Micro light-emitting diodes and methods for forming the same via sidewall diffusion

Abstract

An emissive array includes a plurality of pixel regions, each of the plurality of pixel regions including a first semiconductor layer, a second semiconductor layer, and an active layer disposed between first semiconductor layer and the second semiconductor layer. Regions of the active layer adjacent to sidewalls of the active layer include doped regions. In each the pixel regions, a collimation mirror surrounds at least a portion of the first semiconductor layer, the second semiconductor layer, and the active layer. Various other devices, systems, and methods are also disclosed.

Description

MICRO LIGHT-EMITTING DIODES AND METHODS FOR FORMING THE SAME VIA SIDEWALL DIFFUSIONCROSS-REFERENCE TO RELATED APPLICATION

[0001] This application claims benefit of and priority to U.S. provisional application No. 63 / 602,241, filed November 22, 2023.FIELD

[0002] The present disclosure is generally directed to emissive arrays and methods for forming the same.SUMMARY

[0003] According to an aspect of the present invention, there is provided a method for manufacturing an emissive array, comprising: doping sidewalls of mesas formed in a layered structure comprising an active layer disposed between a first semiconductor layer and a second semiconductor layer, wherein the sidewalls of the mesas include exposed portions of the active layer and exposed portions of the first semiconductor layer; and forming passivation coatings over at least the doped sidewalls of the mesas such that the passivation coatings cover at least the exposed portions of the active layer and the exposed portions of the first semiconductor layer.

[0004] Optionally, dopingthe sidewalls of the mesas comprises performingat least one of a diffusion or ion implantation process.

[0005] Optionally, dopingthe sidewalls of the mesas comprises performingat least one of ampoule doping, spin-on doping, solid-state doping, rapid thermal annealing, or ion implantation.

[0006] Optionally, the sidewalls of the mesas are doped with a p-type dopant.

[0007] Optionally, the p-type dopant comprises at least one of Zn, Mg, or B.

[0008] Optionally, dopingthe sidewalls of the mesas comprises performingat least one of a fast diffusion process and a fast cooling process.

[0009] Optionally, the method further comprises: exposing top surfaces of the mesas, the top surfaces being formed by the first semiconductor layer; and forming contacts on the top surfaces of the mesas.

[0010] Optionally, the passivation coatings do not cover exposed regions of the contacts.

[0011] Optionally, the method further comprises forming routing lines such thateach routing line covers at least a portion of a passivation coating, wherein the routing lines are electrically coupled to portions of the first semiconductor layer disposed on the mesas.

[0012] Optionally, the routing lines comprise a reflective material.

[0013] Optionally, the active layer comprises a quantum well.

[0014] According to a further aspect of the present invention, there is provided an emissive array, comprising: a plurality of pixel regions, each of the plurality of pixel regions comprising: a first semiconductor layer; a second semiconductor layer; and an active layer disposed between the first semiconductor layerand the second semiconductor layer, wherein regions of the active layer adjacent to sidewalls of the active layer comprise doped regions.

[0015] Optionally, the doped regions of the active layer are doped with a p-type dopant.

[0016] Optionally, the p-type dopant comprises at least one of Zn, Mg, or B.

[0017] Optionally, the first semiconductor layer comprises p-type material; and the second semiconductor layer comprises an n-type material.

[0018] Optionally, the emissive array further comprises routing lines coupled to the first semiconductor layer, wherein each of the routing lines is coupled to the first semiconductor layer of a pixel region of the plurality of pixel regions.

[0019] Optionally, the routing lines cover at least a portion of each of the pixel regions; and the routing lines each comprise a reflective material.

[0020] Optionally, the doped regions of the active layer are covered by a passivation coating.

[0021] According to a further aspect of the present invention, there is provided a display device, comprising: a plurality of micro-light-emitting diodes (pLEDs), each of the plurality of pLEDs comprising: a first semiconductor layer; a second semiconductor layer; an active layer disposed between the first semiconductor layer and the second semiconductor layer, wherein regions of the active layer adjacent to sidewalls of the active layer comprise doped regions; and a collimation mirror surrounding at least a portion of the first semiconductor layer, the second semiconductor layer, and the active layer.

[0022] Optionally, the display device further comprises a plurality of micro-lenses, wherein each of the plurality of micro-lenses overlaps one of the plurality of pLEDs.BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings illustrate a number of exemplaryembodiments and are a part of the specification. Together with the following description, these drawings demonstrate and explain various principles of the present disclosure.

[0024] The accompanying drawings illustrate a number of example embodiments and are a part of the specification. Together with the following description, these drawings demonstrate and explain various principles of the present disclosure.

[0025] FIG. 1 is an illustration of an example light-emitting diode according to some embodiments of this disclosure.

[0026] FIG. 2 is an illustration of a bandgap for a portion of an example lightemitting diode according to some embodiments of this disclosure.

[0027] FIG. 3A is an illustration of an example epitaxial structure for manufacturing a light-emitting diode according to some embodiments of this disclosure.

[0028] FIG. 3B is an illustration of an example modified epitaxial structure during manufacture of a light-emitting diode according to some embodiments of this disclosure.

[0029] FIG. 4A is an illustration of an example modified epitaxial structure during manufacture of a light-emitting diode according to some embodiments of this disclosure.

[0030] FIG. 4B is an illustration of an example modified epitaxial structure during manufacture of a light-emitting diode according to some embodiments of this disclosure.

[0031] FIG. 5A is an illustration of an example modified epitaxial structure during manufacture of a light-emitting diode according to some embodiments of this disclosure.

[0032] FIG. 5B is an illustration of an example modified epitaxial structure during manufacture of a light-emitting diode according to some embodiments of this disclosure.

[0033] FIG. 6A is an illustration of an example modified epitaxial structure during manufacture of a light-emitting diode according to some embodiments of this disclosure.

[0034] FIG. 6B is an illustration of an example modified epitaxial structure during manufacture of a light-emitting diode according to some embodiments of this disclosure.

[0035] FIG. 7A is an illustration of an example modified epitaxial structure during manufacture of a light-emitting diode according to some embodiments of this disclosure.

[0036] FIG. 7B is an illustration of an example modified epitaxial structure during manufacture of a light-emitting diode according to some embodiments of this disclosure.

[0037] FIG. 8A is an illustration of an example modified epitaxial structure during manufacture of a light-emitting diode according to some embodiments of this disclosure.

[0038] FIG. 8B is an illustration of an example modified epitaxial structure duringmanufacture of a light-emitting diode according to some embodiments of this disclosure.

[0039] FIG. 9A is an illustration of an example modified epitaxial structure during manufacture of a light-emitting diode according to some embodiments of this disclosure.

[0040] FIG. 9B is an illustration of an example modified epitaxial structure during manufacture of a light-emitting diode according to some embodiments of this disclosure.

[0041] FIG. 10A is an illustration of an example modified epitaxial structure during manufacture of a light-emitting diode according to some embodiments of this disclosure.

[0042] FIG. 10B is an illustration of an example modified epitaxial structure during manufacture of a light-emitting diode according to some embodiments of this disclosure.

[0043] FIG. 11A is an illustration of an example modified epitaxial structure during manufacture of a light-emitting diode according to some embodiments of this disclosure.

[0044] FIG. 11B is an illustration of an example modified epitaxial structure during manufacture of a light-emitting diode according to some embodiments of this disclosure.

[0045] FIG. 12A is an illustration of an example modified epitaxial structure during manufacture of a light-emitting diode according to some embodiments of this disclosure.

[0046] FIG. 12B is an illustration of an example modified epitaxial structure during manufacture of a light-emitting diode according to some embodiments of this disclosure.

[0047] FIG. 13A is an illustration of an example modified epitaxial structure during manufacture of a light-emitting diode according to some embodiments of this disclosure.

[0048] FIG. 13B is an illustration of an example modified epitaxial structure during manufacture of a light-emitting diode according to some embodiments of this disclosure.

[0049] FIG. 14A is an illustration of an example modified epitaxial structure during manufacture of a light-emitting diode according to some embodiments of this disclosure.

[0050] FIG. 14B is an illustration of an example modified epitaxial structure during manufacture of a light-emitting diode according to some embodiments of this disclosure.

[0051] FIG. 15A is an illustration of an example device including a light-emitting diode according to some embodiments of this disclosure.

[0052] FIG. 15B is an illustration of an example device including a light-emitting diode according to some embodiments of this disclosure.

[0053] FIG. 16 is an illustration of an example device including a light-emitting diode according to some embodiments of this disclosure.

[0054] FIG. 17 is a flow diagram of an exemplary method for

[0055] FIG. 18 is an illustration of an example artificial-reality system according to some embodiments of this disclosure.

[0056] FIG. 19 is an illustration of an example artificial-reality system with a handheld device according to some embodiments of this disclosure.

[0057] FIG. 20A is an illustration of example user interactions within an artificialreality system according to some embodiments of this disclosure.

[0058] FIG. 20B is an illustration of example user interactions within an artificialreality system according to some embodiments of this disclosure.

[0059] FIG. 21A is an illustration of example user interactions within an artificialreality system according to some embodiments of this disclosure.

[0060] FIG. 21B is an illustration of example user interactions within an artificialreality system according to some embodiments of this disclosure.

[0061] FIG. 22 is an illustration of an example wrist-wearable device of an artificialreality system according to some embodiments of this disclosure.

[0062] FIG. 23 is an illustration of an example wearable artificial-reality system according to some embodiments of this disclosure.

[0063] FIG. 24 is an illustration of an example augmented-reality system according to some embodiments of this disclosure.

[0064] FIG. 25A is an illustration of an example virtual-reality system according to some embodiments of this disclosure.

[0065] FIG. 25B is an illustration of another perspective of the virtual-reality systems shown in FIG. 25A.

[0066] FIG. 26 is a block diagram showing system components of example artificial- and virtual-reality systems.

[0067] Throughout the drawings, identical reference characters and descriptions indicate similar, but not necessarily identical, elements. While the exemplary embodiments described herein are susceptible to various modifications and alternative forms, specific embodiments have been shown by way of example in the drawings and will be described in detail herein. However, the exemplary embodiments described herein are not intended to be limited to the particular forms disclosed. Rather, the present disclosure covers all modifications, equivalents, and alternatives falling within the scope of the appended claims.DETAILED DESCRIPTION OF EXAMPLE EMBODIMENTS

[0068] In conventional light-emitting diode (LED) devices, such as display devices, aluminum gallium indium phosphide (AllnGaP) can provide increased efficiency and a desired spectrum to meet a specified color gamma. Thus, it may be a suitable red LED solution for many conventional display applications. Displays for head-mounted systems, such as augmented reality (AR) systems, may require a pitch size smaller than 5 / zm, and in some cases smaller than 2.5 [ m, with high collimation efficiency. To satisfy the optical collimation requirements, an emitter size can be significantly smaller than the pitch. Engineering a small AllnGaP pixel with high efficiency may prove challenging since scaling the emitters to smaller sizes may result in the internal quantum efficiency (IQE) becoming extremely low. This is due to the high surface recombination velocity for AllnGaP materials. Also, when emitter dimensions become smaller than the diffusion length of quantum well (QW) carriers, the carriers may be readily drained to surfaces and recombined non-radiatively. Thus, carrier confinement can be critical for achieving sufficiently high IQE for smaller displays. The confinement requirement may be valid for all three colors on different Group lll-V materials for high-efficiency AR displays, and may be particularly important to AllnGaP red emitters, where surface recombination velocity can be very high, and efficiency may be low in the absence of suitable engineering for carrier confinement. For AllnGaP micro-LEDs ( / zLEDs) having a width of less than 5 / zm, the IQE may be less than 5%. Conventional efforts to reduce the surface recombination with better passivation have proved insufficient for efficiency improvement.

[0069] Confined carriers may also have strong benefits on collimation light extraction efficiency (LEE). To achieve high LEE, the light source (i.e., the emitting part of the QW) may need to be suitably small in comparison to collimation optical structures, such as lenses or parabolic reflectors. Due to the high refractive index of conventional semiconductors, light may tend to reflect (i.e., bounce) inside the semiconductor emitter before reaching collimation optics. Thus, in the case of small-scale emitters, the light source may not be fully defined by the emitting area alone due to light spreading effects of the semiconductor materials.

[0070] The present disclosure is generally directed to methods and systems for producing emitters, such as juLEDs, that may be significantly smaller in size in comparison to conventional LED emitters while achieving high IQE and collimation LEE. The disclosed emitters may effectively confine the electrons and holes (carriers) in QWs towards radiativerecombinations while minimizing their leakage to surfaces and reducing losses due to non- radiative recombinations.

[0071] According to at least one embodiment, a shallow, p-type junction may be formed from sidewall diffusion of p-type dopants, such as Zn, Mg, or B, either by ampoule, spin-on, solid-state and rapid thermal processing (RTA), and / or by ion implantation. The processing may utilize relatively fast diffusion and fast cooling to ensure a sharp diffusion front and shallow junction depth to meet display pixel requirements (e.g., for AR / VR displays). In some examples, instead of diffusion from the top, p-type dopants may be diffused or implanted from sidewalls of regions. The light emitting areas (e.g., QW, barriers or hereto- junctions) may be considered "active regions." As used herein, the p-type doped area may be referred to as the "wing" and the light-emitting area may be referred to as the "core." In some examples, the processes described below can be detected using focused ion beam (FIB) and secondary ion mass spectroscopy (SIMS) where a combination of high temperature diffusion using SiOz or specific external sources for atomic diffusion can create changes in the semiconductor band gap.

[0072] In the following embodiments, fast diffusion and / or implantation processes may be utilized to form shallow, p-type junctions on sidewalls of active regions. FIG. 1 shows a cross-sectional view of a / zLED structure 100 formed from a zinc (Zn) diffused die, in accordance with at least one embodiment. Magnesium (Mg), boron (B), or other p-type dopants may be applied to form the shallow p-type junctions in a manner similar to Zn in various embodiments.

[0073] As shown in FIG. 1, the / zLED structure 100 includes an active region 118 disposed between a p-type semiconductor layer 114 and an n-type semiconductor layer 108. The active region 118 may include a quantum well (QW) 116 structure or other suitable structure for emitting light, such as a heterojunction. In at least one embodiment, QW 116 may include multiple QWs layered between barriers. As shown, active region 118 may include p-type doped regions 120 (i.e., wings, shallow junction regions), such as a Zn-doped regions, surrounding sides of a light-emitting region 121 (i.e., core).

[0074] The / zLED structure 100 further includes a passivation layer 106 at least partially surrounding peripheral sides of active region 118. Additionally, passivation layer 106 may surround at least a portion of p-type semiconductor layer 114, n-type semiconductor layer 108, and / or a p-contact 112 electrically coupled to p-type semiconductor layer 114.Passivation layer 106 may include, for example, a dielectric material that prevents conduction between active region 118 and surrounding portions of LED structure 100, such as collimation mirror 104 as shown in FIG. 1. Collimation mirror 104 may include a suitable conductive material that is also reflective so as to reflect and collimate light from light-emitting region 121 toward a viewing region or other target illumination area. Is illustrated, collimation mirror 104 may be disposed on passivation layer 106 and may be electrically coupled to p-contact 112. N-type semiconductor layer 108 may be formed on active region 118 and, in some embodiments, n-type semiconductor layer 108 may overlap a portion of passivation layer 106. An n-type contact 110 may be electrically coupled to n-type semiconductor layer 108. N- type contact 110 may overlap n-type semiconductor layer 108, as illustrated in FIG. 1, or n- type contact 110 may additionally or alternatively be coupled to any other suitable portion of n-type semiconductor layer 108. An insulation layer 102 that includes a dielectric material may surround one or more portions of LED structure 100 as shown in FIG. 1.

[0075] Fig. 2 shows a bandgap diagram for a cut along a QW direction of active region 118 of LED structure 100 illustrated in FIG. 1. In at least one example, the diffusion / implantation process may cause "intermixing" of portions of active region 118 within the p-type doped regions 120, particularly for QW structures. For example, the lightemitting material may be mixed with barriers in QW 116, resulting in increased band gaps in p-type doped regions 120 of active region 118. On the conduction band, a band gap barrier (AEcl) may be formed to prevent electrons from flowing to the surface. Similar structures may be formed by diffusing or ion-implanting other p-type dopants, such as Mg or B. Group lll-V materials may generally behave as n-type materials when doped. Opposite p-type dopants may have a residue build-in voltage drop, resulting in potential barriers (AEc2a, AEc2b), as shown in FIG. 2. The band gap barrier (AEcl) and potential barrier s (AEc2a, AEc2b) may help to prevent electrons in the emitting areas from leaking to the surface. If the p-type dopant is doped heavily enough in p-type doped regions 120, holes may inject from the p- type doped regions 120 to light-emitting region 121. As a result, active region 118 may maintain a high electron and hole concentration for emitting light from light-emitting region 121.

[0076] To form a suitable barrier for carrier blocking, p-type dopants may be diffused from sidewalls of active region 118 to provide a sufficient amount of doping in p-type doped regions 120. In addition, various shallow junctions may be formed by ampoule, spin-on / rapid thermal annealing (RTA), solid-state coating / RTA, and / or implantation / annealing processes. As will be described in greater detail below, methods described herein may include the formation of mesas from epitaxial structures, such as epitaxial wafers. The mesas may facilitate diffusion of dopants into sidewall portions of active region 118. As further discussed below, tops of the mesas may be protected by hard masks to prevent top diffusion and undesired etching. The description below is focused on AllnGaP juLEDs but may be expanded to other QW or hetero-junction-based light emitter systems. Manufacturing steps corresponding to two example processes are illustrated in FIGS. 3A-14B. Additionally, FIGS. 15A-16 show examples of / 1LED pixel structures produced by the processes described herein.

[0077] FIGS. 3A-9B illustrate a first process for manufacturing a jULED structure, in accordance with some embodiments. FIG. 3A shows an initial epitaxial structure 300 that includes an n-type layer 330, an active layer 331 having a QW structure 334 (or other suitable structure, such as a hetero-junction), and a p-type layer 338.

[0078] As shown in FIG. 3B, an intermediate structure 350 may include a mask material patterned as mask portions 342A, 342B, and 342C on a top surface 446 of p-type layer 338 of epitaxial structure 300 in advance of a first mesa etching step.

[0079] FIG. 4A shows an intermediate structure 400 following etching. An etching process may be conducted to form mesa structures 446A, 446B, and 446C that include portions of active layer 331 under mask portions 342A, 342B, and 342C. Following etching, side portions of mesa structures 446A, 446B, and 446C may be exposed, with recessed regions 444A, 444B, and 444C defined around and between the exposed surfaces of mesa structures 446A, 446B, and 446C. As shown in FIG. 4B, an intermediate structure 450 may be formed by optionally applying photolithography to remove mask portion 342C from a processing control region 447 for measurement purposes (e.g., secondary-ion mass spectrometry (SIMS), intermixing wavelength, etc).

[0080] As illustrated in FIG. 5A, a fast diffusion and / or ion implantation process may be used to form an intermediate structure 500 that includes shallow, p-type junctions 548A, 548B, and 548C on the exposed sidewalls of active regions 331. Shallow junctions 548A and 548B, may respectively surround core regions 550A and 550B of active layer 331 corresponding to light-emitting regions 121 (see FIG. 1). In some embodiments, shallow junctions 548A, 548B, and 548C may be formed by at least one of an ampoule, spin-on / RTA, solid-state coating / RTA, and implantation / annealing process. The tops of mesas 446A and446B may be protected by hard mask portions 342A and 342B to restrict top diffusion through top surfaces of mesas 446A and 446B. In some embodiments, hard mask portions 342A and 342B may be the same as or different than hard mask portions utilized for the first mesa etching illustrated in FIG. 4A.

[0081] FIG. 5B shows an intermediate structure 550 following removal of hard mask portions 342A and 342B. In some embodiments, an optional out-diffusion process may be followed to drive out certain interstitial materials and to prevent defects (optionally, the order of performing the hard mask removal and out-diffusion steps may be switched).

[0082] FIG. 6A illustrates an intermediate structure 600 that includes a conductive p-contact layer 652 formed over the exposed top and side surfaces of the mesas 446A, 446B, and 446C. The p-contact layer 652 may optionally be annealed following deposition.

[0083] FIG. 6B illustrates an intermediate structure 650 that includes additional mask portions 654A, 654B, and 654C disposed on top and / or side portions of mesas 446A, 446B, and 446C in preparation for a second dry etching. FIG. 6B illustrates two configurations: (i) a first mesa 446A in which the shallow junctions 548A and 548B are blocked by mask portion 654A so as to not to be trimmed during etching, and (ii) a second mesa 446B in which outer regions of the shallow junctions 548A, 548B, and 548 extend beyond the mask portion 654B so as to be trimmed during etching.

[0084] As illustrated in FIG. 7A, an intermediate structure 700 may be dry etched between and around mask portions 654A, 654B, and 654C such that recessed regions 748A, 748B, and 748C around and between mask portions 654A, 654B, and 654C extend to the n- type layer 330. Accordingly, p / n junctions in the mesas 746A, 746B, and 746C (see FIG. 7B) may be isolated after the dry etching.

[0085] As illustrated in FIG. 7B, the etching mask portions 654A, 654B, and 654C may then be removed to form an intermediate structure 750. As shown in this figure, intermediate structure 750 may include mesas 746A, 746B, and 746C having conductive p- contact layers 752A, 752B, and 752C formed on p-type layers 338 of mesas 746A, 746B, and 746C. As illustrated, conductive p-contact layer 752A may also have wing portions that extend along sides of mesa 746A (e.g., against shallow junctions 548A / 548B illustrated in FIG. 5A).

[0086] FIG. 8A illustrates an intermediate structure 800 that includes a passivation layer 856 formed over mesas 746A, 746B, and 746C and regions between mesas 746A, 746B, and 746C. Passivation layer 856 may include a dielectric material that passivates exposedsidewalls of mesas 746A, 746B, and 746C.

[0087] As illustrated in FIG. 8B, via openings 858A, 858B, and 858C may be formed in passivation layer 856 over p-contact layers 752A, 752B, and 752C. Thus, intermediate structure 850 of FIG. 8B includes mesas 846A, 846B, and 846C with portions of p-contact layers 752A, 752B, and 752C exposed in via openings 858A, 858B, and 858C. Intermediate structure 850 also includes dielectric passivation layers 856A, 856B, and 856C extending along top and sidewall portions of mesas 846A, 846B, and 846C and regions between mesas 846A, 846B, and 846C.

[0088] In an alternative embodiment, dielectric passivation layers may be formed over mesas 746A, 746B, and 746C prior to formation of the p-contact layers. In this embodiment, via openings may be formed in the passivation layers followed by formation of p-contact layers on the mesas 746A, 746B, and 746C. The p-contact layers may contact the p- type layers 338 of mesas 746A, 746B, and 746C through the via openings in the passivation layers.

[0089] FIG. 9A illustrates an intermediate structure 900 following deposition and patterning of routing materials. As shown, intermediate structure 900 includes mesas 946A, 946B, and 946C that include conductive routing layers 960A, 960B, and 960C formed over respective portions of p-contact layers 752A, 752B, and 752C and passivation layers 856A, 856B, and 856C. Conductive routing layers 960A, 960B, and 960C may be electrically coupled to p-contact layers 752A, 752B, and 752C through via openings 858A, 858B, and 858C defined between passivation layers 856A, 856B, and 856C (see, FIG. 8B). Routing layers 960A, 960B, and 960C may extend over substantial portions of mesas 946A, 946B, and 946C, including sidewalls, while being electrically isolated from portions of mesas 946A, 946B, and 946C outside p-contact layers 752A, 752B, and 752C by passivation layers 856A, 856B, and 856C. In some embodiments, routing layers 960A, 960B, and / or 960C may include a reflective material or surface that acts as a mirror (e.g., collimation mirror 104 in FIG. 1). Additionally or alternatively, routing layers 960A, 960B, and / or 960C may include a transparent or translucent material.

[0090] FIG. 9B illustrates an intermediate structure 950 following formation of bonding and / or probe metal layers. As shown, intermediate structure 950 includes bonding and / or probe metal layers 980 coupled to selected portions of routing layers 960A, 960B, and 960C and n-type layer 330. Step routing layers 960A, 960B, and 960C and bonding metal layers980 may be utilized for structures in which light is emitted from the p-side (i.e., in a direction proceeding from core region 550A through a corresponding p-type layer 338). In a p-side emitting device, bonding / probe metal layers 980 are formed in regions not overlapping lightemitting portions of mesas 946A and 946B, as shown. In some embodiments, routing layers 960A, 960B, and / or 960C may be transparent to allow for passage of light from the p-side. In some embodiments, if light is to be emitted from the n-side, routing layers 960A, 960B, and 960C and / or bonding / probe metal layers 980 may not be necessary and / or there may be more flexibility in placement and routing of such layers.

[0091] FIGS. 10-14 illustrate an additional process, in accordance with some embodiments. As illustrated in FIG. 10A, the hard mask portions 342A and 342B used in FIG. 5A may also be utilized in the illustrated embodiment, which includes intermediate structure 1000. The process steps up to the point shown in FIG. 10A may mirror or be substantially similar to those shown and described with reference to FIGS. 3A-5A. However, in contrast to the process illustrated in FIG. 5B, in which hard mask portions 342A and 342B are removed following doping to form shallow junctions 548A, 548B, and 548C, FIG. 10B shows that hard mask portions 342A and 342B are left in place on mesas 446A and 446B.

[0092] As illustrated in FIG. 10B, hard mask portions 342A and 342B may be utilized in a second, self-aligned mesa etching step to form an intermediate structure 1050 including mesas 1046A, 1046B, and 1046C. Mesa 1046C, which is not covered by a mask portion, may be reduced in height, with p-type layer 338 being substantially or completely removed during etching. Additionally, etching between and around mask portions 342A and 342B may form recessed regions 1044A, 1044B and 1044C that extend to the n-type layer 330. Accordingly, p / n junctions in the mesas 1046A and 1046B may be isolated after the dry etching.

[0093] As illustrated in FIG. 11A, wing trim etching may optionally be performed to narrow the diffused shallow junction depth of mesas in an intermediate structure 1100. For example, sidewalls of mesas 1046A and 1046B shown in FIG. 10B may be further etched under hard mask portions 342A and 342B to form mesas with shallow junctions 1148A and 1148B that are reduced in thickness at the sidewalls.

[0094] In FIG. 11B, hard mask portions 342A and 342B may be removed following the etching shown in FIG. 10B or following the optional additional etching shown in FIG. 11A. As shown, a resulting intermediate structure 1150 may include mesas 1146A, 1146B, and1146C with exposed tops and side surfaces.

[0095] As illustrated in FIG. 12A, patterned mask portions 1266A, 1266B, and 1266C may be formed on mesas 1146A, 1146B, and 1146C and regions between the mesas to form intermediate structure 1200. Via openings 1268A and 1268B may be defined between respective mask portions 1266A, 1266B, and 1266C. Via openings 1268A and 1268B may extend to top surfaces of corresponding p-type layers 338 of mesas 1146A and 1146B.

[0096] As illustrated in FIG. 12B, p-contact layers 1270A and 1270B may be respectively formed in via openings 1268A and 1268B on top of mesas 1146A and 1146B. Patterned mask portions 1266A, 1266B, and 1266C may then be removed to form intermediate structure 1250 including on mesas 1246A, 1246B, and 1246C, as shown in FIG. 12B. Optionally, p-contact layers 1270A and 1270B may be annealed.

[0097] FIG. 13A illustrates an intermediate structure 1300 that includes a passivation layer 1372 formed over mesas 1246A, 1246B, and 1246C and regions between mesas 1246A, 1246B, and 1246C. Passivation layer 1372 may include a dielectric material that passivates exposed sidewalls of mesas 1246A, 1246B, and 1246C.

[0098] As illustrated in FIG. 13B, via openings 1376A and 1376B may be formed in passivation layer 1372 over p-contact layers 1270A and 1270B. Thus, intermediate structure 1350 of FIG. 13B includes mesas 1346A, 1346B, and 1346C with portions of p-contact layers 1270A and 1270B on mesas 1346A and 1346B exposed in via openings 1376A and 1376B. Intermediate structure 1350 also includes dielectric passivation layers 1374A, 1374B, and 1374C extending along top and sidewall portions of mesas 1346A, 1346B, and 1346C and regions between mesas 1346A, 1346B, and 1346C. In an alternative embodiment, dielectric passivation layers may be formed over the mesas prior to formation of the p-contact layers.

[0099] FIG. 14A illustrates an intermediate structure 1400 following deposition and patterning of routing materials. As shown, intermediate structure 1400 includes mesas 1446A and 1446B that include a conductive routing layer 1478 formed over respective portions of p-contact layers 1270A and 1270B and passivation layers 1374A, 1374B, and 1374C (see FIG. 13B). Conductive routing layer 1478 may be electrically coupled to p-contact layers 1270A and 1270B through via openings 1376A and 1376B defined between passivation layers 1374A, 1374B, and 1374C (see, FIG. 13B). Routing layer 1478 may extend over substantial portions of mesas 1446A and 1446B, including sidewalls, while being electrically isolated from portions of mesas 1446A and 1446B outside p-contact layers 1270A and 1270Bby passivation layers 1374A, 1374B, and 1374C. In some embodiments, routing layer 1478 may include a reflective material or surface that acts as a mirror (e.g., collimation mirror 104 in FIG. 1). Additionally or alternatively, routing layer 1478 may include a transparent or translucent material.

[0100] FIG. 14B illustrates an intermediate structure 1450 following formation of bonding and / or probe metal layers. As shown, intermediate structure 1450 includes bonding and / or probe metal layers 1480 coupled to selected portions of routing layer 1478 and n-type layer 330. Step routing layer 1478 and bonding metal layers 1480 may be utilized for structures in which light is emitted from the p-side. In a p-side emitting device, bonding / probe metal layers 1480 are formed in regions not overlapping light-emitting portions of mesas 1446A and 1446B, as shown. In some embodiments, if light is to be emitted from the n-side, routing layer 1478 and / or bonding / probe metal layers 1480 may not be necessary and / or there may be more flexibility in placement and routing of such layers.

[0101] In FIG. 15A, a pixel 1500 of a / zLED device is illustrated. The / / LED device may include a plurality of pixels 1500 arranged in an array in accordance with various embodiments. As shown, pixel 1500 may include an LED structure 100, such as that shown in FIG. 1. An n-type semiconductor layer 108 of LED structure 100 may include n-contact metal 1510 that was formed at a step of bonding metal on the p-side, followed by optional annealing (see, e.g., FIGS. 9B and 14B). N-contact metal 1510 may be coupled to a power source to operate pixel 1500. Pixel 1500 may also include a dielectric layer 1582 disposed over LED structure 100 and a microlens 1584 positioned over dielectric layer 1582 to direct and / or focus light emitted from LED structure 100.

[0102] In FIG. 15B, a pixel 1550 of a / / LED device is illustrated. As shown, pixel 1550 may include an LED structure 100 and n-contact metal 110 formed on the n-side following removal of a substrate and buffer materials.

[0103] As shown in FIG. 16, a pixel 1600 of a / / LED device may include one or more collimation lens structures, such as collimation lens structures 1686A and 1686B, which may include one or more of a refractive lens, a diffractive lens, or a combination of both.

[0104] FIG. 17 is a flow diagram of an exemplary method 1700 for manufacturing an emissive array. At step 1710, sidewalls of mesas formed in a layered structure may be doped. The layered structure may include an active layer disposed between a first semiconductor layer and a second semiconductor layer. The sidewalls of the mesas mayinclude exposed portions of the active layer and exposed portions of the first semiconductor layer.

[0105] In some embodiments, doping the sidewalls of the mesas may include performing at least one of a diffusion or ion implantation process. In at least one embodiment, doping the sidewalls of the mesas may include performing at least one of ampoule doping, spin-on doping, solid-state doping, rapid thermal annealing, or ion implantation. The sidewalls of the mesas may be doped with a p-type dopant, such as at least one of zinc, magnesium, or boron. In some embodiments, doping the sidewalls of the mesas may include performing at least one of a fast diffusion process and a fast cooling process.

[0106] At step 1720, passivation coatings may be formed over at least the doped sidewalls of the mesas such that the passivation coatings cover at least the exposed portions of the active layer and the exposed portions of the first semiconductor layer.

[0107] In some embodiments, the method may further include exposing top surfaces of the mesas, the top surfaces being formed by the first semiconductor layer, and forming contacts on the top surfaces of the mesas. The passivation coatings may not cover exposed regions of the contacts.

[0108] In at least one embodiment, the method may further include forming routing lines such that each routing line covers at least a portion of a passivation coating. The routing lines may be electrically coupled to portions of the first semiconductor layer disposed on the mesas. In some examples, the routing lines may include a reflective material. Additionally or alternatively, the routing lines may include a transparent or translucent material. In some embodiments, the active layer may include a quantum well.

[0109] Example Embodiments

[0110] Example 1: A method for forming an emissive array includes 1) doping sidewalls of mesas formed in a layered structure including an active layer disposed between a first semiconductor layer and a second semiconductor layer, wherein the sidewalls of the mesas include exposed portions of the active layer and exposed portions of the first semiconductor layer and 2) forming passivation coatings over at least the doped sidewalls of the mesas such that the passivation coatings cover at least the exposed portions of the active layer and the exposed portions of the first semiconductor layer.

[0111] Example 2: The method of Example 1, where doping the sidewalls of the mesas includes performing at least one of a diffusion or ion implantation process.

[0112] Example 3: The method of Example 1, where doping the sidewalls of the mesas includes performing at least one of ampoule doping, spin-on doping, solid-state doping, rapid thermal annealing, or ion implantation.

[0113] Example 4: The method of Example 1, wherein the sidewalls of the mesas are doped with a p-type dopant.

[0114] Example 5: The method of Example 4, wherein the p-type dopant includes at least one of Zn or Mg, or B.

[0115] Example 6: The method of Example 1, wherein doping the sidewalls of the mesas includes performing at least one of a fast diffusion process and a fast cooling process.

[0116] Example 7: The method of Example 1, further including 1) exposing top surfaces of the mesas, the top surfaces being formed by the first semiconductor layer, and 2) forming contacts on the top surfaces of the mesas.

[0117] Example 8: The method of Example 7, where the passivation coatings do not cover exposed contact regions of the contacts.

[0118] Example 9: The method of Example 1, further including forming routing lines such that each routing line covers at least a portion of a passivation coating, wherein the routing lines are electrically coupled to portions of the first semiconductor layer disposed on the mesas.

[0119] Example 10: The method of Example 9, where the routing lines include a reflective material.

[0120] Example 11: The method of Example 1, wherein the active layer includes a quantum well.

[0121] Example 12: An emissive array including a plurality of pixel regions, each of the plurality of pixel regions including 1) a first semiconductor layer, 2) a second semiconductor layer, and 3) an active layer disposed between first semiconductor layer and the second semiconductor layer, where regions of the active layer adjacent to sidewalls of the active layer include doped regions.

[0122] Example 13: The emissive array of Example 12, where the doped regions of the active layer are doped with a p-type dopant.

[0123] Example 14: The emissive array of Example 13, where the p-type dopant includes at least one of Zn or Mg, or B.

[0124] Example 15: The emissive array of Example 12, where the firstsemiconductor layer includes p-type material and the second semiconductor layer includes an n-type material.

[0125] Example 16: The emissive array of Example 12, further including routing lines coupled to the first semiconductor layer, wherein each of the routing lines is coupled to the first semiconductor layer of a pixel region of the plurality of pixel regions.

[0126] Example 17: The emissive array of Example 16, where 1) the routing lines cover at least a portion of each of the pixel regions, and 2) the routing lines each include a reflective material.

[0127] Example 18: The emissive array of Example 12, where the doped regions of the active layer are covered by a passivation coating.

[0128] Example 19: A display device including a plurality of micro-light-emitting diodes (pLEDs), each of the plurality of pLEDs including 1) a first semiconductor layer, 2) a second semiconductor layer, and 3) an active layer disposed between first semiconductor layer and the second semiconductor layer, where regions of the active layer adjacent to sidewalls of the active layer include doped regions. Each of the plurality of pLEDs also include a collimation mirror surrounding at least a portion of the first semiconductor layer, the second semiconductor layer, and the active layer.

[0129] Example 20: The display device of claim 19, further including a plurality of micro-lenses, where each of the plurality of micro-lenses overlaps one of the plurality of pLEDs.

[0130] Embodiments of the present disclosure may include or be implemented in conjunction with various types of Artificial-Reality (AR) systems. AR may be any superimposed functionality and / or sensory-detectable content presented by an artificial-reality system within a user's physical surroundings. In other words, AR is a form of reality that has been adjusted in some manner before presentation to a user. AR can include and / or represent virtual reality (VR), augmented reality, mixed AR (MAR), or some combination and / or variation of these types of realities. Similarly, AR environments may include VR environments (including non-immersive, semi-immersive, and fully immersive VR environments), augmented-reality environments (including marker-based augmented-reality environments, markerless augmented-reality environments, location-based augmented-reality environments, and projection-based augmented-reality environments), hybrid-reality environments, and / or any other type or form of mixed- or alternative-reality environments.

[0131] AR content may include completely computer-generated content or computer-generated content combined with captured (e.g., real-world) content. Such AR content may include video, audio, haptic feedback, or some combination thereof, any of which may be presented in a single channel or in multiple channels (such as stereo video that produces a three-dimensional (3D) effect to the viewer). Additionally, in some embodiments, AR may also be associated with applications, products, accessories, services, or some combination thereof, that are used to, for example, create content in an artificial reality and / or are otherwise used in (e.g., to perform activities in) an artificial reality.

[0132] AR systems may be implemented in a variety of different form factors and configurations. Some AR systems may be designed to work without near-eye displays (NEDs). Other AR systems may include a NED that also provides visibility into the real world (such as, e.g., augmented-reality system 2400 in FIG. 24) or that visually immerses a user in an artificial reality (such as, e.g., virtual-reality system 2500 in FIGS. 25A and 25B). While some AR devices may be self-contained systems, other AR devices may communicate and / or coordinate with external devices to provide an AR experience to a user. Examples of such external devices include handheld controllers, mobile devices, desktop computers, devices worn by a user, devices worn by one or more other users, and / or any other suitable external system.

[0133] FIGS. 18-21B illustrate example artificial-reality (AR) systems in accordance with some embodiments. FIG. 18 shows a first AR system 1800 and first example user interactions using a wrist-wearable device 1802, a head-wearable device (e.g., AR glasses 2400), and / or a handheld intermediary processing device (HIPD) 1806. FIG. 19 shows a second AR system 1900 and second example user interactions using a wrist-wearable device 1902, AR glasses 1904, and / or an HIPD 1906. FIGS. 20A and 20B show a third AR system 2000 and third example user 2008 interactions using a wrist-wearable device 2002, a head-wearable device (e.g., VR headset 2050), and / or an HIPD 2006. FIGS. 21A and 21B show a fourth AR system 2100 and fourth example user 2108 interactions using a wrist-wearable device 2130, VR headset 2120, and / or a haptic device 2160 (e.g., wearable gloves).

[0134] A wrist-wearable device 2200, which can be used for wrist-wearable device 1802, 1902, 2002, 2130, and one or more of its components, are described below in reference to FIGS. 22 and 23; head-wearable devices 2400 and 2500, which can respectively be used for AR glasses 1804, 1904 or VR headset 2050, 2120, and their one or more components are described below in reference to FIGS. 24-26.

[0135] Referring to FIG. 18, wrist-wearable device 1802, AR glasses 1804, and / or HIPD 1806 can communicatively couple via a network 1825 (e.g., cellular, near field, Wi-Fi, personal area network, wireless LAN, etc.). Additionally, wrist-wearable device 1802, AR glasses 1804, and / or HIPD 1806 can also communicatively couple with one or more servers 1830, computers 1840 (e.g., laptops, computers, etc.), mobile devices 1850 (e.g., smartphones, tablets, etc.), and / or other electronic devices via network 1825 (e.g., cellular, near field, Wi-Fi, personal area network, wireless LAN, etc.).

[0136] In FIG. 18, a user 1808 is shown wearing wrist-wearable device 1802 and AR glasses 1804 and having HIPD 1806 on their desk. The wrist-wearable device 1802, AR glasses 1804, and HIPD 1806 facilitate user interaction with an AR environment. In particular, as shown by first AR system 1800, wrist-wearable device 1802, AR glasses 1804, and / or HIPD 1806 cause presentation of one or more avatars 1810, digital representations of contacts 1812, and virtual objects 1814. As discussed below, user 1808 can interact with one or more avatars 1810, digital representations of contacts 1812, and virtual objects 1814 via wristwearable device 1802, AR glasses 1804, and / or HIPD 1806.

[0137] User 1808 can use any of wrist-wearable device 1802, AR glasses 1804, and / or HIPD 1806 to provide user inputs. For example, user 1808 can perform one or more hand gestures that are detected by wrist-wearable device 1802 (e.g., using one or more EMG sensors and / or IM Us, described below in reference to FIGS. 22 and 23) and / or AR glasses 1804 (e.g., using one or more image sensor or camera, described below in reference to FIGS. 24- 10) to provide a user input. Alternatively, or additionally, user 1808 can provide a user input via one or more touch surfaces of wrist-wearable device 1802, AR glasses 1804, HIPD 1806, and / or voice commands captured by a microphone of wrist-wearable device 1802, AR glasses 1804, and / or HIPD 1806. In some embodiments, wrist-wearable device 1802, AR glasses 1804, and / or HIPD 1806 include a digital assistant to help user 1808 in providing a user input (e.g., completing a sequence of operations, suggesting different operations or commands, providing reminders, confirming a command, etc.). In some embodiments, user 1808 can provide a user input via one or more facial gestures and / or facial expressions. For example, cameras of wrist-wearable device 1802, AR glasses 1804, and / or HIPD 1806 can track eyes of user 1808 for navigating a user interface.

[0138] Wrist-wearable device 1802, AR glasses 1804, and / or HIPD 1806 can operate alone or in conjunction to allow user 1808 to interact with the AR environment. Insome embodiments, HIPD 1806 is configured to operate as a central hub or control center for the wrist-wearable device 1802, AR glasses 1804, and / or another communicatively coupled device. For example, user 1808 can provide an input to interact with the AR environment at any of wrist-wearable device 1802, AR glasses 1804, and / or HIPD 1806, and HIPD 1806 can identify one or more back-end and front-end tasks to cause the performance of the requested interaction and distribute instructions to cause the performance of the one or more back-end and front-end tasks at wrist-wearable device 1802, AR glasses 1804, and / or HIPD 1806. In some embodiments, a back-end task is a background processing task that is not perceptible by the user (e.g., rendering content, decompression, compression, etc.), and a front-end task is a user-facing task that is perceptible to the user (e.g., presenting information to the user, providing feedback to the user, etc.). HIPD 1806 can perform the back-end tasks and provide wrist-wearable device 1802 and / or AR glasses 1804 operational data corresponding to the performed back-end tasks such that wrist-wearable device 1802 and / or AR glasses 1804 can perform the front-end tasks. In this way, HIPD 1806, which has more computational resources and greater thermal headroom than wrist-wearable device 1802 and / or AR glasses 1804, performs computationally intensive tasks and reduces the computer resource utilization and / or power usage of wrist-wearable device 1802 and / or AR glasses 1804.

[0139] In the example shown by first AR system 1800, HIPD 1806 identifies one or more back-end tasks and front-end tasks associated with a user request to initiate an AR video call with one or more other users (represented by avatar 1810 and the digital representation of contact 1812) and distributes instructions to cause the performance of the one or more back-end tasks and front-end tasks. In particular, HIPD 1806 performs back-end tasks for processing and / or rendering image data (and other data) associated with the AR video call and provides operational data associated with the performed back-end tasks to AR glasses 1804 such that the AR glasses 1804 perform front-end tasks for presenting the AR video call (e.g., presenting avatar 1810 and digital representation of contact 1812).

[0140] In some embodiments, HIPD 1806 can operate as a focal or anchor point for causing the presentation of information. This allows user 1808 to be generally aware of where information is presented. For example, as shown in first AR system 1800, avatar 1810 and the digital representation of contact 1812 are presented above HIPD 1806. In particular, HIPD 1806 and AR glasses 1804 operate in conjunction to determine a location for presenting avatar 1810 and the digital representation of contact 1812. In some embodiments,information can be presented a predetermined distance from HIPD 1806 (e.g., within 5 meters). For example, as shown in first AR system 1800, virtual object 1814 is presented on the desk some distance from HIPD 1806. Similar to the above example, HIPD 1806 and AR glasses 1804 can operate in conjunction to determine a location for presenting virtual object 1814. Alternatively, in some embodiments, presentation of information is not bound by HIPD 1806. More specifically, avatar 1810, digital representation of contact 1812, and virtual object 1814 do not have to be presented within a predetermined distance of HIPD 1806.

[0141] U ser inputs provided at wrist-wearable device 1802, AR glasses 1804, and / or HIPD 1806 are coordinated such that the user can use any device to initiate, continue, and / or complete an operation. For example, user 1808 can provide a user input to AR glasses 1804 to cause AR glasses 1804 to present virtual object 1814 and, while virtual object 1814 is presented by AR glasses 1804, user 1808 can provide one or more hand gestures via wristwearable device 1802 to interact and / or manipulate virtual object 1814.

[0142] FIG. 19 shows a user 1908 wearing a wrist-wearable device 1902 and AR glasses 1904, and holding an HIPD 1906. In second AR system 1900, the wrist-wearable device 1902, AR glasses 1904, and / or HIPD 1906 are used to receive and / or provide one or more messages to a contact of user 1908. In particular, wrist-wearable device 1902, AR glasses 1904, and / or HIPD 1906 detect and coordinate one or more user inputs to initiate a messaging application and prepare a response to a received message via the messaging application.

[0143] In some embodiments, user 1908 initiates, via a user input, an application on wrist-wearable device 1902, AR glasses 1904, and / or HIPD 1906 that causes the application to initiate on at least one device. For example, in second AR system 1900, user 1908 performs a hand gesture associated with a command for initiating a messaging application (represented by messaging user interface 1916), wrist-wearable device 1902 detects the hand gesture and, based on a determination that user 1908 is wearing AR glasses 1904, causes AR glasses 1904 to present a messaging user interface 1916 of the messaging application. AR glasses 1904 can present messaging user interface 1916 to user 1908 via its display (e.g., as shown by a field of view 1918 of user 1908). In some embodiments, the application is initiated and executed on the device (e.g., wrist-wearable device 1902, AR glasses 1904, and / or HIPD 1906) that detects the user input to initiate the application, and the device provides another device operational data to cause the presentation of the messaging application. For example, wrist-wearable device 1902 can detect the user input to initiate a messaging application, initiate and run themessaging application, and provide operational data to AR glasses 1904 and / or HIPD 1906 to cause presentation of the messaging application. Alternatively, the application can be initiated and executed at a device other than the device that detected the user input. For example, wrist-wearable device 1902 can detect the hand gesture associated with initiating the messaging application and cause HIPD 1906 to run the messaging application and coordinate the presentation of the messaging application.

[0144] Further, user 1908 can provide a user input provided at wrist-wearable device 1902, AR glasses 1904, and / or HIPD 1906 to continue and / or complete an operation initiated at another device. For example, after initiating the messaging application via wristwearable device 1902 and while AR glasses 1904 present messaging user interface 1916, user 1908 can provide an input at HIPD 1906 to prepare a response (e.g., shown by the swipe gesture performed on HIPD 1906). Gestures performed by user 1908 on HIPD 1906 can be provided and / or displayed on another device. For example, a swipe gestured performed on HIPD 1906 is displayed on a virtual keyboard of messaging user interface 1916 displayed by AR glasses 1904.

[0145] In some embodiments, wrist-wearable device 1902, AR glasses 1904, HIPD 1906, and / or any other communicatively coupled device can present one or more notifications to user 1908. The notification can be an indication of a new message, an incoming call, an application update, a status update, etc. User 1908 can select the notification via wrist-wearable device 1902, AR glasses 1904, and / or HIPD 1906 and can cause presentation of an application or operation associated with the notification on at least one device. For example, user 1908 can receive a notification that a message was received at wrist-wearable device 1902, AR glasses 1904, HIPD 1906, and / or any other communicatively coupled device and can then provide a user input at wrist-wearable device 1902, AR glasses 1904, and / or HIPD 1906 to review the notification, and the device detecting the user input can cause an application associated with the notification to be initiated and / or presented at wrist-wearable device 1902, AR glasses 1904, and / or HIPD 1906.

[0146] While the above example describes coordinated inputs used to interact with a messaging application, user inputs can be coordinated to interact with any number of applications including, but not limited to, gaming applications, social media applications, camera applications, web-based applications, financial applications, etc. For example, AR glasses 1904 can present to user 1908 game application data, and HIPD 1906 can be used asa controller to provide inputs to the game. Similarly, user 1908 can use wrist-wearable device 1902 to initiate a camera of AR glasses 1904, and user 308 can use wrist-wearable device 1902, AR glasses 1904, and / or HIPD 1906 to manipulate the image capture (e.g., zoom in or out, apply filters, etc.) and capture image data.

[0147] Users may interact with the devices disclosed herein in a variety of ways. For example, as shown in FIGS. 20A and 20B, a user 2008 may interact with an AR system 2000 by donning a VR headset 2050 while holding HIPD 2006 and wearing wrist-wearable device 2002. In this example, AR system 2000 may enable a user to interact with a game 2010 by swiping their arm. One or more of VR headset 2050, HIPD 2006, and wrist-wearable device 2002 may detect this gesture and, in response, may display a sword strike in game 2010. Similarly, in FIGS. 21A and 21B, a user 2108 may interact with an AR system 2100 by donning a VR headset 2120 while wearing haptic device 2160 and wrist-wearable device 2130. In this example, AR system 2100 may enable a user to interact with a game 2110 by swiping their arm. One or more of VR headset 2120, haptic device 2160, and wrist-wearable device 2130 may detect this gesture and, in response, may display a spell being cast in game 2010.

[0148] Having discussed example AR systems, devices for interacting with such AR systems and other computing systems more generally will now be discussed in greater detail. Some explanations of devices and components that can be included in some or all of the example devices discussed below are explained herein for ease of reference. Certain types of the components described below may be more suitable for a particular set of devices, and less suitable for a different set of devices. But subsequent reference to the components explained here should be considered to be encompassed by the descriptions provided.

[0149] In some embodiments discussed below, example devices and systems, including electronic devices and systems, will be addressed. Such example devices and systems are not intended to be limiting, and one of skill in the art will understand that alternative devices and systems to the example devices and systems described herein may be used to perform the operations and construct the systems and devices that are described herein.

[0150] An electronic device may be a device that uses electrical energy to perform a specific function. An electronic device can be any physical object that contains electronic components such as transistors, resistors, capacitors, diodes, and integrated circuits. Examples of electronic devices include smartphones, laptops, digital cameras, televisions,gaming consoles, and music players, as well as the example electronic devices discussed herein. As described herein, an intermediary electronic device may be a device that sits between two other electronic devices and / or a subset of components of one or more electronic devices and facilitates communication, data processing, and / or data transfer between the respective electronic devices and / or electronic components.

[0151] An integrated circuit may be an electronic device made up of multiple interconnected electronic components such as transistors, resistors, and capacitors. These components may be etched onto a small piece of semiconductor material, such as silicon. Integrated circuits may include analog integrated circuits, digital integrated circuits, mixed signal integrated circuits, and / or any other suitable type or form of integrated circuit. Examples of integrated circuits include application-specific integrated circuits (ASICs), processing units, central processing units (CPUs), co-processors, and accelerators.

[0152] Analog integrated circuits, such as sensors, power management circuits, and operational amplifiers, may process continuous signals and perform analog functions such as amplification, active filtering, demodulation, and mixing. Examples of analog integrated circuits include linear integrated circuits and radio frequency circuits.

[0153] Digital integrated circuits, which may be referred to as logic integrated circuits, may include microprocessors, microcontrollers, memory chips, interfaces, power management circuits, programmable devices, and / or any other suitable type or form of integrated circuit. In some embodiments, examples of integrated circuits include central processing units (CPUs),

[0154] P rocessing units, such as CPUs, may be electronic components that are responsible for executing instructions and controlling the operation of an electronic device (e.g., a computer). There are various types of processors that may be used interchangeably, or may be specifically required, by embodiments described herein. For example, a processor may be: (i) a general processor designed to perform a wide range of tasks, such as running software applications, managing operating systems, and performing arithmetic and logical operations; (ii) a microcontroller designed for specific tasks such as controlling electronic devices, sensors, and motors; (iii) an accelerator, such as a graphics processing unit (GPU), designed to accelerate the creation and rendering of images, videos, and animations (e.g., virtual-reality animations, such as three-dimensional modeling); (iv) a field-programmable gate array (FPGA) that can be programmed and reconfigured after manufacturing and / or canbe customized to perform specific tasks, such as signal processing, cryptography, and machine learning; and / or (v) a digital signal processor (DSP) designed to perform mathematical operations on signals such as audio, video, and radio waves. One or more processors of one or more electronic devices may be used in various embodiments described herein.

[0155] Memory generally refers to electronic components in a computer or electronic device that store data and instructions for the processor to access and manipulate. Examples of memory can include: (i) random access memory (RAM) configured to store data and instructions temporarily; (ii) read-only memory (ROM) configured to store data and instructions permanently (e.g., one or more portions of system firmware, and / or boot loaders) and / or semi-permanently; (iii) flash memory, which can be configured to store data in electronic devices (e.g., USB drives, memory cards, and / or solid-state drives (SSDs)); and / or (iv) cache memory configured to temporarily store frequently accessed data and instructions. Memory, as described herein, can store structured data (e.g., SQL databases, MongoDB databases, GraphQL data, JSON data, etc.). Other examples of data stored in memory can include (i) profile data, including user account data, user settings, and / or other user data stored by the user, (ii) sensor data detected and / or otherwise obtained by one or more sensors, (iii) media content data including stored image data, audio data, documents, and the like, (iv) application data, which can include data collected and / or otherwise obtained and stored during use of an application, and / or any other types of data described herein.

[0156] Controllers may be electronic components that manage and coordinate the operation of other components within an electronic device (e.g., controlling inputs, processing data, and / or generating outputs). Examples of controllers can include: (i) microcontrollers, including small, low-power controllers that are commonly used in embedded systems and Internet of Things (loT) devices; (ii) programmable logic controllers (PLCs) that may be configured to be used in industrial automation systems to control and monitor manufacturing processes; (iii) system-on-a-chip (SoC) controllers that integrate multiple components such as processors, memory, I / O interfaces, and other peripherals into a single chip; and / or (iv) DSPs.

[0157] A power system of an electronic device may be configured to convert incoming electrical power into a form that can be used to operate the device. A power system can include various components, such as (i) a power source, which can be an alternating current (AC) adapter or a direct current (DC) adapter power supply, (ii) a charger input, whichcan be configured to use a wired and / or wireless connection (which may be part of a peripheral interface, such as a USB, micro-USB interface, near-field magnetic coupling, magnetic inductive and magnetic resonance charging, and / or radio frequency (RF) charging), (iii) a power-management integrated circuit, configured to distribute power to various components of the device and to ensure that the device operates within safe limits (e.g., regulating voltage, controlling current flow, and / or managing heat dissipation), and / or (iv) a battery configured to store power to provide usable power to components of one or more electronic devices.

[0158] Peripheral interfaces may be electronic components (e.g., of electronic devices) that allow electronic devices to communicate with other devices or peripherals and can provide the ability to input and output data and signals. Examples of peripheral interfaces can include (i) universal serial bus (USB) and / or micro-USB interfaces configured for connecting devices to an electronic device, (ii) Bluetooth interfaces configured to allow devices to communicate with each other, including Bluetooth low energy (BLE), (iii) near field communication (NFC) interfaces configured to be short-range wireless interfaces for operations such as access control, (iv) POGO pins, which may be small, spring-loaded pins configured to provide a charging interface, (v) wireless charging interfaces, (vi) GPS interfaces, (vii) Wi-Fi interfaces for providing a connection between a device and a wireless network, and / or (viii) sensor interfaces.

[0159] Sensors may be electronic components (e.g., in and / or otherwise in electronic communication with electronic devices, such as wearable devices) configured to detect physical and environmental changes and generate electrical signals. Examples of sensors can include (i) imaging sensors for collecting imaging data (e.g., including one or more cameras disposed on a respective electronic device), (ii) biopotential-signal sensors, (iii) inertial measurement units (e.g., IMUs) for detecting, for example, angular rate, force, magnetic field, and / or changes in acceleration, (iv) heart rate sensors for measuring a user's heart rate, (v) SpO2 sensors for measuring blood oxygen saturation and / or other biometric data of a user, (vi) capacitive sensors for detecting changes in potential at a portion of a user's body (e.g., a sensor-skin interface), and / or (vii) light sensors (e.g., time-of -flight sensors, infrared light sensors, visible light sensors, etc.).

[0160] Bi opotential-signal-sensing components may be devices used to measure electrical activity within the body (e.g., biopotential-signal sensors). Some types ofbiopotential-signal sensors include (i) electroencephalography (EEG) sensors configured to measure electrical activity in the brain to diagnose neurological disorders, (ii) electrocardiography (ECG or EKG) sensors configured to measure electrical activity of the heart to diagnose heart problems, (iii) electromyography (EMG) sensors configured to measure the electrical activity of muscles and to diagnose neuromuscular disorders, and (iv) electrooculography (EOG) sensors configure to measure the electrical activity of eye muscles to detect eye movement and diagnose eye disorders.

[0161] An application stored in memory of an electronic device (e.g., software) may include instructions stored in the memory. Examples of such applications include (i) games, (ii) word processors, (iii) messaging applications, (iv) media-streaming applications, (v) financial applications, (vi) calendars, (vii) clocks, and (viii) communication interface modules for enabling wired and / or wireless connections between different respective electronic devices (e.g., IEEE 2402.15.4, Wi-Fi, ZigBee, 6L0WPAN, Thread, Z-Wave, Bluetooth Smart, ISAlOO.lla, WirelessHART, or MiWi), custom or standard wired protocols (e.g., Ethernet or HomePlug), and / or any other suitable communication protocols).

[0162] A communication interface may be a mechanism that enables different systems or devices to exchange information and data with each other, including hardware, software, or a combination of both hardware and software. For example, a communication interface can refer to a physical connector and / or port on a device that enables communication with other devices (e.g., USB, Ethernet, HDMI, Bluetooth). In some embodiments, a communication interface can refer to a software layer that enables different software programs to communicate with each other (e.g., application programming interfaces (APIs), protocols like HTTP and TCP / IP, etc.).

[0163] A graphics module may be a component or software module that is designed to handle graphical operations and / or processes and can include a hardware module and / or a software module.

[0164] Non-transitory computer-readable storage media may be physical devices or storage media that can be used to store electronic data in a non-transitory form (e.g., such that the data is stored permanently until it is intentionally deleted or modified).

[0165] FIGS. 22 and 23 illustrate an example wrist-wearable device 2200 and an example computer system 2300, in accordance with some embodiments. Wrist-wearable device 2200 is an instance of wearable device 1802 described in FIG. 18 herein, such that thewearable device 1802 should be understood to have the features of the wrist-wearable device 2200 and vice versa. FIG. 23 illustrates components of the wrist-wearable device 2200, which can be used individually or in combination, including combinations that include other electronic devices and / or electronic components.

[0166] FIG. 22 shows a wearable band 2210 and a watch body 2220 (or capsule) being coupled, as discussed below, to form wrist-wearable device 2200. Wrist-wearable device 2200 can perform various functions and / or operations associated with navigating through user interfaces and selectively opening applications as well as the functions and / or operations described above with reference to FIGS. 18-21B.

[0167] As will be described in more detail below, operations executed by wristwearable device 2200 can include (i) presenting content to a user (e.g., displaying visual content via a display 2205), (ii) detecting (e.g., sensing) user input (e.g., sensing a touch on peripheral button 2223 and / or at a touch screen of the display 2205, a hand gesture detected by sensors (e.g., biopotential sensors)), (iii) sensing biometric data (e.g., neuromuscular signals, heart rate, temperature, sleep, etc.) via one or more sensors 2213, messaging (e.g., text, speech, video, etc.); image capture via one or more imaging devices or cameras 2225, wireless communications (e.g., cellular, near field, Wi-Fi, personal area network, etc.), location determination, financial transactions, providing haptic feedback, providing alarms, providing notifications, providing biometric authentication, providing health monitoring, providing sleep monitoring, etc.

[0168] The above-example functions can be executed independently in watch body 2220, independently in wearable band 2210, and / or via an electronic communication between watch body 2220 and wearable band 2210. In some embodiments, functions can be executed on wrist-wearable device 2200 while an AR environment is being presented (e.g., via one of AR systems 1800 to 2100). The wearable devices described herein can also be used with other types of AR environments.

[0169] Wearable band 2210 can be configured to be worn by a user such that an inner surface of a wearable structure 2211 of wearable band 2210 is in contact with the user's skin. In this example, when worn by a user, sensors 2213 may contact the user's skin. In some examples, one or more of sensors 2213 can sense biometric data such as a user's heart rate, a saturated oxygen level, temperature, sweat level, neuromuscular signals, or a combination thereof. One or more of sensors 2213 can also sense data about a user's environmentincluding a user's motion, altitude, location, orientation, gait, acceleration, position, or a combination thereof. In some embodiment, one or more of sensors 2213 can be configured to track a position and / or motion of wearable band 2210. One or more of sensors 2213 can include any of the sensors defined above and / or discussed below with respect to FIG. 22.

[0170] One or more of sensors 2213 can be distributed on an inside and / or an outside surface of wearable band 2210. In some embodiments, one or more of sensors 2213 are uniformly spaced along wearable band 2210. Alternatively, in some embodiments, one or more of sensors 2213 are positioned at distinct points along wearable band 2210. As shown in FIG. 22, one or more of sensors 2213 can be the same or distinct. For example, in some embodiments, one or more of sensors 2213 can be shaped as a pill (e.g., sensor 2213a), an oval, a circle a square, an oblong (e.g., sensor 2213c) and / or any other shape that maintains contact with the user's skin (e.g., such that neuromuscular signal and / or other biometric data can be accurately measured at the user's skin). In some embodiments, one or more sensors of 2213 are aligned to form pairs of sensors (e.g., for sensing neuromuscular signals based on differential sensing within each respective sensor). For example, sensor 2213b may be aligned with an adjacent sensor to form sensor pair 2214a and sensor 2213d may be aligned with an adjacent sensor to form sensor pair 2214b. In some embodiments, wearable band 2210 does not have a sensor pair. Alternatively, in some embodiments, wearable band 2210 has a predetermined number of sensor pairs (one pair of sensors, three pairs of sensors, four pairs of sensors, six pairs of sensors, sixteen pairs of sensors, etc.).

[0171] Wearable band 2210 can include any suitable number of sensors 2213. In some embodiments, the number and arrangement of sensors 2213 depends on the particular application for which wearable band 2210 is used. For instance, wearable band 2210 can be configured as an armband, wristband, or chest-band that include a plurality of sensors 2213 with different number of sensors 2213, a variety of types of individual sensors with the plurality of sensors 2213, and different arrangements for each use case, such as medical use cases as compared to gaming or general day-to-day use cases.

[0172] In accordance with some embodiments, wearable band 2210 further includes an electrical ground electrode and a shielding electrode. The electrical ground and shielding electrodes, like the sensors 2213, can be distributed on the inside surface of the wearable band 2210 such that they contact a portion of the user's skin. For example, the electrical ground and shielding electrodes can be at an inside surface of a coupling mechanism2216 or an inside surface of a wearable structure 2211. The electrical ground and shielding electrodes can be formed and / or use the same components as sensors 2213. In some embodiments, wearable band 2210 includes more than one electrical ground electrode and more than one shielding electrode.

[0173] Sensors 2213 can be formed as part of wearable structure 2211 of wearable band 2210. In some embodiments, sensors 2213 are flush or substantially flush with wearable structure 2211 such that they do not extend beyond the surface of wearable structure 2211. While flush with wearable structure 2211, sensors 2213 are still configured to contact the user's skin (e.g., via a skin-contacting surface). Alternatively, in some embodiments, sensors 2213 extend beyond wearable structure 2211 a predetermined distance (e.g., 0.1 - 2 mm) to make contact and depress into the user's skin. In some embodiment, sensors 2213 are coupled to an actuator (not shown) configured to adjust an extension height (e.g., a distance from the surface of wearable structure 2211) of sensors 2213 such that sensors 2213 make contact and depress into the user's skin. In some embodiments, the actuators adjust the extension height between 0.01 mm - 1.2 mm. This may allow a the user to customize the positioning of sensors 2213 to improve the overall comfort of the wearable band 2210 when worn while still allowing sensors 2213 to contact the user's skin. In some embodiments, sensors 2213 are indistinguishable from wearable structure 2211 when worn by the user.

[0174] Wearable structure 2211 can be formed of an elastic material, elastomers, etc., configured to be stretched and fitted to be worn by the user. In some embodiments, wearable structure 2211 is a textile or woven fabric. As described above, sensors 2213 can be formed as part of a wearable structure 2211. For example, sensors 2213 can be molded into the wearable structure 2211, be integrated into a woven fabric (e.g., sensors 2213 can be sewn into the fabric and mimic the pliability of fabric and can and / or be constructed from a series woven strands of fabric).

[0175] Wearable structure 2211 can include flexible electronic connectors that interconnect sensors 2213, the electronic circuitry, and / or other electronic components (described below in reference to FIG. 23) that are enclosed in wearable band 2210. In some embodiments, the flexible electronic connectors are configured to interconnect sensors 2213, the electronic circuitry, and / or other electronic components of wearable band 2210 with respective sensors and / or other electronic components of another electronic device (e.g.,watch body 2220). The flexible electronic connectors are configured to move with wearable structure 2211 such that the user adjustment to wearable structure 2211 (e.g., resizing, pulling, folding, etc.) does not stress or strain the electrical coupling of components of wearable band 2210.

[0176] As described above, wearable band 2210 is configured to be worn by a user. In particular, wearable band 2210 can be shaped or otherwise manipulated to be worn by a user. For example, wearable band 2210 can be shaped to have a substantially circular shape such that it can be configured to be worn on the user's lower arm or wrist. Alternatively, wearable band 2210 can be shaped to be worn on another body part of the user, such as the user's upper arm (e.g., around a bicep), forearm, chest, legs, etc. Wearable band 2210 can include a retaining mechanism 2212 (e.g., a buckle, a hook and loop fastener, etc.) for securing wearable band 2210 to the user's wrist or other body part. While wearable band 2210 is worn by the user, sensors 2213 sense data (referred to as sensor data) from the user's skin. In some examples, sensors 2213 of wearable band 2210 obtain (e.g., sense and record) neuromuscular signals.

[0177] The sensed data (e.g., sensed neuromuscular signals) can be used to detect and / or determine the user's intention to perform certain motor actions. In some examples, sensors 2213 may sense and record neuromuscular signals from the user as the user performs muscular activations (e.g., movements, gestures, etc.). The detected and / or determined motor actions (e.g., phalange (or digit) movements, wrist movements, hand movements, and / or other muscle intentions) can be used to determine control commands or control information (instructions to perform certain commands after the data is sensed) for causing a computing device to perform one or more input commands. For example, the sensed neuromuscular signals can be used to control certain user interfaces displayed on display 2205 of wrist-wearable device 2200 and / or can be transmitted to a device responsible for rendering an artificial-reality environment (e.g., a head-mounted display) to perform an action in an associated artificial-reality environment, such as to control the motion of a virtual device displayed to the user. The muscular activations performed by the user can include static gestures, such as placing the user's hand palm down on a table, dynamic gestures, such as grasping a physical or virtual object, and covert gestures that are imperceptible to another person, such as slightly tensing a joint by co-contracting opposing muscles or using sub- muscular activations. The muscular activations performed by the user can include symbolicgestures (e.g., gestures mapped to other gestures, interactions, or commands, for example, based on a gesture vocabulary that specifies the mapping of gestures to commands).

[0178] The sensor data sensed by sensors 2213 can be used to provide a user with an enhanced interaction with a physical object (e.g., devices communicatively coupled with wearable band 2210) and / or a virtual object in an artificial-reality application generated by an artificial-reality system (e.g., user interface objects presented on the display 2205, or another computing device (e.g., a smartphone)).

[0179] In some embodiments, wearable band 2210 includes one or more haptic devices 2346 (e.g., a vibratory haptic actuator) that are configured to provide haptic feedback (e.g., a cutaneous and / or kinesthetic sensation, etc.) to the user's skin. Sensors 2213 and / or haptic devices 2346 (shown in FIG. 23) can be configured to operate in conjunction with multiple applications including, without limitation, health monitoring, social media, games, and artificial reality (e.g., the applications associated with artificial reality).

[0180] Wearable band 2210 can also include coupling mechanism 2216 for detachably coupling a capsule (e.g., a computing unit) or watch body 2220 (via a coupling surface of the watch body 2220) to wearable band 2210. For example, a cradle or a shape of coupling mechanism 2216 can correspond to shape of watch body 2220 of wrist-wearable device 2200. In particular, coupling mechanism 2216 can be configured to receive a coupling surface proximate to the bottom side of watch body 2220 (e.g., a side opposite to a front side of watch body 2220 where display 2205 is located), such that a user can push watch body 2220 downward into coupling mechanism 2216 to attach watch body 2220 to coupling mechanism 2216. In some embodiments, coupling mechanism 2216 can be configured to receive a top side of the watch body 2220 (e.g., a side proximate to the front side of watch body 2220 where display 2205 is located) that is pushed upward into the cradle, as opposed to being pushed downward into coupling mechanism 2216. In some embodiments, coupling mechanism 2216 is an integrated component of wearable band 2210 such that wearable band 2210 and coupling mechanism 2216 are a single unitary structure. In some embodiments, coupling mechanism 2216 is a type of frame or shell that allows watch body 2220 coupling surface to be retained within or on wearable band 2210 coupling mechanism 2216 (e.g., a cradle, a tracker band, a support base, a clasp, etc.).

[0181] Coupling mechanism 2216 can allow for watch body 2220 to be detachably coupled to the wearable band 2210 through a friction fit, magnetic coupling, a rotation-basedconnector, a shear-pin coupler, a retention spring, one or more magnets, a clip, a pin shaft, a hook and loop fastener, or a combination thereof. A user can perform any type of motion to couple the watch body 2220 to wearable band 2210 and to decouple the watch body 2220 from the wearable band 2210. For example, a user can twist, slide, turn, push, pull, or rotate watch body 2220 relative to wearable band 2210, or a combination thereof, to attach watch body 2220 to wearable band 2210 and to detach watch body 2220 from wearable band 2210. Alternatively, as discussed below, in some embodiments, the watch body 2220 can be decoupled from the wearable band 2210 by actuation of a release mechanism 2229.

[0182] Wearable band 2210 can be coupled with watch body 2220 to increase the functionality of wearable band 2210 (e.g., converting wearable band 2210 into wrist-wearable device 2200, adding an additional computing unit and / or battery to increase computational resources and / or a battery life of wearable band 2210, adding additional sensors to improve sensed data, etc.). As described above, wearable band 2210 and coupling mechanism 2216 are configured to operate independently (e.g., execute functions independently) from watch body 2220. For example, coupling mechanism 2216 can include one or more sensors 2213 that contact a user's skin when wearable band 2210 is worn by the user, with or without watch body 2220 and can provide sensor data for determining control commands.

[0183] A user can detach watch body 2220 from wearable band 2210 to reduce the encumbrance of wrist-wearable device 2200 to the user. For embodiments in which watch body 2220 is removable, watch body 2220 can be referred to as a removable structure, such that in these embodiments wrist-wearable device 2200 includes a wearable portion (e.g., wearable band 2210) and a removable structure (e.g., watch body 2220).

[0184] Turning to watch body 2220, in some examples watch body 2220 can have a substantially rectangular or circular shape. Watch body 2220 is configured to be worn by the user on their wrist or on another body part. More specifically, watch body 2220 is sized to be easily carried by the user, attached on a portion of the user's clothing, and / or coupled to wearable band 2210 (forming the wrist-wearable device 2200). As described above, watch body 2220 can have a shape corresponding to coupling mechanism 2216 of wearable band 2210. In some embodiments, watch body 2220 includes a single release mechanism 2229 or multiple release mechanisms (e.g., two release mechanisms 2229 positioned on opposing sides of watch body 2220, such as spring-loaded buttons) for decoupling watch body 2220 from wearable band 2210. Release mechanism 2229 can include, without limitation, a button,a knob, a plunger, a handle, a lever, a fastener, a clasp, a dial, a latch, or a combination thereof.

[0185] A user can actuate release mechanism 2229 by pushing, turning, lifting, depressing, shifting, or performing other actions on release mechanism 2229. Actuation of release mechanism 2229 can release (e.g., decouple) watch body 2220 from coupling mechanism 2216 of wearable band 2210, allowing the user to use watch body 2220 independently from wearable band 2210 and vice versa. For example, decoupling watch body 2220 from wearable band 2210 can allow a user to capture images using rear-facing camera 2225b. Although release mechanism 2229 is shown positioned at a corner of watch body2220, release mechanism 2229 can be positioned anywhere on watch body 2220 that is convenient for the user to actuate. In addition, in some embodiments, wearable band 2210 can also include a respective release mechanism for decoupling watch body 2220 from coupling mechanism 2216. In some embodiments, release mechanism 2229 is optional and watch body 2220 can be decoupled from coupling mechanism 2216 as described above (e.g., via twisting, rotating, etc.).

[0186] Watch body 2220 can include one or more peripheral buttons 2223 and 2227 for performing various operations at watch body 2220. For example, peripheral buttons 2223 and 2227 can be used to turn on or wake (e.g., transition from a sleep state to an active state) display 2205, unlock watch body 2220, increase or decrease a volume, increase or decrease a brightness, interact with one or more applications, interact with one or more user interfaces, etc. Additionally or alternatively, in some embodiments, display 2205 operates as a touch screen and allows the user to provide one or more inputs for interacting with watch body 2220.

[0187] In some embodiments, watch body 2220 includes one or more sensors2221. Sensors 2221 of watch body 2220 can be the same or distinct from sensors 2213 of wearable band 2210. Sensors 2221 of watch body 2220 can be distributed on an inside and / or an outside surface of watch body 2220. In some embodiments, sensors 2221 are configured to contact a user's skin when watch body 2220 is worn by the user. For example, sensors 2221 can be placed on the bottom side of watch body 2220 and coupling mechanism 2216 can be a cradle with an opening that allows the bottom side of watch body 2220 to directly contact the user's skin. Alternatively, in some embodiments, watch body 2220 does not include sensors that are configured to contact the user's skin (e.g., including sensors internal and / orexternal to the watch body 2220 that are configured to sense data of watch body 2220 and the surrounding environment). In some embodiments, sensors 2221 are configured to track a position and / or motion of watch body 2220.

[0188] Watch body 2220 and wearable band 2210 can share data using a wired communication method (e.g., a Universal Asynchronous Receiver / Transmitter (UART), a USB transceiver, etc.) and / or a wireless communication method (e.g., near field communication, Bluetooth, etc.). For example, watch body 2220 and wearable band 2210 can share data sensed by sensors 2213 and 2221, as well as application and device specific information (e.g., active and / or available applications, output devices (e.g., displays, speakers, etc.), input devices (e.g., touch screens, microphones, imaging sensors, etc.).

[0189] In some embodiments, watch body 2220 can include, without limitation, a front-facing camera 2225a and / or a rear-facing camera 2225b, sensors 2221 (e.g., a biometric sensor, an IMU, a heart rate sensor, a saturated oxygen sensor, a neuromuscular signal sensor, an altimeter sensor, a temperature sensor, a bioimpedance sensor, a pedometer sensor, an optical sensor (e.g., imaging sensor 2363), a touch sensor, a sweat sensor, etc.). In some embodiments, watch body 2220 can include one or more haptic devices 2376 (e.g., a vibratory haptic actuator) that is configured to provide haptic feedback (e.g., a cutaneous and / or kinesthetic sensation, etc.) to the user. Sensors 2321 and / or haptic device 2376 can also be configured to operate in conjunction with multiple applications including, without limitation, health monitoring applications, social media applications, game applications, and artificial reality applications (e.g., the applications associated with artificial reality).

[0190] As described above, watch body 2220 and wearable band 2210, when coupled, can form wrist-wearable device 2200. When coupled, watch body 2220 and wearable band 2210 may operate as a single device to execute functions (operations, detections, communications, etc.) described herein. In some embodiments, each device may be provided with particular instructions for performing the one or more operations of wristwearable device 2200. For example, in accordance with a determination that watch body 2220 does not include neuromuscular signal sensors, wearable band 2210 can include alternative instructions for performing associated instructions (e.g., providing sensed neuromuscular signal data to watch body 2220 via a different electronic device). Operations of wrist-wearable device 2200 can be performed by watch body 2220 alone or in conjunction with wearable band 2210 (e.g., via respective processors and / or hardware components) andvice versa. In some embodiments, operations of wrist-wearable device 2200, watch body 2220, and / or wearable band 2210 can be performed in conjunction with one or more processors and / or hardware components.

[0191] As described below with reference to the block diagram of FIG. 23, wearable band 2210 and / or watch body 2220 can each include independent resources required to independently execute functions. For example, wearable band 2210 and / or watch body 2220 can each include a power source (e.g., a battery), a memory, data storage, a processor (e.g., a central processing unit (CPU)), communications, a light source, and / or input / output devices.

[0192] FIG. 23 shows block diagrams of a computing system 2330 corresponding to wearable band 2210 and a computing system 2360 corresponding to watch body 2220 according to some embodiments. Computing system 2300 of wrist-wearable device 2200 may include a combination of components of wearable band computing system 2330 and watch body computing system 2360, in accordance with some embodiments.

[0193] Watch body 2220 and / or wearable band 2210 can include one or more components shown in watch body computing system 2360. In some embodiments, a single integrated circuit may include all or a substantial portion of the components of watch body computing system 2360 included in a single integrated circuit. Alternatively, in some embodiments, components of the watch body computing system 2360 may be included in a plurality of integrated circuits that are communicatively coupled. In some embodiments, watch body computing system 2360 may be configured to couple (e.g., via a wired or wireless connection) with wearable band computing system 2330, which may allow the computing systems to share components, distribute tasks, and / or perform other operations described herein (individually or as a single device).

[0194] Watch body computing system 2360 can include one or more processors 2379, a controller 2377, a peripherals interface 2361, a power system 2395, and memory (e.g., a memory 2380).

[0195] Power system 2395 can include a charger input 2396, a powermanagement integrated circuit (PMIC) 2397, and a battery 2398. In some embodiments, a watch body 2220 and a wearable band 2210 can have respective batteries (e.g., battery 2398 and 2359) and can share power with each other. Watch body 2220 and wearable band 2210 can receive a charge using a variety of techniques. In some embodiments, watch body 2220and wearable band 2210 can use a wired charging assembly (e.g., power cords) to receive the charge. Alternatively, or in addition, watch body 2220 and / or wearable band 2210 can be configured for wireless charging. For example, a portable charging device can be designed to mate with a portion of watch body 2220 and / or wearable band 2210 and wirelessly deliver usable power to battery 2398 of watch body 2220 and / or battery 2359 of wearable band 2210. Watch body 2220 and wearable band 2210 can have independent power systems (e.g., power system 2395 and 2356, respectively) to enable each to operate independently. Watch body 2220 and wearable band 2210 can also share power (e.g., one can charge the other) via respective PMICs (e.g., PMICs 2397 and 2358) and charger inputs (e.g., 2357 and 2396) that can share power over power and ground conductors and / or over wireless charging antennas.

[0196] In some embodiments, peripherals interface 2361 can include one or more sensors 2321. Sensors 2321 can include one or more coupling sensors 2362 for detecting when watch body 2220 is coupled with another electronic device (e.g., a wearable band 2210). Sensors 2321 can include one or more imaging sensors 2363 (e.g., one or more of cameras 2325, and / or separate imaging sensors 2363 (e.g., thermal-imaging sensors)). In some embodiments, sensors 2321 can include one or more SpO2 sensors 2364. In some embodiments, sensors 2321 can include one or more biopotential-signal sensors (e.g., EMG sensors 2365, which may be disposed on an interior, user-facing portion of watch body 2220 and / or wearable band 2210). In some embodiments, sensors 2321 may include one or more capacitive sensors 2366. In some embodiments, sensors 2321 may include one or more heart rate sensors 2367. In some embodiments, sensors 2321 may include one or more IMU sensors 2368. In some embodiments, one or more IMU sensors 2368 can be configured to detect movement of a user's hand or other location where watch body 2220 is placed or held.

[0197] In some embodiments, one or more of sensors 2321 may provide an example human-machine interface. For example, a set of neuromuscular sensors, such as EMG sensors 2365, may be arranged circumferentially around wearable band 2210 with an interior surface of EMG sensors 2365 being configured to contact a user's skin. Any suitable number of neuromuscular sensors may be used (e.g., between 2 and 20 sensors). The number and arrangement of neuromuscular sensors may depend on the particular application for which the wearable device is used. For example, wearable band 2210 can be used to generate control information for controlling an augmented reality system, a robot, controlling a vehicle, scrolling through text, controlling a virtual avatar, or any other suitable control task.

[0198] In some embodiments, neuromuscular sensors may be coupled together using flexible electronics incorporated into the wireless device, and the output of one or more of the sensing components can be optionally processed using hardware signal processing circuitry (e.g., to perform amplification, filtering, and / or rectification). In other embodiments, at least some signal processing of the output of the sensing components can be performed in software such as processors 2379. Thus, signal processing of signals sampled by the sensors can be performed in hardware, software, or by any suitable combination of hardware and software, as aspects of the technology described herein are not limited in this respect.

[0199] Neuromuscular signals may be processed in a variety of ways. For example, the output of EMG sensors 2365 may be provided to an analog front end, which may be configured to perform analog processing (e.g., amplification, noise reduction, filtering, etc.) on the recorded signals. The processed analog signals may then be provided to an analog-to- digital converter, which may convert the analog signals to digital signals that can be processed by one or more computer processors. Furthermore, although this example is as discussed in the context of interfaces with EMG sensors, the embodiments described herein can also be implemented in wearable interfaces with other types of sensors including, but not limited to, mechanomyography (MMG) sensors, sonomyography (SMG) sensors, and electrical impedance tomography (EIT) sensors.

[0200] In some embodiments, peripherals interface 2361 includes a near-field communication (NFC) component 2369, a global-position system (GPS) component 2370, a long-term evolution (LTE) component 2371, and / or a Wi-Fi and / or Bluetooth communication component 2372. In some embodiments, peripherals interface 2361 includes one or more buttons 2373 (e.g., peripheral buttons 2223 and 2227 in FIG. 22), which, when selected by a user, cause operation to be performed at watch body 2220. In some embodiments, the peripherals interface 2361 includes one or more indicators, such as a light emitting diode (LED), to provide a user with visual indicators (e.g., message received, low battery, active microphone and / or camera, etc.).

[0201] Watch body 2220 can include at least one display 2205 for displaying visual representations of information or data to a user, including user-interface elements and / or three-dimensional virtual objects. The display can also include a touch screen for inputting user inputs, such as touch gestures, swipe gestures, and the like. Watch body 2220 can include at least one speaker 2374 and at least one microphone 2375 for providing audio signals to theuser and receiving audio input from the user. The user can provide user inputs through microphone 2375 and can also receive audio output from speaker 2374 as part of a haptic event provided by haptic controller 2378. Watch body 2220 can include at least one camera 2325, including a front camera 2325a and a rear camera 2325b. Cameras 2325 can include ultra-wide-angle cameras, wide angle cameras, fish-eye cameras, spherical cameras, telephoto cameras, depth-sensing cameras, or other types of cameras.

[0202] Watch body computing system 2360 can include one or more haptic controllers 2378 and associated componentry (e.g., haptic devices 2376) for providing haptic events at watch body 2220 (e.g., a vibrating sensation or audio output in response to an event at the watch body 2220). Haptic controllers 2378 can communicate with one or more haptic devices 2376, such as electroacoustic devices, including a speaker of the one or more speakers 2374 and / or other audio components and / or electromechanical devices that convert energy into linear motion such as a motor, solenoid, electroactive polymer, piezoelectric actuator, electrostatic actuator, or other tactile output generating components (e.g., a component that converts electrical signals into tactile outputs on the device). Haptic controller 2378 can provide haptic events to that are capable of being sensed by a user of watch body 2220. In some embodiments, one or more haptic controllers 2378 can receive input signals from an application of applications 2382.

[0203] In some embodiments, wearable band computing system 2330 and / or watch body computing system 2360 can include memory 2380, which can be controlled by one or more memory controllers of controllers 2377. In some embodiments, software components stored in memory 2380 include one or more applications 2382 configured to perform operations at the watch body 2220. In some embodiments, one or more applications 2382 may include games, word processors, messaging applications, calling applications, web browsers, social media applications, media streaming applications, financial applications, calendars, clocks, etc. In some embodiments, software components stored in memory 2380 include one or more communication interface modules 2383 as defined above. In some embodiments, software components stored in memory 2380 include one or more graphics modules 2384 for rendering, encoding, and / or decoding audio and / or visual data and one or more data management modules 2385 for collecting, organizing, and / or providing access to data 2387 stored in memory 2380. In some embodiments, one or more of applications 2382 and / or one or more modules can work in conjunction with one another to perform varioustasks at the watch body 2220.

[0204] In some embodiments, software components stored in memory 2380 can include one or more operating systems 2381 (e.g., a Linux-based operating system, an Android operating system, etc.). Memory 2380 can also include data 2387. Data 2387 can include profile data 2388A, sensor data 2389A, media content data 2390, and application data 2391.

[0205] It should be appreciated that watch body computing system 2360 is an example of a computing system within watch body 2220, and that watch body 2220 can have more or fewer components than shown in watch body computing system 2360, can combine two or more components, and / or can have a different configuration and / or arrangement of the components. The various components shown in watch body computing system 2360 are implemented in hardware, software, firmware, or a combination thereof, including one or more signal processing and / or application-specific integrated circuits.

[0206] Turning to the wearable band computing system 2330, one or more components that can be included in wearable band 2210 are shown. Wearable band computing system 2330 can include more or fewer components than shown in watch body computing system 2360, can combine two or more components, and / or can have a different configuration and / or arrangement of some or all of the components. In some embodiments, all, or a substantial portion of the components of wearable band computing system 2330 are included in a single integrated circuit. Alternatively, in some embodiments, components of wearable band computing system 2330 are included in a plurality of integrated circuits that are communicatively coupled. As described above, in some embodiments, wearable band computing system 2330 is configured to couple (e.g., via a wired or wireless connection) with watch body computing system 2360, which allows the computing systems to share components, distribute tasks, and / or perform other operations described herein (individually or as a single device).

[0207] Wearable band computing system 2330, similar to watch body computing system 2360, can include one or more processors 2349, one or more controllers 2347 (including one or more haptics controllers 2348), a peripherals interface 2331 that can includes one or more sensors 2313 and other peripheral devices, a power source (e.g., a power system 2356), and memory (e.g., a memory 2350) that includes an operating system (e.g., an operating system 2351), data (e.g., data 2354 including profile data 2388B, sensordata 2389B, etc.), and one or more modules (e.g., a communications interface module 2352, a data management module 2353, etc.).

[0208] One or more of sensors 2313 can be analogous to sensors 2321 of watch body computing system 2360. For example, sensors 2313 can include one or more coupling sensors 2332, one or more SpO2 sensors 2334, one or more EMG sensors 2335, one or more capacitive sensors 2336, one or more heart rate sensors 2337, and one or more IMU sensors 2338.

[0209] Peripherals interface 2331 can also include other components analogous to those included in peripherals interface 2361 of watch body computing system 2360, including an NFC component 2339, a GPS component 2340, an LTE component 2341, a Wi-Fi and / or Bluetooth communication component 2342, and / or one or more haptic devices 2346 as described above in reference to peripherals interface 2361. In some embodiments, peripherals interface 2331 includes one or more buttons 2343, a display 2333, a speaker 2344, a microphone 2345, and a camera 2355. In some embodiments, peripherals interface 2331 includes one or more indicators, such as an LED.

[0210] It should be appreciated that wearable band computing system 2330 is an example of a computing system within wearable band 2210, and that wearable band 2210 can have more or fewer components than shown in wearable band computing system 2330, combine two or more components, and / or have a different configuration and / or arrangement of the components. The various components shown in wearable band computing system 2330 can be implemented in one or more of a combination of hardware, software, or firmware, including one or more signal processing and / or application-specific integrated circuits.

[0211] Wrist-wearable device 2200 with respect to FIG. 22 is an example of wearable band 2210 and watch body 2220 coupled together, so wrist-wearable device 2200 will be understood to include the components shown and described for wearable band computing system 2330 and watch body computing system 2360. In some embodiments, wrist-wearable device 2200 has a split architecture (e.g., a split mechanical architecture, a split electrical architecture, etc.) between watch body 2220 and wearable band 2210. In other words, all of the components shown in wearable band computing system 2330 and watch body computing system 2360 can be housed or otherwise disposed in a combined wristwearable device 2200 or within individual components of watch body 2220, wearable band2210, and / or portions thereof (e.g., a coupling mechanism 2216 of wearable band 2210).

[0212] The techniques described above can be used with any device for sensing neuromuscular signals but could also be used with other types of wearable devices for sensing neuromuscular signals (such as body-wearable or head-wearable devices that might have neuromuscular sensors closer to the brain or spinal column).

[0213] In some embodiments, wrist-wearable device 2200 can be used in conjunction with a head-wearable device (e.g., AR glasses 2400 and VR system 2510) and / or an HIPD, and wrist-wearable device 2200 can also be configured to be used to allow a user to control any aspect of the artificial reality (e.g., by using EMG-based gestures to control user interface objects in the artificial reality and / or by allowing a user to interact with the touchscreen on the wrist-wearable device to also control aspects of the artificial reality). Having thus described example wrist-wearable devices, attention will now be turned to example head-wearable devices, such AR glasses 2400 and VR headset 2510.

[0214] FIGS. 24 to 26 show example artificial-reality systems, which can be used as or in connection with wrist-wearable device 2200. In some embodiments, AR system 2400 includes an eyewear device 2402, as shown in FIG. 24. In some embodiments, VR system 2510 includes a head-mounted display (HMD) 2512, as shown in FIGS. 25A and 25B. In some embodiments, AR system 2400 and VR system 2510 can include one or more analogous components (e.g., components for presenting interactive artificial-reality environments, such as processors, memory, and / or presentation devices, including one or more displays and / or one or more waveguides), some of which are described in more detail with respect to FIG. 26. As described herein, a head-wearable device can include components of eyewear device 2402 and / or head-mounted display 2512. Some embodiments of head-wearable devices do not include any displays, including any of the displays described with respect to AR system 2400 and / or VR system 2510. While the example artificial-reality systems are respectively described herein as AR system 2400 and VR system 2510, either or both of the example AR systems described herein can be configured to present fully-immersive virtual-reality scenes presented in substantially all of a user's field of view or subtler augmented-reality scenes that are presented within a portion, less than all, of the user's field of view.

[0215] FIG. 24 show an example visual depiction of AR system 2400, including an eyewear device 2402 (which may also be described herein as augmented-reality glasses, and / or smart glasses). AR system 2400 can include additional electronic components that arenot shown in FIG. 24, such as a wearable accessory device and / or an intermediary processing device, in electronic communication or otherwise configured to be used in conjunction with the eyewear device 2402. In some embodiments, the wearable accessory device and / or the intermediary processing device may be configured to couple with eyewear device 2402 via a coupling mechanism in electronic communication with a coupling sensor 2624 (FIG. 26), where coupling sensor 2624 can detect when an electronic device becomes physically or electronically coupled with eyewear device 2402. In some embodiments, eyewear device 2402 can be configured to couple to a housing 2690 (FIG. 26), which may include one or more additional coupling mechanisms configured to couple with additional accessory devices. The components shown in FIG. 24 can be implemented in hardware, software, firmware, or a combination thereof, including one or more signal-processing components and / or application-specific integrated circuits (ASICs).

[0216] Eyewear device 2402 includes mechanical glasses components, including a frame 2404 configured to hold one or more lenses (e.g., one or both lenses 2406-1 and 2406- 2). One of ordinary skill in the art will appreciate that eyewear device 2402 can include additional mechanical components, such as hinges configured to allow portions of frame 2404 of eyewear device 2402 to be folded and unfolded, a bridge configured to span the gap between lenses 2406-1 and 2406-2 and rest on the user's nose, nose pads configured to rest on the bridge of the nose and provide support for eyewear device 2402, earpieces configured to rest on the user's ears and provide additional support for eyewear device 2402, temple arms configured to extend from the hinges to the earpieces of eyewear device 2402, and the like. One of ordinary skill in the art will further appreciate that some examples of AR system 2400 can include none of the mechanical components described herein. For example, smart contact lenses configured to present artificial reality to users may not include any components of eyewear device 2402.

[0217] Eyewear device 2402 includes electronic components, many of which will be described in more detail below with respect to FIG. 10. Some example electronic components are illustrated in FIG. 24, including acoustic sensors 2425-1, 2425-2, 2425-3, 2425-4, 2425-5, and 2425-6, which can be distributed along a substantial portion of the frame 2404 of eyewear device 2402. Eyewear device 2402 also includes a left camera 2439A and a right camera 2439B, which are located on different sides of the frame 2404. Eyewear device 2402 also includes a processor 2448 (or any other suitable type or form of integrated circuit)that is embedded into a portion of the frame 2404.

[0218] FIGS. 25A and 25B show a VR system 2510 that includes a head-mounted display (HMD) 2512 (e.g., also referred to herein as an artificial-reality headset, a headwearable device, a VR headset, etc.), in accordance with some embodiments. As noted, some artificial-reality systems (e.g., AR system 2400) may, instead of blending an artificial reality with actual reality, substantially replace one or more of a user's visual and / or other sensory perceptions of the real world with a virtual experience (e.g., AR systems 2000 and 2100).

[0219] HMD 2512 includes a front body 2514 and a frame 2516 (e.g., a strap or band) shaped to fit around a user's head. In some embodiments, front body 2514 and / or frame 2516 include one or more electronic elements for facilitating presentation of and / or interactions with an AR and / or VR system (e.g., displays, IMUs, tracking emitter or detectors). In some embodiments, HMD 2512 includes output audio transducers (e.g., an audio transducer 2518), as shown in FIG. 25B. In some embodiments, one or more components, such as the output audio transducer(s) 2518 and frame 2516, can be configured to attach and detach (e.g., are detachably attachable) to HMD 2512 (e.g., a portion or all of frame 2516, and / or audio transducer 2518), as shown in FIG. 25B. In some embodiments, coupling a detachable component to HMD 2512 causes the detachable component to come into electronic communication with HMD 2512.

[0220] FIGS. 25A and 25B also show that VR system 2510 includes one or more cameras, such as left camera 2539A and right camera 2539B, which can be analogous to left and right cameras 2439A and 2439B on frame 2404 of eyewear device 2402. In some embodiments, VR system 2510 includes one or more additional cameras (e.g., cameras 2539C and 2539D), which can be configured to augment image data obtained by left and right cameras 2539A and 2539B by providing more information. For example, camera 2539C can be used to supply color information that is not discerned by cameras 2539A and 2539B. In some embodiments, one or more of cameras 2539A to 2539D can include an optional IR cut filter configured to remove IR light from being received at the respective camera sensors.

[0221] FIG. 26 illustrates a computing system 2620 and an optional housing 2690, each of which show components that can be included in AR system 2400 and / or VR system 2510. In some embodiments, more or fewer components can be included in optional housing 2690 depending on practical restraints of the respective AR system being described.

[0222] In some embodiments, computing system 2620 can include one or moreperipherals interfaces 2622A and / or optional housing 2690 can include one or more peripherals interfaces 2622B. Each of computing system 2620 and optional housing 2690 can also include one or more power systems 2642A and 2642B, one or more controllers 2646 (including one or more haptic controllers 2647), one or more processors 2648A and 2648B (as defined above, including any of the examples provided), and memory 2650A and 2650B, which can all be in electronic communication with each other. For example, the one or more processors 2648A and 2648B can be configured to execute instructions stored in memory 2650A and 2650B, which can cause a controller of one or more of controllers 2646 to cause operations to be performed at one or more peripheral devices connected to peripherals interface 2622A and / or 2622B. In some embodiments, each operation described can be powered by electrical power provided by power system 2642A and / or 2642B.

[0223] In some embodiments, peripherals interface 2622A can include one or more devices configured to be part of computing system 2620, some of which have been defined above and / or described with respect to the wrist-wearable devices shown in FIGS. 22 and 23. For example, peripherals interface 2622A can include one or more sensors 2623A. Some example sensors 2623A include one or more coupling sensors 2624, one or more acoustic sensors 2625, one or more imaging sensors 2626, one or more EMG sensors 2627, one or more capacitive sensors 2628, one or more IMU sensors 2629, and / or any other types of sensors explained above or described with respect to any other embodiments discussed herein.

[0224] In some embodiments, peripherals interfaces 2622A and 2622B can include one or more additional peripheral devices, including one or more NFC devices 2630, one or more GPS devices 2631, one or more LTE devices 2632, one or more Wi-Fi and / or Bluetooth devices 2633, one or more buttons 2634 (e.g., including buttons that are slidable or otherwise adjustable), one or more displays 2635A and 2635B, one or more speakers 2636A and 2636B, one or more microphones 2637, one or more cameras 2638A and 2638B (e.g., including the left camera 2639A and / or a right camera 2639B), one or more haptic devices 2640, and / or any other types of peripheral devices defined above or described with respect to any other embodiments discussed herein.

[0225] AR systems can include a variety of types of visual feedback mechanisms (e.g., presentation devices). For example, display devices in AR system 2400 and / or VR system 2510 can include one or more liquid-crystal displays (LCDs), light emitting diode (LED) displays,organic LED (OLED) displays, and / or any other suitable types of display screens. Artificialreality systems can include a single display screen (e.g., configured to be seen by both eyes), and / or can provide separate display screens for each eye, which can allow for additional flexibility for varifocal adjustments and / or for correcting a refractive error associated with a user's vision. Some embodiments of AR systems also include optical subsystems having one or more lenses (e.g., conventional concave or convex lenses, Fresnel lenses, or adjustable liquid lenses) through which a user can view a display screen.

[0226] For example, respective displays 2635A and 2635B can be coupled to each of the lenses 2406-1 and 2406-2 of AR system 2400. Displays 2635A and 2635B may be coupled to each of lenses 2406-1 and 2406-2, which can act together or independently to present an image or series of images to a user. In some embodiments, AR system 2400 includes a single display 2635A or 2635B (e.g., a near-eye display) or more than two displays 2635A and 2635B. In some embodiments, a first set of one or more displays 2635A and 2635B can be used to present an augmented-reality environment, and a second set of one or more display devices 2635A and 2635B can be used to present a virtual-reality environment. In some embodiments, one or more waveguides are used in conjunction with presenting artificial-reality content to the user of AR system 2400 (e.g., as a means of delivering light from one or more displays 2635A and 2635B to the user's eyes). In some embodiments, one or more waveguides are fully or partially integrated into the eyewear device 2402. Additionally, or alternatively to display screens, some artificial-reality systems include one or more projection systems. For example, display devices in AR system 2400 and / or VR system 2510 can include micro-LED projectors that project light (e.g., using a waveguide) into display devices, such as clear combiner lenses that allow ambient light to pass through. The display devices can refract the projected light toward a user's pupil and can enable a user to simultaneously view both artificial-reality content and the real world. Artificial-reality systems can also be configured with any other suitable type or form of image projection system. In some embodiments, one or more waveguides are provided additionally or alternatively to the one or more display(s) 2635A and 2635B.

[0227] Computing system 2620 and / or optional housing 2690 of AR system 2400 or VR system 2510 can include some or all of the components of a power system 2642A and 2642B. Power systems 2642A and 2642B can include one or more charger inputs 2643, one or more PMICs 2644, and / or one or more batteries 2645A and 2644B.

[0228] Memory 2650A and 2650B may include instructions and data, some or all of which may be stored as non-transitory computer-readable storage media within the memories 2650A and 2650B. For example, memory 2650A and 2650B can include one or more operating systems 2651, one or more applications 2652, one or more communication interface applications 2653A and 2653B, one or more graphics applications 2654A and 2654B, one or more AR processing applications 2655A and 2655B, and / or any other types of data defined above or described with respect to any other embodiments discussed herein.

[0229] Memory 2650A and 2650B also include data 2660A and 2660B, which can be used in conjunction with one or more of the applications discussed above. Data 2660A and 2660B can include profile data 2661, sensor data 2662A and 2662B, media content data 2663A, AR application data 2664A and 2664B, and / or any other types of data defined above or described with respect to any other embodiments discussed herein.

[0230] In some embodiments, controller 2646 of eyewear device 2402 may process information generated by sensors 2623A and / or 2623B on eyewear device 2402 and / or another electronic device within AR system 2400. For example, controller 2646 can process information from acoustic sensors 2425-1 and 2425-2. For each detected sound, controller 2646 can perform a direction of arrival (DOA) estimation to estimate a direction from which the detected sound arrived at eyewear device 2402 of R system 2400. As one or more of acoustic sensors 2625 (e.g., the acoustic sensors 2425-1, 2425-2) detects sounds, controller 2646 can populate an audio data set with the information (e.g., represented in FIG. 10 as sensor data 2662A and 2662B).

[0231] In some embodiments, a physical electronic connector can convey information between eyewear device 2402 and another electronic device and / or between one or more processors 2448, 2648A, 2648B of AR system 2400 or VR system 2510 and controller 2646. The information can be in the form of optical data, electrical data, wireless data, or any other transmittable data form. Moving the processing of information generated by eyewear device 2402 to an intermediary processing device can reduce weight and heat in the eyewear device, making it more comfortable and safer for a user. In some embodiments, an optional wearable accessory device (e.g., an electronic neckband) is coupled to eyewear device 2402 via one or more connectors. The connectors can be wired or wireless connectors and can include electrical and / or non-electrical (e.g., structural) components. In some embodiments, eyewear device 2402 and the wearable accessory device can operateindependently without any wired or wireless connection between them.

[0232] In some situations, pairing external devices, such as an intermediary processing device (e.g., HIPD 1806, 1906, 2006) with eyewear device 2402 (e.g., as part of AR system 2400) enables eyewear device 2402 to achieve a similar form factor of a pair of glasses while still providing sufficient battery and computation power for expanded capabilities. Some, or all, of the battery power, computational resources, and / or additional features of AR system 2400 can be provided by a paired device or shared between a paired device and eyewear device 2402, thus reducing the weight, heat profile, and form factor of eyewear device 2402 overall while allowing eyewear device 2402 to retain its desired functionality. For example, the wearable accessory device can allow components that would otherwise be included on eyewear device 2402 to be included in the wearable accessory device and / or intermediary processing device, thereby shifting a weight load from the user's head and neck to one or more other portions of the user's body. In some embodiments, the intermediary processing device has a larger surface area over which to diffuse and disperse heat to the ambient environment. Thus, the intermediary processing device can allow for greater battery and computation capacity than might otherwise have been possible on eyewear device 2402 standing alone. Because weight carried in the wearable accessory device can be less invasive to a user than weight carried in the eyewear device 2402, a user may tolerate wearing a lighter eyewear device and carrying or wearing the paired device for greater lengths of time than the user would tolerate wearing a heavier eyewear device standing alone, thereby enabling an artificial-reality environment to be incorporated more fully into a user's day-to-day activities.

[0233] AR systems can include various types of computer vision components and subsystems. For example, AR system 2400 and / or VR system 2510 can include one or more optical sensors such as two-dimensional (2D) or three-dimensional (3D) cameras, time-of- flight depth sensors, structured light transmitters and detectors, single-beam or sweeping laser rangefinders, 3D LiDAR sensors, and / or any other suitable type or form of optical sensor. An AR system can process data from one or more of these sensors to identify a location of a user and / or aspects of the use's real-world physical surroundings, including the locations of real-world objects within the real-world physical surroundings. In some embodiments, the methods described herein are used to map the real world, to provide a user with context about real-world surroundings, and / or to generate digital twins (e.g., interactable virtual objects), among a variety of other functions. For example, FIGS. 25A and 25B show VR system2510 having cameras 2539A to 2539D, which can be used to provide depth information for creating a voxel field and a two-dimensional mesh to provide object information to the user to avoid collisions.

[0234] In some embodiments, AR system 2400 and / or VR system 2510 can include haptic (tactile) feedback systems, which may be incorporated into headwear, gloves, body suits, handheld controllers, environmental devices (e.g., chairs or floormats), and / or any other type of device or system, such as the wearable devices discussed herein. The haptic feedback systems may provide various types of cutaneous feedback, including vibration, force, traction, shear, texture, and / or temperature. The haptic feedback systems may also provide various types of kinesthetic feedback, such as motion and compliance. The haptic feedback may be implemented using motors, piezoelectric actuators, fluidic systems, and / or a variety of other types of feedback mechanisms. The haptic feedback systems may be implemented independently of other artificial-reality devices, within other artificial-reality devices, and / or in conjunction with other artificial-reality devices.

[0235] In some embodiments of an artificial reality system, such as AR system 2400 and / or VR system 2510, ambient light (e.g., a live feed of the surrounding environment that a user would normally see) can be passed through a display element of a respective headwearable device presenting aspects of the AR system. In some embodiments, ambient light can be passed through a portion less that is less than all of an AR environment presented within a user's field of view (e.g., a portion of the AR environment co-located with a physical object in the user's real-world environment that is within a designated boundary (e.g., a guardian boundary) configured to be used by the user while they are interacting with the AR environment). For example, a visual user interface element (e.g., a notification user interface element) can be presented at the head-wearable device, and an amount of ambient light (e.g., 15-50% of the ambient light) can be passed through the user interface element such that the user can distinguish at least a portion of the physical environment over which the user interface element is being displayed.

[0236] The process parameters and sequence of the steps described and / or illustrated herein are given by way of example only and can be varied as desired. For example, while the steps illustrated and / or described herein may be shown or discussed in a particular order, these steps do not necessarily need to be performed in the order illustrated or discussed. The various example methods described and / or illustrated herein may also omitone or more of the steps described or illustrated herein or include additional steps in addition to those disclosed.

[0237] The preceding description has been provided to enable others skilled in the art to best utilize various aspects of the example embodiments disclosed herein. This example description is not intended to be exhaustive or to be limited to any precise form disclosed. Many modifications and variations are possible without departing from the scope of the present disclosure. The embodiments disclosed herein should be considered in all respects illustrative and not restrictive. Reference should be made to any claims appended hereto and their equivalents in determining the scope of the present disclosure.

[0238] Unless otherwise noted, the terms "connected to" and "coupled to" (and their derivatives), as used in the specification and / or claims, are to be construed as permitting both direct and indirect (i.e., via other elements or components) connection. In addition, the terms "a" or "an," as used in the specification and / or claims, are to be construed as meaning "at least one of." Finally, for ease of use, the terms "including" and "having" (and their derivatives), as used in the specification and / or claims, are interchangeable with and have the same meaning as the word "comprising."

Claims

WHAT IS CLAIMED IS:

1. A method for manufacturing an emissive array, comprising: doping sidewalls of mesas formed in a layered structure comprising an active layer disposed between a first semiconductor layer and a second semiconductor layer, wherein the sidewalls of the mesas include exposed portions of the active layer and exposed portions of the first semiconductor layer; and forming passivation coatings over at least the doped sidewalls of the mesas such that the passivation coatings cover at least the exposed portions of the active layer and the exposed portions of the first semiconductor layer.

2. The method of claim 1, wherein doping the sidewalls of the mesas comprises performing at least one of a diffusion or ion implantation process.

3. The method of claim 1 or 2, wherein doping the sidewalls of the mesas comprises performing at least one of ampoule doping, spin-on doping, solid-state doping, rapid thermal annealing, or ion implantation.

4. The method of any preceding claim, wherein the sidewalls of the mesas are doped with a p-type dopant, in which case optionally wherein the p-type dopant comprises at least one of Zn, Mg, or B.

5. The method of any preceding claim, wherein dopingthe sidewalls of the mesas comprises performing at least one of a fast diffusion process and a fast cooling process.

6. The method of any preceding claim, further comprising: exposing top surfaces of the mesas, the top surfaces being formed by the first semiconductor layer; and forming contacts on the top surfaces of the mesas, in which case optionally wherein the passivation coatings do not cover exposed regions of the contacts.

7. The method of any preceding claim, further comprising forming routing lines such that each routing line covers at least a portion of a passivation coating, wherein the routing lines are electrically coupled to portions of the first semiconductor layer disposed on the mesas, in which case optionally wherein the routing lines comprise a reflective material.

8. The method of any preceding claim, wherein the active layer comprises a quantum well.

9. An emissive array, comprising: a plurality of pixel regions, each of the plurality of pixel regions comprising:a first semiconductor layer; a second semiconductor layer; and an active layer disposed between the first semiconductor layer and the second semiconductor layer, wherein regions of the active layer adjacent to sidewalls of the active layer comprise doped regions.

10. The emissive array of claim 9, wherein the doped regions of the active layer are doped with a p-type dopant, in which case optionally wherein the p-type dopant comprises at least one of Zn, Mg, or B.

11. The emissive array of claim 9 or 10, wherein: the first semiconductor layer comprises p-type material; and the second semiconductor layer comprises an n-type material.

12. The emissive array of any one of claims 9 to 11, further comprising routing lines coupled to the first semiconductor layer, wherein each of the routing lines is coupled to the first semiconductor layer of a pixel region of the plurality of pixel regions, in which case optionally wherein: the routing lines cover at least a portion of each of the pixel regions; and the routing lines each comprise a reflective material.

13. The emissive array of any one of claims 9 to 12, wherein the doped regions of the active layer are covered by a passivation coating.

14. A display device, comprising: a plurality of micro-light-emitting diodes (pLEDs), each of the plurality of pLEDs comprising: a first semiconductor layer; a second semiconductor layer; an active layer disposed between the first semiconductor layer and the second semiconductor layer, wherein regions of the active layer adjacent to sidewalls of the active layer comprise doped regions; and a collimation mirror surrounding at least a portion of the first semiconductor layer, the second semiconductor layer, and the active layer.

15. The display device of claim 14, further comprising a plurality of micro-lenses, wherein each of the plurality of micro-lenses overlaps one of the plurality of pLEDs.

Images