Integrated component and system for thermal management, and vehicle

Abstract

An integrated component and system for thermal management and a vehicle, the integrated component for thermal management comprising a substrate, a refrigerant module, a first heat exchange device, a second heat exchange device, a multi-way valve, and a water pump. The refrigerant module is internally provided with a refrigerant flow channel, and the area of the refrigerant module is smaller than the area of the substrate. The substrate comprises a first side and a second side, and the orientation of the first side and the orientation of the second side are opposite one another. The multi-way valve and the water pump are arranged on the first side of the substrate, and the multi-way valve and the water pump are in communication with a cooling liquid flow channel in the substrate. The refrigerant module, the first heat exchange device, and the second heat exchange device are arranged on the second side of the substrate. The first heat exchange device and the second heat exchange device are in communication with the refrigerant flow channel in the refrigerant module. By adopting the solutions of the present application, the costs of integration of the system for thermal management can be reduced.

Description

Thermal management of integrated components, systems and vehicles

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on November 30, 2023, with application number 202311641843.5, and priority to the Chinese patent application entitled “Thermal Management Integrated Components, Systems and Vehicles”, all contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of thermal management technology, and in particular, to a thermal management integrated component, system and vehicle. Background Art

[0003] With the continuous development of vehicles, the integration of vehicle thermal management systems has become a trend to improve production and assembly efficiency, facilitate quality control, and reduce the space occupied by thermal management systems. However, the current cost of implementing thermal management system integration is high, and reducing the cost of thermal management system integration has become an urgent issue to be solved. Summary of the Invention

[0004] The present application provides a thermal management integrated component, system and vehicle, which can reduce the cost of thermal management system integration.

[0005] In a first aspect, the present application provides a thermal management integrated component, the thermal management integrated component comprising a substrate, a refrigerant module, a first heat exchange device, a second heat exchange device, a multi-way valve, and a water pump;

[0006] The refrigerant module is provided with a refrigerant flow channel; the area of ​​the refrigerant module is smaller than the area of ​​the substrate;

[0007] The substrate includes a first side and a second side, wherein the first side is oriented in opposite directions to the second side;

[0008] The multi-way valve and the water pump are arranged on the first side of the substrate, and the multi-way valve and the water pump are in communication with the coolant flow channel in the substrate;

[0009] The refrigerant module, the first heat exchange device and the second heat exchange device are arranged on the second side of the substrate; the first heat exchange device and the second heat exchange device are in communication with the refrigerant flow channel in the refrigerant module.

[0010] In the above scheme, the refrigerant flow path in the refrigerant base plate is concentrated onto a refrigerant module with a smaller area. Then, the two heat exchange devices originally set on the refrigerant base plate are directly set together with the refrigerant module on the base plate with integrated coolant flow path, thereby reducing the height of the refrigerant base plate. In addition, the refrigerant base plate is made of high-pressure metal material, which has high material and production costs. The refrigerant module is much smaller than the original refrigerant base plate. In addition to saving material and production costs, it also reduces weight. Based on this, this scheme greatly improves the integration level of the thermal management integrated component, overall reduces the volume and weight of the thermal management integrated component, and reduces the space occupied.

[0011] In a possible implementation manner, the ratio of the area of ​​the refrigerant module to the area of ​​the substrate is between 30% and 70%.

[0012] In the above solution, the area ratio of the refrigerant module and the substrate is within this area ratio range, which can minimize the cost of the refrigerant module and ensure that the number of refrigerant flow channels that meet the requirements can be set in the refrigerant module, that is, taking into account both cost and function.

[0013] In one possible embodiment, the water pump includes a first water pump, a second water pump and a third water pump; the multi-way valve, the first water pump, the second water pump and the third water pump are arranged in sequence along the longer side of the first side of the substrate.

[0014] In the above scheme, because the multi-way valve and the water pump are both connected to the coolant flow channel in the substrate, this arrangement can optimize the layout of the coolant flow channel set in the substrate, reduce the staggered flow channels, and make full use of the area of ​​the substrate to layout more flow channels, thereby improving the utilization rate of the substrate.

[0015] In a possible implementation, the refrigerant module is provided with a first refrigerant flow channel interface;

[0016] The first heat exchange device includes a first refrigerant inlet and a first refrigerant outlet; the first refrigerant inlet is located on a first side of the first heat exchange device, and the first refrigerant outlet is located on a second side opposite to the first side of the first heat exchange device;

[0017] The first refrigerant inlet is used to communicate with the compressor; the first refrigerant outlet is connected to the first refrigerant flow channel interface.

[0018] In the above scheme, the refrigerant inlet of the first heat exchange device is used to connect to the compressor, and the compressor is not integrated on the refrigerant module. Therefore, the refrigerant inlet of the first heat exchange device is not connected to the refrigerant flow channel interface of the refrigerant module, but is designed on the other side to facilitate connection with the compressor. Therefore, there is no need to set a flow channel on the refrigerant module to connect the compressor refrigerant interface and the refrigerant inlet of the first heat exchange device, thereby reducing the area of ​​the refrigerant module and reducing costs.

[0019] In one possible embodiment, the first heat exchange device includes a first coolant inlet and a first coolant outlet; the first coolant inlet and the first coolant outlet are located on the second side of the first heat exchange device;

[0020] A first cooling liquid flow channel interface and a second cooling liquid flow channel interface are provided on the second side of the aforementioned substrate;

[0021] The first coolant inlet is connected to the first coolant flow channel interface, and the first coolant outlet is connected to the second coolant flow channel interface.

[0022] In the above solution, the interface of the heat exchange device is directly connected to the coolant flow channel interface of the substrate, without the need for pipelines or other flow channel transfers, reducing the transfer sealing interface and reducing the flow resistance caused by pipeline transfers.

[0023] In a possible implementation, the refrigerant module is provided with a second refrigerant flow channel interface;

[0024] The second heat exchange device includes a second refrigerant inlet and a second refrigerant outlet; the second refrigerant inlet is located on a first side of the second heat exchange device, and the second refrigerant outlet is located on a second side opposite to the first side of the second heat exchange device;

[0025] The second refrigerant inlet is connected to the second refrigerant flow channel interface; the second refrigerant outlet is used to communicate with the compressor.

[0026] In the above scheme, the refrigerant outlet of the second heat exchange device is used to connect to the compressor, and the compressor is not integrated on the refrigerant module. Therefore, the refrigerant outlet of the second heat exchange device is not connected to the refrigerant flow channel interface of the refrigerant module, but is designed on the other side to facilitate connection with the compressor. Therefore, there is no need to set a flow channel on the refrigerant module that connects the compressor refrigerant interface and the refrigerant outlet of the second heat exchange device, thereby reducing the area of ​​the refrigerant module and reducing costs.

[0027] In one possible embodiment, the second heat exchange device includes a second coolant inlet and a second coolant outlet; the second coolant inlet and the second coolant outlet are located on a first side of the second heat exchange device;

[0028] A third coolant flow channel interface and a fourth coolant flow channel interface are provided on the second side of the aforementioned substrate;

[0029] The second coolant inlet is connected to the third coolant flow channel interface, and the second coolant outlet is connected to the fourth coolant flow channel interface.

[0030] In the above solution, the interface of the heat exchange device is directly connected to the coolant flow channel interface of the substrate, without the need for pipelines or other flow channel transfers, reducing the transfer sealing interface and reducing the flow resistance caused by pipeline transfers.

[0031] In a possible embodiment, the aforementioned thermal management integrated component further includes a refrigerant container; the aforementioned refrigerant module is provided with a third refrigerant flow channel interface and a fourth refrigerant flow channel interface;

[0032] The aforementioned refrigerant container is integrated on the aforementioned refrigerant module and is connected to the refrigerant flow channel in the aforementioned refrigerant module through the aforementioned third refrigerant flow channel interface and the aforementioned fourth refrigerant flow channel interface; the aforementioned refrigerant container is located between the aforementioned first heat exchange device and the aforementioned second heat exchange device.

[0033] In the above solution, a refrigerant container can also be integrated on the refrigerant module to improve the integration level. In addition, the refrigerant container is arranged between the two heat exchange devices to achieve a shorter refrigerant transfer path.

[0034] In one possible embodiment, the refrigerant container includes a first side and a second side, and the first side of the refrigerant container is oriented in opposite directions to the second side of the refrigerant container.

[0035] A third refrigerant inlet and a third refrigerant outlet are provided on the first side of the refrigerant container. The third refrigerant inlet is connected to the third refrigerant flow channel interface in the refrigerant module, and the third refrigerant outlet is connected to the fourth refrigerant flow channel interface in the refrigerant module.

[0036] The second side of the refrigerant container is the bottom of the refrigerant container, and the direction from the second side of the refrigerant container to the first side of the refrigerant container is perpendicular to the refrigerant module; or,

[0037] A direction from the second side of the refrigerant container to the first side of the refrigerant container is parallel to the refrigerant module.

[0038] In this solution, the refrigerant container is perpendicular to the refrigerant module, minimizing the impact on the refrigerant circuit caused by insufficient refrigerant in the tank. Furthermore, this arrangement facilitates increasing refrigerant capacity by replacing the tank with a longer one. Furthermore, the refrigerant container can be placed parallel to the refrigerant module, providing flexibility in layout.

[0039] In one possible embodiment, the aforementioned thermal management integrated component also includes an expansion valve; a fifth refrigerant flow channel interface is provided in the aforementioned refrigerant module; the aforementioned expansion valve is integrated on the aforementioned refrigerant module and is connected to the refrigerant flow channel in the aforementioned refrigerant module through the aforementioned fifth refrigerant flow channel interface.

[0040] In the above solution, an expansion valve can also be integrated on the refrigerant module to improve the integration level.

[0041] In a second aspect, the present application provides a thermal management system, which includes the thermal management integrated component as described in any one of the first aspects above.

[0042] In a third aspect, the present application provides a vehicle comprising the thermal management integrated component as described in any one of the first aspects above, or the aforementioned vehicle comprising the thermal management system as described in the second aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figures 1 and 2 are schematic diagrams of the structure of the thermal management integrated component provided in an embodiment of the present application;

[0044] FIG2A is a schematic structural diagram of a refrigerant module provided in an embodiment of the present application;

[0045] 3 to 6 are schematic structural diagrams of the thermal management integrated component provided in embodiments of the present application;

[0046] FIG6A , FIG7 and FIG7A are schematic structural diagrams of a thermal management integrated component provided in an embodiment of the present application;

[0047] 8 and 9 are schematic diagrams of the structure of the thermal management integrated component provided in an embodiment of the present application;

[0048] Figures 10 to 13 are schematic diagrams of layout position relationships provided in embodiments of the present application;

[0049] FIG14 is a schematic diagram of the structure of a thermal management system provided in an embodiment of the present application;

[0050] FIG15 is a schematic structural diagram of a vehicle provided in an embodiment of the present application.

[0051] Reference numerals:

[0052] 00-thermal management integrated component; 01 to 30-interfaces; 100-baseboard; 110-multi-way valve; 111 (including 1111, 1112 and 1113)-water pump; 120-refrigerant module; 121-first heat exchange device; 122-second heat exchange device; 123-refrigerant container; 124-expansion valve. DETAILED DESCRIPTION

[0053] In the embodiment of the present application, "multiple" refers to two or more. In the embodiment of the present application, "and / or" is used to describe the association relationship of associated objects, indicating three relationships that can exist independently. For example, A and / or B can be expressed as follows: A exists alone, B exists alone, or A and B exist at the same time. The description methods such as "at least one of a1, a2, ... and an" used in the embodiment of the present application include the situation where any one of a1, a2, ... and an exists alone, and also include any combination of any multiple of a1, a2, ... and an, each of which can exist alone; for example, the description method of "at least one of a, b and c" includes the situation where a is alone, b is alone, c is alone, a and b combination, a and c combination, b and c combination, or abc combination.

[0054] In this application, the terms "first," "second," and the like are used to distinguish between identical or similar items having substantially the same function or effect. It should be understood that "first," "second," and "nth" do not have a logical or temporal dependency, nor do they limit the quantity or order of execution. It should also be understood that although the following description uses the terms "first," "second," and the like to describe various elements, these elements should not be limited by these terms. These terms are simply used to distinguish one element from another.

[0055] In the various embodiments of the present application, unless otherwise specified or there is a logical conflict, the terms and / or descriptions between the various embodiments are consistent and can be referenced by each other. The technical features in different embodiments can be combined to form new embodiments according to their inherent logical relationships.

[0056] The thermal management integrated component and thermal management system (the thermal management system includes the thermal management integrated component) provided in the embodiment of the present application are applicable to vehicles, and are also applicable to thermal management scenarios with other cooling (heat dissipation) and / or heating requirements. For example, the thermal management integrated component and thermal management system provided in the embodiment of the present application can be applied to electric vehicles. Specifically, the electric vehicle is a vehicle suitable for driving by an electric drive. The electric vehicle can be a pure electric vehicle (pure electric vehicle / battery electric vehicle, pure EV / battery EV), a hybrid electric vehicle (hybrid electric vehicle, HEV), a range extended electric vehicle (REEV), a plug-in hybrid electric vehicle (PHEV) or a new energy vehicle (NEV), etc.

[0057] The thermal management system of the embodiment of the present application can use water to heat or dissipate heat from the managed object. In some possible implementations, the managed object may be a passenger compartment, a battery, an electric drive, and a control system, etc. In the present application, water is used to transfer heat energy. In some possible implementations, the thermal management system of the present application can also use coolants such as water and refrigerants to heat or dissipate heat from the managed object. Among them, the refrigerant can transfer heat through evaporation and condensation. It should be understood that water can also be replaced by other coolants to transfer heat energy, and the embodiment of the present application does not specifically limit this.

[0058] Current thermal management system integration is costly and bulky. Analysis has revealed that the refrigerant substrates used in components for integrated refrigerant systems require high costs due to their manufacturing and processing methods and materials. Furthermore, these refrigerant substrates are too large, occupying a considerable thickness and volume, resulting in a bulky integrated thermal management component. To reduce the cost and volume of thermal management system integration, the present application provides a thermal management integrated component. An exemplary description is provided below.

[0059] For example, in a specific implementation, the thermal management integrated component 00 provided in an embodiment of the present application includes a substrate 100, a multi-way valve 110, a water pump 111, a refrigerant module 120, a first heat exchange device 121, and a second heat exchange device 122. A refrigerant flow channel is provided in the refrigerant module 120. The area of ​​the refrigerant module 120 is smaller than the area of ​​the substrate 100. The substrate 100 includes a first side and a second side, and the orientation of the first side and the orientation of the second side are opposite. The multi-way valve 110 and the water pump 111 are arranged on the first side of the substrate 100. The multi-way valve 110 and the water pump 111 are connected to the coolant flow channel in the substrate 100. The refrigerant module 120, the first heat exchange device 121, and the second heat exchange device 122 are arranged on the second side of the substrate 100; the first heat exchange device 121 and the second heat exchange device 122 are connected to the refrigerant flow channel in the refrigerant module.

[0060] Exemplarily, the refrigerant flow channel is also called a refrigerant channel, and the refrigerant flow channel can replace the air-conditioning pipe in the thermal management system.

[0061] Exemplarily, the coolant flow channel is also called a coolant channel, and the coolant flow channel can replace the water pipe in the thermal management system.

[0062] For example, the substrate 100 may be an injection molded part made of plastic, or a metal substrate made of metal, or a substrate made of other materials, which is not limited in the embodiment of the present application.

[0063] Illustratively, the multi-way valve 110 may be an eight-way valve or a nine-way valve, etc., and the embodiment of the present application does not impose any limitation on this.

[0064] For example, the refrigerant module 120 may be a plate made of metal. For example, in order to achieve high pressure resistance and high airtightness of the refrigerant flow channel to meet the circulation of high-pressure refrigerant, the refrigerant module 120 may be made by a forging process.

[0065] For example, the first heat exchange device 121 may be a heat exchange device such as a condenser. The second heat exchange device 122 may be a heat exchange device such as a cooler. The embodiment of the present application does not limit the specific types and forms of the two heat exchange devices.

[0066] For example, the refrigerant module 120, the first heat exchange device 121 and the second heat exchange device 122 can be integrated on the second side of the base plate 100 by bolt connection, hinge connection, ultrasonic connection or welding, etc., and the embodiment of the present application does not limit this.

[0067] To facilitate understanding of the structure of the thermal management integrated component 00 provided in the embodiment of the present application, the following is an exemplary description with reference to the accompanying drawings. It should be understood that the shapes and sizes of the various components in the drawings shown in the embodiment of the present application are merely illustrative and do not constitute a limitation to the embodiment of the present application.

[0068] In one possible implementation, see Figure 1, which illustrates an exploded structural diagram of a thermal management integrated component 00 provided in an embodiment of the present application. In Figure 1, the water pump 111 may include three water pumps, namely, water pump 1111, water pump 1112, and water pump 1113.

[0069] As can be seen in FIG1 , substrate 100 may include a first side and a second side. The first side of substrate 100 is provided with interfaces 01 to 04. Interface 01 is used to connect a multi-way valve 110 so that multi-way valve 110 communicates with a coolant flow channel provided in substrate 100. Interface 02 is used to connect a water pump 1111 so that water pump 1111 communicates with the coolant flow channel provided in substrate 100. Interface 03 is used to connect a water pump 1112 so that water pump 1112 communicates with the coolant flow channel provided in substrate 100. Interface 04 is used to connect a water pump 1113 so that water pump 1113 communicates with the coolant flow channel provided in substrate 100.

[0070] For example, as shown in FIG1 , the multi-way valve 110, the water pump 1111, the water pump 1112, and the water pump 1113 can be arranged in sequence along the longer side of the first side of the substrate 100. This arrangement can optimize the layout of the coolant flow channels provided in the substrate 100, reduce the staggering of the flow channels, and maximize the use of the area of ​​the substrate 100 to arrange more flow channels, thereby improving the utilization rate of the substrate 100.

[0071] Exemplarily, the first side of the substrate 100 is further provided with interfaces 05, 06, and 07. Interfaces 05, 06, and 07 are connected to the coolant flow channel in the substrate 100 and are also used to connect the circuit in the thermal management system. For example, interface 05 is connected to a water heater (positive temperature coefficient, PTC), and interfaces 06 and 07 are connected to the battery circuit. It will be understood that this is only an example, and the embodiments of the present application do not limit the specific devices connected to interfaces 05, 06, and 07, and the specific connection can be determined based on the design of the actual thermal management circuit.

[0072] For example, the second side of the substrate 100 is provided with interfaces 08, 09, and 10. Interfaces 08, 09, and 10 are connected to the coolant flow path in the substrate 100 and are also used to connect the circuits in the thermal management system. For example, interfaces 08 and 10 are used to connect to the interface of the electric drive module; interface 09 is used to connect to the radiator. It will be understood that this is only an example, and the embodiments of the present application do not limit the specific devices connected by interfaces 08, 09, and 10, and the specific connection can be determined based on the design of the actual thermal management circuit.

[0073] For example, the second side of the substrate 100 may also be provided with other interfaces. For example, see Figure 2, which shows a schematic diagram of an exploded structure located on the second side of the substrate 100. It can be seen that the second side of the substrate 100 may also be provided with interfaces 11 to 14. The interfaces 11 to 14 are connected to the coolant flow channel in the substrate 100. Among them, the interfaces 11 and 12 are also used to connect to the first heat exchange device 121; the interfaces 13 and 14 are also used to connect to the second heat exchange device 122. For ease of understanding, the first heat exchange device 121 and the second heat exchange device 122 shown in Figure 1 are introduced below.

[0074] For example, in FIG1 , the first heat exchange device 121 includes an interface 15 and an interface 16. Of the interfaces 15 and 16, one is the coolant inlet of the first heat exchange device 121, and the other is the coolant outlet of the first heat exchange device 121. Which one is the inlet or outlet depends on actual application requirements and is not limited in this embodiment of the present application. The second heat exchange device 122 includes an interface 17 and an interface 18. Of the interfaces 17 and 18, one is the coolant inlet of the second heat exchange device 122, and the other is the coolant outlet of the second heat exchange device 122. Which one is the inlet or outlet depends on actual application requirements and is not limited in this embodiment of the present application. In conjunction with FIG1 and FIG2 , the interface 11 on the second side of the substrate 100 is connected to the interface 15 of the first heat exchange device 121. The interface 12 on the second side of the substrate 100 is connected to the interface 16 of the first heat exchange device 121. The interface 13 on the second side of the substrate 100 is connected to the interface 17 of the second heat exchange device 122. The interface 14 on the second side of the base plate 100 is connected to the interface 18 of the second heat exchange device 122 .

[0075] Exemplarily, the above-mentioned interface 12 can pass through the through hole in the refrigerant module 120 (not shown in Figures 1 and 2) and connect with the interface 16 of the first heat exchange device 121. Or, exemplarily, the shape of the refrigerant module 120 can also be as shown in Figure 2A. Such a design facilitates the connection between the interface 12 and the interface 16 of the first heat exchange device 121, and can further reduce the area of ​​the refrigerant module 120 to reduce costs. It will be understood that the shape of the refrigerant module 120 introduced here is for illustration only and does not constitute a limitation on the embodiments of the present application. Exemplarily, the shape of the refrigerant module 120 can be a regular polygon or can be any irregular shape. The embodiments of the present application do not limit the specific shape of the refrigerant module 120.

[0076] As can be seen in Figure 1, the first heat exchange device 121 also includes an interface 19 and an interface 20. Interface 19 can be the refrigerant inlet of the first heat exchange device 121, and interface 20 can be the refrigerant outlet of the first heat exchange device 121. For example, interface 19 can be used to connect to a compressor. For example, interface 19 can be used to connect to the outlet of a compressor.

[0077] As can be seen in Figure 1, the second heat exchange device 122 also includes an interface 21 and an interface 22. Interface 21 can be the refrigerant inlet of the second heat exchange device 122, while interface 22 can be the refrigerant outlet of the second heat exchange device 122. For example, interface 22 can be used to connect to a compressor. For example, interface 22 can be used to connect to the inlet of a compressor.

[0078] Exemplarily, the above-mentioned interface 20 and interface 21 are connected to the refrigerant flow channel interface in the refrigerant module 120. For ease of understanding, the refrigerant module 120 shown in Figure 2 is introduced. As can be seen in Figure 2, the refrigerant module 120 is provided with interfaces 23 to 27. The interfaces 23 to 27 are connected to the refrigerant flow channel provided in the refrigerant module 120. The interface 20 of the above-mentioned first heat exchange device 121 can be connected to the interface 23 on the refrigerant module 120. The interface 21 of the above-mentioned second heat exchange device 122 can be connected to the interface 24 on the refrigerant module 120.

[0079] For example, as can be seen in FIG1 above, the interface 19 is arranged on one side of the first heat exchange device 121 (referred to as the first side). The interface 20 and the interface 15 and the interface 16 are arranged on the other side of the first heat exchange device 121 (referred to as the second side). The direction of the second side of the first heat exchange device 121 is opposite to the direction of the first side of the first heat exchange device 121, or the second side of the first heat exchange device 121 is opposite to the first side of the first heat exchange device 121. And the second side of the first heat exchange device 121 can be the side that is in contact with the substrate 100. It can be understood that the refrigerant inlet (i.e., the interface 19) of the first heat exchange device 121 is used to connect to the compressor, and the compressor is not integrated on the refrigerant module 120. Therefore, the interface 19 of the first heat exchange device 121 is not connected to the refrigerant flow channel interface of the refrigerant module 120. Then, the interface 19 is designed on the other side (i.e., the first side of the first heat exchange device 121) to facilitate connection with the compressor, and there is no need to set a flow channel connecting the compressor interface and the interface 19 of the first heat exchange device 121 on the refrigerant module 120, thereby reducing the area of ​​the refrigerant module 120 and reducing costs.

[0080] Similarly, for example, it can be seen in Figure 1 above that the interface 21, the interface 17, and the interface 18 are arranged on one side of the second heat exchange device 122 (referred to as the first side). The interface 22 is arranged on the other side of the second heat exchange device 122 (referred to as the second side). The direction of the second side of the second heat exchange device 122 is opposite to the direction of the first side of the second heat exchange device 122, or in other words, the second side of the second heat exchange device 122 is opposite to the first side of the second heat exchange device 122. And the first side of the second heat exchange device 122 can be the side that is in contact with the substrate 100. It can be understood that the refrigerant outlet (i.e., the interface 22) of the second heat exchange device 122 is used to connect to the compressor, and the compressor is not integrated on the refrigerant module. Therefore, the interface 22 of the second heat exchange device 122 is not connected to the refrigerant flow channel interface of the refrigerant module 120. Then, the interface 22 is designed on the other side (i.e., the second side of the second heat exchange device 122) to facilitate connection with the compressor, and there is no need to set a flow channel connecting the compressor interface and the interface 22 of the second heat exchange device 122 on the refrigerant module 120, thereby reducing the area of ​​the refrigerant module 120 and reducing costs.

[0081] For example, the interface 25 and the interface 26 in the refrigerant module 120 can be used to connect to the refrigerant container 123, and the interface 27 can be used to connect to the expansion valve 124. For ease of understanding, please refer to Figures 3 and 4. As can be seen in Figure 3, the refrigerant container 123 is provided with an interface 28 and an interface 29. Of the interface 28 and the interface 29, one is the refrigerant inlet of the refrigerant container 123, and the other is the refrigerant outlet of the refrigerant container 123. Which one is the inlet or outlet is determined according to actual application requirements, and the embodiments of the present application do not limit this. The expansion valve 124 is provided with an interface 30. As shown in Figure 4, the interface 28 of the refrigerant container 123 is connected to the interface 25 on the refrigerant module 120. The interface 29 of the refrigerant container 123 is connected to the interface 26 on the refrigerant module 120. The interface 30 of the expansion valve 124 is connected to the interface 27 on the refrigerant module 120.

[0082] In one possible implementation, the refrigerant container and / or the expansion valve may be integrated into the refrigerant module 120. In this case, the interface 28 is directly connected to the interface 25; the interface 29 is directly connected to the interface 26; and the interface 30 is directly connected to the interface 27. Alternatively, in another possible implementation, the refrigerant container and / or the expansion valve may not be integrated into the refrigerant module 120. In this case, the interface 28 is connected to the interface 25 through a pipeline; the interface 29 is connected to the interface 26 through a pipeline; and the interface 30 is connected to the interface 27 through a pipeline. It will be understood that this is merely an example and does not constitute a limitation to the embodiments of the present application.

[0083] For example, the refrigerant container 123 may be a liquid storage tank, and its shape may be cylindrical, cubic, or any other shape, which is not limited in the present embodiment.

[0084] For example, it can be seen in FIG1 above that the area of ​​the refrigerant module 120 is much smaller than the area of ​​the substrate 100. For example, the area ratio of the refrigerant module 120 to the area of ​​the substrate 100 can be between 30% and 70%. In order to meet the circulation of high-pressure refrigerant, the materials used for the refrigerant module (the metal used also needs to have high pressure resistance) and the production cost are relatively high. Therefore, in the embodiment of the present application, the refrigerant flow channel is concentrated in the refrigerant module 120 with a smaller area, which can effectively save costs. And since the refrigerant module 120 is metal, reducing the area of ​​the refrigerant module 120 can also reduce the overall weight of the thermal management integrated component.

[0085] In one possible implementation, to facilitate an understanding of the overall appearance of the thermal management integrated component 00 provided in the embodiments of the present application, reference may be made to Figures 5 and 6 for example. Figures 5 and 6 illustrate an example in which the refrigerant container 123 and the expansion valve 124 are integrated into the refrigerant module 120. Figure 5 illustrates the overall appearance of the thermal management integrated component 00 as viewed from a first side of the substrate 100 after the various components are integrated into the substrate 100. Figure 6 illustrates the overall appearance of the thermal management integrated component 00 as viewed from a second side of the substrate 100 after the various components are integrated into the substrate 100. It should be understood that Figures 5 and 6 are merely examples and constitute limitations on the embodiments of the present application. For example, in the thermal management integrated component 00 shown in Figures 5 and 6, other components (such as a shut-off valve (SOV), a three-way valve, or a compressor, etc.) may also be integrated into the substrate 100, but this is not a limitation of the embodiments of the present application. For example, as shown in Figure 6A , a shut-off valve 125 may also be integrated into the refrigerant module 120. The stop valve 125 is connected to the refrigerant flow channel in the refrigerant module 120 through a refrigerant flow channel interface provided on the refrigerant module 120. For example, the stop valve can also be called a throttle valve, etc., which is not limited in the embodiment of the present application.

[0086] For example, as can be seen in Figure 6 above, the refrigerant container 123 and the expansion valve 124 are located between the first heat exchanger 121 and the second heat exchanger 122. For example, in a specific thermal management refrigerant circuit, the refrigerant is pushed into the first heat exchanger 121 by the compressor. After heat exchange, it flows from the first heat exchanger 121 to the refrigerant container 123. The refrigerant then flows from the refrigerant container 123 to the expansion valve 124, and then flows through the expansion valve 124 to the second heat exchanger 122. After heat exchange, the refrigerant flows out of the second heat exchanger 122 and back to the compressor, forming a refrigerant circuit. Based on this, the embodiment of the present application arranges the refrigerant container 123 and the expansion valve between the first heat exchanger 121 and the second heat exchanger 122, which can save the length of the refrigerant flow path. This can also reduce the area of ​​the refrigerant module 120, further reducing the cost and weight of the thermal management integrated component 00.

[0087] For example, in FIG6 , the refrigerant container 123 is arranged perpendicular to the substrate 100 (and also perpendicular to the refrigerant module 120). Specifically, it is assumed that the side of the refrigerant container 123 where the above-mentioned interface 28 and interface 29 are provided is the first side, and the side opposite to the first side is the second side, that is, the bottom of the refrigerant container is the second side. Then the direction from the second side of the refrigerant container 123 to the first side of the refrigerant container 123 is perpendicular to the refrigerant module. And the interface 28 and the interface 29 are directly connected to the interface 25 and the interface 26 on the refrigerant module 120 respectively. The tank body of the refrigerant container 123 is perpendicular to the refrigerant module 120, which can reduce the impact on the refrigerant circuit caused by the inability to provide refrigerant normally when there is less refrigerant in the tank body. On the other hand, the tank body is perpendicular to the refrigerant module, and it is also convenient to increase the refrigerant capacity by replacing a longer tank body.

[0088] For example, in another possible implementation, the refrigerant container 123 can also be arranged horizontally on the refrigerant module 120. Specifically, the direction from the second side of the refrigerant container 123 to the first side of the refrigerant container 123 is parallel to the refrigerant module 120. For ease of understanding, please refer to Figures 7 and 7A for example. Figures 7 and 7A show schematic diagrams of the refrigerant container 123 being arranged horizontally on the refrigerant module 120. The difference between Figures 7 and 7A is that the positions of the refrigerant inlet and outlet on the refrigerant container 123 are different. Under this arrangement, the interface 25 and the interface 28, as well as the interface 26 and the interface 29 can be connected through a shorter pipe or by welding. For example, the setting position of the interface 25 and the interface 26 on the refrigerant module 120 can be adaptively changed according to the placement position of the refrigerant container 123, and this embodiment of the present application does not limit this. Placing the refrigerant container 123 horizontally on the refrigerant module 120 can further reduce the thickness of the thermal management integrated component 00.

[0089] By way of example, the above-mentioned Figures 1 to 7 are only schematic diagrams of embodiments of the present application. The specific shape and size of each device are shown schematically, and the shape and size of each interface are also shown schematically. The shape and size of the substrate 100 are also shown schematically. The substrate 100 can be any regular square, oval or irregular shape, and the embodiments of the present application do not limit this. By way of example, in a possible implementation, if the substrate 100 is of other shapes, the layout positions of the various interfaces and various devices provided on the substrate can be adaptively adjusted. For ease of understanding, please refer to Figures 8 and 9 for example. The shape of the substrate 100 shown in Figures 8 and 9 is different from the shape of the substrate 100 shown in Figures 1 and 2 above.

[0090] For example, FIG8 shows an exploded view of the thermal management integrated component 00 as viewed from the first side of the substrate 100. FIG9 shows an exploded view of the thermal management integrated component 00 as viewed from the second side of the substrate 100. As can be seen in FIG8 and FIG9 , the shape and size of the substrate 100 differ from those shown in FIG1 and FIG2 ; the layout of the devices disposed on the substrate 100 also differs from the layout shown in FIG1 and FIG2 .

[0091] For example, as shown in Figure 8, the multi-way valve 110, water pump 111, water pump 112 and water pump 113 are still arranged on the first side of the substrate 100. However, compared to the above-mentioned Figure 1, the relative position layout between the multi-way valve 110, water pump 111, water pump 112 and water pump 113 has changed. For example, the multi-way valve 110, water pump 111, water pump 112 and water pump 113 are respectively arranged at the four corners of the substrate 100, etc. This adaptive adjustment of the position layout is to reduce the interlacing of the refrigerant flow channels in the substrate 100, so as to make full use of the area of ​​the substrate 100 to layout more flow channels and improve the utilization rate of the substrate 100. Regarding the first side of the substrate 100, the connection relationship between the multi-way valve 110, water pump 111, water pump 112 and water pump 113 and the interface on the substrate 100 can be referred to the relevant introduction of Figure 1 above, which will not be repeated here.

[0092] For example, as shown in FIG9 , the refrigerant module 120, the first heat exchange device 121, and the second heat exchange device 122 are still arranged on the second side of the substrate 100. However, compared to FIG2 , the relative position layout between the refrigerant module 120, the first heat exchange device 121, and the second heat exchange device 122 has changed. For example, in FIG2 , the refrigerant module 120 is arranged in the middle area of ​​the second side of the substrate 100, and the first heat exchange device 121 and the second heat exchange device 122 are respectively arranged on the two side areas of the second side of the substrate 100, with the first heat exchange device 121 and the second heat exchange device 122 sandwiching the refrigerant module 120. In FIG9 , the refrigerant module 120 is arranged on one side of the second side of the substrate 100, and the first heat exchange device 121 and the second heat exchange device 122 are arranged on the other side of the second side of the substrate 100, with the first heat exchange device 121 and the second heat exchange device 122 being located side by side on the same side of the refrigerant module 120 (referred to as the first side). As an example, refrigerant module 120 is further provided with a refrigerant container 123 and an expansion valve 124. These refrigerant container 123 and expansion valve 124 are located on a side opposite the first side. Refrigerant container 123 is positioned near first heat exchanger 121, while expansion valve 124 is positioned near second heat exchanger 122. This arrangement allows for a shorter refrigerant transfer path.

[0093] It should be understood that the above-mentioned Figures 8 and 9 are merely examples and do not constitute a limitation to the embodiments of the present application.

[0094] In one possible implementation, the layout positions of the various components on the second side of the substrate 100 are not limited to the layout positions shown in FIG. 2 (or FIG. 4 ) or FIG. 9 , but may also be other layout positions. For example, see FIG. 10 to FIG. 13 for examples. FIG. 10 is a plan view of the second side of the substrate 100 in the thermal management integrated component 00 shown in FIG. 4 . FIG. 11 is a plan view of the second side of the substrate 100 in the thermal management integrated component 00 shown in FIG. 9 . The plan view diagrams shown in FIG. 10 and FIG. 11 exemplarily illustrate the layout position relationship of the refrigerant module 120, the first heat exchange device 121, the second heat exchange device 122, the refrigerant container 123, and the expansion valve 124 integrated on the second side of the substrate 100. In another possible implementation, the layout position relationship of the various components integrated on the second side of the substrate 100 may also be shown in FIG. 12 or FIG. 13 , for example.

[0095] 12 , the long sides of the first heat exchange device 121 and the second heat exchange device 122 can be arranged perpendicular to the long side direction of the base plate 100. The refrigerant module 120 is arranged in the middle area of ​​the second side of the base plate 100, and the refrigerant container 123 and the expansion valve 124 integrated in the refrigerant module 120 are arranged between the first heat exchange device 121 and the second heat exchange device 122.

[0096] For example, in FIG13 , the layout position relationship of the refrigerant module 120, the first heat exchange device 121, the second heat exchange device 122, the refrigerant container 123, and the expansion valve 124 forms a mirror image relationship with the layout position relationship shown in FIG11 above. That is, in FIG13 , the refrigerant module 120 is arranged on one side of the second side of the substrate 100, the first heat exchange device 121 and the second heat exchange device 122 are arranged on the other side of the second side of the substrate 100, and the first heat exchange device 121 and the second heat exchange device 122 are located side by side on the same side of the refrigerant module 120 (referred to as the first side). As an example, a refrigerant container 123 and an expansion valve 124 are also provided on the refrigerant module 120, and the refrigerant container 123 and the expansion valve 124 are located on the other side opposite to the first side. The refrigerant container 123 is arranged close to the first heat exchange device 121, and the expansion valve 124 is arranged close to the second heat exchange device 122.

[0097] For example, in the layout position relationship shown in Figures 10 to 13 above, the refrigerant container 123 is arranged close to the refrigerant outlet of the first thermal management device 121, and the expansion valve 124 is arranged close to the refrigerant inlet of the second heat exchange device 122, and the refrigerant container 123 and the expansion valve 124 are also arranged as close together as possible, so that the length of the refrigerant flow channel can be greatly shortened, and the area of ​​the refrigerant module 120 can be greatly reduced.

[0098] In summary, in the embodiment of the present application, the refrigerant flow channel in the refrigerant substrate is concentrated onto a refrigerant module with a smaller area, and then the two heat exchange devices originally set on the refrigerant substrate are directly set together with the refrigerant module on the substrate with integrated coolant flow channel, thereby reducing the height of the refrigerant substrate; and the refrigerant substrate is made of high-pressure metal material, and the material and production costs are very high, while the refrigerant module is much smaller than the original refrigerant substrate. In addition to saving material and production costs, it also reduces weight. Based on this, this solution greatly improves the integration of the thermal management integrated component, reduces the volume and weight of the thermal management integrated component as a whole, and reduces the occupied space.

[0099] The present application also provides a thermal management system, as shown in FIG14 . Thermal management system 1400 may include a thermal management integrated component 1401. Thermal management integrated component 1401 may be, for example, any of the possible embodiments described above. For details, please refer to the preceding description and will not be repeated here.

[0100] The present application also provides a vehicle, as shown in FIG15 . Vehicle 1500 may include a thermal management integrated component 1501. Thermal management integrated component 1501 may be, for example, any of the possible embodiments described above. For details, please refer to the preceding description and will not be repeated here.

[0101] It should be understood that in the various embodiments of the present application, the size of the serial number of each process does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0102] It will also be understood that the term “comprise” (also known as “includes,” “including,” “comprises,” and / or “comprising”) when used in this specification specifies the presence of stated features, integers, steps, operations, elements, and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0103] It should also be understood that references throughout this specification to "one embodiment," "an embodiment," or "one possible implementation" mean that specific features, structures, or characteristics associated with that embodiment or implementation are included in at least one embodiment of the present application. Therefore, the appearance of "in one embodiment," "in an embodiment," or "one possible implementation" throughout this specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0104] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A thermal management integrated component, characterized in that: The thermal management integrated component includes a substrate, a refrigerant module, a first heat exchange device, a second heat exchange device, a multi-way valve and a water pump; The refrigerant module is provided with a refrigerant flow channel; the area of ​​the refrigerant module is smaller than the area of ​​the substrate; The substrate comprises a first side and a second side, wherein the first side is oriented in opposite directions to the second side; The multi-way valve and the water pump are arranged on the first side of the substrate, and the multi-way valve and the water pump are in communication with a coolant flow channel in the substrate; The refrigerant module, the first heat exchange device and the second heat exchange device are arranged on the second side of the substrate; the first heat exchange device and the second heat exchange device are in communication with a refrigerant flow channel in the refrigerant module.

2. The thermal management integrated component according to claim 1, characterized in that: The ratio of the area of ​​the refrigerant module to the area of ​​the substrate is between 30% and 70%.

3. The thermal management integrated component according to claim 1, characterized in that: The water pump comprises a first water pump, a second water pump and a third water pump; the multi-way valve, the first water pump, the second water pump and the third water pump are arranged in sequence along the longer side of the first side of the substrate.

4. The thermal management integrated component according to any one of claims 1 to 3, characterized in that: The refrigerant module is provided with a first refrigerant flow channel interface; The first heat exchange device comprises a first refrigerant inlet and a first refrigerant outlet; the first refrigerant inlet is located at a first side of the first heat exchange device, and the first refrigerant outlet is located at a second side opposite to the first side of the first heat exchange device; The first refrigerant inlet is used to communicate with the compressor; the first refrigerant outlet is connected to the first refrigerant flow channel interface.

5. The thermal management integrated component according to claim 4, characterized in that: The first heat exchange device comprises a first coolant inlet and a first coolant outlet; the first coolant inlet and the first coolant outlet are located on the second side of the first heat exchange device; A first coolant flow channel interface and a second coolant flow channel interface are provided on the second side of the substrate; The first coolant inlet is connected to the first coolant channel interface, and the first coolant outlet is connected to the second coolant channel interface.

6. The thermal management integrated component according to any one of claims 1 to 5, characterized in that: The refrigerant module is provided with a second refrigerant flow channel interface; The second heat exchange device comprises a second refrigerant inlet and a second refrigerant outlet; the second refrigerant inlet is located at a first side of the second heat exchange device, and the second refrigerant outlet is located at a second side opposite to the first side of the second heat exchange device; The second refrigerant inlet is connected to the second refrigerant flow channel interface; the second refrigerant outlet is used to communicate with the compressor.

7. The thermal management integrated component according to claim 6, characterized in that: The second heat exchange device comprises a second coolant inlet and a second coolant outlet; the second coolant inlet and the second coolant outlet are located on a first side of the second heat exchange device; A third coolant flow channel interface and a fourth coolant flow channel interface are provided on the second side of the substrate; The second coolant inlet is connected to the third coolant flow channel interface, and the second coolant outlet is connected to the fourth coolant flow channel interface.

8. The thermal management integrated component according to any one of claims 1 to 7, characterized in that: The thermal management integrated component further includes a refrigerant container; the refrigerant module is provided with a third refrigerant flow channel interface and a fourth refrigerant flow channel interface; The refrigerant container is integrated on the refrigerant module and is connected to the refrigerant flow channel in the refrigerant module through the third refrigerant flow channel interface and the fourth refrigerant flow channel interface; the refrigerant container is located between the first heat exchange device and the second heat exchange device.

9. The thermal management integrated component according to claim 8, characterized in that: The refrigerant container comprises a first side and a second side, and the first side of the refrigerant container is oriented in opposite directions to the second side of the refrigerant container; A third refrigerant inlet and a third refrigerant outlet are provided on the first side of the refrigerant container, the third refrigerant inlet is connected to the third refrigerant flow channel interface in the refrigerant module, and the third refrigerant outlet is connected to the fourth refrigerant flow channel interface in the refrigerant module; The second side of the refrigerant container is the bottom of the refrigerant container, and the direction from the second side of the refrigerant container to the first side of the refrigerant container is perpendicular to the refrigerant module; or, A direction from the second side of the refrigerant container to the first side of the refrigerant container is parallel to the refrigerant module.

10. The thermal management integrated component according to any one of claims 1 to 9, characterized in that: The thermal management integrated component further includes an expansion valve; a fifth refrigerant flow channel interface is provided in the refrigerant module; the expansion valve is integrated on the refrigerant module and communicates with the refrigerant flow channel in the refrigerant module through the fifth refrigerant flow channel interface; and / or, The thermal management integrated component also includes a stop valve; a sixth refrigerant flow channel interface is provided in the refrigerant module; the stop valve is integrated on the refrigerant module and communicates with the refrigerant flow channel in the refrigerant module through the sixth refrigerant flow channel interface.

11. A thermal management system, characterized in that: The thermal management system comprises the thermal management integrated component according to any one of claims 1-10.

12. A vehicle, characterized in that: The vehicle comprises the thermal management integrated component according to any one of claims 1 to 10 , or the vehicle comprises the thermal management system according to claim 11 .

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