Thermal management integrated component, system and vehicle

Abstract

A thermal management integrated component, a system and a vehicle. The thermal management integrated component comprises a base plate and a frame, wherein the base plate and the frame are integrated together; the base plate is used for integrating a water pump and a water valve, the water pump and the water valve being in communication with a cooling liquid flow channel arranged in the base plate; the frame is used for integrating devices of a refrigerant system together; and the devices of the refrigerant system are in communication with each other by means of pipes, and comprise a first heat exchange device, a second heat exchange device and a valve device. By using the solution of the present application, the cost of the thermal management integrated component can be reduced.

Description

Thermal management of integrated components, systems and vehicles

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on November 30, 2023, with application number 202311645782.X, and priority to the Chinese patent application entitled “Thermal Management Integrated Components, Systems and Vehicles”, all contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of thermal management technology, and in particular, to a thermal management integrated component, system and vehicle. Background Art

[0003] With the continuous development of vehicles, the integration of vehicle thermal management systems has become a trend to improve production and assembly efficiency, facilitate quality control, and reduce the space occupied by thermal management systems. However, the current cost of implementing thermal management system integration is high, and reducing the cost of thermal management system integration has become an urgent issue.

[0004] Summary of the Invention

[0005] The present application provides a thermal management integrated component, system and vehicle, which can reduce the cost of thermal management system integration.

[0006] In a first aspect, the present application provides a thermal management integrated component, characterized in that the thermal management integrated component includes a substrate and a frame, and the substrate and the frame are integrated together;

[0007] The aforementioned substrate is used to integrate a water pump and a water valve, and the aforementioned water pump and the aforementioned water valve are in communication with a coolant flow channel provided in the aforementioned substrate;

[0008] The aforementioned frame is used to integrate the components of the refrigerant system; the components of the aforementioned refrigerant system are connected through pipelines, and the components of the aforementioned refrigerant system include a first heat exchange device, a second heat exchange device and a valve device.

[0009] In the above solution, to achieve a highly integrated thermal management system, the baseboard and frame can be integrated together. The baseboard can integrate the water pump, water valve, and coolant flow path, while the frame can integrate the valve mechanism and heat exchange equipment. By replacing the refrigerant baseboard with the frame to integrate the refrigerant system components, and with the piping for high-pressure refrigerant located outside the frame, the frame does not need to be made of high-pressure metal and forged like the refrigerant baseboard, thus reducing the cost of thermal management system integration.

[0010] In a possible implementation, the water pump and the water valve are integrated on the first side of the substrate, and the second side of the substrate is opposite to the first side of the substrate;

[0011] The components of the refrigerant system are integrated on the first side of the frame, and the second side of the frame is opposite to the first side of the frame;

[0012] The components of the refrigerant system are located on the second side of the substrate, and the direction of the first side of the frame intersects with the direction of the second side of the substrate.

[0013] In the above solution, because the frame is not stacked parallel to the substrate, the thickness of the substrate in the thickness direction can be reduced, thereby reducing the overall thickness of the thermal management integrated component and reducing the volume.

[0014] In one possible implementation, the target heat exchange device includes a refrigerant inlet, a refrigerant outlet, a coolant inlet, and a coolant outlet; the target heat exchange device is the first heat exchange device or the second heat exchange device;

[0015] The refrigerant inlet and the refrigerant outlet are located on a first side of the target heat exchange device;

[0016] The coolant inlet and the coolant outlet are located on a second side opposite to the first side of the target heat exchange device;

[0017] A first cooling liquid flow channel interface and a second cooling liquid flow channel interface are provided on the second side of the aforementioned substrate;

[0018] The cooling liquid inlet is connected to the first cooling liquid flow channel interface, and the cooling liquid outlet is connected to the second cooling liquid flow channel interface.

[0019] In another possible implementation, the first side of the target heat exchange device includes a refrigerant inlet, a refrigerant outlet, a coolant inlet, and a coolant outlet; the aforementioned target heat exchange device is the first heat exchange device or the second heat exchange device;

[0020] The second side of the target heat exchange device is connected to the first side of the frame, and the second side of the target heat exchange device is oriented opposite to the first side of the target heat exchange device;

[0021] A first cooling liquid flow channel interface and a second cooling liquid flow channel interface are provided on the second side of the aforementioned substrate;

[0022] The cooling liquid inlet is connected to the first cooling liquid flow channel interface, and the cooling liquid outlet is connected to the second cooling liquid flow channel interface.

[0023] In the above solution, the interface of the heat exchange device is directly connected to the coolant flow channel interface of the substrate, without the need for pipelines or other flow channel transfers, reducing the transfer sealing interface and reducing the flow resistance caused by pipeline transfers.

[0024] In a possible implementation, the surface of the first heat exchange device with the largest area is arranged to face the second side of the substrate, and the surface of the second heat exchange device with the largest area is arranged to face the second side of the substrate.

[0025] In the above solution, such an arrangement can further reduce the thickness in the thickness direction of the substrate, thereby reducing the overall thickness of the thermal management integrated component and reducing the volume.

[0026] In a possible implementation, the refrigerant outlet of the aforementioned valve device is connected to the refrigerant inlet of the aforementioned second heat exchange device.

[0027] In the above solution, the valve device is integrated with the heat exchange equipment to improve the integration level, reduce the piping layout and reduce the space occupied by the thermal management integrated components.

[0028] In one possible implementation, the device of the refrigerant system further includes a refrigerant container, and the refrigerant container is disposed between the first heat exchange device and the second heat exchange device;

[0029] The first heat exchange device is connected to the refrigerant container via a first pipeline, the refrigerant container is connected to the valve device via a second pipeline, and the valve device is connected to the second heat exchange device.

[0030] In the above solution, the outlet of the first heat exchanger is connected to the inlet of the refrigerant container, the outlet of the refrigerant container is connected to the valve device, and the valve device is connected to the second heat exchanger. Therefore, placing the refrigerant container between the two heat exchangers can reduce the length of the pipeline.

[0031] In one possible implementation, the components of the refrigerant system are integrated on the first side of the frame, a refrigerant outlet is provided on the first side of the first heat exchange device, and a refrigerant inlet is provided on the first side of the second heat exchange device.

[0032] The first side of the frame and the first side of the first heat exchange device are perpendicular to each other;

[0033] The orientation of the first side of the aforementioned first heat exchange device is the same as the orientation of the first side of the aforementioned second heat exchange device; or, the orientation of the first side of the aforementioned first heat exchange device and the orientation of the first side of the aforementioned second heat exchange device are perpendicular to each other, and the orientation of the first side of the aforementioned second heat exchange device is perpendicular to the orientation of the first side of the aforementioned frame.

[0034] In the above solution, the first heat exchange device and the second heat exchange device are flexibly arranged in positions or directions, thereby reducing layout limitations.

[0035] In a possible implementation, the frame is manufactured using a first processing method, and the pipeline is manufactured using a second processing method; the first processing method or the second processing method is any one of the following: die casting, sheet metal and injection molding.

[0036] In the above scheme, in this scheme, die casting, sheet metal or injection molding are used instead of the forging processing method adopted in the existing scheme, which can save processing costs.

[0037] In a possible implementation, the frame includes a hollow area, and the ratio of the area of ​​the hollow area to the area of ​​the frame is greater than 50%.

[0038] In the above solution, when the frame is made of metal, hollowing out can save metal materials and thus save costs, and can also reduce weight to achieve lightweight thermal management integrated components.

[0039] In a second aspect, the present application provides a thermal management system, which includes the thermal management integrated component as described in any one of the first aspects above.

[0040] In a third aspect, the present application provides a vehicle, which includes the thermal management integrated component as described in any one of the first aspects above, or the aforementioned vehicle includes the thermal management system as described in the second aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] FIG1 is a schematic structural diagram of a substrate module for an integrated thermal management system;

[0042] Figures 2 to 4 are schematic structural diagrams of a thermal management integrated component provided in an embodiment of the present application;

[0043] 5 and 6 are schematic diagrams of a partial exploded structure of a thermal management integrated component provided in an embodiment of the present application;

[0044] FIG7 is a schematic diagram of the structure of the framework provided in an embodiment of the present application;

[0045] 8 to 10 are schematic diagrams of partial exploded structures of the thermal management integrated component provided in an embodiment of the present application;

[0046] FIG11 is a schematic diagram of device connections provided in an embodiment of the present application;

[0047] FIG12 is a schematic structural diagram of a thermal management integrated component provided in an embodiment of the present application;

[0048] FIG13 is a schematic diagram of device connections provided in an embodiment of the present application;

[0049] FIG14 is a schematic diagram of the structure of a thermal management system provided in an embodiment of the present application;

[0050] FIG15 is a schematic structural diagram of a vehicle provided in an embodiment of the present application.

[0051] Figure markings: 00 - thermal management integrated component; 01 to 12 - interfaces; 100 - base plate; 110 - water valve; 111 (including 1111, 1112 and 1113) - water pump; 200 - frame; 210 - first heat exchange device; 220 - second heat exchange device; 230 - valve device; 240 - refrigerant container; 201 to 205 - pipelines; 301 to 304 - through holes; 206 - hollow area; 207 - frame. DETAILED DESCRIPTION

[0052] In the embodiment of the present application, "multiple" refers to two or more. In the embodiment of the present application, "and / or" is used to describe the association relationship of associated objects, indicating three relationships that can exist independently. For example, A and / or B can be expressed as follows: A exists alone, B exists alone, or A and B exist at the same time. The description methods such as "at least one of a1, a2, ... and an" used in the embodiment of the present application include the situation where any one of a1, a2, ... and an exists alone, and also include any combination of any multiple of a1, a2, ... and an, each of which can exist alone; for example, the description method of "at least one of a, b and c" includes the situation where a is alone, b is alone, c is alone, a and b combination, a and c combination, b and c combination, or abc combination.

[0053] In this application, the terms "first," "second," and the like are used to distinguish between identical or similar items having substantially the same function or effect. It should be understood that "first," "second," and "nth" do not have a logical or temporal dependency, nor do they limit the quantity or order of execution. It should also be understood that although the following description uses the terms "first," "second," and the like to describe various elements, these elements should not be limited by these terms. These terms are simply used to distinguish one element from another.

[0054] In the various embodiments of the present application, unless otherwise specified or there is a logical conflict, the terms and / or descriptions between the various embodiments are consistent and can be referenced by each other. The technical features in different embodiments can be combined to form new embodiments according to their inherent logical relationships.

[0055] The thermal management integrated component and thermal management system (the thermal management system includes the thermal management integrated component) provided in the embodiment of the present application are applicable to vehicles, and are also applicable to thermal management scenarios with other cooling (heat dissipation) and / or heating requirements. For example, the thermal management integrated component and thermal management system provided in the embodiment of the present application can be applied to electric vehicles. Specifically, the electric vehicle is a vehicle suitable for driving by an electric drive. The electric vehicle can be a pure electric vehicle (pure electric vehicle / battery electric vehicle, pure EV / battery EV), a hybrid electric vehicle (hybrid electric vehicle, HEV), a range extended electric vehicle (REEV), a plug-in hybrid electric vehicle (PHEV) or a new energy vehicle (NEV), etc.

[0056] The thermal management system of the embodiment of the present application can use water to heat or dissipate heat from the managed object. In some possible implementations, the managed object may be a passenger compartment, a battery, an electric drive, and a control system, etc. In the present application, water is used to transfer heat energy. In some possible implementations, the thermal management system of the present application can also use coolants such as water and refrigerants to heat or dissipate heat from the managed object. Among them, the refrigerant can transfer heat through evaporation and condensation. It should be understood that water can also be replaced by other coolants to transfer heat energy, and the embodiment of the present application does not specifically limit this.

[0057] The current cost of integrating thermal management systems is high. To reduce this cost, we have analyzed the refrigerant substrates used in components integrated with refrigerant systems and found that their manufacturing, processing, and materials require significant cost. For easier understanding, please first refer to Figure 1. Figure 1 shows a schematic diagram of the structure of a substrate module for an integrated thermal management system.

[0058] As can be seen in Figure 1, the substrate module includes a water channel substrate (also known as a coolant substrate) and a refrigerant substrate. The water channel substrate can be integrated with thermal management devices of the coolant system, such as thermal management devices such as water pumps and multi-way valves. In addition, illustratively, a coolant flow channel (or coolant channel) is also arranged in the water channel substrate. The coolant flow channel can replace the water pipe in the thermal management system. The refrigerant substrate can be integrated with thermal management devices of the refrigerant system. For example, thermal management devices such as condensers and coolers are integrated on the refrigerant substrate. A refrigerant flow channel (or refrigerant channel) is also arranged in the refrigerant substrate. The refrigerant flow channel can replace the air-conditioning pipe in the thermal management system. The refrigerant flow channel can connect devices such as the condenser and cooler integrated on the refrigerant substrate.

[0059] In practice, the refrigerant flow channels in the refrigerant baseplate carry high-pressure refrigerant. To withstand this high pressure, the baseplate must be made of high-strength metal (such as aluminum alloy) and forged. However, the high-strength metal and forging process are both expensive, increasing the cost of integrating the thermal management system.

[0060] In order to reduce the cost of integrating a thermal management system, an embodiment of the present application provides a thermal management integrated component 00. The thermal management integrated component 00 includes a substrate 100 and a frame 200, and the substrate 100 and the frame 200 are integrated together. The substrate 100 is used to integrate a water valve 110 and a water pump 111. The water pump 111 and the water valve 110 are connected to the coolant flow channel provided in the substrate 100. The frame 200 is used to integrate the components of the refrigerant system together. The components of the refrigerant system are connected by pipes. The components of the refrigerant system include a first heat exchange device 210, a second heat exchange device 220 and a valve device 230. For ease of understanding, the following is an exemplary introduction with reference to the accompanying drawings. It can be understood that the shapes of the various components in the drawings shown in the embodiments of the present application are only schematic and do not constitute a limitation to the embodiments of the present application.

[0061] In one possible implementation, see FIG2 , which illustrates a schematic structural diagram of a thermal management integrated component 00 according to an embodiment of the present application. In the embodiment of the present application, the water pump 111 may include three water pumps, namely, water pump 1111, water pump 1112, and water pump 1113, as shown in FIG2 .

[0062] For example, as shown in Figure 2, the first heat exchange device 210, the second heat exchange device 220 and the valve device 230 are integrated on one side of the frame 200 (referred to as the first side of the frame 200). For example, the first heat exchange device 210 and the second heat exchange device 220 can be fixedly connected to the first side of the frame 200 by bolt connection, hinge connection, ultrasonic connection or welding. For example, the first heat exchange device 210 can be, for example, a heat exchange device such as a condenser. The second heat exchange device 220 can be, for example, a heat exchange device such as a cooler. The embodiment of the present application does not limit the specific type and form of the first heat exchange device 210 and the second heat exchange device 220.

[0063] Exemplarily, as shown in Figure 2, the first heat exchange device 210 includes a refrigerant interface 01 (inlet) and a refrigerant interface 02 (outlet). The second heat exchange device 220 includes a refrigerant inlet (not shown in Figure 2) and a refrigerant interface 03 (outlet). Among them, the refrigerant interface 02 is connected to the refrigerant inlet of the valve device 230 (not shown in Figure 2) through a pipeline 201. Exemplarily, the valve device 230 can be integrated with the second heat exchange device 220. Specifically, the refrigerant outlet (not shown in Figure 2) of the valve device 230 is connected to the refrigerant inlet of the second heat exchange device 220. Exemplarily, the outlet of the valve device 230 and the inlet of the second heat exchange device 220 can be sealed by welding or a sealing ring.

[0064] Exemplarily, the valve device 230 may be an expansion valve or a solenoid valve or a combination of the two, and the embodiment of the present application does not limit this.

[0065] 2 , water pump 1111, water pump 1112, water pump 1113, and water valve 110 are integrated on one side of substrate 100 (referred to as the first side of substrate 100). For example, a coolant flow channel is provided in substrate 100, and water pump 1111, water pump 1112, water pump 1113, and water valve 110 are in communication with the coolant flow channel in substrate 100. For example, water valve 110 can be a multi-way valve, such as a three-way valve, an eight-way valve, or a nine-way valve.

[0066] For example, as shown in FIG2 , the substrate 100 and the frame 200 are integrated together. Specifically, the second side of the substrate 100 and the second side of the frame 200 are in contact and connected together. The second side of the substrate 100 is oriented opposite to the first side of the substrate 100. The second side of the frame 200 is oriented opposite to the first side of the frame 200. For example, the substrate 100 and the frame 200 can be integrated by various means such as bolt connection, hinge connection, welding, ultrasonic connection, or integral molding, and the embodiments of the present application are not limited thereto.

[0067] In a possible implementation, you can refer to Figure 3 or Figure 4 for example, which shows a schematic structural diagram of another thermal management integrated component 00 provided in an embodiment of the present application. As shown in Figure 3 or Figure 4, the first heat exchange device 210, the second heat exchange device 220 and the valve device 230 are integrated on one side of the frame 200. For the convenience of the subsequent introduction, this side is still referred to as the first side of the frame 200. And the other side of the frame 200 opposite to the one side is still referred to as the second side of the frame 200. The water pump 1111, the water pump 1112, the water pump 1113 and the water valve 110 are integrated on one side of the substrate 100 (not shown in Figure 4). For the convenience of the subsequent introduction, this side is still referred to as the first side of the substrate 100. And the other side of the substrate 100 opposite to the one side is still referred to as the second side of the substrate 100.

[0068] Figure 3 or Figure 4 differs from Figure 2 in that, in the thermal management integrated component 00 shown in Figure 3 or Figure 4 , while the first heat exchange device 210, the second heat exchange device 220, and the valve assembly 230 are still located on the second side of the base plate 100, the orientation of the first side of the frame 200 intersects with the orientation of the second side of the base plate 100. As shown in Figure 3 or Figure 4 , the orientation of the first side of the frame 200 is indicated by the dashed arrow ①, and the orientation of the second side of the base plate 100 is indicated by the dashed arrow ②. The remaining description of Figure 3 or Figure 4 can be referred to the relevant description of Figure 2 above and will not be repeated here.

[0069] 3 , since the frame 200 is not stacked parallel to the substrate 100 , the thickness of the substrate 100 in the thickness direction can be reduced (such as shown in FIG. 3 or FIG. 4 ③ ), thereby reducing the overall thickness of the thermal management integrated component 00 and reducing the volume.

[0070] In one possible implementation, such as shown in Figures 2 or 3 above, the largest surface area of ​​the first heat exchange device 210 is disposed facing the second side of the substrate 100. Similarly, the largest surface area of ​​the second heat exchange device 220 is disposed facing the second side of the substrate 100. This arrangement can further reduce the thickness of the substrate 100, thereby reducing the thickness of the entire thermal management integrated component and reducing its volume.

[0071] In one possible implementation, the first heat exchange device 210 and the second heat exchange device 220 include a coolant inlet and outlet. The coolant inlet and outlet of the two heat exchange devices are connected to the coolant flow channel interface provided in the base plate 100. For ease of understanding, please refer to Figures 5 to 10 for example.

[0072] For example, referring to (a) of Figure 5, the first heat exchange device 210 includes an interface 04 and an interface 05. Assuming that the interface 04 and the interface 05 are located on the first side of the first heat exchange device 210, the above-mentioned interface 01 and interface 02 are located on the second side of the first heat exchange device 210, and the first side and the second side intersect. For example, of the interface 04 and the interface 05, one is the coolant inlet of the first heat exchange device 210, and the other is the coolant outlet of the first heat exchange device 210. Which one is the inlet or outlet is determined according to actual application requirements, and the embodiment of the present application does not limit this. Similarly, the second heat exchange device 220 includes an interface 06 and an interface 07. Assuming that the interface 06 and the interface 07 are located on the first side of the second heat exchange device 220, the above-mentioned interface 03 and the refrigerant inlet connected to the valve device 230 are located on the second side of the second heat exchange device 220, and the first side and the second side intersect. For example, one of the interfaces 06 and 07 is the coolant inlet of the second heat exchange device 220, and the other is the coolant outlet of the second heat exchange device 220. Which one is the inlet or outlet is determined according to actual application requirements, and the embodiment of the present application does not limit this.

[0073] Referring again to FIG5(b), an exploded schematic diagram of a portion of the structure of the thermal management integrated component 00 shown in FIG2 is shown. In FIG5(b), four through-holes are provided in the frame 200: through-hole 301, through-hole 302, through-hole 303, and through-hole 304. In addition, interfaces 08 to 11 are provided on the second side of the substrate 100. When the substrate 100, the frame 200, the first heat exchange device 210, and the second heat exchange device 220 are integrated together (for example, as shown in FIG2), interface 08 is connected to interface 04 of the first heat exchange device 210 through through-hole 301. Interface 09 is connected to interface 05 of the first heat exchange device 210 through through-hole 302. Interface 10 is connected to interface 06 of the second heat exchange device 220 through through-hole 303. Interface 11 is connected to interface 07 of the second heat exchange device 220 through through-hole 304.

[0074] In another possible implementation, please refer to Figure 6 for an example. The difference between Figure 6 and Figure 5 is that in the implementation shown in Figure 6, the refrigerant inlet and outlet and the cooling inlet and outlet of the first heat exchange device 210 and the second heat exchange device 220 are located on the same surface. Accordingly, the position of the through hole on the frame 200 and the position of the coolant flow channel interface on the substrate 100 are also adaptively changed. Then, when the substrate 100, the frame 200, the first heat exchange device 210 and the second heat exchange device 220 are integrated together, the interface 08 is connected to the interface 04 of the first heat exchange device 210 through the through hole 301. The interface 09 is connected to the interface 05 of the first heat exchange device 210 through the through hole 302. The interface 10 is connected to the interface 06 of the second heat exchange device 220 through the through hole 303. The interface 11 is connected to the interface 07 of the second heat exchange device 220 through the through hole 304.

[0075] In another possible implementation, for example, see FIG7 . The frame 200 includes a hollow region 206 and a frame 207. In this implementation, when the substrate 100, the frame 200, the first heat exchange device 210, and the second heat exchange device 220 are integrated together (for example, as shown in FIG2 ), the interfaces 08 to 11 on the second side of the substrate 100 can pass through the hollow region 206 to communicate with the coolant inlet and outlet of the first heat exchange device 210 and the second heat exchange device 220, respectively. For specific interface connections, please refer to the relevant description of FIG5 above and will not be repeated here.

[0076] For example, in the implementation of the frame 200 shown in FIG. 7 , the first heat exchange device 210 and the second heat exchange device 220 may be fixedly disposed on the frame 207 .

[0077] Exemplarily, in the implementation of the frame 200 shown in FIG. 7 , the ratio of the area of ​​the hollow region 206 to the area of ​​the frame 200 is greater than 50%.

[0078] It is understood that the hollow area 206 shown in Figure 7 is only an example. In a specific implementation, the frame 200 may include a plate-shaped area in addition to the frame 207, which may separate the hollow area 206 into multiple hollow parts. This embodiment of the application does not limit this.

[0079] In the implementation of the frame 200 shown in FIG. 7 , since the frame 200 can be made of metal, hollowing out can save metal materials and thus save costs, and can also reduce weight, thereby achieving lightweight thermal management integrated component 00 .

[0080] For example, referring to (a) of Figure 8 , for the introduction of (a) of Figure 8 , please refer to the introduction of (a) of Figure 5 above, which will not be repeated here. In (b) of Figure 8 , interfaces 08 to 11 are provided on the second side of the substrate 100. When the substrate 100, the frame 200, the first heat exchange device 210, and the second heat exchange device 220 are integrated together (for example, as shown in Figure 3 ), the interface 08 is connected to the interface 04 of the first heat exchange device 210. The interface 09 is connected to the interface 05 of the first heat exchange device 210. The interface 10 is connected to the interface 06 of the second heat exchange device 220. The interface 11 is connected to the interface 07 of the second heat exchange device 220.

[0081] In another possible implementation, the frame 200 shown in FIG. 3 or FIG. 8 may be a frame including a hollow area as shown in FIG. 7 , so as to save costs and reduce weight. For details, please refer to the above introduction, which will not be repeated here.

[0082] In another possible implementation, please refer to Figure 9 for an example. The difference between Figure 9 and Figure 8 is that in the implementation shown in Figure 9, the refrigerant inlet and outlet and the cooling inlet and outlet of the first heat exchange device 210 and the second heat exchange device 220 are located on the same surface. Correspondingly, the position of the coolant flow channel interface on the substrate 100 is also adaptively changed. Then, when the substrate 100, the frame 200, the first heat exchange device 210 and the second heat exchange device 220 are integrated together, the interface 08 is connected to the interface 04 of the first heat exchange device 210. The interface 09 is connected to the interface 05 of the first heat exchange device 210. The interface 10 is connected to the interface 06 of the second heat exchange device 220. The interface 11 is connected to the interface 07 of the second heat exchange device 220.

[0083] For example, referring to (a) of Figure 10, the first heat exchange device 210 includes an interface 04 and an interface 05. Assume that the interface 04 and the interface 05 are located on the first side of the first heat exchange device 210, and the above-mentioned interface 01 and interface 02 are located on the second side of the first heat exchange device 210. The orientation of the first side and the orientation of the second side are opposite to each other (or the first side and the second side are opposite to each other). For example, one of the interface 04 and the interface 05 is the coolant inlet of the first heat exchange device 210, and the other is the coolant outlet of the first heat exchange device 210. Which one is the inlet or outlet is determined according to actual application requirements, and the embodiment of the present application does not limit this. Similarly, the second heat exchange device 220 includes an interface 06 and an interface 07. Assume that the interface 06 and the interface 07 are located on the first side of the second heat exchange device 220, and the above-mentioned interface 03 and the refrigerant inlet connected to the valve device 230 are located on the second side of the second heat exchange device 220. The first surface and the second surface are oriented oppositely (or the first surface and the second surface are facing away from each other). For example, one of the interfaces 06 and 07 is the coolant inlet of the second heat exchange device 220, and the other is the coolant outlet of the second heat exchange device 220. Which one is the inlet or outlet is determined based on actual application requirements and is not limited in this embodiment of the present application.

[0084] In FIG10( b ), interfaces 08 to 11 are provided on the second side of the base plate 100. When the base plate 100, frame 200, first heat exchange device 210, and second heat exchange device 220 are integrated (e.g., as shown in FIG4 ), interface 08 is connected to interface 04 of the first heat exchange device 210. Interface 09 is connected to interface 05 of the first heat exchange device 210. Interface 10 is connected to interface 06 of the second heat exchange device 220. Interface 11 is connected to interface 07 of the second heat exchange device 220.

[0085] In another possible implementation, the frame 200 shown in FIG. 4 or FIG. 10 may be a frame including a hollow area as shown in FIG. 7 , so as to save costs and reduce weight. For details, please refer to the above introduction, which will not be repeated here.

[0086] It should be understood that the locations of the refrigerant inlet and outlet and the coolant inlet and outlet in the first heat exchange device 210 and the second heat exchange device 220 described above are merely examples and do not constitute limitations on the embodiments of the present application. In specific implementations, the locations of the interfaces can be adjusted based on actual application needs. Similarly, it should be understood that the locations of interfaces 08 through 11 on the second side of the substrate 100 are merely examples and do not constitute limitations on the embodiments of the present application. In specific implementations, the locations of the interfaces can be adjusted based on actual application needs.

[0087] In a possible implementation, the components of the refrigerant system may further include a refrigerant container 240. The refrigerant container 240 may be, for example, a liquid storage tank or a gas-liquid separator, and the following mainly uses a liquid storage tank as an example.

[0088] For example, as shown in Figure 11, in a specific implementation, the refrigerant outlet (i.e., interface 02) of the first heat exchange device 210 is used to communicate with the refrigerant inlet of the refrigerant container 240 via pipeline 202. The refrigerant outlet of the refrigerant container 240 is used to communicate with the interface of the valve device 230 via pipeline 203. The valve device 230 is integrated with the second heat exchange device 220. In Figure 11, the refrigerant container 240 is disposed between the first heat exchange device 210 and the second heat exchange device 220 to reduce the length of the pipeline.

[0089] For example, the refrigerant container 240 can be fixedly mounted on the frame 200, as shown in FIG12 . FIG12 uses the thermal management integrated component 00 shown in FIG1 as an example. Similarly, the refrigerant container 240 can also be fixedly mounted on the frame 200 of the thermal management integrated component 00 shown in FIG2 or FIG3 , which will not be described in detail here.

[0090] In a possible implementation, the layout position of the device shown in FIG11 is only an example, and other layout positions can also be adopted. For example, see FIG13 for an example. In FIG13, the refrigerant container 240 can be fixed together with the first heat exchange device. For example, it can be fixed by welding or bolts, etc., and this embodiment of the application is not limited to this. The interface 12 on the refrigerant container 240 can be a refrigerant inlet. The refrigerant outlet of the refrigerant container 240 can be connected to the refrigerant inlet of the first heat exchange device 210 through a pipeline 204. The refrigerant outlet of the first heat exchange device 210 can be connected to the refrigerant inlet of the valve device 230 through a pipeline 205. The valve device 230 is integrated and connected with the second heat exchange device 220. The device shown in FIG13 is also used to be integrated with the above-mentioned frame 200. The specific integration method can be referred to the above-mentioned related introduction, which is not repeated here.

[0091] It is understandable that the layout positions shown in FIG. 13 are merely examples, and the embodiment of the present application does not limit the layout positions between the two heat exchange devices and the refrigerant container.

[0092] In one possible implementation, the frame 200 does not need to be provided with a high-pressure refrigerant flow channel, and can be manufactured using low-cost processing methods such as die casting, sheet metal, and injection molding. In addition, the pipes of the components connected to the refrigerant system can also be manufactured using low-cost processing methods such as die casting, sheet metal, and injection molding.

[0093] In summary, in the embodiments of the present application, in order to achieve a high degree of integration of the thermal management system, the base plate and the frame can be integrated together; the base plate can integrate the water pump, water valve, and coolant flow channel, and the frame can integrate the valve device and the heat exchange equipment. The frame is used instead of the refrigerant base plate to integrate the components of the refrigerant system, and the pipeline for circulating the high-pressure refrigerant is arranged outside the frame. Therefore, the frame does not need to be made of high-pressure-resistant metal and forged like the refrigerant base plate, thereby reducing the cost of integrating the thermal management system.

[0094] The present application also provides a thermal management system, as shown in FIG14 . Thermal management system 1400 may include a thermal management integrated component 1401. Thermal management integrated component 1401 may be, for example, any of the possible embodiments described above. For details, please refer to the preceding description and will not be repeated here.

[0095] The present application also provides a vehicle, as shown in FIG15 . Vehicle 1500 may include a thermal management integrated component 1501. Thermal management integrated component 1501 may be, for example, any of the possible embodiments described above. For details, please refer to the preceding description and will not be repeated here.

[0096] It should be understood that in the various embodiments of the present application, the size of the serial number of each process does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0097] It will also be understood that the term “comprise” (also known as “includes,” “including,” “comprises,” and / or “comprising”) when used in this specification specifies the presence of stated features, integers, steps, operations, elements, and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0098] It should also be understood that references throughout this specification to "one embodiment," "an embodiment," or "one possible implementation" mean that specific features, structures, or characteristics associated with that embodiment or implementation are included in at least one embodiment of the present application. Therefore, the appearance of "in one embodiment," "in an embodiment," or "one possible implementation" throughout this specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0099] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A thermal management integrated component, characterized in that: The thermal management integrated component comprises a substrate and a frame, wherein the substrate and the frame are integrated together; The base plate is used to integrate a water pump and a water valve, and the water pump and the water valve are in communication with a coolant flow channel provided in the base plate; The frame is used to integrate the components of the refrigerant system; the components of the refrigerant system are connected through pipelines, and the components of the refrigerant system include a first heat exchange device, a second heat exchange device and a valve device.

2. The thermal management integrated component according to claim 1, characterized in that: The water pump and the water valve are integrated on the first side of the substrate, and the second side of the substrate is opposite to the first side of the substrate; The components of the refrigerant system are integrated on the first side of the frame, and the second side of the frame is opposite to the first side of the frame; The components of the refrigerant system are located on the second side of the base plate, and the orientation of the first side of the frame intersects with the orientation of the second side of the base plate.

3. The thermal management integrated component according to claim 2, characterized in that: The target heat exchange device includes a refrigerant inlet, a refrigerant outlet, a coolant inlet, and a coolant outlet; the target heat exchange device is the first heat exchange device or the second heat exchange device; The refrigerant inlet and the refrigerant outlet are located on a first side of the target heat exchange device; The coolant inlet and the coolant outlet are located on a second side away from the first side of the target heat exchange device; A first coolant flow channel interface and a second coolant flow channel interface are provided on the second side of the substrate; The coolant inlet is connected to the first coolant flow channel interface, and the coolant outlet is connected to the second coolant flow channel interface.

4. The thermal management integrated component according to claim 2, characterized in that: The first side of the target heat exchange device includes a refrigerant inlet, a refrigerant outlet, a coolant inlet, and a coolant outlet; the target heat exchange device is the first heat exchange device or the second heat exchange device; The second side of the target heat exchange device is connected to the first side of the frame, and the direction of the second side of the target heat exchange device is opposite to the direction of the first side of the target heat exchange device; A first coolant flow channel interface and a second coolant flow channel interface are provided on the second side of the substrate; The coolant inlet is connected to the first coolant flow channel interface, and the coolant outlet is connected to the second coolant flow channel interface.

5. The thermal management integrated component according to any one of claims 1 to 4, characterized in that: The surface of the first heat exchange device with the largest area is arranged to face the second side of the substrate, and the surface of the second heat exchange device with the largest area is arranged to face the second side of the substrate.

6. The thermal management integrated component according to any one of claims 1 to 5, characterized in that: The refrigerant outlet of the valve device is connected to the refrigerant inlet of the second heat exchange device.

7. The thermal management integrated component according to any one of claims 1 to 6, characterized in that: The device of the refrigerant system further includes a refrigerant container, and the refrigerant container is arranged between the first heat exchange device and the second heat exchange device; The first heat exchange device is connected to the refrigerant container via a first pipeline, the refrigerant container is connected to the valve device via a second pipeline, and the valve device is connected to the second heat exchange device.

8. The thermal management integrated component according to any one of claims 1 to 7, characterized in that: The components of the refrigerant system are integrated on the first side of the frame, a refrigerant outlet is provided on the first side of the first heat exchange device, and a refrigerant inlet is provided on the first side of the second heat exchange device; The first side of the frame is oriented perpendicular to the first side of the first heat exchange device; The orientation of the first side of the first heat exchange device is the same as the orientation of the first side of the second heat exchange device; or, the orientation of the first side of the first heat exchange device and the orientation of the first side of the second heat exchange device are perpendicular to each other, and the orientation of the first side of the second heat exchange device and the orientation of the first side of the frame are perpendicular to each other.

9. The thermal management integrated component according to any one of claims 1 to 8, characterized in that: The frame is manufactured by a first processing method, and the pipeline is manufactured by a second processing method; the first processing method or the second processing method is any one of the following: die casting, sheet metal and injection molding.

10. The thermal management integrated component according to any one of claims 1 to 9, characterized in that: The frame includes a hollow area, and the ratio of the area of ​​the hollow area to the area of ​​the frame is greater than 50%.

11. A thermal management system, characterized in that: The thermal management system comprises the thermal management integrated component according to any one of claims 1-10.

12. A vehicle, characterized in that: The vehicle comprises the thermal management integrated component according to any one of claims 1 to 10 , or the vehicle comprises the thermal management system according to claim 11 .

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