Integrated component and system for thermal management, and vehicle

Abstract

An integrated component and system for thermal management and a vehicle, the integrated component for thermal management comprising a waterway substrate and a refrigerant frame. The waterway substrate comprises a first layer and a second layer, the second layer is stacked on the first layer, the area of the second layer is smaller than the area of the first layer, and the first layer and the second layer are each internally provided with a cooling liquid flow channel. The refrigerant frame comprises a first region and a second region. A refrigerant module is arranged in the first region, and a refrigerant flow channel is arranged in the refrigerant module. The second region is a hollowed-out region. The waterway substrate and the refrigerant frame are integrated together, the second layer is embedded into the second region, and the first region is embedded into a recessed interval formed between the second layer and the first layer. By adopting the solutions of the present application, the size of integrated modules of the system for thermal management can be reduced.

Description

Thermal management of integrated components, systems and vehicles

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on November 30, 2023, with application number 202311641655.2, and priority to the Chinese patent application entitled “Thermal Management Integrated Components, Systems and Vehicles”, all contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of thermal management technology, and in particular, to a thermal management integrated component, system and vehicle. Background Art

[0003] With the continuous development of vehicles, the integration of vehicle thermal management systems has become a trend to improve production and assembly efficiency, facilitate quality control, and reduce the space occupied by thermal management systems. However, the current integrated thermal management system modules are large and occupy a large amount of space, making reducing the overall size of the thermal management system integration module a pressing issue. Summary of the Invention

[0004] The present application provides a thermal management integrated component, system and vehicle, which can reduce the volume of the thermal management system integrated module.

[0005] In a first aspect, the present application provides a thermal management integrated component, the thermal management integrated component comprising a water channel substrate and a refrigerant frame;

[0006] The water channel substrate includes a first layer and a second layer, wherein the second layer is stacked on the first layer and has an area smaller than that of the first layer; and cooling liquid flow channels are provided in both the first layer and the second layer.

[0007] The refrigerant frame includes a first area and a second area; the first area is provided with a refrigerant module, and the refrigerant module is provided with a refrigerant flow channel; the second area is a hollow area;

[0008] The water channel substrate and the refrigerant frame are integrated together, the second layer is embedded in the second area, and the first area is embedded in the recessed area formed between the second layer and the first layer.

[0009] In the above scheme, on the one hand, the water channel substrate and the refrigerant frame are arranged in a manner of protrusions and hollow nesting, so that the overall thickness of the water channel substrate and the refrigerant frame integrated together is reduced, thereby reducing the overall thickness of the thermal management integrated component and reducing the volume. On the other hand, the water channel substrate is designed as two layers, and coolant flow channels are also provided in the second layer to meet the layout requirements of the coolant flow channels, thereby avoiding the arrangement of all flow channels in the first layer, resulting in an excessively large area of ​​the first layer, that is, reducing the length or width of the first layer. In addition, concentrating the high-pressure resistant refrigerant flow channels on a refrigerant module with a smaller area can reduce the use of high-pressure resistant metal materials, reducing weight while saving materials and production costs.

[0010] In a possible implementation manner, the ratio of the area of ​​the second layer to the area of ​​the first layer is between 40% and 60%.

[0011] In the above solution, within this area ratio range, the cost of the water channel substrate can be minimized and the number of coolant flow channels that meet the needs can be set in the water channel substrate, that is, both cost and function are taken into account.

[0012] In a possible implementation manner, the area of ​​the second region is larger than the area of ​​the second layer, and the ratio of the area of ​​the second region to the area of ​​the refrigerant frame is between 50% and 70%.

[0013] In the above solution, within this area ratio range, the cost of the refrigerant frame can be minimized and the area of ​​the refrigerant module can be guaranteed to set the number of refrigerant flow channels that meet the needs, that is, taking into account both cost and function.

[0014] In a possible implementation manner, the ratio of the area of ​​the refrigerant module to the area of ​​the refrigerant frame is between 30% and 50%.

[0015] In the above solution, the area ratio of the refrigerant module and the refrigerant frame is within this area ratio range, which can minimize the cost of the refrigerant module and ensure that the number of refrigerant flow channels that meet the needs can be set in the refrigerant module, that is, taking into account both cost and function.

[0016] In a possible implementation manner, a ratio of the thickness of the refrigerant module to the thickness of the refrigerant frame is between 50% and 100%.

[0017] In the above solution, the thickness ratio of the refrigerant module to the refrigerant frame is within this thickness ratio range, which can minimize the material cost of the refrigerant module and ensure that the cross-sectional size of the refrigerant flow channel set in the refrigerant module meets the flow requirements, that is, taking into account both cost and function.

[0018] In a possible implementation manner, the refrigerant module is manufactured by a forging process, and the portion of the refrigerant frame other than the refrigerant module is manufactured by a die-casting or sheet metal processing process.

[0019] In the above solution, the refrigerant module is made by forging to withstand the flow of high-pressure refrigerant, and the refrigerant frame is made by die-casting or sheet metal to reduce the production cost.

[0020] In a possible embodiment, the refrigerant module is provided with a first refrigerant flow channel interface; the refrigerant frame is further provided with a first heat exchange device;

[0021] The first heat exchange device includes a first refrigerant inlet and a first refrigerant outlet; the first refrigerant inlet is located on a first side of the first heat exchange device, and the first refrigerant outlet is located on a second side opposite to the first side of the first heat exchange device;

[0022] The first refrigerant inlet is used to communicate with the compressor; the first refrigerant outlet is connected to the first refrigerant flow channel interface.

[0023] In the above scheme, the refrigerant inlet of the first heat exchange device is used to connect to the compressor, and the compressor is not integrated on the refrigerant module. Therefore, the refrigerant inlet of the first heat exchange device is not connected to the refrigerant flow channel interface of the refrigerant module, but is designed on the other side to facilitate connection with the compressor. Therefore, there is no need to set a flow channel on the refrigerant module connecting the refrigerant outlet of the compressor and the refrigerant inlet of the first heat exchange device, thereby reducing the area of ​​the refrigerant module and reducing costs.

[0024] In one possible embodiment, the first heat exchange device includes a first coolant inlet and a first coolant outlet; the first coolant inlet and the first coolant outlet are located on the second side of the first heat exchange device;

[0025] The water channel substrate is provided with a first coolant flow channel interface and a second coolant flow channel interface, and the second area includes a first hollow area;

[0026] The first coolant flow channel interface passes through the first hollow area and is connected to the first coolant inlet;

[0027] The second coolant flow channel interface passes through the first hollow area and is connected to the first coolant outlet, or the second coolant flow channel interface passes through a through hole on the plate-shaped area and is connected to the first coolant outlet.

[0028] In the above scheme, the coolant flow channel interface of the substrate passes through the hollow area of ​​the refrigerant frame and is directly connected to the coolant inlet and outlet of the first heat exchange device, and the refrigerant flow channel interface of the refrigerant module is directly connected to the refrigerant outlet of the first heat exchange device, without the need for pipelines or other flow channel transfers, reducing the transfer sealing interface and reducing the flow resistance caused by pipeline transfers.

[0029] In one possible embodiment, the refrigerant module is provided with a second refrigerant flow channel interface; the refrigerant frame is also used to fix the second heat exchange device;

[0030] The second heat exchange device includes a second refrigerant inlet and a second refrigerant outlet; the second refrigerant inlet is located on a first side of the second heat exchange device, and the second refrigerant outlet is located on a second side opposite to the first side of the second heat exchange device;

[0031] The second refrigerant inlet is connected to the second refrigerant flow channel interface; the second refrigerant outlet is used to communicate with the compressor.

[0032] In the above scheme, the refrigerant outlet of the second heat exchange device is used to connect to the compressor, and the compressor is not integrated on the refrigerant module. Therefore, the refrigerant outlet of the second heat exchange device is not connected to the refrigerant flow channel interface of the refrigerant module, but is designed on the other side to facilitate connection with the compressor. Therefore, there is no need to set a flow channel on the refrigerant module to connect the refrigerant inlet of the compressor and the refrigerant outlet of the second heat exchange device, thereby reducing the area of ​​the refrigerant module and reducing costs.

[0033] In one possible embodiment, the second heat exchange device includes a second coolant inlet and a second coolant outlet; the second coolant inlet and the second coolant outlet are located on a first side of the second heat exchange device;

[0034] The water channel substrate is provided with a third coolant flow channel interface and a fourth coolant flow channel interface, and the second area includes a second hollow area;

[0035] The third coolant flow channel interface passes through the second hollow area and is connected to the second coolant inlet, and the fourth coolant flow channel interface passes through the first area and is connected to the first coolant outlet.

[0036] In the above solution, the coolant flow channel interface of the substrate passes through the hollow area of ​​the refrigerant frame and is directly connected to the coolant inlet and outlet of the second heat exchange device, and the refrigerant flow channel interface of the refrigerant module is directly connected to the refrigerant outlet of the second heat exchange device, without the need for pipelines or other flow channel transfers, reducing the transfer sealing interface and reducing the flow resistance caused by pipeline transfers.

[0037] In one possible embodiment, a third refrigerant flow channel interface and a fourth refrigerant flow channel interface are provided in the aforementioned refrigerant module; the refrigerant container is integrated on the aforementioned refrigerant module and is connected to the refrigerant flow channel in the aforementioned refrigerant module through the aforementioned third refrigerant flow channel interface and the aforementioned fourth refrigerant flow channel interface.

[0038] In the above solution, a refrigerant container can also be integrated on the refrigerant module to improve the integration level and reduce the refrigerant transmission path.

[0039] In one possible embodiment, the refrigerant container includes a first side and a second side, and the first side of the refrigerant container is oriented in opposite directions to the second side of the refrigerant container.

[0040] A third refrigerant inlet and a third refrigerant outlet are provided on the first side of the refrigerant container. The third refrigerant inlet is connected to the third refrigerant flow channel interface in the refrigerant module, and the third refrigerant outlet is connected to the fourth refrigerant flow channel interface in the refrigerant module.

[0041] The second side of the refrigerant container is the bottom of the refrigerant container, and the direction from the second side of the refrigerant container to the first side of the refrigerant container is perpendicular to the refrigerant module; or,

[0042] A direction from the second side of the refrigerant container to the first side of the refrigerant container is parallel to the refrigerant module.

[0043] In this solution, the refrigerant container is perpendicular to the refrigerant module, minimizing the impact on the refrigerant circuit caused by insufficient refrigerant in the tank. Furthermore, this arrangement facilitates increasing refrigerant capacity by replacing the tank with a longer one. Furthermore, the refrigerant container can be placed parallel to the refrigerant module, providing flexibility in layout.

[0044] In a possible implementation, the refrigerant module is provided with a fifth refrigerant flow channel interface;

[0045] The expansion valve is integrated on the aforementioned refrigerant module and communicates with the refrigerant flow channel in the aforementioned refrigerant module through the aforementioned fifth refrigerant flow channel interface.

[0046] In the above solution, an expansion valve can also be integrated on the refrigerant module to improve the integration level.

[0047] In a possible embodiment, the refrigerant frame is disposed on the first side of the water channel substrate, and the second side of the water channel substrate faces opposite to the first side of the water channel substrate.

[0048] A multi-way valve, a first water pump, a second water pump and a third water pump are sequentially arranged along the direction of the longer side of the second side of the water channel substrate.

[0049] In the above scheme, because the multi-way valve and the water pump are both connected to the coolant flow channel in the substrate, this arrangement can optimize the layout of the coolant flow channel set in the substrate, reduce the staggered flow channels, and make full use of the area of ​​the substrate to layout more flow channels, thereby improving the utilization rate of the substrate.

[0050] In a second aspect, the present application provides a thermal management system, which includes the thermal management integrated component as described in any one of the first aspects above.

[0051] In a third aspect, the present application provides a vehicle, which includes the thermal management integrated component as described in any one of the first aspects above, or the aforementioned vehicle includes the thermal management system as described in the second aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Figures 1 to 9 are schematic diagrams of the structures of the thermal management integrated components provided in embodiments of the present application;

[0053] 9A, 10 and 10A are schematic structural diagrams of a thermal management integrated component provided in an embodiment of the present application;

[0054] 11 and 12 are schematic structural diagrams of a thermal management integrated component provided in an embodiment of the present application;

[0055] Figures 13 to 16 are schematic diagrams of layout position relationships provided in embodiments of the present application;

[0056] FIG17 is a schematic diagram of the structure of a thermal management system provided in an embodiment of the present application;

[0057] FIG18 is a schematic structural diagram of a vehicle provided in an embodiment of the present application.

[0058] Figure markings: 00-thermal management integrated component; 01 to 30-interfaces; 100-water channel substrate; 101-first layer of substrate; 102-second layer of substrate; 1021-first sublayer of the second layer of substrate; 1022-second sublayer of the second layer of substrate; 200-refrigerant frame; 201-first area of ​​refrigerant frame 200; 202-second area of ​​refrigerant frame 200; 110-multi-way valve 110; 111 (including 1111, 1112 and 1113)-water pump; 120-refrigerant module; 121-first heat exchange device; 122-second heat exchange device; 123-refrigerant container; 124-expansion valve. DETAILED DESCRIPTION

[0059] In the embodiment of the present application, "multiple" refers to two or more. In the embodiment of the present application, "and / or" is used to describe the association relationship of associated objects, indicating three relationships that can exist independently. For example, A and / or B can be expressed as follows: A exists alone, B exists alone, or A and B exist at the same time. The description methods such as "at least one of a1, a2, ... and an" used in the embodiment of the present application include the situation where any one of a1, a2, ... and an exists alone, and also include any combination of any multiple of a1, a2, ... and an, each of which can exist alone; for example, the description method of "at least one of a, b and c" includes the situation where a is alone, b is alone, c is alone, a and b combination, a and c combination, b and c combination, or abc combination.

[0060] In this application, the terms "first," "second," and the like are used to distinguish between identical or similar items having substantially the same function or effect. It should be understood that "first," "second," and "nth" do not have a logical or temporal dependency, nor do they limit the quantity or order of execution. It should also be understood that although the following description uses the terms "first," "second," and the like to describe various elements, these elements should not be limited by these terms. These terms are simply used to distinguish one element from another.

[0061] In the various embodiments of the present application, unless otherwise specified or there is a logical conflict, the terms and / or descriptions between the various embodiments are consistent and can be referenced by each other. The technical features in different embodiments can be combined to form new embodiments according to their inherent logical relationships.

[0062] The thermal management integrated component and thermal management system (the thermal management system includes the thermal management integrated component) provided in the embodiment of the present application are applicable to vehicles, and are also applicable to thermal management scenarios with other cooling (heat dissipation) and / or heating requirements. For example, the thermal management integrated component and thermal management system provided in the embodiment of the present application can be applied to electric vehicles. Specifically, the electric vehicle is a vehicle suitable for driving by an electric drive. The electric vehicle can be a pure electric vehicle (pure electric vehicle / battery electric vehicle, pure EV / battery EV), a hybrid electric vehicle (hybrid electric vehicle, HEV), a range extended electric vehicle (REEV), a plug-in hybrid electric vehicle (PHEV) or a new energy vehicle (NEV), etc.

[0063] The thermal management system of the embodiment of the present application can use water to heat or dissipate heat from the managed object. In some possible implementations, the managed object may be a passenger compartment, a battery, an electric drive, and a control system, etc. In the present application, water is used to transfer heat energy. In some possible implementations, the thermal management system of the present application can also use coolants such as water and refrigerants to heat or dissipate heat from the managed object. Among them, the refrigerant can transfer heat through evaporation and condensation. It should be understood that water can also be replaced by other coolants to transfer heat energy, and the embodiment of the present application does not specifically limit this.

[0064] The current thermal management system integrated module is relatively large. In order to reduce the integrated volume of the thermal management system and reduce the occupied space, an embodiment of the present application provides a thermal management integrated component 00. The thermal management integrated component 00 includes a water channel substrate 100 and a refrigerant frame 200;

[0065] The water channel substrate 100 includes a first layer 101 and a second layer 102. The second layer 102 is stacked on the first layer 101. The area of ​​the second layer 102 is smaller than that of the first layer 101. Cooling liquid flow channels are provided in both the first layer 101 and the second layer 102. The refrigerant frame 200 includes a first area 201 and a second area 202. The second area 202 is a hollow area. A refrigerant module 120 is provided in the first area 201, and a refrigerant flow channel is provided in the refrigerant module 120. The water channel substrate 100 and the refrigerant frame 200 are integrated together. The second layer 102 is embedded in the second area 202, and the first area 201 is embedded in the recessed area formed between the second layer 102 and the first layer 101.

[0066] To facilitate understanding of the thermal management integrated component 00 provided in the embodiment of the present application, the following is an exemplary description with reference to the accompanying drawings. It should be understood that the configurations of the various components in the drawings shown in the embodiment of the present application are merely illustrative and do not constitute a limitation to the embodiment of the present application.

[0067] In a possible implementation, reference may be made to FIG1 , which exemplarily shows an exploded structural diagram of a thermal management integrated component 00 provided in an embodiment of the present application.

[0068] As can be seen in FIG. 1 , the thermal management integrated component 00 may include a water channel substrate 100 , a refrigerant frame 200 and a refrigerant module 120 .

[0069] Exemplarily, the waterway substrate 100 is provided with a coolant flow channel. As shown in FIG1 , the waterway substrate 100 includes a first layer 101 and a second layer 102. The waterway substrate 100 may include a first side and a second side, with the first side facing in opposite directions from the second side. The second layer 102 is located on the second side of the waterway substrate 100. Exemplarily, the waterway substrate 100 may be, for example, an injection molded part made of plastic, or a metal waterway substrate made of metal, or a waterway substrate made of other materials, and this embodiment of the present application is not limited thereto.

[0070] In one possible implementation, as shown in FIG1 , the second layer 102 may include two sublayers, namely, a first sublayer 1021 and a second sublayer 1022. The first sublayer 1021 and the second sublayer 1022 are stacked on the first layer 101, and the area of ​​the second layer 102 (i.e., the sum of the areas of the first sublayer 1021 and the second sublayer 1022) is smaller than the area of ​​the first layer 101. Coolant flow channels are provided in the first layer 101, the first sublayer 1021, and the second sublayer 1022.

[0071] For example, as shown in FIG1 , the refrigerant frame 200 may include a first region 201 (twill-covered region) and a second region 202. The first region 201 is a plate-shaped region. The second region 202 may include two sub-regions, a first hollow region 2021 and a second hollow region 2022. In one possible implementation, a through hole 2011 is provided on the first region 201. For example, the refrigerant frame 200 may be made of metal, for example, by a low-cost processing method such as die casting or sheet metal.

[0072] Exemplarily, as shown in FIG1 , the refrigerant module 120 is provided with interfaces 23 to 27, which are connected to the refrigerant flow channel in the refrigerant module 120. For an introduction to interfaces 23 to 27, please refer to the relevant descriptions of FIG5 and FIG7 below, which will not be described in detail here. Exemplarily, the refrigerant module 120 can be a plate made of metal. Exemplarily, in order to achieve high pressure resistance and high air tightness of the refrigerant flow channel to meet the circulation of high-pressure refrigerant, the refrigerant module 120 can be made by a forging processing method.

[0073] The refrigerant module 120 is fixedly disposed in the first region 201 of the refrigerant frame 200. For example, the refrigerant module 120 and the refrigerant frame 200 may be integrally formed. Alternatively, the refrigerant module 120 and the frame 200 may be separate components, fixedly connected together by bolting, hinged connection, ultrasonic connection, or welding.

[0074] Exemplarily, when the waterway substrate 100 and the refrigerant frame 200 are integrated, the second layer 102 is embedded in the second region 202, as shown in FIG2 . As can be seen, the refrigerant frame 200 is disposed on the second side of the waterway substrate 100. Exemplarily, the refrigerant frame 200 can be fixed to the second side of the waterway substrate 100 by bolting, hinged connection, ultrasonic connection, or welding. Exemplarily, when the waterway substrate 100 and the refrigerant frame 200 are integrated, the first sublayer 1021 is embedded in the first hollow region 2021 of the refrigerant frame 200, and the second sublayer 1022 is embedded in the second hollow region 2022 of the refrigerant frame 200. Interfaces 10 and 11 on the waterway substrate 100 extend through the first hollow region 2021 along with the first sublayer 1021. Interfaces 08, 09, 13, and 14 on the waterway substrate 100 extend through the second hollow region 2022 along with the second sublayer 1022. In addition, the first region 201 of the refrigerant frame 200 is embedded in the recessed area formed between the second layer 102 and the first layer 101 of the water channel substrate 100 .

[0075] For example, in another possible implementation, the first region 201 of the refrigerant frame 200 may not have a metal plate, but instead the refrigerant module may be directly fixed to the frame of the first region 201 by bolts or welding. This can further save metal material, reduce cost and weight.

[0076] In the above implementation, the water channel substrate 100 and the refrigerant frame 200 are nested through a configuration of protrusions and hollows, thereby reducing the overall thickness of the integrated water channel substrate 100 and the refrigerant frame 200, thereby reducing the overall thickness and volume of the thermal management integrated component 00. Furthermore, the water channel substrate 100 is designed as a two-layer structure, and coolant flow channels are also provided in the second layer to meet the layout requirements of the coolant flow channels. This avoids the problem of having all the flow channels in the first layer, which would result in an excessively large area of ​​the first layer. This reduces the length or width of the first layer, thereby reducing the volume of the thermal management integrated component 00.

[0077] In another possible implementation, the first hollow area 2021 can be expanded to cover the area where the through hole 2011 is located. For example, see Figure 3. Compared with Figure 1 above, in Figure 3, the area of ​​the first area 201 is reduced, and the area of ​​the first hollow area 2021 is expanded. This implementation saves the material cost of the first area 201 without the need to provide additional through holes 2011. It is understandable that the shape of the refrigerant module 120 can be a regular polygon or any irregular shape. The embodiment of the present application does not limit the specific shape of the refrigerant module 120.

[0078] For example, the ratio of the area of ​​the second layer 102 to the area of ​​the first layer 101 of the water channel substrate 100 is between 40% and 60%. Within this area ratio range, the cost of the water channel substrate can be minimized while ensuring that the required number of coolant channels can be installed in the water channel substrate, thus achieving a balance between cost and functionality.

[0079] Exemplarily, the area of ​​the above-mentioned refrigerant module 120 is much smaller than the area of ​​the refrigerant frame 200. Exemplarily, the area ratio of the refrigerant module 120 to the area of ​​the refrigerant frame 200 can be between 30% and 70%. In order to meet the circulation of high-pressure refrigerant, the materials used (the metal used also needs to have high pressure resistance) and the production cost of the refrigerant module are relatively high. Therefore, in the embodiment of the present application, the refrigerant flow channel is concentrated in the refrigerant module 120 with a smaller area, which can effectively save costs. And since the refrigerant module 120 is metal, reducing the area of ​​the refrigerant module 120 can also reduce the overall weight of the thermal management integrated component.

[0080] Exemplarily, the thickness of the above-mentioned refrigerant module 120 can be much less than or equal to the thickness of the refrigerant frame 200. Exemplarily, the ratio of the thickness of the refrigerant module 120 to the thickness of the refrigerant frame 200 can be between 50% and 100%. Within this thickness ratio range, the material cost of the refrigerant module can be minimized and the cross-sectional size of the refrigerant flow channel set in the refrigerant module can be guaranteed to meet the flow rate requirements, that is, both cost and function are taken into account. In addition, if the thickness of the refrigerant module 120 is much smaller than the thickness of the refrigerant frame 200, the overall thickness of the thermal management integrated component 00 can also be reduced, thereby reducing the volume.

[0081] In one possible implementation, a multi-way valve 110 and a water pump 111 may be further provided on the first side of the substrate 100. The multi-way valve 110 and the water pump 111 may be in communication with the coolant flow channel in the substrate 100. A first heat exchange device 121 and a second heat exchange device 122 may also be fixedly provided on the frame 200. By way of example, the first heat exchange device 121 may be, for example, a heat exchange device such as a condenser. The second heat exchange device 122 may be, for example, a heat exchange device such as a cooler. The embodiments of the present application do not limit the specific types and forms of the two heat exchange devices.

[0082] For ease of understanding, please refer to the exploded structural diagram of the thermal management integrated component 00 shown in Figure 4. In Figure 4, the water pump 111 may exemplarily include three water pumps, namely water pump 1111, water pump 1112 and water pump 1113.

[0083] As can be seen in FIG4 , the first side of the water channel substrate 100 is provided with interfaces 01 to 04. Interface 01 is used to connect to the multi-way valve 110, thereby connecting the multi-way valve 110 to the coolant flow channel provided in the water channel substrate 100. Interface 02 is used to connect to the water pump 1111, thereby connecting the water pump 1111 to the coolant flow channel provided in the water channel substrate 100. Interface 03 is used to connect to the water pump 1112, thereby connecting the water pump 1112 to the coolant flow channel provided in the water channel substrate 100. Interface 04 is used to connect to the water pump 1113, thereby connecting the water pump 1113 to the coolant flow channel provided in the water channel substrate 100.

[0084] Illustratively, the multi-way valve 110 may be a three-way valve, an eight-way valve, a nine-way valve, etc., and the embodiment of the present application does not limit this.

[0085] For example, as shown in FIG4 , the multi-way valve 110, water pump 1111, water pump 1112, and water pump 1113 can be arranged sequentially along the longer side of the first side of the water channel substrate 100. This arrangement can optimize the layout of the coolant flow channels provided in the water channel substrate 100, reduce the overlap of the flow channels, and maximize the area of ​​the water channel substrate 100 to arrange more flow channels, thereby improving the utilization rate of the water channel substrate 100.

[0086] For example, as shown in FIG4 , the first side of the water channel substrate 100 is further provided with an interface 05, an interface 06, and an interface 07. Interface 05, interface 06, and interface 07 are connected to the coolant flow channel in the water channel substrate 100, and are also used to connect the circuit in the thermal management system. For example, interface 05 is connected to a water heater (positive temperature coefficient, PTC), and interface 06 and interface 07 are connected to a battery circuit. It will be understood that this is only an example, and the embodiment of the present application does not limit the specific devices connected to interface 05, interface 06, and interface 07, and the specific connection can be determined according to the design of the actual thermal management circuit.

[0087] For example, as shown in FIG4 , the second side of the water channel substrate 100 is provided with interfaces 08, 09, and 10. Interfaces 08, 09, and 10 are connected to the coolant flow channel in the water channel substrate 100 and are also used to connect the circuits in the thermal management system. For example, interfaces 08 and 10 are used to connect to the interface of the electric drive module; interface 09 is used to connect to the radiator. It will be understood that this is only an example, and the embodiments of the present application do not limit the specific devices to which interfaces 08, 09, and 10 are connected, and the specific components can be determined based on the design of the actual thermal management circuit.

[0088] For example, the second side of the waterway substrate 100 may also be provided with other interfaces. For example, see Figure 5, which shows a schematic diagram of an exploded structure located on the second side of the waterway substrate 100. As can be seen, the second side of the waterway substrate 100 may also be provided with interfaces 11 to 14. These interfaces 11 to 14 are connected to the coolant flow channel in the waterway substrate 100. Among them, interfaces 11 and 12 are also used to connect to the first heat exchange device 121; interfaces 13 and 14 are also used to connect to the second heat exchange device 122. For ease of understanding, the first heat exchange device 121 and the second heat exchange device 122 shown in Figure 4 are introduced below.

[0089] For example, in FIG4 , the first heat exchange device 121 includes an interface 15 and an interface 16. One of the interfaces 15 and 16 serves as the coolant inlet for the first heat exchange device 121, while the other serves as the coolant outlet. Which one serves as the inlet or outlet depends on actual application requirements and is not limited in this embodiment of the present application. The second heat exchange device 122 includes an interface 17 and an interface 18. One of the interfaces 17 and 18 serves as the coolant inlet for the second heat exchange device 122, while the other serves as the coolant outlet. Which one serves as the inlet or outlet depends on actual application requirements and is not limited in this embodiment of the present application. In conjunction with FIG4 and FIG5 , the interface 11 on the second side of the waterway substrate 100 connects to the interface 15 of the first heat exchange device 121 through the first hollow region 2021. The interface 12 on the second side of the waterway substrate 100 connects to the interface 16 of the first heat exchange device 121 through the through hole 2011. Alternatively, in the scenario shown in FIG3 , the interface 12 on the second side of the waterway substrate 100 passes through the first hollow area 2021 to connect with the interface 16 of the first heat exchange device 121. The interface 13 on the second side of the waterway substrate 100 passes through the second hollow area 2022 to connect with the interface 17 of the second heat exchange device 122. The interface 14 on the second side of the waterway substrate 100 passes through the second hollow area 2022 to connect with the interface 18 of the second heat exchange device 122.

[0090] As can be seen in Figure 4, the first heat exchange device 121 also includes an interface 19 and an interface 20. Interface 19 can be the refrigerant inlet of the first heat exchange device 121, and interface 20 can be the refrigerant outlet of the first heat exchange device 121. For example, interface 19 can be used to connect to a compressor. For example, interface 19 can be used to connect to the outlet of a compressor.

[0091] As can be seen in Figure 4, the second heat exchange device 122 also includes an interface 21 and an interface 22. Interface 21 can be the refrigerant inlet of the second heat exchange device 122, while interface 22 can be the refrigerant outlet of the second heat exchange device 122. For example, interface 22 can be used to connect to a compressor. For example, interface 22 can be used to connect to the inlet of a compressor.

[0092] Exemplarily, the above-mentioned interface 20 and interface 21 are connected to the refrigerant flow channel interface in the refrigerant module 120. For ease of understanding, the refrigerant module 120 shown in Figure 5 is introduced. As can be seen in Figure 5, the refrigerant module 120 is provided with interfaces 23 to 27. The interfaces 23 to 27 are connected to the refrigerant flow channel provided in the refrigerant module 120. The interface 20 of the above-mentioned first heat exchange device 121 can be connected to the interface 23 on the refrigerant module 120. The interface 21 of the above-mentioned second heat exchange device 122 can be connected to the interface 24 on the refrigerant module 120.

[0093] For example, as can be seen in FIG4 above, the interface 19 is arranged on one side of the first heat exchange device 121 (referred to as the first side). The interface 20 and the interface 15 and the interface 16 are arranged on the other side of the first heat exchange device 121 (referred to as the second side). The direction of the second side of the first heat exchange device 121 is opposite to the direction of the first side of the first heat exchange device 121, or the second side of the first heat exchange device 121 is opposite to the first side of the first heat exchange device 121. And the second side of the first heat exchange device 121 can be the side that is in contact with the refrigerant frame 200. It can be understood that the refrigerant inlet (i.e., the interface 19) of the first heat exchange device 121 is used to connect to the compressor, and the compressor is not integrated in the refrigerant module 120. Therefore, the interface 19 of the first heat exchange device 121 is not connected to the refrigerant flow channel interface of the refrigerant module 120. Then, the interface 19 is designed on the other side (i.e., the first side of the first heat exchange device 121) to facilitate connection with the compressor, and there is no need to set a flow channel connecting the compressor interface and the interface 19 of the first heat exchange device 121 on the refrigerant module 120, thereby reducing the area of ​​the refrigerant module 120 and reducing costs.

[0094] Similarly, for example, it can be seen in Figure 4 above that the above-mentioned interface 21, the above-mentioned interface 17 and the interface 18 are arranged on one side of the second heat exchange device 122 (referred to as the first side). The above-mentioned interface 22 is arranged on the other side of the second heat exchange device 122 (referred to as the second side). The direction of the second side of the second heat exchange device 122 is opposite to the direction of the first side of the second heat exchange device 122, or in other words, the second side of the second heat exchange device 122 is opposite to the first side of the second heat exchange device 122. And the first side of the second heat exchange device 122 can be the side that is in contact and connected with the refrigerant frame 200. It can be understood that the refrigerant outlet (i.e., interface 22) of the second heat exchange device 122 is used to connect to the compressor, and the compressor is not integrated on the refrigerant module. Therefore, the interface 22 of the second heat exchange device 122 is not connected to the refrigerant flow channel interface of the refrigerant module 120. Then, the interface 22 is designed on the other side (i.e., the second side of the second heat exchange device 122) to facilitate connection with the compressor, and there is no need to set a flow channel connecting the compressor interface and the interface 22 of the second heat exchange device 122 on the refrigerant module 120, thereby reducing the area of ​​the refrigerant module 120 and reducing costs.

[0095] For example, the interface 25 and the interface 26 in the refrigerant module 120 can be used to connect to the refrigerant container 123, and the interface 27 can be used to connect to the expansion valve 124. For ease of understanding, please refer to Figures 6 and 7. In Figure 6, it can be seen that the refrigerant container 123 is provided with an interface 28 and an interface 29. Of the interface 28 and the interface 29, one is the refrigerant inlet of the refrigerant container 123, and the other is the refrigerant outlet of the refrigerant container 123. Which one is the inlet or outlet is determined according to actual application requirements, and the embodiments of the present application do not limit this. The expansion valve 124 is provided with an interface 30. As shown in Figure 7, the interface 28 of the refrigerant container 123 is connected to the interface 25 on the refrigerant module 120. The interface 29 of the refrigerant container 123 is connected to the interface 26 on the refrigerant module 120. The interface 30 of the expansion valve 124 is connected to the interface 27 on the refrigerant module 120.

[0096] In one possible implementation, the refrigerant container and / or the expansion valve may be integrated into the refrigerant module 120. In this case, the interface 28 is directly connected to the interface 25; the interface 29 is directly connected to the interface 26; and the interface 30 is directly connected to the interface 27. Alternatively, in another possible implementation, the refrigerant container and / or the expansion valve may not be integrated into the refrigerant module 120. In this case, the interface 28 is connected to the interface 25 through a pipeline; the interface 29 is connected to the interface 26 through a pipeline; and the interface 30 is connected to the interface 27 through a pipeline. It will be understood that this is merely an example and does not constitute a limitation to the embodiments of the present application.

[0097] For example, the refrigerant container 123 may be a liquid storage tank, and its shape may be cylindrical, cubic, or any other shape, which is not limited in the present embodiment.

[0098] In one possible implementation, to facilitate an understanding of the overall appearance of the thermal management integrated component 00 provided in the embodiments of the present application, reference may be made to Figures 8 and 9 for example. Figures 8 and 9 illustrate the integration of the refrigerant container 123 and the expansion valve 124 on the refrigerant module 120. Figure 8 illustrates the overall appearance of the thermal management integrated component 00 as viewed from the first side of the waterway substrate 100 after the various components are integrated onto the waterway substrate 100. Figure 9 illustrates the overall appearance of the thermal management integrated component 00 as viewed from the second side of the waterway substrate 100 after the various components are integrated onto the waterway substrate 100. It should be understood that Figures 8 and 9 are merely examples and constitute limitations on the embodiments of the present application. For example, in the thermal management integrated component 00 shown in Figures 8 and 9, other components (such as a shut-off valve (SOV), a three-way valve, or a compressor, etc.) may also be integrated onto the waterway substrate 100, but this is not a limitation of the embodiments of the present application. For example, as shown in Figure 9A , the refrigerant module 120 may also be integrated with a shut-off valve 125. The stop valve 125 is connected to the refrigerant flow channel in the refrigerant module 120 through a refrigerant flow channel interface provided on the refrigerant module 120. For example, the stop valve can also be called a throttle valve, etc., which is not limited in the embodiment of the present application.

[0099] For example, as shown in FIG. 9 , the refrigerant container 123 and the expansion valve 124 are located between the first heat exchanger 121 and the second heat exchanger 122. For example, in a specific thermal management refrigerant circuit, the refrigerant is driven by a compressor into the first heat exchanger 121. After heat exchange, it flows from the first heat exchanger 121 to the refrigerant container 123. The refrigerant then flows from the refrigerant container 123 to the expansion valve 124, and then to the second heat exchanger 122. After heat exchange, the refrigerant flows out of the second heat exchanger 122 and back to the compressor, forming a refrigerant circuit. Based on this, the embodiment of the present application places the refrigerant container 123 and the expansion valve between the first heat exchanger 121 and the second heat exchanger 122, which can reduce the length of the refrigerant flow path. This, in turn, can reduce the area of ​​the refrigerant module 120, further reducing the cost and weight of the thermal management integrated component 00.

[0100] For example, in FIG9 , the refrigerant container 123 is arranged perpendicular to the water channel substrate 100 (and also perpendicular to the refrigerant module 120). Specifically, it is assumed that the side of the refrigerant container 123 where the above-mentioned interface 28 and interface 29 are provided is the first side, and the side opposite to the first side is the second side, that is, the bottom of the refrigerant container is the second side. Then the direction from the second side of the refrigerant container 123 to the first side of the refrigerant container 123 is perpendicular to the refrigerant module. And the interface 28 and interface 29 are directly connected to the interface 25 and interface 26 on the refrigerant module 120 respectively. The tank body of the refrigerant container 123 is perpendicular to the refrigerant module 120, which can reduce the impact on the refrigerant circuit caused by the inability to provide refrigerant normally when there is less refrigerant in the tank body. On the other hand, the tank body is perpendicular to the refrigerant module, and it is also convenient to increase the refrigerant capacity by replacing a longer tank body.

[0101] By way of example, in another possible implementation, the refrigerant container 123 may be arranged horizontally on the refrigerant module 120. Specifically, the direction from the second side of the refrigerant container 123 to the first side of the refrigerant container 123 is parallel to the refrigerant module 120. For ease of understanding, please refer to Figures 10 and 10A for example. Figures 10 and 10A show schematic diagrams of the refrigerant container 123 being arranged horizontally on the refrigerant module 120. The difference between Figures 10 and 10A is the location of the refrigerant inlet and outlet on the refrigerant container 123. In this arrangement, the interface 25 and the interface 28, as well as the interface 26 and the interface 29, can be connected via shorter pipes or by welding. By way of example, the location of the interface 25 and the interface 26 on the refrigerant module 120 can be adaptively changed according to the placement of the refrigerant container 123, and this is not limited in this embodiment of the present application. Placing the refrigerant container 123 horizontally on the refrigerant module 120 can further reduce the thickness of the thermal management integrated component 00.

[0102] For example, the above-mentioned Figures 1 to 10 are only schematic diagrams of the embodiments of the present application. The specific shape and size of each component are shown schematically, and the shape and size of each interface are also shown schematically. The shape and size of the waterway substrate 100 are also schematic. The waterway substrate 100 can be any regular square, oval or irregular shape, and the embodiments of the present application are not limited to this. For example, in a possible implementation, if the waterway substrate 100 is of other shapes, then the layout positions of each interface and each component provided on the waterway substrate can be adaptively adjusted. For ease of understanding, please refer to Figures 11 and 12 for example. The shape of the waterway substrate 100 shown in Figures 11 and 12 is different from the shape of the waterway substrate 100 shown in Figures 4 and 5 above.

[0103] For example, Figure 11 shows an exploded view of the thermal management integrated component 00 as viewed from the first side of the waterway substrate 100. Figure 12 shows an exploded view of the thermal management integrated component 00 as viewed from the second side of the waterway substrate 100. As can be seen in Figures 11 and 12, the shape and size of the waterway substrate 100 differ from those shown in Figures 4 and 5; the layout of the components disposed on the waterway substrate 100 also differs from the layouts shown in Figures 4 and 5.

[0104] For example, as shown in Figure 11 , the multi-way valve 110, water pump 111, water pump 112, and water pump 113 are still located on the first side of the waterway substrate 100. However, compared to Figure 4 , the relative positions of the multi-way valve 110, water pump 111, water pump 112, and water pump 113 have changed. For example, the multi-way valve 110, water pump 111, water pump 112, and water pump 113 are located at the four corners of the waterway substrate 100. This adaptive adjustment in position and layout is intended to reduce the interlacing of refrigerant flow channels in the waterway substrate 100, thereby maximizing the area of ​​the waterway substrate 100 and arranging more flow channels, thereby improving the utilization rate of the waterway substrate 100. Regarding the communication relationship between the multi-way valve 110, water pump 111, water pump 112, and water pump 113 and the interface on the waterway substrate 100 on the first side of the waterway substrate 100, please refer to the relevant description of Figure 4 above and will not be repeated here.

[0105] For example, as shown in FIG12 , the refrigerant module 120, the first heat exchange device 121, and the second heat exchange device 122 are still arranged on the refrigerant frame 200. Specifically, the refrigerant module 120 is arranged in the first area 201 (the diagonal area in FIG12 ) of the refrigerant frame 200; the first heat exchange device 121 and the second heat exchange device 122 are arranged on the refrigerant frame 200, and are correspondingly connected to the coolant flow channel interface (including interface 11 to interface 14) passing through the second area 202 on the water channel substrate 100. However, compared with the above-mentioned FIG5 , the relative position layout between the refrigerant module 120, the first heat exchange device 121, and the second heat exchange device 122 has changed. For example, in Figure 5, the refrigerant module 120 is arranged in the middle area of ​​the refrigerant frame 200 (the first area 201 is located in the middle area of ​​the refrigerant frame 200), and the first heat exchange device 121 and the second heat exchange device 122 are respectively arranged in the two side areas of the refrigerant frame 200, and the first heat exchange device 121 and the second heat exchange device 122 sandwich the refrigerant module 120. In Figure 12, the refrigerant module 120 is arranged on one side of the refrigerant frame 200 (the first area 201 is located on one side of the refrigerant frame 200), and the first heat exchange device 121 and the second heat exchange device 122 are arranged on the other side of the refrigerant frame 200 opposite to the side where the refrigerant module 120 is located. The first heat exchange device 121 and the second heat exchange device 122 are located side by side on the same side of the refrigerant module 120 (referred to as the first side). As an example, refrigerant module 120 is further provided with a refrigerant container 123 and an expansion valve 124. These refrigerant container 123 and expansion valve 124 are located on a side opposite the first side. Refrigerant container 123 is positioned near first heat exchanger 121, while expansion valve 124 is positioned near second heat exchanger 122. This arrangement allows for a shorter refrigerant transfer path.

[0106] For example, in Figure 12, the waterway substrate 100 may include a first layer 101 and a second layer 102. The second layer 102 is stacked on the first layer 101, and the area of ​​the second layer 102 is smaller than that of the first layer 101. A coolant flow channel is provided in the second layer 102. When the waterway substrate 100 and the refrigerant frame 200 are integrated together, the second layer 102 is embedded in the second area 202, and the interface 08 to the interface 14 on the waterway substrate 100 pass through the second area 202 along with the second layer 102. Alternatively, in another possible implementation, a through hole (not shown in Figure 12) may be provided in 201 shown in Figure 12, and the interface 12 is connected to the interface 16 of the first heat exchange device 121 through the through hole 2011. For details, please refer to the relevant description of Figure 4 above, which will not be repeated here.

[0107] It should be understood that the above-mentioned Figures 11 and 12 are merely examples and do not constitute a limitation to the embodiments of the present application.

[0108] In one possible implementation, the layout positions of the various components on the second side of the waterway substrate 100 are not limited to the layout positions shown in FIG. 5 (or FIG. 7 ) or FIG. 12 , but may also be other layout positions. For example, see FIG. 13 to FIG. 16 for examples. FIG. 13 is a plan view showing the positional relationship of the second side of the waterway substrate 100 in the thermal management integrated component 00 shown in FIG. 7 . FIG. 14 is a plan view showing the positional relationship of the second side of the waterway substrate 100 in the thermal management integrated component 00 shown in FIG. 12 . The plan views shown in FIG. 13 and FIG. 14 exemplarily illustrate the layout positional relationship of the refrigerant module 120, the first heat exchange device 121, the second heat exchange device 122, the refrigerant container 123, and the expansion valve 124 integrated on the second side of the waterway substrate 100. In another possible implementation, the layout positional relationship of the various components integrated on the second side of the waterway substrate 100 may also be shown in FIG. 15 or FIG. 16 , for example.

[0109] For example, in Figure 15 , the long sides of the first heat exchanger 121 and the second heat exchanger 122 can be arranged perpendicular to the long sides of the water channel substrate 100. The refrigerant module 120 is arranged in the middle area of ​​the second side of the water channel substrate 100, and the refrigerant container 123 and the expansion valve 124 integrated in the refrigerant module 120 are arranged between the first heat exchanger 121 and the second heat exchanger 122.

[0110] For example, in FIG16 , the layout position relationship of the refrigerant module 120, the first heat exchanger 121, the second heat exchanger 122, the refrigerant container 123, and the expansion valve 124 mirrors the layout position relationship shown in FIG14 . That is, in FIG16 , the refrigerant module 120 is disposed on one side of the second side of the water channel substrate 100, and the first heat exchanger 121 and the second heat exchanger 122 are disposed on the other side of the second side of the water channel substrate 100. The first heat exchanger 121 and the second heat exchanger 122 are located side by side on the same side of the refrigerant module 120 (referred to as the first side). As an example, if a refrigerant container 123 and an expansion valve 124 are also disposed on the refrigerant module 120, the refrigerant container 123 and the expansion valve 124 are located on the other side opposite the first side. Furthermore, the refrigerant container 123 is disposed near the first heat exchanger 121, and the expansion valve 124 is disposed near the second heat exchanger 122.

[0111] For example, in the layout position relationship shown in Figures 13 to 16 above, the refrigerant container 123 is arranged close to the refrigerant outlet of the first thermal management device 121, and the expansion valve 124 is arranged close to the refrigerant inlet of the second heat exchange device 122, and the refrigerant container 123 and the expansion valve 124 are also arranged as close together as possible, so that the length of the refrigerant flow channel can be greatly shortened, and the area of ​​the refrigerant module 120 can be greatly reduced.

[0112] In summary, in the embodiment of the present application, on the one hand, the water channel substrate and the refrigerant frame are arranged in a manner of protrusions and hollow nesting, so that the overall thickness of the water channel substrate and the refrigerant frame integrated together is reduced, thereby reducing the overall thickness of the thermal management integrated component and reducing the volume. On the other hand, the water channel substrate is designed as two layers, and coolant flow channels are also provided in the second layer to meet the layout requirements of the coolant flow channels, thereby avoiding the arrangement of all flow channels in the first layer resulting in an excessively large area of ​​the first layer, that is, reducing the length or width of the first layer. In addition, concentrating the high-pressure resistant refrigerant flow channels onto a refrigerant module with a smaller area can reduce the use of high-pressure resistant metal materials, reduce weight, and save material and production costs.

[0113] The present application also provides a thermal management system, as shown in FIG17 . Thermal management system 1700 may include a thermal management integrated component 1701. Thermal management integrated component 1701 may be, for example, any of the possible embodiments described above. For details, please refer to the preceding description and will not be repeated here.

[0114] The present application also provides a vehicle, as shown in FIG18 . Vehicle 1800 may include a thermal management integrated component 1801. Thermal management integrated component 1801 may be, for example, any of the possible embodiments described above. For details, please refer to the preceding description and will not be repeated here.

[0115] It should be understood that in the various embodiments of the present application, the size of the serial number of each process does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0116] It will also be understood that the term “comprise” (also known as “includes,” “including,” “comprises,” and / or “comprising”) when used in this specification specifies the presence of stated features, integers, steps, operations, elements, and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0117] It should also be understood that references throughout this specification to "one embodiment," "an embodiment," or "one possible implementation" mean that specific features, structures, or characteristics associated with that embodiment or implementation are included in at least one embodiment of the present application. Therefore, the appearance of "in one embodiment," "in an embodiment," or "one possible implementation" throughout this specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0118] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A thermal management integrated component, characterized in that: The thermal management integrated component includes a water channel substrate and a refrigerant frame; The water channel substrate comprises a first layer and a second layer, the second layer is stacked on the first layer, and the area of ​​the second layer is smaller than that of the first layer; the first layer and the second layer are both provided with cooling liquid channels; The refrigerant frame includes a first area and a second area; a refrigerant module is disposed in the first area, and a refrigerant flow channel is disposed in the refrigerant module; the second area is a hollow area; The water channel substrate and the refrigerant frame are integrated together, the second layer is embedded in the second area, and the first area is embedded in a recessed area formed between the second layer and the first layer.

2. The thermal management integrated component according to claim 1, characterized in that: The ratio of the area of ​​the second layer to the area of ​​the first layer is between 40% and 60%.

3. The thermal management integrated component according to claim 1 or 2, characterized in that: The area of ​​the second region is greater than the area of ​​the second layer, and the ratio of the area of ​​the second region to the area of ​​the refrigerant frame is between 50% and 70%.

4. The thermal management integrated component according to any one of claims 1 to 3, characterized in that: The ratio of the area of ​​the refrigerant module to the area of ​​the refrigerant frame is between 30% and 50%.

5. The thermal management integrated component according to any one of claims 1 to 4, characterized in that: The ratio of the thickness of the refrigerant module to the thickness of the refrigerant frame is between 50% and 100%.

6. The thermal management integrated component according to any one of claims 1 to 5, characterized in that: The refrigerant module is made by a forging process, and the part of the refrigerant frame other than the refrigerant module is made by a die-casting or sheet metal process.

7. The thermal management integrated component according to any one of claims 1 to 6, characterized in that: The refrigerant module is provided with a first refrigerant flow channel interface; the refrigerant frame is also provided with a first heat exchange device; The first heat exchange device comprises a first refrigerant inlet and a first refrigerant outlet; the first refrigerant inlet is located at a first side of the first heat exchange device, and the first refrigerant outlet is located at a second side opposite to the first side of the first heat exchange device; The first refrigerant inlet is used to communicate with the compressor; the first refrigerant outlet is connected to the first refrigerant flow channel interface.

8. The thermal management integrated component according to claim 7, characterized in that: The first heat exchange device comprises a first coolant inlet and a first coolant outlet; the first coolant inlet and the first coolant outlet are located on the second side of the first heat exchange device; The water channel substrate is provided with a first coolant flow channel interface and a second coolant flow channel interface, and the second area includes a first hollow area; The first coolant flow channel interface passes through the first hollow area and is connected to the first coolant inlet; The second coolant flow channel interface passes through the first hollow area to be connected to the first coolant outlet, or the second coolant flow channel interface passes through a through hole on the plate-shaped area to be connected to the first coolant outlet.

9. The thermal management integrated component according to any one of claims 1 to 8, characterized in that: The refrigerant module is provided with a second refrigerant flow channel interface; the refrigerant frame is also used to fix the second heat exchange device; The second heat exchange device comprises a second refrigerant inlet and a second refrigerant outlet; the second refrigerant inlet is located at a first side of the second heat exchange device, and the second refrigerant outlet is located at a second side opposite to the first side of the second heat exchange device; The second refrigerant inlet is connected to the second refrigerant flow channel interface; the second refrigerant outlet is used to communicate with the compressor.

10. The thermal management integrated component according to claim 9, characterized in that: The second heat exchange device comprises a second coolant inlet and a second coolant outlet; the second coolant inlet and the second coolant outlet are located on a first side of the second heat exchange device; The water channel substrate is provided with a third coolant flow channel interface and a fourth coolant flow channel interface, and the second area includes a second hollow area; The third coolant flow channel interface passes through the second hollow area and is connected to the second coolant inlet, and the fourth coolant flow channel interface passes through the first area and is connected to the first coolant outlet.

11. The thermal management integrated component according to any one of claims 1 to 10, characterized in that: The refrigerant module is provided with a third refrigerant flow channel interface and a fourth refrigerant flow channel interface; the refrigerant container is integrated on the refrigerant module and is connected to the refrigerant flow channel in the refrigerant module through the third refrigerant flow channel interface and the fourth refrigerant flow channel interface.

12. The thermal management integrated component according to claim 11, characterized in that: The refrigerant container comprises a first side and a second side, and the first side of the refrigerant container is oriented in opposite directions to the second side of the refrigerant container; A third refrigerant inlet and a third refrigerant outlet are provided on the first side of the refrigerant container, the third refrigerant inlet is connected to the third refrigerant flow channel interface in the refrigerant module, and the third refrigerant outlet is connected to the fourth refrigerant flow channel interface in the refrigerant module; The second side of the refrigerant container is the bottom of the refrigerant container, and the direction from the second side of the refrigerant container to the first side of the refrigerant container is perpendicular to the refrigerant module; or, A direction from the second side of the refrigerant container to the first side of the refrigerant container is parallel to the refrigerant module.

13. The thermal management integrated component according to any one of claims 1 to 12, characterized in that: The refrigerant module is provided with a fifth refrigerant flow channel interface; the expansion valve is integrated on the refrigerant module and communicates with the refrigerant flow channel in the refrigerant module through the fifth refrigerant flow channel interface; and / or, The refrigerant module is provided with a sixth refrigerant flow channel interface; the stop valve is integrated on the refrigerant module and is connected with the refrigerant flow channel in the refrigerant module through the sixth refrigerant flow channel interface.

14. The thermal management integrated component according to any one of claims 1 to 13, characterized in that: The refrigerant frame is arranged on the first side of the water channel substrate, and the second side of the water channel substrate is oriented opposite to the first side of the water channel substrate; A multi-way valve, a first water pump, a second water pump and a third water pump are sequentially arranged along the direction of the longer side of the second side of the water channel substrate.

15. A thermal management system, characterized in that: The thermal management system comprises the thermal management integrated component according to any one of claims 1-14.

16. A vehicle, characterized in that: The vehicle comprises the thermal management integrated component according to any one of claims 1 to 14 , or the vehicle comprises the thermal management system according to claim 15 .

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