Printing apparatus for manufacturing electronic device and control method thereof

Abstract

The present invention relates to a printing apparatus for manufacturing an electronic device, and the printing apparatus comprises: an electronic ink formulation module for manufacturing an electronic ink for electronic device printing; a design processing module for performing gravure roll design for each layer to be printed on the basis of a circuit layout of the electronic device; a plurality of roll-to-roll printing modules for performing printing in stages according to the number of layers to be printed for each electronic device; and a processor for controlling the electronic ink formulation module, the design processing module, a sensor module, and the roll-to-roll printing modules, controlling a printing process through interaction, and evaluating an operation result of each module or performing simulation for evaluation.

Description

Printing device for manufacturing electronic components and its control method

[0001] The present invention relates to a printing device for manufacturing electronic devices and a control method thereof, which enables manufacturing electronic devices using a roll-to-roll (R2R: Roll-to-Roll) gravure continuous printing method.

[0002] Existing semiconductor manufacturing technology has the problem of increasing carbon dioxide and harmful byproduct emissions while producing hundreds of billions of CPUs (computer chips) per day.

[0003] Accordingly, interest in sustainable manufacturing technologies that can reduce or offset carbon dioxide and hazardous byproduct emissions is growing significantly.

[0004] Flexible electronic printing has been introduced, but it has not entered the market due to various limitations such as lack of surrounding infrastructure and technical difficulties in implementing uniformly stable electronic devices.

[0005] Among the various printing methods for flexible electronic printing, R2R (roll-to-roll) gravure printing, in particular, is considered a process close to commercialization due to its advantage in high-speed mass production, unlike other printing methods (e.g., inkjet, screen printing, R2P (roll-to-plate)). However, because high-speed printing requires precise overlapping of each printed layer and rapid drying of the transferred ink, there are limitations in manufacturing electronic devices with the desired performance through the R2R printing process.

[0006] In addition, in order to apply printed electronics (i.e., flexible electronic printing) to various electronic device manufacturing fields, i.e., to produce electronic devices with excellent stability (e.g., transistors, processors, etc.), process optimization is required.

[0007] Printed electronic devices (i.e., electronic devices manufactured using a printing method) have the advantage of reducing costs when establishing a foundry because they are manufactured using low-temperature and simple processes compared to manufacturing plants (fabs) that produce silicon (Si) devices. However, there is a problem that the characteristics of electronic devices (e.g., transistors) are not uniform depending on the environment during the electronic device manufacturing process.

[0008] Therefore, there is a need for a printing device and a control method thereof that can manufacture highly stable electronic devices (e.g., transistors, processors, etc.) using a roll-to-roll (R2R) gravure continuous printing method through optimization of processes including device design, ink manufacturing, circuit design, and simulation.

[0009] According to one aspect, the present invention was created to solve the above problems, and its purpose is to provide a printing device for manufacturing electronic devices and a control method thereof, which enable manufacturing electronic devices using a roll-to-roll (R2R: Roll-to-Roll) gravure continuous printing method.

[0010] A printing device for manufacturing an electronic device according to one aspect of the present invention is characterized by including: an electronic ink formulation module for manufacturing electronic ink for printing an electronic device; a design processing module for performing gravure roll design for each layer to be printed based on a circuit layout of an electronic device; a plurality of roll-to-roll printing modules for performing stepwise printing according to the number of layers to be printed for each electronic device; and a processor for controlling the electronic ink formulation module, the design processing module, the sensor module, and the roll-to-roll printing module, controlling the printing process through interaction, and evaluating the operation results of each module or performing a simulation for evaluation.

[0011] In the present invention, the processor is characterized in that it adjusts the web tension control parameter value in order to perform printing optimization by minimizing errors due to changes in web tension of a flexible substrate.

[0012] In the present invention, the processor is characterized in that it adjusts ink transfer parameter values ​​so that the electronic device has uniform characteristics by adjusting ink transfer characteristics.

[0013] In the present invention, the processor is characterized in that it adjusts an overlapping precision control parameter value in order to manufacture an electronic device having uniform characteristics of a smaller size through precise overlapping of ink.

[0014] In the present invention, the processor further includes a sensor module for confirming whether a mark printed on a flexible substrate matches a design in each printing layer and is accurately printed at a predetermined position in order to confirm overlapping precision, and the sensor module is characterized by including a camera (CAM1) for confirming a mark printed on a previous printing layer on a flexible substrate being transported; a camera (CAM2) for confirming a mark etched on a roll for printing a current printing layer; and a camera (CAM3) for confirming whether a mark printed on a previous printing layer and a mark printed on a current printing layer match a design and are accurately printed at a predetermined position.

[0015] In the present invention, the electronic ink formulation module is characterized in that it performs a process prior to performing roll-to-roll (R2R) gravure printing, and performs an electronic ink formulation process, an evaluation process for the test results of electronic ink, and a preliminary printing test process using various printing equipment.

[0016] In the present invention, the design processing module is characterized by performing an initial circuit layout process using a processor design kit, a final circuit layout confirmation process by repeating a circuit redesign and optimization process based on the initial circuit layout process, and a gravure roll design for each printing layer based on the confirmed final circuit layout, and then performing an evaluation process for designated evaluation items.

[0017] In the present invention, the roll-to-roll printing module is characterized in that it performs ink rheology re-evaluation, printing environment adjustment, drying condition confirmation, printing speed, overlapping precision confirmation, web tension control, and nip pressure control in order to set an optimal roll-to-roll (R2R) printing process, and performs an overall device yield evaluation, device output characteristic evaluation, and optical and electrical evaluation processes for manufactured electronic devices.

[0018] A control method for a printing device for manufacturing an electronic device according to another aspect of the present invention comprises the steps of: manufacturing electronic ink for printing an electronic device through an electronic ink formulation module; performing a gravure roll design for each layer to be printed based on a circuit layout of an electronic device through a design processing module; performing printing step by step according to the number of layers to be printed for each electronic device through a plurality of roll-to-roll printing modules; and a step in which a processor controls the electronic ink formulation module, the design processing module, the sensor module, and the roll-to-roll printing module, controls the printing process through interaction, and evaluates the operation results of each module or performs a simulation for evaluation.

[0019] In the present invention, in order to perform printing optimization by minimizing errors due to changes in web tension of a flexible substrate, the processor is characterized by adjusting web tension control parameter values.

[0020] In the present invention, in order to make the electronic device have uniform characteristics by adjusting the ink transfer characteristics, the processor is characterized in that it adjusts the ink transfer parameter value.

[0021] In the present invention, in order to manufacture an electronic device having uniform characteristics of a smaller size through precise ink overlapping, the processor is characterized in that it adjusts an overlapping precision control parameter value.

[0022] In the present invention, after the step of performing the printing, the processor further includes a step of checking whether the mark printed on the flexible substrate matches the design in each printing layer and is accurately printed at a predetermined position in order to check the overlapping precision through a sensor module; wherein the sensor module includes a camera (CAM1) for checking the mark printed on the previous printing layer on the flexible substrate being transported; a camera (CAM2) for checking the mark etched on the roll for printing the current printing layer; and a camera (CAM3) for checking whether the mark printed on the previous printing layer and the mark printed on the current printing layer match the design and are accurately printed at a predetermined position.

[0023] In the present invention, in the step of manufacturing electronic ink for printing the electronic element, the electronic ink formulation module is characterized in that it performs a process prior to performing roll-to-roll (R2R) gravure printing, and performs an electronic ink formulation process, an evaluation process for the test results of the electronic ink, and a preliminary printing test process using various printing equipment.

[0024] In the present invention, in the step of performing the gravure roll design for each layer to be printed, the design processing module is characterized in that it performs an initial circuit layout process using a processor design kit, a final circuit layout confirmation process by repeating the circuit redesign and optimization process based on the initial circuit layout process, and a gravure roll design for each printing layer based on the confirmed final circuit layout, and then performs an evaluation process for designated evaluation items.

[0025] In the present invention, in the step of performing stepwise printing, the roll-to-roll printing module performs ink rheology re-evaluation, printing environment adjustment, drying condition confirmation, printing speed, overlapping precision confirmation, web tension control, and nip pressure control in order to set an optimal roll-to-roll (R2R) printing process, and performs an overall device yield evaluation, device output characteristic evaluation, and optical and electrical evaluation processes for the manufactured electronic device.

[0026] According to one aspect of the present invention, the present invention enables the manufacture of electronic devices using a roll-to-roll (R2R) gravure continuous printing method.

[0027] FIG. 1 is an exemplary diagram showing a schematic configuration of a printing device for manufacturing an electronic device according to one embodiment of the present invention.

[0028] FIG. 2 is an exemplary diagram for explaining the operation of the electronic ink formulation module (MD1) in FIG. 1.

[0029] Figure 3 is an exemplary diagram for explaining the operation of the design processing module (MD2) in Figure 1.

[0030] FIG. 4 is an exemplary diagram for explaining the operation of the roll-to-roll printing module (MD4) in FIG. 1.

[0031] FIG. 5 is an exemplary diagram showing a detailed schematic diagram of a printed electronic device manufactured through a high-speed laminated printing process using a printing device for manufacturing electronic devices as illustrated in FIG. 1.

[0032] Figure 6 is an exemplary diagram showing a schematic diagram of a printed transistor related to the present invention.

[0033] FIG. 7 is an exemplary diagram showing a measurement graph and an electrical characteristic graph of a simulation fitting result for a printed transistor manufactured according to one embodiment of the present invention.

[0034] FIG. 8 is a flowchart for explaining an LVS (Layout Versus Schematic) method according to one embodiment of the present invention.

[0035] FIG. 9 is an example diagram showing a simulation result graph for a 1-bit ALU (Arithmetic Logic Unit) among the 4-bit processor modules performed through a processor design kit (PDK) including LVS in FIG. 8.

[0036] FIG. 10 is an exemplary diagram showing an overall schematic diagram of a 4-bit processor according to one embodiment of the present invention.

[0037] FIG. 11 is an exemplary diagram showing each module of a 4-bit processor manufactured through actual roll-to-roll (R2R) gravure printing in FIG. 10.

[0038] FIG. 12 is an example diagram showing a driving board capable of demonstrating a 4-bit processor in FIG. 11.

[0039] FIGS. 13a to 13c are exemplary diagrams showing a truth table, simulation (prediction) results, and actual results for PHASE B, one of the 4-bit processor configuration modules in FIG. 11.

[0040] Hereinafter, an embodiment of a printing device for manufacturing an electronic device according to the present invention and a control method thereof will be described with reference to the attached drawings.

[0041] In this process, the thickness of lines and the sizes of components depicted in the drawings may be exaggerated for clarity and convenience. Furthermore, the terms described below are defined based on their functions within the present invention and may vary depending on the intent or custom of the user or operator. Therefore, the definitions of these terms should be based on the overall content of this specification.

[0042] FIG. 1 is an exemplary diagram showing a schematic configuration of a printing device for manufacturing an electronic device according to one embodiment of the present invention.

[0043] Referring to FIG. 1, a printing device for manufacturing an electronic device according to the present embodiment includes an electronic ink formulation module (MD1), a design processing module (MD2), a sensor module (MD3), a roll-to-roll printing module (MD4), and a processor (PSR).

[0044] In order for the printing device for manufacturing electronic components according to the present embodiment to perform high-speed laminated printing, the processor (PSR) can perform optimization for the following three parameters (items).

[0045] The first parameter is a web tension control parameter (see 200). If printing is performed with uneven tension, the amount of ink transferred on the surface of the film (flexible substrate) may vary, and the transport film (flexible substrate) itself frequently shrinks and expands depending on the web tension, making it impossible to manufacture electronic components of uniform quality. Therefore, in this embodiment, the value for this web tension is quantified and optimized so as to minimize errors resulting from changes in web tension. That is, although not specifically illustrated in the drawing, the processor (PSR) can adjust the parameter value to automatically adjust the positions of the transport rolls (see 200) on both sides of the film (flexible substrate), thereby adjusting the web tension.

[0046] The second parameter is the ink transfer parameter (see 300), which allows for obtaining uniform and high-performance electronic devices through proper ink transfer.

[0047] The final parameter is the overlapping precision control parameter (see 400). Since electronic components are manufactured through the overlapping of inks, the resulting characteristics vary depending on how precisely the overlapping is performed. For example, as the overlapping precision increases, smaller electronic components can be manufactured, and components with more uniform characteristics can be manufactured. If the overlapping precision exceeds 50 μm, the desired electrical characteristics cannot be achieved, and even if the desired electrical characteristics are achieved, the variation between electronic components will be very large.

[0048] That is, although not specifically shown in the drawing, the processor (PSR) can adjust the position / pressure / speed of the printing rolls (see 400) on the upper / lower sides of the film (flexible substrate) by adjusting the parameter values, thereby adjusting the overlapping precision.

[0049] The processor (PSR) can check the overlapping precision through the sensor module (MD3) to perform optimization for the overlapping precision control parameter (see 400) and to check whether the printed mark matches the design in each layer (printing layer) and is printed accurately at the specified location.

[0050] The sensor module (MD3) includes a camera (CAM1) for checking a mark printed on a previous layer (printing layer) on a film (flexible substrate) being transported, a camera (CAM2) for checking a mark (e.g., a T-shaped mark) etched on a roll (pattern roll) for printing the current layer (printing layer), and a camera (CAM3) for checking that the mark printed on the previous layer (printing layer) and the mark printed on the current layer (printing layer) match the design and are accurately located at a predetermined position.

[0051] The processor (PSR) can control the electronic ink formulation module (MD1), the design processing module (MD2), the sensor module (MD3), and the roll-to-roll printing module (MD4), and can also control the printing process through interaction, evaluate the operation results of each module, or perform simulations for evaluation.

[0052] FIG. 2 is an exemplary diagram for explaining the operation of the electronic ink formulation module (MD1) in FIG. 1.

[0053] The electronic ink formulation module (MD1) is performed before performing roll-to-roll (R2R) gravure printing.

[0054] The electronic ink formulation module (MD1) may include an electronic ink formulation process (100), an evaluation process (101) for the test results of electronic ink, and a preliminary printing process (102) using various printing equipment. In this case, the electronic ink formulation process (100), the evaluation process (101) for the test results of electronic ink, and the preliminary printing process (102) using various printing equipment are mutually complementary.

[0055] The electronic ink test evaluation process (101) is a process for evaluating manufactured electronic ink, and is fundamentally performed based on transistors. Considering the physical characteristics of these transistors (e.g., channel length, channel width), morphology and simple electrical characteristics can be verified.

[0056] In order to perform the electronic ink test evaluation process (101), a sample (e.g., transistor, diode, capacitor, etc.) can be manufactured and evaluated through a simple printing method (e.g., inkjet, screen, or drop casting) such as the preceding printing process (102).

[0057] For example, an evaluation can be performed on electronic inks (e.g., conductors, semiconductors, insulators, dielectrics, etc.) to be manufactured and used in R2R gravure printing through the electronic ink formulation module (MD1), and the ink formulation and its functionality can be changed depending on the purpose of the electronic ink being used. At this time, in the case of silver (Ag) conductor ink, conductivity is a priority, and the main material is silver (Ag) nanoparticles, and electronic ink can be formulated (manufactured) by adding a binder that can improve adhesion and a surface modifier that can improve ink transfer. In addition, in the case of semiconductor ink, a semiconductor material for imparting semiconductor properties can be composed as the main material, and a dispersant and a binder for well dispersing (inking) the semiconductor material can be contained to manufacture electronic ink.

[0058] In addition, the evaluation process (101) for the test results of electronic ink can evaluate the physical properties of the ink through a rheology evaluation for electronic ink manufactured through the electronic ink formulation module (MD1), and can ultimately evaluate whether it is suitable for roll-to-roll (R2R) gravure printing through an evaluation of the drying temperature of the ink.

[0059] In some embodiments, the electronic ink formulation module (MD1) may be configured to obtain information (e.g., evaluation items) about the design performed in the design processing (layer-by-layer gravure roll design) described below in advance, and perform the electronic ink formulation process (100), the evaluation process (101) for the test results of the electronic ink, and the preliminary printing process (102) using various printing equipment based on the information.

[0060] Figure 3 is an exemplary diagram for explaining the operation of the design processing module (MD2) in Figure 1.

[0061] Referring to FIG. 3, the design processing module (MD2) performs an initial circuit layout process using a Process Design Kit (PDK) (103), repeats a circuit redesign and optimization process based on this, and performs a final circuit layout confirmation process (104). Based on the confirmed final circuit layout, the module performs a layer-by-layer (i.e., print layer-by-print) gravure roll design, and then performs an evaluation process (105) for designated evaluation items (e.g., cell shape, depth, wall thickness, aspect ratio, eccentricity, mark precision, vertical / horizontal alignment error, etc.).

[0062] Here, the Processor Design Kit (PDK) (103) refers to a tool that can design a circuit layout suitable for printed electronics, and may include tasks such as modeling components, verifying circuits, and drawing diagrams suitable for printed electronics. Simulations of electronic components can be performed through the Processor Design Kit (PDK) (103), and through such simulations, the operability and yield of printed electronic components actually manufactured can be inferred (predicted).

[0063] Through the final circuit layout verification process (104), a circuit design suitable for roll-to-roll (R2R) is finally selected.

[0064] Through the gravure roll design and printing system evaluation process (105), the plate roll is processed, and through evaluation thereof, roll-to-roll (R2R) gravure printing is performed.

[0065] In this case, in the case of the roll-to-roll (R2R) plate roll, since it is impossible to maintain a perfect circle due to the plate structure, some evaluation items (e.g., eccentricity and mark precision) can be checked using separate plate roll measuring equipment.

[0066] FIG. 4 is an exemplary diagram for explaining the operation of the roll-to-roll printing module (MD4) in FIG. 1.

[0067] Referring to FIG. 4, the roll-to-roll printing module (MD4) performs multiple optimization processes (e.g., ink rheology reevaluation, printing environment adjustment, drying condition confirmation, printing speed, overlapping precision confirmation, web tension / nip pressure adjustment, etc.) (106) to set an optimal R2R printing process, thereby manufacturing electronic devices. In addition, the roll-to-roll printing module (MD4) performs an evaluation process (107) for multiple items (e.g., device overall yield evaluation, device output characteristic evaluation, optical and electrical evaluation, etc.) for the manufactured electronic devices.

[0068] The roll-to-roll printing module (MD4) can be implemented with multiple roll-to-roll printing modules depending on the number of layers (printing layers) to be printed.

[0069] FIG. 5 is an exemplary diagram showing a detailed schematic diagram of a printed electronic device manufactured through a high-speed laminated printing process using a printing device for manufacturing electronic devices as illustrated in FIG. 1.

[0070] Referring to FIG. 5, a printing element can be manufactured by stacking multiple layers based on a flexible substrate (500).

[0071] For example, a printed element can be manufactured by stacking a gate electrode, a dielectric layer, a semiconductor layer, a drain / source electrode layer, an insulator layer, a connection layer, a P-doped layer, and an N-doped layer in a stacking order.

[0072] Note that this stacking order can be changed (added or omitted) depending on the desired circuit or configuration.

[0073] Figure 6 is an exemplary diagram showing a schematic diagram of a printed transistor related to the present invention.

[0074] The structure of the printed transistor illustrated in Fig. 6 may be changed in its configuration order depending on the intended use, and may also be changed to a different structure depending on the intended use.

[0075] The printed transistor can be composed of a gate electrode (501), a dielectric layer (502), a semiconductor layer (503), and a drain / source electrode layer (504) on a flexible substrate (500), and if a passivation (sealing) layer or a doping layer is desired to be introduced, it can be printed on the drain / source electrode layer (504). More specifically, by introducing an n-doping layer, a p-type transistor (505) can be converted into an n-type transistor, or by introducing a passivation layer (506), a device that is more stable in an external environment can be manufactured.

[0076] FIG. 7 is an exemplary diagram showing a measurement graph and an electrical characteristic graph of a simulation fitting result for a printed transistor manufactured according to one embodiment of the present invention.

[0077] This is a task that must be performed prior to performing a circuit layout process using a processor design kit (PDK) (103), and the PDK can be completed through this task.

[0078] To simulate a circuit consisting of printed transistors, the measured transistor parameters and I DS -V GS Graph, and I DS -V DS Based on the graph, the model parameters can be extracted as compact model parameters based on a specified model (e.g., the BSIM3 model). At this time, the accuracy of the model fitting can be verified by comparing the predicted simulation results with measured results using an arbitrary simulation device (e.g., Virtuoso Spice simulation) based on the extracted model parameters.

[0079] As shown in Fig. 7, I fitted with the measured values ​​and the BSIM3 model DS -V DS and I DS -V GSThe matching degree is approximately 95% or higher, and through this simulation, the possibility of implementation into an actual electronic device can be shown according to the matching degree value (from 0% to 100%). For example, a higher matching degree means that the electronic device composed of printed transistors operates well without errors. Based on this, the circuit layout process of the electronic device can be performed using the Processor Design Kit (PDK) (103).

[0080] FIG. 8 is a flowchart for explaining an LVS (Layout Versus Schematic) method according to one embodiment of the present invention.

[0081] Typically, a completed processor design kit (PDK) (103) containing only printed transistors does not exist. Therefore, it is difficult to proceed with Layout Versus Schematic (LVS), and the lack of an LVS methodology causes many connection problems, resulting in logic circuit malfunctions and financial losses.

[0082] To solve these problems, an embodiment according to the present invention uses the LVS method as illustrated in FIG. 8.

[0083] For reference, the layout of printed electronic components can be done using AutoCAD's app (e.g., EAGLE), and to perform LVS of printed electronic components, a specified netlist (e.g., HSPICE netlist) is extracted from a schematic that has completed simulation verification (S101).

[0084] At this time, since the formats of 'HSPICE netlist' and 'EAGLE netlist' are different, 'HSPICE netlist' is converted to 'EAGLE netlist' using Python (S102).

[0085] By inserting the converted 'EAGLE netlist' into a designated layout app (e.g. EAGLE) (S103), the connection status of each transistor is displayed, and the final layout is determined (S105) by placing the electronic components while checking the displayed connections and considering the area of ​​the electronic components (S104).

[0086] Accordingly, in this embodiment, the final layout of the printed electronic device can be determined through PDK and LVS, and by applying this layout directly to a gravure plate, the electronic device desired by a consumer or company can be processed into a plate roll without any additional work, and operation can be confirmed through simulation.

[0087] FIG. 9 is an example diagram showing a simulation result graph for a 1-bit ALU (Arithmetic Logic Unit) among the 4-bit processor modules performed through a processor design kit (PDK) including LVS in FIG. 8.

[0088] In one embodiment of the present invention, it is demonstrated that the proposed processor design kit (PDK) can successfully and error-free perform the desired output value (ADDER operation). In addition, although not illustrated in the drawing, it can be seen that other operations (e.g., Subtractor, NAND, XOR operations, etc.) also operate error-free.

[0089] FIG. 10 is an exemplary diagram showing an overall schematic diagram of a 4-bit processor according to one embodiment of the present invention.

[0090] Referring to FIG. 10, the 4-bit processor according to the present embodiment is configured as a circuit suitable for a printing element, based on the Nibbler 4-bit processor.

[0091] The components of a 4-bit processor are largely divided into register blocks and combinational logic blocks. The register block is a clock-synchronous circuit and is mainly composed of flip-flops.

[0092] The register block of a 4-bit processor can be composed of PHASE A / B, FLAGS, PC (Program Counter), FETCH, ACC (Accumulator), and Out Register.

[0093] PHASE A and PHASE B generate PHASE and RESET signals, respectively. PHASE A outputs a RESET signal to initialize all register blocks and combinational logic blocks.

[0094] ACC (Accumulator) is a block where the ALU (Arithmetic Logic Unit) result value is stored, and ALU operations can be performed using the result value as an operand.

[0095] FLAGS is responsible for generating the CARRY and ZERO signals, which are the addresses of the micro ROM.

[0096] The output register is responsible for loading the calculated data to output devices such as displays and speakers.

[0097] PC (Program Counter) is a block that remembers the address of the next instruction to be executed, allowing instructions in memory to be executed sequentially according to cycle.

[0098] In the case of the PC (Program Counter) structure according to this embodiment, the number of printed transistors used is reduced by 12% from 232 to 204, and the logic level is also improved while reducing the number of NAND gates.

[0099] For the ALU according to this embodiment, the datasheet of 74LS181 and the instruction code of the Nibbler microprocessor can be used as the main focus.

[0100] FIG. 11 is an exemplary diagram showing each module of a 4-bit processor manufactured through actual roll-to-roll (R2R) gravure printing in FIG. 10.

[0101] Each module of the 4-bit processor manufactured at this time is the same as each module described in Fig. 10, and a 4-bit processor can be implemented through a combination of these modules.

[0102] FIG. 12 is an example diagram showing a driving board capable of demonstrating a 4-bit processor in FIG. 11.

[0103] At this time, the connection part for each module is as shown in Fig. 10, and is implemented as a board to check whether each function is operating normally and whether it is driven by a 4-bit processor.

[0104] FIGS. 13a to 13c are exemplary diagrams showing a truth table ((a) of FIG. 13), a simulation (prediction) result ((b) of FIG. 13), and an actual result ((c) of FIG. 13) for PHASE B, one of the 4-bit processor configuration modules in FIG. 11.

[0105] Referring to FIGS. 13a to 13c, the output of an actual electronic device can be confirmed through a truth table and simulation, and it can also be seen that it matches the actual printed sample.

[0106] As described above, the present embodiment provides circuit simulations for as many electronic devices as possible to manufacture, thereby enabling the manufacture of electronic devices having desired functions, and based on this as a basic unit for electronic devices, simple calculators, game machines, sensors, etc. can be manufactured, and the electronic devices are manufactured using a roll-to-roll (R2R: Roll-to-Roll) gravure continuous printing method, but by defining key variables in the printing process and controlling these variables, the printed devices can be manufactured efficiently and effectively.

[0107] Although the present invention has been described with reference to the embodiments shown in the drawings, these are merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible from the drawings. Accordingly, the technical protection scope of the present invention should be defined by the following claims. In addition, the implementations described in this specification may be implemented as, for example, a method or process, a device, a software program, a data stream, or a signal. Even if discussed only in the context of a single form of implementation (e.g., discussed only as a method), the implementation of the discussed features may also be implemented in other forms (e.g., a device or a program). The device may be implemented by suitable hardware, software, firmware, etc. The method may be implemented in a device such as a processor, which generally refers to a processing device including, for example, a computer, a microprocessor, an integrated circuit, or a programmable logic device. The processor also includes a communication device such as a computer, a cell phone, a personal digital assistant ("PDA"), and other devices that facilitate the communication of information between end-users.

Claims

1. Electronic ink formulation module for manufacturing electronic ink for printing electronic devices; A design processing module for performing layer-by-layer gravure roll design to be printed based on the circuit layout of an electronic component; A plurality of roll-to-roll printing modules that perform printing in stages according to the number of layers to be printed for each electronic component; and A printing device for manufacturing electronic devices, characterized by including a processor that controls the electronic ink formulation module, the design processing module, the sensor module, and the roll-to-roll printing module, controls the printing process through interaction, and evaluates the operation results of each module or performs a simulation for evaluation.

2. In paragraph 1, The above processor, In order to optimize printing by minimizing errors due to changes in web tension of flexible substrates, A printing device for manufacturing electronic components, characterized by adjusting web tension control parameter values.

3. In paragraph 1, The above processor, In order to ensure that electronic devices have uniform characteristics by adjusting the ink transfer characteristics, A printing device for manufacturing electronic components, characterized by adjusting ink transfer parameter values.

4. In paragraph 1, The above processor, To manufacture electronic devices with uniform characteristics in smaller sizes through precise ink overlay, A printing device for controlling electronic components, characterized by adjusting the values ​​of overlapping precision control parameters.

5. In paragraph 4, The above processor further includes a sensor module for checking whether the mark printed on the flexible substrate matches the design in each printed layer and is accurately printed at a predetermined location to verify the overlapping precision; The above sensor module, A printing device for controlling electronic components, characterized by including a camera (CAM1) for checking a mark printed on a previous printing layer on a flexible substrate being transferred; a camera (CAM2) for checking a mark etched on a roll for printing a current printing layer; and a camera (CAM3) for checking that a mark printed on a previous printing layer and a mark printed on a current printing layer match a design and are accurately located at a predetermined position.

6. In paragraph 1, The above electronic ink formulation module, The process is performed before performing roll-to-roll (R2R) gravure printing. A printing device for controlling electronic components, characterized by performing an electronic ink formulation process, an evaluation process for test results of electronic ink, and a preliminary printing test process using various printing equipment.

7. In paragraph 1, The above design processing module, A printing device for controlling electronic components, characterized by performing an initial circuit layout process using a processor design kit, a final circuit layout confirmation process by repeating a circuit redesign and optimization process based on the initial circuit layout process, and a gravure roll design for each printing layer based on the confirmed final circuit layout, followed by an evaluation process for designated evaluation items.

8. In paragraph 1, The above roll-to-roll printing module, To set up the optimal roll-to-roll (R2R) printing process, ink rheology is re-evaluated, printing environment is adjusted, drying conditions are checked, printing speed and overlap precision are checked, web tension is adjusted, and nip pressure is adjusted. A printing device for controlling electronic devices, characterized in that it performs an overall device yield evaluation, a device output characteristic evaluation, and an optical evaluation and an electrical evaluation process for manufactured electronic devices.

9. A step of manufacturing electronic ink for printing electronic devices using an electronic ink formulation module; A step of performing layer-by-layer gravure roll design to be printed based on the circuit layout of the electronic device through a design processing module; A step of performing printing stepwise according to the number of layers to be printed for each electronic device through multiple roll-to-roll printing modules; and A method for controlling a printing device for manufacturing electronic devices, characterized in that it comprises a step of the processor controlling the electronic ink formulation module, the design processing module, the sensor module, and the roll-to-roll printing module, controlling the printing process through interaction, and evaluating the operation results of each module or performing a simulation for evaluation.

10. In paragraph 9, In order to optimize printing by minimizing errors due to changes in web tension of flexible substrates, The above processor, A method for controlling a printing device for manufacturing electronic components, characterized by adjusting web tension control parameter values.

11. In paragraph 9, In order to ensure that electronic devices have uniform characteristics by adjusting the ink transfer characteristics, The above processor, A method for controlling a printing device for manufacturing electronic devices, characterized by adjusting ink transfer parameter values.

12. In paragraph 9, To manufacture electronic devices with uniform characteristics in smaller sizes through precise ink overlay, The above processor, A control method for a printing device for controlling electronic components, characterized by adjusting a value of a nesting precision control parameter.

13. In paragraph 12, After the step of performing the above printing, The above processor further includes a step of checking whether the mark printed on the flexible substrate matches the design in each printing layer and is accurately printed at a predetermined location to check the overlapping precision through the sensor module; The above sensor module, A control method for a printing device for controlling electronic components, characterized by including a camera (CAM1) for checking a mark printed on a previous printing layer on a flexible substrate being transported; a camera (CAM2) for checking a mark etched on a roll for printing a current printing layer; and a camera (CAM3) for checking that a mark printed on a previous printing layer and a mark printed on a current printing layer match a design and are accurately located at a predetermined position.

14. In paragraph 9, In the step of manufacturing electronic ink for printing the above electronic components, The above electronic ink formulation module, The process is performed before performing roll-to-roll (R2R) gravure printing. A control method for a printing device for controlling electronic components, characterized by performing an electronic ink formulation process, an evaluation process for a test result of electronic ink, and a preliminary printing test process using various printing equipment.

15. In paragraph 9, In the step of performing the gravure roll design for each layer to be printed, The above design processing module, A control method for a printing device for controlling electronic components, characterized by performing an initial circuit layout process using a processor design kit, a final circuit layout confirmation process by repeating a circuit redesign and optimization process based on the initial circuit layout process, and a gravure roll design for each printing layer based on the confirmed final circuit layout, and then performing an evaluation process for designated evaluation items.

16. In paragraph 9, In the above step-by-step printing process, The above roll-to-roll printing module, To set up the optimal roll-to-roll (R2R) printing process, ink rheology is re-evaluated, printing environment is adjusted, drying conditions are checked, printing speed and overlap precision are checked, web tension is adjusted, and nip pressure is adjusted. A control method for a printing device for controlling electronic devices, characterized in that it performs an overall device yield evaluation, a device output characteristic evaluation, and an optical evaluation and an electrical evaluation process for manufactured electronic devices.

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