Chip adjusting device

Abstract

A chip adjusting device. A clamping assembly in the chip adjusting device is mounted on an end face of a base and provided with a through hole allowing a suction nozzle rod to pass through, and the clamping assembly is configured to clamp the suction nozzle rod and allow the suction nozzle rod to rotate in the through hole. One end of a connecting member is connected to the suction nozzle rod, and the connecting member is used for driving, under control, the suction nozzle rod to rotate. A cam is connected to a power source and abuts against the end of the connecting member distant from the suction nozzle rod, and the cam is configured to rotate under the drive of the power source to drive the connecting member to move, so as to drive the suction nozzle rod to rotate. Compared with the solution in which the suction nozzle rod is mounted by means of magnetic attraction, using the clamping assembly to clamp the suction nozzle rod can improve the mounting stability of the suction nozzle rod; and compared with a structure using gears and racks, using the cam to drive the connecting member to move so as to drive the suction nozzle rod to rotate achieves higher precision, so that the rotating precision of the suction nozzle rod can be improved, improving the chip position adjustment precision.

Description

Chip adjustment device Technical Field

[0001] The present invention relates to the field of chip technology, and in particular to a chip adjustment device. Background Art

[0002] During the semiconductor industry's chip production process, chips need to be transported for testing and placement. During this process, a nozzle bar is typically used to hold the chips in place. Due to process requirements, high placement accuracy is required during chip testing and placement. Therefore, the nozzle bar angle must be adjusted more precisely to accurately adjust the chip's position. Furthermore, the nozzle bar's stability is critical to avoid compromising placement accuracy.

[0003] Summary of the Invention

[0004] The purpose of the present invention is to provide a chip adjustment device to solve the technical problems of low chip adjustment accuracy and poor stability in the prior art.

[0005] According to the purpose of the present invention, the present invention provides a chip adjustment device, comprising:

[0006] a base having an end surface;

[0007] A nozzle rod, located at the end surface of the base, for adsorbing the chip;

[0008] a clamping assembly mounted on an end surface of the base and having a through hole for passing the nozzle rod, wherein the clamping assembly is configured to clamp the nozzle rod and allow the nozzle rod to rotate within the through hole;

[0009] A connecting member, one end of which is connected to the nozzle rod, and is used to drive the nozzle rod to rotate under control;

[0010] The driving assembly includes a power source and a cam. The cam is connected to the power source and abuts against an end of the connecting member away from the suction nozzle rod. The cam is configured to rotate under the drive of the power source to drive the connecting member to move, thereby driving the suction nozzle rod to rotate.

[0011] Optionally, a protruding boss is provided at one end of the connecting member close to the cam, and the boss abuts against the cam to drive the connecting member to move during the rotation of the cam.

[0012] Optionally, it also includes:

[0013] A first elastic member has one end connected to or abutting the connecting member and the other end connected to or abutting the base. The first elastic member is configured to shrink or return to its original position when the connecting member moves following the cam.

[0014] Optionally, a sliding groove is provided on the connecting member, and the chip adjustment device further comprises:

[0015] A slide rail is mounted on the base and cooperates with the slide groove of the connecting member so that the connecting member moves along the slide rail under the drive of the cam.

[0016] Optionally, the connecting member includes:

[0017] The first part has the slide rail provided on a side of the first part facing away from the end surface of the base, and a limiting groove extending vertically provided on a side of the first part close to the end surface of the base, and the cam is located above the first part;

[0018] The second part extends in the horizontal direction, and one end portion is clamped with the nozzle rod, and the other end portion is provided with a limiting piece for clamping with the limiting groove.

[0019] Optionally, a first bearing is installed on the top of the boss, and an outer peripheral surface of the first bearing abuts against the cam.

[0020] Optionally, a mounting cavity extending in a horizontal direction is provided in the base, the clamping assembly is arranged in the mounting cavity, and one end extends out of the end surface of the base, and the clamping assembly is arranged to be retractable in the horizontal direction so as to clamp the suction nozzle rod when retracted.

[0021] Optionally, the clamping assembly includes:

[0022] a sliding member defining the through hole;

[0023] A second elastic member has one end connected to the sliding member and the other end connected to the base, so as to allow the clamping assembly to extend and retract along the horizontal direction.

[0024] Optionally, the sliding member includes:

[0025] The two side plates are arranged opposite to each other and are connected by a rotating shaft.

[0026] Optionally, the sliding member further includes:

[0027] The second bearing is sleeved on the rotating shaft and abuts against the nozzle rod.

[0028] In the present invention, the nozzle rod is located at the end face of the base and is used to adsorb the chip. The clamping assembly is installed at the end face of the base and has a through hole for passing the nozzle rod. The clamping assembly is configured to clamp the nozzle rod and allow the nozzle rod to rotate in the through hole. One end of the connector is connected to the nozzle rod and is used to drive the nozzle rod to rotate under control. The driving assembly includes a power source and a cam. The cam is connected to the power source and abuts against one end of the connector away from the nozzle rod. The cam is configured to rotate under the drive of the power source to drive the connector to move, thereby driving the nozzle rod to rotate. The above technical solution uses the clamping assembly to clamp the nozzle rod. Compared with the technical solution of the prior art that uses a magnetic method to install the nozzle rod, the stability of the nozzle rod installation can be improved, thereby improving the stability of the patch. The cam is used to drive the connector to move, thereby driving the nozzle rod to rotate. Compared with the structure of the gear rack in the prior art, the rotation accuracy is higher, which can improve the accuracy of the nozzle rod rotation, thereby improving the accuracy of the chip adjustment.

[0029] Based on the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, those skilled in the art will become more aware of the above and other objects, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0031] FIG1 is a schematic structural diagram of a chip adjustment device according to an embodiment of the present invention;

[0032] FIG2 is a schematic enlarged view of portion A in FIG1 ;

[0033] FIG3 is a schematic structural diagram of the limiting groove and the limiting member of the chip adjustment device shown in FIG1 ;

[0034] FIG4 is a schematic cross-sectional view of the chip adjustment device shown in FIG1 ;

[0035] FIG. 5 is a schematic structural diagram of a clamping assembly of the chip adjustment device shown in FIG. 1 .

[0036] Figure markings: 100-chip adjustment device, 10-base, 20-nozzle rod, 30-driving assembly, 40-connecting piece, 50-first elastic piece, 60-clamping assembly, 70-axis pin, 80-slide rail, 11-end face, 12-vertical piece, 13-horizontal piece, 31-power source, 32-cam, 41-boss, 411-first bearing, 42-first part, 421-limiting groove, 422-convex strip, 43-second part, 431-limiting piece, 61-sliding piece, 62-second elastic piece, 63-installing cavity, 611-side plate, 612-through hole, 613-rotating shaft, 614-second bearing. DETAILED DESCRIPTION

[0037] The following describes embodiments of the present invention in detail, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and are not to be construed as limiting the present invention.

[0038] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0039] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features, that is, include one or more of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. When a feature "includes or contains" one or more of the features it covers, unless otherwise specifically described, this indicates that other features are not excluded and may further include other features.

[0040] Unless otherwise specified or limited, the term "connection" and other terms should be understood broadly. For example, it can mean fixed connection, detachable connection, or integration; it can mean mechanical connection or electrical connection; it can mean direct connection or indirect connection through an intermediate medium; it can mean internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art should be able to understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0041] Unless otherwise defined, all terms (including technical terms and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0042] FIG1 is a schematic structural diagram of a chip adjustment device 100 according to an embodiment of the present invention, and FIG2 is a schematic enlarged diagram of part A in FIG1 , wherein the arrow a in FIG1 indicates the horizontal direction. As shown in FIG1 and FIG2 , in a specific embodiment, the chip adjustment device 100 includes a base 10, a nozzle rod 20, a clamping assembly 60, a connector 40, and a drive assembly 30, wherein the base 10 has an end face 11, and the nozzle rod 20 is located at the end face 11 of the base 10 for adsorbing the chip. The clamping assembly 60 is installed at the end face 11 of the base 10 and has a through hole 612 for passing the nozzle rod 20. The clamping assembly 60 is configured to clamp the nozzle rod 20 and allow the nozzle rod 20 to rotate in the through hole 612. One end of the connector 40 is connected to the nozzle rod 20 for driving the nozzle rod 20 to rotate under control. The drive assembly 30 includes a power source 31 and a cam 32. The cam 32 is connected to the power source 31 and abuts against one end of the connector 40 away from the nozzle rod 20. The cam 32 is configured to rotate under the drive of the power source 31 to drive the connector 40 to move, thereby driving the nozzle rod 20 to rotate. Here, the power source 31 is a motor, and the output shaft of the motor is connected to the cam 32. The motor drives the cam 32 to rotate, thereby driving the connector 40 to move. In other embodiments, the power source 31 can also select other components according to actual needs. The nozzle rod 20 picks up the chip by vacuum adsorption. The chip to be picked up generally has an angular position offset, so it is necessary to adjust and correct the angle of the chip by rotating the nozzle rod 20 to meet the high requirements for mounting accuracy during chip mounting.

[0043] This embodiment utilizes a clamping assembly 60 to clamp the nozzle rod 20. Compared with the technical solution of installing the nozzle rod 20 by magnetic attraction in the prior art, the stability of the installation of the nozzle rod 20 can be improved, thereby improving the stability of the patch, and the cam 32 is used to drive the connecting part 40 to move, thereby driving the nozzle rod 20 to rotate. Compared with the gear rack structure in the prior art, the rotation accuracy is higher, which can improve the rotation accuracy of the nozzle rod 20, thereby improving the accuracy of chip adjustment.

[0044] In the prior art, the use of magnetic adsorption will lead to poor stability of the nozzle rod 20. On the other hand, since the nozzle rod 20 is fixed by magnetic adsorption, the magnet is prohibited during the relatively large movement of the nozzle rod 20 along the Z axis. When the movement stroke of the adsorbent along the Z axis is large, the adsorption force direction of the magnet will form an angle with the horizontal direction. At this time, there is a component of the adsorption force acting in the vertical direction of the adsorbent, which will cause the pressure of the nozzle rod 20 to take and place the patch to increase, thereby creating a risk of crushing the chip surface and causing damage to the chip. Therefore, this embodiment is designed with a retractable clamping component 60. On the one hand, it can provide a horizontal clamping force for the nozzle rod 20 to clamp the nozzle rod 20, and will not generate a component force in the vertical direction, so as not to damage the chip. On the other hand, the clamping component 60 can be connected and separated with the nozzle rod 20 by telescoping, which is more flexible and provides convenience for replacing the adsorbent. In addition, it has better stability than the magnetic adsorption method.

[0045] The resolution of the cam 32 used in this embodiment is controlled within 0.01mm, that is, the motor with a step angle of 0.36° makes one pulse, and the maximum accuracy of the cam 32 stroke can be guaranteed within 0.01mm, and the minimum deflection angle is 0.36°, thereby improving the accuracy of chip adjustment.

[0046] In this embodiment, a raised boss 41 is provided on one end of the connecting member 40 near the cam 32. Boss 41 abuts against the cam 32, driving the connecting member 40 to move during the rotation of the cam 32. In a preferred embodiment, a first bearing 411 is mounted on the top of boss 41, the outer circumference of which abuts against the cam 32. In other embodiments, boss 41 may alternatively be a component having the same function as the first bearing 411, such as a rotatable cylindrical component.

[0047] In this embodiment, the base 10 includes a vertical member 12 arranged in the vertical direction and a horizontal member 13 arranged in the horizontal direction, and the drive assembly 30 is located on the front side of the vertical member 12 and above the horizontal member 13. In addition, the connecting member 40 is also located above the horizontal member 13.

[0048] In this embodiment, the chip adjustment device 100 further includes a first elastic member 50. One end of the first elastic member 50 is connected to or abuts the connector 40, and the other end is connected to or abuts the base 10. The first elastic member 50 is configured to contract or return to its original position as the connector 40 follows the movement of the cam 32. In this embodiment, the chip adjustment device 100 includes a shaft pin 70. The first elastic member 50 is passed through the shaft pin 70, which is mounted on the vertical member 12 of the base 10. The first elastic member 50 ensures that the connector 40 returns to its original position after movement. The shaft pin 70 can also limit the travel of the connector 40, preventing the connector 40 from exceeding its maximum travel range.

[0049] A slide groove is provided on the connecting member 40, and the chip adjustment device 100 also includes a slide rail 80. The slide rail 80 is installed on the base 10 and cooperates with the slide groove of the connecting member 40 so that the connecting member 40 moves along the slide rail 80 under the drive of the cam 32. Here, the slide rail 80 moves in a direction perpendicular to the horizontal direction. The horizontal direction is the direction of arrow a, which can also be understood as the horizontal direction. During the rotation of the cam 32, the connecting member 40 will be pushed to move along the slide rail 80, thereby driving the suction nozzle rod 20 to rotate. In this embodiment, the extension length of the slide rail 80 can be specifically set according to the stroke of the connecting member 40. The greater the stroke of the connecting member 40, the longer the extension length of the slide rail 80, and the smaller the stroke of the connecting member 40, the smaller the extension length of the slide rail 80. In this embodiment, the slide rail 80 is set below the cam 32. In other embodiments, the setting position of the slide rail 80 can also be set according to specific design requirements.

[0050] FIG3 is a schematic structural diagram of the limiting groove 421 and the limiting member 431 of the chip adjustment device 100 shown in FIG1 . As shown in FIG3 , in this embodiment, the connecting member 40 includes a first portion 42 and a second portion 43, wherein the first portion 42 is provided with a slide rail 80 on the side facing away from the end face 11 of the base 10, and the first portion 42 is provided with a limiting groove 421 extending vertically on the side close to the end face 11 of the base 10, and the cam 32 is located above the first portion 42. The second portion 43 extends in the horizontal direction, and one end is engaged with the suction nozzle rod 20, and the other end is provided with a limiting member 431 for engaging with the limiting groove 421. Here, the limiting groove 421 is provided with raised ribs 422 on opposite sides, and the ribs 422 are arranged to extend vertically. The limiting member 431 is a bearing, which is clamped by the two protruding strips 422 so that the first part 42 moves along the slide rail 80 driven by the cam 32 and drives the second part 43 to move, thereby driving the nozzle rod 20 to rotate.

[0051] Figure 4 is a schematic cross-sectional view of the chip adjustment device 100 shown in Figure 1, and Figure 5 is a schematic structural diagram of the clamping assembly 60 of the chip adjustment device 100 shown in Figure 1. As shown in Figures 4 and 5, in this embodiment, a horizontally extending mounting cavity 63 is defined within the base 10. The clamping assembly 60 is disposed within the mounting cavity 63, with one end extending beyond the end surface 11 of the base 10. The clamping assembly 60 is configured to be horizontally retractable so as to securely engage the nozzle rod 20 when retracted.

[0052] In this embodiment, the snap-fit ​​assembly 60 includes a sliding member 61 and a second elastic member 62. The sliding member 61 defines a through hole 612. One end of the second elastic member 62 is connected to the sliding member 61, and the other end is connected to the base 10 to allow the snap-fit ​​assembly 60 to extend and retract in the horizontal direction.

[0053] In this embodiment, the sliding member 61 includes two side plates 611 arranged opposite to each other, and the two side plates 611 are connected by a rotating shaft 613 .

[0054] In this embodiment, the sliding member 61 further includes a second bearing 614, which is sleeved on the rotating shaft 613 and abuts against the nozzle rod 20. In other embodiments, the second bearing 614 can also be replaced with a component having the same function as a bearing, such as a cylindrical and rotatable component.

[0055] Specifically, when clamping the nozzle rod 20, first stretch the clamping assembly 60 to the extended state, then pass the nozzle rod 20 through the through hole 612 in the vertical direction, and finally release the clamping assembly 60 so that the second bearing 614 abuts against the nozzle rod 20, thereby clamping the nozzle rod 20.

[0056] This embodiment eliminates the use of magnetic suction to adsorb the nozzle rod 20, and instead uses a more stable telescopic stretching method to clamp the adsorption component. This ensures that the pressure of the adsorption component in the vertical direction is not affected by the tensioning force in the horizontal direction, and the nozzle rod 20 can maintain a stable pick-up and placement pressure for a long time, thereby preventing damage to the chip.

[0057] At this point, those skilled in the art will recognize that, although a number of exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications consistent with the principles of the present invention may be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and deemed to cover all such other variations or modifications.

Claims

1. A chip adjustment device, in, The chip adjustment device includes: a base having an end surface; A nozzle rod, located at the end surface of the base, for adsorbing the chip; A clamping assembly is installed at the end surface of the base and has a through hole for passing the nozzle rod, and the clamping assembly is configured to clamp the nozzle rod and allow the nozzle rod to rotate in the through hole; A connecting piece, one end of which is connected to the nozzle rod, and is used to drive the nozzle rod to rotate under control; The driving assembly includes a power source and a cam, wherein the cam is connected to the power source and abuts against an end of the connecting member away from the suction nozzle rod. The cam is configured to rotate under the drive of the power source to drive the connecting member to move, thereby driving the suction nozzle rod to rotate.

2. The chip adjustment device according to claim 1, in, A protruding boss is provided at one end of the connecting member close to the cam, and the boss abuts against the cam to drive the connecting member to move during the rotation of the cam.

3. The chip adjustment device according to claim 2, further comprising: include: A first elastic member has one end connected to or abutting the connecting member and the other end connected to or abutting the base. The first elastic member is configured to shrink or return to its original position when the connecting member moves following the cam.

4. The chip adjustment device according to claim 3, in, The connecting member is provided with a sliding groove, and the chip adjustment device further comprises: A slide rail is installed on the base and cooperates with the slide groove of the connecting member so that the connecting member moves along the slide rail under the drive of the cam.

5. The chip adjustment device according to claim 4, in, The connecting piece comprises: A first part, wherein the slide rail is disposed on a side of the end surface facing away from the base, a limiting groove extending vertically is disposed on a side of the first part close to the end surface of the base, and the cam is located above the first part; The second part extends in the horizontal direction, and one end thereof is clamped with the suction nozzle rod, and the other end thereof is provided with a limiting piece for clamping with the limiting groove.

6. The chip adjustment device according to any one of claims 2 to 5, in, A first bearing is installed on the top of the boss, and the outer peripheral surface of the first bearing contacts the cam. catch.

7. The chip adjustment device according to any one of claims 1 to 5, in, The base is provided with an installation cavity extending in a horizontal direction, the clamping assembly is arranged in the installation cavity, and one end extends out of the end surface of the base, and the clamping assembly is arranged to be retractable in the horizontal direction so as to clamp the suction nozzle rod when contracted.

8. The chip adjustment device according to claim 7, in, The clamping assembly comprises: A sliding member, defining the through hole; A second elastic member has one end connected to the sliding member and the other end connected to the base, so as to allow the clamping assembly to extend and retract along the horizontal direction.

9. The chip adjustment device according to claim 8, in, The sliding member comprises: Two side plates are arranged opposite to each other and are connected via a rotating shaft.

10. The chip adjustment device according to claim 9, wherein, the sliding member further includes: a second bearing sleeved on the rotating shaft and abutted against the nozzle rod.

Images