Cleaning device and wet method apparatus

Abstract

Disclosed in the present invention are a cleaning device and a wet apparatus. The cleaning device comprises a swing arm, a nozzle, a fluid conveying device and a heating device. The swing arm is provided with an accommodation cavity; the nozzle is arranged at the first end of the swing arm and used for outputting a fluid; the fluid conveying device is arranged in the accommodation cavity and comprises a flow channel used for enabling a first fluid to pass through, and the flow channel communicates with the nozzle so as to convey the first fluid to the nozzle; the heating device is arranged in the accommodation cavity and used for heating the first fluid in the flow channel. The present invention can heat the first fluid to the ultrahigh temperature, thereby meeting process requirements.

Description

Cleaning equipment and wet process equipment Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a cleaning device and wet process equipment. Background Art

[0002] The basic process of photolithography generally includes three steps: coating, exposure, and development. The purpose of the coating process is to create a thin, uniform, and defect-free photoresist layer on the substrate surface. Exposure is the process of transferring the pattern on the photomask to the photoresist layer using an exposure lamp or other radiation source. After exposure, the device or circuit pattern is recorded on the photoresist layer in the form of exposed and unexposed areas. After development, the photomask pattern is fixed on the photoresist layer. After the photolithography process, the photoresist layer can be used as a mask for etching or ion implantation. After etching or ion implantation, the photoresist on the substrate surface must be removed.

[0003] The most common solution used for wet cleaning of photoresist is SPM (Sulfuric Acid Hydrogen Peroxide Mixture). The cleaning process involves injecting hydrogen peroxide into a sulfuric acid solution. The hydrogen peroxide and sulfuric acid react exothermically to form a high-temperature SPM solution, which is then sprayed onto the photoresist surface. The SPM solution reacts with the photoresist, removing it. The substrate surface is then rinsed with deionized water and dried with nitrogen. Recent research indicates that heating sulfuric acid to a high temperature (e.g., above 180°C) facilitates the removal of photoresist after high-dose ion implantation.

[0004] Therefore, it is necessary to provide a cleaning device and a wet process equipment to solve the problem of how to heat sulfuric acid to a high temperature.

[0005] Summary of the Invention

[0006] The object of the present invention is to solve the problem of how to heat sulfuric acid to a high temperature.

[0007] To solve the above problems, an embodiment of the present invention provides a cleaning device, comprising:

[0008] A swing arm having a receiving cavity;

[0009] a nozzle, disposed at the first end of the swing arm, for outputting fluid;

[0010] a fluid delivery device, disposed inside the accommodating chamber, the fluid delivery device comprising a flow channel for the first fluid to pass through, the flow channel being in communication with the nozzle to deliver the first fluid to the nozzle; and

[0011] The heating device is arranged inside the accommodating cavity and is used for heating the first fluid inside the flow channel.

[0012] An embodiment of the present invention provides a wet process device, comprising:

[0013] chamber;

[0014] a substrate supporting device, disposed inside the chamber and configured to support the substrate; and

[0015] In the above-mentioned cleaning device, the nozzle of the cleaning device is used to supply fluid to the substrate.

[0016] The cleaning device provided in the present application integrates a fluid conveying device and a heating device inside the accommodating cavity of the swing arm. The fluid conveying device includes a flow channel, and the heating device is used to heat the first fluid inside the flow channel, so that the first fluid can be heated to a high temperature to meet the process requirements.

[0017] Other features and corresponding beneficial effects of the present invention are described in the latter part of the specification, and it should be understood that at least some of the beneficial effects become obvious from the description in the specification of the present invention.

[0018] Summary of the Figures

[0019] The features and performance of the present application are further described by the following examples and drawings.

[0020] FIG1 is a cross-sectional view of a cleaning device according to an embodiment of the present application;

[0021] FIG2 is a partial cross-sectional view of a cleaning device according to an embodiment of the present application;

[0022] FIG3 a is a cross-sectional view along section line AA of FIG2 ;

[0023] 3b and 3c are schematic diagrams of a configuration of a fluid delivery device and a heating device of a cleaning device according to an embodiment of the present application;

[0024] FIG4 is a cross-sectional view of a cleaning device according to another embodiment of the present application;

[0025] FIG5 is a cross-sectional view of FIG4 along section line BB;

[0026] FIG6 is a schematic diagram of a configuration of a reflective layer and a heat insulating member of a cleaning device according to an embodiment of the present application;

[0027] FIG7 is a structural diagram of a wet process device according to an embodiment of the present application, and

[0028] FIG8 is a process flow chart of supplying SPM solution to a substrate using a cleaning device according to an embodiment of the present application.

[0029] Preferred embodiment of this application

[0030] The following is an explanation of the embodiments of the present invention by specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this embodiment. On the contrary, the purpose of introducing the invention in conjunction with the embodiment is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will contain many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description. It should be noted that the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

[0031] It should be noted that in this specification, similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0032] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0033] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0034] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0035] To make the objectives, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0036] 1 is a cross-sectional view of a cleaning device according to an embodiment of the present application; FIG. 2 is a partial cross-sectional view of a cleaning device according to an embodiment of the present application; and FIG. 3 a is a cross-sectional view taken along section line AA of FIG. 2 .

[0037] With reference to Figures 1 to 3a, the present application proposes a cleaning device 1, comprising a swing arm 100, a nozzle 200, a fluid conveying device 300, and a heating device 400. The nozzle 200 is disposed at the first end of the swing arm 100, which has a receiving cavity. The fluid conveying device 300 is disposed inside the receiving cavity of the swing arm 100. The fluid conveying device 300 includes a flow channel 330 for a first fluid to pass through. The flow channel 330 includes a fluid inlet 310 and a fluid outlet 320. The fluid outlet 320 of the flow channel 330 is connected to the nozzle 200 to convey the first fluid to the nozzle 200. The heating device 400 is disposed inside the receiving cavity of the swing arm 100 and is used to heat the first fluid inside the flow channel 330 so that the first fluid is heated to a target temperature, for example, to above 190°C, to meet process requirements. In this embodiment, the fluid delivery device 300 has a shell 331 that defines the above-mentioned flow channel 330. The first fluid can be sulfuric acid (H2S04), and the nozzle 200 can be made of high-temperature resistant, corrosion-resistant and high-purity materials, such as quartz or silicon carbide.

[0038] In some embodiments, the flow channel 330 is arranged around the periphery of the heating device 400. Referring to Figures 2 and 3a, the fluid delivery device 300 includes a shell 331, which includes an inner shell 3301 and an outer shell 3302. The flow channel 330 is formed by the space between the inner shell 3301 and the outer shell 3302. The heating device 400 is arranged inside the inner shell 3301 so that the flow channel 330 surrounds the periphery of the heating device 400. Specifically, the inner wall of the inner shell 3301 is defined as a groove 340, and the heating device 400 is integrated inside the groove 340, which can reduce heat loss of the heating device 400. In the examples shown in Figures 1 to 3a, the appearance of the flow channel 330 is linear, and the cross-section of the flow channel 330 is circular. In other embodiments, the appearance of the flow channel 330 can be spiral. In other embodiments, as shown in FIG3b , the heating device 400 can be disposed around the periphery of the fluid delivery device 300, or, as shown in FIG3c , the heating device 400 can be disposed on the side of the fluid delivery device 300. In the examples shown in FIG3b and FIG3c , the housing 331 is a single-layer housing, the flow channel 330 is surrounded by the housing 331, and the heating device 400 is disposed outside the housing 331.

[0039] 2 and 3 a , the cleaning device 1 further includes a bracket 500 for supporting the heating device 400 inside the accommodating cavity of the swing arm 100 . Specifically, the bracket 500 supports the heating device 400 inside the groove 340 .

[0040] In some embodiments, the heating device 400 includes at least one heating lamp, such as an infrared lamp.

[0041] In the example shown in Figures 1 to 3a, the heating device 400 includes a heating lamp tube, and a bracket 500 is installed at each end of the heating lamp tube for clamping the heating lamp tube to support the heating lamp tube inside the groove 340. When the heating lamp tube needs to be replaced, it can be removed from the bracket 500.

[0042] FIG4 is a cross-sectional view of a cleaning device according to another embodiment of the present application; FIG5 is a cross-sectional view taken along section line BB of FIG4 .

[0043] In the example shown in Figures 4 and 5 , heating device 400' includes two heating lamps, one end of which is mounted on the bottom wall of recess 340, and the other end of which is supported by bracket 500'. It should be noted that, with respect to Figures 1 to 5 , identical elements or elements having identical functions are denoted by identical reference numerals, and duplicate descriptions are omitted.

[0044] In some embodiments, referring to FIG1 , the cleaning device 1 further includes a first temperature sensor 610, a second temperature sensor 620, a flow meter 700, and a controller 800. The first temperature sensor 610 is used to detect the temperature of the first fluid before entering the flow channel 330. The second temperature sensor 620 is used to detect the temperature of the first fluid flowing out of the flow channel 330. The first temperature sensor 610 and the second temperature sensor 620 can be a thermal resistor sensor, a thermistor sensor, or a thermocouple sensor. Specifically, the first temperature sensor 610 is disposed on the first fluid supply pipe 350, and the second temperature sensor 620 is disposed at the fluid outlet 320. The first fluid supply pipe 350 will be described later.

[0045] The flow meter 700 is used to detect the flow rate of the first fluid entering the flow channel 330. The controller 800 is connected to the flow meter 700, the heating device 400, the first temperature sensor 610, and the second temperature sensor 620, respectively, and is configured to: obtain a temperature difference ΔT based on the target temperature T of the first fluid flowing out of the flow channel 330 and the temperature T1 of the first fluid detected by the first temperature sensor 610, ΔT = T-T1, and control the power of the heating device 400 based on the temperature difference ΔT and the flow rate of the first fluid detected by the flow meter 700. This application does not limit the connection method between the controller 800 and the flow meter 700, the heating device 400, the first temperature sensor 610, and the second temperature sensor 620, which can be a wired connection or a wireless connection.

[0046] In some embodiments, the heating power of the heating device 400 is calculated using the formula P = C * ρ * Q * ΔT, where P is the heating power of the heating device 400; C is the specific heat capacity of the first fluid; ρ is the density of the first fluid; Q is the flow rate of the first fluid entering the flow channel 330; and ΔT is the temperature difference described above, namely, the difference between the target temperature T of the first fluid flowing out of the flow channel 330 and the temperature T1 of the first fluid detected by the first temperature sensor 610, i.e., ΔT = T - T1. When the flow rate of the first fluid is constant, the temperature T1 of the first fluid before entering the flow channel 330 is determined by the first temperature sensor 610. Based on the difference between the target temperature T and temperature T1, i.e., ΔT = T - T1, the corresponding heating power P is determined, so that the heating device 400 heats the first fluid within the flow channel 330. Furthermore, the temperature T2 of the first fluid flowing out of the flow channel 330 is detected by the second temperature sensor 620 to determine whether the temperature T2 has reached the target temperature T.

[0047] In some embodiments, referring to FIG. 2 , the cleaning device 1 further includes a third temperature sensor 630 , which is disposed on the fluid conveying device 300 . Specifically, the third temperature sensor 630 is disposed on the outer housing 3302 of the fluid conveying device 300 and can promptly detect whether the surface temperature of the outer housing 3302 is excessively high. When the third temperature sensor 630 detects that the temperature of the outer housing 3302 is excessively high, it sends an overtemperature signal to an alarm device, which then issues an alarm. The third temperature sensor 630 can be a thermal resistor sensor, a thermistor sensor, or a thermocouple sensor, among others.

[0048] In some embodiments, the cleaning device 1 further includes a reflective layer. The reflective layer is configured to reflect light back into the interior of the flow channel 330 when light emitted by the heating device 400 (specifically, a heating lamp) passes through the flow channel 330 and reaches the reflective layer. The reflected light acts on the first fluid inside the flow channel 330, thereby effectively utilizing the irradiation light from the heating lamp. The reflective layer can be aluminum foil. Specifically, referring to FIG2 , when the heating device 400 is disposed inside the inner shell 3301 of the fluid conveying device 300, the reflective layer (not shown in FIG2 ) can be disposed on the outer periphery of the outer shell 3302, or the reflective layer can be disposed on the inner periphery of the swing arm 100.

[0049] FIG6 is a schematic diagram of a configuration of a reflective layer and a heat insulating member of a cleaning device according to an embodiment of the present application. In FIG6 , the fluid conveying device 300 includes a shell 331, a flow channel 330 is surrounded by the shell 331, and the heating device 400 is disposed outside the shell 331. For ease of description, the shell 331 of the fluid conveying device 300 is divided into two parts 331a and 331b. The upper half of the shell 331 facing away from the heating device 400 is denoted as the shell 331a and is indicated by a solid outline. The lower half of the shell 331 close to the heating device 400 is denoted as the shell 331b and is indicated by a dotted outline. The area demarcated by the dotted outline represents a light-transmitting area, which allows the light emitted by the heating device 400 to pass smoothly through the shell 331b into the interior of the flow channel 330, thereby heating the first fluid in the flow channel 330. When the heating device 400 is disposed outside the housing 331, the reflective layer 940 can be disposed not only on the inner circumference of the swing arm 100 but also on the side of the fluid conveying device 300 facing away from the heating device 400. For example, as shown in FIG6 , the reflective layer 940 is disposed on the housing 331a on the side of the fluid conveying device 300 facing away from the heating device 400. In this case, the length of the reflective layer 940 is half the circumference of the housing 331, where the length of the reflective layer 940 ensures that the reflective layer 940 does not block the light emitted by the heating device 400 toward the flow channel 330. The solid arrows in FIG6 represent the incident light from the heating device 400, and the dashed arrows represent the reflected light. In other embodiments, the length of the reflective layer 940 can be less than half the circumference of the housing 331, or can be greater than half the circumference of the housing 331 to a certain extent. It should be noted that the structure of the reflective layer 940 shown in FIG6 is for example only, and this embodiment does not specifically limit the length of the reflective layer 940.

[0050] In some embodiments, the cleaning device 1 further includes a thermal insulator 910, which covers at least a portion of the outer surface of the fluid conveying device 300 to provide thermal insulation. Referring to FIG2 , when the heating device 400 is disposed within the inner housing 3301 of the fluid conveying device 300, the thermal insulator 910 may cover the entire outer circumference of the outer housing 3302. Alternatively, the thermal insulator 910 may cover the entire inner or outer circumference of the swing arm 100. Referring to FIG6 , when the heating device 400 is disposed outside the fluid conveying device 300, the thermal insulation member 910 may not only cover the entire inner or outer periphery of the swing arm 100, but may also cover a portion of the outer side of the fluid conveying device 300. Specifically, the thermal insulation member 910 covers the side of the fluid conveying device 300 facing away from the heating device 400. For example, as shown in FIG6 , the thermal insulation member 910 covers the housing 331a of the fluid conveying device 300 facing away from the heating device 400. In this case, the length of the thermal insulation member 910 is half the circumference of the housing 331, so long as the thermal insulation member 910 does not affect the transfer of heat generated by the heating device 400 to the interior of the flow channel 330. The thermal insulation member 910 may be quartz wool. In other embodiments, the length of the thermal insulation member 910 may be less than half the circumference of the housing 331, or may be greater than half the circumference of the housing 331 to a certain extent. It should be noted that the structure of the heat insulating member 910 shown in FIG6 is only an example, and this embodiment does not particularly limit the length of the heat insulating member 910. When the cleaning device 1 includes the reflective layer 940, the heat insulating member 910 is wrapped around the outer periphery of the reflective layer 940.

[0051] In some embodiments, referring to FIG2 , the swing arm 100 of the cleaning device 1 includes a body 920 , the aforementioned accommodating cavity is located inside the body 920 , and the body 920 is made of stainless steel.

[0052] In some embodiments, the swing arm 100 of the cleaning device 1 further includes an anti-corrosion layer 930, which covers the outer periphery of the body 920 to prevent acid gas in the process environment from corroding the body 920. The material of the anti-corrosion layer 930 is PFA or PTFE.

[0053] In some embodiments, referring to FIG1 , the cleaning device 1 further includes a column 110 disposed at the second end of the swing arm 100 and configured to drive the swing arm 100 to rise, fall, and rotate. A pipeline passage 111 is disposed within the column 110 for passing pipelines or wires, such as a power cord for the heating device 400 and a pipeline connecting the flow channel 330.

[0054] In some embodiments, referring to FIG. 1 , the cleaning apparatus 1 further includes a first fluid supply pipe 350, a first control valve 351, a preheater 352, a bypass branch 360, and a second control valve 361. The first fluid supply pipe 350 is in communication with the fluid inlet 310 and is configured to supply a first fluid to the flow channel 330 via the fluid inlet 310. The first control valve 351 is in communication with the first fluid supply pipe 350 and is disposed between the preheater 352 and the fluid inlet 310 to control the on / off state of the first fluid supply pipe 350. The preheater 352 is in communication with the first fluid supply pipe 350 and is configured to heat the first fluid before entering the flow channel 330, for example, to approximately 170°C. The bypass branch 360 is in communication with the first fluid supply pipe 350 and is connected between the preheater 352 and the first control valve 351. When the first control valve 351 is closed, the first fluid heated by the preheater 352 is passed into the bypass branch 360 to maintain a stable temperature of the first fluid. The first fluid in bypass branch 360 flows back into a liquid storage device for storing the first fluid. In some examples, this liquid storage device can also serve as the liquid source for first fluid supply pipe 350. A second control valve 361 is connected to bypass branch 360 and is used to control the on / off operation of bypass branch 360. The flowmeter 700 mentioned above is located on first fluid supply pipe 350, and the preheater 352 can utilize an existing heater. The working process of this component is described in detail in the process flow below.

[0055] In some embodiments, referring to FIG7 , the cleaning device 1 further includes a fluid branch 210 for supplying a second fluid to the nozzle 200. Further, referring to FIG2 and FIG7 , the nozzle 200 includes a confluence portion 220, which connects the fluid outlet 320 of the flow channel 330 and the fluid branch 210, and has a compact structure. The first fluid output from the flow channel 330 of the fluid delivery device 300 and the second fluid output from the fluid branch 210 are mixed at the confluence portion 220 and then flow out of the nozzle 200. In this example, the confluence portion 220 is integrated into the nozzle 200. In other examples, the confluence portion 220 and the nozzle 200 may also be separate components. In this embodiment, the second fluid may be hydrogen peroxide (H2O2).

[0056] When the first fluid is sulfuric acid and the second fluid is hydrogen peroxide, the sulfuric acid and hydrogen peroxide mix at the confluence portion 220 to form an SPM (Sulfuric Acid Hydrogen Peroxide Mixture) solution, which then flows out of the nozzle 200. The SPM solution is suitable for, for example, removing photoresist formed on the surface of the substrate 1000. In the present application, the sulfuric acid within the flow channel 330 can be heated to above 190°C by the heating device 400. Moreover, the ultra-high temperature sulfuric acid generates heat when mixed with room temperature hydrogen peroxide. Therefore, the SPM solution is heated to a temperature higher than 190°C, for example, above 200°C, when it reaches the nozzle 200. This can remove the photoresist formed on the surface of the substrate 1000, significantly improve the photoresist removal efficiency, and thus save the amount of SPM solution used.

[0057] In some embodiments, referring to Figures 2 and 7 , the cleaning device 1 further includes an exhaust duct 230, which is in communication with the confluence portion 220 of the nozzle 200 and is configured to exhaust bubbles generated when sulfuric acid and hydrogen peroxide are mixed at the confluence portion 220. The exhaust duct 230 may be disposed on the top or side of the nozzle 200.

[0058] Referring to Figure 7, the present application proposes a wet process equipment, including a chamber 2, a substrate supporting device 3 and the above-mentioned cleaning device 1. The substrate supporting device 3 is arranged inside the chamber 2 to support the substrate 1000. The nozzle 200 of the cleaning device 1 is used to supply fluid to the substrate 1000. The fluid is a mixed fluid formed by mixing a first fluid and a second fluid, such as SPM solution.

[0059] FIG8 is a process flow chart of supplying SPM solution to a substrate using a cleaning device according to an embodiment of the present application.

[0060] For example, referring to FIG. 1 to FIG. 8 , the process flow of supplying SPM solution to the substrate 1000 based on the cleaning device 1 of the wet process equipment is described as follows:

[0061] Step S01: the substrate supporting device 3 rotates the substrate 1000;

[0062] Step S02: opening the fluid branch 210 to supply hydrogen peroxide (H2O2) to the substrate 1000;

[0063] Step S03: Open the first control valve 351 and close the second control valve 361 to open the first fluid supply pipe 350 and close the bypass branch pipe 360;

[0064] Step S04: supplying sulfuric acid (H 2 SO 4 ) to the first fluid supply pipe 350 , so that the sulfuric acid in the first fluid supply pipe 350 enters the interior of the flow channel 330 from the fluid inlet 310 ;

[0065] Step S05: Turn on the heating lamp to heat the sulfuric acid inside the flow channel 330;

[0066] Step S06: The sulfuric acid heated by the heating lamp enters the confluence portion 220 from the fluid outlet 320 and mixes with the hydrogen peroxide to form an SPM solution. The SPM solution is supplied to the substrate 1000 through the nozzle 200 to perform SPM treatment on the substrate 1000.

[0067] Step S07: After the SPM treatment of the substrate 1000 is completed, the heating lamp is turned off;

[0068] Step S08: Close first control valve 351 and open second control valve 361 to shut off first fluid supply pipe 350. This allows the sulfuric acid heated by preheater 352 to flow into bypass branch 360, maintaining a stable sulfuric acid temperature. The sulfuric acid in bypass branch 360 then flows back into the liquid storage device. During this process, preheater 352 remains in a heating state, preventing sulfuric acid temperature fluctuations caused by startup and shutdown.

[0069] Step S09 , closing the fluid branch 210 to stop supplying hydrogen peroxide to the substrate 1000 .

[0070] As mentioned above, although the Example of this application was described, this application is not limited to the said Example, Various changes are possible as long as they do not deviate from the summary.

[0071] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A cleaning device, characterized in that: include: A swing arm having a receiving cavity; A nozzle, disposed at the first end of the swing arm, for outputting fluid; A fluid delivery device, disposed inside the accommodating chamber, the fluid delivery device comprising a flow channel for a first fluid to pass through, the flow channel being in communication with the nozzle to deliver the first fluid to the nozzle; as well as A heating device is arranged inside the accommodating cavity and is used to heat the first fluid inside the flow channel.

2. The cleaning device according to claim 1, characterized in that: The flow channel is arranged around the outer periphery of the heating device.

3. The cleaning device according to claim 2, characterized in that: The fluid conveying device comprises a shell, wherein the shell comprises an inner shell and an outer shell, the flow channel is formed by a space between the inner shell and the outer shell, and the heating device is arranged inside the inner shell.

4. The cleaning device according to claim 1, characterized in that: The fluid conveying device comprises a shell, the flow channel is surrounded by the shell, and the heating device is arranged outside the shell.

5. The cleaning device according to claim 1, characterized in that: Also includes: a first temperature sensor, used to detect the temperature of the first fluid before entering the flow channel; a flow meter, used for detecting the flow rate of the first fluid passing into the flow channel; A controller is connected to the flow meter, the heating device and the first temperature sensor respectively, and is configured as follows: A temperature difference is obtained according to a target temperature of the first fluid flowing out of the flow channel and a temperature of the first fluid detected by the first temperature sensor, and the power of the heating device is controlled according to the temperature difference and a flow rate of the first fluid detected by the flowmeter.

6. The cleaning device according to claim 5, characterized in that: The heating power calculation formula of the heating device is P=C*ρ*Q*ΔT; Wherein, P is the heating power of the heating device; C is the specific heat capacity of the first fluid; ρ is the density of the first fluid; Q is the flow rate of the first fluid entering the flow channel; ΔT is the difference between the target temperature and the temperature of the first fluid detected by the first temperature sensor.

7. The cleaning device according to claim 5, characterized in that: Also includes: A second temperature sensor is used to detect the temperature of the first fluid flowing out of the flow channel.

8. The cleaning device according to claim 7, characterized in that: Also includes: The third temperature sensor is used to detect the temperature of the surface of the fluid conveying device.

9. The cleaning device according to claim 1, characterized in that: A bracket is also included for supporting the heating device inside the accommodating cavity.

10. The cleaning device according to claim 1, characterized in that: The heating device comprises at least one heating lamp.

11. The cleaning device according to claim 10, characterized in that: Also includes: The reflective layer is configured to reflect the light emitted by the heating lamp tube back to the interior of the flow channel when the light passes through the flow channel and reaches the reflective layer.

12. The cleaning device according to claim 1, characterized in that: Also includes: A heat insulating member covers at least a portion of the outer side of the fluid conveying device.

13. The cleaning device according to claim 1, characterized in that: Also includes: a first fluid supply pipe, connected to the flow channel; a first control valve, connected to the first fluid supply pipe, and used to control the on-off of the first fluid supply pipe; A pre-heater is communicated with the first fluid supply pipe and is configured to heat the first fluid before entering the flow channel.

14. The cleaning device according to claim 13, characterized in that: Also includes: a bypass branch pipe, communicated with the first fluid supply pipe and connected between the preheater and the first control valve, for passing the first fluid heated by the preheater when the first control valve is closed; The second control valve is communicated with the bypass branch pipe and is used to control the on-off of the bypass branch pipe.

15. The cleaning device according to claim 1, characterized in that: The swing arm comprises: The main body, the accommodating cavity is located inside the main body, and the main body is made of stainless steel.

16. The cleaning device according to claim 15, characterized in that: The swing arm also includes: The anti-corrosion layer is coated on the outer periphery of the main body.

17. The cleaning device according to claim 16, characterized in that: The material of the anti-corrosion layer is PFA or PTFE.

18. The cleaning device according to claim 1, characterized in that: Also includes: a fluid branch for supplying a second fluid to the nozzle; The nozzle includes a confluence portion, and the confluence portion connects the flow channel and the fluid branch, so that the first fluid and the second fluid are mixed at the confluence portion and flow out of the nozzle.

19. The cleaning device according to claim 18, characterized in that: Also includes: The exhaust duct is communicated with the confluence portion.

20. A wet process equipment, characterized in that: include: Chamber; A substrate supporting device, disposed inside the chamber and used to support the substrate; as well as The cleaning device according to any one of claims 1 to 19, wherein the nozzle of the cleaning device is used to supply fluid to the substrate.

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