Insulation film and window structure

Abstract

An insulation film according to embodiments of the present invention comprises: a base layer; and an insulation layer that is disposed on the base layer and includes conductive patterns arranged separately from each other and separation regions between the conductive patterns. The sum of the length of one side of the conductive pattern and the width of the separation region is 50-250 µm, and the area of the separation region is more than 3% and no more than 20% of the total area of the insulation layer in a plan view.

Description

Insulating films and window structures

[0001] The present invention relates to an insulating film and a window structure. More particularly, it relates to an insulating film and a window structure comprising a plurality of patterns.

[0002]

[0003] Recently, to improve heating and cooling efficiency and energy efficiency, low-emissivity (L-E) glass with high insulation properties has been used in building exterior walls, windows, and vehicle windows. However, because low-E glass contains a metallic coating formed on the glass surface, it can hinder and block the movement of radio waves, increasing radio wave loss.

[0004] For example, as the information society develops, wireless communication technologies such as Wi-Fi and Bluetooth are being applied or built into display devices, electronic devices, buildings, the Internet of Things (IoT), and autonomous vehicles. Furthermore, with the recent advancement of mobile communication technology, antennas for high-frequency and ultra-high-frequency communication are being widely applied. For example, along with Wi-Fi, which operates in bands such as 2.4 GHz and 5 GHz, and Bluetooth, which operates in the 2.45 GHz band, 5G (5th-generation) communication systems, which operate in high-frequency bands (e.g., 28 GHz or higher), are being commercialized.

[0005] However, electromagnetic waves in the high-frequency or ultra-high-frequency bands have high transmission speeds and short wavelengths, and can be lost, attenuated, or dissipated when passing through windows or car glass. Consequently, the antenna's signal efficiency and coverage may be reduced. Installing or forming an electromagnetic wave-transmitting area in low-E glass to compensate for signal loss may also reduce insulation.

[0006] Therefore, there is a need to design an insulating film that ensures thermal insulation while suppressing the loss of electromagnetic waves emitted from antennas, radars, etc. For example, Korean Patent Publication No. 10-2013-0048132 discloses an insulating film, but does not consider electromagnetic wave transmittance.

[0007]

[0008] One object of the present invention is to provide an insulating film having improved radio wave transmittance and insulating properties.

[0009] An object of the present invention is to provide a window structure having improved radio wave transmittance and thermal insulation.

[0010]

[0011] 1. A substrate layer; and an insulating layer disposed on the substrate layer and including conductive patterns arranged separately from each other and a separation region between the conductive patterns,

[0012] An insulating film, wherein the sum of the length of one side of the conductive pattern and the width of a separation region adjacent to the one side of the conductive pattern is 50 µm to 250 µm, and the area of ​​the separation region is more than 3% and less than 20% of the total area of ​​the insulating layer in a plane direction.

[0013] 2. In the above 1, the area of ​​the separation region is 5% to 20% of the total area of ​​the insulation layer in the plane direction, an insulating film.

[0014] 3. An insulating film in the above 1, wherein the sum of the length of one side of the conductive pattern and the width of the separation region adjacent to the one side of the conductive pattern is 100 µm to 250 µm.

[0015] 4. In the above 1, the insulating film has an island pattern shape that is physically spaced apart from each other.

[0016] 5. In the above 4, the insulating film, wherein the above challenge patterns each independently have a polygonal shape.

[0017] 6. In the above 1, the insulating film includes a first conductive pattern row including first conductive patterns arranged along the thermal direction and a second conductive pattern row including second conductive patterns arranged along the thermal direction.

[0018] 7. In the above 6, the first conductive pattern column and the second conductive pattern column are alternately and repeatedly arranged along the row direction, an insulating film.

[0019] 8. In the above 7, the first conductive pattern and the second conductive pattern have different polygonal shapes, an insulating film.

[0020] 9. In the above 8, the sum of the inner angles of the first conductive pattern and the inner angles of the second conductive pattern adjacent in the row direction is 180°, an insulating film.

[0021] 10. In the above 8, the first conductive patterns include a first pattern and a second pattern that are alternately and repeatedly arranged along the thermal direction, and the second conductive patterns include a third pattern and a fourth pattern that are alternately and repeatedly arranged along the thermal direction, an insulating film.

[0022] 11. In the above 10, the second pattern has a shape in which the first pattern is flipped in the thermal direction, and the fourth pattern has a shape in which the third pattern is flipped in the thermal direction, an insulating film.

[0023] 12. In the above 1, the open ratio expressed by the following formula 1 is 0.5 to 1.4, the insulating film:

[0024] [Formula 1]

[0025] Open ratio = GW / AR

[0026] (In Equation 1, GW is a numerical value of the width (㎛) of the separation area, and AR is a numerical value of the percentage (%) of the area of ​​the separation area among the total area of ​​the insulation layer).

[0027] 13. In the above 1, the above challenge patterns are insulating films having a solid structure.

[0028] 14. In the above 1, the insulating film includes an electrode layer including the conductive pattern and the separation region, a lower insulating layer disposed between the substrate layer and the electrode layer, and an upper insulating layer disposed on the electrode layer.

[0029] 15. In the above 14, the electrode layer is an insulating film containing a transparent conductive oxide.

[0030] 16. In the above 14, the insulating film further includes an adhesive layer disposed between the base layer and the lower insulating layer.

[0031] 17. A lower substrate; an upper substrate arranged spaced apart from the lower substrate; and an insulating layer arranged on the lower substrate, the insulating layer including conductive patterns arranged separately from each other and a separation region between the conductive patterns.

[0032] A window structure, wherein the sum of the length of one side of the conductive pattern and the width of the separation region adjacent to the one side of the conductive pattern is 50 µm to 250 µm, and the area of ​​the separation region is more than 3% and less than 20% of the total area of ​​the insulating layer in the planar direction.

[0033] 18. A window structure further comprising an air layer formed between the lower substrate and the upper substrate in the above 17.

[0034] 19. A window structure further comprising an interlayer insulating layer sandwiched between the lower substrate and the upper substrate in the above 17.

[0035]

[0036] An insulating film according to embodiments of the present invention may include an insulating layer comprising a plurality of conductive patterns and a separation region between the conductive patterns. The period of the conductive patterns and the area of ​​the separation region may be adjusted within a predetermined range. Accordingly, the thermal resistance and thermal insulation properties of the insulating film may be improved, while simultaneously enhancing optical properties and electromagnetic wave transmission properties.

[0037] The ratio of the area of ​​the above-mentioned separation region and the width of the above-mentioned separation region can be adjusted within a predetermined range. Accordingly, the electromagnetic wave transmittance can be increased by suppressing reflection and destructive interference of electromagnetic waves while suppressing heat flow and transfer through the separation region.

[0038]

[0039] FIG. 1 is a schematic plan view showing an insulating film according to exemplary embodiments.

[0040] Figure 2 is a schematic cross-sectional view showing an insulating film according to exemplary embodiments.

[0041] Figure 3 is a schematic plan view that enlarges area A of Figure 1.

[0042] Figure 4 is a schematic plan view showing an insulating film according to exemplary embodiments.

[0043] Figure 5 is a schematic plan view showing an insulating film according to exemplary embodiments.

[0044] Figure 6 is a schematic plan view showing an insulating film according to exemplary embodiments.

[0045] Figure 7 is a schematic plan view showing an insulating film according to exemplary embodiments.

[0046] FIGS. 8 and 9 are schematic cross-sectional views each showing a window structure according to exemplary embodiments.

[0047] Figure 10 is a graph showing radio wave transmittance according to embodiments.

[0048]

[0049] Embodiments of the present invention provide an insulating film including a challenge pattern.

[0050] Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings. However, the following drawings attached to this specification illustrate preferred embodiments of the present invention and, together with the contents of the invention described above, serve to further understand the technical concept of the present invention. Therefore, the present invention should not be interpreted as being limited to the matters described in such drawings.

[0051] The terms “upper”, “lower”, “top surface”, “bottom surface”, etc. used in the present invention indicate the relative positions of each component and do not imply an absolute superior-subordinate relationship.

[0052] Fig. 1 is a schematic plan view showing an insulating film according to exemplary embodiments. Fig. 2 is a schematic cross-sectional view showing an insulating film according to exemplary embodiments.

[0053] Referring to FIGS. 1 and 2, the insulating film may include a substrate layer (100) and an insulating layer (105) disposed on the upper surface of the substrate layer (100).

[0054] The substrate layer (100) may include, for example, a resin material. For example, the substrate layer (100) may include a polyester resin such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, or polybutylene terephthalate; a cellulose resin such as diacetyl cellulose or triacetyl cellulose; a polycarbonate resin; an acrylic resin such as polymethyl (meth)acrylate or polyethyl (meth)acrylate; a styrene resin such as polystyrene or an acrylonitrile-styrene copolymer; a polyolefin resin such as polyethylene, polypropylene, a polyolefin having a cyclo- or norbornene structure, or an ethylene-propylene copolymer; a vinyl chloride resin; an amide resin such as nylon or an aromatic polyamide; an imide resin; a polyethersulfone resin; a sulfone resin; a polyetheretherketone resin; a sulfated polyphenylene resin; a vinyl alcohol resin; It may include vinylidene chloride resin; vinyl butyral resin; allylate resin; polyoxymethylene resin; epoxy resin; urethane or acrylic urethane resin; silicone resin, etc. These may be used alone or in combination of two or more.

[0055] In some embodiments, the substrate layer (100) may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, glass, or the like.

[0056] The insulating layer (105) may include an electrode layer (120). The electrode layer (120) may include conductive patterns (121) and a separation region (125) between the conductive patterns (121).

[0057] The challenge patterns (121) may be arranged periodically. For example, the challenge patterns (121) may be arranged along the column direction (second direction) and the row direction (first direction) parallel to the upper surface of the substrate layer (100).

[0058] The conductive patterns (121) may be physically separated from each other. For example, the conductive patterns (121) may have an island pattern shape that is physically separated from each other. Accordingly, a separation region (125) may be formed between the conductive patterns (121) to separate the conductive patterns (121) from each other.

[0059] A separation region (125) is formed between the conductive patterns (121), thereby increasing the transmittance of electromagnetic waves. For example, when electromagnetic waves pass through a metal layer, absorption or reflection of the electromagnetic waves due to the metal component may increase. In addition, in high-frequency or ultra-high-frequency bands such as 4G / 5G, the wavelength of the electromagnetic waves is short and diffraction is difficult, which may further increase the loss of the electromagnetic waves.

[0060] According to exemplary embodiments, the separation region (125) can reduce electromagnetic wave extinction and reflection, thereby increasing transmittance. Accordingly, transmission loss and attenuation can be prevented even in high frequency bands, and signal strength can be increased.

[0061] The area of ​​the separation region (125) may be 20% or less of the total area of ​​the insulation layer (105) in the planar direction (third direction). For example, the total area of ​​the conductive patterns (121) may be 80% or more of the total area of ​​the insulation layer (105).

[0062] Within the above range, the electromagnetic wave transmittance of the insulating film can be increased while the insulating properties can be further improved. For example, when the area of ​​the separation region (125) exceeds 20%, the thermal energy passing through the separation region (125) can increase, and the thermal resistance and insulating properties of the insulating layer (105) can be reduced.

[0063] The area of ​​the separation area (125) may exceed 3% of the total area of ​​the insulation layer (105). If the area of ​​the separation area (125) is less than 3%, the electromagnetic wave transmittance may be reduced.

[0064] In some embodiments, the area of ​​the isolation region (125) may be 5% to 20% of the total area of ​​the insulation layer (105), preferably 5% to 15%, and more preferably 5% to 10%. Within this range, electromagnetic wave transmittance through the isolation region (125) may be increased while heat transfer and radiation may be reduced. Accordingly, the radio wave transmittance and thermal insulation properties of the insulation film may be further improved.

[0065] Figure 3 is a schematic plan view that enlarges area A of Figure 1.

[0066] According to exemplary embodiments, the sum of the length (PW) of one side of the conductive pattern (121) and the width (GW) of the separation region (125) adjacent to the one side of the conductive pattern (121) may be 50 μm to 250 μm. For example, the width (GW) may refer to the width of the separation region (125) in the extension direction of the one side of the conductive pattern (121). Hereinafter, the sum of the length (PW) of one side of the conductive pattern (121) and the width (GW) of the separation region (125) may be referred to as the period of the conductive patterns (121).

[0067] Within the above range, the insulation layer (105) can block radiation in the infrared or far infrared region while increasing the transmittance for electromagnetic waves in the high frequency or ultra-high frequency band.

[0068] For example, when the period of the conductive patterns (121) exceeds 250 μm, the size of the conductive patterns (121) increases, which may increase reflection and destructive interference of electromagnetic waves, and the electromagnetic wave transmittance of the insulating film may decrease. For example, when the period of the conductive patterns (121) is less than 50 μm, etching defects due to a substantially fine pitch may occur, or the conductive patterns (121) may be electrically connected to each other. Accordingly, electromagnetic interference may occur during the passage of electromagnetic waves, which may deteriorate the transmittance characteristics.

[0069] In some embodiments, the period of the conductive patterns (121) may be 50 μm to 200 μm, preferably 100 μm to 250 μm, and more preferably more than 100 μm and less than or equal to 200 μm. Within the above range, electrical isolation between the conductive patterns (121) can be secured, and electromagnetic wave transmittance can be further improved while suppressing an increase in thermal transmittance and thermal emissivity.

[0070] In some embodiments, the open ratio of the insulation layer represented by Equation 1 may be 0.5 to 1.4.

[0071] [Formula 1]

[0072] Open ratio = GW / AR

[0073] In Equation 1, GW is a numerical value of the width (㎛) of the separation region, and AR is a numerical value of the ratio (percentage, %) of the area of ​​the separation region to the total area of ​​the insulation layer. For example, GW is a numerical value excluding the unit from the width of the separation region measured in ㎛, and AR is a numerical value excluding the unit from the area of ​​the separation region measured in % of the total area of ​​the insulation layer.

[0074] Within the above range, the width of the separation area can be appropriately adjusted according to the aperture ratio (AR) of the insulation layer, thereby preventing a decrease in insulation properties while increasing the electromagnetic wave transmittance. For example, even with the same aperture ratio, as the width of the separation area increases, the thermal emissivity may increase, and as the width of the separation area decreases, the electromagnetic wave transmittance characteristics may deteriorate.

[0075] In one embodiment, the open ratio represented by the above formula 1 may be 0.5 to 1.4, and preferably may be greater than 1.0 and less than or equal to 1.4. Within this range, radio wave transmittance may be improved while facilitating the design and manufacture of the pattern.

[0076] In some embodiments, the conductive pattern (121) may include a solid structure. Accordingly, the thermal resistance of the conductive pattern (121) may be increased, and the open area within the insulating film may be controlled so that the insulating film may have low thermal emissivity and thermal transmittance.

[0077] In some embodiments, the electrode layer (120) may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these. These may be used alone or in combination of two or more thereof.

[0078] In one embodiment, the electrode layer (120) may include silver (Ag) or a silver alloy (e.g., a silver-palladium-copper (APC) alloy), or copper (Cu) or a copper alloy (e.g., a copper-calcium (CuCa) alloy).

[0079] In some embodiments, the electrode layer (120) may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), aluminum zinc oxide (AZO), zinc oxide (ZnOx), indium oxide (InOx), tin oxide (SnOx), cadmium tin oxide (CTO), gallium-doped zinc oxide (GZO), zinc tin oxide (ZTO), or indium gallium oxide (IGO).

[0080] In some embodiments, the electrode layer (120) may include a laminated structure of a transparent conductive oxide layer and a metal layer, and may have, for example, a two-layer structure of a transparent conductive oxide layer-metal layer, or a three-layer structure of a transparent conductive oxide layer-metal layer-transparent conductive oxide layer.

[0081] The metal layer may include the metal or alloy described above. The transparent conductive oxide layer may include the transparent conductive oxide described above. The metal layer may improve thermal insulation properties, and the transparent conductive oxide layer may improve corrosion resistance and transparency.

[0082] In some embodiments, the insulation layer (105) may further include a lower insulation layer (130) disposed between the substrate layer (100) and the electrode layer (120) and / or an upper insulation layer (140) disposed on the electrode layer (120).

[0083] The lower insulating layer (130) may be provided as a base layer or buffer layer of the electrode layer (120). The mechanical properties and stability, such as crack resistance, of the electrode layer (120) may be improved by the lower insulating layer (130).

[0084] The upper insulating layer (140) may be provided as a passivation layer or a protective film. The upper insulating layer (140) may prevent oxidation and corrosion of the metal or metal oxide included in the electrode layer (120).

[0085] In one embodiment, the lower insulating layer (130) and the upper insulating layer (140) may include an organic insulating material such as an epoxy resin, an acrylic resin, an imide-based resin, or an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, or the like.

[0086] In one embodiment, a transparent insulating resin may be provided as the lower insulating layer (130) and the upper insulating layer (140). For example, the transparent insulating resin may be a polyester-based resin such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, or polybutylene terephthalate; a cellulose-based resin such as diacetyl cellulose or triacetyl cellulose; a polycarbonate-based resin; an acrylic-based resin such as polymethyl (meth)acrylate or polyethyl (meth)acrylate; a styrene-based resin such as polystyrene or an acrylonitrile-styrene copolymer; a polyolefin-based resin such as polyethylene, polypropylene, a polyolefin having a cyclo-based or norbornene structure, or an ethylene-propylene copolymer; a vinyl chloride-based resin; an amide-based resin such as nylon or an aromatic polyamide; an imide-based resin; a polyethersulfone-based resin; a sulfone-based resin; a polyetheretherketone-based resin; It may include sulfated polyphenylene resin; vinyl alcohol resin; vinylidene chloride resin; vinyl butyral resin; allylate resin; polyoxymethylene resin; epoxy resin; urethane or acrylic urethane resin, etc. These may be used alone or in combination of two or more.

[0087] In some embodiments, the dielectric constants of the lower insulating layer (130) and the upper insulating layer (140) can be adjusted to a range of about 2 to 12, respectively. Within this range, transmission loss due to refraction and reflection of electromagnetic waves can be suppressed.

[0088] According to exemplary embodiments, the insulating layer (105) may further include a point-of-contact adhesive layer (110). The point-of-contact adhesive layer (110) may be formed on one surface of the insulating layer (105) that is in contact with the substrate layer (100).

[0089] In some embodiments, the adhesive layer (110) may include an adhesive film such as an optically clear adhesive (OCA), an optically clear resin (OCR), or the like.

[0090] In some embodiments, the insulating film may be manufactured by the method described below.

[0091] A preliminary electrode layer can be formed on the upper surface of the substrate layer (100). For example, the preliminary electrode layer can be formed by a vacuum deposition method, a physical deposition method, a chemical deposition method, a plasma deposition method, a plasma polymerization method, a thermal deposition method, a thermal oxidation method, an anodic oxidation method, a cluster ion beam deposition method, a screen printing method, a gravure printing method, a flexographic printing method, an offset printing method, an inkjet coating method, a dispenser printing method, a photolithography method, or the like.

[0092] In one embodiment, the preliminary electrode layer can be formed through a plasma deposition method, for example, a sputtering process.

[0093] In one embodiment, before forming the preliminary electrode layer, a lower insulating layer (130) and / or a point-of-contact adhesive layer (110) may be first formed on the substrate layer (100). For example, an insulating resin may be coated on the upper surface of the substrate layer (100) to form the lower insulating layer (130) and / or the point-of-contact adhesive layer (110).

[0094] A photoresist layer can be formed by applying a photoresist composition on the upper surface of the above-mentioned preliminary electrode layer.

[0095] The above photoresist layer can be exposed to light to form an exposed portion and a non-exposed portion. A mask can be placed on the non-exposed portion before exposing the above photoresist layer.

[0096] In one embodiment, a photoresist pattern can be formed by selectively removing either an exposed portion or an unexposed portion through a development process. For example, when the photoresist composition has a positive type, the exposed portion can be removed through a development process, and the unexposed portion can remain, thereby forming a photoresist pattern. For example, when the photoresist composition has a negative type, the unexposed portion can be removed through a development process, and the exposed portion can remain, thereby forming a photoresist pattern.

[0097] In one embodiment, the developing process may be performed using a developer having strong basicity. For example, the developer may include an ammonium-based solution such as tetramethylammonium hydroxide (TMAH).

[0098] The preliminary electrode layer can be etched using the photoresist pattern as a mask. The photoresist pattern can have the same shape as the conductive patterns (121). By etching the preliminary electrode layer, an electrode layer (120) including the conductive patterns (121) and a separation region (125) can be formed.

[0099] In one embodiment, the etching process for the preliminary electrode layer may be performed using an etchant solution. The etchant solution may include an acidic solution, for example, phosphoric acid, nitric acid, hydrochloric acid, hydrogen peroxide, and / or acetic acid.

[0100] In some embodiments, the photoresist remaining on the electrode layer (120) can be removed through a strip process or an ashing process.

[0101] In one embodiment, an upper insulating layer (140) may be formed by applying and curing an insulating resin on the upper surface of the electrode layer (120).

[0102] According to exemplary embodiments, the conductive pattern (121) may have a polygonal shape such as a triangle, a square, a rhombus, a parallelogram, a pentagon, a hexagon, etc. For example, referring to FIG. 3, the conductive pattern (121) may be a solid pattern having a square shape.

[0103] Figures 4 and 5 are schematic plan views showing insulating films according to exemplary embodiments.

[0104] Referring to FIG. 4, the conductive patterns (121) may have a triangular shape. For example, the conductive patterns (121) in a triangular shape may be arranged so that the period of the conductive patterns (121) satisfies the above-described range.

[0105] Referring to FIG. 5, the conductive patterns (121) may have a hexagonal shape. For example, the conductive patterns (121) having a hexagonal shape may be arranged so that the period of the conductive patterns (121) satisfies the above-described range.

[0106] In one embodiment, the sum of the internal angles of the vertices of the facing conductive patterns (121) may be 360°. Accordingly, the conductive patterns (121) may be arranged more densely, and the aperture ratio of the insulating film may be reduced, thereby improving the insulating properties.

[0107] For example, in FIG. 4, the sum of the internal angles θ1, θ2, θ3, θ4, θ5, and θ6 of the triangular-shaped conductive patterns (121) facing each other may be 360°. For example, in FIG. 5, the sum of the internal angles θ1, θ2, and θ3 of the hexagonal-shaped conductive patterns (121) facing each other may be 360°.

[0108] Figures 6 and 7 are schematic plan views showing insulating films according to exemplary embodiments.

[0109] Referring to FIGS. 6 and 7, the conductive patterns (121) may include a first conductive pattern (122) and a second conductive pattern (123) alternately arranged along the row direction (first direction).

[0110] In some embodiments, the first conductive patterns (122) may be arranged in the column direction (second direction) to define a first conductive pattern column (121a). The second conductive patterns (123) may be arranged in the column direction to define a second conductive pattern column (121b).

[0111] The sum of the length (PW1) of one side of the first challenge pattern (122) and the width (GW) of the separation area (125), and the sum of the length (PW2) of one side of the second challenge pattern (123) and the width (GW) of the separation area (125) can each satisfy the above-described ranges.

[0112] In some embodiments, the first conductive pattern column (121a) and the second conductive pattern column (121b) may be alternately and repeatedly arranged along the row direction. For example, the first conductive pattern (122) and the second conductive pattern (123) may be arranged along the row direction such that the periods of the first and second conductive patterns (122, 123) each satisfy the above-described range.

[0113] In some embodiments, the first conductive pattern (122) and the second conductive pattern (123) may have different polygonal shapes. For example, the first conductive pattern (122) may have a hexagonal shape, and the second conductive pattern (123) may have a triangular shape (see FIG. 6 ). For example, the first conductive pattern (122) may have a parallelogram shape, and the second conductive pattern (123) may have a triangular shape.

[0114] Challenge patterns (121) having different shapes are alternately arranged to suppress moire occurrence and pattern visibility due to regular and repetitive arrangement of identical pattern shapes.

[0115] In some embodiments, the sum of the inner angles of the first conductive pattern (122) and the second conductive pattern (123) adjacent in the row direction may be 180°.

[0116] For example, in Fig. 6, the sum of the interior angle θ1 of the first conductive pattern (122) and the interior angle θ2 of the second conductive pattern (123) adjacent in the row direction may be 180°. In addition, the sum of the interior angle θ3 of the first conductive pattern (122) and the interior angle θ4 or θ5 of the second conductive pattern (123), and the sum of the interior angle θ6 of the first conductive pattern (122) and the interior angle θ4 or θ5 of the second conductive pattern (123) may also each be 180°.

[0117] For example, in FIG. 7, the sum of the interior angles θ2 of the first conductive pattern (122) adjacent in the row direction and the interior angle θ1 of the second conductive pattern (123) may be 180°. In addition, the sum of the interior angles θ3 and θ5 of the first conductive pattern (122) adjacent in the row direction and the interior angle θ4 of the second conductive pattern (123) may be 180°.

[0118] As the sum of the inner angles of adjacent conductive patterns (121) in the row direction is adjusted to 180°, the conductive patterns (121) can be arranged while interlocking with each other, and the aperture ratio of the electrode layer (120) and the width of the separation area (125) can be easily adjusted.

[0119] In some embodiments, the first challenge patterns (122) may include a first pattern (122a) and a second pattern (122b) alternately and repeatedly arranged along the thermal direction.

[0120] In one embodiment, the second pattern (122b) may have a shape in which the first pattern (122a) is flipped in the column direction. For example, the first pattern (122a) and the second pattern (122b) may have shapes that are symmetrical to each other.

[0121] In some embodiments, the second challenge patterns (123) may also include a third pattern (123a) and a fourth pattern (123b) alternately and repeatedly arranged along the thermal direction.

[0122] In one embodiment, the third pattern (123a) and the fourth pattern (123b) may have shapes that are symmetrical to each other, for example, the fourth pattern (123b) may have a shape that is flipped in the column direction with respect to the third pattern (123a).

[0123] The window structure according to embodiments of the present invention may include the above-described insulating layer.

[0124] FIGS. 8 and 9 are schematic cross-sectional views each showing a window structure according to exemplary embodiments.

[0125] Referring to FIGS. 8 and 9, the window structure may include a substrate (90) and an insulating layer (105) disposed on the substrate (90).

[0126] For example, the insulation layer (105) can be separated from the base layer (100) of the above-mentioned insulation film. The insulation layer (105) separated from the base layer (100) can be attached to the substrate (90) via the adhesive layer (110).

[0127] The substrate (90) may include, for example, glass and / or a transparent flexible polymer material. Examples of the transparent flexible polymer include cyclic olefin polymer (COP), polyethylene terephthalate (PET), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), polyallylate, polyimide (PI), cellulose acetate propionate (CAP), polyethersulfone (PES), cellulose triacetate (TAC), polycarbonate (PC), cyclic olefin copolymer (COC), polymethyl methacrylate (PMMA), etc.

[0128] In one embodiment, a glass substrate may be provided as a substrate (90) of a window structure. For example, a glass substrate of an object to which the window structure is applied may be provided as the substrate (90). The glass substrate may include, for example, glass such as a window of a building's exterior wall, a window included in an appliance, or automobile glass.

[0129] In one embodiment, the thickness of the glass substrate may be 2t to 10t, but is not limited thereto, and may be appropriately adjusted depending on the design purpose and target object.

[0130] The location and size of the area where the insulating layer (105) is formed on the substrate (90) can be designed or adjusted in consideration of the surrounding environment or the operating conditions of the antenna. For example, indoor and outdoor temperature, humidity, thickness and permittivity of the substrate, surrounding structures, permittivity and physical properties of the structures, height and signal transmission path of the window structure, frequency of electromagnetic waves, angle of incidence, and transmission distance, etc. can be taken into consideration.

[0131] Thermal energy such as thermal radiation passing through the window structure can be blocked by the insulating layer (105), thereby improving the insulating properties of the window structure. In addition, since the insulating layer (105) has high electromagnetic wave permeability, transmission loss due to the insulating layer (105) can be suppressed.

[0132] In one embodiment, the thermal transmittance of the window structure is 3.90 kcal / m 2 h℃ or less. Preferably, the thermal transmittance of the window structure is 3.70 kcal / m 2 h℃ or less, more preferably 3.50 kcal / m 2 h℃ to 3.60 kcal / m 2 It could be h℃.

[0133] In some embodiments, the window structure may further include an upper substrate (92). The upper substrate (92) may be disposed spaced apart from the substrate (90). For example, the window structure may have a pair glass form.

[0134] In one embodiment, the window structure may further include a spacer formed between the substrate (90) and the upper substrate (92). The spacer may maintain a gap between the substrate (90) and the upper substrate (92).

[0135] In one embodiment, an air layer (200) may be formed between the substrate (90) and the upper substrate (92). The air layer (200) may include air or argon (Ar) gas. The air layer (200) may further suppress heat flow through conduction and convection.

[0136] The insulating layer (105) may be formed on one surface of the substrate (90) facing the air layer (200). In one embodiment, the insulating layer (105) may be formed on the opposite surface of the surface of the substrate (90) facing the air layer (200).

[0137] In one embodiment, an insulating resin may be filled between the substrate (90) and the upper substrate (92). For example, the window structure may further include an interlayer insulating layer (300) sandwiched or embedded between the substrate (90) and the upper substrate (92).

[0138] The organic insulating material and / or inorganic insulating material described above may be used as the insulating resin, and a transparent insulating film may be used as the interlayer insulating layer (300).

[0139] The above window structure can be applied to various structures and objects, such as windows of public transportation such as buses and subways, buildings, windows, vehicles, decorative sculptures, and guidance signs (e.g., directional signs, emergency exit signs, emergency lights), etc. The above window structure can improve insulation and energy efficiency, thereby increasing the signal efficiency of an antenna or radar.

[0140]

[0141] Hereinafter, preferred embodiments are presented to help understand the present invention, but these embodiments are only illustrative of the present invention and do not limit the scope of the appended claims. It is obvious to those skilled in the art that various changes and modifications to the embodiments are possible within the scope and technical idea of ​​the present invention, and it is also natural that such changes and modifications fall within the scope of the appended claims.

[0142]

[0143] Experimental example

[0144] Examples and Comparative Examples

[0145] A glass substrate with an insulating film attached to the window structure was used. Specifically, an insulating layer including a conductive pattern and a separation region was attached to a glass substrate (thickness 4.8 μm) as shown in Fig. 1. The insulating layer was formed as a three-layer structure of a lower insulating layer, an electrode layer (IZO / APC / IZO), and an upper insulating layer. The insulating layer was bonded to the glass substrate using OCA (thickness 5 μm).

[0146] The conductive pattern was formed to have the shape of Fig. 3. The aperture ratio of the electrode layer, the period of the conductive pattern, and the width (㎛) of the separation region were set as shown in Tables 1 and 2 below.

[0147] The opening ratio of the electrode layer was calculated as the percentage (%) of the area of ​​the separation region among the total area of ​​the electrode layer, and the period (㎛) of the conductive pattern was calculated as the sum of the length of one side of the conductive pattern (PW) and the width (GW) of the adjacent separation region. The open ratio was calculated using the above equation 1.

[0148] In Comparative Example 1, an electrode layer was coated on the entire surface of a glass substrate without a separation region. In Comparative Example 2, an insulating layer was not formed on the glass substrate.

[0149]

[0150] Aperture ratio AR(%) Period of challenge pattern(㎛) Width of separation area GW(㎛) Open ratio(GW / AR) Example 151002.50.5Embodiment 251503.80.76Embodiment 352005.11.02Embodiment 452506.31.26Embodiment 55501.30.26Embodiment 6101005.10.51Embodiment 7101507.70.77Embodiment 81020010.31.03Embodiment 91025012.81.28Embodiment 1010502.60.26Embodiment 112010010.60.53Embodiment 122015015.80.79Embodiment 132020021.11.055Embodiment 142025026.41.32Embodiment 1520505.30.265

[0151] Aperture ratio AR(%) Period of challenge pattern(㎛) Width of separation area GW(㎛) Open ratio(GW / AR) Comparative example 10---Comparative example 2100---Comparative example 353007.61.52 Comparative example 4540010.12.02 Comparative example 51030015.41.54 Comparative example 61040020.52.05 Comparative example 72030031.71.585 Comparative example 82040042.22.11 Comparative example 93500.80.267 Comparative example 1031001.50.5 Comparative example 1131502.30.767 Comparative example 123 2003.01 Comparison Example 1332503.81.267 Comparison Example 1433004.51.5 Comparison Example 1534006.02 Comparison Example 1630508.20.273 Comparison Example 173010016.30.543 Comparison Example 183015024.50.817 Comparison Example 193020032.71.09 Comparison Example 203025040.81.36 Comparison Example 213030049.01.633 Comparison Example 223040065.32.177

[0152] Radio transmission loss assessment

[0153] The radio wave transmission loss for the window structure was evaluated. The radio wave transmission loss was measured as a relative value to the transmission in air in the frequency range of 3 GHz to 4.5 GHz (Sub-6 5G) and 27 GHz to 29 GHz (n257 5G).

[0154]

[0155] Insulation evaluation

[0156] The thermal emissivity of the window structure was measured using an infrared spectroscopy (FT-IR) according to KS L 2514. The thermal transmittance of the window structure was measured using the measured emissivity according to KS L 2003:2013.

[0157] The evaluation results are shown together in Tables 3 and 4 below.

[0158]

[0159] Radio transmittance, insulation, Sub-6 (dB), n257 (dB), thermal emissivity, thermal transmittance (kcal / m) 2h℃)Example 1-3.13-4.350.0603.55Example 2-3.18-4.750.0613.55Example 3-3.17-5.060.0613.55Example 4-3.24-13.390.0603.55Example 5-3.10-4.280.0623.55Example 6-3.02-4.060.1013.67Example 7-3.09-4.200.1013.67Example 8-3.17-4.510 .1013.67 Example 9-3.17-4.600.1013.67 Example 10-2.98-4.010.1023.67 Example 11-2.99-4.640.1833.91 Example 12-3.00-4.020.1823.91 Example 13-3.02-4.320.1823.91 Example 14-3.08-4.290.1823.91 Example 15-2.95-3.970.1833.91

[0160] Radio transmittance, insulation, Sub-6 (dB), n257 (dB), thermal emissivity, thermal transmittance (kcal / m) 2 h℃) Comparative Example 1 - -0.020 3.43 Comparative Example 2 - 2.83 - 3.65 0.84 35.83 Comparative Example 3 - 3.35 - 13.16 0.06 13.55 Comparative Example 4 - 3.33 - 16.25 0.06 03.55 Comparative Example 5 - 3.20 - 10.9 10.10 13.67 Comparative Example 6 - 3.20 - 12.57 0. 1013.67Comparative Example 7-3.08-4.620.1833.91Comparative Example 8-3.19-4.750.1823.91Comparative Example 9-3.12-6.890.0463.50Comparative Example 10-3.18-7.710.0443.50Comparative Example 11-3.24-8.550.0453.50Comparative Example 12-3 .43-12.430.0443.50Comparative Example 13-3.21-14.460.0383.48Comparative Example 14-3.38-15.010.0443.50Comparative Example 15-3.33-18.970.0443.50Comparative Example 16-2.87-3.700.2644.15Comparative Example 17-2.94-4. 080.2634.15Comparative Example 18-2.91-3.900.2644.15Comparative Example 19-2.98-3.910.2644.15Comparative Example 20-3.01-4.040.2634.15Comparative Example 21-3.02-4.150.2644.15Comparative Example 22-3.06-4.450.2634.15

[0161] Referring to Tables 1 to 4, in the embodiments, the window structure had high radio wave transmittance while having low thermal emissivity and thermal transmittance.

[0162] However, in the comparative examples, the period and open ratio of the challenge pattern did not satisfy the above-described range, and the transmission loss increased. Furthermore, in the comparative examples, the transmission loss in the ultra-high frequency band increased more rapidly than in the examples.

[0163]

[0164] Experimental example

[0165] A glass substrate with an insulating film attached was used as a window structure. Specifically, an insulating layer including a conductive pattern and a separation region was attached to a glass substrate (4.8 μm thick) as shown in Fig. 1. The insulating layer was formed as a three-layer structure of a lower insulating layer - an electrode layer (IZO / APC / IZO) - an upper insulating layer. The conductive pattern was formed to have the shape shown in Fig. 3. The insulating layer was bonded to the glass substrate via OCA (5 μm thick).

[0166] The aperture ratio of the electrode layer was adjusted to 10%. The period (㎛) of the conductive pattern was adjusted to 100 ㎛, 150 ㎛, 300 ㎛, 400 ㎛, and 500 ㎛, and the radio wave transmittance was measured for each period.

[0167] Radio transmittance was measured as a relative value to the transmittance in air in the frequency range of 27 GHz to 30 GHz (n257 5G).

[0168] Figure 10 is a graph showing radio wave transmittance according to embodiments.

[0169] Referring to Fig. 10, even when the aperture ratio is the same, when the period of the conductive pattern is 300 μm or more, the transmission loss of radio waves increases in the ultra-high frequency band. However, in examples where the period of the conductive pattern is 100 μm and 150 μm, the transmission loss of radio waves was substantially similar to that of the glass substrate.

Claims

1. Base layer; and An insulating layer is disposed on the above substrate layer and includes conductive patterns arranged separately from each other and a separation region between the conductive patterns. The sum of the length of one side of the above challenge pattern and the width of the separation region adjacent to the one side of the above challenge pattern is 50 ㎛ to 250 ㎛, An insulating film, wherein the area of ​​the above-mentioned separation region is greater than 3% and less than or equal to 20% of the total area of ​​the above-mentioned insulating layer in a plane direction.

2. An insulating film according to claim 1, wherein the area of ​​the separation region is 5% to 20% of the total area of ​​the insulating layer in a plane direction.

3. An insulating film according to claim 1, wherein the sum of the length of one side of the conductive pattern and the width of the separation region adjacent to the one side of the conductive pattern is 100 µm to 250 µm.

4. An insulating film according to claim 1, wherein the challenge patterns have an island pattern shape that is physically spaced from one another.

5. An insulating film according to claim 4, wherein each of the challenge patterns independently has a polygonal shape.

6. An insulating film according to claim 1, wherein the conductive patterns include a first conductive pattern row including first conductive patterns arranged along the thermal direction and a second conductive pattern row including second conductive patterns arranged along the thermal direction.

7. An insulating film according to claim 6, wherein the first challenge pattern column and the second challenge pattern column are alternately and repeatedly arranged along the row direction.

8. An insulating film according to claim 7, wherein the first challenging pattern and the second challenging pattern have different polygonal shapes.

9. An insulating film according to claim 8, wherein the sum of the inner angles of the first conductive pattern and the inner angles of the second conductive pattern adjacent in the row direction is 180°.

10. In claim 8, the first challenge patterns include a first pattern and a second pattern alternately and repeatedly arranged along the heat direction, An insulating film, wherein the second challenge patterns include third patterns and fourth patterns alternately and repeatedly arranged along the thermal direction.

11. An insulating film according to claim 10, wherein the second pattern has a shape in which the first pattern is flipped in the thermal direction, and the fourth pattern has a shape in which the third pattern is flipped in the thermal direction.

12. In claim 1, an insulating film having an open ratio expressed by the following formula 1 of 0.5 to 1.4: [Formula 1] Open ratio = GW / AR (In Equation 1, GW is a numerical value of the width (㎛) of the separation area, and AR is a numerical value of the percentage (%) of the area ratio of the separation area to the total area of ​​the insulation layer).

13. An insulating film according to claim 1, wherein the challenge patterns have a solid structure.

14. An insulating film according to claim 1, wherein the insulating layer comprises an electrode layer including the conductive pattern and the separation region, a lower insulating layer disposed between the substrate layer and the electrode layer, and an upper insulating layer disposed on the electrode layer.

15. An insulating film according to claim 14, wherein the electrode layer comprises a transparent conductive oxide.

16. An insulating film according to claim 14, wherein the insulating layer further includes a point-adhesive layer disposed between the substrate layer and the lower insulating layer.

17. Lower substrate; an upper substrate positioned spaced apart from the lower substrate; and It comprises an insulating layer disposed on the lower substrate and including conductive patterns arranged separately from each other and a separation region between the conductive patterns, The sum of the length of one side of the above challenge pattern and the width of the separation region adjacent to the one side of the above challenge pattern is 50 ㎛ to 250 ㎛, A window structure, wherein the area of ​​the above separation region is greater than 3% and less than or equal to 20% of the total area of ​​the insulation layer in a plane direction.

18. A window structure according to claim 17, further comprising an air layer formed between the lower substrate and the upper substrate.

19. A window structure according to claim 17, further comprising an interlayer insulating layer sandwiched between the lower substrate and the upper substrate.

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