the pad is greater than the sum of the thicknesses of the light receiving chip array and the circuit board.

7. The optical module according to claim 1, wherein: The upper surface of the first connecting portion is connected to the lower surface of the circuit board; The second connection portion is electrically connected to the upper surface of the circuit board.

8. The optical module according to claim 7, wherein: A ground pad is provided on the upper surface of the circuit board, and the ground pad is connected to the ground pin by wire bonding; A grounding metal layer is provided on the lower surface of the circuit board, and the grounding layer is electrically connected to the grounding metal layer.

9. The optical module according to claim 8, wherein: The circuit board comprises: a circuit through hole, one end of which is connected to the ground pad, and the other end of which is connected to the ground metal layer.

10. The optical module according to claim 1, wherein: The circuit board comprises: Circuit board body; The first extension portion has a thickness smaller than that of the circuit board body; the first connection portion is located below the first extension portion, and one end of the second connection portion abuts against a side wall of the first extension portion.

11. The optical module according to claim 10, wherein: The sum of the thickness of the first connecting portion and the thickness of the second connecting portion is greater than or equal to the thickness of the circuit board body.

12. The optical module according to claim 10, wherein: The thickness of the circuit board body is greater than or equal to 0.9 mm, and the thickness of the circuit board body is less than or equal to 1.1 mm; the thickness of the second connecting portion is greater than or equal to 0.45 mm, and the thickness of the second connecting portion is less than or equal to 0.55 mm; the thickness of the first connecting portion is greater than or equal to 0.6 mm, and the thickness of the first connecting portion is less than or equal to 1.1 mm.

13. The optical module according to claim 10, wherein: include: Conductive adhesive, the conductive adhesive is located between the first connecting portion and the first extending portion; The circuit board comprises: A ground pad, located on the upper surface of the circuit board, the ground pad being connected to the ground pin by wire bonding; The grounding metal layer is located on the lower surface of the circuit board. The grounding layer and the grounding metal layer are electrically connected to the circuit through hole. One end of the circuit through hole is connected to the grounding pad, and the other end is connected to the grounding metal layer.

14. The optical module according to claim 10, wherein: The thickness of the circuit board body is greater than or equal to twice the thickness of the second connecting portion.

15. The optical module according to claim 10, wherein: The thickness of the circuit board body is greater than or equal to twice the thickness of the first extending portion.

16. An optical module, comprising: Circuit boards; A light receiving component is located above the circuit board, and the light receiving component includes: Pads; A light receiving chip array is located on one side of the pad and on the circuit board; A receiving assembly is located above the pad, and the light receiving assembly includes: A base plate, located above the pad; A turning prism is located above the substrate, A spectroscopic device is located above the substrate, and the signal light is incident on the turning prism after passing through the spectroscopic device; A lens assembly is located below the turning prism, and the lens assembly is covered above the light receiving chip array; the signal light is incident on the lens assembly after being turned by the turning prism, and is converged to the light receiving chip array by the lens assembly; The lower surface of the light receiving chip array is flush with the lower surface of the pad, and the upper surface of the pad is higher than the upper surface of the light receiving chip array.

17. The optical module according to claim 16, wherein: The substrate comprises a glue storage tank, the glue storage tank is located on the upper surface of the substrate, and the lens assembly is arranged in the glue storage tank.

18. The optical module according to claim 16, wherein: The projection of the turning prism covers the lens assembly; the projection of the lens assembly covers the light receiving chip array.

19. The optical module according to claim 16, wherein: The lens assembly is located inside the substrate, the upper surface of the lens assembly is lower than the upper surface of the substrate, and the lower surface of the lens assembly is higher than the lower surface of the substrate.

20. A light receiving component, comprising: Pads; A light receiving chip array is located on one side of the pad; A receiving assembly is located above the pad, and the receiving assembly includes: A base plate, located above the pad; A turning prism is located above the substrate, A spectroscopic device is located above the substrate, and the signal light is incident on the turning prism after passing through the spectroscopic device; A lens assembly is located below the turning prism, and the lens assembly is covered above the light receiving chip array; the signal light is incident on the lens assembly after being turned by the turning prism, and is converged to the light receiving chip array by the lens assembly; The lens assembly is located inside the substrate, the upper surface of the lens assembly is lower than the upper surface of the substrate, and the lower surface of the lens assembly is higher than the lower surface of the substrate; The turning prism is arranged separately from the light splitting device.

21. The light receiving element according to claim 20, wherein The substrate comprises a glue storage tank, the glue storage tank is located on the upper surface of the substrate, and the lens assembly is arranged in the glue storage tank.

22. The light receiving element according to claim 20, wherein The projection of the turning prism covers the lens assembly; the projection of the lens assembly covers the light receiving chip array.

23. The light receiving element according to claim 20, wherein The projection of the substrate covers the turning prism, the projection of the substrate covers the lens assembly, and the projection of the substrate covers the light receiving chip array.

24. The light receiving element according to claim 20, wherein The receiving component comprises: A first gasket, located between the substrate and the light splitting device; A second gasket, located between the substrate and the light splitting device; The thickness of the first gasket is the same as the thickness of the second gasket.

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