Radio frequency transmission optical module, interface, and communication device

Abstract

Embodiments of the present application relate to the technical field of communications, and provide a radio frequency transmission optical module, an interface, and a communication device, used for mitigating the problem of a gold finger connector of an optical module for transmitting an analog signal being possibly mistakenly plugged into an interface of an optical module for transmitting a digital signal. The radio frequency transmission optical module comprises a housing and a gold finger connector arranged in the housing; the gold finger connector is connected to an interface; the gold finger connector comprises a substrate; the substrate comprises a substrate body and a first protruding portion; the substrate body comprises a first side surface; and the first protruding portion is connected to the first side surface. The provision of the first protruding portion is equivalent to increasing the width of the gold finger connector, so that the width of the gold finger connector is greater than the width of an interface of an optical module for transmitting a digital signal. When being mistakenly plugged into the interface of the optical module for transmitting the digital signal, the gold finger connector cannot be plugged due to the blocking of the first protruding portion, so that mistaken plugging of gold finger connectors of optical modules of different signal types can be avoided.

Description

A radio frequency transmission optical module, interface and communication equipment

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on November 24, 2023, with application number 202311605967.8 and application name “A radio frequency transmission optical module, interface and communication equipment”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of communication technology, and in particular to a radio frequency transmission optical module, an interface, and a communication device. Background Art

[0003] Pluggable optical modules are primarily used in optoelectronic conversion and transmission devices. They convert optical signals into electrical signals, which are then transmitted to the device's circuit board via a connector, achieving optoelectronic conversion. Pluggable optical modules involve the optical module, connector, PCB, and handle panel, all working together to securely mount each component and ensure reliable signal transmission.

[0004] In actual applications, optical modules used to transmit analog signals may be used in the same station as optical modules that transmit digital signals. Because the connectors and cage dimensions of these two optical modules are consistent and the dimensions are the same, there is a risk of mis-insertion.

[0005] Summary of the Invention

[0006] The embodiments of the present application provide a radio frequency transmission optical module, an interface compatible with the radio frequency transmission optical module, and a communication device to improve the problem that the gold finger connector of the radio frequency transmission optical module transmitting analog signals may be mis-inserted into the interface of the optical module transmitting digital signals.

[0007] In the first aspect, an embodiment of the present application provides a radio frequency transmission optical module, which includes a shell and a gold finger connector arranged in the shell, and the gold finger connector is used to connect to the interface; the gold finger connector includes a substrate, the substrate includes a substrate body and a first protrusion, the substrate body includes a first side surface, and the first protrusion is connected to the first side surface.

[0008] The RF transmission optical module provided in the embodiment of the present application has a gold finger connector with a first protrusion on the first side surface of the substrate body, which is equivalent to increasing the width of the gold finger connector, so that the width of the gold finger connector is greater than the width of the interface of the optical module transmitting digital signals. When the gold finger connector is mistakenly inserted into the interface of the optical module transmitting digital signals, the gold finger connector cannot be inserted due to the obstruction of the first protrusion, which can avoid the gold finger connectors and interfaces of optical modules with different signal types from being mistakenly inserted, and avoid problems such as short circuit and board burning.

[0009] In one possible implementation, the substrate further includes a second protrusion, the substrate body includes a second side surface opposite the first side surface, and the second protrusion is connected to the second side surface. The first and second protrusions are provided on either side of the substrate body, respectively, to prevent misinsertion, thereby achieving low-cost physical foolproofing.

[0010] In a possible implementation, the lengths of the first protrusion and the second protrusion in the plugging and unplugging direction of the gold finger connector are less than or equal to the length of the substrate body in the plugging and unplugging direction of the gold finger connector.

[0011] In a possible implementation, the thickness of the first protrusion and the second protrusion is less than or equal to the thickness of the body.

[0012] In a possible implementation, the first protrusion and the second protrusion have different thicknesses. The different thicknesses of the first protrusion and the second protrusion can be used to distinguish the front and back sides of the gold finger connector.

[0013] In one possible implementation, the gold finger connector includes a first gold finger module and a second gold finger module; the substrate body includes a first surface, and the first gold finger module and the second gold finger module are distributed along a first direction on the first surface, and the first direction is a direction perpendicular to the plug-in and pull-out direction of the substrate surface and the gold finger connector; the first gold finger module includes a plurality of signal terminals distributed along the first direction, and the second gold finger module includes a plurality of signal terminals distributed along the first direction.

[0014] In a possible implementation, a receiving groove is formed in the substrate body, and the first gold finger module and the second gold finger module are distributed on both sides of the receiving groove.

[0015] In a possible implementation, a metal layer is provided on an inner wall of the receiving groove, and the metal layer is connected to a ground terminal of the radio frequency transmission optical module.

[0016] In a possible implementation, a cross-sectional width of the substrate in a first direction is 9.3 mm to 12 mm, and the first direction is a direction perpendicular to the surface of the substrate and the plugging and unplugging direction of the gold finger connector.

[0017] In a possible implementation, the width of the first protrusion in the first direction is 0.1 mm to 1.5 mm; the width of the second protrusion in the first direction is 0.1 mm to 1.5 mm.

[0018] In a possible implementation, the substrate body, the first protrusion, and the second protrusion are integrally formed.

[0019] In the second aspect, an embodiment of the present application provides an interface for mating with a gold finger connector of a radio frequency transmission optical module provided by any implementation method of the first aspect. The interface includes a shell, the shell forms a housing, the housing includes a first side wall, a first groove is provided on the first side wall, and when the gold finger connector is mated with the interface, the first protrusion of the gold finger connector is received in the first groove. The interface provided by the present application has been improved accordingly to the gold finger connector. A first groove is provided on the first side wall of the housing chamber corresponding to the first protrusion of the gold finger connector. When the gold finger connector is mated with the interface, the first protrusion can be received in the first groove. This allows the same type of connector and interface to be adapted, while different types of connector and interface are not adapted, thus avoiding problems such as mis-insertion.

[0020] In one possible implementation, the accommodating cavity includes a first sidewall and a second sidewall facing each other, and a second groove is provided on the second sidewall. When the gold finger connector is mated with the interface, the second protrusion of the gold finger connector is received in the second groove. In the case where the gold finger connector is respectively provided with a first protrusion and a second protrusion, the interface is provided with a first groove corresponding to the first protrusion, and a second groove corresponding to the second protrusion. In this way, when the gold finger connector is mated with the interface, the first protrusion can be received in the first groove, and the second protrusion can be received in the second groove, thereby achieving adaptation between the interface and the gold finger connector.

[0021] In one possible implementation, the interface also includes a first spring clip module, a second spring clip module and an isolation rib, and the first spring clip module, the second spring clip module and the isolation rib are arranged in the accommodating cavity, wherein the isolation rib is arranged between the first spring clip module and the second spring clip module, and the isolation rib separates the first spring clip module and the second spring clip module in different chambers of the accommodating cavity, and when the gold finger connector is connected to the interface, the isolation rib is accommodated in the accommodating groove of the gold finger connector; the first spring clip module includes a plurality of first spring clips distributed along the first direction, the first end of the first spring clip is used to connect to the circuit board, and the second end of the first spring clip is used to abut against the gold finger connector; the second spring clip module includes a plurality of second spring clips distributed along the first direction, the first end of the second spring clip is used to connect to the circuit board, and the second end of the second spring clip is used to abut against the gold finger connector.

[0022] In one possible implementation, a metal spring is provided on the surface of the isolation rib. When the gold finger connector is connected to the interface, the isolation rib can be accommodated in the receiving groove of the gold finger connector. The metal spring on the isolation rib can abut against the metal layer on the inner wall of the receiving groove of the gold finger connector. For example, the metal spring can be grounded. In this way, the RF transmission optical module can be grounded by abutting the metal spring and the metal layer.

[0023] In the third aspect, an embodiment of the present application provides a connector assembly, including a gold finger connector and an interface, the gold finger connector including a substrate, the substrate including a substrate body and a first protrusion, the substrate body including a first side surface, and the first protrusion is connected to the first side surface; the interface includes a shell, the shell forms an accommodating cavity, the accommodating cavity includes a first side wall, and a first groove is provided on the first side wall. When the gold finger connector and the interface are mated and connected with each other, the first protrusion is accommodated in the first groove.

[0024] In one possible implementation, the substrate body includes a second side surface opposite to the first side surface, and the substrate also includes a second protrusion, which is connected to the second side surface; the accommodating cavity of the shell also includes a second side wall opposite to the first side wall, and a second groove is provided on the second side wall. When the gold finger connector and the interface are mated and connected with each other, the second protrusion is accommodated in the second groove.

[0025] In one possible implementation, the gold finger connector includes a first gold finger module and a second gold finger module; the substrate body includes a first surface, and the first gold finger module and the second gold finger module are distributed along the first direction on the first surface; the first gold finger module includes a plurality of signal terminals distributed along the first direction, and the second gold finger module includes a plurality of signal terminals distributed along the first direction; the interface also includes a first spring module, a second spring module and an isolation rib, and the first spring module, the second spring module and the isolation rib are arranged in the accommodating cavity, wherein the isolation rib is arranged between the first spring module and the second spring module, and the isolation rib separates the first spring module and the second spring module in different chambers of the accommodating cavity; the first spring module includes a plurality of first springs distributed along the first direction, and the first end of the first spring is used to connect to the circuit board, and when the gold finger connector and the interface are matched and connected to each other, the second end of the first spring abuts the first gold finger module; the second spring module includes a plurality of second springs distributed along the first direction, and the first end of the second spring is used to connect to the circuit board, and when the gold finger connector and the interface are matched and connected to each other, the second end of the second spring abuts the second gold finger module.

[0026] In a possible implementation, the substrate body is provided with a receiving groove, and when the gold finger connector and the interface are connected to each other, the isolation rib is received in the receiving groove.

[0027] In a possible implementation, a metal spring is provided on the surface of the isolation rib, and a metal layer is provided on the inner wall of the receiving groove. When the isolation rib is received in the receiving groove, the metal spring abuts against the metal layer.

[0028] In a possible implementation, a cross-sectional width of the substrate in the first direction is 9.3 mm to 12 mm.

[0029] In a possible implementation, the width of the first protrusion in the first direction is 0.1 mm to 1.5 mm; the width of the second protrusion in the first direction is 0.1 mm to 1.5 mm.

[0030] In a fourth aspect, an embodiment of the present application further provides a communication device, comprising a circuit board and an interface provided in any implementation manner of the second aspect, wherein the interface is arranged on the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] FIG1 is a schematic diagram of a communication system provided in an embodiment of the present application;

[0032] FIG2 is a schematic diagram of an optical module for transmitting digital signals provided in an embodiment of the present application;

[0033] FIG3 is a schematic diagram of a gold finger connector and an interface of an optical module for transmitting digital signals provided in an embodiment of the present application;

[0034] FIG4 is a schematic diagram of an optical module for transmitting analog signals provided in an embodiment of the present application;

[0035] FIG5 is a comparative schematic diagram of gold finger connectors and interfaces of two optical modules provided in an embodiment of the present application;

[0036] FIG6 is a schematic diagram showing the function definition of the signal terminals of the gold finger connector provided in an embodiment of the present application;

[0037] FIG7 is a schematic diagram of a radio frequency transmission optical module provided in an embodiment of the present application;

[0038] FIG8 is a schematic diagram of a gold finger connector of a radio frequency transmission optical module provided in an embodiment of the present application;

[0039] FIG9 is a comparative schematic diagram of two gold finger connectors provided in an embodiment of the present application;

[0040] FIG10 is a schematic diagram of a gold finger connector provided in an embodiment of the present application;

[0041] FIG11 is a cross-sectional schematic diagram of a gold finger connector provided in an embodiment of the present application;

[0042] FIG12 is a schematic diagram of the dimensions of a gold finger connector provided in an embodiment of the present application;

[0043] FIG13 is a schematic diagram of another gold finger connector provided in an embodiment of the present application;

[0044] FIG14 is a schematic diagram of another gold finger connector provided in an embodiment of the present application;

[0045] FIG15 is a cross-sectional schematic diagram of another gold finger connector provided in an embodiment of the present application;

[0046] FIG16 is a schematic diagram showing the dimensions of another gold finger connector provided in an embodiment of the present application;

[0047] FIG17 is a schematic diagram of the structure of an interface provided in an embodiment of the present application;

[0048] FIG18 is a schematic diagram of the cooperation between the gold finger connector and the interface provided in an embodiment of the present application;

[0049] FIG19 is a schematic diagram of an interface provided in an embodiment of the present application;

[0050] FIG20 is a schematic diagram of the structure of another interface provided in an embodiment of the present application;

[0051] FIG21 is a schematic diagram of the principle of preventing mis-insertion provided in an embodiment of the present application. DETAILED DESCRIPTION

[0052] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. In the present application, "at least one" refers to one or more, and "more" refers to two or more. "And / or" describes the association relationship of associated objects, indicating that there may be three relationships. For example, A and / or B can represent: the existence of A alone, the existence of A and B at the same time, and the existence of B alone, where A and B can be singular or plural. "At least one of the following items (individuals)" or similar expressions refers to any combination of these items, including any combination of single items (individuals) or plural items (individuals). For example, at least one of a, b or c can represent: a, b, c, a and b, a and c, b and c or a, b and c, where a, b and c can be single or multiple.

[0053] The embodiments of this application use terms such as "first" and "second" to distinguish objects with similar names, functions, or effects. Those skilled in the art will understand that terms such as "first" and "second" do not limit the quantity or order of execution. The term "coupled" is used to indicate an electrical connection, including direct connection via wires or connectors or indirect connection via other devices. Therefore, "coupling" should be considered a broadly defined electronic communication connection.

[0054] It should be noted that, in this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described in this application as "exemplary" or "for example" should not be construed as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0055] The solution provided by the embodiments of the present application can be applied to communication systems, such as indoor wireless communication systems. Taking an indoor base station as an example, referring to Figure 1, the base station includes a baseband unit (BBU), a remote radio unit hub (RHUB), and a remote radio unit (RRU). The RHUB is called the mother end, and the RRU is called the head end. Signals are transmitted between the RHUB and the RRU via optical fiber, usually digital signals. The RRU includes a conversion circuit for converting digital signals into analog signals, which are then transmitted through the antenna for user use.

[0056] An RF optical module is an optoelectronic device used for photoelectric and electro-optical conversion. The transmitting end of an RF optical module converts electrical signals into optical signals, and the receiving end converts optical signals into electrical signals. For example, at the BBU, an RF optical module converts electrical signals into optical signals and transmits the signals to the RHUB via optical fiber. After the signals reach the RHUB, another RF optical module converts the optical signals into electrical signals for processing by the RHUB.

[0057] The communication system shown in Figure 1 uses optical fiber to transmit digital signals. Radio frequency (RF) transmission optical modules perform both optical-to-electrical and electrical-to-optical conversion. These RF transmission optical modules are also called digital optical modules. Digital optical modules are categorized by package type, with common types including Small Formfactor Pluggable (SFP) and Small Formfactor Pluggable Plus (SFP+). See Figure 2, which shows a schematic diagram of a digital optical module that complies with the SFP protocol.

[0058] One end of the digital optical module is provided with an optical fiber interface for connecting the optical fiber, and the other end of the digital optical module is provided with a gold finger connector. The digital optical module is connected to the mainboard of a communication device such as a BBU, RHUB, or RRU through the cooperation of the gold finger connector and the interface. For example, an interface is provided on the mainboard of the above-mentioned communication device, and the gold finger connector of the digital optical module can be inserted into the above-mentioned interface and connected with the interface. In this way, the signal transmitted on the optical fiber can be converted into an electrical signal and transmitted to a communication device such as a BBU, RHUB, or RRU, or the electrical signal of a communication device such as a BBU, RHUB, or RRU can be converted into an optical signal and transmitted through the optical fiber.

[0059] Refer to Figure 3, which shows a schematic diagram of the gold finger connector of the digital optical module shown in Figure 2 and the corresponding interface. The gold finger connector of the digital optical module (hereinafter referred to as the gold finger connector) includes an upper surface and a lower surface (only one of the surfaces is shown in the figure). The upper and lower surfaces of the gold finger connector are both provided with multiple signal terminals. Correspondingly, the interface includes a receiving cavity, and the gold finger connector can be plugged into the receiving cavity. Two sets of upper and lower metal shrapnel are provided in the receiving cavity. When the gold finger connector is plugged into the interface and connected with the interface, one end of the metal shrapnel located at the upper part of the receiving cavity abuts against the multiple signal terminals on the upper surface of the gold finger connector in a one-to-one correspondence, and one end of the metal shrapnel located at the lower part of the receiving cavity abuts against the multiple signal terminals on the lower surface of the gold finger connector in a one-to-one correspondence, and the other end of the metal shrapnel of the interface is connected to the circuit board of the communication device. By abutting the metal shrapnel of the interface with the signal terminals of the gold finger connector, bidirectional transmission of signals is achieved.

[0060] As mentioned in the previous example, when transmitting digital signals via optical fiber, conversion circuits are required in the RRU to convert digital signals into analog signals. However, with the development of technology, according to statistics, the power consumption of base stations in the 5G era will be several times higher than that of the 4G era. At the same time, for high-frequency scenarios, bandwidth requirements are greater, and signal quality requirements are becoming increasingly stringent, leading to increased power consumption and size of the headend.

[0061] Radio-over-fiber (RoF) technology is an emerging wireless access technology that combines fiber-optic and wireless communications, responding to the demand for high-speed, high-capacity wireless communications. At the motherboard, microwaves are modulated onto lasers. The modulated light waves are then transmitted through complex optical fiber links. Upon reaching the headend, optoelectronic conversion demodulates the microwave signal, which is then transmitted through an antenna for user use. RoF technology shifts components like the digital intermediate frequency (IF) signal from the headend to the motherboard, enabling high-quality analog signal transmission while reducing headend power consumption and size. It is expected to become a key technology for next-generation wireless communications.

[0062] In RoF technology, analog signals are modulated onto optical signals for transmission. Since analog signals are transmitted, a radio frequency optical module is required to implement electro-optical conversion or photoelectric conversion (of the analog signal). Therefore, such an optical module can also be called an analog optical module. Referring to Figure 4, Figure 4 shows a schematic diagram of another radio frequency transmission optical module provided in an embodiment of the present application. The radio frequency transmission optical module is used to convert or transmit analog signals, and therefore can also be called an analog optical module. Since there are currently no clear standards for the interface, appearance, and performance indicators of analog optical modules, considering compatibility and weak user surface perception, the radio frequency transmission optical module provided in the embodiment of the present application is compatible with the SFP protocol in terms of external dimensions.

[0063] The external dimensions of the analog optical module provided in the embodiment of the present application are compatible with the SFP protocol, that is, the external dimensions of the two are the same, and the corresponding interface is also the same size as the interface of the digital optical module. In terms of the connector, considering the requirements for isolation of the electrical port of the analog optical module, the electrical interface is redesigned based on the SPF protocol, and a slot is made in the middle of the gold finger connector. The corresponding interface is also designed accordingly. A retaining rib is provided in the accommodating cavity of the interface of the analog optical module. When the gold finger connector of the analog optical module is connected to the interface of the analog optical module, the retaining rib of the interface is accommodated in the slot opened by the gold finger connector, so that the two can be adapted.

[0064] With reference to Figure 1, since the BBU and RHUB transmit digital signals, while the RHUB and RRU transmit analog signals, digital and analog optical modules may coexist. Since the external dimensions of the analog optical module are the same as those of the digital optical module, and the width of the gold finger connector of the analog optical module and the gold finger connector of the digital optical module are also the same, it is possible that the two optical modules may be mixed. For example, the gold finger of the analog optical module may be mistakenly inserted into the interface of the digital optical module.

[0065] Referring to Figures 5 and 6, Figure 5 shows a comparative schematic diagram of the gold finger connectors and corresponding interfaces of the two optical modules provided in an embodiment of the present application. Figure 6 shows a schematic diagram of the functional definition of the signal terminals of the interface (or gold finger connector) of the digital optical module. Since the number and arrangement of the signal terminals of the interface (or gold finger connector) of the analog optical module are different from the number and arrangement of the signal terminals of the interface (or gold finger connector) of the digital optical module, if the gold finger connector of the digital optical module is inserted into the interface of the analog optical module or the gold finger connector of the analog optical module is inserted into the interface of the digital optical module, a short circuit may occur, damaging the equipment.

[0066] The analog optical module interface has a retaining rib, while the digital optical module's gold finger connector lacks a groove. Therefore, if the digital optical module's gold finger connector is inserted into the analog optical module's connector, the retaining rib will prevent it from being inserted. This prevents the digital optical module's gold finger connector from being mistakenly inserted into the analog optical module's interface. However, the analog optical module's gold finger connector and the digital optical module's gold finger connector have the same width. If the analog optical module connector is mistakenly inserted into the digital optical module's interface, the grounding portion of the analog optical module's gold finger connector could contact the VCC spring of the digital optical module's interface, potentially causing a short circuit, sparks, or even burnout. Given the high cost of BBUs, RHUBs, and RRUs, physical anti-error measures are required to prevent equipment damage.

[0067] Since the gold finger connectors, interfaces, etc. of digital optical modules already have mature and universal protocols or standards and are not easy to change, the embodiment of the present application provides an optical module. By improving the size of the gold finger connector of the optical module and making corresponding improvements to the interface to which it is adapted, it is possible to avoid the gold finger connection area of ​​the analog optical module being mistakenly inserted into the interface of the digital optical module or to avoid the gold finger connector of the digital optical module being mistakenly inserted into the interface of the analog optical module.

[0068] In conjunction with Figures 7 and 8, Figure 7 shows a schematic diagram of a radio frequency transmission optical module provided in an embodiment of the present application. The radio frequency transmission optical module includes a housing and a gold finger connector 100 disposed within the housing. The gold finger connector 100 is used to connect to an interface. Figure 8 shows a schematic diagram of the structure of the gold finger connector 100 of the radio frequency transmission optical module shown in Figure 7.

[0069] 8 , the gold finger connector 100 includes a substrate 110 , which includes a substrate body 111 and a first protrusion 112 . The substrate body 111 includes a first surface 111C, a second surface (not shown), a first side surface 111A, and a second side surface 111B. The first side surface 111A and the second side surface 111B are arranged opposite to each other, and the first surface 111C and the second surface 111D are two surfaces arranged opposite to each other. The first surface 111C can also be referred to as an upper surface, and the second surface can also be referred to as a lower surface.

[0070] Please refer to Figures 8 and 9. The first protrusion 112 of the gold finger connector 100 provided in the embodiment of the present application is connected to the first side surface 111A. After the first protrusion 112 is set, refer to Figure 9. Compared with the gold finger connector of the digital optical module, the width of the gold finger connector 100 of the RF transmission optical module provided in the embodiment of the present application is greater than the width of the gold finger connector of the digital optical module. Since the width of the interface of the digital optical module is adapted to the width of the gold finger connector of the digital optical module, the width of the gold finger connector 100 of the RF transmission optical module provided in the embodiment of the present application is also greater than the width of the corresponding interface of the digital optical module. This can prevent the gold finger connector 100 of the RF transmission optical module provided in the embodiment of the present application from being mistakenly inserted into the interface of the digital optical module, thereby avoiding circuit board short circuit, equipment damage, and the like.

[0071] For example, the length of the first protrusion 112 in the plug-in / plug-out direction of the gold finger connector can be less than or equal to the length of the substrate body 111 in the plug-in / plug-out direction of the gold finger connector. Referring to Figures a and b in Figure 10 , Figure 10 a shows the length of the first protrusion 112 of the gold finger connector 100 in the plug-in / plug-out direction being less than the length of the substrate body 111 in the plug-in / plug-out direction of the gold finger connector. Figure 10 b shows the length of the first protrusion 112 of the gold finger connector 100 in the plug-in / plug-out direction being the same as the length of the substrate body 111 in the plug-in / plug-out direction of the gold finger connector.

[0072] For example, Figure 11 shows a cross-sectional schematic diagram of the gold finger connector 100. In combination with Figure 11a, the thickness of the first protrusion 112 can also be less than the thickness of the substrate body 111, or, in combination with Figure 11b, the thickness of the first protrusion 112 can be the same as the thickness of the substrate body 111, which can reduce the difficulty of processing.

[0073] In order to prevent the gold finger connector 100 of the RF transmission optical module provided in the embodiment of the present application from being mistakenly inserted into the interface 200 of the digital optical module, please refer to Figures 8 and 12. The width w1 of the gold finger connector 100 of the RF transmission optical module provided in the embodiment of the present application in the first direction is 9.3 mm to 12 mm, for example, it can be 10.03 mm, and the width w2 of the substrate body 111 of the gold finger connector 100 in the first direction is about 9.2 mm. On this basis, the width w3 of the first protrusion 112 in the first direction is 0.1 mm to 1.5 mm. The first protrusion 112 and the substrate body 111 can be integrally formed. After the first protrusion 112 is provided, the size of the substrate 110 of the gold finger connector 100 is increased, so that the gold finger connector 100 of the RF transmission optical module provided in the embodiment of the present application cannot be inserted into the interface of the digital optical module due to the obstruction of the first protrusion 112.

[0074] Referring to Figures 8 and 13 , a first gold finger module 120 and a second gold finger module 130 are disposed on the first surface 111C of the substrate body 111, arranged along a first direction. The first direction is perpendicular to the insertion and removal direction of the gold finger connector 100 and the first gold finger module 120. The first gold finger module 120 may include a plurality of signal terminals 121, also referred to as gold fingers, arranged along the first direction. The second gold finger module 130 may include a plurality of signal terminals 131, also arranged along the first direction.

[0075] In one possible implementation, similar to the first surface 111C, a third gold finger module and a fourth gold finger module arranged along the first direction are provided on the second surface (not shown) of the substrate body 111. The third gold finger module includes a plurality of signal terminals arranged along the first direction, and the fourth gold finger module includes a plurality of signal terminals arranged along the first direction.

[0076] The signal terminals are used to transmit signals and are connected to the optoelectronic or electro-optical conversion circuits of the RF transmission optical module. The functional definition and arrangement of the signal terminals can be found in the example shown in FIG5 and will not be further described here. When the gold finger connector 100 of the RF transmission optical module is mated with the interface, the signal terminals contact the springs within the interface, enabling signal transmission.

[0077] In one possible implementation, referring to Figure 14 , the substrate body 111 may be provided with a receiving groove 140, which may be located between the first gold finger module 120 and the second gold finger module 130. In one possible implementation, the receiving groove 140 may be a U-shaped groove. Based on this design, when the gold finger connector 100 of the RF transmission optical module and the interface are mated and connected, the isolation rib of the interface may be received in the receiving groove 140. Exemplarily, the width of the receiving groove 140 may be 0.5 mm to 3 mm, for example, the width of the receiving groove 140 may be 1 mm.

[0078] In one possible implementation, a metal layer 141 is provided on the inner wall of the receiving groove 140, and the metal layer 141 is connected to the ground terminal of the RF transmission optical module. When the gold finger connector 100 of the RF transmission optical module and the interface are mutually connected, the isolation rib of the interface can be received in the receiving groove 140, and the surface of the isolation rib can be provided with a metal spring. When the isolation rib is received in the receiving groove 140, the metal spring of the isolation rib can abut against the metal layer 141 of the receiving groove 140. Usually, the metal spring of the isolation rib can be grounded. The abutment of the metal spring of the isolation rib with the metal layer 141 of the receiving groove 140 can provide grounding for the RF transmission optical module.

[0079] In the above example, the substrate 110 of the gold finger connector 100 includes a first protrusion 112, which is connected to the first side surface 111A of the substrate body 111. In another possible implementation, please continue to refer to Figure 14. The substrate 110 of the gold finger connector 100 also includes a second protrusion 113, which is connected to the second side surface 111B of the substrate body 111. The first protrusion 112 and the second protrusion 113 are arranged opposite to each other. The substrate body 111, the first protrusion 112 and the second protrusion 113 can be integrally formed. The first protrusion 112 and the second protrusion 113 are arranged on both sides of the gold finger connector 100 at the same time to widen the width of the gold finger connector 100 of the RF transmission optical module, and together play a physical anti-mistakable role to prevent the RF transmission optical module provided in the embodiment of the present application from being mistakenly inserted into the interface corresponding to the digital optical module.

[0080] The structure and principle of the second protrusion 113 are substantially the same as those of the first protrusion 112, and are only briefly described in the embodiments of this application. For example, the lengths of the first and second protrusions 112, 113 in the plug-in and unplugging directions of the gold finger connector can be smaller than the length of the substrate body 111 in the plug-in and unplugging directions of the gold finger connector. When the RF transmission optical module provided in the embodiments of this application is mistakenly inserted into the interface of the digital optical module, the presence of the first and second protrusions 112, 113 makes the width of the gold finger connector 100 in the first direction greater than the width of the accommodating cavity of the interface of the digital optical module, thereby hindering the insertion of the gold finger connector 100 into the interface of the digital optical module.

[0081] In one possible implementation, the lengths of the first protrusion 112 and the second protrusion 113 in the plug-in and pull-out direction of the gold finger connector can be the same as the length of the substrate body 111 in the plug-in and pull-out direction of the gold finger connector. In this way, the first protrusion 112 is equivalent to the overall widening of the substrate body 111 in the direction from the second side surface 111B toward the first side surface 111A, and the second protrusion 113 is equivalent to the overall widening of the substrate body 111 in the direction from the first side surface 111A toward the second side surface 111B. The width of the widened substrate body 111 of the gold finger connector 100 is greater than the width of the accommodating cavity 211 of the interface 200 of the digital optical module, which can hinder the gold finger connector 100 from being inserted into the interface 200 of the digital optical module.

[0082] In one possible implementation, the thickness of the first protrusion 112 and the second protrusion 113 may be less than the thickness of the substrate body 111. In another possible implementation, referring to FIG15 , the thickness of the first protrusion 112 and the second protrusion 113 may also be the same as the thickness of the substrate body 111.

[0083] In addition, the thickness of the first protrusion 112 and the second protrusion 113 can be the same or different. When the thickness of the first protrusion 112 is different from the thickness of the second protrusion 113, the size of the interface can be adjusted accordingly. The different thicknesses of the first protrusion 112 and the second protrusion 113 can be used to distinguish the direction of the gold finger connector 100. For example, it can be used to distinguish whether the first surface or the second surface of the substrate body 111 of the gold finger connector 100 is facing upward.

[0084] 16 , the width w1 of the gold finger connector 100 of the RF transmission optical module provided in the embodiment of the present application in the first direction is 9.3 mm to 12 mm, while the width w2 of the substrate body 111 of the gold finger connector 100 in the first direction is approximately 9.2 mm. The widths of the first protrusion 112 and the second protrusion 113 can be the same. On this basis, the width w3 of the first protrusion 112 in the first direction is 0.1 mm to 1.5 mm, and the width w3 of the second protrusion 113 in the first direction is 0.1 mm to 1.5 mm. The provision of the first protrusion 112 and the second protrusion 113 increases the size of the substrate 110 of the gold finger connector 100, so that the gold finger connector 100 of the RF transmission optical module provided in the embodiment of the present application cannot be inserted into the interface of the digital optical module due to the obstruction of the first protrusion 112 and the second protrusion 113, thereby preventing misinsertion.

[0085] Due to the increase in the width of the gold finger connector of the RF transmission optical module, in order to adapt to the gold finger connector, the embodiment of the present application also provides an interface, which can be installed on the circuit board of equipment such as BBU, RHUB, RRU, etc., for mating with the gold finger connector of the RF transmission optical module. Referring to Figure 17, Figure a in Figure 17 shows a structural schematic diagram of the interface provided by the embodiment of the present application, and Figure b in Figure 17 shows a schematic diagram of the interface in the plug-in and pull-out direction of the gold finger connector. In combination with Figures a and b in Figure 17, the interface 200 may include a shell 210, a first spring clip module 220, a second spring clip module 230, and an isolation rib 240. The shell 210 forms a accommodating cavity 211, and the first spring clip module 220, the second spring clip module 230, and the isolation rib 240 are arranged in the accommodating cavity 211. The isolation rib 240 is arranged between the first spring clip module 220 and the second spring clip module 230, separating the first spring clip module 220 and the second spring clip module 230 into different chambers in the accommodating cavity 211. For example, the isolation rib 240 can isolate the first spring module 220 in the first chamber 211A and isolate the second spring module 230 in the second chamber 211B.

[0086] Referring to Figure 17(b), the first spring clip module 220 includes a plurality of first spring clips 221 distributed along a first direction. The first ends of the first spring clips 221 are used to connect to a circuit board. For example, when the interface 200 is installed on a circuit board of a device such as a BBU, RHUB, or RRU, the first ends of the first spring clips 221 can be soldered to the circuit board. The second ends of the first spring clips 221 are used to abut against a gold finger connector. For example, when the gold finger connector of the RF transmission optical module is inserted into the interface 200, the second ends of the first spring clips 221 abut against the signal terminals of the gold finger connector. The second spring clip module 230 includes a plurality of second spring clips 231 distributed along the first direction. The first ends of the second spring clips 231 are used to connect to the circuit board, and the second ends of the second spring clips 231 are used to abut against the gold finger connector.

[0087] In one possible implementation, since signal terminals are provided on both the upper and lower surfaces of the gold finger connector of the RF transmission optical module, the interface 200 provided in the embodiment of the present application is also correspondingly provided with multiple spring modules. For example, the interface 200 includes a first spring module 220 and a second spring module 230 located in the upper part of the accommodating cavity 211, which are used to abut the signal terminals located on the upper surface of the gold finger connector; the interface 200 also includes a third spring module 250 and a fourth spring module 260 located in the lower part of the accommodating cavity 211, and the third spring module 250 and the fourth spring module 260 are used to abut the signal terminals located on the lower surface of the gold finger connector. Within the interior of the accommodating cavity 211, the first spring fragment module 220 faces the third spring fragment module 250, and the second spring fragment module 230 faces the fourth spring fragment module 260. Isolation ribs 240 isolate the first and third spring fragment modules 220 and 250 within the first cavity 211A, and the second and fourth spring fragment modules 230 and 260 within the second cavity 211B. The functional definitions of each spring fragment in the aforementioned spring fragment modules can be found in Figures 5 and 6 and the corresponding examples, and will not be further described in detail in this embodiment of the present application.

[0088] Please refer to Figure 18, which shows a schematic diagram of the matching of the gold finger connector 100 and the interface 200 provided in an embodiment of the present application. When the gold finger connector is adapted and connected to the interface 200, the isolation rib 240 will be received in the receiving groove 140 of the gold finger connector 100. In the aforementioned example, the width of the receiving groove can be 1 mm, so the width of the isolation rib 240 needs to be smaller than the width of the receiving groove. For example, the width of the isolation rib 240 can be 0.9 mm. A metal spring (not shown in the figure) can be provided on the surface of the isolation rib 240. The metal spring can be used to connect to the ground terminal of the circuit board. In this way, when the gold finger connector of the RF transmission optical module is inserted into the interface 200, the metal spring on the surface of the isolation rib 240 can be abutted against the metal layer in the receiving groove on the gold finger connector to provide grounding for the gold finger connector.

[0089] Since the size of the gold finger connector of the RF transmission optical module provided in the embodiment of the present application is widened, the size of the accommodating cavity 211 of the interface 200 also needs to be adjusted accordingly. The width of the accommodating cavity 211 in the first direction is greater than the width of the substrate 110 of the gold finger connector 100 in the aforementioned example to ensure that the gold finger connector 100 can be inserted into the interface 200. Here, the first direction is the direction perpendicular to the substrate surface of the gold finger connector and the plug-in and unplugging direction of the gold finger connector.

[0090] For example, in the above example, if the width of the gold finger connector is 10.03 mm, the width of the accommodating cavity 211 of the interface 200 provided in the embodiment of the present application may be 10.15 mm.

[0091] In one possible implementation, referring to Figures 8 and 19 , the substrate 110 of the gold finger connector 100 includes a first protrusion 112. In this case, the accommodating cavity 211 of the interface 200 includes a first side wall 213 and a second side wall 214 that are opposite to each other. A first groove 2131 is provided on the first side wall 213. When the gold finger connector 100 of the RF transmission optical module is inserted into the interface 200, in conjunction with Figure 19 , when the gold finger connector 100 is mated with the interface 200, the first protrusion 112 is received in the first groove 2131.

[0092] In another possible implementation, please refer to Figures 14 and 20 in combination. The substrate 110 of the gold finger connector 100 includes a first protrusion 112 and a second protrusion 113, and the first protrusion 112 and the second protrusion 113 are arranged opposite to each other. In this case, the accommodating cavity 211 of the interface 200 includes a first side wall 213 and a second side wall 214 opposite to each other, and a first groove 2131 is provided on the first side wall 213, and a second groove 2141 is provided on the second side wall 214. When the gold finger connector 100 of the RF transmission optical module is inserted into the interface 200, in combination with Figure 20, when the gold finger connector 100 is mated and connected with the interface 200, the first protrusion 112 is accommodated in the first groove 2131, and the second protrusion 113 is accommodated in the second groove 2141.

[0093] For example, the thickness of the first protrusion 112 and the second protrusion 113 of the gold finger connector 100 can be the same as the thickness of the substrate body 111. In this case, the size of the first groove 2131 for accommodating the first protrusion 112 can be the same as the size of the accommodating cavity for accommodating the substrate body 111, and the size of the second groove 2141 for accommodating the second protrusion 113 can be the same as the size of the accommodating cavity for accommodating the substrate body 111. The dimensions here can be considered as the height of the first groove 2131, the second groove 2141, and the accommodating cavity 211. In this way, the first groove 2131 can be formed in the interface 200 by making the first sidewall 213 thinner. Similarly, the second groove 2141 can be formed by making the second sidewall 214 thinner overall.

[0094] In one possible implementation, the thickness of the first protrusion 112 and the thickness of the second protrusion 113 are different, and accordingly, the sizes of the first groove 2131 and the second groove 2141 are also different, wherein the first groove 2131 is configured to mate with the first protrusion 112, and the second groove 2141 is configured to mate with the second protrusion 113. In this way, the correspondence relationship can be distinguished based on the different thicknesses of the first protrusion 112 and the second protrusion 113 and the inconsistent sizes of the first groove 2131 and the second groove 2141. For example, assuming that the thickness of the first protrusion 112 is greater than that of the second protrusion 113, and the size of the first groove 2131 is greater than that of the second groove 2141, the gold finger connector 100 can be inserted into the interface 200 only when the first protrusion 112 is accommodated in the first groove 2131 and the second protrusion 113 is accommodated in the second groove 2141.

[0095] The RF transmission optical module provided in the embodiment of the present application has made improvements to the structure of its gold finger connector, and has made corresponding improvements to the interface corresponding to the RF transmission optical module. Combined with Figure 21, the gold finger connector 100 of the RF transmission optical module provided in the embodiment of the present application matches the interface 200, and the gold finger connector of the digital optical module matches the interface of the digital optical module. When the gold finger connector 100 of the RF transmission optical module provided in the embodiment of the present application is mistakenly inserted into the interface of the digital optical module, since the gold finger connector is provided with a first protrusion and / or a second protrusion, the size is larger, which will hinder the insertion of the gold finger connector into the interface of the digital optical module, thus avoiding errors; and when the gold finger connector of the digital optical module is mistakenly inserted into the interface 200 provided in the embodiment of the present application, since an isolation rib is provided in the interface 200, the gold finger connector of the digital optical module will be blocked from being inserted.

[0096] The solution provided by the embodiments of this application, without changing the overall module size, achieves low-cost anti-intermixing of digital and analog optical modules through the structural design of the gold finger connector and interface, providing a physical anti-mash function. In addition to the dimensions provided in the embodiments of this application, the dimensions of the gold finger connector and interface can also be adjusted accordingly.

[0097] An embodiment of the present application further provides a communication device, which includes a circuit board and the interface provided in the above embodiment. The interface can be installed on the circuit board and is used to connect to the gold finger connector of the radio frequency transmission optical module.

[0098] An embodiment of the present application also provides a communication system, which includes a first communication device, a second communication device and a transmission line. The transmission line may be an optical fiber. The first end of the transmission line is connected to the first communication device, and the second end of the transmission line is connected to the second communication device. Exemplarily, the first end of the transmission line is provided with a first RF transmission optical module, and the second end of the transmission line is provided with a second RF transmission optical module. The first RF transmission optical module is connected to the first interface of the first communication device, and the second RF transmission optical module is connected to the second interface of the second communication device. Signals are transmitted between the first communication device and the second communication device via optical fiber. The first RF transmission optical module and the second RF transmission optical module are RF transmission optical modules provided in the examples shown in Figures 8 to 16 of the embodiments of the present application, and the first interface and the second interface may be interfaces provided in the examples shown in Figures 17 or 18.

[0099] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A radio frequency transmission optical module, characterized in that: The radio frequency transmission optical module comprises a housing and a gold finger connector arranged in the housing, wherein the gold finger connector is used to connect to an interface; The gold finger connector includes a substrate, the substrate includes a substrate body and a first protrusion, the substrate body includes a first side surface, and the first protrusion is connected to the first side surface.

2. The radio frequency transmission optical module according to claim 1, characterized in that: The substrate further includes a second protrusion, the substrate body includes a second side surface opposite to the first side surface, and the second protrusion is connected to the second side surface.

3. The radio frequency transmission optical module according to claim 2, characterized in that: The lengths of the first protrusion and the second protrusion in the plugging and unplugging direction of the gold finger connector are less than or equal to the length of the substrate body in the plugging and unplugging direction of the gold finger connector.

4. The radio frequency transmission optical module according to claim 2, characterized in that: The thickness of the first protrusion and the second protrusion is less than or equal to the thickness of the body.

5. The radio frequency transmission optical module according to claim 4, characterized in that: The first protrusion and the second protrusion have different thicknesses.

6. The radio frequency transmission optical module according to any one of claims 2 to 4, characterized in that: The gold finger connector includes a first gold finger module and a second gold finger module; The substrate body comprises a first surface, the first gold finger module and the second gold finger module are distributed along a first direction on the first surface, and the first direction is a direction perpendicular to the plugging and unplugging direction of the substrate surface and the gold finger connector; The first gold finger module includes a plurality of signal terminals distributed along the first direction, and the second gold finger module includes a plurality of signal terminals distributed along the first direction.

7. The radio frequency transmission optical module according to claim 6, characterized in that: The substrate body is provided with a receiving groove, and the first gold finger module and the second gold finger module are distributed on both sides of the receiving groove.

8. The radio frequency transmission optical module according to claim 7, characterized in that: The inner wall of the receiving groove is provided with a metal layer, and the metal layer is connected to the ground end of the radio frequency transmission optical module.

9. The radio frequency transmission optical module according to any one of claims 6 to 8, characterized in that: The cross-sectional width of the substrate in the first direction is 9.3 mm to 12 mm, and the first direction is a direction perpendicular to the plugging and unplugging direction of the substrate surface and the gold finger connector.

10. The radio frequency transmission optical module according to claim 9, characterized in that: The width of the first protrusion in the first direction is 0.1 mm to 1.5 mm; the width of the second protrusion in the first direction is 0.1 mm to 1.5 mm.

11. The radio frequency transmission optical module according to any one of claims 2 to 9, characterized in that: The substrate body, the first protrusion and the second protrusion are integrally formed.

12. An interface, characterized in that: The interface is used to connect with the gold finger connector of the radio frequency transmission optical module according to any one of claims 1 to 11, and the interface includes a shell, and the shell forms a receiving cavity. The accommodating cavity comprises a first side wall, and a first groove is arranged on the first side wall. When the gold finger connector is matingly connected with the interface, the first protrusion of the gold finger connector is accommodated in the first groove.

13. The interface according to claim 12, characterized in that: The accommodating cavity comprises a first side wall and a second side wall opposite to each other. A second groove is arranged on the second side wall. When the gold finger connector is matingly connected with the interface, the second protrusion of the gold finger connector is accommodated in the second groove.

14. The interface according to claim 12 or 13, characterized in that: The interface further includes a first spring sheet module, a second spring sheet module and an isolation barrier rib, wherein the first spring sheet module, the second spring sheet module and the isolation barrier rib are arranged in the accommodating cavity, wherein the isolation barrier rib is arranged between the first spring sheet module and the second spring sheet module, and the isolation barrier rib separates the first spring sheet module and the second spring sheet module into different chambers of the accommodating cavity, and when the gold finger connector is matingly connected with the interface, the isolation barrier rib is accommodated in the accommodating groove of the gold finger connector; The first spring sheet module includes a plurality of first spring sheets distributed along a first direction, wherein a first end of the first spring sheet is used to connect with a circuit board, and a second end of the first spring sheet is used to abut against the gold finger connector; The second spring sheet module includes a plurality of second spring sheets distributed along a first direction, a first end of the second spring sheet is used to be connected to the circuit board, and a second end of the second spring sheet is used to abut against the gold finger connector.

15. The interface according to claim 14, characterized in that: The surface of the isolation rib is provided with a metal spring sheet.

16. A connector assembly, characterized in that: It includes a gold finger connector and an interface, wherein the gold finger connector includes a substrate, wherein the substrate includes a substrate body and a first protrusion, wherein the substrate body includes a first side surface, and the first protrusion is connected to the first side surface; The interface includes a shell, the shell forms a accommodating cavity, the accommodating cavity includes a first side wall, a first groove is provided on the first side wall, and when the gold finger connector and the interface are mutually matched and connected, the first protrusion is accommodated in the first groove.

17. The connector assembly according to claim 16, characterized in that The substrate body includes a second side surface opposite to the first side surface, and the substrate further includes a second protrusion, and the second protrusion is connected to the second side surface; The accommodating cavity of the shell further includes a second side wall opposite to the first side wall, and a second groove is provided on the second side wall. When the gold finger connector and the interface are mutually matched and connected, the second protrusion is accommodated in the second groove.

18. The connector assembly according to claim 17, wherein: The gold finger connector includes a first gold finger module and a second gold finger module; the substrate body includes a first surface, and the first gold finger module and the second gold finger module are distributed along a first direction on the first surface; the first gold finger module includes a plurality of signal terminals distributed along the first direction, and the second gold finger module includes a plurality of signal terminals distributed along the first direction; The interface further includes a first spring sheet module, a second spring sheet module and an isolation barrier rib, wherein the first spring sheet module, the second spring sheet module and the isolation barrier rib are arranged in the accommodating cavity, wherein the isolation barrier rib is arranged between the first spring sheet module and the second spring sheet module, and the isolation barrier rib separates the first spring sheet module and the second spring sheet module into different chambers of the accommodating cavity; The first spring sheet module includes a plurality of first spring sheets distributed along a first direction, wherein a first end of the first spring sheet is used to connect with a circuit board, and when the gold finger connector and the interface are connected with each other, a second end of the first spring sheet abuts against the first gold finger module; The second spring sheet module includes a plurality of second spring sheets distributed along a first direction, wherein a first end of the second spring sheet is used to connect with the circuit board, and when the gold finger connector and the interface are mutually matched and connected, a second end of the second spring sheet abuts against the second gold finger module.

19. The connector assembly according to claim 18, wherein: The substrate body is provided with a receiving groove, and when the gold finger connector and the interface are matched and connected with each other, the isolation rib is received in the receiving groove.

20. The connector assembly according to claim 19, wherein: A metal spring sheet is arranged on the surface of the isolation barrier rib, and a metal layer is arranged on the inner wall of the receiving groove. When the isolation barrier rib is received in the receiving groove, the metal spring sheet abuts against the metal layer.

21. The connector assembly according to any one of claims 18 to 19, characterized in that: The cross-sectional width of the substrate in the first direction is 9.3 mm to 12 mm.

22. The connector assembly according to claim 21, characterized in that The width of the first protrusion in the first direction is 0.1 mm to 1.5 mm; the width of the second protrusion in the first direction is 0.1 mm to 1.5 mm.

23. A communication device, characterized in that: The communication device comprises a circuit board and an interface according to any one of claims 12 to 15, wherein the interface is arranged on the circuit board.

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