Thermal management integrated component, thermal management system and vehicle

Abstract

A thermal management integrated component, a thermal management system and a vehicle. The thermal management integrated component comprises a frame and a refrigerant module, wherein a refrigerant flow channel is provided in the refrigerant module; the frame comprises a plate-shaped region and a hollowed-out region, and the area of the plate-shaped region is less than or equal to the area of the hollowed-out region; the refrigerant module is fixed in the plate-shaped region, and the area of the refrigerant module is less than or equal to the area of the plate-shaped region; and the frame is further used for integrating with a substrate, and the substrate is internally provided with a cooling liquid flow channel. By using the solution of the present application, the cost of integration of a thermal management system can be reduced.

Description

Thermal management of integrated components, systems and vehicles

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on November 30, 2023, with application number 202311636995.6, and priority to the Chinese patent application entitled “Thermal Management Integrated Components, Systems and Vehicles”, all contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of thermal management technology, and in particular, to a thermal management integrated component, system and vehicle. Background Art

[0003] With the continuous development of vehicles, the integration of vehicle thermal management systems has become a trend to improve production and assembly efficiency, facilitate quality control, and reduce the space occupied by thermal management systems. However, the current cost of implementing thermal management system integration is high, and reducing the cost of thermal management system integration has become an urgent issue. Summary of the Invention

[0004] The present application provides a thermal management integrated component, system and vehicle, which can reduce the cost of thermal management system integration.

[0005] In a first aspect, the present application provides a thermal management integrated component, the thermal management integrated component comprising a frame and a refrigerant module;

[0006] The aforementioned refrigerant module is provided with a refrigerant flow channel;

[0007] The frame includes a plate-shaped region and a hollow region, and the area of ​​the plate-shaped region is smaller than or equal to the area of ​​the hollow region;

[0008] The refrigerant module is fixed on the plate-shaped region, and the area of ​​the refrigerant module is smaller than or equal to the area of ​​the plate-shaped region;

[0009] The frame is also used to be integrated with a base plate, and a cooling liquid flow channel is provided in the base plate.

[0010] In this solution, the high-pressure refrigerant flow channels in the refrigerant base are concentrated onto a smaller refrigerant module, which is then directly fixed to a largely hollow frame, reducing the frame's material costs. The frame also serves as a mounting fixture, eliminating the need for expensive, high-pressure metal materials. Furthermore, the refrigerant module, made of high-pressure metal, is significantly smaller than the original refrigerant base, saving material and manufacturing costs while also reducing weight.

[0011] In a possible implementation manner, the refrigerant module is manufactured by a forging process, and the frame is manufactured by a die-casting or sheet metal processing process.

[0012] In the above solution, the refrigerant module is made by forging to withstand the flow of high-pressure refrigerant, while the frame is made by die-casting or sheet metal to reduce the production cost.

[0013] In a possible implementation manner, the ratio of the area of ​​the refrigerant module to the area of ​​the frame is between 30% and 50%.

[0014] In the above solution, the area ratio of the refrigerant module and the frame is within this area ratio range, which can minimize the cost of the refrigerant module and ensure that the number of refrigerant flow channels that meet the requirements can be set in the refrigerant module, that is, taking into account both cost and function.

[0015] In a possible implementation manner, a ratio of the thickness of the refrigerant module to the thickness of the frame is between 50% and 100%.

[0016] In the above solution, the thickness ratio of the refrigerant module to the frame is within this thickness ratio range, which can minimize the material cost of the refrigerant module and ensure that the cross-sectional size of the refrigerant flow channel set in the refrigerant module meets the flow requirements, that is, taking into account both cost and function.

[0017] In one possible embodiment, the substrate includes a first layer and a second layer, the second layer is stacked on the first layer, and the area of ​​the second layer is smaller than that of the first layer; cooling liquid flow channels are provided in both the first layer and the second layer; and the second layer is embedded in the hollow area.

[0018] In this solution, the substrate and frame are nested in a pattern of raised and hollowed-out panels, reducing the overall thickness of the integrated substrate and frame, thereby reducing the overall thickness and volume of the thermal management integrated component. Furthermore, the substrate is designed as a two-layer structure, with coolant flow channels also provided in the second layer to meet the required coolant flow channel layout. This avoids the need to place all flow channels in the first layer, which would result in an excessively large area of ​​the first layer, thereby reducing the length or width of the first layer.

[0019] In one possible embodiment, the refrigerant module is provided with a first refrigerant flow channel interface; the frame is also used to fix the first heat exchange device;

[0020] The first heat exchange device includes a first refrigerant inlet and a first refrigerant outlet; the first refrigerant inlet is located on a first side of the first heat exchange device, and the first refrigerant outlet is located on a second side opposite to the first side of the first heat exchange device;

[0021] The first refrigerant inlet is used to communicate with the compressor; the first refrigerant outlet is connected to the first refrigerant flow channel interface.

[0022] In the above scheme, the refrigerant inlet of the first heat exchange device is used to connect to the compressor, and the compressor is not integrated on the refrigerant module. Therefore, the refrigerant inlet of the first heat exchange device is not connected to the refrigerant flow channel interface of the refrigerant module, but is designed on the other side to facilitate connection with the compressor. Therefore, there is no need to set a flow channel on the refrigerant module connecting the refrigerant outlet of the compressor and the refrigerant inlet of the first heat exchange device, thereby reducing the area of ​​the refrigerant module and reducing costs.

[0023] In one possible embodiment, the first heat exchange device includes a first coolant inlet and a first coolant outlet; the first coolant inlet and the first coolant outlet are located on the second side of the first heat exchange device;

[0024] A first cooling liquid flow channel interface and a second cooling liquid flow channel interface are provided on the aforementioned substrate, and the aforementioned hollow area includes a first area;

[0025] The first coolant flow channel interface passes through the first area and is connected to the first coolant inlet;

[0026] The second coolant flow channel interface passes through the first area and is connected to the first coolant outlet, or the second coolant flow channel interface passes through a through hole on the plate-shaped area and is connected to the first coolant outlet.

[0027] In the above solution, the coolant flow channel interface of the substrate passes through the hollow area of ​​the frame and is directly connected to the coolant inlet and outlet of the first heat exchange device, and the refrigerant flow channel interface of the refrigerant module is directly connected to the refrigerant outlet of the first heat exchange device, without the need for pipelines or other flow channel transfers, reducing the transfer sealing interface and reducing the flow resistance caused by pipeline transfers.

[0028] In one possible embodiment, the refrigerant module is provided with a second refrigerant flow channel interface; the frame is also used to fix the second heat exchange device;

[0029] The second heat exchange device includes a second refrigerant inlet and a second refrigerant outlet; the second refrigerant inlet is located on a first side of the second heat exchange device, and the second refrigerant outlet is located on a second side opposite to the first side of the second heat exchange device;

[0030] The second refrigerant inlet is connected to the second refrigerant flow channel interface; the second refrigerant outlet is used to communicate with the compressor.

[0031] In the above scheme, the refrigerant outlet of the second heat exchange device is used to connect to the compressor, and the compressor is not integrated on the refrigerant module. Therefore, the refrigerant outlet of the second heat exchange device is not connected to the refrigerant flow channel interface of the refrigerant module, but is designed on the other side to facilitate connection with the compressor. Therefore, there is no need to set a flow channel on the refrigerant module to connect the refrigerant inlet of the compressor and the refrigerant outlet of the second heat exchange device, thereby reducing the area of ​​the refrigerant module and reducing costs.

[0032] In one possible embodiment, the second heat exchange device includes a second coolant inlet and a second coolant outlet; the second coolant inlet and the second coolant outlet are located on a first side of the second heat exchange device;

[0033] The substrate is provided with a third coolant flow channel interface and a fourth coolant flow channel interface, and the hollow area includes the second area;

[0034] The third coolant flow channel interface passes through the second area and is connected to the second coolant inlet. The fourth coolant flow channel interface passes through the second area and is connected to the first coolant outlet.

[0035] In the above solution, the coolant flow channel interface of the substrate passes through the hollow area of ​​the refrigerant frame and is directly connected to the coolant inlet and outlet of the second heat exchange device, and the refrigerant flow channel interface of the refrigerant module is directly connected to the refrigerant outlet of the second heat exchange device, without the need for pipelines or other flow channel transfers, reducing the transfer sealing interface and reducing the flow resistance caused by pipeline transfers.

[0036] In one possible embodiment, a third refrigerant flow channel interface and a fourth refrigerant flow channel interface are provided in the aforementioned refrigerant module; the refrigerant container is integrated on the aforementioned refrigerant module and is connected to the refrigerant flow channel in the aforementioned refrigerant module through the aforementioned third refrigerant flow channel interface and the aforementioned fourth refrigerant flow channel interface.

[0037] In the above solution, a refrigerant container can also be integrated on the refrigerant module to improve the integration level and reduce the refrigerant transmission path.

[0038] In one possible embodiment, the refrigerant container includes a first side and a second side, and the first side of the refrigerant container is oriented in opposite directions to the second side of the refrigerant container.

[0039] A third refrigerant inlet and a third refrigerant outlet are provided on the first side of the refrigerant container. The third refrigerant inlet is connected to the third refrigerant flow channel interface in the refrigerant module, and the third refrigerant outlet is connected to the fourth refrigerant flow channel interface in the refrigerant module.

[0040] The second side of the refrigerant container is the bottom of the refrigerant container, and the direction from the second side of the refrigerant container to the first side of the refrigerant container is perpendicular to the refrigerant module; or,

[0041] A direction from the second side of the refrigerant container to the first side of the refrigerant container is parallel to the refrigerant module.

[0042] In this solution, the refrigerant container is perpendicular to the refrigerant module, minimizing the impact on the refrigerant circuit caused by insufficient refrigerant in the tank. Furthermore, this arrangement facilitates increasing refrigerant capacity by replacing the tank with a longer one. Furthermore, the refrigerant container can be placed parallel to the refrigerant module, providing flexibility in layout.

[0043] In a possible implementation, the refrigerant module is provided with a fifth refrigerant flow channel interface;

[0044] The expansion valve is integrated on the aforementioned refrigerant module and communicates with the refrigerant flow channel in the aforementioned refrigerant module through the aforementioned fifth refrigerant flow channel interface.

[0045] In the above solution, an expansion valve can also be integrated on the refrigerant module to improve the integration level.

[0046] In a possible embodiment, the frame is disposed on the first side of the substrate, and the second side of the substrate is oriented opposite to the first side of the substrate.

[0047] A multi-way valve, a first water pump, a second water pump and a third water pump are sequentially arranged along the longer side of the second side of the substrate.

[0048] In the above scheme, because the multi-way valve and the water pump are both connected to the coolant flow channel in the substrate, this arrangement can optimize the layout of the coolant flow channel set in the substrate, reduce the staggered flow channels, and make full use of the area of ​​the substrate to layout more flow channels, thereby improving the utilization rate of the substrate.

[0049] In a second aspect, the present application provides a thermal management system, which includes the thermal management integrated component as described in any one of the first aspects above.

[0050] In a third aspect, the present application provides a vehicle comprising the thermal management integrated component as described in any one of the first aspects above, or the aforementioned vehicle comprising the thermal management system as described in the second aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] FIG1 is a schematic structural diagram of a substrate module for an integrated thermal management system;

[0052] 2 to 12 are schematic structural diagrams of thermal management integrated components provided in embodiments of the present application;

[0053] 12A, 13 and 13A are schematic structural diagrams of a thermal management integrated component provided in an embodiment of the present application;

[0054] 14 and 15 are schematic structural diagrams of the thermal management integrated component provided in an embodiment of the present application;

[0055] Figures 16 to 19 are schematic diagrams of layout position relationships provided in embodiments of the present application;

[0056] FIG20 is a schematic diagram of the structure of a thermal management system provided in an embodiment of the present application;

[0057] Figure 21 is a schematic structural diagram of the vehicle provided in an embodiment of the present application.

[0058] Figure markings: 00 - thermal management integrated component; 01 to 30 - interfaces; 100 - substrate; 101 - first layer of substrate; 102 - second layer of substrate; 1021 - first sublayer of the second layer of substrate; 1022 - second sublayer of the second layer of substrate; 200 - frame; 201 - plate-shaped area of ​​frame 200; 202 - hollow area of ​​frame 200; 110 - multi-way valve 110; 111 (including 1111, 1112 and 1113) - water pump; 120 - refrigerant module; 121 - first heat exchange device; 122 - second heat exchange device; 123 - refrigerant container; 124 - expansion valve. DETAILED DESCRIPTION

[0059] In the embodiment of the present application, "multiple" refers to two or more. In the embodiment of the present application, "and / or" is used to describe the association relationship of associated objects, indicating three relationships that can exist independently. For example, A and / or B can be expressed as follows: A exists alone, B exists alone, or A and B exist at the same time. The description methods such as "at least one of a1, a2, ... and an" used in the embodiment of the present application include the situation where any one of a1, a2, ... and an exists alone, and also include any combination of any multiple of a1, a2, ... and an, each of which can exist alone; for example, the description method of "at least one of a, b and c" includes the situation where a is alone, b is alone, c is alone, a and b combination, a and c combination, b and c combination, or abc combination.

[0060] In this application, the terms "first," "second," and the like are used to distinguish between identical or similar items having substantially the same function or effect. It should be understood that "first," "second," and "nth" do not have a logical or temporal dependency, nor do they limit the quantity or order of execution. It should also be understood that although the following description uses the terms "first," "second," and the like to describe various elements, these elements should not be limited by these terms. These terms are simply used to distinguish one element from another.

[0061] In the various embodiments of the present application, unless otherwise specified or there is a logical conflict, the terms and / or descriptions between the various embodiments are consistent and can be referenced by each other. The technical features in different embodiments can be combined to form new embodiments according to their inherent logical relationships.

[0062] The thermal management integrated component and thermal management system (the thermal management system includes the thermal management integrated component) provided in the embodiment of the present application are applicable to vehicles, and are also applicable to thermal management scenarios with other cooling (heat dissipation) and / or heating requirements. For example, the thermal management integrated component and thermal management system provided in the embodiment of the present application can be applied to electric vehicles. Specifically, the electric vehicle is a vehicle suitable for driving by an electric drive. The electric vehicle can be a pure electric vehicle (pure electric vehicle / battery electric vehicle, pure EV / battery EV), a hybrid electric vehicle (hybrid electric vehicle, HEV), a range extended electric vehicle (REEV), a plug-in hybrid electric vehicle (PHEV) or a new energy vehicle (NEV), etc.

[0063] The thermal management system of the embodiment of the present application can use water to heat or dissipate heat from the managed object. In some possible implementations, the managed object may be a passenger compartment, a battery, an electric drive, and a control system, etc. In the present application, water is used to transfer heat energy. In some possible implementations, the thermal management system of the present application can also use coolants such as water and refrigerants to heat or dissipate heat from the managed object. Among them, the refrigerant can transfer heat through evaporation and condensation. It should be understood that water can also be replaced by other coolants to transfer heat energy, and the embodiment of the present application does not specifically limit this.

[0064] The current cost of integrating thermal management systems is high. To reduce this cost, we have analyzed the refrigerant substrates used in components integrated with refrigerant systems and found that their manufacturing, processing, and materials require significant cost. For easier understanding, please first refer to Figure 1. Figure 1 shows a schematic diagram of the structure of a substrate module for an integrated thermal management system.

[0065] As can be seen in Figure 1, the substrate module includes a water channel substrate (also known as a coolant substrate) and a refrigerant substrate. The water channel substrate can be integrated with thermal management devices of the coolant system, such as thermal management devices such as water pumps and multi-way valves. In addition, illustratively, a coolant flow channel (or coolant channel) is also arranged in the water channel substrate. The coolant flow channel can replace the water pipe in the thermal management system. The refrigerant substrate can be integrated with thermal management devices of the refrigerant system. For example, thermal management devices such as condensers and coolers are integrated on the refrigerant substrate. A refrigerant flow channel (or refrigerant channel) is also arranged in the refrigerant substrate. The refrigerant flow channel can replace the air-conditioning pipe in the thermal management system. The refrigerant flow channel can connect devices such as the condenser and cooler integrated on the refrigerant substrate.

[0066] In practice, the refrigerant flow channels in the refrigerant baseplate carry high-pressure refrigerant. To withstand this high pressure, the baseplate must be made of high-strength metal (such as aluminum alloy) and forged. However, the high-strength metal and forging process are both expensive, increasing the cost of integrating the thermal management system.

[0067] In order to reduce the cost of thermal management system integration, an embodiment of the present application provides a thermal management integrated component 00. The thermal management integrated component 00 includes a frame 200 and a refrigerant module 120. The refrigerant module 120 is provided with a refrigerant flow channel. The frame 200 includes a plate-shaped area 201 and a hollow area 202, and the area of ​​the plate-shaped area 201 is less than or equal to the area of ​​the hollow area 202. The refrigerant module 120 is fixed on the plate-shaped area 201, and the area of ​​the refrigerant module 120 is less than or equal to the area of ​​the plate-shaped area 201. The frame 200 is also used for integration with the substrate 100. A coolant flow channel is provided in the substrate 100. For ease of understanding, the following is an exemplary introduction with reference to the accompanying drawings. It can be understood that the shapes of the various devices in the drawings shown in the embodiments of the present application are only schematic and do not constitute a limitation to the embodiments of the present application.

[0068] In a possible implementation, please refer to FIG2 , which exemplarily shows an exploded structural diagram of a thermal management integrated component 00 provided in an embodiment of the present application.

[0069] As can be seen in FIG. 2 , the thermal management integrated component 00 may include a base plate 100 , a frame 200 and a refrigerant module 120 .

[0070] Exemplarily, the substrate 100 is a water channel substrate, in which a coolant flow channel is provided. As shown in Figure 2, the substrate 100 may include a first side and a second side. The orientation of the first side and the orientation of the second side are opposite to each other. Among them, the first side of the substrate 100 is provided with interfaces 05 to 07. The second side of the substrate 100 is provided with interfaces 08 to 14. For an introduction to interfaces 05 to 14, please refer to the relevant description of Figures 7 and 8 below, which will not be described in detail here. Exemplarily, the substrate 100 can be, for example, an injection molded part made of plastic, or can be a metal substrate made of metal, or can be a substrate made of other materials, and the embodiments of the present application do not limit this.

[0071] For example, as shown in FIG2 , the frame 200 may include a plate-like region 201 (twill-covered region) and a hollow region 202. The hollow region 202 may include two sub-regions: a hollow region 2021 and a hollow region 2022. For example, the plate-like region 201 is provided with a through-hole 2011. For example, the frame 200 may be made of metal, for example, by low-cost processing methods such as die-casting or sheet metal.

[0072] Exemplarily, as shown in FIG2 , the refrigerant module 120 is provided with interfaces 23 to 27, which are connected to the refrigerant flow channel in the refrigerant module 120. For an introduction to interfaces 23 to 27, please refer to the relevant descriptions of FIG8 and FIG9 below, which will not be described in detail here. Exemplarily, the refrigerant module 120 can be a plate made of metal. Exemplarily, in order to achieve high pressure resistance and high air tightness of the refrigerant flow channel to meet the circulation of high-pressure refrigerant, the refrigerant module 120 can be made by a forging processing method.

[0073] For example, please refer to Figure 3, which shows a schematic diagram of the above-mentioned substrate 100, frame 200 and refrigerant module 120 integrated together. It can be seen that the frame 200 is arranged on the second side of the substrate 100. For example, the frame 200 can be fixedly arranged on the second side of the substrate 100 by means of bolt connection, hinge, ultrasonic connection or welding. In addition, the plate-shaped area 201 is used to fix the refrigerant module 120. For example, the refrigerant module 120 can be fixedly arranged on the plate-shaped area 201 by means of bolt connection, hinge, ultrasonic connection or welding. In addition, when the substrate 100 and the frame 200 are integrated together, the interface 12 on the substrate 100 can pass through the plate-shaped area 201 through the through hole 2011; the interface 10 and the interface 11 can pass through the hollow area 2021, and the interface 08, the interface 09, the interface 13 and the interface 14 can pass through the hollow area 2022.

[0074] In another possible implementation, the hollow area 2021 can be expanded to cover the area where the through hole 2011 is located. For example, see Figure 4. Compared with Figure 2 above, in Figure 4, the area of ​​the plate-shaped area 201 is reduced and the area of ​​the hollow area 2021 is expanded. This implementation saves the material cost of the plate-shaped area 201 without the need to provide additional through holes 2011. It is understandable that the shape of the refrigerant module 120 can be a regular polygon or any irregular shape. The embodiment of the present application does not limit the specific shape of the refrigerant module 120.

[0075] In one possible implementation, the substrate 100 includes a first layer 101 and a second layer 102. For ease of understanding, please refer to Figure 5 for example. As shown in Figure 5, the second layer 102 may include two sublayers, namely a first sublayer 1021 and a second sublayer 1022. The first sublayer 1021 and the second sublayer 1022 are stacked on the first layer 101, and the area of ​​the second layer 102 (i.e., the sum of the areas of the first sublayer 1021 and the second sublayer 1022) is smaller than the area of ​​the first layer 101. Coolant flow channels are provided in the first layer 101, the first sublayer 1021, and the second sublayer 1022.

[0076] For example, when the substrate 100 and frame 200 are integrated, the second layer 102 is embedded in the hollow region 202, as shown in FIG6 . Specifically, the first sublayer 1021 is embedded in the hollow region 2021 of the frame 200, and the second sublayer 1022 is embedded in the hollow region 2022 of the frame 200. Interfaces 10 and 11 on the substrate 100 extend through the hollow region 2021 along with the first sublayer 1021. Interfaces 08, 09, 13, and 14 on the substrate 100 extend through the hollow region 2022 along with the second sublayer 1022.

[0077] In the above implementation, the substrate 100 and frame 200 are nested in a configuration of protrusions and hollows, thereby reducing the overall thickness of the integrated substrate 100 and frame 200, thereby reducing the overall thickness and volume of the thermal management integrated component 00. Furthermore, the substrate 100 is designed as a two-layer structure, and coolant flow channels are also provided in the second layer to meet the layout requirements of the coolant flow channels. This avoids the problem of having all the flow channels in the first layer, which would result in an excessively large area of ​​the first layer. This reduces the length or width of the first layer, thereby reducing the volume of the thermal management integrated component 00.

[0078] Exemplarily, the area of ​​the above-mentioned refrigerant module 120 is much smaller than the area of ​​the frame 200. Exemplarily, the area ratio of the refrigerant module 120 to the area of ​​the frame 200 can be between 30% and 50%. In order to meet the circulation of high-pressure refrigerant, the materials used for the refrigerant module (the metal used also needs to have high pressure resistance) and the production cost are relatively high. Therefore, in the embodiment of the present application, the refrigerant flow channel is concentrated in the refrigerant module 120 with a smaller area, which can effectively save costs. And since the refrigerant module 120 is metal, reducing the area of ​​the refrigerant module 120 can also reduce the overall weight of the thermal management integrated component.

[0079] Exemplarily, the thickness of the refrigerant module 120 can be much less than or equal to the thickness of the frame 200. Exemplarily, the ratio of the thickness of the refrigerant module 120 to the thickness of the frame 200 can be between 50% and 100%. Within this thickness ratio range, the material cost of the refrigerant module can be minimized and the cross-sectional size of the refrigerant flow channel set in the refrigerant module can be guaranteed to meet the flow rate requirements, that is, both cost and function are taken into account. In addition, if the thickness of the refrigerant module 120 is much smaller than the thickness of the frame 200, the overall thickness of the thermal management integrated component 00 can also be reduced, thereby reducing the volume.

[0080] In one possible implementation, a multi-way valve 110 and a water pump 111 may be further provided on the first side of the substrate 100. The multi-way valve 110 and the water pump 111 may be in communication with the coolant flow channel in the substrate 100. A first heat exchange device 121 and a second heat exchange device 122 may also be fixedly provided on the frame 200. By way of example, the first heat exchange device 121 may be, for example, a heat exchange device such as a condenser. The second heat exchange device 122 may be, for example, a heat exchange device such as a cooler. The embodiments of the present application do not limit the specific types and forms of the two heat exchange devices.

[0081] For ease of understanding, please refer to the exploded structural diagram of the thermal management integrated component 00 shown in Figure 7. In Figure 7, the water pump 111 may exemplarily include three water pumps, namely water pump 1111, water pump 1112 and water pump 1113.

[0082] As can be seen in FIG7 , the first side of the substrate 100 is provided with interfaces 01 to 04. Interface 01 is used to connect to the multi-way valve 110, thereby connecting the multi-way valve 110 to the coolant flow channel provided in the substrate 100. Interface 02 is used to connect to the water pump 1111, thereby connecting the water pump 1111 to the coolant flow channel provided in the substrate 100. Interface 03 is used to connect to the water pump 1112, thereby connecting the water pump 1112 to the coolant flow channel provided in the substrate 100. Interface 04 is used to connect to the water pump 1113, thereby connecting the water pump 1113 to the coolant flow channel provided in the substrate 100.

[0083] Illustratively, the multi-way valve 110 may be a three-way valve, an eight-way valve, a nine-way valve, etc., and the embodiment of the present application does not limit this.

[0084] For example, as shown in FIG7 , the multi-way valve 110, the water pump 1111, the water pump 1112, and the water pump 1113 can be arranged in sequence along the longer side of the first side of the substrate 100. This arrangement can optimize the layout of the coolant flow channels provided in the substrate 100, reduce the staggered flow channels, and maximize the use of the area of ​​the substrate 100 to arrange more flow channels, thereby improving the utilization rate of the substrate 100.

[0085] For example, as shown in FIG7 , the first side of the substrate 100 is further provided with an interface 05, an interface 06, and an interface 07. Interfaces 05, 06, and 07 are connected to the coolant flow channel in the substrate 100, and are also used to connect the circuit in the thermal management system. For example, interface 05 is connected to a water heater (positive temperature coefficient, PTC), and interfaces 06 and 07 are connected to the battery circuit. It will be understood that this is only an example, and the embodiments of the present application do not limit the specific devices connected to interfaces 05, 06, and 07, and can be determined based on the design of the actual thermal management circuit.

[0086] For example, as shown in FIG7 , the second side of the substrate 100 is provided with interfaces 08, 09, and 10. Interfaces 08, 09, and 10 are in communication with the coolant flow channel in the substrate 100 and are also used to connect the circuits in the thermal management system. For example, interfaces 08 and 10 are used to connect with the interface of the electric drive module; interface 09 is used to connect with the radiator. It will be understood that this is only an example, and the embodiments of the present application do not limit the specific devices to which interfaces 08, 09, and 10 are connected, and the specific components can be determined based on the design of the actual thermal management circuit.

[0087] For example, the second side of the substrate 100 may also be provided with other interfaces. For example, see Figure 8, which shows a schematic diagram of an exploded structure located on the second side of the substrate 100. It can be seen that the second side of the substrate 100 may also be provided with interfaces 11 to 14. The interfaces 11 to 14 are connected to the coolant flow channel in the substrate 100. Among them, the interfaces 11 and 12 are also used to connect to the first heat exchange device 121; the interfaces 13 and 14 are also used to connect to the second heat exchange device 122. For ease of understanding, the first heat exchange device 121 and the second heat exchange device 122 shown in Figure 7 are introduced below.

[0088] For example, in Figure 7, the first heat exchange device 121 includes an interface 15 and an interface 16. Of the interface 15 and the interface 16, one is the coolant inlet of the first heat exchange device 121, and the other is the coolant outlet of the first heat exchange device 121. Which one is the inlet or outlet is determined according to actual application requirements, and the embodiments of the present application do not limit this. The second heat exchange device 122 includes an interface 17 and an interface 18. Of the interface 17 and the interface 18, one is the coolant inlet of the second heat exchange device 122, and the other is the coolant outlet of the second heat exchange device 122. Which one is the inlet or outlet is determined according to actual application requirements, and the embodiments of the present application do not limit this. In conjunction with Figures 7 and 8, the interface 11 on the second side of the substrate 100 is connected to the interface 15 of the first heat exchange device 121 through the hollow area 2021. The interface 12 on the second side of the substrate 100 is connected to the interface 16 of the first heat exchange device 121 through the through hole 2011. Alternatively, in the scenario shown in FIG4 , the interface 12 on the second side of the substrate 100 passes through the hollow region 2021 to connect with the interface 16 of the first heat exchange device 121. The interface 13 on the second side of the substrate 100 passes through the hollow region 2022 to connect with the interface 17 of the second heat exchange device 122. The interface 14 on the second side of the substrate 100 passes through the hollow region 2022 to connect with the interface 18 of the second heat exchange device 122.

[0089] As can be seen in Figure 7, the first heat exchange device 121 also includes an interface 19 and an interface 20. Interface 19 can be the refrigerant inlet of the first heat exchange device 121, and interface 20 can be the refrigerant outlet of the first heat exchange device 121. For example, interface 19 can be used to connect to a compressor. For example, interface 19 can be used to connect to the outlet of a compressor.

[0090] As can be seen in Figure 7, the second heat exchange device 122 also includes an interface 21 and an interface 22. Interface 21 can be the refrigerant inlet of the second heat exchange device 122, while interface 22 can be the refrigerant outlet of the second heat exchange device 122. For example, interface 22 can be used to connect to a compressor. For example, interface 22 can be used to connect to the inlet of a compressor.

[0091] Exemplarily, the above-mentioned interface 20 and interface 21 are connected to the refrigerant flow channel interface in the refrigerant module 120. For ease of understanding, the refrigerant module 120 shown in Figure 8 is introduced. As can be seen in Figure 8, interfaces 23 to 27 are provided on the refrigerant module 120. The interfaces 23 to 27 are connected to the refrigerant flow channel provided in the refrigerant module 120. The interface 20 of the above-mentioned first heat exchange device 121 can be connected to the interface 23 on the refrigerant module 120. The interface 21 of the above-mentioned second heat exchange device 122 can be connected to the interface 24 on the refrigerant module 120.

[0092] For example, as can be seen in FIG7 above, the interface 19 is arranged on one side of the first heat exchange device 121 (referred to as the first side). The interface 20 and the interface 15 and the interface 16 are arranged on the other side of the first heat exchange device 121 (referred to as the second side). The direction of the second side of the first heat exchange device 121 is opposite to the direction of the first side of the first heat exchange device 121, or the second side of the first heat exchange device 121 is opposite to the first side of the first heat exchange device 121. And the second side of the first heat exchange device 121 can be the side that is in contact with the frame 200. It can be understood that the refrigerant inlet (i.e., the interface 19) of the first heat exchange device 121 is used to connect to the compressor, and the compressor is not integrated in the refrigerant module 120. Therefore, the interface 19 of the first heat exchange device 121 is not connected to the refrigerant flow channel interface of the refrigerant module 120. Then, the interface 19 is designed on the other side (i.e., the first side of the first heat exchange device 121) to facilitate connection with the compressor, and there is no need to set a flow channel connecting the compressor interface and the interface 19 of the first heat exchange device 121 on the refrigerant module 120, thereby reducing the area of ​​the refrigerant module 120 and reducing costs.

[0093] Similarly, for example, it can be seen in Figure 7 above that the above-mentioned interface 21, the above-mentioned interface 17 and the interface 18 are arranged on one side of the second heat exchange device 122 (referred to as the first side). The above-mentioned interface 22 is arranged on the other side of the second heat exchange device 122 (referred to as the second side). The direction of the second side of the second heat exchange device 122 is opposite to the direction of the first side of the second heat exchange device 122, or in other words, the second side of the second heat exchange device 122 is opposite to the first side of the second heat exchange device 122. And the first side of the second heat exchange device 122 can be the side that is in contact and connected with the frame 200. It can be understood that the refrigerant outlet (i.e., interface 22) of the second heat exchange device 122 is used to connect to the compressor, and the compressor is not integrated on the refrigerant module. Therefore, the interface 22 of the second heat exchange device 122 is not connected to the refrigerant flow channel interface of the refrigerant module 120. Then, the interface 22 is designed on the other side (i.e., the second side of the second heat exchange device 122) to facilitate connection with the compressor, and there is no need to set a flow channel connecting the compressor interface and the interface 22 of the second heat exchange device 122 on the refrigerant module 120, thereby reducing the area of ​​the refrigerant module 120 and reducing costs.

[0094] For example, the interface 25 and interface 26 in the refrigerant module 120 can be used to connect to the refrigerant container 123, and the interface 27 can be used to connect to the expansion valve 124. For ease of understanding, please refer to Figures 9 and 10. In Figure 9, it can be seen that the refrigerant container 123 is provided with an interface 28 and an interface 29. Of the interface 28 and interface 29, one is the refrigerant inlet of the refrigerant container 123, and the other is the refrigerant outlet of the refrigerant container 123. Which one is the inlet or outlet is determined according to actual application requirements and is not limited in this embodiment of the present application. The expansion valve 124 is provided with an interface 30. As shown in Figure 10, the interface 28 of the refrigerant container 123 is connected to the interface 25 on the refrigerant module 120. The interface 29 of the refrigerant container 123 is connected to the interface 26 on the refrigerant module 120. The interface 30 of the expansion valve 124 is connected to the interface 27 on the refrigerant module 120.

[0095] In one possible implementation, the refrigerant container and / or the expansion valve may be integrated into the refrigerant module 120. In this case, the interface 28 is directly connected to the interface 25; the interface 29 is directly connected to the interface 26; and the interface 30 is directly connected to the interface 27. Alternatively, in another possible implementation, the refrigerant container and / or the expansion valve may not be integrated into the refrigerant module 120. In this case, the interface 28 is connected to the interface 25 through a pipeline; the interface 29 is connected to the interface 26 through a pipeline; and the interface 30 is connected to the interface 27 through a pipeline. It will be understood that this is merely an example and does not constitute a limitation to the embodiments of the present application.

[0096] For example, the refrigerant container 123 may be a liquid storage tank, and its shape may be cylindrical, cubic, or any other shape, which is not limited in the present embodiment.

[0097] In one possible implementation, to facilitate an understanding of the overall appearance of the thermal management integrated component 00 provided in the embodiments of the present application, reference may be made to Figures 11 and 12 for example. Figures 11 and 12 illustrate an example in which a refrigerant container 123 and an expansion valve 124 are integrated into a refrigerant module 120. Figure 11 illustrates the overall appearance of the thermal management integrated component 00 as viewed from a first side of the substrate 100 after the various components are integrated into the substrate 100. Figure 12 illustrates the overall appearance of the thermal management integrated component 00 as viewed from a second side of the substrate 100 after the various components are integrated into the substrate 100. It should be understood that Figures 11 and 12 are merely examples and constitute limitations on the embodiments of the present application. For example, in the thermal management integrated component 00 shown in Figures 11 and 12, other components (such as a shut-off valve (SOV), a three-way valve, or a compressor, etc.) may also be integrated into the substrate 100, but this is not a limitation of the embodiments of the present application. For example, as shown in Figure 12A, a shut-off valve 125 may also be integrated into the refrigerant module 120. The stop valve 125 is connected to the refrigerant flow channel in the refrigerant module 120 through a refrigerant flow channel interface provided on the refrigerant module 120. For example, the stop valve can also be called a throttle valve, etc., which is not limited in the embodiment of the present application.

[0098] For example, as shown in Figure 12 above, the refrigerant container 123 and expansion valve 124 are located between the first heat exchanger 121 and the second heat exchanger 122. For example, in a specific thermal management refrigerant circuit, the refrigerant is pushed into the first heat exchanger 121 by the compressor. After heat exchange, it flows from the first heat exchanger 121 to the refrigerant container 123. The refrigerant then flows from the refrigerant container 123 to the expansion valve 124, and then flows through the expansion valve 124 to the second heat exchanger 122. After heat exchange, the refrigerant flows out of the second heat exchanger 122 and back to the compressor, forming a refrigerant circuit. Based on this, the embodiment of the present application arranges the refrigerant container 123 and the expansion valve between the first heat exchanger 121 and the second heat exchanger 122, which can reduce the length of the refrigerant flow path. This can also reduce the area of ​​the refrigerant module 120, further reducing the cost and weight of the thermal management integrated component 00.

[0099] For example, in FIG12 , the refrigerant container 123 is arranged perpendicular to the substrate 100 (and also perpendicular to the refrigerant module 120). Specifically, it is assumed that the side of the refrigerant container 123 where the above-mentioned interface 28 and interface 29 are provided is the first side, and the side opposite to the first side is the second side, that is, the bottom of the refrigerant container is the second side. Then the direction from the second side of the refrigerant container 123 to the first side of the refrigerant container 123 is perpendicular to the refrigerant module. And the interface 28 and the interface 29 are directly connected to the interface 25 and the interface 26 on the refrigerant module 120 respectively. The tank body of the refrigerant container 123 is perpendicular to the refrigerant module 120, which can reduce the impact on the refrigerant circuit caused by the inability to provide refrigerant normally when there is less refrigerant in the tank body. On the other hand, the tank body is perpendicular to the refrigerant module, and it is also convenient to increase the refrigerant capacity by replacing a longer tank body.

[0100] By way of example, in another possible implementation, the refrigerant container 123 may be arranged horizontally on the refrigerant module 120. Specifically, the direction from the second side of the refrigerant container 123 to the first side of the refrigerant container 123 is parallel to the refrigerant module 120. For ease of understanding, please refer to Figures 13 and 13A for example. Figures 13 and 13A show schematic diagrams of the refrigerant container 123 being arranged horizontally on the refrigerant module 120. The difference between Figures 13 and 13A is the location of the refrigerant inlet and outlet on the refrigerant container 123. In this arrangement, the interface 25 and the interface 28, as well as the interface 26 and the interface 29, can be connected via shorter pipes or by welding. By way of example, the location of the interface 25 and the interface 26 on the refrigerant module 120 can be adaptively changed according to the placement of the refrigerant container 123, and this is not limited in this embodiment of the present application. Placing the refrigerant container 123 horizontally on the refrigerant module 120 can further reduce the thickness of the thermal management integrated component 00.

[0101] By way of example, the above-mentioned Figures 1 to 13 are only schematic diagrams of embodiments of the present application. The specific shape and size of each device are shown schematically, and the shape and size of each interface are also shown schematically. The shape and size of the substrate 100 are also shown schematically. The substrate 100 can be any regular square, oval or irregular shape, and the embodiments of the present application do not limit this. By way of example, in a possible implementation, if the substrate 100 is of other shapes, the layout positions of the various interfaces and various devices provided on the substrate can be adaptively adjusted. For ease of understanding, please refer to Figures 14 and 15 for example. The shape of the substrate 100 shown in Figures 14 and 15 is different from the shape of the substrate 100 shown in Figures 7 and 8 above.

[0102] For example, FIG14 shows an exploded view of the thermal management integrated component 00 as viewed from a first side of the substrate 100. FIG15 shows an exploded view of the thermal management integrated component 00 as viewed from a second side of the substrate 100. As can be seen in FIG14 and FIG15 , the shape and size of the substrate 100 differ from those shown in FIG7 and FIG8 ; the layout of the devices disposed on the substrate 100 also differs from the layout shown in FIG7 and FIG8 .

[0103] For example, as shown in Figure 14, the multi-way valve 110, water pump 1111, water pump 1112, and water pump 1113 are still arranged on the first side of the substrate 100. However, compared to the above-mentioned Figure 7, the relative position layout between the multi-way valve 110, water pump 1111, water pump 1112, and water pump 1113 has changed. For example, the multi-way valve 110, water pump 1111, water pump 1112, and water pump 1113 are respectively arranged at the four corners of the substrate 100, etc. This adaptive adjustment of the position layout is to reduce the interlacing of the refrigerant flow channels in the substrate 100, so as to make the best use of the area of ​​the substrate 100 to layout more flow channels and improve the utilization rate of the substrate 100. Regarding the first side of the substrate 100, the connection relationship between the multi-way valve 110, water pump 1111, water pump 1112, and water pump 1113 and the interface on the substrate 100 can be referred to the relevant introduction of Figure 7 above, which will not be repeated here.

[0104] For example, as shown in FIG15 , the refrigerant module 120, the first heat exchange device 121, and the second heat exchange device 122 are still arranged on the frame 200. Specifically, the refrigerant module 120 is arranged on the plate-shaped area 201 of the frame 200 (the diagonal area in FIG15 ); the first heat exchange device 121 and the second heat exchange device 122 are arranged on the frame 200 and are connected to the coolant flow channel interfaces (including interfaces 11 to 14) on the base plate 100 that pass through the hollow area 202. However, compared with the above-mentioned FIG8 , the relative position layout between the refrigerant module 120, the first heat exchange device 121, and the second heat exchange device 122 has changed. For example, in Figure 8, the refrigerant module 120 is disposed in the middle region of the frame 200 (the plate-shaped region 201 is located in the middle region of the frame 200), and the first heat exchanger 121 and the second heat exchanger 122 are respectively disposed on either side of the frame 200, sandwiching the refrigerant module 120. In contrast, in Figure 15, the refrigerant module 120 is disposed on one side of the frame 200 (the plate-shaped region 201 is located on one side of the frame 200), and the first heat exchanger 121 and the second heat exchanger 122 are disposed on the other side of the frame 200 opposite the side where the refrigerant module 120 is located. The first heat exchanger 121 and the second heat exchanger 122 are located side by side on the same side of the refrigerant module 120 (hereinafter referred to as the first side). As an example, if the refrigerant module 120 is also provided with a refrigerant container 123 and an expansion valve 124, the refrigerant container 123 and the expansion valve 124 are located on the other side opposite the first side. The refrigerant container 123 is disposed close to the first heat exchange device 121, and the expansion valve 124 is disposed close to the second heat exchange device 122. This arrangement can achieve a shorter refrigerant transmission path.

[0105] In another possible implementation, for example, see Figure 15. The substrate 100 may include a first layer 101 and a second layer 102. The second layer 102 is stacked on the first layer 101, and the area of ​​the second layer 102 is smaller than the area of ​​the first layer 101. A coolant flow channel is provided in the second layer 102. When the substrate 100 and the frame 200 are integrated together, the second layer 102 is embedded in the hollow area 202, and the interface 08 to the interface 14 on the substrate 100 pass through the hollow area 202 along with the second layer 102. Alternatively, in another possible implementation, a through hole (not shown in Figure 15) may be provided in 201 shown in Figure 15, and the interface 12 is connected to the interface 16 of the first heat exchange device 121 through the through hole 2011. For details, please refer to the relevant description of Figure 4 above, which will not be repeated here.

[0106] It will be understood that the above-mentioned Figures 14 and 15 are merely examples and do not constitute a limitation to the embodiments of the present application.

[0107] In one possible implementation, the layout positions of the various components on the second side of the substrate 100 are not limited to the layout positions shown in FIG. 8 (or FIG. 10 ) or FIG. 15 , but may also be other layout positions. For example, see FIG. 16 to FIG. 19 for examples. FIG. 16 is a plan view showing the positional relationship of the second side of the substrate 100 in the thermal management integrated component 00 shown in FIG. 10 . FIG. 17 is a plan view showing the positional relationship of the second side of the substrate 100 in the thermal management integrated component 00 shown in FIG. 15 . The plan views shown in FIG. 16 and FIG. 17 exemplarily illustrate the layout positional relationship of the refrigerant module 120, the first heat exchange device 121, the second heat exchange device 122, the refrigerant container 123, and the expansion valve 124 integrated on the second side of the substrate 100. In another possible implementation, the layout positional relationship of the various components integrated on the second side of the substrate 100 may also be shown in FIG. 18 or FIG. 19 , for example.

[0108] 18 , the long sides of the first heat exchange device 121 and the second heat exchange device 122 can be arranged perpendicular to the long side direction of the base plate 100. The refrigerant module 120 is arranged in the middle area of ​​the second side of the base plate 100, and the refrigerant container 123 and the expansion valve 124 integrated in the refrigerant module 120 are arranged between the first heat exchange device 121 and the second heat exchange device 122.

[0109] For example, in FIG19 , the layout position relationship of the refrigerant module 120, the first heat exchange device 121, the second heat exchange device 122, the refrigerant container 123, and the expansion valve 124 forms a mirror image relationship with the layout position relationship shown in FIG17 above. That is, in FIG19 , the refrigerant module 120 is arranged on one side of the second side of the substrate 100, the first heat exchange device 121 and the second heat exchange device 122 are arranged on the other side of the second side of the substrate 100, and the first heat exchange device 121 and the second heat exchange device 122 are located side by side on the same side of the refrigerant module 120 (referred to as the first side). As an example, a refrigerant container 123 and an expansion valve 124 are also provided on the refrigerant module 120, and the refrigerant container 123 and the expansion valve 124 are located on the other side opposite to the first side. The refrigerant container 123 is arranged close to the first heat exchange device 121, and the expansion valve 124 is arranged close to the second heat exchange device 122.

[0110] For example, in the layout position relationship shown in Figures 16 to 19 above, the refrigerant container 123 is arranged close to the refrigerant outlet of the first heat exchange device 121, and the expansion valve 124 is arranged close to the refrigerant inlet of the second heat exchange device 122, and the refrigerant container 123 and the expansion valve 124 are also arranged as close together as possible, so that the length of the refrigerant flow channel can be greatly shortened, and the area of ​​the refrigerant module 120 can be greatly reduced.

[0111] In summary, in the embodiments of the present application, the high-pressure refrigerant flow channels in the refrigerant base plate are concentrated onto a smaller refrigerant module, which is then directly fixed to a mostly hollow frame, reducing the material cost of the frame. Furthermore, the frame serves as a fixed installation, eliminating the need for expensive high-pressure metal materials. The refrigerant module using high-pressure metal materials is significantly smaller than the original refrigerant base plate, saving material and production costs while also reducing weight.

[0112] In addition, because the refrigerant module and the heat exchange device are made of metal, if these metal devices are directly integrated into the substrate, the material requirements of the substrate are relatively high. In the embodiment of the present application, the refrigerant module and the heat exchange device are fixed by a frame, and then the frame can be integrated with the above-mentioned substrate by bolts, hinges or ultrasonic connections, so that the refrigerant module and the heat exchange device can be firmly and safely integrated with the substrate. Because the connection method of the frame and the substrate is flexible, the material selection of the substrate can be more flexible. For example, a low-cost and lightweight plastic material can be selected to reduce cost and weight.

[0113] The present application also provides a thermal management system, as shown in FIG20 . The thermal management system 2000 may include a thermal management integrated component 2001. The thermal management integrated component 2001 may be, for example, any of the possible embodiments described above. For details, please refer to the aforementioned description and will not be repeated here.

[0114] The present application also provides a vehicle, as shown in FIG21 . Vehicle 2100 may include a thermal management integrated component 2101. Thermal management integrated component 2101 may be, for example, any of the possible embodiments described above. For details, please refer to the aforementioned description and will not be repeated here.

[0115] It should be understood that in the various embodiments of the present application, the size of the serial number of each process does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0116] It will also be understood that the term “comprise” (also known as “includes,” “including,” “comprises,” and / or “comprising”) when used in this specification specifies the presence of stated features, integers, steps, operations, elements, and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0117] It should also be understood that references throughout this specification to "one embodiment," "an embodiment," or "one possible implementation" mean that specific features, structures, or characteristics associated with that embodiment or implementation are included in at least one embodiment of the present application. Therefore, the appearance of "in one embodiment," "in an embodiment," or "one possible implementation" throughout this specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0118] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A thermal management integrated component, characterized in that: The thermal management integrated component includes a frame and a refrigerant module; The refrigerant module is provided with a refrigerant flow channel; The frame includes a plate-shaped area and a hollow area, and the area of ​​the plate-shaped area is less than or equal to the area of ​​the hollow area; The refrigerant module is fixed on the plate-shaped area, and the area of ​​the refrigerant module is less than or equal to the area of ​​the plate-shaped area; The frame is also used to be integrated with a base plate, in which a cooling liquid flow channel is arranged.

2. The thermal management integrated component according to claim 1, characterized in that: The refrigerant module is manufactured by a forging method, and the frame is manufactured by a die-casting or sheet metal processing method.

3. The thermal management integrated component according to claim 1 or 2, characterized in that: The ratio of the area of ​​the refrigerant module to the area of ​​the frame is between 30% and 50%.

4. The thermal management integrated component according to any one of claims 1 to 3, characterized in that: The ratio of the thickness of the refrigerant module to the thickness of the frame is between 50% and 100%.

5. The thermal management integrated component according to any one of claims 1 to 4, characterized in that: The substrate comprises a first layer and a second layer, wherein the second layer is stacked on the first layer and the area of ​​the second layer is smaller than that of the first layer; cooling liquid channels are arranged in both the first layer and the second layer; and the second layer is embedded in the hollow area.

6. The thermal management integrated component according to any one of claims 1 to 5, characterized in that: The refrigerant module is provided with a first refrigerant flow channel interface; the frame is also used to fix the first heat exchange device; The first heat exchange device comprises a first refrigerant inlet and a first refrigerant outlet; the first refrigerant inlet is located at a first side of the first heat exchange device, and the first refrigerant outlet is located at a second side opposite to the first side of the first heat exchange device; The first refrigerant inlet is used to communicate with the compressor; the first refrigerant outlet is connected to the first refrigerant flow channel interface.

7. The thermal management integrated component according to claim 6, characterized in that: The first heat exchange device comprises a first coolant inlet and a first coolant outlet; the first coolant inlet and the first coolant outlet are located on the second side of the first heat exchange device; The substrate is provided with a first coolant flow channel interface and a second coolant flow channel interface, and the hollow area includes a first area; The first coolant flow channel interface passes through the first area and is connected to the first coolant inlet; The second coolant flow channel interface passes through the first region to be connected to the first coolant outlet, or the second coolant flow channel interface passes through a through hole on the plate-shaped region to be connected to the first coolant outlet.

8. The thermal management integrated component according to any one of claims 1 to 7, characterized in that: The refrigerant module is provided with a second refrigerant flow channel interface; the frame is also used to fix the second heat exchange device; The second heat exchange device comprises a second refrigerant inlet and a second refrigerant outlet; the second refrigerant inlet is located at a first side of the second heat exchange device, and the second refrigerant outlet is located at a second side opposite to the first side of the second heat exchange device; The second refrigerant inlet is connected to the second refrigerant flow channel interface; the second refrigerant outlet is used to communicate with the compressor.

9. The thermal management integrated component according to claim 8, characterized in that: The second heat exchange device comprises a second coolant inlet and a second coolant outlet; the second coolant inlet and the second coolant outlet are located on a first side of the second heat exchange device; The substrate is provided with a third coolant flow channel interface and a fourth coolant flow channel interface, and the hollow area includes a second area; The third coolant flow channel interface passes through the second area and is connected to the second coolant inlet, and the fourth coolant flow channel interface passes through the second area and is connected to the first coolant outlet.

10. The thermal management integrated component according to any one of claims 1 to 9, characterized in that: The refrigerant module is provided with a third refrigerant flow channel interface and a fourth refrigerant flow channel interface; the refrigerant container is integrated on the refrigerant module and is connected to the refrigerant flow channel in the refrigerant module through the third refrigerant flow channel interface and the fourth refrigerant flow channel interface.

11. The thermal management integrated component according to claim 10, characterized in that: The refrigerant container comprises a first side and a second side, and the first side of the refrigerant container is oriented in opposite directions to the second side of the refrigerant container; A third refrigerant inlet and a third refrigerant outlet are provided on the first side of the refrigerant container, the third refrigerant inlet is connected to the third refrigerant flow channel interface in the refrigerant module, and the third refrigerant outlet is connected to the fourth refrigerant flow channel interface in the refrigerant module; The second side of the refrigerant container is the bottom of the refrigerant container, and the direction from the second side of the refrigerant container to the first side of the refrigerant container is perpendicular to the refrigerant module; or, A direction from the second side of the refrigerant container to the first side of the refrigerant container is parallel to the refrigerant module.

12. The thermal management integrated component according to any one of claims 1 to 11, characterized in that: The refrigerant module is provided with a fifth refrigerant flow channel interface; the expansion valve is integrated on the refrigerant module and communicates with the refrigerant flow channel in the refrigerant module through the fifth refrigerant flow channel interface; and / or, The refrigerant module is provided with a sixth refrigerant flow channel interface; the stop valve is integrated on the refrigerant module and is connected with the refrigerant flow channel in the refrigerant module through the sixth refrigerant flow channel interface.

13. The thermal management integrated component according to any one of claims 1 to 12, characterized in that: The frame is arranged on the first side of the substrate, and the second side of the substrate is oriented opposite to the first side of the substrate; A multi-way valve, a first water pump, a second water pump and a third water pump are sequentially arranged along the direction of the longer side of the second side of the substrate.

14. A thermal management system, characterized in that: The thermal management system comprises the thermal management integrated component according to any one of claims 1-13.

15. A vehicle, characterized in that: The vehicle comprises the thermal management integrated component according to any one of claims 1 to 13 , or the vehicle comprises the thermal management system according to claim 14 .

Images